Multi-chip wafer packaging processing system

Abstract

The invention relates to the technical field of semiconductor packaging, in particular to a multi-chip wafer packaging processing system which comprises a fixing frame, the fixing frame is provided with a first frame body and an installation support located on the periphery of the first frame body in the circumferential direction, and the first frame body is internally provided with a first discharging mechanism used for containing a first wafer. A mounting plate and a driving part for driving the mounting plate to lift are arranged on the mounting bracket, a second frame body is arranged on the mounting plate, a second emptying mechanism for placing a second wafer is arranged in the second frame body, and alignment marks are arranged on the first wafer and the second wafer; the fixing frame is provided with a reflection assembly used for reflecting the alignment marks on the first wafer and the second wafer to the same plane at the same time, and the fixing frame is further provided with a reading device. According to the invention, the alignment precision of the two wafers in the bonding process can be improved, so that the bonding precision between the two wafers can be improved, and the yield of the packaged wafers can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor packaging, in particular to a multi-chip wafer packaging processing system. BACKGROUND

[0002] Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, which is a basic material for manufacturing chips. Semiconductor packaging refers to a process of processing a wafer that has passed the test into an independent chip according to product model and functional requirements. Hybrid bonding technology is a new type of semiconductor packaging technology, which can integrate homogeneous and heterogeneous materials and realize vertical stacking to improve chip performance. Compared with the traditional thermal compression bonding technology, the hybrid bonding technology does not require solder bumps and can realize higher density interconnection and reduce chip power consumption. Generally, the hybrid bonding process can be divided into three process stages of surface treatment, alignment bonding and post-treatment. Among them, the surface treatment process uses plasma or acid-base to clean and activate the wafer surface to enhance adhesion; the alignment bonding is to complete the high-precision alignment of multiple wafers to ensure that the pads are one-to-one corresponding, and then directly bond under the action of a certain pressure through van der Waals force, molecular and atomic force; the post-treatment process is to strengthen the bonding by annealing, and the annealing temperature is usually 200 to 300°C.

[0003] In the above entire process flow, the alignment accuracy is a key indicator affecting the electrical connection and reliability between multiple chips. Once the alignment accuracy is problematic, it will greatly affect the yield of the chips. In the existing alignment bonding process, the main bonding method is to respectively align the alignment marks on two wafers through two sets of visual positioning systems, position the positions of the two wafers, and then convert the coordinate system through a certain functional relationship to realize the alignment of the two wafers, thereby realizing the high-precision bonding between the two wafers.

[0004] However, the positioning method using two sets of visual positioning systems is easy to cause positioning errors due to mechanical movement, equipment vibration and motion control, thereby easily affecting the alignment accuracy between the two wafers, and further affecting the bonding accuracy between the two wafers. SUMMARY

[0005] In order to improve the alignment accuracy of the two wafers in the bonding process, thereby improving the bonding accuracy between the two wafers, and further improving the yield of the wafer packaging processing, the present application provides a multi-chip wafer packaging processing system.

[0006] The present application provides a multi-chip wafer packaging processing system, which adopts the following technical scheme: The application discloses a multi-chip wafer packaging processing system, which comprises a fixing frame, a first frame body and a mounting support arranged on the circumferential periphery of the first frame body, a first material placing mechanism arranged in the first frame body for placing a first wafer, a mounting plate and a driving element for driving the mounting plate to ascend and descend, a second frame body arranged on the mounting plate, a second material placing mechanism arranged in the second frame body for placing a second wafer, alignment marks arranged on the first wafer and the second wafer, a reflection assembly arranged on the fixing frame and used for simultaneously reflecting the alignment marks on the first wafer and the second wafer to the same plane, and a reading device arranged on the fixing frame and used for reading the position information of the reflected alignment marks.

[0007] By adopting the technical scheme, the reflection assembly is used to help simultaneously reflect the alignment marks on the first wafer and the second wafer to the reading surface of the reading device, the reading device is used to help read the position information of the two alignment marks, the read information is transmitted to the processor for processing, the first wafer and the second wafer can be accurately positioned, whether the first wafer and the second wafer are aligned can be determined, compared with the positioning mode of adopting two sets of visual positioning systems, the application can help to avoid the positioning errors caused by mechanical movement, equipment vibration and motion control of the two sets of visual positioning systems, can help to improve the alignment accuracy of the first wafer and the second wafer in the bonding process, can help to improve the bonding accuracy between the first wafer and the second wafer, and can help to improve the yield of the first wafer and the second wafer after packaging processing.

[0008] In a specific embodiment, the reflection assembly comprises a placing seat, a driving cylinder, an extension rod and a reflection block, the placing seat is arranged on the fixing frame, the driving cylinder is arranged on the placing seat, the extension rod is coaxially connected with a piston rod of the driving cylinder, the reflection block is arranged at one end of the extension rod away from the piston rod of the driving cylinder, the first reflection mirror surface and the second reflection mirror surface are symmetrically arranged on the reflection block, and the included angles between the first reflection mirror surface and the second reflection mirror surface and the horizontal plane are both 45 degrees.

