Workpiece carrying table and semiconductor detection equipment

Abstract

The invention provides a workpiece carrying table and semiconductor detection equipment. The workpiece carrying table comprises a lifting assembly, a jacking assembly, a reversing assembly and a driving mechanism. The lifting assembly comprises a lifting inclined face and a bearing face which are opposite in the height direction of the workpiece carrying table. A jacking inclined plane is arranged at the bottom of the jacking assembly, a supporting column is arranged at the top of the jacking assembly, and the inclined plane where the jacking inclined plane is located intersects with the inclined plane where the lifting inclined plane is located; the reversing assembly is in sliding fit with the lifting assembly and the jacking assembly. The driving mechanism comprises a transmission part and a linear driving part, the transmission part abuts against the lifting inclined face and the jacking inclined face, the linear driving part is connected with the transmission part, and the driving direction of the linear driving part intersects with the guiding direction of the reversing assembly. The lifting assembly and the jacking assembly share one driving mechanism, the structure is simple, transmission is smooth, and accurate cooperative operation of the lifting assembly and the jacking assembly can be achieved.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, and particularly relates to a workpiece stage and a semiconductor inspection device. Background Art

[0002] In a semiconductor inspection device, a moving stage can accurately position a wafer in the height direction. Among them, a lifting mechanism and a carrier plate are arranged on the moving stage, and both the lifting mechanism and the carrier plate can be lifted and lowered. The wafer transported by an external transfer manipulator can be placed on the carrier plate by the lifting mechanism, and the lifting mechanism can also lift the wafer on the carrier plate and move it away by the external transfer manipulator.

[0003] In some technologies, the lifting of the lifting mechanism and the lifting of the carrier plate are independent of each other, and the problem that those skilled in the art urgently need to solve is the coordinated cooperation between the two. Summary of the Invention

[0004] An embodiment of this application provides a workpiece stage and a semiconductor inspection device, and the workpiece stage can realize the precise coordinated operation of a lifting component and a lifting mechanism.

[0005] In a first aspect, an embodiment of this application provides a workpiece stage, which includes a lifting component, a lifting mechanism, a commutation component, and a driving mechanism. The lifting component includes a lifting inclined surface and a bearing surface that are opposite to each other in the height direction of the workpiece stage; the bottom of the lifting mechanism is provided with a lifting inclined surface, and the top is provided with a support column. The inclined surface where the lifting inclined surface is located intersects with the inclined surface where the lifting inclined surface is located; the commutation component is slidably matched with the lifting component and the lifting mechanism, and is used to commutate the movement trajectory of the lifting component and the movement trajectory of the lifting mechanism; the driving mechanism includes a transmission member and a linear driving member. The transmission member abuts against the lifting inclined surface and the lifting inclined surface, and the linear driving member is connected to the transmission member and the driving direction intersects with the guiding direction of the commutation component; wherein, the transmission member pushes the lifting inclined surface and the lifting inclined surface along the driving direction based on the driving force of the linear driving member, and the lifting component and the lifting mechanism abut against the commutation component under the action of the pushing force, and commutate the pushing force along the driving direction to the pushing force in the guiding direction and relatively slide in the guiding direction.

[0006] In some embodiments, the inclined directions of the lifting inclined surface and the lifting inclined surface are opposite.

[0007] In some embodiments, the included angle between the lifting inclined surface and the driving direction ranges from 10° to 35°, and the included angle between the lifting inclined surface and the driving direction ranges from 10° to 35°.

[0008] In some embodiments, the transmission member includes a lifting transmission member. A transmission surface is provided at the top of the lifting transmission member, and a sliding surface is provided at the bottom. The transmission surface is in contact with the lifting inclined surface, and the angle between the sliding surface and the transmission surface is less than 45°. The transmission surface is used to push the lifting inclined surface to translate, and the sliding surface is used to slide along the driving direction.

[0009] In some embodiments, the transmission member further includes a jacking transmission member. The jacking transmission member includes a jacking seat and a jacking ball. The jacking seat is disposed on the lifting transmission member, and the jacking ball is rotatably disposed on the jacking seat. The jacking ball is in contact with the jacking inclined surface and is used to push the jacking inclined surface to translate.

[0010] In some embodiments, the jacking seat and the lifting transmission member are connected by an adjusting rod. The adjusting rod is rotatably disposed on the lifting transmission member and is threadedly connected to the jacking seat. The adjusting rod is disposed parallel to the driving direction and is used to fix and adjust the position of the jacking seat.

[0011] In some embodiments, the workpiece stage further includes a base. A commutation assembly is provided on the base. The commutation assembly includes a lifting guide member and a jacking guide member. The lifting guide member is slidably engaged with the lifting assembly, and the jacking guide member is slidably engaged with the jacking assembly. The lifting guide member and the jacking guide member are disposed parallel to each other, and the guiding direction is perpendicular to the driving direction.

[0012] In some embodiments, a lifting mating portion is provided on one side of the lifting assembly perpendicular to the driving direction. The lifting mating portion is slidably engaged with the lifting guide member.

[0013] In some embodiments, a jacking mating portion is provided at the bottom of the jacking assembly. The jacking mating portion is slidably engaged with the jacking guide member.

[0014] In some embodiments, a reset member is provided on the base. The reset member is connected to the lifting assembly and is used to provide a pulling force for the lifting assembly to move towards the base.

