Precise control device for coating thickness of semiconductor core part
By using a single drive source and synchronous belt transmission in the semiconductor core components coating device, combined with electromagnetic clutch and servo motor control, the high cost and synchronization problems of existing devices are solved, the stability and accuracy of coating are achieved, and the operation convenience and automation are improved.
Patent Information
- Application Number
- CN202510599132.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-10
- Publication Date
- 2025-08-08
AI Technical Summary
The existing semiconductor core components coating devices perform coating operations through multiple driving sources, resulting in high costs, high energy consumption, and difficulty in maintaining synchronization of the drive motor, which easily leads to offset or drop of parts.
The first dual-axis motor is used as a single driving source, combined with the first and second electromagnetic clutches, and the clamp is fixed and loosened, and the synchronous rotation of the clamp is driven by the synchronous belt. In combination with the precise control of the servo motor driving the coating nozzle, the thickness sensor and the PLC controller are used to realize real-time monitoring and adjustment of the coating thickness.
It reduces the cost and energy consumption of the device, ensures the synchronization and stability of the coating process, improves the coating quality and accuracy, and increases the convenience of operation and automation.
Smart Images

Figure CN120438181A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of coating equipment, and in particular to a device for precisely controlling the coating thickness of semiconductor core components. Background Art
[0002] In the semiconductor manufacturing process, coating of core components is one of the key processes. It is a process that uses physical or chemical methods to form a layer of metal or other material coating on the surface of an object. Through plating, the performance of the object surface can be improved, such as improving corrosion resistance, wear resistance, conductivity, decorativeness, etc. The precise control of the coating thickness directly affects the performance and quality of semiconductor devices.
[0003] For example, the description of a semiconductor production coating device with Chinese Publication No. CN222219978U states, "The present utility model discloses a semiconductor production coating device, comprising a support plate, the upper surface of which is fixedly connected to a box, the interior of which is provided with a fixing plate, the upper surface of which is fixedly connected to symmetrical fixing blocks and a double-headed motor, respectively, the adjacent side surfaces of each fixing block being fixedly embedded with a first bearing, the upper surface of the fixing plate being provided with two sets of symmetrical slideways, the adjacent side surfaces of each connecting plate being fixedly embedded with a second bearing, the inner ring of each second bearing being fixedly connected to a rotating rod."
[0004] However, the existing device has the following shortcomings during use:
[0005] The existing device uses a screw to enable the two output ends of the double-headed motor to drive the clamping plate and the connecting plate to move through the rotation of the screw, so that the two clamping plates can clamp and fix the semiconductor. Through the rotating rod, the output ends of the two drive motors drive the two clamping plates to rotate simultaneously through the rotating rod, so that the two rotating clamping plates drive the semiconductor to rotate, which is convenient for the staff to coat the two sides of the semiconductor. However, the coating operation on both sides of the semiconductor by multiple drive sources such as the double-headed motor and the two drive motors increases the cost of the device and energy consumption, and it is difficult for the two drive motors to maintain synchronous rotation. When one of the drive motors fails, it will cause the rotation speeds of the two sides of the semiconductor to be inconsistent, so that the semiconductor is unevenly stressed during rotation, which can easily cause the semiconductor to shift or even fall.
[0006] Therefore, we proposed a device for precisely controlling the coating thickness of semiconductor core components in order to solve the above-mentioned problems. Summary of the Invention
[0007] The purpose of the present invention is to provide a device for precisely controlling the coating thickness of semiconductor core components. The device uses a first dual-axis motor as a single driving source and utilizes the cooperation of a first electromagnetic clutch and a second electromagnetic clutch. When the first electromagnetic clutch is connected, the first dual-axis motor drives the bidirectional threaded rod to rotate, so that the two movable plates move toward or away from each other under the action of the bidirectional threaded rod and the guide rod, thereby driving the two clamping plates to move closer or farther away, thereby achieving the fixation and loosening of the semiconductor core components; when the second electromagnetic clutch is connected, the first dual-axis motor drives the two rotating rods to rotate synchronously through the first sliding rod, the first synchronous belt, the second synchronous belt and the third synchronous belt, thereby causing the clamping plate to drive the semiconductor core components to rotate and turn over, so as to solve the problems raised by the above-mentioned background technology.
[0008] To achieve the above-mentioned object, the present invention provides the following technical solution: a device for precisely controlling the coating thickness of a semiconductor core component, comprising a bracket, a box body mounted on the top of the bracket, an automatic door opening and discharging mechanism provided on the inner side of the box body, and a component fixing and turning mechanism provided on the automatic door opening and discharging mechanism;
[0009] The component fixing and flipping mechanism includes a fixed platform, four fixed plates, a bidirectional threaded rod, a guide rod, two movable plates, two rotating rods, two clamping plates, a first dual-axis motor, a first electromagnetic clutch, a support plate, a first slide rod, a first synchronous belt, a second synchronous belt, a second electromagnetic clutch, and a third synchronous belt. The first motor shaft of the first dual-axis motor movably passes through one of the fixed plates and is connected to the smooth end of the bidirectional threaded rod through the first electromagnetic clutch. A rotating sleeve is rotatably installed on one side of one of the movable plates, and a second slide rod is rotatably installed on one side of the other movable plate. The second slide rod and the outer surface of the first slide rod are fixedly connected to a limiting block. The first slide rod, the second slide rod and the limiting block are all slidably connected to the inner side of the rotating sleeve. One of the rotating rods is fixedly sleeved with two second rotating wheels on the outer surface of the rotating sleeve, and the other rotating rod is fixedly sleeved with two first rotating wheels on the outer surface of the second slide rod. The second motor shaft of the first dual-axis motor is connected to the input end of the second electromagnetic clutch, and the output end of the second electromagnetic clutch is connected to one end of the first slide rod with two third rotating wheels.
