PCB performance testing device and testing method

Abstract

The invention provides a PCB performance testing device and method, and particularly relates to the technical field of circuit board tests.The PCB performance testing device comprises a base, a main control displayer is installed on the front side of the top of the base, a testboard is fixedly arranged on the top face of the base, a PCB loading area is arranged in the center of the top face of the testboard, and a circuit board to be tested is loaded in the loading area; efficient cleaning pretreatment before testing is achieved through the combined treatment mechanism, plasma generated by the low-temperature plasma generator can remove an oxide layer and oil dirt on the surface of a testing point, ultrasonic vibration assists in stripping tiny impurities, impurities and chippings can be removed in time in cooperation with negative pressure adsorption of the rectangular suction nozzle, testing errors caused by surface pollution are effectively reduced, and the testing efficiency is improved. Meanwhile, by means of airflow purging and surrounding type high-frequency ultrasonic vibration, physical and mechanical friction is avoided, in the process of removing the oxide layer, the circuit board is not prone to being damaged, and the testing cost of the circuit board can be effectively reduced.

Description

Technical Field

[0001] The present invention provides a PCB circuit board performance testing device and a testing method, and particularly relates to the technical field of circuit board testing. Background Art

[0002] PCB circuit boards are a very important component of electronic products. Testing PCB circuit boards can ensure the quality and reliability of electronic products. The main goal of circuit board testing is to verify the function and performance of the circuit board.

[0003] In the authorization announcement number CN117949815B, a circuit board electrical testing device and its testing method are disclosed. The core solution of the electrical testing device is: the bottom surface of each syringe is driven by a rotating driving component to contact and rotate with the test point on the test pad, and the oxide layer on the test point is removed by friction to ensure the test effect.

[0004] Although the above-mentioned electrical test equipment can remove the oxide layer on the test point, the friction between the end face of the annular syringe and the test point not only fails to completely remove the oxide layer, but the torque generated by the continuous friction will damage the test point and the PCB board.

[0005] This indicates that this electrical testing equipment suffers from incomplete oxide layer removal, which results in a portion of the oxide layer increasing the contact resistance during probe testing, thus affecting the accuracy of test results. Furthermore, it can cause unnecessary damage to the PCB being tested, which not only affects test results but also increases PCB testing costs.

[0006] Therefore, the present invention proposes a PCB circuit board performance testing device and testing method to make up for the shortcomings of the prior art. Summary of the Invention

[0007] In view of the defects of the prior art, the present invention provides a PCB circuit board performance testing device and testing method, which can effectively solve the relevant technical problems raised by the background technology.

[0008] To achieve the above objectives, the present invention is implemented through the following technical solutions: The present invention discloses a PCB circuit board performance test device, comprising a base, a main control display installed on the front side of the top of the base, a test bench fixedly installed on the top surface of the base, a PCB loading area provided at the center of the top surface of the test bench, and a circuit board to be tested loaded in the loading area, limit light rods fixedly provided on the four sides of the top surface of the test bench, the top ends of the four limit light rods are fixedly connected to a top frame body, a servo cylinder is fixedly installed at the center of the top frame body, the end of the servo cylinder piston rod is fixedly connected to a limit orifice plate, a mounting plate is fixedly installed on the bottom of the limit orifice plate, the bottom surface of the mounting plate is rectangular and has a plurality of sleeves equidistantly distributed thereon, and a test probe is provided in each sleeve; Also included is a combined processing mechanism provided on the mounting plate and the sleeve; The combined processing mechanism includes a low-temperature plasma generator and an ultrasonic generator respectively mounted on the bottom surface of the mounting plate; It also includes a positioning plate fixedly connected to the outer wall of one side of each sleeve, a cavity ring fixedly connected to the bottom of the positioning plate, an air inlet pipe connected to one side of the top surface of the cavity ring, and a plurality of air outlet pipes equidistantly distributed along the circumferential direction at the bottom of the cavity ring, with the lower end of each air outlet pipe tilted downward at a 45-degree angle; A micro-electrically controlled telescopic rod is fixedly installed at the bottom of one side of the cavity ring, and a mounting ring body is fixedly installed at the telescopic end of the micro-electrically controlled telescopic rod. A ring-shaped vibration plate is detachably connected to the inner circumference of the mounting ring body, and the ring-shaped vibration plate is located outside the test probe; It also includes a rectangular suction nozzle that is arranged horizontally with the top surface of the circuit board to be tested.

