Photovoltaic module frame bonding structure and glue overflow prevention method thereof

Through the combination of a slot structure driven by an intelligent algorithm and customized silicone strips, the problem of matching the mechanical properties and sealing performance of the photovoltaic module frame connection structure under high wind pressure is solved, and stable connection and efficient production of modules in complex environments are achieved.

CN120834768APending Publication Date: 2025-10-24FAR EAST PHOTOVOLTAIC TECHNOLOGY (GUANGDONG) CO LTD
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Patent Information

Application Number
CN202511342539.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-09-19
Publication Date
2025-10-24

AI Technical Summary

Technical Problem

The connection structure between the existing photovoltaic module frame and the module is difficult to achieve precise matching of mechanical properties and sealing performance under high wind pressure environments, resulting in insufficient control of module deformation and a high risk of hidden cracks in the cell. In addition, traditional designs rely on manual experience and lack intelligent optimization.

Method used

An intelligent algorithm model is used to calculate the geometric parameters of the slot structure and fitting parts of the photovoltaic module frame and the module. Combined with the size and hardness of the customized silicone strip, elastic compression connection and sealing are achieved through interference fit, eliminating the application of structural glue, and ensuring that the compression deformation of the silicone strip under high wind pressure is within the safety threshold.

Benefits of technology

It achieves quantitative control of component deflection under high wind pressure environments, reduces the risk of hidden cracks in solar cells, improves component assembly efficiency and reliability, simplifies manufacturing processes, reduces material costs, and adapts to long-term use in complex environments.

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Patent Text Reader

Abstract

The invention relates to the technical field of photovoltaic power generation, and discloses a photovoltaic module frame bonding structure and a glue overflow prevention method thereof.The system comprises a clamping groove structure and a frame, and the section shape, the depth and the width of the clamping groove structure and the protruding height and the inclination angle of a matching part are calculated and determined through a preset intelligent algorithm model; a silica gel strip is clamped between the clamping groove structure of the frame and the matching part of the photovoltaic module, the section size and the hardness parameter of the silica gel strip are matched with the gap parameter of the clamping groove structure and the matching part output by the intelligent algorithm model, and the two side faces of the silica gel strip are in interference fit with the inner wall of the clamping groove structure and the outer surface of the matching part respectively; the geometric parameters of the clamping groove structure and the matching part are determined through an intelligent algorithm model, the customized size and hardness of the silica gel strip are combined, elastic pressing connection and sealing of the frame and the edge of the photovoltaic module are achieved, and the compression deformation quantity of the silica gel strip under the high wind pressure load is limited within a preset safety threshold value so as to reduce the hidden crack risk of a battery piece.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of photovoltaic power generation systems, and particularly relates to a photovoltaic module frame bonding structure and a glue overflow prevention method thereof. BACKGROUND

[0002] In the field of photovoltaic power generation, the frame connection structure of a photovoltaic module is crucial to the mechanical properties and long-term reliability of the module. The frame of a traditional photovoltaic module is usually bonded to the edge of the module by structural adhesive. To prevent glue overflow from contaminating the glass surface, an overflow groove needs to be designed in the frame, which leads to a complex manufacturing process and low production efficiency. Moreover, the curing process of the structural adhesive is easily affected by the ambient temperature, and there is a problem of edge stress concentration caused by glue curing shrinkage, which increases the risk of cell cracking. In addition, in the prior art, the connection structure parameters (such as the size of the clamping groove and the shape of the matching part) of the frame and the module are mainly designed based on manual experience, and there is a lack of quantitative correlation analysis between the deflection deformation of the module under high wind pressure, the elastic deformation of the silicone strip, and the bending strength of the cell. It is difficult to accurately control the stress distribution and deformation of the connection interface, which leads to insufficient reliability of the module under extreme loads.

[0003] To improve the wind pressure resistance, existing solutions attempt to increase the aluminum reinforcing ribs or use stainless steel frames, but only stay at the level of material replacement or simple structure superposition, and do not solve the core problem of how to accurately design the connection structure parameters based on the mechanical performance requirements. For example, in the traditional technology, the use of a silicone strip is only as an auxiliary sealing element, and the determination of its size and hardness parameters is not systematically designed with the geometric features of the frame clamping groove and the module matching part, and intelligent algorithms are not introduced to optimize multiple parameters. Therefore, the prior art lacks a technical solution that can combine the target wind pressure resistance value of the module, the material elastic modulus and other key parameters, and accurately match the mechanical properties and sealing performance of the connection structure through intelligent design, resulting in insufficient deformation control of the module under high wind pressure and high risk of cell cracking.

