Chip heat dissipation packaging structure

Abstract

The invention provides a chip heat dissipation packaging structure, and belongs to the technical field of chip packaging, the chip heat dissipation packaging structure comprises a packaging substrate, a packaging cover plate and a chip, the bottom of the chip is provided with chip pins, and the chip heat dissipation packaging structure further comprises a positioning frame wrapping a heat dissipation assembly; a dual electrical connection path combining slot type connection with contact between the side wall of the chip and the leading-out pin is adopted, and when main connection fails, a standby path can maintain circuit conduction; upper and lower double-sided heat dissipation main channels are constructed, heat is uniformly distributed through a vapor chamber phase change material, and the heat transfer frame is matched with external airflow, so that all-directional efficient heat dissipation of the chip and the pins is realized; the condensation plate, the air bag and other assemblies form targeted heat dissipation circulation, the problem of local overheating of the pins is solved, and the temperature of the chip and key parts is effectively reduced; multiple sealing is achieved through the design of matching of the positioning boss and the clamping groove, automatic sealing of the air bag and the like, dustproof and waterproof closed-loop protection is formed, the service life of the packaging structure is prolonged, and the application requirement of a severe environment is met.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a chip heat dissipation packaging structure. Background Art

[0002] Chips typically contain numerous precision circuits. If these circuits are exposed directly to air, they can be corroded by impurities, undesirable gases, and water vapor, degrading their electrical performance. Chip packaging technology is a process that encapsulates the delicate circuitry within a chip to prevent it from contacting the outside world, effectively protecting it.

[0003] The heat dissipation path of traditional packaging structures is relatively simple, and usually only relies on the heat dissipation components on the top or bottom of the chip for heat conduction and dissipation. The chip pins, as the key parts connecting the chip and the external circuit, will generate Joule heat when transmitting large current or high-frequency signals. However, traditional heat dissipation design does not fully consider the special heat dissipation needs of the pins, and heat is difficult to be quickly dissipated, resulting in continuous accumulation of temperature in the pin area. For example, in the high-performance CPU (central processing unit) used in servers, the number of pins is large and the current density is high. Traditional packaging cannot dissipate the heat of the pins in time, which can easily cause local overheating in the pin area, causing signal attenuation, solder joint failure and other faults, seriously restricting the performance of the chip; in addition, traditional packaging mostly uses simple glue sealing or gasket sealing methods. During long-term use, such sealing structures are affected by environmental factors such as temperature cycles and humidity changes. The sealing materials are prone to aging and cracking, causing external pollutants such as dust and moisture to invade the interior of the package, corroding the chip and electrical connections, and shortening the chip's service life.

[0004] How to invent a chip heat dissipation packaging structure to solve these problems has become an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0005] In order to make up for the above deficiencies, the present invention provides a chip heat dissipation packaging structure, aiming to solve the problems mentioned in the above background.

[0006] The present invention is achieved in that:

[0007] The present invention provides a chip heat dissipation packaging structure, comprising a packaging substrate, a packaging cover, and a chip, wherein the bottom of the chip is provided with chip pins, and further comprising:

[0008] Positioning frame: The positioning frame is provided between the package substrate and the package cover, and the chip is mounted inside the positioning frame;

[0009] Enclosed heat dissipation component: The enclosed heat dissipation component is arranged in the packaging substrate and the packaging cover.

[0010] Preferably, a plurality of lead-out pins are welded and connected on the upper side of the packaging substrate, a chip pin slot corresponding to the chip pin is provided on the upper side of the packaging substrate, the positioning frame is snap-fitted on the packaging substrate, a positioning column is provided on the lower side of the positioning frame, a positioning hole matching the positioning column is provided on the packaging substrate, an upper card slot and a lower card slot are provided at the side frame of the positioning frame corresponding to the lead-out pins, a positioning boss and a connecting platform are fixedly connected to the lower side of the packaging cover, wherein the positioning boss matches the upper card slot, the outer side of the connecting platform is flush with the outer side of the packaging cover, and the inner side of the connecting platform is connected to the end of the positioning boss; a pad mounting groove is provided on the upper side of the packaging substrate corresponding to the short side of the positioning frame, and a pad is interference fit in the pad mounting groove.

[0011] Preferably, after the chip is fixed on the packaging substrate through the chip pins, its side walls are in contact with the inner ends of the lead pins; the upper side walls of the lead pins are flush with the top wall of the packaging substrate; after the positioning frame is fixed on the packaging substrate, its bottom wall is against the upper surface of the lead pins and the pad.

[0012] Preferably, a mounting sleeve is fixedly connected to the lower side of the connecting platform, and a mounting hole is opened on the packaging substrate corresponding to the mounting sleeve, and a gasket and a screw are provided in the mounting hole. During assembly, the positioning frame is first fixed on the packaging substrate, and then the chip is installed in the positioning frame, and then the packaging cover is buckled onto the packaging substrate, and finally the screw is screwed into the mounting sleeve to complete the assembly.

[0013] Preferably, the interior of the lower card slot is fixedly connected to a condensation plate, and a plurality of sockets are provided on the upper card slot corresponding to the lead-out pins, the ends of the sockets pass through the upper card slot and the side walls of the condensation plate, and the bottom of the condensation plate is fixedly connected to an airbag, the lower side wall of the airbag is flush with the bottom wall of the positioning frame, and a mounting tube is slidably connected in the socket, and the lower end of the mounting tube is against the upper side wall of the airbag, and the airbag is made of thermal conductive silicone material.

