Air gap type thermal switch, inflation device, inflation method and target inflation volume determination method

Abstract

The invention discloses an air gap type thermal switch, an inflation device, an inflation method and a target inflation volume determination method, the air gap type thermal switch comprises a thermal switch main body and an adsorption pump communicated with the thermal switch main body, and the inflation device comprises a pressure monitoring device which is communicated with an inflation inlet of the thermal switch main body through a first pipeline, the adsorption pump is used for monitoring the pressure value reflecting the working gas quantity in the air gap type thermal switch in real time, and the adsorption effect of the adsorption pump on the working gas is influenced by heating or cooling of the adsorption pump; working gas is stored in the gas tank, and the gas tank is connected with the inflation inlet of the thermal switch main body through a second pipeline which can be controlled to be opened and closed; and the sealing device is used for sealing the inflation port of the thermal switch main body when the pressure monitoring device monitors that the pressure value meets the target inflation volume. The gas charging device provided by the invention can quickly and accurately control the charging amount of the working gas in the adsorption pump.

Description

Technical Field

[0001] The present invention relates to the field of quantum computer technology, and in particular to an air gap type thermal switch, an inflation device, a method, and a method for determining a target inflation amount. Background Art

[0002] Quantum computers are physical devices that follow the laws of quantum mechanics to perform high-speed mathematical and logical operations, store, and process quantum information. Their key characteristics include rapid operation, robust information processing capabilities, and a wide range of applications. Among the various quantum computing technology approaches, superconducting technology holds great promise, and quantum computers developed based on this approach are attracting significant industry attention.

[0003] The fundamental unit of superconducting quantum computing is a superconducting quantum chip, which must operate in an ultra-low temperature environment, approximately 10mK to 20mK (Kelvins). This ultra-low temperature effectively reduces the impact of environmental noise on the superconducting quantum chip. This ultra-low temperature environment is typically provided by a dilution refrigerator, which uses graded refrigeration technology to create different temperature zones. The quantum chip is typically placed in the lowest temperature zone of the dilution refrigerator, while the signal source equipment and microwave monitoring equipment that control the quantum chip are typically located outside the dilution refrigerator. The different temperature zones in the dilution refrigerator are separated by cold plates, which effectively reduces interference in heat transfer between the zones. However, when the quantum chip needs to be removed, all temperature zones of the dilution refrigerator must be restored to room temperature, requiring thermal connections between adjacent cold plates. Furthermore, during the pre-cooling process of the dilution refrigerator, thermal connections between adjacent cold plates are also required to speed up the pre-cooling process. After pre-cooling, the thermal connections between the cold plates should be disconnected to allow the dilution refrigerator to begin operation. Currently, a common method is to connect two adjacent cold plates using an air-gap thermal switch to achieve thermal connection and separation between the cold plates under different operating conditions of the quantum chip. This air-gap thermal switch typically consists of a thermal switch body and an adsorption pump, which requires a certain amount of working gas to be sealed. Precisely controlling the amount of working gas sealed in the adsorption pump (referred to as the charge level) is a pressing challenge.

[0004] It should be noted that the information disclosed in the background technology section of this application is only intended to deepen the understanding of the general background technology of this application, and should not be regarded as an admission or any form of implication that the information constitutes prior art already known to those skilled in the art. Summary of the Invention

[0005] The object of the present invention is to provide an air gap type thermal switch, an inflation device, a method, a target inflation amount determination method, a dilution refrigerator and a quantum computer that can accurately control the working gas.

[0006] In order to achieve the above object, the present invention provides the following technical solutions:

[0007] A first aspect of the present invention provides an air-gap thermal switch inflation device, the air-gap thermal switch comprising a thermal switch body and an adsorption pump connected to the thermal switch body, the inflation device comprising:

[0008] a pressure monitoring device, connected to the air filling port of the thermal switch body through a first pipeline, for real-time monitoring of a pressure value reflecting the amount of working gas in the air-gap thermal switch, wherein the adsorption effect of the adsorption pump on the working gas is affected by whether the adsorption pump is heated or cooled;

[0009] A gas tank storing working gas therein, the gas tank being connected to the gas filling port of the thermal switch body via a second pipeline that can be controlled on and off;

[0010] The sealing device is used to seal the inflation port of the thermal switch body when the pressure monitoring device monitors a pressure value that meets the target inflation volume.

[0011] The inflation device of the air gap type thermal switch as described above, further, the gas tank is connected to the first pipeline through a second pipeline so that the second pipeline is connected to the inflation port of the thermal switch body.

[0012] The inflation device of the air-gap thermal switch as described above, further, the second pipeline is provided with a first valve for controlling the on-off of the second pipeline.

[0013] In the inflation device of the air gap type thermal switch as described above, further, the first valve is a fine-tuning valve.

[0014] The inflation device of the air-gap thermal switch as described above further includes a cooling device for cooling the adsorption pump.

[0015] The inflation device of the air-gap thermal switch as described above, further, the cooling device is a tank filled with liquid nitrogen.

[0016] A second aspect of the present invention provides a method for inflating an air-gap thermal switch, the air-gap thermal switch comprising a thermal switch body and an adsorption pump connected to the thermal switch body, the method comprising:

[0017] Filling the thermal switch body and the adsorption pump with working gas through a gas tank and a connected second pipeline, and ending the gas filling when the pressure monitoring device detects a pressure value of a first threshold;

[0018] The adsorption pump is cooled, and when the pressure monitoring device detects a pressure value of a second threshold, the air filling port of the thermal switch body is sealed using a sealing device, wherein the difference between the first threshold and the second threshold is the target air filling volume required for the air gap thermal switch to operate at a preset ambient temperature.

[0019] The above-mentioned inflation method may further include: vacuuming the adsorption pump before filling the thermal switch body and the adsorption pump with working gas.

[0020] The inflation method as described above, further comprising:

[0021] Obtain the maximum air volume of the air gap thermal switch at the preset ambient temperature;

[0022] Obtain the minimum air volume of the air gap thermal switch at the preset ambient temperature;

[0023] The first threshold and the second threshold are determined according to the maximum inflation volume and the minimum inflation volume; wherein the target inflation volume is any inflation volume between the maximum inflation volume and the minimum inflation volume.

[0024] The inflation method as described above further includes a step of obtaining the maximum inflation volume of the air gap type thermal switch at a preset ambient temperature, comprising:

[0025] Turning off the heater of the adsorption pump and performing a first gas charging test, wherein the first gas charging test includes: filling the thermal switch body and the adsorption pump with working gas through a gas tank and a second connected pipeline, so that the thermal switch body is about to be turned on when the heater of the adsorption pump is not turned on, and the thermal switch body is fully turned on when the heater of the adsorption pump is turned on;

[0026] When the heater is turned on and the thermal switch body is fully conductive and the preset ambient temperature returns to room temperature, the pressure monitoring value of the pressure monitoring device is the maximum air filling volume of the air gap thermal switch.

[0027] As described above, in the inflation method, further, the state in which the thermal switch body is about to be turned on is determined by a first temperature sensor provided at the cold end of the thermal switch body and a second temperature sensor provided at the hot end of the thermal switch body. When the temperatures of the first temperature sensor and the second temperature sensor are close, it is determined that the thermal switch body is about to be turned on.

