Active vibration elimination system and method for semiconductor equipment

Abstract

The invention provides an active vibration elimination system and method for semiconductor equipment, the active vibration elimination system is internally provided with a data acquisition device, a control device and a vibration generation device, the vibration generation device can generate vibration waves with adaptive frequency, adaptive phase and adaptive amplitude, and the vibration waves with adaptive frequency, adaptive phase and adaptive amplitude can be generated on the basis of the interference principle of mechanical waves. An active vibration elimination method is utilized to generate anti-phase vibration waves to destructively interfere original vibration waves so as to eliminate or partially eliminate measured external vibration waves, so that vibration waves generated by various kinds of production equipment can be counteracted or partially counteracted by vibration waves generated by a vibration generation device in the production process of semiconductors, and therefore, the production efficiency of the semiconductors is improved. And the glass IC carrier plate is not excited to generate resonance, so that the glass IC carrier plate is not broken, and a production plate is not influenced or a production process is not polluted.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and particularly to an active vibration elimination system and method for semiconductor equipment. Background Art

[0002] Each object has its specific natural frequency, which is determined by factors such as the material, shape, size, thickness, and support conditions of the object. When an object is subjected to a periodic external force, it will perform forced vibration. In forced vibration, when the frequency of the external force is equal to the natural frequency of the object, the amplitude is the largest at this time, and the object will be excited to produce resonance.

[0003] Generally, the mechanical waves generated by a mechanical vibration source are divided into transverse waves and longitudinal waves. The longitudinal waves can apply a periodic external force to an object through direct contact or air transmission, and the transverse waves can apply a periodic external force to an object through direct contact; the external force applied to the surface of the object causes the object to start vibrating; when the frequency of the applied external vibration is close to or equal to the natural frequency of the object, the object will be excited to produce resonance and enter the resonance state. At this time, its amplitude will increase significantly, and at the same time, the stress inside the object will also increase. When the stress exceeds the yield strength or fatigue limit of the object, it will cause the object to start plastic deformation or microscopic crack propagation, resulting in damage to the object.

[0004] In the semiconductor industry, due to the continuous upgrading and change of semiconductor production processes, the materials and equipment used in it are also constantly upgraded and changed. For example, the introduction of new materials in the IC carrier board production industry brings new challenges to both carrier board manufacturers and corresponding equipment suppliers, such as glass used in TGV production.

[0005] Due to the fragile nature of glass, during the semiconductor production process, the vibrations generated by various production equipment will be applied to the glass IC carrier board through the production equipment or air, and will have a certain impact on the performance of the glass IC carrier board. When the vibrations generated by various production equipment are applied to the glass IC carrier board and the vibration frequency of the glass IC carrier board matches its natural frequency, the glass IC carrier board will be excited to produce resonance, resulting in the breakage of the glass IC carrier board. The debris dropped when the glass IC carrier board breaks may cause the entire production board to be scrapped, and at the same time, it will also pollute the entire production process. Summary of the Invention

[0006] To solve the above technical problems, this application provides an active vibration elimination system and method for semiconductor equipment.

[0007] In the first aspect of this application, an active vibration elimination system for semiconductor equipment is provided, including: A data acquisition device for monitoring vibration and collecting vibration data; A control device for receiving, analyzing and processing the vibration data and outputting a control instruction; A vibration generating device for receiving a control instruction and generating an anti-phase vibration wave.

[0008] In some embodiments of the present application, the data acquisition device is disposed on a preset production device and / or in a production environment.

[0009] In some embodiments of the present application, the vibration generating device is disposed on a preset production device and / or in a production environment.

[0010] In some embodiments of the present application, in combination with the layout diagram of the preset production environment, the layout diagram of the preset production environment is meshed to form a production environment layout coordinate diagram. The data acquisition device is set according to the production environment layout coordinate diagram, and the data acquisition positions are numbered, and the data acquisition positions are marked in the production environment layout coordinate diagram.

[0011] In some embodiments of the present application, the position of the vibration generating device is set according to the position of the data acquisition device, and the vibration generating positions are numbered, and the vibration generating positions are marked in the production environment layout coordinate diagram.

[0012] In some embodiments of the present application, the data acquisition device is disposed on a carrier device of an IC carrier board and / or around the carrier device.

[0013] In some embodiments of the present application, the vibration generating device is disposed on a carrier device of an IC carrier board and / or around the carrier device In some embodiments of the present application, the data acquisition device is a vibration sensor array, which includes at least one vibration sensor.

