Intelligent detection method and system for pin state of power management chip

Abstract

The invention provides a power management chip pin state intelligent detection method and system. The method comprises the steps that temperature difference quantity is input into a gradient heat conduction compensation structure, and compensation current opposite to a temperature gradient vector is generated based on temperature field distribution in the copper-based composite material; superposing and coupling the voltage fluctuation signal and the compensation current to generate a reference voltage signal; performing frequency component separation processing on the reference voltage signal, and extracting electromagnetic interference characteristic data in a frequency component; performing time sequence correlation on the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjusting an interference suppression parameter through closed-loop control, and acting the adjusted interference suppression parameter on an interference suppression process of a reference voltage signal to generate a pin state detection signal; and detecting the pin state of the power management chip according to the pin state detection signal. According to the invention, the pin voltage stability and the state detection precision of the power management chip are improved.

Description

Technical Field

[0001] This application relates to the field of computer technology, and in particular, to an intelligent detection method and system for the pin status of a power management chip. Background Art

[0002] In application scenarios such as server power supplies, new energy vehicle electronic controls, and high-end communication devices, power management chips with high integration and large current face severe challenges. The pin area bears a significant current load during operation, resulting in a rapid increase in local temperature and the formation of a complex and dynamic temperature gradient field. At the same time, switching noise and high-frequency signals inside and around the chip will cause strong electromagnetic interference. These dynamically changing temperature gradients and electromagnetic interference are coupled with each other, seriously interfering with the stability and accuracy of the pin voltage signal. In order to achieve real-time and accurate monitoring of the chip pin status, an intelligent detection method is urgently needed.

[0003] The existing solution is a detection method based on the joint analysis of an external temperature sensor network and voltage fluctuations. This solution deploys multiple discrete temperature sensor nodes on the package periphery or specific areas of the power management chip to collect approximate temperature distribution information on the chip surface. At the same time, through a high-precision analog-to-digital converter, the sampling circuit obtains the real-time voltage fluctuation signal of the target pin. The system uses the collected temperature data to estimate the drift effect of temperature on the pin voltage through a preset algorithm model and performs preliminary static or quasi-static compensation. Then, a fixed digital filtering technology is applied to the compensated voltage signal to suppress electromagnetic interference in known frequency bands. Finally, the working status of the pin is judged by comparing the processed voltage signal with a preset threshold.

[0004] However, the existing solution has limited ability to perceive the subtle and dynamic changes in the temperature gradient field inside the chip. It is difficult for the peripheral sensors to accurately capture the transient and high-spatial-resolution temperature differences in the pin connection area, resulting in a large error in the temperature drift compensation model. Its electromagnetic interference suppression usually relies on preset fixed filtering parameters and is difficult to cope with the dynamic changes in the electromagnetic interference spectrum characteristics under complex working conditions, with insufficient adaptability. Summary of the Invention

[0005] This application provides an intelligent detection method and system for the pin status of a power management chip, aiming to solve the problem of low detection accuracy of the pin status of a power management chip caused by insufficient high-resolution dynamic temperature gradient perception accuracy, insufficient electromagnetic interference suppression adaptability, and lack of dynamic coupling and correlation processing of temperature and electromagnetic interference in the prior art.

[0006] In a first aspect, this application provides an intelligent detection method for the pin status of a power management chip, including: Build a temperature gradient distribution monitoring structure formed by multiple micro temperature sensing units inside the power management chip, and obtain the temperature distribution data of the pin connection area of the power management chip and the voltage fluctuation signal of the pins in the operating state. The temperature distribution data includes the temperature difference between adjacent micro temperature sensing units; Input the temperature difference into the gradient heat conduction compensation structure, and generate a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material; Superpose and couple the voltage fluctuation signal and the compensation current to generate a reference voltage signal; Perform frequency component separation processing on the reference voltage signal, and extract the electromagnetic interference characteristic data in the frequency components; Perform time series correlation on the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjust the interference suppression parameters through closed-loop control based on the time series correlation result, and apply the adjusted interference suppression parameters to the interference suppression process of the reference voltage signal to generate a pin status detection signal, and detect the pin status of the power management chip according to the pin status detection signal.

[0007] Optionally, the step of inputting the temperature difference into the gradient heat conduction compensation structure and generating a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material includes: Based on the temperature difference, construct a temperature gradient vector in the gradient heat conduction compensation structure; Taking the temperature gradient vector as the reference axis, decompose the temperature field distribution in the copper-based composite material into an axial conduction component and a radial circulation component; Generate an axial compensation current component according to the heat flow attenuation characteristic of the axial conduction component; Perform Fourier harmonic decomposition on the radial circulation component, extract the main component of the vortex heat flow of the radial circulation component, and generate a reverse spiral current path on the surface of the pin metal layer according to the rotation direction of the main component of the vortex heat flow; Perform three-dimensional vector synthesis on the axial compensation current component and the radial component of the reverse spiral current path to obtain a compensation current opposite to the temperature gradient vector.

[0008] Optionally, the step of generating an axial compensation current component according to the heat flow attenuation characteristic of the axial conduction component includes: Along the direction of the temperature gradient vector, divide the heat conduction field domain of the copper-based composite material into a continuous number of heat flow micro-elements, and each heat flow micro-element corresponds to a material cross-sectional layer perpendicular to the temperature gradient vector; Measure the heat flux density attenuation rate between adjacent heat flux micro-elements, and generate spatial distribution data according to the heat flux density attenuation rate, where the spatial distribution data includes the attenuation gradient of the heat flux density along the temperature gradient vector direction; Based on the attenuation gradient, establish the carrier migration trajectory, and map the attenuation gradient to the topological constraint conditions of the carrier migration trajectory through the lattice vibration spectrum characteristics of the copper-based composite material; Based on the distribution of the trajectory tangent direction in the topological constraint conditions, perform phase coherent superposition on the output signals of the distributed current source array deployed in the gradient heat conduction compensation structure to generate an axial compensation current component.

[0009] Optionally, the Fourier harmonic decomposition of the radial circulation component, extracting the main component of the vortex heat flux of the radial circulation component, and generating a reverse spiral current path on the surface of the pin metal layer according to the rotation direction of the main component of the vortex heat flux, includes: Taking the temperature gradient vector as the origin, perform polar coordinate transformation on the radial circulation component to generate the mapping result of the circulation field in the polar coordinate system; Perform Fourier harmonic decomposition on the mapping result to generate the angular Fourier series expansion of the circulation field and the radial Bessel basis projection coefficients; According to the angular Fourier series expansion and the radial Bessel basis projection coefficients, and combining the spatial distribution density of the circulation field and the proportion of the maximum circulation kinetic energy, extract the main component of the vortex heat flux; Based on the angular phase gradient direction of the main component of the vortex heat flux, determine the rotation direction mapping rule of the spiral current path, and calculate the pitch parameter of the spiral current path according to the circulation density distribution gradient of the main component of the vortex heat flux; Use the rotation direction mapping rule and the pitch parameter to construct an initial spiral current path, and perform phase modulation on the initial spiral current path based on the electro-thermal coupling frequency response characteristics of the copper-based composite material to generate a modulated current path with a wavefront propagation speed matching the rotation angular velocity of the main component of the vortex heat flux; Perform mirror symmetry operation on the modulated current path along the normal plane of the temperature gradient vector to generate a reverse spiral current path on the surface of the pin metal layer.

[0010] Optionally, the extracting the main component of the vortex heat flux according to the angular Fourier series expansion and the radial Bessel basis projection coefficients, and combining the spatial distribution density of the circulation field and the proportion of the maximum circulation kinetic energy, includes: Establish the mapping relationship between the harmonic components of each order in the angular Fourier series expansion and the phase singularities of the circulation field, and count the occurrence frequency of the phase singularities in the preset spatial grid cells to generate a phase singularity density distribution map; Perform a modulus square weighted integration operation on the radial Bessel basis projection coefficients to obtain the annular flow kinetic energy spectral density function corresponding to each order of harmonic, and identify the global maximum of the annular flow kinetic energy spectral density function to determine the dominant order; Match the spatial coordinates of the local maximum positions in the phase singularity density distribution map with the global maximum to generate a position set; Based on the position set, extract the phase singularity density values at the corresponding positions in the phase singularity density distribution map. When the phase singularity density value exceeds a preset multiple threshold of the average density of the circulation field, determine that the harmonic component of the dominant order is the candidate vortex heat flow main component; Based on the lattice vibration cut-off frequency of the copper-based composite material, with the frequency corresponding to the Debye temperature as the upper limit, perform band screening on the candidate vortex heat flow main component, and retain the harmonic components below the upper limit to generate the vortex heat flow main component.