[0028] In the inflation method as described above, further, the temperature of the first temperature sensor is close to that of the second temperature sensor, comprising: a ratio of the temperature of the first temperature sensor to the temperature of the second temperature sensor is 4:(4.2-5).

[0029] The above-mentioned inflation method further comprises the steps of filling the thermal switch body and the adsorption pump with working gas through a gas tank and a second connected pipeline, so that the thermal switch body is about to be turned on when the heater on the adsorption pump is not turned on and the thermal switch body is fully turned on when the heater on the adsorption pump is turned on; comprising:

[0030] Inflate the air gap type thermal switch after the vacuum treatment, and stop inflating when the temperature difference between the cold end and the hot end of the air gap type thermal switch reaches a first preset value;

[0031] Turn on the heater to determine whether the air gap thermal switch is conducting;

[0032] If yes, the experiment ends;

[0033] If not, the air gap thermal switch is continuously charged with gas until the air gap thermal switch is in a fully conductive state when the heater is turned on.

[0034] The inflation method as described above further includes a step of obtaining a minimum inflation volume of the air gap type thermal switch at a preset ambient temperature, comprising:

[0035] Under a preset ambient temperature, the heater is turned on and a second gas filling test is performed, wherein the second gas filling test includes: filling the thermal switch body and the adsorption pump with working gas through a gas tank and a second connected pipeline, so that the thermal switch body is fully conductive when the heater on the adsorption pump is turned on and the thermal switch body is not conductive when the heater on the adsorption pump is turned off;

[0036] When the heater is turned off and the thermal switch body is not conductive and the preset ambient temperature returns to room temperature, the pressure monitoring value of the pressure monitoring device is the minimum inflation volume of the air gap thermal switch.

[0037] The inflation method as described above further comprises the steps of: filling the thermal switch body and the adsorption pump with working gas through a gas tank and a second connected pipeline, so that the thermal switch body is fully conductive when the heater on the adsorption pump is turned on and the thermal switch body is non-conductive when the heater on the adsorption pump is turned off; and

[0038] Inflate the air-gap thermal switch after the vacuum treatment, and stop inflating when the cold end and the hot end of the air-gap thermal switch are conductive;

[0039] Turn off the heater and determine whether the air gap thermal switch is non-conductive;

[0040] If yes, the experiment ends;

[0041] If not, the air gap type thermal switch is restored to room temperature and evacuated and then the inflation step is performed again until the air gap type thermal switch is in a non-conducting state when the heater is turned off.

[0042] The inflation method as described above, further comprising the step of determining the first threshold value and the second threshold value based on the maximum inflation volume and the minimum inflation volume, comprising:

[0043] determining that a first difference between the first threshold value and the second threshold value is between the maximum inflation volume and the minimum inflation volume;

[0044] determining a first threshold based on the maximum inflation volume and an adsorption rate of the adsorption medium in the adsorption pump, and determining a second threshold based on the first threshold and the first difference;

[0045] Alternatively, the second threshold is determined based on the minimum inflation volume and the adsorption rate of the adsorption medium in the adsorption pump, and the first threshold is determined based on the second threshold and the first difference.

[0046] A third aspect of the present invention provides a method for determining a target air filling volume of an air-gap thermal switch, the air-gap thermal switch comprising a thermal switch body and an adsorption pump connected to the thermal switch body, the method comprising:

[0047] Obtain the maximum air volume of the air gap thermal switch at the preset ambient temperature;

[0048] Obtain the minimum air volume of the air gap thermal switch at the preset ambient temperature;

[0049] The target air filling volume required for the air gap type thermal switch to operate at a preset ambient temperature is determined according to the maximum air filling volume and the minimum air filling volume.

[0050] The determination method described above further includes the step of obtaining the maximum air filling volume of the air gap type thermal switch at a preset ambient temperature, comprising:

[0051] Turning off the heater of the adsorption pump and performing a first gas charging test, wherein the first gas charging test includes: filling the thermal switch body and the adsorption pump with working gas through a gas tank and a second connected pipeline, so that the thermal switch body is about to be turned on when the heater of the adsorption pump is not turned on, and the thermal switch body is fully turned on when the heater of the adsorption pump is turned on;

[0052] When the heater is turned on and the thermal switch body is fully conductive and the preset ambient temperature returns to room temperature, the pressure monitoring value of the pressure monitoring device is the maximum inflation volume of the air gap thermal switch.

[0053] According to the determination method described above, further, the state in which the thermal switch body is about to be turned on is determined by a first temperature sensor arranged at the cold end of the thermal switch body and a second temperature sensor arranged at the hot end of the thermal switch body, and when the temperatures of the first temperature sensor and the second temperature sensor are close to each other, it is determined that the thermal switch body is about to be turned on.

[0054] According to the determination method described above, further, the temperature of the first temperature sensor is close to the temperature of the second temperature sensor, which includes: a ratio of the temperature of the first temperature sensor to the temperature of the second temperature sensor is 4:(4.2-5).

[0055] The determination method described above further includes the steps of: filling the thermal switch body and the adsorption pump with working gas through a gas tank and a second connected pipeline, so that the thermal switch body is about to be turned on when the heater on the adsorption pump is not turned on, and the thermal switch body is fully turned on when the heater on the adsorption pump is turned on; comprising:

[0056] Inflate the air gap type thermal switch after the vacuum treatment, and stop inflating when the temperature difference between the cold end and the hot end of the air gap type thermal switch reaches a first preset value;

[0057] Turn on the heater to determine whether the air gap thermal switch is conducting;

[0058] If yes, the experiment ends;

[0059] If not, the air gap thermal switch is continuously charged with gas until the air gap thermal switch is in a fully conductive state when the heater is turned on.

[0060] The determination method described above further includes a step of obtaining the minimum air filling volume of the air gap type thermal switch at a preset ambient temperature, comprising:

[0061] Under a preset ambient temperature, the heater is turned on and a second gas filling test is performed, wherein the second gas filling test includes: filling the thermal switch body and the adsorption pump with working gas through a gas tank and a second connected pipeline, so that the thermal switch body is fully conductive when the heater on the adsorption pump is turned on and the thermal switch body is not conductive when the heater on the adsorption pump is turned off;

[0062] When the heater is turned off and the thermal switch body is not conductive and the preset ambient temperature returns to room temperature, the pressure monitoring value of the pressure monitoring device is the minimum inflation volume of the air gap thermal switch.

[0063] The determination method described above further includes the steps of: filling the thermal switch body and the adsorption pump with working gas through a gas tank and a second connected pipeline, so that the thermal switch body is fully conductive when the heater on the adsorption pump is turned on and the thermal switch body is not conductive when the heater on the adsorption pump is turned off; and

[0064] Inflate the air-gap thermal switch after the vacuum treatment, and stop inflating when the cold end and the hot end of the air-gap thermal switch are conductive;

[0065] Turn off the heater and determine whether the air gap thermal switch is non-conductive;

[0066] If yes, the experiment ends;

[0067] If not, the air gap type thermal switch is restored to room temperature and evacuated and then the inflation step is performed again until the air gap type thermal switch is in a non-conducting state when the heater is turned off.