[0014] In some embodiments of the present application, the vibration generating device is a vibration generator array, which includes at least one vibration generator, and the vibration generator is at least one of a vibration film, a piezoelectric vibration or an ultrasonic vibration.

[0015] In a second aspect of the present application, an active vibration elimination method is provided, including the following steps: S1. The data acquisition device collects vibration data and transmits the collected vibration data to the control device; S2. The control device receives the vibration data sent by the data acquisition device, processes the vibration data, forms a control instruction and issues the control instruction to the vibration generating device; S3. The vibration generating device receives the control instruction issued by the control device and generates an anti-phase vibration wave opposite to the vibration data.

[0016] In some embodiments of the present application, the process of the control device processing the vibration data in step S2 includes the following steps: Analyze the vibration data transmitted by each vibration sensor received to obtain the vibration data harmful to the IC carrier board; Determine the vibration parameters of the anti-phase vibration waves that each vibration generator needs to generate according to the vibration data harmful to the IC carrier board.

[0017] In some embodiments of the present application, the process of obtaining the vibration data harmful to the IC carrier board is as follows: Model the loading device of the IC carrier board and other devices equipped with vibration sensors and vibration generators, and mark the position coordinates and numbers of each vibration sensor and vibration generator; Map the vibration data collected by each vibration sensor into the models of each device to obtain vibration data such as the vibration frequency and vibration amplitude of each device; Based on the vibration data of the loading device, obtain the vibration data of the IC carrier board; Conduct experimental modal analysis or finite element analysis on the IC carrier board to obtain its natural frequency; Compare the vibration data of each device with the natural frequency of the IC carrier board, and the vibration data whose vibration frequency is close to the natural frequency of the IC carrier board is the vibration data harmful to the IC carrier board.

[0018] Compared with the prior art, the present invention has the following advantages and beneficial effects: In the active vibration cancellation system for semiconductor equipment of the present application, a vibration generating device is provided. The vibration generating device can generate vibration waves with an adapted frequency, adapted phase, and adapted amplitude. Based on the interference principle of mechanical waves, using the active vibration cancellation method, anti-phase vibration waves are generated to perform destructive interference on the original vibration wave to cancel or partially cancel the measured external vibration wave. Thus, during the production process of semiconductors, the vibration waves generated by various production equipment will be canceled or partially canceled by the vibration waves generated by the vibration generating device. Therefore, it will not excite the glass IC carrier board to resonate and cause the glass IC carrier board to break, thereby affecting the production board or polluting the production process.

[0019] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings forming a part of this application are used to provide a further understanding of this application. The schematic embodiments and descriptions thereof in this application are used to explain this application and do not constitute an improper limitation to this application. In the drawings: Figure 1 is the schematic diagram of the active vibration cancellation system for semiconductor equipment provided by an exemplary embodiment of the present application; Figure 2It is a layout diagram of a data acquisition device and a vibration generating device provided by an exemplary embodiment of the present application; Figure 3 It is a grid layout diagram of a data acquisition device and a vibration generating device provided by an exemplary embodiment of the application; Figure 4 It is a schematic diagram of a vibration generating device provided by an exemplary embodiment of the present application; Figure 5 It is a principle block diagram of an active vibration elimination method provided by an exemplary embodiment of the present application; Figure 6 It is a vibration data diagram of a vibration sensor and a vibration generator installed at a fixed part of a production device provided by an exemplary embodiment of the present application; Figure 7 It is an X-axis vibration data diagram of a vibration sensor and a vibration generator installed at a three-axis moving part of a production device provided by an exemplary embodiment of the present application; Figure 8 It is a Y-axis vibration data diagram of a vibration sensor and a vibration generator installed at a three-axis moving part of a production device provided by an exemplary embodiment of the present application; Figure 9 It is a Z-axis vibration data diagram of a vibration sensor and a vibration generator installed at a three-axis moving part of a production device provided by an exemplary embodiment of the present application; Figure 10 It is an X-axis vibration data diagram of a vibration sensor and a vibration generator installed at a two-axis moving part of a production device provided by an exemplary embodiment of the present application; Figure 11 It is a Y-axis vibration data diagram of a vibration sensor and a vibration generator installed at a two-axis moving part of a production device provided by an exemplary embodiment of the present application; Figure 12 It is an X-axis vibration data diagram of a vibration sensor and a vibration generator installed on a carrying device provided by an exemplary embodiment of the present application; Figure 13 It is an X-axis vibration data diagram of a vibration sensor and a vibration generator installed on a carrying device provided by an exemplary embodiment of the present application; Figure 14 It is an X-axis vibration data diagram of a vibration sensor and a vibration generator installed on a carrying device provided by an exemplary embodiment of the present application.

