A dual-effect shielded thin film capacitor

Abstract

The application discloses a double-effect shielding thin-film capacitor and belongs to the technical field of capacitors. The double-effect shielding thin-film capacitor comprises an integrally-formed bottom plate and a wrapping shell, and further comprises a magnetic shielding support and an electrostatic shielding support which are arranged in the wrapping shell respectively for electrostatic and magnetic shielding, the magnetic shielding support is embeddedly installed in the electrostatic shielding support, the magnetic shielding support is composed of a lower shielding plate and an upper shielding plate, the electrostatic shielding support is composed of an upper support, a lower support and a connecting rod, the upper support and the lower support are connected through the connecting rod, in the embeddedly-installed magnetic shielding support and electrostatic shielding support, the position of the upper shielding plate is lower than that of the upper support, and the position of the lower shielding plate is lower than that of the lower support, and the magnetic shielding support and the electrostatic shielding support are provided with heat dissipation wrapping cavities, and a plurality of capacitor cores are arranged in the heat dissipation wrapping cavities. The application can ensure the stable operation of the thin-film capacitor in a complex and changeable electromagnetic environment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of capacitors, in particular to a double-effect shielding thin-film capacitor. BACKGROUND

[0002] In the automotive electronic system, the generation and accumulation of static electricity is a common problem, static electricity not only may cause circuit failure and data error, but also may cause direct damage to electronic components such as thin-film capacitors, thereby affecting their performance and service life, at the same time, various electronic equipment modules in the automotive electronic system will generate complex electromagnetic fields, these electromagnetic fields may interfere with each other, leading to the decline or failure of circuit performance; as a storage element in the circuit, the stability and precision of the performance of the thin-film capacitor are crucial to ensure the normal operation of the circuit.

[0003] The application of thin-film capacitors in new energy vehicles in the prior art has been relatively mature, but the technology in the aspects of anti-static and magnetic shielding may still need to be further improved, especially in the complex and changeable electromagnetic environment, how to ensure the stability and reliability of the thin-film capacitor is a continuous technical challenge, and the existing shielding devices are basically separate devices used in combination with the capacitor body, and the anti-static and magnetic shielding effect of the capacitor body is poor. SUMMARY

[0004] The purpose of the present application is to solve the problems in the prior art and provide a double-effect shielding thin-film capacitor.

[0005] In order to achieve the above-mentioned purpose, the present application adopts the following technical scheme:

[0006] The double-effect shielding thin-film capacitor comprises an integrally formed bottom plate and a wrapping shell, and further comprises: a magnetic shielding support and an electrostatic shielding support for static electricity and magnetic shielding respectively arranged in the wrapping shell, the magnetic shielding support is embeddedly installed in the electrostatic shielding support; the magnetic shielding support is composed of a lower shielding plate and an upper shielding plate, the electrostatic shielding support is composed of an upper support, a lower support and a connecting rod, the upper support and the lower support are connected through the connecting rod; in the embeddedly installed magnetic shielding support and electrostatic shielding support, the position of the upper shielding plate is lower than that of the upper support, and the position of the lower shielding plate is lower than that of the lower support; a heat dissipation wrapping cavity is arranged in the magnetic shielding support and the electrostatic shielding support, and a plurality of capacitor cores are arranged in the heat dissipation wrapping cavity; an air inlet pipe and an air outlet pipe for exchanging gas with the outside are arranged on the upper and lower surfaces of the heat dissipation wrapping cavity respectively.

[0007] Preferably, a top cover is arranged on the wrapping shell, an opening one is formed on the top cover, the air inlet pipe passes through the opening one, and a through hole for pouring epoxy resin or polyurethane material into the capacitor is also formed on the top cover.

[0008] Preferably, the bottom surface of the bottom plate is provided with a plurality of groups of overflow channels, the plurality of groups of overflow channels converge at the central part of the bottom plate, and a circular converging groove is formed at the converging position; and the bottom plate is also provided with exhaust holes communicating with the converging groove.

[0009] Further, the bottom plate is provided with an annular cooling pipe, the bottom of the annular cooling pipe is in communication with the exhaust hole, and the top of the annular cooling pipe is connected with a connecting pipe, and the connecting pipe is in communication with the exhaust pipe.

[0010] Preferably, the lower shielding plate and the upper shielding plate form a whole magnetic shielding support through a heat dissipation wrapping cavity, wherein the lower shielding plate and the upper shielding plate are used for magnetically shielding the upper and lower ends of the capacitor core, and the heat dissipation wrapping cavity is used for magnetically shielding the side of the capacitor core.