[0014] Preferably, before the packaging cover is assembled, the upper end of the mounting tube is located above the bottom wall of the upper slot. When the packaging cover is assembled with the packaging substrate, the positioning boss squeezes the upper end of the mounting tube, causing the mounting tube to be displaced. At this time, its lower end acts on the upper wall of the airbag, causing the airbag to fully swell, thereby increasing the sealing effect at the connection between the positioning frame and the lead-out pin.

[0015] The heat dissipation device is a heat dissipation device, and a heat dissipation device is installed in the heat dissipation device, and a heat dissipation device is installed in the heat dissipation device.

[0016] Preferably, a heat dissipation channel is provided inside the packaging cover plate corresponding to the mounting tube, and a filter port is installed in the upper end of the heat dissipation channel, and the filter port is arranged in a shape of a small outer port and a large inner port. The lower end of the heat dissipation channel is fixedly connected with a plug port, and the plug port is nested in the accommodating cavity when the packaging substrate and the packaging cover plate are assembled. The heat dissipation channel is arranged in a bent inverted L shape, and a tapered portion is provided on the outer side wall of the mounting tube, and the end of the tapered portion is clamped in the socket at the bottom when the packaging substrate and the packaging cover plate are assembled. A plurality of air guide holes are provided on the mounting tube above the tapered portion, and the ends of the air guide holes pass through the side wall of the mounting tube and the inner cavity of the accommodating cavity.

[0017] Preferably, the side wall of the packaging cover plate is provided with a fin mounting groove, in which a fin is inserted and installed, and the side wall of the fin located in the packaging cover plate is abutted against the side wall of the upper heat conducting plate, and the upper heat conducting plate, heat conducting boss, fin, heat spreader, heat transfer frame, heat conducting column and lower heat conducting plate are all made of high thermal conductivity alloy material.

[0018] Preferably, the lower side wall of the lower heat conducting plate is connected to the top of the heat conducting column by gluing, the width of the heat spreader is smaller than the width of the packaging substrate, the length of the heat spreader is equal to the length of the packaging substrate, the length of the heat transfer frame is equal to the width of the packaging substrate, the heat transfer frame is distributed opposite to the lead-out pins, and the inner cavity width of the heat transfer frame is greater than the width of the lead-out pins.

[0019] The beneficial effects of the present invention are:

[0020] 1. This structure adopts a slot-type connection between the chip pins and the substrate to form a dual electrical connection path. When there is a problem with the connection between the chip pins and the slot, the side wall contact point can maintain the circuit conduction, which greatly improves the reliability compared with the traditional single welding connection; the side wall of the chip in this structure contacts the lead pins, expanding the heat dissipation path, and the lead pins can quickly diffuse heat; the condensation plate, air bag, mounting tube and other components work together to form an efficient heat dissipation cycle, and carry out targeted treatment of the heat of the pins and other parts. The air bag does not affect the heat dissipation while enhancing the sealing, realizing the synergy of the dual functions of sealing and heat dissipation. Compared with traditional packaging, the heat dissipation efficiency is significantly improved; this structure achieves multiple sealing through the design of positioning boss and upper card slot, and automatic inflating of the air bag to fill the gap, which has a good sealing effect, effectively prevents external contaminants from entering, and improves the sealing and protection performance of the packaging structure.

[0021] 2. The lower heat conduction plate is in direct contact with the bottom of the chip and is connected to the heat spreader through the thermal columns to form the main heat dissipation channel at the bottom; the upper heat conduction plate is attached to the top surface of the chip with the help of thermal grease, and is equipped with thermal bosses and fins to achieve top heat dissipation. Compared with single-sided heat dissipation, this double-sided design greatly improves the heat transfer efficiency; the heat spreader uses the phase change material inside it to quickly distribute heat evenly through solid-liquid conversion, thereby reducing the temperature difference on the chip surface; the heat transfer frame is directly opposite the lead-out pins, and its wide inner cavity design allows external airflow to enter. The airflow first contacts the thermal columns for heat dissipation, and then is guided to the bottom and both sides of the lead-out pins through the heat spreader. Combined with the airbag cooling the top of the pin, all-round heat dissipation of the lead-out pins is achieved, solving the problem of local overheating of the pins caused by large current. The size difference between the heat transfer frame and the heat spreader guides the airflow to accurately cover the pin area, effectively avoiding signal attenuation or solder joint failure caused by pin overheating.

[0022] 3. The inverted L-shaped structure of the heat dissipation channel cooperates with the filter port to effectively intercept small particles and prevent dust blockage; even if a small amount of water vapor enters, it will condense in the accommodating cavity or be treated by the condensation plate for a second time, preventing the airbag from getting damp and aging, extending the life of the sealing components, and the hot air is discharged through the air guide hole, the accommodating cavity, and the heat dissipation channel to form a convection cycle, effectively improving the heat dissipation efficiency; the conical surface structure of the tapered part forms a guide, and there is no need for precise alignment during assembly. Only vertical pressing is required to make the installation cylinder automatically slide into the lower card slot and the plug hole. When the tapered part is fully pressed in, the lower end of the tapered part fills the installation cylinder and the plug hole. The gaps in the holes block the path of water vapor penetrating into the airbag along the gaps, thus preventing the airbag from aging due to water vapor corrosion. Even if a small amount of water vapor enters the heat dissipation channel, the inverted L-shaped structure and the accommodating cavity form a preliminary condensation cavity, causing the water vapor to initially condense in the accommodating cavity. After the residual water vapor enters the lower card slot through the air guide hole, it is adsorbed and condensed by the condensation plate. The cooling effect of the condensation plate on the condensed water droplets can take away additional heat from the surface of the airbag. At the same time, the heat generated by the chip operation is evaporated and discharged for the second time, forming a closed-loop protection, achieving two-way gain of protection and heat dissipation, and effectively alleviating the problem of local overheating at the lead-out pins. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a schematic diagram of the bottom structure of the present invention;