[0015] In a second aspect, an embodiment of the present application provides a semiconductor detection device, which includes the workpiece stage described in any of the above embodiments.

[0016] The present application provides a workpiece stage and a semiconductor detection device. The workpiece stage includes a lifting assembly, a jacking assembly, a commutation assembly, and a driving mechanism. The driving mechanism includes a transmission member and a linear driving member. Based on the driving force of the linear driving member and under the action of the commutation assembly, the transmission member can make the support column slide relative to the bearing surface, so that the support column can lift the workpiece from the bearing surface or place the workpiece on the bearing surface. The lifting assembly and the jacking assembly share a driving mechanism, which has a simple structure and smooth transmission, and can realize the precise coordinated operation of the lifting assembly and the jacking assembly. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 Structural schematic diagram of the workpiece stage of some embodiments of the present application from one perspective;

[0019] Figure 2 Exploded structural schematic diagram of the workpiece stage of some embodiments of the present application;

[0020] Figure 3 Structural schematic diagram of the workpiece stage of some embodiments of the present application from another perspective;

[0021] Figure 4 Structural schematic diagram of the lifting member of some embodiments of the present application from one perspective;

[0022] Figure 5 Structural schematic diagram of the jacking member of some embodiments of the present application from one perspective;

[0023] Figure 6 Structural schematic diagram of the driving mechanism of some embodiments of the present application from one perspective;

[0024] Figure 7 Structural schematic diagram of the driving mechanism of some embodiments of the present application from another perspective;

[0025] Figure 8 For the present application Figure 7 Partial enlarged view at I.

[0026] In the drawings:

[0027] 1 - Base; 11 - Commutation component; 111 - Lifting guide; 112 - Jacking guide; 12 - Reset component; 2 - Lifting component; 21 - Lifting inclined plane; 22 - Bearing surface; 23 - Lifting mating part; 3 - Jacking component; 31 - Jacking inclined plane; 32 - Support column; 33 - Jacking mating part; 4 - Driving mechanism; 41 - Linear driving part; 42 - Lifting transmission part; 421 - Transmission surface; 422 - Sliding surface; 43 - Jacking transmission part; 431 - Jacking seat; 432 - Jacking ball; 44 - Adjusting rod; X - Driving direction; Y - Guiding direction. Detailed implementation manners

[0028] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the following further describes the present application in detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than limiting the present application. For those skilled in the art, the present application can be implemented without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.

[0029] It should be noted that, in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or sequence between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover a non - exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, elements defined by the statement "comprising..." do not exclude the presence of additional identical elements in the process, method, article or device comprising the said elements.

[0030] In a semiconductor detection device, a moving stage can accurately position a wafer in the height direction (vertical direction). The moving stage is provided with a jacking mechanism and an electrostatic chuck. Both the jacking mechanism and the electrostatic chuck can be lifted and lowered in the height direction to interact with the outside world for the wafer. When interacting with the outside world for the wafer, an external transfer manipulator transfers the wafer to the jacking mechanism, and the jacking mechanism places the wafer on the electrostatic chuck or jacks up the wafer from the electrostatic chuck and transfers it to the external transfer manipulator.

[0031] In some technologies, both the electrostatic chuck and the lifting mechanism are independently controlled. Among them, the lifting mechanism is driven by a motor outside the vacuum chamber of the semiconductor inspection equipment, and vacuum sealing is achieved through a bellows. Then, it drives the lifting rod inside the vacuum chamber (which can be a lead screw, and the nut of the lead screw is connected to the lifting mechanism). The lifting rod jacks up the lifting mechanism (the lifting mechanism is composed of two guide rails, a lifting column mounting seat, and three lifting columns). Driven by the lifting rod, the lifting mechanism moves up and down along the slide table. The lifting column can lift or place the wafer from the top of the electrostatic chuck, realizing the transfer of the wafer in the height direction. The electrostatic chuck, on the other hand, realizes the lifting drive through another set of drive mechanisms.

[0032] Although the lifting of the wafer in the vacuum environment is achieved to a certain extent in this technology, the structure is complex, involving the design of two parts inside and outside the vacuum chamber; it is prone to jamming. The drive mechanisms of the electrostatic chuck and the lifting mechanism need to be arranged in the same space, with a complex layout and poor transmission; the transmission efficiency is low. The motor of the lifting mechanism is located outside the vacuum chamber, resulting in power loss and reduced transmission efficiency during power transmission; the synchronization is poor. The coordinated actions of the two sets of drive mechanisms are easily affected by power fluctuations, transmission wear, etc. Therefore, when transferring the wafer, this technology is prone to jamming, offset, or damage during the wafer transfer process due to improper cooperation, affecting the transfer accuracy and stability of the wafer.

[0033] In order to improve the transfer accuracy and stability of the wafer, the drive mechanisms of the electrostatic chuck and the lifting mechanism can be improved so that the electrostatic chuck and the lifting mechanism share a set of drive mechanisms, thereby improving the coordination between the electrostatic chuck and the lifting mechanism, reducing space occupation and power loss, and simplifying the drive mechanism, thus improving the transfer accuracy and stability of the wafer.