[0009] Preferably, the limiting orifice plate is provided with through holes all around, and is slidably engaged with each limiting polished rod through the through holes.

[0010] Preferably, the sleeve is composed of two identical halves of the cylinder, and the two cylinders are connected by a snap-fit ​​structure.

[0011] Preferably, a first through hole is provided on the top of the sleeve, and a second through hole is provided on the mounting plate at a position corresponding to the first through hole.

[0012] Preferably, the lower end of each air outlet pipe is provided with a trumpet-shaped expansion portion.

[0013] Preferably, at least two fastening bolts are threadedly connected to the mounting ring body, and fastening holes corresponding to the fastening bolts and threadedly matched with the fastening bolts are provided on the outer peripheral surface of the annular vibration plate.

[0014] Preferably, a limit buffer assembly is further provided between the test probe and the sleeve, and the limit buffer assembly includes two vertical wall grooves opened on the inner circumference of the sleeve, and protrusions that slide with the vertical wall grooves are provided on both sides of the top circumference of the test probe. A first magnetic ring is fixedly installed on the top of the test probe, and a second magnetic ring is fixedly installed on the top wall inside the sleeve. The first magnetic ring and the second magnetic ring correspond to each other up and down, and their N poles and S poles are arranged relative to each other.

[0015] Preferably, the position limiting buffer assembly further includes a plurality of strip-shaped holes formed on the top circumference of the sleeve.

[0016] The testing method of the PCB circuit board performance testing device comprises the following steps: Step 1: PCB loading and initialization: Place the circuit board to be tested in the PCB loading area of ​​the test bench and secure it with a positioning fixture; the main control display starts the device, and the electrical control system performs self-tests to ensure the normal operation of components such as the servo cylinder, low-temperature plasma generator, and ultrasonic generator; Step 2: Pre-treatment cleaning: The servo cylinder drives the mounting plate down to a preset height without contacting the circuit board. The low-temperature plasma generator and blower are then started, spraying plasma gas through the outlet pipe toward the test point for a continuous cleaning period of 3-5 seconds. The ultrasonic generator and rectangular suction nozzle are then simultaneously started, and the annular vibrating plate is lowered to contact the test point. The high-frequency vibration of the annular vibrating plate assists in removing impurities, while the suction nozzle absorbs impurities and debris. After cleaning is complete, the plasma generator and ultrasonic generator are turned off. Step 3: Probe contact and testing: The servo cylinder continues to drive the mounting plate downward, and the test probe, guided by the limit buffer assembly, vertically contacts the test point of the circuit board to be tested. The electrical control system collects electrical parameters such as resistance and capacitance in real time through the signal acquisition module, and transmits them to the main control unit after processing by the signal conditioning circuit. The main control display shows the test data in real time. Step 4: Test completion and reset: After the test is completed, the servo cylinder drives the mounting plate to rise and reset, and the test probe is separated from the circuit board; if retesting is required, repeat steps 2 to 3; if the test is completed, turn off the device, remove the circuit board to be tested, and continue to work for a few seconds to clean the residual impurities.

[0017] Preferably, in the above step 2, the annular vibrating plate is precisely controlled to descend and contact the test point by a micro-electrically controlled telescopic rod.

