Block coil

Abstract

An electronic module includes: a substrate or a lead frame including a conductive pattern; a magnetic core on or above the substrate or the lead frame; a first block coil and a second block coil connected by a bridge to define a single integral assembly, each of the first block coil and the second block coil includes a resin body on or above the substrate or the lead frame and extending above the magnetic core, and a first terminal on or embedded in the resin body and connected to the conductive pattern; an electronic component on the substrate or the lead frame; and an insulating material covering the substrate or the lead frame, the magnetic core, and the bulk coil.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Patent Application No. 63 / 571,525, filed on March 29, 2024. The entire contents of that application are incorporated herein by reference. Technical Field

[0002] The present invention relates to a block coil. More particularly, the present invention relates to a block coil that can be attached to a substrate or a lead frame and can be used in a magnetic assembly or an electronic module. Background Art

[0003] It is known to use windings comprising terminals extending over the core. Since there is no structure to support the terminals, there is a risk that the terminals may short-circuit or fall sideways. Summary of the Invention

[0004] To overcome the aforementioned issues, exemplary embodiments of the present invention provide a block-shaped coil comprising a resin body and terminals on or within the resin body, thereby eliminating or significantly reducing the risk of short circuits and terminal detachment caused by the block-shaped coil. The magnetic core may include one or more gaps. These gaps improve the power handling capability of the magnetic core by delaying core saturation.

[0005] According to an example embodiment of the present invention, an electronic module includes: a substrate or a lead frame, which includes a primary conductive pattern and a secondary conductive pattern; a magnetic core located on or above the substrate or the lead frame; a block coil including: a resin body located on or above the substrate or the lead frame and including a first leg, a second leg, a third leg, and a fourth leg extending above the magnetic core; a first terminal on or embedded in the first and second legs, such that the first terminal extends above the magnetic core and is connected to the primary conductive pattern; and a second terminal on or embedded in the third and fourth legs, such that the second terminal extends above a second portion of the magnetic core and is connected to the secondary conductive pattern; and an electronic component located on the substrate or the lead frame.

[0006] The block coil may include an additional first terminal and an additional second terminal; the first terminal and the additional first terminal may define a first terminal group; and the second terminal and the additional second terminal may define a second terminal group. Each terminal in the first terminal group may be connected to a corresponding primary conductive pattern; and each terminal in the second terminal group may be connected to a corresponding secondary conductive pattern. The first terminal group may be located adjacent to and spaced apart from the second terminal group.

[0007] The substrate or lead frame may include a first layer and a second layer. A primary conductive pattern may be in the first layer; a secondary conductive pattern may be in the second layer; and a portion of the primary conductive pattern and a portion of the secondary conductive pattern may vertically overlap when viewed from a side view of the substrate. The electronic module may further include an additional primary conductive pattern in a third layer of the substrate and an additional secondary conductive pattern in a fourth layer of the substrate, wherein a portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern may vertically overlap when viewed from a side view of the substrate.

[0008] The electronic module may further include an insulating material covering a substrate or lead frame, a magnetic core, and a bulk coil. The electronic components may include an integrated circuit (IC) and / or a capacitor. The bulk coil may include an inner tapered portion connected to the magnetic core.

[0009] According to an example embodiment of the present invention, an electronic module includes: a substrate or lead frame, the substrate or lead frame including a conductive pattern; a magnetic core located on or above the substrate or lead frame; a first block coil and a second block coil connected by a bridge to define a single integral component, each of the first block coil and the second block coil including a resin body located on or above the substrate or lead frame and extending above the magnetic core, and including a first terminal on or embedded in the resin body and connected to the conductive pattern; an electronic component located on the substrate or lead frame; and an insulating material covering the substrate or lead frame, the magnetic core, and the block coils.

[0010] The conductive pattern may be a primary conductive pattern, and the first terminal of the first block coil may be connected only to the primary conductive pattern. The conductive pattern may be a secondary conductive pattern, and the first terminal of the second block coil may be connected only to the secondary conductive pattern. The block coil may include an inner tapered portion connected to the magnetic core.

[0011] The first block coil may include a first terminal group and a second terminal group, and the first terminal of the first block coil may be included in the first terminal group. Each terminal in the first terminal group may be connected to a corresponding primary conductive pattern, and each terminal in the second terminal group may be connected to a corresponding secondary conductive pattern. Each terminal in the first terminal group and each terminal in the second terminal group may be connected to a corresponding primary conductive pattern. Each terminal in the first terminal group and each terminal in the second terminal group may be connected to a corresponding secondary conductive pattern. The first terminal group may be located next to the second terminal group and spaced apart from the second terminal group.

[0012] The substrate or lead frame may include a first layer and a second layer. The electronic module may further include a primary conductive pattern in the first layer and a secondary conductive pattern in the second layer, wherein a portion of the primary conductive pattern and a portion of the secondary conductive pattern may vertically overlap when viewed from a side view of the substrate. The electronic module may further include an additional primary conductive pattern in a third layer of the substrate and an additional secondary conductive pattern in a fourth layer of the substrate, wherein a portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern may vertically overlap when viewed from a side view of the substrate.

[0013] The electronic components may include integrated circuits (ICs) and / or capacitors.

[0014] According to an example embodiment of the present invention, a magnetic component includes: a substrate or a lead frame, which includes a primary conductive pattern and a secondary conductive pattern; a magnetic core located on or above the substrate or the lead frame; a block coil including: a resin body located on or above the substrate or the lead frame and including a first leg, a second leg, a third leg, and a fourth leg extending above the magnetic core; a first terminal on or embedded in the first and second legs, such that the first terminal extends over the magnetic core and is connected to the primary conductive pattern; and a second terminal on or embedded in the third and fourth legs, such that the second terminal extends over a second portion of the magnetic core and is connected to the secondary conductive pattern; and an insulating material covering the substrate or the lead frame, the magnetic core, and the block coil.

[0015] The magnetic core may be located on a substrate or lead frame. The magnetic core may be located above the substrate or lead frame and may be attached to the inner upper surface of the block coil. The magnetic assembly may also include a coating covering the magnetic core.

[0016] The block coil may include an additional first terminal and an additional second terminal; the first terminal and the additional first terminal may define a first terminal group; and the second terminal and the additional second terminal may define a second terminal group. Each terminal in the first terminal group may be connected to a corresponding primary conductive pattern, and each terminal in the second terminal group may be connected to a corresponding secondary conductive pattern. The first terminal group may be located adjacent to and spaced apart from the second terminal group.

[0017] The substrate or lead frame may include a first layer and a second layer; the primary conductive pattern may be in the first layer; the secondary conductive pattern may be in the second layer; and a portion of the primary conductive pattern and a portion of the secondary conductive pattern may vertically overlap when viewed from a side view of the substrate or lead frame. The magnetic assembly may further include an additional primary conductive pattern in a third layer of the substrate or lead frame and an additional secondary conductive pattern in a fourth layer of the substrate or lead frame, wherein a portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern may vertically overlap when viewed from a side view of the substrate or lead frame.