[0021] In the figure: 201, stimulated vibration surface; 301, mounting plate; 302, vibrating body; 303, terminal post. Detailed implementation manners

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the accompanying drawings in the embodiments of this application. Apparently, the described embodiments are some, but not all, of the embodiments of this application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of this application without creative efforts shall fall within the scope of protection of this application. It should be noted that, without conflict, the embodiments in this application and the features in the embodiments may be combined with each other arbitrarily.

[0023] In the related art, due to the fragile nature of glass, during the production process of semiconductors, the vibrations generated by various production equipment are applied to the glass IC carrier through the production equipment or the air, and have a certain impact on the performance of the glass IC carrier. When the vibrations generated by various production equipment are applied to the glass IC carrier and the vibration frequency of the glass IC carrier coincides with its natural frequency, it will excite the glass IC carrier to generate resonance, causing the glass IC carrier to break. The debris that falls when the glass IC carrier breaks may cause the entire production board to be scrapped and also pollute the entire production process.

[0024] Based on this, an exemplary embodiment of this application provides an active vibration cancellation system for semiconductor equipment. Based on the interference principle of mechanical waves, using the active vibration cancellation method, an anti-phase vibration wave is generated to perform destructive interference on the original vibration wave, thereby overcoming the bias of the above technical route. A vibration generating device is provided in this system. The vibration generating device can generate vibration waves with an appropriate frequency, appropriate phase, and appropriate amplitude to cancel or partially cancel the originally measured external vibration wave. Thus, during the production process of semiconductors, the vibrations generated by various production equipment will be cancelled or partially cancelled by the vibration waves generated by the vibration generating device. Therefore, it will not excite the glass IC carrier to generate resonance, causing the glass IC carrier to break, and further affecting the production board or polluting the production process.

[0025] An exemplary embodiment of this application provides an active vibration cancellation system for semiconductor equipment, as Figure 1 shown. The active vibration cancellation system includes a data acquisition device, a control device, and a vibration generating device. The data acquisition device is used to monitor vibrations and acquire vibration data, and transmit the acquired vibration data to the control device; the control device is used to receive, analyze, and process the vibration data, and output a control instruction; the vibration generating device is used to receive the control instruction and generate an anti-phase vibration wave. Thus, the anti-phase vibration wave generated by the vibration generating device can cancel or partially cancel the original vibration wave to reduce the vibration wave transmitted to the glass IC carrier, prevent the glass IC carrier from generating resonance, and prevent the glass IC carrier from being damaged and affecting the production board or polluting the production process.

[0026] The data acquisition device is a vibration sensor array, which includes at least one vibration sensor, and the vibration sensor can collect vibration data and transmit the vibration data to the control device. The vibration sensor array can form a data acquisition matrix, and can perform matrix data acquisition on the vibration in the equipment or environment, and can provide dense data acquisition points, increase the coverage density of the monitoring area of ​​the equipment or production environment, and realize refined monitoring and measurement, which can improve the accuracy of vibration measurement and the quality of the collected vibration data. At the same time, the multi-point synchronous sampling method is adopted to realize multi-point synchronous monitoring, which can improve the efficiency and real-time performance of data acquisition. In addition, the position point of each vibration sensor can be determined by analyzing the response of each point in the vibration sensor array according to the vibration sensor array. At this time, the position of the vibration generating device can be determined according to the position of the vibration sensor. So that the control device can send control instructions to the vibration generator of the corresponding position point.

[0027] The vibration generating device is a vibration generator array, which includes at least one vibration generator, and the vibration generator is at least one of a vibration membrane, piezoelectric vibration, or ultrasonic vibration. Generally, it can be set that when the collected vibration data exceeds a preset value, the vibration generator at the corresponding position point is started, and when it is lower than the preset value, the vibration generator at the corresponding position point is in an inoperative state.

