Array glue spraying type nanoimprint device and method

Abstract

The invention provides an array glue spraying type nanoimprint device and method, and relates to the technical field of micro-nano manufacturing, and the device comprises a substrate adsorption unit which is used for adsorbing a substrate to drive the substrate to move; the flexible leveling unit is used for adsorbing the mother set, and the substrate adsorption unit drives the substrate to move so as to enable the substrate to be aligned with the mother set, enable the substrate to be in contact with the mother set and apply imprinting force; the glue spraying unit is used for spraying imprinting glue drops which are preset in glue drop size and are arranged in an array to the surface of the substrate; the optical alignment unit is used for observing an alignment mark between the substrate and the mother set and determining the alignment state of the substrate and the mother set; the electric displacement unit is used for driving the substrate adsorption unit to move; the exposure unit is configured to expose the imprinting glue under the condition that the substrate and the master mask are aligned and compressed, so that the imprinting glue is cured; and the control unit is used for controlling all the units to execute corresponding actions.

Description

Technical Field

[0001] The present disclosure relates to the field of micro-nano manufacturing technology, and in particular to an array glue-jet nanoimprinting device and method. Background Art

[0002] Current nanoimprinting technology usually requires the substrate to be coated with glue and other processes outside the system before being moved to the imprinting table for imprinting operations. This is rather cumbersome in actual use, and the relative position between the master and substrate cannot be observed before imprinting.

[0003] Manual glue coating basically involves applying glue to the entire surface of the substrate. Since manual glue coating involves multiple steps, particles are more likely to be introduced during the operation. Not only can the cleanliness between the master and the substrate not be well guaranteed, but the area covered by the imprint glue cannot be accurately controlled during the spin coating process, resulting in waste of imprint glue outside the active area. In addition, a large number of tiny bubbles are easily generated during conventional spin coating and imprinting, which has a negative impact on the imprinting results.

[0004] In addition, existing nanoimprinting technology cannot directly observe the dispersion of the imprinted glue and whether it contains defects such as bubbles before the glue solidifies. It is also unable to ensure the contact sequence between the entire imprint master and the substrate and the parallelism between the two active surfaces during the imprinting process. Summary of the Invention

[0005] In view of this, a first aspect of an embodiment of the present disclosure provides an array-type glue-spraying nanoimprinting device, comprising: a substrate adsorption unit, configured to adsorb a substrate to drive the substrate to move; a flexible leveling unit, arranged above the substrate adsorption unit, configured to adsorb a master, wherein the substrate adsorption unit drives the substrate to move so as to align the substrate with the master, and brings the substrate into contact with the master and applies an imprinting force; a glue-spraying unit, configured to spray imprinting glue droplets of a preset glue droplet size and arranged in an array onto the surface of the substrate; a light alignment unit, arranged above the master, configured to observe the alignment marks between the substrate and the master and determine the alignment state of the substrate and the master; an electric displacement unit, on which the substrate adsorption unit is arranged, and configured to drive the substrate adsorption unit to move; an exposure unit, configured to expose the imprinting glue when the substrate and the master are aligned and pressed, so as to solidify the imprinting glue; and a control unit, configured to control the substrate adsorption unit, the flexible leveling unit, the glue-spraying unit, the light alignment unit, the electric displacement unit and the exposure unit to perform corresponding actions.

[0006] According to an embodiment of the present disclosure, the device further includes: a carrying platform for carrying a substrate adsorption unit, a flexible leveling unit, a glue spraying unit, a light alignment unit, an exposure unit and an electric displacement unit.

[0007] According to an embodiment of the present disclosure, the substrate adsorption unit includes: a substrate suction cup; a vacuum guide groove is provided on the surface of the substrate suction cup, and the vacuum guide groove is used to remove the gas between the substrate and the substrate suction cup to fix the substrate by vacuum adsorption.

[0008] According to an embodiment of the present disclosure, the flexible leveling unit includes a leveling structure and an adsorption plate installed on the leveling structure; the working surface of the adsorption plate is provided with a vacuum air path for vacuum adsorption, and the side is provided with a vacuum connection hole connected to the vacuum air path. The gas between the adsorption plate and the master is discharged through the vacuum air path and the vacuum connection hole to fix the master by vacuum adsorption; the leveling structure is installed at an angle relative to the substrate surface so that the substrate surface and the master surface are contacted and pressed successively from one side to the other.

[0009] According to an embodiment of the present disclosure, the material of the leveling structure is an elastic material, and the deformation of the leveling structure is adjusted by changing the shape of the elastic material.

[0010] According to an embodiment of the present disclosure, the glue spraying unit includes a nozzle, a nozzle fixing plate, a nozzle board card, a glue box, a liquid level sensor, a power pump, and a pressure sensor; the nozzle is installed on the nozzle fixing plate, and the nozzle board card is used to control the nozzle to move along a preset path and spray glue; a glue supply branch and a glue return branch are provided between the nozzle and the glue box, and the liquid level sensor is used to detect the amount of glue supplied and returned; the power pump is used to provide glue supply and return pressure, wherein the return pressure is higher than the glue supply pressure; the pressure sensor is used to detect the glue supply pressure and the return pressure.

[0011] According to an embodiment of the present disclosure, the glue spraying unit and the flexible leveling unit are arranged on the same axis, and the axis is perpendicular to the substrate surface.

