Resin aluminum cover plate for circuit board drilling and preparation method thereof

Abstract

The invention discloses a resin aluminum cover plate for circuit board drilling and a preparation method thereof.The preparation method comprises the steps that modified polyurethane is dissolved in water and then evenly mixed with modified filler, modified paint is prepared, the surface of aluminum foil is coated with the modified paint, drying is conducted, and the resin aluminum cover plate is prepared. Compared with traditional polyethylene oxide and polyethylene glycol, the high temperature resistance and the stability are better, large-area surface coating melting caused by overheating in the drilling process is avoided, the drilling precision is guaranteed, meanwhile, a polyurethane molecule side chain contains a long-chain ester group, the lubricating property between a drill bit and resin can be improved, and when the drill bit makes contact with modified filler, the service life of the drill bit is prolonged. When the drill bit is in use, polyethylene glycol on the surface of the modified filler melts, palm oil in pore diameters of the bamboo fibers is released under extrusion of the drill bit, the bamboo fibers can extrude hexagonal boron nitride in the bamboo fibers to form sliding, and then friction between the drill bit and resin is greatly reduced.

Description

Technical Field

[0001] The invention relates to the technical field of resin aluminum cover plate preparation, and in particular to a resin aluminum cover plate for drilling a circuit board and a preparation method thereof. Background Art

[0002] PCB back drilling technology is to remove the non-transmission conductive layer in the via hole after copper deposition by mechanical drilling to ensure the stability of the signal transmission of the retained part, which is conducive to high-speed signal transmission. PCB back drilling technology usually uses a high-frequency electronic induction principle drill to perform back drilling processing. Using a high-frequency electronic conduction circuit, the drill tip starts to calculate and design the depth of drilling from the point where the drill tip contacts the cover plate or PCB board. At present, the covers commonly used for back drilling are epoxy glass fiber cloth covers, phenolic resin covers, aluminum foil covers, and coated aluminum foil covers (resin aluminum foil covers). The resin aluminum foil cover is the best among all the covers, but the resin layer may be worn due to the friction of the drill bit during the drilling process, and the heat generated may affect the performance of the resin layer. If the temperature is too high, the resin layer may be deformed or damaged, thereby affecting its protective effect and positioning accuracy. Summary of the invention

[0003] The purpose of the present invention is to provide a resin aluminum cover plate for circuit board drilling and a preparation method thereof, which solves the problem of low positioning accuracy of the resin aluminum cover plate due to drill bit friction at the current stage.

[0004] The purpose of the present invention can be achieved through the following technical solutions:

[0005] A method for preparing a resin aluminum cover plate for drilling a circuit board comprises the following steps:

[0006] Step A1: lauryl alcohol, acrylic acid, p-toluenesulfonic acid and toluene are uniformly mixed, and reacted for 3-5 hours at a speed of 150-200 r / min and a temperature of 115-120° C. to obtain an intermediate; the intermediate, tetramethyltetrasiloxane, chloroplatinic acid and DMF are mixed, and reacted for 2-4 hours at a speed of 120-150 r / min and a temperature of 80-85° C. to obtain a modified monomer;

[0007] Step A2: octamethylcyclotetrasiloxane, modified monomer, tetramethylammonium hydroxide, tetramethyldisiloxane and dimethyl sulfoxide are mixed uniformly, nitrogen is introduced for protection, and the reaction is carried out for 3-5 hours at a speed of 120-150 r / min and a temperature of 105-110° C. to obtain dihydrogenpolysiloxane; dihydrogenpolysiloxane, allyl alcohol, chloroplatinic acid and DMF are mixed uniformly, and the reaction is carried out for 3-5 hours at a speed of 150-200 r / min and a temperature of 80-90° C. to obtain modified silicone;

[0008] Step A3: isophorone diisocyanate, modified silicone, polytetrahydrofuran and DMF are mixed, stirred at a speed of 120-150 r / min and a temperature of 65-75°C, and dibutyltin dilaurate is added. After reacting for 2-3 hours, 1,4-butanediol and 2-dihydroxybutyric acid are added, and the reaction is continued for 4-6 hours. Triethylamine is added and neutralized to obtain a modified polyurethane. The modified polyurethane is dissolved in deionized water, and a modified filler is added and mixed evenly to obtain a modified coating. The modified coating is coated on the surface of an aluminum foil and dried to obtain a resin aluminum cover.

[0009] Furthermore, the molar ratio of lauryl alcohol to acrylic acid in step A1 is 1:1, and the molar ratio of the intermediate to tetramethyltetrasiloxane is 4:1.

[0010] Furthermore, the molar ratio of octamethylcyclotetrasiloxane, modified monomer, tetramethylammonium hydroxide and tetramethyldisiloxane described in step A2 is 2:0.4:3:2, and the molar ratio of dihydrogenpolysiloxane and acryl alcohol is 1:1.