[0068] A fourth aspect of the present invention provides an air-gap thermal switch, comprising a thermal switch body, an adsorption pump connected to the thermal switch body, and a heater mounted on the adsorption pump, wherein the adsorption pump is filled with an adsorption medium, and a gap for filling a working gas is provided inside the thermal switch body. The working gas is filled into the adsorption pump through the above-mentioned inflation device or the working gas is filled into the adsorption pump using the inflation method described above or the target inflation amount required for the operation of the air-gap thermal switch is determined by the above-mentioned method.

[0069] A fifth aspect of the present invention provides a dilution refrigerator comprising a plurality of cold plates, wherein at least one air gap type thermal switch as described above is provided between adjacent cold plates.

[0070] A sixth aspect of the present invention provides a quantum computer comprising a quantum chip and the dilution refrigerator as described above, wherein the quantum chip is disposed in the lowest temperature zone of the dilution refrigerator.

[0071] The beneficial effects of the present invention are:

[0072] The inflation device provided in the present application can quickly and accurately control the amount of working gas charged into the adsorption pump. By setting a pressure monitoring device, the pressure value of the process in which the adsorption medium in the adsorption pump adsorbs the working gas can be accurately monitored. Since the change in pressure value is closely related to the amount of working gas charged, precise control of the amount of working gas charged can be achieved.

[0073] The inflation method provided in the present application ends inflation and cools the adsorption pump when the pressure monitoring device monitors a pressure value of the first threshold value, and seals the inflation port of the thermal switch body using a sealing device when the pressure monitoring device monitors a pressure value of the second threshold value. The difference between the first threshold value and the second threshold value is the amount of working gas charged into the adsorption pump. Therefore, by performing the inflation end and sealing operations respectively when the pressure value monitored by the pressure monitoring device reaches the first threshold value and the second threshold value, the amount of working gas charged into the adsorption pump can be accurately controlled.

[0074] In the target inflation volume determination method provided in the present application, the accuracy of the target inflation volume finally determined is ensured by obtaining the minimum inflation volume and the maximum inflation volume of the air-gap thermally opened tube at a preset ambient temperature.

[0075] In the air-gap thermal switch provided in the present application, the working gas is filled into the adsorption pump through the above-mentioned inflation device, or the working gas is filled into the adsorption pump using the above-mentioned inflation method, or the target inflation volume required for the operation of the air-gap thermal switch is determined by the above-mentioned method, so it has the same beneficial effects and will not be repeated here.

[0076] The dilution refrigerator provided in the present application includes the above-mentioned air gap type thermal switch, and therefore has the same beneficial effects, which will not be described in detail here.

[0077] The quantum computing provided in this application includes the above-mentioned dilution refrigerator, and therefore has the same beneficial effects, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0078] Figure 1 A schematic diagram of the first structure of the inflation device of the air gap type thermal switch provided in an embodiment of the present application;

[0079] Figure 2 A schematic diagram of a second structure of the inflation device of the air gap type thermal switch provided in an embodiment of the present application;

[0080] Figure 3 A first flow chart of the inflation method of the air gap type thermal switch provided in the embodiment of the present application;

[0081] Figure 4 A second flow chart of the inflation method of the air gap type thermal switch provided in an embodiment of the present application;

[0082] Figure 5 A third flow chart of the inflation method of the air gap type thermal switch provided in an embodiment of the present application;

[0083] Figure 6 A fourth flow chart of the method for inflating an air-gap thermal switch provided in an embodiment of the present application;

[0084] Figure 7 A fifth flow chart of the method for inflating an air gap type thermal switch provided in an embodiment of the present application;

[0085] Figure 8 A sixth flow chart of the method for inflating an air gap type thermal switch provided in an embodiment of the present application;

[0086] Figure 9 A seventh flow chart of the method for inflating an air gap type thermal switch provided in an embodiment of the present application;

[0087] Figure 10 An eighth flow chart of the method for inflating an air gap type thermal switch provided in an embodiment of the present application;

[0088] Figure 11 A first flow chart of a method for determining a target air filling volume of an air-gap thermal switch provided in an embodiment of the present application;

[0089] Figure 12 A second flow chart of the method for determining the target air filling volume of an air-gap thermal switch provided in an embodiment of the present application;

[0090] Figure 13 A third flow chart of the method for determining the target air filling volume of an air-gap thermal switch provided in an embodiment of the present application;

[0091] Figure 14 A fourth flow chart of the method for determining the target air filling volume of an air-gap thermal switch provided in an embodiment of the present application;

[0092] Figure 15 A fifth flow chart of the method for determining the target air filling volume of an air gap type thermal switch provided in an embodiment of the present application;

[0093] Figure 16 A schematic diagram of the structure of an air gap thermal switch provided in an embodiment of the present application;

[0094] In the accompanying drawings: 1. thermal switch body; 2. adsorption pump; 3. four-way pipe; 4. gas tank; 5. pressure reducing valve; 6. first valve; 7. second valve; 8. vacuum pump; 9. sealing device; 10. cooling device; 11. pressure monitoring device; 12. cold end; 13. hot end; 14. heater. DETAILED DESCRIPTION

[0095] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of this application. The embodiments described below with reference to the drawings are exemplary and are only used to explain this application, and cannot be interpreted as limiting this application.

[0096] In the description of the present invention, it should be understood that the terms "center", "up", "down", "left", "right", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0097] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0098] Figure 1This is a schematic diagram of the first structure of the inflation device of the air gap type thermal switch provided in the embodiment of the present application; Figure 1 As shown: An embodiment of the present application discloses an inflation device of an air-gap thermal switch, the air-gap thermal switch comprising a thermal switch body 1 and an adsorption pump 2 connected to the thermal switch body 1, the inflation device comprising: a pressure monitoring device 11, connected to the inflation port of the thermal switch body 1 through a first pipeline, for real-time monitoring of a pressure value reflecting the amount of working gas in the air-gap thermal switch, wherein the adsorption effect of the adsorption pump 2 on the working gas is affected by whether the adsorption pump 2 is heated or cooled; a gas tank 4 storing working gas internally, the gas tank 4 being connected to the inflation port of the thermal switch body 1 through a second pipeline that can be controlled on and off; a sealing device 9, for sealing the inflation port of the thermal switch body 1 when the pressure monitoring device 11 monitors a pressure value that meets the target inflation amount.

[0099] The inflation device of the present application can quickly and accurately control the amount of working gas charged into the adsorption pump 2. By setting a pressure monitoring device 11, the pressure value of the process in which the adsorption medium in the adsorption pump 2 adsorbs the working gas can be accurately monitored. Since the change in the pressure value is closely related to the amount of working gas charged, precise control of the amount of working gas charged can be achieved.

[0100] Specifically, in this embodiment, the gas tank 4 is connected to the first pipeline through a second pipeline so that the second pipeline is connected to the charging port of the thermal switch body 1 .

[0101] In this embodiment, the second pipeline is provided with a first valve 6 for controlling the on-off of the second pipeline. By providing the first valve 6, the on-off of the second pipeline can be achieved. When ventilation is required, the first valve 6 is opened, and when inflation is not required, the valve is closed.