[0012] According to an embodiment of the present disclosure, a light-transmitting hole is opened in the center of the adsorption plate, and the light alignment unit includes an optical microscope, which is arranged above the flexible leveling unit and aligned with the light-transmitting hole; the optical microscope cooperates with the control unit, the electric displacement unit, and the substrate adsorption unit to align the substrate with the master; the exposure unit and the light alignment unit are aligned with the light-transmitting hole through the guide rail translation switching for exposure.

[0013] According to an embodiment of the present disclosure, the electric displacement unit includes a two-axis motion stage or a three-axis motion stage. In the case where the electric displacement unit is a two-axis motion stage, the two-axis motion stage is used to drive the substrate adsorption unit to move in a first direction to align the substrate with the master, and to drive the substrate adsorption unit to move in a second direction to contact the substrate with the master and apply an imprint force, the first direction being orthogonal to the second direction.

[0014] When the electric displacement unit is a three-axis motion table, the two-axis motion table is used to drive the substrate adsorption unit to move in the first direction and / or the third direction to align the substrate with the master, and drive the substrate adsorption unit to move in the second direction to contact the substrate with the master and apply an imprinting force. The first direction is perpendicular to the second direction, and the third direction is perpendicular to each other.

[0015] According to an embodiment of the present disclosure, the control unit includes a host computer and multiple control units, and the substrate adsorption unit, flexible leveling unit, glue spraying unit, light alignment unit, electric displacement unit and exposure unit respectively correspond to their respective control units and perform corresponding actions under the control of the host computer and their respective control units.

[0016] A second aspect of the disclosed embodiments provides an array-based spray-type nanoimprinting method, comprising: fixing a substrate on a substrate adsorption unit and fixing a master on a flexible leveling unit; under the control of a control unit, using an electric displacement unit to drive the substrate adsorption unit to move below the flexible leveling unit to move the substrate below the master; using an optical alignment unit to align the substrate and the master, and recording the coordinate positions after alignment; using the control unit to convert a preset droplet distribution map into a specific format and send the result to a spray unit, controlling the spray unit to spray imprinting glue droplets of a preset size and arranged in an array on the surface of the substrate according to the droplet distribution map; under the control of the control unit, using the electric displacement unit to drive the substrate adsorption unit to move toward the flexible leveling unit to press the substrate and the master together; under the control of the control unit, using an exposure unit to expose the imprinting glue to solidify the imprinting glue; under the control of the control unit, using the electric displacement unit to drive the substrate adsorption unit to move away from the flexible leveling unit to separate the substrate from the master. During the separation process, nitrogen gas may be introduced into the middle region of the master to facilitate demolding.

[0017] The array-based spray-type nanoimprinting device and method provided by the embodiments of the present disclosure have at least the following technical effects:

[0018] By setting up a glue spraying unit, under the control of the control unit, the size of the glue droplets in the nanoimprint glue layer can be accurately controlled, thereby controlling the thickness of the residual glue after the imprint is completed. Combined with the electric displacement unit, the substrate adsorption unit is moved to control the array position and array shape of the glue droplets on the substrate surface to achieve different array forms. The array arrangement of the glue droplets reduces the bubbles generated when the substrate contacts the master, which is beneficial to improving the imprint quality and uniformity.

[0019] By setting up a flexible leveling unit, the planar fit between the master surface and the substrate surface is made more consistent, further avoiding the large number of tiny bubbles generated during conventional spin coating and imprinting, which would have a negative impact on the imprinting results.

[0020] By providing the optical alignment unit, the alignment marks between the substrate and the master can be observed in real time, so as to adjust the positions between the substrate and the master, thereby achieving precise alignment between the substrate and the master. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and other objects, features and advantages of the present disclosure will become more apparent through the following description of the embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0022] Figure 1 Schematically shows a structural diagram of an array glue-jet nanoimprinting device according to an embodiment of the present disclosure;

[0023] Figure 2 Schematically shows a structural diagram of a substrate adsorption unit according to an embodiment of the present disclosure;

[0024] Figure 3 Schematically shows a structural diagram of a flexible leveling unit according to an embodiment of the present disclosure;

[0025] Figure 4 The structure of the glue spraying unit according to the embodiment of the present disclosure is schematically shown;

[0026] Figure 5 Schematically shows the structure of the light alignment unit according to an embodiment of the present disclosure

[0027] Figure 6 Schematically shows a structural diagram of a two-axis motion stage according to an embodiment of the present disclosure;

[0028] Figure 7 Schematically shows a structural diagram of an exposure unit according to an embodiment of the present disclosure;

[0029] Figure 8 The structure of the carrier platform according to the embodiment of the present disclosure is schematically shown;

[0030] Figure 9 The flowchart of the array spray-type nanoimprinting method according to an embodiment of the present disclosure is schematically shown. DETAILED DESCRIPTION

[0031] To make the objectives, technical solutions, and advantages of the present disclosure more clearly understood, the present disclosure is further described below in conjunction with specific embodiments and with reference to the accompanying drawings. It is apparent that the embodiments described are only a portion of the embodiments of the present disclosure, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present disclosure without inventive effort are intended to fall within the scope of protection of the present disclosure.

[0032] The terms used herein are only for describing specific embodiments and are not intended to limit the present disclosure. The terms "comprise," "include," etc. used herein indicate the presence of the features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0033] In this disclosure, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections, electrical connections, or communication; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this disclosure based on specific circumstances.

[0034] In the description of the present disclosure, it should be understood that the terms "longitudinal", "length", "circumferential", "front", "rear", "left", "right", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the subsystem or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0035] Throughout the drawings, identical elements are denoted by identical or similar reference numerals. Conventional structures or configurations are omitted where they may obscure the understanding of this disclosure. The shapes, sizes, and positional relationships of components in the drawings do not reflect actual size, proportion, or positional relationships. In addition, in the claims, any reference signs placed between parentheses should not be construed as limitations of the claims.

