A shaking mechanism for a chemical plating process tank on semiconductor wafers

Abstract

This invention relates to the field of semiconductor wafer electroless plating process tank technology, specifically a shaking mechanism for a semiconductor wafer electroless plating process tank. The mechanism includes a wafer electroless plating tank with a working cavity at its lower end and a guide rod fixedly installed at the upper end of the working cavity. The working cavity contains a wafer basket-type positioning assembly and a wafer plating assembly. By combining the basket unit with the positioning unit, the wafer is reinforced and mounted. The shaking unit enables the basket unit to reciprocate horizontally, achieving uniform contact between the wafer and the plating solution. Furthermore, the shaking unit, in conjunction with the curved positioning plate, ensures stable horizontal movement of the basket unit while allowing for small-amplitude longitudinal shaking during the horizontal reciprocating movement of the wafer, enhancing the shaking effect of the wafer plating. It also assists in cleaning crystals formed at the bottom of the basket unit, achieving a multi-functional design.

Description

Technical Field

[0001] This invention relates to the field of semiconductor wafer electroless plating process tank technology, specifically to a shaking mechanism for a semiconductor wafer electroless plating process tank. Background Technology

[0002] In the wafer electroless plating process, a basket containing wafers needs to be immersed in the electroless plating bath to allow the wafers to come into contact with the chemical agents. In order to ensure that each wafer can fully contact the chemical agents, the basket containing the wafers is usually placed on a shaking frame first, and then the shaking frame and the basket are immersed together in the electroless plating bath. The shaking mechanism causes the wafers to move relative to each other in the plating solution, increasing the contact area between the plating solution and the wafer surface, accelerating the deposition of metal ions, and improving the deposition rate and uniformity of the coating.

[0003] In the prior art, such as the wafer electroless plating process tank shaking mechanism with announcement number CN218059200U, the wafer basket is driven by a dual-output shaft drive motor through a transmission mechanism to perform stable shaking, which can effectively improve the processing effect of the electroless plating process tank.

[0004] The aforementioned document describes a method where a drive mechanism causes the shaking frame to vibrate, thereby causing the wafers in the basket to vibrate and allowing the chemical reagents to fully penetrate the gaps between the wafers. However, in actual use, chemical reagents can easily remain at the bottom of the shaking frame, which can crystallize over time and potentially contaminate the wafers. Furthermore, during the chemical plating process, the poor fluidity of the plating solution can easily create dead zones in the wafer plating process, affecting the wafer plating effect.

[0005] Therefore, this invention proposes a shaking mechanism for a semiconductor wafer electroless plating process tank to solve the problem of poor fluidity of the electroplating solution and the potential for dead corners in wafer plating during the use of existing electroplating tanks. The aim is to ensure stable wafer positioning, achieve smooth shaking, increase the plating effect, and assist in the cleaning of the bottom of the wafer basket to form crystals. Summary of the Invention

[0006] To address the shortcomings of existing technologies, the present invention aims to provide a shaking mechanism for a semiconductor wafer electroless plating process tank, thereby solving the problems mentioned in the background section.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a shaking mechanism for a semiconductor wafer chemical plating process tank, comprising a wafer chemical plating tank, a working cavity being provided at the lower end of the wafer chemical plating tank, a guide rod being fixedly installed at the upper end of the working cavity, a wafer basket limiting assembly and a wafer plating assembly being provided inside the working cavity, the wafer basket limiting assembly comprising a curved limiting plate, and the wafer plating assembly comprising a basket unit, a shaking unit and a limiting unit, the wafer plating assembly being movably disposed inside the wafer basket limiting assembly, and the wafer basket limiting assembly being fixedly installed in the inner cavity of the working cavity.