[0102] In some implementations of this embodiment, the first valve 6 is a fine-tuning valve; by selecting a fine-tuning valve as the first valve 6, the flow rate of the inflation can be adjusted very finely, thereby accurately controlling the amount of working gas charged. Exemplarily, the fine-tuning valve is a needle valve.

[0103] In some implementations of this embodiment, the inflation device further includes a cooling device 10 for cooling the adsorption pump 2. The provision of the cooling device 10 has the following advantages:

[0104] Improving Adsorption Efficiency: Lowering the temperature can increase the efficiency of gas adsorption by the adsorption pump 2. At lower temperatures, the thermal motion of gas molecules slows, making them more easily adsorbed onto the surface of the adsorption medium. Cooling device 10, by providing a low-temperature environment, promotes a more efficient adsorption process.

[0105] Increased adsorption capacity: The adsorption capacity of the adsorption medium generally increases with cooling. At lower temperatures, the adsorption medium surface can accommodate more gas molecules, thus increasing the adsorption capacity of the adsorption pump 2.

[0106] Increased pump speed: The cooling device 10 also helps increase the pump speed of the adsorption pump 2. The pump speed refers to the volume of gas that the adsorption pump 2 can pump per unit time. Through cooling, the adsorption process is faster, thereby increasing the pump speed.

[0107] Reduce back leakage: The cooling device 10 also helps to reduce back leakage, that is, when the adsorption pump 2 is working, some adsorbed gas molecules are released again. By using a low temperature environment, the problem of back leakage can be minimized.

[0108] In general, placing the adsorption pump 2 in the cooling device 10 helps to improve adsorption efficiency, adsorption capacity and pumping speed while reducing back leakage.

[0109] In some implementations of this embodiment, the cooling device 10 may be a tank that provides a preset ambient temperature, wherein the preset ambient temperature refers to the ambient temperature of the specific application of the air-gap thermal switch. In some optional implementations, the cooling device 10 may also be a tank filled with liquid nitrogen. Specifically, the adsorption pump 2 is placed in the tank filled with liquid nitrogen to achieve cooling of the adsorption pump 2.

[0110] In some implementations of this embodiment, the pressure monitoring device 11 is a pressure transmitter. By selecting a pressure transmitter as the pressure monitoring device 11, the pressure change in the air gap type thermal switch can be monitored in real time.

[0111] In some implementations of this embodiment, a pressure reducing valve 5 is provided on the communication path between the gas tank 4 and the first valve 6. By providing the pressure reducing valve 5, the pressure at the outlet of the gas tank 4 can be automatically adjusted and stabilized, ensuring that a predetermined working pressure is always maintained in the pipeline downstream of the pressure reducing valve 5.

[0112] In some implementations of this embodiment, the type of working gas is not specifically limited and can be helium, neon, argon, or nitrogen. For example, the working gas is helium, which has good thermal conductivity and can improve heat transfer efficiency.

[0113] In some implementations of this embodiment, the sealing device 9 is one of manual cold welding pliers, hydraulic sealing pliers, and ultrasonic sealing machines.

[0114] Figure 2 A second structural diagram of the inflation device of the air gap type thermal switch provided in the embodiment of the present application; Figure 2 As shown: This embodiment of the application discloses another air gap type thermal switch inflation device, Figure 1On the basis of the middle inflation device, it also includes a vacuum pump 8 and a four-way pipe 3. The vacuum pump 8 is connected to the inflation port of the thermal switch body 1 through a third pipeline that can be controlled to be on and off. The first pipe port of the four-way pipe 3 is connected to the inflation port of the thermal switch body 1; the second pipe port of the four-way pipe 3 is connected to the pressure monitoring device 11 through the first pipeline; the second pipe port of the four-way pipe 3 is connected to the gas tank 4 through the second pipeline; the fourth pipe port of the four-way pipe 3 is connected to the vacuum pump 8 through the third pipeline; the vacuum pump 8 is provided to perform vacuum treatment on the thermal switch body 1 and the adsorption pump 2 to ensure the purity of the gas flushed into the adsorption pump 2.

[0115] In some implementations of this embodiment, a second valve 7 is provided on the third pipeline to ensure the on-off of the third pipeline. Exemplarily, the second valve 7 includes a ball valve or an angle valve. By selecting a ball valve or an angle valve as the second valve 7, complete opening or closing can be achieved quickly.

[0116] Based on the same application concept, Figure 3 This is a first flow chart of the inflation method of the air gap type thermal switch provided in the embodiment of the present application; Figure 3 As shown: The embodiment of the present application also proposes an inflation method for an air gap type thermal switch, which includes the following steps.

[0117] Step S1, filling the thermal switch body and the adsorption pump with heat-conducting working gas through the gas tank and the connected second pipeline, and ending the gas filling when the pressure monitoring device detects a pressure value of a first threshold.

[0118] Step S2: Cool the adsorption pump, and when the pressure monitoring device detects a pressure value of a second threshold, use a sealing device to seal the inflation port of the thermal switch body, wherein the difference between the first threshold and the second threshold is the target inflation volume required for the air gap thermal switch to operate at a preset ambient temperature.

[0119] In the inflation method of this embodiment, when the pressure monitoring device monitors a pressure value of the first threshold, the inflation is terminated and the adsorption pump is cooled. When the pressure monitoring device monitors a pressure value of the second threshold, the sealing device is used to seal the inflation port of the thermal switch body. The difference between the first threshold and the second threshold is the amount of working gas charged into the adsorption pump. Therefore, by performing the inflation termination and sealing operations respectively when the pressure value monitored by the pressure monitoring device reaches the first threshold and the second threshold, the amount of working gas charged into the adsorption pump can be accurately controlled.

[0120] In an optional embodiment, according to the above Figure 3 The method shown in the embodiment of the present application also provides an inflation method. Figure 4 As shown, Figure 4This is a second flow chart of the inflation method provided in the embodiment of the present application. Before filling the thermal switch body and the adsorption pump with working gas, the following steps are also included.

[0121] Step S0: vacuuming the adsorption pump. The adsorption pump is vacuumed to ensure the purity of the working gas injected into the adsorption pump.

[0122] It should be noted that the preset ambient temperature refers to the ambient temperature in which the air-gap thermal switch is used. When the air-gap thermal switch is used in a dilution refrigerator, the preset ambient temperature is the application temperature within the dilution refrigerator. Because the target air volume required for the air-gap thermal switch to operate is not a fixed value but rather operates within a range of values, the first and second thresholds are not limited to fixed values ​​and are affected by the aforementioned ranges.

[0123] In an optional embodiment, according to the above Figure 3 The method shown in the embodiment of the present application also provides an inflation method. Figure 5 As shown, Figure 5 This is a third flow chart of the inflation method provided in the embodiment of the present application. The inflation method further includes the following steps.

[0124] Step S10: obtaining the maximum air filling volume of the air gap type thermal switch under a preset ambient temperature.

[0125] Step S20: obtaining the minimum air filling volume of the air gap type thermal switch under a preset ambient temperature.