[0036] Similarly, in order to streamline the present disclosure and aid in understanding one or more of the various disclosed aspects, in the above description of exemplary embodiments of the present disclosure, the various features of the present disclosure are sometimes grouped together into a single embodiment, figure, or description thereof. Descriptions with reference to the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples" and the like mean that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in an appropriate manner.

[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the present disclosure, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0038] To address the shortcomings of existing nanoimprint technology, the embodiments of the present disclosure redesign the mechanisms used in existing nanoimprint devices to implement master glue spraying, position alignment, and the order of imprint contact between the two active surfaces during the imprinting process. This provides an array-spraying nanoimprint device and method for mask replication that can improve imprint uniformity and quality. By accurately controlling the size of the glue droplets in the nanoimprint glue layer and controlling the array position, the process of replicating the master through nanoimprinting is achieved, improving imprint quality and master lifespan, reducing production costs, and facilitating rapid mass production. The nanoimprint device provided by the present disclosure, which improves imprint uniformity and quality, is composed of multiple relatively independent functional device structures, which can switch functions on the device, making it more convenient to use and non-interfering with each other.

[0039] The array spray-type nanoimprinting device and method provided by the embodiments of the present disclosure will be explained in detail below with reference to specific drawings.

[0040] Figure 1 The structure of an array glue-jet nanoimprinting device according to an embodiment of the present disclosure is schematically shown.

[0041] like Figure 1 As shown, the array glue spraying nanoimprinting device may include a substrate adsorption unit 1, a flexible leveling unit 2, a glue spraying unit 3, an optical alignment unit 4, an electric displacement unit 5, an exposure unit 6 and a control unit 8.

[0042] The substrate adsorption unit 1 is configured to adsorb a substrate and move the substrate.

[0043] The flexible leveling unit 2 is disposed above the substrate adsorption unit and is configured to adsorb the master, wherein the substrate adsorption unit drives the substrate to move so as to align the substrate with the master, and brings the substrate into contact with the master and applies an imprinting force.

[0044] The glue spraying unit 3 is configured to spray embossing glue droplets of a preset glue droplet size and arranged in an array onto the surface of the substrate.

[0045] The optical alignment unit 4 is disposed above the master, and is configured to observe the alignment marks between the substrate and the master, and determine the alignment state between the substrate and the master.

[0046] Electric displacement unit 5 The substrate adsorption unit is provided on the electric displacement unit, and the electric displacement unit is configured to drive the substrate adsorption unit to move, so as to drive the substrate to move.

[0047] The exposure unit 6 is configured to expose the embossing adhesive to solidify the embossing adhesive when the substrate and the master are aligned and pressed.

[0048] The control unit 8 is configured to control the substrate adsorption unit, the flexible leveling unit, the glue spraying unit, the light alignment unit, the electric displacement unit and the exposure unit to perform corresponding actions.

[0049] It should be noted that the control unit 8 controls the substrate adsorption unit 1 to perform corresponding actions, which can be understood as controlling the adsorption unit 1 to adsorb the substrate, and the control unit 8 controls the electric displacement unit 5 to perform corresponding actions, which can be understood as controlling the electric displacement unit 5 to move, driving the substrate adsorption unit to move, and thus driving the substrate to move, so that the substrate and the master are aligned and pressed.

[0050] The control unit 8 controls the flexible leveling unit 2 to perform corresponding actions, which can be understood as controlling the flexible leveling unit 2 to absorb the master and control the master to be closely attached to the substrate.

[0051] The control unit 8 controls the glue spraying unit 3 to perform corresponding actions, which can be understood as controlling the glue spraying unit 3 to spray embossing glue droplets with a preset glue droplet size and arranged in an array onto the substrate surface.

[0052] The control unit 8 controls the optical alignment unit 4 to perform corresponding actions, which can be understood as controlling the optical alignment unit 4 to observe the alignment mark between the substrate and the master in real time. The control unit 8 determines whether the substrate and the master are aligned based on the alignment mark. If they are not aligned, the control unit 8 controls the electric displacement unit 5 to drive the substrate adsorption unit to move, adjust the position of the substrate, and achieve alignment between the substrate and the master.

[0053] The control unit 8 controls the exposure unit 6 to perform corresponding actions, which can be understood as controlling the exposure unit 6 to expose the embossing rubber.

[0054] According to the embodiments of the present disclosure, by setting up a glue spraying unit, under the control of a control unit, the size of the glue droplets of the nano-imprint glue layer is accurately controlled, thereby controlling the thickness of the residual glue after the imprinting is completed. The electric displacement unit is combined to move the substrate adsorption unit to control the array position and array shape of the glue droplets on the substrate surface, thereby realizing different array forms. The array arrangement of the glue droplets reduces the bubbles generated when the substrate contacts the master, which is beneficial to improving the quality and uniformity of the imprinting. By setting up a flexible leveling unit, the plane fit between the master surface and the substrate surface is made more consistent, further avoiding the large number of tiny bubbles generated during conventional spin coating and imprinting, which have an adverse effect on the imprinting results. By setting up an optical alignment unit, the alignment mark between the substrate and the master can be observed in real time, so as to adjust the position between the substrate and the master, thereby realizing precise alignment between the substrate and the master.

