Model-driven optoelectronic integrated link analysis system and method

Abstract

The invention relates to a model-driven optoelectronic integrated link analysis system and method. The system comprises a signal transmitting terminal model used for generating an original electric signal; the electric interconnection model comprises at least one electric interconnection sub-model and is used for simulating input and output characteristics of an electric interconnection device and outputting a primary electric signal according to the original electric signal; the electric photoelectric equivalent model comprises at least one electric photoelectric equivalent sub-model and is used for simulating the input and output characteristics of an electric photoelectric link and outputting a secondary electric signal according to the primary electric signal; and the signal receiving end model is used for analyzing the secondary electric signal to obtain an analysis result. The system solves the problems that in existing optoelectronic integrated link modeling, a photoelectric interconnection model is tedious to build, and signal integrity analysis is difficult.

Description

Technical Field

[0001] The present application relates to the field of optical communications, and in particular to a model-driven optoelectronic integrated link analysis system and method. Background Art

[0002] With the explosive growth in demand for high-speed interconnects driven by high-bandwidth applications such as artificial intelligence and data centers, optoelectronic integration technologies such as silicon photonics and co-packaged optics (CPO) have become key approaches to addressing the bandwidth bottleneck of high-speed interconnects. In optoelectronic collaborative design, signal integrity analysis of end-to-end optoelectronic interconnect links is required, involving collaborative modeling of multiple links, including electrical interconnection, electro-optical conversion, optical transmission, and optoelectronic conversion. However, optoelectronic interconnect link design faces multiple challenges, including high bandwidth, low power consumption, and thermal management. The traditional "trial and error" R&D model is no longer sufficient, and an efficient, accurate, and low-cost optoelectronic link analysis system is urgently needed.

[0003] Traditionally, optoelectronic integrated link modeling tools have mostly performed independent simulations targeting a single physical field. Optoelectronic devices require specialized optical tools for simulation, making coordination with electrical circuits difficult. Signal data must be frequently switched between multiple simulation software packages, making model building a cumbersome process. Furthermore, when the number and variety of optoelectronic devices in a link are large, model modification or migration becomes extremely complex, severely limiting design efficiency. Furthermore, optimizing optoelectronic interconnects typically requires specialized optical knowledge, making it difficult for non-experts to quickly identify problems. Therefore, achieving efficient optoelectronic integrated link modeling is a critical issue that needs to be addressed for signal integrity analysis of optoelectronic interconnects. Summary of the Invention

[0004] Based on the above technical problems, an embodiment of the present application provides a model-driven optoelectronic integrated link analysis system and method.

[0005] In a first aspect, the present application provides a model-driven optoelectronic integrated link analysis system, comprising:

[0006] Signal transmitter model, used to generate the original electrical signal;

[0007] an electrical interconnection model, comprising at least one electrical interconnection sub-model, for simulating input and output characteristics of an electrical interconnection device and outputting a primary electrical signal according to the original electrical signal;

[0008] an electro-optical equivalent model, comprising at least one electro-optical equivalent sub-model, for simulating input and output characteristics of the electro-optical link and outputting a secondary electrical signal according to the primary electrical signal;

[0009] The signal receiving end model is used to analyze the secondary electrical signal to obtain an analysis result.

[0010] In one embodiment, the electrical interconnection model is constructed by modeling and simulating the electrical interconnection device to obtain a parameterized model of the electrical interconnection device, and is constructed according to input and output characteristics of the parameterized model.

[0011] In one embodiment, the electrical interconnection model is constructed by obtaining a parameterized model of the electrical interconnection device through experiments and based on input and output characteristics of the parameterized model.

[0012] In one embodiment, the electro-optical equivalent model is constructed by simulating the electro-optical link to build an electro-optical link model, evaluating the input and output characteristics of the electro-optical link model to obtain characteristic parameters for characterizing the electro-optical link, and is constructed based on the characteristic parameters.

[0013] In one embodiment, the at least one electrical interconnection sub-model is sequentially connected to the output end of the signal transmitting end model, and the at least one electro-optical equivalent sub-model is sequentially connected to the output end of the terminal electrical interconnection model.

