Array flexible tactile sensor packaging layer micro-nano manufacturing method and device

Abstract

The invention discloses an array flexible tactile sensor packaging layer micro-nano manufacturing method and device, and the method comprises the steps: obtaining a performance demand of a packaging layer, and selecting a packaging material of the packaging layer according to the performance demand; forming a packaging substrate based on the packaging material, coating the packaging substrate to form a pre-packaging layer, and constructing a nano-pore structure on the pre-packaging layer; and curing the nano-pore structure, aligning the cured nano-pore structure to a sensing unit of the arrayed flexible tactile sensor by using a micro-nano precise alignment device, recording an alignment position, and fixing the packaging layer on the arrayed flexible tactile sensor according to the alignment position. By preparing the packaging layer with the nano-pore structure, external impurities and interference can be effectively blocked, gas and heat exchange between the sensor and the external environment can be ensured, and the normal working performance of the sensor is maintained.

Description

Technical Field

[0001] The present invention relates to the field of electronic technology, and in particular to a micro-nano manufacturing method and device for an arrayed flexible tactile sensor packaging layer. Background Art

[0002] Arrayed tactile sensors are composed of multiple tactile sensing units arranged in a regular pattern, used to sense and measure spatially distributed tactile information. These sensors mimic the tactile perception of human skin and can detect a variety of physical quantities, including contact pressure, shear force, temperature, and vibration. They are commonly used in robotics, intelligent prosthetics, wearable devices, and human-computer interaction. Due to their array structure, arrayed tactile sensors can achieve simultaneous multi-point detection. They often use flexible substrate materials, allowing them to adapt to curved or irregular shapes. Some sensors in arrayed tactile sensors can simultaneously sense multiple parameters, including pressure and temperature.

[0003] With the development of flexible electronics and smart sensors, arrayed tactile sensors are finding widespread application in robotic skin, intelligent prosthetics, human-computer interaction systems, and wearable devices. Arrayed tactile sensors achieve high-precision sensing of tactile information such as contact pressure, shear force, temperature, and vibration through an array-like layout of multiple sensing units. However, to ensure long-term stable operation of the sensor in complex environments, it must be effectively packaged to isolate external interference factors such as dust, moisture, and chemicals that may affect device performance. Existing packaging technologies often use dense thin film materials or multi-layer structures to encapsulate the sensor. While these packaging methods can provide a certain degree of physical protection, they can also hinder the necessary exchange of gas and heat between the sensor and the external environment, resulting in slow sensor response or unstable operation, especially in high-sensitivity or high-frequency detection scenarios. Furthermore, traditional packaging methods have limited process control precision at the micro- and nanoscale, making it difficult to achieve efficient alignment and stable integration with the arrayed sensing units, thus affecting the consistency and reliability of the sensor's overall performance. Summary of the Invention

[0004] In order to solve the above technical problems, the present invention provides a micro-nano manufacturing method and device for an arrayed flexible tactile sensor packaging layer, which realizes gas and heat exchange between the sensor and the external environment and maintains the normal working performance of the sensor.

[0005] The technical solution of the present invention is:

[0006] A micro-nano manufacturing method for an arrayed flexible tactile sensor packaging layer, comprising:

[0007] Obtaining performance requirements for the encapsulation layer, and selecting an encapsulation material for the encapsulation layer according to the performance requirements;

[0008] forming a packaging substrate based on the packaging material, coating the packaging substrate to form a pre-packaging layer, and constructing a nanoporous structure on the pre-packaging layer;

[0009] The nanoporous structure is solidified, and the solidified nanoporous structure is aligned with the sensing unit of the arrayed flexible tactile sensor using a micro-nano precision alignment device, the alignment position is recorded, and the encapsulation layer is fixed on the arrayed flexible tactile sensor according to the alignment position.

[0010] Preferably, obtaining the performance requirements of the encapsulation layer and selecting the encapsulation material of the encapsulation layer according to the performance requirements includes:

[0011] Obtain key performance requirements and enhanced function requirements of the encapsulation layer;

[0012] Selecting the base material and nanomaterial of the encapsulation layer according to the key performance requirements and the enhanced function requirements;

[0013] The base material and the nanomaterial are mixed to obtain the packaging material of the packaging layer.

[0014] Preferably, the base material and nanomaterial of the encapsulation layer are selected according to the key performance requirements and the enhanced function requirements, respectively, including:

[0015] Obtaining a base material score of the base material according to the key performance requirements, obtaining a nano material score of the nano material according to the key performance requirements and the enhanced function requirements, and obtaining a compatibility coefficient of the packaging material composed of the base material and the nano material;

[0016] The packaging material score of the packaging material is calculated based on the base material score, the nanomaterial score and the compatibility coefficient, and the base material and the nanomaterial are selected according to the packaging material score.

[0017] Preferably, obtaining a base material score of the base material according to the key performance requirements includes:

[0018] Extracting key performance indicators from the key performance requirements and key indicator weights corresponding to the key performance indicators;

[0019] The base material score is calculated according to the key performance indicators and the key indicator weights.

[0020] Preferably, obtaining the nanomaterial score of the nanomaterial according to the key performance requirements and the enhanced function requirements includes:

[0021] Extracting enhanced function indicators and key performance indicators from the enhanced function requirements and the key performance requirements respectively;

[0022] The nanomaterial score is calculated based on the enhanced function index and the key performance index according to preset weights.