[0055] Based on the above embodiment, the array spray-type nanoimprinting device may further include:

[0056] The carrying platform 7 is used to support the substrate adsorption unit 1, the flexible leveling unit 2, the glue spraying unit 3, the optical alignment unit 4, the electric displacement unit 5, and the exposure unit 6. The substrate adsorption unit 1, the flexible leveling unit 2, the glue spraying unit 3, the optical alignment unit 4, the electric displacement unit 5, and the exposure unit 6 are all arranged on the carrying platform 7 and well-isolated to minimize the impact of external vibrations and ensure operational stability.

[0057] In one possible implementation, the supporting platform 7 can be a marble platform, for example, to provide a more stable platform for the entire system. The material properties of the platform are more uniform than those of other metal materials, and the platform has the advantages of extremely small linear expansion coefficient, no internal stress, good rigidity, high hardness, not easy to deform, and long service life. During installation, a special rubber pad is installed in contact with the base as a transition layer for vibration transmission, which greatly reduces its vibration frequency. The flatness obtained after grinding and polishing is higher, and the flatness obtained when installing each component is better. Therefore, the other components of the device are fixed on top of the platform in sequence, which provides a guarantee for the stability of the entire system.

[0058] Figure 2 The structure of the substrate adsorption unit according to the embodiment of the present disclosure is schematically shown.

[0059] like Figure 2 As shown, based on the above embodiment, the substrate adsorption unit 1 may include:

[0060] Substrate chuck 11. The surface of substrate chuck 11 is provided with vacuum guide grooves, which are used to remove gas between the substrate and substrate chuck 11, so as to fix substrate 12 by vacuum adsorption;

[0061] The electric displacement unit 5 drives the substrate chuck 11 to move so that the substrate 12 sucked by the substrate chuck 11 is aligned with and pressed against the master.

[0062] The substrate chuck 11 includes a suction cup 111 and a fixing screw hole 112. The holes on the electric displacement unit 5 are aligned with the fixing screw holes 112 on the substrate chuck 11, and then fixed by axial pressure provided by the threads. A vacuum guide groove is also provided on the upper surface of the substrate chuck 11 to discharge residual gas between the substrate and the substrate chuck 11, thereby generating a suction force that holds the substrate in place. In other words, the substrate chuck also uses vacuum to secure the substrate.

[0063] Figure 3 The structure of a flexible leveling unit according to an embodiment of the present disclosure is schematically shown.

[0064] like Figure 3 As shown, based on the above embodiment, the flexible leveling unit 2 may include a leveling structure 21 and a suction plate 22 mounted on the leveling structure 21 .

[0065] The working surface of the adsorption plate 22 is provided with a vacuum air passage 221 for vacuum adsorption, and a vacuum connection hole 222 is provided on the side thereof, connected to the vacuum air passage 221. The air between the adsorption plate and the master is exhausted through the vacuum air passage 221 and the vacuum connection hole 222, thereby securing the master by vacuum adsorption. The leveling structure 21 is tilted at a predetermined angle relative to the substrate surface.

[0066] For example, the lower surface of the adsorption plate 22 fixes the motherboard through vacuum adsorption. The surface of the adsorption plate 22 is provided with a vacuum air path 221 for vacuum adsorption, and the side of the adsorption plate is provided with a vacuum connection hole 222 connected to the vacuum air path 221; a quick plug for quick connection of the vacuum air path is installed on the side, and each group of four controls different ranges, which can be compatible with a wider range of sizes.

[0067] The leveling structure 21 is made of elastic material, and the deformation of the leveling structure 21 is adjusted by changing the shape of the elastic material.

[0068] The leveling structure 21 may include a leveling structure body (a metal structure with slots) and screws for fixing the unit to the device body. The flexible leveling unit 2 is mounted below the top plate of the supporting platform 7 by means of screw fastening. Since mounting holes are provided at both ends of the structure, the adsorption plate 22 is also mounted below the leveling structure 21 body by means of screws. The principle is to partially interrupt a whole material to reduce its overall rigidity. At the same time, the elastic characteristics of the material are utilized to change the shape characteristics of the material so that the material itself has a greater elastic change. The position of the interruption and the distance on the circumference of the interruption are adjusted to give the material the ability to elastically deform in a certain space. At the same time, the elastic deformation of the parts can be used to enable the leveling unit to tilt in any direction of ±15 degrees. Due to the position and shape of the local interruption, after tilting in any direction, the deformation force generated by it can be evenly distributed. The rise of the Z-axis of the electric displacement unit can enable the mother plate fixed by the adsorption plate to contact the substrate fixed by the substrate suction cup. After contact, the two active surfaces can be made relatively parallel.

[0069] Figure 4 The structure of the glue spraying unit according to an embodiment of the present disclosure is schematically shown.

[0070] like Figure 4 As shown, based on the above embodiment, the glue spraying unit 3 includes a nozzle 31, a nozzle fixing plate 32, a nozzle board 33, a glue box 34, a liquid level sensor 35, a power pump 36, and a pressure sensor 37.

[0071] The nozzle 31 is mounted on a nozzle fixing plate 32 , and the nozzle board 33 is used to control the nozzle 31 to move along a preset path and spray glue.

[0072] A glue supply branch and a glue return branch are provided between the nozzle 31 and the glue box 34 , and a liquid level sensor 35 is used to detect the glue supply and glue return amounts.

[0073] The power pump 36 is used to provide pressure for supplying and returning the glue, wherein the pressure for returning the glue is higher than the pressure for supplying the glue.

[0074] The pressure sensor 37 is used to detect the pressure of the glue supply and the pressure of the glue return.

