Thermopile chip testing device

Abstract

The invention relates to a thermopile chip testing device, and the device comprises a constant-temperature platform which comprises a housing, and a clamping assembly, a circuit board and a heating part which are disposed on the housing; the clamping assembly is used for clamping a thermopile chip to be detected; the circuit board is used for being electrically connected with the thermopile chip to be detected; the heating element is in heat conduction connection with the clamping assembly so as to heat the thermopile chip to be detected by means of the clamping assembly; and the first cooling system is in cold conduction connection with the clamping assembly so as to cool the thermopile chip to be detected by means of the clamping assembly. On one hand, the test temperature of the to-be-detected thermopile chip can be kept stable, and on the other hand, the test at a relatively low temperature can be realized.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor device testing, and in particular to a thermopile chip testing device. Background Art

[0002] With the development of handheld temperature measurement devices, efficient performance testing of thermopile chips, a key component of these devices, has become increasingly important. A thermopile chip is a thermal infrared sensor, a metal-encapsulated device composed of thermocouples. It converts temperature differences into electrical energy, achieving the desired temperature by measuring electrical energy.

[0003] Thermopile chips are currently widely used as temperature sensing devices in applications such as ear thermometers, radiation thermometers, electric ovens, and food temperature monitoring. Testing the performance of thermopile chips during the design and production stages is crucial for improving their yield. However, current testing systems are unable to achieve low test temperatures (below room temperature) and struggle to maintain stable test temperatures. Summary of the Invention

[0004] Based on this, it is necessary to provide a thermopile chip testing device to address at least one of the above problems.

[0005] A thermopile chip testing device, comprising:

[0006] A constant temperature platform comprises a housing and a clamping assembly, a circuit board, and a heating element provided on the housing; the clamping assembly is used to clamp the thermopile chip to be tested; the circuit board is used to be electrically connected to the thermopile chip to be tested; the heating element is thermally connected to the clamping assembly to heat the thermopile chip to be tested with the help of the clamping assembly; and

[0007] The first cooling system is connected to the clamping assembly in a cooling manner so as to cool the thermopile chip to be detected by means of the clamping assembly.

[0008] In one embodiment, the clamping assembly includes two metal clamping members arranged opposite to each other, and the thermopile chip to be tested is used to be arranged between the two metal clamping members;

[0009] The heating element is thermally connected to at least one of the two metal clamping elements, and the first cooling system is thermally connected to at least one of the two metal clamping elements.

[0010] In one embodiment, the metal clamp is made of copper.

[0011] In one embodiment, the metal clamp is provided with a flow channel;

[0012] The first cooling system includes a first cooling pipeline, a first driving member and a first cooling assembly. The first cooling pipeline is connected to the flow channel. The first cooling assembly is used to cool the first cooling medium in the first cooling pipeline; the first driving member is used to drive the first cooling medium in the first cooling pipeline to circulate.

[0013] In one embodiment, the clamping assembly further includes a connecting pipe, wherein the connecting pipe connects the flow channels of the two metal clamping members.

[0014] In one embodiment, the first cooling assembly includes a first cooling unit and a second cooling unit. The constant temperature platform and the first cooling unit are configured in a first space, and the second cooling unit is configured in a second space.

[0015] In one embodiment, the first cooling unit includes a first air-cooling component and a first liquid-cooling component, and the first air-cooling component and the first liquid-cooling component are used to cool the first cooling medium;

[0016] And / or, the second cooling unit includes a second air-cooling component and a second liquid-cooling component, and the second air-cooling component and the second liquid-cooling component are used to cool the first cooling medium.

[0017] In one embodiment, the first cooling medium is methyl silicone oil.

[0018] In one embodiment, the thermopile chip testing device further includes an infrared emitting mechanism, and the infrared emitting mechanism is disposed opposite to the constant temperature platform;

[0019] Among the two metal clamps, one metal clamp is located between the infrared emitting mechanism and the other metal clamp; wherein, a through hole is provided on the one metal clamp, and at least a portion of the thermopile chip to be detected is provided in the through hole.

[0020] In one embodiment, the thermopile chip testing device further includes a second cooling system, and the second cooling system is connected to the infrared emitting mechanism in a cooling manner to cool the infrared emitting mechanism.

