Type-C port anti-burning equipment, method and device, electronic equipment and readable storage medium

Abstract

The invention relates to anti-burning equipment, method and device for a Type-C port, electronic equipment and a readable storage medium. The equipment comprises a plurality of temperature sensing assemblies which are respectively connected with a signal processing unit and are used for acquiring detection point temperature information of each temperature detection point in a plurality of temperature detection points and transmitting the detection point temperature information to the signal processing unit; the signal processing unit is connected with the protection assembly and used for determining the area temperature of each temperature detection area according to the detection point temperature information of each temperature detection point, comparing the area temperatures of the two corresponding temperature detection areas, generating a protection signal under the condition that it is determined that the Type-C port is overheated according to the comparison result, and sending the protection signal to the protection assembly. The protection signal is transmitted to the protection assembly; and the protection component is used for grounding a VBUS pin of the Type-C port in response to the protection signal. According to the invention, the technical problem of low protection effect of the anti-burning mode of the Type-C port in the prior art can be solved.

Description

Technical Field

[0001] The present disclosure relates to the field of electrical connection technology, and in particular to a Type-C port anti-burning device, method and apparatus, electronic device, and readable storage medium. Background Art

[0002] With the widespread use of mobile electronic devices such as smartphones and tablets, the usage scenarios faced by mobile phones are becoming increasingly complex, leading to increasingly stringent requirements for outdoor use environments. Certain special usage scenarios or poor user habits can easily cause the Type-C port to overheat or even burn during charging. For example, underwater use or foreign objects entering the Type-C port can cause corrosion or short circuits. Charging through the Type-C port in these situations can easily cause the port to generate excessive heat, leading to burnout, severely impacting the user experience and causing serious adverse effects on the user's property or even life.

[0003] In the related art, there is a method of determining whether the Type-C port needs to be protected by determining whether the temperature detected by the Type-C port is too high. However, this method can only trigger protection when the temperature has reached a preset upper temperature limit, that is, the protection of the Type-C port can only be triggered when the temperature is too high. However, when the temperature of the Type-C port is too high, the Type-C port is prone to burn out. Therefore, the Type-C port anti-burning method in the related art has a technical problem of poor protection effect. Summary of the Invention

[0004] The present disclosure provides a Type-C port anti-burn device, method and apparatus, electronic device, and readable storage medium to address the deficiencies in the related art.

[0005] According to a first aspect of an embodiment of the present disclosure, a Type-C port burn prevention device is provided, comprising: a signal processing unit, a protection component, and a plurality of temperature sensing components respectively provided at a plurality of temperature detection points of the Type-C port;

[0006] The plurality of temperature sensing components are respectively connected to the signal processing unit, and are used to obtain detection point temperature information of each temperature detection point of the plurality of temperature detection points, and transmit the detection point temperature information to the signal processing unit;

[0007] The signal processing unit is connected to the protection component and is configured to determine the regional temperature of each temperature detection area based on the detection point temperature information of each temperature detection point, compare the regional temperatures of two corresponding temperature detection areas, and generate a protection signal when it is determined that the Type-C port is overheated according to the comparison result, and transmit the protection signal to the protection component, wherein each temperature detection area includes at least one temperature detection point;

[0008] The protection component is configured to ground the VBUS pin of the Type-C port in response to the protection signal.

[0009] Optionally, there are at least two temperature sensing components, and the multiple temperature detection points include at least a first temperature detection point and a second temperature detection point.

[0010] The first temperature detection point is located between the GND pin cable and the VBUS pin cable on one side of the Type-C port, and the second temperature detection point is located between the GND pin cable and the VBUS pin cable on the other side of the Type-C port.

[0011] Optionally, the temperature sensing components are provided with 4;

[0012] There are four temperature detection points, which are respectively located at the two GND pin wirings of the Type-C port and the two VBUS pin wirings of the Type-C port.

[0013] Optionally, for any pin cable, a distance between a temperature detection point at the pin cable and a pin to which the pin cable is connected is within a preset distance range, wherein the pin cable includes: the GND pin cable and the VBUS pin cable.

[0014] Optionally, the temperature sensing component includes a thermistor.

[0015] Optionally, the signal processing unit is further configured to:

[0016] Determine the detection point temperature of each temperature detection point according to the detection point temperature information of each temperature detection point;

[0017] Determine the average value of the detection point temperature information of all temperature detection points included in each temperature detection area;

[0018] The average value corresponding to each temperature detection area is determined as the area temperature of each temperature detection area.

[0019] Optionally, the signal processing unit is further configured to:

[0020] Determining at least one temperature detection area group among all the temperature detection areas, wherein the temperature detection area group includes two temperature detection areas corresponding to each other;

[0021] Determine the temperature difference value corresponding to each temperature detection area group by calculating the temperature difference between the area temperatures corresponding to the two temperature detection areas in each temperature detection area group;

[0022] When the temperature difference corresponding to any temperature detection area group does not meet the temperature difference threshold corresponding to any temperature detection area group, it is determined that the Type-C port is overheated.

[0023] Optionally, the signal processing unit is further configured to:

[0024] If it is determined according to the detection point temperature information of each temperature detection point that the detection point temperature of at least one of the temperature detection points is higher than a preset temperature upper limit, it is determined that the Type-C port is overheated.

[0025] Optionally:

[0026] The signal processing unit is further configured to apply a target voltage to the charger end through the CC pin; and when the target voltage is applied, apply the target voltage as the protection signal to the protection component;

[0027] The protection component is further configured to conduct according to the target voltage and ground the VBUS pin of the Type-C port.

[0028] Optionally:

[0029] The signal processing unit is further configured to apply a target voltage to the charger terminal via the CC pin, and if the target voltage is not applied for over a preset time period, apply a charging voltage as the protection signal to the protection component, wherein the charging voltage is higher than the target voltage;

[0030] The protection component is further configured to conduct according to the charging voltage and ground the VBUS pin of the Type-C port.

[0031] According to a second aspect of an embodiment of the present disclosure, a Type-C port burn prevention method is also provided, including:

[0032] Obtaining detection point temperature information of each temperature detection point among multiple temperature detection points on the Type-C port;

[0033] Determining the regional temperature of each temperature detection area according to the detection point temperature information of each temperature detection point, wherein each temperature detection area includes at least one temperature detection point;

[0034] Compare the regional temperatures of the two corresponding temperature detection areas;

[0035] When it is determined according to the comparison result that the Type-C port is overheated, the protection component is controlled to ground the VBUS pin of the Type-C port.

[0036] Optionally, determining the regional temperature of each temperature detection area according to the detection point temperature information of each temperature detection point includes:

[0037] Determine the average value of the detection point temperature information of all temperature detection points included in each temperature detection area;

[0038] The average value corresponding to each temperature detection area is determined as the area temperature of each temperature detection area.

[0039] Optionally, comparing the regional temperatures of two corresponding temperature detection regions includes:

[0040] Determining at least one temperature detection area group among all the temperature detection areas, wherein the temperature detection area group includes two temperature detection areas corresponding to each other;

[0041] Determine the temperature difference value corresponding to each temperature detection area group by calculating the temperature difference between the area temperatures corresponding to the two temperature detection areas in each temperature detection area group;

[0042] When the temperature difference corresponding to any temperature detection area group does not meet the temperature difference threshold corresponding to any temperature detection area group, it is determined that the Type-C port is overheated.

[0043] Optionally, when it is determined according to the comparison result that the Type-C port is overheated, before controlling the protection component to ground the VBUS pin of the Type-C port, the method further includes:

[0044] If it is determined that the temperature information of at least one of the detection points is higher than the preset temperature upper limit, it is determined that the Type-C port is overheated.

[0045] Optionally, the controlling protection component grounding the VBUS pin of the Type-C port includes:

[0046] Apply the target voltage to the charger through the CC pin;

[0047] When the target voltage is applied, the target voltage is applied to the protection component, so that the VBUS pin of the Type-C port is grounded through the protection component.

