Laser stripping device for SiC crystal ingot
Through the multi-pulse dynamic switching laser stripping device and gas circulation heat dissipation system, the problem of crack and stress control in the non-uniform area of SiC crystal ingot is solved, and efficient and stable SiC wafer production is achieved.
Patent Information
- Application Number
- CN202510874275.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-27
- Publication Date
- 2025-09-23
AI Technical Summary
In the existing technology, it is difficult to effectively control the cracks and stress distribution in the non-uniform area during the SiC ingot cutting or stripping process, resulting in unstable wafer yield and high loss, which is particularly significant in the production of large-size SiC wafers.
A multi-pulse dynamic switching laser stripping device, combined with a gas circulation heat dissipation system, flexibly switches between femtosecond, picosecond and nanosecond pulse widths to accurately match the stress distribution and crack propagation characteristics of the internal defect area and doping layer of the crystal, and reduces the heat-affected zone through low-temperature gas heat dissipation.
It achieves high yield and low loss of large-size SiC wafers, ensures the stability and uniformity of the laser lift-off process, and overcomes the problem of insufficient lift-off matching capability in non-uniform areas in the existing technology.
Smart Images
Figure CN120680170A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor material laser processing, and in particular to a laser stripping device for SiC crystal ingots. Background Art
[0002] SiC crystals are widely used as substrate materials for high-power, high-frequency devices due to their high thermal conductivity, wide bandgap, and radiation resistance. However, with the advancement of large-scale SiC crystal preparation technology, various defects (such as dislocations, voids, and twins) have become common within them, as well as gradient variations in doping (n-type, p-type) within the silicon carbide. These non-uniform regions exhibit significant differences in conductivity and thermal diffusion properties, which can lead to stress concentration and crack distortion during the cutting or peeling process, severely impacting final wafer quality and yield.
[0003] Currently, 6-inch ingots are usually cut using a multi-wire sawing method. Although this method can be processed in parallel, its overall processing efficiency is low and the cutting loss is large (loss is about 200 μm or more). In addition, when the multi-wire sawing method is used to cut larger sizes such as 8-inch and 12-inch ingots, its loss will be further increased, the wear of the wire will be aggravated, and there is even a risk of fragmentation. Currently, the use of lasers to modify the interior of silicon carbide (SiC) and combine this with external mechanical force for stripping has enabled the stripping of SiC ingots. However, most methods employ a single pulse width (femtosecond, picosecond, or nanosecond) and wavelength. This makes it difficult to achieve stable crack control and thermal modulation in non-uniform regions such as internal defects and doped layers. This results in uneven stress distribution in the stripped wafers, wide variations in the modified depth, and unstable wafer yields. This problem severely restricts the large-scale and efficient application of SiC wafers. Summary of the Invention
[0004] The technical problem of the present invention is to provide a laser stripping device for SiC crystal ingots, which can adapt to the conductive and thermal diffusion characteristics of non-uniform areas through dynamic switching of femtosecond / picosecond / nanosecond pulse widths, realize precise control of cracks / stress in defect areas and conductive transition areas, ensure high wafer yield and low loss, and is suitable for the production of large-size, high-quality SiC wafers.
[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a laser stripping device for SiC ingots, comprising a sealing cover and a stripping sheet, wherein a sealing cap is fixedly mounted on the upper end of the sealing cover, and the sealing cap and the sealing cover form a closed space, wherein a stripping assembly is provided in the closed space, and the stripping assembly comprises: A peeling frame, wherein a laser output mechanism is provided at the upper end of the peeling frame. The laser output mechanism includes a multi-pulse dynamic switching system that can dynamically switch between femtosecond, picosecond, and nanosecond pulse widths, and adjust the energy density and scanning parameters in real time. It can flexibly adapt to the stress distribution and crack propagation characteristics of non-uniform areas such as defective areas and doped layers inside the crystal. A laser output nozzle is provided in the laser output mechanism; The heat dissipation mechanism includes a gas circulation unit and a gas guide. The gas guide includes vertical partitions. The vertical partitions are symmetrically located on both sides of the laser output nozzle and can move with the laser output nozzle. The gas guide can concentrate the cold air flow on the surface of the peeling sheet.
