Special solid aluminum capacitor for electronic detonator with ultralow electric leakage characteristic and preparation method thereof

Abstract

The invention discloses a special aluminum fixing capacitor for an electronic detonator with ultralow electric leakage characteristic and a preparation method thereof, the capacitor comprises a positive foil electrode, a negative foil electrode, an aluminum foil or an aluminum alloy foil coated with an oxide film on the surface, electrolytic paper and an electrolyte, and the electrolyte can be a phosphate-based electrolyte, a borate-based electrolyte or an organic electrolyte containing high-conductivity salt, and an additive, the preparation method comprises the following steps: slitting positive and negative foils and electrolytic paper, winding the positive and negative foils and the electrolytic paper to form a concentric circle, forming a repair oxide film, dipping a conductive polymer material, baking and polymerizing to form a conductive film, injecting a pouring sealant into an aluminum shell, and carrying out heat treatment to obtain the conductive aluminum shell. The formation liquid is ammonium dihydrogen phosphate, ammonium adipate or boric acid aqueous solution, and the pouring sealant is epoxy resin or polyurethane; the capacitor has an ultra-low electric leakage characteristic, is suitable for being used as a power supply energy storage element in an electronic detonator system, stabilizes power supply output and inhibits an electric leakage phenomenon.

Description

Technical Field

[0001] The present invention relates to a special solid aluminum capacitor for electronic detonators with ultra-low leakage characteristics and a preparation method thereof. Background Art

[0002] With the promotion of policies and the growth of market demand, the requirements for blasting technology in fields such as mine exploitation, railway and road construction, and water conservancy construction are increasing day by day. Especially in blasting operations, electronic detonators, as new blasting equipment, have gradually replaced traditional detonators. Compared with traditional detonators, electronic detonators have higher control precision, more functions, and stronger data recording capabilities, which can improve the blasting efficiency while significantly enhancing the safety of blasting construction. Electronic detonators can not only precisely control the timing of blasting but also provide reliable basis for subsequent safety analysis and optimization by recording blasting data.

[0003] An electronic detonator usually consists of three parts: an electronic control module, an encoder, and a detonator. One of its core functions is to achieve precise delay control before detonation, and the delay range is usually 1 - 15 seconds. During this process, the capacitor used inside the electronic detonator must have reliable performance. Especially during the delay process, the stability of the capacitor is crucial. If the performance of the capacitor is unstable, it may lead to delay errors, thereby affecting the accuracy and safety of the entire blasting operation.

[0004] In the design of electronic detonators, the capacitor undertakes the key task of storing electrical energy and releasing it at a predetermined time. To meet the high-precision control requirements of electronic detonators, the capacitor needs to have extremely low leakage characteristics and excellent stability. Traditional aluminum electrolytic capacitors are prone to leakage and performance degradation due to the influence of environmental factors (such as temperature, humidity, etc.), which may cause equipment failure in the application of high-demand electronic detonators, thus bringing potential safety hazards. Therefore, adopting solid aluminum capacitor components with ultra-low leakage characteristics becomes the key to solving this problem.

[0005] Existing solid aluminum capacitor components show good performance in applications, especially in terms of low leakage rate, shock wave resistance, high-altitude and low-pressure environments, and long-term stability, which can effectively improve the reliability of electronic detonators. By improving the packaging technology, product structure, and materials, such capacitor components can maintain a low leakage rate and ensure the stability of the capacitor during long-term energy storage, avoiding the performance degradation problem of traditional capacitors, thereby ensuring the delay accuracy and blasting safety.

[0006] However, there are still some challenges in current capacitor technology. For example, existing solid aluminum capacitors may still face problems such as performance degradation, misfiring, and premature detonation under extreme environmental conditions, especially in high-temperature, high-pressure, high-altitude, and intensive tunneling operations. In addition, how to further improve the environmental change resistance of capacitors and extend their service life remains a key direction in current technological development. Summary of the Invention

[0007] In view of the deficiencies in the prior art, the present invention provides a solid aluminum capacitor for special use in electronic detonators with ultra-low leakage characteristics and a preparation method thereof. By optimizing material selection, structural optimization, refined process control, and strict quality inspection, the problems of high leakage current and unstable performance of capacitors in the prior art are solved, thereby improving the overall performance of the solid aluminum capacitor for special use in electronic detonators with ultra-low leakage characteristics and meeting the requirements of high reliability and high precision of the detonator system.