[0026] Figure 3 It is a schematic diagram of the mounting hole structure of the present invention;

[0027] Figure 4 It is a left side cross-sectional structural schematic diagram of the present invention;

[0028] Figure 5 The present invention Figure 4 A in the middle is an enlarged structural diagram;

[0029] Figure 6 It is a front cross-sectional structural schematic diagram of the present invention;

[0030] Figure 7 The present invention Figure 6 The enlarged structural diagram at B in the middle;

[0031] Figure 8 It is a schematic diagram of the explosion structure of the present invention;

[0032] Figure 9 This is a schematic diagram of the structure of the positioning frame and chip installation of the present invention;

[0033] Figure 10 The present invention Figure 9 The enlarged structural diagram at C in the middle;

[0034] Figure 11 Schematic diagram of the upper structure of the packaging substrate of the present invention;

[0035] Figure 12 is a schematic diagram of the bottom structure of the packaging substrate of the present invention;

[0036] Figure 13 It is a schematic diagram of the upper structure of the packaging cover plate of the present invention;

[0037] Figure 14 This is a schematic diagram of the bottom structure of the packaging cover plate of the present invention;

[0038] Figure 15It is a schematic diagram of the upper structure of the positioning frame of the present invention;

[0039] Figure 16 This is a schematic diagram of the bottom structure of the positioning frame of the present invention;

[0040] Figure 17 It is a schematic diagram of the heat transfer frame and the heat spreader structure of the present invention.

[0041] Figure: 1, package substrate; 2, package cover; 3, positioning frame; 4, heat sink; 5, upper heat conducting plate; 6, heat dissipation channel; 7, mounting tube; 8, chip; 9, airbag; 10, mounting hole; 11, lead pin; 12, pad mounting groove; 13, positioning hole; 14, chip pin slot; 21, positioning boss; 22, connecting platform; 23, mounting sleeve; 24, fin mounting groove; 25, through hole; 26, sealing ring; 31, positioning column; 32, upper card slot; 33. Lower card slot; 40. Plate slot; 41. Heat transfer frame; 42. Heat-conducting column; 43. Lower heat-conducting plate; 51. Heat-conducting boss; 52. Fin; 53. Thermal grease; 61. Filter port; 62. Plug port; 71. Conical portion; 72. Accommodating cavity; 73. Air guide hole; 81. Chip pin; 91. Condensation plate; 101. Gasket; 121. Pad; 251. Embedded slot; 321. Socket; 411. Frame slot; 421. Perforation; 431. Positioning slot. DETAILED DESCRIPTION

[0042] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0043] Example 1, refer to Figures 1-17 A chip heat dissipation packaging structure includes a packaging substrate 1, a packaging cover 2 and a chip 8, wherein a chip pin 81 is provided at the bottom of the chip 8, and further includes:

[0044] Positioning frame 3: The positioning frame 3 is provided between the package substrate 1 and the package cover plate 2, and the chip 8 is installed inside the positioning frame 3;

[0045] Encapsulated heat dissipation component: The encapsulated heat dissipation component is arranged inside the packaging substrate 1 and the packaging cover 2.

[0046] Furthermore, a number of lead pins 11 are welded and connected on the upper side of the packaging substrate 1 for realizing electrical connection between the chip 8 and the external circuit, ensuring that the chip 8 can receive power supply and transmit working signals. A chip pin slot 14 corresponding to the chip pin 81 is provided on the upper side of the packaging substrate 1 to facilitate the installation and removal of the chip 8. Elastic contacts can be set in the slot to provide a certain holding force to ensure that the chip pin 81 is in good contact with the slot and the reliability of the electrical connection. The positioning frame 3 is snap-fitted on the packaging substrate 1, and a positioning column 31 is provided on the lower side of the positioning frame 3. A positioning hole 13 matching the positioning column 31 is provided on the packaging substrate 1. The matching design of the positioning column 31 and the positioning hole 13 can achieve fast and accurate positioning during assembly, and the error can be controlled within a very small range to prevent the chip 8 from offsetting during installation. The cooperation between the two can also enhance the connection strength between the positioning frame 3 and the packaging substrate 1, and reduce structural looseness when subjected to external vibration and impact. The cam 22 is provided with a plurality of support members 21 and 22, and the support members 21 are provided with a plurality of support members 22, 22 and a plurality of support members 23. The support members 23 are provided with a plurality of support members 23 and 23. The support members 23 are provided with a plurality of support members 23 and 23.

