A high heat load test target plate device based on a pseudo three-dimensional topology optimization method

Abstract

The application relates to the technical field of fusion reactors and discloses a high-heat-load test target plate device based on a pseudo-three-dimensional topological optimization method, which comprises a panel and a heat sink assembly; a plasma beam current can pass through an irradiation channel to irradiate a sample to be tested; cooling medium flows through a water inlet, a water inlet channel, a water inlet flow channel, a topologically optimized micro flow channel, a water outlet flow channel, a water outlet channel and a water outlet in sequence to realize the flow of the cooling medium and the cooling of the sample to be tested arranged between the panel and a micro-channel heat sink plate; the topologically optimized micro flow channel designed by the pseudo-three-dimensional topological optimization method has more specific surface and heat exchange area, the flow channel shape is round, the flow resistance can be reduced, the hydraulic performance can be improved, the cooling medium pressure drop loss is small, and the heat dissipation efficiency and the heat dissipation effect are improved; and the cooling medium is effectively guided to flow into the topologically optimized micro flow channel stably through the setting of the flow resistance block and the arc-shaped sides of the flow resistance block, so that the sample to be tested is cooled quickly and effectively.

Description

Technical Field

[0001] The present invention relates to the technical field of fusion reactors, and in particular to a high heat load test target plate device based on a pseudo three-dimensional topology optimization method. Background Art

[0002] Magnetic confinement fusion is considered a key approach to solving future energy challenges. During operation, plasma interactions (PMI) occur between the reactor boundary plasma and the first-wall material. The divertor target plate's impact point experiences extremely high particle flux and steady-state heat loads, leading to complex physical and chemical reactions in the first-wall material, typically including erosion, sputtering, surface changes, and vacancy defects. These reactions can severely impact the service life of the fusion reactor material.

[0003] Since fusion device experiments are expensive and the discharge conditions are strict, in order to conveniently and quickly study the interaction between fusion reactor boundary plasma and materials, linear plasma devices that can generate high-density plasma beams are usually used to carry out plasma irradiation experiments.

[0004] A linear plasma device contains a target plate area, where samples to be tested are typically placed for plasma irradiation experiments. When the linear plasma device operates at high power, the target plate area generates a high heat load similar to that at the boundary of a fusion reactor. However, existing linear plasma devices typically only incorporate simple flow channels within the target plate for cooling, resulting in poor cooling effectiveness and low cooling efficiency, making it difficult to achieve rapid and effective cooling under high heat loads. Summary of the Invention

[0005] The purpose of the present invention is to provide a high heat load test target plate device based on a pseudo three-dimensional topology optimization method to solve the problems of poor cooling effect and low cooling efficiency caused by relatively simple flow channels in existing target plates.

[0006] In order to achieve the above-mentioned object, the present invention provides a high heat load test target plate device based on a pseudo three-dimensional topology optimization method, which includes a panel and a heat sink assembly;

[0007] The heat sink assembly includes a microchannel heat sink plate, a manifold plate, and an inlet and outlet plate connected in sequence from front to back along the front-to-back direction; the inlet and outlet plates are provided with water inlets and outlets running through the front and rear surfaces thereof at intervals; the manifold plate is provided with water inlet channels and water outlet channels at intervals, the water inlet channels are connected to the water inlet, and the water outlet channels are connected to the water outlet;

[0008] The rear surface of the microchannel heat sink plate is provided with an inlet channel, an outlet channel and a topology optimized microchannel; the inlet channel and the outlet channel are both extended along a first direction; the inlet channel is connected to the inlet channel, and the outlet channel is connected to the outlet channel;

[0009] The topology optimized microchannel is designed by a pseudo three-dimensional topology optimization method and extends along the second direction, and the multiple topology optimized microchannels are sequentially connected along the first direction; adjacent water inlet channels and water outlet channels are connected through the multiple topology optimized microchannels;

[0010] A plurality of flow blocks are provided in the water inlet channel at intervals along a first direction, and the flow blocks are in a convex arc shape on both sides in the first direction;

[0011] The panel is provided with an irradiation channel running through its front and rear surfaces, and the panel is connected to the front surface of the microchannel heat sink plate;

[0012] The front-to-back direction, the first direction and the second direction are perpendicular to each other.

[0013] Furthermore, the topology optimized microchannel includes a subchannel extending along the second direction; the width of the subchannel gradually increases from the water inlet channel to the water outlet channel along the second direction;

[0014] The baffle is provided at a connection position of two adjacent topology-optimized microchannels on a side close to the water inlet channel in the second direction; the rear surface of the baffle is flush with the rear surface of the microchannel heat sink plate.