[0010] Preferably, two through slots are provided on the top of the fixed platform, the four fixed plates are fixedly connected to the bottom of the fixed platform, the bidirectional threaded rod is rotatably connected between two of the fixed plates, the guide rod is fixedly connected between the other two fixed plates, the two movable plates are threadedly installed on the outer surfaces of the bidirectional threaded rod and the guide rod, and the two movable plates are movable through the two through slots, and the two rotating rods are rotatably installed on one side of the two movable plates.
[0011] Preferably, the two clamping plates are fixedly connected to one end of the two rotating rods, the first dual-axis motor is fixedly installed on one side of one of the fixed plates, the first electromagnetic clutch and the second electromagnetic clutch are respectively installed on the bottom of the fixed platform, the support plate is fixedly connected to the top of the fixed platform, the first sliding rod is rotatably installed on one side of the support plate, the second synchronous belt drive is connected to the outer surfaces of the two second rotating wheels, the first synchronous belt drive is connected to the outer surfaces of the two first rotating wheels, and the third synchronous belt drive is connected to the outer surfaces of the two third rotating wheels.
[0012] Preferably, the automatic door opening and discharging mechanism includes two box doors, the two box doors are hinged to one side of the box body, two grooves are provided on one side of the two box doors, two fixing rods are fixedly connected in the two grooves, the outer surfaces of the two fixing rods are sleeved with two first slides, two sliding grooves are provided on the inner side of the box body, two second slides are slidably connected in the two sliding grooves, and two connecting rods are hinged between the two first slides and the two second slides.
[0013] Preferably, a fixed shell is fixedly connected between the two second slides, a second dual-axis motor is fixedly installed on the inner side of the fixed shell, two motor shafts of the second dual-axis motor are fixedly connected to two drive shafts, one end of the two drive shafts is rotatably connected to the fixed shell, two gears are fixedly sleeved on the outer surfaces of the two drive shafts, and two racks are installed on the inner side of the box.
[0014] Preferably, the two racks are meshed with two gears, two guide rails are installed on the inner side of the box body, two moving blocks are slidably connected to the two guide rails, and the bottoms of the two moving blocks are fixedly connected to the tops of the two second slides, the fixed platform is fixedly connected between the two moving blocks, and two visual windows are provided on the two box doors.
[0015] Preferably, a coating thickness precision control mechanism is provided on the inner side of the bracket, and the coating thickness precision control mechanism includes a mounting frame, the mounting frame is fixedly connected to the inner side of the box, the inner side of the mounting frame is rotatably connected to a one-way threaded rod, the inner side of the mounting frame is provided with a guide groove, the outer surface of the one-way threaded rod is threadedly mounted with a lifting frame, and the lifting frame moves through the guide groove.
[0016] Preferably, a coating nozzle is installed at the bottom of the lifting frame, a pump body is installed on the top of the box body, the output end of the pump body is fixedly connected to a delivery hard pipe, and the end of the delivery hard pipe away from the pump body is movable through the box body and fixedly connected to a telescopic tube.
[0017] Preferably, the end of the telescopic tube away from the conveying rigid tube is movable through the lifting frame and is connected with the interior of the coating nozzle, an electromagnetic regulating valve is installed on the conveying rigid tube, a plurality of thickness sensors are installed on the inner top of the box body, a servo motor is fixedly installed on the top of the mounting frame, and the output end of the servo motor is movable through the mounting frame and is fixedly connected to the smooth end of the one-way threaded rod.
[0018] Preferably, a coating liquid recovery mechanism is provided at the bottom of the box body, and the coating liquid recovery mechanism includes a recovery box, which is installed at the bottom of the box body. The bottom of the recovery box is fixedly connected to a drain pipe, and a control valve is installed on the drain pipe. A PLC controller is installed on one side of the box body, and the wiring terminal of the PLC controller is connected to the wiring port in the device.
[0019] Compared with the prior art, the present invention has the following beneficial effects:
[0020] 1. The present invention adopts a component fixing and flipping mechanism, sets a first dual-axis motor as a single driving source, and utilizes the cooperation of the first electromagnetic clutch and the second electromagnetic clutch. When the first electromagnetic clutch is connected, the first dual-axis motor drives the bidirectional threaded rod to rotate, so that the two movable plates move toward or away from each other under the action of the bidirectional threaded rod and the guide rod, thereby driving the two clamping plates to move closer or farther away, thereby achieving the fixation and loosening of the semiconductor core components; when the second electromagnetic clutch is connected, the first dual-axis motor drives the two rotating rods to rotate synchronously through the first sliding rod, the first synchronous belt, the second synchronous belt and the third synchronous belt, and then the clamping plates drive the semiconductor core components to rotate and flip over, thereby facilitating the coating operation thereon, solving the problem that the existing device uses multiple driving sources such as a double-headed motor and two driving motors, which increases the device cost and energy consumption, and the two driving motors are difficult to maintain synchronous rotation. When one of the driving motors fails, it is easy to cause the semiconductor to shift or even fall off.
