Glue uniformizing equipment capable of shortening wafer transmission time

Abstract

The invention relates to glue uniformizing equipment capable of shortening wafer transmission time, which belongs to the technical field of semiconductor manufacturing equipment and comprises a rack, a box station unit, a box station robot, a process processing unit, a glue uniformizing unit and a process robot. The box station unit, the box station robot, the process treatment units and the glue uniformizing unit are sequentially arranged, each process treatment unit comprises a cold disc unit, a hot disc unit and a centering unit, a middle area is formed between the cold disc unit and the hot disc unit, and the box station robot and the process robots are at least partially arranged in front of and behind the middle area; and the box station robot and the process robot only rotate and lift to transfer the wafer. According to the invention, the working efficiency of the box station robot and the process robot can be brought into full play, the production flow of the whole wafer glue uniformizing process is accelerated, and the working efficiency of the wafer glue uniformizing equipment is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor manufacturing equipment, and specifically relates to a dispensing device that can shorten the wafer transfer time. Background Art

[0002] The rapid development of the semiconductor industry is accompanied by the continuous upgrading of the semiconductor equipment closely related to it. The semiconductor industry is technology-intensive, and its development level is closely linked to the process flow and hardware facilities. Coating and developing equipment is crucial in the semiconductor process. It ensures the uniform coating and precise development of photoresist, which directly affects the stability and pattern quality of subsequent processes. It is a key equipment for improving production efficiency and ensuring product quality and reliability.

[0003] As market competition becomes increasingly fierce, how to improve the production capacity of equipment while controlling equipment costs has become one of the technical high grounds that major manufacturers are competing to tackle. For example, patent CN200610134922.7 discloses an improved structure of a time-saving coating and development process and equipment. The coating and development equipment includes a coating unit, a development unit, a hot plate unit, a cold plate unit, a pre-treatment and viscosity-increasing unit, a cassette station, a cassette station robot, a process robot, a centering unit, and a wafer cassette. A conveying mechanism and a clamping mechanism are added between the hot plate unit and the cold plate unit to transfer the wafers heated on the hot plate to the cold plate for cooling without requiring the process robot to transfer them. This can reduce the number of times the process robot is used, shorten the overall process transfer time, and improve the working efficiency of the coating and development equipment. As can be seen from the above content, the manufacturer has added a "conveying mechanism" to the process unit to reduce the transfer of the process robot within the process unit, saving the transfer time of the process robot and improving the production efficiency of the equipment. However, the process robot has more steps to transfer the wafers than the cassette station robot, which makes the effective working time of the process robot longer than that of the cassette station robot, resulting in low working efficiency of the cassette station robot. Therefore, how to increase the effective working time of the box station robot and keep it consistent with the effective working time of the process robot without increasing the equipment cost, so as to improve or maximize the utilization rate of all robots in the coating and developing equipment, has become a technical problem that needs to be urgently solved by coating and developing equipment manufacturers. Summary of the Invention

[0004] In response to the above situation, the present invention provides a dispensing device that can shorten wafer transfer time, aiming to partially or completely solve the technical problem of increasing or maximizing the utilization rate of existing robots. Accordingly, the technical solution adopted by the present invention is as follows:

[0005] A glue spreading device that can shorten the wafer transfer time includes a rack, a box station unit, a box station robot, a process processing unit, a glue spreading unit, and a process robot. The box station unit, the box station robot, multiple process processing units, and the glue spreading unit are arranged in sequence. The process processing unit includes a cold plate unit, a hot plate unit, and a centering unit. An intermediate area is formed between the cold plate unit and the hot plate unit. The box station robot and the process robot are at least partially arranged in front and behind the intermediate area. The box station robot and the process robot only rotate and rise and fall to transfer the wafer.

[0006] Optionally, after the wafer has completed thermal baking on the hot plate unit, if the box station robot is transferring other wafers and the process robot is temporarily idle, the process robot will take the wafer out of the hot plate unit and send it to the cold plate unit; or, after the wafer has completed thermal baking on the hot plate unit, if the process robot is transferring other wafers and the box station robot is temporarily idle, the box station robot will take the wafer out of the hot plate unit and send it to the cold plate unit.

[0007] Optionally, the box station unit includes a plurality of wafer box stations, and the plurality of wafer box stations are arranged in a surrounding manner on one side of the box station robot.