[0015] Furthermore, the manifold plate has a plurality of water inlet channels, and each water inlet channel is provided with a water outlet channel on both sides of the second direction; the water inlet channel and the water outlet channel are both extended along the first direction;

[0016] The microchannel heat sink plate is provided with water inlet channels having the same number as the water inlet channels, and the water inlet channels are arranged in front of the water inlet channels in a one-to-one correspondence with the water inlet channels and are connected to the water inlet channels;

[0017] The microchannel heat sink plate is further provided with water outlet channels of the same number as the water outlet channels. The water outlet channels are arranged in front of the water outlet channels in a one-to-one correspondence with the water outlet channels and are communicated with the water outlet channels.

[0018] Furthermore, the rear surface of the manifold plate is alternately provided with first water inlet grooves and first water outlet grooves extending in the first direction, and each first water inlet groove is provided with a first water outlet groove on both sides in the second direction;

[0019] A water inlet through-hole is formed at the bottom of the first water inlet trough, and the water inlet through-hole passes through the front surface of the manifold plate; a water outlet through-hole is formed at the bottom of the first water outlet trough, and the water outlet through-hole passes through the front surface of the manifold plate;

[0020] Define the first water inlet and the first water outlet as the first end, the end close to the water inlet, and the end close to the water outlet;

[0021] The manifold plate is provided with a second water inlet groove on one side of the first end of the first water inlet groove, the second water inlet groove is aligned with and connected to the water inlet; the first ends of the plurality of first water inlet grooves are all connected to the second water inlet groove; the second water inlet groove, the first water inlet groove and the water inlet through hole are sequentially connected to form the water inlet channel;

[0022] The manifold plate is provided with a second water outlet groove on one side of the second end of the first water outlet groove, and the second water outlet groove is aligned with and connected to the water outlet; the second ends of multiple first water outlet grooves are all connected to the second water outlet groove; the second water outlet groove, the first water outlet groove and the water outlet through hole are connected in sequence to form the water outlet channel.

[0023] Furthermore, a connecting assembly is included, wherein the connecting assembly includes a bolt and a nut;

[0024] The panel, microchannel heat sink plate, manifold plate and water inlet and outlet plates are all provided with a plurality of connecting through holes penetrating the front and rear surfaces thereof;

[0025] The bolts are sequentially passed through the connecting holes of the panel, microchannel heat sink plate, manifold plate and water inlet and outlet plates and are screwed with nuts to lock the panel and heat sink assembly.

[0026] Furthermore, a placement groove is provided on the rear surface of the panel, and the placement groove is connected to the irradiation channel;

[0027] The cross-section of the irradiation channel is circular, and the cross-section of the placement slot is square;

[0028] The placement groove is concentrically arranged with the irradiation channel, and the side length of the placement groove is greater than or equal to the diameter of the irradiation channel.

[0029] Furthermore, flexible graphite paper is provided between the panel and the microchannel heat sink plate.

[0030] Furthermore, the thickness of the flexible graphite paper is 0.02-0.2 mm.

[0031] Furthermore, the front and rear surfaces of the manifold plate are respectively welded to the microchannel heat sink plate and the inlet and outlet water plates.

[0032] Furthermore, the welding is explosion welding, hot isostatic pressing welding or vacuum brazing.

[0033] Compared with the prior art, the high heat load test target plate device based on the pseudo three-dimensional topology optimization method provided by the present invention has the following beneficial effects:

[0034] The present invention provides a high heat load test target plate device based on a pseudo three-dimensional topology optimization method, which includes a panel and a heat sink assembly; a sample to be tested is placed between the panel and the heat sink assembly, and a plasma beam generated by a linear plasma device used in the experiment irradiates the sample to be tested through an irradiation channel; a cooling medium enters the water inlet and outlet plate through the water inlet, and then enters the water inlet channel of the microchannel heat sink plate through the water inlet channel of the manifold plate; the cooling medium flows and diffuses toward both sides along a second direction, and flows through a plurality of topology optimized microchannels designed by the pseudo three-dimensional topology optimization method into the water outlet channel; and then flows through the water outlet channel in the manifold plate and the water outlet of the water inlet and outlet plate in sequence to flow out of the heat sink assembly, thereby passing the cooling medium in the microchannel heat sink plate. The flow in the sink plate realizes heat dissipation and cooling of the sample to be tested; and the topology optimized microchannels opened in the microchannel heat sink plate have a larger specific surface area and heat exchange area than the channels designed by conventional topology optimization methods, while the channel contour is smoother and rounder, which can reduce flow resistance and improve hydraulic performance; thereby making the cooling medium flow uniform and with small pressure drop loss, thereby improving heat dissipation efficiency and heat dissipation effect, and by spacing multiple baffles in the water inlet channel, the cooling medium entering the water inlet channel can flow directly to the topology optimized microchannels on both sides under the blocking effect of the baffles, and under the effect of the arc setting on both sides of the baffles, the flow stability of the cooling medium flowing to the topology optimized microchannels is guaranteed; comprehensively realizing rapid and effective cooling of the sample to be tested under high heat load. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 1 is an explosion diagram of a high heat load test target plate device based on a pseudo three-dimensional topology optimization method according to an embodiment of the present invention;