[0028] like Figure 4 The schematic diagram of the vibration generating device is shown. In one embodiment, the vibration generating device includes a frequency generator and a vibration generator. The vibration generator is mounted on a mounting plate 301. The mounting plate 301 is provided with a terminal 302. The mounting plate 301 is directly in contact with the excited vibration surface 201. The vibration generator includes a vibration membrane or a vibration body 302. The frequency generator generates a stable electrical signal according to the control instruction issued by the control device. The control instruction may include the parameters of the vibration wave to be generated, such as frequency, waveform, amplitude, etc.; the vibration generator converts the electrical signal into a vibration wave. In order to completely offset the original vibration wave, at this time, the frequency and amplitude of the vibration wave to be generated are the same as the original vibration wave, and the waveform is opposite. Therefore, the vibration wave generated by the vibration generating device and the original vibration wave can offset each other to achieve the effect of vibration reduction.

[0029] In another exemplary embodiment, the vibration generator does not need to generate an anti-phase vibration wave that is completely opposite to the original vibration, but only needs to generate a vibration wave with an opposite phase. The amplitude of the vibration wave can be smaller than the amplitude of the original vibration wave. At this time, since the amplitude of the vibration wave generated by the vibration generator is smaller than the amplitude of the original vibration, the original vibration wave can be partially offset and the amplitude of the original vibration wave can be reduced. The active vibration elimination method reduces the amplitude applied to the glass IC substrate, reduces the stress inside the glass IC substrate, and prevents the glass IC substrate from being damaged.

[0030] To drive the diaphragm to reach a sufficient amplitude, a power amplifier also needs to be set up. At this time, the output signal of the frequency generator is first amplified by the power amplifier to provide sufficient electrical energy to drive subsequent vibrations. To convert electrical energy into vibrations, a piezoelectric transducer, i.e., piezoelectric vibration, or an ultrasonic transducer, i.e., ultrasonic vibration, can be used at this time. When the diaphragm receives the mechanical vibration transmitted by the transducer, it will vibrate at a preset frequency, that is, generate a vibration that is out of phase with the original vibration to cancel or partially cancel the original vibration and prevent the glass IC carrier from being damaged due to the original vibration.

[0031] Embodiment 1: The vibration sensor is set on a preset production device, and the vibration generator is set on the preset production device or in the production environment. That is, for production requirements and production equipment, the vibration source of the production equipment is predicted, and the vibration sensor is set according to the position of the predicted vibration source. At this time, the vibration sensor and the vibration generator can be set for one or more devices. The position of the vibration generator can be close to the position of the vibration sensor, or the position of the vibration generator can be set according to the collected vibration data. For different production equipment, the position points of the vibration sensor and the vibration generator are also different. For example, the vibration sensor can be set at the loading device, conveyor system, loader, boom, fly cutter, process module, chassis of the equipment, equipment housing, etc., and the vibration generator can be set at the loading device, boom, fly cutter, etc. or in the production environment. Among them, the loading device is used to carry and clamp the IC carrier, the conveyor system is used to convey the loading device to drive the IC carrier to achieve displacement movement in the X, Y, and Z directions, the boom is used to connect the conveyor system and the loading device, and the process module is used to process the IC carrier. At this time, vibration data can be collected for the vibrations of each part of a production device or a group of production devices composed of multiple production devices, and a vibration generator can be set according to the collected vibration data to generate a vibration wave to cancel or partially cancel the original vibration wave.

[0032] Embodiment 2: The vibration sensor is set in a preset production device or production environment, and the vibration generator is also set in a preset production device or production environment, such as Figure 2As shown, where the square boxes represent the production equipment in the production environment, and the circular boxes represent the vibration acquisition positions set. At this time, the position of the vibration generator can be set according to the collected vibration data or the position of the vibration sensor. Usually, in the semiconductor production process, several devices are usually set in the same production workshop, and several devices are in the same production environment, forming one or more production processes. At this time, the vibration data of several devices in the production environment and the preset position points in the production environment can be collected, and the position of the vibration generator can be set according to the collected vibration data to generate an anti-phase vibration wave to cancel or partially cancel the original vibration wave. Preferably, a vibration generator is set at each vibration sensor, that is, the vibration sensor and the vibration generator are combined and installed. In this way, there is no need to distinguish the installation positions, and the installation process of the vibration sensor and the vibration generator can be simplified.