[0048] Optionally, the controlling protection component grounding the VBUS pin of the Type-C port includes:

[0049] Apply the target voltage to the charger through the CC pin;

[0050] If the target voltage is not applied for over a preset time period, a charging voltage is applied to the protection component to ground the VBUS pin of the Type-C port through the protection component, wherein the charging voltage is higher than the target voltage.

[0051] According to a third aspect of the embodiments of the present disclosure, a Type-C port anti-burning device is further provided, including:

[0052] an acquisition module, configured to acquire detection point temperature information of each temperature detection point among a plurality of temperature detection points on the Type-C port when the Type-C port is connected to a power source;

[0053] a determination module, configured to determine the regional temperature of each temperature detection area based on the detection point temperature information of each temperature detection point, wherein each temperature detection area includes at least one temperature detection point;

[0054] A comparison module is used to compare the regional temperatures of two corresponding temperature detection areas;

[0055] The control module is used to control the protection component to ground the VBUS pin of the Type-C port when it is determined that the Type-C port is overheated according to the comparison result.

[0056] According to a fourth aspect of the embodiments of the present disclosure, there is further provided an electronic device, including a processor;

[0057] a memory for storing processor-executable instructions;

[0058] The processor implements the steps in any of the above methods by running the executable instructions.

[0059] According to a fifth aspect of the embodiments of the present disclosure, a computer-readable storage medium is further provided, on which a computer program is stored. When the program is executed by a processor, the steps in the method described in any of the above embodiments are implemented.

[0060] According to a sixth aspect of an embodiment of the present disclosure, a Type-C port is further provided, comprising the Type-C port anti-burning device described in any of the above embodiments.

[0061] The technical solutions provided by the embodiments of the present disclosure may have the following beneficial effects:

[0062] It can be seen from the above embodiments that the device disclosed herein can obtain detection point temperature information of multiple temperature detection points through multiple temperature sensing components, so that the signal processing unit can determine the regional temperature of each temperature detection area based on the detection point temperature information of the multiple temperature detection points, and compare the regional temperatures of the corresponding two temperature detection areas to determine whether any of the two corresponding temperature detection areas is overheated. Compared with the method of detecting whether the temperature is too high in the related art, the device disclosed herein can determine whether the Type-C port is overheated by using the regional temperatures of the two corresponding temperature detection areas as a reference even if the regional temperature of the temperature detection area has not reached the temperature upper limit. Therefore, compared with the related art, the Type-C port abnormality can be identified in advance, thereby effectively overcoming the technical problem of poor protection effect of the Type-C port anti-burning method in the related art.

[0063] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0065] Figure 1 1 is a schematic diagram of electrical connections of a Type-C port anti-burn device according to an embodiment of the present disclosure.

[0066] Figure 2 1 is a schematic diagram of electrical connections of a Type-C port anti-burn device according to another embodiment of the present disclosure.

[0067] Figure 3 The present invention is a schematic flowchart of a method for preventing a Type-C port from burning according to an embodiment of the present invention.

[0068] Figure 4 FIG1 is a schematic flow chart of a Type-C port burn prevention method according to another embodiment of the present disclosure.

[0069] Figure 5 FIG1 is a schematic flow chart of a Type-C port burn prevention method according to another embodiment of the present disclosure.

[0070] Figure 6 FIG1 is a schematic flow chart of a Type-C port burn prevention method according to another embodiment of the present disclosure.

[0071] Figure 7 1 is a schematic block diagram of a Type-C port anti-burning device according to an embodiment of the present disclosure.

[0072] Figure 8 It is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure.

[0073] Figure 9 The figure is a schematic block diagram of a Type-C port anti-burning device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0074] The following will be combined with the accompanying drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the embodiments described are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present disclosure.

[0075] The terms used in the embodiments of the present disclosure are for the purpose of describing specific embodiments only and are not intended to limit the embodiments of the present disclosure. The singular forms "a," "an," and "the" used in the embodiments of the present disclosure and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0076] It should be understood that although the terms first, second, third, etc. may be used to describe various information in the embodiments of the present disclosure, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of the embodiments of the present disclosure, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0077] For the purpose of brevity and ease of understanding, the terms "greater than," "less than," "higher than," and "lower than" are used herein to describe size relationships. However, those skilled in the art will understand that the term "greater than" also encompasses the meaning of "greater than or equal to," and "less than" also encompasses the meaning of "less than or equal to," and the term "higher than" also encompasses the meaning of "higher than or equal to," and "lower than" also encompasses the meaning of "lower than or equal to."

[0078] Figure 1 1 is a schematic diagram showing the structure of a Type-C port anti-burning device according to an embodiment of the present disclosure. Figure 1 As shown, a Type-C port anti-burning device includes: a signal processing unit 11, a protection component 12, and multiple temperature sensing components 13 respectively provided at multiple temperature detection points of the Type-C port;

[0079] A plurality of temperature sensing components 13 are respectively connected to the signal processing unit 11 and are used to obtain detection point temperature information of each temperature detection point among the plurality of temperature detection points and transmit the detection point temperature information to the signal processing unit 11;

[0080] The signal processing unit 11 is connected to the protection component 12 and is configured to determine the regional temperature of each temperature detection area based on the detection point temperature information of each temperature detection point, compare the regional temperatures of two corresponding temperature detection areas, and generate a protection signal when it is determined that the Type-C port is overheated based on the comparison result, and transmit the protection signal to the protection component 12, wherein each temperature detection area includes at least one temperature detection point;

[0081] The protection component 12 is configured to ground the VBUS pin of the Type-C port in response to a protection signal.

[0082] There are multiple temperature sensing components 13, and the temperature sensing components 13 are placed at unique corresponding temperature detection points, so that each temperature sensing component can collect temperature information of a temperature detection point.

[0083] The detection point temperature information may be relevant information that can determine the detection point temperature of the temperature detection point. The information type of the detection point temperature information depends on the type of the temperature sensing component 13. For example, when the temperature sensing component 13 is a component that can directly determine the temperature, the detection point temperature information is the temperature value. When the temperature sensing component 13 includes a thermistor whose resistance changes with temperature, and the resistance is determined by voltage, the detection point temperature information is the voltage value.

[0084] In some optional embodiments, each temperature detection point is different from another, and a temperature detection point can be provided with at least one temperature sensing component 13. When a temperature detection point is provided with multiple temperature sensing components 13 and each temperature sensing component 13 is operating normally, the detection point temperature information of the temperature detection point can be determined based on the average value of the temperatures sensed by each temperature sensing component 13. When a temperature detection point is provided with multiple temperature sensing components 13 and there is a faulty temperature sensing component 13, the corresponding detection point temperature information can be determined based only on the temperature detected by the normal temperature sensing component 13. A temperature detection point can be a point within a detection range, and the detection ranges corresponding to different temperature detection points are different.

[0085] Optionally, the temperature sensing component 13 may include, but is not limited to, one or more of the following: a thermocouple, a thermal resistor, a thermistor, etc. Furthermore, the temperature sensing component 13 may be a thermistor and a voltage collector for collecting the voltage of the thermistor, thereby effectively reducing operating costs and improving detection accuracy.

[0086] After acquiring the corresponding detection point temperature information, the temperature sensing component 13 may transmit the detection point temperature information to the signal processing unit 11. After acquiring the detection point temperature information corresponding to each temperature detection point, the signal processing unit 11 may determine the detection point temperature of each temperature detection point based on the detection point temperature information.