[0036] Figure 2 This is a schematic 3D partial cross-sectional view of a high heat load test target plate device based on a pseudo 3D topology optimization method according to an embodiment of the present invention (vertically cutting through the water inlet pipe, water outlet pipe, water inlet and outlet plate, manifold plate, and microchannel heat sink plate, and horizontally cutting through the microchannel heat sink plate);

[0037] Figure 3 yes Figure 2 A magnified schematic diagram of area A in the middle;

[0038] Figure 4 1 is a bottom view schematic diagram of a microchannel heat sink plate in a high heat load test target plate device based on a pseudo three-dimensional topology optimization method according to an embodiment of the present invention;

[0039] Figure 5 yes Figure 4 A magnified schematic diagram of area B in the middle;

[0040] Figure 61 is a schematic cross-sectional view of a manifold plate in a high heat load test target plate device based on a pseudo three-dimensional topology optimization method according to an embodiment of the present invention;

[0041] Figure 7 1 is a bottom view schematic diagram of a panel in a high heat load test target plate device based on a pseudo three-dimensional topology optimization method according to an embodiment of the present invention;

[0042] Figure 8 1 is a schematic cross-sectional view of a high heat load test target plate device based on a pseudo three-dimensional topology optimization method according to an embodiment of the present invention;

[0043] Figure 9 This is a temperature distribution diagram of a high heat load test target plate device simulated based on a pseudo three-dimensional topology optimization method according to an embodiment of the present invention;

[0044] Figure 10 This is a velocity distribution diagram of a high heat load test target plate device simulated based on a pseudo three-dimensional topology optimization method according to an embodiment of the present invention;

[0045] Figure 11 This is a pressure distribution diagram of a simulation of a high heat load test target plate device based on a pseudo three-dimensional topology optimization method in an embodiment of the present invention.

[0046] In the figure, 100, a high heat load test target plate device based on a pseudo three-dimensional topology optimization method; 1, panel; 11, irradiation channel; 12, placement tank; 2, heat sink assembly; 21, microchannel heat sink plate; 211, water inlet channel; 212, water outlet channel; 213, topology optimized microchannel; 214, flow block; 22, manifold plate; 221, water inlet channel; 2211, first water inlet trough; 2212, inlet Water through hole; 2213, second water inlet trough; 222, water outlet channel; 2221, first water outlet trough; 2222, water outlet through hole; 2223, second water outlet trough; 23, water inlet and outlet plate; 231, water inlet; 232, water outlet; 3, water inlet and outlet assembly; 31, water inlet pipe; 32, water outlet pipe; 4, connecting assembly; 41, bolt; 42, nut; 5, flexible graphite paper; 200, sample to be tested. DETAILED DESCRIPTION

[0047] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0048] In the description of the present invention, it should be understood that the term "topology optimized microfluidic channel" used in the present invention refers to the flow channel designed by the pseudo three-dimensional topology optimization method. The pseudo three-dimensional topology optimization method is a type of topology optimization method. Topology optimization is an optimization design method that automatically distributes fluid-solid materials in the design domain driven by objective functions and constraints to produce the best flow channel distribution. Compared with ordinary topology optimization methods, the pseudo three-dimensional topology optimization method further considers the heat exchange between the hot fluid layer and the solid layer and the influence of thermal viscous dissipation between layers when performing topology optimization design, and has the advantages of small calculation error and high precision. The specific process of designing flow channel distribution using the pseudo three-dimensional topology optimization method belongs to the existing technology and will not be described here.

[0049] like Figures 1-8 As shown, a high heat load test target plate device 100 based on a pseudo three-dimensional topology optimization method according to an embodiment of the present invention includes a panel 1 and a heat sink assembly 2;

[0050] The heat sink assembly 2 includes a microchannel heat sink plate 21, a manifold plate 22, and an inlet and outlet plate 23 connected in sequence from front to back along the front-to-back direction; the inlet and outlet plate 23 is provided with a water inlet 231 and a water outlet 232 spaced apart from each other through its front and rear surfaces; the manifold plate 22 is provided with a water inlet channel 221 and a water outlet channel 222 spaced apart from each other, the water inlet channel 221 being in communication with the water inlet 231, and the water outlet channel 222 being in communication with the water outlet 232;

[0051] The rear surface of the microchannel heat sink plate 21 is provided with an inlet channel 211, an outlet channel 212, and a topology optimized microchannel 213; the inlet channel 211 and the outlet channel 212 are both extended along the first direction X; the inlet channel 211 is connected to the inlet channel 221, and the outlet channel 212 is connected to the outlet channel 222;

[0052] The topology optimized microchannels 213 are designed using a pseudo-three-dimensional topology optimization method and extend along the second direction Y. A plurality of topology optimized microchannels 213 are sequentially connected along the first direction X. Adjacent water inlet channels 211 and water outlet channels 212 are connected via the plurality of topology optimized microchannels 213.