[0018] The block coil may include an inner tapered portion connected to the magnetic core.

[0019] According to an example embodiment of the present invention, a magnetic component includes: a substrate or lead frame, the substrate or lead frame including a first layer and a conductive pattern; a magnetic core located on or above the substrate or lead frame; a first block coil and a second block coil connected by a bridge to define a single integral component, each of the first block coil and the second block coil including: a resin body located on or above the substrate or lead frame and extending above the magnetic core; and a first terminal on or embedded in the resin body and connected to the conductive pattern; and an insulating material covering the substrate or lead frame, the magnetic core and the block coil.

[0020] The magnetic core may be located on a substrate or a lead frame. The magnetic core may be located above the substrate or the lead frame and may be attached to an inner upper surface of the first block coil and / or the second block coil. The magnetic assembly may further include a coating covering the magnetic core.

[0021] The magnetic component may further include a primary conductive pattern and a secondary conductive pattern, wherein the first terminal of the first block coil may be connected only to the primary conductive pattern, and wherein the first terminal of the second block coil may be connected only to the secondary conductive pattern. The block coil may include an inner tapered portion connected to the magnetic core. The first block coil may include a first terminal group and a second terminal group; the first terminal of the first block coil may be included in the first terminal group; each terminal in the first terminal group may be connected to a corresponding primary conductive pattern; and each terminal in the second terminal group may be connected to a corresponding secondary conductive pattern. The first terminal group may be located next to the second terminal group and spaced apart from the second terminal group. The magnetic component may further include a primary conductive pattern in a first layer of a substrate or lead frame and a secondary conductive pattern in a second layer of the substrate or lead frame, wherein, from a side view of the substrate or lead frame, a portion of the primary conductive pattern and a portion of the secondary conductive pattern may vertically overlap. The magnetic component may further include an additional primary conductive pattern in a third layer of the substrate or lead frame and an additional secondary conductive pattern in a fourth layer of the substrate or lead frame, wherein a portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern may vertically overlap as viewed from a side view of the substrate.

[0022] According to an exemplary embodiment of the present invention, an electronic module includes: a substrate or lead frame including a primary conductive pattern and a secondary conductive pattern; a magnetic core located on or above the substrate or lead frame; a block coil including: a resin body located on or above the substrate or lead frame and including a first leg, a second leg, a third leg, and a fourth leg extending above the magnetic core; first terminals defining a first terminal group and being located on or embedded in the first and second legs such that the first terminals extend above the magnetic core; and second terminals defining a second terminal group and being located on or embedded in the third and fourth legs such that the second terminals extend above a second portion of the magnetic core; an integrated circuit located on the substrate or lead frame; and a capacitor located on the substrate or lead frame. Two first terminals of the first terminal group are connected to corresponding primary conductive patterns; two second terminals of the second terminal group are connected to corresponding secondary conductive patterns; and the first primary conductive pattern is closer to the second primary conductive pattern than any secondary conductive pattern.

[0023] Each first terminal in the first terminal group can be connected to a corresponding primary conductive pattern, and each second terminal in the second terminal group can be connected to a corresponding secondary conductive pattern. The first terminal group can be located next to the second terminal group and spaced apart from the second terminal group.

[0024] The substrate or lead frame may include a first layer and a second layer. A primary conductive pattern may be in the first layer; a secondary conductive pattern may be in the second layer; and a portion of the primary conductive pattern may vertically overlap with a corresponding portion of the secondary conductive pattern when viewed from a side view of the substrate. The electronic module may further include an additional primary conductive pattern in a third layer of the substrate and an additional secondary conductive pattern in a fourth layer of the substrate, wherein a portion of the additional primary conductive pattern may vertically overlap with a corresponding portion of the additional secondary conductive pattern when viewed from a side view of the substrate.

[0025] The electronic module may further include an insulating material covering a substrate or lead frame, a magnetic core, and a block coil. The electronic module may include a substrate, and the substrate may include vias. The magnetic core may be located on or above a first surface of the substrate or lead frame, and the capacitor may be located on a second surface of the substrate or lead frame opposite the first surface. The electronic module may further include a coating covering the magnetic core. The block coil may include an inner tapered portion connected to the magnetic core.

[0026] According to an exemplary embodiment of the present invention, an electronic module includes: a substrate or lead frame including a primary conductive pattern and a secondary conductive pattern; a magnetic core located on or above the substrate or lead frame; a first block coil and a second block coil connected by a bridge to define a single integral component, each of the first block coil and the second block coil including a resin body located on or above the substrate or lead frame and extending above the magnetic core, first terminals defining a first terminal group and located on or embedded in the resin body, and second terminals defining a second terminal group and located on or embedded in the resin body; an IC located on the substrate or lead frame; and a capacitor located on the substrate or lead frame. Two first terminals of the first terminal group are connected to corresponding primary conductive patterns; two second terminals of the second terminal group are connected to corresponding secondary conductive patterns; and the first primary conductive pattern is closer to the second primary conductive pattern than any secondary conductive pattern.

[0027] Each first terminal in the first terminal group can be connected to a corresponding primary conductive pattern, and each second terminal in the second terminal group can be connected to a corresponding secondary conductive pattern. The first terminal group can be located next to the second terminal group and can be spaced apart from the second terminal group.

[0028] The substrate or lead frame may include a first layer and a second layer. A primary conductive pattern may be in the first layer; a secondary conductive pattern may be in the second layer; and a portion of the primary conductive pattern may vertically overlap with a corresponding portion of the secondary conductive pattern when viewed from a side view of the substrate. The electronic module may further include an additional primary conductive pattern in a third layer of the substrate and an additional secondary conductive pattern in a fourth layer of the substrate, wherein a portion of the additional primary conductive pattern may vertically overlap with a corresponding portion of the additional secondary conductive pattern when viewed from a side view of the substrate.

[0029] The electronic module may further include an insulating material covering a substrate or lead frame, a magnetic core, and a block coil. The electronic module may include a substrate, and the substrate may include vias. The magnetic core may be located on or above a first surface of the substrate or lead frame, and the capacitor may be located on a second surface of the substrate or lead frame opposite the first surface. The electronic module may further include a coating covering the magnetic core. The block coil may include an inner tapered portion connected to the magnetic core.

[0030] The above and other features, elements, characteristics, steps and advantages of the present invention will become more apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a top perspective view of the block coil mounted on the substrate of the magnetic assembly.

[0032] Figure 2 yes Figure 1 Top view of the block coil mounted on the magnetic assembly’s PCB.

[0033] Figure 3 In the electronic module Figure 1 Top perspective view of the block coil mounted on the magnetic assembly's PCB.

[0034] Figure 4 yes Figure 3 A top perspective view of the electronics module, with insulation covering the coil block.

[0035] Figure 5 yes Figure 3 Top view of an electronic module.

