Vacuum wafer detection platform

Abstract

The invention relates to a vacuum wafer detection platform, and belongs to the technical field of semiconductor detection equipment. The invention provides a vacuum wafer detection platform, which mainly comprises a motion output module, a macro motion jacking module, a jacking assembly and a wafer platform, and is characterized in that a module capable of realizing up-down macro motion and a module for realizing wafer jacking are integrated on a ball screw; the macro moving block and the jacking block which comprise the wedge-shaped blocks in the opposite directions are installed on the ball screw to be matched with the jacking plate and the jacking assembly respectively, synchronous movement of the macro moving block and the jacking block can be driven at the same time only by using one motor as a driving source, and then two different actions of a macro moving detection platform or wafer jacking can be conducted. Not only are a lot of space and debugging time saved, but also the stability of movement can be ensured.

Description

Technical Field

[0001] The invention relates to a vacuum wafer detection platform, belonging to the technical field of semiconductor detection equipment. Background Art

[0002] With the rapid development of semiconductor technology, wafer inspection equipment has been increasingly widely used. During the wafer inspection process, on the one hand, the wafer inspection equipment needs to place the wafer from the robot to the inspection position, requiring a lifting device to receive the wafer and lower it to place the wafer stably on the inspection plane. On the other hand, when the wafer enters the inspection area, in order to detect different height positions of the wafer, the height of the previous inspection position is fixed and cannot meet the requirements of detecting the position of the next height plane, so a macro-motion inspection platform is required to adjust. Therefore, for the wafer inspection platform, it must be able to simultaneously meet the execution of these two actions to meet the production inspection requirements.

[0003] However, existing inspection platforms are unable to simultaneously perform these two motions. Current inspection platforms rely on structural separation to achieve these two separate motions, occupying significant production space and creating complex motion logic during multi-axis motion control. Furthermore, such inspection platforms are cumbersome to install and difficult to debug, wasting significant time during production. Furthermore, to maintain stability during wafer reciprocation, the wafer must compromise motion timing, resulting in slow speeds, impacting the wafer inspection cycle, and prone to jitter and instability.

[0004] Therefore, there is an urgent need to find a detection platform that can perform both macro movement of the detection platform and wafer lifting without affecting the detection rhythm of single wafers and the movement process of the wafer. Summary of the Invention

[0005] In order to solve the above problems, the present invention provides a vacuum wafer detection platform, which integrates the module that can realize up and down macro movement and the module that realizes wafer lifting onto a ball screw. The up and down macro movement of the detection platform and the lifting of the wafer can be realized simultaneously by driving a single motor, which not only saves a lot of space and debugging time, but also ensures the stability of the movement.

[0006] The vacuum wafer inspection platform proposed by the present invention includes:

[0007] A motion output module includes a motor and a planar guide rail mounted on a base, the motor being connected to a ball screw, on which a first horizontal slider, a second horizontal slider, and a third horizontal slider are sequentially mounted, the first and third horizontal sliders being respectively mounted with a first macro-moving block and a second macro-moving block, the second horizontal slider being mounted with a lifting block, the first and second macro-moving blocks each having a macro-moving wedge with the same inclination direction, and the lifting block having a lifting wedge with an inclination direction opposite to that of the macro-moving wedge; driven by the ball screw, the first, second, and third horizontal sliders are capable of synchronously performing linear motion in the same direction;

[0008] The macro-movement lifting module includes a top plate and a piezoelectric module and a shock-absorbing module connected to the edge of the top plate. The top plate is provided with two lifting connectors corresponding to the positions of the first macro-movement block and the second macro-movement block, respectively. The two lifting connectors are respectively provided with a first bearing capable of cooperating with the two macro-movement wedges. The top plate also has a hole for the lifting component to pass through, and the lifting component is provided with a second bearing capable of cooperating with the lifting wedges.

[0009] The wafer platform is connected to the lifting assembly.

[0010] Furthermore, the planar guide rail includes a first planar guide rail and a second planar guide rail arranged parallel to the base, and the first horizontal slider, the second horizontal slider, and the third horizontal slider are simultaneously slidably connected to the first planar guide rail and the second planar guide rail.

[0011] Furthermore, a fourth horizontal slider is installed on the ball screw, and the fourth horizontal slider is slidably connected to the first planar guide rail. A photoelectric sensor is installed on the base, and the fourth horizontal slider is connected to a baffle that can pass through the photoelectric sensor.