[0033] Embodiment 3. To facilitate the monitoring of the entire production environment, the layout diagram of the preset production environment can be combined, and the layout diagram of the preset production environment can be gridified, that is, a three-dimensional space coordinate is established for the production environment. At this time, the horizontal direction of the horizontal plane of the production environment is set as the X-axis, the direction perpendicular to the X-axis is set as the Y-axis, and the direction perpendicular to the X-axis and the Y-axis is set as the Z-axis direction. As Figure 3 shown, a production environment layout coordinate map is formed. Vibration sensors are set according to the production environment layout coordinate map, and each vibration sensor of the vibration sensors is numbered, and the three-dimensional coordinates of each vibration sensor are marked in the production environment layout coordinate map. At this time, the vibration sensors of the data acquisition device can be evenly set in the production environment according to preset parameters. For example, the distances between adjacent vibration sensors in the X-axis and Y-axis directions are equal, forming a wireless sensor matrix. The control device analyzes the vibration data collected by each vibration sensor, locates the positions of each vibration sensor through the production environment layout coordinate map, determines the position of the vibration generator, numbers the positions where the vibration occurs, marks the positions where the vibration occurs in the production environment layout coordinate map, and the control device can form corresponding control instructions and send them to the vibration generators at the corresponding coordinates. Each vibration generator generates an anti-phase vibration wave according to the received control instructions to cancel or partially cancel the original vibration wave.

[0034] Example 4: The vibration sensor is arranged on the carrying device of the glass IC carrier board, that is, the vibration sensor is only arranged on the carrying device of the glass IC carrier board, and only the vibration data of the carrying device of the glass IC carrier board is collected. The carrying device is a device that is in direct contact with the glass IC carrier board. According to the collected vibration data, a vibration generator is arranged on or around the carrying device to generate a vibration wave that is out of phase with the original vibration. At this time, as long as the vibration wave of the carrying device that is in direct contact with the glass IC carrier board is offset or partially offset, the breakage of the glass IC carrier board caused by the original vibration can be avoided. In this example, only the vibration data of the carrying device that is in direct contact with the IC carrier board is collected, that is, only the vibration data of the IC carrier board is collected, without considering the source of the harmful vibration and the reduction and superposition in the process of the vibration being transmitted from the source of the vibration to the IC carrier board, and a vibration generator is arranged on or around the carrying device to generate an out-of-phase vibration wave to eliminate the harmful vibration to the IC carrier board. In this setting method, the harmful vibration data can be collected simply and conveniently, the number of vibration sensors and vibration generators can be reduced, the operation program of the control system can be streamlined, and the operation program of the control system is greatly optimized.

[0035] As Figures 12 to 14 shown in the vibration data graph where both the vibration sensor and the vibration generator are installed on the carrying device. Among them, Figures 12 to 14 the first vibration data graph is the vibration data collected by the vibration sensor in the X, Y, and Z axis directions; according to this vibration data, the vibration generator is set to generate the vibration data shown in the Figures 12 to 14 second vibration data graph; after the vibration generator generates the reverse vibration data, the vibration data on the carrying device is collected again, and the obtained vibration data is shown in the Figures 12 to 14 third vibration data graph. It can be concluded from this that after the action of the out-of-phase vibration generated by the vibration generator, the maximum amplitude of the vibration data carried in the X-axis direction on the carrying device is reduced from nearly 120 to less than 100. Through effectiveness analysis and comparison, the analysis and comparison result shown in the Figure 12 fourth graph is obtained, and the percentage of harmful vibration reduction reaches 24.23%. The maximum amplitude of the vibration data carried in the Y-axis direction on the carrying device is reduced from more than 80 to more than 60. Through effectiveness analysis and comparison, the analysis and comparison result shown in the Figure 13 fourth graph is obtained, and the percentage of harmful vibration reduction reaches 21.43%. The maximum amplitude of the vibration data carried in the Z-axis direction on the carrying device is reduced from nearly 40 to nearly 30. Through effectiveness analysis and comparison, the analysis and comparison result shown in the Figure 14 fourth graph is obtained, and the percentage of harmful vibration reduction reaches 12.76%.

[0036] Example 5. The vibration sensor is arranged around the glass IC carrier board, that is, the vibration sensor is arranged around the loading device of the glass IC carrier board, and vibration data is collected only around the loading device of the glass IC carrier board. Exemplarily, the vibration sensor is arranged at the connection of the loading device and the conveying system or on the conveying system. According to the collected vibration data, a vibration generator is arranged on or around the loading device to generate a vibration wave that is out of phase with the original vibration, so as to avoid the breakage of the glass IC carrier board caused by the original vibration.