[0087] In this embodiment, the signal processing unit 11 can first determine the detection point temperature of each temperature detection point based on the detection point temperature information of each temperature detection point, and then determine the regional temperature of each temperature detection area based on the temperature detection points included in each temperature detection area and the detection point temperature of each temperature detection point. Since each temperature detection area can include one or more temperature detection points, when the temperature detection area includes only one temperature detection point, then the temperature detection area is equivalent to the temperature within the range used to detect the temperature detection point. When the temperature detection area includes multiple temperature detection points, then the temperature detection area is equivalent to the set of ranges corresponding to the multiple temperature detection points. In general, the ranges corresponding to multiple temperature detection points in the same temperature detection area are adjacent. In other words, a temperature detection area is a continuous area and is not divided into multiple independent areas. For example, when the temperature detection area A includes temperature detection point a1 and temperature detection point a2, then the detection range corresponding to the temperature detection area is the set of detection range I of temperature detection point a1 and detection range II of temperature detection point a2, and detection range I and detection range II are adjacent. It can be understood that since the temperature detection area includes at least one temperature detection point, when the temperature detection points included in one temperature detection area A1 are included in all the temperature detection points included in another temperature detection area A2, the temperature detection area A1 is included in the temperature detection area A2, and when there is an overlap between all the temperature detection points included in one temperature detection area A3 and all the temperature detection points included in another temperature detection area A4, the temperature detection area A3 and the temperature detection area A4 also overlap.

[0088] As an optional embodiment, the signal processing unit 11 can determine the regional temperature of each temperature detection area based on the detection point temperature information of each temperature detection point by the signal processing unit 11 as follows: determining the detection point temperature of each temperature detection point based on the detection point temperature information of each temperature detection point; determining the average value of the detection point temperatures of all temperature detection points included in each temperature detection area; and determining the regional temperature of each temperature detection area using the average value corresponding to each temperature detection area. In other words, the signal processing unit 11 can first determine the detection point temperature of each temperature detection point based on the detection point temperature information of each temperature detection point. For example, when the temperature sensing component 13 is a thermistor, the detection point temperature corresponding to the temperature sensing component 13, the resistance value of the thermistor, and the voltage value of the thermistor are proportional. Therefore, the detection point temperature information can be a voltage value, and the detection point temperature of the temperature detection point corresponding to the thermistor can be determined based on the voltage value. Since each temperature detection area includes one or more temperature detection points, the detection point temperature of all temperature detection points included in each temperature detection area can be calculated to determine the corresponding average value, and the average value is determined as the regional temperature of each temperature detection area. For example, when the temperature detection area A includes the temperature detection point a1 and the temperature detection point a2, and the detection point temperature T of the temperature detection point a1 is a1 The detection point temperature T of the temperature detection point a2 is 50℃. a2 When the temperature is 56°C, the temperature of the temperature detection area A is (T a1 +T a2 ) / 2=53° C. After determining the regional temperature of each temperature detection area, the temperature difference between different temperature detection areas can be determined. In this embodiment, the regional temperatures of two corresponding temperature detection areas can be compared to determine the temperature difference between the two corresponding temperature detection areas.

[0089] The two corresponding temperature detection areas can be two detection areas with similar temperatures when the Type-C interface is normally charging. For example, taking the two temperature detection areas as temperature detection area A and temperature detection area A' as an example, when temperature detection area A is Figure 1 In the case of the range between GND and VBUS on the left, the temperature detection area A' is Figure 1 The range between GND and VBUS on the right.

[0090] Under normal circumstances, the temperature difference between the regional temperatures of two corresponding temperature detection areas is extremely small. Only when the Type-C interface is corroded or has conductive foreign matter does the impedance between VBUS and GND change, where the impedance between the left VBUS and GND is equivalent to Rx1, and the impedance between the right VBUS and GND is equivalent to Rx2, resulting in different temperature changes at both ends. Based on the above reasons, in this embodiment, the regional temperatures of the two corresponding temperature detection areas are compared to obtain a comparison result for determining whether the Type-C port is overheated. Optionally, when there is a temperature inconsistency or a temperature difference between the regional temperatures of the two temperature detection areas is too large (for example, greater than or equal to a temperature difference threshold), a comparison result indicating that the Type-C port is overheated can be obtained. Conversely, when the regional temperatures of the two temperature detection areas are consistent or the temperature difference is very small (for example, less than the temperature difference threshold), a comparison result indicating that the Type-C port is not overheated is obtained.

[0091] When it is determined that the Type-C port is overheated, the signal processing unit 11 can generate a protection signal and transmit the protection signal to the protection component 12. The protection signal can be a signal for instructing the protection component 12 to perform anti-burn protection for the Type-C port.

[0092] After receiving the protection signal, the protection component 12 can ground the VBUS pin of the Type-C port so that the VBUS current is directly guided by the ground, thereby preventing the VBUS current from continuing to flow to the GND end, and further preventing further heat from occurring between VBUS and GND.

[0093] The device disclosed herein can obtain detection point temperature information of multiple temperature detection points through multiple temperature sensing components, so that the signal processing unit can determine the regional temperature of each temperature detection area based on the detection point temperature information of the multiple temperature detection points, and compare the regional temperatures of the two corresponding temperature detection areas to determine whether any of the two corresponding temperature detection areas is overheated. Compared with the method of detecting whether the temperature is too high in the related art, the device disclosed herein can determine whether the Type-C port is overheated by using the regional temperatures of the two corresponding temperature detection areas as a reference even if the regional temperature of the temperature detection area has not reached the temperature upper limit. Therefore, compared with the related art, the abnormality of the Type-C port can be identified in advance, thereby effectively overcoming the technical problem of low protection effect of the Type-C port anti-burning method in the related art.

[0094] As an optional embodiment, the temperature sensing components 13 are provided with at least two, and the multiple temperature detection points include at least a first temperature detection point and a second temperature detection point.

[0095] The first temperature detection point is located between the GND pin cable and the VBUS pin cable on one side of the Type-C port, and the second temperature detection point is located between the GND pin cable and the VBUS pin cable on the other side of the Type-C port.

[0096] Optionally, a first temperature detection area including the first temperature detection point corresponds to a second temperature detection area including the second temperature detection point. In other words, the first temperature detection area and the second temperature detection area correspond to the area between the GND pin and the VBUS pin on both sides of the Type-C port, respectively. Therefore, under normal charging conditions, the regional temperatures of the first temperature detection area and the second temperature detection area should be similar, that is, within a preset temperature difference range.

[0097] For example, Figure 1 As shown, when there are only two temperature sensing components 13, the multiple temperature detection points are the first temperature detection point and the second temperature detection point. The temperature sensing component Rntc1 is set at the first temperature detection point, and the temperature sensing component Rntc2 is set at the second temperature detection point. That is to say, the first temperature detection area only includes the temperature sensing component Rntc1, and the second temperature detection area only includes the temperature sensing component Rntc2. In this case, the signal processing unit 11 can determine the regional temperature of the first temperature detection area based on the detection point temperature information detected by the temperature sensing component Rntc1, determine the regional temperature of the second temperature detection area based on the detection point temperature information detected by the temperature sensing component Rntc2, and compare the regional temperature of the first temperature detection area with the regional temperature of the second temperature detection area. If the two regional temperatures are different or the temperature of one of the regional temperatures exceeds the temperature of the other regional temperature by a preset temperature difference (for example, 3°C, 5°C, etc.), it is determined that the Type-C port is overheated. Otherwise, it is determined that the Type-C port is not overheated.

[0098] As an optional embodiment, there are four temperature sensing components 13;

[0099] There are four temperature detection points, which are located at the GND pin wiring of the Type-C port and the VBUS pin wiring of the Type-C port.

[0100] like Figure 2As shown, a temperature sensing component NTC1 is provided at the left GND pin wiring, a temperature sensing component NTC2 is provided at the left VBUS pin wiring, a temperature sensing component NTC3 is provided at the right VBUS pin wiring, and a temperature sensing component NTC4 is provided at the right GND pin wiring.

[0101] As Figure 2 As shown, the temperature detection areas are identified by the included temperature sensing components as an example, that is, NTCi indicates the temperature detection area that only includes the temperature sensing component NTCi, and (NTCi, NTCj) indicates the temperature detection area that includes the temperature sensing component NTCi and the temperature sensing component NTCj. The two corresponding temperature detection areas may include the following groups: NTC1 and NTC2, NTC3 and NTC4, (NTC1, NTC2) and (NTC3, NTC4), NTC1 and NTC3, NTC2 and NTC4, NTC1 and NTC4, NTC2 and NTC3.