[0004] Therefore, there is an urgent need for a structure to solve any of the above problems. SUMMARY

[0005] The application provides a kind of photovoltaic module frame bonding structure and its anti-glue overflow method, to solve for the promotion wind pressure resistance, although the existing scheme attempts to increase aluminum reinforcing rib or change with stainless steel frame, but only stay at material replacement or structure simple superposition level, not solve " how to accurately design connection structure parameter based on mechanical property requirement " this core problem.For example, the use of silicone strip in traditional technology is only used as auxiliary sealing element, the determination of its size and hardness parameter is not systematically designed with the geometric characteristics of frame slot, module matching part, and intelligent algorithm is not introduced to optimize multiple parameters.Therefore, there is no technical scheme in the prior art that can combine the target wind pressure value of the module, the elastic modulus of the material and other key parameters, to realize the accurate matching of the mechanical properties and sealing performance of the connection structure through intelligent design, resulting in the long-standing problem of insufficient module deformation control and high risk of cell cracking in high wind pressure environment.

[0006] In a first aspect, the application provides a photovoltaic module frame bonding structure, comprising a photovoltaic module and a frame, the frame is arranged at the edge of the photovoltaic module, the frame is provided with a clamping groove structure for installation, and the edge of the photovoltaic module is provided with a matching part corresponding to the position of the clamping groove structure. The cross-sectional shape, depth and width of the clamping groove structure and the protrusion height and inclination angle of the matching part are determined by a preset intelligent algorithm model, the intelligent algorithm model takes the target wind pressure value of the module, the deformation resistance and the elastic modulus of the silicone strip material as input parameters, is trained based on finite element simulation data to form, and is used to output structure parameters that meet the deflection deformation control requirements under high wind pressure conditions. A silicone strip is clamped between the clamping groove structure of the frame and the matching part of the photovoltaic module, the cross-sectional size and hardness parameter of the silicone strip are adapted to the gap parameter between the clamping groove structure and the matching part output by the intelligent algorithm model, and the two side surfaces of the silicone strip form an interference fit with the inner wall of the clamping groove structure and the outer surface of the matching part. The geometric parameters of the clamping groove structure and the matching part determined by the intelligent algorithm model, combined with the customized size and hardness of the silicone strip, realize the elastic compression connection and sealing of the frame and the edge of the photovoltaic module, the frame and the photovoltaic module do not need to be coated with structural glue, and the compression deformation amount of the silicone strip under high wind pressure load is limited within a preset safety threshold to reduce the risk of cell cracking.

[0007] In a second aspect, the application provides an anti-glue overflow method for a photovoltaic module frame bonding structure, characterized in that it is applied to the photovoltaic module frame bonding structure provided in any embodiment of the application, the frame is provided with a clamping groove structure for installation, and the edge of the photovoltaic module is provided with a matching part corresponding to the position of the clamping groove structure; the method comprises: The cross-sectional shape, depth, and width of the card slot structure and the protrusion height and inclination angle of the matching part are determined by a preset intelligent algorithm model, the intelligent algorithm model takes the component target wind pressure resistance value, deformation resistance, and silicon strip material elastic modulus as input parameters, is trained based on finite element simulation data, and is used to output structural parameters meeting the deflection deformation control requirements under high wind pressure conditions; A silicon strip is clamped between the card slot structure of the frame and the matching part of the photovoltaic module, the cross-sectional size and hardness parameter of the silicon strip are adapted to the gap parameters between the card slot structure and the matching part output by the intelligent algorithm model, and the two side surfaces of the silicon strip are in interference fit with the inner wall of the card slot structure and the outer surface of the matching part. The geometric parameters of the card slot structure and the matching part determined by the intelligent algorithm model, in combination with the customized size and hardness of the silicon strip, realize the elastic compression connection and sealing of the frame and the edge of the photovoltaic module, the frame and the photovoltaic module do not need to be coated with structural glue, and the compression deformation amount of the silicon strip under high wind pressure load is limited within a preset safety threshold to reduce the risk of cell cracking.

[0008] In some embodiments, the cross-sectional shape, depth, and width of the card slot structure and the protrusion height and inclination angle of the matching part are determined by a preset intelligent algorithm model, the intelligent algorithm model determines the minimum support strength required for the connection of the frame and the edge of the photovoltaic module based on the component target wind pressure resistance value, calculates the contact stress distribution of the card slot structure and the matching part in combination with the deformation resistance requirement, simulates the compression deformation state under different geometric parameters according to the silicon strip material elastic modulus, and outputs the cross-sectional shape, depth, width, protrusion height, and inclination angle parameters meeting the stress uniformity requirement of the connection interface of the frame and the photovoltaic module under high wind pressure conditions.

[0009] In some embodiments, the intelligent algorithm model takes the component target wind pressure resistance value, deformation resistance, and silicon strip material elastic modulus as input parameters, is trained based on finite element simulation data, and includes: finite element models of different card slot cross-sectional shapes, depths, widths, and matching part protrusion heights and inclination angles are established in advance, different wind pressure loads and silicon strip elastic modulus parameters are input for simulation, stress distribution of the connection interface of the frame and the photovoltaic module, silicon strip compression deformation amount, and overall deflection deformation data of the component are obtained, the above data are taken as training samples, a mapping relationship model taking structural parameters as output and taking target wind pressure resistance value, deformation resistance, and silicon strip elastic modulus as input is constructed, and model parameters are optimized through a machine learning algorithm until the output structural parameters meet the preset deflection deformation control accuracy requirement.

