Anti-offset circuit board chip welding device and welding method

Abstract

The invention discloses an anti-deviation circuit board chip welding device and method, and relates to the field of chip welding, the anti-deviation circuit board chip welding device comprises a welding workbench, a welding robot is installed on the welding workbench, a welding positioning groove is formed in the welding workbench, a hot melting mechanism is arranged on the welding workbench, and the hot melting mechanism comprises a horizontal sliding seat, a vertical plate and a hot melting plate; the horizontal sliding seat is arranged on the welding workbench in a sliding mode, the sliding direction of the horizontal sliding seat is parallel to the welding positioning groove, the vertical plate is fixed to the horizontal sliding seat, the hot melting plate is arranged on the vertical plate in a sliding mode, a rectangular groove is formed in the middle of the hot melting plate in a penetrating mode, and a plurality of hot fuses are arranged on the two opposite inner walls of the rectangular groove at equal intervals in the horizontal direction; in the welding process, tin is plated on the chip welding holes of the circuit board through the welding robot, the thermal fuse is located between every two adjacent welding holes and used for enabling tin to be in a hot melting state, it is guaranteed that the chip cannot move in the welding process, the welding reject ratio is greatly reduced, and the welding quality is improved.

Description

Technical Field

[0001] The invention relates to the technical field of chip welding, and in particular to an anti-deviating circuit board chip welding device and a welding method. Background Art

[0002] In the production of integrated circuits, the chip needs to be welded on the circuit board. During the welding process of the chip, the welding quality of the chip directly affects whether the integrated circuit can run smoothly. During welding, the chip pins need to correspond to the chip welding holes on the circuit board, and the welding accuracy requirements are high. Although the traditional manual welding can ensure the welding quality, the labor cost is high and the production efficiency is low. With the rapid development of automated production, the emergence of welding robots has replaced manual welding, greatly improving the welding production efficiency. However, in the welding of the chip, the pins need to be welded on the welding holes of the circuit board in a circle around the chip. Therefore, the welding operation range of the welding robot is large. In order to avoid interference, after the chip is loaded, the limiting mechanism, negative pressure mechanism, etc. need to be removed. At this time, the chip is placed on the welding hole of the circuit board without restriction for welding. During the welding process, the welding gun of the welding robot will contact the pins of the chip and weld the pins on the circuit board by pushing back and forth. Since the chip is not limited, the welding robot is easy to push the chip to move during the welding process, causing the chip to shift, causing the pins to be out of the welding hole, resulting in defective welding products. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide an anti-drift circuit board chip welding device and welding method to solve the deficiencies of the prior art.

[0004] The objective of the present invention is achieved through the following technical solutions: an anti-deviating circuit board chip welding device, comprising a welding workbench, a welding robot is installed on the welding workbench, a welding positioning groove is provided on the welding workbench, the outer dimensions of the welding positioning groove match the outer dimensions of the circuit board, a hot melt mechanism is provided on the welding workbench, the hot melt mechanism comprises a horizontal slide, a vertical plate and a hot melt plate, the horizontal slide is slidably arranged on the welding workbench, the sliding direction of the horizontal slide is parallel to the welding positioning groove, the vertical plate is fixed on the horizontal slide, the hot melt plate is slidably arranged on the vertical plate, the moving direction of the vertical plate is perpendicular to one end direction of the horizontal slide on the water surface, a rectangular groove is provided through the middle part of the hot melt plate, a plurality of hot fuses are arranged on two opposite inner walls of the rectangular groove, and the plurality of hot fuses are arranged at equal intervals in the horizontal direction, the chip welding hole of the circuit board is first tinned by the welding robot, and the hot fuse is located between two adjacent welding holes to make the tin in a hot melt state.

[0005] Furthermore, a strip groove is provided on the top surface of the welding workbench, a first screw rod is rotatably arranged in the strip groove, the horizontal slide is slidably adapted to the strip groove, and the horizontal slide is threadedly mounted on the first screw rod, a pushing cylinder is installed on the vertical plate, a connecting rod is connected to the telescopic shaft of the pushing cylinder, a thread is provided on the end of the connecting rod away from the pushing cylinder, the connecting rod is threadedly connected to the hot melt plate, and the hot melt wire is in the shape of a downwardly convex arc.

[0006] Furthermore, the vertical plate includes a fixed body and a lifting body, the fixed body is connected to the horizontal slide, a control cavity is arranged in the fixed body, the lifting body is located directly above the fixed body, a sliding bar is fixed to the bottom of the lifting body, the sliding bar is slidably penetrated through the fixed body, an electromagnet is installed in the control cavity, one end of the sliding bar extends to be connected to a permanent magnet in the control cavity, the electromagnet generates a magnetic pole with a different magnetic property from that of the permanent magnet when energized, a spring is arranged between the electromagnet and the permanent magnet, the top of the fixed body is threadedly connected to a limit screw, a distance measuring sensor is installed at the bottom of the lifting body, and the limit screw is located on the detection path of the distance measuring sensor.

[0007] Furthermore, it also includes a loading mechanism, which includes a circuit board loading box, a chip loading column and a multi-directional conveying mechanism, the circuit board loading box and the chip loading column are respectively arranged at two ends of the welding workbench, the top of the circuit board loading box is provided with a circuit board storage slot, the circuit boards are stacked in the circuit board loading box along the horizontal direction, and the circuit boards are arranged in a vertical state, the top of the chip loading column is provided with a storage slot along its own axial direction, the side wall of the storage slot is provided with a pin slot, the pin slot extends to the top of the chip loading column, the chip is stacked in the storage slot along the axial direction of the chip loading column, and the pins of the chip are located in the pin slot.