[0009] By adopting the above technical scheme, when the distance between the first wafer and the second wafer reaches the set distance, the driving cylinder helps the extension rod drive the reflection block to move horizontally to the middle position of the first wafer and the second wafer, so as to help the first reflection mirror and the second reflection mirror reflect the alignment marks on the first wafer and the second wafer to the reading surface of the reading device at the same time, the reading device helps to read the position information of the two alignment marks, and after the read information is transmitted to the processor for processing, the first wafer and the second wafer can be accurately positioned, which helps to judge whether the first wafer and the second wafer are aligned, improves the alignment accuracy of the first wafer and the second wafer in the bonding process, and thus improves the bonding accuracy between the first wafer and the second wafer, and further improves the yield of the first wafer and the second wafer after packaging processing.

[0010] In a specific embodiment, the first placing mechanism includes a first bearing table arranged in the first frame body, and a first placing groove for placing the first wafer is arranged on the first bearing table. A positioning assembly for positioning the placing position of the first bearing table is arranged in the first frame body, and a limiting assembly for limiting the first wafer placed in the first placing groove is arranged in the first bearing table.

[0011] By adopting the above technical scheme, after the first wafer is placed in the first placing groove, the limiting assembly helps to clamp and limit the first wafer, thereby improving the stability of the first wafer placed in the first placing groove. The positioning assembly helps to position the first bearing table and adjust the placing position of the first bearing table in the first frame body, thereby adjusting the position of the first wafer.

[0012] In a specific embodiment, the positioning assembly includes a first electric push rod, a first clamping block, a second electric push rod, and a second clamping block. First and second clamping grooves are respectively arranged on the adjacent two side walls of the first bearing table, and the first and second clamping grooves are horizontally arranged. The first electric push rod is arranged in the first frame body near one side of the first clamping groove, the first clamping block is arranged on the output end of the first electric push rod and is slidably clamped in the first clamping groove, the second electric push rod is arranged in the first frame body near one side of the second clamping groove, and the second clamping block is arranged on the output end of the second electric push rod and is slidably clamped in the second clamping groove.

[0013] By adopting the technical scheme, the first electric push rod helps to push the first clamping block to move, the sliding of the second clamping block in the second clamping groove helps to guide and limit the moving direction of the first bearing table, thereby helping to drive the first bearing table to move horizontally along the length direction of the first electric push rod; the second electric push rod helps to push the second clamping block to move, the sliding of the first clamping block in the first clamping groove helps to guide and limit the moving direction of the first bearing table, thereby helping to drive the first bearing table to move horizontally along the length direction of the second electric push rod; the cooperation of the first electric push rod and the second electric push rod helps to finely adjust the position of the first bearing table in the first frame body, thereby helping to finely adjust the position of the first wafer.

[0014] In one specific implementation scheme, the position limiting assembly comprises a jacking cylinder, the first bearing table is provided with a mounting blind hole communicating with the first placing groove, the jacking cylinder is arranged in the mounting blind hole, a work-type shaft disc is arranged on the piston rod of the jacking cylinder, mounting grooves are symmetrically arranged on both sides of the mounting blind hole in the first bearing table and communicate with the mounting blind hole, first and second rotating plates are rotatably arranged in the mounting grooves, the first and second rotating plates are connected by a connecting plate and arranged in parallel, one end of the first rotating plate away from the connecting plate is inserted into the work-type shaft disc, one end of the second rotating plate away from the connecting plate is provided with a limiting block, and a jacking plate is arranged on the work-type shaft disc.

[0015] By adopting the technical scheme, when the first wafer is clamped and limited, the jacking cylinder helps to drive the work-type shaft disc to move downward in the vertical direction, thereby helping to drive the first rotating plate to rotate, and further helping to synchronously rotate the second rotating plate and the limiting block under the driving of the connecting plate, helping to clamp and limit the first wafer by the two limiting blocks after rotation, thereby helping to improve the stability of the first wafer placed in the first placing groove. When the first wafer is jacked out of the first placing groove, the jacking cylinder helps to drive the work-type shaft disc to move upward in the vertical direction, thereby helping to drive the first rotating plate to reversely rotate, and further helping to synchronously reversely rotate the second rotating plate and the limiting block under the driving of the connecting plate, helping to release the clamping and limitation of the first wafer by the two limiting blocks, and at the same time, the jacking plate is synchronously moved upward in the process of upward movement of the work-type shaft disc, the jacking plate after upward movement helps to jack the first wafer after release of the limitation, thereby helping to jack the first wafer out of the first placing groove.

[0016] In one specific implementation, the second placing mechanism comprises a second bearing table arranged inside a second frame, the second frame and the second bearing table jointly form an enclosed cavity, the second bearing table is provided with a second placing slot for placing a second wafer on one side of the enclosed cavity, a through hole is arranged through the second bearing table for connecting the enclosed cavity and the second placing slot, an electric cylinder is arranged on the mounting plate, the output end of the electric cylinder is provided with a connecting plate, both ends of the connecting plate are provided with connecting rods, one end of the connecting rod away from the connecting plate is inserted into the second frame, the end of the connecting rod inserted into the second frame is provided with a piston, and the circumferential sidewall of the piston is in sliding fit with the inner sidewall of the enclosed cavity.