[0021] 2. The present invention sets up a precise control mechanism for the coating thickness. The servo motor drives the one-way threaded rod to rotate, driving the lifting frame to rise and fall in the guide groove, and then adjusting the height of the coating nozzle. The coating position can be precisely controlled according to actual needs. When the coating nozzle starts to coat the semiconductor core components, the thickness sensor is located directly above the semiconductor core components to facilitate continuous real-time monitoring of the coating thickness, and feeds back the data to the PLC controller. The PLC controller controls the opening of the electromagnetic regulating valve and adjusts the flow rate of the coating liquid to achieve precise control of the coating thickness, thereby improving the quality and accuracy of the coating of the semiconductor core components.
[0022] 3. The present invention sets an automatic door opening and discharging mechanism. The second dual-axis motor drives the two drive shafts to rotate, causing the two gears to rotate and engage with the rack, thereby driving the fixed shell and the second slide and moving block connected thereto to slide synchronously. Through the transmission of the connecting rod, the two box doors are automatically opened and closed, and the component fixing and flipping mechanism is extended from and entered into the box body, which is convenient for placing and removing semiconductor core components, thereby improving the convenience and automation of operation. At the same time, the setting of the viewing window makes it easy to observe the situation inside the box body. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 This is a three-dimensional diagram of the main structure of a device for accurately controlling the thickness of a semiconductor core component coating according to the present invention;
[0024] Figure 2 This is a left-side structural perspective diagram of a device for precisely controlling the thickness of a semiconductor core component coating according to the present invention;
[0025] Figure 3 This is a bottom structural perspective view of a device for precisely controlling the thickness of a semiconductor core component coating according to the present invention;
[0026] Figure 4 This is a perspective view of the expanded structure of the box door and box body in a device for accurately controlling the thickness of the coating film of a semiconductor core component of the present invention;
[0027] Figure 5 This is a structural stereogram of a telescopic tube in a device for precisely controlling the thickness of a semiconductor core component coating according to the present invention;
[0028] Figure 6 This is a structural stereogram of a fixing platform in a device for accurately controlling the thickness of a semiconductor core component coating according to the present invention;
[0029] Figure 7 This is a structural stereogram of a limit block in a device for precisely controlling the thickness of a semiconductor core component coating according to the present invention;
[0030] Figure 8 This is a structural stereogram of a bidirectional threaded rod in a device for precisely controlling the thickness of a semiconductor core component coating according to the present invention;
[0031] Figure 9 This is a partial cross-sectional structural perspective diagram of a box in a device for accurately controlling the thickness of a semiconductor core component coating according to the present invention;
[0032] Figure 10 This is a partial structural perspective diagram of a chamber door in a device for accurately controlling the thickness of a semiconductor core component coating according to the present invention;
[0033] Figure 11This is a partial structural stereogram of a fixed shell in a device for precisely controlling the thickness of coating films on semiconductor core components according to the present invention.
[0034] In the figure: 1. bracket; 2. box body; 3. automatic door opening and unloading mechanism; 301. box door; 302. groove; 303. fixed rod; 304. first slide; 305. slide groove; 306. second slide; 307. connecting rod; 308. fixed shell; 309. second double-axis motor; 310. drive shaft; 311. gear; 312. rack; 313. guide rail; 314. moving block; 315. viewing window; 4. component fixing and turning mechanism; 401. fixed table; 402. through groove; 403. fixed plate; 404. two-way threaded rod; 405. guide rod; 406. moving plate; 407. rotating rod; 408. clamping plate; 409. first double-axis motor; 410. first electromagnetic clutch; 411. support plate; 412. First slide bar; 413, rotating sleeve; 414, second slide bar; 415, limit block; 416, first rotating wheel; 417, second rotating wheel; 418, first synchronous belt; 419, second synchronous belt; 420, second electromagnetic clutch; 421, third rotating wheel; 422, third synchronous belt; 5. Coating thickness precision control mechanism; 501, mounting frame; 502, one-way threaded rod; 503, guide groove; 504, lifting frame; 505, coating nozzle; 506, pump body; 507, conveying hard pipe; 508, telescopic pipe; 509, electromagnetic regulating valve; 510, thickness sensor; 511, servo motor; 6. Coating liquid recovery mechanism; 601, recovery box; 602, drain pipe; 603, control valve; 7, PLC controller. DETAILED DESCRIPTION
[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.