[0014] In one embodiment, the at least one electrical interconnection sub-model and the at least one electrical-photoelectric equivalent sub-model are connected in series at intervals between the signal transmitting end model and the signal receiving end model.

[0015] In a second aspect, the present application also provides a model-driven optoelectronic integrated link analysis method, including:

[0016] Build a signal transmitter model and use it to generate the original electrical signal;

[0017] Building an electrical interconnection model to output a primary electrical signal according to the original electrical signal by simulating input and output characteristics of the electrical interconnection device; the built electrical interconnection model includes at least one electrical interconnection sub-model;

[0018] Building an electro-optical equivalent model to output a secondary electrical signal according to the primary electrical signal by simulating the input and output characteristics of the electro-optical link; the electro-optical equivalent model includes at least one electro-optical equivalent sub-model;

[0019] A signal receiving end model is constructed, and the secondary electrical signal is analyzed to obtain analysis results.

[0020] In one embodiment, building the electrical interconnection model includes:

[0021] Modeling and simulating the electrical interconnection device to obtain a parameterized model of the electrical interconnection device;

[0022] The electrical interconnection model is constructed according to the input and output characteristics of the parameterized model.

[0023] In one embodiment, building the electrical interconnection model includes:

[0024] Acquire a parameterized model of the electrical interconnection device through experiments;

[0025] The electrical interconnection model is constructed according to the input and output characteristics of the parameterized model.

[0026] In one embodiment, the building of the electro-optical equivalent model includes:

[0027] Simulating the electro-optical link and building an electro-optical link model;

[0028] Obtaining input and output characteristics of the electrical-optical-electrical link model;

[0029] The input and output characteristics are evaluated, characteristic parameters used to characterize the electrical-optical-electrical link are extracted, and an electrical-optical-electrical equivalent model is obtained.

[0030] The model-driven optoelectronic integrated link analysis system and method described above converts optoelectronic link device models into parameter form through an electro-optical equivalent model, simplifying the modeling process of optoelectronic interconnect links. Integrating the electro-optical equivalent model and the electrical interconnect model into the same system solves the cumbersome data format conversion problem caused by frequent switching between multiple software packages when co-simulating optoelectronic devices and electrical circuits in traditional optoelectronic integrated link analysis. Optimizing optoelectronic interconnect links through equivalent parameter models enables designers to quickly locate link issues through electrical signal analysis, achieving efficient optoelectronic integrated link modeling and signal integrity analysis. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments of the present application or related technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 is a structural block diagram of an optoelectronic integrated link analysis system in one embodiment;

[0033] Figure 2 Schematic diagram of a flow chart of a method for constructing an electro-optical equivalent model in one embodiment;

[0034] Figure 3 Schematic diagram of signal integrity analysis of optoelectronic interconnection of an electrical-optical link model in one embodiment;

[0035] Figure 4A schematic diagram of an electro-optical equivalent model for signal integrity analysis of an optoelectronic interconnection in one embodiment;

[0036] Figure 5 A flowchart of an optoelectronic integrated link in an orderly cascaded manner in one embodiment;

[0037] Figure 6 A flowchart of an optoelectronic integration link with disordered cascading in one embodiment;

[0038] Figure 7 1 is a flow chart of an optoelectronic integrated link analysis method according to an embodiment;

[0039] Figure 8 A schematic diagram of a process for building an electro-optical equivalent model in one embodiment. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0041] In the field of optical communications, signal integrity analysis refers to the process of evaluating and optimizing the waveform and logical integrity of electrical signals within transmission links. In the field of optoelectronic integration, its core goal is to ensure that high-speed electrical signals maintain their original amplitude, phase, and timing characteristics after transmission through electrical interconnects and optical links, avoiding signal distortion caused by factors such as attenuation, noise, and inter-symbol interference. Signal integrity analysis is primarily performed using simulation modeling tools. Existing technologies typically require separate simulation platforms for the electrical and optical domains.