[0012] Furthermore, at least one first support seat is provided on the base, a longitudinal macro motion guide rail is installed on the first support seat, and a longitudinal macro motion slider connected to the top plate is matched on the longitudinal macro motion guide rail.

[0013] Furthermore, the top plate has a bracket hole and multiple lifting rod holes, the lifting assembly includes a lifting bracket that movably fits in the bracket hole and multiple lifting rods that movably fit in the lifting rod holes, and the lifting bracket is assembled with a second bearing through a bearing connecting block.

[0014] Furthermore, at least one second support seat is provided on the base, and the second support seat is equipped with a longitudinal jacking guide rail, and the longitudinal jacking guide rail is equipped with a longitudinal jacking slider, and the longitudinal jacking slider is connected to the jacking rod through a support arm, and the jacking rod is connected to the wafer platform, and the jacking bracket is connected to all the longitudinal jacking sliders at the same time. Under the connection action of the jacking bracket, all the longitudinal jacking sliders can slide at the same time and always be at the same height position.

[0015] Furthermore, the wafer platform includes a base plate and a wafer placement platform module supported by the base plate, and the wafer to be tested can be assembled in the wafer placement platform module.

[0016] Furthermore, the edge of the top plate is connected to a first mounting seat, a second mounting seat, a third mounting seat, a fourth mounting seat and a fifth mounting seat, wherein the first mounting seat and the third mounting seat are both equipped with a shock-absorbing module, the second mounting seat is equipped with a piezoelectric module, and the fourth mounting seat and the fifth mounting seat are both equipped with a shock-absorbing module and a piezoelectric module.

[0017] Furthermore, the first mounting seat and the third mounting seat are respectively provided with a first reinforcement block and a third reinforcement block to reinforce the mounting of the shock-absorbing module; the second mounting seat is provided with a second reinforcement block to reinforce the mounting of the piezoelectric module; the fourth mounting seat and the fifth mounting seat are respectively provided with a fourth reinforcement block and a fifth reinforcement block to reinforce the mounting of the shock-absorbing module and the piezoelectric module.

[0018] Furthermore, the base is connected to a connection surface of a motor or a motion platform.

[0019] Beneficial effects of the present invention:

[0020] The present invention installs a macro-movement block and a lifting block containing wedge-shaped blocks in opposite directions on the ball screw, which cooperate with the top plate and the lifting assembly respectively, so that only one motor is needed as a driving source to simultaneously drive the synchronous movement of the macro-movement block and the lifting block, thereby being able to perform two different actions: macro-movement of the detection platform or lifting of the wafer. Among them, the wedge-shaped blocks of the macro-movement block and the wedge-shaped blocks of the lifting block respectively form a rolling fit with the bearings on the top plate and the lifting assembly, thereby converting the planar movement of the ball screw into a macro-movement and lifting movement in a vertical direction, thereby improving the stability during rapid movement. In addition, the present invention is also provided with a piezoelectric module and a shock-absorbing module to further reduce the vibration during wafer movement and improve stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present invention.

[0022] Figure 2 Schematic diagram of the structure of the portion below the wafer platform in one embodiment of the present invention.

[0023] Figure 3 Schematic diagram of the structure of a wafer placement platform module in one embodiment of the present invention.

[0024] Figure 4 A side view of a wafer platform according to an embodiment of the present invention.

[0025] Figure 5 Schematic diagram of the structure of the motion output module in one embodiment of the present invention.

[0026] Figure 6 This is a schematic diagram of the three-dimensional structure of the macro-dynamic lifting module in one embodiment of the present invention.

[0027] Figure 7 This is a top view of the macro-dynamic lifting module in one embodiment of the present invention.

[0028] Figure 8 This is a partial structural schematic diagram of a jacking assembly in one embodiment of the present invention.

[0029] Figure 9 This is a schematic structural diagram of a jacking bracket in one embodiment of the present invention.

[0030] Figure 10 Schematic diagram of three motion states formed by the cooperation of the first bearing, the second bearing and the motion output module in one embodiment of the present invention.

