Chip picking and positioning equipment for chip packaging

Abstract

The invention discloses chip picking and positioning equipment for chip packaging, and relates to the technical field of chip packaging. The equipment comprises a case, a mounting frame, a conveying assembly and a picking and positioning structure, an adsorption air channel, a screw hole pipe, a limiting air pipe and other parts are arranged in an adsorption arm in the picking and positioning structure, and movement and function control of an adsorption rod are achieved through spiral transmission connection of the screw hole pipe and a spiral ribbon rod and the synergistic effect of the limiting air pipe, a piston compensation air pipe and the like; the screw hole pipe is connected with the track rolling body, and the track rolling body moves in the nearly-surrounding movement track to drive an activating agent roll coating pen and a glue rolling wheel rod on the activating piece and the glue rolling piece to perform activating and glue rolling treatment at chip welding spots and bonding positions, so that the problem that a substrate is not synchronously activated when a chip is picked up and positioned is solved, and the chip picking and positioning efficiency is improved. The connection reliability of the chip and the substrate is improved, integration of multiple functions is realized, time and space are saved, and the stability, reliability and production efficiency of chip packaging are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a chip picking and positioning device for chip packaging. Background Art

[0002] In today's era of rapid digital development, chips have become a core driving force of modern technology. From everyday electronic devices such as smartphones and laptops to high-end industrial fields such as aerospace and automotive manufacturing, chips are ubiquitous. As electronic products continue to move towards miniaturization, high performance, and multi-functionality, stringent requirements are placed on chip packaging. On the one hand, consumers are pursuing lighter and more portable products, such as the rise of foldable screen phones, which requires chip packaging to be as small as possible to fit into the confined internal space. On the other hand, the vigorous development of cutting-edge technologies such as 5G communications, artificial intelligence, and big data processing requires chips to have superb computing power and high-speed data transmission characteristics. This requires chip packaging to effectively solve heat dissipation problems while ensuring electrical performance, creating a stable working environment for the chip. In addition, with the fierce competition in the global chip market, major chip manufacturers are optimizing packaging processes to improve chip yield, reliability, and overall performance, striving to seize the initiative in the fierce competition. This is driving the continuous innovation of chip packaging technology to meet the growing and diverse demands. The chip packaging process is a sophisticated technological extravaganza, a crucial step in the chip's evolution from bare die to practical application. It begins with chip pasting, where adhesive materials such as silver glue are used to precisely secure the fragile chip to the substrate, essentially creating a stable "foundation" for the chip. This step demands extremely high positioning accuracy and bonding properties. Wire bonding follows, building a "bridge" between the chip and the outside world. Using metal wires such as gold, hot pressing or ultrasonic bonding techniques tightly connect the chip solder joints to the substrate pins. Wire diameter and bonding parameters are crucial. The subsequent potting step is like draping a sturdy "armor" around the chip. Using materials such as epoxy resin, under precisely controlled fluidity and curing conditions, the chip and wires are tightly encased to protect against moisture, dust, and mechanical shock. Finally, a rigorous testing phase begins, meticulously examining everything from electrical performance to functional integrity and reliability testing. Only chips that perfectly pass these tests are eligible to enter the market, powering a wide range of electronic devices.

[0003] Among them, in the chip packaging process, the link before the chip and substrate are bonded is crucial. The current chip mounting equipment has certain limitations when performing the operation from cutting the chip to transferring it to the substrate surface, that is, before bonding, the solder joints on the substrate surface are not activated simultaneously. This negligence may cause potential problems. Since there may be an oxide layer on the surface of the substrate solder joints if it is not treated, the oxide layer will act as an isolation during the subsequent gold wire bonding process, which will have a negative impact on the gold wire bonding effect, reduce the connection reliability between the chip and the substrate, and ultimately affect the quality and performance of the entire chip packaging.