[0034] Based on the above considerations, this application designs a workpiece stage, as Figure 1 shown. The workpiece stage includes a lifting component 2, a jacking component 3, a commutation component 11, and a drive mechanism 4. As Figure 2 、 Figure 4 and Figure 5As shown in the figure, the lifting assembly 2 includes a lifting inclined surface 21 and a bearing surface 22 that are opposite to each other in the height direction of the workpiece stage; the bottom of the jacking assembly 3 is provided with a jacking inclined surface 31, and the top is provided with a support column 32. The inclined surface where the jacking inclined surface 31 is located intersects with the inclined surface where the lifting inclined surface 21 is located. The reversing assembly 11 is slidably engaged with the lifting assembly 2 and the jacking assembly 3, and is used to reverse the movement trajectories of the lifting assembly 2 and the jacking assembly 3. The driving mechanism 4 includes a transmission member and a linear driving member 41. The transmission member abuts against the lifting inclined surface 21 and the jacking inclined surface 31, and the driving direction X of the linear driving member 41 intersects with the guiding direction Y of the reversing assembly 11. Among them, the transmission member pushes the lifting inclined surface 21 and the jacking inclined surface 31 along the driving direction X based on the driving force of the linear driving member 41. The lifting assembly 2 and the jacking assembly 3 abut against the reversing assembly 11 under the action of the driving force, reverse the driving force along the driving direction X to the driving force in the guiding direction Y, and slide relative to each other in the guiding direction Y, so that the support column 32 can lift the workpiece from the bearing surface 22 or place the workpiece on the bearing surface 22. The workpiece can be a wafer (hereinafter, the wafer will be used as an example for description).

[0035] In the height direction of the workpiece stage, the top of the lifting assembly 2 is provided with a bearing surface 22, and the bottom is provided with a lifting inclined surface 21. The top of the jacking assembly 3 is provided with a support column 32, and the bottom is provided with a jacking inclined surface 31. The inclined surfaces where the jacking inclined surface 31 and the lifting inclined surface 21 are located intersect. When the transmission member drives the lifting assembly 2 and the jacking assembly 3 to lift based on the driving force of the linear driving member 41 and the acting force of the reversing assembly 11, their lifting amplitudes are different. Therefore, the support column 32 can translate relative to the bearing surface 22, and then lift the wafer from the bearing surface 22 or place the wafer transmitted from the outside on the bearing surface 22.

[0036] Exemplarily, the inclination directions of the lifting inclined surface 21 and the jacking inclined surface 31 can be opposite, as Figure 3 shown, in the driving direction X, the inclination angle of the lifting assembly 2 is R1, and the inclination angle of the jacking assembly 3 is R2. When the transmission member simultaneously pushes the lifting inclined surface 21 and the jacking inclined surface 31, under the action of the reversing assembly 11, the translation directions of the jacking assembly 3 and the lifting assembly 2 are opposite. That is, when the jacking assembly 3 rises, the lifting assembly 2 descends; when the lifting assembly 2 rises, the jacking assembly 3 descends. The support column 32 can lift or lower relative to the bearing surface 22, so as to place the wafer on the bearing surface 22 or take the wafer from the bearing surface 22.

[0037] Exemplarily, the inclination direction of the lifting slope 21 and the jacking slope 31 can be the same. Taking the path of the transmission member away from the linear drive member 41 in the driving direction X as a reference, the angle between the lifting slope 21 and the reference is smaller than the angle between the jacking slope 31 and the reference, and the angle between the jacking slope 31 and the reference is less than 90°, that is, relative to the inclination amplitude of the lifting slope 21, the inclination amplitude of the jacking slope 31 is larger. When the transmission member pushes the lifting slope 21 and the jacking slope 31 at the same time, under the action of the reversing component 11, the jacking component 3 and the lifting component 2 are lifted and lowered synchronously, and the lifting amplitude of the jacking component 3 is greater than the lifting amplitude of the lifting component 2, so that the support column 32 can be lifted and lowered relative to the bearing surface 22.

[0038] The lifting assembly 2 is a component that can drive the wafer to lift in the guide direction Y. The lifting assembly 2 can be an integrated design or a split design. The lifting assembly 2 is slidably matched with the reversing assembly 11, and can slide along the guide direction Y under the guiding action of the reversing assembly 11. The lifting slope 21 is a surface on the lifting assembly 2 that cooperates with the transmission member, and the transmission member pushes the lifting assembly 2 through the lifting slope 21. The bearing surface 22 can be the top surface of the electrostatic suction cup, and the lifting assembly 2 fits the wafer through the bearing surface 22. Among them, piezoelectric ceramics can also be set at the part of the lifting assembly 2 that is connected to the electrostatic suction cup, and the piezoelectric effect of the piezoelectric ceramics can be used to achieve fine-tuning of the electrostatic suction cup.

[0039] The lifting assembly 3 is a component for lifting the wafer from the carrying surface 22 or placing the wafer on the carrying surface 22. The lifting assembly 3 is slidably matched with the reversing assembly 11, and can slide along the guiding direction Y under the guiding action of the reversing assembly 11. A lifting slope 31 is provided at the bottom of the lifting assembly 3, and the lifting slope 31 is a surface on the lifting assembly 3 that cooperates with the transmission member, and the transmission member pushes the lifting assembly 3 through the lifting slope 31. A support column 32 is provided at the top of the lifting assembly 3, and the support column 32 is a component for the lifting assembly 3 to receive the wafer. Exemplarily, there can be three support columns 32, and three through holes are provided on the electrostatic suction cup. The three support columns 32 are located in the three through holes one by one. When the support column 32 is lifted and lowered relative to the electrostatic suction cup, the wafer can be placed on the carrying surface 22 or taken away from the carrying surface 22. The support column 32 can be made of a lightweight and high-strength material (such as polyetheretherketone) to reduce weight and increase the corresponding speed. The top of the support column 32 is the surface in contact with the wafer, and can be covered with a soft material (such as silicone) to prevent scratching the wafer.