[0053] A plurality of flow blocks 214 are provided in the water inlet channel 211 at intervals along the first direction X. The flow blocks 214 are in a convex arc shape on both sides in the first direction X.

[0054] The panel 1 is provided with an irradiation channel 11 running through its front and rear surfaces, and the panel 1 is connected to the front surface of the microchannel heat sink plate 21;

[0055] The front-to-back direction, the first direction X, and the second direction Y are perpendicular to each other.

[0056] Based on the above technical scheme, the sample to be tested is placed between the panel 1 and the heat sink assembly 2, the plasma beam generated by the linear plasma device used in the experiment irradiates the sample to be tested 200 through the irradiation channel 11; the cooling medium enters the inlet and outlet water plate 23 through the water inlet 231, and then enters the water inlet flow channel 211 of the micro-channel heat sink plate 21 through the water inlet channel 221 of the manifold plate 22; the cooling medium flows and diffuses to both sides along the second direction Y, and flows into the water outlet flow channel 212 through a plurality of topologically optimized micro-channels 213 designed by a pseudo three-dimensional topological optimization method; and then sequentially flows through the water outlet channel 222 in the manifold plate 22 and the water outlet 232 of the inlet and outlet water plate 23 to flow out of the heat sink assembly 2, thereby realizing the heat dissipation and cooling of the sample to be tested 200 through the flow of the cooling medium in the micro-channel heat sink plate 21; and compared with the flow channel designed by the conventional topological optimization method, the topologically optimized micro-channel 213 in the micro-channel heat sink plate 21 has more specific surface and heat exchange area, and the flow channel profile shape is relatively smooth and round, which can reduce the flow resistance to improve the hydraulic performance; thereby the cooling medium has good flow uniformity and small pressure drop loss, and the heat dissipation efficiency and effect are improved; and by spacing a plurality of flow resistance blocks 214 in the water inlet flow channel 211, the cooling medium entering the water inlet flow channel 211 can directly flow to the topologically optimized micro-channels 213 on both sides under the blocking action of the flow resistance blocks 214, and the flow stability of the cooling medium flowing to the topologically optimized micro-channels 213 is ensured under the arc-shaped arrangement on both sides of the flow resistance blocks 214; comprehensive realization of rapid and effective cooling under high heat load.

[0057] Preferably, as shown in Figure 1 and Figure 2 , in order to facilitate the introduction of the cooling medium into the heat sink assembly 2 and the export of the cooling medium from the heat sink assembly 2; the high heat load test target plate device 100 based on the pseudo three-dimensional topological optimization method further comprises an inlet and outlet water assembly 3; the inlet and outlet water assembly 3 comprises a water inlet pipe 31 and a water outlet pipe 32; the water inlet pipe 31 and the water outlet pipe 32 are both arranged along the front and rear directions; the water inlet pipe 31 is connected with the water inlet 231, and the water outlet pipe 32 is connected with the water outlet 232.

[0058] Further, as shown in Figure 5 , the topologically optimized micro-channel 213 comprises a sub-flow channel arranged along the second direction Y; the width of the sub-flow channel gradually increases from the water inlet flow channel 211 to the water outlet flow channel 212 along the second direction Y;

[0059] The connecting position of the adjacent two topologically optimized micro-channels 213 is provided with the flow resistance block 214 on the side close to the water inlet flow channel 211 in the second direction Y; the rear surface of the flow resistance block 214 is flush with the rear surface of the micro-channel heat sink plate 21.

[0060] It can be understood that the width of the sub-channel gradually increases along the second direction Y from the water inlet channel 211 to the water outlet channel 212, so that when the cooling medium flows through the topology optimized microchannel 213, the flow resistance is small, so as to ensure the flow efficiency and reduce the pressure loss of the fluid; and by setting the baffle block 214 in the water inlet channel 211 on one side of the connection position of the two adjacent topology optimized microchannels 213, and the rear surface of the baffle block 214 is flush with the rear surface of the microchannel heat sink plate 21, so as to divide the water inlet channel 211 into multiple areas, which helps to guide the cooling medium entering the water inlet channel 211 to flow toward the sub-channel, thereby ensuring the flow effect of the cooling medium.