[0011] Preferably, the lower shielding plate is provided with an opening three, the upper shielding plate is provided with an opening two, and the heat dissipation wrapping cavity is provided with an opening four.

[0012] Preferably, the heat dissipation wrapping cavity is provided with a partition plate, the partition plate is close to the bottom of the heat dissipation wrapping cavity, the heat dissipation wrapping cavity is divided into an upper cavity and a lower cavity by the partition plate, the upper cavity and the lower cavity are in communication through an exhaust pipe, the exhaust pipe is provided with a temperature sensor, in the upper cavity, the upper cavity is divided into a plurality of small chambers, the number of the small chambers is consistent with the number of the capacitor cores, and each of the small chambers is provided with a capacitor core.

[0013] Further, the number of the exhaust pipes and the number of the air inlet pipes are one-to-one correspondence, and the number of the exhaust pipes and the number of the air inlet pipes are consistent with the number of the capacitor cores.

[0014] Further, each of the small chambers is correspondingly provided with a group of exhaust pipes and air inlet pipes, the temperature in each of the small chambers is detected through the temperature sensor arranged in each of the exhaust pipes, the connecting pipe is used for transmitting the medium in the lower cavity, the connecting pipe is provided with two, and each of the connecting pipes is provided with a temperature sensor.

[0015] Compared with the prior art, the present application provides a double-effect shielding thin film capacitor, which has the following beneficial effects:

[0016] 1. The double-effect shielding thin film capacitor guides the external electric field or electromagnetic wave to the surface of the support through the electrostatic shielding support, and dissipates it through grounding or the like, thereby protecting the internal capacitor core from interference, and effectively shielding the electric field in the support, so that the internal capacitor core will not produce charge leakage or electromagnetic wave radiation to the external environment.

[0017] 2. The double-effect shielding thin-film capacitor, by the combination of the magnetic shielding support and the heat dissipation wrapping cavity, can realize the functions of magnetic shielding and heat dissipation at the same time, and the combination not only improves the electromagnetic compatibility of the equipment, but also enhances the heat management capability.

[0018] The parts not involved in the double-effect shielding thin-film capacitor are the same as or can be realized by the prior art, and the stability and reliability of the thin-film capacitor can be ensured in the complicated electromagnetic environment. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 The overall structure of the double-effect shielding thin-film capacitor is shown in the figure Figure 1 ;

[0020] Figure 2 The overall structure of the double-effect shielding thin-film capacitor is shown in the figure Figure 2 ;

[0021] Figure 3 The explosion of the double-effect shielding thin-film capacitor is shown in the figure Figure 1 ;

[0022] Figure 4 The explosion of the double-effect shielding thin-film capacitor is shown in the figure Figure 2 ;

[0023] Figure 5 The structure of the magnetic shielding support and the electrostatic shielding support in the double-effect shielding thin-film capacitor is shown in the figure

[0024] Figure 6 The cross-sectional view of the bottom plate in the double-effect shielding thin-film capacitor is shown in the figure

[0025] Figure 7 The cross-sectional view of the heat dissipation wrapping cavity in the double-effect shielding thin-film capacitor is shown in the figure Figure 1 ;

[0026] Figure 8 The cross-sectional view of the heat dissipation wrapping cavity in the double-effect shielding thin-film capacitor is shown in the figure Figure 2 .

[0027] Fig. 1, bottom plate; 101, converging groove; 102, overflow channel; 103, exhaust hole; 104, annular cooling pipe; 105, connecting pipe; 2, wrapping shell; 3, top cover; 301, opening one; 4, air inlet pipe; 5, magnetic shielding support; 501, lower shielding plate; 502, upper shielding plate; 6, electrostatic shielding support; 601, upper support; 602, lower support; 603, connecting rod; 7, heat dissipation wrapping cavity; 701, partition plate; 702, exhaust pipe; 703, temperature sensor; 8, capacitor core; 9, opening two; 10, opening three; 11, opening four. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all.

[0029] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0030] Reference Figures 1-8 , including integrally formed bottom plate 1 and wrapping shell 2, also including: wrapping shell 2 is provided with magnetic shielding support 5 and electrostatic shielding support 6 for electrostatic and magnetic shielding, respectively, magnetic shielding support 5 is embeddedly installed in electrostatic shielding support 6; magnetic shielding support 5 is composed of lower shielding plate 501 and upper shielding plate 502, electrostatic shielding support 6 is composed of upper support 601, lower support 602 and connecting rod 603, upper support 601 and lower support 602 are connected through connecting rod 603; in the embeddedly installed magnetic shielding support 5 and electrostatic shielding support 6, the position of upper shielding plate 502 is lower than that of upper support 601, and the position of lower shielding plate 501 is lower than that of lower support 602; magnetic shielding support 5 and electrostatic shielding support 6 are provided with heat dissipation wrapping cavity 7, and a plurality of capacitor cores 8 are arranged in heat dissipation wrapping cavity 7; the upper and lower surfaces of heat dissipation wrapping cavity 7 are respectively provided with air inlet pipe 4 and exhaust pipe 702 for exchanging gas with the outside.