[0008] Optionally, the box station robot includes a gripper assembly for grasping wafers, a liftable Z-axis assembly, and a circumferentially rotatable T-axis assembly, the gripper is connected to the liftable Z-axis assembly, and the liftable Z-axis assembly is connected to the circumferentially rotatable T-axis assembly.

[0009] Optionally, the process robots include a gripper assembly for grasping wafers, a liftable Z-axis assembly, and a rotatable T-axis assembly, the gripper is connected to the liftable Z-axis assembly, and the liftable Z-axis assembly is connected to the rotatable T-axis assembly.

[0010] Optionally, the glue spreading unit includes a first glue spreading cavity, a second glue spreading cavity and a glue injection component. The glue injection component can be located between the first glue spreading cavity and the second glue spreading cavity. The glue injection component injects glue into the first glue spreading cavity or the second glue spreading cavity.

[0011] Optionally, the process treatment unit includes a first process treatment unit and a second process treatment unit, the first process treatment unit includes a plurality of cold plate units and a plurality of centering units, and the second process treatment unit includes a plurality of hot plate units and a plurality of centering units.

[0012] Optionally, a plurality of centering units are aligned and stacked, a plurality of cold plate units are aligned and stacked, and the plurality of aligned and stacked cold plate units are located above the plurality of centering units.

[0013] Optionally, a plurality of centering units are aligned and stacked, a plurality of hot plate units are aligned and stacked, and the plurality of aligned and stacked hot plate units are located above the plurality of centering units.

[0014] Optionally, the box station robot is at least partially located between the box station unit and the process processing unit, and the process robot is at least partially located between the glue spreading unit and the process processing unit.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] (1) In the present invention application, after the hot plate unit completes the wafer drying, the task of transferring the wafer to the cold plate unit can be flexibly arranged according to the real-time working status of the box station robot and the process robot. The box station robot and the process robot can cooperate with each other. When one party is busy with other transmission tasks, the other party can quickly fill the vacancy to avoid the wafer glue equipment being idle due to waiting. The idle robot can respond quickly and transfer it to the cold plate unit in time, which greatly shortens the residence time of the wafer in the hot plate unit, gives full play to the working efficiency of the box station robot and the process robot, accelerates the production process of the entire wafer glue process, improves the working efficiency of the wafer glue equipment, reduces the unit cost of the wafer glue process, and improves the cost competitiveness of the enterprise.

[0017] (2) In the present invention application, even if one of the box station robot and the process robot encounters a temporary failure or task overload, the other robot can immediately take over the work to ensure the continuity of wafer transmission, effectively reducing the risk of production interruption caused by accidents of the box station robot and the process robot, and providing a strong guarantee for the stable operation of the wafer manufacturing production line. At the same time, the work of the robots is reasonably deployed, so that raw materials and human resources are more fully utilized, unnecessary energy consumption is reduced, the wafer manufacturing production process is made more efficient, production benefits are improved, and the comprehensive competitiveness of the enterprise in the market is enhanced. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of a coating device that can shorten the wafer transfer time applied in the present invention. Figure 1 ;

[0019] Figure 2 This is a schematic diagram of the structure of a coating device that can shorten the wafer transfer time applied in the present invention. Figure 2 ;

[0020] Figure 3 This is a schematic diagram of the structure of a coating device that can shorten the wafer transfer time applied in the present invention. Figure 3 ;

[0021] Figure 4 This is a schematic diagram of the structure of a coating device that can shorten the wafer transfer time applied in the present invention. Figure 4 ;

[0022] Figure 5It is a partial structural diagram of the box station robot or process robot applied for in the present invention;

[0023] Figure 6 It is a structural schematic diagram of the coating unit of the present invention; DETAILED DESCRIPTION

[0024] In the following description, a number of specific details are provided to provide a more thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, some technical features well known in the art are not described to avoid confusion with the present invention.

[0025] like Figures 1 to 4 As shown, a glue spreading device that can shorten the wafer transfer time includes a frame F, a box station unit 100, a box station robot 200, a process processing unit 300, a glue spreading unit 400, and a process robot 500. The box station unit 100, the box station robot 200, the process processing unit 300, and the glue spreading unit 400 are arranged in sequence. The process processing unit 300 includes a cold plate unit 301, a hot plate unit 302 and a centering unit 303. An intermediate area is formed between the cold plate unit 301 and the hot plate unit 302. The box station robot 200 and the process robot 500 are at least partially arranged in front and behind the intermediate area. The box station robot 200 and the process robot 500 only rotate and rise and fall to transfer the wafer.