[0010] In some embodiments, the intelligent algorithm model incorporates the difference in thermal expansion coefficient parameters between the frame material and the edge material of the photovoltaic module during the training process. By simulating the size change of the frame and the photovoltaic module under different environmental temperatures, the temperature adaptability of the slot structure depth, the fitting part inclination angle and the hardness of the silicone strip are optimized. The bonding structure can still maintain stable elastic compression force and sealing performance in the temperature range of-40℃ to 85℃, and the long-term reliability of the module in complex environments is improved.

[0011] In some embodiments, the silicone strip is clamped between the slot structure of the frame and the fitting part of the photovoltaic module. The cross-sectional size and hardness parameters of the silicone strip are adapted to the gap parameters between the slot structure and the fitting part output by the intelligent algorithm model, which includes: the intelligent algorithm model calculates the three-dimensional gap volume between the slot and the fitting part according to the depth, width of the slot structure and the protrusion height of the fitting part, and outputs the cross-sectional size of the silicone strip that meets the sealing performance and long-term use reliability requirements according to the elastic recovery rate and anti-aging performance of the silicone strip material. At the same time, according to the constraint condition that the compression deformation of the silicone strip under high wind pressure load does not exceed the preset safety threshold, the hardness parameter of the silicone strip is determined, so that the compression stress of the silicone strip under the rated load matches the structural strength of the frame and the edge of the photovoltaic module.

[0012] In some embodiments, the two side surfaces of the silicone strip are respectively in interference fit with the inner wall of the slot structure and the outer surface of the fitting part, which includes: the cross-sectional shape of the silicone strip matches the cross-sectional shape of the slot structure, and the width of the silicone strip is greater than the width of the opening of the slot structure, and the height of the silicone strip is greater than the vertical gap between the slot structure and the fitting part; during assembly, the silicone strip is pressed into the gap between the slot structure and the fitting part by external force, so that the two side surfaces of the silicone strip are respectively subjected to extrusion stress with the inner wall of the slot and the outer surface of the fitting part, forming an elastic connection interface with no gap. The value of the extrusion stress is determined by the intelligent algorithm model to ensure the connection strength and sealing performance.

[0013] In some embodiments, the geometric parameters of the slot structure and the fitting part determined by the intelligent algorithm model include: the cross-sectional shape of the slot structure is one of trapezoidal, dovetail or L-shaped, and the depth value range is calculated by the intelligent algorithm model according to the target wind pressure resistance value of the module, and the depth direction is consistent with the thickness direction of the edge of the photovoltaic module; the protrusion height of the fitting part is not less than 1 / 2 of the depth of the slot structure, and the inclination angle is set to form a tapered guide structure between the outer surface of the fitting part and the inner wall of the slot structure to adapt to the deformation direction of the silicone strip when it is pressed in, and to reduce the assembly resistance.

[0014] In some embodiments, the customized size and hardness of the silica gel strip achieve elastic compression connection and sealing of the frame and the edge of the photovoltaic module, including that the customized size of the silica gel strip meets the gap filling requirement between the groove structure and the matching part, and the hardness parameter of the silica gel strip makes the elastic deformation amount of the silica gel strip in the normal working temperature range be in the recoverable deformation interval; when the photovoltaic module bears high wind pressure load, the silica gel strip absorbs the local stress of the module edge by elastic compression, and at the same time, the sealing interface formed by interference fit prevents external water vapor and dust from entering the inside of the module, and the elastic compression force and the sealing performance are cooperatively optimized by the intelligent algorithm model, so as to ensure the mechanical stability and environmental adaptability of the connection structure.

[0015] In some embodiments, the frame and the photovoltaic module do not need to be coated with structural glue, and the compression deformation amount of the silica gel strip under high wind pressure load is limited within a preset safety threshold to reduce the risk of cell cracking, including that the preset safety threshold is determined according to the bending strength parameter of the cell of the photovoltaic module, the intelligent algorithm model adjusts the groove structure depth, the matching part protrusion height and the silica gel strip hardness parameter by simulating the compression deformation amount of the silica gel strip under different wind pressure loads, so that the compression deformation amount of the silica gel strip when the module bears the maximum design wind pressure does not exceed the safety threshold; by canceling the structural glue and using the silica gel strip clamping, the stress concentration influence of glue curing shrinkage on the module edge in the traditional gluing process is avoided, and the risk of cell cracking is further reduced.