[0126] Step S30: determining the first threshold and the second threshold according to the maximum inflation volume and the minimum inflation volume; wherein the target inflation volume is any inflation volume between the maximum inflation volume and the minimum inflation volume.

[0127] The above steps are described in detail below through specific implementation methods.

[0128] Regarding the above step S10, that is, at a preset ambient temperature, the maximum air filling volume of the air gap type thermal switch is obtained. Figure 6 This is a fourth flow chart of the inflation method of the air gap type thermal switch provided in the embodiment of the present application; Figure 6 As shown: In an optional embodiment, in the above Figure 5 Based on the method shown, the above step S10 is refined into the following steps, namely step S11 - step S12.

[0129] Step S11: Under a preset ambient temperature, turn off the heater of the adsorption pump and perform a first inflation test, wherein the first inflation test includes: filling the thermal switch body and the adsorption pump with working gas through a gas tank and a connected second pipeline, so that the thermal switch body is about to be turned on when the heater on the adsorption pump is not turned on and the thermal switch body is fully turned on when the heater on the adsorption pump is turned on.

[0130] In this step, the state in which the thermal switch body is about to be turned on is determined by a first temperature sensor provided at the cold end of the thermal switch body and a second temperature sensor provided at the hot end of the thermal switch body. When the temperatures of the first temperature sensor and the second temperature sensor are close to each other, it is determined that the thermal switch body is about to be turned on. In an optional embodiment, the temperatures of the first temperature sensor and the second temperature sensor are close to each other, including: the ratio of the temperature of the first temperature sensor to the temperature of the second temperature sensor is 4:(4.2-5). For example, when the temperature of the first temperature sensor is 4K and the temperature of the second temperature sensor is 5K, the ratio is 4:5, indicating that the thermal switch body is about to be turned on; for example, when the temperature of the first temperature sensor is 4K and the temperature of the second temperature sensor is 4.2K, the ratio is 4:4.2, also indicating that the thermal switch body is about to be turned on.

[0131] In this embodiment, the thermal switch body being fully conductive means that the temperature of the cold end and the hot end are equal. For example, the temperature of the cold end is 4K and the temperature of the hot end is also 4K.

[0132] In addition, it should be noted that the cold end and the hot end of the thermal switch body are the two opposite ends of the air flow direction of the air gap thermal switch, and the adsorption pump is arranged at the cold end; in an optional embodiment, when the air gap thermal switch is applied to a dilution refrigerator, the cold end and the hot end are respectively connected to a cold plate, the cold end is connected to the cold plate close to the cold head of the pulse tube refrigerator in the dilution refrigerator, and the hot end is connected to the cold plate away from the cold head. For example, the temperature of the cold head of the pulse tube refrigerator is 4K, which conducts the cold energy to the cold plate directly connected to it (the cold end of the air gap thermal switch can be connected to the cold plate), and the cold plate below it (the hot end of the air gap thermal switch is connected to the cold plate) is connected to the above-mentioned directly connected cold plate through the air gap thermal switch, and the conduction of cold energy is realized when the air gap thermal switch is turned on.

[0133] Step S12, obtaining the maximum air volume of the air gap thermal switch when the thermal switch body is fully conductive and the preset ambient temperature returns to room temperature when the heater is turned on, and the pressure monitoring value of the pressure monitoring device.

[0134] Figure 7 This is a fifth flow chart of the inflation method of the air gap type thermal switch provided in the embodiment of the present application; Figure 7 As shown: In an optional embodiment, in the above Figure 6Based on the method shown, step S11 is refined into the following steps, namely step S111 to step S113.

[0135] Step S111: Under a preset ambient temperature, the heater of the adsorption pump is turned off.

[0136] Step S112 , performing an inflating process on the air-gap thermal switch after the vacuum process, and stopping the inflating process when the temperature difference between the cold end and the hot end of the air-gap thermal switch reaches a first preset value.

[0137] Step S113, turning on the heater to determine whether the air gap thermal switch is conducting; if so, the experiment ends; if not, the air gap thermal switch continues to be inflated until the air gap thermal switch is fully conducting when the heater is turned on.

[0138] By evacuating the adsorption pump and then performing operations such as inflation and judgment, the accuracy of the maximum inflation volume finally obtained is improved.

[0139] It should be noted that the first preset value in step S112 is not specifically limited and is related to the ambient temperature when the air gap thermal switch is specifically used. For example, when the air gap thermal switch is used in a preset ambient temperature of 4K, the first preset value here can be 0.2-1.5K, preferably 0.2-1K. For example, the first preset value can be 0.2K, 0.5K or 1K.

[0140] With respect to the above step S20, the minimum air filling volume of the air gap type thermal switch is obtained under a preset ambient temperature. Figure 8 This is a sixth flow chart of the inflation method of the air gap type thermal switch provided in the embodiment of the present application; Figure 8 As shown: In an optional embodiment, in the above Figure 5 Based on the method shown, the above step S20 is refined into the following steps, namely step S21-step S22.

[0141] Step S21, under a preset ambient temperature, turn on the heater and perform a second inflation experiment, wherein the second inflation experiment includes: filling the thermal switch body and the adsorption pump with working gas through a gas tank and a connected second pipeline, so that the thermal switch body is fully conductive when the heater on the adsorption pump is turned on and the thermal switch body is not conductive when the heater on the adsorption pump is turned off.

[0142] Step S22 , obtaining the minimum air volume of the air gap thermal switch when the heater is turned off and the thermal switch body is not conducting and the preset ambient temperature returns to room temperature.

[0143] In step S21 of this embodiment, the thermal switch body is fully conductive when the temperatures of the cold end and the hot end are equal. For example, the cold end temperature is 4K and the hot end temperature is also 4K. The thermal switch body is not conductive when the temperatures of the cold end and the hot end are unequal. For example, the cold end temperature is 4K and the hot end temperature is also 50K.

[0144] Figure 9 This is a seventh flow chart of the inflation method of the air gap type thermal switch provided in the embodiment of the present application; Figure 9 As shown: In an optional embodiment, in the above Figure 8 Based on the method shown, step S21 is refined into the following steps, namely step S211 to step S213.

[0145] Step S211: Under a preset ambient temperature, the heater of the adsorption pump is turned on.

[0146] Step S212 , performing an inflating process on the air-gap thermal switch after the vacuum process, and stopping the inflating process when the cold end and the hot end of the air-gap thermal switch are conductive.

[0147] In step S213, the heater is turned off and it is determined whether the air-gap thermal switch is non-conductive; if so, the experiment ends; if not, the air-gap thermal switch is restored to room temperature and evacuated and the inflation step is performed again until the air-gap thermal switch is non-conductive when the heater is turned off.

[0148] By evacuating the adsorption pump and then performing operations such as inflation and judgment, the accuracy of the minimum inflation volume finally obtained is improved.

[0149] With respect to the above step S30, the first threshold value and the second threshold value are determined according to the maximum inflation volume and the minimum inflation volume. Figure 10 This is an eighth flow chart of the inflation method of the air gap type thermal switch provided in the embodiment of the present application; Figure 10 As shown: In an optional embodiment, in the above Figure 5 Based on the method shown, the above step S30 is refined into the following steps, namely step S31-step S32.