[0004] To this end, a chip picking and positioning device for chip packaging is proposed. Summary of the Invention

[0005] The object of the present invention is to provide a chip picking and positioning device for chip packaging to solve the problem in the background art that the substrate surface is not activated synchronously during the chip picking and positioning process.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a chip picking and positioning device for chip packaging, comprising: The chassis is the control center and is located before the thermosetting equipment and wire bonding equipment. The mounting frame is connected to the upper surface of the chassis by bolts, and a mounting platform and a conveyor are integrally provided on the upper and lower sides respectively; The conveyor assembly is connected to the upper surface of the chassis through bolts and brackets, and is located on the left and right sides of the mounting frame and is flush with the conveyor of the mounting frame; The picking and positioning structure has the ability to move freely in multiple nodes and is connected to the lower surface of the mounting platform of the mounting frame by bolts; The cam is secured to the bottom of the suction arm and is secured to the bottom of the suction arm with a spring which is secured to the bottom of the suction arm. The side surface of the screw hole tube is movably connected with the track rolling body in cooperation with the spring telescopic rod, and the track rolling body is arranged to roll in the near-circular motion path opened inside the adsorption arm, and the side surface of the track rolling body is fixed to one end of the connecting frame inside the near-circular motion path, and the other end of the connecting frame extends out of the near-circular motion path and bends downward to the adsorption end of the adsorption rod, and is movably connected with the activating part and the rolling rubber part arranged on the opposite sides of the adsorption rod in cooperation with the spring rod, wherein the activating part is arranged on the solder joint path of the chip, and the rolling rubber part is arranged on the bonding position of the chip, and is actively driven and pulled by the motion compensation electric push rod set by the sliding limit in the connecting frame, and the activating part and the rolling rubber part are respectively integrated with an activator roller pen and a rolling rubber wheel rod on the side close to the adsorption rod.

[0007] Preferably, the picking and positioning structure further includes a picking arm, which is a mechanical arm structure with multiple rotation nodes, and the movable end is connected to the adsorption arm via a bolt.

[0008] Preferably, one end of the adsorption air channel passes through one side of the adsorption arm, and an interface for connecting with the suction device is integrally provided at the through-port.

[0009] Preferably, the upper surface of the end plate for limiting the air pipe is provided with several air holes along the axial ring, and the upper surface is fixed to a reset spring sleeved on the outside of the screw rod, and the upper end of the reset spring is fixed on the slide pipe wall opened inside the adsorption arm, so as to limit and reset the movement of the limited air pipe.

[0010] Preferably, the upper end surface of the adsorption rod is connected to a telescopic sleeve by bolts, and the telescopic sleeve is movably sleeved outside the tube defining the air pipe, and the upper end of the telescopic sleeve is fixed to the inner wall of the pre-opened slide groove of the adsorption arm by bolts.

[0011] Preferably, the two piston rods and the two hydraulic cylinders are symmetrically arranged along the axis, and the side surfaces of the adsorption arm corresponding to the piston rehydration fluid channel are respectively provided with input and output one-way interfaces, and the input interface is connected to the supply component inside the adsorption arm through a pipeline.

[0012] Preferably, the path of the nearly circular motion track is the same as the trajectory of the welding point, and a circular arc treatment is performed at the turning position to facilitate turning.

[0013] Preferably, the activating member and the rubber rolling member are respectively provided with interfaces for replenishing materials inside the activating agent roller pen and the rubber rolling wheel rod on the opposite sides of the activating agent roller pen and the rubber rolling wheel rod, and are respectively connected to the output interface of one of the piston refilling liquid channels through the cooperation of the interface and the pipeline.

[0014] Compared with the prior art, the present invention has the following beneficial effects: The present invention uses the internal structural design of the adsorption arm to enable quantitative extraction of activator and adhesive when adsorbing the chip, and when placing the chip, the activator roller pen and the adhesive roller rod are linked together by the hydraulic cylinder, the screw hole tube, the track rolling body and other components to activate and roll adhesive at the solder joints and the chip bonding positions respectively. The solder joints on the surface of the substrate are activated to avoid the negative influence of the oxide layer on the bonding effect during gold wire bonding, so that the connection between the chip and the substrate is more firm and reliable. In the subsequent packaging process, it can better withstand the influence of various stresses and environmental factors, thereby improving the overall stability of the chip package. Qualitative and reliable, reducing the risk of chip failure due to poor connection. Secondly, the synchronous glue rolling process not only saves time, but also integrates multiple functions such as chip picking, positioning, solder joint activation and glue rolling into one, reducing the equipment's footprint and improving the utilization rate of production space. At the same time, it also simplifies the chip packaging process, reduces the time loss and error risk caused by equipment conversion and process connection, and improves production efficiency. In addition, the whole process has a high degree of automation and the components are closely coordinated, which greatly improves the production efficiency of chip packaging and reduces the error and labor intensity of manual operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The overall structure of the present invention is Figure 1 .

[0016] Figure 2 The overall structure of the present invention is Figure 2 .