[0036] Figure 6 yes Figure 1 A top perspective view of the block coil.

[0037] Figure 7 yes Figure 1 Bottom perspective view of the block coil.

[0038] Figure 8is a top perspective view of a block coil with terminals having different widths.

[0039] Figure 9 Shows that it can be used for Figure 3 Top view of the different layers of the PCB of an electronic module.

[0040] Figure 10 yes Figure 4 A partial cross-section of an electronic module, where insulation material covers the block-shaped coil.

[0041] Figures 11 to 15 It shows the manufacturing Figure 3 A perspective view of an approach to an electronic module.

[0042] Figure 16 This is a cross-sectional view of a block coil mounted on a single-layer substrate of an electronic component.

[0043] Figure 17 yes Figure 16 Top view of the top layer of the substrate.

[0044] Figure 18 is a cross-sectional view of a magnetic assembly showing various distances.

[0045] Figure 19 is a top perspective view of the block coil mounted to the lead frame of the magnetic assembly.

[0046] Figure 20 yes Figure 19 Side cross-sectional view of a block coil mounted to the lead frame of a magnetic assembly.

[0047] Figure 21 yes Figure 19 Bottom perspective view of the block coil mounted to the lead frame of the magnetic assembly.

[0048] Figure 22 yes Figure 20 Top perspective view of the partially assembled magnetic assembly.

[0049] Figure 23 yes Figure 20 A top perspective view of the magnetic assembly, with insulation covering the coil block.

[0050] Figure 24 An EE or EI core that can be used for three block coils is shown.

[0051] Figure 25 A rod-shaped core is shown that can be used for a single block coil.

[0052] Figures 26 to 31 Shows that it can be used for Figure 1 Magnetic components and Figure 3Example substrate for an electronic module.

[0053] Figure 32 A top view of an electronic module with a gap in the magnetic core.

[0054] Figure 33 A gapped EE or EI core that can be used for three block coils is shown.

[0055] Figure 34 is a top perspective view of a block coil having four legs and a magnetic core mounted to the block coil.

[0056] Figure 35 yes Figure 34 Bottom perspective view of the block coil and core.

[0057] Figure 36 yes Figure 34 Side view of the block coil and core.

[0058] Figure 37 is a top perspective view of another block coil having four legs and a magnetic core mounted to the block coil.

[0059] Figure 38 yes Figure 37 Bottom perspective view of the block coil and core.

[0060] Figure 39 yes Figure 37 Side view of the block coil and core.

[0061] Figure 40 Includes mounting to the baseboard Figure 37 Cross-sectional view of the magnetic assembly including the block coil.

[0062] Figure 41 is a top perspective view of a block coil with a magnetic core molded into the block coil.

[0063] Figure 42 yes Figure 41 A top perspective view of a block coil, where the block coil is transparent.

[0064] Figure 43 and Figure 44 yes Figure 41 A side view of a block coil, where the block coil is transparent.

[0065] Figure 45 It can be used for Figure 41 A top perspective view of the terminal strips of the block coil.

[0066] Figure 46 With a magnetic core Figure 45 Top perspective view of the terminal strip.

[0067] Figure 47 It can be used for Figure 41 A top perspective view of another terminal strip of the block coil.

[0068] Figure 48 With a magnetic core Figure 47 Top perspective view of the terminal strip.

[0069] Figure 49 yes Figure 48 A side perspective view of a terminal strip, where the core is transparent. DETAILED DESCRIPTION

[0070] Figure 1 and Figure 2 A magnetic assembly 100 is shown, which includes a substrate 20 , a magnetic core 30 and two block coils 10 . Figures 3 to 5 An electronic module 200 is shown, which includes Figure 1 The magnetic component 100 and the additional electronic component 50. Figures 1 to 5 Two bulk coils 10 are shown in FIG. 1 , but any number of bulk coils 10 , including a single bulk coil 10 , may be used.

[0071] The magnetic assembly 100 may include one or more windings wound around the magnetic core 30. For example, the magnetic assembly 100 may include a primary winding and a secondary winding both extending around the magnetic core 30. Each winding may include one or more terminals 11 in one or more block coils 10 and may include one or more traces or conductive patterns 23 on or in the substrate 20. Figure 32 As shown, the magnetic core 30 may include a gap 37 .

[0072] Substrate 20 may be any suitable substrate, including, for example, a printed circuit board (PCB). Substrate 20 may include a single layer or multiple layers and may include traces or conductive patterns 23 on the outer surfaces (i.e., the top and bottom surfaces) of substrate 20 and / or within substrate 20 (i.e., on an inner layer of substrate 20). If substrate 20 includes a single layer, traces or conductive patterns 23 for both the primary and secondary windings may be located on the same layer, such as on the top surface of substrate 20. If substrate 20 includes multiple layers, traces or conductive patterns 23 for the primary and secondary windings may be located on the same layer or on different layers. Figure 9 Four possible layers of substrate 20 are shown. Although Figure 9 Four layers are shown in , but any number of layers, including one, may be used.

[0073] like Figure 3 (exist Figure 3 , the insulating material 40 is shown as transparent) and Figure 4 (exist Figure 4 As shown in FIG. 2 , the insulating material 40 is opaque, the insulating material 40 may be applied to the electronic module 200 to cover the substrate 20, the magnetic core 30, the two block coils 10, and any additional electronic components 50. Any suitable insulating material 40 may be used, including, for example, a molding compound or epoxy resin. The insulating material 40 may be applied in any suitable manner. The insulating material 40 may improve and help maintain isolation between the primary and secondary circuits of the magnetic assembly 100. The insulating material 40 may also be applied to Figure 1 The magnetic component 100.

[0074] exist Figure 1 and Figure 2 In the embodiment, no additional electronic components 50 are shown on the substrate 20, but as shown in FIG. Figure 3 and Figure 5 As shown in the electronic module 200, the substrate 20 may include additional electronic components 50. The electronic components 50 may be active components, such as transistors, integrated circuits (ICs), etc., or may be passive components, such as resistors, capacitors, inductors, etc. The electronic components 50 may be connected to the same surface as the magnetic core 30, such as Figure 3 and Figure 5 As shown, and / or may be connected to a surface (not shown) opposite the magnetic core 30. For example, positioning the capacitor on the surface of the substrate 20 opposite the magnetic core 30 may contribute to (i) "miniaturization" of the electronic module 200 and (ii) preventing or significantly reducing short circuits.

[0075] The electronic module 200 may be, for example, a power converter, an isolator, or a transformer, and the electronic assembly 50 may be a component of the power converter, isolator, or transformer. The electronic module 200 may be any suitable power converter, including, for example, a DC-DC converter or an AC-DC converter. For example, if the electronic module 200 is an isolated DC-DC converter, then, for example, Figure 3 and Figure 5 As shown, electronic components 50 of primary circuit 21 on a first side of the isolation barrier may be located at one end of the substrate, and electronic components 50 of secondary circuit 22 on a second side of the isolation barrier may be located at an opposite end of substrate 20 .