[0031] In the figure, 1. Wafer platform; 2. Motion output module; 3. Macro lifting module; 4. Lifting assembly;

[0032] 11. Wafer placement platform module; 12. Base plate;

[0033] 2101, motor; 2102, ball screw; 2103, fixed seat; 2104, positioning seat; 2105, photoelectric sensor; 2106, first planar guide rail; 2107, second planar guide rail; 2108, longitudinal macro-motion guide rail; 2201, fourth horizontal slider; 2202, third horizontal slider; 2203, second horizontal slider; 2204, first horizontal slider; 2205, second macro-motion block; 2206, lifting block; 2207, first macro-motion block; 2208, longitudinal macro-motion slider; 2209, first support seat; 2210, base;

[0034] 3101, first mounting seat; 3102, second mounting seat; 3103, third mounting seat; 3104, fourth mounting seat; 3105, fifth mounting seat; 3106, lifting connector; 3111, first reinforcement block; 3112, second reinforcement block; 3113, third reinforcement block; 3114, fourth reinforcement block; 3115, fifth reinforcement block; 3120, top plate; 3201, first bearing; 3301, piezoelectric module; 3302, shock-absorbing module;

[0035] 4101, second support seat; 4102, longitudinal jacking slider; 4103, support arm; 4104, first extension platform; 4105, second extension platform; 4111, jacking bracket; 4112, bearing connecting block; 4201, longitudinal jacking guide rail; 4202, jacking rod; 4210, second bearing. DETAILED DESCRIPTION

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0037] In the present invention, unless otherwise expressly specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0038] In the present invention, the terms "first" and "second" are only used to distinguish similar components / parts in different positions or with different characteristics, and have no other limiting meanings; the term "upper" refers to the direction in which each component is away from the ground, and the term "lower" refers to the direction in which each component is away from the ground.

[0039] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0040] like Figures 1-9 As shown, the vacuum wafer inspection platform proposed in the present invention mainly includes a motion output module 2, a macro-lifting module 3, a lifting component 4 and a wafer platform 1, wherein:

[0041] exist Figure 5In the example, the motion output module 2 includes a motor 2101 and a planar guide rail installed on a base 2210, the motor 2101 is connected to a ball screw 2102, and both ends of the ball screw 2102 are fixed to the base 2210 through a fixed seat 2103 and a positioning seat 2104, and the ball screw 2102 is installed with a first horizontal slider 2204, a second horizontal slider 2203, and a third horizontal slider 2202 from right to left, and the first horizontal slider 2204 and the third horizontal slider 2202 are respectively installed with a first macro-moving block 2207 and a second macro-moving block 2205, and the second horizontal slider 2203 is installed with a lifting block 2206, the first macro-moving block 2207 and the second macro-moving block 2205 both have macro-moving wedges with the same inclination direction and the number of macro-moving wedges is two, and the lifting block 2206 has four lifting wedges with an inclination direction opposite to that of the macro-moving wedges.

[0042] In some embodiments, driven by the ball screw 2102 , the first horizontal slider 2204 , the second horizontal slider 2203 , and the third horizontal slider 2202 can synchronously move linearly in the same direction, for example, simultaneously move to the left or simultaneously move to the right.

[0043] The macro-lifting module 3 includes a top plate 3120 and a piezoelectric module 3301 and a shock-absorbing module 3302 connected to the edge of the top plate 3120. Figure 6-Figure 7 In the example, the edge of the top plate 3120 is connected to a first mounting seat 3101, a second mounting seat 3102, a third mounting seat 3103, a fourth mounting seat 3104, and a fifth mounting seat 3105. The first mounting seat 3101 and the third mounting seat 3103 are both equipped with a shock-absorbing module 3302, the second mounting seat 3102 is equipped with a piezoelectric module 3301, and the fourth mounting seat 3104 and the fifth mounting seat 3105 are both equipped with a shock-absorbing module 3302 and a piezoelectric module 3301. The piezoelectric module 3301 has the following functions: during the wafer inspection process, when high voltage is applied, the piezoelectric module 3301 is slightly deformed to achieve fine adjustment of the distance from the upper electron microscope and achieve focus with the electron microscope. The shock-absorbing module 3302 also has the following functions: to better reduce vibration when the wafer placement platform module 11 moves with the XY stage motion platform.