[0018] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects: This PCB performance test device achieves efficient cleaning and pre-treatment before testing through a combined processing mechanism. The plasma generated by the low-temperature plasma generator can remove the oxide layer and oil stains on the surface of the test point. Ultrasonic vibration assists in the removal of tiny impurities. The negative pressure adsorption of the rectangular suction nozzle can promptly remove impurities and debris, effectively reducing test errors caused by surface contamination and improving the accuracy of test data. At the same time, the use of airflow blowing and surrounding high-frequency ultrasonic vibration avoids physical mechanical friction. During the process of removing the oxide layer, it is not easy to damage the circuit board, which can effectively reduce the testing cost of the circuit board. The sliding fit between the limiting polished rod and the limiting orifice plate provides a stable guide for the probe to rise and fall. The limiting structure of the vertical wall groove and the protrusion ensures the precise alignment of the probe, avoiding poor contact caused by offset, and ensuring reliable contact between the probe and the test point on the circuit board during the test. The buffer structure formed by the repulsive force of the magnetic ring can effectively offset the impact force when the probe contacts the test point, preventing the probe from bending and breaking and damaging the test point on the circuit board. The heat dissipation design of the strip hole can avoid heat accumulation in the probe, extending the service life of the probe and ensuring the stability of long-term testing. The sleeve's snap-on structure facilitates probe replacement and maintenance, while the removable ring-shaped vibrating plate reduces component maintenance. The overall device combines test accuracy, ease of operation, and equipment protection, making it suitable for efficient performance testing of various PCB circuit boards. In summary, this PCB performance testing device implements a coordinated process of "pretreatment - precise testing - protection and cleaning". By combining the plasma cleaning, ultrasonic-assisted impurity removal, and negative pressure adsorption of the processing mechanism, it solves the problem of poor contact caused by surface contamination in traditional testing; ensures the safety and stability of the probe and circuit board, and finally completes signal acquisition and analysis through the electrical control system, forming a complete PCB high-performance testing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a main perspective structural diagram of the present invention; Figure 2 It is a three-dimensional structural diagram of the present invention from another perspective; Figure 3 It is a partial three-dimensional structural diagram of the relevant components at the bottom of the mounting plate in the present invention; Figure 4 A three-dimensional structural diagram of the relevant components of the mounting plate of the present invention in a partially cut-away state; Figure 5 It is a partial three-dimensional structural diagram of the relevant components of the positioning plate in the present invention; Figure 6 It is a partial three-dimensional structural diagram of the relevant components of the bottom of the hollow ring in the present invention; Figure 7It is a partial three-dimensional structural diagram of the relevant components in the cross-section state of the hollow ring of the present invention; Figure 8 It is a partial exploded three-dimensional structural diagram of the relevant components at the installation ring body of the present invention; Figure 9 It is a partial three-dimensional structural diagram of the relevant components inside the sleeve in the present invention.

[0020] The numbers in the figure represent: 1. Base; 10. Main control display; 11. Test bench; 12. Circuit board to be tested; 13. Limiting rod; 14. Top frame; 15. Servo cylinder; 16. Limiting orifice plate; 17. Mounting plate; 171. Sleeve; 172. Test probe; 173. First through hole; 174. Second through hole; 2. Combined processing mechanism; 21. Low-temperature plasma generator; 22. Ultrasonic generator; 23. Positioning plate; 24. Cavity ring; 25. Inlet pipe; 26. Outlet pipe; 27. Micro-electrically controlled telescopic rod; 28. Mounting ring; 29. ​​Ring vibrating plate; 281, fastening bolt; 291, fastening hole; 3. Limit buffer assembly; 31. Strip hole; 32. Vertical wall groove; 33. Bump; 34. First magnetic ring; 35. Second magnetic ring; 4. Rectangular nozzle. DETAILED DESCRIPTION

[0021] The present invention will be further described below with reference to the embodiments.