[0037] As Figure 6 shown, it is a vibration data diagram in which both the vibration sensor and the vibration generator are installed at the fixed part of the production equipment; this fixed part may vibrate due to the movement of other parts. Among them, Figure 6 the first vibration data diagram in is the vibration data collected by the vibration sensor; according to this vibration data, a vibration generator is set to generate vibration data as shown in the second vibration data diagram; after the vibration generator generates reverse vibration data, the vibration data is collected again, and the obtained vibration data is as shown in the third vibration data diagram. It can be concluded that through the action of the reverse vibration generated by the vibration generator, the maximum amplitude of the vibration data on this fixed part is reduced from nearly 20 to nearly 15. After effectiveness analysis and comparison, the analysis and comparison result as shown in Figure 6 the fourth diagram is obtained, and the percentage of harmful vibration reduction reaches 19.70%.

[0038] Figures 7 to 9 It is a vibration data diagram in which the vibration sensor and the vibration generator are arranged at the three-axis moving part. This three-axis moving part can be a conveying system capable of moving in the X, Y, and Z directions. Among them, Figures 7 to 9 the first vibration data diagram in is the vibration data in the X, Y, and Z axis directions collected by the vibration sensor; according to this vibration data, a vibration generator is set to generate vibration data as shown in Figures 7 to 9 the second vibration data diagram in; after the vibration generator generates reverse vibration data, the vibration data on the loading device is collected again, and the obtained vibration data is as shown in Figures 7 to 9 the third vibration data diagram in. It can be concluded that through the action of the reverse vibration generated by the vibration generator, the maximum amplitude of the vibration data carried in the X-axis direction on the three-axis moving part is reduced from nearly 60 to less than 50. After effectiveness analysis and comparison, the analysis and comparison result as shown in Figure 7 the fourth diagram is obtained, and the percentage of harmful vibration reduction reaches 33.44%. The maximum amplitude of the vibration data carried in the Y-axis direction on the three-axis moving part is reduced from more than 80 to more than 70. After effectiveness analysis and comparison, the result as shown in Figure 8As shown in the fourth figure, the percentage of harmful vibration reduction reaches 22.84%. The maximum amplitude of the vibration data carried in the Z-axis direction on the three-axis moving part is reduced from nearly 40 to nearly 30. After effectiveness analysis and comparison, the analysis and comparison results are as shown in Figure 9 As shown in the fourth figure, the percentage of harmful vibration reduction reaches 8.55%.

[0039] Figure 10 and 11 Figures and are vibration data diagrams of vibration sensors and vibration generators set on the two-axis moving part, and the two-axis moving part can be a conveying system capable of moving in the X and Y directions. Among them, Figure 10 and 11 The first vibration data diagram in is the vibration data in the X and Y axis directions collected by the vibration sensor; according to this vibration data, the vibration generator is set to generate the vibration data in the second vibration data diagram as shown in Figure 10 and 11 After the vibration generator generates reverse vibration data, the vibration data is collected again, and the obtained vibration data is as shown in Figure 10 and 11 As shown in the third vibration data diagram in. It can be concluded from this that after the action of the reverse vibration generated by the vibration generator, the maximum amplitude of the vibration data carried in the X-axis direction on the two-axis moving part is reduced from more than 40 to more than 30. After effectiveness analysis and comparison, the analysis and comparison results are as shown in Figure 10 As shown in the fourth figure in, the percentage of harmful vibration reduction reaches 9.27%. The maximum amplitude of the vibration data carried in the Y-axis direction on the three-axis moving part is reduced from more than 80 to more than 60. After effectiveness analysis and comparison, the analysis and comparison results are as shown in Figure 10 As shown in the fourth figure in, the percentage of harmful vibration reduction reaches 32.39%.

[0040] It can be concluded from this that after the vibration generator generates reverse vibration waves, the original vibration waves can be greatly reduced. In this way, during the production process of semiconductors, the vibration waves generated by various production equipment will be offset or partially offset by the vibration waves generated by the vibration generating device. Therefore, the glass IC carrier will not be excited to resonate, causing the glass IC carrier to break, thereby affecting the production board or polluting the production process.

[0041] An exemplary embodiment of the present application provides an active vibration elimination method. As shown in Figure 5 , the method includes the following steps: S1. The data acquisition device acquires vibration data and transmits the acquired vibration data to the control device; S2. The control device receives the vibration data sent by the data acquisition device, obtains the vibration data of the vibration sensor within a certain period of time, processes the vibration data to form a control instruction, and issues the control instruction to the vibration generating device. S3. The vibration generating device receives the control instruction issued by the control device and generates an anti-phase vibration wave opposite to the vibration data.