[0044] Furthermore, in some embodiments, the top plate 3120 is provided with two lifting connectors 3106 corresponding to the positions of the first macro-moving block 2207 and the second macro-moving block 2205, respectively. The two lifting connectors 3106 are respectively provided with first bearings 3201 capable of cooperating with the two macro-moving wedges. Figure 6-Figure 7In the example, each lifting connection member 3106 is respectively equipped with two first bearings 3201 on both sides, which can form a movable fit with the two macro-moving wedges on each macro-moving block. When the two macro-moving blocks move, each first bearing 3201 will roll along the inclined surface of the macro-moving wedge or the surface plane of the macro-moving block due to the relative displacement with the corresponding macro-moving block. When the first bearing 3201 rolls upward along the inclined surface of the macro-moving wedge, it will carry the entire top plate 3120 up through the lifting connection member 3106, thus performing the macro-movement action.

[0045] In some embodiments, the top plate 3120 also has a hole for the jacking assembly 4 to pass through, and the jacking assembly is provided with a second bearing 4210 that can cooperate with the jacking wedge; Figure 8-Figure 9 In the example, the top plate 3120 is provided with a bracket hole and a plurality of lifting rod holes, the lifting assembly 4 includes a lifting bracket 4111 movably fitted in the bracket hole and a plurality of lifting rods 4202 movably fitted in the lifting rod holes, the lifting bracket 4111 is a Y-shaped structure, and the bottom of the lifting bracket 4111 is equipped with four second bearings 4210 through a bearing connecting block 4112, and the four second bearings 4210 respectively form a movably fit with the four lifting wedges on the lifting block 2206. When the lifting block 2206 moves, each second bearing 4210 will roll along the inclined surface of the lifting wedge or the surface plane of the lifting block due to relative displacement with the corresponding lifting block. When the second bearing 4210 rolls upward along the inclined surface of the lifting wedge, it will carry the entire lifting assembly 4 to be lifted through the lifting bracket 4111, that is, perform the lifting action;

[0046] Furthermore, three second support seats 4101 are provided on the base 2210, and each of the second support seats 4101 is installed with a longitudinal lifting guide rail 4201, and the longitudinal lifting guide rail 4201 is equipped with a longitudinal lifting slider 4102. The longitudinal lifting slider 4102 can be connected to the lifting rod 4202 through one or more combinations of the support arm 4103, the first extension platform 4104, and the second extension platform 4105 according to the actual distance requirements, and the lifting rod 4202 is connected to the wafer platform 1. The three branches of the lifting bracket 4111 are respectively connected to the three longitudinal lifting sliders 4102. Therefore, under the connection action of the lifting bracket 4111, when the lifting action is performed, all the longitudinal lifting sliders 4102 can slide at the same time and always be at the same height position.

[0047] Preferably, the planar guide rail includes a first planar guide rail 2106 and a second planar guide rail 210 which are arranged parallel to the base 2210. Since the first horizontal slider 2204, the second horizontal slider 2203 and the third horizontal slider 2202 all have design requirements of multiple wedge blocks, the first horizontal slider 2204, the second horizontal slider 2203 and the third horizontal slider 2202 can be slid simultaneously across the first planar guide rail 2106 and the second planar guide rail 2107.

[0048] In some embodiments, a fourth horizontal slider 2201 is also installed on the ball screw 2102, and the fourth horizontal slider 2201 is slidably connected to the first planar guide rail 2106. A photoelectric sensor 2105 is installed on the base 2210, and the fourth horizontal slider 2201 is connected to a baffle 2211 that can pass through the photoelectric sensor 2105.

[0049] exist Figure 5 In the example, three first support seats 2209 are further provided on the base 2210, and the first support seats 2209 are installed with a longitudinal macro motion guide rail 2108. The longitudinal macro motion guide rail 2108 is equipped with a longitudinal macro motion slider 2208 connected to the top plate 3120, which can provide certain support in the natural state when the top plate 3120 is not lifted, and can provide a certain longitudinal macro motion direction guidance when the top plate 3120 is lifted.

[0050] The wafer platform 1 includes a base plate 12 and a wafer placement platform module 11 supported by the base plate 12 . The wafer to be tested can be assembled in the wafer placement platform module 11 .

[0051] In some embodiments, the first mounting seat 3101 and the third mounting seat 3103 are respectively provided with a first reinforcement block 3111 and a third reinforcement block 3113 to reinforce the mounting of the shock absorbing module 3302; the second mounting seat 3102 is provided with a second reinforcement block 3112 to reinforce the mounting of the piezoelectric module 3301; the fourth mounting seat 3104 and the fifth mounting seat 3105 are respectively provided with a fourth reinforcement block 3114 and a fifth reinforcement block 3115 to reinforce the mounting of the shock absorbing module 3302 and the piezoelectric module 3301.