[0008] Preferably, the flower basket unit is composed of a connecting end plate, a clamping side plate, a central reinforcing plate, and an abutment support rod. The connecting end plate and the clamping side plate are provided in two sets. The two ends of the two sets of clamping side plates are respectively fixedly connected to the inner side of the connecting end plate. The abutment support rod is fixedly installed at the lower end of the connecting end plate, and a clamping groove is opened on the upper inner wall of the abutment support rod. The central reinforcing plate is located in the center of the clamping side plate and is fixedly connected to the inner surface. A pull ring is fixedly installed at the upper end of the central reinforcing plate. A lifting lug is fixedly connected to the upper surface of the pull ring. The inner surface of the lifting lug is slidably connected to the outer surface of the guide rod.

[0009] Preferably, the shaking unit includes a Y-shaped fixed back plate, the upper end of which is provided with a sliding groove, a horizontal slide rod is slidably connected to the inner surface of the sliding groove, a protruding plate is fixedly added to the center of the horizontal slide rod, and a central limiting groove is provided on the inner wall of the protruding plate.

[0010] Preferably, the shaking unit further includes a motor and a circular plate. The motor is fixedly mounted on the outer surface of the back side of the wafer chemical plating tank, the circular plate is fixedly mounted on the output shaft of the motor, and the circular plate is rotatably mounted on the surface of the Y-shaped fixed back plate away from the motor. An eccentric protrusion is fixedly mounted on the outer surface of the circular plate.

[0011] Preferably, a limiting post is rotatably connected to the lower inner wall of the Y-shaped fixed back plate, and a swing arm is fixedly installed on the outer surface of the limiting post. A movable groove is opened on the inner wall of the swing arm, and the inner surface of the movable groove is movably connected to the outer surface of the eccentric protrusion. A swing protrusion is fixedly installed at the end of the swing arm away from the limiting post, and the outer surface of the swing protrusion is movably connected to the inner side of the central limiting groove.

[0012] Preferably, the limiting unit includes a double-ended rod, which is fixedly connected to both sides of the connecting end plate by bolts. The double-ended rod is provided in two sets and is distributed in a mirror image about the longitudinal central axis of the clamp side plate. One end of each set of double-ended rods is fixedly connected to both ends of a horizontal slide bar, and the end of the double-ended rod away from the horizontal slide bar is slidably connected to the upper outer surface of the curved limiting plate.

[0013] Preferably, the upper end of one side of the curved limiting plate is fixedly connected to the inner wall of the working chamber, and a through groove plate is fixedly installed at the lower end of the curved limiting plate. The through groove plate has a hollow plate structure, and a liquid guide pipe is fixedly installed at the lower end of the through groove plate.

[0014] Preferably, the curved limiting plate is a hollow tubular structure, the inner wall of the curved limiting plate is connected to both ends of the through groove plate, a water spray pipe is fixedly connected to the inner side of the curved limiting plate, and uniform spray holes are evenly opened on the inner wall of the water spray pipe.

[0015] Preferably, a corrugated strip is fixedly installed on the inner circumferential surface of the through groove plate, and an auxiliary shaking component is provided on the inner side of the corrugated strip. The horizontal cross-section of the corrugated strip has a wavy structure, and the side view of the corrugated strip has an isosceles trapezoidal structure with a high middle and low sides.