[0006] As a further solution of the present invention, an upper mounting seat is fixedly installed on the upper end of the peeling frame, an upper guide rail is fixedly installed on the lower surface of the upper mounting seat, a laser output component is slidably connected to the upper guide rail, the lower end of the laser output component is fixedly connected to the laser output nozzle, and the laser output nozzle is vertically above the peeling sheet.
[0007] As a further solution of the present invention, the gas guide includes an elastic sealing baffle and a strip-shaped temperature sensing element. The vertical partition is fixedly installed on both sides of the laser output element. The upper end of the vertical partition away from the laser output element is fixedly installed with an elastic sealing baffle. The other end of the elastic sealing baffle is fixedly connected to the inner wall of the stripping frame. The lower ends of the vertical partitions are inclined toward the laser output nozzle. The strip-shaped temperature sensing element is fixedly installed at the lower end of the vertical partition. The elastic sealing baffles on both sides are inclined downward near one end of the vertical partition.
[0008] As a further solution of the present invention, the gas circulation unit includes a circulation output component, a refrigeration device and a dehumidification component. The circulation output component is provided in two groups and is symmetrically arranged on the inner wall of the stripping frame. The output end of the circulation output component remains parallel to the vertical partition. The dehumidification component is fixedly installed on one side of the stripping frame. A shunt pipe is connected between the upper end of the circulation output component and the dehumidification component. The refrigeration device is fixedly installed on the outside of the sealing cover, and an outlet pipe is connected between the dehumidification component and the refrigeration device.
[0009] As a further solution of the present invention, a feed rail is provided at the lower end of the stripping frame, one end of the feed rail is led out to the outside of the stripping frame, a feed table is slidably connected to the feed rail, the feed table can position and clamp the stripping sheet, the feed table is located below the vertical partition, and an upper hanging frame is slidably connected to the upper end of the stripping frame close to the feed rail, a hanging pipe is fixedly installed on the upper hanging frame, a suction nozzle is fixedly installed at one end of the hanging pipe, and the suction nozzle is fixedly connected between the two groups of vertical partitions, and a connecting pipe is fixedly installed at the other end of the hanging pipe, and the other end of the connecting pipe is led out of the sealing cover and is fixedly connected to the refrigeration equipment through a return pipe.
[0010] As a further solution of the present invention, a partition plate is fixedly installed on the circulating output member. The partition plate is a trapezoidal plate, and the long side is in the same vertical plane as the edge of the feed rail. The upper surface of the partition plate remains flush with the upper surface of the feed table.
[0011] As a further solution of the present invention, a storage part is provided in the sealing cover on the side away from the stripping component, and the storage part is provided with two groups of storage bins. Multiple groups of interlayer baffles are evenly arranged in the storage bins, and the stripping original sheet is placed between adjacent interlayer baffles.
[0012] As a further solution of the present invention, a transfer member is installed in the sealing cover between the stripping component and the storage member, a rotating seat is provided at the bottom of the transfer member, a robotic arm is provided at the upper end of the rotating seat, a lifting member is fixedly installed at the upper end of the robotic arm, and the front end of the lifting member can be inserted into the bottom of the stripping original sheet and the stripping sheet.
[0013] Compared with the prior art, the present invention has the following beneficial effects: In the present invention, the laser output can be dynamically switched during the stripping process. The laser output is set to three modes: femtosecond, picosecond and nanosecond. The dynamic switching is controlled by CPPW programming, accurately matching crack generation and heat-affected zone, and improving the overall uniformity of the stripping piece, so that the output mechanism of this mechanism can flexibly adapt to the stress distribution and crack propagation characteristics of non-uniform areas such as internal defect areas and doping layers of the crystal, thereby overcoming the defect of insufficient stripping matching ability of the existing single-pulse width laser stripping method in non-uniform areas, and avoiding the problem of insufficient crack control and heat impact matching ability of the existing laser stripping method when facing non-uniform areas such as crystal defect areas and doping layers, resulting in large fluctuations in the quality of the stripping piece.