[0011] Furthermore, the molar ratio of isophorone diisocyanate, modified silicone, polytetrahydrofuran, 1,4-butanediol, 2-dihydroxybutyric acid and triethylamine in step A3 is 6:1:3:1:1.2:1.5, and the mass ratio of modified polyurethane, deionized water and modified filler is 10:30:1-3.

[0012] Further, the modified filler is prepared by the following steps:

[0013] Step B1: Hexagonal boron nitride, sodium hydroxide and deionized water are mixed uniformly, and ultrasonically treated for 1-1.5 hours at a frequency of 20-30kHz and a temperature of 25-30°C, and then heated to 120-125°C, refluxed for 20-25 hours, cooled to room temperature and washed to neutrality to obtain hydroxylated hexagonal boron nitride, and the hydroxylated hexagonal boron nitride is dispersed in ethanol, and KH550 and deionized water are added under stirring at a speed of 200-300r / min and a temperature of 60-70°C, and reacted for 2-3 hours to obtain modified boron nitride;

[0014] Step B2: N-hydroxyphthalimide, copper chloride, sodium hypochlorite and deionized water are mixed evenly, stirred and bamboo cellulose is added at a speed of 200-300 r / min and a temperature of 60-65° C., and the reaction is carried out for 1-1.5 hours, and the filtrate is filtered to remove the filtrate to obtain oxidized bamboo fiber, and the oxidized bamboo fiber, modified boron nitride, dicyclohexylcarbodiimide and toluene are mixed, and the reaction is carried out for 2-3 hours at a speed of 150-200 r / min and a temperature of 40-50° C. to obtain a composite carrier;

[0015] Step B3: The composite carrier, allyl alcohol, p-toluenesulfonic acid and toluene are mixed evenly, and the reaction is carried out at a speed of 120-150r / min and a temperature of 115-120°C for 2-3h to obtain a modified carrier. The modified carrier, 1,3-propanedithiol, benzophenone and DMF are mixed evenly, and irradiated for 10-15s under 365nm ultraviolet light to obtain a functional carrier. The functional carrier is added to palm oil, and ultrasonically treated for 3-5h at a frequency of 20-30kHz. The filtrate is filtered to remove the filtrate to obtain a precursor.

[0016] Step B4: dissolve polyethylene glycol in dichloromethane, add triethylamine, introduce nitrogen protection, stir and add acryloyl chloride at a speed of 120-150r / min and a temperature of 0-5°C, raise the temperature to 25-30°C, react for 2-3h to obtain a coating agent, dissolve the coating agent in deionized water, add benzophenone and the precursor and mix evenly, raise the temperature to 110-120°C to remove the deionized water, and irradiate under 365nm ultraviolet light for 30-60s to obtain a modified filler.

[0017] Furthermore, the dosage ratio of hexagonal boron nitride, sodium hydroxide and deionized water in step B1 is 1 mmol:0.5 mmol:100 mL, and the dosage of KH550 is 3% of the mass of hydroxylated hexagonal boron nitride.

[0018] Furthermore, the dosage ratio of N-hydroxyphthalimide, cupric chloride, sodium hypochlorite, deionized water and bamboo cellulose in step B2 is 10mmo l:10mmo l:50mmo l:100mL:5g, and the mass ratio of oxidized bamboo fiber, modified boron nitride and dicyclohexylcarbodiimide is 5:1:1.

[0019] Furthermore, the molar ratio of carboxyl and propenol on the composite carrier described in step B3 is 1:1, the molar ratio of double bonds and 1,3-propanedithiol on the modified carrier is 1:1, and the usage ratio of the functional carrier and palm oil is 1g:5mL.

[0020] Furthermore, the amount ratio of polyethylene glycol, triethylamine and acryloyl chloride described in step B4 is 10g:2.5mL:2g, the molecular weight of polyethylene glycol is 2000, the amount ratio of coating agent, deionized water and precursor is 5g:10mL:1g, and the mass of the precursor of benzophenone is 1‰.

[0021] The beneficial effects of the invention are as follows: the resin aluminum cover plate for drilling a circuit board disclosed by the invention is prepared by esterification reaction of lauryl alcohol and acrylic acid as raw materials to obtain an intermediate, the intermediate is reacted with tetramethyltetrasiloxane so that the double bond on the intermediate reacts with the SiH bond on the tetramethyltetrasiloxane to obtain a modified monomer, octamethylcyclotetrasiloxane and the modified monomer are ring-opened, and then polymerized with tetramethyldisiloxane to obtain dihydrogenpolysiloxane, the dihydrogenpolysiloxane is reacted with allyl alcohol so that the SiH bond on the dihydrogenpolysiloxane reacts with the double bond on the allyl alcohol to obtain a modified silicone, isophorone diisocyanate, the modified silicone and polytetrahydrofuran are reacted to form a polyurethane prepolymer, 1,4-butanediol and 2-dihydroxybutyric acid are used for chain extension, and finally triethylamine is used for neutralization to obtain a modified polyurethane, the modified polyurethane is dissolved in water and then mixed evenly with a modified filler to obtain a modified coating, and the modified coating is coated on the surface of an aluminum foil and dried to obtain a resin aluminum cover plate.