[0016] Preferably, the auxiliary vibration component includes a snap-fit ​​insert and a connecting curved tube. The outer surface of the snap-fit ​​insert is fitted into the inner wall of the snap-fit ​​groove. Both ends of the connecting curved tube are fixedly connected to the inner side of the snap-fit ​​insert. A limiting collar is fixedly installed at the center of the connecting curved tube. A lifting rod is slidably connected to the inner wall of the center of the limiting collar. The lower end of the lifting rod is provided with a rounded corner. The outer surface of the rounded corner is movably abutting against the inner surface of the corrugated plate. A fixing ring is fixedly installed at the upper end of the lifting rod. Movable rod one is rotatably connected to both sides of the fixing ring. The other end of movable rod one is movably connected to an abutting curved plate. Movable rod two is movably connected to the outer surface of movable rod one. A sliding collar is hinged to the other end of movable rod two. The inner surface of the sliding collar is movably connected to the outer surface of the connecting curved tube.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] This invention proposes a shaking mechanism for a semiconductor wafer electroless plating process tank. By combining a basket unit with a limiting unit, the wafer is reinforced and mounted. With the addition of the shaking unit, the basket unit achieves horizontal reciprocating motion, ensuring uniform contact between the wafer and the plating solution. Furthermore, the shaking unit works in conjunction with the curved limiting plate to ensure stable horizontal movement of the basket unit while allowing for small-amplitude longitudinal shaking during the horizontal reciprocating movement of the wafer. This enhances the shaking effect of the wafer plating and also assists in cleaning the crystals formed at the bottom of the basket unit, achieving a multi-functional effect. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the wafer chemical coating tank of the present invention;

[0020] Figure 2This is a schematic diagram of a partial cross-sectional structure of the wafer chemical coating tank of the present invention;

[0021] Figure 3 This is a schematic diagram of the connection structure between the flower basket unit and the curved limiting plate of the present invention. Figure 1 ;

[0022] Figure 4 This is a schematic diagram of the moving state structure of the flower basket unit of the present invention;

[0023] Figure 5 For the present invention Figure 4 A magnified structural diagram at point A;

[0024] Figure 6 This is a schematic diagram of the connection structure between the jitter unit and the limiting unit of the present invention;

[0025] Figure 7 This is a disassembled structural diagram of the shaking unit, the flower basket unit, and the wafer flower basket limiting component of the present invention;

[0026] Figure 8 This is a bottom view of the wafer basket positioning component of the present invention.

[0027] Figure 9 This is a schematic diagram of the connection structure between the flower basket unit and the curved limiting plate of the present invention. Figure 2 ;

[0028] Figure 10 For the present invention Figure 9 A magnified structural diagram at point B;

[0029] Figure 11 This is a schematic diagram of the disassembled structure of the flower basket unit and the auxiliary shaking component of the present invention;

[0030] Figure 12 For the present invention Figure 11 A magnified structural diagram at point C;

[0031] Figure 13 This is a schematic diagram of a partial connection structure of the card side plate of the present invention.

[0032] In the diagram: 1. Wafer chemical coating tank; 10. Working chamber; 11. Guide rod; 2. Bent limiting plate; 21. Through-slot plate; 210. Liquid inlet pipe; 22. Corrugated strip plate; 23. Water spray pipe; 24. Parallel pipe; 241. Baffle plate; 3. Basket unit; 31. Connecting end plate; 32. Clip side plate; 321. Clip-on piece; 322. Flexible clamping plate; 33. Central reinforcing plate; 331. Pull ring; 332. Lifting lug; 34. Abutment support rod; 340. Mounting slot; 341. 35. Snap-fit ​​insert; 351. Connecting curved tube; 36. Limiting collar; 37. Lifting rod; 361. Fixing ring; 362. Movable rod one; 363. Movable rod two; 364. Sliding collar; 365. Abutting curved plate; 4. Y-shaped fixed back plate; 41. Motor; 40. Sliding groove; 42. Circular plate; 421. Eccentric protrusion; 43. Limiting post; 431. Swinging arm; 4310. Movable groove; 44. Swinging protrusion; 45. Horizontal slide bar; 450. Center limiting groove; 5. Double-end clamping rod. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the present invention clear and complete, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of the present invention, and are merely illustrative of the embodiments of the present invention. They are not intended to limit the embodiments of the present invention. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Example 1, please refer to Figure 1-13This invention provides a technical solution: a shaking mechanism for a semiconductor wafer chemical plating process tank, including a wafer chemical plating tank 1, a working cavity 10 at the lower end of the wafer chemical plating tank 1, a guide rod 11 fixedly installed at the upper end of the working cavity 10, a wafer basket limiting assembly and a wafer plating assembly disposed inside the working cavity 10, the wafer basket limiting assembly including a curved limiting plate 2, the wafer plating assembly including a basket unit 3, a shaking unit and a limiting unit, the wafer plating assembly being movably disposed inside the wafer basket limiting assembly, and the wafer basket limiting assembly being fixedly installed inside the working cavity 10; the basket unit 3 is composed of a connecting end plate 31, a clamping side plate 32, a central reinforcing plate 33 and an abutment support rod 34, connecting... Two sets of end plates 31 and clamping side plates 32 are provided. The two ends of the two sets of clamping side plates 32 are fixedly connected to the inner side of the end plate 31. The abutment support rod 34 is fixedly installed at the lower end of the end plate 31, and a clamping groove 340 is opened on the upper inner wall of the abutment support rod 34. The central reinforcing plate 33 is located inside the center of the clamping side plate 32 and is fixedly connected to the inner surface. A pull ring 331 is fixedly installed at the upper end of the central reinforcing plate 33. A lifting lug 332 is fixedly connected to the upper surface of the pull ring 331. The inner surface of the lifting lug 332 is slidably connected to the outer surface of the guide rod 11. A snap-fit ​​piece 321 is fixedly installed on the inner surface of the clamping side plate 32. A flexible clamping pouch plate 322 is fixedly installed on the inner side of the snap-fit ​​piece 321.