[0023] Preferably, the step of constructing a nanoporous structure on the pre-packaging layer comprises:

[0024] coating an electron beam resist on the pre-packaging layer to form a resist layer, exposing the resist layer point by point according to a preset pattern using electron beam exposure, and developing the exposed resist layer to obtain a nanoporous structure;

[0025] or

[0026] A precursor material is coated on the pre-packaging layer to form a precursor layer, a nanoporous mold having the nanoporous structure is imprinted onto the precursor layer, the precursor layer is cured, and the cured precursor layer and the nanoporous mold are separated.

[0027] Preferably, the step of constructing a nanoporous structure on the pre-packaging layer comprises:

[0028] A nanoporous pattern having a nanoporous structure is additively manufactured on the surface of the pre-packaging layer using a removable nanomaterial and the packaging material, the nanoporous pattern is solidified, and the solidified nanoporous pattern is dissolved to obtain a nanoporous structure.

[0029] Preferably, fixing the encapsulation layer on the arrayed flexible tactile sensor according to the alignment position includes:

[0030] Acquiring a sensing unit material of the sensing unit, and selecting an auxiliary bonding material based on the sensing unit material and the packaging material;

[0031] The auxiliary bonding material is coated on the sensing unit to form an auxiliary bonding layer, the auxiliary bonding layer is cured, and the encapsulation layer is fixed on the arrayed flexible tactile sensor provided with the auxiliary bonding layer according to the alignment position.

[0032] Preferably, after fixing the packaging layer on the arrayed flexible tactile sensor according to the alignment position, the method further includes:

[0033] A packaging area between the packaging layer and the sensing unit is microscopically scanned to detect the degree of fit between the packaging layer and the sensing unit, and a packaging consistency evaluation result is output based on the degree of fit.

[0034] The present invention also provides a micro-nano manufacturing device for an arrayed flexible tactile sensor packaging layer, comprising:

[0035] A packaging material selection module, configured to obtain performance requirements of the packaging layer and select packaging materials for the packaging layer according to the performance requirements;

[0036] a nanopore construction module, configured to form a packaging substrate based on the packaging material, coat the packaging substrate to form a pre-packaging layer, and construct a nanopore structure on the pre-packaging layer;

[0037] The sensor packaging module is used to solidify the nanoporous structure, align the solidified nanoporous structure with the sensing unit of the arrayed flexible tactile sensor using a micro-nano precision alignment device, record the alignment position, and fix the packaging layer on the arrayed flexible tactile sensor according to the alignment position.

[0038] The beneficial effects of the present invention are:

[0039] The packaging layer prepared by the present invention has a nano-scale pore structure, which can effectively prevent dust, liquid and other particulate impurities from entering the interior of the sensor, improve the sensor's anti-pollution and anti-interference capabilities, and extend its service life; the nano-pore structure not only provides physical protection, but also retains the heat and gas exchange channels between the sensor and the outside world, preventing the packaging layer from causing thermal lag or response delay in the sensing performance, and ensuring the stability and sensitivity of the sensor in a dynamic environment; nano-scale alignment is achieved through a micro-nano precision alignment device, and the packaging layer is precisely fixed on the sensing unit of the arrayed flexible tactile sensor, effectively improving the packaging accuracy and structural consistency of the device during mass production; the packaged sensor can still maintain the stability and repeatability of its signal output under various environmental stresses, thereby improving the reliability of the overall system. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0041] Figure 1 This is a flow chart of a micro-nano manufacturing method for an arrayed flexible tactile sensor packaging layer of the present invention;

[0042] Figure 2 This is a structural schematic diagram of a micro-nano manufacturing device for an arrayed flexible tactile sensor packaging layer of the present invention. DETAILED DESCRIPTION

[0043] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0044] In order to make the purpose, technical solutions and advantages of the present application clearer, the specific embodiments of the present application are further described in detail below in conjunction with the accompanying drawings. It is understood that the specific embodiments described herein are merely used to explain the present application and are not intended to limit the present application. It should also be noted that, for ease of description, only portions related to the present application, not all of the contents, are shown in the accompanying drawings. Before discussing the exemplary embodiments in more detail, it should be mentioned that some exemplary embodiments are described as processes or methods depicted as flow charts. Although the flow charts describe the various operations (or steps) as being processed sequentially, many of the operations therein can be performed in parallel, concurrently or simultaneously. In addition, the order of the various operations can be rearranged. The process can be terminated when its operations are completed, but may also have additional steps not included in the accompanying drawings. The process can correspond to a method, function, procedure, subroutine, subprogram, etc.

[0045] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the data used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than those illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects connected before and after are in an "or" relationship.

[0046] like Figure 1 As shown, the present invention provides a micro-nano manufacturing method for an arrayed flexible tactile sensor packaging layer, comprising the following steps:

[0047] S110 : Obtain performance requirements of the encapsulation layer, and select an encapsulation material for the encapsulation layer according to the performance requirements.