[0061] Further, if Figure 2 and Figure 3 As shown, in order to specifically realize the correspondence between the water inlet flow channel and the water inlet channel, and the water outlet flow channel and the water outlet channel, which is beneficial to the continuous and stable flow of the cooling medium; the manifold plate 22 has multiple water inlet channels 221, and each water inlet channel 221 is provided with a water outlet channel 222 on both sides of the second direction Y; the water inlet channel 221 and the water outlet channel 222 are both extended along the first direction X;

[0062] The microchannel heat sink plate 21 is provided with the same number of water inlet channels 211 as the water inlet channels 221. The water inlet channels 211 are arranged in front of the water inlet channels 221 in a one-to-one correspondence with the water inlet channels 221 and are connected to the water inlet channels 221.

[0063] The microchannel heat sink plate 21 is further provided with the same number of water outlet channels 212 as the water outlet channels 222 . The water outlet channels 212 are arranged in front of the water outlet channels 222 in a one-to-one correspondence with the water outlet channels 222 and are communicated with the water outlet channels 222 .

[0064] Preferably, in order to facilitate the corresponding communication between the water inlet 231 and the water inlet channel 221 and the corresponding communication between the water outlet 232 and the water outlet channel 222 , the water inlet 231 and the water outlet 232 are respectively opened at both ends of the water inlet and outlet plate 23 in the first direction X.

[0065] Preferably, if Figure 6 As shown, the manifold plate 22 of this embodiment is provided with three water inlet channels 221 and four water outlet channels 222 to enhance cooling effect and efficiency. In other embodiments, different numbers of water inlet channels 221 may be provided based on specific needs and dimensions, and the number of water outlet channels 222 may be determined based on the number of water inlet channels 221.

[0066] Further, if Figure 4 andFigure 5 As shown, the width of the topology optimized microchannel 213 is 0.2-0.5 mm, and the height is 0.2-1 mm;

[0067] It should be noted that the width of the topology optimized microchannel 213 refers to the inner diameter of each branch structure of its channel; since the topology optimized microchannel 213 is opened on the rear surface of the microchannel heat sink plate 21, the height of the topology optimized microchannel 213 refers to the depth of each branch structure of the channel of the topology optimized microchannel 213 in the microchannel heat sink plate 21.

[0068] It is understandable that by limiting the width and height of the topology optimized microchannel 213 , the topology optimized microchannel 213 can be specifically opened on the rear surface of the microchannel heat sink plate 21 .

[0069] Preferably, the topology optimized microchannel 213 is manufactured by precision carving; in some other embodiments, the microchannel heat sink plate 21 is directly manufactured by 3D printing.

[0070] Preferably, the thickness of the microchannel heat sink plate 21 is 2-4 mm to facilitate processing and production; the microchannel heat sink plate 21 is made of oxygen-free copper to have a better thermal conductivity.

[0071] Furthermore, if Figure 3 As shown, in the second direction Y, the size of the water inlet channel 221 is smaller than the size of the water inlet channel 211 .

[0072] It can be understood that since the setting of the baffle 214 divides the water inlet channel 211 into multiple areas, this will reduce the channel diameter, increase the flow rate of the cooling medium, and improve the cooling efficiency; in the second direction Y, the size of the water inlet channel 221 is smaller than the size of the water inlet channel 211, so that in the second direction Y, when the cooling medium diffuses to both sides, the diameter of the water inlet channel through which it flows gradually increases, so as to reduce the flow rate of the cooling medium and guide the cooling medium to flow smoothly through the topology optimized microchannel 213 to ensure the cooling effect.

[0073] Furthermore, if Figure 6 As shown, in order to specifically realize the communication between the water inlet 231 and the water inlet channel 221, and the communication between the water outlet 232 and the water outlet channel 222; the rear surface of the manifold plate 22 is alternately provided with first water inlet grooves 2211 and first water outlet grooves 2221 extending in the first direction X, and each first water inlet groove 2211 is provided with a first water outlet groove 2221 on both sides in the second direction Y;

[0074] The first water inlet groove 2211 is provided with a water inlet through hole 2212 in the groove bottom, which penetrates the front surface of the manifold plate 22; the first water outlet groove 2221 is provided with a water outlet through hole 2222 in the groove bottom, which penetrates the front surface of the manifold plate 22;

[0075] The first end of the first water inlet groove 2211 and the first water outlet groove 2221 near the water inlet 231 is defined as the first end, and the end near the water outlet 232 is defined as the second end;

[0076] The manifold plate 22 is provided with a second water inlet groove 2213 on one side of the first end of the first water inlet groove 2211, which is aligned and communicated with the water inlet 231; the first end of the plurality of first water inlet grooves 2211 is communicated with the second water inlet groove 2213; the second water inlet groove 2213, the first water inlet groove 2211 and the water inlet through hole 2212 are sequentially communicated to form the water inlet channel 221;

[0077] The manifold plate 22 is provided with a second water outlet groove 2223 on one side of the second end of the first water outlet groove 2221, which is aligned and communicated with the water outlet 232; the second end of the plurality of first water outlet grooves 2221 is communicated with the second water outlet groove 2223; the second water outlet groove 2223, the first water outlet groove 2221 and the water outlet through hole 2222 are sequentially communicated to form the water outlet channel 222.