[0047] It should be noted that after the chip 8 is fixed on the package substrate 1 through the chip pin 81, its side wall contacts the inner end of the lead pin 11. The pins of the traditional chip 8 are only connected to the substrate through solder joints, which poses a risk of poor contact. The side walls of the chip 8 contact the inner ends of the lead pins 11, forming a dual electrical connection path. When the connection between the chip pin 81 and the slot becomes loose or aged, the side wall contact point can be used as a backup connection to maintain circuit conduction, thereby improving connection reliability. Part of the heat generated by the chip 8 during operation is conducted to the substrate through the pin, and the other part can be transferred to the lead pin 11 through the side wall. The lead pin 11 is usually made of metal (such as copper alloy), and its large area is exposed inside the package, which can quickly diffuse heat; the upper side wall of the lead pin 11 is flush with the top wall of the package substrate 1; after the positioning frame 3 is fixed on the package substrate 1, its bottom wall is against the upper surface of the lead pin 11 and the pad 121, further improving the sealing effect of the package structure.

[0048] Furthermore, a mounting sleeve 23 is fixedly connected to the lower side of the connecting platform 22, and a mounting hole 10 is opened on the packaging substrate 1 corresponding to the mounting sleeve 23. A gasket 101 and a screw are provided in the mounting hole 10. The gasket 101 plays a buffering role during the screw tightening process, avoiding the screw from directly contacting the packaging substrate 1 and causing damage, thereby protecting the integrity of the substrate. At the same time, the gasket 101 can also fill the small gap between the mounting hole 10 and the screw, further enhancing the sealing of the connection, and preventing external dust, moisture and other impurities from entering the interior of the package. During assembly, first fix the positioning frame 3 On the packaging substrate 1, the chip 8 is then installed in the positioning frame 3, and the packaging cover plate 2 is buckled onto the packaging substrate 1. Finally, the screws are screwed into the mounting sleeve 23 to complete the assembly. The mounting sleeve 23 plays a guiding role, so that the packaging cover plate 2 can be quickly and accurately buckled onto the packaging substrate 1, reducing the difficulty and error of assembly. By screwing the screws into the mounting sleeve 23, a stable fastening force can be applied to firmly connect the packaging cover plate 2, the positioning frame 3 and the packaging substrate 1 into one, ensuring the stability of the packaging structure during use, and being able to withstand certain external forces and vibrations without loosening.

[0049] The interior of the lower card slot 33 is fixedly connected to a condensation plate 91, and a number of sockets 321 are provided on the upper card slot 32 corresponding to the lead-out pin 11. The ends of the sockets 321 pass through the side walls of the upper card slot 32 and the condensation plate 91. The bottom of the condensation plate 91 is fixedly connected to an airbag 9, and the lower side wall of the airbag 9 is flush with the bottom wall of the positioning frame 3, ensuring that after the positioning frame 3 is assembled, the airbag 9 can effectively fill the gap between the positioning frame 3 and the lead-out pin 11. The inside of the socket 321 is slidably connected to a mounting tube 7, and the lower end of the mounting tube 7 is against the upper side wall of the airbag 9. The airbag 9 can transfer the heat of the lead-out pin 11, and transfer it to the condensation plate 91 and the mounting tube 7, and then dissipate it to the external environment of the package, forming an effective heat dissipation cycle.

[0050] It should be noted that before the packaging cover 2 is assembled, the upper end of the mounting tube 7 is located above the inner bottom wall of the upper card slot 32. When the packaging cover 2 and the packaging substrate 1 are assembled, the positioning boss 21 squeezes the upper end of the mounting tube 7, causing the mounting tube 7 to be displaced. At this time, its lower end acts on the upper wall of the airbag 9, causing the airbag 9 to fully swell, thereby increasing the sealing effect at the connection between the positioning frame 3 and the lead pin 11. The power of the assembly of the packaging cover 2 and the packaging substrate 1 is used to achieve automatic sealing enhancement without the need for additional sealing operations. The swollen airbag 9 can tightly fill the gap between the positioning frame 3 and the lead pin 11, effectively preventing external contaminants from entering, and improving the sealing and protection performance of the packaging structure. While enhancing the sealing effect, the airbag 9 will not affect the heat dissipation function of the condensation plate 91. The airbag 9 is made of a flexible material with a certain thermal conductivity. In the swollen state, it can still ensure that heat is conducted through the condensation plate 91, realizing the dual functions of sealing and heat dissipation, and ensuring that the chip 8 works stably in a good environment.

[0051] In this embodiment, the positioning frame 3 is first aligned and snapped with the positioning hole 13 of the packaging substrate 1 through the positioning column 31. The positioning column 31 and the positioning hole 13 are highly matched to achieve fast and accurate positioning, and the error can be controlled within a very small range. Compared with traditional manual assembly or assembly without a positioning structure, the assembly deviation is greatly reduced. At the same time, the bottom wall of the positioning frame 3 is against the lead pin 11 and the upper surface of the pad 121. The elastic supporting force generated by the interference fit of the pad 121 ensures that the positioning frame 3 is stably fixed on the packaging substrate 1, and the bottom wall of the positioning frame 3 is tightly against the lead pin 11 and the pad 121, which can effectively fill the tiny gap that may exist between the three. If there is a gap, external pollutants such as dust, moisture, and corrosive gas may enter the interior of the package, affecting the performance and life of the chip 8. The tightly against-each-other structure cooperates with the extrusion effect generated by the interference fit of the pad 121 to eliminate these gaps, prevent the intrusion of pollutants, and achieve a good sealing effect.

[0052] Then place the chip 8 into the positioning frame 3, and insert the chip pin 81 into the corresponding chip pin slot 14 on the packaging substrate 1. The elastic contact in the slot provides retention force to ensure good contact between the pin and the slot. After the chip 8 is fixed, its side wall contacts the inner end of the lead pin 11, forming a double electrical connection path.

