Phased array antenna

Abstract

The invention discloses a phased-array antenna, the phased-array antenna comprises a plurality of antenna module units, each antenna module unit comprises a PCB and an integrated radome module, and the integrated radome module is arranged on the surface of the PCB; a feed network, a dielectric substrate and an antenna radiation patch are arranged on the PCB, and the PCB is used for realizing feed and partial radiation functions; the integrated antenna housing module comprises a honeycomb support, an antenna patch, a PET film and an antenna housing, the antenna patch is etched on the PET film, the honeycomb support, the PET film and the antenna housing are mutually connected to form an integrated structure, and the integrated antenna housing module is used for realizing wave transmission, bandwidth broadening and impedance matching. According to the phased-array antenna, the use cost of PCB materials is reduced, and the problem that the electrical performance of the phased-array antenna is reduced due to dielectric loss caused by excessive use of PCB materials is solved.

Description

Technical Field

[0001] This application belongs to the field of wireless communication, and particularly relates to a phased array antenna. Background Art

[0002] Satellite communication has become a research hotspot in the field of wireless communication in recent years due to its advantages such as wide coverage, convenient and rapid networking, and large system capacity. Among them, whether in satellite payloads or ground terminal devices, the phased array antenna module is an important part. Considering the design requirements of miniaturization and low profile of communication devices, two-dimensional planar phased array antennas composed of microstrip patch antenna elements have been widely used.

[0003] For a wide-band phased array antenna with TRX transceiver coplanarity (such as Ku and Ka bands), the traditional design is that the antenna radiation patch, parasitic patch, and RF part are integrated in the PCB (Printed Circuit Board) stack, as Figure 1 shown. However, this will lead to an increase in the cost of using PCB materials, a decrease in the electrical performance of the phased array antenna caused by dielectric loss, and an adverse constraint on the design freedom. Summary of the Invention

[0004] The purpose of this application is: aiming at the problems of cost increase and electrical performance reduction existing in the product design in the above technical background, the phased array antenna of this application separates the original dielectric substrate II and the antenna parasitic patch part from the PCB, thereby reducing the usage cost of PCB materials and improving the reduction in the electrical performance of the phased array antenna caused by dielectric loss due to the use of PCB materials.

[0005] On the one hand, the purpose of this application is achieved through the following technical solutions:

[0006] A phased array antenna, the phased array antenna includes a plurality of antenna module units, and each antenna module unit includes: a PCB board and an integrated radome module, and the integrated radome module is arranged on the surface of the PCB board;

[0007] A feeding network, a dielectric substrate, and an antenna radiation patch are arranged on the PCB board, and the PCB board is used to realize feeding and partial radiation functions;

[0008] The integrated radome module includes: a honeycomb support, an antenna patch, a PET film, and a radome. The antenna patch is etched on the PET film. The honeycomb support, the PET film, and the radome are connected to form an integrated structure, and the integrated radome module is used to realize wave transmission, bandwidth broadening, and impedance matching.

[0009] According to a preferred embodiment, the honeycomb support is a hollow structure made of foamed 3D material.

[0010] According to a preferred embodiment, the honeycomb support, the PET film, and the radome are assembled into an integrated structure by structural glue or ultrasonic welding.

[0011] According to a preferred embodiment, the structural shape of the honeycomb support includes: circular, square, rhombus, or other regular or irregular polygons.

[0012] On the other hand, the present application also discloses:

[0013] A phased array antenna, the phased array antenna includes a plurality of antenna module units, and the antenna module unit includes: a PCB board and an integrated radome module, and the integrated radome module is disposed on the surface of the PCB board;

[0014] The PCB board is provided with a feeding network, a dielectric substrate, and an antenna radiation patch, and the PCB board is used to realize feeding and partial radiation functions;

[0015] The integrated radome module is: a honeycomb support formed by engraving a piece of PC or fiberglass material into a designed shape, and then an antenna parasitic patch is constructed inside the honeycomb support, and the integrated radome module is used to realize wave transmission, bandwidth broadening, and impedance matching.

[0016] According to a preferred embodiment, the antenna parasitic patch is disposed inside the honeycomb support by etching metal or brushing silver paste.

[0017] According to a preferred embodiment, the honeycomb support is a hollow structure.

[0018] According to a preferred embodiment, there is still a radome on the top of the honeycomb support.