[0078] It can be understood that, since the water inlet 231 and the water outlet 232 are respectively arranged at the two ends of the water inlet and outlet plate 23 in the first direction; and the water inlet channel 221 and the water outlet channel 222 are arranged along the first direction X and usually arranged in multiple, in order to make the water inlet 231 and the plurality of water inlet channels 221 communicated, the second water inlet groove 2213 and the plurality of first water inlet grooves 2211 are arranged to be communicated, and the first water inlet grooves 2211 are communicated to the water inlet flow channel 211 through the water inlet through hole 2212, so that the second water inlet groove 2213, the first water inlet groove 2211 and the water inlet through hole 2212 are sequentially communicated to form the water inlet channel 221. Similarly, in order to make the water outlet 232 and the plurality of water outlet channels 222 communicated, the second water outlet groove 2223 and the plurality of first water outlet grooves 2221 are arranged to be communicated, and the first water outlet grooves 2221 are communicated with the water outlet flow channel 212 through the water outlet through hole 2222, so that the second water outlet groove 2223, the first water outlet groove 2221 and the water outlet through hole 2222 are sequentially communicated to form the water outlet channel 222.

[0079] Preferably, the size of the first water inlet groove 2211 and the first water outlet groove 2221 in the first direction X can be set to 24 mm, and the size in the second direction Y can be set to 1~3 mm; so as to realize the specific processing and production of the first water inlet groove 2211 and the first water outlet groove 2221.

[0080] Preferably, the thickness of the manifold plate 22 is 6 mm to facilitate processing and production; the manifold plate 22 is made of oxygen-free copper to have a better thermal conductivity.

[0081] Furthermore, if Figure 1 As shown, in order to connect the panel 1 and the heat sink assembly 2, the high heat load test target plate device 100 based on the pseudo three-dimensional topology optimization method also includes a connecting component 4, and the connecting component 4 includes a bolt 41 and a nut 42; the panel 1, the microchannel heat sink plate 21, the manifold plate 22 and the inlet and outlet water plate 23 are all provided with a plurality of connecting through holes running through the front and rear surfaces thereof; the bolt 41 sequentially penetrates the connecting through holes of the panel 1, the microchannel heat sink plate 21, the manifold plate 22 and the inlet and outlet water plate 23 and is screwed with the nut 42 to lock the panel 1 and the heat sink assembly 2.

[0082] Preferably, the thickness of the water inlet and outlet plates 23 is 5 mm to facilitate processing and production; the water inlet and outlet plates 23 are made of oxygen-free copper to have better thermal conductivity.

[0083] Preferably, the diameters of the water inlet 231 and the water outlet 232 are both 8 mm, and the outer diameters of the water inlet pipe 31 and the water outlet pipe 32 are 8 mm, so as to correspond to the water inlet 231 and the water outlet 232; the inner diameters of the water inlet pipe 31 and the water outlet pipe 32 are 5 mm, and they are both made of 316L stainless steel to improve their service life.

[0084] Preferably, the water inlet pipe 31 and the water outlet pipe 32 are correspondingly welded to the water inlet 231 and the water outlet 232 of the water inlet and outlet plate 23 by vacuum brazing.

[0085] Furthermore, if Figure 7 As shown, the rear surface of the panel 1 is provided with a placement slot 12, which is connected to the irradiation channel 11, so that the sample 200 to be tested can be placed through the placement slot 12. The cross-section of the irradiation channel 11 is circular. Since the plasma beam generated by the linear plasma device is circular, the circular irradiation channel 11 is more suitable for material irradiation testing. The cross-section of the placement slot 12 is square, so that it can easily accommodate samples 200 of conventional shapes to be tested.

[0086] The placement groove 12 is arranged concentrically with the irradiation channel 11, and the side length of the placement groove 12 is greater than or equal to the diameter of the irradiation channel 11; so as to ensure that the plasma beam generated by the linear plasma device can effectively act on the sample 200 to be tested.

[0087] Further, as shown in the figure, the flexible graphite paper 5 is arranged between the panel 1 and the micro-channel heat sink plate 21; so as to reduce the radial temperature gradient of the sample 200 to be tested under high-density plasma beam irradiation, so that the temperature distribution of the sample 200 to be tested is more uniform. Figure 1

[0088] Further, as shown in the figure, the flexible graphite paper 5 is arranged between the panel 1 and the micro-channel heat sink plate 21; so as to reduce the radial temperature gradient of the sample 200 to be tested under high-density plasma beam irradiation, so that the temperature distribution of the sample 200 to be tested is more uniform. Figure 1

[0089] Further, in order to avoid leakage of the cooling medium from the front and rear surfaces of the manifold plate 22; the front and rear surfaces of the manifold plate 22 are respectively welded with the micro-channel heat sink plate 21 and the water inlet and outlet plate 23.