[0031] In the present application, the integrally formed bottom plate 1 and wrapping shell 2, and the embeddedly installed magnetic shielding support 5 and electrostatic shielding support 6 make the structure of the capacitor more compact and the integration higher, not only reducing the volume and weight of the capacitor, but also improving the manufacturing efficiency and production efficiency of the capacitor.

[0032] In one embodiment, when there is an external electrostatic field or electromagnetic wave, the electrostatic shielding support 6 can guide the external electric field or electromagnetic wave to the surface of the support like a Faraday cage, and dissipate it through grounding or other means, thereby protecting the internal capacitor core 8 from interference; at the same time, since the electric field inside the support is effectively shielded, the internal capacitor core 8 will not generate charge leakage or electromagnetic wave radiation to the external environment;

[0033] The combination of the magnetic shielding support 5 and the heat dissipation wrapping cavity 7 can simultaneously realize the functions of magnetic shielding and heat dissipation, which not only improves the electromagnetic compatibility of the device, but also enhances its heat management capability; at the same time, the magnetic shielding support 5 and the heat dissipation wrapping cavity 7 form an internal support support with integrated heat dissipation and magnetic shielding functions, which not only saves space, but also serves as a mounting support for the capacitor core 8;

[0034] The heat dissipation wrapping cavity 7 wraps the capacitor core 8, which not only fixes the capacitor core 8, but also better absorbs the heat generated by the capacitor core 8. Through the air inlet pipe 4 and the air outlet pipe 702 for exchanging gas with the outside, the heat dissipation wrapping cavity 7 can exchange gas with the outside, thereby dissipating heat inside the capacitor. By wrapping the capacitor core 8 with the heat dissipation wrapping cavity 7, the uneven heat dissipation problem is avoided.

[0035] Referring to Figures 1-8 The top cover 3 is provided on the wrapping shell 2, and the top cover 3 is provided with an opening one 301, and the air inlet pipe 4 passes through the opening one 301. The top cover 3 is also provided with a through hole for pouring epoxy resin or polyurethane material into the capacitor.

[0036] In the present application, the capacitor is sealed by pouring epoxy resin or polyurethane material. This material not only has good insulation performance, but also can reduce electromagnetic radiation and noise pollution of the capacitor.

[0037] After the capacitor is installed, the gas discharged from the air outlet hole 103 is collected in the converging groove 101 and flows to the outside through the overflow channel 102.

[0038] Referring to Figures 1-8 The annular cooling pipe 104 is provided in the bottom plate 1, the bottom of the annular cooling pipe 104 is connected with the air outlet hole 103, and the top of the annular cooling pipe 104 is connected with the connecting pipe 105, and the connecting pipe 105 is connected with the air outlet pipe 702.

[0039] In the present application, the annular cooling pipe 104 is a mosquito coil coil pipe, which has a continuous spiral or annular shape. This design enables the cooling pipe to distribute heat more evenly, improves cooling efficiency, and makes the temperature of the gas in the annular cooling pipe 104 and the exhaust hole 103 lower than that in the exhaust pipe 702 and the connecting pipe 105. This forms a temperature gradient at both ends of the heat dissipation package cavity 7, which in turn generates a natural convection effect, causing the gas in the heat dissipation package cavity 7 to flow and achieve the effect of heat dissipation.

[0040] At the same time, the mosquito coil type annular cooling pipe also has the advantages of compact structure and small space occupation, which meets the structural size design of the thin film capacitor.

[0041] Referring to Figures 1-8 The lower shielding plate 501 and the upper shielding plate 502 form a complete magnetic shielding bracket 5 through the heat dissipation package cavity 7. The lower shielding plate 501 and the upper shielding plate 502 are used to magnetically shield the upper and lower ends of the capacitor core 8, and the heat dissipation package cavity 7 magnetically shields the side of the capacitor core 8.