[0019] The main solution of the present application and its various further selection solutions can be freely combined to form multiple solutions, all of which are solutions that can be adopted and claimed in the present application. Those skilled in the art can understand that there are various combinations according to the prior art and common general knowledge after understanding the solution of the present application, all of which are the technical solutions to be protected by the present application, and will not be enumerated here.

[0020] The beneficial effects of the present application:

[0021] Each antenna module unit of the phased array antenna in this application only consists of two parts. One part is a PCB component with low manufacturing complexity, and the other part is an integrated radome (which can be realized at low cost by various processes). The PCB realizes the functions of power feeding and partial radiation, and the radome realizes radiation electrical functions such as wave transmission, bandwidth broadening, and impedance matching, as well as the protection function of the local general radome. The original dielectric substrate two can be replaced by a honeycomb bracket (the shape of the honeycomb bracket can be designed into but not limited to polygons such as circles, squares, rhombuses, etc. according to the need for optimizing electrical performance; a hollow structure such as a low-density foamed 3D material can also be used). This reduces the use cost of PCB materials and improves the reduction of the electrical performance of the phased array antenna caused by dielectric loss due to the use of PCB materials. Description of the Drawings

[0022] Figure 1 is an exploded view of the structure of a traditional microstrip patch antenna unit;

[0023] Figure 2 is an exploded schematic view of the corresponding structure in Embodiment 1 of this application;

[0024] Figure 3 is a side view of the corresponding structure in Embodiment 1 of this application;

[0025] Figure 4 is a three-layer side view of the integrated radome module corresponding to Embodiment 1 of this application;

[0026] Figure 5 is a schematic diagram of the corresponding structure of the antenna module unit in Embodiment 2 of this application;

[0027] Figure 6 is a schematic diagram of the corresponding structure of the phased array antenna in Embodiment 2 of this application. Detailed Embodiments

[0028] The following uses specific specific examples to illustrate the implementation manners of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0029] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0030] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of this application is usually placed during use. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to the present application. In addition, terms such as "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0031] In addition, terms such as "horizontal", "vertical", "hanging", etc. do not mean that the components are required to be absolutely horizontal or hanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0032] In the description of the present application, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0033] In addition, it should be pointed out in the present application that in the present application, if the specific structures, connection relationships, positional relationships, power source relationships, etc. involved are not specifically written, then the structures, connection relationships, positional relationships, power source relationships, etc. involved in the present application are all those that can be known by those skilled in the art on the basis of the prior art without creative labor.

[0034] Embodiment 1

[0035] Reference Figures 2 to 4 As shown, this embodiment discloses a phased array antenna. The phased array antenna includes a plurality of antenna module units. The antenna module unit includes: a PCB board and an integrated radome module. The integrated radome module is disposed on the surface of the PCB board.

[0036] A feeding network, a dielectric substrate and an antenna radiation patch are provided on the PCB board. The PCB board is used to realize the feeding and partial radiation functions.

[0037] The integrated radome module includes: a honeycomb support, an antenna patch, a PET film, and a radome. The antenna patch is etched on the PET film. The honeycomb support, the PET film, and the radome are interconnected to form an integrated structure. The integrated radome module is used to achieve wave transmission, bandwidth broadening, and impedance matching.

[0038] Preferably, the honeycomb support is a hollow structure constructed of foamed 3D material.

[0039] Preferably, the honeycomb support, the PET film, and the radome are assembled together by structural glue or ultrasonic welding to form an integrated structure.

[0040] Preferably, the structural shape of the honeycomb support includes: circular, square, diamond, or other regular or irregular polygons to meet the need for optimizing electrical performance in actual scenarios.

[0041] For the existing conventional antenna design scheme: in the integrated PCB scheme, the PCB assembly cost is high, and in the process of multi-layer stacking, the material cost is high.

[0042] In this application, the original dielectric substrate II and the antenna parasitic patch part in the traditional technology are separated from the PCB for design. According to the present invention, the PAAM (Power Amplifier Antenna Module) in the Ku or Ka band only includes two parts, one part is a PCB component with low manufacturing complexity, and the other part is an integrated radome. Through the structural design of this application, the use cost of PCB materials is reduced, and the reduction of the electrical performance of the phased array antenna caused by the dielectric loss due to the use of PCB materials is improved.