[0035] In this embodiment, when multiple wafers are installed, a enclosure structure is formed by two sets of connecting end plates 31 and two sets of clamping side plates 32. The clamping tabs 321 and flexible clamping plates 322 on the inner side of the clamping side plates 32 form a set to flexibly clamp both sides of the wafer. The setting of the limiting unit realizes the clamping reinforcement of the basket unit 3. The driving of the shaking unit realizes the synchronous movement of the limiting unit and the basket unit 3. With the setting of the curved limiting plate 2, the basket unit 3 drives the wafer to move horizontally back and forth. While mixing the electrolyte in the working cavity 10, it increases the contact surface between the wafer and the electrolyte, avoids the formation of coating dead corners, and further improves the processing effect and efficiency of chemical coating of semiconductor wafers.

[0036] Example 2, see attached document Figure 1-13Based on Embodiment 1, in order to drive the shaking unit and achieve the horizontal reciprocating motion of the flower basket unit 3: the shaking unit includes a Y-shaped fixed back plate 4, the upper end of which has a sliding groove 40, and a horizontal slide rod 45 is slidably connected to the inner surface of the sliding groove 40. A protruding plate is fixedly added to the center of the horizontal slide rod 45, and a center limiting groove 450 is opened on the inner wall of the protruding plate; the shaking unit also includes a motor 41 and a circular plate 42. The motor 41 is fixedly installed on the outer back surface of the wafer chemical plating tank 1, and the circular plate 42 is fixedly installed on the output shaft of the motor 41. The circular plate 42 is rotatably installed on the side surface of the Y-shaped fixed back plate 4 away from the motor 41, and an eccentric protrusion 421 is fixedly installed on the outer surface of the circular plate 42; a rotatably connected... The limiting post 43 has a swing arm 431 fixedly installed on its outer surface. The swing arm 431 has a movable groove 4310 on its inner wall. The inner surface of the movable groove 4310 is movably connected to the outer surface of the eccentric protrusion 421. The swing arm 431 is fixedly installed with a swing protrusion 44 at the end away from the limiting post 43. The outer surface of the swing protrusion 44 is movably connected to the inner side of the central limiting groove 450. The limiting unit includes a double-end rod 5. The double-end rod 5 is fixedly connected to both sides of the connecting end plate 31 by bolts. There are two sets of double-end rods 5, which are mirrored about the longitudinal central axis of the clamp side plate 32. One end of each set of double-end rods 5 is fixedly connected to both ends of the horizontal slide bar 45. The end of the double-end rod 5 away from the horizontal slide bar 45 is slidably connected to the upper outer surface of the curved limiting plate 2.