[0053] Then the packaging cover 2 is buckled onto the packaging substrate 1, and the positioning boss 21 on the lower side of the packaging cover 2 matches the card slot 32 on the positioning frame 3. The outer side of the connecting platform 22 is flush with the outer side of the packaging cover 2, and the inner side is connected to the positioning boss 21 to ensure that the cover is installed in the accurate position. The mounting sleeve 23 corresponds to the mounting hole 10 on the packaging substrate 1. The gasket 101 and the screw in the mounting hole 10 play a role, and the mounting sleeve 23 plays a guiding role to reduce the difficulty of assembly. After the screw is screwed into the mounting sleeve 23, a stable tightening force is applied to firmly connect the packaging cover 2, the positioning frame 3 and the packaging substrate 1.

[0054] During the buckling process of the packaging cover 2, the positioning boss 21 squeezes the upper end of the mounting tube 7, causing it to move downward, and the lower end of the mounting tube 7 acts on the upper wall of the airbag 9, causing the airbag 9 to fully swell and tightly fill the gap between the positioning frame 3 and the lead pin 11, thereby realizing automatic sealing enhancement. The swollen airbag 9 can adaptively fill the irregular gap between the positioning frame 3 and the lead pin 11 by virtue of its flexible material properties, forming a tightly fitting sealing layer. Compared with traditional static sealing gaskets, the airbag 9 can dynamically adjust the filling degree according to the assembly error, and can still maintain a good sealing effect even if there is a dimensional deviation. The bottom seal generated by the interference installation of the gasket 121 is combined with the upper and lower double sealing protection of the packaging structure. At the same time, the heat generated by the lead pin 11 is transferred to the condensation plate 91 and the mounting tube 7 through the airbag 9, and then dissipated to the external environment of the package, forming a heat dissipation cycle.

[0055] On the other hand, through the cooperation between the positioning boss 21, the connecting platform 22 and the top of the positioning frame 3, a stepped structure can be formed, which changes the water vapor penetration path and reduces the possibility of water vapor entering along the gap between the packaging cover 2 and the positioning frame 3. In the traditional planar sealing structure, water vapor can quickly penetrate along the straight gap; while the stepped structure forces the water vapor to undergo multiple direction changes and surface attachment, which increases the penetration resistance. At the same time, the grooves formed by the stepped surface can intercept part of the condensed water to prevent it from further invading the interior of the package.

[0056] This structure uses a slot-type connection between the chip pin 81 and the substrate to form a dual electrical connection path. When there is a problem with the connection between the chip pin 81 and the slot, the side wall contact point can maintain the circuit conduction, which greatly improves the reliability compared to the traditional single welding connection. The traditional package has a single heat dissipation path, which mainly relies on the top or bottom of the chip 8 for heat dissipation. The heat generated by the pins and other parts is not handled well, which can easily lead to local overheating. The side wall of the chip 8 of this structure contacts the lead pin 11, expanding the heat dissipation path, and the lead pin 11 can quickly diffuse heat. The condensation plate 91, air bag 9, installation tube 7 and other components work together to form an efficient heat dissipation cycle. The heat of the pins and other parts is processed in a targeted manner. The airbag 9 does not affect the heat dissipation while enhancing the sealing, realizing the synergy of the dual functions of sealing and heat dissipation. Compared with traditional packaging, the heat dissipation efficiency is significantly improved; traditional packaging sealing methods are mostly simple glue sealing or gasket sealing, and the sealing effect is limited. After long-term use, the sealing material is prone to aging, causing external pollutants to enter the interior of the package, affecting the performance of the chip 8; this structure realizes multiple sealing through the design of matching the positioning boss 21 with the upper card slot 32 and the airbag 9 automatically swelling to fill the gap, so as to achieve good sealing effect, effectively prevent external pollutants from entering, and improve the sealing and protection performance of the packaging structure.

[0057] Example 2, refer to Figure 3-Figure 17The coated heat dissipation component includes a heat spreader 4, a lower heat conducting plate 43, an upper heat conducting plate 5 and an accommodating cavity 72 arranged inside the mounting tube 7. The upper side wall of the heat spreader 4 is fixedly connected with a heat transfer frame 41 and a heat conducting column 42. The bottom wall of the packaging substrate 1 is provided with a plate groove 40 matching the heat spreader 4 and a frame groove 411 matching the heat conducting frame 41. The upper side wall of the packaging substrate 1 is provided with a positioning groove 431 matching the lower heat conducting plate 43. A plurality of through holes 421 are opened between the positioning groove 431 and the frame groove 411. The through holes 421 match the heat conducting column 42. The upper heat conducting plate 5 is embedded in the packaging cover plate 2. The upper side of the upper heat conducting plate 5 is fixedly connected with a heat conducting boss 51. The upper side of the packaging cover plate 2 is provided with a through hole 25 matching the heat conducting boss 51. The interior of the packaging cover plate 2 corresponding to the through hole 25 is provided with an embedding groove 251. The inner interference fit of 51 is equipped with a sealing ring 26, the upper heat conducting plate 5 is embedded in the inside of the packaging cover plate 2, and the positioning is achieved by cooperating with the heat conducting boss 51 and the through hole 25. The interference fit of the sealing ring 26 ensures the sealing. The lower side of the upper heat conducting plate 5 and the top wall of the chip 8 are coated with thermal grease 53. The upper side wall of the lower heat conducting plate 43 is against the bottom wall of the chip 8, and the lower side wall of the lower heat conducting plate 43 is against the top of the heat conducting column 42. The lower heat conducting plate 43 is tightly against the bottom of the chip 8 and is connected to the heat spreader 4 (with phase change material inside) through the heat conducting column 42 to quickly conduct the bottom heat to the outside of the packaging substrate 1; the upper heat conducting plate 5 is attached to the top surface of the chip 8 through the thermal grease 53, and cooperates with the heat conducting boss 51 and the fin 52 to dissipate the top heat to the outside. This double-sided heat dissipation design greatly improves the efficiency of single-sided heat dissipation and can effectively reduce the temperature of the chip 8.