[0017] By adopting the above technical scheme, when the second wafer is placed into the second placing slot, the electric cylinder helps to drive the connecting plate and the connecting rod to move upward, thereby helping to drive the piston to move in the enclosed cavity towards the direction away from the second bearing table, and further helping to generate negative pressure between the piston and the second bearing table, and helping to generate suction force on the second wafer placed in the second placing slot through the through hole, thereby helping to improve the stability of the second wafer placed in the second placing slot.

[0018] In one specific implementation, the mounting bracket comprises a mounting top plate and a plurality of columns, the plurality of columns are fixedly arranged on the fixed frame and located at the circumferential periphery of the first frame, the mounting top plate is arranged at the top end of the plurality of columns, an axle sleeve is slidingly sleeved on each of the columns, the mounting plate is fixedly sleeved on the plurality of axle sleeves, and a stop mechanism for limiting the lifting of the mounting plate is arranged on each of the columns.

[0019] By adopting the above technical scheme, when the driving member drives the mounting plate to slide up and down on the columns to the set position, the stop mechanism helps to stop the mounting plate, thereby helping to symmetrically distribute the first wafer and the second wafer on both sides of the reflection block, and further helping to improve the accuracy of the reflection block in reflecting the alignment mark position on the first wafer and the second wafer.

[0020] In one specific implementation, the stop mechanism comprises a supporting spring arranged on the fixed frame and sleeved on the circumferential periphery of the column, a stop sleeve ring is sleeved on the column, the stop sleeve ring is connected with the supporting spring, a through hole is arranged through the sidewall of the stop sleeve ring, a plug-in hole is arranged on the sidewall of the column for communicating with the through hole, and a plug-in assembly for being sequentially inserted into the through hole and the plug-in hole is arranged on the fixed frame.

[0021] By adopting the above technical scheme, the plug-in assembly helps to be sequentially inserted into the penetrating hole and the plug-in hole inside, thereby helping to position the position of the stop ring on the stand, and further helping to stop the mounting plate by the stop ring.

[0022] In one specific implementation, the plug-in assembly includes a mounting seat arranged on the fixing frame, an opening is arranged through the mounting seat, a lifting plate is arranged in the opening in a liftable manner, a connecting rod is arranged at the top end of the lifting plate in a hinged manner, a plug-in rod is arranged at the end of the connecting rod away from the lifting plate in a horizontal manner, the plug-in rod penetrates the mounting seat and is in sliding connection with the mounting seat, the plug-in rod is flush with the penetrating hole, a through slot is arranged through the lifting plate, a strip-shaped tooth is arranged on the side wall of the through slot in the vertical direction, a transmission gear is arranged on the mounting seat in a rotating manner, the transmission gear is located inside the through slot and is in engagement with the strip-shaped tooth, the extension rod is a threaded rod, and the extension rod penetrates the transmission gear and is in threaded connection with the transmission gear.

[0023] By adopting the above technical scheme, the extension rod helps to drive the transmission gear to rotate, thereby helping to drive the lifting plate to rise through the strip-shaped tooth, and further helping to drive the plug-in rod to move horizontally towards the penetrating hole through the connecting rod until the plug-in rod penetrates the penetrating hole and is inserted into the plug-in hole inside, helping to position the position of the stop ring on the stand by the plug-in rod, thereby helping to stop the mounting plate by the stop ring.

[0024] In one specific implementation, one side of the first frame body towards the second frame body is provided with a mounting ring groove, and a buffer ring for buffering and damping is arranged in the mounting ring groove in a clamped manner.

[0025] By adopting the above technical scheme, the buffer ring helps to buffer and dampen during the contact of the first frame body and the second frame body, thereby helping to improve the stability of the first wafer placed in the first placing groove and the stability of the second wafer placed in the second placing groove, and further helping to ensure the alignment accuracy of the first wafer and the second wafer.

[0026] In summary, the present application has at least one of the following beneficial technical effects: 1. The application helps to reflect the alignment marks on the first wafer and the second wafer to the reading surface of the reading device at the same time through the setting of the reflection assembly and the reading device, helps to read the position information of the two alignment marks by using the reading device, and then helps to accurately position the first wafer and the second wafer after processing the read information in the processor, so as to help to judge whether the first wafer and the second wafer are aligned. Compared with the positioning mode of using two sets of visual positioning systems, the application helps to avoid the positioning error caused by mechanical movement, equipment vibration and motion control of the two sets of visual positioning systems as much as possible, helps to improve the alignment accuracy of the first wafer and the second wafer in the bonding process, helps to improve the bonding accuracy between the first wafer and the second wafer, and further helps to improve the yield of the first wafer and the second wafer after packaging processing. 2. The application helps to clamp and position the first wafer placed in the first placing groove through the setting of the limiting assembly and the positioning assembly, so as to help to improve the stability of the first wafer placed in the first placing groove; the positioning assembly helps to position the position of the first bearing table in the first frame body, and helps to finely adjust the placing position of the first bearing table in the first frame body, so as to help to finely adjust the position of the first wafer. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 is the overall structure schematic diagram of the embodiment of the application.

[0028] Figure 2 is the schematic diagram of the specific structure of the positioning assembly.

[0029] Figure 3 is the schematic diagram of the specific structure of the limiting assembly.

[0030] Figure 4 is the sectional view of the specific structure inside the second frame body.

[0031] Figure 5 is the schematic diagram of the specific structure of the plug-in assembly.