[0026] In some embodiments, the cassette station 100 is used for wafer storage and supply. It can accommodate multiple wafer cassettes, each containing wafers to be processed or already processed. During operation, the equipment sequentially supplies wafers for subsequent steps according to process requirements, ensuring a stable wafer supply throughout the entire coating process.

[0027] In some embodiments, the cold plate unit 301 is used to cool the wafers by removing heat through an internally circulating cooling medium (such as cold water or coolant), thereby cooling the wafers. The wafers are placed on the cold plate and cooled by heat conduction between the cold plate and the wafers.

[0028] In certain embodiments, the hot plate unit 302 heats the wafer to meet the different process temperature requirements of the photoresist, such as evaporating the solvent in the photoresist, enhancing the adhesion of the photoresist to the wafer surface, baking the wafer after photolithography, and promoting the cross-linking reaction of the photoresist. The hot plate unit 302 usually adopts an electric heating method to heat the hot plate to a set temperature through an accurate temperature control system. After the photoresist is applied, the wafer is placed on the hot plate for soft baking to remove part of the solvent in the photoresist, so that the photoresist is cured to a certain extent and the bonding force between the photoresist and the wafer is enhanced. After photolithography, heating is performed again for post-baking (i.e., hot baking) to further complete the chemical reaction of the photoresist and stabilize the photoresist pattern.

[0029] In some embodiments, the coating unit 400 is used to evenly coat the photoresist on the wafer surface to form a photoresist film of uniform thickness, providing a high-quality photoresist coating for subsequent photolithography processes. For example, the coating unit 400 can first fix the wafer on a vacuum chuck, which rotates at high speed. The photoresist is dripped from the nozzle. Under the action of centrifugal force, the photoresist quickly diffuses to the edge, thereby being evenly distributed on the wafer surface. By adjusting parameters such as the rotation speed, the amount of photoresist added, and the dripping speed, the final thickness and uniformity of the photoresist film can be controlled.

[0030] In some embodiments, the process robot 500 is responsible for the efficient handling and precise positioning of wafers in the entire wafer dispensing equipment. It can transfer wafers from one process unit to another, ensuring smooth connection between units and greatly improving production efficiency. For example, first, the process robot 500 can quickly identify the position and posture of the wafer through a visual recognition system or sensor, and accurately grasp the wafer using a robotic arm; then, according to a preset motion trajectory, the wafer is transported to the target process unit, such as from the centering unit 303 to at least one of the cold plate unit, hot plate unit, and dispensing unit. During the transportation process, the process robot ensures smooth transportation of the wafer by precisely controlling the speed, acceleration, and movement direction of the robotic arm to prevent collisions and jitters; after reaching the target position, the wafer is precisely placed through a fine-tuning mechanism to meet the strict requirements of each process unit for wafer position accuracy. After completing the operation, it returns to the starting position or moves to the next handling task point, and the cycle continues to ensure the continuity of the entire wafer dispensing process.

[0031] In some embodiments, an intermediate area is formed between the cold plate unit 301 and the hot plate unit 302, and the box station robot 200 and the process robot 500 are at least partially arranged in front and behind the intermediate area. The box station robot 200 can be at least partially located between the box station unit 100 and the process processing unit 300. The process robot 500 can be at least partially located between the glue unit 400 and the process processing unit 300. The process processing units are closely arranged around the box station robot and the process robot. The box station robot and the process robot only need to rotate and lift to complete the grasping and transmission of the wafer.

[0032] Therefore, in the coating equipment applied for in the present invention that can shorten the wafer transmission time, an intermediate area is formed between the cold plate unit 301 and the hot plate unit 302, and the box station robot 200 and the process robot 500 are at least partially arranged in front and behind the intermediate area. The layout design appropriately improves the space utilization rate of the wafer coating equipment. The box station robot and the process robot only need to rotate and lift to complete the operation, which greatly shortens the wafer transportation time and improves the wafer coating production efficiency. The short-distance transportation path effectively reduces the risk of wafer contamination during transportation, ensures the quality of the wafer coating process, adapts to diversified production needs, and provides strong technical support for large-scale, high-precision wafer coating production, bringing higher economic benefits and market competitiveness to enterprises.