[0040] The commutation assembly 11 is in sliding fit with the lifting assembly 2, which can restrict the movement trajectory of the lifting assembly 2 and enable the lifting assembly 2 to translate in the guiding direction Y. The commutation assembly 11 is also in sliding fit with the jacking assembly 3, which can restrict the movement trajectory of the jacking assembly 3 and enable the jacking assembly 3 to translate in the guiding direction Y. The guiding direction Y of the commutation assembly 11 intersects with the driving direction X of the linear driving member 41. When the linear driving member 41 drives the transmission member to apply a force to the jacking inclined surface 31 and the lifting inclined surface 21 along the driving direction X, the commutation assembly 11 converts the movement trajectories of the jacking assembly 3 and the lifting assembly 2 into translation along the guiding direction Y, thereby achieving commutation. Exemplarily, the commutation assembly 11 can be multiple guide rails. A part of the guide rails restrain the jacking assembly 3 to make the jacking assembly 3 slide along the guiding direction Y; another part of the guide rails restrain the lifting assembly 2 to make the lifting assembly 2 slide along the guiding direction Y. Wherein, the included angle between the guiding direction Y and the driving direction X can be an acute angle or a right angle.

[0041] The driving mechanism 4 is a mechanism that applies a force to the lifting assembly 2 and the jacking assembly 3 and is the power source for the lifting movement of the lifting assembly 2 and the jacking assembly 3. The linear driving member 41 is a power element that pushes the transmission member to translate along the driving direction X. Exemplarily, the linear driving member 41 can be a linear motor, a cylinder, or a hydraulic cylinder. The linear driving member 41 is preferably a linear motor or a combination of a motor and a lead screw, which can improve the movement accuracy. The transmission member is a component that slides along the driving direction X under the driving force of the linear driving member 41, transmits the driving force of the transmission member to the lifting assembly 2 and the jacking assembly 3, and forms a thrust on the lifting inclined surface 21 and the jacking inclined surface 31. The transmission member abuts against the lifting inclined surface 21 and the jacking inclined surface 31 and can slide relative to the lifting inclined surface 21 and the jacking inclined surface 31. The transmission member and the lifting inclined surface 21 and / or the jacking inclined surface 31 can be any one or a combination of point contact, line contact, and surface contact, and can apply a synchronous thrust to the lifting inclined surface 21 and the jacking inclined surface 31.

[0042] In the technical solution of the embodiment of the present application, when the linear driving member 41 drives the transmission member along the driving direction X, the transmission member can simultaneously apply a thrust to the lifting inclined surface 21 and the jacking inclined surface 31. Under the action of the commutation assembly 11, the lifting assembly 2 and the jacking assembly 3 can lift along the guiding direction Y. Furthermore, the support column 32 can lift the wafer from the bearing surface 22 or place the wafer on the bearing surface 22. The lifting assembly 2 and the jacking assembly 3 of the workpiece stage share a driving mechanism 4, which can achieve the precise coordinated operation of the lifting assembly 2 and the jacking assembly 3, simplify the structure, reduce the space occupation, and when applied to semiconductor detection equipment, the driving mechanism 4 can be arranged in the vacuum chamber to improve the smoothness and efficiency of transmission and realize the high-efficiency, stable, and high-precision transmission of the wafer.

[0043] As Figure 2 and Figure 3As shown, according to some embodiments of the present application, optionally, the inclined direction of the lifting inclined plane 21 is opposite to that of the jacking inclined plane 31.

[0044] As Figure 3 shown, in the driving direction X, the inclination angle of the lifting assembly 2 is R1, and the inclination angle of the jacking assembly 3 is R2. Among them, R1 can be equal to R2, or R1 can be unequal to R2. Preferably, both R1 and R2 are less than 45°, which can improve the lifting accuracy of the lifting assembly 2 and the jacking assembly 3 during transmission.

[0045] In the technical solution of the embodiments of the present application, the inclined directions of the lifting inclined plane 21 and the jacking inclined plane 31 are opposite. When the lifting assembly 2 rises, the jacking assembly 3 descends, and when the jacking assembly 3 rises, the lifting assembly 2 descends. The moving directions of the bearing surface 22 and the support column 32 are always opposite, which can increase the relative speed of the lifting assembly 2 and the jacking assembly 3 during lifting, improve the efficiency of the lifting assembly 2 and the jacking assembly 3 in interacting with the wafer, and thus improve the wafer transmission efficiency.

[0046] As Figure 2 and Figure 3 shown, according to some embodiments of the present application, optionally, the included angle range between the lifting inclined plane 21 and the driving direction X is 10° to 35°, and the included angle range between the jacking inclined plane 31 and the driving direction X is 10° to 35°.

[0047] The included angle between the lifting inclined plane 21 and the driving direction X is also the inclination angle R1 of the lifting inclined plane 21, and the included angle between the jacking inclined plane 31 and the driving direction X is also the inclination angle R2 of the jacking inclined plane 31.