[0076] Figure 16 Shown with Figure 1 and Figure 2 Similar magnetic assembly 100, but Figure 16 The substrate 20 in the embodiment includes a single-layer substrate.

[0077] exist Figure 9, the first layer of the substrate 20 shows the top surface of the electronic module 200, wherein the magnetic core 30 can be located on the top surface and the block coil 10 and the electronic component 50 can be attached to the top surface. The first layer can include traces or conductive patterns 23 connecting the electronic component 50. The traces 23 of the primary winding (i.e., primary traces or primary conductive patterns) and the traces 23 of the secondary winding (i.e., secondary traces or secondary conductive patterns) can be as shown. Figure 9 The primary traces 23 and the secondary traces 23 are shown as being on different layers of the substrate 20, or may be on the same layer of the substrate 20. For example, the primary traces 23 may be on the third layer of the substrate 20, and the secondary traces 23 may be on the first layer. The primary traces 23 and the secondary traces 23 may be separated by one or more layers. Figure 9 In FIG, the primary trace 23 and the secondary trace 23 are separated by the second layer of the substrate 20. Figure 10 In the cross-sectional view of , the primary trace 23 and the secondary trace 23 are separated by three film layers, with a total spacing of 0.15 mm. Figure 9 The shaded area in FIG is a forbidden area, but other forbidden area arrangements are also feasible. For example, the area between the legs 12 of the terminal 11 of the block coil 10 on the first layer can also be used as a forbidden area, such as Figure 10 As shown, it includes a keep-out zone with a minimum width of 0.4 mm between block coils 10. The outer layer of substrate 20 may include input / output (I / O) terminals P1, P2, P3, and P4, which can be used to connect electronic module 200 to a host substrate (not shown). I / O terminals P1 and P2 can be connected to an input voltage, while I / O terminals P3 and P4 can provide an output voltage.

[0078] like Figure 9 As shown, one or more terminals 11 of each block coil 10 can be connected to a trace 23. For example, in one of the block coils 10, a single secondary trace 23 can connect the leg of one secondary terminal 11 to the leg of another secondary terminal 11 to define a single turn of the secondary winding, or in one of the block coils 10, a primary trace 23 can connect the legs 12 of three primary terminals 11 to the legs 12 of three other primary terminals 11 to define a single turn of the primary winding. In other words, a single turn of the winding can include one or more terminals 11 connected by a single trace 23. Figure 17 2 shows a possible circuit arrangement of an electronic module 200 comprising (a) a single layer substrate 20 or (b) a multi-layer substrate 20 with the electronic components 50 and all traces 23 on the top surface of the substrate 20. Figure 9As shown, one or more terminals 11 of each block coil 10 can be connected to a trace 23. Traces 23 on substrate 20 can determine how many terminals 11 are included in a single turn and how many turns are in the primary or secondary winding. Therefore, the same block coil 10 can be used for different applications, which can save design costs because a different block coil 10 does not have to be made for each application.

[0079] The core 30 may have any suitable shape, including Figures 1 to 3 and Figure 5 , or other suitable shapes, such as Figure 24 The EI or EE core 31 shown in Figure 25 The straight or rod-shaped core 32 shown in , the elliptical core, the non-circular core, the irregular shaped core (not shown), etc. The cores 30, 31, 32 may include any suitable magnetic material, including, for example, ferrite. The cores 30, 31, 32 may be coated or uncoated. Coating the cores 30, 31, 32 may improve isolation. The coating may be any suitable material, including, for example, epoxy, polyimide, etc. The cores 30, 31, 32 may be attached to the substrate 20 or the block coil 10. If the cores 30, 31, 32 are attached to the block coil 10, the cores 30, 31, 32 may be attached to the inner upper surface of the block coil 10. As Figure 32 As shown, the core 30 may include a gap 37, and as shown Figure 33 As shown, the core 31 may include two gaps 38. Although Figure 32 A gap 37 is shown, and Figure 33 Two gaps 38 are shown, but any number of gaps may be used. The cores 30, 31 may be manufactured with the gaps 37, 38, or the gaps 37, 38 may be manufactured in the cores 30, 31 after the cores 30, 31 are manufactured, for example by cutting or sawing.

[0080] In some applications including, for example, DC-DC or AC-DC converters, one or more gaps 37 , 38 may be used to control the inductance of the magnetic cores 30 , 31 . Figure 32 and Figure 33 The gaps 37, 38 shown in FIG. 3 are air gaps that increase the power handling capability of the cores 30, 31 by delaying core saturation, which causes the cores 30, 31 to lose their magnetic properties.

[0081] The location of gaps 37, 38 relative to the windings (including terminals 11 in block coil 10) can affect the performance of the converter. If gaps 37, 38 are close to the windings (including terminals 11 in block coil 10), a phenomenon known as "edge effect" can induce eddy currents in the windings (including terminals 11 in block coil 10), which can result in power losses. Therefore, if Figure 32 and Figure 33 As shown, since the gaps 37 and 38 can be separated from the windings, the influence caused by the fringing field is limited, thereby reducing power loss. Since the position of the gaps 37 and 38 can be precisely controlled, the power loss can be continuously reduced.

[0082] Figure 6 、 Figure 7 and Figures 34 to 44 FIG. 1 shows an example of a block-shaped coil 10. The block-shaped coil 10 may include a resin body 17 and a terminal 11. Figure 6 and Figure 7 As shown, the resin body 17 may include two legs 13 connected by a bridge 14 to define a cavity or recess 16 that receives a portion of the magnetic core 30 .

[0083] although Figure 6 、 Figure 7 and Figures 41 to 44 Two legs 13 are shown extending from the bridge 14 , but the number of legs 13 extending from the bridge 14 may vary. Figures 41 to 44 The block coil 10 in FIG. 1 can be molded so that the legs 13 extend from the bridge 14 and connect below the magnetic assembly. Figures 34 to 40 As shown, four legs 13 may extend from the bridge member 14. In other words, Figures 34 to 40 The following block coil 10 is shown, wherein: Figure 6 and Figure 7 The two block coils 10 are connected by a bridge 14 to be combined into a single integral component. Figures 34 to 40 The block coil 10 in the embodiment may include a monolithic body defined by four legs 13, a bridge 14, and a protrusion 18, wherein the four legs 13, the bridge 14, and the protrusion 18 may be made of the same material. The terminal 11 may be connected to and / or held by the monolithic body.

[0084] like Figure 6 、 Figure 7 and Figures 37 to 39 As shown, the legs 13 may have the same length or substantially the same length within manufacturing and / or measurement tolerances, or as shown Figures 34 to 36 As shown, the legs 13 can have different lengths. Figures 41 to 44 In the embodiment of the present invention, the circumference of the outer leg 13 is greater than the circumference of the inner leg 13.