[0011] Optionally, the process of time-sequentially correlating the electromagnetic interference characteristic data with the temperature distribution data, dynamically adjusting the interference suppression parameters through closed-loop control based on the time-sequential correlation result, and applying the adjusted interference suppression parameters to the interference suppression process of the reference voltage signal to generate a pin status detection signal includes: Convert the temperature distribution data into a time-sequential series of thermally excited carrier concentration distributions, and extract the azimuthal change rate of the interference source and the harmonic clustering factor from the frequency-phase spectrum of the electromagnetic interference characteristic data; Through the carrier tunneling effect, perform time-sequential correlation between the time-sequential series of thermally excited carrier concentration distributions and the time-varying phase angle of the harmonic clustering factor; Calculate the carrier injection phase offset according to the phase deviation gradient of the time-sequential correlation result and the azimuthal change rate of the interference source; Use the carrier injection phase offset to adjust the output level of the gate voltage control array to generate dynamically updated interference suppression parameters; Load the dynamically updated interference suppression parameters onto the surface of the carrier migration channel of the reference voltage signal; Perform phase synchronization compensation on the carrier migration process of the reference voltage signal on the surface of the carrier migration channel to generate a pin status detection signal.

[0012] Optionally, the process of superimposing and coupling the voltage fluctuation signal with the compensation current to generate a reference voltage signal includes: Decompose the compensation current into an axial compensation current component and a radial compensation current component; Establish an asymmetric spiral inductor structure on the surface of the pin metal layer to drive the radial compensation current component to form an annular magnetic field along the spiral path; Based on the interaction between the circular magnetic field and the voltage fluctuation signal, a voltage-current coupling constraint condition is constructed; According to the heat flow attenuation gradient distribution of the axial compensation current component, a carrier injection phase synchronization factor is generated; Using the carrier injection phase synchronization factor to modulate the carrier migration trajectory of the voltage fluctuation signal, a modulated voltage fluctuation signal is generated; The modulated voltage fluctuation signal is input into the center tap of the asymmetric spiral inductor structure, and at the same time, the axial compensation current component is loaded onto the outer ring of the asymmetric spiral inductor structure; Based on the voltage-current coupling constraint condition, combined with the Seebeck coefficient of the copper-based composite material and the mutual inductance effect of the asymmetric spiral inductor structure, a three-dimensional vector superposition is performed on the modulated voltage fluctuation signal and the axial compensation current component to generate a reference voltage signal.

[0013] In a second aspect, the present application provides an intelligent detection system for the pin status of a power management chip, including: A construction module for constructing a temperature gradient distribution monitoring structure formed by a plurality of micro temperature sensing units inside the power management chip, and obtaining temperature distribution data of the pin connection area of the power management chip and the voltage fluctuation signal of the pin in the operating state, where the temperature distribution data includes the temperature difference between adjacent micro temperature sensing units; An input module for inputting the temperature difference into a gradient heat conduction compensation structure to generate a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material; A superposition coupling module for superposition coupling the voltage fluctuation signal and the compensation current to generate a reference voltage signal; A separation and extraction module for performing frequency component separation processing on the reference voltage signal and extracting the electromagnetic interference characteristic data in the frequency components; An adjustment module for adjusting the timing correlation between the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjusting the interference suppression parameter through closed-loop control based on the timing correlation result, and applying the adjusted interference suppression parameter to the interference suppression process of the reference voltage signal to generate a pin status detection signal, and detecting the pin status of the power management chip according to the pin status detection signal.

[0014] In a third aspect, the present application provides a computing device, including a processing component and a storage component; the storage component stores one or more computer instructions; the one or more computer instructions are used to be called and executed by the processing component to implement an intelligent detection method for the pin status of a power management chip as described in any item of the first aspect.

[0015] Fourthly, the present application provides a computer storage medium storing a computer program, which when executed by a computer, implements a method for intelligent detection of the pin status of a power management chip as described in any one of the first aspects.

[0016] In the present application, a method for intelligent detection of the pin status of a power management chip is provided. The method includes: constructing a temperature gradient distribution monitoring structure formed by a plurality of micro temperature sensing units inside the power management chip, and obtaining the temperature distribution data of the pin connection area of the power management chip and the voltage fluctuation signal of the pins in the operating state, where the temperature distribution data includes the temperature difference amount between adjacent micro temperature sensing units; inputting the temperature difference amount into the gradient heat conduction compensation structure to generate a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material; superimposing and coupling the voltage fluctuation signal and the compensation current to generate a reference voltage signal; performing frequency component separation processing on the reference voltage signal and extracting the electromagnetic interference characteristic data in the frequency components; performing time-series correlation on the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjusting the interference suppression parameters through closed-loop control based on the time-series correlation result, and applying the adjusted interference suppression parameters to the interference suppression process of the reference voltage signal to generate a pin status detection signal, and detecting the pin status of the power management chip according to the pin status detection signal.

[0017] The present application realizes high-resolution and real-time dynamic temperature gradient distribution monitoring of the pin connection area by constructing a micro temperature sensing unit array inside the chip; utilizes the gradient heat conduction compensation structure to actively generate a canceling compensation current based on the monitored temperature difference amount, effectively neutralizing the influence of the temperature gradient on the voltage signal; suppresses the temperature drift noise by superimposing and coupling the compensation current and the original voltage fluctuation signal, and generates a more stable reference voltage signal; performs frequency component separation on the reference voltage signal to accurately extract the contained electromagnetic interference characteristic data; then performs time-series correlation analysis on the electromagnetic interference characteristic data and the temperature distribution data, and dynamically optimizes the interference suppression parameters through closed-loop control based on this, and finally applies these parameters in the interference suppression process to deeply filter out the residual noise related to temperature dynamics, thereby greatly improving the accuracy and reliability of the pin status detection signal and realizing high-precision intelligent detection of the pin status of the power management chip.

[0018] Furthermore, based on the monitored temperature difference, a temperature gradient vector is constructed in the gradient heat conduction compensation structure; taking this vector as the reference axis, the temperature field distribution within the copper-based composite material is decomposed into an axial conduction component along the vector direction and a radial circulation component surrounding the axis. For the axial conduction component, according to the characteristic that its heat flow decays with the conduction distance, by discretizing the heat conduction field domain into continuous heat flow micro-element layers along the temperature gradient vector direction, the heat flow density decay rate and its spatial gradient between adjacent micro-element layers are measured; a carrier migration trajectory model is established using this decay gradient, and combined with the lattice vibration spectrum characteristics of the copper-based composite material, the decay gradient is mapped as the topological constraint condition of the trajectory; finally, based on the distribution of the tangent direction of the trajectory in the constraint condition, the output signals of the distributed current source array are subjected to phase coherent superposition to generate an axial compensation current component.

[0019] Moreover, for the radial circulation component, it is subjected to Fourier harmonic decomposition, the dominant vortex heat flow principal component is extracted, and according to its rotation direction, a reverse spiral current path with the opposite direction is induced on the surface of the pin metal layer. Finally, the generated axial compensation current component and the radial component generated by the reverse spiral current path are subjected to three-dimensional vector synthesis to obtain a compensation current with the direction opposite to the original temperature gradient vector. This solution realizes the high-precision and physically essential compensation of the complex temperature field inside the chip: by accurately decomposing the temperature field into axial conduction and radial circulation components and designing targeted compensation mechanisms respectively. Axial compensation uses the discretization of heat flow micro-elements to accurately capture the heat flow decay characteristics, combined with the mapping of the lattice vibration spectrum, to ensure that the compensation current accurately matches the heat conduction physical process in terms of amplitude and phase, effectively canceling the linear heat diffusion effect. Radial compensation identifies and locks the dominant vortex heat flow through Fourier decomposition, and uses the reverse spiral current path to directly counteract the heat circulation at the physical level, efficiently suppressing the heat vortex perturbation. The final three-dimensional vector synthesis technology realizes the all-round and adaptive reverse cancellation of the compensation current in the spatial dimension for the temperature gradient vector, improving the accuracy, dynamic response ability and spatial coverage of the temperature gradient compensation, and laying a solid foundation for subsequent high-precision signal processing.

[0020] These aspects or other aspects of the present application will be more clearly understood in the following description of the embodiments. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1Flowchart of an intelligent detection method for pin status of a power management chip provided by an embodiment of the present application; Figure 2 Structural schematic diagram of an intelligent detection system for pin status of a power management chip provided by an embodiment of the present application; Figure 3 Structural schematic diagram of a computing device provided by an embodiment of the present application. Detailed implementation manners

[0023] In order to enable those skilled in the art to better understand the solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application.