[0008] Furthermore, a pushing conveyor belt is provided at the bottom of the circuit board loading box, and the circuit board loading box is connected to the conveying frame of the pushing conveyor belt by bolts, and a pushing plate is fixed on the conveying plane of the pushing conveyor belt, and a pushing window is provided through the side wall of the circuit board loading box, and the pushing window extends to the bottom of the circuit board loading box, and a material resisting cylinder is installed on the side wall of the circuit board loading box, and the telescopic shaft of the material resisting cylinder movably penetrates into the circuit board loading box and is connected with a material resisting plate, the material resisting plate and the pushing plate are arranged opposite to each other, and a loading shaft is rotatably provided on one end of the material resisting plate close to the push plate.

[0009] Furthermore, the chip loading column is installed on a loading platform, a linear drive module is vertically arranged on one side of the chip loading column, a top plate is arranged in the chip loading column, an avoidance groove is opened on the side wall of the chip loading column, the avoidance groove extends to the bottom of the chip loading column, the sliding seat of the linear drive module is connected with a horizontal connecting rod, and the horizontal connecting rod passes through the avoidance groove to connect the top plate.

[0010] Furthermore, the multi-directional conveying mechanism includes a U-shaped bracket, a chip loading assembly and a circuit board loading assembly, the chip loading assembly and the circuit board loading assembly are arranged alternately up and down, the chip loading assembly includes a chip beam, a chip slide and a chip lifting seat, the chip beam is slidably installed on the U-shaped bracket, the chip slide is slidably set on the chip beam, the moving direction of the chip slide is perpendicular to the moving direction of the chip beam on the horizontal plane, a chip loading cylinder is vertically installed on the chip slide, the chip lifting seat is installed on the telescopic axis of the chip loading cylinder, a negative pressure loading pipe is installed at the bottom of the chip lifting seat, the circuit board loading assembly includes a circuit board beam, a circuit board slide, a circuit board lift The lowering seat and the flip plate, the circuit board beam is slidably arranged on the U-shaped bracket, the circuit board slide plate is slidably arranged on the circuit board beam, the moving direction of the circuit board beam is perpendicular to the moving direction of the circuit board slide plate in the horizontal plane, a circuit board feeding cylinder is vertically installed on the circuit board slide plate, the circuit board lifting seat is installed on the telescopic shaft of the circuit board feeding cylinder, the flip plate is rotatably installed on the bottom of the circuit board lifting seat, a negative pressure suction cup is installed on the circuit board lifting seat, the circuit board feeding box is provided with an avoidance window on the side wall close to the circuit board feeding assembly, the avoidance window extends to the top of the circuit board feeding box, and the negative pressure suction cup enters from the avoidance window to load the circuit board.

[0011] Furthermore, a first screw rod groove is horizontally opened on the U-shaped bracket, a second screw rod is rotatably arranged in the first screw rod groove, one end of the chip beam is threadedly mounted on the second screw rod, a second screw rod groove is opened at the bottom of the chip beam, a third screw rod is rotatably arranged in the second screw rod groove, a first screw rod slider is threadedly mounted on the third screw rod, the chip slider is connected to the first screw rod slider, a first motor is installed on the U-shaped bracket, the output shaft of the first motor is transmission-connected to the second screw rod, a second motor is installed at one end of the chip beam, and the output shaft of the second motor is transmission-connected to the third screw rod.

[0012] Further, a third lead screw groove is horizontally formed in the U-shaped bracket. The third lead screw groove is located below the first lead screw groove. A fourth lead screw is rotatably arranged in the third lead screw groove. The circuit board cross beam is threadedly sleeved on the fourth lead screw. A third motor is installed on the U-shaped bracket. The output shaft of the third motor is drivingly connected to the fourth lead screw. A fourth lead screw groove is formed at the bottom of the circuit board cross beam. A fifth lead screw is rotatably arranged in the fourth lead screw groove. A second lead screw slider is threadedly sleeved on the fifth lead screw. The circuit board slide plate is connected to the second lead screw slider. A fourth motor is installed at one end of the circuit board cross beam. The output shaft of the fourth motor is drivingly connected to the fifth lead screw. An installation notch is formed at the bottom of the circuit board lifting seat. A rotating main shaft is rotatably arranged in the installation notch. The shape of the turning plate is an inverted T shape. The turning plate is fixedly sleeved on the rotating main shaft. A fifth motor is installed on the side wall of the circuit board lifting seat. The output shaft of the fifth motor is drivingly connected to the rotating main shaft.

[0013] A method for welding circuit board chips to prevent deviation, using the above welding device, includes the following steps: S1. Circuit board loading: Load the circuit board into the welding positioning groove so that the upper surface of the circuit board is completely exposed. S2. Chip welding holes tin plating: Deposit a layer of tin on the chip welding holes through a welding robot. S3. Heat the tin on the welding holes through the heating wires on the hot melt plate so that the tin layer is in a hot melt state. S4. Load the chip onto the circuit board through the rectangular groove, then reset the hot melt mechanism, and position the chip in advance through tin plating. S5. Finally, perform full welding on the chip through the welding robot to complete the chip welding operation.