[0090] Further, in order to realize the selection of the welding method; the welding is explosion welding, hot isostatic pressing welding or vacuum brazing.

[0091] Preferably, the panel 1 and the bolt 41 are both made of molybdenum, so that they can directly face the irradiation of the plasma; molybdenum is a high-temperature-resistant material with low sputtering rate, and has good machining performance, which is convenient for processing and manufacturing various parts.

[0092] The working process of the application is: the cooling medium enters the heat sink assembly 2 from the water inlet pipe 31, and then flows through the water inlet port 231 of the water inlet and outlet plate 23 and the second water inlet groove 2213, the first water inlet groove 2211 and the water inlet through hole 2212 in the manifold plate 22 into the water inlet flow channel 211; and then diffuses to both sides along the second direction Y, and flows through the topologically optimized micro-channel 213 to enter the water outlet flow channel 212. The cooling medium then flows through the water outlet through hole 2222, the first water outlet groove 2221 and the second water outlet groove 2223 in the manifold plate 22 and the water outlet port 232 of the water inlet and outlet plate 23 in turn and flows out, and finally flows out from the water outlet pipe 32.

[0093] The high-heat-load test target plate device 100 based on the pseudo three-dimensional topological optimization method is simulated by software ANSYSfluent 2022R1, the cooling water inlet flow is set to 4L / min, and the water temperature is set to 20℃. The material of the sample 200 to be tested is tungsten, and a power density of 10MW / m 2 ​​The Gaussian heat load is used to simulate the plasma beam generated by the linear device to bombard the sample 200. The simulation results are shown in Figures 9-11 As shown in the figure, the maximum temperature of the surface of the sample 200 is 739.0℃, which is lower than the recrystallization temperature 1200℃, the maximum flow rate in the microchannel reaches 4.9m / s, the flow rate distribution is relatively uniform, and the overall pressure drop is kept below 36000Pa, which is relatively small.

[0094] In summary, the high heat load test target plate device 100 based on the pseudo three-dimensional topological optimization method provided by the embodiment of the application includes a panel 1 and a heat sink assembly 2. The sample to be tested is placed between the panel 1 and the heat sink assembly 2. The plasma beam generated by the linear plasma device used in the experiment irradiates the sample 200 through the irradiation channel 11. The cooling medium enters the water inlet 231, then enters the water inlet flow channel 211 of the microchannel heat sink plate 21 through the water inlet channel 221 of the manifold plate 22, and then flows to the water outlet flow channel 212 along the second direction Y and through the topologically optimized microflow channel 213 designed by the pseudo three-dimensional topological optimization method. Then, the cooling medium flows through the water outlet channel 222 in the manifold plate 22 and the water outlet 232 in the water inlet and outlet plate 23 in sequence, and then flows out of the heat sink assembly 2. In this way, the cooling of the sample 200 to be tested is realized by the flow of the cooling medium in the microchannel heat sink plate 21. The topologically optimized microflow channel 213 in the microchannel heat sink plate 21 has more specific surface area and heat exchange area, and the flow channel profile is relatively smooth and round, which can reduce the flow resistance and improve the hydraulic performance. Therefore, the cooling medium has good flow uniformity and small pressure drop loss, thereby improving the heat dissipation efficiency and effect. In addition, the cooling medium entering the water inlet flow channel 211 can directly flow to the topologically optimized microflow channel 213 on both sides under the blocking action of the flow resistance block 214, and the flow stability of the cooling medium flowing to the topologically optimized microflow channel 213 is ensured under the action of the arc-shaped arrangement on both sides of the flow resistance block 214. Comprehensive realization of rapid and effective cooling under high heat load.

[0095] The above only describes the preferred embodiments of the application. It should be noted that those skilled in the art can make some improvements and replacements without departing from the technical principles of the application, and these improvements and replacements should also be considered as the protection scope of the application.