[0022] The modified filler is prepared by treating hexagonal boron nitride as a raw material with sodium hydroxide to obtain hydroxylated hexagonal boron nitride, treating the hydroxylated hexagonal boron nitride with KH550 to graft amino groups on the surface to obtain modified boron nitride, oxidizing bamboo fiber to graft carboxyl groups on bamboo fiber molecules to obtain oxidized bamboo fiber, reacting the oxidized bamboo fiber with the modified boron nitride to dehydrate the carboxyl groups on the oxidized bamboo fiber and the amino groups on the modified boron nitride to form a composite carrier of oxidized bamboo fiber coated with modified boron nitride, reacting the composite carrier with allyl alcohol to graft carboxyl groups on the surface of the composite carrier with amino groups on the modified boron nitride, and The alcoholic hydroxyl group on propylene alcohol is reacted to obtain a modified carrier, the modified carrier is reacted with 1,3-propanedithiol so that the double bond on the modified carrier reacts with a thiol group on 1,3-propanedithiol to obtain a functional carrier, the functional carrier is added to palm oil, ultrasonically treated to obtain a precursor, polyethylene glycol is reacted with acryloyl chloride so that the alcoholic hydroxyl group on the polyethylene glycol reacts with the acyl chloride group on the acryloyl chloride to obtain a coating agent, the coating agent is coated on the surface of the precursor, and ultraviolet irradiation is performed so that the double bond on the coating agent and the thiol group on the precursor are grafted to obtain a modified filler.

[0023] The surface coating of the resin aluminum cover is silicone-modified polyurethane. Compared with traditional polyethylene oxide and polyethylene glycol, it has better high temperature resistance and stability. The surface coating will not melt over a large area due to overheating during the drilling process, thereby ensuring the drilling accuracy. At the same time, the side chain of the polyurethane molecule contains a long-chain ester group, which can increase the lubricity between the drill bit and the resin. When the drill bit contacts the modified filler, the polyethylene glycol on the surface of the modified filler will melt and release the palm oil in the pore size of the bamboo fiber under the extrusion of the drill bit. The bamboo fiber will squeeze the internal hexagonal boron nitride to form sliding, thereby greatly reducing the friction between the drill bit and the resin. The internal palm oil is not directly in contact with the outside world, so that the resin aluminum cover still has a good lubrication effect after being placed for a long time. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] Embodiment 1: A method for preparing a resin aluminum cover plate for drilling a circuit board, comprising the following steps:

[0026] Step A1: lauryl alcohol, acrylic acid, p-toluenesulfonic acid and toluene are uniformly mixed, and reacted at a speed of 150 r / min and a temperature of 115° C. for 3 h to obtain an intermediate; the intermediate, tetramethyltetrasiloxane, chloroplatinic acid and DMF are mixed, and reacted at a speed of 120 r / min and a temperature of 80° C. for 2 h to obtain a modified monomer;

[0027] Step A2: octamethylcyclotetrasiloxane, modified monomer, tetramethylammonium hydroxide, tetramethyldisiloxane and dimethyl sulfoxide are mixed uniformly, nitrogen is introduced for protection, and the mixture is reacted for 3 hours at a speed of 120 r / min and a temperature of 105° C. to obtain dihydrogenpolysiloxane; dihydrogenpolysiloxane, allyl alcohol, chloroplatinic acid and DMF are mixed uniformly, and the mixture is reacted for 3 hours at a speed of 150 r / min and a temperature of 80° C. to obtain modified silicone;

[0028] Step A3: isophorone diisocyanate, modified silicone, polytetrahydrofuran and DMF are mixed, stirred at a speed of 120 r / min and a temperature of 65°C, and dibutyltin dilaurate is added. After reacting for 2 hours, 1,4-butanediol and 2-dihydroxybutyric acid are added, and the reaction is continued for 4 hours. Triethylamine is added and neutralized to obtain a modified polyurethane. The modified polyurethane is dissolved in deionized water, and a modified filler is added and mixed evenly to obtain a modified coating. The modified coating is coated on the surface of an aluminum foil and dried to obtain a resin aluminum cover.

[0029] The molar ratio of lauryl alcohol and acrylic acid described in step A1 is 1:1, the amount of p-toluenesulfonic acid used is 2% of the mass of acrylic acid, the molar ratio of the intermediate and tetramethyltetrasiloxane is 4:1, and the amount of chloroplatinic acid used is 1‰ of the mass of tetramethyltetrasiloxane.

[0030] The molar ratio of octamethylcyclotetrasiloxane, modified monomer, tetramethylammonium hydroxide and tetramethyldisiloxane described in step A2 is 2:0.4:3:2, the molar ratio of dihydrogenpolysiloxane and allyl alcohol is 1:1, and the amount of chloroplatinic acid used is 1‰ of the mass of dihydrogenpolysiloxane.