[0085] The resin body 17 may define a U-shape or may have any suitable shape such that the resin body 17 extends over or bridges the magnetic core 30. The resin body 17 may extend over three sides of a cross section of the magnetic core 30. Figure 6 、 Figure 7 、 Figures 37 to 36 and Figures 41 to 44As shown, the legs may be straight, ie, perpendicular or substantially perpendicular to the bridge member 14 within manufacturing and / or measurement tolerances, or as shown. Figures 37 to 39 As shown, the legs 13 may be inclined, ie, the legs 13 are not perpendicular to the bridge 14, so that the resin body 17 defines a tapered portion. Figures 37 to 39 As shown, the bridge 14 may include a protrusion 18 that extends into the bore of the core 30 .

[0086] exist Figure 6 and Figure 7 In the embodiment, the resin body 17 may be open, that is, the resin body 17 may include an opening at an end of the resin body 17 so that the block coil 10 extends only over a portion of the magnetic core 30. The block coil 10 may have a different shape from the magnetic core 30. For example, Figure 1 and Figure 2 As shown, the block coil 10 may have a linear or rectangular shape, and the magnetic core 30 may have a circular or annular shape. Figures 41 to 44 As shown, the resin body 17 may be closed, that is, the resin body 17 defines a loop without ends, so that the block coil 10 extends over the entire magnetic core 30. Even if the resin body 17 is closed to define a loop as described above, the resin body 17 may include an opening at the bottom so that the resin body 17 can be placed over the magnetic core 30. The block coil 10 and the magnetic core 30 may have the same or similar shapes. For example, Figures 41 to 44 As shown, the block coil 10 and the magnetic core 30 may have a circular or annular shape.

[0087] The resin body 17 may include a slot 15 in which the terminal 11 may be located or embedded, and the resin body 17 may define a flat pick surface that a pick and place machine may use to accurately place the block coil 10 on the substrate 20 in a single motion. That is, a multi-turn winding may be produced with a single motion. In addition, the block coil 10 provides a structure that protects the terminal 11 and prevents or greatly reduces the possibility of any short circuits. Since the resin body 17 allows different arrangements of the terminals 11 to be used for the same resin body 17, the same resin body 17 may be used in different applications, which may save design costs because a different resin body 17 does not have to be made for each application. For example, if the resin body 17 is made by a molding process, the same mold may be used for different applications, thereby saving design costs. Figure 6 and Figure 7 In the embodiment, the slots 15 in the resin body 17 are visible, but in the finished product, the slots 15 may not be visible, for example, if a resin mold that fills the gaps in the slots 15 is used.

[0088] Resin body 17 may be made of any suitable insulating material, including, for example, liquid crystal polymer (LCP) resin, and may be made in any suitable manner. Terminal 11 may be made of any suitable conductive material, including, for example, copper or a copper alloy.

[0089] exist Figures 41 to 44 In the embodiment, the resin body 17 is molded around the terminal 11 and the magnetic core 30. The terminal 11 may be embedded in the resin body 17 or exposed on the top surface of the resin body 17, and the magnetic core 30 may be fully or partially embedded in the resin body. Figures 41 to 44 In the embodiment of the present invention, the magnetic core 30 is completely embedded in the resin body 17 so that the resin body 17 extends below the magnetic core 30. When the block coil 10 with the completely embedded magnetic core 30 is mounted to the substrate, the magnetic core 30 does not directly contact the substrate because the resin body 17 extends below the magnetic core 30. The magnetic core 30 can be raised above the substrate to meet any safety requirements. The magnetic core 30 can be insulated or non-insulated. If the magnetic core 30 is insulated, the magnetic core 30 can directly contact the terminal 11 when the resin body 17 is molded around the magnetic core 30 and the terminal 11.

[0090] Figures 45 to 49 The terminal strip 70 is shown as being usable when the resin body 17 is molded around the magnetic core 30 and the terminals 11. The terminal strip 70 includes a plurality of terminals 11 connected by tabs 71 located at opposite ends of the terminal strip 70. Figure 45 and Figure 46 In the embodiment, the terminals 11 are identical or substantially identical within manufacturing tolerances and / or measurement tolerances, and Figures 47 to 49 In FIG, the terminal 11 includes two placement terminals for determining the position of the magnetic core 30 in the resin body 17. Figure 47 and Figure 48 In the example, the two placement terminals are the first terminal 11 and the last terminal 11, but any number and arrangement of placement terminals may be used.

[0091] The terminals 11 in the terminal strip 70 have a W shape, wherein each terminal 11 includes two notches on opposite sides of a protrusion. Figure 46 and Figure 48 As shown, the core 30 can be placed on the terminal strip 70 so that the core 30 rests on the recess and the protrusions of the terminals 11 extend into the holes of the core 30. Figure 49 As shown, the placement terminal may have a shallower notch and a shorter protrusion so that the core 30 is held above the other terminals 11 when it is placed on the terminal strip 70. Since all terminals 11 must initially be the same length, additional notches may be included in the placement terminal.

[0092] The resin body 17 may surround Figure 46 and Figure 48 The magnetic core 30 and the terminal 11 are molded in the resin body 17. After the resin body 17 is formed, a portion of the protrusion of the terminal 11 can be removed to form the foot 12 located inside the hole of the magnetic core 30, and a portion of the terminal 11 located outside the resin body 17 can be removed to form the foot 12 located outside the magnetic core 30. The removal of the portion of the terminal 11 creates two terminals 11, one on each side of the hole of the magnetic core 30. Since the protrusion for placing the terminal is embedded in the resin body, the protrusion cannot be removed, thereby forming a single terminal 11 that extends from one side of the magnetic core 30 into the hole of the magnetic core 30 and reaches the other side of the magnetic core 30.

[0093] Figure 6 and Figure 7 The block coil 10 may need to be positioned above the magnetic core 30 (e.g., as shown in FIG. Figure 1 and Figure 5 The magnetic core 30 is positioned and secured in place before the substrate is assembled (as shown). The magnetic core 30 can be placed / bonded to the substrate using a surface mount assembly (SMA), and the block coil can then be placed over the magnetic core 30 on the substrate using the SMA. This multi-step process increases cost and creates a cumulative design / manufacturing tolerance that must be factored into the design of the electronic module, typically increasing the module's footprint. Furthermore, when the magnetic core 30 directly contacts the substrate on which the windings reside, isolation requirements between the windings must be carefully considered, often resulting in a more complex / costly substrate stackup.