[0048] For example, it is necessary to first systematically define and quantify the comprehensive performance indicators that the selected packaging layer should have to ensure that it can meet the multi-scenario working requirements of the arrayed flexible tactile sensor in actual applications. Specifically, the physical, chemical and electromagnetic interference factors that the sensor may face in the target application environment should be comprehensively evaluated, including but not limited to complex working conditions such as high humidity, high temperature difference, high mechanical stress, strong electromagnetic radiation, chemically corrosive atmosphere and biological fluids. Based on the above environmental conditions and working scenarios, and further combined with the functional positioning and core performance requirements of the sensor itself, such as response sensitivity, dynamic range, signal linearity, working life and system integration compatibility, a multi-dimensional performance requirement model for the packaging layer is constructed. The model covers performance indicators such as mechanical protection capability, electromagnetic shielding effectiveness, chemical corrosion resistance, thermal management performance, electrical insulation and chemical stability. Mechanical protection capability refers to the ability of the packaging material to maintain structural integrity and functional stability under mechanical loads such as compression, bending, and shear; electromagnetic shielding effectiveness includes the ability to absorb and reflect electromagnetic waves (such as radio frequency, electric field, electromagnetic pulse, etc.) to suppress the impact of external interference on the sensor signal; chemical corrosion resistance refers to the ability to maintain the stability of the material structure and performance after long-term exposure to media such as acid, alkali, salt solution or volatile organic compounds; thermal management performance includes high thermal conductivity for rapid heat conduction, or low thermal conductivity to provide thermal insulation, depending on the specific sensor structure and thermal sensitivity; electrical insulation ensures that the packaging layer does not experience breakdown, leakage, etc., thereby protecting the underlying electrodes and signal processing units; chemical stability refers to the ability of the packaging material to maintain performance without degradation under long-term aging conditions such as air, ultraviolet light, and oxidizing atmosphere.

[0049] S120 , forming a packaging substrate based on the packaging material, coating the packaging substrate to form a pre-packaging layer, and constructing a nanopore structure on the pre-packaging layer.

[0050] For example, after the selection of the encapsulation material system is completed, the film formation of the material on the functional substrate is achieved by a variety of physical or physical-chemical deposition methods to form an initial encapsulation base layer with uniform thickness and continuous structure. Specifically, according to the viscosity, surface tension and solvent volatility characteristics of the selected encapsulation material, spin coating, spray coating, casting or molding can be selected for deposition. Among them, spin coating is suitable for rapid spreading of low-viscosity liquid polymer systems, spray coating is suitable for rapid film formation over a large area, and molding has obvious advantages in situations where local thickness control or surface texture preset is required. In order to further improve the physical adhesion and interface matching ability between the encapsulation layer and the subsequent nano-pattern, the surface properties of the base layer need to be controlled after the initial film formation. Polar functional groups are introduced into the material surface through plasma surface activation treatment, ultraviolet ozone treatment, functional initiator modification or introduction of an interfacial bonding layer, thereby significantly improving its surface energy, wettability and material responsiveness in subsequent pattern processing. Based on excellent surface reactivity, micro- and nanoscale structure construction technology is used to form nanoporous structures with specific geometric, arrangement, and topological characteristics on the surface of the pre-encapsulated layer. Micro- and nanoscale patterns can be obtained through methods such as nanoimprinting, template replication, self-assembled monolayers, and photolithography-induced phase separation. Nanoimprinting involves applying pressure to the encapsulation layer using a hard or soft mold, forming a high-fidelity nanopattern under heating or UV curing conditions. Template replication involves transferring structures using templates such as anodized aluminum oxide, nanospheres, or etched silicon to replicate periodic or quasi-periodic pore arrays. Self-assembled monolayers utilize hydrophobic / hydrophilic interfaces to control the regular arrangement of polymer segments or colloidal particles on a two-dimensional interface, forming an ordered microporous pattern. Photolithography-induced phase separation involves locally altering the solubility of polymer materials through photolithography, inducing two-phase separation to form a multi-scale pore structure. The resulting nanoporous structure has an adjustable pore size range, pore density, and porosity. Its specific geometric parameters can be customized based on the sensor's specific requirements for gas and water vapor transmission rates and contamination shielding levels. The pore morphology can be hexagonal close-packed, bi-periodic interference, or incorporate fractal structures or aperiodic topological networks to achieve selective shielding or transmission of substances of varying particle sizes and molecular weights. The introduction of this micro-nanostructure allows the encapsulation layer to maintain mechanical strength while also exhibiting excellent molecular sieve properties: it effectively shields the sensor from the intrusion of solid impurity particles and liquid-phase contaminants, preventing them from physically blocking the sensor unit or causing performance degradation. It also allows for the orderly exchange of gas and water vapor molecules, maintaining thermal and moisture balance in the sensor's working area and improving its response speed and dynamic stability.

[0051] S130, curing the nanoporous structure, aligning the cured nanoporous structure with the sensing unit of the arrayed flexible tactile sensor using a micro-nano precision alignment device, recording the alignment position, and fixing the encapsulation layer on the arrayed flexible tactile sensor according to the alignment position.