[0017] Figure 3 Schematic diagram of the adsorption arm of the present invention.

[0018] Figure 4 This is a cross-sectional view of the interior of the adsorption arm of the present invention.

[0019] Figure 5 It is a cross-sectional view of the adsorption arm of the present invention.

[0020] Figure 6 Schematic diagram of the adsorption rod and its connection structure of the present invention Figure 1 .

[0021] Figure 7 Schematic diagram of the adsorption rod and its connection structure of the present invention Figure 2 .

[0022] Figure 8 This is a cross-sectional view of the adsorption rod and its connection structure of the present invention.

[0023] In the picture: 1. Chassis; 2. Mounting frame; 3. Conveyor assembly; 4. Picking and positioning structure; 41. Pickup arm; 42. Adsorption arm; 421. Adsorption air channel; 422. Near-surrounding motion channel; 423. Piston fluid replenishment channel; 43. Adsorption rod; 431. Piston rod; 432. Hydraulic cylinder; 433. Piston compensation air pipe; 4331. Telescopic sleeve; 434. Limiting air pipe; 4341. Screw rod; 4342. Return spring; 435. Screw hole tube; 4351. Spring telescopic rod; 4352. Track rolling element; 436. Connecting frame; 437. Activating part; 4371. Activator roller pen; 438. Rubber roller; 4381. Rubber roller rod; 4382. Motion compensation electric push rod. DETAILED DESCRIPTION