[0014] In the laser stripping process of the present invention, the heat dissipation mechanism assists the stripping sheet in dissipating heat, and the low-temperature nitrogen / helium / compressed air and other inert gases are continuously input into the stripping frame through the gas circulation unit. The gas guide unit enables the input low-temperature gas to be compressed to the surface of the stripping sheet, and enables the low-temperature gas to gather between the vertical partitions, so that the low-temperature gas can concentrate on dissipating heat at the points where laser stripping is being performed, thereby avoiding local heat accumulation and reducing the width of the heat-affected zone. The input cooling convection will not directly blow onto the output route of the laser, avoiding the output laser from being disturbed by wind, ensuring that the output laser remains continuously stable, and increasing the stability of the output beam during laser stripping. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0016] Figure 1 This is a schematic diagram of the structure of the present invention from a front side perspective; Figure 2 This is a schematic diagram of the rear side perspective structure of the present invention; Figure 3 This is a schematic diagram of the internal structure of the sealing cover of the present invention; Figure 4 Schematic diagram of the stripping assembly structure in the present invention; Figure 5 It is a structural cross-sectional view of the peeling frame in the present invention; Figure 6 Schematic diagram of the structure of the storage element in the present invention; Figure 7 It is a structural schematic diagram of the transfer component in the present invention.
[0017] In the accompanying drawings, the components represented by the reference numerals are as follows: Sealing cover; 2. Sealing cover; 3. Refrigeration equipment; 4. Return pipe; 5. Export pipe; 6. Storage part; 601. Interlayer baffle; 602. Peeling original sheet; 7. Transfer part; 701. Rotating seat; 702. Robotic arm; 703. Lifting part; 8. Feeding rail; 9. Feeding table; 10. Connecting pipe; 11. Hanging pipe; 12. Upper mounting seat; 13. Peeling frame; 14. Diverter pipe; 15. Elastic sealing baffle; 16. Vertical partition; 17. Peeling sheet; 18. Partition plate; 19. Dehumidification part; 20. Upper hanging rack; 21. Circulation output part; 22. Strip temperature sensing part; 23. Laser output part; 24. Laser output nozzle; 25. Upper guide rail. DETAILED DESCRIPTION
[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.
[0019] See also Figure 1-Figure 7 The present invention provides a technical solution: a laser stripping device for SiC ingots, comprising a sealing cover 1 and a stripping sheet 17. A sealing cover 2 is fixedly mounted on the upper end of the sealing cover 1. The sealing cover 2 and the sealing cover 1 form a closed space. A stripping assembly is provided in the closed space. The stripping assembly comprises: The peeling frame 13 has a laser output mechanism disposed on its upper end. The laser output mechanism includes a multi-pulse dynamic switching system that can dynamically switch between femtosecond, picosecond, and nanosecond pulse widths, and adjust energy density and scanning parameters in real time. This allows for flexible adaptation to stress distribution and crack propagation characteristics in non-uniform regions such as defective areas and doped layers within the crystal. A laser output nozzle 24 is disposed within the laser output mechanism. The heat dissipation mechanism includes a gas circulation unit and a gas guide. The gas guide includes vertical partitions 16. The vertical partitions 16 are symmetrically located on both sides of the laser output nozzle 24 and can move with the laser output nozzle 24. The gas guide can concentrate the cold air flow on the surface of the peeling sheet 17.
[0020] During operation, the peeling original sheet of the present invention enters the peeling frame 13, and the peeling original sheet is laser peeled by the laser output mechanism. During the peeling process, the laser output can be dynamically switched. The laser output is set to three modes: femtosecond, picosecond and nanosecond. Among them, the femtosecond pulse is non-thermal peeling (suppressing thermal stress in the defect area); the picosecond pulse can increase the crack density of the modified layer and moderate thermal diffusion; the nanosecond pulse (10-200 ns) guides the lateral extension of the crack, and thermal stress assists in connection. Femtosecond and picosecond pulses can dominate non-thermal stripping to avoid thermal stress accumulation in the defect area, while nanosecond pulse width can guide the lateral connection of the crack with low-power thermal guidance to avoid longitudinal crack extension. Dynamic switching is controlled by CPPW programming, dynamically adapting to the changes in crystal conductivity (semi-insulating / n / p type) and defect area distribution, accurately matching crack generation and heat-affected zone, and improving the overall uniformity of the stripping piece 17, so that the output mechanism of this mechanism can flexibly adapt to the stress distribution and crack extension characteristics of non-uniform areas such as defect areas and doping layers inside the crystal, thereby overcoming the defect of insufficient stripping matching ability of existing single-pulse width laser stripping methods in non-uniform areas, and avoiding the problem of insufficient crack control and thermal influence matching ability of existing laser stripping methods when facing non-uniform areas such as crystal defect areas and doping layers, resulting in large quality fluctuations of the stripping piece 17. In addition, during the laser stripping process, the heat dissipation mechanism assists the stripping sheet 17 in dissipating heat, and the low-temperature nitrogen / helium / compressed air and other inert gases are continuously input into the stripping frame 13 through the gas circulation unit. The gas guide unit allows the input low-temperature gas to be compressed to the surface of the stripping sheet 17, and the low-temperature gas to gather between the vertical partitions 16, so that the low-temperature gas can concentrate on dissipating heat at the points where laser stripping is being performed, thereby avoiding local heat accumulation and reducing the width of the heat-affected zone. The input cooling convection will not blow directly onto the output route of the laser, avoiding the output laser from being disturbed by wind, ensuring that the output laser remains continuously stable, and increasing the stability of the output beam during laser stripping.