[0048] Exemplarily, the angle of R1 can be any value among 10°, 15°, 20°, 25°, 30°, 35°, or any intermediate value between any two adjacent values above. The angle of R2 can be any value among 10°, 15°, 20°, 25°, 30°, 35°, or any intermediate value between any two adjacent values above.

[0049] Preferably, the angle of R1 and / or R2 can be any value among 20°, 21°, 22°, 23°, 24°, 25°, or any intermediate value between any two adjacent values above.

[0050] In the technical solution of the embodiments of the present application, both the lifting inclined plane 21 and the jacking inclined plane 31 form an included angle with the driving direction X in the range of 10° to 35°, which can not only improve the movement accuracy of the lifting assembly 2 and the jacking assembly 3, but also facilitate the transmission member to push the lifting inclined plane 21 and the jacking inclined plane 31, improving the transmission smoothness.

[0051] As Figure 2 , Figure 6 and Figure 7As shown, according to some embodiments of the present application, optionally, the transmission member includes a lifting transmission member 42. A transmission surface 421 is provided at the top of the lifting transmission member 42, and a sliding surface 422 is provided at the bottom. The transmission surface 421 is in contact with the lifting inclined surface 21, and the included angle between the sliding surface 422 and the transmission surface 421 is less than 45°. The transmission surface 421 is used to push the lifting inclined surface 21 to translate, and the sliding surface 422 is used to slide along the transmission direction.

[0052] The lifting assembly 2 is an assembly for driving the wafer to lift. When the workpiece stage is applied to a semiconductor inspection device, the lifting assembly 2 has an important influence on the movement accuracy and stability of the wafer in the height direction. The transmission member pushes the lifting assembly 2 through the lifting transmission member 42. When the lifting rotating member is subjected to the driving force of the linear driving member 41, a thrust is applied to the lifting inclined surface 21 through the transmission surface 421.

[0053] Exemplarily, the lifting transmission member 42 can be a wedge-shaped table, which is hollowed out in the middle and the transmission surfaces 421 are provided at both ends. The linear driving member 41 is a linear motor. The lifting transmission member 42 is fixedly connected (such as welded) to the nut of the linear motor. The sliding surface 422 is parallel to the driving direction X, so as to promote the lifting transmission member 42 to translate in the driving direction X.

[0054] In the technical solution of the embodiment of the present application, the sliding surface 422 can limit the lifting transmission member 42 to prevent the lifting transmission member 42 from rotating, and promote the lifting transmission member 42 to translate in the driving direction X. The transmission surface 421 is in contact with the lifting inclined surface 21, and the contact form between the two is surface contact, which can increase the contact area, thereby improving the transmission stability, so that the lifting assembly 2 can drive the wafer to lift smoothly. The included angle between the sliding surface 422 and the transmission surface 421 is less than 45°. During transmission, the displacement of the lifting transmission member 42 in the driving direction X is greater than the displacement of the lifting assembly 2 in the guiding direction Y, which can improve the movement accuracy of the lifting assembly 2.

[0055] As Figure 2 and Figure 5 As shown, according to some embodiments of the present application, optionally, the transmission member further includes a jacking transmission member 43. The jacking transmission member 43 includes a jacking seat 431 and a jacking ball 432. The jacking seat 431 is arranged on the lifting transmission member 42, and the jacking ball 432 is rotatably arranged on the jacking seat 431. The jacking ball 432 is in contact with the jacking inclined surface 31 and is used to push the jacking inclined surface 31 to translate.

[0056] The jacking seat 431 can be fixedly arranged on the lifting transmission member 42. For example, the jacking seat 431 is welded to the lifting transmission member 42, or the jacking seat 431 can be a part of the lifting transmission member 42 and is integrally formed with the lifting transmission member 42. The jacking seat 431 can also be movably arranged on the lifting transmission member 42, and the installation position on the lifting transmission member 42 can be adjusted.

[0057] Exemplarily, the jacking seat 431 is disposed between the middle parts of the lifting transmission member 42 and the transmission surfaces 421 at both ends. The jacking ball 432 can rotate 360° within the jacking seat 431, and the jacking ball 432 abuts against the jacking inclined surface 31. In order to reduce the frictional force, grease lubrication can be adopted between the jacking ball 432 and the jacking seat 431, and a lubricating layer can also be provided on the jacking inclined surface 31.

[0058] In the technical solution of the embodiment of the present application, the jacking transmission member 43 provides a thrust for the jacking assembly 3 through the jacking ball 432, and pushes the jacking assembly 3 to translate along the guiding direction Y. The jacking ball 432 and the jacking inclined surface 31 are in point contact, which can reduce the contact area, thereby reducing the frictional force and improving the smoothness; the jacking ball 432 and the jacking inclined surface 31 are in rolling friction, which can further reduce the frictional force and improve the smoothness of the transmission.

[0059] As Figure 7 and Figure 8 shown, according to some embodiments of the present application, optionally, the jacking seat 431 and the lifting transmission member 42 are connected by an adjusting rod 44. The adjusting rod 44 is rotatably disposed on the lifting transmission member 42 and is threadedly connected to the jacking seat 431. The adjusting rod 44 is arranged parallel to the driving direction X and is used to fix and adjust the position of the jacking seat 431.

[0060] The installation position of the jacking seat 431 on the lifting transmission member 42 determines the initial positions of the support column 32 and the bearing surface 22. If the position of the jacking seat 431 cannot be adjusted on the lifting transmission member 42, it is necessary to ensure the assembly accuracy of the jacking seat 431 and the lifting transmission member 42, which causes difficulties in part processing and assembly.