[0014] The beneficial effects of the present invention are: First, pre-apply a layer of solder to the chip welding area of the circuit board. Contact the solder through the heating wires of the hot melt plate. The heat generated by the heating wires keeps the solder in a molten state all the time. Then load the chip onto the circuit board so that the pins of the circuit board correspond to the welding holes on the circuit board. Then remove the hot melt plate, and the molten tin cools and fixes the pins of the circuit board, so that the position of the chip can be positioned and restricted before welding. Finally, perform full welding on the chip through the welding robot, which can ensure that the chip will not move during the welding process, greatly reducing the welding defect rate and improving the welding quality. Description of the Drawings

[0015] Figure 1 is a partial structural schematic diagram of a circuit board chip welding device for preventing deviation according to the present invention Figure 1 ; Figure 2 For Figure 1 the enlarged view at position B in Figure 3 a partial structural schematic diagram of a circuit board chip soldering device for preventing deviation according to the present invention Figure 2 ; Figure 4 a partial structural schematic diagram of a circuit board chip soldering device for preventing deviation according to the present invention Figure 3 ; Figure 5 a partial structural schematic diagram of a circuit board chip soldering device for preventing deviation according to the present invention Figure 4 ; Figure 6 a structural schematic diagram of a vertical plate in a circuit board chip soldering device for preventing deviation according to the present invention; Figure 7 a partial structural schematic diagram of a circuit board chip soldering device for preventing deviation according to the present invention Figure 5 ; Figure 8 For Figure 7 the enlarged view at position A in Fig. 9 a structural schematic diagram of a circuit board chip soldering device for preventing deviation according to the present invention; In the figure, 1 - soldering workbench, 2 - soldering robot, 3 - soldering positioning groove, 4 - horizontal sliding seat, 5 - vertical plate, 6 - hot melt plate, 7 - rectangular groove, 8 - hot melt wire, 9 - strip groove, 10 - first lead screw, 11 - pushing cylinder, 12 - connecting rod, 13 - fixing body, 14 - lifting body, 15 - control cavity, 16 - sliding strip, 17 - electromagnet, 18 - permanent magnet, 19 - spring, 20 - limiting screw, 21 - distance measuring sensor, 22 - circuit board loading box, 23 - chip loading column, 24 - storage groove, 25 - pin slot, 26 - pushing conveyor belt, 27 - pushing plate, 28 - pushing window, 29 - material pressing cylinder, 30 - material pressing plate, 31 - loading shaft, 32 - loading platform, 33 - linear driving module, 34 - ejecting plate, 35 - avoiding groove, 36 - horizontal connecting rod, 37 - U-shaped bracket, 38 - chip cross beam, 39 - chip sliding plate, 40 - chip lifting seat, 41 - chip loading cylinder, 42 - negative pressure loading pipe, 43 - circuit board cross beam, 44 - circuit board sliding plate, 45 - circuit board lifting seat, 46 - flipping plate, 47 - circuit board loading cylinder, 48 - negative pressure suction cup, 49 - avoiding window, 50 - first lead screw groove, 51 - second lead screw, 52 - second lead screw groove, 53 - third lead screw, 54 - first motor, 55 - second motor, 56 - third lead screw groove, 57 - fourth lead screw, 58 - third motor, 59 - fourth lead screw groove, 60 - fifth lead screw, 61 - installation notch, 62 - rotating main shaft, 63 - fourth motor, 64 - fifth motor. Detailed implementation manners

[0016] The technical solution of the present invention is further described in detail below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0017] Embodiment 1: like Figures 1 to 9 As shown, an anti-deviating circuit board chip welding device comprises a welding workbench 1, a welding robot 2 is installed on the welding workbench 1, a welding positioning groove 3 is opened on the welding workbench 1, the outer dimensions of the welding positioning groove 3 match the outer dimensions of the circuit board, a hot melt mechanism is arranged on the welding workbench 1, and the hot melt mechanism comprises a horizontal slide 4, a vertical plate 5 and a hot melt plate 6, the horizontal slide 4 is slidably arranged on the welding workbench 1, the sliding direction of the horizontal slide 4 is parallel to the welding positioning groove 3, the vertical plate 5 is fixed on the horizontal slide 4, and the hot melt plate 6 is slidably arranged on the vertical plate 5, the moving direction of the vertical plate 5 is perpendicular to the direction of one end of the horizontal slide 4 on the water surface, a rectangular groove 7 is penetrated in the middle of the hot melt plate 6, and a plurality of hot fuses 8 are arranged on the two opposite inner walls of the rectangular groove 7, and the plurality of hot fuses 8 are arranged at equal intervals in the horizontal direction. First, the chip welding hole of the circuit board is tinned by the welding robot 2, and the hot fuse 8 is located between two adjacent welding holes, which is used to make the tin in a hot-melt state. A feeding mechanism is also included, which is used to feed the circuit board into the welding positioning groove 3, and at the same time, the chip can be fed onto the circuit board. When welding, the feeding mechanism First, place the circuit board in the welding positioning groove 3, and limit the circuit board through the welding positioning groove 3 to prevent deviation during welding. Then, the welding robot 2 first applies a layer of solder on the chip welding area of ​​the circuit board. Generally, for a rectangular welding area, only any two side welding holes need to be coated. After the solder coating is completed, the hot melt plate 6 moves to the chip welding area of ​​the circuit board, and the hot fuse 8 is inserted into the solder. The solder is melted by the heat generated by the hot fuse 8, so that the solder always remains in a liquid state. Then, the chip is loaded onto the circuit board through the loading mechanism, and the chip is positioned and loaded in the chip welding area through the rectangular groove 7, so that the pins of the chip correspond to the chip welding holes on the circuit board. At the same time, the solder in the liquid state will not limit the position of the chip. The chip can be fine-tuned on the circuit board so that the pins correspond to the chip welding holes one by one. When the chip loading is completed, the hot melt plate 6 is removed from the circuit board. At this time, the solder quickly cools and solidifies, thereby limiting the position of the chip. Finally, the welding robot 2 welds the chip, which can ensure that the chip will not move during the welding process, greatly reducing the welding defect rate and improving the welding quality. The movement of the horizontal slide 4 can adjust the X-axis position of the hot melt plate 6, and the movement of the hot melt plate 6 can adjust the Y-axis position, thereby adjusting the working position of the hot melt plate 6 so that the hot fuse 8 is located between two adjacent welding holes, so that during the chip loading process on the circuit board, the hot melt plate 6 does not need to be removed and will not interfere with the chip.