[0037] In this embodiment, when it is necessary to fully react each wafer with the electrolyte, the control motor 41 is turned on, causing its output shaft to rotate. At this time, the circular plate 42 rotates, and simultaneously, the eccentric protrusion 421 rotates eccentrically around the center origin of the circular plate 42, thus driving the eccentric arm 431 to eccentricate. The swinging protrusion 44 moves inside the central limiting groove 450, causing the swinging protrusion 44 to move the horizontal slide bar 45. Under the limiting action of the sliding groove 40, the horizontal slide bar 45 moves horizontally. At the same time, the double-ended holding rod 5 drives the basket unit 3 and the entire wafer, which are fixedly connected inside, to perform horizontal reciprocating motion. It should be noted that, referring to Figure 6 As shown, the Y-shaped fixed back plate 4 has an overall "Y"-shaped plate structure, which can not only support the shaking unit, but also provide a limiting function for the circular plate 42, the limiting post 43 and the horizontal slide bar 45, achieving the effect of multiple uses in one piece; in addition, the end of the double-ended support rod 5 away from the horizontal slide bar 45 slides and adapts to the upper surface of the curved limiting plate 2, so as to ensure that both ends of the basket unit 3 are limited, maintain the balance of horizontal movement, and increase the stability of the wafer coating reaction.

[0038] Example 3 (see Appendix) Figure 1-13Based on Embodiment 2, in order to achieve uniformity of semiconductor wafer coating: the upper end of one side of the curved limiting plate 2 is fixedly connected to the inner wall of the working cavity 10, and a through groove plate 21 is fixedly installed at the lower end of the curved limiting plate 2. The through groove plate 21 has a hollow plate structure, and a liquid guide pipe 210 is fixedly installed at the lower end of the through groove plate 21. A suction pump is fixedly installed at the input end of the through groove plate 21, and a solenoid valve is provided inside the liquid guide pipe 210. The curved limiting plate 2 has a hollow tubular structure as a whole. The inner wall of the curved limiting plate 2 is connected to both ends of the through groove plate 21. A water spray pipe 23 is fixedly connected inside the curved limiting plate 2. The water spray pipe 23 has uniform spray holes evenly opened on its inner wall. The uniform spray holes spray liquid towards the inner wafer to ensure uniform coating of the wafer when it moves horizontally back and forth, and to avoid coating dead corners.

[0039] In this embodiment, after the wafer is fully mounted and during the horizontal reciprocating motion of the basket unit 3, a through-groove plate 21 is integrated on the bottom side of the curved limiting plate 2. A suction pump draws electrolyte from the inside of the working chamber 10, which then enters the cavity of the curved limiting plate 2 through the through-groove plate 21. With the connection of the spray pipe 23, the electrolyte is evenly sprayed onto both sides of the basket unit 3 through evenly distributed spray holes. Since the basket unit 3 is in a horizontal reciprocating motion, the spray holes can fully spray onto the wafer surface, maintaining the comprehensiveness of the coating. It should also be noted that a turbulence-inducing component is provided on the inner side of the curved limiting plate 2. The turbulence assembly includes a parallel tube 24 and a turbulence blade 241. The two ends of the parallel tube 24 are fixedly connected to the inner side of the curved limiting plate 2, and the turbulence blade 241 is rotatably installed on the outside of the parallel tube 24 through bearings. By adding the turbulence assembly, the water jet from the uniform spray hole can be satisfied, and the water flow can be disturbed. At the same time, the turbulence blade 241 rotates to accelerate the water flow vortex, avoid coating dead angles, and during the horizontal reciprocating process of the basket unit 3, the bottom side of the abutting support rod 34 repeatedly contacts the turbulence blade 241, which can also achieve auxiliary cleaning of the crystals formed at the bottom of the abutting support rod 34, improve the treatment effect, and facilitate later maintenance.