[0008] The technical solution adopted by the present invention to solve its technical problems is as follows:

[0009] A solid aluminum capacitor for special use in electronic detonators with ultra-low leakage characteristics, characterized by comprising:

[0010] Positive and negative foil electrodes, the positive and negative foil electrodes being aluminum foil or aluminum alloy foil, with an oxide film coated on the surface;

[0011] Electrolytic paper, placed between the positive and negative foils;

[0012] Electrolyte, containing conductive salts and solvents.

[0013] Additives, polydimethylsilane, conductive polymer poly(3,4-ethylenedioxythiophene): poly(styrenesulfonate) (PEDOT:PSS) graphene solution, epoxy resin system, or polyurethane and graphite-like network structure reinforcing agent.

[0014] Preferably, the electrolyte is a phosphate-based electrolyte, a borate-based electrolyte, or an organic electrolyte containing a high-conductive salt.

[0015] Another technical problem to be solved by the present invention is to provide a preparation method for a solid aluminum capacitor for special use in electronic detonators with ultra-low leakage characteristics, comprising the following steps:

[0016] Cut the positive foil, negative foil, and electrolytic paper;

[0017] Press and rivet the foil and the lead pins together, and use winding technology to wind the aluminum foil and the electrolytic paper into a concentric circle;

[0018] Weld the wound core on an iron bar, and place the core in a formation solution to repair the damaged oxide film by passing direct current;

[0019] Impregnate the formed cores with a conductive polymer material and bake and polymerize them to form a conductive polymer film;

[0020] Prepare potting glue and quantitatively inject it into the aluminum shell, load the polymerized cores and perform waist-bundling sealing;

[0021] Clean the bare capacitors after encapsulation, apply pressure to repair the oxide film, conduct aging tests, and finally perform sorting, printing, taping and packaging.

[0022] Preferably, the forming solution is an aqueous solution of ammonium dihydrogen phosphate, an aqueous solution of ammonium adipate or an aqueous solution of boric acid. The temperature of the forming solution is 40°C to 60°C, and the forming time is 10 to 60 minutes.

[0023] Preferably, the potting glue is an epoxy resin system or a polyurethane potting glue added with a graphene network solvent structure enhancer, and the mass concentration ratio of the potting glue is 10% to 50%.

[0024] Preferably, the injection amount of the potting glue in the aluminum shell is 0.05 to 0.2 mL.

[0025] Preferably, the operating conditions for ultrasonic wrapping and uniformity of the semi-finished capacitors after encapsulation are as follows: Place the semi-finished capacitors after potting glue sealing in an ultrasonic device. The ultrasonic frequency is 10 to 200 kHz, and the ultrasonic time is 5 minutes to 2 hours.

[0026] Preferably, the operating conditions for high-temperature curing and shaping of the semi-finished capacitors after encapsulation are as follows: Place the semi-finished capacitors after potting glue sealing in an oven. The curing temperature is 150°C to 200°C, and the curing time is 1 hour to 24 hours.

[0027] Preferably, the cleaning method for the bare capacitors after encapsulation is: Wash the sealed bare products with a cleaning agent / warm water.

[0028] Another technical problem to be solved by the present invention is to provide an application of a special aluminum-solid capacitor for electronic detonators with ultra-low leakage characteristics, which is used as a power energy storage component in an electronic detonator system to stabilize the power output and suppress the leakage phenomenon.

[0029] The beneficial effects of the present invention are:

[0030] By injecting a certain proportion of electronic potting adhesive in a certain quantity into the aluminum shell in advance and performing high-temperature curing and qualitative determination on the semi-finished capacitor with a sealed mouth under certain conditions, the present invention effectively solves the problem of unstable performance of capacitors in electronic detonators. The protective layer formed by the cured electronic potting adhesive can effectively slow down the external force borne by the internal structure of the capacitor core package, greatly reducing the damage of oxide scales between materials. This protective effect can prevent the capacitor body from directly contacting the harsh external environmental conditions, reducing the damage to the internal structure of the capacitor caused by external impacts or temperature changes and other factors, and avoiding excessive leakage current leading to the failure of the electronic detonator to detonate as expected, thereby ensuring the safety and reliability of blasting operations.

[0031] The special aluminum-fixed capacitor for electronic detonators with ultra-low leakage characteristics manufactured by this invention greatly improves the shock resistance and temperature resistance of the capacitor compared with conventional ordinary capacitors, and has excellent ultra-low leakage characteristics. In this way, the electronic detonator can meet more stringent requirements during actual use. Whether in extreme environments such as high vibration and high temperature, it can still work stably, effectively preventing capacitor failure and the resulting blasting failure.