[0021] As a further solution of the present invention, an upper mounting seat 12 is fixedly installed on the upper end of the peeling frame 13, an upper guide rail 25 is fixedly installed on the lower surface of the upper mounting seat 12, a laser output component 23 is slidably connected to the upper guide rail 25, and the lower end of the laser output component 23 is fixedly connected to the laser output nozzle 24, and the laser output nozzle 24 is vertically above the peeling sheet 17.
[0022] During operation, the upper guide rail 25 of the present invention is an electric guide rail, and the laser output component 23 can move on the upper guide rail 25. Through the movement of the laser output component 23 on the upper guide rail 25, the action point of the laser output nozzle 24 on the peeling original sheet 602 can be adjusted. The peeling original sheet 602 is introduced along the feeding rail 8. The upper guide rail 25 is arranged perpendicular to the feeding rail 8. The peeling original sheet 602 is gradually fed in through the feeding rail 8, and the movement of the laser output nozzle 24 on the upper guide rail 25 is coordinated so that the output point of the laser can cover the surface of the peeling original sheet 602.
[0023] As a further solution of the present invention, the gas guide includes an elastic sealing baffle 15 and a strip temperature sensing element 22. The vertical partition 16 is fixedly installed on both sides of the laser output element 23. The upper end of the vertical partition 16 away from the laser output element 23 is fixedly installed with an elastic sealing baffle 15. The other end of the elastic sealing baffle 15 is fixedly connected to the inner wall of the stripping frame 13. The lower ends of the vertical partitions 16 are inclined toward the laser output nozzle 24. The strip temperature sensing element 22 is fixedly installed at the lower end of the vertical partition 16. The elastic sealing baffles 15 on both sides are inclined downward near the end of the vertical partition 16.
[0024] During operation, the laser output element 23 of the present invention moves to drive the vertical partition 16 to move, and the elastic sealing baffle 15 is pulled by the vertical partition 16. The greater the traction force on the elastic sealing baffle 15, the more the elastic sealing baffle 15 is located on both sides of the vertical partition 16. As the vertical partition 16 moves, it can be ensured that the elastic sealing baffle 15 is always blocked above the stripping frame 13. The elastic sealing baffle 15 limits the overflow of low-temperature gas, increases the possibility of contact between the low-temperature gas and the surface of the stripping sheet 17, and as the low-temperature gas is continuously input, the low-temperature gas can overflow from the lower end of the vertical partition 16 and accumulate between the vertical partitions 16, that is, the local output range of the laser output nozzle 24, so that the gas heat dissipation to the stripping sheet 17 is more specific and accurate, reducing the possibility of heat accumulation.
[0025] As a further solution of the present invention, the gas circulation unit includes a circulation output component 21, a refrigeration device 3 and a dehumidification component 19. The circulation output component 21 is provided in two groups and is symmetrically arranged on the inner wall of the stripping frame 13. The output end of the circulation output component 21 remains parallel to the vertical partition 16. The dehumidification component 19 is fixedly installed on one side of the stripping frame 13. A shunt pipe 14 is connected between the upper end of the circulation output component 21 and the dehumidification component 19. The refrigeration device 3 is fixedly installed on the outside of the sealing cover 1, and an outlet pipe 5 is connected between the dehumidification component 19 and the refrigeration device 3.
[0026] During operation, the refrigeration equipment 3 in the present invention inputs the low-temperature gas into the dehumidification component 19 through the outlet pipe 5, and the dehumidification component 19 diverts the gas into the diversion pipe 14, and then the low-temperature gas enters the circulation output component 21 through the diversion pipe 14, and the low-temperature gas is relatively output to the stripping construction area in the stripping frame 13 through the circulation output component 21.