[0061] When the jacking seat 431 is movably connected to the lifting transmission member 42, the installation position of the jacking seat 431 on the lifting transmission member 42 can be adjusted. Specifically, the jacking seat 431 abuts against the lifting transmission member 42. When the adjusting rod 44 is rotated, the threaded connection length between the jacking seat 431 and the adjusting rod 44 can be adjusted, so as to adjust the installation position of the jacking seat 431 on the lifting transmission member 42.

[0062] Exemplarily, the number of the adjusting rods 44 can be two, which improves the adjustment accuracy and the reliability during fixation. Further, a nut can also be threadedly connected to the adjusting rod 44. When it is necessary to fix the jacking seat 431, the nut is abutted against the jacking seat 431 to achieve double-nut fastening.

[0063] In the technical solution of the embodiment of the present application, the jacking seat 431 and the lifting transmission member 42 are connected by the adjusting rod 44. The adjusting rod 44 is arranged parallel to the driving direction X, and the installation position of the jacking seat 431 on the lifting transmission member 42 can be adjusted, thereby reducing the requirements for part processing and assembly, and enabling flexible adjustment of the jacking transmission member 43.

[0064] As Figure 2 and Figure 3 shown, according to some embodiments of the present application, optionally, the workpiece stage further includes a base 1, on which a commutation assembly 11 is provided. The commutation assembly 11 includes a lifting guide 111 and a jacking guide 112. The lifting guide 111 is slidably engaged with the lifting assembly 2, and the jacking guide 112 is slidably engaged with the jacking assembly 3. The lifting guide 111 and the jacking guide 112 are arranged in parallel, and the guiding direction Y is perpendicular to the driving direction X.

[0065] Exemplarily, the base 1 may include a rectangular substrate, on which the commutation assembly 11 is provided, thereby forming the base 1. The driving mechanism 4 may be installed on the base 1. The lifting guide 111 may be a guide rail, or a guide rail is provided on the lifting guide 111. The jacking guide 112 may be a guide rail, or a guide rail is provided on the jacking guide 112. The number of the lifting guide 111 and / or the jacking guide 112 may be one or more.

[0066] In the technical solution of the embodiment of the present application, the workpiece stage is provided with the base 1, which can improve the integration of the workpiece stage and make the base 1 become the load-bearing component of the entire workpiece stage. The lifting guide 111 and the jacking guide 112 are arranged in parallel, which can improve the movement accuracy of the lifting assembly 2 and the jacking assembly 3, so that the wafer is only subjected to the force in the guiding direction Y, reducing wafer offset and sliding. The guiding direction Y is perpendicular to the driving direction X, and the commutation assembly 11 can perform a 90° commutation on the lifting assembly 2 and the jacking assembly 3, facilitating the structural design and simplifying the transmission form.

[0067] As Figure 2 and Figure 4 shown, according to some embodiments of the present application, optionally, a lifting mating portion 23 is provided on one side of the lifting assembly 2 perpendicular to the driving direction X, and the lifting mating portion 23 is slidably engaged with the lifting guide 111.

[0068] The lifting mating portion 23 may be a part of the lifting assembly 2, or a component installed on the lifting assembly 2 and slidably engaged with the lifting guide 111. Exemplarily, the lifting guide 111 may be a guide rail, and the lifting mating portion 23 may be a slider, and the lifting mating portion 23 is slidably engaged with the lifting guide 111. The number of the lifting mating portions 23 is two.

[0069] The linear driving member 41 may be a linear motor, and the power element (motor) of the linear motor is located at one end of the lifting assembly 2, and the lifting mating portion 23 is located at the end opposite to this end. When the lifting transmission member 42 pushes the lifting assembly 2, the acting force generated by the lifting mating portion 23 on the lifting guide 111 is a pressure force, and no acting force intersecting the plane where the driving direction X and the guiding direction Y are located will be generated.

[0070] In the technical solution of the embodiment of the present application, the lifting cooperation part 23 is located on one side of the lifting component 2 perpendicular to the driving direction X. When the lifting component 2 moves up and down, the pressure applied by the lifting cooperation part 23 to the lifting guide 111 is along the driving direction X, which can reduce the influence of the gap existing when the lifting cooperation part 23 and the lifting guide 111 are in sliding cooperation on the movement accuracy of the lifting component 2, thereby improving the wafer transfer accuracy.

[0071] As Figure 2 and Figure 5 shown, according to some embodiments of the present application, optionally, a jacking cooperation part 33 is provided at the bottom of the jacking component 3, and the jacking cooperation part 33 is in sliding cooperation with the jacking guide 112.

[0072] Exemplarily, the jacking guide 112 can be a guide rail, and the jacking cooperation part 33 can be a slider, and the jacking guide 112 is in sliding cooperation with the jacking cooperation part 33. The number of the jacking cooperation parts 33 can be four, and they are respectively located at the four corners of the jacking inclined surface 31.

[0073] In the technical solution of the embodiment of the present application, the jacking cooperation part 33 is located at the bottom of the jacking component 3, and the jacking inclined surface 31 is also located at the bottom of the jacking component 3. When the jacking component 3 moves up and down, the jacking transmission part 43 applies a thrust to the jacking inclined surface 31, and the jacking cooperation part 33 applies a thrust to the jacking guide 112. The forces on the jacking component 3 are all located at the bottom of the jacking component 3, which can improve the force balance of the jacking component 3, thereby improving the movement accuracy of the jacking component 3.