[0102] As an optional embodiment, for any pin cable, the distance between the temperature detection point at any pin cable and the pin to which the pin cable is connected is within a preset distance range, wherein the pin cable includes: the GND pin cable and the VBUS pin cable. The preset distance range corresponding to the temperature detection point can be based on not affecting the normal use of the Type-C port and being able to most accurately collect the actual temperature of the pin to which the pin cable where the temperature detection point is located is connected, and is not limited here. For example, Figure 2 As shown, the temperature sensing component NTC1 is located at the GND pin cable on the left side of the Type-C port, and the distance between the temperature sensing component NTC1 and the GND pin on the left side of the Type-C port should be within a preset distance range. The preset distance range is based on not affecting the normal use of the Type-C port and being able to most accurately collect the actual temperature of the GND pin on the left side of the Type-C port.

[0103] As an optional implementation, the signal processing unit 11 may implement the aforementioned step of comparing the regional temperatures of the two corresponding temperature detection regions to determine whether the Type-C port is overheated by performing the following steps:

[0104] Among all the temperature detection areas, at least one temperature detection area group is determined, wherein the temperature detection area group includes two corresponding temperature detection areas; by calculating the temperature difference between the area temperatures corresponding to the two temperature detection areas in each temperature detection area group, the temperature difference corresponding to each temperature detection area group is determined; if the temperature difference corresponding to any temperature detection area group does not meet the temperature difference threshold corresponding to any temperature detection area group, it is determined that the Type-C port is overheated.

[0105] The signal processing unit 11 can be pre-configured to determine at least one temperature detection area group corresponding to each other in all temperature detection areas. The two corresponding temperature detection areas can be two temperature detection areas with similar temperatures under normal charging conditions of the Type-C port. Figure 2 As shown, the temperature detection areas are identified by the included temperature sensing components as an example, that is, NTCi indicates a temperature detection area that only includes the temperature sensing component NTCi, and (NTCi, NTCj) indicates a temperature detection area that includes the temperature sensing component NTCi and the temperature sensing component NTCj. The two corresponding temperature detection areas may include the following groups: NTC1 and NTC2, NTC3 and NTC4, (NTC1, NTC2) and (NTC3, NTC4), NTC1 and NTC3, NTC2 and NTC4, NTC1 and NTC4, NTC2 and NTC3. After determining the two temperature detection areas, the temperature difference calculation can be performed on the regional temperatures corresponding to the two temperature detection areas in each temperature detection area group to determine the temperature difference value corresponding to each temperature detection area group. After calculating the temperature difference corresponding to each temperature detection zone group, it is determined whether the temperature difference of each temperature detection zone group meets the temperature difference threshold corresponding to each temperature detection zone group. The temperature difference threshold can be a threshold used to indicate the upper limit of the temperature difference of each temperature detection zone group. Different temperature detection zone groups have different temperature detection zones, so the temperature difference thresholds corresponding to different temperature detection zone groups are also different. If the temperature difference corresponding to any temperature detection zone group does not meet the temperature difference threshold corresponding to that temperature detection zone group, the Type-C port is determined to be overheated.

[0106] For example, when T1 is the temperature of the temperature detection point where the temperature sensing component NTC1 is located, when T2 is the temperature of the temperature detection point where the temperature sensing component NTC2 is located, when T3 is the temperature of the temperature detection point where the temperature sensing component NTC3 is located, and when T4 is the temperature of the temperature detection point where the temperature sensing component NTC4 is located, if one of the following conditions exists, it is determined that the Type-C port is overheated:

[0107] ∣T1-T2∣>C1, ∣T3-T4∣>C1, ∣(T1+T2) / 2-(T3+T4) / 2∣>C2, ∣T1-T3∣>C3, ∣T2-T3∣>C3, ∣T1-T4∣>C3, ∣T2-T4∣>C3.

[0108] Among them, (T1+T2) / 2 is the regional temperature of the temperature detection area including the temperature detection point where the temperature sensing component NTC1 is located and the temperature detection point where the temperature sensing component NTC2 is located, and (T3+T4) / 2 is the regional temperature of the temperature detection area including the temperature detection point where the temperature sensing component NTC3 is located and the temperature detection point where the temperature sensing component NTC4 is located.

[0109] As an optional implementation manner, the signal processing unit 11 is further configured to:

[0110] If it is determined according to the detection point temperature information of each temperature detection point that the detection point temperature of at least one temperature detection point is higher than the preset temperature upper limit, it is determined that the Type-C port is overheated.

[0111] That is to say, the signal processing unit 11 can also determine the detection point temperature of each temperature detection point based on the detection point temperature information, and then compare the temperature of each detection point with the preset temperature upper limit. If there is at least one monitoring point temperature higher than the preset temperature upper limit, it is determined that the Type-C port is overheated.

[0112] Through the method of this embodiment, the Type-C port can be protected even when the temperature difference between two corresponding temperature detection areas is not large but both are overheated. In addition, when the detection point temperature of at least one temperature detection point is higher than the preset temperature upper limit, the Type-C port is judged to be overheated. This can solve the problem of slow triggering time caused by the randomness of hot spot distribution and improve the degree of freedom of detection.

[0113] As an optional implementation:

[0114] The signal processing unit 11 is further configured to apply a target voltage to the charger end through the CC pin; if the target voltage is applied, the target voltage is applied as a protection signal to the protection component 12;

[0115] The protection component 12 is further configured to conduct according to the target voltage and ground the VBUS pin of the Type-C port.

[0116] After determining that the Type-C port is overheating, it needs to be protected. In this embodiment, the signal processing unit 11 applies for a target voltage to the charger end through the CC pin. The target voltage can be a voltage that drives the protection component 12 to operate normally. The protection component 12 is used to connect the VBUS pin and the ground terminal, and when the Type-C port is normal, the protection component 12 disconnects the VBUS pin and the ground terminal. When the signal processing unit 11 applies for the target voltage, it applies the target voltage as a protection signal to the protection component 12, so that the protection component 12 can be turned on under the drive of the target voltage, and then the VBUS pin of the Type-C port is grounded.

[0117] For example, the protection component 12 can be a burn-in MOS. In this case, the target voltage can be a voltage that enables the burn-in MOS to operate normally, generally 5V. The signal processing unit 11 is connected to the gate of the burn-in MOS, the source of the burn-in MOS is grounded, and the drain of the burn-in MOS is connected to the VBUS pin. Thus, the target voltage can be applied to the gate to drive the source and drain of the burn-in MOS to conduct, thereby grounding the VBUS pin. The current of the VBUS pin is directly conducted through the ground, thereby protecting the Type-C port.

[0118] Through the device of this embodiment, a target voltage can be applied to drive the protection component to ground the VBUS pin of the Type-C port, thereby ensuring the normal operation of the burn-proof MOS while protecting the Type-C port.

[0119] As an optional embodiment: the signal processing unit 11 is further configured to apply a target voltage to the charger end through the CC pin. If the target voltage is not applied for after a preset time, the charging voltage as a protection signal is applied to the protection component 12, wherein the charging voltage is higher than the target voltage.

[0120] The protection component 12 is further configured to conduct according to the charging voltage and ground the VBUS pin of the Type-C port.

[0121] After determining that the Type-C port is overheating, it needs to be protected. In this embodiment, the signal processing unit 11 applies for a target voltage to the charger end through the CC pin. The target voltage can be the voltage that drives the protection component to operate. When the target voltage is not applied for more than the preset time, it means that the CC port is very likely to have corroded and cannot be used normally, and the probability of corrosion of the entire Type-C port is also very high. Therefore, if the target voltage cannot be applied for a long time, VBUS will be forcibly pulled to the ground through the anti-burn MOS. The preset time can be a pre-set upper limit for applying for the target voltage through the CC port, for example, 300ms, 400ms, etc.

[0122] Protection component 12 connects the VBUS pin to ground and, when the Type-C port is operating normally, disconnects the VBUS pin from ground. If the target voltage is not applied for a preset period of time, the charging voltage is applied directly to protection component 12 to protect the Type-C port from burning out. This voltage then turns protection component 12 on, grounding the VBUS pin of the Type-C port.

[0123] The device of this embodiment can protect the Type-C port from burning even when the port is corroded.