[0036] like Figures 1-11 As shown, the present invention provides a technical solution: a device for accurately controlling the coating thickness of a semiconductor core component, comprising a bracket 1, a box 2 is mounted on the top of the bracket 1, an automatic door opening and discharging mechanism 3 is provided on the inner side of the box 2, and a component fixing and turning mechanism 4 is provided on the automatic door opening and discharging mechanism 3;
[0037] The component fixing and turning mechanism 4 includes a fixed platform 401, four fixed plates 403, a bidirectional threaded rod 404, a guide rod 405, two movable plates 406, two rotating rods 407, two clamping plates 408, a first dual-axis motor 409, a first electromagnetic clutch 410, a support plate 411, a first sliding rod 412, a first synchronous belt 418, a second synchronous belt 419, a second electromagnetic clutch 420, and a third synchronous belt 422. The first motor shaft of the first dual-axis motor 409 is movable through one of the fixed plates 403 and is connected to the smooth end of the bidirectional threaded rod 404 through the first electromagnetic clutch 410. A rotating sleeve 413 is rotatably installed on one side of one of the movable plates 406, and the other A second slide bar 414 is rotatably installed on one side of the movable plate 406, and the outer surfaces of the second slide bar 414 and the first slide bar 412 are fixedly connected to the limiting block 415. The first slide bar 412, the second slide bar 414 and the limiting block 415 are all slidably connected to the inner side of the rotating sleeve 413. One of the rotating rods 407 is fixedly sleeved with two second rotating wheels 417 on the outer surface of the rotating sleeve 413, and the other rotating rod 407 is fixedly sleeved with two first rotating wheels 416 on the outer surface of the second slide bar 414. The second motor shaft of the first dual-axis motor 409 is connected to the input end of the second electromagnetic clutch 420, and the output end of the second electromagnetic clutch 420 is connected to one end of the first slide bar 412 with two third rotating wheels 421.
[0038] like Figure 6 、 Figure 7 and Figure 8 As shown, the top of the fixed platform 401 is provided with two through slots 402, four fixed plates 403 are fixedly connected to the bottom of the fixed platform 401, a two-way threaded rod 404 is rotatably connected between two of the fixed plates 403, a guide rod 405 is fixedly connected between the other two fixed plates 403, two movable plates 406 are threadedly installed on the outer surfaces of the two-way threaded rod 404 and the guide rod 405, and the two movable plates 406 are movable through the two through slots 402, and two rotating rods 407 are rotatably installed on one side of the two movable plates 406. The arrangement of the through slots 402 provides space for the movement of the movable plates 406, ensuring that the movable plates 406 can move freely. The movable plate 406 can move smoothly under the action of the bidirectional threaded rod 404 and the guide rod 405; the rotational connection between the bidirectional threaded rod 404 and the fixed plate 403, the fixed connection between the guide rod 405 and the fixed plate 403, and the cooperation between the movable plate 406 and the bidirectional threaded rod 404 and the guide rod 405 form a stable transmission structure, ensuring that the two movable plates 406 can remain parallel when moving toward or away from each other, so that the two clamping plates 408 can evenly clamp or release the semiconductor core components, effectively avoiding damage or offset problems of components caused by uneven clamping force, and improving the stability of component fixation.
[0039] like Figure 6 、 Figure 7and Figure 8 As shown, the two clamping plates 408 are fixedly connected to one end of the two rotating rods 407, the first dual-axis motor 409 is fixedly installed on one side of one of the fixed plates 403, the first electromagnetic clutch 410 and the second electromagnetic clutch 420 are respectively installed on the bottom of the fixed platform 401, the support plate 411 is fixedly connected to the top of the fixed platform 401, the first slide bar 412 is rotatably installed on one side of the support plate 411, the second synchronous belt 419 is transmission-connected to the outer surfaces of the two second rotating wheels 417, the first synchronous belt 418 is transmission-connected to the outer surfaces of the two first rotating wheels 416, and the third synchronous belt 422 is transmission-connected to the outer surfaces of the two third rotating wheels 421. The first synchronous belt 418, the second synchronous belt 419 and the third synchronous belt 422 are all toothed synchronous belts, which are connected to the first rotating wheel 416 and the second rotating wheel through teeth. The teeth on 417 and the third rotating wheel 421 are engaged with each other to transmit motion and power, which can achieve a precise transmission ratio. The fixed connection between the splint 408 and the rotating rod 407 can stably drive the splint 408 and the semiconductor core components to rotate when the rotating rod 407 rotates, ensuring the continuity of the rotation of the components during the coating operation. The support plate 411 supports and positions the first slide bar 412, ensuring the stability of the first slide bar 412 when rotating, and thus ensuring the accuracy of the transmission of the first synchronous belt 418, the second synchronous belt 419 and the third synchronous belt 422; the setting of the synchronous belt realizes the transmission of power, which can ensure the synchronous rotation of the two rotating rods 407, so that the semiconductor core components are evenly stressed during the rotation and flipping process, avoiding the problem of uneven coating caused by inconsistent rotation speed, and effectively improving the coating quality.