[0052] For example, after constructing a pre-encapsulation layer with a specific pore topology, the nanostructure requires appropriate curing to ensure stable physical morphology and excellent mechanical / interfacial properties during subsequent integration. Depending on the chemical composition and crosslinking mechanism of the selected encapsulation material, thermal curing, UV curing, or chemical crosslinking can be used. Thermal curing is suitable for thermoplastic or thermosetting polymer systems, maintaining the temperature at a set temperature for several minutes to hours to promote crosslinking of the molecular segments. UV curing is suitable for silicone and acrylic materials containing photosensitive groups, and can complete structural curing in seconds to minutes. Chemical crosslinking, on the other hand, introduces a crosslinking agent to form a spatial network structure, thereby enhancing the stability and deformation resistance of the nanoporous framework. After curing, the nanoporous structure not only maintains excellent dimensional retention and structural density, but also controls its flexibility and local elastic modulus through appropriate crosslinking, ensuring that it can adapt to the microscopic topography of the underlying sensing device during the bonding process. This is particularly true in areas with stress concentrations, sudden surface changes, or local structural inhomogeneities, achieving low-stress, highly consistent bonding between the encapsulation layer and the sensing unit. In order to achieve high-precision alignment and assembly between the packaging layer and the sensing area of ​​the arrayed flexible tactile sensor, the present invention adopts a high-resolution microscopic alignment system, including an optical microscopic automatic alignment platform, a femtosecond laser interferometer and a scanning probe auxiliary system. The optical microscopic automatic alignment platform is based on high-magnification imaging and sub-pixel image recognition algorithms to achieve accurate recognition and adjustment of XY two-dimensional displacement; the femtosecond laser interferometer is used for nanometer-level vertical direction (Z-axis) gap measurement and posture compensation; the scanning probe auxiliary system is used to detect the boundary of the sensing unit in the near field and construct a spatial offset vector field to provide feedback closed-loop correction. During the entire alignment process, the system uses a machine vision algorithm to identify the alignment mark points or structural features on the packaging layer and the sensor array, and combines the displacement feedback control mechanism to achieve fully automatic or semi-automatic alignment. Through the coordinated action of software control and mechanical execution units, the packaging layer can be accurately positioned above each sensing unit, and the error is controlled within the range of ±100 nanometers, effectively avoiding the misalignment coupling between the sensing functional area and the packaging pores, thereby maintaining the accuracy and consistency of signal acquisition. After precise alignment, structural integration is achieved using a physical packaging process that combines reliability and gentleness at the micro-nano scale. During the packaging process, the system also records key alignment and assembly parameters in real time, including XY axis translation, Z axis bonding distance, pressing time, and curing energy dose, to facilitate subsequent process quality assessment, precision analysis, and batch-to-batch repeatability control. This data can be used not only for process optimization and defect tracing, but also as a quantitative basis for package integrity verification and failure analysis, providing highly reliable technical support for the industrial packaging of large-scale micro-nano array devices.

[0053] In a preferred embodiment, obtaining the performance requirements of the encapsulation layer and selecting the encapsulation material of the encapsulation layer according to the performance requirements includes:

[0054] Obtain key performance requirements and enhanced function requirements of the encapsulation layer;

[0055] Selecting the base material and nanomaterial of the encapsulation layer according to the key performance requirements and the enhanced function requirements;

[0056] The base material and the nanomaterial are mixed to obtain the packaging material of the packaging layer.

[0057] For example, the key performance requirements and enhanced functional requirements of the encapsulation layer are determined. Key performance requirements include the basic functional requirements that the encapsulation layer must meet in actual application environments, such as excellent mechanical strength, gas / water vapor permeability, electrical insulation, biocompatibility, thermal stability, and chemical inertness. Enhanced functional requirements, on the other hand, refer to performance indicators that add additional capabilities to the encapsulation layer in specific application scenarios, such as electromagnetic shielding capability, UV barrier properties, self-healing ability, antibacterial / antifouling properties, flexible responsiveness, or thermochromic properties. Key performance requirements and enhanced functional requirements can be combined with historical application data and functional evaluation criteria through a task-driven model to form a set of quantitative or semi-quantitative technical parameter indicators. Subsequently, based on this requirement system, a material layering design concept is adopted to select two types of materials that meet different functional objectives to form the encapsulation layer composite material system. In one embodiment, the base material is preferentially selected from polymer matrices with good mechanical support, film-forming properties, and processing compatibility, such as polydimethylsiloxane (PDMS), polyurethane (PU), polyimide (PI), fluorinated elastomers, and polyetheretherketone (PEEK). This type of material provides the necessary mechanical strength, flexibility, and interfacial stability for the encapsulation layer, forming the mechanical skeleton of the encapsulation system. Nanofunctional materials are selected from a series of inorganic or organic nanoparticles with targeted enhanced functions, such as zinc oxide (ZnO), titanium dioxide (TiO2), graphene oxide (GO), MXene, silver nanowires (AgNW), carbon nanotubes (CNT), nanocellulose (CNF), etc. This type of material imparts enhanced functions such as shielding, conductivity, antibacterial, and inductive properties to the matrix through doping, compounding, or surface modification. Finally, through a material composite strategy, the selected base material and functional nanomaterials are mixed in proportion to construct an encapsulation material system with multi-scale structure and multifunctional synergistic properties. The mixing method can be selected according to the dispersibility and interfacial affinity of the nanomaterials, such as solution blending, in situ polymerization, interfacial self-assembly, layer-by-layer self-assembly (LBL), emulsion polymerization, etc., to ensure that the nanoparticles are evenly dispersed in the matrix and form an effective interfacial bond with the polymer chains, thereby improving the structural stability and functional retention of the overall material. Through the above-mentioned layered material selection and interface composite process, the resulting packaging material can not only meet the basic protection and working requirements of the sensor, but also cope with more complex operating environments and functional expansion scenarios, reflecting high integration and high-performance system packaging capabilities.

[0058] In a preferred embodiment, selecting the base material and nanomaterial of the encapsulation layer according to the key performance requirements and the enhanced function requirements respectively includes:

[0059] Obtaining a base material score of the base material according to the key performance requirements, obtaining a nano material score of the nano material according to the key performance requirements and the enhanced function requirements, and obtaining a compatibility coefficient of the packaging material composed of the base material and the nano material;

[0060] The packaging material score of the packaging material is calculated based on the base material score, the nanomaterial score and the compatibility coefficient, and the base material and the nanomaterial are selected according to the packaging material score.