[0150] Step S31 : determining whether a first difference between the first threshold value and the second threshold value is between the maximum inflation volume and the minimum inflation volume.

[0151] Step S32: Determine a first threshold based on the maximum inflation volume and the adsorption rate of the adsorption medium in the adsorption pump, and determine a second threshold based on the first threshold and the first difference; or determine a second threshold based on the minimum inflation volume and the adsorption rate of the adsorption medium in the adsorption pump, and determine the first threshold based on the second threshold and the first difference.

[0152] It should be noted that in some implementations of this embodiment, the inflation method of this embodiment may further include a verification step for the air gap type thermal switch after inflation, specifically, verifying whether the air gap type thermal switch after inflation works normally at a preset ambient temperature, and adjusting the first threshold and the second threshold according to the verification result until it can work normally at the preset ambient temperature.

[0153] Figure 11 This is a first flow chart of a method for determining a target air filling volume of an air gap type thermal switch provided in an embodiment of the present application; Figure 11 As shown: The embodiment of the present application also proposes a method for determining the target inflation volume of an air gap type thermal switch, comprising the following steps.

[0154] Step S40: obtaining the maximum air filling volume of the air gap type thermal switch under a preset ambient temperature.

[0155] Step S50: obtaining the minimum air filling volume of the air gap type thermal switch under a preset ambient temperature.

[0156] Step S60 , determining the target air filling volume required for the air gap type thermal switch to operate at a preset ambient temperature according to the maximum air filling volume and the minimum air filling volume.

[0157] In this embodiment, the accuracy of the target inflation volume that is finally determined is ensured by obtaining the minimum inflation volume and the maximum inflation volume of the air-gap type thermally opened tube at a preset ambient temperature.

[0158] The following describes the embodiments of the present application through specific implementation methods.

[0159] Regarding the above step S40 , that is, obtaining the maximum air filling volume of the air gap type thermal switch under the preset ambient temperature. Figure 12 This is a second flow chart of the method for determining the target air filling volume of the air gap type thermal switch provided in the embodiment of the present application; Figure 12 As shown: In an optional embodiment, in the above Figure 11 Based on the method shown, the above step S40 is refined into the following steps, namely step S41-step S42.

[0160] Step S41: At a preset ambient temperature, turn off the heater of the adsorption pump and perform a first inflation experiment, wherein the first inflation experiment includes: filling the thermal switch body and the adsorption pump with working gas through a gas tank and a connected second pipeline, so that the thermal switch body is about to be turned on when the heater on the adsorption pump is not turned on, and the thermal switch body is fully turned on when the heater on the adsorption pump is turned on.

[0161] In this step, the state of the thermal switch body being about to be turned on is determined by a first temperature sensor located at the cold end of the thermal switch body and a second temperature sensor located at the hot end of the thermal switch body. When the temperatures of the first temperature sensor and the second temperature sensor are close to each other, the thermal switch body is determined to be about to be turned on. In one optional embodiment, the temperatures of the first temperature sensor and the second temperature sensor are close to each other, including: the ratio of the temperature of the first temperature sensor to the temperature of the second temperature sensor is 4:(4.2-5). For example, when the temperature of the first temperature sensor is 4K and the temperature of the second temperature sensor is 5K, the ratio of 4:5 indicates that the thermal switch body is about to be turned on.

[0162] In this embodiment, the thermal switch body being fully conductive means that the temperature of the cold end and the hot end are equal. For example, the temperature of the cold end is 4K and the temperature of the hot end is also 4K.

[0163] Step S42 , obtaining the maximum air volume of the air gap type thermal switch when the thermal switch body is fully conductive and the preset ambient temperature returns to room temperature, and the pressure monitoring value of the pressure monitoring device.

[0164] Figure 13 This is a third flow chart of the method for determining the target air filling volume of the air gap type thermal switch provided in the embodiment of the present application; Figure 13 As shown: In an optional embodiment, in the above Figure 12 Based on the method shown, step S41 is refined into the following steps, namely step S411 to step S413.

[0165] Step S411: Under a preset ambient temperature, the heater of the adsorption pump is turned off.

[0166] Step S412, the air gap type thermal switch after the vacuum treatment is inflated. When the temperature difference between the cold end and the hot end of the air gap type thermal switch (wherein the cold end and the hot end are two opposite ends of the air gap type thermal switch in the direction of air flow) reaches a first preset value, the inflation is stopped.

[0167] Step S413, turning on the heater to determine whether the air gap type thermal switch is conducting; if so, the experiment ends; if not, the air gap type thermal switch continues to perform the inflation process until the air gap type thermal switch is fully conducting when the heater is turned on.

[0168] With respect to the above step S50 , the minimum air filling volume of the air gap type thermal switch is obtained under a preset ambient temperature.

[0169] Figure 14 This is a fourth flow chart of the method for determining the target air filling volume of the air gap type thermal switch provided in the embodiment of the present application; Figure 14 As shown: In an optional embodiment, in the above Figure 11Based on the method shown, in an optional implementation of this embodiment, the above step S50 is refined into the following steps, namely step S51-step S52.

[0170] Step S51: at a preset ambient temperature, turn on the heater and perform a second inflation experiment, wherein the second inflation experiment includes: filling the thermal switch body and the adsorption pump with working gas through a gas tank and a connected second pipeline, so that the thermal switch body is fully conductive when the heater on the adsorption pump is turned on and the thermal switch body is not conductive when the heater on the adsorption pump is turned off.

[0171] Step S52 , obtaining a pressure monitoring value of the pressure monitoring device as the minimum air filling volume of the air gap type thermal switch when the thermal switch body is not conducting and the preset ambient temperature returns to room temperature when the heater is turned off.

[0172] In this embodiment, the thermal switch body is fully conductive when the temperature of the cold end and the hot end are equal. For example, the cold end temperature is 4K and the hot end temperature is also 4K. The thermal switch body is not conductive when the temperature of the cold end and the hot end are unequal. For example, the cold end temperature is 4K and the hot end temperature is also 50K.

[0173] Figure 15 This is a fifth flow chart of the method for determining the target air filling volume of the air gap type thermal switch provided in the embodiment of the present application; Figure 15 As shown: In an optional embodiment, in the above Figure 14 Based on the method shown, step S51 is refined into the following steps, namely step S511 to step S513.

[0174] Step S511: turning on the heater of the adsorption pump at a preset ambient temperature.

[0175] Step S512 , performing an inflating process on the air-gap thermal switch after the vacuuming process, and stopping the inflating process when the cold end and the hot end of the air-gap thermal switch are conductive.

[0176] In step S513, the heater is turned off and it is determined whether the air-gap thermal switch is non-conductive; if so, the experiment ends; if not, the air-gap thermal switch is restored to room temperature and evacuated and the inflation step is performed again until the air-gap thermal switch is non-conductive when the heater is turned off.

[0177] With respect to the above step S60, the target air filling volume required for the air gap type thermal switch to operate at a preset ambient temperature is determined according to the maximum air filling volume and the minimum air filling volume.