[0052] In some embodiments, the base 2210 may also be connected to a connection surface of a motor or a motion platform (eg, a linear motor, an XY stage motion platform).

[0053] Preferably, the maximum height of the lifting wedge is greater than the maximum height of the macro-movement wedge. This configuration enables the maximum height and amplitude of the lifting action to be greater than the macro-movement action. The upper surfaces of the macro-movement block and the lifting block, where the wedge is mounted, may be provided with a stopper to limit the maximum travel of the first and second bearings.

[0054] like Figure 9 State 1 is a schematic diagram of the natural state of the first bearing, the second bearing and the motion output module of the present invention. Among them, the macro-dynamic wedge is tilted and raised to the left, and the jacking wedge is tilted and raised to the right.

[0055] In this state, the first bearing 3201 is located on the upper surface plane portion of the first macro-moving block 2207 and the second macro-moving block 2205 and close to the bottom of the macro-moving wedge; and the second bearing 4210 is located on the upper surface plane portion of the lifting block 2206 and close to the bottom of the lifting wedge.

[0056] like Figure 9 As shown in state 2, when the jacking action needs to be performed, the motor 2101 controls the ball screw 2102 to rotate in the first direction, and the ball screw 2102 drives the first horizontal slider 2204, the second horizontal slider 2203, and the third horizontal slider 2202 to move to the left at the same time. Since the first horizontal slider 2204, the second horizontal slider 2203, and the third horizontal slider 2202 all have a relative displacement to the left with the first bearing 3201 and the second bearing 4210, the first bearing 3201 continues to move to the right in a straight line along the planar part of the upper surface of the macro-motion block, while the second bearing 4210 rolls along the inclined surface of the jacking wedge block to the upper right, and at the same time, the entire jacking assembly 4 is lifted by the jacking bracket 4111, so that the wafer jacking action can be realized. During the jacking action, the top plate 3120 will not be lifted or the height will change.

[0057] like Figure 9 As shown in state 3, when the jacking action needs to be performed, the motor 2101 controls the ball screw 2102 to rotate in the second direction (opposite to the first direction), and the ball screw 2102 drives the first horizontal slider 2204, the second horizontal slider 2203, and the third horizontal slider 2202 to move to the right at the same time. Since the first horizontal slider 2204, the second horizontal slider 2203, and the third horizontal slider 2202 all have a rightward relative displacement with the first bearing 3201 and the second bearing 4210, the first horizontal slider 2204, the second horizontal slider 2203, and the third horizontal slider 2202 are all rightward relative displacements. The second bearing 4210 continues to move linearly to the left along the flat part of the upper surface of the lifting block. The second bearing 4210 on the right can be blocked by the lifting wedge on the left to limit the stroke; and the first bearing 3201 rolls to the upper left along the inclined surface of the macro-motion wedge, and at the same time carries the entire top plate 3120 to be lifted through the lifting connector 3106. In this way, the macro-motion lifting action of the top plate 3120 can be completed, that is, the macro-motion action of the detection platform. During the macro-motion action, the wafer platform 1 will not be lifted or the height will change.

[0058] Although the present invention has been disclosed above in terms of preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this technology can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the definition of the claims.

Claims

1. A vacuum wafer inspection platform, characterized in that: include: The motion output module (2) comprises a motor (2101) and a planar guide rail mounted on a base (2210); the motor (2101) is connected to a ball screw (2102); a first horizontal slider (2204), a second horizontal slider (2203), and a third horizontal slider (2202) are mounted on the ball screw (2102) in sequence; a first macro-movement block (2207) and a second macro-movement block (2208) are mounted on the first horizontal slider (2204) and the third horizontal slider (2202) respectively. 05), a lifting block (2206) is installed on the second horizontal slider (2203), the first macro-moving block (2207) and the second macro-moving block (2205) both have macro-moving wedges with the same inclination direction, and the lifting block (2206) has a lifting wedge with an inclination direction opposite to that of the macro-moving wedge; under the drive of the ball screw (2102), the first horizontal slider (2204), the second horizontal slider (2203), and the third horizontal slider (2202) can synchronously move linearly in the same direction; A macro-movement lifting module (3) comprises a top plate (3120) and a piezoelectric module (3301) and a damping module (3302) connected to the edge of the top plate (3120); the top plate (3120) is provided with two lifting connectors (3106) corresponding to the positions of the first macro-movement block (2207) and the second macro-movement block (2205), respectively; the two lifting connectors (3106) are respectively provided with a first bearing (3201) capable of cooperating with the two macro-movement wedges; the top plate (3120) also has a hole for a lifting assembly (4) to pass through; the lifting assembly is provided with a second bearing (4210) capable of cooperating with the lifting wedges; A wafer platform (1) is connected to the lifting assembly (4).