[0040] like Figure 9 and Figure 10 As shown, the automatic door opening and discharging mechanism 3 includes two box doors 301, the two box doors 301 are hinged to one side of the box body 2, two grooves 302 are provided on one side of the two box doors 301, two fixing rods 303 are fixedly connected in the two grooves 302, the outer surfaces of the two fixing rods 303 are sleeved with two first slides 304, the inner side of the box body 2 is provided with two slide grooves 305, two second slides 306 are slidably connected in the two slide grooves 305, two connecting rods 307 are hinged between the two first slides 304 and the two second slides 306, and the box doors 301 and the box body 2 are connected. The hinged method provides a flexible rotation structure for the opening and closing of the box door 301; the cooperation of the groove 302, the fixed rod 303, the first slide 304, the slide groove 305, the second slide 306 and the connecting rod 307 constitute a stable transmission connection structure. When the second slide 306 slides in the slide groove 305, it can drive the first slide 304 to slide on the fixed rod 303 through the connecting rod 307, thereby realizing the synchronous opening and closing of the two box doors 301, ensuring the consistency and stability of the opening and closing actions of the box doors 301, and facilitating the operator to accurately place and remove semiconductor core components.
[0041] like Figure 9 and Figure 11 As shown, a fixed shell 308 is fixedly connected between the two second slides 306, and a second dual-axis motor 309 is fixedly installed on the inner side of the fixed shell 308. The two motor shafts of the second dual-axis motor 309 are fixedly connected to two drive shafts 310. One end of the two drive shafts 310 is rotatably connected to the fixed shell 308. Two gears 311 are fixedly sleeved on the outer surfaces of the two drive shafts 310. Two racks 312 are installed on the inner side of the box body 2. The fixed shell 308 provides a stable connection for the second dual-axis motor 309, the drive shaft 310 and the gear 311. The carrier is installed to protect the internal components from external interference and damage; the second dual-axis motor 309 drives the gear 311 to rotate through the drive shaft 310, and uses the dual-axis synchronous drive method to provide stable and synchronous power output for the two gears 311, ensuring that the speed of the two gears 311 is consistent; the drive shaft 310 is rotatably connected to the fixed shell 308, which reduces the friction resistance during the rotation process, makes the gear 311 rotate more smoothly, and improves the transmission efficiency of the entire automatic door opening and discharging mechanism 3, ensuring that the box door 301 can complete the opening and closing action quickly and stably.
[0042] like Figure 9 、 Figure 10 and Figure 11 As shown, two racks 312 are meshed with two gears 311, two guide rails 313 are installed on the inner side of the box body 2, two moving blocks 314 are slidably connected to the two guide rails 313, and the bottoms of the two moving blocks 314 are fixedly connected to the tops of the two second slides 306, and the fixed platform 401 is fixedly connected between the two moving blocks 314. Two viewing windows 315 are provided on the two box doors 301. The rotational motion of the gear 311 is converted into linear motion through the meshing connection between the gear 311 and the rack 312, which provides power for the sliding of the second slide 306, ensuring that the second slide 306 can slide in the slide groove 305 according to the predetermined trajectory; the guide rails The setting of 313 and the moving block 314 further enhances the stability and guidance of the second slide 306 during sliding, reduces the shaking and deviation during the sliding process, and ensures that the fixed platform 401 and the component fixing and turning mechanism 4 can accurately extend from and enter the box body 2, making it convenient for operators to operate the components; the setting of the visual window 315 enables operators to observe the coating conditions and equipment operation status of the semiconductor core components in the box body 2 in real time without opening the box door 301, so as to facilitate timely detection of problems and adjustments, improve the convenience and work efficiency of operation, and at the same time reduce the interference of the external environment on the coating operation caused by frequent opening of the box door 301.
[0043] like Figure 1 and Figure 5As shown, a coating thickness precision control mechanism 5 is provided on the inner side of the bracket 1, and the coating thickness precision control mechanism 5 includes a mounting frame 501, which is fixedly connected to the inner side of the box body 2, and a one-way threaded rod 502 is rotatably connected to the inner side of the mounting frame 501. A guide groove 503 is provided on the inner side of the mounting frame 501, and a lifting frame 504 is threadedly installed on the outer surface of the one-way threaded rod 502. The lifting frame 504 is movable through the guide groove 503, and a stable installation foundation is provided for each component of the coating thickness precision control mechanism 5 through the mounting frame 501, ensuring that the connection between the entire mechanism and the box body 2 is firm; the one-way threaded rod 502 and the mounting frame 501 are connected. The rotating connection and the cooperation between the lifting frame 504, the one-way threaded rod 502 and the guide groove 503 constitute a stable lifting transmission structure. When the servo motor 511 drives the one-way threaded rod 502 to rotate, the lifting frame 504 can move up and down smoothly along the guide groove 503, thereby realizing precise adjustment of the height of the coating nozzle 505 to meet the coating needs of semiconductor core components with different coating process requirements; the guide groove 503 guides and limits the lifting frame 504, preventing the lifting frame 504 from rotating or offsetting during movement, ensuring that the coating nozzle 505 can accurately move to the predetermined position, and improving the accuracy of coating position control.
