Heat regeneration device and refrigerating and heating device

Abstract

The invention provides a heat regeneration device and a refrigerating and heating device, the heat regeneration device comprises a sleeve and solid elastic clamping material plates, the inner wall of the sleeve comprises protrusions, the multiple solid elastic clamping material plates are stacked in the sleeve, each solid elastic clamping material plate comprises a groove, a space formed by stacking the multiple grooves is used for containing the protrusions on the inner wall of the sleeve, and the protrusions are arranged on the inner wall of the sleeve. After the grooves are stacked, gaps between the grooves and the protrusions form flow cavities for heat conduction fluid to flow through. The protrusions are arranged on the inner wall of the sleeve and extend into the grooves of the solid elastic clamping material plate, the position of the solid elastic clamping material plate can be fixed, the flow resistance of gaps between the grooves and the protrusions is small, and the heat conduction efficiency is improved. In addition, the contact area between the flow cavity and the solid elastic clamping material is large, and the heat conduction efficiency of the heat conduction fluid is further improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of refrigeration and heating, and in particular relates to a heat recovery device and a refrigeration and heating device. Background Art

[0002] Solid-state spring card cooling and heating is an emerging green and environmentally friendly cooling and heating technology. By loading or unloading solid-state spring card materials, it causes phase change or reverse phase change to generate heat or cold, thereby achieving cooling or heating.

[0003] The cooling and heating device prepared based on this principle applies stress to the solid-state spring card material through a driving device, and sets a flow cavity in the solid-state spring card material. Under the action of a pump, a heat-conducting fluid passes through, and the heat or cold generated is transferred by the heat-conducting fluid. When the solid-state spring card material is loaded, the block-shaped solid-state spring card material will be partially buckled and deformed due to excessive loading and unloading times. Therefore, the solid-state spring card material is designed to be sheet-shaped, and each sheet has a perforation. After stacking, the perforations form a flow cavity. However, in actual applications, the stacked sheets are easily misaligned during the process of applying stress by the driving device, and the flow cavity is blocked, resulting in a decrease in the thermal conductivity efficiency of the heat-conducting fluid.

[0004] In order to improve the heat transfer efficiency, the flow rate of the heat transfer fluid needs to be increased as much as possible. The usual practice is to reduce the cross-sectional area of ​​the flow cavity under a certain pump power. Therefore, a smaller shape is designed or a plug is added to a larger shape. However, considering the effect of flow resistance, a flow cavity that is too small will greatly limit the flow rate of the heat transfer fluid, which is not conducive to heat transfer. If a plug is added, the driver will also apply stress to the plug. The reaction force of the plug will cause the driver's loading efficiency to be too low, increasing the energy consumption ratio of the cooling and heating device. Summary of the invention

[0005] An embodiment of the present application provides a heat recovery device, comprising: a sleeve and a solid spring-loaded material plate, wherein the inner wall of the sleeve comprises a protrusion and a plurality of solid spring-loaded material plates are stacked in the sleeve, each of the solid spring-loaded material plates comprises a groove, and a space formed by stacking the plurality of grooves is used to accommodate the protrusion on the inner wall of the sleeve, and after the protrusion extends into the space formed by the stacked grooves, a gap between the inner wall of the sleeve and the outer surface of the stacked solid spring-loaded material plates forms a flow cavity for the circulation of a heat-conducting fluid.

[0006] Furthermore, each of the solid-state spring-card material plates has multiple grooves corresponding to the protrusions on the inner wall of the sleeve, and the edges of the grooves are serrated.

[0007] Furthermore, the gap between the inner wall of the sleeve and the edge of the groove of the solid spring material plate is 0.1-5 mm, preferably 0.1-2.0 mm.

[0008] Furthermore, the surface of the solid spring material plate also includes: perforations, and the perforations are stacked to form a second flow cavity.

[0009] Furthermore, the outer surface of the protrusion is engaged with the inner surface of the stacked groove, and a partition is provided on the inner wall of the sleeve, and the partition is made of Teflon, POM, nylon, polyester or silicone.

[0010] Furthermore, the convex surface of the protrusion is engaged with the concave surface of the groove so that the inner wall of the sleeve except the convex surface and the outer edge of the solid spring material plate except the concave surface form a flow cavity.

[0011] Furthermore, the thickness of the solid spring card material plate is 0.01-100 mm, preferably 0.1-10 mm.

[0012] A cooling and heating device, comprising: the heat recovery device and a driver as described above; The driver includes: a power element, a pressure rod and a pressure head, the power element is connected to one end of the pressure rod, and the pressure head is placed at the other end of the pressure rod. The power element drives the pressure rod to make the pressure head reciprocate in the sleeve to load or unload the solid card material plate.

[0013] Furthermore, the shape of the pressing head is the same as the shape of the solid spring material plate.

[0014] Furthermore, the pressure head is made of ceramic or tungsten steel.