[0043] Moreover, the integrated design structure of the antenna parasitic patch, the honeycomb support, and the radome in this application can effectively reduce the complexity of processing and production assembly, thus being more conducive to ensuring the consistency of design structure parameters and the structural fatigue resistance during long-term operation, and improving the stability of the electrical performance of the whole machine equipment.

[0044] Embodiment 2

[0045] Reference Figure 5 and Figure 6 As shown in

[0046] This embodiment discloses a phased array antenna. The phased array antenna includes a plurality of antenna module units. The antenna module unit includes: a PCB board and an integrated radome module. The integrated radome module is disposed on the surface of the PCB board.

[0047] The integrated radome module is as follows: A honeycomb support is formed by engraving a piece of PC or fiberglass material, and then antenna parasitic patches are constructed inside the honeycomb support. The integrated radome module is used to achieve wave transmission, bandwidth broadening, and impedance matching, thereby further reducing the assembly complexity.

[0048] Preferably, the antenna parasitic patches are disposed inside the honeycomb support by etching metal or brushing silver paste.

[0049] Preferably, the honeycomb support is a hollow structure.

[0050] Preferably, there is still a radome on the top of the honeycomb support.

[0051] For the existing conventional antenna design scheme: In the integrated PCB scheme, the PCB assembly cost is high, and in the multi-layer stacking process, the material cost is high.

[0052] In this application, the original dielectric substrate II and the antenna parasitic patch part in the traditional technology are separated from the PCB. According to the present invention, the PAAM (Power Amplifier Antenna Module) in the Ku or Ka band only includes two parts. One part is a PCB component with low manufacturing complexity, and the other part is an integrated radome. Through the structural design of this application, both the use cost of PCB materials is reduced, and the reduction of the electrical performance of the phased array antenna caused by the dielectric loss caused by the use of PCB materials is improved.

[0053] Moreover, the integrated design structure of the antenna parasitic patch, the honeycomb support, and the radome in this application can effectively reduce the complexity of processing and production assembly, thereby being more conducive to ensuring the consistency of design structure parameters and the structural fatigue resistance during long-term operation, and improving the stability of the electrical performance of the whole machine equipment.

[0054] The above are only the preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of this application shall be included in the protection scope of this application.

Claims

1. A phased array antenna, characterized in that, The phased array antenna includes a number of antenna module units, and each antenna module unit includes: a PCB board and an integrated radome module, and the integrated radome module is arranged on the surface of the PCB board; The PCB board is provided with a feed network, a dielectric substrate and antenna radiation patches, and the PCB board is used to achieve the functions of feeding and partial radiation; The integrated radome module includes: a honeycomb support, an antenna patch, a PET film and a radome. The antenna patch is etched on the PET film. The honeycomb support, the PET film and the radome are connected to each other to form an integrated structure, and the integrated radome module is used to achieve wave transmission, bandwidth broadening and impedance matching.

2. The phased array antenna according to claim 1, characterized in that The honeycomb support is a hollow structure made of foamed 3D material.

3. The phased array antenna according to claim 1, characterized in that, The honeycomb support, the PET film and the radome are assembled by structural glue or ultrasonic welding to form an integrated structure.

4. The phased array antenna according to claim 1, characterized in that, The structural shape of the honeycomb support includes: circular, square, diamond or other regular or irregular polygons.

5. A phased array antenna, characterized in that, The phased array antenna includes a number of antenna module units, and each antenna module unit includes: a PCB board and an integrated radome module, and the integrated radome module is arranged on the surface of the PCB board; The PCB board is provided with a feed network, a dielectric substrate and antenna radiation patches, and the PCB board is used to achieve the functions of feeding and partial radiation; The integrated radome module is: a designed honeycomb support is formed by engraving a piece of PC or fiberglass material, and then an antenna parasitic patch is constructed inside the honeycomb support. The integrated radome module is used to achieve wave transmission, bandwidth broadening and impedance matching.

6. The phased array antenna according to claim 5, characterized in that, The antenna parasitic patch is arranged inside the honeycomb support by etching metal or brushing silver paste.

7. The phased array antenna according to claim 5, wherein, The honeycomb support is a hollow structure.

8. The phased array antenna according to claim 5, characterized in that, There is still a radome on the top of the honeycomb support.

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