[0024] In some processes described in the specification, claims and above-mentioned drawings of the present application, multiple operations appear in a specific order. However, it should be clearly understood that these operations may not be executed in the order in which they appear herein or may be executed in parallel. The serial numbers of the operations, such as 11, 12, etc., are only used to distinguish different operations, and the serial numbers themselves do not represent any execution order. In addition, these processes may include more or fewer operations, and these operations may be executed in sequence or in parallel. It should be noted that the descriptions such as "first" and "second" in this article are used to distinguish different messages, devices, modules, etc., and do not represent a sequence, nor do they limit that "first" and "second" are of different types.

[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.

[0026] In the prior art, temperature compensation and electromagnetic interference suppression are treated as relatively independent processes, failing to deeply analyze and utilize the strong coupling correlation in time sequence between the dynamic change of temperature distribution and the characteristics of electromagnetic interference. As a result, significant noise components related to temperature dynamics still remain in the signal after interference suppression, ultimately restricting the accuracy and reliability of pin state detection, especially showing deficiencies under extreme or rapidly changing working conditions. To solve the problem of poor pin state detection effect of power management chips caused by insufficient high-resolution dynamic temperature gradient perception accuracy, insufficient electromagnetic interference suppression adaptability, and lack of processing of the dynamic coupling correlation between temperature and electromagnetic interference in the prior art, the embodiment of the present application provides an intelligent detection method for the pin state of a power management chip. The method adopts the following concept: integrating a micro temperature sensing array inside the chip to monitor the temperature gradient in the pin area in real time with high precision; using this gradient data to generate a reverse compensation current in a dedicated compensation structure to actively offset the influence of temperature on voltage; performing spectral analysis on the compensated signal to extract the characteristics of electromagnetic interference; the key innovation lies in performing time sequence correlation between the interference characteristics and real-time temperature data, and dynamically optimizing the interference suppression parameters based on this; finally, applying the optimized parameters to deeply filter out noise and generate a high-fidelity detection signal to achieve accurate pin state diagnosis.

[0027] Figure 1 FIG. is a flowchart of an intelligent detection method for the pin state of a power management chip provided by an embodiment of the present application. As Figure 1 shown, the method includes: S11. Construct a temperature gradient distribution monitoring structure formed by multiple micro temperature sensing units inside the power management chip, and obtain the temperature distribution data of the pin connection area of the power management chip and the voltage fluctuation signal of the pin in the operating state. The temperature distribution data includes the temperature difference amount between adjacent micro temperature sensing units.

[0028] Among them, the power management chip can be an integrated circuit for power conversion and distribution, including functional modules such as voltage regulation and charge and discharge control. Multiple micro temperature sensing units are integrated in the form of an array on the thermocouples or thermistor groups on the chip substrate for collecting micro area temperature values. The temperature gradient distribution monitoring structure is a grid topology network composed of sensing units, where the nodes are temperature sampling points and the edges reflect the heat conduction relationship between adjacent points. The pin connection area refers to the physical area on the power management chip where the pins are connected to the external circuit, including pads or contacts, for transmitting electrical signals and bearing thermal stress. The voltage fluctuation signal refers to the voltage change signal generated by the pin during operation, including noise or interference components, which reflects electrical instability based on sensor acquisition. The temperature difference amount refers to the temperature difference between adjacent micro temperature sensing units, including positive or negative deviations, obtained by calculating the difference between the unit temperature values, and is used to quantify the thermal gradient.

[0029] In an embodiment of the present application, firstly, a plurality of miniature temperature sensing units are integrated on the substrate of the pin connection area of the power management chip through a photolithography process to form a temperature gradient distribution monitoring structure with a grid topology; secondly, the temperature values of all the sensing units are collected in real time, the temperature difference between adjacent units is calculated and a temperature difference matrix is generated; at the same time, the voltage fluctuation signal of the pin in the operating state is synchronously acquired through a high-impedance probe; finally, the temperature difference matrix and the voltage fluctuation signal are packaged into a time-space aligned original data set.

[0030] S12, inputting the temperature difference into the gradient heat conduction compensation structure, and generating a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material.

[0031] Among them, the gradient heat conduction compensation structure refers to a compensation mechanism designed based on thermodynamic principles, including a copper-based composite material layer, which is used to generate reverse current according to the temperature field distribution and neutralize thermal effects. Copper-based composite materials refer to mixed materials with copper as the matrix, including added thermal conductivity enhancers, which are used to optimize thermal conductivity performance and can simulate heat flow based on temperature field distribution. Compensation current refers to the current signal output by the gradient heat conduction compensation structure, including size and direction characteristics, which is designed based on the opposite temperature gradient vector to offset thermal interference.

[0032] In an embodiment of the present application, the temperature difference matrix is first input into a three-dimensional thermodynamic simulation model to generate a temperature gradient vector reflecting the direction and intensity of heat conduction; secondly, a detection current is injected into the copper-based composite material cavity of the gradient heat conduction compensation structure, and the internal temperature field is inverted according to the temperature distribution on the cavity surface; then, based on the thermal-electric equivalence principle, the temperature gradient vector modulus is converted into current intensity, and the direction is opposite to the vector; finally, the distributed current source array in the compensation structure is controlled to output a synthetic compensation current.

[0033] S13, superimposing and coupling the voltage fluctuation signal with the compensation current to generate a reference voltage signal.

[0034] Among them, the reference voltage signal refers to a stable voltage signal that has been compensated and superimposed, including a reference value component, which is used for subsequent interference analysis and is generated based on the fusion of the voltage fluctuation signal and the compensation current.

[0035] In an embodiment of the present application, the pin voltage fluctuation signal is first conditioned by a preamplifier; secondly, the compensation current is converted into an equivalent voltage signal by a transimpedance amplifier; then, the two signals are input into the positive and negative input terminals of the differential adder, and the gain ratio is set according to the thermoelectric conversion coefficient; finally, a reference voltage signal with a compressed fluctuation amplitude is generated by weighted superposition.

[0036] S14, performing frequency component separation processing on the reference voltage signal, and extracting electromagnetic interference characteristic data in the frequency component.

[0037] Among them, the frequency component refers to the frequency band components obtained after the separation of the reference voltage signal, including high-frequency or low-frequency bands, which are obtained through Fourier transform and reflect the spectral characteristics of the signal. The electromagnetic interference characteristic data refers to the interference-related information extracted from the frequency components, including amplitude, frequency, and mode characteristics, and is used to identify external interference sources.

[0038] In the embodiment of the present application, first, a high-speed analog-to-digital conversion is performed on the reference voltage signal to obtain a digital signal stream; secondly, the signal is decomposed into a preset frequency band through a parallel digital filter bank; then, Hilbert transform is performed on each frequency band component to extract the instantaneous amplitude and phase; finally, the frequency points with amplitudes exceeding the dynamic threshold are screened, and their center frequencies, peak amplitudes, and phase offsets are recorded as electromagnetic interference characteristic data.

[0039] S15. Perform time-series association on the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjust the interference suppression parameters through closed-loop control based on the time-series association result, and apply the adjusted interference suppression parameters to the interference suppression process of the reference voltage signal to generate a pin status detection signal, and detect the pin status of the power management chip according to the pin status detection signal.

[0040] Among them, the time-series association result refers to the analysis result after the electromagnetic interference characteristic data and the temperature distribution data are aligned in time. Closed-loop control refers to a feedback control system that dynamically adjusts parameters, including sensors, controllers, and actuators, and optimizes performance based on the association result. The interference suppression parameter refers to the configuration value used to suppress signal interference. The pin status detection signal refers to the detection signal generated after interference suppression, including a status indication value, which is used to determine whether the pin is normal and is output based on the processing of the reference voltage signal. The pin status refers to the operating condition of the pins of the power management chip, including open circuit, short circuit, or normal state, and is evaluated based on the pin status detection signal.

[0041] In the embodiment of the present application, first, a timestamp alignment sequence of the electromagnetic interference characteristic data and the temperature distribution data is established; secondly, the time delay value of the temperature change and the interference enhancement is calculated through the cross-correlation algorithm; then, when the time delay is lower than the set threshold, the filter order is adjusted according to the temperature difference change rate, and the cut-off frequency is reset according to the temperature difference amplitude; finally, the optimized interference suppression parameters are loaded into the adaptive filter to process the reference voltage signal, generate a pin status detection signal, and output a diagnostic result.

