Application of PI semiconductor material in pressure sensor and pressure sensor

By using PI semiconductor material as pressure sensitive components in pressure sensors, the problems of poor stability and high production costs in high temperature, high humidity and high acid environments are solved, and a pressure sensor with high accuracy, low cost and strong adaptability are realized.

CN120027957APending Publication Date: 2025-05-23YIXING SIWEI NEW MATERIALS TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202510168977.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-17
Publication Date
2025-05-23

AI Technical Summary

Technical Problem

Traditional pressure sensors have poor stability in high temperature, high humidity and high acid environments, reduced measurement accuracy, and high production costs, and are complex in structure and not suitable for certain special application scenarios.

Method used

PI semiconductor material is used as the pressure sensitive element. The PI semiconductor material is composed of a polyimide substrate and a uniformly dispersed conductive substance, with a high glass transition temperature and a good piezoresistive effect.

Benefits of technology

Long-term stability and high-precision measurement in high temperature, high humidity and high acid environments are achieved, which reduces production costs, and is suitable for various special application scenarios due to its simple structure and small size.

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Abstract

The invention relates to the technical field of pressure sensors, in particular to application of a PI semiconductor material in a pressure sensor and the pressure sensor. The PI semiconductor material has a piezoresistive effect, is high in glass transition temperature and can resist high temperature, high humidity and high acid environments; the pressure sensor prepared by using the PI semiconductor material as a pressure sensitive element has good long-term stability and is suitable for a high-temperature, high-humidity and high-acid environment. The PI semiconductor material is good in flexibility and thin in thickness, can be conveniently attached to the surface of a base material or a component to serve as a pressure sensitive element, and has a good application prospect. In addition, the pressure sensor comprises a PI semiconductor diaphragm made of a PI semiconductor material, a pressure sensing circuit arranged on the surface of the PI semiconductor diaphragm, and a CPU chip electrically connected with the pressure sensing circuit. The pressure sensor has the advantages of being good in long-term stability, suitable for high-temperature, high-humidity and high-acid environments, low in production cost, high in precision and fast in reaction.
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