[0061] For example, based on the key performance requirements obtained in the early stage, such as mechanical strength, ductility, film uniformity, thermal conductivity, electrical insulation, etc., a substrate material performance evaluation model for screening substrate materials is constructed. This model normalizes each performance parameter and assigns a weight coefficient, which can be obtained based on the entropy weight method, AHP method or expert scoring method, and then performs weighted calculation on the candidate substrate materials to form a substrate material score BMS. In parallel, a nanomaterial functional evaluation model is constructed based on key performance requirements and enhanced functional requirements, such as electromagnetic shielding capability, biological activity, ultraviolet response, thermochromism, gas selective permeability, etc., to evaluate the comprehensive adaptability of candidate nanomaterials in the target application scenario and obtain a nanomaterial score NMS. Secondly, considering the interaction and interface synergistic performance between the candidate substrate material and the nanomaterial in the composite state, the fusion compatibility and stability during the processing are evaluated, and the material compatibility coefficient MCC is constructed. The compatibility coefficient is used to characterize the composite matching degree and interface fusion ability of the selected substrate material and nanomaterial in terms of physical and chemical properties. This coefficient can be comprehensively quantified based on indicators such as contact angle test, Hansen solubility parameter difference, Zeta potential, dispersion stability test, and interface bonding energy simulation. The value range is 0 to 1. The larger the value, the greater the composite synergy potential of the two materials. Finally, the comprehensive score EMS of the packaging material is calculated as follows:

[0062] EMS = (α·BMS + β·NMS) × MCC

[0063] Among them, α and β are weighting factors, satisfying α + β = 1, which are used to adjust the importance ratio of the substrate material performance and the nanomaterial function. MCC, as a multiplier factor, directly affects the overall score. Even if the material itself has excellent performance, if the composite is incompatible, the system score will drop significantly. This shows that the performance of the packaging material system depends not only on the performance of each material alone, but also on the synergy between their interfaces and the composite behavior. Finally, the system is ranked according to the EMS value to select the optimal substrate material and nanomaterial combination for the construction of a high-performance, multifunctional, and interface-stable tactile sensor packaging layer material system.

[0064] In a preferred embodiment, obtaining a base material score of the base material according to the key performance requirements includes:

[0065] Extracting key performance indicators from the key performance requirements and key indicator weights corresponding to the key performance indicators;

[0066] The base material score is calculated according to the key performance indicators and the key indicator weights.

[0067] For example, based on preset functional scenarios or user input, such as "the sensor is used for tactile perception of skin-attached robots" or "needs to adapt to high humidity, high temperature and long-term continuous working environment", the task description text is extracted through the natural language parsing system to extract the key performance requirement semantic fragments that affect the performance of the packaging layer. Subsequently, the natural language processing algorithm is used in combination with semantic vector models such as BERT, RoBERTa, etc. and material science-specific terminology ontology libraries such as MatBERT, SciBERT or self-built material performance knowledge graphs to automatically extract key performance indicators related to the target sensor. Based on the extracted set of performance indicators, the system further quantifies the importance of each indicator in the original demand corpus through NLP methods such as context-dependent semantic strength analysis, keyword co-occurrence frequency analysis and TF-IDF weight scoring mechanism, thereby generating a semantic weight value w for each key performance indicator. i The semantic weight value reflects the importance of the indicator in the current semantic scenario and can be directly used as the weight input in the performance evaluation model. For example, if the natural language requirement emphasizes "softness and biocompatibility take precedence over heat resistance", the system will automatically assign higher weights to "elastic modulus", "tensile properties" and "cytotoxicity", while the weights of "thermal conductivity" and "thermal stability" will be relatively low. Finally, the performance matching degree of each candidate substrate material is calculated by the following formula:

[0068]

[0069] Among them, w i is the semantic weight of the i-th performance indicator output by the natural language processing system; s i is the standardized performance score of the material under the i-th performance index.

[0070] In a preferred embodiment, obtaining a nanomaterial score of the nanomaterial according to the key performance requirements and the enhanced function requirements includes:

[0071] Extracting enhanced function indicators and key performance indicators from the enhanced function requirements and the key performance requirements respectively;

[0072] The nanomaterial score is calculated based on the enhanced function index and the key performance index according to preset weights.

[0073] For example, natural language processing technology is used to parse the key performance requirement text and the enhanced function requirement text, extracting several key performance indicators (KPIs) and enhanced function indicators (EFIs). This process utilizes a material domain semantic vocabulary, a functional ontology, and a set of standard terminology to ensure the accuracy and completeness of the extracted indicators. The system then assigns a uniform weight coefficient α to all key performance indicators and another uniform weight coefficient β to all enhanced function indicators, where α and β ∈ (0, 1) and satisfy the normalization constraint: α + β = 1.

[0074] Each group of internal indicators is weighted equally, that is, all KPIs have a weight of α / m, and all EFIs have a weight of β / n, where m and n are the number of KPIs and EFIs, respectively. Subsequently, the experimental or simulated values ​​of the candidate nanomaterials under each indicator are retrieved from the material properties database and normalized to a score s i , and obtain its standardized performance in each indicator dimension. Finally, the comprehensive score NMS of the nanomaterial is calculated, and its mathematical expression is:

[0075]

[0076] in, is the score of the nanomaterial under the jth key performance indicator; is the score of the k-th enhancement function indicator; α and β control the contribution ratio of the two types of indicators in the overall evaluation.