2. The vacuum wafer inspection platform according to claim 1, characterized in that: The planar guide rail comprises a first planar guide rail (2106) and a second planar guide rail (2107) arranged parallel to the base (2210); the first horizontal slider (2204), the second horizontal slider (2203), and the third horizontal slider (2202) are simultaneously slidably connected to the first planar guide rail (2106) and the second planar guide rail (2107).

3. The vacuum wafer inspection platform according to claim 2, characterized in that: A fourth horizontal slider (2201) is also installed on the ball screw (2102), and the fourth horizontal slider (2201) is slidably connected to the first planar guide rail (2106). A photoelectric sensor (2105) is installed on the base (2210), and the fourth horizontal slider (2201) is connected to a baffle (2211) that can pass through the photoelectric sensor (2105).

4. The vacuum wafer inspection platform according to claim 3, characterized in that: At least one first support seat (2209) is provided on the base (2210), and the first support seat (2209) is installed with a longitudinal macro-motion guide rail (2108), and the longitudinal macro-motion guide rail (2108) is matched with a longitudinal macro-motion slider (2208) connected to the top plate (3120).

5. The vacuum wafer inspection platform according to claim 4, characterized in that: The top plate (3120) is provided with a bracket hole and a plurality of lifting rod holes. The lifting assembly (4) comprises a lifting bracket (4111) movably fitted in the bracket hole and a plurality of lifting rods (4202) movably fitted in the lifting rod holes. The lifting bracket (4111) is equipped with a second bearing (4210) via a bearing connecting block (4112).

6. The vacuum wafer inspection platform according to claim 5, characterized in that: At least one second support seat (4101) is also provided on the base (2210), and the second support seat (4101) is installed with a longitudinal lifting guide rail (4201), and the longitudinal lifting guide rail (4201) is matched with a longitudinal lifting slider (4102), and the longitudinal lifting slider (4102) is connected to the lifting rod (4202) through the support arm (4103), and the lifting rod (4202) is connected to the wafer platform (1), and the lifting bracket (4111) is connected to all the longitudinal lifting sliders (4102) at the same time. Under the connection action of the lifting bracket (4111), all the longitudinal lifting sliders (4102) can slide at the same time and always be at the same height position.

7. The vacuum wafer inspection platform according to claim 6, characterized in that: The wafer platform (1) comprises a base plate (12) and a wafer placement platform module (11) carried by the base plate (12), and a wafer to be tested can be assembled in the wafer placement platform module (11).

8. The vacuum wafer inspection platform according to claim 1, characterized in that: The edge of the top plate (3120) is connected to a first mounting seat (3101), a second mounting seat (3102), a third mounting seat (3103), a fourth mounting seat (3104) and a fifth mounting seat (3105), wherein the first mounting seat (3101) and the third mounting seat (3103) are both equipped with a shock-absorbing module (3302), the second mounting seat (3102) is equipped with a piezoelectric module (3301), and the fourth mounting seat (3104) and the fifth mounting seat (3105) are both equipped with a shock-absorbing module (3302) and a piezoelectric module (3301).

9. The vacuum wafer inspection platform according to claim 8, characterized in that: The first mounting seat (3101) and the third mounting seat (3103) are respectively provided with a first reinforcement block (3111) and a third reinforcement block (3113) to reinforce the mounting of the shock-absorbing module (3302); the second mounting seat (3102) is provided with a second reinforcement block (3112) to reinforce the mounting of the piezoelectric module (3301); the fourth mounting seat (3104) and the fifth mounting seat (3105) are respectively provided with a fourth reinforcement block (3114) and a fifth reinforcement block (3115) to reinforce the mounting of the shock-absorbing module (3302) and the piezoelectric module (3301).

10. The vacuum wafer inspection platform according to any one of claims 1 to 9, characterized in that: The base (2210) is connected to a connection surface of a motor or a motion platform.

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