[0032] Explanation of reference signs: 1, fixed frame; 2, first frame body; 3, mounting support; 31, mounting top plate; 32, stand column; 4, mounting plate; 5, driving piece; 6, second frame body; 7, alignment mark; 8, reflection assembly; 81, placing seat; 82, driving cylinder; 83, extension rod; 84, reflection block; 841, first reflection mirror surface; 842, second reflection mirror surface; 9, reading device; 10, first bearing table; 11, first placing groove; 12, positioning assembly; 121, first electric push rod; 122, first clamping block; 123, second electric push rod; 124, second clamping block; 13, first clamping groove; 14, second clamping groove; 15, limiting assembly; 151, jacking cylinder; 152, I-shaped shaft disc; 153, first rotating plate; 154, second rotating plate; 155, connecting plate; 156, limiting block; 16, mounting blind hole; 17, mounting groove; 18, jacking plate; 19, second bearing table; 20, closed chamber; 21, second placing groove; 22, communication hole; 23, electric cylinder; 24, connecting plate; 25, connecting rod; 26, piston; 27, shaft sleeve; 28, jacking spring; 29, stop collar; 30, insertion hole; 33, insertion hole; 34, insertion assembly; 35, mounting seat; 36, opening; 37, lifting plate; 38, connecting rod; 39, insertion rod; 40, through groove; 41, strip-shaped tooth; 42, transmission gear; 43, mounting ring groove; 44, buffer pad ring; 45, first wafer; 46, second wafer. DETAILED DESCRIPTION

[0033] The application will be further described in detail below with reference to the drawings.

[0034] The application discloses a multi-chip wafer packaging processing system, referring to Figure 1 , comprising a fixed frame 1, a first frame body 2 and a mounting support 3 are fixedly installed on the top surface of the fixed frame 1, in the embodiment, the mounting support 3 comprises a mounting top plate 31 and four stand columns 32, the four stand columns 32 are fixedly installed on the top surface of the fixed frame 1 and are distributed at the four corners of the periphery of the first frame body 2, and the mounting top plate 31 is fixedly installed at the top end of the four stand columns 32. An axle sleeve 27 is slidably sleeved on the circumference of each stand column 32, four axle sleeves 27 are collectively sleeved on the four axle sleeves 27, two driving pieces 5 are fixedly arranged on the bottom surface of the mounting top plate 31, in the embodiment, the driving pieces 5 are electric push rods, the output ends of the two electric push rods are fixedly connected with the top surface of the mounting plate 4, and a second frame body 6 is fixedly installed on the bottom surface of the mounting plate 4.

[0035] Referring to Figure 2 and Figure 3The first frame 2 is internally provided with a first feeding mechanism. The first feeding mechanism comprises a first bearing table 10 movably placed in the first frame 2. A first placing groove 11 is formed in the top surface of the first bearing table 10. A first wafer 45 is clamped and placed in the first placing groove 11. The first wafer 45 is provided with an alignment mark 7. An installation ring groove 43 is formed in the top surface of the first frame 2. A buffer pad ring 44 is clamped and installed in the installation ring groove 43.

[0036] With reference to Figure 2 and Figure 3 The first frame 2 is internally provided with a positioning assembly 12. The positioning assembly 12 comprises a first electric push rod 121, a first clamping block 122, a second movable push rod 123 and a second clamping block 124. First and second clamping grooves 13 and 14 are respectively formed in the adjacent two side walls of the first bearing table 10. The first and second clamping grooves 13 and 14 are both horizontally arranged. The first electric push rod 121 is fixedly installed in the first frame 2 near one side of the first clamping groove 13. The output end of the first electric push rod 121 extends towards the first clamping groove 13. The first clamping block 122 is fixedly installed on the output end of the first electric push rod 121 and is slidably clamped in the first clamping groove 13. The second electric push rod 123 is fixedly installed in the first frame 2 near one side of the second clamping groove 14. The output end of the second electric push rod 123 extends towards the second clamping groove 14. The second clamping block 124 is fixedly installed on the output end of the second electric push rod 123 and is slidably clamped in the second clamping groove 14.

[0037] With reference to Figure 3 An installation blind hole 16 is formed in the bottom groove wall of the first placing groove 11 in the first bearing table 10. Installation grooves 17 that are in communication with the installation blind hole 16 are symmetrically formed on the top of the first bearing table 10. A limiting assembly 15 is arranged in the installation blind hole 16 and the two installation grooves 17. The limiting assembly 15 comprises a jacking air cylinder 151. The jacking air cylinder 151 is fixedly installed in the installation blind hole 16. The piston rod of the jacking air cylinder 151 extends upwards. A work-type shaft disc 152 is fixedly arranged on the top end of the piston rod of the jacking air cylinder 151. A jacking plate 18 is fixedly installed on the top surface of the work-type shaft disc 152. First and second rotating plates 153 and 154 that are arranged in parallel with each other are rotatably installed in each installation groove 17. A connecting plate 155 is hingedly connected to the end of the first rotating plate 153 away from the jacking air cylinder 151. The end of the connecting plate 155 away from the first rotating plate 153 is hingedly connected to the second rotating plate 154. The end of the first rotating plate 153 away from the connecting plate 155 is inserted into the work-type shaft disc 152. The end of the second rotating plate 154 away from the connecting plate 155 is fixedly provided with a limiting block 156.