[0022] Example 1: like Figures 1 to 8As shown, a PCB circuit board performance test device includes a base 1, a main control display 10 is installed on the front side of the top of the base 1, a test table 11 is fixedly installed on the top surface of the base 1, and a PCB loading area is provided in the center of the top surface of the test table 11. Specifically, the loading area can be a trough body adapted to the shape of the PCB, or it can be a workbench equipped with an adjustable clamp. A circuit board 12 to be tested is loaded in the loading area, and limit rods 13 are fixedly provided on the four sides of the top surface of the test table 11. The top ends of the four limit rods 13 are fixedly connected to a top frame 14. A servo cylinder 15 is fixedly installed in the center of the top frame 14. The end of the piston rod of the servo cylinder 15 is fixedly connected to a limit orifice plate 16. The limit orifice plate 16 is provided with through holes on all sides and slides with each limit rod 13 through the through holes. The four limit rods 13 cooperate with the through holes to ensure the stability of the limit orifice plate 16 in moving up and down. A mounting plate 17 is fixedly installed at the bottom of the limiting hole plate 16. The bottom surface of the mounting plate 17 is rectangular and has multiple sleeves 171 equidistantly distributed. A test probe 172 is provided in each sleeve 171. As a supplement to the existing technology, an electrical control system is also provided on the base 1, which includes: a main control unit, as a core controller, which receives software instructions and coordinates the actions of each module (such as the lifting and lowering of the test probe 172, and processing test data); a signal acquisition and processing module: an interface for instruments such as an integrated multimeter, an LCR tester, and an oscilloscope, which is used to collect electrical parameters such as resistance, capacitance, and inductance of the PCB; a signal conditioning circuit: amplifies, filters, and isolates the collected weak signals to reduce noise interference and ensure signal accuracy; an A / D converter: converts analog signals such as voltage and current into digital signals and transmits them to the main control unit for analysis; a power supply system: a DC regulated power supply that provides a stable working voltage for each electrical component of the test device.

[0023] It also includes a combined processing mechanism 2 provided on the mounting plate 17 and the sleeve 171; The combined processing mechanism 2 includes a low-temperature plasma generator 21 and an ultrasonic generator 22 respectively mounted on the bottom surface of the mounting plate 17; The system further includes a positioning plate 23 fixedly connected to the outer wall of one side of each sleeve 171. A cavity ring 24 is fixedly connected to the bottom of the positioning plate 23. An air inlet pipe 25 is provided on the top surface of the cavity ring 24. Specifically, a fan and a pipe are provided in conjunction with the low-temperature plasma generator 21. Note: For ease of illustration, the structure is not shown in the figure. The low-temperature plasma generator 21 generates low-temperature plasma gas, which is then fed into the cavity ring 24 through the air inlet pipe 25 via the fan and the pipe. Ultimately, the low-temperature plasma gas is directed downward from the bottom of each air outlet pipe 26 to the test points on the circuit board. Multiple air outlet pipes 26 are equidistantly distributed along the circumference of the bottom of the cavity ring 24. The lower end of each air outlet pipe 26 is tilted downward at a 45-degree angle. Specifically, the downward tilt of the air outlet pipe 26 allows the low-temperature plasma gas to be blown toward the test points on the circuit board.

[0024] A micro-electrically controlled telescopic rod 27 is fixedly installed at the bottom of one side of the cavity ring 24, and a mounting ring body 28 is fixedly installed at the telescopic end of the micro-electrically controlled telescopic rod 27. A ring-shaped vibration plate 29 is detachably connected to the inner circumferential surface of the mounting ring body 28. The ring-shaped vibration plate 29 is located outside the test probe 172. Specifically, the access end of the ring-shaped vibration plate 29 is connected to the output end of the ultrasonic generator 22 through a wire. Through the cooperation of the ultrasonic generator 22 and the wire, the ring-shaped vibration plate 29 generates ultrasonic vibration.

[0025] It also includes a rectangular suction nozzle 4 horizontally arranged on the top surface of the circuit board 12 to be tested. The rectangular suction nozzle 4 is fixedly installed on the test bench 11, and one side of it is connected to an external negative pressure adsorption component. The negative pressure adsorption component is configured as: a vacuum cleaner, and its suction end is connected to one side of the rectangular suction nozzle 4 through a pipe. When in use: the vacuum cleaner generates a negative pressure adsorption force, and further sucks away the impurities in the oxide layer on the surface of the circuit board through the rectangular suction nozzle 4 and the pipe to avoid affecting its normal testing.

[0026] Furthermore, the sleeve 171 is composed of two identical halves of the cylinder, which are connected by a snap-fit ​​structure. The snap-fit ​​structure is configured as: a socket and a column are respectively arranged on the surface of one side of the two cylinders close to each other, and the two are tightly snap-fitted together; it is convenient for personnel to install or repair the structure inside the sleeve 171.

[0027] Furthermore, a first through hole 173 is provided at the top of the sleeve 171, and a second through hole 174 is provided at a position corresponding to the first through hole 173 on the mounting plate 17, wherein the top of the test probe 172 is connected to the electrical system through a wire, and the first through hole 173 and the second through hole 174 are used for the wire to pass through to prevent the wire from being scattered; however, in order to facilitate the display of the relevant structure, it is not drawn in the figure.