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] See also Figures 1 to 8 , the present invention provides a technical solution for a chip picking and positioning device for chip packaging: A chip picking and positioning device for chip packaging, comprising: Chassis 1 is the control center and is located before the thermosetting equipment and wire bonding equipment. The mounting frame 2 is connected to the upper surface of the chassis 1 by bolts, and a mounting platform and a conveyor are integrally provided on the upper and lower sides respectively; The conveyor assembly 3 is connected to the upper surface of the chassis 1 by bolts and brackets, and is located on the left and right sides of the mounting frame 2 and is flush with the conveyor of the mounting frame 2; The picking and positioning structure 4 has the ability to move freely at multiple nodes and is connected to the lower surface of the mounting platform of the mounting frame 2 by bolts; Among them, the picking and positioning structure 4 includes a picking arm 41, which is a mechanical arm structure with multiple rotating nodes, and the movable end is connected to the adsorption arm 42 by a bolt, and an L-shaped adsorption air duct 421 is opened at the bottom of the interior of the adsorption arm 42, and one end of the adsorption air duct 421 passes through one side of the adsorption arm 42, and an interface for connecting with the suction device is integrally provided at the through-port, and the other end of the adsorption air duct 421 is downwardly connected with a screw hole tube 435 that is rotatably arranged at the bottom of the interior of the adsorption arm 42 from the middle position, and the screw hole tube 435 is composed of a tube body with a limiting ring and a butterfly screw hole plate connected to the lower end of the tube body by bolts, and the screw hole tube The screw rod 4341 is screwed to the bottom of the screw rod 4341, and the screw rod 4341 is screwed to the bottom of the screw rod 4341. ... The piston compensation air pipe 433 provided in the tube through the annular groove is slidingly limited. The lower end of the piston compensation air pipe 433 extends out of the limiting air pipe 434 and is fixed to the adsorption rod 43 slidably provided at the lower part of the adsorption arm 42, and is communicated with the through adsorption hole opened at the axial position of the adsorption rod 43. The lower end of the adsorption rod 43 extends out of the adsorption arm 42, and the upper end surface of the adsorption rod 43 is connected to a retractable telescopic sleeve 4331 by bolts. The telescopic sleeve 4331 is movably sleeved on the outside of the tube limiting the air pipe 434, and the upper end of the telescopic sleeve 4331 is fixed to the inner wall of the pre-opened slide groove of the adsorption arm 42 by bolts. Two piston rods 431 and two hydraulic cylinders 432 are fixedly arranged around the middle position of the side surface of the adsorption rod 43, and the two piston rods 431 and the two hydraulic cylinders 432 are symmetrically arranged along the axis, wherein the piston rod 431 is slidingly sealed and arranged in the piston rehydration liquid channel 423 opened on both sides of the lower part of the adsorption arm 42, and the side surface of the adsorption arm 42 is respectively provided with input and output one-way interfaces corresponding to the piston rehydration liquid channel 423, and the input interface is connected to the supply component inside the adsorption arm 42 through a pipeline. The hydraulic cylinder 432 is fixedly arranged inside the adsorption arm 42, and the output end can pull the adsorption rod 43 to move reciprocally up and down; The side of the screw hole tube 435 limiting ring is integrally connected with a spring telescopic rod 4351 that can be freely extended and retracted, and is movably connected to the track rolling body 4352 through the spring telescopic rod 4351. The track rolling body 4352 is composed of a rod body and a ball, and is rolled in cooperation with the spring telescopic rod 4351 under the traction of the screw hole tube 435 and is set inside the near-surrounding motion path 422. The near-surrounding motion path 422 is opened inside the adsorption arm 42, and the path is the same as the trajectory of the welding point, and a circular arc treatment is made at the turning position for easy turning. The lower side of the track rolling body 4352 is fixed to one end of the adjustable connecting frame 436 inside the near-surrounding motion path 422. The connecting frame 436 is composed of a special-shaped connecting rod, an elliptical sleeve mounted on the lower end of the adsorption rod 43, and a sliding limiting box integrally arranged on the sleeve, wherein one end of the special-shaped connecting rod extends out of the near-surrounding motion path 422, bends downward to the adsorption end of the adsorption rod 43 and is fixed to the elliptical sleeve, and the elliptical sleeve cooperates with the retractable spring rod. The activating member 437 and the rubber rolling member 438 are movably connected to the activating member 437 and the rubber rolling member 438 arranged on the opposite sides of the adsorption rod 43, wherein one end of the spring rod connected to the activating member 437 is fixed inside the elliptical sleeve, and the spring rod connected to the rubber rolling member 438 is slidably limited inside the sliding limit box, and the rear side and the right end of the spring rod are respectively fixed to the output end of the motion compensation electric push rod 4382, and the motion compensation electric push rod 4382 is also slidably arranged inside the sliding limit box for compensating the circular motion of the rubber rolling member 438, wherein the activating member 437 is arranged opposite to the soldering point path of the chip, and the rubber rolling member 438 is arranged opposite to the bonding position of the chip, and the activating member 437 is integrally provided with an activator roller pen 4371 on the side close to the adsorption rod 43, and the activating member 437 is integrally provided with an interface for replenishing the inside of the activator roller pen 4371 on the opposite side of the activator roller pen 4371, and is connected to the output interface of one of the piston rehydration channels 423 through the cooperation of the interface and the pipeline; The rubber rolling element 438 is integrally provided with a rubber rolling wheel rod 4381 on one side close to the adsorption rod 43, and the rubber rolling element 438 is integrally provided with an interface for replenishing material inside the rubber rolling wheel rod 4381 on the opposite side of the rubber rolling wheel rod 4381, and is connected to the output interface of one of the piston refilling liquid channels 423 through the cooperation of the interface and the pipeline. The rubber rolling gap of the rubber rolling wheel rod 4381 is larger than the rolling gap of the activator roller pen 4371, which can ensure that a layer of adhesive of a specified thickness is rolled on the surface of the substrate.

[0026] During operation, the substrate is first placed on the surface of the input side conveying component 3, and the conveying component 3 cooperates with the conveyor under the mounting rack 2 to deliver the substrate to the specified position of the conveyor of the mounting rack 2. Then, the picking arm 41 drives the adsorption arm 42 to the top of the cut chip under the program control of the chassis 1, and picks up the chips one by one. During adsorption, after the adsorption arm 42 is in place, the hydraulic cylinder 432 pushes the adsorption rod 43 out of the adsorption arm 42. During this process, the adsorption rod 43 pulls the piston compensation air pipe 433 and drags the piston rod 431 to quantitatively extract the activator and glue from the feeding end, and at the same time pushes the activating part 437 and the glue rolling part 438. After the lower end of the adsorption rod 43 contacts the chip, the suction device turns on the vacuum system to grab the chip, and then the hydraulic cylinder 432 pulls up the adsorption rod 43 to reset it, and the piston rod 431 pushes the activator and glue to fill the activator roller pen 43. 71 and the rubber roller rod 4381, the picking arm 41 then moves the adsorption arm 42 to the designated chip bonding position above the substrate to place the chip. At this time, the activator roller pen 4371 contacts the solder joint, and the rubber roller rod 4381 contacts the previous chip placement position. The hydraulic cylinder 432 continues to pull up the adsorption rod 43, driving a series of component movements, so that the activator roller pen 4371 and the rubber roller rod 4381 respectively activate and roll glue at the solder joint and chip bonding position along the near-circular motion path 422. The motion compensation electric push rod 4382 ensures that the rubber roller rod 4381 moves within the chip pasting area. At the same time, the piston rod 431 further pushes the activator and glue to fully roll. Finally, the hydraulic cylinder 432 pushes the adsorption rod 43 to reset, and all components reset accordingly. The picking arm 41 transfers the adsorption arm 42 to pick up and position the next chip.