[0058] Furthermore, a heat dissipation channel 6 is opened inside the packaging cover plate 2 corresponding to the mounting tube 7, and a filter port 61 is installed in the upper end of the heat dissipation channel 6. The filter port 61 is arranged with a small outer port and a large inner port, which can intercept small particles and prevent dust from entering. The lower end of the heat dissipation channel 6 is fixedly connected with a plug port 62. When the packaging substrate 1 and the packaging cover plate 2 are assembled, the plug port 62 is nested in the accommodating cavity 72. Through the cooperation between the plug port 62 and the accommodating cavity 72, on the one hand, assembly is facilitated, and on the other hand, the sealing of the connection between the two can be improved.

[0059] The heat dissipation channel 6 is set in a bent inverted L shape, and the setting of the filter port 61 is used to reduce the probability of water vapor entering the packaging structure along the heat dissipation channel 6. The outer wall of the mounting cylinder 7 is provided with a tapered portion 71. The end of the tapered portion 71 is snap-fitted into the bottom socket 321 when the packaging substrate 1 and the packaging cover plate 2 are assembled. The setting of the tapered portion 71, on the one hand, facilitates the assembly of the mounting cylinder 7. The tapered portion 71 of the mounting cylinder 7 can be pressed into the lower card groove 33 by simply pressing. At this time, the tapered portion 71 can cooperate with the socket 321 to achieve positioning. On the other hand, the lower end of the tapered portion 71 can fill the gap between the mounting cylinder 7 and the bottom socket 321 to prevent water vapor from passing through the gap between the mounting cylinder 7 and the bottom socket 321. The gap between them is in contact with the airbag 9, effectively preventing its aging. A number of air guide holes 73 are provided on the mounting tube 7 above the tapered portion 71. The ends of the air guide holes 73 pass through the side walls of the mounting tube 7 and the inner cavity of the accommodating cavity 72. The hot air generated in the lower card slot 33 will pass through the air guide holes 73, the accommodating cavity 72, and the heat dissipation channel 6 in sequence to exchange heat with the outside world. Even if water vapor enters the heat dissipation channel 6, it will accumulate inside the accommodating cavity 72. When some water vapor enters the lower card slot 33 along the air guide holes 73, it will condense into water droplets under the action of the condensation plate 91, which can better provide heat dissipation for the airbag 9. At the same time, these water droplets will gradually evaporate under the action of heat.

[0060] Furthermore, a fin mounting groove 24 is provided on the side wall of the packaging cover 2, and a fin 52 is inserted into the fin mounting groove 24. The fin 52 is inserted into the fin mounting groove 24 (the plug-in structure of the fin mounting groove 24 and the fin 52 is designed with an anti-loosening buckle, which can withstand a certain pulling force without falling off, ensuring that it remains firmly connected in harsh environments such as vibration and impact), which is convenient for disassembly and maintenance. Fins 52 of different specifications can be replaced according to heat dissipation requirements. The side walls of the fins 52 located in the packaging cover 2 are against the side walls of the upper heat conducting plate 5, ensuring that the heat of the upper heat conducting plate 5 can be effectively transferred to the fins 52. The upper heat conducting plate 5, the heat conducting boss 51, the fins 52, the heat spreader 4, the heat transfer frame 41, the heat conducting column 42, and the lower heat conducting plate 43 are all made of a high thermal conductivity alloy material (such as a copper-based alloy). It has high thermal conductivity efficiency and can ensure efficient heat transfer.

[0061] It should be noted that the lower side wall of the lower heat conducting plate 43 and the top of the heat conducting column 42 are connected by gluing. During installation, the heat transfer frame 41, the heat spreader 4 and the heat conducting column 42 are pre-connected, and glue is applied in the positioning groove 431. Then the lower heat conducting plate 43 is installed in the positioning groove 431. Finally, the heat conducting column 42 is inserted to successfully complete the connection with the lower heat conducting plate 43. The width of the heat spreader 4 is less than the width of the package substrate 1, and the length of the heat spreader 4 is equal to the length of the package substrate 1. The heat spreader 4 can connect multiple heat transfer frames 41 and heat conducting columns 42 in series to ensure uniform heat dissipation. The length of the heat transfer frame 41 is equal to the width of the package substrate 1, and the heat transfer frame 41 is directly opposite to the lead pins 11. The heat transfer frame 41 is provided with a heat dissipation plate 42 and a heat dissipation plate 43. The heat dissipation plate 42 is provided with a heat dissipation plate 44 and a heat dissipation plate 45. The heat dissipation plate 42 is provided with a heat dissipation plate 45. The heat dissipation plate 42 is provided with a heat dissipation plate 44 and ...