[0018] According to the above correspondence, a welding method for preventing deviation is provided, comprising the following steps: S1, loading the circuit board; loading the circuit board into the welding positioning groove 3 so that the upper surface of the circuit board is completely exposed; S2, tinning the chip solder holes: plating a layer of tin on the chip solder holes by the welding robot 2; S3, heating the tin on the soldering hole by the hot-melt wire on the hot-melt plate 6, so that the tin layer is in a hot-melt state; S4, loading the chip onto the circuit board through the rectangular slot 7, then resetting the hot melt mechanism, and positioning the chip by tinning in advance; S5. Finally, the chip is fully welded by the welding robot 2 to complete the chip welding operation.

[0019] Embodiment 2: Based on the first embodiment, Figures 1 to 6As shown, a strip groove 9 is provided on the top surface of the welding workbench 1, a first screw rod 10 is rotatably arranged in the strip groove 9, a horizontal slide 4 is slidably adapted to the strip groove 9, and the horizontal slide 4 is threadedly mounted on the first screw rod 10, a pushing cylinder 11 is installed on the vertical plate 5, a connecting rod 12 is connected to the telescopic shaft of the pushing cylinder 11, a thread is provided on the end of the connecting rod 12 away from the pushing cylinder 11, the connecting rod 12 is threadedly connected to the hot melt plate 6, the hot melt wire 8 is in the shape of an arc convex downward, the first screw rod 10 is driven by a motor installed on the welding workbench 1, and the first screw rod 10 rotates to make the horizontal slide 4 thereon move horizontally, and by pushing The expansion and contraction of the cylinder 11 drives the hot melt plate 6 to move, so that the position of the hot melt plate 6 can be adjusted so that the hot melt plate 6 corresponds to the chip welding area on the circuit board. The vertical plate 5 includes a fixed body 13 and a lifting body 14. The fixed body 13 is connected to the horizontal slide 4. A control cavity 15 is arranged in the fixed body 13. The lifting body 14 is located directly above the fixed body 13. A slide bar 16 is fixed to the bottom of the lifting body 14. The slide bar 16 is slidably arranged in the fixed body 13. An electromagnet 17 is installed in the control cavity 15. One end of the slide bar 16 extends to the control cavity 15 and is connected to a permanent magnet 18. The electromagnet 17 generates a magnetic field with a different magnetic property from the permanent magnet 18 when it is energized. The spring 19 is arranged between the electromagnet 17 and the permanent magnet 18, the top of the fixed body 13 is threadedly connected with a limit screw 20, and the bottom of the lifting body 14 is installed with a distance sensor 21, and the limit screw 20 is located on the detection path of the distance sensor 21. When the hot melt mechanism is working, the position of the horizontal slide 4 is adjusted according to the installation position of the chip, so that the X-axial position of the hot melt plate 6 corresponds to the welding position of the chip. For the subsequent batch production of circuit boards, there is no need to reposition the position of the horizontal slide 4, and the cylinder 11 is pushed to drive the hot melt plate 6 to move to the top of the chip welding area. Then, the electromagnet 17 is energized, and the electromagnet 17 attracts the permanent magnet 18 to make the lifting body 14 squeeze the spring 19 and move downward, so that the hot melt plate 6 contacts the circuit board, and the bottom of the hot fuse 8 is located above the bottom of the hot melt plate 6. After the hot melt plate 6 contacts the circuit board, the hot fuse 8 does not contact the circuit board, and the hot fuse 8 is inserted into the solder. The hot fuse 8 is energized to heat the hot fuse 8, so that the solder remains in a liquid state. When the chip loading is completed, the electromagnet 17 is powered off, and the lifting body 14 moves upward under the reaction force of the spring 19, so that the hot melt plate 6 is located above the chip, and finally the cylinder 11 is pushed to contract to drive the hot melt plate 6 to reset, so that it does not affect the welding operation of the welding robot 2;It should be noted that, due to the different thicknesses of different circuit boards, the descending position of the lifting body 14 needs to be adjusted accordingly for different circuit boards so that the hot melt plate 6 can smoothly contact the circuit board without interfering with the circuit board. For this purpose, a limit screw 20 is provided to control the descending position of the corresponding lifting body 14. When the lifting body 14 contacts the limit screw 20, the lifting body 14 cannot continue to move downward. The limit height can be adjusted by rotating the limit screw 20, and the distance sensor 21 can accurately reflect the descending height of the lifting body 14, so that the position of the limit screw 20 can be adjusted according to the different thicknesses of the circuit board, and then the descending position of the lifting body 14 is adjusted so that the hot melt plate 6 can accurately contact the circuit board. ;