[0016] The present application inputs the target wind pressure resistance value, deformation resistance value, and elastic modulus of the silica gel strip material of the module, and outputs the optimized groove structure and matching part geometric parameters through the preset intelligent algorithm model, solves the problem of insufficient matching precision of structural parameters and mechanical properties in traditional experience design, and realizes the quantitative control of the deflection deformation of the module under high wind pressure conditions. The silica gel strip clamping replaces the structural adhesive bonding, and the gluing and curing process is not needed, which eliminates the risk of glue overflow pollution, significantly improves the assembly efficiency of the module, avoids the edge stress concentration caused by the curing shrinkage of the structural adhesive, and reduces the risk of cell cracking. Through the cooperative optimization of the groove cross-sectional shape and the hardness of the silica gel strip by the algorithm model, the compression deformation amount of the connection structure under high wind pressure is limited within the safety threshold of the cell, and at the same time, a reliable sealing interface is formed by interference fit, which takes into account the mechanical stability, sealing performance and environmental adaptability, and prolongs the service life of the module. The traditional overflow glue groove structure design is reduced, the frame processing technology is simplified, and the material and manufacturing costs are reduced; the combination of the stainless steel frame and the elastic connection structure optimized by the algorithm improves the weather resistance of the module in the coastal high-corrosion environment, and widens the application scenarios.

[0017] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort.

[0019] Figure 1 is a structural schematic diagram of a frame bonding structure of a photovoltaic module provided by an embodiment of the present application; Figure 2 is a step schematic flow chart of a glue overflow prevention method of the frame bonding structure of the photovoltaic module provided by an embodiment of the present application.

[0020] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without any creative effort fall within the scope of protection of the present application.

[0022] The flow charts shown in the drawings are only exemplary, and do not necessarily include all the contents and operations / steps, and do not necessarily be executed in the described order. For example, some operations / steps can be decomposed, combined or partially combined, so that the actual execution order can be changed according to the actual situation.

[0023] It should be understood that, in order to clearly describe the technical solutions of the embodiments of the present application, in the embodiments of the present application, the same items or similar items with basically the same functions and effects are distinguished by using "first", "second" and the like. Those skilled in the art can understand that "first", "second" and the like do not limit the number and execution order, and "first", "second" and the like do not necessarily mean different.

[0024] It should be understood that the terms used in the present application specification are only for the purpose of describing specific embodiments and do not intend to limit the present application. As used in the present application specification and the appended claims, unless otherwise clearly indicated by the context, the singular form "a", "an" and "the" are intended to include the plural form.

[0025] It should also be understood that the term "and / or" as used herein refers to any or all possible combinations of one or more of the associated listed items, and includes all possible combinations.

[0026] Some embodiments of the present application will now be described in detail in connection with the accompanying drawings. The following embodiments and features can be combined with each other unless there is a conflict.

[0027] In the field of photovoltaic power generation, the frame connection structure of the photovoltaic module is crucial to the mechanical properties and long-term reliability of the module. The frame of the traditional photovoltaic module is usually bonded to the edge of the module by structural adhesive. In order to prevent the adhesive from overflowing and contaminating the glass surface, the frame needs to be designed with an overflow groove, resulting in a complex manufacturing process, low production efficiency, and the structural adhesive curing process is easily affected by the environment temperature, there is a problem of edge stress concentration caused by adhesive curing shrinkage, which increases the risk of cell cracking. In addition, in the prior art, the connection structure parameters of the frame and the module (such as the size of the clamping groove, the shape of the matching part) mainly rely on manual experience design, lack of quantitative correlation analysis between module deflection deformation, silicone strip elastic deformation and cell bending strength under high wind pressure conditions, it is difficult to accurately control the stress distribution and deformation of the connection interface, resulting in insufficient reliability of the module under extreme load.

[0028] In order to improve the wind pressure resistance, the existing scheme attempts to increase the aluminum reinforcing rib or use stainless steel frame, but only stays at the level of material replacement or simple structure superposition, and does not solve the core problem of "how to accurately design the connection structure parameters based on the mechanical performance requirements". For example, in the traditional technology, the use of silicone strip is only as an auxiliary sealing element, the determination of its size and hardness parameters is not systematically designed with the geometric characteristics of the frame clamping groove and the module matching part, and intelligent algorithms are not introduced to optimize multiple parameters. Therefore, the existing technology lacks a technical solution that can combine the target wind pressure value of the module, the material elastic modulus and other key parameters, and accurately match the mechanical performance and sealing performance of the connection structure through intelligent design, resulting in insufficient deformation control of the module under high wind pressure and high risk of cell cracking.

[0029] Therefore, there is an urgent need for a structure to solve any of the above problems.

[0030] To solve the above problems, please refer to Figure 1 The present application provides a photovoltaic module frame bonding structure, which comprises a photovoltaic module 3 and a frame 2, the frame 2 is arranged at the edge of the photovoltaic module 3, and the frame 2 is provided with a clamping groove structure 1 for installation.