[0074] As Figure 2 and Figure 3 shown, according to some embodiments of the present application, optionally, a reset part 12 is provided on the base 1, and the reset part 12 is connected to the lifting component 2 and is used to provide a pulling force for the lifting component 2 to move towards the base 1.

[0075] The lifting cooperation part 23 is located on one side of the lifting component 2, and the lifting component 2 has its own weight. Therefore, when descending, the pressure applied by the lifting cooperation part 23 to the lifting guide 111 at the bottom is greater than the pressure applied by the lifting cooperation part 23 to the lifting guide 111 at the top, and there is a hidden danger that the lifting component 2 is blocked.

[0076] The reset part 12 is a component connecting the lifting component 2 and the base 1. The reset part 12 can undergo elastic deformation by itself and bears a pulling force between the base 1 and the lifting component 2. Exemplarily, the reset part 12 can be a tension spring, with one end connected to the base 1 and the other end connected to the bottom of the lifting component 2. Preferably, the connection position of the reset part 12 and the lifting component 2 is located near the lifting guide 111.

[0077] In the technical solution of the embodiment of the present application, the reset member 12 is connected between the base 1 and the lifting assembly 2, and can provide a pulling force for the lifting assembly 2 to move towards the base 1, thereby improving the smoothness of the descent of the lifting assembly 2, eliminating the hidden danger of the lifting assembly 2 being blocked, and improving the smoothness of wafer transfer.

[0078] According to some embodiments of the present application, the present application further provides a semiconductor detection device, including the workpiece stage of any of the above solutions.

[0079] The workpiece stage can be used as a loading stage of the semiconductor detection device or a part of the loading stage, receive the wafer transferred by the external transfer manipulator, and drive the wafer to lift for the semiconductor detection device to detect the wafer. After the semiconductor detection device finishes detecting the wafer, the workpiece stage can convey the wafer to the external transfer manipulator to carry the wafer away.

[0080] In the technical solution of the embodiment of the present application, the semiconductor detection device includes a workpiece stage, so the semiconductor detection device has all the advantages of the workpiece stage in the above embodiments.

[0081] As Figures 1 to 7 shown, the working process of the workpiece stage will be described in detail with a specific embodiment below:

[0082] The workpiece stage includes a lifting assembly 2, a jacking assembly 3, a reversing assembly 11 and a driving mechanism 4. The lifting assembly 2 includes a lifting inclined surface 21 and a bearing surface 22, and the bearing surface 22 is located on the electrostatic chuck. The jacking assembly 3 includes a jacking inclined surface 31 and a support column 32. The support column 32 is located at the top of the jacking assembly 3. There are multiple support columns 32, which can be arranged in a circumferential array at the top of the jacking assembly 3. For example, the number of support columns 32 is three, and the adjacent support columns 32 are arranged in a circumferential array at an angle of 120°, which can form a stable support for the wafer. The lifting inclined surface 21 of the lifting assembly 2 and the jacking inclined surface 31 of the jacking assembly 3 are inclined in opposite directions. The reversing assembly 11 is a part of the base 1. The reversing assembly 11 includes a lifting guide 111 and a jacking guide 112. The lifting guide 111 and the jacking guide 112 are arranged in parallel, and both are parallel to the guiding direction Y. The guiding direction Y is perpendicular to the driving direction X. The driving mechanism 4 includes a transmission member and a linear driving member 41. The transmission member includes a lifting transmission member 42 and a jacking transmission member 43. The jacking transmission member 43 is installed on the lifting transmission member 42 and moves synchronously with the lifting transmission member 42. The linear driving member 41 is a combination of a motor and a ball screw.

[0083] When a wafer needs to be transferred, the motor drives the ball screw to rotate. The nut of the ball screw is fixedly connected to the lifting transmission member 42 and can drive the lifting transmission member 42 and the jacking transmission member 43 to slide synchronously along the driving direction X. The lifting transmission member 42 is in transmission cooperation with the lifting assembly 2, and the jacking transmission member 43 is in transmission cooperation with the jacking assembly 3. The transmission surface 421 is in sliding cooperation with the lifting inclined surface 21, and the jacking ball 432 slides along the jacking inclined surface 31. While the lifting assembly 2 descends, the jacking assembly 3 ascends. When the top surface of the support column 32 extends from above the bearing surface 22 and is higher than the bearing surface 22, the wafer can be jacked up from the bearing surface 22, and the wafer is separated from the bearing surface 22; conversely, while the lifting assembly 2 ascends, the jacking assembly 3 descends. When the support column 32 descends below the bearing surface 22 and the top surface of the support column 32 is lower than the bearing surface 22, the wafer is separated from the support column 32, and thus the wafer is placed on the bearing surface 22.

[0084] When the semiconductor detection device interacts with the outside world for wafers, the external transfer manipulator can transfer the wafers to the semiconductor detection device by rotating, and the axis of its rotation is parallel to the guiding direction Y.