[0094] exist Figures 34 to 40 In the embodiment, the magnetic core 30 can be attached to the block coil 10 and Figures 41 to 44 In the embodiment, the magnetic core 30 may be embedded in the resin body 17 . Figures 34 to 40 The magnetic core 30 in the embodiment can be clamped and / or glued to the block coil 10. Thus, Figures 34 to 44 The block coils in the can be made into a single integral component, which is faster, easier and cheaper to manufacture. Figures 34 to 40 The single integral component in may comprise a monolithic body, wherein the four legs 13, the bridge 14 and the protrusion 18 are made of the same material. The terminal 11 may be connected to and / or held by the monolithic body. Figures 34 to 40 The block coil 10 can position the magnetic core 30 above the substrate, allowing for a simpler, more cost-effective substrate design. When mounted to the substrate, the block coil 10 can position the magnetic core 30 at a predetermined distance above the substrate, including, for example, a distance to meet safety requirements. Figures 41 to 44 The magnetic core 30 in the embodiment is embedded in the resin body 17, thereby isolating the magnetic core 30 from the substrate, which also allows the use of a simpler, more cost-effective substrate design. Figures 41 to 44The magnetic core 30 in the lead frame may be completely embedded in the resin body 17 or may be partially embedded in the resin body 17. The magnetic core 30 may be insulating or non-insulating. If the magnetic core 30 is insulating, the magnetic core 30 may be in direct contact with the lead frame, while if the magnetic core 30 is non-insulating, the magnetic core 30 may be spaced apart from the lead frame.

[0095] Figure 6 Twelve terminals 11 and four empty slots 15 are shown. Any number of terminals 11 may be used, including, for example, 14, 16, 18, 20, or more than 20 terminals. The terminals 11 may have Figure 6 and Figure 7 The U-shape shown, or may have any suitable shape, such that the terminal 11 extends over the magnetic core 30 or bridges the magnetic core 30. The terminal 11 may extend over three sides of the cross-section of the magnetic core 30. The terminal 11 may include a foot 12, which may be mounted to the substrate 20 in a surface mounting manner. Alternatively, the terminal 11 may be connected to the substrate 20 in any suitable manner. The foot 12 of the terminal 11 may be attached to the substrate 20 so that the block coil 10 including the resin body 17 is located on or above the substrate 20. The terminal 11 may be located or embedded in a slot 15 in the block coil 10. As shown Figure 6 As shown, not all slots 15 necessarily have corresponding terminals 11. Figure 6 In the embodiment, four slots 15 do not have corresponding terminals 11, but any number of slots 15 may be empty. Figure 6 Sixteen slots 15 are shown, but any number of slots 15 may be used.

[0096] The terminals 11 in the block coil 10 and the traces 23 on or in the substrate 20 can be included in the windings of the magnetic assembly 100. If the windings include a primary winding and a secondary winding, some of the terminals 11 can be included in the primary winding and connected to the primary traces 23, and some of the terminals 11 can be included in the secondary winding and connected to the secondary traces 23. Alternatively, all of the terminals 11 in the block coil 10 can be included in the primary winding and connected to the primary traces 23, or can be included in the secondary winding and connected to the secondary traces 23. If all of the terminals 11 in one block coil 10 are included in the primary winding, all of the terminals 11 in another block coil 10 can be included in the secondary winding, and vice versa. If all of the terminals 11 in one block coil 10 are included in the primary winding, the other block can include the terminals 11 in both the primary and secondary windings, and vice versa.

[0097] The terminals 11 in the block coil 10 can be included in groups. Which terminal group each terminal 11 belongs to is determined by the traces 23 on the substrate 20. For example, for one substrate 20, all terminals 11 may belong to the first terminal group, while for another substrate 20, adjacent terminals 11 may be in two different terminal groups, either the first terminal group or the second terminal group. For example, Figure 6 Two terminal groups are shown, namely a first terminal group and a second terminal group. Figure 6 In the embodiment, the first terminal group includes four first terminals 11 located on each end of the block coil 10, and the second terminal group includes four second terminals 11 located in the middle of the block coil 10 between the first terminals 11 of the first terminal group. Other arrangements are also possible. For example, the first terminals 11 and the second terminals 11 can be arranged alternately along the length of the block coil 10, so that each terminal 11 of one terminal group can be located between two terminals 11 of the other terminal group. Alternatively, the terminal groups do not have to be separated. That is, the terminals 11 of the first terminal group can be located at one end of the block coil 10 (for example, there are seven first terminals 11 on one end), and the terminals 11 of the second terminal group can be located at the other end of the block coil 10 (for example, there are seven second terminals 11 on the other end, and the two middle slots 15 do not have any terminals 11). The terminals 11 can also be arranged in a bifilar arrangement, in which the two windings are arranged adjacent to each other. For example, adjacent terminals 11 can be connected to the first primary winding or the second primary winding.

[0098] Each terminal 11 in the first terminal group or the second terminal group can be closer to the adjacent terminal 11 of the same group than the terminal 11 of the other group. That is, each first terminal 11 can be closer to another first terminal 11 than any second terminal 11, and each second terminal 11 can be closer to another second terminal 11 than any first terminal 11. The slots 15 between adjacent terminal groups can be empty (that is, the number of terminals 11 can be lowered or reduced) to help improve the isolation between the first terminal group and the second terminal group. More empty slots 15 between adjacent terminal groups can increase the isolation between the terminal groups. Adjacent terminal groups can be spaced apart from each other. Instead of including empty slots 15, adjacent terminal groups can be spaced farther apart from each other than adjacent terminals 11 in the terminal group. For example, the distance between adjacent terminal groups can be twice the distance between adjacent terminals 11 in the terminal group, without having empty slots 15 between adjacent terminal groups.

[0099] Figure 8 Two block-shaped coils 10 are shown with terminals 11 having different widths. Figure 8 As shown, the terminals 11 of each block-shaped coil 10 may have the same width. Alternatively, terminals 11 having different widths may be included in the same block-shaped coil 10 .

[0100] Figure 10 A cross section of two block coils 10 connected to a multi-layer substrate 20 is shown. Figure 10 Various minimum distances (MIN) to ensure adequate isolation are shown. For example, the wall thickness of the resin body 17 should be at least 0.4 mm, so that the terminal 11 is at least 0.4 mm away from the cavity or groove 16 in the block coil 10. If the magnetic core 30 is coated, the wall thickness of 0.4 mm can be reduced to, for example, 0.2 mm. The isolation distance will depend on the application. The minimum distance between the magnetic core 30 and the wall of the resin body 17 can be 0.0 mm, so that there is no distance between the magnetic core 30 and the wall of the resin body 17. On the surface of the substrate 20, the minimum distance between the traces or conductive patterns 23 of the primary and secondary circuits should be at least 0.4 mm.