[0020] Embodiment three: Based on the second embodiment, Figures 1 to 8 As shown, the loading mechanism includes a circuit board loading box 22, a chip loading column 23 and a multi-directional conveying mechanism. The circuit board loading box 22 and the chip loading column 23 are respectively arranged at two ends of the welding workbench 1. A circuit board storage slot is provided on the top of the circuit board loading box 22. The circuit boards are stacked in the circuit board loading box 22 along the horizontal direction, and the circuit boards are arranged in a vertical state. A storage slot 24 is provided on the top of the chip loading column 23 along its own axial direction. A pin slot 25 is provided on the side wall of the storage slot 24. The pin slot 25 extends to the top of the chip loading column 23. The chip is stacked in the storage slot 24 along the axial direction of the chip loading column 23, and the pins of the chip are located in the pin slot 25. The circuit boards are stacked in the circuit board loading box 22, the circuit board is positioned by the circuit board loading box 22, and the circuit boards are stacked in the circuit board loading box 22 in a vertical state, so that the circuit boards will not be squeezed against each other and cause damage. The chip is light in weight and small in size, and is directly stacked in the storage slot 24 of the chip loading column 23, which will also not cause chip squeezing damage. The circuit board in the circuit board loading box 22 is first placed in the welding positioning slot 3 through the multi-directional conveying mechanism, and then the hot melt mechanism moves to the chip welding area. At the same time, the multi-directional conveying mechanism loads the chip to the chip welding area to complete the preliminary welding positioning of the chip. Finally, the hot melt mechanism and the multi-directional conveying mechanism are reset, and the welding robot 2 performs the final welding operation on the chip.

[0021] Embodiment 4: Based on the third embodiment, Figures 1 to 8As shown, the chip loading column 23 is installed on the loading platform 32, a linear drive module 33 is vertically arranged on one side of the chip loading column 23, a top plate 34 is arranged in the chip loading column 23, and a side wall of the chip loading column 23 is provided with an avoidance groove 35, the avoidance groove 35 extends to the bottom of the chip loading column 23, the slide seat of the linear drive module 33 is connected with a horizontal connecting rod 36, the horizontal connecting rod 36 passes through the avoidance groove 35 to connect the top plate 34, and the top plate 34 is driven to move upward by the linear drive module 33, each time the top plate 34 moves upward by the thickness of a chip, thereby ejecting the chips from the storage slot 24 in turn, so that the loading position of the chip remains unchanged each time, and the accuracy of loading is ensured; secondly, the side wall of the chip loading column 23 is fixed by bolts It is connected to the loading platform 32. After the chip loading in the chip loading column 23 is completed, the fully loaded chip loading column 23 is removed and replaced; the multi-directional conveying mechanism includes a U-shaped bracket 37, a chip loading assembly and a circuit board loading assembly. The chip loading assembly and the circuit board loading assembly are arranged alternately up and down. The chip loading assembly includes a chip beam 38, a chip slide 39 and a chip lifting seat 40. The chip beam 38 is slidably installed on the U-shaped bracket 37. The chip slide 39 is slidably set on the chip beam 38. The moving direction of the chip slide 39 is perpendicular to the moving direction of the chip beam 38 in the horizontal plane. A chip loading cylinder 41 is vertically installed on the chip slide 39. The chip lifting seat 40 is installed on the telescopic axis of the chip loading cylinder 41. A negative pressure feeding tube 42 is installed at the bottom of the lowering seat 40, a first screw groove 50 is horizontally opened on the U-shaped bracket 37, a second screw 51 is rotatably arranged in the first screw groove 50, one end of the chip beam 38 is threadedly mounted on the second screw 51, a second screw groove 52 is opened at the bottom of the chip beam 38, a third screw 53 is rotatably arranged in the second screw groove 52, a first screw slider is threadedly mounted on the third screw 53, the chip slide plate 39 is connected to the first screw slider, a first motor 54 is installed on the U-shaped bracket 37, the output shaft of the first motor 54 is transmission-connected to the second screw 51, a second motor 55 is installed at one end of the chip beam 38, the output shaft of the second motor 55 is transmission-connected to the third screw 53, and the specific loading process of the chip is as follows: The first motor 54 drives the second screw rod 51 to rotate, so that the chip beam 38 moves linearly along the axial direction of the second screw rod 51, so that the negative pressure feeding tube 42 has the freedom to move along the Y-axis direction, and the second motor 55 drives the third screw rod 53 to rotate, so that the first screw rod slider drives the chip slide plate 39 to move along the axial direction of the third screw rod 53, so that the negative pressure feeding tube 42 has the freedom to move along the X-axis direction, and the chip feeding cylinder 41 drives the chip lifting seat 40 to move up and down, so that the negative pressure feeding tube 42 has the freedom to move along the Z-axis direction, so that the negative pressure feeding tube 42 has the freedom to move in three directions in the spatial coordinate system. After the negative pressure feeding tube 42 negatively adsorbs the chip, the chip can be accurately loaded into the welding area of ​​the circuit board.