[0038] With reference to Figure 2 and Figure 3The operator places the first wafer 45 into the first placement slot 11, and the piston rod of the lifting cylinder 151 contracts, driving the work-type shaft disc 152 to move downward synchronously, thereby driving the first rotating plates 153 on both sides to rotate, and then driven by the connecting plate 155, driving the second rotating plate 154 and the limit block 156 to rotate synchronously, which helps to use the two rotated limit blocks 156 to clamp and limit the first wafer 45, thereby helping to improve the stability of the first wafer 45 placed in the first placement slot 11.

[0039] Reference Figure 1 and Figure 4 A second material discharge mechanism is provided inside the second frame 6. The second material discharge mechanism includes a second carrier 19 fixedly mounted in the second frame 6. A second placement groove 21 is provided on the bottom surface of the second carrier 19. A second wafer 46 is clamped and placed in the second placement groove 21. The second wafer 46 has an alignment mark 7 relative to the first wafer 45. The second carrier 19 and the second frame 6 together form a closed chamber 20. The second carrier 19 is provided with a plurality of connecting holes 22 that connect the closed chamber 20 and the second placement groove 21. An electric cylinder 23 is fixedly mounted on the top surface of the mounting plate 4. The output end of the electric cylinder 23 extends upward and is fixedly mounted with a connecting plate 24. Vertically arranged connecting rods 25 are fixedly mounted on the bottom surfaces of both ends of the connecting plate 24. The bottom ends of the two connecting rods 25 are both inserted into the closed chamber 20, and the bottom ends of the two piston rods are jointly mounted with a piston 26. The circumferential side wall of the piston 26 slides in contact with the inner wall of the closed chamber 20.

[0040] Reference Figure 1 and Figure 4 The operator places the second wafer 46 into the second placement groove 21, and the piston rod of the electric cylinder 23 extends, driving the connecting plate 24 and the connecting rod 25 to move upward, thereby driving the piston 26 to move in the closed chamber 20 in the direction away from the second supporting platform 19, thereby generating negative pressure between the piston 26 and the second supporting platform 19, which helps to generate suction to the second wafer 46 placed in the second placement groove 21 through the connecting hole 22, thereby helping to improve the stability of the second wafer 46 placed in the second placement groove 21.

[0041] Reference Figure 1The fixed frame 1 is provided with a reflection assembly 8 on one side of the first frame body 2, and a reading device 9 is mounted on the side of the fixed frame 1 away from the reflection assembly 8. The reflection assembly 8 comprises a placing seat 81, a driving cylinder 82, an extension rod 83 and a reflection block 84. The placing seat 81 is fixedly mounted on the fixed frame 1. The driving cylinder 82 is fixedly mounted on the top surface of the placing seat 81. The piston rod of the driving cylinder 82 horizontally extends towards the first frame body 2. The extension rod 83 is coaxially and fixedly connected to the piston rod of the driving cylinder 82. The reflection block 84 is fixedly mounted on the end of the extension rod 83 away from the piston rod of the driving cylinder 82. The reflection block 84 is provided with symmetrically arranged first and second reflection mirror surfaces 841 and 842. The included angle between each of the first and second reflection mirror surfaces 841 and 842 and the horizontal plane is 45 degrees.

[0042] With reference to Figure 1 and Figure 5 The four columns 32 are provided with a stop mechanism. The stop mechanism comprises a supporting spring 28 which is fixedly mounted on the fixed frame 1 and sleeved on the circumferential periphery of the column 32. A stop sleeve 29 is slidably sleeved on the column 32. The bottom surface of the stop sleeve 29 is connected to the top end of the supporting spring 28. A penetrating hole 30 is formed through the side wall of the stop sleeve 29. A plug-in hole 33 is formed in the side wall of the column 32. The plug-in hole 33 has the same hole diameter as the penetrating hole 30. The fixed frame 1 is provided with a plug-in assembly 34.

[0043] With reference to Figure 5 The plug-in assembly 34 comprises a mounting seat 35 fixed on the fixed frame 1. An opening 36 is formed through the mounting seat 35. A lifting plate 37 is liftably connected to the opening 36. The top end of the lifting plate 37 is hingedly connected to a connecting rod 38. The end of the connecting rod 38 away from the lifting plate 37 is hingedly connected to a horizontally arranged plug-in rod 39. The plug-in rod 39 penetrates the mounting seat 35 and is slidably connected to the mounting seat 35. The plug-in rod 39 is flush with the penetrating hole 30. A through slot 40 is formed through the lifting plate 37. A strip-shaped tooth 41 is integrally formed on the side wall of the through slot 40 in the vertical direction. A transmission gear 42 is rotatably connected to the mounting seat 35. The transmission gear 42 is located inside the through slot 40 and is engaged with the strip-shaped tooth 41. In this embodiment, the extension rod 83 is a threaded rod. The extension rod 83 penetrates the transmission gear 42 and is threadedly connected to the transmission gear 42.