[0075] In the embodiment of the present disclosure, the glue spraying unit 3 is provided with a corresponding glue supply system. There is a glue box 34 inside the glue supply system. The glue box 34 is equipped with a liquid level sensor 35, so that the liquid level can be directly obtained by observing the feedback value on the upper computer of the control unit 8. Two glue paths, glue supply and glue return, are provided above the nozzle 31. Two power pumps 36 responsible for transmitting power are equipped with pressure sensors 37. Through the pressure sensor 37, the pressure signal fed back is used to adjust the PID parameters to dynamically adjust the operating parameters of the two power pumps 36. After starting, the return glue pressure is slightly higher than the glue supply pressure, so that there is a certain negative pressure during operation. At the same time, the negative pressure does not cause too much air in the nozzle 31, preventing excessive air when the glue spraying signal is triggered, causing the nozzle 31 to respond untimely and preventing glue from dripping under the influence of gravity. At the same time, the pressure sensor 37 can also monitor the glue path status and the nozzle status during printing. Through the PID parameters in the program, the speed of the power pump 36 can be dynamically adjusted in time, so that the glue path pressure is adjusted.

[0076] By adjusting the print grayscale value in the software or the pixel density of the image used in the program, the size of a single glue droplet can be changed. The minimum glue droplet unit can be, for example, 3 pl. Because the nozzle 31 is installed in a fixed position, if a glue droplet array is required, the Y-axis movement rate of the motion stage and the operating frequency of the nozzle 31 are calculated to achieve the correct ratio, thereby achieving a uniform glue droplet array effect. At the same time, the graphics to be printed can be visualized through software programming. Where more glue is needed, the nozzle 31 will control the amount of glue sprayed to match the program settings. Excessive glue can cause numerous capillary bubbles to fill the interior, and an overly thick glue layer can prevent the internal capillary bubbles from being expelled after the fine pattern is pressed against the substrate, thus making it difficult to control the printing quality. By controlling the glue droplet size and thus reducing the glue thickness, the internal bubbles can be controlled.

[0077] In the embodiment of the present disclosure, the glue spraying unit 3 and the flexible leveling unit 2 are arranged on the same axis, which is perpendicular to the substrate surface. This is to make the nozzle 31 more stable during printing without the need for lateral movement, thereby achieving a better glue drop array effect.

[0078] Figure 5 Schematically shows the structure of the light alignment unit according to an embodiment of the present disclosure

[0079] like Figure 3 and Figure 5 As shown, a light-transmitting hole 223 is opened in the center of the adsorption plate 22 , and the light alignment unit 4 includes an optical microscope, which is arranged above the flexible leveling unit 2 and aligned with the light-transmitting hole 223 .

[0080] The optical microscope cooperates with the control unit 8, the electric displacement unit 5, and the substrate adsorption unit 1 to align the substrate and the master.

[0081] In the embodiment of the present disclosure, an optical microscope can be fixed to the light-transmitting hole 223 on the adsorption plate 22 by means of a slide bar for exposure. The optical microscope can then be focused by moving the motion stage along the Z axis. The optical microscope then transmits the content to a display for observation. If the positions of the markings on the substrate and the master do not align, the motion stage can be adjusted through software until they are aligned. The movement of the optical microscope and the motion stage cooperates to achieve alignment between the substrate and the master.

[0082] In the embodiment of the present disclosure, the electric displacement unit 5 includes a two-axis motion stage or a three-axis motion stage. The two-axis motion stage can be understood as being able to move in two directions, and the three-axis motion stage can be understood as being able to move in three directions.

[0083] When the electric displacement unit is a two-axis motion stage, the two-axis motion stage is used to drive the substrate adsorption unit to move in a first direction to align the substrate with the master, and drive the substrate adsorption unit to move in a second direction to contact the substrate with the master and apply an imprinting force. The first direction is orthogonal to the second direction.

[0084] When the electric displacement unit is a three-axis motion table, the two-axis motion table is used to drive the substrate adsorption unit to move in the first direction and / or the third direction to align the substrate with the master, and drive the substrate adsorption unit to move in the second direction to contact the substrate with the master and apply an imprinting force. The first direction and the second direction are perpendicular, and the third direction is perpendicular and orthogonal to each other.

[0085] The following is an explanation of substrate movement control using a two-axis motion stage. Figure 6 The structure of a two-axis motion stage according to an embodiment of the present disclosure is schematically shown.

[0086] like Figure 6 As shown, the motorized displacement unit 5 is a two-axis motion stage capable of moving the substrate chuck 11 and, therefore, the substrate. For example, the two-axis motion stage can be a combined Y-axis and Z-axis motion stage. Movement in the Y-axis aligns the substrate and the master, while movement in the Z-axis applies the imprint force and controls the relative distance between the nozzle of the adhesive spray unit 3 and the substrate. When mounting the substrate, the X-axis is mounted using a fixture, ensuring a more precise X-axis position. Furthermore, since there are no patterns on the active surface, no X-axis movement is required for imprint alignment.

[0087] This two-axis motion stage provides the entire system with a positioning accuracy of ±0.1 micron, making it more accurate. The X-axis travel range is 0-200mm, the motion speed can be 100 mm / s, and the bidirectional repeatability accuracy is ±0.1 micron, which is compatible with wafer sizes within 200mm. The Z-axis travel range is 0-35mm, the motion speed can be 10mm / s, and the bidirectional repeatability accuracy is ±0.2 micron, with a positioning accuracy of ±0.3 micron.