[0062] In this embodiment, the lower heat conducting plate 43 is in direct contact with the bottom of the chip 8 and is connected to the heat spreader 4 through the heat conducting column 42 to form the main heat dissipation channel at the bottom; the upper heat conducting plate 5 is attached to the top surface of the chip 8 with the help of thermal grease 53, and is matched with the heat conducting boss 51 and the fin 52 to achieve top heat dissipation. Compared with single-sided heat dissipation, this double-sided design greatly improves the heat transfer efficiency.

[0063] The heat spreader 4 distributes heat evenly through the solid-liquid conversion of the phase change material inside it, reducing the temperature difference on the surface of the chip 8; the heat transfer frame 41 is opposite to the lead pin 11, and its wide inner cavity design allows external airflow (such as fan drive) to enter. The airflow first contacts the heat-conducting column 42 to dissipate heat, and then is guided to the bottom and both sides of the lead pin 11 through the heat spreader 4. Cooperating with the airbag 9 to cool the top of the pin, all-round heat dissipation of the lead pin 11 is achieved, solving the problem of local overheating of the pin caused by large current. Cooperating with the size difference between the heat transfer frame 41 and the heat spreader 4 (the width of the heat spreader 4 is smaller than the substrate), the airflow is guided to accurately cover the pin area, effectively avoiding signal attenuation or solder joint failure caused by pin overheating.

[0064] The inverted L-shaped structure of the heat dissipation channel 6 cooperates with the filter port 61 (funnel-shaped, small on the outside and large on the inside) to effectively intercept small particles and prevent dust blockage; even if a small amount of water vapor enters, it will condense in the accommodating cavity 72 or be treated again by the condensation plate 91, preventing the airbag 9 from getting damp and aging, and extending the life of the sealing components. The hot air is discharged through the air guide holes 73, the accommodating cavity 72, and the heat dissipation channel 6, forming a convection cycle, which effectively improves the heat dissipation efficiency.

[0065] The conical surface structure of the conical portion 71 forms a guide, and there is no need for precise alignment during assembly. Only vertical pressing is required to make the mounting tube 7 automatically slide into the lower card slot 33 and the insertion hole 321. When the conical portion 71 is fully pressed in, the lower end of the conical portion 71 fills the gap between the mounting tube 7 and the insertion hole 321, blocking the path of water vapor penetrating along the gap to the airbag 9, thereby preventing the airbag 9 from aging due to water vapor corrosion (the service life of conventional rubber airbags is greatly shortened under high humidity); even if a small amount of water vapor enters the heat dissipation channel 6, the inverted L-shaped structure and the accommodating cavity 72 form a preliminary condensation cavity, so that the water vapor is initially condensed in the accommodating cavity 72. After the residual water vapor enters the lower card slot 33 through the air guide hole 73, it is adsorbed and condensed by the condensation plate 91. The cooling effect of the condensation plate 91 on the condensed water droplets can additionally take away the heat from the surface of the airbag 9. At the same time, the heat generated by the chip 8 during operation is evaporated and discharged, forming a closed-loop protection, achieving a two-way gain of protection and heat dissipation, and effectively alleviating the local overheating problem of the lead pin 11 and the airbag 9.

[0066] The fins 52 are installed in a plug-in manner, which is convenient for users to replace. The specifications of the fins 52 can be dynamically adjusted according to the load of the chip 8: thin fins are used at low loads (to reduce cost and thickness), and dense fins are replaced at high loads to increase the heat dissipation area to meet the needs of different working conditions.

[0067] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. A chip heat dissipation packaging structure, comprising a packaging substrate (1), a packaging cover (2) and a chip (8), wherein a chip pin (81) is provided at the bottom of the chip (8), characterized in that: Also includes: Positioning frame (3): The positioning frame (3) is provided between the package substrate (1) and the package cover (2), and the chip (8) is mounted inside the positioning frame (3); Encapsulated heat dissipation component: the encapsulated heat dissipation component is arranged inside the packaging substrate (1) and the packaging cover (2).

2. The chip heat dissipation packaging structure according to claim 1, characterized in that: The upper side of the package substrate (1) is welded with a plurality of lead pins (11), the upper side of the package substrate (1) is provided with a chip pin slot (14) corresponding to the chip pin (81), the positioning frame (3) is buckled and arranged on the package substrate (1), the lower side of the positioning frame (3) is provided with a positioning column (31), the package substrate (1) is provided with a positioning hole (13) matching the positioning column (31), and the side frame of the positioning frame (3) corresponding to the lead pin (11) is provided with an upper card slot (32) ) and a lower card slot (33), the lower side of the packaging cover (2) is fixedly connected with a positioning boss (21) and a connecting platform (22), wherein the positioning boss (21) matches the upper card slot (32), the outer side of the connecting platform (22) is flush with the outer side of the packaging cover (2), and the inner side of the connecting platform (22) is connected to the end of the positioning boss (21); a pad installation groove (12) is provided on the upper side of the packaging substrate (1) corresponding to the short side of the positioning frame (3), and a pad (121) is interference-fitted in the pad installation groove (12).

3. The chip heat dissipation packaging structure according to claim 2, characterized in that: After the chip (8) is fixed on the package substrate (1) through the chip pins (81), its side wall contacts the inner end of the lead pin (11); the upper side wall of the lead pin (11) is flush with the top wall of the package substrate (1); after the positioning frame (3) is fixed on the package substrate (1), its bottom wall abuts against the upper surface of the lead pin (11) and the pad (121).