[0021] In one embodiment, the second cooling system includes a second cooling pipeline, a second driving member and a second cooling assembly. The cold end of the second cooling pipeline is connected to the infrared emitting mechanism for cooling. The second cooling assembly is used to cool the second cooling medium in the second cooling pipeline; the second driving member is used to drive the circulation of the second cooling medium in the second cooling pipeline.

[0022] In one embodiment, the second cooling assembly includes a third cooling unit and a fourth cooling unit, the infrared emitting mechanism and the third cooling unit are configured in a first space, and the fourth cooling unit is configured in a second space.

[0023] In one embodiment, the thermopile chip testing device further includes a control component, and the infrared emitting mechanism, the heating component, the first driving component, and the second driving component are all electrically connected to the control component.

[0024] In one embodiment, the thermopile chip testing device further includes an assembly mechanism, and the infrared emitting mechanism and the constant temperature platform are both arranged on the assembly mechanism, wherein at least one of the infrared emitting mechanism and the constant temperature platform can be slidably arranged on the assembly mechanism so that the distance between the infrared emitting mechanism and the constant temperature platform can be adjusted.

[0025] In the thermopile chip testing device provided in the embodiment of the present application, the circuit board can supply power to the thermopile chip to be tested and transmit input signals to the thermopile chip to be tested, and the circuit board can also read the output signal of the thermopile chip to be tested. The clamping assembly can clamp the thermopile chip to be tested. Since the heating element is thermally connected to the clamping assembly, the clamping assembly can quickly transfer the heat transferred by the heating element to the thermopile chip to be tested. Since the first cooling system is cold-conductingly connected to the clamping assembly, the clamping assembly can quickly transfer the cold transferred by the first cooling system to the thermopile chip to be tested. In this way, on the one hand, during the test process, the heating and cooling of the thermopile chip to be tested can be carried out simultaneously, that is, the test temperature of the thermopile chip to be tested can be bidirectionally controlled, which is conducive to keeping the test temperature of the thermopile chip to be tested stable; on the other hand, since the first cooling system is cold-conductingly connected to the clamping assembly, when testing at a lower test temperature is required, the first cooling system can be used to cool the thermopile chip to be tested, thereby achieving low-temperature testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 A schematic structural diagram of a thermopile chip testing device provided in one embodiment of the present application at a first viewing angle.

[0028] Figure 2 for Figure 1The structure diagram of the thermopile chip testing device shown is from a second viewing angle.

[0029] Figure 3 A schematic diagram of the principle of a first cooling system according to an embodiment of the present application for regulating the temperature of a thermopile chip to be detected.

[0030] Figure 4 for Figure 1 A schematic structural diagram of the clamping assembly of the thermopile chip testing device is shown.

[0031] Reference numerals:

[0032] 10. Thermopile chip testing device; 11. Infrared emission mechanism; 12. Constant temperature platform; 121. Housing; 122. Clamping assembly; 1221. Metal clamping member; 1221a. Flow channel; 1221b. Through hole; 1222. Connecting pipe; 1223. Y-shaped connecting pipe; 123. Heating element; 124. Circuit board; 13. First cooling system; 131. First cooling pipeline; 132. First driving member; 133. First cooling assembly; 1331. First Cooling unit; 13311, first air-cooling part; 13312, first liquid-cooling part; 1332, second cooling unit; 14, second cooling system; 141, second cooling pipeline; 142, second driving part; 143, second cooling assembly; 1431, third cooling unit; 14311, third air-cooling part; 14312, third liquid-cooling part; 15, control part; 151, control button; 16, assembly mechanism; 161, slide bar; 20, thermopile chip to be tested. DETAILED DESCRIPTION

[0033] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0034] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0036] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0037] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0038] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0039] As used herein, the singular forms "a," "an," and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include," "comprising," "having," and the like specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Also, in this specification, the term "and / or" includes any and all combinations of the relevant listed items.

[0040] Reference Figure 1 、 Figure 2 and Figure 3 As shown, an embodiment of the present application provides a thermopile chip testing device 10 , which can test the performance of a thermopile chip.