[0027] As a further solution of the present invention, a feeding rail 8 is provided at the lower end of the stripping frame 13, and one end of the feeding rail 8 is led to the outside of the stripping frame 13, and a feeding table 9 is slidably connected to the feeding rail 8, and the feeding table 9 can position and clamp the stripping sheet 17. The feeding table 9 is below the vertical partition 16, and the upper end of the stripping frame 13 close to the feeding rail 8 is slidably connected to an upper suspension frame 20, and a suspension pipe 11 is fixedly installed on the upper suspension frame 20, and a suction nozzle is fixedly installed at one end of the suspension pipe 11, and the suction nozzle is fixedly connected between the two groups of vertical partitions 16, and a connecting pipe 10 is fixedly installed at the other end of the suspension pipe 11, and the other end of the connecting pipe 10 is led to the outside of the sealing cover 1, and is fixedly connected to the refrigeration equipment 3 through the return pipe 4.
[0028] During operation, the peeling original 602 of the present invention is placed on the feeding table 9, and the feeding table 9 enters the peeling frame 13 through the feeding rail 8, so that the peeling original 602 on the feeding table 9 is below the vertical partition 16, and the heat-absorbing gas between the vertical partitions 16 is sucked into the connecting pipe 10 through the hanging pipe 11, and returns to the refrigeration equipment 3 through the return pipe 4.
[0029] As a further solution of the present invention, a partition plate 18 is fixedly installed on the circulating output member 21. The partition plate 18 is a trapezoidal plate, and its long side is in the same vertical plane as the edge of the feed rail 8. The upper surface of the partition plate 18 remains flush with the upper surface of the feed table 9.
[0030] During operation, the present invention divides the output gas into two layers, one above the feeding table 9 and the other below the feeding table 9, through the partition plate 18. The upper gas dissipates heat to the stripping sheet 17, and the lower gas dissipates heat to the equipment to avoid heat accumulation.
[0031] As a further solution of the present invention, a storage part 6 is provided in the sealing cover 1 on the side away from the stripping component. The storage part 6 is provided with two groups of storage bins. Multiple groups of interlayer baffles 601 are evenly arranged in the storage bins, and the stripping original sheets 602 are placed between adjacent interlayer baffles 601.
[0032] During operation, the storage member 6 of the present invention serves as a storage space for the peeling original sheet 602 and the peeling sheet 17 .
[0033] As a further solution of the present invention, a transfer part 7 is installed in the sealing cover 1 between the stripping component and the storage part 6, and a rotating seat 701 is provided at the bottom of the transfer part 7. A robotic arm 702 is provided at the upper end of the rotating seat 701, and a lifting part 703 is fixedly installed at the upper end of the robotic arm 702. The front end of the lifting part 703 can be inserted into the bottom of the stripping original sheet 602 and the stripping sheet 17.
[0034] During operation, the present invention transfers the peeling original sheet 602 to the feeding table 9 through the transfer member 7, and the feeding table 9 feeds the peeling original sheet 602 into the peeling frame 13. After the peeling sheet 17 is peeled off, the feeding table 9 transports it out of the peeling frame 13, and then the transfer member 7 transfers the peeling sheet 17 to the storage member 6.
[0035] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.
Claims
1. A laser stripping device for SiC ingots, comprising a sealing cover (1) and a stripping sheet (17), characterized in that: A sealing cover (2) is fixedly mounted on the upper end of the sealing cover (1), and the sealing cover (2) and the sealing cover (1) form a closed space. A stripping assembly is provided in the closed space, and the stripping assembly comprises: A peeling frame (13), wherein a laser output mechanism is provided at the upper end of the peeling frame (13), wherein the laser output mechanism includes a multi-pulse dynamic switching system, which can dynamically switch between femtosecond, picosecond and nanosecond pulse widths, and adjust energy density and scanning parameters in real time, and can flexibly adapt to stress distribution and crack propagation characteristics of non-uniform areas such as defective areas and doped layers inside the crystal, and a laser output nozzle (24) is provided in the laser output mechanism; A heat dissipation mechanism, the heat dissipation mechanism includes a gas circulation unit and a gas guide, the gas guide includes a vertical partition (16), the vertical partition (16) is symmetrically located on both sides of the laser output nozzle (24), and can move with the laser output nozzle (24), and the gas guide can concentrate the cold air flow on the surface of the peeling sheet (17).