[0028] Furthermore, the lower end of each gas outlet pipe 26 is provided with a trumpet-shaped expansion portion, which is conducive to the diffusion of low-temperature plasma gas to ensure that it can cover the test points on the circuit board.

[0029] At least two fastening bolts 281 are threadedly connected to the mounting ring body 28, and a fastening hole 291 corresponding to the fastening bolts 281 and threadedly matched with the fastening bolts 281 is provided on the outer peripheral surface of the annular vibration plate 29. When in use, the annular vibration plate 29 can be removed by rotating and removing the fastening bolts 281, thereby facilitating the installation and maintenance of the annular vibration plate 29.

[0030] During use: Before testing, first activate the servo cylinder 15, driving the test probe 172 close to the test point on the circuit board, but not touching it. Then, activate the low-temperature plasma generator 21 to generate low-temperature plasma gas, which is transported to the air inlet pipe 25 via a blower and pipeline. It then enters the cavity ring 24 and is ejected through multiple downward-facing air outlet pipes 26, directly acting on the test point of the circuit board 12 under test. The active components of the plasma remove impurities such as oxide layers and oil stains on the test point, thereby improving the reliability of the conductive contact between the probe and the test point. At the same time, the micro-electrically controlled telescopic rod 27 is activated, driving the annular vibrating plate 29 downward to contact the test point on the circuit board. The ultrasonic generator 22 is then activated to drive the annular vibrating plate 29 to generate high-frequency ultrasonic vibrations. The vibration energy is transmitted to the test point, further stripping away the tiny oxide impurities there.

[0031] The rectangular nozzle 4, under the action of the negative pressure suction component, absorbs the oxidized impurities and debris generated during the stripping process in real time, avoiding secondary contamination. The synergy of plasma cleaning, ultrasonic-assisted impurity removal, and negative pressure suction effectively reduces test errors caused by surface contamination and improves test accuracy.

[0032] Example 2: like Figure 1 Figure 9 As shown, the above-mentioned PCB circuit board performance test device also includes a limit buffer assembly 3 arranged between the test probe 172 and the sleeve 171. The limit buffer assembly 3 includes two vertical wall grooves 32 opened on the inner circumference of the sleeve 171. The top circumference of the test probe 172 is provided with protrusions 33 that slide with the vertical wall grooves 32 on both sides. The sliding fit between the vertical wall grooves 32 and the protrusions 33 provides a precise guiding and limiting effect for the test probe 172. A first magnetic ring 34 is fixedly installed on the top of the test probe 172, and a second magnetic ring 35 is fixedly installed on the inner top wall of the sleeve 171. The first magnetic ring 34 and the second magnetic ring 35 correspond to each other up and down, and the N poles and S poles of the two are arranged relative to each other. Initially, there is a magnetic repulsion state between the two, and the repulsion acts on the test probe 172, so that it is always forced downward.

[0033] Furthermore, the limit buffer assembly 3 also includes a plurality of strip holes 31 opened on the top circumference of the sleeve 171, which facilitates the heat generated by the test probe 172 during testing to be discharged from the top, thereby preventing the heat accumulation of the test probe 172 and affecting normal testing.

[0034] During use: When the servo cylinder 15 drives the test probe 172 to descend and contact the circuit board 12 to be tested, the magnetic repulsion between the first magnetic ring 34 and the second magnetic ring 35 forms a buffer force, which can offset the impact force at the moment of probe contact, preventing the probe from bending or breaking due to rigid collision, and protecting the test point of the circuit board from damage; During testing, the bump 33 slides stably along the vertical groove 32, further ensuring that the probe is subjected to vertical force and improving contact stability. Furthermore, the strip hole 31 at the top of the sleeve 171 balances the air pressure inside and outside the sleeve 171, preventing probe jams caused by pressure differences when the probe is raised or lowered. It also accelerates the dissipation of heat generated by the probe through the strip hole 31, preventing high temperatures from causing probe performance degradation and ensuring long-term test reliability.