[0042] Among them, the process of the control device processing the vibration data is as follows: Analyze the vibration data transmitted by each vibration sensor received to obtain the vibration data harmful to the glass IC carrier; among them, the vibration data includes but is not limited to vibration frequency, amplitude, direction, phase, and the variation law with time, etc.

[0043] According to the vibration data harmful to the glass IC carrier, determine the vibration parameters of the anti-phase vibration wave that each vibration generator needs to generate.

[0044] The process of obtaining the vibration data harmful to the glass IC carrier is as follows: Conduct experimental modal analysis or finite element analysis on the glass IC carrier to obtain its natural frequency; Model the loading device of the glass IC carrier and other devices equipped with vibration sensors and vibration generators, and mark the position coordinates and numbers of each vibration sensor and vibration generator; map the vibration data collected by each vibration sensor into the models of each device to obtain the vibration frequency, vibration amplitude, and vibration conduction process of each device, and then obtain the vibration conditions of each device within a certain period of time; since the glass IC carrier is in direct contact with the loading device, the vibration frequency, vibration amplitude, and other data on the glass IC carrier can be obtained, and then the vibration conditions of the glass IC carrier can be obtained.

[0045] According to data such as the vibration frequency, vibration amplitude of the glass IC carrier and the natural frequency of the glass IC carrier, it can be obtained that the vibration data with a vibration frequency close to the natural frequency of the glass IC carrier is the vibration data harmful to the glass IC carrier; According to data such as the vibration frequency, vibration amplitude of the glass IC carrier, the stress distribution and deformation data of the glass IC carrier can be obtained; the vibration data that causes stress or deformation on the glass IC carrier exceeding the preset range is the vibration data harmful to the glass IC carrier.

[0046] Preferably, in order to better collect effective vibration data, the installation positions of the vibration sensors are preferably the following: install vibration sensors at the fixing points of the glass IC carrier and the carrying device, so that the vibration conduction process can be better obtained and the vibration data of the glass IC carrier can be better inferred; install vibration sensors at the connection points of the carrying device and the conveying system of the carrying device to obtain the vibration data introduced from the outside; the conveying system is a device for conveying the carrying device, such as a robotic arm, a maglev track, etc.; install vibration sensors at the edges of the carrying device to monitor the vibration of the carrying device in a timely manner; install vibration sensors at the positions where rotational, translational and other movements occur to detect the vibration of each component in motion in real time.

[0047] Preferably, a vibration generator is provided at each vibration sensor to eliminate the source vibration that generates harmful vibrations; or the vibration generator is provided at a position close to the glass IC carrier to improve the reaction speed of eliminating harmful vibrations and enhance the effect of eliminating harmful vibrations; or the vibration generator is provided at the connection point of the carrying device and the conveying device to eliminate the vibration wave transmitted from the outside to the carrying device in advance and reduce the vibration wave transmitted to the glass IC carrier.

[0048] The process of determining the vibration parameters of the anti-phase vibration waves that each vibration generator needs to generate is as follows: After modeling the carrying device of the glass IC carrier and other devices equipped with vibration sensors and vibration generators, map the vibration data collected by each vibration sensor into the models of each device. Based on the vibration data such as the vibration frequency and vibration amplitude of each device obtained, use the vibration data such as the vibration frequency and vibration amplitude of each device obtained as the original input parameters of the vibration generator, and obtain the vibration parameters of the vibration generator that is in anti-phase with it based on the original input parameters.

[0049] Exemplarily, before the vibration generator generates the anti-phase vibration wave, the vibration data collected by the vibration sensor at the carrying device is the first vibration data; After the vibration generator at a certain position generates the anti-phase vibration wave, the vibration sensor at the carrying device continues to collect vibration data and names the collected vibration data as the second vibration data; compare the second vibration data with the first vibration data to obtain a comparison result; based on the comparison result, effective vibration generators can be identified.

[0050] If the parameters of the second vibration data are significantly smaller than those of the first vibration data, the anti-phase vibration generated by the vibration generator is an effective anti-phase vibration. Mark the vibration generator as an effective vibration generator, and record the label and coordinates of the vibration generator. If the parameters of the second vibration data show no significant change compared with those of the first vibration data, or the parameters of the second vibration data are greater than those of the first vibration data, the anti-phase vibration generated by the vibration generator is an ineffective anti-phase vibration. Mark the vibration generator as an ineffective vibration generator and remove the vibration generator from the array of vibration generators.