[0041] Specifically, the thermopile chip testing device 10 includes a constant temperature platform 12 and a first cooling system 13. The constant temperature platform 12 includes a housing 121 and a clamping assembly 122, a circuit board 124, and a heating element 123 arranged on the housing 121. The clamping assembly 122 is used to clamp the thermopile chip 20 to be tested. The circuit board 124 is used to be electrically connected to the thermopile chip 20 to be tested. The heating element 123 is thermally connected to the clamping assembly 122 to heat the thermopile chip 20 to be tested with the help of the clamping assembly 122. The first cooling system 13 is coldly connected to the clamping assembly 122 to cool the thermopile chip 20 to be tested with the help of the clamping assembly 122. It can be understood that the heating element 123 can heat the surrounding areas of the thermopile chip 20 to be tested with the help of the clamping assembly 122, and the first cooling system 13 can cool the surrounding areas of the thermopile chip 20 to be tested with the help of the clamping assembly 122.

[0042] It should be noted that, in this application, the "thermal connection" between A and B means: A and B are in direct contact and A transfers heat to B, or, a heat-conducting element (e.g., a metal component) is provided between A and B, both A and B are in contact with the heat-conducting element, and A transfers heat to B. The "cold-conducting connection" between C and D in this application means: C and D are in direct contact and C transfers cold energy to D, or, a cold-conducting element (e.g., a metal component) is provided between C and D, both C and D are in contact with the cold-conducting element, and C transfers cold energy to D. It is understood that the "thermal connection" between A and B can be considered equivalent to the "cold-conducting connection" between B and A.

[0043] In the thermopile chip testing device 10 provided in the embodiment of the present application, the circuit board 124 can supply power to the thermopile chip 20 to be tested and transmit an input signal to the thermopile chip 20 to be tested. The circuit board 124 can also read the output signal of the thermopile chip 20 to be tested. The clamping assembly 122 can clamp the thermopile chip 20 to be tested. Since the heating element 123 is thermally connected to the clamping assembly 122, the clamping assembly 122 can quickly transfer the heat transferred by the heating element 123 to the thermopile chip 20 to be tested. Since the first cooling system 13 is cold-connected to the clamping assembly 122, the clamping assembly 122 can quickly transfer the cold transferred by the first cooling system 13 to the thermopile chip 20 to be tested. In this way, on the one hand, during the test process, the heating and cooling of the thermopile chip 20 to be tested can be carried out simultaneously, that is, the test temperature of the thermopile chip 20 to be tested can be bidirectionally controlled, which is conducive to keeping the test temperature of the thermopile chip 20 to be tested stable.

[0044] Specifically, assuming the standard test temperature is 23°C, when the actual test temperature of the thermopile chip 20 to be tested is higher than 23°C, the cooling efficiency of the first cooling system 13 can be increased and / or the heating efficiency of the heating element 123 can be reduced. When the actual temperature of the thermopile chip 20 to be tested is lower than 23°C, the heating efficiency of the heating element 123 can be increased and / or the cooling efficiency of the first cooling system 13 can be reduced. In this way, regardless of whether the actual test temperature of the thermopile chip 20 to be tested is higher or lower than the standard test temperature, the actual test temperature of the thermopile chip 20 to be tested can be quickly adjusted to maintain a stable actual test temperature.

[0045] On the other hand, when testing at a lower test temperature is required, the first cooling system 13 can be used to cool the thermopile chip 20 to be tested, thereby achieving low-temperature testing.

[0046] In one embodiment, referring to Figure 3As shown, the clamping assembly 122 includes two metal clamps 1221 disposed opposite each other, and the thermopile chip 20 to be tested is used to be disposed between the two metal clamps 1221. The heating element 123 is thermally connected to at least one of the two metal clamps 1221, and the first cooling system 13 is thermally connected to at least one of the two metal clamps 1221.

[0047] By providing two metal clamping members 1221, on the one hand, the clamping assembly 122 can firmly clamp the thermopile chip 20 to be tested, preventing the thermopile chip 20 to be tested from shaking during the test, thereby affecting the test effect; on the other hand, the clamping assembly 122 can have better heat (cooling) conductivity, which is conducive to quickly controlling the temperature of the thermopile chip 20 to be tested.

[0048] In one embodiment, the heater 123 is thermally connected to two metal clamps 1221. For example, the heater 123 is in direct contact with the two metal clamps 1221. This increases the contact area between the heater 123 and the clamping assembly 122, thereby improving heat transfer efficiency and facilitating rapid temperature control of the thermopile chip 20 under test.