[0040] Example 4, see attached document Figure 1-13Based on Example 3, to achieve more thorough wafer assisted shaking and accelerate the completeness of coating: a corrugated plate 22 is fixedly installed on the inner circumferential surface of the through slot plate 21, and an auxiliary shaking component is provided on the inner side of the corrugated plate 22. The horizontal cross-section of the corrugated plate 22 has a wavy structure, and the side view of the corrugated plate 22 has an isosceles trapezoidal structure with a high middle and low two sides. The auxiliary shaking component includes a snap-fit ​​insert 341 and a connecting curved tube 35. The outer surface of the snap-fit ​​insert 341 is adapted to fit into the inner wall of the snap-fit ​​slot 340. The two ends of the connecting curved tube 35 are respectively fixedly connected to the inner side of the snap-fit ​​insert 341, and a [missing information - likely a component or element] is fixedly installed at the center of the connecting curved tube 35. A limiting collar 351 is slidably connected to the inner wall of the center of the limiting collar 351. The lower end of the lifting rod 36 is provided with a rounded corner. The outer surface of the rounded corner is in movable contact with the inner surface of the corrugated plate 22. A fixing ring 361 is fixedly installed at the upper end of the lifting rod 36. Movable rod 362 is rotatably connected to both sides of the fixing ring 361. A contacting curved plate 365 is movably connected to the other end of the movable rod 362. Movable rod 363 is movably connected to the outer surface of the movable rod 362. A sliding collar 364 is hinged to the other end of the movable rod 363. The inner surface of the sliding collar 364 is movably connected to the outer surface of the connecting curved tube 35.

[0041] In this embodiment, by connecting an abutment support rod 34 to the bottom side of the connecting end plate 31, the bottom of the wafer can be supported to prevent it from falling. Furthermore, an auxiliary shaking component is installed inside the mounting slot 340 to achieve small-amplitude longitudinal shaking of the basket unit 3 during horizontal reciprocating motion. Specifically, refer to 9- Figure 12 As shown, when the basket unit 3 moves horizontally and reciprocally, the rounded end of the bottom of the lifting rod 36 contacts the upper side of the corrugated plate 22. At this time, the lifting rod 36 moves longitudinally inside the limiting collar 351, causing the fixed ring 361 on the top side to move. Then, the angles of the first movable rod 362 and the second movable rod 363 change, thereby causing the contact plate 365 to contact and move away from the bottom of the wafer. This achieves a small longitudinal vibration of the wafer. With this setting, the efficiency of the vibration coating can be increased, and the bubbles in the microporous structure formed on the wafer can be broken, realizing the separation of the bubbles from the wafer, further improving the coating effect of the semiconductor wafer. This auxiliary vibration component can not only achieve auxiliary vibration of the wafer to achieve uniform coating thickness, but also provide auxiliary support for the bottom of the wafer to prevent the wafer from falling.

[0042] Example 5, see attached document Figure 1-13 Based on Example 4, the present invention also proposes a method for using a shaking mechanism in a semiconductor wafer electroless plating process tank, comprising the following steps:

[0043] Step 1, Wafer Mounting and Clamping Reinforcement: Multiple wafers are mounted into the wafer coating assembly basket unit 3. Two sets of connecting end plates 31 and two sets of clamping side plates 32 form a enclosure structure. The wafers are flexibly clamped on both sides by the snap-fit ​​pieces 321 and the flexible clamping bladder plate 322 inside the clamping side plates 32. The basket unit 3 is clamped and reinforced with the help of the limiting unit to ensure that the wafers are mounted securely.