[0027] In summary, the internal structural design of the adsorption arm 42 enables quantitative extraction of activator and adhesive when adsorbing the chip. When the chip is placed, the hydraulic cylinder 432, the screw tube 435, the track roller 4352 and other components are linked to enable the activator roller pen 4371 and the adhesive roller rod 4381 to activate and apply adhesive to the solder joints and the chip bonding position, respectively. Activating the solder joints on the substrate surface avoids the negative impact of the oxide layer on the bonding effect during gold wire bonding, making the connection between the chip and the substrate more secure and reliable. In the subsequent packaging process, it can better withstand the influence of various stresses and environmental factors. It improves the overall stability and reliability of chip packaging and reduces the risk of chip failure due to poor connection. Secondly, the synchronous glue rolling process not only saves time, but also integrates multiple functions such as chip picking, positioning, solder joint activation and glue rolling, reducing the equipment's footprint and improving the utilization rate of production space. At the same time, it also simplifies the chip packaging process, reduces the time loss and error risk caused by equipment conversion and process connection, and improves production efficiency. In addition, the entire process has a high degree of automation and the components work closely together, which greatly improves the production efficiency of chip packaging and reduces the error and labor intensity of manual operation.

[0028] Working principle: When working, first place the substrate for chip pasting and bonding on the surface of the conveying component 3 on the input side, so that the conveying component 3 cooperates with the conveyor under the mounting rack 2 to convey the substrate to the specified position of the conveyor of the mounting rack 2, and then the picking arm 41 will drive the adsorption arm 42 under the control of the specified program of the chassis 1, and transfer the adsorption arm 42 to the top of the cut chip, and adsorb and pick up the cut chips one by one. During the adsorption process, when the adsorption arm 42 is transferred to the top of the specified chip, the hydraulic cylinder 432 will push the adsorption rod 43 downward, and then the adsorption rod 43 will move downward along the channel opened inside the adsorption arm 42 to pass through the adsorption arm 42, and during the downward movement of the adsorption rod 43, the adsorption rod 43 will synchronously pull the piston to compensate for the air pipe 433 moves downward along the wall of the limiting air pipe 434, while the limiting air pipe 434 does not move. At the same time, the adsorption rod 43 will also drag the piston rod 431 to move downward along the inner wall of the hydraulic cylinder 432, and cooperate with the one-way interface to quantitatively extract the activator and glue stored in the feeding end set inside the adsorption arm 42. Then, as the adsorption rod 43 moves downward, it will contact the activating part 437 and the rolling rubber part 438, and push the activating part 437 and the rolling rubber part 438 to both sides (if the area of the chip is large, the activating part 437 and the rolling rubber part 438 will not be pushed by the downward movement of the adsorption rod 43). The relatively moving activating part 437 and the rolling rubber part 438 will compress the spring rod connected to the connecting frame 436 until the adsorption rod 43 moves downward. The end contacts the surface of the chip, and then the suction device will turn on the vacuum system to generate negative pressure to grab the chip. Then the hydraulic cylinder 432 will pull the adsorption rod 43 upward, so that it will be retracted upward along the inner wall of the adsorption arm 42 to its initial position. At the same time, the adsorption rod 43 will synchronously push the piston compensation air pipe 433 and the piston rod 431 to reset to the initial position (the adsorption equipment is dynamically adjusted, and the chip adsorption will not be affected), and the piston rod 431 will push the extracted activator and adhesive along the pipeline into the interior of the activator roller pen 4371 and the rubber roller rod 4381, filling the storage space of the activator roller pen 4371 and the rubber roller rod 4381. Then the picking arm 41 will transfer the adsorption arm 42 to the top of the substrate under the control of the specified program. , and transferred to the designated position for chip bonding. Then, under the cooperative control of the suction equipment, the chip will be placed in the designated position for pre-rolling glue. At this time, the ball end of the activator roller pen 4371 contacts the solder joint of the chip placement position, and the