[0049] It is understandable that the number of heating elements 123 can be 1 or 2, and the embodiment of the present application does not limit the number of heating elements 123.

[0050] In one embodiment, the first cooling system 13 is in conductive cooling connection with the two metal clamps 1221. For example, the first cooling system 13 is in direct contact with the two metal clamps 1221. It is understood that the first cooling medium in the first cooling system 13 may also be in direct contact with the two metal clamps 1221.

[0051] In one embodiment, the metal clamp 1221 is made of copper. For example, the metal clamp 1221 can be made of red copper. This allows the metal clamp 1221 to have good thermal (or cooling) conductivity, facilitating rapid temperature control of the thermopile chip 20 being tested.

[0052] In one embodiment, a socket is provided on the circuit board 124, and the thermopile chip 20 to be tested is electrically connected to the circuit board 124 via the socket. By providing the socket, the difficulty of assembling the thermopile chip 20 to be tested and the circuit board 124 when electrically connecting them can be reduced.

[0053] It is understandable that there may be multiple sockets, so that performance tests can be performed on multiple thermopile chips 20 to be tested at the same time.

[0054] It should be noted here that the circuit board 124 can have at least the following functions: first, supplying power to the thermopile chip 20 to be tested so that the thermopile chip 20 to be tested can work normally; second, transmitting an input signal (such as a command signal) to the thermopile chip 20 to be tested so that the thermopile chip 20 to be tested starts working; and third, reading the output signal of the thermopile chip 20 to be tested during the test process, processing the output signal, and sending it to the control end (such as an industrial computer).

[0055] In one embodiment, the constant temperature platform 12 may further include a base (not shown) and an adapter (not shown), with the base located at the bottom and the adapter located above the base. The socket of the circuit board 124 may be embedded in the adapter, and the adapter and base may be connected via screws or bolts. This ensures a secure connection between the circuit board 124 and the constant temperature platform 12.

[0056] In one embodiment, referring to Figure 2 and Figure 4 As shown, the metal clamp 1221 is provided with a flow channel 1221a. The first cooling system 13 includes a first cooling pipeline 131, a first driving member 132, and a first cooling assembly 133. The first cooling pipeline 131 is connected to the flow channel 1221a. The first cooling assembly 133 is used to cool the first cooling medium in the first cooling pipeline 131. The first driving member 132 is used to drive the circulation of the first cooling medium in the first cooling pipeline 131.

[0057] By connecting the flow channel 1221a on the metal clamp 1221 with the first cooling pipeline 131, the first cooling medium can flow into the metal clamp 1221, thereby being able to fully exchange heat with the metal clamp 1221, which is beneficial to improving cooling efficiency.

[0058] It is understandable that the first cooling assembly 133 can be a single-stage cooling mechanism or a multi-stage cooling mechanism.

[0059] In one embodiment, the clamping assembly 122 further includes a connecting pipe 1222, which connects the flow channels 1221a of the two metal clamping members 1221. This allows the first cooling medium to flow between the two metal clamping members 1221, which helps maintain a consistent temperature around the thermopile chip 20 to be tested, thereby ensuring the operating performance of the thermopile chip 20 to be tested.

[0060] In one embodiment, the first cooling assembly 133 includes a first cooling unit 1331 and a second cooling unit 1332. The constant temperature platform 12 and the first cooling unit 1331 are configured in a first space, and the second cooling unit 1332 is configured in a second space. For example, the first space can be an indoor space, and the second space can be an outdoor space. The above arrangement, on the one hand, is equivalent to providing a two-stage cooling mechanism, which is conducive to achieving a lower cooling temperature for the first cooling system 13; on the other hand, it can not only reduce noise, but also reduce the impact of the heat generated by the operation of the second cooling unit 1332 on the test environment in the first space.

[0061] It is understandable that the first space and the second space may also be different indoor spaces.

[0062] In one embodiment, the first cooling unit 1331 includes a first air-cooling element 13311 and a first liquid-cooling element 13312, which are used to cool the first refrigerant. For example, the first air-cooling element 13311 can be a fan, and the first liquid-cooling element 13312 can be a liquid-cooled radiator, a condensing radiator, or a compression refrigerator. This arrangement can effectively improve cooling efficiency.

[0063] It is understandable that the first air-cooling component 13311 can be disposed on the first liquid-cooling component 13312 to form an integrated first cooling assembly 133 .