[0031] The molar ratio of isophorone diisocyanate, modified silicone, polytetrahydrofuran, 1,4-butanediol, 2-dihydroxybutyric acid and triethylamine described in step A3 is 6:1:3:1:1.2:1.5, the molecular weight of polytetrahydrofuran is 1000, the amount of dibutyltin dilaurate is 3% of the mass of isophorone diisocyanate, and the mass ratio of modified polyurethane, deionized water and modified filler is 10:30:1.

[0032] The modified filler is prepared by the following steps:

[0033] Step B1: Hexagonal boron nitride, sodium hydroxide and deionized water are mixed evenly, and ultrasonically treated for 1 hour at a frequency of 20 kHz and a temperature of 25°C, and then heated to 120°C, refluxed for 20 hours, cooled to room temperature and washed to neutrality to obtain hydroxylated hexagonal boron nitride, and the hydroxylated hexagonal boron nitride is dispersed in ethanol, and KH550 and deionized water are added under stirring at a speed of 200 r / min and a temperature of 60°C, and reacted for 2 hours to obtain modified boron nitride;

[0034] Step B2: N-hydroxyphthalimide, copper chloride, sodium hypochlorite and deionized water are mixed evenly, stirred and bamboo cellulose is added at a speed of 200 r / min and a temperature of 60° C., and the reaction is carried out for 1 hour, and the filtrate is filtered to remove the filtrate to obtain oxidized bamboo fiber, and the oxidized bamboo fiber, modified boron nitride, dicyclohexylcarbodiimide and toluene are mixed, and the reaction is carried out at a speed of 150 r / min and a temperature of 40° C. for 2 hours to obtain a composite carrier;

[0035] Step B3: The composite carrier, allyl alcohol, p-toluenesulfonic acid and toluene are mixed evenly, and the reaction is carried out at a speed of 120 r / min and a temperature of 115°C for 2 hours to obtain a modified carrier; the modified carrier, 1,3-propanedithiol, benzophenone and DMF are mixed evenly, and the mixture is irradiated with 365 nm ultraviolet light for 10 seconds to obtain a functional carrier; the functional carrier is added to palm oil, and the mixture is ultrasonically treated at a frequency of 20 kHz for 3 hours; the filtrate is filtered to remove the filtrate to obtain a precursor.

[0036] Step B4: dissolve polyethylene glycol in dichloromethane, add triethylamine, introduce nitrogen protection, stir and add acryloyl chloride at a speed of 120r / min and a temperature of 0°C, raise the temperature to 25°C, and react for 2h to obtain a coating agent, dissolve the coating agent in deionized water, add benzophenone and the precursor and mix evenly, raise the temperature to 110°C to remove the deionized water, and irradiate under 365nm ultraviolet light for 30s to obtain a modified filler.

[0037] The dosage ratio of hexagonal boron nitride, sodium hydroxide and deionized water in step B1 is 1 mmol:0.5 mmol:100 mL, and the dosage of KH550 is 3% of the mass of hydroxylated hexagonal boron nitride.

[0038] The dosage ratio of N-hydroxyphthalimide, cupric chloride, sodium hypochlorite, deionized water and bamboo cellulose described in step B2 is 10mmol:10mmol:50mmol:100mL:5g, and the mass ratio of oxidized bamboo fiber, modified boron nitride and dicyclohexylcarbodiimide is 5:1:1.

[0039] The molar ratio of carboxyl and acryl alcohol on the composite carrier described in step B3 is 1:1, the amount of sodium p-toluenesulfonate is 1% of the mass of acryl alcohol, the molar ratio of double bonds and 1,3-propanedithiol on the modified carrier is 1:1, the amount of benzophenone is 1‰ of the mass of 1,3-propanedithiol, and the amount ratio of functional carrier and palm oil is 1g:5mL.

[0040] The amount ratio of polyethylene glycol, triethylamine and acryloyl chloride described in step B4 is 10g:2.5mL:2g, the molecular weight of polyethylene glycol is 2000, the amount ratio of coating agent, deionized water and precursor is 5g:10mL:1g, and the mass of the precursor of benzophenone is 1‰.