[0022] Embodiment five: Based on the fourth embodiment, Figures 1 to 8 As shown, a push conveyor belt 26 is provided at the bottom of the circuit board loading box 22, and the circuit board loading box 22 is connected to the conveying frame of the push conveyor belt 26 by bolts. A push plate 27 is fixed on the conveying plane of the push conveyor belt 26. A push window 28 is opened through the side wall of the circuit board loading box 22, and the push window 28 extends to the bottom of the circuit board loading box 22. A material-repelling cylinder 29 is installed on the side wall of the circuit board loading box 22. The telescopic shaft of the material-repelling cylinder 29 movably penetrates into the circuit board loading box 22 and is connected to a material-repelling plate 30. The material-repelling plate 30 is arranged opposite to the push plate 27, and the material-repelling plate 30 is close to the push plate 27. A loading shaft 31 is rotatably provided at one end. In order to ensure that the loading position of the circuit board remains unchanged each time, a pushing conveyor belt 26 is provided. In the initial state, the abutting plate 30 contacts the inner wall of the circuit board loading box 22, so that the circuit board loading box 22 has the largest storage space, and the circuit boards are neatly stacked in the circuit board loading box 22. Then, the circuit board loading box 22 is installed on the conveying frame of the pushing conveyor belt 26. Then, the pushing conveyor belt 26 drives the pushing plate 27 to move. The pushing plate 27 enters the circuit board loading box 22 through the pushing window 28 to contact the circuit board. The two ends of the stacked circuit boards are loaded in sequence from the end close to the welding workbench 1. The circuit boards are moved upward and out of the circuit board loading box 22. In the process of the circuit boards moving upward, the loading shaft 31 is in rolling contact with the circuit boards, which will not cause friction damage to the circuit boards. When the loaded circuit boards are separated from the loading shaft 31 and the loaded circuit boards are not completely moved out of the circuit board loading box 22, the abutting cylinder 29 drives the abutting plate 30 to move close to the next circuit board, so that the loading shaft 31 abuts on the next circuit board to complete the limit. Since the loaded circuit boards are not completely moved out of the circuit board loading box 22, the loading cylinder 29 drives the abutting plate 30 to move close to the next circuit board, so that the loading shaft 31 abuts on the next circuit board to complete the limit. The circuit board still partially contacts the next circuit board, and can limit the position of the next circuit board. After the loading shaft 31 contacts the next circuit board, the loaded circuit board is completely moved out of the circuit board loading box 22, which can ensure that the subsequent circuit boards will not be offset due to the gaps during the loading process. After the loaded circuit board moves out of the circuit board loading box 22, the material-receiving cylinder 29 drives the material-receiving plate 30 to reset. At the same time, the pushing conveyor belt 26 drives the pushing plate 27 to move the thickness of a circuit board, so that the next circuit board is in a loading state, thereby ensuring that the loading position of the circuit board is consistent each time, and ensuring the accuracy of the loading.

[0023] Embodiment six: Based on Example 5, Figures 1 to 5As shown, the circuit board loading component includes a circuit board cross beam 43, a circuit board slide plate 44, a circuit board lifting seat 45 and a turning plate 46. The circuit board cross beam 43 is slidably arranged on the U-shaped bracket 37. The circuit board slide plate 44 is slidably arranged on the circuit board cross beam 43. The moving direction of the circuit board cross beam 43 is perpendicular to the moving direction of the circuit board slide plate 44 on the horizontal plane. A circuit board loading cylinder 47 is vertically installed on the circuit board slide plate 44. The circuit board lifting seat 45 is installed on the telescopic shaft of the circuit board loading cylinder 47. The turning plate 46 is rotatably installed at the bottom of the circuit board lifting seat 45. A negative pressure suction cup 48 is installed on the circuit board lifting seat 45. An avoidance window 49 is opened on the side wall of the circuit board loading box 22 close to the circuit board loading component. The avoidance window 49 extends to the top of the circuit board loading box 22. The negative pressure suction cup 48 enters through the avoidance window 49 to load the circuit board. A third lead screw groove 56 is horizontally opened on the U-shaped bracket 37. The third lead screw groove 56 is located below the first lead screw groove 50. A fourth lead screw 57 is rotatably arranged in the third lead screw groove 56. The circuit board cross beam 43 is threadedly sleeved on the fourth lead screw 57. A third motor 58 is installed on the U-shaped bracket 37. The output shaft of the third motor 58 is drivingly connected to the fourth lead screw 57. A fourth lead screw groove 59 is opened at the bottom of the circuit board cross beam 43. A fifth lead screw 60 is rotatably arranged in the fourth lead screw groove 59. A second lead screw slider is threadedly sleeved on the fifth lead screw 60. The circuit board slide plate 44 is connected to the second lead screw slider. A fourth motor 63 is installed at one end of the circuit board cross beam 43. The output shaft of the fourth motor 63 is drivingly connected to the fifth lead screw 60. An installation notch 61 is opened at the bottom of the circuit board lifting seat 45. A rotating main shaft 62 is rotatably arranged in the installation notch 61. The turning plate 46 is in the shape of an inverted T and is fixedly sleeved on the rotating main shaft 62. A fifth motor 64 is installed on the side wall of the circuit board lifting seat 45. The output shaft of the fifth motor 64 is drivingly connected to the rotating main shaft 62. In the initial state, the negative pressure suction cup 48 is perpendicular to the circuit board. The third motor 58 drives the fourth lead screw 57 to rotate, so that the circuit board cross beam 43 makes a linear movement along the axial direction of the fourth lead screw 57, so that the negative pressure suction cup 48 has the freedom of movement in the Y-axis direction. The fourth motor 63 drives the fifth lead screw 60 to rotate, so that the circuit board slide plate 44 makes a linear movement along the axial direction of the fifth lead screw 60, so that the negative pressure suction cup 48 has the freedom of movement in the X-axis direction. The telescopic movement of the circuit board loading cylinder 47 drives the circuit board lifting seat 45 to move up and down, so that the negative pressure suction cup 48 has the freedom of movement in the Z-axis direction. Thus, the negative pressure suction cup 48 has the freedom of movement in three directions in the space coordinate system, so that the negative pressure suction cup 48 moves from the avoidance window 49 to the inside of the circuit board loading box 22 to adsorb the circuit board, and then lifts the circuit board out of the circuit board loading box 22. Then, the fifth motor 64 drives the rotating main shaft 62 to rotate, so that the circuit board rotates downward by 90°, so that the circuit board is in a horizontal state. Finally, the circuit board is placed in the welding positioning groove 3 to complete the circuit board loading operation.