[0064] In one embodiment, the second cooling unit 1332 includes a second air-cooling element (not shown) and a second liquid-cooling element (not shown). The second air-cooling element and the second liquid-cooling element are used to cool the first refrigerant. For example, the second air-cooling element can be a fan, and the second liquid-cooling element can be a liquid-cooled radiator, a condensing radiator, or a compression refrigerator. This arrangement can effectively improve cooling efficiency.

[0065] It is understandable that the second cooling unit 1332 can be the same as the first cooling unit 1331, and the embodiments of the present application will not be repeated here.

[0066] In one embodiment, the first cooling medium is methyl silicone oil, so as to improve the stability and accuracy of temperature control by taking advantage of the high specific heat and good temperature stability of methyl silicone oil.

[0067] In one embodiment, referring to Figure 4As shown, the clamping assembly 122 further includes a Y-shaped connecting pipe 1223 having three nozzles. The first nozzle is connected to the flow channel 1221a of one metal clamping member 1221, the second nozzle is connected to the flow channel 1221a of the other metal clamping member 1221, and the third nozzle is connected to the first cooling pipeline 131. It is understood that there can be two Y-shaped connecting pipes 1223, both of which are connected to the first cooling pipeline 131. In this way, the first cooling medium can be circulated between the first cooling pipeline 131 and the clamping assembly 122.

[0068] In one embodiment, the thermopile chip testing apparatus 10 further includes an infrared emitting mechanism 11, which is disposed opposite the constant temperature platform 12. The infrared emitting mechanism 11 is configured to emit predetermined infrared rays for reception by the thermopile chip 20 to be tested. The predetermined infrared rays may be ambient infrared rays, and the infrared emitting mechanism 11 may be an infrared emitting device for simulating ambient infrared rays. For example, the infrared emitting mechanism 11 may be a blackbody furnace.

[0069] Of the two metal clamps 1221, one is located between the infrared emitting mechanism 11 and the other. This metal clamp 1221 is provided with a through-hole 1221b, into which at least a portion of the thermopile chip 20 to be tested resides. This allows the thermopile chip 20 to be partially assembled within the through-hole 1221b while ensuring that the thermopile chip 20 to be tested can receive the infrared light emitted by the infrared emitting mechanism 11.

[0070] In one embodiment, the thermopile chip testing device 10 further includes a second cooling system 14, which is conductively connected to the infrared emitting mechanism 11 to cool the infrared emitting mechanism 11. As a result, when the temperature of the infrared emitting mechanism 11 rises, the second cooling system 14 can be used to regulate the temperature of the infrared emitting mechanism 11, thereby stabilizing the temperature of the infrared emitting mechanism 11.

[0071] In one embodiment, the infrared emitting mechanism 11 includes a housing and a radiator, wherein the housing has a cavity and the radiator is disposed in the cavity. The second cooling system 14 is connected to the housing in a cooling conduction manner to reduce the temperature in the cavity.

[0072] In one embodiment, the second cooling system 14 includes a second cooling pipe 141, a second driving member 142 and a second cooling assembly 143. The cold end of the second cooling pipe 141 is connected to the infrared emitting mechanism 11 for cooling, and the second cooling assembly 143 is used to cool the second cooling medium in the second cooling pipe 141. The second driving member 142 is used to drive the circulation of the second cooling medium in the second cooling pipe 141. It should be noted here that the cold end of the second cooling pipe 141 can be the end of the second cooling pipe 141 that contacts the infrared emitting mechanism 11, and the hot end of the second cooling pipe 141 can be the end of the second cooling pipe 141 that contacts the second cooling assembly 143. The second driving member 142 can be a circulation pump.

[0073] It is understood that the second cooling pipe 141 is a closed loop, and the second cooling medium circulates in the second cooling pipe 141. Specifically, after the second cooling component 143 cools the second cooling medium, the second cooling medium flows to the cold end and cools the infrared emitting mechanism 11, causing the temperature of the second cooling medium to rise. Then, the second cooling medium flows to the hot end, and the second cooling component 143 cools the second cooling medium, and this cycle repeats.

[0074] In one embodiment, the second cooling assembly 143 can be a single-stage cooling mechanism or a multi-stage cooling mechanism.