[0077] This approach not only ensures the logical clarity and structural symmetry of the scoring system, but also provides a flexible adjustment interface for functional preferences in different application scenarios (for example, medical devices can be set to β>α, while structural functional devices can be set to α>β), thereby significantly improving the configurability and engineering adaptability of the material selection algorithm.

[0078] In a preferred embodiment, the step of constructing a nanoporous structure on the pre-encapsulation layer comprises:

[0079] coating an electron beam resist on the pre-packaging layer to form a resist layer, exposing the resist layer point by point according to a preset pattern using electron beam exposure, and developing the exposed resist layer to obtain a nanoporous structure;

[0080] or

[0081] A precursor material is coated on the pre-packaging layer to form a precursor layer, a nanoporous mold having the nanoporous structure is imprinted onto the precursor layer, the precursor layer is cured, and the cured precursor layer and the nanoporous mold are separated.

[0082] For example, a layer of electron beam resist material, such as PMMA, ZEP520 or HSQ, is uniformly coated on the surface of the pre-packaging layer by spin coating, spinning or vapor deposition to form a resist layer with controllable thickness and good adhesion; then, electron beam exposure equipment, such as Raith eLINE, JEOL JBX series, etc., is used to perform point-by-point scanning exposure based on preset pore pattern design data. The pattern can be a periodic array, a quasi-periodic topology or a fractal structure, and the feature size is controlled within the range of 10nm to 500nm; then, the exposed resist layer is developed. Commonly used developers include isopropyl alcohol mixed system, MIBK / IPA solution, etc. The development temperature and time are set according to the type of resist material to form a nanopore structure template with high pattern fidelity; if necessary, the template can be further used for dry etching to engrave the structure into the underlying packaging material to improve the stability and durability of the structure. On the other hand, a mold-assisted nanoimprinting process can also be used to achieve large-area rapid replication. A layer of precursor material based on organic or inorganic precursors is applied to the surface of the pre-packaging layer by physical coating, such as spin coating, dip coating or scraping. The material can be a photocurable polymer, a thermosetting oligomer, a sol-gel system, etc., to form a precursor layer suitable for pattern transfer; a nanoimprinting mold with a fine nanoporous structure, such as a hard mold or soft mold prepared by electron beam exposure, focused ion beam or template etching, is selected, and the mold is imprinted into the precursor layer under appropriate temperature and pressure conditions so that the precursor layer fully fills the mold structure cavity; while maintaining the imprinting state, the precursor layer is subjected to UV curing, thermal crosslinking or wet chemical reaction curing treatment to transform it from a fluid or gel state to a solid state with a stable structure; after curing is completed, the imprinting mold and the precursor layer are separated to obtain a nanoporous packaging layer with a high degree of surface conformality and structural integrity. By setting up a nanoporous structure, its pore size, pore density and arrangement topology can be flexibly designed and controlled according to application requirements, thereby achieving permeability regulation of water vapor molecules, volatile gases, etc., while effectively blocking the infiltration of particulate impurities and liquids, providing tactile sensors with a high-performance packaging interface with selective permeability and environmental isolation functions.

[0083] In a preferred embodiment, the step of constructing a nanoporous structure on the pre-encapsulation layer comprises:

[0084] A nanoporous pattern having a nanoporous structure is additively manufactured on the surface of the pre-packaging layer using a removable nanomaterial and the packaging material, the nanoporous pattern is solidified, and the solidified nanoporous pattern is dissolved to obtain a nanoporous structure.

[0085] For example, removable nanomaterials with good printability and controllable removability, such as polyvinyl alcohol nanoparticles, polylactic acid microspheres, calcium carbonate nanoparticles, water-soluble core-shell structure materials, etc., are selected and compounded with the packaging material in a preset ratio. By means of additive manufacturing technology, such as nanoscale inkjet printing, photocuring 3D printing, 4D printing, electrospinning deposition or two-photon polymerization printing, a nanopore pattern with a three-dimensional pore geometric topology is constructed on the surface of the pre-packaged layer. The construction parameters of the nanopore pattern include but are not limited to pore size, pore density, spatial distribution pattern, depth size and inner surface roughness, and the above parameters can be precisely controlled by process parameters. The nanopore pattern preliminarily constructed is subjected to a directional solidification treatment, which can be completed by ultraviolet light irradiation, heat treatment or wet crosslinking, so that it can achieve interfacial bonding with the pre-packaged layer and improve mechanical stability. At the same time, during the curing process, the fluid components in the non-structured area are discharged to enhance the resolution of the pore boundaries. After the curing is completed, the removable nanomaterial used in the early stage is removed by a selective dissolution or stripping step. Specific methods can include solvent immersion, low-temperature thermal dissolution, low-pH or high-pH reaction environment, ion exchange reaction, or ultrasound-assisted dissolution. This step can effectively preserve the nano-skeleton structure formed by the encapsulation material without destroying the overall topology. Ultimately, a nanoporous structure layer precisely constructed on the surface of the pre-encapsulation layer is obtained. This structure not only has excellent gas / water vapor selective permeability, but also can shield particulate impurities and liquid corrosion without significantly sacrificing mechanical integrity, thereby improving the environmental adaptability and functional responsiveness of the overall encapsulation interface.