[0101] like Figure 10 As shown, the substrate 20 may include laser vias that may be created by a laser and do not necessarily extend all the way through the substrate 20, and the substrate 20 may include buried vias that extend between inner layers of the substrate 20 but do not extend to the outer surface of the substrate 20. Each of the multiple layers of the substrate 20 may be within a manufacturing tolerance and / or a measurement tolerance of 0.05 mm or approximately 0.05 mm. Figure 10 As shown, the primary trace 23 and the secondary trace 23 can be separated by three inner layers so that the total distance between the primary trace 23 and the secondary trace 23 is at least 0.15 mm to ensure sufficient isolation. Although the minimum distance between the primary circuit and the secondary circuit is required to be 0.4 mm on the surface of the substrate 20, the minimum distance between the primary circuit and the secondary circuit inside the substrate 20 depends on the isolation requirements of each product. Other distances are also feasible. For example, Figure 18 In the embodiment, distance 1 is the wall thickness of the block coil 10 and can be about 0.01 mm to about 2.0 mm within manufacturing tolerances and / or measurement tolerances; distance 2 is the distance between the trace 23 on the top layer of the substrate 20 and the magnetic core 30 and can be about 0.01 mm to about 2.0 mm within manufacturing tolerances and / or measurement tolerances; and distance 3 is the minimum distance between the block coils 10 (i.e., Figure 18 The distance between the legs 12 of the middle terminal 11) and can be about 0.01 mm to about 2.0 mm within manufacturing tolerances and / or measurement tolerances.

[0102] Figures 26 to 31 Different possible substrates 20 that may be used in the magnetic assembly 100 or in the electronic module 200 are shown. Figures 26 to 30 Different possible multilayer substrates 20 are shown, and Figure 31 A single layer substrate 20 is shown. Figures 26 to 30As shown, substrate 20 may include multiple layers, including a top mask 24, one or more prepreg layers 27, a core layer 28, one or more prepreg layers 27, and a bottom mask 24. Core layer 28 may also include a core prepreg layer 28a. Core layer 28 may include any suitable material, including, for example, FR-4. Traces 23 may be included on the top and bottom surfaces of substrate 20 and may be included in an inner layer of substrate 20. Traces 23 on different layers may be connected by vias. A via may include a hole in substrate 20 that is plated with a conductive material (including, for example, a metal or metal alloy) and filled with any suitable material (including, for example, a resin). Alternatively, the via may be filled only with a conductive material. The via may be made in any suitable manner, including, for example, mechanical drilling or laser drilling. Any suitable vias may be used, including buried vias where neither side of the via is exposed on the top or bottom surface of the substrate 20, blind vias where one side of the via is exposed on the top or bottom surface of the substrate 20, and through holes where both sides of the via are exposed on the top or bottom surface of the substrate 20. The traces 23 may comprise copper or other suitable conductive materials. Similarly, as Figure 31 As shown, substrate 20 may include a single layer including top mask 24 , core layer 28 , and bottom mask 24 . Figure 31 Traces 23 in FIG. 2 may be located on either the top or bottom surface of substrate 20 .

[0103] Figure 26 A multilayer substrate 20 is shown that includes a top mask 24, a prepreg layer 27, a core prepreg layer 28a, a core layer 28, two prepreg layers 27, and a bottom mask 24. Traces 23 are located on the top and bottom surfaces of the substrate 20, on the top surface of the core prepreg layer 28a, and on the bottom surface of the core layer 28.

[0104] Figure 27 A multilayer substrate 20 is shown that includes a top mask 24, a prepreg layer 27, a core prepreg layer 28a, a core layer 28, three prepreg layers 27, and a bottom mask 24. Traces 23 are located on the top and bottom surfaces of the substrate 20, on the top surface of the core prepreg layer 28a, and on the bottom surface of the core layer 28.

[0105] Figure 28 A multilayer substrate 20 is shown including a top mask 24, a prepreg layer 27, a core layer 28, three prepreg layers 27, and a bottom mask 24. Traces 23 are located on the top and bottom surfaces of the substrate 20 and the top and bottom surfaces of the core layer 28.

[0106] Figure 29A multilayer substrate 20 is shown including a top mask 24, a prepreg layer 27, a core layer 28, a prepreg layer 27, and a bottom mask 24. Traces 23 are located on the top and bottom surfaces of substrate 20 and core layer 28.

[0107] Figure 30 A multilayer substrate 20 is shown comprising a top mask 24, two prepreg layers 27, a core layer 28, two prepreg layers 27, and a bottom mask 24. Traces 23 are located on the top and bottom surfaces of the substrate 20 and the core layer 28.

[0108] Figures 26 to 30 The multi-layer substrate in the embodiment makes it easier to position the primary traces or conductive patterns 23 and the secondary traces or conductive patterns 23 and provide insulation between the primary traces or conductive patterns 23 and the secondary traces or conductive patterns 23. If multiple block coils 10 are used, then Figures 26 to 30 The multi-layer substrate in may make it easier to provide isolation between the primary traces or conductive patterns 23 and the secondary traces or conductive patterns 23 .

[0109] Figure 31 The bottom of FIG. 2 shows a single layer substrate 20 , which includes a top mask 24 , a core layer 28 , and a bottom mask 24 . Traces 23 are located on the top and bottom surfaces of the substrate 20 . Figure 31 The top of FIG. 1 shows a magnetic assembly 100 that includes two block coils 10 mounted to a single-layer substrate 20 and includes a magnetic core 30. Traces 23 are on the top surface of the single-layer substrate 20. The single-layer substrate 20 allows for a smaller magnetic assembly 100 or electronic module 200. For example, one of the block coils 10 may include a primary terminal 11 and the other block coil 10 may include a secondary terminal 11, so that a primary trace 23 connected to the primary terminal 11 and a secondary trace 23 connected to the secondary terminal can be located on the same surface of the substrate 20.

[0110] like Figure 10 As shown, portions of the secondary trace 23 and the primary trace 23 can vertically overlap, which can improve coupling between the primary and secondary windings. The greater the overlap between the primary and secondary windings, the greater the coupling between the primary and secondary windings. If the primary trace 23 or the secondary trace 23 is located on adjacent layers, the resistance can be reduced. That is, if primary traces 23 on different layers are separated by only a single layer, the resistance in the primary winding can be reduced, and if secondary traces 23 on different layers are separated by only a single layer, the resistance in the secondary winding can be reduced.

[0111] Figures 11 to 15 A method of manufacturing an electronic module 200 is shown, in which a block coil 10 is mounted to a substrate 20 . Figure 11There is shown providing a substrate 20 and subsequently applying solder paste 25. The substrate 20 may be one of the substrates 20 discussed above, and may be a multi-layer or single-layer substrate. Figure 12 Glue or adhesive 26 is shown dispensed onto substrate 20. Glue or adhesive 26 may be dispensed as part of a surface mount technology (SMT) process, or separate from the SMT process. Figure 13 The placement of the magnetic core 30 and the electronic components 50 are shown. Figure 14 The placement of two block coils 10 extending over or bridging the magnetic core 30 is shown. Figure 15 Insulation material 40 covering substrate 20 , electronic components 50 , magnetic core 30 , and block coil 10 is shown. Figure 15 The insulating material 40 is shown covering the entire substrate 20, but the insulating material 40 may cover only a portion of the substrate 20 and / or only one or some of the electronic components 50, the magnetic core 30, and the block coil 10. Typically, a mother substrate may be used, wherein the array of electronic modules 200 is included in the mother substrate. The mother substrate is then cut or singulated to form the individual electronic modules 200. Alternatively, the individual electronic modules 200 may be manufactured without using a mother substrate.