[0042] The following is a specific example: In the pin connection area of a certain type of power management chip, 24 micro temperature sensors are integrated to collect the temperature data of this area in real time and calculate the temperature difference between adjacent sensors. For example, the temperature difference between adjacent points is 3.2 °C. At the same time, the original voltage signal of pin 5 is obtained through a high-impedance probe, and the sampling rate is 1 billion times per second. The temperature difference data is input into the copper-based composite compensation structure. First, the heat conduction direction vector is calculated. For example, the heat flux intensity is 12 °C / mm, and the direction angle is 35°. The temperature field is decomposed into an axial component and a rotational component. The heat flux density of the axial component is 8.7 W / m², and the heat flux density of the rotational component is 4.1 W / m². According to the conversion coefficient of 0.38 V / Kelvin, an axial compensation current is generated, and the core vortex characteristics of the rotational component are extracted. For example, the main frequency is 217 MHz, and it rotates clockwise. A reverse spiral current path is formed on the surface of the metal layer. For example, the pitch is 20 μm, and it rotates counterclockwise, etc. Finally, a synthesized compensation current is output, and the peak value is 4.5 mA.

[0043] In the special inductance structure, in the embodiment of the present application, the rotational component current can be input into the outer ring of the inductor to form a magnetic field. For example, the intensity is 0.3 Tesla. The phase factor modulated by the temperature difference data, such as 0.05 radians per degree, is used to process the original voltage signal. According to the thermoelectric characteristic of 42 μV / Kelvin, the processed voltage signal and the axial current are superimposed in three-dimensional space to generate a reference voltage, and the ripple of this voltage is reduced from 120 mV to 18 mV. This embodiment can perform dynamic diagnosis: analyze the spectrum of the reference voltage, extract the interference characteristics, such as the center frequency of 217 MHz and the intensity of 28 dB; correlate the temperature data with the interference phase change rate, such as the time delay of 2 ms; accordingly, dynamically optimize the filter to increase the order to 10 and reduce the cut-off frequency to 200 MHz; finally, the output diagnostic signal has a signal-to-noise ratio of 41 dB, and it is determined that pin 5 is in a normal state.

[0044] By executing S11~S15, in the embodiment of the present application, by constructing a temperature gradient monitoring and heat conduction compensation mechanism, the influence of the thermal effect in the chip pin area on the voltage signal is effectively neutralized. At the same time, combined with the extraction of electromagnetic interference characteristics and the analysis of time sequence correlation, the dynamic optimization of interference suppression parameters is realized, thereby improving the accuracy and reliability of pin state detection and ensuring the stability and service life of the power management chip in a complex operating environment.

[0045] In a possible embodiment, in S12, the temperature difference amount is input into the gradient heat conduction compensation structure, and a compensation current opposite to the temperature gradient vector is generated based on the temperature field distribution in the copper-based composite material, including: Step 121: Based on the temperature difference amount, a temperature gradient vector is constructed in the gradient heat conduction compensation structure.

[0046] Among them, the temperature gradient vector refers to a spatial vector constructed by the temperature difference amount, including magnitude and direction attributes, and is used to characterize the directional intensity of heat conduction inside the chip.

[0047] Step 122: With the temperature gradient vector as the reference axis, decompose the temperature field distribution within the copper-based composite material into an axial conduction component and a radial circulation component.

[0048] Among them, the reference axis refers to the coordinate axis with the direction of the temperature gradient vector as the reference, which is used to decompose the spatial components of the temperature field distribution. The axial conduction component refers to the heat conduction component along the reference axis direction, including linear heat flow characteristics, and is obtained based on the scalar value of the temperature field projected onto the axis. The radial circulation component refers to the annular heat flow component perpendicular to the reference axis, including vortex characteristics, and is calculated based on the circulation of the temperature field in the radial plane.

[0049] Step 123: Generate an axial compensation current component according to the heat flow attenuation characteristics of the axial conduction component.

[0050] Among them, the heat flow attenuation characteristics refer to the physical law that the axial heat flow decays exponentially with distance, including the attenuation coefficient and the distance function, which are used to calculate the change in heat flow intensity. The axial compensation current component refers to the current that cancels the influence of the axial heat flow, including reverse current parameters, and is generated based on the conversion of the heat flow attenuation characteristics.

[0051] Step 124: Perform Fourier harmonic decomposition on the radial circulation component, extract the main component of the vortex heat flow of the radial circulation component, and generate a reverse spiral current path on the surface of the pin metal layer according to the rotation direction of the main component of the vortex heat flow.

[0052] Among them, Fourier harmonic decomposition refers to the technique of decomposing the radial circulation component into the fundamental frequency and higher harmonics, including the extraction of the spectral amplitude, which is used to identify the dominant heat flow mode. The main component of the vortex heat flow refers to the harmonic component with the largest amplitude in the radial circulation component, including the rotation direction and intensity characteristics, which reflect the main vortex heat flow pattern. The reverse spiral current path refers to the reverse spiral-shaped current distribution generated on the metal layer surface to cancel the vortex heat flow, including the spatial path topological structure.

[0053] Step 125: Perform three-dimensional vector synthesis on the axial compensation current component and the radial component of the reverse spiral current path to obtain a compensation current opposite to the temperature gradient vector.

[0054] Among them, three-dimensional vector synthesis refers to the spatial vector superposition of the axial current component and the radial component of the spiral path, including the weighted fusion of each direction component, to generate the final compensation current.

[0055] The following is a specific example: First, a temperature gradient vector is constructed based on the temperature difference between adjacent micro temperature sensing units. Second, with this vector as the reference axis, the temperature field of the copper-based composite material is decomposed into an axial conduction component and a radial circulation component. Subsequently, an axial compensation current component is generated according to the heat flow attenuation characteristic of the axial component. At the same time, the radial circulation component is subjected to Fourier harmonic decomposition and the main component of the vortex heat flow is extracted. According to its rotation direction, a reverse spiral current path is generated on the surface of the pin metal layer. Finally, the axial compensation current component and the radial component of the reverse spiral path are subjected to three-dimensional vector synthesis to output a compensation current opposite to the temperature gradient vector.

[0056] By performing steps 121 to 125, the embodiment of the present application realizes the three-dimensional dynamic cancellation of the complex temperature field in the copper-based composite material through the precise construction and spatial decomposition of the temperature gradient vector, combined with the axial heat flow attenuation compensation and the generation of reverse current of the radial vortex heat flow, and improves the matching accuracy between the compensation current and the thermal gradient.

[0057] In a possible embodiment, step 123, generating an axial compensation current component according to the heat flow attenuation characteristic of the axial conduction component, includes: Step a1, along the direction of the temperature gradient vector, divide the heat conduction field domain of the copper-based composite material into a continuous plurality of heat flow micro-elements, and each heat flow micro-element corresponds to a material cross-sectional layer perpendicular to the temperature gradient vector.

[0058] Among them, the heat conduction field domain refers to the spatial region of the internal heat conduction effect of the copper-based composite material, including the temperature field distribution range, defined based on the heat flow transfer path. The heat flow micro-element refers to the tiny heat conduction unit divided along the temperature gradient direction, including an independent cross-sectional layer, and is used for discretized analysis of local heat flow characteristics. In the embodiment of the present application, first, the heat conduction field domain of the copper-based composite material is divided into a continuous plurality of heat flow micro-elements along the direction of the temperature gradient vector, and each heat flow micro-element corresponds to a material cross-sectional layer perpendicular to this vector, and a heat flow analysis model is established through spatial discretization.

[0059] Step a2, measure the heat flow density attenuation rate between adjacent heat flow micro-elements, and generate spatial distribution data according to the heat flow density attenuation rate. The spatial distribution data includes the attenuation gradient of the heat flow density along the direction of the temperature gradient vector.

[0060] Among them, the heat flow density attenuation rate refers to the attenuation ratio of the heat flow intensity per unit distance between adjacent heat flow micro-elements, including a change rate parameter, calculated by dividing the heat flow density difference by the distance. The spatial distribution data refers to the distribution information of the heat flow density attenuation rate in space. The attenuation gradient refers to the intensity attenuation change rate of the heat flow density along the direction of the temperature gradient vector.

[0061] Step a3: Establish the carrier migration trajectory based on the attenuation gradient, and map the attenuation gradient to the topological constraint conditions of the carrier migration trajectory through the lattice vibration spectrum characteristics of the copper-based composite material.

[0062] Among them, the carrier migration trajectory refers to the motion path model of electrons in the material, including trajectory curvature and length parameters, which is constructed based on the spatial variation of the attenuation gradient. The lattice vibration spectrum characteristics refer to the vibration frequency distribution characteristics of the atomic lattice of the copper-based composite material, including phonon spectrum data, which are used to correlate heat conduction and electron migration. The topological constraint conditions refer to the spatial restriction rules imposed on the carrier migration trajectory, including the upper limit of curvature and the range of tangent directions, which are generated based on the mapping of the attenuation gradient and lattice vibration.