[0033] Optionally, the process unit 300 includes a first process unit and a second process unit, the first process unit includes multiple cold plate units 301 and multiple centering units, and the second process unit includes multiple hot plate units 302 and multiple centering units.

[0034] In some embodiments, the middle area mentioned above is also formed between the first process treatment unit and the second process treatment unit, and the box station robot 200 and the process robot 500 are at least partially arranged in front and behind the middle area.

[0035] Optionally, multiple centering units are stacked, multiple cold plate units 301 are stacked, multiple stacked cold plate units 301 are located above multiple centering units, multiple centering units are stacked, multiple hot plate units 302 are stacked, and multiple stacked hot plate units 302 are located above multiple centering units.

[0036] In some embodiments, multiple cold plate units 301 and multiple centering units 3031 (303) are aligned and stacked along the height direction of the wafer gluing equipment to form a first process processing unit; multiple hot plate units 302 and multiple centering units 3032 (303) are stacked along the height direction of the wafer gluing equipment to form a second process processing unit.

[0037] Optionally, after the wafer has completed thermal baking on the hot plate unit, if the box station robot is transferring other wafers and the process robot is temporarily idle, the process robot will take the wafer out of the hot plate unit and send it to the cold plate unit; or, after the wafer has completed thermal baking on the hot plate unit, if the process robot is transferring other wafers and the box station robot is temporarily idle, the box station robot will take the wafer out of the hot plate unit and send it to the cold plate unit.

[0038] In the application of the present invention, firstly, after the hot plate unit completes the wafer hot baking, the task of transferring the wafer to the cold plate unit can be flexibly arranged according to the real-time working status of the box station robot and the process robot. The box station robot and the process robot can cooperate with each other. When one is busy with other transfer tasks, the other can quickly fill the vacancy to avoid the wafer glue equipment being idle due to waiting. The idle robot can respond quickly and transfer it to the cold plate unit in time, which greatly shortens the residence time of the wafer in the hot plate unit, gives full play to the working efficiency of the box station robot and the process robot, accelerates the production process of the entire wafer glue process, and improves the output of the wafer glue equipment. The unit cost of the wafer coating process is reduced, and the cost competitiveness of the enterprise is improved. In addition, even if one of the box station robot and the process robot encounters a temporary failure or task overload, the other robot can immediately take over the work to ensure the continuity of wafer transmission, effectively reducing the risk of production interruption caused by accidents of the box station robot and the process robot, and providing a strong guarantee for the stable operation of the wafer manufacturing production line. At the same time, the work of the robots is rationally deployed, so that raw materials and human resources are more fully utilized, unnecessary energy consumption is reduced, the wafer manufacturing production process is more efficient, production benefits are improved, and the overall competitiveness of the enterprise in the market is enhanced.

[0039] Optionally, the box station unit 100 includes a plurality of wafer box stations, which are arranged in a surrounding manner on one side of the box station robot 200 .

[0040] In the present application, several wafer box stations in the box station unit 100 are arranged in a surround manner on one side of the box station robot 200. This layout greatly optimizes space utilization. The surround design makes the activity range of the box station robot more concentrated, reduces the distance moved between different box stations, and thus improves the efficiency of wafer pickup and placement. The surround layout allows the box station robot to access each wafer box station more conveniently, shortens the operation path, reduces the operation time, and further speeds up the rhythm of wafer transmission. Moreover, the surround layout makes the signal communication between the box station unit 100 and the box station robot 200 closer, the signal transmission is more stable, reduces signal interference, ensures the accuracy of data transmission and the stability of equipment operation, and lays a solid foundation for an efficient and stable wafer production process.

[0041] Alternatively, as Figure 5 As shown, the box station robot 200 includes a gripper assembly 10 for grasping wafers, a liftable Z-axis assembly 20, and a circumferentially rotatable T-axis assembly 30, the gripper is connected to the liftable Z-axis assembly 20, and the liftable Z-axis assembly 20 is connected to the circumferentially rotatable T-axis assembly 30; and / or, the process robot 500 includes a gripper assembly 10 for grasping wafers, a liftable Z-axis assembly 20, and a circumferentially rotatable T-axis assembly 30, the gripper is connected to the liftable Z-axis assembly 20, and the liftable Z-axis assembly 20 is connected to the circumferentially rotatable T-axis assembly 30.