[0124] According to another aspect of the embodiments of the present disclosure, a Type-C port is further provided, comprising the Type-C port anti-burning device described in any of the above embodiments.

[0125] Figure 3 This is a schematic flow chart of a Type-C port anti-burning method according to an embodiment of the present disclosure. The Type-C port anti-burning method shown in this embodiment can be executed by a terminal, including but not limited to a mobile phone, tablet computer, wearable device, sensor, IoT device, and other communication devices.

[0126] like Figure 3 As shown, the Type-C port burn prevention method may include the following steps:

[0127] Step S302: Acquire detection point temperature information of each temperature detection point among multiple temperature detection points on the Type-C port.

[0128] In this embodiment, the detection point temperature information of each temperature detection point can be collected by one or more temperature sensing components provided at each temperature detection point. There are multiple temperature sensing components, and the temperature sensing components are placed at the only corresponding temperature detection point, so that each temperature sensing component can collect the detection point temperature information of one temperature detection point.

[0129] The detection point temperature information may be relevant information that can determine the detection point temperature of the temperature detection point. The information type of the detection point temperature information depends on the type of the temperature sensing component. For example, when the temperature sensing component is a component that can directly determine the temperature, the detection point temperature information is the temperature value. When the temperature sensing component includes a thermistor whose resistance changes with temperature, and the resistance is determined by voltage, the detection point temperature information is the voltage value.

[0130] In some optional embodiments, each temperature detection point is different from another, and a temperature detection point can be provided with at least one temperature sensing component. When a temperature detection point is provided with multiple temperature sensing components and each temperature sensing component is able to operate normally, the detection point temperature information of the temperature detection point can be determined based on the average value of the temperatures sensed by each temperature sensing component. When a temperature detection point is provided with multiple temperature sensing components and there is a faulty temperature sensing component, the corresponding detection point temperature information can be determined based only on the temperature detected by the normal temperature sensing component. A temperature detection point can be a point within a detection range, and the detection ranges corresponding to different temperature detection points are different.

[0131] Step S304 : determining the regional temperature of each temperature detection area according to the detection point temperature information of each temperature detection point, wherein each temperature detection area includes at least one temperature detection point.

[0132] In this embodiment, the method of this embodiment can be implemented by a signal processing unit. The signal processing unit can first determine the detection point temperature of each temperature detection point based on the detection point temperature information of each temperature detection point, and then determine the regional temperature of each temperature detection area based on the temperature detection points included in each temperature detection area and the detection point temperature of each temperature detection point. Since each temperature detection area can include one or more temperature detection points, when the temperature detection area includes only one temperature detection point, then the temperature detection area is equivalent to the temperature within the range used to detect the temperature detection point. When the temperature detection area includes multiple temperature detection points, then the temperature detection area is equivalent to the set of ranges corresponding to the multiple temperature detection points. In general, the ranges corresponding to multiple temperature detection points in the same temperature detection area are adjacent. In other words, a temperature detection area is a continuous area and is not divided into multiple independent areas. For example, when the temperature detection area A includes temperature detection point a1 and temperature detection point a2, then the detection range corresponding to the temperature detection area is the set of detection range I of temperature detection point a1 and detection range II of temperature detection point a2, and detection range I and detection range II are adjacent. It can be understood that since the temperature detection area includes at least one temperature detection point, when the temperature detection points included in one temperature detection area A1 are included in all the temperature detection points included in another temperature detection area A2, the temperature detection area A1 is included in the temperature detection area A2, and when there is an overlap between all the temperature detection points included in one temperature detection area A3 and all the temperature detection points included in another temperature detection area A4, the temperature detection area A3 and the temperature detection area A4 also overlap.

[0133] As an optional embodiment, the signal processing unit can determine the regional temperature of each temperature detection area based on the detection point temperature information of each temperature detection point by the signal processing unit as follows: determining the detection point temperature of each temperature detection point based on the detection point temperature information of each temperature detection point; determining the average detection point temperature of all temperature detection points included in each temperature detection area; and determining the regional temperature of each temperature detection area using the average value corresponding to each temperature detection area. In other words, the signal processing unit 11 can first determine the detection point temperature of each temperature detection point based on the detection point temperature information of each temperature detection point. For example, when the temperature sensing component 13 is a thermistor, the detection point temperature corresponding to the temperature sensing component 13, the resistance value of the thermistor, and the voltage value of the thermistor are proportional. Therefore, the detection point temperature information can be a voltage value, and the detection point temperature of the temperature detection point corresponding to the thermistor can be determined based on the voltage value. Since each temperature detection area includes one or more temperature detection points, the detection point temperature of all temperature detection points included in each temperature detection area can be calculated to determine the corresponding average value, and the average value is determined as the regional temperature of each temperature detection area. For example, when the temperature detection area A includes the temperature detection point a1 and the temperature detection point a2, and the detection point temperature T of the temperature detection point a1 is a1 The detection point temperature T of the temperature detection point a2 is 50℃. a2 When the temperature is 56°C, the temperature of the temperature detection area A is (T a1 +T a2 ) / 2=53℃.

[0134] Step S306 : comparing the regional temperatures of the two corresponding temperature detection regions.

[0135] After determining the regional temperature of each temperature detection area, the signal processing unit can determine the temperature difference between different temperature detection areas. In this embodiment, the temperature difference between the two corresponding temperature detection areas can be determined by comparing the regional temperatures of the two corresponding temperature detection areas.

[0136] The two corresponding temperature detection areas can be two detection areas with similar temperatures when the Type-C interface is normally charging. For example, taking the two temperature detection areas as temperature detection area A and temperature detection area A' as an example, when temperature detection area A is Figure 1 In the case of the range between GND and VBUS on the left, the temperature detection area A' is Figure 1 The range between GND and VBUS on the right.

[0137] Under normal circumstances, the temperature difference between the regional temperatures of the two corresponding temperature detection areas is extremely small. Only when the Type-C interface is corroded or there is a conductive foreign object will the impedance between VBUS and GND change, resulting in different temperature changes at both ends. Based on the above reasons, in this embodiment, the regional temperatures of the two corresponding temperature detection areas are compared to determine whether the Type-C port is overheating. Optionally, if there is a temperature inconsistency or a temperature difference between the regional temperatures of the two temperature detection areas is too large (for example, greater than or equal to a temperature difference threshold), it can be determined that the Type-C port is overheating. Conversely, if the regional temperatures of the two temperature detection areas are consistent or the temperature difference is very small (for example, less than the temperature difference threshold), it is determined that the Type-C port is not overheating.

[0138] like Figure 4 As shown, as an optional implementation, the above step S306 can be implemented through the following steps S402 to S406:

[0139] Step S402: determining at least one temperature detection area group from among all temperature detection areas, wherein the temperature detection area group includes two temperature detection areas corresponding to each other;

[0140] Step S404, calculating the temperature difference between the regional temperatures corresponding to the two temperature detection regions in each temperature detection region group, and determining the temperature difference value corresponding to each temperature detection region group;

[0141] Step S406 : If the temperature difference corresponding to any temperature detection area group does not meet the temperature difference threshold corresponding to any temperature detection area group, it is determined that the Type-C port is overheated.

[0142] In this embodiment, the signal processing unit can be pre-configured to determine at least one temperature detection area group corresponding to each other in all temperature detection areas. The two corresponding temperature detection areas can be two temperature detection areas with similar temperatures under normal charging conditions of the Type-C port. Figure 2As shown, the temperature detection areas are identified by the included temperature sensing components as an example, that is, NTCi indicates a temperature detection area that only includes the temperature sensing component NTCi, and (NTCi, NTCj) indicates a temperature detection area that includes the temperature sensing component NTCi and the temperature sensing component NTCj. The two corresponding temperature detection areas may include the following groups: NTC1 and NTC2, NTC3 and NTC4, (NTC1, NTC2) and (NTC3, NTC4), NTC1 and NTC3, NTC2 and NTC4, NTC1 and NTC4, NTC2 and NTC3. After determining the two temperature detection areas, the temperature difference calculation can be performed on the regional temperatures corresponding to the two temperature detection areas in each temperature detection area group to determine the temperature difference value corresponding to each temperature detection area group. After calculating the temperature difference corresponding to each temperature detection zone group, it is determined whether the temperature difference of each temperature detection zone group meets the temperature difference threshold corresponding to each temperature detection zone group. The temperature difference threshold can be a threshold used to indicate the upper limit of the temperature difference of each temperature detection zone group. The two temperature detection zones in different temperature detection zone groups are different, so the temperature difference thresholds corresponding to different temperature detection zone groups are also different. If the temperature difference corresponding to any temperature detection zone group does not meet the temperature difference threshold corresponding to the temperature detection zone group, it is determined that the Type-C port is overheating, and a comparison result indicating that the Type-C port is overheating is obtained.