[0051] According to the labels and coordinates of the effective vibration generators, adjust the vibration parameters of the effective vibration generators and monitor the changes in the second vibration data in real time to ensure the maximum elimination of harmful vibrations.

[0052] In this application, the terms "comprising", "including" or any other variation thereof are intended to cover non-exclusive inclusion, such that an article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such article or device. Without further limitation, an element defined by the statement "comprising..." does not exclude the presence of additional identical elements in the article or device comprising said element.

[0053] Although the preferred embodiments of this application have been described, those skilled in the art can make additional changes and modifications once they learn the basic creative concept. Therefore, the appended claims are intended to be construed as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0054] Obviously, those skilled in the art can make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalent technologies, the intention of this application also includes these modifications and variations.

Claims

1. An active vibration elimination system for semiconductor equipment, characterized in that: include: A data acquisition device for monitoring vibration and collecting vibration data; A control device for receiving, analyzing and processing the vibration data and outputting control instructions; A vibration generating device for receiving control instructions and generating anti-phase vibration waves.

2. The active vibration cancellation system for semiconductor equipment according to claim 1, characterized in that: The data acquisition device is arranged on a preset production equipment and / or a production environment.

3. The active vibration cancellation system for semiconductor equipment according to claim 1, characterized in that: The vibration generating device is arranged on a preset production equipment and / or a production environment.

4. The active vibration cancellation system for semiconductor equipment according to claim 1, characterized in that: Combined with the layout diagram of the preset production environment, the preset production environment layout diagram is gridded to form a production environment layout coordinate diagram, a data acquisition device is set according to the production environment layout coordinate diagram, and the data acquisition positions are numbered and marked in the production environment layout coordinate diagram.

5. The active vibration cancellation system for semiconductor equipment according to claim 4, characterized in that: The position of the vibration generating device is set according to the position of the data acquisition device, and the vibration generating position is numbered, and the vibration generating position is marked in the production environment layout coordinate diagram.

6. The active vibration cancellation system for semiconductor equipment according to claim 2, characterized in that: The data acquisition device is arranged on the carrying device of the IC carrier and / or around the carrying device.

7. The active vibration cancellation system for semiconductor equipment according to claim 3, characterized in that: The vibration generating device is arranged on the carrying device of the IC carrier and / or around the carrying device.

8. The active vibration cancellation system for semiconductor equipment according to claim 1, characterized in that: The data acquisition device is a vibration sensor array, which includes at least one vibration sensor.

9. The active vibration cancellation system for semiconductor equipment according to claim 1, characterized in that: The vibration generating device is a vibration generator array, which includes at least one vibration generator, and the vibration generator is at least one of a vibration membrane, piezoelectric vibration, or ultrasonic vibration.

10. An active vibration elimination method, characterized in that: The steps include: S1, the data acquisition device collects vibration data and transmits the collected vibration data to the control device; S2, the control device receives the vibration data sent by the data acquisition device and processes the vibration data, forms a control instruction and sends the control instruction to the vibration generating device; S3. The vibration generating device receives the control instruction sent by the control device and generates an anti-phase vibration wave opposite to the vibration data.

11. The active vibration elimination method according to claim 10, characterized in that: In step S2, the control device processes the vibration data, including the following steps: Analyze the vibration data transmitted by each vibration sensor to obtain vibration data harmful to the IC substrate; According to the vibration data harmful to the IC substrate, the vibration parameters of the anti-phase vibration waves that each vibration generator needs to generate are determined.

12. The active vibration elimination method according to claim 11, characterized in that: The process of obtaining vibration data that is harmful to the IC substrate is as follows: Model the device equipped with vibration sensors and vibration generators, and mark the position coordinates and numbers of each vibration sensor and vibration generator; Mapping the vibration data collected by each vibration sensor to the model of each device to obtain vibration data such as vibration frequency and vibration amplitude of each device; Based on the vibration data of the carrier device, obtain the vibration data of the IC carrier; Perform experimental modal analysis or finite element analysis on the IC substrate to obtain its natural frequency; The vibration data of each device is compared with the natural frequency of the IC substrate, and the vibration data with a vibration frequency close to the natural frequency of the IC substrate is vibration data harmful to the IC substrate.

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