[0086] In a preferred embodiment, fixing the encapsulation layer on the arrayed flexible tactile sensor according to the alignment position includes:

[0087] Acquiring a sensing unit material of the sensing unit, and selecting an auxiliary bonding material based on the sensing unit material and the packaging material;

[0088] The auxiliary bonding material is coated on the sensing unit to form an auxiliary bonding layer, the auxiliary bonding layer is cured, and the encapsulation layer is fixed on the arrayed flexible tactile sensor provided with the auxiliary bonding layer according to the alignment position.

[0089] For example, the material composition information of each sensing unit in the arrayed flexible tactile sensor is obtained, including the physical properties of its surface material, such as surface energy, roughness, hydrophilicity and chemical properties, such as functional group type, chemical stability, polarity, etc., and combined with the molecular structure characteristics and surface activity parameters of the encapsulation layer material, a comprehensive analysis of the interface compatibility and chemical coupling potential is performed. Based on the above information, through material database retrieval, bonding strength simulation or experimental verification screening, an auxiliary bonding material with high compatibility with both is selected. The material can be a reversible thermosetting polymer, a biocompatible adhesive, a photosensitive cross-linking glue, a hydrogen bond network polymerization system, etc., which meets the requirements of low-temperature processing, good packaging integrity and minimization of mechanical stress transmission. Based on the known alignment parameters and structural topology, the auxiliary bonding material is evenly coated on the surface of the sensing unit of the arrayed flexible tactile sensor using high-precision droplet coating, micro-template transfer, aerosol spraying or laser-induced local deposition, forming an auxiliary bonding layer with interface continuity and controllable thickness. The thickness of this layer is generally controlled between hundreds of nanometers and several microns to take into account both stress buffering and bonding efficiency. Then, the auxiliary adhesive layer is directionally solidified using an adapted curing method to transform it from a fluid state into a stable solid structure and enhance its interface bonding force with the sensing unit. Finally, using the pre-acquired alignment position information, a micromanipulation platform, a laser alignment system, or a flexible manipulation arm are used to precisely align the packaging layer above the sensing unit so that its lower surface is in full contact with the auxiliary adhesive layer. While maintaining the alignment, an appropriate pressing force and thermal field are applied to promote the formation of stable mechanical locking or molecular interface bonding between the packaging layer and the auxiliary adhesive layer, thereby achieving reliable fixation of the packaging layer at the micro-nano scale, while taking into account the packaging integrity, signal response fidelity, and structural flexibility.

[0090] In a preferred embodiment, after fixing the encapsulation layer on the arrayed flexible tactile sensor according to the alignment position, the method further comprises:

[0091] A packaging area between the packaging layer and the sensing unit is microscopically scanned to detect the degree of fit between the packaging layer and the sensing unit, and a packaging consistency evaluation result is output based on the degree of fit.

[0092] Exemplarily, a high-precision microscopic scanning test is performed on the packaging interface area formed between the packaging layer and the multiple sensing units in the arrayed flexible tactile sensor to achieve non-destructive quantitative verification and global consistency assessment of the packaging quality. The detection process preferably uses imaging technology with high aspect ratio resolution, such as confocal laser scanning microscopy, three-dimensional interferometric profilometer, microfocus X-ray tomography, atomic force topography reconstruction and other multimodal micro-nanostructure characterization methods to achieve multi-dimensional data acquisition and image reconstruction of the packaging interface morphology. In the scanning stage, by establishing a three-dimensional reconstruction model, multiple key structural parameters at the packaging interface are extracted, including but not limited to: interface continuity distribution, thickness uniformity, interlayer connection quality in the material transition area, interface defect density and local deformation mode. Based on the obtained structural parameters, quantitative performance indicators are further derived, such as the proportion of packaging bonding area, local stress concentration coefficient, interface roughness change rate, etc., as important inputs for packaging state modeling. Subsequently, a packaging fit evaluation model is constructed based on the above multidimensional parameter set, and a prediction function or multidimensional regression relationship can be established by combining the finite element simulation results with the measured sample calibration values. Preferably, machine learning algorithms such as support vector machines, random forests, principal component analysis, or image recognition models based on convolutional neural networks are introduced to build an intelligent evaluation system for package integrity. The system can perform high-dimensional mapping and comparison of the current sample fit characteristics with the existing qualified sample database, and output structured evaluation grades, such as multi-level labels such as "excellent", "good", "boundary critical", or "package failure", or provide package quality scores in the form of continuous scores. The evaluation results can be integrated into the quality closed-loop control link of the packaging process, and can be used to dynamically optimize the bonding process parameters such as pressing time, curing temperature, and adhesive layer thickness through the feedback channel to achieve automatic correction of package displacement errors, setting of interface stress compensation strategies, or identification of potential process abnormality trends in specific batches, thereby improving the traceability, controllability, and large-scale consistency of the entire micro-nano manufacturing process.

[0093] like Figure 2 As shown, the present invention also provides a micro-nano manufacturing device for an arrayed flexible tactile sensor packaging layer, comprising:

[0094] The packaging material selection module 21 is used to obtain the performance requirements of the packaging layer and select the packaging material of the packaging layer according to the performance requirements;

[0095] a nanopore construction module 22 for forming a packaging substrate based on the packaging material, coating the packaging substrate to form a pre-packaging layer, and constructing a nanopore structure on the pre-packaging layer;

[0096] The sensor packaging module 23 is used to solidify the nanoporous structure, align the solidified nanoporous structure with the sensing unit of the arrayed flexible tactile sensor using a micro-nano precision alignment device, record the alignment position, and fix the packaging layer on the arrayed flexible tactile sensor according to the alignment position.