[0015] In the embodiment of the present invention, a protrusion is arranged on the inner wall of the sleeve and extends into the groove of the solid-state spring card material plate. On the one hand, the position of the solid-state spring card material plate can be fixed to limit its movement and form dislocation; on the other hand, the flow cavity formed by the gap between the groove space formed after the solid-state spring card material plate is stacked and the protrusion is slender, with a large size and small flow resistance, and the flow rate of the heat transfer fluid is increased due to the obstruction of the protrusion, and the heat transfer efficiency is increased. In addition, the contact area with the solid-state spring card material in the flow cavity is large, which will further improve the heat transfer efficiency of the heat transfer fluid; in addition, the pressure head of the driver is designed to be the same shape as the solid-state spring card material plate, which can avoid the reaction force when the driver loads the solid-state spring card material plate, and improve the energy efficiency ratio of the cooling and heating device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 A cross-sectional view of a solid spring material plate in a heat recovery device provided by the present invention; Figure 2 A structural diagram of a refrigeration and heating device provided by the present invention; Figure 3 This is a cross-sectional view of the refrigeration and heating device provided by the present invention. DETAILED DESCRIPTION

[0018] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0019] like Figure 1 The figure shows a heat recovery device provided by an embodiment of the present invention, comprising: a sleeve 1 and a solid spring-loaded material plate 2, the inner wall of the sleeve 1 comprises a protrusion 11 and a plurality of solid spring-loaded material plates 2 are stacked in the sleeve 1, each solid spring-loaded material plate 2 comprises a groove 21, and a space formed by stacking the plurality of grooves 21 is used to accommodate the protrusion 11 on the inner wall of the sleeve, and after the protrusion 11 extends into the space formed by the stacked grooves 21, a gap between the inner wall of the sleeve 1 and the outer surface of the stacked solid spring-loaded material plates 2 forms a flow cavity for the circulation of a heat-conducting fluid.

[0020] In practical applications, the larger the mass (mass or volume) of the solid-state spring card material, the more heat or cold it generates. Therefore, in order to maximize the absorption of the heat or cold generated by the solid-state spring card material by the medium, this embodiment also needs to ensure that the amount of the solid-state spring card material matches the heat transfer capacity. Generally, a larger flow cavity size is designed to ensure that the same mass of solid-state spring card material has a larger specific surface area or volume.

[0021] In one embodiment of the present invention, the grooves 21 of each solid-state spring card material plate and the protrusions 11 on the inner wall of the sleeve 1 are multiple and correspond one to one. The number of protrusions 11 on the inner wall of the sleeve 1 and the number of spaces of the grooves 21 formed after the solid-state spring card material plates 2 are stacked is the same, and the protrusions 11 are respectively embedded in the spaces of the grooves 21 of the solid-state spring card material plates 2. In this embodiment, the protrusions 12 extend longitudinally along the sleeve, and their length is greater than or equal to the length of the solid-state spring card material plates 2 after stacking. In this way, the position of the solid-state spring card material plates 2 can be fixed to a certain extent to limit their dislocation. In order to increase the cross-sectional area of ​​the flow cavity, multiple protrusions 11 and grooves 21 can be set at different angles. In order to further increase the flow cavity, a serrated structure can also be set at the edge of the groove 21 of the solid-state spring card material plate 2 to form a small micro-flow cavity while increasing the contact area between the heat transfer fluid and the solid-state spring card material, thereby increasing the heat transfer efficiency.

[0022] It should be noted that the grooves and protrusions can be rectangular, arc-shaped, or irregular in shape, which is not limited here. Preferably, the grooves and protrusions can be designed to be rectangular. The flow cavity formed in this way is an elongated structure. On the one hand, the contact surface with the solid spring card material is large. On the other hand, due to the obstruction of the protrusions, the flow rate of the heat transfer fluid is faster and the heat transfer efficiency is higher.

[0023] It should be noted that the gap between the inner wall of the sleeve 1 and the edge of the groove 21 of the solid spring material plate 2 is 0.1-5 mm, preferably 0.5-1 mm. Under this size, the flow resistance can be minimized and the flow rate can be maximized.

[0024] It should be noted that the solid-state card material plate will expand laterally during the loading process. Therefore, in order to ensure that the solid-state card material plate has enough space when expanding, an interlayer is set on the inner wall of the sleeve and the convex surface. For example, an interlayer film is brushed or attached to the inner wall of the sleeve. The interlayer film can be Teflon, POM, nylon, polyester or silicone. On the one hand, the film is soft and can play a role in accommodating and buffering when the solid-state card material plate expands. On the other hand, the film has a heat-insulating effect, which minimizes the heat loss when the medium exchanges heat through the flow cavity. In practical applications, Teflon and POM are preferred. In order to facilitate assembly, brushing is used. After brushing the Teflon paint on the inner wall of the sleeve, the solid-state card material plate is placed in the tube cavity of the sleeve, which is easy to operate.

[0025] Furthermore, the solid-state spring-cage material plate 2 also includes: perforations, which are stacked to form a second flow cavity. In an embodiment of the present invention, a plurality of perforations are provided on the solid-state spring-cage material plate, and after stacking the solid-state spring-cage material plates, the perforations are aligned to form a flow cavity. In an embodiment in which the solid-state spring-cage material plate is connected to the inner wall of the sleeve, the edge of the solid-state spring-cage material plate and the inner wall of the sleeve form a second flow cavity. In this embodiment, the shape and number of the perforations are not limited. Preferably, the perforations are polygonal, radial, circular or square.