[0044] Step 2: Drive the horizontal reciprocating motion of the wafer: Turn on the drive device motor 41 to make its output shaft rotate, which drives the circular plate 42 to rotate. The eccentric protrusion 421 rotates eccentrically around the center origin of the circular plate 42, which in turn drives the eccentric arm 431 to eccentrically swing. The swing protrusion 44 moves inside the center limiting groove 450, and moves the horizontal slide bar 45 horizontally under the limiting action of the sliding groove 40. Through the limiting unit, the basket unit 3 and the whole wafer are driven to perform horizontal reciprocating motion, so that the wafer is in full contact with the electrolyte and avoids coating dead corners.

[0045] Step 3: Achieve uniform wafer coating: The electrolyte inside the working chamber 10 is drawn by a suction pump, enters the cavity of the curved limiting plate 2 through the through-channel plate 21, and is then evenly sprayed onto the wafers on both sides of the basket unit 3 through the uniform spray holes on the spray pipe 23. The baffle blades 241 in the baffle assembly rotate under the action of the water flow, accelerating the water flow vortex and further avoiding coating dead corners. At the same time, the bottom side of the abutting support rod 34 repeatedly contacts the baffle blades 241, which helps to clean the crystals formed at the bottom of the abutting support rod 34.

[0046] Step 4, Assisted Wafer Longitudinal Shaking: When the basket unit 3 reciprocates horizontally, the rounded end of the bottom of the lifting rod 36 contacts the upper side of the corrugated plate 22. The lifting rod 36 moves longitudinally inside the limiting collar 351, driving the fixed ring 361 to move, causing the angles of the movable rod 1 362 and movable rod 2 363 to change, thereby driving the contact plate 365 to contact and move away from the bottom of the wafer, realizing small-amplitude longitudinal shaking of the wafer. Through assisted shaking, the coating efficiency is increased, the bubbles in the micropore structure on the wafer are broken, the bubbles are peeled off from the wafer, and the coating effect is improved.

[0047] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer electroless plating process tank shaking mechanism, comprising a wafer electroless plating film tank (1), the lower end of the wafer electroless plating film tank (1) is provided with a working cavity (10), the upper end of the working cavity (10) is fixedly installed with a guide rod (11), characterized in that: The inner part of the working cavity (10) is provided with a wafer basket limiting assembly and a wafer coating assembly, the wafer basket limiting assembly comprises a bent limiting plate (2), the wafer coating assembly comprises a basket unit (3), a shaking unit and a limiting unit, the wafer coating assembly is movably arranged at the inner side of the wafer basket limiting assembly, and the wafer basket limiting assembly is fixedly installed in the inner cavity of the working cavity (10); The basket unit (3) is composed of a connecting end plate (31), a clamping piece side plate (32), a center reinforcing plate (33) and an abutting supporting rod (34), the connecting end plate (31) and the clamping piece side plate (32) are both provided with two groups, the two ends of the two groups of clamping piece side plates (32) are fixedly connected with the inner sides of the connecting end plates (31) respectively, the abutting supporting rod (34) is fixedly installed at the lower end of the connecting end plate (31), and a clamping groove (340) is formed in the upper inner wall of the abutting supporting rod (34), the center reinforcing plate (33) is located at the center inner side of the clamping piece side plate (32) and is fixedly connected with the inner side surface thereof, a pull ring (331) is fixedly installed at the upper end of the center reinforcing plate (33), a lifting lug (332) is fixedly connected with the upper surface of the pull ring (331), and the inner surface of the lifting lug (332) is slidably connected with the outer surface of the guide rod (11); The shaking unit comprises a Y-shaped fixed back plate (4), a sliding groove (40) is formed in the upper end of the Y-shaped fixed back plate (4), a horizontal sliding rod (45) is slidably connected with the inner side surface of the sliding groove (40), and a protruding plate is additionally arranged at the center of the horizontal sliding rod (45), and a center limiting groove (450) is formed in the inner wall of the protruding plate; The shaking unit further comprises a motor (41) and a circular plate (42), the motor (41) is fixedly installed at the back outer surface of the wafer chemical coating groove (1), the circular plate (42) is fixedly installed on the output shaft of the motor (41), the circular plate (42) is rotatably installed on the side surface of the Y-shaped fixed back plate (4) away from the motor (41), and an eccentric protruding column (421) is fixedly installed on the outer surface of the circular plate (42); A limiting column (43) is rotatably connected with the lower end inner wall of the Y-shaped fixed back plate (4), an eccentric swing arm rod (431) is fixedly installed on the outer surface of the limiting column (43), an active groove (4310) is formed in the inner wall of the eccentric swing arm rod (431), the inner surface of the active groove (4310) is movably connected with the outer surface of the eccentric protruding column (421), a swing protruding column (44) is fixedly installed on the end of the eccentric swing arm rod (431) away from the limiting column (43), and the outer surface of the swing protruding column (44) is movably connected with the inner side of the center limiting groove (450). The limiting unit comprises double-end embracing poles (5) fixedly connected with both sides of the connecting end plate (31) through bolts, two groups of the double-end embracing poles (5) are mirror-imaged distributed about the longitudinal center axis of the clamping side plate (32), one end of the two groups of the double-end embracing poles (5) is fixedly connected with both ends of the horizontal sliding rod (45), and the other end of the double-end embracing poles (5) away from the horizontal sliding rod (45) is slidingly connected with the upper outer surface of the curved limiting plate (2).