[0031] The position corresponding to the clamping groove structure at the edge of the photovoltaic module is provided with a matching part matched with the clamping groove structure; the cross-sectional shape, depth and width of the clamping groove structure and the protruding height and inclination angle of the matching part are determined by a preset intelligent algorithm model, the intelligent algorithm model takes the component target wind pressure value, deformation resistance and elastic modulus of the silicone strip material as input parameters, is trained based on finite element simulation data to form, and is used to output the structure parameters meeting the deflection deformation control requirements under high wind pressure working condition; the silicone strip is clamped between the clamping groove structure of the frame and the matching part of the photovoltaic module, the cross-sectional size and hardness parameter of the silicone strip are matched with the gap parameters of the clamping groove structure and the matching part output by the intelligent algorithm model, and the two side surfaces of the silicone strip are respectively in interference fit with the inner wall of the clamping groove structure and the outer surface of the matching part; the geometric parameters of the clamping groove structure and the matching part determined by the intelligent algorithm model are combined with the customized size and hardness of the silicone strip to realize the elastic compression connection and sealing of the frame and the edge of the photovoltaic module, the frame and the photovoltaic module do not need to be coated with structural glue, and the compression deformation amount of the silicone strip under high wind pressure load is limited within the preset safety threshold to reduce the risk of cell cracking.

[0032] Specifically, the photovoltaic module frame bonding structure provided by the application is core in that the parameterized design driven by the intelligent algorithm and the elastic clamping structure of the silicone strip replace the traditional structural glue bonding to realize the accurate matching of the mechanical properties and sealing performance of the component connection interface under high wind pressure environment.

[0033] The frame is arranged at the edge of the photovoltaic module, the inner side of the frame is provided with a clamping groove structure, and the edge of the photovoltaic module is provided with a matching part (protruding structure) at the corresponding position. The geometric parameters (such as cross-sectional shape, depth, width, protruding height and inclination angle) of the clamping groove and the matching part are determined by an intelligent algorithm model, rather than relying on manual experience.

[0034] The customized silicone strip is clamped between the clamping groove and the matching part, the cross-sectional size and hardness parameter of the silicone strip are strictly matched with the gap parameters of the clamping groove and the matching part, the two side surfaces are tightly combined with the inner wall of the clamping groove and the outer surface of the matching part through interference fit to form an elastic compression connection interface, and structural glue is not needed to be coated.

[0035] The intelligent algorithm model's input parameters include the target wind pressure resistance of the module (e.g., design wind pressure of 2.5kPa), deformation resistance (e.g., maximum allowable module edge deflection of 5mm), and the elastic modulus of the silicone strip material (e.g., 60 Shore A). Output parameters include the slot cross-sectional shape (e.g., trapezoidal, dovetail), depth (10-15mm), width (8-12mm), mating protrusion height (no less than 1 / 2 the slot depth), inclination angle (10°-15° tapered guide structure), silicone strip cross-sectional dimensions (width 2-3mm larger than the slot opening, height 1-2mm larger than the gap), and hardness parameters (ensuring compression deformation ≤ the cell safety threshold). Based on finite element simulation data and machine learning optimization, a mapping relationship between mechanical performance requirements, structural parameters, and material parameters is established to ensure that the silicone strip compression deformation under high wind pressure is limited to the cell's flexural strength safety threshold (e.g., ≤0.3mm) while also meeting the required extrusion stress for sealing (e.g., 0.8-1.2MPa).

[0036] The construction and training of the intelligent algorithm model includes the following steps: Step 1: Establishing a Finite Element Model Library: Designing multiple sets of 3D models with different slot cross-sections (trapezoidal, dovetail, and L-shaped), depths (10mm, 12mm, and 15mm), mating protrusion heights (6mm, 8mm, and 10mm), and inclination angles (10°, 15°, and 20°). Inputting different wind pressure loads (1kPa, 2kPa, and 3kPa) and silicone strip elastic moduli (50-70 Shore A), finite element simulations were used to obtain data on the stress distribution at the connection interface, silicone strip compression, and overall component deflection to form a training sample set. Step 2: Model Training and Optimization: Using a neural network or support vector machine algorithm, a mapping model was constructed using the target wind pressure resistance value, deformation resistance, and silicone strip elastic modulus as inputs and structural parameters (slot depth, mating angle, etc.) as outputs. Through iterative training, the structural parameters output by the model are made to meet the constraints such as "compression deformation of silicone strip ≤ safety threshold" and "interface stress uniformity ≥ 90%", and finally an engineerable intelligent algorithm model is formed.

[0037] Based on the target module's wind pressure resistance rating (e.g., requirements for high wind pressure areas), the algorithm model inputs parameters such as a slot depth of 12mm, a mating angle of 12°, and a silicone strip hardness of 65 Shore A. The frame is made of stainless steel or high-strength aluminum alloy, with a trapezoidal slot (opening width 10mm, bottom width 12mm, depth 12mm) extruded. A raised mating portion (8mm height, 12° angle) is formed on the edge of the PV module through a molding process.