[0143] For example, when T1 is the temperature of the temperature detection point where the temperature sensing component NTC1 is located, when T2 is the temperature of the temperature detection point where the temperature sensing component NTC2 is located, when T3 is the temperature of the temperature detection point where the temperature sensing component NTC3 is located, and when T4 is the temperature of the temperature detection point where the temperature sensing component NTC4 is located, if one of the following conditions exists, it is determined that the Type-C port is overheated:

[0144] ∣T1-T2∣>C1, ∣T3-T4∣>C1, ∣(T1+T2) / 2-(T3+T4) / 2∣>C2, ∣T1-T3∣>C3, ∣T2-T3∣>C3, ∣T1-T4∣>C3, ∣T2-T4∣>C3.

[0145] Among them, (T1+T2) / 2 is the regional temperature of the temperature detection area including the temperature detection point where the temperature sensing component NTC1 is located and the temperature detection point where the temperature sensing component NTC2 is located, and (T3+T4) / 2 is the regional temperature of the temperature detection area including the temperature detection point where the temperature sensing component NTC3 is located and the temperature detection point where the temperature sensing component NTC4 is located.

[0146] Step S308 : When it is determined according to the comparison result that the Type-C port is overheated, the protection component is controlled to ground the VBUS pin of the Type-C port.

[0147] When the signal processing unit determines that the Type-C port is overheated, that is, when the comparison result indicates that the Type-C port is overheated, it can generate a protection signal and transmit the protection signal to the protection component. The protection signal can be a signal for instructing the protection component to perform anti-burn protection for the Type-C port.

[0148] After receiving the protection signal, the protection component can ground the VBUS pin of the Type-C port so that the VBUS current is directly guided through the ground, thereby preventing the VBUS current from continuing to flow to the GND end, and further preventing further heating between VBUS and GND.

[0149] As an optional embodiment, before controlling the protection component to ground the VBUS pin of the Type-C port when the comparison results determine that the Type-C port is overheating, the method further includes: determining that the Type-C port is overheating if, based on the detection point temperature information of each temperature detection point, the detection point temperature of at least one temperature detection point is higher than a preset upper temperature limit. In other words, the signal processing unit may also determine the detection point temperature of each temperature detection point based on the detection point temperature information, and then compare each detection point temperature with the preset upper temperature limit. If at least one detection point temperature is higher than the preset upper temperature limit, the Type-C port is determined to be overheating. The method of this embodiment can protect the Type-C port even when the temperature difference between two corresponding temperature detection areas is small, but both are overheating. Furthermore, determining that the Type-C port is overheating when the detection point temperature of at least one temperature detection point is higher than the preset upper temperature limit can address the issue of slow triggering time due to the random distribution of hotspots and improve the degree of freedom of detection.

[0150] like Figure 5 As shown, as an optional implementation, the following steps S502 to S506 are performed to implement the control protection component in step S308 to ground the VBUS pin of the Type-C port:

[0151] Step S502, requesting a target voltage from the charger via the CC pin;

[0152] Step S504: When the target voltage is obtained, the target voltage is applied to the protection component, so as to ground the VBUS pin of the Type-C port through the protection component.

[0153] Step S506 , if the target voltage is not applied for within a preset time, applying a charging voltage to the protection component to ground the VBUS pin of the Type-C port through the protection component, wherein the charging voltage is higher than the target voltage.

[0154] In this embodiment, after determining that the Type-C port is overheating, protection is required. In this embodiment, the signal processing unit requests a target voltage from the charger via the CC pin. The target voltage can be a voltage that enables the protection component to operate normally. The protection component connects the VBUS pin to the ground terminal. When the Type-C port is operating normally, the protection component disconnects the VBUS pin from the ground terminal. Upon requesting the target voltage, the signal processing unit applies the target voltage as a protection signal to the protection component, causing the protection component to conduct under the target voltage, thereby grounding the VBUS pin of the Type-C port. For example, the protection component 12 can be a burn-in MOSFET. In this case, the target voltage can be a voltage that enables the burn-in MOSFET to operate normally, typically 5V. The signal processing unit 11 is connected to the gate of the burn-in MOSFET, the source of the burn-in MOSFET is grounded, and the drain of the burn-in MOSFET is connected to the VBUS pin. Applying the target voltage to the gate drives the source and drain of the burn-in MOSFET to conduct, thereby grounding the VBUS pin. This allows the current in the VBUS pin to be directly diverted through the ground, thereby protecting the Type-C port.

[0155] Furthermore, when the target voltage is not applied for more than the preset time, it means that the CC port is very likely to have been corroded and cannot be used normally, and the probability of corrosion of the entire Type-C port is also very high. Therefore, if the target voltage cannot be applied for a long time, the VBUS will be forcibly pulled to the ground through the anti-burn MOS. The preset time can be a pre-set upper limit for applying the target voltage through the CC port, for example, 300ms, 400ms, etc. When the target voltage is not applied for more than the preset time, in order to protect the Type-C interface in time and prevent it from burning, the charging voltage is directly applied to the protection component 12, so that the protection component 12 can be turned on under the drive of the charging voltage, and the VBUS pin of the Type-C port is grounded.

[0156] Through the method of steps S502 to S506, a target voltage can be applied to drive the protection component to ground the VBUS pin of the Type-C port, thereby protecting the Type-C port while ensuring the normal operation of the burn-out prevention MOS. In addition, even if the port is corroded, the Type-C port can still be protected from burning.

[0157] The method disclosed herein can obtain detection point temperature information of multiple temperature detection points through multiple temperature sensing components, so that the signal processing unit can determine the regional temperature of each temperature detection area based on the detection point temperature information of the multiple temperature detection points, and compare the regional temperatures of the corresponding two temperature detection areas to determine whether any of the two corresponding temperature detection areas is overheated. Compared with the method of detecting whether the temperature is too high in the related art, the device disclosed herein can determine whether the Type-C port is overheated by using the regional temperatures of the two corresponding temperature detection areas as a reference even if the regional temperature of the temperature detection area has not reached the temperature upper limit. Therefore, compared with the related art, the abnormality of the Type-C port can be identified in advance, thereby effectively overcoming the technical problem of low protection effect of the Type-C port anti-burning method in the related art.

[0158] like Figure 6 As shown, Figure 2 Taking the Type-C port anti-burning device shown in the figure as an example, a specific example of applying the method described in any of the above embodiments is provided:

[0159] S601: When a terminal equipped with a Type-C port uses an NTC as a temperature sensing component, periodically detect the temperatures of four NTCs located on the VBUS pin cable and the GND pin cable at both ends of the Type-C port. The temperatures corresponding to NTC1, NTC2, NTC3, and NTC4 are recorded as T1, T2, T3, and T4, respectively. That is, the temperatures of the four temperature detection points located on the VBUS pin cable and the GND pin cable are obtained: T1, T2, T3, and T4.

[0160] S602, based on the temperature of each detection point, calculate the regional temperature of each temperature detection area, and compare the temperatures of each area by calculating the difference between the temperatures of each area, that is, calculate the differences as shown below: |T1-T2|, |T3-T4|, |(T1+T2) / 2-(T3+T4) / 2|, |T1-T3|, |T2-T3|, |T1-T4|, |T2-T4|.

