Frame-free potting method for integrated circuit

Abstract

The invention provides an enclosure-frame-free potting method for an integrated circuit. The method comprises the following steps: step 1, putting the integrated circuit into an upper enclosure frame in a potting tool; step 2, connecting the pins of the integrated circuit with the pin fixing strips; step 3, after the integrated circuit is turned over, the integrated circuit is placed in a lower enclosure frame of the potting tool; and step 4, instilling the prepared pouring sealant into the lower enclosure frame, and taking out the lower enclosure frame after the pouring sealant is cured, thereby completing enclosure-frame-free encapsulation of the integrated circuit. The method has the advantages of simple steps, convenient operation, light structure of the encapsulation tool, low preparation cost, effective reduction of the production cost of the integrated circuit, and effective suitability for small-batch product processing.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuits, in particular to a method for frameless potting of integrated circuits. Background Art

[0002] Current IC packaging methods include metal packaging, ceramic packaging, glass packaging, and resin packaging. Resin packaging typically involves securing the IC board in a metal casing, pouring epoxy resin into the casing, and curing the resin at a specific temperature and time to create a semi-airtight package. This packaging method, similar to potting in a metal enclosure, is also relatively expensive. Summary of the Invention

[0003] The present invention aims to overcome the deficiencies in the prior art and provides a method for encapsulating an integrated circuit without a frame.

[0004] This application provides the following technical solutions: A method for potting an integrated circuit without a frame is characterized by comprising the following steps: first, preparing a potting tool, placing the integrated circuit to be packaged into an upper frame, and clamping the integrated circuit circuit board on an inner ring platform of the upper frame; second, inserting the pins of the integrated circuit into a pin fixing bar, thereby fixing the position between the upper frame and the circuit board; Step 3: Remove the upper frame, flip the integrated circuit so that the pins face upward, and then place the integrated circuit after the first packaging into the lower frame; Step 4: Pour the prepared potting glue into the lower frame to encapsulate the surface of the integrated circuit. After the potting glue is cured, remove the lower frame to complete the frameless potting of the integrated circuit.

[0005] On the basis of the above technical solutions, there are further technical solutions as follows: In step three, the prepared potting glue is dripped into the upper frame to pre-package the upper surface of the integrated circuit. After the potting glue is cured, the upper frame is removed, and then the integrated circuit is turned over so that the pins face upward, and then the pre-packaged integrated circuit is placed in the lower frame.

[0006] The potting tool of the method for potting an integrated circuit without a frame is characterized in that it includes an upper frame, a lower frame and a set of pin fixing strips. The main body of the upper frame is a tubular structure, and a coaxially distributed inner ring platform is provided on the inner wall of the upper frame. The lower frame is a barrel-shaped structure with a sealed bottom. The pin fixing strips are provided with sockets corresponding to the pins.

[0007] The inner hole of the upper frame corresponds to the shape of the circuit board, and its length and width are slightly larger by 0.5mm, and its height is half of the total height of the integrated circuit minus 1-2mm. Advantages of the invention: The present invention has simple steps, convenient operation, light potting tooling structure, low preparation cost, effectively reduces the production cost of integrated circuits, and is effectively suitable for small batch product processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is a schematic structural diagram when completing step 2 of the present invention; Figure 2 This is a schematic structural diagram when completing step three of the present invention; Figure 3 It is a structural diagram when step three is completed in embodiment 2 of the present invention. DETAILED DESCRIPTION Example

[0009] like Figure 1 and 2 The method for potting an integrated circuit without a frame, as shown, includes the following steps: 1. Preparing a potting tool, which includes an upper frame 1, a lower frame 4, and a set of pin fixing bars 5. The upper frame 1 is a tubular structure with two open ends. The inner hole of the upper frame 1 corresponds to the outer shape of the circuit board 2a, and its length and width are slightly larger than 0.5mm. The height is half the total height of the integrated circuit 2 (including the combined height of the circuit board 2a, components 2c, and pins 2b) minus 1-2mm. The inner dimensions of the length, width, and height of the lower frame are slightly larger than the outer dimensions of the circuit board 2a by 1mm.

[0010] An inner ring platform 3 is coaxially distributed on the inner wall of the upper frame 1. The lower frame 4 is a barrel-shaped structure with a sealed bottom. The pin fixing strip 5 is provided with a socket 5a corresponding to the pin 2b.

[0011] The integrated circuit 2 to be packaged is placed into the upper frame 1 and the circuit board 2 a of the integrated circuit 2 is clamped on the inner ring platform of the upper frame 1 .