[0038] According to the gap parameters (such as the vertical gap of 5 mm and the horizontal gap of 2 mm) output by the algorithm, a customized rectangular cross-section silicone strip (width of 13 mm, height of 6 mm, and hardness of 65 Shore A) is ensured to have a width greater than 3 mm of the opening of the card slot and a height greater than 1 mm of the gap. During assembly, the silicone strip is pressed into the card slot along the inclined surface of the fitting part, and the tapered guide structure is used to reduce the assembly resistance. After the silicone strip is extruded, a contact stress of 0.9 MPa is generated, forming an elastic connection interface with no gap, without the need for structural adhesive assistance.

[0039] By canceling the structural adhesive coating and curing process, the single-component assembly time is shortened from 30 minutes in the traditional process to 5 minutes, and the production line efficiency is improved by more than 60%. The elastic deformation of the silicone strip absorbs the difference in thermal expansion of the frame and the component caused by environmental temperature changes (-40°C to 85°C), avoiding the edge stress concentration caused by the shrinkage of the structural adhesive (the edge stress in the traditional process can reach 15 MPa, and the proposed solution is reduced to less than 5 MPa), and the battery piece hidden crack rate is reduced from the industry average of 3% to less than 0.5%.

[0040] Quantitative optimization of wind pressure resistance: Through the algorithm model, the deflection deformation of the component edge is controlled within the design threshold (such as deflection ≤ 4 mm under 1.5 kPa wind pressure), which improves the anti-deformation ability by 30% compared to the traditional empirical design, meeting the long-term use requirements in coastal typhoon areas (design wind pressure ≥ 2.5 kPa).

[0041] Multi-parameter collaborative optimization of sealing and mechanical properties: The sealing interface formed by the interference fit of the silicone strip (contact stress ≥ 0.8 MPa) can block the invasion of dust and rain with a particle size of ≥ 5 μm, while its compression deformation is strictly limited within the safety threshold of the battery piece (such as 0.3 mm), realizing the triple optimization of "connection strength-sealing performance-battery piece protection".

[0042] Frame structure simplification: No need to design traditional overflow groove, the complexity of frame mold is reduced, the material consumption is reduced by 10%, and the cost of single frame is reduced by 15%. Life cycle reliability improvement: The anti-aging life of the silicone strip (≥ 25 years) is better than that of the structural adhesive (usually 15 years), reducing the component operation and replacement cost, especially suitable for harsh environments with high salt mist and high ultraviolet radiation.

[0043] Intelligent algorithm model can be compatible with different specifications of components (such as 182 mm and 210 mm battery piece components) and materials (aluminum alloy, stainless steel frame, and EPDM or silicone strip), and can quickly output the adaptive structure scheme by inputting parameter adjustment, promoting the transformation of photovoltaic component connection structure from "empirical design" to "data-driven design".

[0044] The scheme breaks through the technical bottleneck of traditional photovoltaic modules relying on structural glue connection through the innovative combination of "intelligent algorithm precise design + silica gel strip elastic clamping", realizes the multidimensional improvement of mechanical properties, sealing performance and manufacturing efficiency, and has significant technical advantages and engineering application value in high wind pressure and high environmental stress scenarios.

[0045] Please refer to Figure 2 , Figure 2 is a step schematic flow chart of a glue overflow prevention method for a photovoltaic module frame bonding structure provided by an embodiment of the present application, which is used to assemble the photovoltaic module frame bonding structure provided by any embodiment of the present application. As shown in Figure 2 , the method provided includes steps S101 to S103.

[0046] Step S101. The cross-sectional shape, depth, and width of the clamping groove structure and the protrusion height and inclination angle of the matching part are determined by a preset intelligent algorithm model. The intelligent algorithm model takes the target wind pressure value, deformation resistance, and elastic modulus of the silica gel strip material as input parameters, is trained based on finite element simulation data, and is used to output structural parameters that meet the deflection deformation control requirements under high wind pressure conditions.

[0047] Specifically, this step replaces traditional experience design with data-driven intelligent design to establish a precise mapping relationship between "mechanical performance requirements and structure parameters". The core is to train an intelligent algorithm model using finite element simulation data, input the target wind pressure value, deformation resistance, and elastic modulus of the silica gel strip material, and output the clamping groove structure (cross-sectional shape, depth, and width) and matching part parameters (protrusion height and inclination angle) that meet the deflection deformation control requirements under high wind pressure conditions, to ensure uniformity of the connection interface stress and quantifiable control of the deformation amount.

[0048] A finite element simulation model library is established by designing multiple sets of different clamping groove cross-sectional shapes (such as trapezoidal, dovetail, and L-shaped), setting the depth range (10-15 mm), the width range (8-12 mm), the matching part protrusion height (6-10 mm), and the inclination angle (10°-20°). Different wind pressure loads (1-3 kPa) and silica gel strip elastic modulus parameters (50-70 Shore A) are applied to each model, and the stress distribution (such as contact stress and shear stress) of the connection interface, the silica gel strip compression deformation amount (Δh), and the module edge deflection (δ) are calculated by ANSYS and other simulation software to form a training sample set containing 100,000+ groups of data.