[0161] S603, determining whether the above difference satisfies the corresponding temperature difference, that is, determining whether the following requirements are met:

[0162] ∣T1-T2∣>C1, ∣T3-T4∣>C1, ∣(T1+T2) / 2-(T3+T4) / 2∣>C2, ∣T1-T3∣>C3, ∣T2-T3∣>C3, ∣T1-T4∣>C3, ∣T2-T4∣>C3.

[0163] S604 , when at least one difference satisfies the corresponding temperature difference and the target voltage is 5V, apply for 5V.

[0164] S605: It is detected that a 5V voltage is applied for or the duration of the 5V voltage application exceeds a preset duration (eg, 300ms).

[0165] S606 , when the protection component is an anti-burn MOS, the GPIO2 in the signal processing unit pulls up the gate of the anti-burn MOS based on the charging voltage to pull VBUS to ground through the anti-burn MOS.

[0166] S607: The terminal restarts and recovers.

[0167] Corresponding to the aforementioned embodiment of the Type-C port anti-burning method, the present disclosure also provides an embodiment of a Type-C port anti-burning device.

[0168] like Figure 7 As shown, the Type-C port anti-burning device includes:

[0169] An acquisition module 71 is configured to acquire detection point temperature information of each temperature detection point among a plurality of temperature detection points on a Type-C port;

[0170] a determination module 72 for determining a regional temperature of each temperature detection area based on the detection point temperature information of each temperature detection point, wherein each temperature detection area includes at least one temperature detection point;

[0171] A judgment module 73 is used to compare the regional temperatures of two corresponding temperature detection areas;

[0172] The control module 74 is configured to control the protection component to ground the VBUS pin of the Type-C port when it is determined based on the comparison result that the Type-C port is overheated.

[0173] As an optional implementation, the determining module 72 is configured to:

[0174] Determine the average value of the detection point temperature information of all temperature detection points included in each temperature detection area;

[0175] The average value corresponding to each temperature detection area is determined as the area temperature of each temperature detection area.

[0176] As an optional implementation, the judgment module 73 is configured to:

[0177] Determining at least one temperature detection area group among all the temperature detection areas, wherein the temperature detection area group includes two temperature detection areas corresponding to each other;

[0178] By calculating the temperature difference between the regional temperatures corresponding to the two temperature detection regions in each temperature detection region group, a temperature difference value corresponding to each temperature detection region group is determined;

[0179] When the temperature difference corresponding to any temperature detection area group does not meet the temperature difference threshold corresponding to any temperature detection area group, it is determined that the Type-C port is overheated.

[0180] As an optional implementation, the method further includes a second determining module configured to:

[0181] If it is determined according to the detection point temperature information of each temperature detection point that the detection point temperature of at least one temperature detection point is higher than the preset temperature upper limit, it is determined that the Type-C port is overheated.

[0182] As an optional implementation, the control module 74 is configured to:

[0183] Apply the target voltage to the charger through the CC pin;

[0184] When the target voltage is applied, the target voltage is applied to the protection component, so that the VBUS pin of the Type-C port is grounded through the protection component.

[0185] As an optional implementation, the control module 74 is further configured to:

[0186] Apply the target voltage to the charger through the CC pin;

[0187] If the target voltage is not applied for within a preset time, a charging voltage is applied to the protection component to ground the VBUS pin of the Type-C port through the protection component, wherein the charging voltage is higher than the target voltage.

[0188] Regarding the apparatus in the above embodiments, the specific manner in which each module performs operations has been described in detail in the embodiments of the relevant methods and will not be elaborated on here.

[0189] For the device embodiments, since they basically correspond to the method embodiments, the relevant parts can be referred to the partial description of the method embodiments. The device embodiments described above are merely illustrative, wherein the modules described as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical modules, that is, they may be located in one place, or they may be distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the disclosed solution. Those of ordinary skill in the art can understand and implement it without paying any creative work.

[0190] This specification also provides an electronic device, comprising:

[0191] processor;

[0192] a memory for storing processor-executable instructions;

[0193] The processor implements any of the above methods by running the executable instructions.

[0194] Figure 8 This is a schematic structural diagram of an electronic device provided by an exemplary embodiment. Figure 8 At the hardware level, the device includes a processor 802, an internal bus 804, a network interface 806, a memory 808, and a non-volatile memory 810. Of course, it may also include hardware required for other services. One or more embodiments of this specification can be implemented based on software, such as the processor 802 reading the corresponding computer program from the non-volatile memory 810 into the memory 808 and then running it. Of course, in addition to software implementation, one or more embodiments of this specification do not exclude other implementation methods, such as logic devices or a combination of software and hardware, etc., that is, the execution subject of the following processing flow is not limited to each logic unit, but can also be hardware or logic devices.

[0195] Among them, as mentioned above Figure 7 The device can be used for Figure 8 In the device shown, the technical solution as described above is implemented.

[0196] The devices, modules, or units described in the above embodiments may be implemented by computer chips or entities, or by products having certain functions. A typical implementation device is a computer, which may be in the form of a personal computer, laptop computer, cellular phone, camera phone, smartphone, personal digital assistant, media player, navigation device, email transceiver, game console, tablet computer, wearable device, or any combination of these devices.

[0197] In a typical configuration, a computer includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0198] Memory may include non-permanent storage in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. Memory is an example of a computer-readable medium.

[0199] This specification also provides a computer-readable storage medium having a computer program stored thereon, which implements the steps of any of the above methods when executed by a processor.

[0200] Computer-readable media include permanent and non-permanent, removable and non-removable media that can be used to store information using any method or technology. Information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassettes, disk storage, quantum memory, graphene-based storage media or other magnetic storage devices, or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer-readable media does not include transitory media such as modulated data signals and carrier waves.

[0201] Figure 9 1 is a schematic block diagram of a Type-C port anti-burn device 900 according to an embodiment of the present disclosure. For example, the device 900 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0202] Reference Figure 9 , the device 900 may include one or more of the following components: a processing component 902 , a memory 904 , a power component 906 , a multimedia component 908 , an audio component 910 , an input / output (I / O) interface 912 , a sensor component 914 , and a communication component 916 .

[0203] The processing component 902 generally controls the overall operation of the device 900, such as operations associated with display, phone calls, data communications, camera operation, and recording operations. The processing component 902 may include one or more processors 920 to execute instructions to perform all or part of the steps of the above-described method. In addition, the processing component 902 may include one or more modules to facilitate interaction between the processing component 902 and other components. For example, the processing component 902 may include a multimedia module to facilitate interaction between the multimedia component 908 and the processing component 902.

[0204] The memory 904 is configured to store various types of data to support the operations of the device 900. Examples of such data include instructions for any application or method operating on the device 900, contact data, phone book data, messages, pictures, videos, etc. The memory 904 can be implemented by any type of volatile or non-volatile storage device, or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk, or optical disk.

[0205] The power supply component 906 provides power to the various components of the device 900. The power supply component 906 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the device 900.

[0206] The multimedia component 908 includes a screen that provides an output interface between the device 900 and the user. In some embodiments, the screen may include a liquid crystal display and a touch panel (TP). If the screen includes a touch panel, the screen can be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, slides, and gestures on the touch panel. The touch sensor can not only sense the boundaries of the touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 908 includes a front camera and / or a rear camera. When the device 900 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera can receive external multimedia data. Each front camera and rear camera can be a fixed optical lens system or have a focal length and optical zoom capability.

[0207] The audio component 910 is configured to output and / or input audio signals. For example, the audio component 910 includes a microphone (MIC), which is configured to receive external audio signals when the device 900 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signal can be further stored in the memory 904 or transmitted via the communication component 916. In some embodiments, the audio component 910 also includes a speaker for outputting audio signals.

[0208] I / O interface 912 provides an interface between processing component 902 and peripheral interface modules, such as a keyboard, click wheel, buttons, etc. These buttons may include but are not limited to: a home button, volume buttons, a start button, and a lock button.