2. The semiconductor wafer electroless plating process tank shaking mechanism according to claim 1, characterized in that: One side upper end of the curved limiting plate (2) is fixedly connected with the inner wall of the working cavity (10), and the lower end of the curved limiting plate (2) is fixedly installed with a through groove plate (21), which is in a hollow plate structure, and the lower end of the through groove plate (21) is fixedly installed with a liquid guide inlet pipe (210).

3. The semiconductor wafer electroless plating process tank shaking mechanism of claim 2, wherein: The curved limiting plate (2) is in a hollow tubular structure, the inner wall of the curved limiting plate (2) is throughly connected with both ends of the through groove plate (21), the inner side of the curved limiting plate (2) is fixedly through with a water spraying pipe (23), and the inner wall of the water spraying pipe (23) is uniformly provided with uniform spray holes.

4. The semiconductor wafer electroless plating process tank shaking mechanism of claim 3, wherein: The inner side surface of the through groove plate (21) is fixedly installed with a wave strip plate (22), the inner side of the wave strip plate (22) is provided with an auxiliary shaking member, the horizontal cross section of the wave strip plate (22) is in a wave shape structure, and the side view cross section of the wave strip plate (22) is in an isosceles trapezoidal structure with the middle part being higher and the two side parts being lower.

5. The semiconductor wafer electroless plating process tank shaking mechanism of claim 4, wherein: The auxiliary shaking member comprises a clamping embedded block (341) and a connecting curved pipe (35), the outer surface of the clamping embedded block (341) is adaptively embedded with the inner wall of the clamping groove (340), both ends of the connecting curved pipe (35) are fixedly connected with the inner side of the clamping embedded block (341), the center of the connecting curved pipe (35) is fixedly installed with a limiting sleeve ring (351), the center inner wall of the limiting sleeve ring (351) is slidingly connected with a jacking rod (36), the lower end of the jacking rod (36) is provided with a rounded corner, the outer surface of the rounded corner is movably abutted with the inner side surface of the wave strip plate (22), the upper end of the jacking rod (36) is fixedly installed with a fixed ring (361), both sides of the fixed ring (361) are rotatably connected with movable rods one (362), the other end of the movable rod one (362) is movably connected with a resisting curved plate (365), the outer side surface of the movable rod one (362) is movably connected with a movable rod two (363), the other end of the movable rod two (363) is hingedly installed with a sliding sleeve ring (364), and the inner surface of the sliding sleeve ring (364) is movably connected with the outer surface of the connecting curved pipe (35).

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