[0012] Step 2: Insert the pin 2b of the integrated circuit into the socket 5a of the pin fixing bar 5, and push the pin fixing bar 5 upward until the pin fixing bar 5 contacts the upper frame 1. During this process, the circuit board 2a does not move, thereby fixing the position between the upper frame 1 and the circuit board.

[0013] Step 3: Pour the prepared potting compound into upper frame 1 to pre-encapsulate the top surface of the integrated circuit. Curing the potting compound according to the specified curing conditions is complete. After the potting compound has cured, remove upper frame 1. Then, flip integrated circuit 2 so that pins 2b face upward. Place the pre-encapsulated integrated circuit 2 into lower frame 4.

[0014] Step 4: Pour the prepared potting glue into the lower frame 4 between two adjacent pin fixing strips 5 to encapsulate the surface of the integrated circuit. After the potting glue is cured, remove the lower frame to complete the frameless potting of the integrated circuit. Example

[0015] like Figure 1 and 3 The method for potting an integrated circuit without a frame, as shown, includes the following steps: 1. Preparing a potting tool, which includes an upper frame 1, a lower frame 4, and a set of pin fixing bars 5. The upper frame 1 is a tubular structure with two open ends. The inner hole of the upper frame 1 corresponds to the outer shape of the circuit board 2a, and its length and width are slightly larger than 0.5mm. The height is half the total height of the integrated circuit 2 (including the combined height of the circuit board 2a, components 2c, and pins 2b) minus 1-2mm. The inner dimensions of the length, width, and height of the lower frame are slightly larger than the outer dimensions of the circuit board 2a by 1mm.

[0016] An inner ring platform 3 is coaxially distributed on the inner wall of the upper frame 1. The lower frame 4 is a barrel-shaped structure with a sealed bottom. The pin fixing strip 5 is provided with a socket 5a corresponding to the pin 2b.

[0017] The integrated circuit 2 to be packaged is placed into the upper frame 1 and the circuit board 2 a of the integrated circuit 2 is clamped on the inner ring platform of the upper frame 1 .

[0018] Step 2: Insert the pin 2b of the integrated circuit into the socket 5a of the pin fixing bar 5, and push the pin fixing bar 5 upward until the pin fixing bar 5 contacts the upper frame 1. During this process, the circuit board 2a does not move, thereby fixing the position between the upper frame 1 and the circuit board.

[0019] Step 3: Remove the upper frame 1 , then flip the integrated circuit 2 so that the pins 2 b face upward, and then place the integrated circuit 2 after the first packaging into the lower frame 4 .

[0020] Step 4: Pour the prepared potting glue into the lower frame 4 between two adjacent pin fixing strips 5 to perform the first packaging on the lower surface of the integrated circuit. After the potting glue is cured, remove the lower frame to complete the frameless potting of the integrated circuit.

Claims

1. A method for potting an integrated circuit without a frame, characterized in that: The method comprises the following steps: first, preparing a potting tool and placing an integrated circuit (2) to be packaged into an upper frame (1); clamping a circuit board (2a) of the integrated circuit (2) on an inner ring platform of the upper frame (1); and second, inserting pins (2b) of the integrated circuit into pin fixing bars (5), thereby fixing the position between the upper frame (1) and the circuit board. Step 3: Remove the upper frame (1), then flip the integrated circuit so that the pins (2b) face upwards, and then place the integrated circuit after the first packaging into the lower frame; Step 4: drip the prepared potting glue into the lower frame (4) to encapsulate the surface of the integrated circuit. After the potting glue is solidified, remove the lower frame to complete the frameless potting of the integrated circuit.

2. The method for frameless potting of integrated circuits according to claim 1, characterized in that: In step three, the prepared potting glue is dripped into the upper frame (1) to pre-package the upper surface of the integrated circuit. After the potting glue is solidified, the upper frame (1) is removed, and the integrated circuit is turned over so that the pins (2b) face upward, and the pre-packaged integrated circuit is placed in the lower frame.

3. A potting tool for implementing the method for frameless potting of integrated circuits according to claim 1 or 2, characterized in that: It comprises an upper frame (1), a lower frame (4) and a set of pin fixing strips (5); the upper frame (1) is a tubular structure, and a coaxially distributed inner ring platform (3) is provided on the inner wall of the upper frame (1); the lower frame (4) is a barrel-shaped structure with a sealed bottom, and the pin fixing strips (5) are provided with sockets (5a) corresponding to the pins (2b).

4. The potting tool for the frameless potting method of integrated circuit according to claim 3, characterized in that: The inner hole of the upper enclosure frame (1) corresponds to the outer shape of the circuit board (2a), and its length and width are slightly larger by 0.5 mm, and its height is half the total height of the integrated circuit (2) minus 1 to 2 mm.

Images