[0063] Step a4: Based on the distribution of the trajectory tangent directions in the topological constraint conditions, perform phase-coherent superposition on the output signals of the distributed current source array deployed in the gradient heat conduction compensation structure to generate an axial compensation current component.

[0064] Among them, the distribution of the trajectory tangent directions refers to the set of tangent directions at each point of the carrier trajectory, including angular distribution characteristics, which are used to guide current phase regulation. The distributed current source array refers to a set of micro current sources distributed in space in the gradient heat conduction compensation structure, including independently controllable output units, which are used to generate compensation current components. Phase-coherent superposition refers to the technology of aligning and fusing multiple current source signals with zero phase difference.

[0065] The following is a specific example: First, divide the heat conduction field domain of the copper-based composite material into continuous heat flow micro-elements along the temperature gradient vector direction, and each micro-element corresponds to a vertical cross-sectional layer. Secondly, measure the heat flow density attenuation rate between adjacent heat flow micro-elements to generate spatial distribution data containing the attenuation gradient. Subsequently, establish the carrier migration trajectory based on the attenuation gradient, and map the attenuation gradient to the topological constraint conditions of the trajectory through the lattice vibration spectrum characteristics. Finally, according to the distribution of the trajectory tangent directions in the constraint conditions, perform phase-coherent superposition on the output signals of the distributed current source array to generate an axial compensation current component.

[0066] By executing Step a1 to Step a4, the embodiments of the present application accurately quantify the heat conduction attenuation characteristics through the discretization of heat flow micro-elements, and combine the constraint effect of the lattice vibration spectrum on the carrier trajectory to realize the phase-coherent regulation of the distributed current source array, thereby generating an axial compensation current component that highly matches the heat flow attenuation and improving the physical consistency of heat conduction compensation.

[0067] In a possible embodiment, Step 124: Perform Fourier harmonic decomposition on the radial circulation component, extract the main component of the vortex heat flow of the radial circulation component, and generate a reverse spiral current path on the surface of the pin metal layer according to the rotation direction of the main component of the vortex heat flow, including: Step b1: Taking the temperature gradient vector as the origin, perform a polar coordinate transformation on the radial circulation component to generate the mapping result of the circulation field in the polar coordinate system.

[0068] Among them, the polar coordinate transformation refers to the mathematical operation of converting Cartesian coordinate system data into radius and angle, including coordinate remapping, which is used to simplify the analysis of the circulation field. The mapping result of the circulation field in the polar coordinate system refers to the data expression of the radial circulation component after coordinate transformation, including the three-dimensional distribution of radius-angle-heat flux value.

[0069] Step b2: Perform Fourier harmonic decomposition on the mapping result to generate the angular Fourier series expansion of the circulation field and the radial Bessel basis projection coefficients.

[0070] Among them, the angular Fourier series expansion of the circulation field refers to the harmonic decomposition expression of the circulation field in the angular direction, including the amplitudes of each order of harmonics, which reflects the angular periodic characteristics. The radial Bessel basis projection coefficients refer to the expansion coefficients of the circulation field on the Bessel function basis, including order parameters, which are used to describe the radial distribution pattern. The angular Fourier series expansion of the circulation field is: , where, is the thermal circulation distribution function in the polar coordinate system, is the radial amplitude distribution of the -th order harmonic, is the angular harmonic order, is the angular harmonic basis. The formula for the radial Bessel basis projection coefficients is: where, m is the expansion coefficient of the n -th order and -th kind Bessel basis, is the eigenvalue determined by the boundary condition, is the n -th positive root, is the boundary radius of the action domain of the circulation field.

[0071] Step b3: According to the angular Fourier series expansion and the radial Bessel basis projection coefficients, and combined with the spatial distribution density and the proportion of the maximum circulation kinetic energy of the circulation field, extract the main components of the vortex heat flux.

[0072] Among them, the proportion of the maximum circulation kinetic energy refers to the proportion of the kinetic energy of the main components of the vortex heat flux in the total kinetic energy of the circulation field, including percentage parameters, which are used to identify the dominant vortex. The main components of the vortex heat flux refer to the core vortex structure screened by the energy proportion, including the rotation direction and intensity distribution, which reflect the main thermal circulation pattern.

[0073] Step b4: Determine the rotation mapping rule of the helical current path based on the angular phase gradient direction of the vortex heat flow main component, and calculate the pitch parameter of the helical current path according to the circulation density distribution gradient of the vortex heat flow main component.

[0074] Among them, the angular phase gradient refers to the phase change rate of the vortex heat flow main component in the angular direction. The helical current path refers to a helical conductive channel designed to cancel the thermal vortex. The rotation mapping rule refers to the helical rotation correspondence defined according to the angular phase gradient direction, including the left-handed or right-handed matching logic. The circulation density distribution gradient refers to the intensity change rate of the vortex heat flow main component in the radial direction. The pitch parameter refers to the distance control value between adjacent loops in the helical current path, including a length dimension, and is generated based on the circulation density gradient.

[0075] Step b5: Construct an initial helical current path using the rotation mapping rule and the pitch parameter, and perform phase modulation on the initial helical current path based on the electro-thermal coupling frequency response characteristics of the copper-based composite material to generate a modulated current path with a wavefront propagation speed matching the rotational angular velocity of the vortex heat flow main component.

[0076] Among them, the initial helical current path refers to a helical path constructed only by the rotation rule and the pitch, including an unmodulated geometric model. The thermal coupling frequency response characteristic refers to the frequency response characteristic of the interaction between electricity and heat in the copper-based composite material. The wavefront propagation speed refers to the propagation rate of the current signal in the path. The modulated current path refers to the helical path after phase modulation.

[0077] Step b6: Perform a mirror symmetry operation on the modulated current path along the normal plane of the temperature gradient vector to generate a reverse helical current path on the surface of the pin metal layer.

[0078] Among them, the mirror symmetry operation refers to a spatial symmetry transformation with the normal plane as the mirror surface, including geometric flipping processing, which is used to generate a reverse path.

[0079] The following is a specific example: First, perform a polar coordinate transformation on the radial circulation component with the temperature gradient vector as the origin to generate the polar coordinate mapping result of the circulation field. Secondly, perform a Fourier harmonic decomposition on this result to obtain the angular Fourier series expansion and the radial Bessel projection coefficient. Subsequently, extract the vortex heat flow main component based on the spatial distribution density and the proportion of the maximum circulation kinetic energy. Then determine the rotation mapping rule according to the angular phase gradient direction of the main component, and calculate the pitch parameter according to the circulation density distribution gradient to construct an initial helical current path. Then perform phase modulation on the initial path based on the electro-thermal coupling frequency response characteristics to make the current wavefront propagation speed match the rotational angular velocity of the thermal vortex. Finally, mirror-symmetry the modulated path along the normal plane of the temperature gradient vector to generate a reverse helical current path on the surface of the pin metal layer.

[0080] By performing steps b1 to b6, the embodiments of the present application accurately quantify the characteristics of thermal vortices through polar coordinate transformation and harmonic decomposition, generate an adaptive spiral path by combining the rotation direction mapping and pitch parameters, and achieve the dynamic matching of the current wavefront and thermal vortices based on the electro-thermal coupling characteristics. Finally, a physically realizable compensation current path is generated through mirroring operations.

[0081] In a possible embodiment, in step b3, according to the angular Fourier series expansion formula and the radial Bessel basis projection coefficients, and in combination with the spatial distribution density of the circulation field and the proportion of the maximum circulation kinetic energy, the main components of the vortex heat flux are extracted, including: Step b31: Establish a mapping relationship between the harmonic components of each order in the angular Fourier series expansion and the phase singularities of the circulation field, and within a preset spatial grid cell, count the occurrence frequency of the phase singularities to generate a phase singularity density distribution map.

[0082] Among them, the harmonic components of each order refer to the harmonic components of different orders in the angular Fourier series expansion, including the fundamental wave and higher harmonics, which reflect the multi-scale characteristics of the circulation field. The phase singularities of the circulation field refer to the points where the phase values are discontinuous or mutated in the circulation field. The preset spatial grid cell refers to a pre-divided regular spatial region, including cubic or hexahedral cells, used for discretely counting the singularity distribution. The phase singularity density distribution map refers to the spatial distribution map of the number of phase singularities per unit volume.