[0041] Embodiment 2: A method for preparing a resin aluminum cover plate for drilling a circuit board, comprising the following steps:

[0042] Step A1: lauryl alcohol, acrylic acid, p-toluenesulfonic acid and toluene are uniformly mixed, and reacted at a speed of 150 r / min and a temperature of 120° C. for 4 hours to obtain an intermediate; the intermediate, tetramethyltetrasiloxane, chloroplatinic acid and DMF are mixed, and reacted at a speed of 120 r / min and a temperature of 85° C. for 3 hours to obtain a modified monomer;

[0043] Step A2: octamethylcyclotetrasiloxane, modified monomer, tetramethylammonium hydroxide, tetramethyldisiloxane and dimethyl sulfoxide are mixed uniformly, nitrogen is introduced for protection, and the mixture is reacted for 4 hours at a speed of 120 r / min and a temperature of 110° C. to obtain dihydrogenpolysiloxane; dihydrogenpolysiloxane, allyl alcohol, chloroplatinic acid and DMF are mixed uniformly, and the mixture is reacted for 4 hours at a speed of 150 r / min and a temperature of 85° C. to obtain modified silicone;

[0044] Step A3: isophorone diisocyanate, modified silicone, polytetrahydrofuran and DMF are mixed, stirred at a speed of 120 r / min and a temperature of 75°C, and dibutyltin dilaurate is added. After reacting for 2 hours, 1,4-butanediol and 2-dihydroxybutyric acid are added, and the reaction is continued for 5 hours. Triethylamine is added and neutralized to obtain a modified polyurethane. The modified polyurethane is dissolved in deionized water, and a modified filler is added and mixed evenly to obtain a modified coating. The modified coating is coated on the surface of an aluminum foil and dried to obtain a resin aluminum cover.

[0045] The molar ratio of lauryl alcohol and acrylic acid described in step A1 is 1:1, the amount of p-toluenesulfonic acid used is 2% of the mass of acrylic acid, the molar ratio of the intermediate and tetramethyltetrasiloxane is 4:1, and the amount of chloroplatinic acid used is 1‰ of the mass of tetramethyltetrasiloxane.

[0046] The molar ratio of octamethylcyclotetrasiloxane, modified monomer, tetramethylammonium hydroxide and tetramethyldisiloxane described in step A2 is 2:0.4:3:2, the molar ratio of dihydrogenpolysiloxane and allyl alcohol is 1:1, and the amount of chloroplatinic acid used is 1‰ of the mass of dihydrogenpolysiloxane.

[0047] The molar ratio of isophorone diisocyanate, modified silicone, polytetrahydrofuran, 1,4-butanediol, 2-dihydroxybutyric acid and triethylamine described in step A3 is 6:1:3:1:1.2:1.5, the molecular weight of polytetrahydrofuran is 1000, the amount of dibutyltin dilaurate is 3% of the mass of isophorone diisocyanate, and the mass ratio of modified polyurethane, deionized water and modified filler is 10:30:2.

[0048] The modified filler is prepared by the following steps:

[0049] Step B1: Hexagonal boron nitride, sodium hydroxide and deionized water are mixed evenly, and ultrasonically treated for 1.5 hours at a frequency of 25 kHz and a temperature of 25°C, and then heated to 125°C, refluxed for 20 hours, cooled to room temperature and washed to neutrality to obtain hydroxylated hexagonal boron nitride, and the hydroxylated hexagonal boron nitride is dispersed in ethanol, and KH550 and deionized water are added under stirring at a speed of 200 r / min and a temperature of 65°C, and reacted for 3 hours to obtain modified boron nitride;

[0050] Step B2: N-hydroxyphthalimide, copper chloride, sodium hypochlorite and deionized water are mixed evenly, stirred and bamboo cellulose is added at a speed of 200 r / min and a temperature of 65°C, and the reaction is carried out for 1 hour, and the filtrate is filtered to remove the filtrate to obtain oxidized bamboo fiber, and the oxidized bamboo fiber, modified boron nitride, dicyclohexylcarbodiimide and toluene are mixed, and the reaction is carried out at a speed of 200 r / min and a temperature of 45°C for 2 hours to obtain a composite carrier;

[0051] Step B3: Evenly mix the composite carrier, allyl alcohol, p-toluenesulfonic acid and toluene, and react at a speed of 150 r / min and a temperature of 115°C for 3 hours to obtain a modified carrier; evenly mix the modified carrier, 1,3-propanedithiol, benzophenone and DMF, and irradiate for 10 seconds under 365 nm ultraviolet light to obtain a functional carrier; add the functional carrier to palm oil, and ultrasonically treat for 3-5 hours at a frequency of 25 kHz; filter and remove the filtrate to obtain a precursor.

[0052] Step B4: dissolve polyethylene glycol in dichloromethane, add triethylamine, introduce nitrogen protection, stir and add acryloyl chloride at a speed of 120r / min and a temperature of 5°C, raise the temperature to 30°C, react for 2h to obtain a coating agent, dissolve the coating agent in deionized water, add benzophenone and the precursor and mix evenly, raise the temperature to 115°C to remove the deionized water, and irradiate under 365nm ultraviolet light for 45s to obtain a modified filler.

[0053] The dosage ratio of hexagonal boron nitride, sodium hydroxide and deionized water in step B1 is 1 mmol:0.5 mmol:100 mL, and the dosage of KH550 is 3% of the mass of hydroxylated hexagonal boron nitride.