[0042] In the present application, the lower shielding plate 501 and the upper shielding plate 502 wrap around the two levels of the capacitor core 8, and the generated electromagnetic field is relatively large. Therefore, the lower shielding plate 501 and the upper shielding plate 502 use beryllium copper or metal foil as the material, which has better shielding effect. When the capacitor core 8 is working, it will generate a certain electromagnetic field, which may interfere with the surrounding circuit or equipment. The lower shielding plate 501 and the upper shielding plate 502 can effectively limit these electromagnetic fields within the capacitor, preventing them from leaking to the external environment, thereby avoiding interference with the surrounding circuit or equipment. The strong electromagnetic field from the outside may interfere with the charge distribution of the capacitor core 8, affecting its capacitance value or working frequency. The lower shielding plate 501 and the upper shielding plate 502 can effectively block the external electromagnetic field from entering the capacitor, protecting the capacitor core 8 from external electromagnetic interference.

[0043] In order to meet the requirements of electromagnetic shielding and heat dissipation performance at the same time, a metal material with high thermal conductivity (such as aluminum or copper) is used as the material of the heat dissipation package cavity 7.

[0044] Further, the opening three 10 is convenient for the connecting pipe 105 to pass through; the opening two 9 is a reserved hole for pouring epoxy resin or polyurethane material, which is convenient for the epoxy resin or polyurethane material to flow downward. At the same time, the upper shielding plate 502 is lower than the upper bracket 601, and the upper surface of the upper shielding plate 502 and the upper bracket 601 forms a groove, which can accommodate the epoxy resin or polyurethane material that does not flow in time. In this way, when pouring the epoxy resin or polyurethane material, it will not overflow; the opening four 11 is opened on the heat dissipation package cavity 7, which is convenient for the epoxy resin or polyurethane material to continue to flow downward until it fills the inside of the capacitor.

[0045] Referring to Figures 1-8 , the heat dissipation package cavity 7 is provided with a partition plate 701, the partition plate 701 is close to the bottom of the heat dissipation package cavity 7, the heat dissipation package cavity 7 is divided into an upper cavity and a lower cavity by the partition plate 701, the upper cavity and the lower cavity are communicated through an exhaust pipe 702, the exhaust pipe 702 is provided with a temperature sensor 703, in the upper cavity, the upper cavity is divided into a plurality of small chambers, the number of the small chambers is consistent with the number of the capacitor cores 8, and one capacitor core 8 is arranged in each small chamber; the number of the exhaust pipes 702 and the intake pipes 4 is one-to-one correspondence, and the number of the exhaust pipes 702 and the intake pipes 4 is consistent with the number of the capacitor cores 8.

[0046] In the application, the heat dissipation package cavity 7 is divided into an upper cavity and a lower cavity by the partition plate 701, the upper cavity is further divided into a plurality of small chambers, and the space ratio of the upper cavity to the lower cavity is 9:1; each small chamber independently wraps a corresponding capacitor core 8, so that the heat transfer of each capacitor core 8 is independently carried out, and finally the hot air in each small chamber is discharged through the exhaust pipe 702.

[0047] Referring to Figures 1-8 , a group of exhaust pipes 702 and intake pipes 4 are arranged in each small chamber, the temperature in each small chamber is detected through the temperature sensor 703 arranged in each exhaust pipe 702, and the connecting pipe 105 is used for transmitting the medium in the lower cavity, and two connecting pipes 105 are arranged, and one temperature sensor 703 is arranged in each connecting pipe 105.

[0048] Referring to Figure 6 and Figure 7 , the two temperature sensors 703 in the two connecting pipes 105 are installed at the bottom of the two connecting pipes 105; the five temperature sensors 703 in the five exhaust pipes 702 are installed at the bottom of the five exhaust pipes 702.

[0049] In the embodiment, only seven groups of temperature values are marked, which correspond to the number of capacitor cores 8, if the number of capacitor cores 8 increases or decreases, the number of exhaust pipes 702 and temperature sensors 703 in the exhaust pipes 702 also increases or decreases accordingly.

[0050] The step of monitoring the temperature in the capacitor is specifically that the five temperature sensors 703 in the five exhaust pipes 702 independently detect the temperature in each small chamber, and the temperature value is recorded as T 1、 T 2、 T 3、 T 4、 T5, here, the sizes of the five small chambers are consistent, the mass, density, pressure and heat capacity of the gas in the five small chambers are consistent, when the gas in the five small chambers is mixed into the lower cavity, the mixed temperature is roughly estimated as , considering the energy loss in the gas transmission process, the error value is given here , two temperature sensors 703 in the two connecting pipes 105 respectively detect the temperature of the gas entering the connecting pipe 105, and the temperature value is T L , T R , if the values of T L , T R are consistent or approximate, it is considered that the two temperature sensors 703 in the two connecting pipes 105 are normal, if it satisfies , it is considered that the five temperature sensors 703 in the five exhaust pipes 702 are normal, at this time, if the temperature in a certain chamber is detected to be over standard, the corresponding capacitor core 8 can be controlled to output, so as to avoid thermal damage.