rubber roller of the rubber roller rod 4381 contacts the previous chip placement position of the current chip. Then the hydraulic cylinder 432 will continue to pull up the adsorption rod 43, so that it continues to move upward along the inner wall of the adsorption arm 42. During the upward movement, the piston compensation air pipe 433 will push the limiting air pipe 434 upward, so that the limiting air pipe 434 slides upward in a straight line along the inner wall of the adsorption arm 42 under the limitation of the return spring 4342 and the piston compensation air pipe 433. The upward moving limiting air pipe 434 will push the screw rod 4341 to move upward.When moving upward, the butterfly screw hole at the lower end of the screw hole tube 435 is cooperated with (the principle is similar to that of the flying fairy toy) to rotate the screw hole tube 435 inside the adsorption arm 42, and then the rotating screw hole tube 435 will drag the spring telescopic rod 4351 to make its traction track rolling body 4352 move along the near-circular motion path 422 opened inside the adsorption arm 42, and the rolling body 4352 moving along the trajectory of the near-circular motion path 422 will synchronously drag the connecting frame 436 to drive the activating part 437 and the rolling rubber part 438 to move, and then the activating part 437 and the rolling rubber part 438 will drive the activator roller pen 4371 and the rolling rubber wheel rod 4381 to respectively perform the activating agent coating at the welding position of the current chip and the bonding position of the previous chip along the near-circular motion path 422 on the soldering point path. The diameter and chip bonding position are activated and glue rolled until the adsorption rod 43, under the upward pulling action of the hydraulic cylinder 432, cooperates with the screw rod 4341 to drive the screw hole tube 435 and the track rolling body 4352 to rotate along the nearly circular motion path 422 to the end position. At this time, the solder joint activation and glue rolling have been carried out for nearly a week. During this process, the motion compensation electric push rod 4382 will actively push and pull the glue rolling part 438 back and forth or left and right, so that it can be moved in the moving limit box integrally arranged on the connecting frame 436 to ensure that the glue rolling wheel rod 4381 always moves within the area of the chip pasting position. At the same time, as the adsorption rod 43 moves upward, it will synchronously drag the piston rod 431 to continue to move upward, and then the upward piston rod 431 will further push the piston to pump out the fluid inside the rehydration channel 423. The activator and glue taken out are respectively flowed into the interior of the activator roller pen 4371 and the rubber roller rod 4381 along the pipeline. Since the storage space inside the activator roller pen 4371 and the rubber roller rod 4381 has been filled before, then with the pressure of the activator and glue that continue to enter, the activator roller pen 4371 and the rubber roller rod 4381 will fully roll the activator and glue on the solder joints and chip bonding positions, and then the hydraulic cylinder 432 will push the adsorption rod 43 downward to reset it to its initial position again. In this process, due to the downward movement of the adsorption rod 43, the piston compensation air pipe 433 will be separated from the top support of the limiting air pipe 434 under the drive of the adsorption rod 43, and then the limiting air pipe 434 will be compressed under the return spring 4342. Under the action, it will move downward and reset. The downward limiting air pipe 434 will pull the screw rod 4341 downward and drive the screw hole tube 435 to rotate in the opposite direction. Then the screw hole tube 435 will cooperate with the spring telescopic rod 4351, the track rolling body 4352 and the connecting frame 436 to drag the activating part 437 and the rolling rubber part 438 to move in the opposite direction along the near-circular motion path 422 and reset. At this time, the activating agent roller pen 4371 and the rolling rubber wheel rod 4381 will continue to activate and roll the rubber along the solder joint path and the chip pasting position. After the activation and rolling rubber treatment, the activating agent roller pen 4371 and the rolling rubber wheel rod 4381 will be basically empty. Then the picking arm 41 will transfer the adsorption arm 42 to perform the above steps again to pick up and position the next chip.

[0029] It should be noted that initially, the lower end of the adsorption rod 43 is slightly higher than the rolling ends of the activator roller pen 4371 and the rubber roller rod 4381, and the height is related to the thickness of the rubber roller and the chip thickness, and can be adjusted according to the situation.