[0054] The dosage ratio of N-hydroxyphthalimide, cupric chloride, sodium hypochlorite, deionized water and bamboo cellulose described in step B2 is 10mmol:10mmol:50mmol:100mL:5g, and the mass ratio of oxidized bamboo fiber, modified boron nitride and dicyclohexylcarbodiimide is 5:1:1.

[0055] The molar ratio of carboxyl and acryl alcohol on the composite carrier described in step B3 is 1:1, the amount of sodium p-toluenesulfonate is 1% of the mass of acryl alcohol, the molar ratio of double bonds and 1,3-propanedithiol on the modified carrier is 1:1, the amount of benzophenone is 1‰ of the mass of 1,3-propanedithiol, and the amount ratio of functional carrier and palm oil is 1g:5mL.

[0056] The amount ratio of polyethylene glycol, triethylamine and acryloyl chloride described in step B4 is 10g:2.5mL:2g, the molecular weight of polyethylene glycol is 2000, the amount ratio of coating agent, deionized water and precursor is 5g:10mL:1g, and the mass of the precursor of benzophenone is 1‰.

[0057] Embodiment 3: A method for preparing a resin aluminum cover plate for drilling a circuit board, comprising the following steps:

[0058] Step A1: lauryl alcohol, acrylic acid, p-toluenesulfonic acid and toluene are uniformly mixed, and reacted at a speed of 200 r / min and a temperature of 120° C. for 5 hours to obtain an intermediate; the intermediate, tetramethyltetrasiloxane, chloroplatinic acid and DMF are mixed, and reacted at a speed of 150 r / min and a temperature of 85° C. for 4 hours to obtain a modified monomer;

[0059] Step A2: octamethylcyclotetrasiloxane, modified monomer, tetramethylammonium hydroxide, tetramethyldisiloxane and dimethyl sulfoxide are mixed uniformly, nitrogen is introduced for protection, and the reaction is carried out for 5 hours at a speed of 150 r / min and a temperature of 110° C. to obtain dihydrogenpolysiloxane; dihydrogenpolysiloxane, allyl alcohol, chloroplatinic acid and DMF are mixed uniformly, and the reaction is carried out for 5 hours at a speed of 200 r / min and a temperature of 90° C. to obtain modified silicone;

[0060] Step A3: isophorone diisocyanate, modified silicone, polytetrahydrofuran and DMF are mixed, stirred at a speed of 150 r / min and a temperature of 75°C, and dibutyltin dilaurate is added. After reacting for 3 hours, 1,4-butanediol and 2-dihydroxybutyric acid are added, and the reaction is continued for 6 hours. Triethylamine is added and neutralized to obtain a modified polyurethane. The modified polyurethane is dissolved in deionized water, and a modified filler is added and mixed evenly to obtain a modified coating. The modified coating is coated on the surface of an aluminum foil and dried to obtain a resin aluminum cover.

[0061] The molar ratio of lauryl alcohol and acrylic acid described in step A1 is 1:1, the amount of p-toluenesulfonic acid used is 2% of the mass of acrylic acid, the molar ratio of the intermediate and tetramethyltetrasiloxane is 4:1, and the amount of chloroplatinic acid used is 1‰ of the mass of tetramethyltetrasiloxane.

[0062] The molar ratio of octamethylcyclotetrasiloxane, modified monomer, tetramethylammonium hydroxide and tetramethyldisiloxane described in step A2 is 2:0.4:3:2, the molar ratio of dihydrogenpolysiloxane and allyl alcohol is 1:1, and the amount of chloroplatinic acid used is 1‰ of the mass of dihydrogenpolysiloxane.

[0063] The molar ratio of isophorone diisocyanate, modified silicone, polytetrahydrofuran, 1,4-butanediol, 2-dihydroxybutyric acid and triethylamine described in step A3 is 6:1:3:1:1.2:1.5, the molecular weight of polytetrahydrofuran is 1000, the amount of dibutyltin dilaurate is 3% of the mass of isophorone diisocyanate, and the mass ratio of modified polyurethane, deionized water and modified filler is 10:30:3.

[0064] The modified filler is prepared by the following steps:

[0065] Step B1: Hexagonal boron nitride, sodium hydroxide and deionized water are mixed evenly, and ultrasonically treated for 1.5 hours at a frequency of 30kHz and a temperature of 30°C, and then heated to 125°C, refluxed for 25 hours, cooled to room temperature and washed to neutrality to obtain hydroxylated hexagonal boron nitride, and the hydroxylated hexagonal boron nitride is dispersed in ethanol, and KH550 and deionized water are added under stirring at a speed of 300r / min and a temperature of 70°C, and reacted for 3 hours to obtain modified boron nitride;

[0066] Step B2: N-hydroxyphthalimide, copper chloride, sodium hypochlorite and deionized water are mixed evenly, stirred and bamboo cellulose is added at a speed of 300 r / min and a temperature of 65°C, and the reaction is carried out for 1.5 hours, and the filtrate is filtered to remove the filtrate to obtain oxidized bamboo fiber, and the oxidized bamboo fiber, modified boron nitride, dicyclohexylcarbodiimide and toluene are mixed, and the reaction is carried out at a speed of 200 r / min and a temperature of 50°C for 3 hours to obtain a composite carrier;