[0042] Figure 1 This is a block diagram of the structure of a model-driven optoelectronic integrated link analysis system for some embodiments of the present application. As shown in the figure, the system includes a signal transmitter model 100, an electrical interconnect model 200, an electro-optical equivalent model 300, and a signal receiver model 400, which are connected in sequence. These models are integrated into a single simulation environment, eliminating the need for designers to manually transfer data between optical and electrical tools. The system can directly adapt to the needs of high-speed serial data transmission in SerDes (Serializer / Deserializer) communication technology, supporting signal simulation of common modulation formats such as NRZ and PAM4, as well as signal integrity analysis of processes such as electrical interconnect loss and optical transmission characteristics in SerDes links.

[0043] The signal transmitter model 100 is used to generate the original electrical signal. The model can provide an excitation signal source that meets the operating range of the optoelectronic device by setting the modulation format, rate, code type, impedance, swing, and equalization of the original signal.

[0044] The electrical interconnect model 200 includes at least one electrical interconnect sub-model, which is used to simulate the input and output characteristics of the electrical interconnect device and output a primary electrical signal based on the original electrical signal. The electrical interconnect model can set equivalent parameters so that the electrical signal is affected by the electrical link and produces a certain degree of attenuation. Specifically, the electrical interconnect sub-model connected to the signal transmitting end is the transmitting end electrical interconnect sub-model, which receives the original electrical signal output by the signal transmitting end and introduces the influence of the transmitting end electrical link to obtain the primary electrical signal; the electrical interconnect sub-model connected to the signal receiving end is the receiving end electrical interconnect sub-model, which outputs the received electrical signal affected by the output end electrical link.

[0045] The electro-optical equivalent model 300 includes at least one electro-optical equivalent sub-model, which simulates the input and output characteristics of the electro-optical link and outputs a secondary electrical signal based on the primary electrical signal. The electro-optical equivalent model can output a secondary electrical signal that represents the complete photoelectric conversion effect by setting equivalent parameters extracted through linear or nonlinear evaluation. It will be understood that in the electro-optical equivalent model, the primary electrical signal is primarily affected by the electro-optical modulator, optical link, and photodetector. This signal may introduce noise and produce certain linear and nonlinear effects such as attenuation, intersymbol interference, and crosstalk.

[0046] The signal receiving end model 400 is used to analyze the secondary electrical signal. Specifically, the received electrical signal output by the receiving end electrical interconnection sub-model is ultimately equalized and analyzed by the signal receiving end model, and then outputs the target electrical signal. This model can set the signal's modulation format, timing, and equalization parameters. It can also provide multi-dimensional analysis capabilities as needed, including eye diagram generation based on time-domain analysis results and bit error rate analysis. Based on these analysis results, it can reversely optimize the parameters of the preamble model.

[0047] The system provided by the above embodiments replaces the traditional independent multi-physics simulation model by building an electrical interconnect model and an electro-optical equivalent model within the same platform. This solves the problems of cross-platform data switching, difficult data format conversion, and high computing power consumption associated with multiple modeling tools. Designers can leverage the end-to-end link framework to quickly analyze circuit metrics, locate attenuation nodes or noise sources within the link, and achieve efficient optimization of optoelectronic integrated links.

[0048] In some embodiments, the electrical interconnect model is constructed by modeling and simulating the electrical interconnect device to obtain a parametric model of the electrical interconnect device, and based on the input and output characteristics of the parametric model. It can be understood that the core of parametric modeling is to obtain the input and output characteristics of the device through two paths: simulation extraction or experimental measurement. Specifically, the electrical interconnect device is modeled using simulation software, its electromagnetic characteristics are analyzed through frequency domain scanning, characteristic parameters are extracted, and then a parametric model representing the input and output characteristics of the device is generated through rational function fitting and other methods. This model can describe characteristics such as amplitude attenuation and phase shift of the electrical signal during transmission.

[0049] In other embodiments, the electrical interconnect model can also be obtained through experiments. Specifically, a network analyzer can be used to perform frequency sweep measurements on actual devices to obtain transmission characteristic curves, or a time domain reflectometer (TDR) and a time domain transmeter (TDT) can be used to measure reflection and transmission characteristics. The measured data can then be mapped to model parameters to form a parameterized model based on the experimental data.