[0030] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A chip picking and positioning device for chip packaging, characterized in that: include: The chassis is the control center and is located before the thermosetting equipment and wire bonding equipment. The mounting frame is connected to the upper surface of the chassis by bolts, and a mounting platform and a conveyor are integrally provided on the upper and lower sides respectively; The conveyor assembly is connected to the upper surface of the chassis through bolts and brackets, and is located on the left and right sides of the mounting frame and is flush with the conveyor of the mounting frame; The picking and positioning structure has the ability to move freely in multiple nodes and is connected to the lower surface of the mounting platform of the mounting frame by bolts; The picking and positioning structure includes an adsorption arm, an adsorption air channel is provided at the lower part of the adsorption arm, one end of the adsorption air channel is communicated with a screw hole tube rotatably provided at the lower part of the adsorption arm, the screw hole tube is connected to the screw rod (4341) through the screw hole, the lower end of the screw rod (4341) is spirally passed through the screw hole tube, and is fixed to the upper end plate of the limiting air tube slidably provided at the inner part of the adsorption arm, the tube wall of the limiting air tube is used to slide the piston compensation air tube provided in the tube through the annular groove provided, the lower end of the piston compensation air tube extends through the limiting air tube and is fixed to the adsorption rod slidably provided at the lower part of the adsorption arm, and is communicated with the through adsorption hole provided at the axial center position of the adsorption rod, two piston rods and two hydraulic cylinders are respectively fixedly provided around the circumferential side of the adsorption rod, wherein the piston rod sliding seal is provided in the piston rehydration fluid channel provided on both sides at the lower part of the adsorption arm, and the hydraulic cylinder is fixedly provided at the inner part of the adsorption arm; The side of the screw hole tube is movably connected with the track rolling body in cooperation with the spring telescopic rod, and the track rolling body is arranged to roll in the near-circular motion path opened inside the adsorption arm, and the side of the track rolling body is fixed to one end of the connecting frame inside the near-circular motion path, and the other end of the connecting frame extends out of the near-circular motion path and bends downward to the adsorption end of the adsorption rod, and is movably connected with the activating part and the rolling rubber part arranged on the opposite sides of the adsorption rod in cooperation with the spring rod, wherein the activating part is arranged on the solder joint path of the chip, and the rolling rubber part is arranged on the bonding position of the chip, and is actively driven and pulled by the motion compensation electric push rod set by the sliding limit in the connecting frame, and the activating part and the rolling rubber part are respectively integrated with an activator roller pen and a rolling rubber wheel rod on the side close to the adsorption rod.

2. The chip pickup and positioning device for chip packaging according to claim 1, wherein: The picking and positioning structure also includes a picking arm, which is a mechanical arm structure with multiple rotation nodes, and the movable end is connected to the adsorption arm through a bolt.

3. The chip pickup and positioning device for chip packaging according to claim 2, wherein: One end of the adsorption air channel passes through one side of the adsorption arm, and an interface for connecting with the suction device is integrally provided at the through port.

4. The chip pickup and positioning device for chip packaging according to claim 1, wherein: The upper surface of the air pipe end plate is provided with several air holes along the axis ring, and the upper surface is fixed to the reset spring sleeved on the outside of the screw rod, and the upper end of the reset spring is fixed on the slide pipe wall opened inside the adsorption arm, so as to limit and reset the movement of the limited air pipe.

5. The chip pickup and positioning device for chip packaging according to claim 4, wherein: The upper end surface of the adsorption rod is connected to a telescopic sleeve by bolts, and the telescopic sleeve is movably sleeved outside the tube that defines the air pipe, and the upper end of the telescopic sleeve is fixed to the inner wall of the pre-opened slide groove of the adsorption arm by bolts.

6. The chip pickup and positioning device for chip packaging according to claim 5, wherein: The two piston rods and the two hydraulic cylinders are symmetrically arranged along the axis. The side of the adsorption arm corresponds to the piston rehydration channel and is respectively provided with input and output one-way interfaces, and the input interface is connected to the supply component inside the adsorption arm through a pipeline.

7. The chip pickup and positioning device for chip packaging according to claim 1, wherein: The path of the near-circular motion track is the same as the trajectory of the welding point, and an arc treatment is made at the turning position to facilitate turning.

8. The chip pickup and positioning device for chip packaging according to claim 8, wherein: The activating part and the rubber rolling part are respectively provided with interfaces for replenishing materials inside the activating agent roller pen and the rubber rolling wheel rod on the opposite sides of the activating agent roller pen and the rubber rolling wheel rod, and are respectively connected to the output interface of one of the piston refilling liquid channels through the cooperation of the interface and the pipeline.

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