[0067] Step B3: The composite carrier, allyl alcohol, p-toluenesulfonic acid and toluene are mixed evenly, and the reaction is carried out at a speed of 150 r / min and a temperature of 120°C for 3 hours to obtain a modified carrier; the modified carrier, 1,3-propanedithiol, benzophenone and DMF are mixed evenly, and the mixture is irradiated with 365 nm ultraviolet light for 15 seconds to obtain a functional carrier; the functional carrier is added to palm oil, and the mixture is ultrasonically treated at a frequency of 30 kHz for 5 hours, and the filtrate is filtered to remove the filtrate to obtain a precursor.

[0068] Step B4: dissolve polyethylene glycol in dichloromethane, add triethylamine, introduce nitrogen protection, stir and add acryloyl chloride at a speed of 150r / min and a temperature of 5°C, raise the temperature to 30°C, and react for 3h to obtain a coating agent, dissolve the coating agent in deionized water, add benzophenone and the precursor and mix evenly, raise the temperature to 120°C to remove the deionized water, and irradiate under 365nm ultraviolet light for 60s to obtain a modified filler.

[0069] The dosage ratio of hexagonal boron nitride, sodium hydroxide and deionized water in step B1 is 1 mmol:0.5 mmol:100 mL, and the dosage of KH550 is 3% of the mass of hydroxylated hexagonal boron nitride.

[0070] The dosage ratio of N-hydroxyphthalimide, cupric chloride, sodium hypochlorite, deionized water and bamboo cellulose described in step B2 is 10mmol:10mmol:50mmol:100mL:5g, and the mass ratio of oxidized bamboo fiber, modified boron nitride and dicyclohexylcarbodiimide is 5:1:1.

[0071] The molar ratio of carboxyl and acryl alcohol on the composite carrier described in step B3 is 1:1, the amount of sodium p-toluenesulfonate is 1% of the mass of acryl alcohol, the molar ratio of double bonds and 1,3-propanedithiol on the modified carrier is 1:1, the amount of benzophenone is 1‰ of the mass of 1,3-propanedithiol, and the amount ratio of functional carrier and palm oil is 1g:5mL.

[0072] The amount ratio of polyethylene glycol, triethylamine and acryloyl chloride described in step B4 is 10g:2.5mL:2g, the molecular weight of polyethylene glycol is 2000, the amount ratio of coating agent, deionized water and precursor is 5g:10mL:1g, and the mass of the precursor of benzophenone is 1‰.

[0073] Comparative Example 1: Compared with Example 1, no modified monomer was added to this comparative example, and the remaining steps were the same.

[0074] Comparative Example 2: Compared with Example 1, this comparative example uses polyethylene glycol with a relative molecular mass of 10,000 to replace the modified polyurethane, and the remaining steps are the same.

[0075] Comparative Example 3: Compared with Example 1, this comparative example uses a functional carrier instead of a precursor, and the remaining steps are the same.

[0076] Comparative Example 4: Compared with Example 1, this comparative example uses hexagonal boron nitride to replace the modified filler, and the other steps are the same.

[0077] The resin aluminum cover plates prepared in Examples 1-3 and Comparative Examples 1-4, wherein the aluminum foil thickness is 100 μm and the total thickness of the resin cover plates is 160 μm, are respectively drilled 1000 holes in the PCB plates using a 250 kr / min ultra-high speed drilling machine, the hole position accuracy is tested to obtain the CPK value, and the drill bit surface is observed for wire entanglement and wear. The test results are shown in Table 1 below.

[0078] Table 1

[0079]

[0080] It can be seen from Table 1 above that the present application has good drilling accuracy.

[0081] The above contents are merely examples and explanations of the concept of the present invention. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the concept of the invention or exceed the scope defined by the claims, they should all fall within the protection scope of the present invention.

Claims

1. A method for preparing a resin aluminum cover plate for drilling a circuit board, characterized in that: The specific steps include: Step A1: lauryl alcohol, acrylic acid, p-toluenesulfonic acid and toluene are mixed and reacted to obtain an intermediate, and the intermediate, tetramethyltetrasiloxane, chloroplatinic acid and DMF are mixed and reacted to obtain a modified monomer; Step A2: octamethylcyclotetrasiloxane, a modified monomer, tetramethylammonium hydroxide, tetramethyldisiloxane and dimethyl sulfoxide are uniformly mixed, nitrogen is introduced for protection, and a reaction is carried out to obtain dihydrogenpolysiloxane; dihydrogenpolysiloxane, allyl alcohol, chloroplatinic acid and DMF are mixed for reaction to obtain modified organosilicon; Step A3: isophorone diisocyanate, modified silicone, polytetrahydrofuran and DMF are mixed and stirred, and dibutyltin dilaurate is added to react, 1,4-butanediol and 2-dihydroxybutyric acid are added, the reaction is continued, triethylamine is added, and modified polyurethane is obtained by neutralization. The modified polyurethane is dissolved in deionized water, and a modified filler is added and mixed evenly to obtain a modified coating. The modified coating is coated on the surface of an aluminum foil and dried to obtain a resin aluminum cover.