[0032] Therefore, the aluminum-fixed capacitor of the present invention has significant advantages. Especially in the application of electronic detonators, it can significantly improve the safety and efficiency of blasting operations, reduce failures caused by capacitor problems, and provide a high-performance, stable and reliable solution. Specific implementation method

[0034] The principles and features of the present invention will be described below in conjunction with examples. The examples given are only used to explain the present invention and are not intended to limit the scope of the present invention. The present invention will be described more specifically by way of example in the following paragraphs. The advantages and features of the present invention will be clearer according to the following description and claims.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0036] Example 1:

[0037] A preparation method of a special aluminum-fixed capacitor for electronic detonators with ultra-low leakage characteristics, comprising the following steps:

[0038] (1) Dilute and stir ammonium dihydrogen phosphate, ammonium adipate, boric acid and pure water in proportion to prepare a formation solution. The temperature of the formation solution is 45°C and the formation time is 20 min;

[0039] (2) The type of the electronic potting adhesive is an epoxy resin system. The mass concentration ratio of the potting adhesive is 75%:25%, and the injection volume is 0.1 mL.

[0040] (3) The homogenizing ultrasonic frequency of the electronic potting adhesive is 50 kHz, and the homogenizing ultrasonic time is 20 min.

[0041] (4) The semi-finished capacitor after homogenizing ultrasonic treatment is placed in an oven. The curing temperature is 180 °C, and the curing time is 1 h.

[0042] In this embodiment, the selected capacitor specification is a 100 / 25V solid capacitor.

[0043] In this embodiment, by using an electronic potting adhesive of the epoxy resin system and appropriate formation and curing processes, the structural stability and durability of the capacitor are effectively improved, the leakage current is reduced, and the shock resistance is enhanced. The cured potting adhesive forms a good protective layer in the capacitor, which helps to improve the reliability of the capacitor in the application of electronic detonators, ensures its normal operation in high-temperature and vibration environments, and significantly improves the ultra-low leakage characteristics of the capacitor.

[0044] Embodiment 2:

[0045] A preparation method of a special solid aluminum capacitor for electronic detonators with ultra-low leakage characteristics, comprising the following steps:

[0046] (1) Dilute and stir ammonium dihydrogen phosphate, ammonium adipate, boric acid and pure water in proportion to prepare a formation solution. The temperature of the formation solution is 50 °C, and the formation time is 30 min.

[0047] (2) The type of the electronic potting adhesive is an epoxy resin system. The mass concentration ratio of the potting adhesive is 75%:25%, and the injection volume is 0.1 mL.

[0048] (3) The homogenizing ultrasonic frequency of the electronic potting adhesive is 50 kHz, and the homogenizing ultrasonic time is 30 min.

[0049] (4) The semi-finished capacitor after homogenizing ultrasonic treatment is placed in an oven. The curing temperature is 150 °C, and the curing time is 2 h.

[0050] In this embodiment, the selected capacitor specification is a 100 / 25V solid capacitor.

[0051] In this embodiment, by appropriately increasing the formation temperature and time, the bonding force between the internal electrodes and the electrolyte of the capacitor is enhanced, and the stability of the capacitor is further improved. At the same time, the ultrasonic homogenization technology helps to distribute the potting adhesive more evenly, ensuring the formation of a stronger protective layer and further reducing the leakage current. This method has a positive effect on improving the adaptability and anti-interference ability of the capacitor in the field of electronic detonators, and can meet the use requirements in high-temperature and high-vibration environments.

[0052] Example 3:

[0053] A preparation method of a special solid aluminum capacitor for electronic detonators with ultra-low leakage characteristics, comprising the following steps:

[0054] (1) Dilute and stir ammonium dihydrogen phosphate, ammonium adipate, boric acid and pure water in proportion to prepare a formation solution, the temperature of the formation solution is 45 °C, and the formation time is 20 min;

[0055] (2) The type of electronic potting glue is polyurethane system, the mass concentration ratio of the potting glue is 80%:20%, and the injection amount is 0.05 mL;

[0056] (3) The homogenizing ultrasonic frequency of the electronic potting glue is 50 kHz, and the homogenizing ultrasonic time is 10 min;

[0057] (4) The semi-finished capacitor after homogenizing ultrasonic is placed in an oven, the curing temperature is 150 °C, and the curing time is 1 h.