[0042] In some embodiments, the gripper assembly 10 is used to grasp wafers of different sizes and shapes, and can also avoid damage to the wafers during the grasping and transportation process, greatly ensuring the integrity of the wafers, reducing product losses caused by improper operation, and reducing production costs.

[0043] In some embodiments, the liftable Z-axis assembly 20 gives the box station robot and the process robot the ability to adjust in the height direction, so that they can transfer wafers between the glue spreading units, hot plate units, and / or between the glue spreading units and the centering units, and / or between the hot plate units and the cold plate units at different heights, thereby achieving efficient operation of the wafers between the centering units, hot plate units, cold plate units, and glue spreading units, effectively optimizing the working range of the box station robot and the process robot, improving the versatility of the wafer glue spreading equipment, and reducing the cost of additional investment to adapt to different heights.

[0044] In some embodiments, the circumferentially rotatable T-axis assembly 30 significantly enhances the flexibility of the box station robot and process robot, allowing them to rotate freely in the horizontal direction, changing the direction of wafer placement and grasping without significant movement of the robot body. This significantly shortens the operation time of the box station robot and process robot, and improves their work efficiency. In multi-tasking parallel production scenarios, the T-axis assembly enables the robot to quickly respond to different task requirements, enhancing the robot's ability to cope with complex production processes.

[0045] In the present invention application, the box station robot 200 and the process robot 500 work together through three components, which greatly improves the robot's operating ability in complex wafer production processes, enabling it to complete various tasks quickly and accurately, thereby improving the stability and reliability of the entire production system, and strongly supporting an efficient wafer manufacturing process.

[0046] Alternatively, as Figure 6As shown, the glue spreading unit 400 includes a first glue spreading cavity 401, a second glue spreading cavity 402 and a glue injection component 403. The glue injection component 403 can be located between the first glue spreading cavity 401 and the second glue spreading cavity 402. The glue injection component 403 injects glue into the first glue spreading cavity 401 or the second glue spreading cavity 402.

[0047] In some embodiments, the coating unit may further include a rotating assembly, a coating assembly, a vacuum adsorption assembly, and a control system. The vacuum adsorption assembly is made of porous ceramic or special vacuum adsorption materials. During the coating process, the negative pressure generated by the vacuum pump is used to firmly adsorb the wafer to the platform, preventing the wafer from shifting or falling off during high-speed rotation, ensuring the stability and accuracy of the coating process and ensuring that each wafer is evenly coated. The rotating assembly includes a motor that can stably output high speeds and provide strong centrifugal force for the wafer coating process. By rotating the wafer at high speed, the centrifugal force causes the photoresist coated on the wafer to spread evenly, ensuring that the photoresist is evenly distributed on the wafer surface and the thickness of the photoresist film is consistent, laying the foundation for high-precision operation in the subsequent photolithography process. The coating device assembly includes a glue barrel, a pipe, and a nozzle. The glue barrel is used to store the photoresist, the pipe is responsible for transporting the photoresist to the nozzle, and the piezoelectric nozzle accurately controls the amount and location of the photoresist according to a preset program. Different chip manufacturing processes have different requirements for the amount and position of photoresist. The glue coating device can accurately meet these diverse needs. The control system flexibly and accurately controls the coordinated work of various components according to different process requirements to achieve automated and high-precision glue coating operations. Technical personnel in this field can understand this based on the existing technology of existing glue coating mechanisms.

[0048] In the present invention, firstly, the glue injection component 403 can be positioned between the first glue-spreading cavity 401 and the second glue-spreading cavity 402, and can quickly and conveniently inject glue between the first and second glue-spreading cavities. The glue injection target can be adjusted in a timely manner according to actual production needs, shortening the glue injection interval and improving overall work efficiency. Furthermore, the glue injection component 403 can also set different glue-spreading parameters for different cavities to better meet diverse process requirements and improve the uniformity and quality of the glue layer. Furthermore, the independent location of the glue injection component facilitates routine inspection, cleaning, and maintenance by staff. When a fault occurs, it can be quickly located and addressed, reducing equipment downtime and lowering maintenance costs.