[0178] In this step, the target inflation volume can generally be within the range of greater than or equal to the maximum inflation volume and less than or equal to the minimum inflation volume. In an optional embodiment, to further improve the performance of the air-gap thermal switch, a performance test can be performed on the air-gap thermal switch within the above inflation volume range. For example, the switch ratio is tested, and the inflation volume of the air-gap thermal switch with the best test result is selected as the target inflation volume. In the method for determining the target inflation volume of this embodiment, the preset ambient temperature can be provided by a pulse tube refrigerator. In actual operation, in a relatively closed environment, the cold end of the air-gap thermal switch is directly connected to the cold head of the pulse tube refrigerator, and the gas tank and pressure monitoring device are placed outside the pulse tube refrigerator for inflation and pressure monitoring and are both connected to the inflation port of the air-gap thermal switch. The preset ambient temperature mentioned in the determination method is restored to room temperature, which means stopping the refrigeration operation of the pulse tube refrigerator to allow the temperature to return to room temperature. In some optional embodiments, room temperature in this application refers to a temperature range of 10-25°C.

[0179] Figure 16 Schematic diagram of the structure of the air gap type thermal switch provided in the embodiment of the present application; Figure 16 As shown: Based on the same application concept, the embodiment of the present application also proposes an air gap type thermal switch, including a thermal switch body 1, an adsorption pump 2 connected to the thermal switch body 1, and a heater 14 installed on the adsorption pump 2, the adsorption pump 2 is filled with an adsorption medium, and a gap filled with working gas is provided inside the thermal switch body 1. The working gas is filled into the adsorption pump 2 through the above-mentioned inflation device or the working gas is filled into the adsorption pump 2 using the above-mentioned inflation method or the target inflation amount required for the operation of the air gap type thermal switch is determined by the above-mentioned method.

[0180] The adsorption medium in this embodiment can be selected from materials with high adsorption performance and thermal stability. For example, the adsorption medium is activated carbon.

[0181] Based on the same application concept, an embodiment of the present application further proposes a dilution refrigerator, comprising a plurality of cold plates, with at least one air gap type thermal switch as described above being provided between adjacent cold plates.

[0182] Based on the same application concept, an embodiment of the present application further proposes a quantum computer, comprising a quantum chip and the above-mentioned dilution refrigerator, wherein the quantum chip is arranged in the lowest temperature zone of the dilution refrigerator.

[0183] Throughout this specification, references to terms such as "some embodiments" or "examples" indicate that the specific features, structures, materials, or characteristics described in conjunction with such embodiments or examples are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments. Furthermore, those skilled in the art may combine and reconcile the different embodiments or examples described in this specification.

[0184] The above description is merely a preferred embodiment of the present invention and does not limit the present invention in any way. Any person skilled in the art who, without departing from the scope of the present invention, makes any equivalent substitution, modification, or other changes to the technical solution and technical content disclosed in the present invention shall be deemed to be within the scope of the present invention and still fall within the scope of protection of the present invention.

Claims

1. An air-gap thermal switch inflation device, the air-gap thermal switch comprising a thermal switch body and an adsorption pump connected to the thermal switch body, characterized in that: The inflation device comprises: a pressure monitoring device, connected to the air filling port of the thermal switch body through a first pipeline, for real-time monitoring of a pressure value reflecting the amount of working gas in the air-gap thermal switch, wherein the adsorption effect of the adsorption pump on the working gas is affected by whether the adsorption pump is heated or cooled; A gas tank storing working gas therein, the gas tank being connected to the gas filling port of the thermal switch body via a second pipeline that can be controlled on and off; The sealing device is used to seal the inflation port of the thermal switch body when the pressure monitoring device monitors a pressure value that meets the target inflation volume.

2. The air-gap thermal switch inflation device according to claim 1, characterized in that: The gas tank is connected to the first pipeline through a second pipeline so that the second pipeline is connected to the charging port of the thermal switch body.

3. The gas filling device of the air gap type thermal switch according to claim 2, characterized in that: The second pipeline is provided with a first valve for controlling the on-off of the second pipeline.

4. The inflation device of the air gap type thermal switch according to claim 3, characterized in that: The first valve is a fine-tuning valve.

5. The inflation device of the air gap type thermal switch according to claim 1, characterized in that: The inflation device further comprises a cooling device for cooling the adsorption pump.

6. The gas filling device of the air gap type thermal switch according to claim 5, characterized in that: The cooling device is a tank filled with liquid nitrogen.

7. A method for inflating an air gap type thermal switch, the air gap type thermal switch comprising a thermal switch body and an adsorption pump connected to the thermal switch body, characterized in that: The inflation method includes: Filling the thermal switch body and the adsorption pump with working gas through a gas tank and a connected second pipeline, and ending the gas filling when the pressure monitoring device detects a pressure value of a first threshold; The adsorption pump is cooled, and when the pressure monitoring device detects a pressure value of a second threshold, the air filling port of the thermal switch body is sealed using a sealing device, wherein the difference between the first threshold and the second threshold is the target air filling volume required for the air gap thermal switch to operate at a preset ambient temperature.

8. The inflation method according to claim 7, characterized in that: Before filling the thermal switch body and the adsorption pump with working gas, the gas charging method further includes: performing a vacuum process on the adsorption pump.

9. The inflation method according to claim 7, characterized in that: The inflation method further comprises: Obtain the maximum air volume of the air gap thermal switch at the preset ambient temperature; Obtain the minimum air volume of the air gap thermal switch at the preset ambient temperature; The first threshold and the second threshold are determined according to the maximum inflation volume and the minimum inflation volume; wherein the target inflation volume is any inflation volume between the maximum inflation volume and the minimum inflation volume.

10. The inflation method according to claim 9, characterized in that: The steps of obtaining the maximum air filling volume of the air gap type thermal switch under a preset ambient temperature include: Turning off the heater of the adsorption pump and performing a first gas charging test, wherein the first gas charging test includes: filling the thermal switch body and the adsorption pump with working gas through a gas tank and a second connected pipeline, so that the thermal switch body is about to be turned on when the heater of the adsorption pump is not turned on, and the thermal switch body is fully turned on when the heater of the adsorption pump is turned on; When the heater is turned on and the thermal switch body is fully conductive and the preset ambient temperature returns to room temperature, the pressure monitoring value of the pressure monitoring device is the maximum air filling volume of the air gap thermal switch.

11. The inflation method according to claim 10, characterized in that: The state of the thermal switch body about to be turned on is determined by a first temperature sensor arranged at the cold end of the thermal switch body and a second temperature sensor arranged at the hot end of the thermal switch body. When the temperatures of the first temperature sensor and the second temperature sensor are close to each other, it is determined that the thermal switch body is about to be turned on.

12. The inflation method according to claim 11, characterized in that: The temperatures of the first temperature sensor and the second temperature sensor are close to each other, which includes: a ratio of the temperature of the first temperature sensor to the temperature of the second temperature sensor is 4:(4.2-5).

13. The inflation method according to claim 10, characterized in that: The step of filling the thermal switch body and the adsorption pump with working gas through a gas tank and a second connected pipeline so that the thermal switch body is about to be turned on when the heater on the adsorption pump is not turned on and the thermal switch body is fully turned on when the heater on the adsorption pump is turned on comprises: Inflate the air gap type thermal switch after the vacuum treatment, and stop inflating when the temperature difference between the cold end and the hot end of the air gap type thermal switch reaches a first preset value; Turn on the heater to determine whether the air gap thermal switch is conducting; If yes, the experiment ends; If not, the air gap thermal switch is continuously charged with gas until the air gap thermal switch is in a fully conductive state when the heater is turned on.