[0209] The sensor assembly 914 includes one or more sensors for providing various aspects of the status assessment of the device 900. For example, the sensor assembly 914 can detect the open / closed state of the device 900, the relative positioning of components, such as the display and keypad of the device 900. The sensor assembly 914 can also detect changes in the position of the device 900 or a component of the device 900, the presence or absence of user contact with the device 900, the orientation or acceleration / deceleration of the device 900, and temperature changes of the device 900. The sensor assembly 914 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 914 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 914 may also include an accelerometer, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0210] The communication component 916 is configured to facilitate wired or wireless communication between the device 900 and other devices. The device 900 can access a wireless network based on a communication standard, such as WiFi, 2G or 3G, 4G LTE, 5G NR or a combination thereof. In an exemplary embodiment, the communication component 916 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 916 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0211] In an exemplary embodiment, the apparatus 900 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the method described in any of the above embodiments.

[0212] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 904 including instructions, and the instructions can be executed by the processor 920 of the apparatus 900 to perform the above method. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0213] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.

[0214] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A Type-C port anti-burning device, characterized in that: include: A signal processing unit, a protection component, and multiple temperature sensing components respectively provided at multiple temperature detection points of the Type-C port; The plurality of temperature sensing components are respectively connected to the signal processing unit, and are used to obtain detection point temperature information of each temperature detection point of the plurality of temperature detection points, and transmit the detection point temperature information to the signal processing unit; The signal processing unit is connected to the protection component and is configured to determine the regional temperature of each temperature detection area based on the detection point temperature information of each temperature detection point, compare the regional temperatures of two corresponding temperature detection areas, and generate a protection signal when it is determined that the Type-C port is overheated according to the comparison result, and transmit the protection signal to the protection component, wherein each temperature detection area includes at least one temperature detection point; The protection component is configured to ground the VBUS pin of the Type-C port in response to the protection signal.

2. The Type-C port anti-burning device according to claim 1, characterized in that: There are at least two temperature sensing components, and the multiple temperature detection points include at least a first temperature detection point and a second temperature detection point. The first temperature detection point is located between the GND pin cable and the VBUS pin cable on one side of the Type-C port, and the second temperature detection point is located between the GND pin cable and the VBUS pin cable on the other side of the Type-C port.

3. The Type-C port anti-burning device according to claim 1, characterized in that: There are 4 temperature sensing components; There are four temperature detection points, which are respectively located at the two GND pin wirings of the Type-C port and the two VBUS pin wirings of the Type-C port.

4. The Type-C port anti-burning device according to claim 3, characterized in that: For any pin cable, a distance between a temperature detection point on the pin cable and a pin to which the pin cable is connected is within a preset distance range, wherein the pin cables include: the GND pin cable and the VBUS pin cable.

5. The Type-C port anti-burning device according to claim 1, characterized in that: The temperature sensing component includes a thermistor.

6. The Type-C port anti-burning device according to claim 1, characterized in that: The signal processing unit is further configured to: Determine the detection point temperature of each temperature detection point according to the detection point temperature information of each temperature detection point; Determine the average temperature of all temperature detection points in each temperature detection area; The average value corresponding to each temperature detection area is determined as the area temperature of each temperature detection area.

7. The Type-C port anti-burning device according to claim 1, characterized in that: The signal processing unit is further configured to: Determining at least one temperature detection area group among all the temperature detection areas, wherein the temperature detection area group includes two temperature detection areas corresponding to each other; Determine the temperature difference value corresponding to each temperature detection area group by calculating the temperature difference between the area temperatures corresponding to the two temperature detection areas in each temperature detection area group; When the temperature difference corresponding to any temperature detection area group does not meet the temperature difference threshold corresponding to any temperature detection area group, it is determined that the Type-C port is overheated.

8. The Type-C port anti-burning device according to claim 1, characterized in that: The signal processing unit is further configured to: If it is determined according to the detection point temperature information of each temperature detection point that the detection point temperature of at least one of the temperature detection points is higher than a preset temperature upper limit, it is determined that the Type-C port is overheated.

9. The Type-C port anti-burning device according to claim 1, characterized in that: The signal processing unit is further configured to apply a target voltage to the charger end through the CC pin; and when the target voltage is applied, apply the target voltage as the protection signal to the protection component; The protection component is further configured to conduct according to the target voltage and ground the VBUS pin of the Type-C port.

10. The Type-C port anti-burning device according to claim 1, characterized in that: The signal processing unit is further configured to apply a target voltage to the charger terminal via the CC pin, and if the target voltage is not applied for over a preset time period, apply a charging voltage as the protection signal to the protection component, wherein the charging voltage is higher than the target voltage; The protection component is further configured to conduct according to the charging voltage and ground the VBUS pin of the Type-C port.

11. A method for preventing Type-C port from burning, characterized in that: include: Obtaining detection point temperature information of each temperature detection point among multiple temperature detection points on the Type-C port; Determining the regional temperature of each temperature detection area according to the detection point temperature information of each temperature detection point, wherein each temperature detection area includes at least one temperature detection point; Compare the regional temperatures of the two corresponding temperature detection areas; When it is determined according to the comparison result that the Type-C port is overheated, the protection component is controlled to ground the VBUS pin of the Type-C port.

12. The Type-C port anti-burning method according to claim 11, characterized in that: The determining of the regional temperature of each temperature detection area according to the detection point temperature information of each temperature detection point includes: Determine the detection point temperature of each temperature detection point according to the detection point temperature information of each temperature detection point; Determine the average temperature of all temperature detection points in each temperature detection area; The average value corresponding to each temperature detection area is determined as the area temperature of each temperature detection area.

13. The Type-C port anti-burning method according to claim 11, characterized in that: The comparing of the regional temperatures of the two corresponding temperature detection regions includes: Determining at least one temperature detection area group among all the temperature detection areas, wherein the temperature detection area group includes two temperature detection areas corresponding to each other; Determine the temperature difference value corresponding to each temperature detection area group by calculating the temperature difference between the area temperatures corresponding to the two temperature detection areas in each temperature detection area group; When the temperature difference corresponding to any temperature detection area group does not meet the temperature difference threshold corresponding to any temperature detection area group, it is determined that the Type-C port is overheated.

14. The Type-C port anti-burning method according to claim 11, characterized in that: Before controlling the protection component to ground the VBUS pin of the Type-C port when it is determined that the Type-C port is overheated according to the comparison result, the method further includes: If it is determined according to the detection point temperature information of each temperature detection point that the detection point temperature of at least one of the temperature detection points is higher than a preset temperature upper limit, it is determined that the Type-C port is overheated.

15. The Type-C port anti-burning method according to claim 11, characterized in that: The control protection component grounds the VBUS pin of the Type-C port, including: Apply the target voltage to the charger through the CC pin; When the target voltage is applied, the target voltage is applied to the protection component, so that the VBUS pin of the Type-C port is grounded through the protection component.

16. The Type-C port anti-burning method according to claim 11, characterized in that: The control protection component grounds the VBUS pin of the Type-C port, including Apply the target voltage to the charger through the CC pin; If the target voltage is not applied for over a preset time period, a charging voltage is applied to the protection component to ground the VBUS pin of the Type-C port through the protection component, wherein the charging voltage is higher than the target voltage.

17. A Type-C port anti-burning device, characterized in that: include: an acquisition module, configured to acquire detection point temperature information of each temperature detection point among a plurality of temperature detection points on the Type-C port when the Type-C port is connected to a power source; a determination module, configured to determine the regional temperature of each temperature detection area based on the detection point temperature information of each temperature detection point, wherein each temperature detection area includes at least one temperature detection point; A comparison module is used to compare the regional temperatures of two corresponding temperature detection areas; The control module is used to control the protection component to ground the VBUS pin of the Type-C port when it is determined that the Type-C port is overheated according to the comparison result.

18. An electronic device, characterized in that: include: processor; a memory for storing processor-executable instructions; The processor is configured to implement the method according to any one of claims 11 to 16.

19. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the steps of the method according to any one of claims 11 to 16 are implemented.

20. A Type-C port, characterized in that: The device comprises the Type-C port anti-burning device according to any one of claims 1 to 10.

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