[0050] The parameterized models obtained through the above simulation extraction or experimental measurement methods can characterize the input and output characteristics of the electrical interconnection device, and then construct an electrical interconnection model to simulate the primary electrical signal output after the electrical signal is transmitted through the device.

[0051] In an exemplary embodiment, Figure 3 As shown, the electro-optical equivalent model is constructed by simulating the electro-optical link to build an electro-optical link model, evaluating the input and output characteristics of the electro-optical link model to obtain characteristic parameters for characterizing the electro-optical link, and is constructed based on the characteristic parameters.

[0052] Specifically, an electro-optical link including an electro-optical modulator, an optical fiber, and a photodetector is constructed using simulation software, including but not limited to VPIphotonics, ADS, and OptiSystem.

[0053] An electrical signal within a preset range is input to the link, and the electrical signal at the link's output is obtained through simulation. Linear or nonlinear evaluation of the input and output signals is then performed to extract characteristic parameters. Linear evaluation parameters can be obtained by calculating the amplitude-frequency response and phase-frequency response of the transfer function. Nonlinear evaluation parameters can also be extracted by analyzing intersymbol interference and noise power spectral density.

[0054] Through the extraction of the above feature parameters, such as Figure 2 As shown, an electro-optical link can be represented end-to-end using a mathematical model, known as an electro-optical equivalent model. This model simulates optical links and components such as photodetectors by setting equivalent parameters, introducing noise and generating a certain amount of signal attenuation and inter-symbol interference.

[0055] Through the method of this embodiment, a parameterized model can be used to replace the traditional multi-physics collaborative simulation of a complete electro-optical link, avoiding the problems of signal format conversion and computing power scheduling on multiple simulation platforms. Computing power only needs to be consumed to calibrate the model when the equivalent model is constructed. Thereafter, the migration, maintenance, and computing costs of the model are greatly reduced.

[0056] As a comparison, Figure 3 This example illustrates an example of signal integrity analysis for SerDes (SerDes) optical / electrical interconnects. The electro-optical link model in this example consists of a driver module, an electro-optical modulator, an optical fiber, a photodetector, and a transimpedance amplifier, all connected in sequence. After passing through the electro-optical modulator, the optical signal is combined into a single optical fiber using wavelength division multiplexing (WDM). Demultiplexing then separates the wavelengths and transmits them to the photodetector. The signal transmitter and receiver are each described by an IBIS-AMI model; the transmitter outputs a signal modulated in either PAM4 or NRZ format. By setting reasonable baud rate, matching impedance, swing, and feedforward equalization parameters, the waveform and eye diagram of the original electrical signal at the output node of the signal transmitter model can be obtained; after the original electrical signal passes through the passive electrical interconnection model of the transmitter, it outputs a primary electrical signal, the signal swing is attenuated, and the eye height and eye width of the eye diagram are reduced; after the primary electrical signal passes through the electro-optical link model, it outputs a secondary electrical signal, and the signal swing further changes; the secondary electrical signal then passes through the electrical interconnection model of the receiver to output the received electrical signal, and the signal swing further changes; finally, the received electrical signal passes through the signal receiver model to output the target electrical signal. Relying on the built-in signal processing mechanisms of the IBIS-AMI model, such as continuous-time linear equalization, feedforward equalization, and decision feedback equalization, signal restoration is achieved and the signal-to-noise ratio and bit error rate are analyzed.

[0057] In contrast, Figure 4 For the link using the electrical interconnection model and the electro-optical equivalent model of the present invention. Parameters are extracted from the complete electro-optical link model and converted into a single electro-optical equivalent model. The above electro-optical interconnection signal integrity analysis is repeated to obtain eye diagrams at different nodes. Figure 3 and Figure 4 The eye diagrams at the corresponding nodes show that the analysis results of the two links are essentially consistent. However, the use of equivalent models enables efficient link simulation, avoiding signal format conversion across multiple simulation platforms. If the model needs to be modified, it can be done directly by modifying the equivalent parameters. Furthermore, if model migration is required, only the model parameters need to be saved and migrated, eliminating the need to save and migrate every component in the link, improving model migration efficiency. Furthermore, this system helps non-optical designers quickly locate design flaws based on signal eye diagrams and bit error rates. Using the electro-optical equivalent model approach, model parameters can be tracked and optimized, improving optimization efficiency and effectively optimizing link equalization parameters.