Claims

1. A circuit board chip welding device with anti-deviating function, comprising a welding workbench (1), characterized in that: A welding robot (2) is installed on the welding workbench (1); a welding positioning groove (3) is provided on the welding workbench (1); the outer dimensions of the welding positioning groove (3) match the outer dimensions of the circuit board; a hot melt mechanism is provided on the welding workbench (1); the hot melt mechanism comprises a horizontal slide seat (4), a vertical plate (5) and a hot melt plate (6); the horizontal slide seat (4) is slidably arranged on the welding workbench (1); the sliding direction of the horizontal slide seat (4) is parallel to the welding positioning groove (3); the vertical plate (5) is fixed on the horizontal slide seat (4) and the vertical plate (5) is fixed on the horizontal slide seat (4). On the slide seat (4), the hot melt plate (6) is slidably arranged on the vertical plate (5), the moving direction of the vertical plate (5) is perpendicular to the direction of one end of the horizontal slide seat (4) on the water surface, a rectangular groove (7) is penetrated through the middle of the hot melt plate (6), and two opposite inner walls of the rectangular groove (7) are arranged with a plurality of hot fuses (8), and the plurality of hot fuses (8) are arranged at equal intervals along the horizontal direction. Tin is first plated on the chip soldering hole of the circuit board by the welding robot (2), and the hot fuse (8) is located between two adjacent soldering holes to keep the tin in a hot melt state.

2. The circuit board chip welding device for preventing deviation according to claim 1, characterized in that: The top surface of the welding workbench (1) is provided with a strip groove (9), a first screw rod (10) is rotatably arranged in the strip groove (9), the horizontal slide seat (4) is slidably adapted to the strip groove (9), and the horizontal slide seat (4) is threadedly sleeved on the first screw rod (10), a pushing cylinder (11) is installed on the vertical plate (5), the telescopic shaft of the pushing cylinder (11) is connected to a connecting rod (12), the connecting rod (12) is provided with a thread at one end away from the pushing cylinder (11), the connecting rod (12) is threadedly connected to the hot melt plate (6), and the hot melt wire (8) is in the shape of an arc convex downward.

3. The circuit board chip welding device for preventing deviation according to claim 2, characterized in that: The vertical plate (5) comprises a fixed body (13) and a lifting body (14); the fixed body (13) is connected to the horizontal slide seat (4); a control chamber (15) is arranged in the fixed body (13); the lifting body (14) is located directly above the fixed body (13); a slide bar (16) is fixed at the bottom of the lifting body (14); the slide bar (16) is slidably arranged on the fixed body (13); an electromagnet (17) is installed in the control chamber (15); the slide bar (16) ) is extended from one end of the control cavity (15) and connected to a permanent magnet (18); the electromagnet (17) generates a magnetic pole having a different magnetic property from that of the permanent magnet (18) when energized; a spring (19) is provided between the electromagnet (17) and the permanent magnet (18); a limit screw (20) is threadedly connected to the top of the fixed body (13); a distance sensor (21) is installed at the bottom of the lifting body (14); and the limit screw (20) is located on a detection path of the distance sensor (21).

4. The circuit board chip welding device for preventing deviation according to claim 1, characterized in that: The invention also comprises a loading mechanism, the loading mechanism comprising a circuit board loading box (22), a chip loading column (23) and a multi-directional conveying mechanism, the circuit board loading box (22) and the chip loading column (23) are respectively arranged at two ends of the welding workbench (1), the top of the circuit board loading box (22) is provided with a circuit board storage slot, the circuit boards are stacked in the circuit board loading box (22) along a horizontal direction, and the circuit boards are arranged in a vertical state, the top of the chip loading column (23) is provided with a storage slot (24) penetrating along its own axial direction, the side wall of the storage slot (24) is provided with a pin slot (25), the pin slot (25) extends to the top of the chip loading column (23), the chip is stacked in the storage slot (24) along the axial direction of the chip loading column (23), and the pins of the chip are located in the pin slot (25).

5. The circuit board chip welding device for preventing deviation according to claim 4, characterized in that: A pushing conveyor belt (26) is arranged at the bottom of the circuit board loading box (22), and the circuit board loading box (22) is connected to the conveying frame of the pushing conveyor belt (26) by bolts. A pushing plate (27) is fixed on the conveying plane of the pushing conveyor belt (26). A pushing window (28) is opened through the side wall of the circuit board loading box (22), and the pushing window (28) extends to the bottom of the circuit board loading box (22). A material-repelling cylinder (29) is installed on the side wall of the circuit board loading box (22), and the telescopic shaft of the material-repelling cylinder (29) is movably inserted into the circuit board loading box (22) and connected to a material-repelling plate (30). The material-repelling plate (30) is arranged opposite to the pushing plate (27), and a loading shaft (31) is rotatably arranged at one end of the material-repelling plate (30) close to the pushing plate (27).