[0044] With reference to Figure 1 and Figure 5, the piston rod of the electric push rod extends, driving the mounting plate 4 to slide downward on the stand 32; at the same time, the piston rod of the drive cylinder 82 extends, driving the reflecting block 84 to move horizontally to the set position through the extension rod 83. While the extension rod 83 moves, the transmission gear 42 rotates under the action of the extension rod 83, thereby driving the lifting plate 37 to rise through the strip-shaped teeth 41, and further causing the connecting rod 38 to push the insertion rod 39 to move horizontally towards the direction of the insertion hole 30 until the insertion rod 39 is inserted into the insertion hole 33, which helps to position the stop ring 29 on the stand 32 by using the insertion rod 39, thereby helping to stop the mounting plate 4 by using the stop ring 29, and further helping to symmetrically distribute the first wafer 45 and the second wafer 46 on both sides of the reflecting block 84.

[0045] With reference to Figure 1 and Figure 3 When the first wafer 45 and the second wafer 46 are symmetrically distributed on both sides of the reflecting block 84, the first reflecting mirror surface 841 and the second reflecting mirror surface 842 simultaneously reflect the alignment marks 7 on the first wafer 45 and the second wafer 46 to the reading surface of the reading device 9, the reading device 9 reads the position information of the two alignment marks 7, and after processing the read information in the processor, the first wafer 45 and the second wafer 46 can be precisely positioned, which helps to improve the alignment accuracy of the first wafer 45 and the second wafer 46 in the bonding process, thereby helping to improve the bonding accuracy between the first wafer 45 and the second wafer 46, and further helping to improve the yield of the first wafer 45 and the second wafer 46 after packaging processing.

[0046] With reference to Figure 2 and Figure 3 When the first wafer 45 and the second wafer 46 are not aligned, the first electric push rod 121 is started, driving the first bearing table 10 to move horizontally along the length direction of the first electric push rod 121 through the first clamping block 122; the second electric push rod 123 is started, driving the second bearing table 19 to move horizontally along the length direction of the second electric push rod 123 through the second clamping block 124, which helps to finely adjust the position of the first bearing table 10 in the first frame 2, thereby helping to finely adjust the position of the first wafer 45, and further helping to improve the alignment accuracy of the first wafer 45 and the second wafer 46.

[0047] With reference to Figure 1 and Figure 3After the alignment accuracy detection of the first wafer 45 and the second wafer 46 is completed, the piston rod of the driving cylinder 82 is retracted, so that the extension rod 83 moves towards the driving cylinder 82, the transmission gear 42 is reversely rotated under the action of the extension rod 83, so as to drive the lifting plate 37 to descend through the strip-shaped tooth 41, and then the connecting rod 38 pulls the plug-in rod 39, so that the plug-in rod 39 is pulled out from the inside of the plug-in hole 33 and the plug-in hole 30, which helps to release the blocking effect of the blocking ring 29 on the mounting plate 4, and then helps the electric push rod to continue to move the mounting plate 4 downwards, and the bonding process of the first wafer 45 and the second wafer 46 is completed.

[0048] With reference to Figure 1 and Figure 3 After the bonding of the first wafer 45 and the second wafer 46 is completed, the piston rod of the jacking cylinder 151 is extended, driving the work shaft disc 152 to move upwards along the vertical direction, so as to help the first rotating plate 153 to reversely rotate, and then the second rotating plate 154 and the limiting block 156 are reversely rotated synchronously under the driving of the connecting plate 155, which helps to release the clamping and limiting of the first wafer 45 by the two limiting blocks 156; at the same time, the jacking plate 18 moves upwards synchronously in the process of the upward movement of the work shaft disc 152, and the jacking plate 18 moves upwards to jacking the first wafer 45 which is released from the limiting, so as to help the first wafer 45 and the second wafer 46 which are bonded to be jacked out from the first placing groove 11.

[0049] The implementation principle of the embodiment of the application is that the operator places the first wafer 45 into the first placing groove 11, the piston rod of the jacking cylinder 151 is retracted, driving the work shaft disc 152 to move downwards synchronously, so as to drive the first rotating plate 153 on both sides to rotate, and then the second rotating plate 154 and the limiting block 156 are synchronously rotated under the driving of the connecting plate 155, which helps to clamp and limit the first wafer 45 by the two limiting blocks 156 which are rotated, so as to help to improve the stability of the first wafer 45 placed in the first placing groove 11.

[0050] The operator places the second wafer 46 into the second placing groove 21, the piston rod of the electric cylinder 23 is extended, driving the connecting plate 24 and the connecting rod 25 to move upwards, so as to drive the piston 26 to move in the closed chamber 20 towards the direction away from the second bearing table 19, and then the negative pressure is generated between the piston 26 and the second bearing table 19, which helps to generate the suction force on the second wafer 46 placed in the second placing groove 21 through the communication hole 22, so as to help to improve the stability of the second wafer 46 placed in the second placing groove 21.

[0051] The piston rod of the electric push rod extends, driving the mounting plate 4 to slide downward on the stand 32; at the same time, the piston rod of the drive cylinder 82 extends, driving the reflecting block 84 to move horizontally to the set position through the extension rod 83. While the extension rod 83 moves, the transmission gear 42 rotates under the action of the extension rod 83, thereby driving the lifting plate 37 to rise through the strip-shaped teeth 41, and further making the connecting rod 38 push the plug-in rod 39 to move horizontally towards the direction of the plug-in hole 30 until the plug-in rod 39 is inserted into the plug-in hole 33, which helps to position the stop sleeve 29 on the stand 32 by using the plug-in rod 39, thereby helping to stop the mounting plate 4 by using the stop sleeve 29, and further helping to make the first wafer 45 and the second wafer 46 symmetrically distributed on both sides of the reflecting block 84.