[0088] Figure 7 Schematically shows a structural diagram of an exposure unit according to an embodiment of the present disclosure;

[0089] like Figure 1 and Figure 7 As shown, the exposure unit 6 and the light alignment unit 4 are aligned with the light-transmitting hole by translational switching of the guide rail.

[0090] In an embodiment of the present disclosure, the exposure unit 6 and the optical alignment unit 4 can be placed together on a platform and translated by a guide rail below the platform. Because a light-transmitting hole is opened in the center of the master suction cup, the two units need to be switched due to the limitation of the hole area. After translation, the exposure unit 6 or the optical alignment unit 4 is switched. For example, a UV curing light source with a wavelength of 193nm can be set above the platform. The light source can control the exposure time and can adjust different curing doses to achieve a curing effect of the glue.

[0091] Figure 8 The structure of the carrier platform according to the embodiment of the present disclosure is schematically shown.

[0092] like Figure 8 As shown, the control unit 8 includes a host computer and multiple control units. The substrate adsorption unit 1, the flexible leveling unit 2, the glue spraying unit 3, the light alignment unit 4, the electric displacement unit 5 and the exposure unit 6 correspond to their respective control units and perform corresponding actions under the control of the host computer and their respective control units.

[0093] In the embodiment of the present disclosure, the control unit 8 is placed outside the device and includes a host computer and multiple controllers corresponding to each unit. The signal is sent to the corresponding controller through the signal end of each unit, and then the signal of the controller is connected through the network cable. The motion table signal and the spray unit signal are fed back to the host computer at the same time through the switch. The host computer also sends instructions to each controller at the same time, thereby realizing the control of the entire system.

[0094] Based on the above array-based spray-type nanoimprinting device, an embodiment of the present disclosure further provides an array-based spray-type nanoimprinting method.

[0095] Figure 9The flowchart of the array spray-type nanoimprinting method according to an embodiment of the present disclosure is schematically shown.

[0096] like Figure 9 As shown, the array jet nanoimprinting method may include operations S910 to S960.

[0097] In operation S910 , a substrate is fixed on a substrate adsorption unit, and a master is fixed on a flexible leveling unit.

[0098] In operation S920, under the control of the control unit, the electric displacement unit is used to drive the substrate adsorption unit to move under the flexible leveling unit to move the substrate under the master, and the optical alignment unit is used to align the substrate and the master, and the aligned coordinate position is recorded.

[0099] In operation S930, the control unit converts the preset glue droplet distribution map into a specific format and sends it to the glue spraying unit, which controls the glue spraying unit to spray imprint glue droplets of preset glue droplet size and array arrangement on the substrate surface according to the glue droplet distribution map.

[0100] In operation S940 , under the control of the control unit, the electric displacement unit is used to drive the substrate adsorption unit to move toward the flexible leveling unit to press the substrate and the master.

[0101] In operation S950 , under the control of the control unit, the embossing adhesive is exposed by an exposure unit to cure the embossing adhesive.

[0102] In operation S960, under the control of the control unit, the electric displacement unit is used to drive the substrate adsorption unit to move away from the flexible leveling unit to separate the substrate from the master. During the separation process, nitrogen gas is introduced into the middle area of ​​the master to facilitate demolding.

[0103] First, the master can be placed on the fixture, and then the positioning slots on the fixture restrict the degree of freedom. The master is then moved under the suction plate 22, and the vacuum air circuit is then controlled to complete the master installation. The motion stage is then removed, and the substrate is placed on the substrate chuck 11 using the same method. For example, the substrate is placed on the top of the substrate chuck 11 using vacuum. Both sides of the upper and lower chucks have four quick-connect connectors for connecting to vacuum tubes (a total of eight). Each pair of two can be used to control the 6-inch and 3-inch vacuum air circuits respectively, adapting to different sizes.

[0104] Then, the control unit 8 controls the electric displacement unit 5 and the substrate adsorption unit 1 to move in the Y-axis direction, moves the substrate to the bottom of the master, and then moves it up the Z-axis to a suitable focal length position. Then, the host computer controls the movement of the substrate in the Y-axis direction to align the substrate with the master, and records their coordinate positions after alignment.

[0105] Next, after alignment, when the motion stage moves and scans a photoelectric signal, it triggers the pre-printing program within the controller. This is intended to ensure sufficient glue flow within the nozzle 31 and a more sensitive response. The current mechanical coordinates of the motion stage are then memorized as the Y-axis motion endpoint after glue spraying. The motion stage is then moved to the mechanical starting point defined within the program. Then, under the control of the control unit 8, the pre-edited array shape is input and segmented into a format recognizable by the nozzle 31. The grayscale value of the nozzle 31 is adjusted according to the required glue volume. By adjusting the grayscale value within the control software of the nozzle 31, the glue volume of a single pixel can be adjusted. As the motion stage moves below the nozzle 31, it scans the sensor mounted on the motion stage and feeds back a photoelectric signal to the detector. This signal is transmitted to the differential plate to trigger the nozzle pre-printing. The internal program controls the motion stage's movement rate, matching the movement rate with the nozzle frequency. The motion stage coordinates are promptly fed back to the control software, and by reading the motion stage position signal, the nozzle is triggered to spray the glue droplet array. When spraying droplet arrays, the image format can be converted to a specific format and then split. After the split, the printhead will recognize the image and convert the image content into appropriate signals. The image content is then used to array the droplets according to the image through the combination of the printhead and the motion stage. For example, the image size can be fixed through programming, controlling the image to 1000*1000 pixels. After editing, the image format is changed to BMP format. Then, by editing the internal pixels, the printhead is informed of the triggering signal. This allows for different array formations to be achieved, accurately controlling the droplet size of the nanoimprint layer, and thus the thickness of the residual adhesive after imprinting.