[0058] In this example, the selected capacitor specification is a 100 / 25V solid capacitor.

[0059] In this example, by using a polyurethane system potting glue, better resistance to temperature changes and chemical corrosion can be provided, thereby improving the long-term reliability of the capacitor. The shorter ultrasonic homogenizing time and lower curing temperature help to reduce energy consumption while ensuring product quality. This method is particularly suitable for the field of electronic detonators, and can reduce the manufacturing cost and energy consumption while ensuring the performance of the capacitor.

[0060] Example 4:

[0061] A preparation method of a special solid aluminum capacitor for electronic detonators with ultra-low leakage characteristics, comprising the following steps:

[0062] (1) Dilute and stir ammonium dihydrogen phosphate, ammonium adipate, boric acid and pure water in proportion to prepare a formation solution, the temperature of the formation solution is 50 °C, and the formation time is 30 min;

[0063] (2) The type of electronic potting glue is epoxy resin system, the mass concentration ratio of the potting glue is 70%:30%, and the injection amount is 0.05 mL;

[0064] (3) The homogenizing ultrasonic frequency of the electronic potting glue is 50 kHz, and the homogenizing ultrasonic time is 10 min;

[0065] (4) The semi-finished capacitor after homogenizing ultrasonic is placed in an oven, the curing temperature is 150 °C, and the curing time is 2 h.

[0066] In this embodiment, the selected capacitor specification is a solid capacitor of 100 / 25V.

[0067] This embodiment uses a relatively low epoxy resin ratio, which helps to improve the mechanical strength and compressive capacity of the capacitor. The reasonable selection of the curing time and temperature can ensure the full curing of the potting adhesive, thereby enhancing the insulation performance of the capacitor, especially in applications such as electronic detonators with high-precision and high-reliability requirements. This method can provide more stable performance for the capacitor and reduce the leakage current, ensuring the safety of the detonator in harsh environments.

[0068] Example 5:

[0069] A preparation method of a special solid aluminum capacitor for electronic detonators with ultra-low leakage characteristics, comprising the following steps:

[0070] (1) Dilute and stir ammonium dihydrogen phosphate, ammonium adipate, boric acid and pure water in proportion to prepare a formation solution, the temperature of the formation solution is 55 °C, and the formation time is 20 min;

[0071] (2) The type of electronic potting adhesive is a polyurethane system, the mass concentration ratio of the potting adhesive is 70%:30%, and the injection amount is 0.1 mL;

[0072] (3) The homogenizing ultrasonic frequency of the electronic potting adhesive is 100 kHz, and the homogenizing ultrasonic time is 10 min;

[0073] (4) The semi-finished capacitor after homogenizing ultrasonic is placed in an oven, the curing temperature is 180 °C, and the curing time is 1 h.

[0074] In this embodiment, the selected capacitor specification is a solid capacitor of 100 / 25V.

[0075] In this embodiment, higher-frequency ultrasonic waves help to more effectively disperse the potting adhesive, ensure the uniformity of the colloid, and optimize the encapsulation effect of the capacitor. The use of polyurethane potting adhesive enhances the adaptability of the capacitor to temperature changes, making it more capable of coping with high-temperature environments. This method can effectively improve the electrical performance and reliability of the capacitor, and is suitable for application occasions with high-precision and ultra-low leakage requirements of electronic detonators.

[0076] Example 6:

[0077] A preparation method of a special solid aluminum capacitor for electronic detonators with ultra-low leakage characteristics, comprising the following steps:

[0078] (1) Dilute and stir ammonium dihydrogen phosphate, ammonium adipate, boric acid and pure water in proportion to prepare a formation solution, the temperature of the formation solution is 55 °C, and the formation time is 30 min;

[0079] (2) The type of the electronic potting adhesive is the polyurethane system. The mass concentration ratio of the potting adhesive is 70%:30%, and the injection volume is 0.1 mL.

[0080] (3) The homogenizing ultrasonic frequency of the electronic potting adhesive is 100 kHz, and the homogenizing ultrasonic time is 10 min.

[0081] (4) The semi-finished capacitor after homogenizing ultrasonic is placed in an oven. The curing temperature is 150 °C, and the curing time is 2 h.

[0082] In this embodiment, the selected capacitor specification is a 100 / 25V solid capacitor.