[0052] When the first wafer 45 and the second wafer 46 are symmetrically distributed on both sides of the reflecting block 84, the first reflecting mirror 841 and the second reflecting mirror 842 simultaneously reflect the alignment marks 7 on the first wafer 45 and the second wafer 46 to the reading surface of the reading device 9, and the reading device 9 reads the position information of the two alignment marks 7, and then transmits the read information to the processor for processing, so as to accurately position the first wafer 45 and the second wafer 46, which helps to improve the alignment accuracy of the first wafer 45 and the second wafer 46 in the bonding process, thereby improving the bonding accuracy between the first wafer 45 and the second wafer 46, and further improving the yield of the first wafer 45 and the second wafer 46 after packaging.

[0053] When the first wafer 45 and the second wafer 46 are not aligned, the first electric push rod 121 is started, and the first bearing table 10 is driven to move horizontally along the length direction of the first electric push rod 121 through the first clamping block 122; the second electric push rod 123 is started, and the second bearing table 19 is driven to move horizontally along the length direction of the second electric push rod 123 through the second clamping block 124, which helps to finely adjust the position of the first bearing table 10 in the first frame 2, thereby finely adjusting the position of the first wafer 45, and further improving the alignment accuracy of the first wafer 45 and the second wafer 46.

[0054] After the alignment accuracy of the first wafer 45 and the second wafer 46 is detected, the piston rod of the drive cylinder 82 retracts, making the extension rod 83 move towards the drive cylinder 82, and the transmission gear 42 reversely rotates under the action of the extension rod 83, thereby driving the lifting plate 37 to descend through the strip-shaped teeth 41, and further making the connecting rod 38 pull the plug-in rod 39, so that the plug-in rod 39 is pulled out from the inside of the plug-in hole 33 and the plug-in hole 30, which helps to release the stop effect of the stop sleeve 29 on the mounting plate 4, and further helps to make the mounting plate 4 continue to move downward under the driving of the electric push rod, thereby completing the bonding process of the first wafer 45 and the second wafer 46.

[0055] After the first wafer 45 and the second wafer 46 are bonded, the piston rod of the jacking cylinder 151 is extended, the work-type shaft disc 152 is moved upward along the vertical direction, the first rotating plate 153 is reversely rotated, the second rotating plate 154 and the limiting block 156 are reversely rotated synchronously under the driving of the connecting plate 155, the two limiting blocks 156 are released from the clamping and limiting of the first wafer 45; at the same time, the work-type shaft disc 152 drives the jacking plate 18 to move upward synchronously, the jacking plate 18 that moves upward jacks up the first wafer 45 that is released from the limiting, so as to help the first wafer 45 and the second wafer 46 that are bonded to be jacked out from the first placing groove 11.

[0056] The above are preferred embodiments of the present application, which do not limit the protection scope of the present application, therefore: all equivalent changes made on the structure, shape and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A multi-chip wafer packaging processing system, characterized by: The invention comprises a fixing frame (1), wherein the fixing frame (1) is provided with a first frame (2) and a mounting bracket (3) located on the circumference of the first frame (2); a first discharge mechanism for placing a first wafer (45) is provided in the first frame (2); a mounting plate (4) and a driving member (5) for driving the mounting plate (4) to move up and down are provided on the mounting bracket (3); a second frame (6) is provided on the mounting plate (4); a second discharge mechanism for placing a second wafer (46) is provided in the second frame (6); both the first wafer (45) and the second wafer (46) are provided with alignment marks (7); a reflection component (8) for simultaneously reflecting the alignment marks (7) on the first wafer (45) and the second wafer (46) to the same plane is provided on the fixing frame (1); and a reading device (9) for reading position information of the reflected alignment marks (7) is also provided on the fixing frame (1).

2. The multi-chip wafer packaging processing system according to claim 1, characterized in that: The reflection assembly (8) comprises a placement seat (81), a driving cylinder (82), an extension rod (83) and a reflection block (84); the placement seat (81) is arranged on a fixed frame (1); the driving cylinder (82) is arranged on the placement seat (81); the extension rod (83) is coaxially connected to the piston rod of the driving cylinder (82); the reflection block (84) is arranged at one end of the extension rod (83) away from the piston rod of the driving cylinder (82); a first reflection mirror surface (841) and a second reflection mirror surface (842) are symmetrically arranged on the reflection block (84); and the angles between the first reflection mirror surface (841) and the second reflection mirror surface (842) and the horizontal plane are both 45 degrees.

3. The multi-chip wafer packaging processing system according to claim 1, characterized in that: The first material discharging mechanism comprises a first carrier platform (10) arranged inside a first frame (2); a first placement groove (11) for placing a first wafer (45) is provided on the first carrier platform (10); a positioning component (12) for positioning the placement position of the first carrier platform (10) is provided inside the first frame (2); and a limiting component (15) for limiting the first wafer (45) placed in the first placement groove (11) is provided inside the first carrier platform (10).