[0035] Example 3: Based on the above-mentioned PCB circuit board performance test device, a specific test method is now proposed, including the following steps: Step 1: PCB loading and initialization: The circuit board 12 to be tested is placed in the PCB loading area of ​​the test bench 11 and fixed using a positioning fixture such as a trough or an adjustable clamp. The main control display 10 starts the device and the electrical control system performs a self-test to ensure that the servo cylinder 15, low-temperature plasma generator 21, ultrasonic generator 22 and other components are operating normally. Step 2: Pre-treatment cleaning: The servo cylinder 15 drives the mounting plate 17 to descend to a preset height. The test probe 172 does not contact the circuit board. The low-temperature plasma generator 21 and the blower are started, and plasma gas is sprayed toward the test point through the outlet pipe 26 for a continuous cleaning of 3-5 seconds. The ultrasonic generator 22 and the rectangular suction nozzle 4 are simultaneously started, and the annular vibrating plate 29 is lowered to contact the test point. The annular vibrating plate 29 vibrates at a high frequency to assist in impurity removal, and the suction nozzle absorbs impurities and debris. After cleaning is completed, the plasma generator and ultrasonic generator are turned off. Step 3: Probe contact and testing: The servo cylinder 15 continues to drive the mounting plate 17 downward, and the test probe 172 vertically contacts the test point of the circuit board 12 under the guidance of the limit buffer assembly 3; the electrical control system collects electrical parameters such as resistance and capacitance in real time through the signal acquisition module, and transmits them to the main control unit after processing by the signal conditioning circuit. The main control display 10 displays the test data in real time; Step 4: Test completion and reset: After the test is completed, the servo cylinder 15 drives the mounting plate 17 to rise and reset, and the test probe 172 is separated from the circuit board; if retesting is required, repeat steps 2 to 3; if the test is completed, turn off the device, remove the circuit board 12 to be tested, and the rectangular suction nozzle 4 continues to work for several seconds to clean residual impurities.

[0036] Furthermore, in the above step 2, the annular vibrating plate 29 is precisely controlled to descend and contact the test point by the micro electric telescopic rod 27 .

[0037] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A PCB circuit board performance test device, comprising a base (1), a main control display (10) being installed on the top front side of the base (1), characterized in that: A test bench (11) is fixedly provided on the top surface of the base (1), a PCB loading area is provided at the center of the top surface of the test bench (11), and a circuit board (12) to be tested is loaded in the loading area, and limited light rods (13) are fixedly provided around the top surface of the test bench (11), and the top ends of the four limited light rods (13) are fixedly connected to a top frame body (14), a servo cylinder (15) is fixedly installed at the center of the top frame body (14), and the end of the piston rod of the servo cylinder (15) is fixedly connected to a limited orifice plate (16), and a mounting plate (17) is fixedly installed at the bottom of the limited orifice plate (16), and the bottom surface of the mounting plate (17) is rectangular with a plurality of sleeves (171) distributed at equal intervals, and each sleeve (171) is provided with a test probe (172); It also includes a combined processing mechanism (2) disposed on the mounting plate (17) and the sleeve (171); The combined processing mechanism (2) includes a low-temperature plasma generator (21) and an ultrasonic generator (22) respectively mounted on the bottom surface of the mounting plate (17); It also includes a positioning plate (23) fixedly connected to the outer wall of one side of each sleeve (171), a cavity ring (24) fixedly connected to the bottom of the positioning plate (23), an air inlet pipe (25) connected to one side of the top surface of the cavity ring (24), and a plurality of air outlet pipes (26) equidistantly distributed along the circumferential direction at the bottom of the cavity ring (24), the lower end of each air outlet pipe (26) being inclined downward at a 45-degree angle; A micro-electrically controlled telescopic rod (27) is fixedly mounted on the bottom of one side of the cavity ring (24); a mounting ring body (28) is fixedly mounted on the telescopic end of the micro-electrically controlled telescopic rod (27); an annular vibration plate (29) is detachably connected to the inner circumferential surface of the mounting ring body (28); and the annular vibration plate (29) is located outside the test probe (172); It also includes a rectangular suction nozzle (4) arranged horizontally with the top surface of the circuit board (12) to be tested.