[0083] In this embodiment, operating at a relatively high formation temperature and ultrasonic frequency can effectively improve the stability of the internal structure of the capacitor, enhance its high-temperature resistance, shock resistance and anti-leakage ability. The potting adhesive of the polyurethane system provides excellent mechanical strength and electrical insulation performance, ensuring the safety and reliability of the capacitor in the electronic detonator. This process is particularly suitable for capacitors operating under complex conditions, such as high-vibration and high-temperature working environments.

[0084] The leakage distribution, life situation and anti-seismic effect of the solid capacitor prepared in Example 1 and the solid capacitor of the traditional process are detected. The detection results are shown in Table 1 and Table 2 below.

[0085] Table 1 Comparison of high-temperature load reliability data

[0086]

[0087]

[0088] Table 2 Comparison of 20G mechanical vibration reliability data

[0089]

[0090] As can be seen from the above, in the 10,000-hour test of the solid capacitor of the traditional process at 105 °C, some capacitors (such as No. 116, 115, etc.) failed to pass the reliability test (judged as NG). Especially, the indicators such as leakage current (LC) and equivalent series resistance (ESR) were more serious, showing obvious deterioration.

[0091] In the 10,000-hour high-temperature load test of the solid capacitor of Example 1 of the present invention at 125 °C, all capacitors showed stable performance. The indicators such as leakage current (LC) and equivalent series resistance (ESR) were within a good range, and all were judged as OK. Compared with the traditional process, the solid capacitor of Example 1 of the present invention showed better reliability at a higher temperature.

[0092] After undergoing a 20G mechanical vibration test, all traditional process solid-state capacitors failed the reliability test. There were significant changes in leakage current (LC) and other indicators, and they were judged as NG. Especially for the impact caused by mechanical vibration, capacitors using traditional processes performed poorly.

[0093] After the same 20G mechanical vibration test, all solid-state capacitors in Example 1 of the present invention could maintain stable performance. The leakage current (LC) and other performance indicators were within the normal range, and they were judged as OK. This indicates that the solid-state capacitors of the present invention have stronger earthquake resistance and better mechanical vibration tolerance.

[0094] The leakage current distribution, lifespan, and earthquake resistance effects of the solid-state capacitors prepared in Examples 2 - 6 and those of traditional process solid-state capacitors were detected. The test results are shown in Tables 3 and 4 below.

[0095] Table 3 Comparison of high-temperature load reliability data

[0096]

[0097]

[0098] Table 4 Comparison of 20G mechanical vibration reliability data

[0099]

[0100]

[0101] As can be seen from the above, under the high-temperature load condition of 125°C in Examples 2 - 6, all capacitors showed good reliability. During the 10,000 hours of testing, key parameters such as leakage current (LC) and equivalent series resistance (ESR) remained within a low range, and there was no serious performance degradation. They were all judged as "OK".

[0102] Although most of the capacitors using traditional processes were judged as "OK" at 105°C, two cases were judged as "NG" after testing. This shows that the reliability of capacitors using traditional processes under high-temperature load is poor, especially the changes in ESR and LC are more significant.

[0103] Compared with the traditional process, Examples 2 - 6 can maintain better performance stability at a higher temperature (125°C), have lower leakage current (LC), and longer lifespan, showing better high-temperature load tolerance.

[0104] 2. Mechanical vibration reliability analysis (Table 4)

[0105] Examples 2-6 performed excellently in the 20G mechanical vibration test. Key indicators such as leakage current (LC) and equivalent series resistance (ESR) remained basically stable without obvious changes, and all were judged as "OK". This indicates that these capacitors have good anti-seismic performance and can operate stably in a vibration environment.

[0106] Most of the capacitors produced by traditional processes were judged as "NG" after the vibration test. The changes in leakage current (LC) and ESR were significant, showing poor anti-seismic performance. After being subjected to vibration, the performance of these capacitors degraded significantly, especially the changes in leakage current and ESR were more prominent.

[0107] 3. Comprehensive comparison

[0108] High-temperature load reliability: When the capacitors produced by traditional processes were tested at 105°C, although most of them met the standards, a certain proportion of capacitors showed poor performance (such as increased ESR and LC), which ultimately led to the judgment of "NG". In contrast, the capacitors of Examples 2-6 showed better performance at 125°C, with lower leakage current (LC) and ESR, and all were judged as "OK", showing stronger high-temperature tolerance.