[0049] The intelligent algorithm model is constructed by using machine learning algorithms (such as random forest and neural network), with the target wind pressure value (P), deformation resistance ([δ]), and silica gel strip elastic modulus (E) as the input layer, and the clamping groove depth (H) and matching part inclination angle (θ) as the output layer.

[0050] With the constraints of "silicone strip compression deformation amount ≤ battery piece safety threshold (Δh ≤ 0.3mm)", "component deflection ≤ design value (δ ≤ [δ])", and "interface stress uniformity ≥ 90%", the model parameters are optimized by gradient descent algorithm until the output precision meets the engineering requirements (error ≤ 5%).

[0051] The engineering parameter output outputs the optimal parameters by inputting the model according to the specific project requirements (such as target wind pressure of 2.5kPa in coastal areas, allowable deflection of 4mm, and silicone strip elastic modulus of 60 Shore A): the slot cross section is trapezoidal (depth 12mm, opening width 10mm, bottom width 12mm), the matching part protrusion height is 8mm, and the inclination angle is 15°.

[0052] Step S102. A silicone strip is clamped between the slot structure of the frame and the matching part of the photovoltaic module, the cross-sectional size and hardness parameter of the silicone strip are matched with the slot structure and matching part gap parameter output by the intelligent algorithm model, and the two side surfaces of the silicone strip form an interference fit with the inner wall of the slot structure and the outer surface of the matching part.

[0053] Specifically, according to the slot-matching part gap parameters (such as three-dimensional gap volume) output in step S101, the cross-sectional size (width, height, shape) and hardness parameter of the silicone strip are customized to form an interference fit (i.e. the silicone strip size is slightly larger than the gap, and the extrusion stress is generated after being pressed in) between the two side surfaces and the slot inner wall and the matching part outer surface, without the need for structural glue to realize elastic connection and sealing.

[0054] The silicone strip parameter calculation includes: size adaptation: according to the slot depth H=12mm and the matching part protrusion height h=8mm, the vertical gap Δh=H-h=4mm is calculated, and the silicone strip height h_s=Δh+1mm=5mm (1mm interference amount is reserved) is set; the slot opening width W=10mm, and the silicone strip width w_s=W+2mm=12mm (1mm interference amount is reserved on both sides). Hardness matching: based on the maximum allowable compression deformation amount Δh_max=0.3mm under high wind pressure, the required hardness is calculated by Hooke's law: silicone strip elastic modulus E_s=(F / A) / (Δh / h_s), wherein F is the wind pressure load force, to ensure that the compression stress ≤ the allowable stress of the frame and the module edge material (such as the allowable stress of aluminum alloy 80MPa).

[0055] The silicone strip manufacturing and assembly includes: material selection: using addition type silicone rubber (temperature resistance -50℃~200℃, anti-aging grade ≥25 years), preparing trapezoidal cross section silicone strip (matching the shape of the clamping groove) by extrusion molding process, and doing anti-skid treatment on the surface to increase the friction coefficient (μ≥0.6). Assembly process: slowly press the silicone strip along the inclined angle (15°) of the fitting part into the clamping groove, use the tapered guide structure (the outer surface of the fitting part is inclined) to reduce the pressing force (the traditional vertical pressing force needs 50N, and the scheme reduces to 20N), ensure the uniform deformation of the silicone strip, and avoid local tearing.

[0056] Step S103. The geometric parameters of the clamping groove structure and the fitting part determined by the intelligent algorithm model, combined with the customized size and hardness of the silicone strip, realize the elastic compression connection and sealing of the frame and the edge of the photovoltaic module, the structure glue is not needed between the frame and the photovoltaic module, and the compression deformation amount of the silicone strip under high wind pressure load is limited within the preset safety threshold to reduce the risk of cell cracking.

[0057] Specifically, the geometric parameters determined by the intelligent algorithm and the customized parameters of the silicone strip work together to form an elastic compression connection interface between the frame and the edge of the photovoltaic module: on the one hand, the high wind pressure load energy is absorbed by the elastic deformation of the silicone strip, and the compression deformation amount is controlled within the safety threshold of the cell (to reduce the risk of cracking); on the other hand, the interference fit is realized to replace the adhesive sealing function of the traditional structure glue, while simplifying the process and improving the reliability.

[0058] Mechanical property verification: apply a target wind pressure (such as 2.5kPa) to the assembled module in a laboratory environment, measure the stress of the connection interface (requirement ≤60MPa) by strain gauge, monitor the compression amount of the silicone strip (requirement ≤0.3mm) and the deflection of the module edge (requirement ≤4mm) by laser displacement sensor, and the data is fed back to the algorithm model to form a closed loop optimization.

[0059] Sealing performance test: detect the air tightness of the module by pressure decay method (inflated to 10kPa, pressure drop ≤0.5kPa within 5 minutes), verify the corrosion resistance of the silicone strip by salt spray test (5% NaCl solution, 96 hours) (weight loss ≤1%), and ensure long-term sealing reliability in harsh environment.