4. The chip heat dissipation packaging structure according to claim 2, characterized in that: The lower side of the connecting platform (22) is fixedly connected to a mounting sleeve (23), and a mounting hole (10) is provided on the packaging substrate (1) corresponding to the mounting sleeve (23), and a gasket (101) and a screw are provided in the mounting hole (10). During assembly, the positioning frame (3) is first fixed on the packaging substrate (1), and then the chip (8) is installed in the positioning frame (3), and then the packaging cover (2) is buckled onto the packaging substrate (1), and finally the screw is screwed into the mounting sleeve (23) to complete the assembly.

5. The chip heat dissipation packaging structure according to claim 2, characterized in that: The interior of the lower card slot (33) is fixedly connected to a condensation plate (91), and a plurality of jacks (321) are provided on the upper card slot (32) corresponding to the lead pin (11), and the ends of the jacks (321) pass through the side walls of the upper card slot (32) and the condensation plate (91), and the bottom of the condensation plate (91) is fixedly connected to an air bag (9), and the lower side wall of the air bag (9) is flush with the bottom wall of the positioning frame (3), and the inside of the jack (321) is slidably connected to a mounting tube (7), and the lower end of the mounting tube (7) is against the upper side wall of the air bag (9), and the air bag (9) is made of heat-conducting silicone material.

6. The chip heat dissipation packaging structure according to claim 5, characterized in that: Before the packaging cover plate (2) is assembled, the upper end of the mounting tube (7) is located above the inner bottom wall of the upper slot (32). When the packaging cover plate (2) and the packaging substrate (1) are assembled, the positioning boss (21) squeezes the upper end of the mounting tube (7), causing the mounting tube (7) to be displaced. At this time, the lower end of the positioning boss acts on the upper wall of the airbag (9), causing the airbag (9) to fully swell, thereby increasing the sealing effect at the connection between the positioning frame (3) and the lead pin (11).

7. The chip heat dissipation packaging structure according to claim 2, characterized in that: The coated heat dissipation component includes a heat spreader (4), a lower heat conducting plate (43), an upper heat conducting plate (5) and an accommodating cavity (72) arranged inside the mounting tube (7); the upper side wall of the heat spreader (4) is fixedly connected with a heat transfer frame (41) and a heat conducting column (42); the bottom wall of the packaging substrate (1) is provided with a plate groove (40) matching the heat spreader (4) and a frame groove (411) matching the heat transfer frame (41); the upper side wall of the packaging substrate (1) is provided with a positioning groove (431) matching the lower heat conducting plate (43); a plurality of through holes (421) are opened between the positioning groove (431) and the frame groove (411); the through holes (421) match the heat conducting column (42) The upper heat conducting plate (5) is embedded in the packaging cover (2), the upper side of the upper heat conducting plate (5) is fixedly connected with a heat conducting boss (51), the upper side of the packaging cover (2) is provided with a through hole (25) matching the heat conducting boss (51), the interior of the packaging cover (2) corresponding to the through hole (25) is provided with an embedding groove (251), the embedding groove (251) is interference fit with a sealing ring (26), the lower side of the upper heat conducting plate (5) and the top wall of the chip (8) are coated with thermal grease (53), the upper side wall of the lower heat conducting plate (43) is against the bottom wall of the chip (8), and the lower side wall of the lower heat conducting plate (43) is against the top of the heat conducting column (42).

8. The chip heat dissipation packaging structure according to claim 7, characterized in that: A heat dissipation channel (6) is provided inside the packaging cover plate (2) corresponding to the mounting tube (7), and a filter port (61) is provided inside the upper end of the heat dissipation channel (6), and the filter port (61) is arranged in a shape of a small outer port and a large inner port. The lower end of the heat dissipation channel (6) is fixedly connected with a plug port (62), and the plug port (62) is nested in the accommodating cavity (72) when the packaging substrate (1) and the packaging cover plate (2) are assembled. The heat dissipation channel (6) is arranged in a bent inverted L shape. A tapered portion (71) is provided on the outer wall of the mounting tube (7), and the end of the tapered portion (71) is clamped in the jack (321) at the bottom when the packaging substrate (1) and the packaging cover plate (2) are assembled. A plurality of air guide holes (73) are provided on the mounting tube (7) above the tapered portion (71), and the ends of the air guide holes (73) pass through the side wall of the mounting tube (7) and the inner cavity of the accommodating cavity (72).

9. The chip heat dissipation packaging structure according to claim 7, characterized in that: The side wall of the packaging cover (2) is provided with a fin mounting groove (24), and a fin (52) is inserted and installed in the fin mounting groove (24). The side wall of the fin (52) located in the packaging cover (2) is against the side wall of the upper heat conducting plate (5). The upper heat conducting plate (5), the heat conducting boss (51), the fin (52), the heat spreader (4), the heat transfer frame (41), the heat conducting column (42), and the lower heat conducting plate (43) are all made of a high thermal conductivity alloy material.

10. The chip heat dissipation packaging structure according to claim 7, characterized in that: The lower side wall of the lower heat conducting plate (43) and the top of the heat conducting column (42) are connected by gluing, the width of the heat spreader (4) is smaller than the width of the package substrate (1), the length of the heat spreader (4) is equal to the length of the package substrate (1), the length of the heat transfer frame (41) is equal to the width of the package substrate (1), the heat transfer frame (41) is arranged opposite to the lead pin (11), and the inner cavity width of the heat transfer frame (41) is greater than the width of the lead pin (11).

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