[0083] Step b32: Perform a modulus square weighted integral operation on the radial Bessel basis projection coefficients to obtain the circulation kinetic energy spectral density function corresponding to each order of harmonics, and identify the global maximum value of the circulation kinetic energy spectral density function to determine the dominant order.

[0084] Among them, the modulus square weighted integral operation refers to integrating the modulus square of the Bessel projection coefficients along the radial direction. The circulation kinetic energy spectral density function refers to the kinetic energy distribution function corresponding to each order of harmonics. The dominant order refers to the harmonic order corresponding to the maximum energy value in the circulation kinetic energy spectral density function. Among them, the formula for the circulation kinetic energy spectral density function is: , where, is the circulation kinetic energy spectral density corresponding to the m th order angular harmonic, is the radial Bessel basis projection coefficient, is the modulus square of the projection coefficient, is the radial weight function, is the polar coordinate integration measure, is the maximum action radius of the circulation field, and r is the radius.

[0085] Step b33: Match the local maximum positions in the phase singularity density distribution map with the global maximum value in terms of spatial coordinates to generate a position set.

[0086] Among them, the local maximum position refers to the coordinate points of the regional peaks in the phase singularity density distribution map, including spatial coordinate values, which are extracted by the neighborhood comparison algorithm. The position set refers to the set of spatial points after the local maximum positions are matched with the coordinates of the leading order, including the coordinate groups of the candidate vortex cores.

[0087] Step b34: Based on the position set, extract the phase singularity density values corresponding to the positions in the phase singularity density distribution map. When the phase singularity density value exceeds the preset multiple threshold of the average density of the circulation field, determine that the harmonic component of the leading order is the candidate main component of the vortex heat flux.

[0088] Among them, the phase singularity density value refers to the singularity density numerical values corresponding to each point in the position set. The harmonic component refers to a single component in the Fourier series expansion. The candidate main component of the vortex heat flux refers to the harmonic component screened by the position and density thresholds, including the order identifier, as the object to be selected as the main component.

[0089] Step b35: Based on the cut-off frequency of the lattice vibration of the copper-based composite material, with the frequency corresponding to the Debye temperature as the upper limit, perform band screening on the candidate main component of the vortex heat flux, and retain the harmonic components lower than the upper limit to generate the main component of the vortex heat flux.

[0090] Among them, the cut-off frequency of the lattice vibration refers to the highest frequency limit value of the atomic lattice vibration of the copper-based composite material, including the frequency value parameter, which is determined by the Debye temperature. The Debye temperature refers to the characteristic temperature parameter of the lattice vibration of the material, including the Kelvin dimension, which is used to calculate the upper limit of the cut-off frequency.

[0091] The following is a specific example: First, establish the mapping relationship between the harmonic components of each order and the phase singularities of the circulation field, and count the singularity frequencies within the preset spatial grid cells to generate the phase singularity density distribution map. Secondly, perform the modulus square weighted integral operation on the radial Bessel basis projection coefficients to generate the circulation kinetic energy spectral density function and identify the leading order. Subsequently, match the local maximum positions of the density map with the leading order coordinates to generate the position set. Then, extract the phase singularity density values of the position set, and when it exceeds the preset multiple of the average density of the circulation field, determine that the leading order harmonic is the candidate main component of the vortex heat flux. Finally, perform band screening on the candidate components with the frequency corresponding to the Debye temperature as the upper limit, and retain the low-frequency components to generate the main component of the vortex heat flux.

[0092] By executing steps b31 to b35, the embodiment of the present application accurately locates the vortex core through the joint analysis of the phase singularity density and the circulation kinetic energy, and filters out the harmonics that do not conform to the material physical properties by combining band screening, ensuring that the extracted main component of the vortex heat flux has both spatial aggregation and thermodynamic realizability.

[0093] In a possible embodiment, S15: perform time-series correlation on the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjust the interference suppression parameters through closed-loop control based on the time-series correlation result, and apply the adjusted interference suppression parameters to the interference suppression process of the reference voltage signal to generate a pin status detection signal, including: Step 151: Convert the temperature distribution data into a time-series sequence of thermally excited carrier concentration distributions, and extract the azimuth angle change rate of the interference source and the harmonic clustering factor from the frequency-phase spectrum of the electromagnetic interference characteristic data. The time-series sequence of thermally excited carrier concentration distributions refers to the spatially distributed data of thermally generated carrier density that changes over time, including a concentration value matrix sequence, which is generated based on the conversion of the temperature distribution data. The azimuth angle change rate of the interference source refers to the rate of change of the direction angle of the electromagnetic interference source over time. The harmonic clustering factor is a quantization parameter that characterizes the degree of harmonic energy aggregation, including an amplitude clustering coefficient, which is calculated based on the kurtosis characteristics of the electromagnetic interference spectrum.

[0094] Step 152: Perform time-series correlation on the time-series sequence of thermally excited carrier concentration distributions and the time-varying phase angle of the harmonic clustering factor through the carrier tunneling effect. The carrier tunneling effect refers to the quantum mechanical phenomenon of carriers tunneling through a potential barrier. The phase deviation gradient refers to the change amount of the phase deviation per unit time in the time-series correlation result.

[0095] Step 153: Calculate the carrier injection phase offset according to the phase deviation gradient of the time-series correlation result and the azimuth angle change rate of the interference source. The carrier injection phase offset refers to the carrier injection phase correction value required to compensate for phase distortion, including an angular dimension, which is synthesized based on the phase deviation gradient and the azimuth angle change rate.

[0096] Step 154: Use the carrier injection phase offset to adjust the output level of the gate voltage control array to generate dynamically updated interference suppression parameters. The gate voltage control array refers to an array of voltage regulation devices composed of programmable gates, including independent control units for outputting dynamic level signals.

[0097] Step 155: Load the dynamically updated interference suppression parameters onto the surface of the carrier migration channel of the reference voltage signal. The dynamically updated interference suppression parameters refer to the interference suppression configuration values that are adjusted in real time according to the environment, including voltage amplitude and phase parameters, which are generated based on the carrier injection phase offset. The surface of the carrier migration channel refers to the interface area where carriers move in the transmission path of the reference voltage signal, including the semiconductor surface layer for applying electric field regulation.

[0098] Step 156: Perform phase synchronization compensation on the carrier migration process of the reference voltage signal on the surface of the carrier migration channel to generate a pin status detection signal. Among them, the phase synchronization compensation operation refers to the control action of real-time correcting the phase shift during the carrier migration process, including the synchronous application of the electric field to ensure that the carrier movement is synchronized with the reference signal.

[0099] The following is a specific example: First, convert the temperature distribution data into a time-sequence series of the thermally excited carrier concentration distribution, and at the same time extract the azimuth change rate of the interference source and the harmonic clustering factor from the electromagnetic interference characteristic data. Second, perform time-sequence correlation on the carrier concentration sequence and the time-varying phase angle of the harmonic clustering factor through the carrier tunneling effect. Subsequently, calculate the carrier injection phase offset according to the phase deviation gradient and the azimuth change rate of the correlation result. Then, use this offset to adjust the output level of the gate voltage control array to generate a dynamic interference suppression parameter. Then, load this parameter onto the surface of the carrier migration channel of the reference voltage signal. Finally, perform phase synchronization compensation on the carrier movement process on the migration surface to generate a pin status detection signal.

[0100] By executing Steps 151 to 156, the embodiment of the present application accurately quantifies the thermal-electric coupling distortion through the dynamic correlation between the hot carrier concentration and the electromagnetic interference phase, and generates an interference suppression parameter in real time based on the carrier injection mechanism. Finally, phase synchronization compensation is achieved at the carrier migration interface, effectively improving the anti-interference performance and detection accuracy of the pin status signal.

[0101] In a possible embodiment, S13: Superpose and couple the voltage fluctuation signal and the compensation current to generate a reference voltage signal, including: Step 131: Decompose the compensation current into an axial compensation current component and a radial compensation current component.

[0102] Step 132: Establish an asymmetric spiral inductor structure on the surface of the pin metal layer to drive the radial compensation current component to form a circular magnetic field along the spiral path. Among them, the asymmetric spiral inductor structure refers to a spiral-shaped conductive device with an asymmetric geometric shape, including a center tap and an outer ring electrode, which is used to directionally regulate the magnetic field distribution. The circular magnetic field refers to the closed magnetic field formed by the radial compensation current in the spiral path, including the magnetic field intensity vector, which is generated based on Ampere's circuital law.