[0075] In one embodiment, the second cooling assembly 143 includes a third cooling unit 1431 and a fourth cooling unit (not shown). The infrared emitting mechanism 11 and the third cooling unit 1431 are configured within the first space, while the fourth cooling unit is configured within the second space. This provides a two-stage cooling mechanism, facilitating lower cooling temperatures for the second cooling system 14. Furthermore, this reduces noise and the impact of heat generated by the fourth cooling unit on the test environment within the first space.

[0076] In one embodiment, the third cooling unit 1431 includes a third air-cooling element 14311 and a third liquid-cooling element 14312, which are used to cool the second refrigerant. For example, the third air-cooling element 14311 can be a fan, and the third liquid-cooling element 14312 can be a liquid-cooled radiator, a condensing radiator, or a compression refrigerator. This configuration effectively improves cooling efficiency.

[0077] In one embodiment, the fourth cooling unit includes a fourth air-cooling element and a fourth liquid-cooling element, which are used to cool the second refrigerant. For example, the fourth air-cooling element may be a fan, and the fourth liquid-cooling element may be a liquid-cooled radiator, a condensing radiator, or a compression refrigerator. This arrangement can effectively improve cooling efficiency.

[0078] It is understandable that the second cooling component 143 can be the same as the first cooling component 133, and the embodiments of the present application will not be described in detail here.

[0079] In one embodiment, the second cooling medium in the second cooling pipe 141 is methyl silicone oil. In this way, the advantages of methyl silicone oil, such as high specific heat and good temperature stability, can be utilized to improve the stability and accuracy of temperature control.

[0080] In one embodiment, the thermopile chip testing device 10 further includes a control unit 15, to which the infrared emitting mechanism 11, the heating element 123, the first driving element 132, and the second driving element 142 are all electrically connected. For example, the control unit 15 may be a temperature controller. Thus, the temperature of the infrared emitting mechanism 11 and the constant temperature test platform can be automatically controlled by the control unit 15.

[0081] In one embodiment, a first temperature sensor (not shown in the figure) is provided on the infrared emitting mechanism 11, and the first temperature sensor is electrically connected to the control component 15. A second temperature sensor (not shown in the figure) is provided on the thermopile chip 20 to be detected, and the second temperature sensor is electrically connected to the control component 15.

[0082] In this manner, when the temperature detected by the first temperature sensor by the control component 15 is greater than a first threshold temperature, the control component 15 controls the second driver 142 to increase its power (or rotational speed), thereby increasing the flow rate of the second coolant in the second cooling line 141. When the temperature detected by the second temperature sensor by the control component 15 is greater than a second threshold temperature, the control component 15 controls the first driver 132 to increase its power (or rotational speed), thereby increasing the flow rate of the first coolant in the first cooling line 131. Furthermore, the control component 15 can also control the heater 123 to decrease its power, thereby reducing the amount of heat generated by the heater 123. When the temperature detected by the second temperature sensor by the control component 15 is less than a second threshold temperature, the control component 15 controls the first driver 132 to decrease its power (or rotational speed), thereby reducing the flow rate of the first coolant in the first cooling line 131. Furthermore, the control component 15 can also control the heater 123 to increase its power, thereby increasing the amount of heat generated by the heater 123.

[0083] It is understandable that the control element 15 can control the first driving element 132 and the second driving element 142 by a pulse width modulation (PWM) control method, specifically, adjust the duty cycle of the first driving element 132 and the second driving element 142 .

[0084] It should be noted that the control unit 15 can be electrically connected to an industrial computer to receive configurations and commands from the industrial computer. It is understood that the circuit board 124 can also be electrically connected to the industrial computer to achieve independent communication, thereby preventing signal interference caused by the control unit 15 on the circuit board 124. It is understood that the control unit 15 can be provided with a control button 151 for controlling the start and / or stop of the entire system.

[0085] In one embodiment, the thermopile chip testing device 10 further includes an assembly mechanism 16, on which both the infrared emitting mechanism 11 and the constant temperature platform 12 are mounted. At least one of the infrared emitting mechanism 11 and the constant temperature platform 12 is slidably mounted on the assembly mechanism 16, such that the distance between the infrared emitting mechanism 11 and the constant temperature platform 12 is adjustable. This facilitates adjustment of the distance between the infrared emitting mechanism 11 and the constant temperature platform 12 to meet different testing conditions.