6. The circuit board chip welding device for preventing deviation according to claim 4, characterized in that: The chip loading column (23) is installed on the loading platform (32), a linear drive module (33) is vertically arranged on one side of the chip loading column (23), a top plate (34) is arranged in the chip loading column (23), a side wall of the chip loading column (23) is provided with an avoidance groove (35), the avoidance groove (35) extends to the bottom of the chip loading column (23), the slide seat of the linear drive module (33) is connected to a horizontal connecting rod (36), and the horizontal connecting rod (36) passes through the avoidance groove (35) to connect the top plate (34).

7. The circuit board chip welding device for preventing deviation according to any one of claims 5 or 6, characterized in that: The multi-directional conveying mechanism comprises a U-shaped bracket (37), a chip loading assembly and a circuit board loading assembly. The chip loading assembly and the circuit board loading assembly are arranged alternately up and down. The chip loading assembly comprises a chip beam (38), a chip slide plate (39) and a chip lifting seat (40). The chip beam (38) is slidably mounted on the U-shaped bracket (37). The chip slide plate (39) is slidably arranged on the chip beam (38). The moving direction of the chip slide plate (39) is perpendicular to the moving direction of the chip beam (38) on a horizontal plane. A chip loading cylinder (41) is vertically mounted on the chip slide plate (39). The chip lifting seat (40) is mounted on the telescopic shaft of the chip loading cylinder (41). A negative pressure loading pipe (42) is installed at the bottom of the chip lifting seat (40). The circuit board loading assembly comprises a circuit board beam (43), a circuit board slide plate (44), a circuit board lifting seat (45) and a flip plate. (46), the circuit board crossbeam (43) is slidably arranged on the U-shaped bracket (37), the circuit board slide (44) is slidably arranged on the circuit board crossbeam (43), the moving direction of the circuit board crossbeam (43) is perpendicular to the moving direction of the circuit board slide (44) on a horizontal plane, a circuit board loading cylinder (47) is vertically installed on the circuit board slide (44), the circuit board lifting seat (45) is installed on the telescopic shaft of the circuit board loading cylinder (47), the flip plate (46) is rotatably installed on the bottom of the circuit board lifting seat (45), a negative pressure suction cup (48) is installed on the circuit board lifting seat (45), and a side wall of the circuit board loading box (22) close to the circuit board loading assembly is provided with an avoidance window (49), the avoidance window (49) extends to the top of the circuit board loading box (22), and the negative pressure suction cup (48) enters from the avoidance window (49) to load the circuit board.

8. The circuit board chip welding device for preventing deviation according to claim 7, characterized in that: A first screw rod groove (50) is horizontally opened on the U-shaped bracket (37), a second screw rod (51) is rotatably arranged in the first screw rod groove (50), one end of the chip cross beam (38) is threadedly mounted on the second screw rod (51), a second screw rod groove (52) is opened at the bottom of the chip cross beam (38), a third screw rod (53) is rotatably arranged in the second screw rod groove (52), a first screw rod slider is threadedly mounted on the third screw rod (53), the chip slider (39) is connected to the first screw rod slider, a first motor (54) is installed on the U-shaped bracket (37), the output shaft of the first motor (54) is transmission-connected to the second screw rod (51), a second motor (55) is installed at one end of the chip cross beam (38), the output shaft of the second motor (55) is transmission-connected to the third screw rod (53).

9. The circuit board chip welding device for preventing deviation according to claim 8, characterized in that: A third lead screw groove (56) is horizontally formed in the U-shaped bracket (37). The third lead screw groove (56) is located below the first lead screw groove (50). A fourth lead screw (57) is rotatably arranged in the third lead screw groove (56). The circuit board cross beam (43) is threadedly sleeved on the fourth lead screw (57). A third motor (58) is installed on the U-shaped bracket (37). The output shaft of the third motor (58) is drivingly connected to the fourth lead screw (57). A fourth lead screw groove (59) is formed at the bottom of the circuit board cross beam (43). A fifth lead screw (60) is rotatably arranged in the fourth lead screw groove (59). A second lead screw slider is threadedly sleeved on the fifth lead screw (60). The circuit board slide plate (44) is connected to the second lead screw slider. A fourth motor (63) is installed at one end of the circuit board cross beam (43). The output shaft of the fourth motor (63) is drivingly connected to the fifth lead screw (60). An installation notch (61) is formed at the bottom of the circuit board lifting seat (45). A rotating main shaft (62) is rotatably arranged in the installation notch (61). The shape of the turning plate (46) is an inverted T shape. The turning plate (46) is fixedly sleeved on the rotating main shaft (62). A fifth motor (64) is installed on the side wall of the circuit board lifting seat (45). The output shaft of the fifth motor (64) is drivingly connected to the rotating main shaft (62).

10. A circuit board chip welding method for preventing deviation, using the circuit board chip welding device for preventing deviation as claimed in claim 1, characterized in that: The method includes the following steps: S1. Circuit board feeding: Feed the circuit board into the welding positioning groove (3) so that the upper surface of the circuit board is completely exposed; S2. Chip welding hole tin plating: Deposit a layer of tin on the chip welding holes through the welding robot (2); S3. Heat the tin on the welding holes through the hot melt wire on the hot melt plate (6) to make the tin layer in a hot melt state; S4. Feed the chip onto the circuit board through the rectangular groove (7), then reset the hot melt mechanism, and position the chip in advance by tin plating; S5. Finally, perform full welding on the chip through the welding robot (2) to complete the welding operation of the chip.

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