2. The laser lift-off device for SiC ingot according to claim 1, characterized in that: An upper mounting seat (12) is fixedly mounted on the upper end of the stripping frame (13), an upper guide rail (25) is fixedly mounted on the lower surface of the upper mounting seat (12), a laser output component (23) is slidably connected to the upper guide rail (25), and the lower end of the laser output component (23) is fixedly connected to the laser output nozzle (24), and the laser output nozzle (24) is vertically located above the stripping sheet (17).
3. The laser lift-off device for SiC ingot according to claim 2, characterized in that: The gas guide comprises an elastic sealing baffle (15) and a strip-shaped temperature sensing element (22), the vertical partition (16) is fixedly mounted on both sides of the laser output element (23), the upper end of the vertical partition (16) away from the laser output element (23) is fixedly mounted with an elastic sealing baffle (15), the other end of the elastic sealing baffle (15) is fixedly connected to the inner wall of the stripping frame (13), the lower ends of the vertical partitions (16) are inclined toward the laser output nozzle (24), the strip-shaped temperature sensing element (22) is fixedly mounted on the lower ends of the vertical partitions (16), and the ends of the elastic sealing baffles (15) on both sides close to the vertical partitions (16) are inclined downward.
4. The laser lift-off device for SiC ingot according to claim 3, wherein: The gas circulation unit includes a circulation output member (21), a refrigeration device (3) and a dehumidification member (19). The circulation output member (21) is provided in two groups and is symmetrically arranged on the inner wall of the stripping frame (13). The output end of the circulation output member (21) is kept parallel to the vertical partition (16). The dehumidification member (19) is fixedly installed on one side of the stripping frame (13). A shunt pipe (14) is connected between the upper end of the circulation output member (21) and the dehumidification member (19). The refrigeration device (3) is fixedly installed on the outside of the sealing cover (1), and an outlet pipe (5) is connected between the dehumidification member (19) and the refrigeration device (3).
5. The laser lift-off device for SiC ingot according to claim 1, characterized in that: A feeding rail (8) is provided at the lower end of the stripping frame (13), one end of the feeding rail (8) is led out to the outside of the stripping frame (13), a feeding table (9) is slidably connected to the feeding rail (8), the feeding table (9) can position and clamp the stripping sheet (17), the feeding table (9) is located below the vertical partition (16), an upper hanging frame (20) is slidably connected to the upper end of the stripping frame (13) close to the feeding rail (8), a hanging pipe (11) is fixedly installed on the upper hanging frame (20), one end of the hanging pipe (11) is fixedly installed with a suction nozzle, the suction nozzle is fixedly connected between the two groups of vertical partitions (16), the other end of the hanging pipe (11) is fixedly installed with a connecting pipe (10), the other end of the connecting pipe (10) is led out of the sealing cover (1), and is fixedly connected to the refrigeration equipment (3) through the return pipe (4).
6. The laser lift-off device for SiC ingot according to claim 5, characterized in that: A partition plate (18) is fixedly mounted on each of the circulation output members (21). The partition plate (18) is a trapezoidal plate, and its long side is in the same vertical plane as the edge of the feeding rail (8). The upper surface of the partition plate (18) is flush with the upper surface of the feeding platform (9).
7. The laser lift-off device for SiC ingot according to claim 1, characterized in that: A storage unit (6) is provided in the sealing cover (1) on a side away from the stripping assembly. The storage unit (6) is provided with two groups of storage bins. Multiple groups of interlayer baffles (601) are evenly arranged in the storage bins. The stripping original sheets (602) are placed between adjacent interlayer baffles (601).
8. The laser lift-off device for SiC ingot according to claim 7, characterized in that: A transfer member (7) is installed in the sealing cover (1) at a position between the stripping component and the storage member (6), and a rotating seat (701) is provided at the bottom of the transfer member (7), and a mechanical arm (702) is provided at the upper end of the rotating seat (701). A lifting member (703) is fixedly installed at the upper end of the mechanical arm (702), and the front end of the lifting member (703) can be inserted into the bottom of the stripping original sheet (602) and the stripping sheet (17).