Material with mechanical property insensitive to deformation rate as well as preparation method and application of material

Abstract

The invention discloses preparation and application of a material with mechanical properties insensitive to a deformation rate, and belongs to the technical field of high polymer materials, 2-hydroxyethyl-5-(1, 2-dithiolane-3-yl) valerate is selected as a monomer, N, N-dimethylformamide is used as a solvent and a catalyst, the N, N-dimethylformamide is volatilized to induce the 2-hydroxyethyl-5-(1, 2-dithiolane-3-yl) valerate to react with the deformation rate, and the mechanical properties of the material are insensitive to the deformation rate. The preparation method comprises the following steps: polymerizing 1, 2-dithiolane-3-yl) valerate to form a linear polymer and a cyclic polymer, and dialyzing by using tetrahydrofuran to remove the residual monomer and linear polymer, thereby obtaining the lantern ring material of which the mechanical property is insensitive to the deformation rate. The material with the mechanical property insensitive to the deformation rate has the advantages that the mechanical property is insensitive to strain, the preparation is simple, the mechanical property is controllable and the like, has a wide application prospect in the aspects of electronic insulating layers, automobile and rail transit, deep sea engineering and the like, and is simple and feasible in synthesis process, wide in application range, low in preparation cost and easy to popularize.

Description

Technical Field

[0001] The present invention belongs to the technical field of polymer materials, and particularly relates to a material with mechanical properties insensitive to strain rate, and its preparation method and application. Background Art

[0002] Mechanically insensitive materials refer to materials whose mechanical properties (such as strength, hardness, elastic modulus, fracture toughness, etc.) are insensitive to changes in external environmental factors (such as strain rate, temperature, humidity, etc.). Such materials can still maintain relatively stable mechanical properties under different working conditions, so they are usually used in engineering fields with high requirements for environmental adaptability. For example, in the field of insulating layers of electronic devices, the insulating layer should maintain stable mechanical properties when subjected to external force stimulation; in the fields of automobiles and rail transit, high-strength and high-speed moving parts, such as braking systems and suspension systems, should maintain their mechanical properties during rapid changes; in the field of deep-sea engineering, the mechanical properties of its materials remain stable when the pressure changes. However, traditional materials such as rubber, polyether ether ketone, polybutylene terephthalate, and polyethersulfone still exhibit the phenomenon that their mechanical properties change with the stretching rate.

[0003] In addition, with the development of technology, the demand for mechanically insensitive materials is gradually increasing, especially for mechanically insensitive materials with excellent performance. However, how to achieve their mechanical insensitivity still faces challenges. In addition, an excellent mechanically insensitive material should have the advantages of simple preparation, easy availability of raw materials, and economy. These factors all affect the development of mechanically insensitive materials. Summary of the Invention

[0004] The purpose of the present invention is to: aiming at the problem that it is difficult to achieve a material with mechanical properties insensitive to strain rate in existing materials, based on the modified existing technology (Angew. Chem. Int. Ed, 2025, e2024250), provide a material with mechanical properties insensitive to strain rate, and its preparation method and application.

[0005] The technical solution adopted by the present invention is as follows:

[0006] A material with mechanical properties insensitive to strain rate, the molecular formula of the monomer molecule is:

[0007]

[0008] R = -H, -C n H 2n+1 , -C n H 2n , -OH, -C n H 2n , -NH 2 , -C n H 2n , -Cl, -Cn H 2n -Br, -C n H 2n -COOH

[0009] The preparation method of the above-mentioned strain-rate insensitive mechanical property material comprises the following steps:

[0010] S1. Combining with the preparation method reported in the prior art (Angew. Chem. Int. Ed, 2025, e2024250), dissolve the first type of 2-hydroxyethyl 5-(1,2-dithiolan-3-yl) pentanoate in N,N-dimethylformamide, and the molar ratio of 2-hydroxyethyl 5-(1,2-dithiolan-3-yl) pentanoate to N,N-dimethylformamide is 7:3.

[0011] S2. Place the above solution in an air environment at room temperature to allow the solvent to naturally evaporate completely, and then place it in tetrahydrofuran to remove monomers and linear polymers. The remaining loop polymer is the strain-rate insensitive mechanical property material.