4. The multi-chip wafer packaging processing system according to claim 3, characterized in that: The positioning assembly (12) comprises a first electric push rod (121), a first clamping block (122), a second electric push rod (123) and a second clamping block (124); a first clamping groove (13) and a second clamping groove (14) are respectively provided on adjacent side walls of the first supporting platform (10); the first clamping groove (13) and the second clamping groove (14) are both arranged horizontally; the first electric push rod (121) is arranged on a side close to the first clamping groove (13) in the first frame (2); the first clamping block (122) is arranged at the output end of the first electric push rod (121) and is slidably clamped in the first clamping groove (13); the second electric push rod (123) is arranged on a side close to the second clamping groove (14) in the first frame (2); the second clamping block (124) is arranged at the output end of the second electric push rod (123) and is slidably clamped in the second clamping groove (14).

5. The multi-chip wafer packaging processing system according to claim 3, characterized in that: The limiting assembly (15) includes a lifting cylinder (151), a mounting blind hole (16) communicating with the first placement groove (11) is provided in the first bearing platform (10), the lifting cylinder (151) is provided in the mounting blind hole (16), an I-type shaft disc (152) is provided on the piston rod of the lifting cylinder (151), mounting grooves (17) are symmetrically provided on both sides of the mounting blind hole (16) in the first bearing platform (10), the mounting grooves (17) are communicated with the mounting blind hole (16), and the A first rotating plate (153) and a second rotating plate (154) are rotatably mounted in the mounting groove (17). The first rotating plate (153) and the second rotating plate (154) are connected via a connecting plate (155) and are arranged in parallel. An end of the first rotating plate (153) away from the connecting plate (155) is inserted into the interior of the I-type shaft disc (152). A limiting block (156) is provided at an end of the second rotating plate (154) away from the connecting plate (155). A lifting plate (18) is provided on the I-type shaft disc (152).

6. The multi-chip wafer packaging processing system according to claim 1, characterized in that: The second material discharge mechanism includes a second carrier platform (19) arranged inside the second frame (6), the second frame (6) and the second carrier platform (19) together enclose a closed chamber (20), a second placement groove (21) for placing the second wafer (46) is provided on a surface of the second carrier platform (19) located outside the closed chamber (20), and a connecting hole (22) for connecting the closed chamber (20) and the second placement groove (21) is opened through the second carrier platform (19). An electric cylinder (23) is provided on the mounting plate (4), a connecting plate (24) is provided at the output end of the electric cylinder (23), connecting rods (25) are provided at both ends of the connecting plate (24), the end of the connecting rod (25) away from the connecting plate (24) is inserted into the interior of the second frame (6), a piston (26) is provided at the end of the connecting rod (25) inserted into the interior of the second frame (6), and the circumferential side wall of the piston (26) is slidably fitted with the inner wall of the closed chamber (20).

7. The multi-chip wafer packaging processing system according to claim 2, characterized in that: The mounting bracket (3) comprises a mounting top plate (31) and a plurality of columns (32). The plurality of columns (32) are fixedly mounted on the fixing frame (1) and are located on the circumferential periphery of the first frame (2). The mounting top plate (31) is arranged on the top ends of the plurality of columns (32). A shaft sleeve (27) is slidably sleeved on each of the columns (32). The mounting plate (4) is fixedly sleeved on the plurality of shaft sleeves (27). A stop mechanism for limiting the lifting and lowering of the mounting plate (4) is provided on the columns (32).

8. The multi-chip wafer packaging processing system according to claim 7, characterized in that: The stopping mechanism comprises a supporting spring (28), the supporting spring (28) being arranged on the fixing frame (1) and sleeved on the circumference of the column (32), the column (32) being sleeved with a stopping collar (29), and the stopping collar (29) being connected to the supporting spring (28), a through hole (30) being provided through the side wall of the stopping collar (29), a plug hole (33) being provided on the side wall of the column (32) for communicating with the through hole (30), and a plug assembly (34) being provided on the fixing frame (1) for sequentially inserting into the through hole (30) and the plug hole (33).

9. The multi-chip wafer packaging processing system according to claim 8, characterized in that: The plug-in assembly (34) includes a mounting seat (35) arranged on a fixing frame (1), an opening (36) is provided on the mounting seat (35), a lifting plate (37) is provided in the opening (36) and can be lifted and lowered, a connecting rod (38) is hingedly provided at the top end of the lifting plate (37), a horizontally arranged plug-in rod (39) is hingedly provided at one end of the connecting rod (38) away from the lifting plate (37), the plug-in rod (39) passes through the mounting seat (35) and is slidably connected to the mounting seat (35), The plug-in rod (39) is flush with the insertion hole (30); a through slot (40) is provided on the lifting plate (37); a bar tooth (41) is provided on a side wall of the through slot (40) in a vertical direction; a transmission gear (42) is rotatably provided on the mounting seat (35); the transmission gear (42) is located inside the through slot (40) and meshes with the bar tooth (41); the extension rod (83) is a threaded rod; the extension rod (83) passes through the transmission gear (42) and is threadedly connected to the transmission gear (42).

10. The multi-chip wafer packaging processing system according to claim 1, characterized in that: A mounting ring groove (43) is provided on a surface of the first frame body (2) facing the second frame body (6), and a buffer ring (44) for buffering and shock absorbing is clamped in the mounting ring groove (43).

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