[0049] It should be noted that the device embodiments described above are merely illustrative. In the embodiments disclosed in this application, terms such as "installed," "connected," "connected," and "fixed" should be understood broadly. For example, "connected" may refer to a fixed connection, a detachable connection, or an integral connection; and "connected" may refer to a direct connection or an indirect connection via an intermediary. Those skilled in the art will understand the specific meanings of the above terms in the embodiments disclosed in this application based on specific circumstances.

[0050] The above description is merely a preferred embodiment of the present invention. It should be noted that, without departing from the principles of the present invention, a person skilled in the art can make several improvements and modifications, and these improvements and modifications should also be considered as falling within the scope of protection of the present invention. A person skilled in the art can understand and implement these improvements and modifications without inventive effort. Without departing from the principles of the present invention, a person skilled in the art can make several improvements and modifications, and these improvements and modifications should also be considered as falling within the scope of protection of the present invention.

Claims

1. A coating device capable of shortening wafer transfer time, characterized in that: It includes a frame, a box station unit, a box station robot, a process processing unit, a glue spreading unit and a process robot. The box station unit, the box station robot, the process processing unit and the glue spreading unit are arranged in sequence. The process processing unit includes a cold plate unit, a hot plate unit and a centering unit. An intermediate area is formed between the cold plate unit and the hot plate unit. The box station robot and the process robot are at least partially arranged in front and behind the intermediate area. The box station robot and the process robot only rotate and rise and fall to transfer the wafers.

2. The coating device capable of shortening wafer transfer time according to claim 1, characterized in that: When the wafer has finished heating on the hot plate unit, if the box station robot is transferring other wafers and the process robot is temporarily idle, the process robot will take the wafer out of the hot plate unit and send it to the cold plate unit; Or, after the wafer has completed thermal baking on the hot plate unit, if the process robot is transferring other wafers and the box station robot is temporarily idle, the box station robot takes the wafer out of the hot plate unit and sends it to the cold plate unit.

3. The coating device capable of shortening wafer transfer time according to claim 2, characterized in that: The box station unit includes a plurality of wafer box stations, and the plurality of wafer box stations are arranged in a surrounding manner on one side of the box station robot.

4. The coating device capable of shortening wafer transfer time according to claim 2, characterized in that: The box station robot includes a gripper assembly for grasping wafers, a liftable Z-axis assembly, and a rotatable T-axis assembly. The gripper is connected to the liftable Z-axis assembly, and the liftable Z-axis assembly is connected to the rotatable T-axis assembly.

5. The coating device capable of shortening wafer transfer time according to claim 2, characterized in that: The process robots all include a gripper assembly for grasping wafers, a liftable Z-axis assembly, and a rotatable T-axis assembly. The gripper is connected to the liftable Z-axis assembly, and the liftable Z-axis assembly is connected to the rotatable T-axis assembly.

6. The coating device capable of shortening wafer transfer time according to claim 2, characterized in that: The glue spreading unit includes a first glue spreading cavity, a second glue spreading cavity and a glue injection component. The glue injection component can be located between the first glue spreading cavity and the second glue spreading cavity. The glue injection component injects glue into the first glue spreading cavity or the second glue spreading cavity.

7. The coating device capable of shortening wafer transfer time according to claim 2, characterized in that: The process unit includes a first process unit and a second process unit. The first process unit includes a plurality of cold plate units and a plurality of centering units. The second process unit includes a plurality of hot plate units and a plurality of centering units.

8. The coating device capable of shortening wafer transfer time according to claim 7, characterized in that: A plurality of centering units are aligned and stacked, a plurality of cold plate units are aligned and stacked, and a plurality of aligned and stacked cold plate units are located above the plurality of centering units.

9. The coating device capable of shortening wafer transfer time according to claim 7, characterized in that: A plurality of centering units are aligned and stacked, a plurality of heat plate units are aligned and stacked, and a plurality of aligned and stacked heat plate units are located above the plurality of centering units.

10. The coating device capable of shortening wafer transfer time according to claim 7, characterized in that: The box station robot is at least partially located between the box station unit and the process processing unit, and the process robot is at least partially located between the glue spreading unit and the process processing unit.

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