[0085] When the workpiece stage receives a wafer, first, the lifting assembly 2 descends and the jacking assembly 3 ascends. The support column 32 jacks up the wafer from the external transfer manipulator, and the external transfer manipulator rotates away; then, the jacking assembly 3 descends and the lifting assembly 2 ascends. The wafer is lifted by the bearing surface 22 and adsorbed on the bearing surface 22, so that the wafer is separated from the support column 32; finally, the lifting assembly 2 drives the wafer to move to the working distance of the semiconductor detection device, so that the wafer is detected by the semiconductor detection device.

[0086] When the workpiece stage transfers a wafer to the external transfer manipulator, first, the jacking assembly 3 ascends and the lifting assembly 2 descends. The support column 32 jacks up the wafer from the bearing surface 22 to a position higher than the wafer receiving position (the position for receiving the wafer) of the external transfer manipulator; then, the jacking assembly 3 descends and the lifting assembly 2 ascends. The wafer falls onto the external transfer manipulator; finally, the support column 32 continues to descend to a height lower than the external transfer manipulator, and the external transfer manipulator leaves, completing the wafer transfer. Repeatedly interacting with the wafers between the workpiece stage and the external transfer manipulator can realize the incoming and outgoing of the wafers.

[0087] As described above, only the specific embodiments of the present application are provided. Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the above-described systems, modules, and units can refer to the corresponding processes in the foregoing method embodiments and will not be repeated here. It should be understood that the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present application.

Claims

1. A workpiece stage, characterized in that, Comprising: A lifting component (2), including a lifting inclined surface (21) and a bearing surface (22) opposite to each other in the height direction of the workpiece stage; A jacking component (3), having a jacking inclined surface (31) at the bottom and a support column (32) at the top, and the inclined surface where the jacking inclined surface (31) is located intersects with the inclined surface where the lifting inclined surface (21) is located; A reversing component (11), which is slidably matched with the lifting component (2) and the jacking component (3) and is used to reverse the movement trajectories of the lifting component (2) and the jacking component (3); A driving mechanism (4), including a transmission member and a linear driving member (41), the transmission member abuts against the lifting inclined surface (21) and the jacking inclined surface (31), and the linear driving member (41) is connected to the transmission member and the driving direction (X) intersects with the guiding direction (Y) of the reversing component (11); Wherein, the transmission member pushes the lifting inclined surface (21) and the jacking inclined surface (31) along the driving direction (X) based on the driving force of the linear driving member (41), and the lifting component (2) and the jacking component (3) abut against the reversing component (11) under the action of the pushing force, reversing the pushing force along the driving direction (X) to the pushing force in the guiding direction (Y) and sliding relative to each other in the guiding direction (Y).

2. The workpiece stage according to claim 1, wherein, The inclination directions of the lifting inclined surface (21) and the jacking inclined surface (31) are opposite.

3. The workpiece stage according to claim 2, wherein, The included angle range between the lifting inclined surface (21) and the driving direction (X) is 10° to 35°, and the included angle range between the jacking inclined surface (31) and the driving direction (X) is 10° to 35°.

4. The workpiece stage according to claim 1, wherein, The transmission member includes a lifting transmission member (42), the top of the lifting transmission member (42) is provided with a transmission surface (421), the bottom is provided with a sliding surface (422), the transmission surface (421) is attached to the lifting inclined surface (21), the included angle between the sliding surface (422) and the transmission surface (421) is less than 45°, the transmission surface (421) is used to push the lifting inclined surface (21) to translate, and the sliding surface (422) is used to slide along the driving direction (X).

5. The workpiece stage according to claim 4, wherein, The transmission member further includes a jacking transmission member (43), the jacking transmission member (43) includes a jacking seat (431) and a jacking ball (432), the jacking seat (431) is arranged on the lifting transmission member (42), the jacking ball (432) is rotatably arranged on the jacking seat (431), and the jacking ball (432) is attached to the jacking inclined surface (31) and is used to push the jacking inclined surface (31) to translate.

6. The workpiece stage according to claim 5, wherein, The jacking seat (431) is connected to the lifting transmission member (42) through an adjusting rod (44), the adjusting rod (44) is rotatably arranged on the lifting transmission member (42) and is threadedly connected to the jacking seat (431), the adjusting rod (44) is arranged parallel to the driving direction (X) and is used to fix and adjust the position of the jacking seat (431).

7. The workpiece stage according to claim 1, wherein It further includes a base (1), on which the commutation assembly (11) is provided. The commutation assembly (11) includes a lifting guide (111) and a jacking guide (112). The lifting guide (111) is in sliding fit with the lifting assembly (2), and the jacking guide (112) is in sliding fit with the jacking assembly (3). The lifting guide (111) and the jacking guide (112) are arranged in parallel, and the guiding direction (Y) is perpendicular to the driving direction (X).

8. The workpiece stage according to claim 7, wherein, On one side of the lifting assembly (2) perpendicular to the driving direction (X), a lifting mating part (23) is provided, and the lifting mating part (23) is in sliding fit with the lifting guide (111).

9. The workpiece stage according to claim 7, characterized in that, At the bottom of the jacking assembly (3), a jacking mating part (33) is provided, and the jacking mating part (33) is in sliding fit with the jacking guide (112).

10. The workpiece stage according to claim 7, characterized in that, A resetting member (12) is provided on the base (1), and the resetting member (12) is connected to the lifting assembly (2) to provide a pulling force for the lifting assembly (2) to move towards the base (1).

11. A semiconductor detection device, characterized in that, It includes a workpiece stage as described in any one of claims 1 to 10.

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