[0026] It should be noted that the thickness of the solid spring card material plate is 0.01-100 mm, preferably 0.1-10 mm, and more preferably 0.15-0.3 mm.

[0027] In practical applications, if there is a gap between the inner wall of the sleeve and the solid spring-cage material plate, the solid spring-cage material plate may be slightly misaligned, causing the perforations on its surface to be difficult to align, affecting the flow rate of the heat transfer fluid in the second flow chamber. To solve this problem, the invention provides an embodiment, in which the outer surface of the protrusion contacts the inner surface of the stacked groove, that is, only the protrusion and the groove are clamped without leaving a gap, so that a gap is left between the inner wall of the sleeve and the outer edge of the solid spring-cage material plate, thereby limiting the misalignment of the solid spring-cage material plate.

[0028] In a preferred embodiment, the convex surface of the protrusion on the inner wall of the sleeve is clamped with the concave surface of the groove so that the inner wall of the sleeve and the outer edge of the solid spring material plate form a flow cavity, and the side surface of the protrusion and the side surface of the groove form a flow cavity. In this way, the cross section of the flow cavity can be further increased, and the heat conduction can be increased.

[0029] like Figure 2-Figure 3 The embodiment of the present invention further provides a cooling and heating device, comprising: the above-mentioned heat recovery device 10 and a driver 20; The driver 20 includes: a power element 201, a pressure rod 202 and a pressure head 203. The power element 201 is connected to one end of the pressure rod 202, and the pressure head 203 is placed at the other end of the pressure rod 202. The power element 201 drives the pressure rod 202 to make the pressure head 203 reciprocate in the sleeve to load or unload the solid card material plate.

[0030] Specifically, the power element 201 may be: a motor, a hydraulic power element, a pneumatic power element, etc.

[0031] It should be noted that the shape of the pressure head 203 is the same as the cross-sectional shape of the solid spring-cage material plate. In this way, when the pressure head applies stress to the solid spring-cage material plate, it can avoid applying force to the protrusion at the same time, thereby increasing the energy consumption ratio of the cooling and heating device.

[0032] In order to increase the strength of the load, the pressure head can be set to high-strength ceramic or tungsten steel. In order to ensure that the medium flows in the flow cavity, a sealing ring is set at the connection between the pressure rod and the pressure head to form a closed flow cavity to prevent medium leakage. In this embodiment, the pipeline is not shown in the figure. It serves as a container for the flow of the medium and is connected to the heat exchange device of the equipment, so that the medium flows into the heat exchange device and releases heat or cold.

[0033] The above content is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A heat recovery device, characterized in that: include: A sleeve and a solid-state spring-cage material plate, wherein the inner wall of the sleeve comprises a protrusion and a plurality of solid-state spring-cage material plates are stacked in the sleeve, each of the solid-state spring-cage material plates comprises a groove, and a space formed by stacking the plurality of grooves is used to accommodate the protrusion on the inner wall of the sleeve, and after the protrusion extends into the space formed by the stacked grooves, a gap between the inner wall of the sleeve and the outer surface of the stacked solid-state spring-cage material plates forms a flow cavity for the circulation of a heat-conducting fluid.

2. The heat recovery device according to claim 1, characterized in that: The grooves of each solid spring material plate correspond to the protrusions on the inner wall of the sleeve in a one-to-one manner, and the edges of the grooves are serrated.

3. The heat recovery device according to claim 1, characterized in that: The gap between the inner wall of the sleeve and the edge of the groove of the solid spring card material plate is 0.05-10mm.

4. The heat recovery device according to claim 1, characterized in that: The surface of the solid spring material plate also includes: perforations, and the perforations are stacked to form a second flow cavity.

5. The heat recovery device according to claim 1, characterized in that: The outer surface of the protrusion is clamped with the inner surface of the stacked groove, and a partition is arranged on the inner wall of the sleeve. The partition is made of Teflon, POM, nylon, polyester or silicone.

6. The heat recovery device according to claim 1, characterized in that: The convex surface of the protrusion is engaged with the concave surface of the groove so that the inner wall of the sleeve except the convex surface and the outer edge of the solid spring material plate except the concave surface form a flow cavity.

7. The refrigeration and heating device according to claim 1, characterized in that: The thickness of the solid spring card material plate is 0.01-100 mm.

8. A cooling and heating device, characterized in that: include: The heat recovery device and the driver according to any one of claims 1 to 7; The driver includes: a power element, a pressure rod and a pressure head, the power element is connected to one end of the pressure rod, and the pressure head is placed at the other end of the pressure rod. The power element drives the pressure rod to make the pressure head reciprocate in the sleeve to load or unload the solid card material plate.

9. The refrigeration and heating device according to claim 8, characterized in that: The shape of the pressing head is the same as that of the solid spring material plate.

10. The cooling and heating device according to claim 8, characterized in that: The pressure head is made of ceramic or tungsten steel.

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