[0106] Next, after spraying is completed, the motion stage is moved to the previously memorized Y-axis motion end coordinate after spraying through program control, and the Y-axis is locked to prevent the relative position between the two substrates from moving, so as to obtain a more accurate imprint range. By moving the Z-axis upward, the substrate is moved upward and contacts the flexible leveling unit 2 to perform leveling between the master and the substrate. The purpose is to make the pattern on the master fit better with the substrate. The spread of the glue droplets and the bubbles in each slit are observed using an optical microscope. After meeting the requirements, the optical microscope is switched horizontally. Since the exposure unit 6 and the optical alignment unit 4 are on a plate fixed on the sliding guide rail, the function is switched by moving the slide rail. The optical microscope is switched to the exposure unit 6 (UV light source) to cure the glue. After curing is completed, the demolding operation is performed by lowering the Z-axis of the motion stage, and then the Y-axis is moved to the printing starting point. The vacuum systems are closed respectively before the substrate and the master can be removed.

[0107] In the embodiment of the present disclosure, the Y-axis is moved outward to place the substrate on the substrate suction cup 11, and the substrate is fixed in the corresponding working range by vacuum adsorption, and then the Y-axis is moved to the bottom of the substrate suction cup for alignment. The movement of the Y-axis is coordinated with the optical microscope above, and the Y-axis coordinate of the current motion stage is memorized and fed back to the controller through the infrared detection value, and then the movement of the Y-axis of the motion stage is controlled by software, so that the substrate surface and the nozzle find the best glue spraying distance, and then the Y-axis height is locked to maintain the best distance between the nozzle and the substrate. The nozzle is triggered by the Y movement to the photoelectric signal trigger point to give the nozzle a trigger signal for triggering, and then the signal is transmitted to the nozzle control system. First, the motion stage memorizes the coordinates of the movement and pre-prints in front of the area where the glue drop array is required, giving priority to ensuring that the internal pressure of the nozzle tends to be balanced, and then after the performance of the nozzle is stabilized, the glue droplets are arrayed according to the required glue drop conditions according to the coordinates memorized by the motion stage.

[0108] After the distribution of the glue drop array is completed, the coordinate memory point after the motion stage is aligned is identified, and the coordinate of the motion stage is reset before printing so that it coincides with the position of the upper master. The substrate with the arrayed glue droplets is moved upward and close to the master. Because the upper master is fixed in a flexible connection, there is a part of movable space between the master and the substrate, which can further ensure the fit between the two planes when the substrate and the master are close to each other. Because there is a certain angle during installation, the center of gravity is slightly shifted to the shorter direction. Under the transfer of the center of gravity, the flexible leveling unit 2 itself has an inclination angle in static state. The generation of this inclination angle makes the two planes have a certain order when they contact, which can further ensure that the gas inside the imprinted glue is discharged in time during the entire imprinting process. In the case of fine patterns, the internal bubbles can also be discharged, thereby avoiding the common bubble defects in imprinting to the greatest extent.

[0109] An optical microscope is then used to check the spread of the glue droplets and the filling of the slits. If the conditions are met, the next step is carried out. The optical microscope above is manually switched to a UV light source, and the locking mechanism designed on the guide rail is used to fix the switched position. The different exposure doses are then controlled to cure the glue. After the glue is cured, the Z axis will adjust the descent rate through the program to ensure the integrity of the pattern after peeling. It will descend to peel them apart. During this period, the descent rate of the motion stage will be a vector change process. The substrate suction cup is then closed and the substrate is removed, and the pattern replication of the mask is completed.

[0110] During the demoulding process, the Z axis of the motion table is moved to peel the master and the substrate from each other. During the peeling process, nitrogen can be added to the master area to make the middle protrude, that is, the four corners of the contact surface between the master and the substrate are lower than the center, which is more convenient for demoulding.

[0111] According to the embodiments of the present disclosure, the array-based spray-type nanoimprinting device described above is used for array-based spray-type nanoimprinting, which can realize different array forms, accurately control the size of the glue droplets of the nanoimprinting glue layer, thereby controlling the thickness of the residual glue after the imprinting is completed, and control the array position and array shape of the glue droplets through the position coordinates of the motion stage. The flexible leveling unit provided above can make the planar fit between the master surface and the substrate surface more consistent by leveling the two active surfaces, thereby realizing the process of replicating two mask plates, improving the imprinting quality and the service life of the mask plates, reducing production costs, and realizing rapid mass production.

[0112] It should be noted that for any details not included in the embodiment of the method, please refer to the embodiment of the device, which will not be repeated here.

[0113] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present disclosure. It should be understood that the above are only preferred embodiments of the present disclosure and the technical principles used. Those skilled in the art will understand that the present disclosure is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present disclosure. Therefore, although the present disclosure has been described in more detail through the above embodiments, the present disclosure is not limited to the above embodiments, and may also include more other equivalent embodiments without departing from the concept of the present disclosure, all of which fall within the scope of protection of the present disclosure.