[0012] The present invention prepares the material in the following two ways. First, a homogeneous solution containing 2-hydroxyethyl 5-(1,2-dithiolan-3-yl) pentanoate and N,N-dimethylformamide is prepared; second, N,N-dimethylformamide is uniformly evaporated at room temperature. During the evaporation process, 2-hydroxyethyl 5-(1,2-dithiolan-3-yl) pentanoate polymerizes to form two types of polymers, loop polymers and linear polymers, and further uses tetrahydrofuran to remove linear polymers.

[0013]

[0014] The present invention uses the prior art to prepare a polymer containing a loop structure, and further uses a solvent to remove unreacted monomers and linear polymers. The pure polymer containing a loop structure exhibits the characteristic of strain-rate insensitive mechanical properties.

[0015] The above-mentioned strain-rate insensitive mechanical property material is applied in the fields of insulating layers of electronic devices, automobiles and rail transit, deep-sea engineering, etc.

[0016] The force-insensitive characteristic exhibited by the material prepared by the present invention enables the material to be applied to the insulating layer of electronic devices, and the insulating layer of electronic devices requires this force-insensitive characteristic. The force-induced performance enhancement and weakening exhibited by traditional materials will have an adverse impact on electronic devices. This strain-rate insensitive mechanical property material can well solve the above problems.

[0017] The force-insensitive property exhibited by the material prepared by the present invention enables the material to be applied in the fields of automobiles and rail transit. In these fields, its high-strength and high-speed moving components, such as braking systems, suspension systems, etc., are required to maintain their mechanical properties during rapid changes, rather than the strengthening or weakening of mechanical properties. Therefore, materials with mechanical properties insensitive to the strain rate show great potential.

[0018] The force-insensitive property exhibited by the material prepared by the present invention enables the material to be applied in the field of deep-sea engineering. In the field of deep-sea engineering, rapid pressure changes often occur. Under such changes, the force-induced strengthening and weakening of ordinary materials can easily lead to various unknown problems. Therefore, materials are required to maintain stable mechanical properties during pressure changes. This material with mechanical properties insensitive to the strain rate can exhibit consistent mechanical properties under different pressures.

[0019] In summary, due to the adoption of the above technical solutions, the beneficial effects of the present invention are as follows:

[0020] 1. In the material with mechanical properties insensitive to the strain rate of the present invention, the internal structure is polymer chain segments in the form of collar structures;

[0021] 2. The material with mechanical properties insensitive to the strain rate of the present invention has a controllable molecular structure and composition, and can effectively realize the preparation of materials with different mechanical properties;

[0022] 3. The material with mechanical properties insensitive to the strain rate of the present invention has excellent mechanical properties and is insensitive to strain;

[0023] 4. The preparation method of the material with mechanical properties insensitive to the strain rate of the present invention is simple, easy to implement, environmentally friendly, has a high yield, low preparation cost, and is easy to promote. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0025] Figure 1 It is a schematic diagram for the preparation of the material with mechanical properties insensitive to the strain rate of the present invention;

[0026] Figure 2 It is a physical diagram of the material with mechanical properties insensitive to the strain rate of the present invention;

[0027] Figure 3This is the stress-strain curve diagram of the material with mechanical properties insensitive to strain rate of the present invention under different tensile rates;

[0028] Figure 4 This is the compressive stress-strain curve of the material with mechanical properties insensitive to strain rate of the present invention. Specific embodiments

[0029] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention, that is, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Therefore, the detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0030] The features and performance of the present invention will be further described in detail below with reference to the embodiments.

[0031] Embodiment 1

[0032] A preferred embodiment of the present invention provides a method for preparing a material with mechanical properties insensitive to strain rate, and the specific steps are as follows:

[0033] Add 1.75 g of 2-hydroxyethyl 5-(1,2-dithiolan-3-yl)pentanoate to 0.219 g of N,N-dimethylformamide to form a homogeneous solution, and then volatilize it at room temperature until there is no residue of N,N-dimethylformamide. Polymer 1 can be prepared.