Claims

1. A high heat load test target plate device based on pseudo three-dimensional topology optimization method, characterized in that: Includes panel and heat sink assembly; The heat sink assembly includes a microchannel heat sink plate, a manifold plate, and an inlet and outlet plate connected in sequence from front to back along the front-to-back direction; the inlet and outlet plates are provided with water inlets and outlets running through the front and rear surfaces thereof at intervals; the manifold plate is provided with water inlet channels and water outlet channels at intervals, the water inlet channels are connected to the water inlet, and the water outlet channels are connected to the water outlet; The rear surface of the microchannel heat sink plate is provided with an inlet channel, an outlet channel and a topology optimized microchannel; the inlet channel and the outlet channel are both extended along a first direction; the inlet channel is connected to the inlet channel, and the outlet channel is connected to the outlet channel; The topology optimized microchannel is designed by a pseudo three-dimensional topology optimization method and extends along the second direction, and the multiple topology optimized microchannels are sequentially connected along the first direction; adjacent water inlet channels and water outlet channels are connected through the multiple topology optimized microchannels; A plurality of flow blocks are provided in the water inlet channel at intervals along a first direction, and the flow blocks are in a convex arc shape on both sides in the first direction; The panel is provided with an irradiation channel running through its front and rear surfaces, and the panel is connected to the front surface of the microchannel heat sink plate; The topology optimized microchannel includes a subchannel extending along the second direction; the width of the subchannel gradually increases from the water inlet channel to the water outlet channel along the second direction; The blocking block is provided at a connection position of two adjacent topology-optimized microchannels on a side close to the water inlet channel in the second direction; The rear surface of the baffle is flush with the rear surface of the microchannel heat sink plate The front-to-back direction, the first direction and the second direction are perpendicular to each other.

2. The high heat load test target plate device based on the pseudo three-dimensional topology optimization method according to claim 1, characterized in that: The manifold plate has a plurality of water inlet channels, and each water inlet channel is provided with a water outlet channel on both sides of the second direction; the water inlet channel and the water outlet channel are both extended along the first direction; The microchannel heat sink plate is provided with water inlet channels having the same number as the water inlet channels, and the water inlet channels are arranged in front of the water inlet channels in a one-to-one correspondence with the water inlet channels and are connected to the water inlet channels; The microchannel heat sink plate is further provided with water outlet channels of the same number as the water outlet channels. The water outlet channels are arranged in front of the water outlet channels in a one-to-one correspondence with the water outlet channels and are communicated with the water outlet channels.

3. The high heat load test target plate device based on the pseudo three-dimensional topology optimization method according to claim 2, characterized in that: The rear surface of the manifold plate is alternately provided with first water inlet grooves and first water outlet grooves extending in the first direction, and each first water inlet groove is provided with a first water outlet groove on both sides in the second direction; A water inlet through-hole is formed at the bottom of the first water inlet trough, and the water inlet through-hole passes through the front surface of the manifold plate; a water outlet through-hole is formed at the bottom of the first water outlet trough, and the water outlet through-hole passes through the front surface of the manifold plate; Define the first water inlet and the first water outlet as the first end, the end close to the water inlet, and the end close to the water outlet; The manifold plate is provided with a second water inlet groove on one side of the first end of the first water inlet groove, the second water inlet groove is aligned with and connected to the water inlet; the first ends of the plurality of first water inlet grooves are all connected to the second water inlet groove; the second water inlet groove, the first water inlet groove and the water inlet through hole are sequentially connected to form the water inlet channel; The manifold plate is provided with a second water outlet groove on one side of the second end of the first water outlet groove, and the second water outlet groove is aligned with and connected to the water outlet; the second ends of multiple first water outlet grooves are all connected to the second water outlet groove; the second water outlet groove, the first water outlet groove and the water outlet through hole are connected in sequence to form the water outlet channel.

4. The high heat load test target plate device based on the pseudo three-dimensional topology optimization method according to claim 1, characterized in that: Also included is a connecting assembly, the connecting assembly including a bolt and a nut; The panel, microchannel heat sink plate, manifold plate and water inlet and outlet plates are all provided with a plurality of connecting through holes penetrating the front and rear surfaces thereof; The bolts are sequentially passed through the connecting holes of the panel, microchannel heat sink plate, manifold plate and water inlet and outlet plates and are screwed with nuts to lock the panel and heat sink assembly.

5. The high heat load test target plate device based on the pseudo three-dimensional topology optimization method according to claim 1, characterized in that: A placement groove is provided on the rear surface of the panel, and the placement groove is communicated with the irradiation channel; The cross-section of the irradiation channel is circular, and the cross-section of the placement slot is square; The placement groove is concentrically arranged with the irradiation channel, and the side length of the placement groove is greater than or equal to the diameter of the irradiation channel.

6. The high heat load test target plate device based on the pseudo three-dimensional topology optimization method according to claim 1, characterized in that: Flexible graphite paper is provided between the panel and the microchannel heat sink plate.

7. The high heat load test target plate device based on the pseudo three-dimensional topology optimization method according to claim 6, characterized in that: The thickness of the flexible graphite paper is 0.02-0.2 mm.

8. The high heat load test target plate device based on the pseudo three-dimensional topology optimization method according to claim 1, characterized in that: The front and rear surfaces of the manifold plate are respectively welded to the microchannel heat sink plate and the inlet and outlet water plates.

9. The high heat load test target plate device based on the pseudo three-dimensional topology optimization method according to claim 8, characterized in that: The welding is explosion welding, hot isostatic pressing welding or vacuum brazing.

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