[0103] Step 133: Based on the interaction between the circular magnetic field and the voltage fluctuation signal, construct a voltage-current coupling constraint condition. Among them, the voltage-current coupling constraint condition refers to the physical equation describing the interaction between the magnetic field and the voltage signal, including the induced electromotive force relationship, which is used to constrain the signal modulation process.

[0104] Step 134: Generate a carrier injection phase synchronization factor based on the heat flow attenuation gradient distribution of the axial compensation current component. The carrier injection phase synchronization factor is a parameter for regulating the migration phase of carriers, including an angular offset, and is calculated and generated based on the heat flow attenuation gradient distribution.

[0105] Step 135: Modulate the carrier migration trajectory of the voltage fluctuation signal using the carrier injection phase synchronization factor to generate a modulated voltage fluctuation signal. The carrier migration trajectory is the movement path of carriers under the action of an electric field, including a spatial curve model, and is dynamically adjusted by the phase factor. The modulated voltage fluctuation signal is a voltage signal modulated by the carrier trajectory, including a phase correction component for canceling thermal distortion.

[0106] Step 136: Input the modulated voltage fluctuation signal into the center tap of the asymmetric spiral inductor structure, and at the same time load the axial compensation current component onto the outer ring of the asymmetric spiral inductor structure. The center tap is the central access electrode of the asymmetric spiral inductor structure, including an electrical contact point for inputting a voltage signal. The outer ring of the asymmetric spiral inductor structure is the peripheral conductive layer of the spiral path, including a ring conductor for loading the axial compensation current component.

[0107] Step 137: Based on the voltage-current coupling constraint conditions, combine the Seebeck coefficient of the copper-based composite material and the mutual inductance effect of the asymmetric spiral inductor structure to perform three-dimensional vector superposition on the modulated voltage fluctuation signal and the axial compensation current component to generate a reference voltage signal. The Seebeck coefficient is a thermoelectric conversion characteristic parameter of the copper-based composite material, including the voltage-temperature gradient ratio, which reflects the conversion efficiency of thermal energy into electrical energy. The mutual inductance effect of the asymmetric spiral inductor structure is the electromagnetic coupling effect between the current and the voltage signal in the spiral structure, including the mutual inductance coefficient for enhancing the signal superposition effect.

[0108] The following is a specific example: First, decompose the compensation current into an axial component and a radial component. Second, construct an asymmetric spiral inductor structure on the pin metal layer to drive the radial component to form an annular magnetic field. Subsequently, establish voltage-current coupling constraint conditions based on the interaction between the magnetic field and the voltage fluctuation signal. Then, generate a carrier injection phase synchronization factor according to the heat flow attenuation gradient of the axial component to modulate the carrier migration trajectory of the voltage signal. Then, input the modulated voltage signal into the center tap of the spiral inductor, and at the same time load the axial current component onto the outer ring of the inductor. Finally, based on the coupling constraint conditions, combine the Seebeck coefficient and the mutual inductance effect to perform three-dimensional vector superposition on the modulated voltage and the axial current to generate a reference voltage signal.

[0109] By performing steps 131 to 137, the embodiment of the present application realizes magnetic field directional regulation through an asymmetric spiral inductor structure, combines carrier phase synchronization and thermoelectric electromagnetic coupling mechanisms, precisely fuses the thermal compensation current and the modulation voltage signal in three-dimensional vector superposition, and effectively improves the anti-interference ability and temperature stability of the reference voltage.

[0110] Figure 2 FIG. is a schematic structural diagram of an intelligent detection system for pin states of a power management chip provided by an embodiment of the present application. As Figure 2 shown, the system includes: A construction module 21, configured to construct a temperature gradient distribution monitoring structure formed by a plurality of micro temperature sensing units inside the power management chip, and obtain temperature distribution data of the pin connection area of the power management chip and voltage fluctuation signals of the pins in the operating state. The temperature distribution data includes the temperature difference between adjacent micro temperature sensing units.

[0111] An input module 22, configured to input the temperature difference into a gradient heat conduction compensation structure, and generate a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material.

[0112] A superposition coupling module 23, configured to superposition-couple the voltage fluctuation signal and the compensation current to generate a reference voltage signal.

[0113] A separation and extraction module 24, configured to perform frequency component separation processing on the reference voltage signal, and extract electromagnetic interference characteristic data in the frequency components.

[0114] An adjustment module 25, configured to adjust the timing correlation between the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjust the interference suppression parameters through closed-loop control based on the timing correlation result, and apply the adjusted interference suppression parameters to the interference suppression process of the reference voltage signal to generate a pin state detection signal, and detect the pin state of the power management chip according to the pin state detection signal.

[0115] Figure 2 The described intelligent detection system for pin states of a power management chip can execute Figure 1 The intelligent detection method for pin states of a power management chip described in the embodiment shown. Its implementation principle and technical effects will not be elaborated again. For the intelligent detection system for pin states of a power management chip in the above embodiment, the specific manners of operations performed by each module and unit have been described in detail in the embodiment related to the method, and will not be elaborated here.

[0116] In a possible design, Figure 2 The intelligent detection system for pin states of a power management chip in the embodiment shown can be implemented as a computing device, such as Figure 3As shown, the computing device may include a storage component 31 and a processing component 32.

[0117] The storage component 31 stores one or more computer instructions, and the one or more computer instructions are called and executed by the processing component 32.

[0118] The processing component 32 is configured to: construct a temperature gradient distribution monitoring structure formed by a plurality of micro temperature sensing units inside a power management chip, and obtain temperature distribution data of a pin connection area of the power management chip and a voltage fluctuation signal of the pin in an operating state, where the temperature distribution data includes the temperature difference amount between adjacent micro temperature sensing units. Input the temperature difference amount into a gradient heat conduction compensation structure, and generate a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material. Superimpose and couple the voltage fluctuation signal and the compensation current to generate a reference voltage signal. Perform frequency component separation processing on the reference voltage signal, and extract electromagnetic interference characteristic data in the frequency components. Perform time series association on the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjust interference suppression parameters through closed-loop control based on the time series association result, and apply the adjusted interference suppression parameters to the interference suppression process of the reference voltage signal to generate a pin status detection signal, and detect the pin status of the power management chip according to the pin status detection signal.

[0119] Among them, the processing component 32 may include one or more processors to execute computer instructions to complete all or part of the steps in the above method. Of course, the processing component may also be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors or other electronic components for executing the above method.

[0120] The storage component 31 is configured to store various types of data to support the operations of the terminal. The storage component can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as random access memory (RAM), static random access memory (SRAM), electrically erasable programmable read only memory (EEPROM), erasable programmable read only memory (EPROM), programmable read only memory (PROM), read only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disc.

[0121] Of course, the computing device may necessarily further include other components, such as an input / output interface, a display component, a communication component, etc.

[0122] The input / output interface provides an interface between the processing component and the peripheral interface module, and the above-mentioned peripheral interface module can be an output device, an input device, etc.

[0123] The communication component is configured to facilitate communication between the computing device and other devices in a wired or wireless manner, etc.

[0124] Among them, the computing device can be a physical device or an elastic computing host provided by a cloud computing platform, etc. At this time, the computing device can refer to a cloud server, and the above-mentioned processing component, storage component, etc. can be basic server resources leased or purchased from the cloud computing platform.

[0125] The embodiment of the present application also provides a computer storage medium storing a computer program, and when the computer program is executed by the computer, it can implement the above-mentioned Figure 1 intelligent detection method for the pin status of a power management chip in the shown embodiment.

[0126] Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the above-described systems, devices, and units can refer to the corresponding processes in the foregoing method embodiments and will not be elaborated herein.

[0127] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art can understand and implement it without creative efforts.

[0128] Through the description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be implemented by hardware. Based on this understanding, the essence of the above technical solution, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions for causing a computer device (which can be a personal computer, server, or network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0129] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit them. Although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An intelligent detection method for the pin status of a power management chip, characterized in that Including: Constructing a temperature gradient distribution monitoring structure formed by multiple micro temperature sensing units inside a power management chip, and acquiring temperature distribution data of the pin connection area of the power management chip and voltage fluctuation signals of the pins in the operating state, where the temperature distribution data includes the temperature difference amount between adjacent micro temperature sensing units; Inputting the temperature difference amount into a gradient heat conduction compensation structure, and generating a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material; Superposing and coupling the voltage fluctuation signal and the compensation current to generate a reference voltage signal; Performing frequency component separation processing on the reference voltage signal, and extracting electromagnetic interference characteristic data in the frequency components; Performing time series association on the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjusting interference suppression parameters through closed-loop control based on the time series association result, and applying the adjusted interference suppression parameters to the interference suppression process of the reference voltage signal to generate a pin status detection signal, and detecting the pin status of the power management chip according to the pin status detection signal.