[0034] Take the above-prepared Polymer 1 and place it in 10 mL of tetrahydrofuran, and change the tetrahydrofuran every other day. Finally, a material 1 with mechanical properties insensitive to strain rate is obtained. The preparation process is as Figure 1 shown, and the physical picture of the preparation is as Figure 2 shown

[0035] Embodiment 2

[0036] A preferred embodiment of the present invention provides a method for preparing a material with mechanical properties insensitive to strain rate, and the specific steps are as follows:

[0037] Add 2 g of 2-hydroxyethyl 5-(1,2-dithiolan-3-yl)pentanoate to 0.1 g of N,N-dimethylformamide to form a homogeneous solution, and then volatilize it at 45 °C until there is no residue of N,N-dimethylformamide. Polymer 2 can be prepared.

[0038] Take the polymer 2 prepared above, place it in 20 mL of tetrahydrofuran, and change the tetrahydrofuran every other day. Finally, a material 2 with mechanical properties insensitive to the strain rate is obtained.

[0039] Example 3

[0040] A preferred embodiment of the present invention provides a method for preparing a material with mechanical properties insensitive to the strain rate, and the specific steps are as follows:

[0041] Add 1.5 g of 2-hydroxyethyl 5-(1,2-dithiolan-3-yl)pentanoate to 0.4 g of N,N-dimethylformamide to form a homogeneous solution, and then volatilize it at room temperature until there is no residue of N,N-dimethylformamide. Then the polymer 3 can be prepared.

[0042] Take the polymer 3 prepared above, place it in 10 mL of tetrahydrofuran, and change the tetrahydrofuran every other day. Finally, a material 3 with mechanical properties insensitive to the strain rate is obtained.

[0043] Example 4

[0044] A preferred embodiment of the present invention provides a tensile stress test for a material with mechanical properties insensitive to the strain rate, and the specific steps are as follows:

[0045] Take the material 1 with mechanical properties insensitive to the strain rate prepared in Example 1, place it in a universal tensile testing machine, and set the tensile rates to 10 mm / min, 20 mm / min, and 40 mm / min respectively. The obtained stress-strain curves are as Figure 3 shown. It can be seen that as the tensile rate increases, the stress-strain curve only shows a slight change, indicating that the material has the characteristic of being insensitive to the tensile rate in mechanical properties.

[0046] Example 5

[0047] A preferred embodiment of the present invention provides a compressive stress test for a material with mechanical properties insensitive to the strain rate, and the specific steps are as follows:

[0048] Take the material 1 with mechanical properties insensitive to the strain rate prepared in Example 1, place it in a universal tensile testing machine, set the tensile rate to 10 mm / min, and continuously stretch it in cycles three times. The obtained stress-strain curves are as Figure 4 shown. It can be seen that there is no obvious change in the mechanical properties during the three stretching processes.

[0049] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. Preparation and application of a material whose mechanical properties are insensitive to deformation rate, characterized in that: The simplified formula of the constituent materials is: R=-H,-C n H 2n+1 ,-C n H 2n -OH,-C n H 2n -NH2,-C n H 2n -Cl,-C n H 2n -Br,-C n H 2n -COOH Where n=1-100.

2. The method for preparing a material whose mechanical properties are insensitive to deformation rate according to claim 1, characterized in that: The following steps are involved: According to the modified prior art Angew.Chem.Int.Ed, 2025, e2024250, a certain amount of N,N-dimethylformamide and the monomer described in claim 1 are evenly mixed, and then the N,N-dimethylformamide is volatilized to remove the prepared material, and the unreacted monomer and linear polymer are removed to prepare the polymer containing the ring structure.

3. The method for preparing a material whose mechanical properties are insensitive to deformation rate according to claim 2, characterized in that: The polymers are all cyclic polymer chains inside, and are in a ring structure with each other.

4. The method for preparing a material whose mechanical properties are insensitive to deformation rate according to claim 2, characterized in that: The skeleton of the cyclic polymer is mainly composed of sulfur element.

5. The use according to claims 1-4, characterized in that: The material can be used in the insulation layer of electronic equipment and deep-sea engineering.

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