[0044] like Figure 1 and Figure 5 As shown, a coating nozzle 505 is installed at the bottom of the lifting frame 504, and a pump body 506 is installed on the top of the box 2. The output end of the pump body 506 is fixedly connected to a delivery hard pipe 507. The end of the delivery hard pipe 507 away from the pump body 506 is movable and passes through the box 2 and is fixedly connected to a telescopic pipe 508. The coating nozzle 505 is installed at the bottom of the lifting frame 504 and can be adjusted in position as the lifting frame 504 moves, ensuring that the coating nozzle 505 is always in the best coating position, ensuring the uniformity and accuracy of the coating; the pump body 50 6. The arrangement of the delivery hard pipe 507 and the telescopic pipe 508 constitutes a stable coating liquid delivery channel. The pump body 506 provides power for the delivery of the coating liquid. The delivery hard pipe 507 ensures the stability of liquid delivery, and the telescopic pipe 508 can adapt to the up and down movement of the lifting frame 504. Under the premise of not affecting the liquid delivery, it ensures the flexibility of the connection between the coating nozzle 505 and the lifting frame 504, avoids damage to the delivery pipeline or liquid leakage due to the movement of the lifting frame 504, and ensures the continuity and safety of the coating operation.
[0045] like Figure 1 and Figure 5As shown, one end of the telescopic tube 508 away from the delivery tube 507 is movable and passes through the lifting frame 504 and is connected to the inside of the coating nozzle 505. An electromagnetic regulating valve 509 is installed on the delivery tube 507. A plurality of thickness sensors 510 are installed on the inner top of the box body 2. A servo motor 511 is fixedly installed on the top of the mounting frame 501. The output end of the servo motor 511 is movable and passes through the mounting frame 501 and is fixedly connected to the smooth end of the one-way threaded rod 502. The connection design of the telescopic tube 508, the lifting frame 504 and the coating nozzle 505 ensures that the coating liquid can be smoothly transported to the coating nozzle 505; the installation of the electromagnetic regulating valve 509 enables the PLC controller 7 to accurately control the flow rate of the coating liquid according to the data fed back by the thickness sensor 510, thereby realizing precise adjustment of the coating thickness; a plurality of thickness sensors 510 are evenly distributed on the top of the box body 2, which can comprehensively and real-time monitor the semi-finished product. The changes in the coating thickness of the core components of the conductor provide accurate data support for the PLC controller 7; multiple thickness sensors 510 adopt a non-contact measurement principle, and the most common one is an optical measurement method. The thickness sensor 510 emits light of a specific wavelength, and the light is reflected after hitting the coating surface of the semiconductor core component. The sensor receives the reflected light and calculates the current coating thickness based on parameters such as the propagation time and reflection angle of the light, combined with a pre-set algorithm model. The connection between the servo motor 511 and the one-way threaded rod 502 provides a power source for the lifting of the lifting frame 504. Through the control of the servo motor 511 by the PLC controller 7, the height of the coating nozzle 505 can be accurately adjusted. Combined with the control of the liquid flow by the electromagnetic regulating valve 509, a closed-loop control system is formed to achieve dynamic and precise control of the coating thickness, effectively improving the quality and accuracy of the coating of the core components of the semiconductor.
[0046] like Figure 1 、 Figure 3 and Figure 6As shown, a coating liquid recovery mechanism 6 is provided at the bottom of the box body 2. The coating liquid recovery mechanism 6 includes a recovery box 601. The recovery box 601 is installed at the bottom of the box body 2. The bottom of the recovery box 601 is fixedly connected to a drain pipe 602. The drain pipe 602 is installed with a control valve 603. A PLC controller 7 is installed on one side of the box body 2. The connection terminal of the PLC controller 7 is connected to the wiring port in the device. The setting of the recovery box 601 can collect the coating liquid dripping during the coating process in time, avoid the accumulation of the coating liquid in the box body 2, keep the working environment clean, and reduce corrosion to the equipment. The setting of the drain pipe 602 and the control valve 603 makes it convenient for operators to centrally process or reuse the recovered coating liquid, reducing production costs and complying with environmental protection requirements; the PLC controller 7 serves as the control core of the entire device. Through electrical connection with various components in the device, it realizes unified and coordinated control of the automatic door opening and discharging mechanism 3, the component fixing and turning mechanism 4, the coating thickness precision control mechanism 5, etc., ensuring that the various mechanisms can work together, improving the degree of automation and operational stability of the device, and enabling the entire semiconductor core component coating thickness precision control device to operate efficiently.
[0047] The usage and working principle of this device: During the component fixing stage, the second dual-axis motor 309 is started through the PLC controller 7, and its two motor shafts drive the drive shaft 310 to rotate. The gear 311 on the drive shaft 310 is engaged with the rack 312, so that the fixed shell 308, the second slide 306 and the moving block 314 slide along the guide rail 313, and the box door 301 is driven to open through the connecting rod 307. Since the fixed platform 401 is fixedly connected between the two moving blocks 314, the component fixing and flipping mechanism 4 is driven to extend from the box body 2, and then the semiconductor core component is placed between the two clamping plates 408. The first electromagnetic clutch 410 is turned on through the PLC controller 7, and the first dual-axis motor 409 is started. The first motor shaft of the first dual-axis motor 409 drives the bidirectional threaded rod 404 to rotate, and the two movable plates 406 move toward each other under the action of the bidirectional threaded rod 404 and the guide rod 405. At the same time, the second slide bar 414 and the rotating sleeve 413 move toward each other, and one end of the second slide bar 414 enters the rotating sleeve 413. The first slide bar 412 and the rotating sleeve 413 move away from each other, and one end of the first slide bar 412 moves away from the rotating sleeve 413 (one end of the first slide bar 412 is always located in the rotating sleeve 413), so that the clamping plate 408 is driven to clamp and fix the semiconductor core components. Then, the second dual-axis motor 309 is started to reverse through the PLC controller 7, so that the box door 301 is closed, and the component fixing flipping mechanism 4 enters the box body 2.