Claims

1. An array glue-jet nanoimprinting device, characterized in that: include: a substrate adsorption unit, configured to adsorb a substrate to move the substrate; a flexible leveling unit, disposed above the substrate adsorption unit and configured to adsorb the master, wherein the substrate adsorption unit drives the substrate to move so as to align the substrate with the master, and brings the substrate into contact with the master and applies an imprinting force; A glue spraying unit is configured to spray embossing glue droplets of a preset glue droplet size and arranged in an array onto the surface of the substrate; an optical alignment unit, disposed above the master, configured to observe the alignment mark between the substrate and the master to determine an alignment state between the substrate and the master; an electric displacement unit, the substrate adsorption unit being arranged on the electric displacement unit, and the electric displacement unit being configured to drive the substrate adsorption unit to move; an exposure unit configured to expose the embossing adhesive to solidify the embossing adhesive when the substrate and the master are aligned and pressed; The control unit is configured to control the substrate adsorption unit, the flexible leveling unit, the glue spraying unit, the light alignment unit, the electric displacement unit and the exposure unit to perform corresponding actions.

2. The device according to claim 1, characterized in that Also includes: A carrying platform is used to carry the substrate adsorption unit, the flexible leveling unit, the glue spraying unit, the light alignment unit, the exposure unit and the electric displacement unit.

3. The device according to claim 1 or 2, characterized in that The substrate adsorption unit includes: A substrate suction cup is provided with a vacuum guide groove on the surface of the substrate suction cup, and the vacuum guide groove is used to remove the gas between the substrate and the substrate suction cup to fix the substrate by vacuum adsorption.

4. The device according to claim 1 or 2, characterized in that The flexible leveling unit includes a leveling structure and a suction plate mounted on the leveling structure; The working surface of the adsorption plate is provided with a vacuum air passage for vacuum adsorption, and the side surface is provided with a vacuum connection hole connected to the vacuum air passage, and the gas between the adsorption plate and the master is discharged through the vacuum air passage and the vacuum connection hole, so as to fix the master by vacuum adsorption; The leveling structure is installed obliquely relative to the substrate surface, so that the substrate surface and the master surface are contacted and pressed successively from one side to the other.

5. The device according to claim 4, characterized in that The material of the leveling structure is an elastic material, and the deformation of the leveling structure is adjusted by changing the shape of the elastic material.

6. The device according to claim 1 or 2, characterized in that The glue spraying unit includes a nozzle, a nozzle fixing plate, a nozzle card, a glue box, a liquid level sensor, a power pump, and a pressure sensor; The nozzle is mounted on the nozzle fixing plate, and the nozzle board is used to control the nozzle to move along a preset path and spray glue; A glue supply branch and a glue return branch are provided between the nozzle and the glue box, and the liquid level sensor is used to detect the glue supply and glue return amounts; The power pump is used to provide pressure for supplying glue and returning glue, wherein the pressure for returning glue is higher than the pressure for supplying glue; The pressure sensor is used to detect the pressure of the glue supply and the pressure of the glue return.

7. The device according to claim 1 or 2, characterized in that The glue spraying unit and the flexible leveling unit are arranged on the same axis, and the axis is perpendicular to the substrate surface.

8. The device according to claim 4, characterized in that A light-transmitting hole is opened in the center of the adsorption plate, and the light alignment unit includes an optical microscope, which is arranged above the flexible leveling unit and aligned with the light-transmitting hole; The optical microscope cooperates with the control unit, the electric displacement unit, and the substrate adsorption unit to align the substrate with the master; The exposure unit and the light alignment unit are aligned with the light-transmitting hole after translational switching by the guide rail to perform exposure.

9. The device according to claim 1 or 2, characterized in that The electric displacement unit includes a two-axis motion stage or a three-axis motion stage; In a case where the electric displacement unit is a two-axis motion stage, the two-axis motion stage is used to drive the substrate adsorption unit to move in a first direction to align the substrate with the master, and drive the substrate adsorption unit to move in a second direction to bring the substrate into contact with the master and apply an imprint force, the first direction being orthogonal to the second direction; In the case where the electric displacement unit is a three-axis motion stage, the two-axis motion stage is used to drive the substrate adsorption unit to move in a first direction and / or a third direction to align the substrate with the master, and drive the substrate adsorption unit to move in a second direction to contact the substrate with the master and apply an imprinting force, and the first direction, the second direction, and the third direction are orthogonal to each other.

10. The device according to claim 1 or 2, characterized in that The control unit includes a host computer and multiple control units. The substrate adsorption unit, the flexible leveling unit, the glue spraying unit, the light alignment unit, the above-mentioned electric displacement unit and the exposure unit correspond to their respective control units and perform corresponding actions under the control of the host computer and their respective control units.

11. An array spray-type nanoimprinting method, characterized in that: include: Fixing the substrate on the substrate adsorption unit and fixing the master on the flexible leveling unit; Under the control of the control unit, the electric displacement unit is used to drive the substrate adsorption unit to move to the bottom of the flexible leveling unit to move the substrate to the bottom of the master, the optical alignment unit is used to align the substrate and the master, and the coordinate position after alignment is recorded; The control unit converts the preset glue droplet distribution map into a specific format and sends it to the glue spraying unit, and controls the glue spraying unit to spray the embossing glue droplets of preset glue droplet size and array arrangement on the substrate surface according to the glue droplet distribution map; Under the control of the control unit, the electric displacement unit is used to drive the substrate adsorption unit to move toward the flexible leveling unit to press the substrate and the master; Under the control of the control unit, the embossed adhesive is exposed to light by the exposure unit to solidify the embossed adhesive; Under the control of a control unit, the electric displacement unit is used to drive the substrate adsorption unit to move away from the flexible leveling unit, so as to separate the substrate from the motherboard.

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