2. The method according to claim 1, wherein The step of inputting the temperature difference amount into a gradient heat conduction compensation structure and generating a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material includes: Based on the temperature difference amount, constructing a temperature gradient vector in the gradient heat conduction compensation structure; Taking the temperature gradient vector as the reference axis, decomposing the temperature field distribution in the copper-based composite material into an axial conduction component and a radial circulation component; Generating an axial compensation current component according to the heat flow attenuation characteristic of the axial conduction component; Performing Fourier harmonic decomposition on the radial circulation component, extracting the main component of the vortex heat flow of the radial circulation component, and generating a reverse spiral current path on the surface of the pin metal layer according to the rotation direction of the main component of the vortex heat flow; Performing three-dimensional vector synthesis on the axial compensation current component and the radial component of the reverse spiral current path to obtain a compensation current opposite to the temperature gradient vector.

3. The method according to claim 2, wherein The step of generating an axial compensation current component according to the heat flow attenuation characteristic of the axial conduction component includes: Along the direction of the temperature gradient vector, dividing the heat conduction field domain of the copper-based composite material into a continuous plurality of heat flow micro-elements, and each heat flow micro-element corresponds to a material cross-sectional layer perpendicular to the temperature gradient vector; Measuring the heat flow density attenuation rate between adjacent heat flow micro-elements, and generating spatial distribution data according to the heat flow density attenuation rate, where the spatial distribution data includes the attenuation gradient of the heat flow density along the direction of the temperature gradient vector; Establishing a carrier migration trajectory based on the attenuation gradient, and mapping the attenuation gradient to the topological constraint conditions of the carrier migration trajectory through the lattice vibration spectrum characteristics of the copper-based composite material; Based on the distribution of the trajectory tangent direction in the topological constraint conditions, performing phase coherent superposition on the output signals of the distributed current source array deployed in the gradient heat conduction compensation structure to generate an axial compensation current component.

4. The method according to claim 2, wherein Performing Fourier harmonic decomposition on the radial circulation component, extracting the main component of the vortex heat flux of the radial circulation component, and generating a reverse spiral current path on the surface of the pin metal layer according to the rotation direction of the main component of the vortex heat flux, including: Taking the temperature gradient vector as the origin, performing polar coordinate transformation on the radial circulation component to generate a mapping result of the circulation field in the polar coordinate system; Performing Fourier harmonic decomposition on the mapping result to generate an angular Fourier series expansion of the circulation field and radial Bessel basis projection coefficients; Extracting the main component of the vortex heat flux according to the angular Fourier series expansion and the radial Bessel basis projection coefficients, and combining the spatial distribution density of the circulation field and the proportion of the maximum circulation kinetic energy; Based on the angular phase gradient direction of the main component of the vortex heat flux, determining the rotation mapping rule of the spiral current path, and calculating the pitch parameter of the spiral current path according to the circulation density distribution gradient of the main component of the vortex heat flux; Constructing an initial spiral current path using the rotation mapping rule and the pitch parameter, and performing phase modulation on the initial spiral current path based on the electro-thermal coupling frequency response characteristics of the copper-based composite material to generate a modulated current path with a wavefront propagation speed matching the rotation angular velocity of the main component of the vortex heat flux; Performing a mirror symmetry operation on the modulated current path along the normal plane of the temperature gradient vector to generate a reverse spiral current path on the surface of the pin metal layer.

5. The method according to claim 4, characterized in that, The extracting the main component of the vortex heat flux according to the angular Fourier series expansion and the radial Bessel basis projection coefficients, and combining the spatial distribution density of the circulation field and the proportion of the maximum circulation kinetic energy, including: Establishing the mapping relationship between the harmonic components of each order in the angular Fourier series expansion and the phase singularities of the circulation field, and counting the occurrence frequency of the phase singularities in a preset spatial grid cell to generate a phase singularity density distribution map; Performing a modulus square weighted integral operation on the radial Bessel basis projection coefficients to obtain the circulation kinetic energy spectral density function corresponding to each order of harmonics, and identifying the global maximum value of the circulation kinetic energy spectral density function to determine the dominant order; Matching the spatial coordinates of the local maximum positions in the phase singularity density distribution map with the global maximum value to generate a position set; Based on the position set, extracting the phase singularity density values at the corresponding positions in the phase singularity density distribution map. When the phase singularity density value exceeds a preset multiple threshold of the average density of the circulation field, determining that the harmonic component of the dominant order is the candidate main component of the vortex heat flux; Based on the lattice vibration cut-off frequency of the copper-based composite material, using the frequency corresponding to the Debye temperature as the upper limit, performing frequency band screening on the candidate main component of the vortex heat flux, and retaining the harmonic components lower than the upper limit to generate the main component of the vortex heat flux.

6. The method according to claim 1, wherein The performing time-series correlation on the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjusting the interference suppression parameters through closed-loop control based on the time-series correlation result, and applying the adjusted interference suppression parameters to the interference suppression process of the reference voltage signal to generate a pin state detection signal, including: Convert the temperature distribution data into a time sequence of the thermally excited carrier concentration distribution, and extract the azimuth change rate of the interference source and the harmonic clustering factor from the frequency-phase spectrum of the electromagnetic interference characteristic data; Through the carrier tunneling effect, perform time sequence correlation between the time sequence of the thermally excited carrier concentration distribution and the time-varying phase angle of the harmonic clustering factor; Calculate the carrier injection phase offset according to the phase deviation gradient of the time sequence correlation result and the azimuth change rate of the interference source; Use the carrier injection phase offset to adjust the output level of the gate voltage control array to generate dynamically updated interference suppression parameters; Load the dynamically updated interference suppression parameters onto the surface of the carrier migration channel of the reference voltage signal; Perform phase synchronization compensation on the carrier migration process of the reference voltage signal on the surface of the carrier migration channel to generate a pin state detection signal.

7. The method according to claim 1, characterized in that The superimposing and coupling the voltage fluctuation signal and the compensation current to generate a reference voltage signal includes: Decompose the compensation current into an axial compensation current component and a radial compensation current component; Establish an asymmetric spiral inductor structure on the surface of the pin metal layer to drive the radial compensation current component to form a circular magnetic field along a spiral path; Based on the interaction between the circular magnetic field and the voltage fluctuation signal, construct a voltage-current coupling constraint condition; Generate a carrier injection phase synchronization factor according to the heat flow attenuation gradient distribution of the axial compensation current component; Use the carrier injection phase synchronization factor to modulate the carrier migration trajectory of the voltage fluctuation signal to generate a modulated voltage fluctuation signal; Input the modulated voltage fluctuation signal into the center tap of the asymmetric spiral inductor structure, and at the same time load the axial compensation current component onto the outer ring of the asymmetric spiral inductor structure; Based on the voltage-current coupling constraint condition, combine the Seebeck coefficient of the copper-based composite material and the mutual inductance effect of the asymmetric spiral inductor structure to perform three-dimensional vector superposition on the modulated voltage fluctuation signal and the axial compensation current component to generate a reference voltage signal.

8. An intelligent detection system for the pin status of a power management chip, characterized in that, Include: A construction module for constructing a temperature gradient distribution monitoring structure formed by a plurality of micro temperature sensing units inside a power management chip, and obtaining temperature distribution data of the pin connection area of the power management chip and the voltage fluctuation signal of the pins in the operating state, wherein the temperature distribution data includes the temperature difference between adjacent micro temperature sensing units; An input module for inputting the temperature difference into a gradient heat conduction compensation structure to generate a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material; A superimposing and coupling module for superimposing and coupling the voltage fluctuation signal and the compensation current to generate a reference voltage signal; A separation and extraction module for performing frequency component separation processing on the reference voltage signal and extracting the electromagnetic interference characteristic data in the frequency components; An adjustment module is used to adjust the temporal association of the electromagnetic interference feature data and the temperature distribution data, dynamically adjust the interference suppression parameters through closed-loop control based on the temporal association result, and apply the adjusted interference suppression parameters to the interference suppression process of the reference voltage signal to generate a pin status detection signal, and detect the pin status of the power management chip according to the pin status detection signal.

9. A computing device, characterized in that, It includes a processing component and a storage component; the storage component stores one or more computer instructions; the one or more computer instructions are used to be called and executed by the processing component to implement a method for intelligent detection of the pin status of a power management chip according to any one of claims 1 to 7.

10. A computer storage medium, characterized in that, A computer program is stored, and when the computer program is executed by a computer, it implements a method for intelligent detection of the pin status of a power management chip according to any one of claims 1 to 7.

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