[0058] In an exemplary embodiment, Figure 5 As shown, the signal transmitting end model generates an original electrical signal and passes through a series of M cascaded electrical interconnection sub-models, namely, electrical interconnection sub-model 201 to electrical interconnection sub-model 20M, to output a primary electrical signal; the primary electrical signal then passes through a series of N cascaded electro-optical equivalent sub-models, namely, electro-optical equivalent sub-model 301 to electro-optical equivalent sub-model 30N to output a received electrical signal; the received electrical signal finally passes through the signal receiving end model to output a target electrical signal and analyze the signal-to-noise ratio and bit error rate. This embodiment is an ordered signal link model. The multi-cascade electrical interconnection model can be implemented by a multi-layer signal processing circuit. The application scenario can be short-distance electrical signal routing, that is, the transmitting end signal needs to pass through multiple signal transfer stations to reach the target receiving end; similarly, the multi-cascade electro-optical equivalent sub-model can be implemented by a multi-layer optical link. The application scenario can be long-distance optical signal routing, that is, the transmitting end signal needs to pass through multiple optical fibers to reach the target receiving end.

[0059] It should be noted that, in addition to being able to be sequentially cascaded, the electro-optical equivalent sub-model and the electrical interconnection sub-model can also be constructed in the form of a disordered mixed cascade. In another exemplary embodiment, Figure 6 As shown, the original electrical signal generated by the signal transmitting end model needs to pass through M electrical interconnection sub-models in any order, namely, electrical interconnection sub-model 201 to electrical interconnection sub-model 20M, and N electrical-photoelectric equivalent sub-models, namely, electrical-photoelectric equivalent sub-model 301 to electrical-photoelectric equivalent sub-model 30N, before reaching the signal receiving end model. The M electrical interconnection sub-models and N electrical-photoelectric equivalent sub-models can be arranged in any order. This embodiment is an unordered signal link model, and the application scenario can be long-distance signal routing, that is, the transmitting end signal needs to pass through a hybrid link of multiple electrical signal transfer stations and multiple optical fibers to reach the target receiving end.

[0060] Based on the same inventive concept, the present application also provides an analysis method for implementing the aforementioned model-driven optoelectronic integrated link analysis system. The solution provided by this method is similar to the solution described in the aforementioned system. Therefore, the specific limitations in one or more of the following method embodiments can be found in the aforementioned limitations on the model-driven optoelectronic integrated link analysis system and will not be further elaborated here.

[0061] In an exemplary embodiment, Figure 7 As shown, a model-driven optoelectronic integrated link analysis method is provided, which includes steps S701 to S704:

[0062] S701, building a signal transmitter model, and using the signal transmitter model to generate an original electrical signal;

[0063] S702, constructing an electrical interconnection model, simulating input and output characteristics of an electrical interconnection device, and outputting a primary electrical signal according to the original electrical signal; the constructed electrical interconnection model includes at least one electrical interconnection sub-model;

[0064] S703, building an electro-optical equivalent model, simulating the input and output characteristics of the electro-optical link, and outputting a secondary electrical signal according to the primary electrical signal; the electro-optical equivalent model includes at least one electro-optical equivalent sub-model;

[0065] S704: Build a signal receiving end model, analyze the secondary electrical signal, and obtain an analysis result.

[0066] Furthermore, in some embodiments, step S702 may be implemented by: modeling and simulating the electrical interconnection device to obtain a parameterized model of the electrical interconnection device; and constructing the electrical interconnection model according to input and output characteristics of the parameterized model.

[0067] In other embodiments, step S702 may also be implemented by: experimentally acquiring the electrical interconnect device for modeling, simulating to obtain a parameterized model of the electrical interconnect device, and constructing the model based on input and output characteristics of the parameterized model.