2. The PCB circuit board performance testing device according to claim 1, characterized in that: The limiting orifice plate (16) is provided with through holes on all sides and is slidably engaged with each limiting light rod (13) through the through holes.

3. The PCB circuit board performance testing device according to claim 1, characterized in that: The sleeve (171) is composed of two identical half cylinders, and the two cylinders are connected by a snap-fit ​​structure.

4. The PCB circuit board performance testing device according to claim 1, characterized in that: A first through hole (173) is provided on the top of the sleeve (171), and a second through hole (174) is provided on the mounting plate (17) at a position corresponding to the first through hole (173).

5. The PCB circuit board performance testing device according to claim 1, characterized in that: The lower end of each air outlet pipe (26) is provided with a trumpet-shaped expansion portion.

6. The PCB circuit board performance testing device according to claim 1, characterized in that: At least two fastening bolts (281) are threadedly connected to the mounting ring body (28), and fastening holes (291) corresponding to the fastening bolts (281) and threadedly matched are provided on the outer peripheral surface of the annular vibration plate (29).

7. The PCB circuit board performance testing device according to claim 1, characterized in that: A limit buffer assembly (3) is further provided between the test probe (172) and the sleeve (171), the limit buffer assembly (3) comprising two vertical wall grooves (32) provided on the inner circumference of the sleeve (171), protrusions (33) slidingly engaged with the vertical wall grooves (32) are provided on both sides of the top circumference of the test probe (172), a first magnetic ring (34) is fixedly mounted on the top of the test probe (172), and a second magnetic ring (35) is fixedly mounted on the inner top wall of the sleeve (171), the first magnetic ring (34) and the second magnetic ring (35) correspond to each other in the upper and lower parts, and the N poles and S poles of the two are arranged relative to each other.

8. The PCB circuit board performance testing device according to claim 7, characterized in that: The position limiting buffer assembly (3) further includes a plurality of strip-shaped holes (31) formed on the top circumference of the sleeve (171).

9. A PCB circuit board performance testing method, applied to the PCB circuit board performance testing device described in any one of claims 1 to 8 above, characterized in that: The following steps are involved: Step 1: PCB loading and initialization: The circuit board (12) to be tested is placed in the PCB loading area of ​​the test bench (11) and fixed by a positioning fixture (such as a trough or an adjustable clamp); the main control display (10) starts the device, and the electrical control system performs self-test to ensure that the servo cylinder (15), the low-temperature plasma generator (21), the ultrasonic generator (22) and other components are operating normally; Step 2: Pre-treatment cleaning: The servo cylinder (15) drives the mounting plate (17) to descend to a preset height, the test probe (172) does not contact the circuit board, the low-temperature plasma generator (21) and the blower are started, and plasma gas is sprayed to the test point through the outlet pipe (26), and the cleaning is continued for 3-5 seconds; the ultrasonic generator (22) and the rectangular suction nozzle (4) are started simultaneously, and the annular vibration plate (29) is lowered to contact the test point, the annular vibration plate (29) vibrates at high frequency to assist in impurity removal, and the suction nozzle absorbs impurities and debris. After cleaning is completed, the plasma generator (21) and the ultrasonic generator (22) are turned off; Step 3: Probe contact and testing: The servo cylinder (15) continues to drive the mounting plate (17) downward, and the test probe (172) vertically contacts the test point of the circuit board (12) to be tested under the guidance of the limit buffer assembly (3); the electrical control system collects electrical parameters such as resistance and capacitance in real time through the signal acquisition module, and transmits them to the main control unit after processing by the signal conditioning circuit, and the main control display (10) displays the test data in real time; Step 4: Test completion and reset: After the test is completed, the servo cylinder (15) drives the mounting plate (17) to rise and reset, and the test probe (172) is separated from the circuit board; if retesting is required, repeat steps 2 to 3; if the test is completed, the device is turned off, the circuit board to be tested (12) is removed, and the rectangular suction nozzle (4) continues to work for several seconds to clean the residual impurities.

10. The PCB performance testing method according to claim 9, wherein: In step 2, the annular vibrating plate (29) is precisely controlled to descend and contact the test point by a micro-electrically controlled telescopic rod (27).

Images