14. The inflation method according to claim 9, characterized in that: The steps of obtaining the minimum air filling volume of the air gap type thermal switch at a preset ambient temperature include: Under a preset ambient temperature, the heater is turned on and a second gas filling test is performed, wherein the second gas filling test includes: filling the thermal switch body and the adsorption pump with working gas through a gas tank and a second connected pipeline, so that the thermal switch body is fully conductive when the heater on the adsorption pump is turned on and the thermal switch body is not conductive when the heater on the adsorption pump is turned off; When the heater is turned off and the thermal switch body is not conductive and the preset ambient temperature returns to room temperature, the pressure monitoring value of the pressure monitoring device is the minimum inflation volume of the air gap thermal switch.

15. The inflation method according to claim 14, characterized in that: The step of filling the thermal switch body and the adsorption pump with working gas through a gas tank and a second connected pipeline so that the thermal switch body is fully conductive when the heater on the adsorption pump is turned on and the thermal switch body is not conductive when the heater on the adsorption pump is turned off comprises: Inflate the air-gap thermal switch after the vacuum treatment, and stop inflating when the cold end and the hot end of the air-gap thermal switch are conductive; Turn off the heater and determine whether the air gap thermal switch is non-conductive; If yes, the experiment ends; If not, the air gap type thermal switch is restored to room temperature and evacuated and then the inflation step is performed again until the air gap type thermal switch is in a non-conducting state when the heater is turned off.

16. The inflation method according to any one of claims 9 to 15, characterized in that: The step of determining the first threshold value and the second threshold value according to the maximum inflation volume and the minimum inflation volume includes: determining that a first difference between the first threshold value and the second threshold value is between the maximum inflation volume and the minimum inflation volume; determining a first threshold based on the maximum inflation volume and an adsorption rate of the adsorption medium in the adsorption pump, and determining a second threshold based on the first threshold and the first difference; Alternatively, the second threshold is determined based on the minimum inflation volume and the adsorption rate of the adsorption medium in the adsorption pump, and the first threshold is determined based on the second threshold and the first difference.

17. A method for determining a target air filling volume of an air gap type thermal switch, the air gap type thermal switch comprising a thermal switch body and an adsorption pump connected to the thermal switch body, characterized in that: The determination method includes: Obtain the maximum air volume of the air gap thermal switch at the preset ambient temperature; Obtain the minimum air volume of the air gap thermal switch at the preset ambient temperature; The target air filling volume required for the air gap type thermal switch to operate at a preset ambient temperature is determined according to the maximum air filling volume and the minimum air filling volume.

18. The determination method according to claim 17, characterized in that: It is characterized by: The steps of obtaining the maximum air filling volume of the air gap type thermal switch under a preset ambient temperature include: Turning off the heater of the adsorption pump and performing a first gas charging test, wherein the first gas charging test includes: filling the thermal switch body and the adsorption pump with working gas through a gas tank and a second connected pipeline, so that the thermal switch body is about to be turned on when the heater of the adsorption pump is not turned on, and the thermal switch body is fully turned on when the heater of the adsorption pump is turned on; When the heater is turned on and the thermal switch body is fully conductive and the preset ambient temperature returns to room temperature, the pressure monitoring value of the pressure monitoring device is the maximum inflation volume of the air gap thermal switch.

19. The determination method according to claim 18, characterized in that: The state of the thermal switch body about to be turned on is determined by a first temperature sensor arranged at the cold end of the thermal switch body and a second temperature sensor arranged at the hot end of the thermal switch body. When the temperatures of the first temperature sensor and the second temperature sensor are close to each other, it is determined that the thermal switch body is about to be turned on.

20. The determination method according to claim 19, characterized in that: The temperatures of the first temperature sensor and the second temperature sensor are close to each other, which includes: a ratio of the temperature of the first temperature sensor to the temperature of the second temperature sensor is 4:(4.2-5).

21. The determination method according to claim 18, characterized in that: The step of filling the thermal switch body and the adsorption pump with working gas through a gas tank and a second connected pipeline so that the thermal switch body is about to be turned on when the heater on the adsorption pump is not turned on and the thermal switch body is fully turned on when the heater on the adsorption pump is turned on comprises: Inflate the air gap type thermal switch after the vacuum treatment, and stop inflating when the temperature difference between the cold end and the hot end of the air gap type thermal switch reaches a first preset value; Turn on the heater to determine whether the air gap thermal switch is conducting; If yes, the experiment ends; If not, the air gap thermal switch is continuously charged with gas until the air gap thermal switch is in a fully conductive state when the heater is turned on.

22. The determination method according to claim 17, characterized in that: The steps of obtaining the minimum air filling volume of the air gap type thermal switch at a preset ambient temperature include: Under a preset ambient temperature, the heater is turned on and a second gas filling test is performed, wherein the second gas filling test includes: filling the thermal switch body and the adsorption pump with working gas through a gas tank and a second connected pipeline, so that the thermal switch body is fully conductive when the heater on the adsorption pump is turned on and the thermal switch body is not conductive when the heater on the adsorption pump is turned off; When the heater is turned off and the thermal switch body is not conductive and the preset ambient temperature returns to room temperature, the pressure monitoring value of the pressure monitoring device is the minimum inflation volume of the air gap thermal switch.

23. The determination method according to claim 22, characterized in that: The step of filling the thermal switch body and the adsorption pump with working gas through a gas tank and a second connected pipeline so that the thermal switch body is fully conductive when the heater on the adsorption pump is turned on and the thermal switch body is not conductive when the heater on the adsorption pump is turned off comprises: Inflate the air-gap thermal switch after the vacuum treatment, and stop inflating when the cold end and the hot end of the air-gap thermal switch are conductive; Turn off the heater and determine whether the air gap thermal switch is non-conductive; If yes, the experiment ends; If not, the air gap type thermal switch is restored to room temperature and evacuated and then the inflation step is performed again until the air gap type thermal switch is in a non-conducting state when the heater is turned off.

24. An air gap thermal switch, characterized in that: The invention comprises a thermal switch body, an adsorption pump connected to the thermal switch body, and a heater installed on the adsorption pump, wherein the adsorption pump is filled with an adsorption medium, and a gap for filling a working gas is provided inside the thermal switch body. The working gas is filled into the adsorption pump by the inflation device according to any one of claims 1 to 6, or the working gas is filled into the adsorption pump by the inflation method according to any one of claims 7 to 16, or the target inflation volume required for the operation of the air gap thermal switch is determined by the determination method according to any one of claims 17 to 23.

25. A dilution refrigerator, characterized in that: It comprises a plurality of cold plates, and at least one air gap type thermal switch as claimed in claim 24 is provided between adjacent cold plates.

26. A quantum computer, characterized in that The invention comprises a quantum chip and the dilution refrigerator according to claim 25, wherein the quantum chip is arranged in the lowest temperature zone of the dilution refrigerator.

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