[0109] Mechanical vibration reliability: Most of the capacitors produced by traditional processes were judged as "NG" in the 20G vibration test, and the changes in leakage current (LC) and ESR were significant, indicating poor anti-seismic performance. While the capacitors of Examples 2-6 completely passed the mechanical vibration test, and all the results were judged as "OK", indicating that their anti-seismic performance is far superior to that of traditional processes.

[0110] The above embodiments of the present invention do not limit the protection scope of the present invention. The implementation manners of the present invention are not limited to this. All kinds of modifications, substitutions or changes made to the above structure of the present invention according to the above content of the present invention, in accordance with the common general knowledge and customary means in the art, without departing from the above basic technical idea of the present invention, shall fall within the protection scope of the present invention.

Claims

1. An aluminum solid capacitor dedicated to electronic detonators with ultra-low leakage characteristics, characterized in that, It includes: Positive and negative foil electrodes, which are aluminum foils or aluminum alloy foils with an oxide film coated on the surface; Electrolytic paper, placed between the positive and negative foils; Electrolyte, containing conductive salts and solvents. Additives, such as polydimethylsilane, conductive polymer poly: poly graphene solution, epoxy resin system or polyurethane and graphite-like network structure reinforcing agent.

2. The dedicated solid aluminum capacitor for electronic detonators with ultra-low leakage characteristics according to claim 1, wherein The electrolyte is a phosphate-based electrolyte, a borate-based electrolyte or an organic electrolyte containing a highly conductive salt.

3. A preparation method of a special aluminum solid capacitor for electronic detonators with ultra-low leakage current characteristics, characterized in that, It includes the following steps: Cut the positive foil, negative foil and electrolytic paper; Press and rivet the foil and the lead pin together, and use the winding technology to wind the aluminum foil and the electrolytic paper into concentric circles; Weld the wound core on the iron bar, and place the core in the formation solution to repair the damaged oxide film by passing direct current; Immerse the well-formed core in a conductive polymer material and bake and polymerize it to form a conductive polymer film; Prepare potting glue and quantitatively inject it into the aluminum shell, install the polymerized core and carry out waist-bundling sealing; Clean the encapsulated capacitor bare product, pressurize to repair the oxide film, conduct aging tests, and finally carry out sorting, printing, taping and packaging.

4. The preparation method of the aluminum-solid capacitor dedicated to electronic detonators with ultra-low leakage characteristics according to claim 3, characterized in that, The formation solution is an aqueous solution of ammonium dihydrogen phosphate, an aqueous solution of ammonium adipate or an aqueous solution of boric acid. The temperature of the formation solution is 40°C to 60°C, and the formation time is 10 to 60 minutes.

5. The preparation method of the aluminum solid capacitor dedicated for electronic detonators with ultra-low leakage characteristics according to claim 3, characterized in that, The potting glue is an epoxy resin system or a polyurethane potting glue, and the mass concentration ratio of the potting glue is 10% to 50%.

6. The preparation method of the special aluminum solid capacitor for electronic detonators with ultra-low leakage characteristics according to claim 3, characterized in that, The injection amount of the potting glue in the aluminum shell is 0.05 to 0.2 mL.

7. The preparation method of the special solid aluminum capacitor for electronic detonators with ultra-low leakage characteristics according to claim 3, characterized in that, The operating conditions for ultrasonic wrapping uniformity of the encapsulated capacitor semi-finished product are: place the encapsulated capacitor semi-finished product in an ultrasonic device, the ultrasonic frequency is 10 to 200 kHz, and the ultrasonic time is 5 minutes to 2 hours.

8. The manufacturing method of the dedicated solid aluminum capacitor for electronic detonators with ultra-low leakage characteristics according to claim 3, wherein, The operating conditions for high-temperature curing and shaping of the encapsulated capacitor semi-finished product are: place the encapsulated capacitor semi-finished product in an oven, the curing temperature is 150°C to 200°C, and the curing time is 1 hour to 24 hours.

9. The preparation method of the aluminum solid capacitor dedicated to electronic detonators with ultra-low leakage characteristics according to claim 3 is characterized in that, The cleaning method for the encapsulated capacitor bare product is: wash the sealed bare product with a cleaning agent / warm water.

10. Application of a special solid aluminum capacitor for electronic detonators with ultra-low leakage characteristics, characterized in that, It is used as a power energy storage component in an electronic detonator system to stabilize the power output and suppress the leakage phenomenon.

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