[0097] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A micro-nano manufacturing method for an arrayed flexible tactile sensor packaging layer, characterized in that: include: Obtaining performance requirements for the encapsulation layer, and selecting an encapsulation material for the encapsulation layer according to the performance requirements; forming a packaging substrate based on the packaging material, coating the packaging substrate to form a pre-packaging layer, and constructing a nanoporous structure on the pre-packaging layer; The nanoporous structure is solidified, and the solidified nanoporous structure is aligned with the sensing unit of the arrayed flexible tactile sensor using a micro-nano precision alignment device, the alignment position is recorded, and the encapsulation layer is fixed on the arrayed flexible tactile sensor according to the alignment position.

2. The micro-nano manufacturing method for arrayed flexible tactile sensor packaging layer according to claim 1, characterized in that: The obtaining performance requirements of the encapsulation layer and selecting an encapsulation material for the encapsulation layer according to the performance requirements includes: Obtain key performance requirements and enhanced function requirements of the encapsulation layer; Selecting the base material and nanomaterial of the encapsulation layer according to the key performance requirements and the enhanced function requirements; The base material and the nanomaterial are mixed to obtain the packaging material of the packaging layer.

3. The micro-nano manufacturing method for arrayed flexible tactile sensor packaging layer according to claim 2, characterized in that: The base material and nanomaterial of the encapsulation layer are selected according to the key performance requirements and the enhanced function requirements, respectively, including: Obtaining a base material score of the base material according to the key performance requirements, obtaining a nano material score of the nano material according to the key performance requirements and the enhanced function requirements, and obtaining a compatibility coefficient of the packaging material composed of the base material and the nano material; The packaging material score of the packaging material is calculated based on the base material score, the nanomaterial score and the compatibility coefficient, and the base material and the nanomaterial are selected according to the packaging material score.

4. The micro-nano manufacturing method for arrayed flexible tactile sensor packaging layer according to claim 3, characterized in that: The step of obtaining a base material score for the base material according to the key performance requirements includes: Extracting key performance indicators from the key performance requirements and key indicator weights corresponding to the key performance indicators; The base material score is calculated according to the key performance indicators and the key indicator weights.

5. The micro-nano manufacturing method for arrayed flexible tactile sensor packaging layer according to claim 2, characterized in that: Obtaining a nanomaterial score for the nanomaterial according to the key performance requirements and the enhanced function requirements includes: Extracting enhanced function indicators and key performance indicators from the enhanced function requirements and the key performance requirements respectively; The nanomaterial score is calculated based on the enhanced function index and the key performance index according to preset weights.

6. The micro-nano manufacturing method for arrayed flexible tactile sensor packaging layer according to claim 1, characterized in that: The step of constructing a nanoporous structure on the pre-packaging layer comprises: coating an electron beam resist on the pre-packaging layer to form a resist layer, exposing the resist layer point by point according to a preset pattern using electron beam exposure, and developing the exposed resist layer to obtain a nanoporous structure; or A precursor material is coated on the pre-packaging layer to form a precursor layer, a nanoporous mold having the nanoporous structure is imprinted onto the precursor layer, the precursor layer is cured, and the cured precursor layer and the nanoporous mold are separated.

7. The micro-nano manufacturing method for arrayed flexible tactile sensor packaging layer according to claim 1, characterized in that: The step of constructing a nanoporous structure on the pre-packaging layer comprises: A nanoporous pattern having a nanoporous structure is additively manufactured on the surface of the pre-packaging layer using a removable nanomaterial and the packaging material, the nanoporous pattern is solidified, and the solidified nanoporous pattern is dissolved to obtain a nanoporous structure.

8. The micro-nano manufacturing method for arrayed flexible tactile sensor packaging layer according to claim 1, characterized in that: The step of fixing the packaging layer on the arrayed flexible tactile sensor according to the alignment position includes: Acquiring a sensing unit material of the sensing unit, and selecting an auxiliary bonding material based on the sensing unit material and the packaging material; The auxiliary bonding material is coated on the sensing unit to form an auxiliary bonding layer, the auxiliary bonding layer is cured, and the encapsulation layer is fixed on the arrayed flexible tactile sensor provided with the auxiliary bonding layer according to the alignment position.

9. The micro-nano manufacturing method for arrayed flexible tactile sensor packaging layer according to claim 1, characterized in that: After fixing the packaging layer on the arrayed flexible tactile sensor according to the alignment position, the method further includes: A packaging area between the packaging layer and the sensing unit is microscopically scanned to detect the degree of fit between the packaging layer and the sensing unit, and a packaging consistency evaluation result is output based on the degree of fit.

10. A micro-nano manufacturing device for arrayed flexible tactile sensor packaging layer, characterized in that: include: A packaging material selection module, configured to obtain performance requirements of the packaging layer and select packaging materials for the packaging layer according to the performance requirements; a nanopore construction module, configured to form a packaging substrate based on the packaging material, coat the packaging substrate to form a pre-packaging layer, and construct a nanopore structure on the pre-packaging layer; The sensor packaging module is used to solidify the nanoporous structure, align the solidified nanoporous structure with the sensing unit of the arrayed flexible tactile sensor using a micro-nano precision alignment device, record the alignment position, and fix the packaging layer on the arrayed flexible tactile sensor according to the alignment position.

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