[0048] During the coating operation stage, the servo motor 511 is started through the PLC controller 7, which drives the one-way threaded rod 502 to rotate, and the lifting frame 504 rises and falls in the guide groove 503, thereby adjusting the coating nozzle 505 to a suitable height, aligning it with the position of the semiconductor core components to be coated, and then turning on the pump body 506. The coating liquid is transported to the coating nozzle 505 through the delivery hard pipe 507 and the telescopic pipe 508, and sprayed out to coat the semiconductor core components.
[0049] During the flipping coating stage, when the coating on one side is completed, the second electromagnetic clutch 420 is turned on through the PLC controller 7 (the first electromagnetic clutch 410 is disconnected at this time) and the first dual-axis motor 409 is started. The second motor shaft of the first dual-axis motor 409 drives the first slide bar 412 to rotate through the third rotating wheel 421 and the third synchronous belt 422. When the first slide bar 412 rotates, the rotating sleeve 413, the second slide bar 414, the limit block 415, the first synchronous belt 418 and the second synchronous belt 419 drive the two rotating rods 407 to rotate synchronously, so that the splint 408 drives the semiconductor core components to flip over and perform coating on the other side.
[0050] During the coating thickness control stage, the thickness sensor 510 monitors the coating thickness in real time during the coating process and feeds the data back to the PLC controller 7. The PLC controller 7 compares the feedback data with the preset value. If the thickness is insufficient, the electromagnetic regulating valve 509 is controlled to increase the opening and increase the coating liquid flow rate. If the thickness exceeds the standard, the electromagnetic regulating valve 509 is controlled to decrease the opening and reduce the flow rate to achieve precise control of the coating thickness.
[0051] In the coating liquid recovery stage, the coating liquid dripping during the coating process falls into the recovery box 601 through the fixed table 401 and the box body 2. After the coating is completed, the control valve 603 is opened and the recovered liquid can be processed or reused through the drain pipe 602.
[0052] In the stage of removing components, the coating is completed and the operation of placing the components is repeated. The box door 301 is opened, the second electromagnetic clutch 420 is disconnected through the PLC controller 7 (the first electromagnetic clutch 410 is connected at this time), and the first dual-axis motor 409 is started to drive the bidirectional threaded rod 404 to rotate in the opposite direction. The moving plate 406 drives the clamping plate 408 to loosen, and the semiconductor core components can be taken out.
[0053] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A device for precisely controlling the thickness of a semiconductor core component coating, characterized in that: It comprises a bracket (1), a box body (2) is installed on the top of the bracket (1), an automatic door opening and material discharge mechanism (3) is provided on the inner side of the box body (2), and a component fixing and turning mechanism (4) is provided on the automatic door opening and material discharge mechanism (3); The component fixing and turning mechanism (4) comprises a fixed platform (401), four fixed plates (403), a bidirectional threaded rod (404), a guide rod (405), two movable plates (406), two rotating rods (407), two clamping plates (408), a first dual-axis motor (409), a first electromagnetic clutch (410), a support plate (411), a first sliding rod (412), a first synchronous belt (418), a second synchronous belt (419), a second electromagnetic clutch (420), and a third synchronous belt (422). The first motor shaft of the first dual-axis motor (409) is movable through one of the fixed plates (403) and is connected to the smooth end of the bidirectional threaded rod (404) through the first electromagnetic clutch (410). One side of one of the movable plates (406) is rotatably mounted with a rotating sleeve (413). The other one A second slide bar (414) is rotatably mounted on one side of the movable plate (406); the outer surfaces of the second slide bar (414) and the first slide bar (412) are fixedly connected to a limiting block (415); the first slide bar (412), the second slide bar (414) and the limiting block (415) are all slidably connected to the inner side of the rotating sleeve (413); one of the rotating rods (407) and the outer surface of the rotating sleeve (413) are fixedly sleeved with two second rotating wheels (417); the other rotating rod (407) and the outer surface of the second slide bar (414) are fixedly sleeved with two first rotating wheels (416); the second motor shaft of the first dual-axis motor (409) is connected to the input end of the second electromagnetic clutch (420); the output end of the second electromagnetic clutch (420) and one end of the first slide bar (412) are connected to two third rotating wheels (421).