[0086] In one embodiment, the assembly mechanism 16 includes four slide bars 161, which are arranged at intervals and pass through the infrared emitting mechanism 11 and the constant temperature platform 12. In this way, the infrared emitting mechanism 11 and the constant temperature platform 12 can both slide.

[0087] Furthermore, the center lines of the four slide bars 161 form a rectangle, that is, the four slide bars 161 are arranged at the four corners of a virtual rectangle, thereby improving the stability of the assembly.

[0088] Throughout this specification, references to terms such as "some embodiments," "other embodiments," and "desired embodiments" indicate that a particular feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present application. The schematic descriptions of these terms throughout this specification do not necessarily refer to the same embodiment or example.

[0089] The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features of the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0090] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A thermopile chip testing device, characterized in that: include: The constant temperature platform includes a housing and a clamping assembly, a circuit board, and a heating element disposed on the housing; the clamping assembly is used to clamp the thermopile chip to be tested; the circuit board is used to be electrically connected to the thermopile chip to be tested; the heating element is thermally connected to the clamping assembly to heat the thermopile chip to be tested with the help of the clamping assembly; as well as The first cooling system is connected to the clamping assembly in a cooling manner so as to cool the thermopile chip to be detected by means of the clamping assembly.

2. The thermopile chip testing device according to claim 1, characterized in that: The clamping assembly includes two metal clamping pieces arranged opposite to each other, and the thermopile chip to be tested is used to be arranged between the two metal clamping pieces; The heating element is thermally connected to at least one of the two metal clamping elements, and the first cooling system is thermally connected to at least one of the two metal clamping elements.

3. The thermopile chip testing device according to claim 2, characterized in that: The metal clamp is provided with a flow channel; The first cooling system includes a first cooling pipeline, a first driving member and a first cooling assembly. The first cooling pipeline is connected to the flow channel. The first cooling assembly is used to cool the first cooling medium in the first cooling pipeline; the first driving member is used to drive the first cooling medium in the first cooling pipeline to circulate.

4. The thermopile chip testing device according to claim 3, characterized in that: The first cooling assembly includes a first cooling unit and a second cooling unit. The constant temperature platform and the first cooling unit are configured in a first space, and the second cooling unit is configured in a second space.

5. The thermopile chip testing device according to claim 4, characterized in that: The first cooling unit includes a first air-cooling component and a first liquid-cooling component, and the first air-cooling component and the first liquid-cooling component are used to cool the first cooling medium; And / or, the second cooling unit includes a second air-cooling component and a second liquid-cooling component, and the second air-cooling component and the second liquid-cooling component are used to cool the first cooling medium.

6. The thermopile chip testing device according to claim 3, characterized in that: The thermopile chip testing device further includes an infrared emitting mechanism, which is arranged opposite to the constant temperature platform; Among the two metal clamps, one metal clamp is located between the infrared emitting mechanism and the other metal clamp; wherein, a through hole is provided on the one metal clamp, and at least a portion of the thermopile chip to be detected is provided in the through hole.

7. The thermopile chip testing device according to claim 6, characterized in that: The thermopile chip testing device further includes a second cooling system, which is connected to the infrared emitting mechanism in a cooling manner to cool the infrared emitting mechanism.

8. The thermopile chip testing device according to claim 7, characterized in that: The second cooling system includes a second cooling pipeline, a second driving member and a second cooling assembly. The cold end of the second cooling pipeline is connected to the infrared emitting mechanism for cooling. The second cooling assembly is used to cool the second cooling medium in the second cooling pipeline; the second driving member is used to drive the circulation of the second cooling medium in the second cooling pipeline.

9. The thermopile chip testing device according to claim 8, characterized in that: The second cooling assembly includes a third cooling unit and a fourth cooling unit. The infrared emitting mechanism and the third cooling unit are configured in the first space, and the fourth cooling unit is configured in the second space.

10. The thermopile chip testing device according to claim 6, characterized in that: The thermopile chip testing device also includes an assembly mechanism, and the infrared emitting mechanism and the constant temperature platform are both arranged on the assembly mechanism, wherein at least one of the infrared emitting mechanism and the constant temperature platform can be slidably arranged on the assembly mechanism so that the distance between the infrared emitting mechanism and the constant temperature platform can be adjusted.

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