[0112] Figures 19 to 23 Shown with Figure 1 The magnetic assembly 100 is similar to the magnetic assembly 100. For the sake of brevity, the description of similar components will not be repeated. The magnetic assembly 100 may include Figure 1 The magnetic assembly 100 includes a block coil 10 and a magnetic core 30 .

[0113] Figures 19 to 23 The magnetic assembly 100 and Figure 1 The difference of the magnetic assembly 100 is that Figures 19 to 23 The block coil 10 of the magnetic assembly 100 is connected to the lead frame 60 instead of the substrate 20 . Figures 19 to 23 The magnetic assembly 100 includes an insulating material 40 similar to that used in Figure 4 The insulating material 40 of the electronic module 200. Figures 19 to 21 Insulating material 40 is shown as transparent, but in Figure 23 , the insulating material 40 is shown as opaque. For clarity, Figure 22 The insulating material 40 and one of the block coils 10 are not shown.

[0114] Although not shown, additional electronic components may be included to form the electronic module 200 , such that the magnetic assembly 100 may be part of a DC-DC converter, for example.

[0115] The lead frame 60 may include mounting terminals 62 and a conductive pattern 61. The mounting terminals 62 may be used to connect the lead frame 60 and the magnetic assembly 100 or electronic module 200 to a host substrate (not shown). The conductive pattern 61 is similar to the traces 23 included on or in the substrate 20 and, as described above, may connect one or more terminals 11 to define a single-turn winding. The conductive pattern 61 may determine to which winding a terminal 11 is connected. For example, the conductive pattern 61 may be connected to a terminal 11 so that one block coil 10 includes two primary turns and another block coil includes four secondary turns. Figures 19 to 23 The terminals 11 in the block coil 10 in the magnetic assembly 100 can be divided into different terminal groups, as described above for Figure 1 The magnetic assembly 100 in the block coil 10 is described.

[0116] It should be understood that the above description is merely illustrative of the present invention. Various substitutions and modifications may be devised by those skilled in the art without departing from the present invention. Therefore, the present invention is intended to encompass all such substitutions, modifications, and variations that fall within the scope of the appended claims.

Claims

1. An electronic module comprising: a substrate or lead frame including a primary conductive pattern and a secondary conductive pattern; a magnetic core, located on or above the substrate or the lead frame; Block coil, including: a resin body located on or over the substrate or the lead frame and including a first leg, a second leg, a third leg, and a fourth leg extending over the magnetic core; a first terminal on or embedded in the first leg and the second leg such that the first terminal extends over the magnetic core and the first terminal is connected to the primary conductive pattern; and a second terminal on or embedded in the third leg and the fourth leg such that the second terminal extends over the magnetic core and is connected to the secondary conductive pattern; and The electronic component is located on the substrate or the lead frame.

2. The electronic module according to claim 1, wherein The block coil includes an additional first terminal and an additional second terminal; The first terminal and the additional first terminal define a first terminal set; and The second terminal and the additional second terminal define a second terminal set.

3. The electronic module according to claim 2, wherein Each terminal in the first terminal group is connected to a corresponding primary conductive pattern; and Each terminal in the second terminal group is connected to a corresponding secondary conductive pattern.

4. The electronic module according to claim 2, wherein: The first terminal group is located beside the second terminal group and is spaced apart from the second terminal group.

5. The electronic module according to any one of claims 1 to 4, wherein: The substrate or the lead frame includes a first layer and a second layer.

6. The electronic module according to claim 5, wherein The primary conductive pattern is in the first layer; The secondary conductive pattern is in the second layer; and A portion of the primary conductive pattern and a portion of the secondary conductive pattern vertically overlap when viewed from a side view of the substrate.

7. The electronic module according to claim 6, further comprising: adding a primary conductive pattern in the third layer of the substrate; as well as Additional secondary conductive pattern, in the fourth layer of the substrate; wherein, A portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern vertically overlap as viewed from a side view of the substrate. 8 . The electronic module according to claim 1 , further comprising an insulating material, wherein the insulating material covers the substrate or the lead frame, the magnetic core, and the block coil.

9. The electronic module according to any one of claims 1 to 4, wherein: The electronic components include an integrated circuit IC and / or a capacitor.

10. The electronic module according to any one of claims 1 to 4, wherein: The block coil includes an inner tapered portion connected to the magnetic core.

11. An electronic module comprising: a substrate or lead frame including a conductive pattern; a magnetic core, located on or above the substrate or the lead frame; A first massive coil and a second massive coil are connected by a bridge to define a single integral assembly, each of the first massive coil and the second massive coil comprising: a resin body located on or over the substrate or the lead frame and extending over the magnetic core; and a first terminal on or embedded in the resin body and connected to the conductive pattern; an electronic component located on the substrate or the lead frame; and An insulating material covers the substrate or the lead frame, the magnetic core and the block coil.

12. The electronic module according to claim 11, wherein The conductive pattern is a primary conductive pattern; and The first terminal of the first block coil is connected only to the primary conductive pattern.

13. The electronic module according to claim 11, wherein The conductive pattern is a secondary conductive pattern; and The first terminal of the second block coil is connected only to the secondary conductive pattern.

14. The electronic module according to claim 11, wherein: The resin body includes an inner tapered portion connected to the magnetic core.

15. The electronic module according to any one of claims 11 to 14, wherein The first block coil includes a first terminal group and a second terminal group; and The first terminal of the first block coil is included in the first terminal group.

16. The electronic module according to claim 15, wherein Each terminal in the first terminal group is connected to a corresponding primary conductive pattern; and Each terminal in the second terminal group is connected to a corresponding secondary conductive pattern.

17. The electronic module according to claim 15, wherein: Each terminal in the first terminal group and each terminal in the second terminal group is connected to a corresponding primary conductive pattern.

18. The electronic module according to claim 15, wherein: Each terminal in the first terminal group and each terminal in the second terminal group is connected to a corresponding secondary conductive pattern.

19. The electronic module according to claim 15, wherein: The first terminal group is located beside the second terminal group and is spaced apart from the second terminal group.

20. The electronic module according to any one of claims 11 to 14, wherein: The substrate or the lead frame includes a first layer and a second layer.

21. The electronic module according to claim 20, further comprising: a primary conductive pattern in the first layer; as well as A secondary conductive pattern is provided in the second layer; wherein, A portion of the primary conductive pattern and a portion of the secondary conductive pattern vertically overlap when viewed from a side view of the substrate.

22. The electronic module according to claim 21, further comprising: adding a primary conductive pattern in the third layer of the substrate; as well as Additional secondary conductive pattern, in the fourth layer of the substrate; wherein, A portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern vertically overlap as viewed from a side view of the substrate.

23. The electronic module according to any one of claims 11 to 14, wherein: The electronic components include an integrated circuit IC and / or a capacitor.

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