2. The device for precisely controlling the thickness of a semiconductor core component coating according to claim 1, wherein: Two through slots (402) are provided on the top of the fixed platform (401), the four fixed plates (403) are fixedly connected to the bottom of the fixed platform (401), the bidirectional threaded rod (404) is rotatably connected between two of the fixed plates (403), the guide rod (405) is fixedly connected between the other two fixed plates (403), the two movable plates (406) are threadedly mounted on the outer surfaces of the bidirectional threaded rod (404) and the guide rod (405), and the two movable plates (406) are movable through the two through slots (402), and the two rotating rods (407) are rotatably mounted on one side of the two movable plates (406).
3. The device for precisely controlling the thickness of a semiconductor core component coating according to claim 2, wherein: The two clamping plates (408) are fixedly connected to one end of the two rotating rods (407), the first dual-axis motor (409) is fixedly installed on one side of one of the fixed plates (403), the first electromagnetic clutch (410) and the second electromagnetic clutch (420) are respectively installed on the bottom of the fixed platform (401), the support plate (411) is fixedly connected to the top of the fixed platform (401), the first sliding rod (412) is rotatably installed on one side of the support plate (411), the second synchronous belt (419) is transmission-connected to the outer surfaces of the two second rotating wheels (417), the first synchronous belt (418) is transmission-connected to the outer surfaces of the two first rotating wheels (416), and the third synchronous belt (422) is transmission-connected to the outer surfaces of the two third rotating wheels (421).
4. The device for precisely controlling the thickness of a semiconductor core component coating according to claim 1, wherein: The automatic door opening and discharging mechanism (3) comprises two box doors (301), the two box doors (301) are hinged to one side of the box body (2), two grooves (302) are provided on one side of the two box doors (301), two fixing rods (303) are fixedly connected in the two grooves (302), two first slides (304) are sleeved on the outer surfaces of the two fixing rods (303), two slide grooves (305) are provided on the inner side of the box body (2), two second slides (306) are slidably connected in the two slide grooves (305), and two connecting rods (307) are hinged between the two first slides (304) and the two second slides (306).
5. The device for precisely controlling the thickness of a semiconductor core component coating according to claim 4, characterized in that: A fixed shell (308) is fixedly connected between the two second slides (306), a second dual-axis motor (309) is fixedly installed on the inner side of the fixed shell (308), two motor shafts of the second dual-axis motor (309) are fixedly connected to two drive shafts (310), one end of the two drive shafts (310) is rotatably connected to the fixed shell (308), two gears (311) are fixedly sleeved on the outer surfaces of the two drive shafts (310), and two racks (312) are installed on the inner side of the box body (2).
6. The device for precisely controlling the thickness of a semiconductor core component coating according to claim 5, characterized in that: The two racks (312) are meshedly connected with the two gears (311), two guide rails (313) are installed on the inner side of the box body (2), two moving blocks (314) are slidably connected to the two guide rails (313), and the bottoms of the two moving blocks (314) are fixedly connected to the tops of the two second slides (306), the fixed platform (401) is fixedly connected between the two moving blocks (314), and two visual windows (315) are provided on the two box doors (301).
7. The device for precisely controlling the thickness of a semiconductor core component coating according to claim 1, wherein: A coating thickness precision control mechanism (5) is provided on the inner side of the bracket (1), and the coating thickness precision control mechanism (5) comprises a mounting frame (501), the mounting frame (501) is fixedly connected to the inner side of the box body (2), the inner side of the mounting frame (501) is rotatably connected to a one-way threaded rod (502), the inner side of the mounting frame (501) is provided with a guide groove (503), the outer surface of the one-way threaded rod (502) is threadedly mounted with a lifting frame (504), and the lifting frame (504) is movably inserted into the guide groove (503).
8. The device for precisely controlling the thickness of a semiconductor core component coating according to claim 7, wherein: A coating nozzle (505) is installed at the bottom of the lifting frame (504), and a pump body (506) is installed on the top of the box body (2). The output end of the pump body (506) is fixedly connected to a delivery hard pipe (507), and the end of the delivery hard pipe (507) away from the pump body (506) is movable and passes through the box body (2) and is fixedly connected to a telescopic pipe (508).
9. The device for precisely controlling the thickness of a semiconductor core component coating according to claim 8, characterized in that: The end of the telescopic tube (508) away from the delivery tube (507) is movable through the lifting frame (504) and is connected to the interior of the coating nozzle (505). An electromagnetic regulating valve (509) is installed on the delivery tube (507). A plurality of thickness sensors (510) are installed on the inner top of the box (2). A servo motor (511) is fixedly installed on the top of the mounting frame (501). The output end of the servo motor (511) is movable through the mounting frame (501) and is fixedly connected to the smooth end of the one-way threaded rod (502).
10. The device for accurately controlling the thickness of a semiconductor core component coating according to claim 9, characterized in that: A coating liquid recovery mechanism (6) is provided at the bottom of the box body (2), and the coating liquid recovery mechanism (6) includes a recovery box (601). The recovery box (601) is installed at the bottom of the box body (2). The bottom of the recovery box (601) is fixedly connected to a drainage pipe (602), and a control valve (603) is installed on the drainage pipe (602). A PLC controller (7) is installed on one side of the box body (2), and the connection terminal of the PLC controller (7) is connected to the wiring port in the device.
Citation Information
Patent Citations
Film coating equipment for semiconductor production
CN222219978U
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