[0051] The above is only the preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this, any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A double-effect shielded film capacitor, comprising an integrally formed bottom plate (1) and a wrapping shell (2), characterized in that: Also includes: A magnetic shielding bracket (5) and an electrostatic shielding bracket (6) for electrostatic and magnetic shielding are respectively provided in the wrapping shell (2), and the magnetic shielding bracket (5) is embedded in the electrostatic shielding bracket (6); The magnetic shielding bracket (5) is composed of a lower shielding plate (501) and an upper shielding plate (502); the electrostatic shielding bracket (6) is composed of an upper bracket (601), a lower bracket (602), and a connecting rod (603); the upper bracket (601) and the lower bracket (602) are connected via the connecting rod (603); In the embedded magnetic shielding bracket (5) and the electrostatic shielding bracket (6), the upper shielding plate (502) is positioned lower than the upper bracket (601), and the lower shielding plate (501) is positioned lower than the lower bracket (602); A heat dissipation cavity (7) is provided in the magnetic shielding bracket (5) and the electrostatic shielding bracket (6), and a plurality of capacitor cores (8) are provided in the heat dissipation cavity (7); An air inlet pipe (4) and an exhaust pipe (702) for exchanging gas with the outside are respectively provided on the upper and lower surfaces of the heat dissipation package cavity (7); The bottom surface of the bottom plate (1) is provided with a plurality of overflow channels (102), which converge at the center of the bottom plate (1) to form a circular convergence groove (101). The bottom plate (1) is also provided with an exhaust hole (103) connected to the convergence groove (101).

2. A double-effect shielded film capacitor according to claim 1, characterized in that: The wrapping shell (2) is provided with a top cover (3), the top cover (3) is provided with an opening (301), the air inlet pipe (4) passes through the opening (301), and the top cover (3) is also provided with a through hole for injecting epoxy resin or polyurethane material into the interior of the capacitor.

3. The double-effect shielded film capacitor according to claim 1, characterized in that: An annular cooling pipe (104) is provided in the bottom plate (1), the bottom of the annular cooling pipe (104) is connected to the exhaust hole (103), the top of the annular cooling pipe (104) is connected to a connecting pipe (105), and the connecting pipe (105) is connected to the exhaust pipe (702).

4. The double-effect shielded film capacitor according to claim 1, characterized in that: The lower shielding plate (501) and the upper shielding plate (502) form an integral magnetic shielding bracket (5) through a heat dissipation wrapping cavity (7), wherein the lower shielding plate (501) and the upper shielding plate (502) are used to magnetically shield the upper and lower ends of the capacitor core (8), and the heat dissipation wrapping cavity (7) magnetically shields the side surfaces of the capacitor core (8).

5. The double-effect shielded film capacitor according to claim 1, characterized in that: The lower shielding plate (501) is provided with a third opening (10), the upper shielding plate (502) is provided with a second opening (9), and the heat dissipation wrapping cavity (7) is provided with a fourth opening (11).

6. The double-effect shielded film capacitor according to claim 3, characterized in that: A partition plate (701) is provided in the heat-dissipating wrapped cavity (7), the partition plate (701) being close to the bottom of the heat-dissipating wrapped cavity (7), and the partition plate (701) divides the heat-dissipating wrapped cavity (7) into an upper cavity and a lower cavity. The upper cavity and the lower cavity are connected via an exhaust pipe (702), and the exhaust pipe (702) is provided with a temperature sensor (703). In the upper cavity, the upper cavity is divided into a plurality of small chambers, the number of the small chambers being the same as the number of the capacitor cores (8), and each of the small chambers is provided with a capacitor core (8).

7. The double-effect shielded film capacitor according to claim 6, characterized in that: The number of the exhaust pipes (702) and the intake pipes (4) corresponds one to one, and the number of the exhaust pipes (702) and the intake pipes (4) is consistent with the number of the capacitor cores (8).

8. The double-effect shielded film capacitor according to claim 7, characterized in that: A set of exhaust pipes (702) and air inlet pipes (4) are correspondingly provided on each of the small chambers. The temperature in each of the small chambers is detected by a temperature sensor (703) provided in each of the exhaust pipes (702). The connecting pipe (105) is used to transmit the medium in the lower chamber. Two connecting pipes (105) are provided, and each connecting pipe (105) is provided with a temperature sensor (703).

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