[0068] In some embodiments, as Figure 8 As shown, the method for building the electro-optical equivalent model in step S703 specifically includes steps S801 to S803:

[0069] S801, simulating the electro-optical link and building an electro-optical link model;

[0070] S802, obtaining input and output characteristics of the electrical-optical-electrical link model;

[0071] S803 , evaluating the input and output characteristics, extracting characteristic parameters for characterizing the electrical-optical-electrical link, and obtaining an electrical-optical-electrical equivalent model.

[0072] Those skilled in the art will understand that all or part of the processes in the above-mentioned embodiments can be implemented by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. In particular, any reference to memory, database, or other media used in the embodiments provided in this application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The databases involved in the various embodiments provided herein may include at least one of a relational database and a non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the various embodiments provided herein may be, but are not limited to, general-purpose processors, central processing units (CPUs), graphics processing units (GPUs), digital signal processors (DSPs), programmable logic devices (PLDs), quantum computing-based data processing logic devices, artificial intelligence (AI) processors, and the like.

[0073] The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0074] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

Claims

1. A model-driven optoelectronic integrated link analysis system, characterized in that: The system comprises: Signal transmitter model, used to generate the original electrical signal; an electrical interconnection model, comprising at least one electrical interconnection sub-model, for simulating input and output characteristics of an electrical interconnection device and outputting a primary electrical signal according to the original electrical signal; an electro-optical equivalent model, comprising at least one electro-optical equivalent sub-model, for simulating input and output characteristics of the electro-optical link and outputting a secondary electrical signal according to the primary electrical signal; The signal receiving end model is used to analyze the secondary electrical signal to obtain an analysis result.

2. The system according to claim 1, wherein: The electrical interconnection model is constructed by modeling and simulating the electrical interconnection device to obtain a parameterized model of the electrical interconnection device, and is constructed according to input and output characteristics of the parameterized model.

3. The system according to claim 1, wherein: The electrical interconnection model is constructed by obtaining a parameterized model of the electrical interconnection device through experiments and based on input and output characteristics of the parameterized model.

4. The system according to claim 1, wherein: The electro-optical equivalent model is constructed by simulating the electro-optical link to build an electro-optical link model, evaluating the input and output characteristics of the electro-optical link model to obtain characteristic parameters for characterizing the electro-optical link, and is constructed based on the characteristic parameters.

5. The system according to claim 1, wherein: The at least one electrical interconnection sub-model is sequentially connected to the output end of the signal transmitting end model, and the at least one electrical-photoelectric equivalent sub-model is sequentially connected to the output end of the terminal electrical interconnection model.

6. The system according to claim 1, wherein: The at least one electrical interconnection sub-model and the at least one electrical-photoelectric equivalent sub-model are connected in series at intervals between the signal transmitting end model and the signal receiving end model.

7. A model-driven optoelectronic integrated link analysis method, characterized in that: include: Build a signal transmitter model and use it to generate the original electrical signal; Building an electrical interconnection model, simulating input and output characteristics of the electrical interconnection device, and outputting a primary electrical signal according to the original electrical signal; The electrical interconnection model building includes at least one electrical interconnection sub-model; Building an electro-optical equivalent model to simulate the input and output characteristics of the electro-optical link and output a secondary electrical signal according to the primary electrical signal; The electro-optical equivalent model includes at least one electro-optical equivalent sub-model; A signal receiving end model is constructed, and the secondary electrical signal is analyzed to obtain analysis results.

8. The method according to claim 7, characterized in that The electrical interconnection model building includes: Modeling and simulating the electrical interconnection device to obtain a parameterized model of the electrical interconnection device; The electrical interconnection model is constructed according to the input and output characteristics of the parameterized model.

9. The method according to claim 7, characterized in that The electrical interconnection model building includes: Acquire a parameterized model of the electrical interconnection device through experiments; The electrical interconnection model is constructed according to the input and output characteristics of the parameterized model.

10. The method according to claim 7, characterized in that The construction of the electro-optical equivalent model includes: Simulating the electro-optical link and building an electro-optical link model; Obtaining input and output characteristics of the electrical-optical-electrical link model; The input and output characteristics are evaluated, characteristic parameters used to characterize the electrical-optical-electrical link are extracted, and an electrical-optical-electrical equivalent model is obtained.

Images