2. The method for preparing a resin aluminum cover plate for drilling a circuit board according to claim 1, characterized in that: The molar ratio of lauryl alcohol to acrylic acid in step A1 is 1:1, and the molar ratio of the intermediate to tetramethyltetrasiloxane is 4:

1.

3. The method for preparing a resin aluminum cover plate for circuit board drilling according to claim 1, characterized in that: The molar ratio of octamethylcyclotetrasiloxane, modified monomer, tetramethylammonium hydroxide and tetramethyldisiloxane in step A2 is 2:0.4:3:2, and the molar ratio of dihydrogenpolysiloxane and acryl alcohol is 1:

1.

4. The method for preparing a resin aluminum cover plate for circuit board drilling according to claim 1, characterized in that: The molar ratio of isophorone diisocyanate, modified silicone, polytetrahydrofuran, 1,4-butanediol, 2-dihydroxybutyric acid and triethylamine described in step A3 is 6:1:3:1:1.2:1.5, and the mass ratio of modified polyurethane, deionized water and modified filler is 10:30:1-3.

5. The method for preparing a resin aluminum cover plate for circuit board drilling according to claim 1, characterized in that: The modified filler is prepared by the following steps: Step B1: mixing hexagonal boron nitride, sodium hydroxide and deionized water, ultrasonically treating the mixture, heating and refluxing the mixture, cooling the mixture to room temperature and washing the mixture to neutrality to obtain hydroxylated hexagonal boron nitride, dispersing the hydroxylated hexagonal boron nitride in ethanol, stirring the mixture, adding KH550 and deionized water, and reacting the mixture to obtain modified boron nitride; Step B2: N-hydroxyphthalimide, copper chloride, sodium hypochlorite and deionized water are mixed and stirred and added to bamboo cellulose for reaction, and the filtrate is filtered to remove the filtrate to obtain oxidized bamboo fiber, and the oxidized bamboo fiber, modified boron nitride, dicyclohexylcarbodiimide and toluene are mixed and reacted to obtain a composite carrier; Step B3: The composite carrier, allyl alcohol, p-toluenesulfonic acid and toluene are mixed and reacted to obtain a modified carrier, the modified carrier, 1,3-propanedithiol, benzophenone and DMF are evenly mixed, and irradiated under 365nm ultraviolet light to obtain a functional carrier, the functional carrier is added to palm oil, after ultrasonic treatment, the filtrate is filtered to remove the filtrate to obtain a precursor. Step B4: dissolving polyethylene glycol in dichloromethane, adding triethylamine, introducing nitrogen protection, stirring and adding acryloyl chloride, heating to react, and obtaining a coating agent, dissolving the coating agent in deionized water, adding benzophenone and the precursor and mixing evenly, heating to remove the deionized water, and irradiating under 365 nm ultraviolet light to obtain a modified filler.

6. The method for preparing a resin aluminum cover plate for circuit board drilling according to claim 5, characterized in that: The dosage ratio of hexagonal boron nitride, sodium hydroxide and deionized water in step B1 is 1 mmol:0.5 mmol:100 mL, and the dosage of KH550 is 3% of the mass of hydroxylated hexagonal boron nitride.

7. The method for preparing a resin aluminum cover plate for circuit board drilling according to claim 5, characterized in that: The dosage ratio of N-hydroxyphthalimide, cupric chloride, sodium hypochlorite, deionized water and bamboo cellulose described in step B2 is 10mmol:10mmol:50mmol:100mL:5g, and the mass ratio of oxidized bamboo fiber, modified boron nitride and dicyclohexylcarbodiimide is 5:1:

1.

8. The method for preparing a resin aluminum cover plate for drilling a circuit board according to claim 5, characterized in that: The molar ratio of carboxyl and propenol on the composite carrier described in step B3 is 1:1, the molar ratio of double bonds and 1,3-propanedithiol on the modified carrier is 1:1, and the dosage ratio of the functional carrier and palm oil is 1g:5mL.

9. The method for preparing a resin aluminum cover plate for circuit board drilling according to claim 5, characterized in that: The amount ratio of polyethylene glycol, triethylamine and acryloyl chloride described in step B4 is 10g:2.5mL:2g, the molecular weight of polyethylene glycol is 2000, and the amount ratio of coating agent, deionized water and precursor is 5g:10mL:1g.

10. A resin aluminum cover plate for drilling a circuit board, characterized in that: Prepared according to any one of the preparation methods described in claims 1-8.

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