[0060] Production process integration: detect the machining precision of the clamping groove and the fitting part (tolerance ±0.1mm) by visual recognition system on the automatic production line, press the silicone strip accurately by mechanical arm and monitor the pressing force in real time (deviation ±5N), and ensure the consistency of the connection parameters of each module.

[0061] In some embodiments, the calculation of the cross-sectional shape, depth, width of the card slot structure, and the protrusion height and inclination angle of the matching part by the preset intelligent algorithm model comprises: the intelligent algorithm model determines the minimum support strength required for the connection of the frame and the edge of the photovoltaic module based on the target wind pressure resistance value of the assembly, calculates the contact stress distribution of the card slot structure and the matching part in combination with the deformation resistance requirement, simulates the compression deformation state under different geometric parameters according to the elastic modulus of the silicone strip material, and outputs the cross-sectional shape, depth, width, protrusion height and inclination angle parameters that meet the stress uniformity requirement of the connection interface between the frame and the photovoltaic module under high wind pressure conditions.

[0062] This embodiment clearly defines the core calculation logic of the intelligent algorithm model: based on the target wind pressure resistance value, the minimum support strength required for the connection is determined, the contact stress distribution of the card slot and the matching part is calculated in combination with the deformation resistance requirement, and the compression deformation state under different geometric parameters is simulated through the elastic modulus of the silicone strip, and finally the structure parameters (cross-sectional shape, depth, width, protrusion height and inclination angle) that meet the stress uniformity requirement are output.

[0063] The mechanical requirement is decomposed by calculating the total load required for the frame edge to bear according to the target wind pressure resistance value (such as 2.5 kPa) through the mechanical formula F=P×S (P is the wind pressure, and S is the wind area of the assembly), and the minimum support strength required for the connection interface (such as the contact stress ≥10 MPa) is derived. In combination with the deformation resistance requirement (such as the edge deflection ≤5 mm), an elastic mechanics model is established, and the contact stress distribution under different card slot depths and matching part heights (such as the stress and strain are related by using Hooke's law σ=E×ε) is calculated.

[0064] The silicone strip deformation simulation inputs the elastic modulus of the silicone strip (such as 60 Shore A), simulates its compression deformation under different card slot widths and inclination angles (such as the elastic recovery characteristic when the compression rate is ≤20%) through the nonlinear elastic theory, and ensures that the stress is uniformly transmitted to the frame and the assembly during the deformation process.

[0065] The parameter optimization output adopts a multi-objective optimization algorithm (such as NSGA-II), takes “contact stress uniformity ≥90%” and “maximum stress ≤material allowable stress” as constraint conditions, and iteratively calculates the optimal cross-sectional shape (such as trapezoidal cross-section), depth (12 mm), inclination angle (15°) and other parameters.

[0066] In some embodiments, the intelligent algorithm model takes the component target wind pressure resistance value, deformation resistance, and silicone strip material elastic modulus as input parameters, is trained based on finite element simulation data, and includes: pre-establishing finite element models of different card slot cross-sectional shapes, depths, widths, and fitting part protrusion heights and inclination angles, inputting different wind pressure loads and silicone strip elastic modulus parameters for simulation, obtaining stress distribution of the frame and photovoltaic module connection interface, silicone strip compression deformation, and overall deflection deformation data of the module, taking the above data as training samples, constructing a mapping relationship model with structure parameters as output and target wind pressure resistance value, deformation resistance, and silicone strip elastic modulus as input, and optimizing model parameters through a machine learning algorithm until the output structure parameters meet the preset deflection deformation control precision requirements.

[0067] This embodiment specifies the data-driven construction process of the intelligent algorithm model: by establishing multiple finite element models with different geometric parameters, inputting different wind pressure loads and silicone strip elastic modulus for simulation, obtaining stress distribution, silicone strip compression, and module deflection data as training samples, constructing a mapping relationship model of “input parameters (wind pressure, deformation, modulus) → output parameters (structure geometry)”, and optimizing through machine learning to meet the deflection control precision requirements.

[0068] The finite element model library is constructed by designing 30 groups of differentiated geometric parameter combinations (such as card slot depth 10 / 12 / 15 mm, fitting part angle 10° / 15° / 20°), using ANSYS to establish a three-dimensional model, dividing the grid, and then applying wind pressure load (1-3 kPa) and silicone strip material properties (elastic modulus 50-70 Shore A converted to MPa level parameters).

[0069] The simulation outputs key data: connection interface maximum stress (σmax), silicone strip compression (ΔΔh), and module center deflection (δ), forming a training set containing 2000+ groups of data.

[0070] The machine learning model is constructed using a neural network (such as a BP network), the input layer is [target wind pressure, allowable deflection, silicone modulus], the output layer is [card slot depth, fitting part angle, cross-sectional shape code], the hidden layer is set with mechanical constraint conditions (such as Δh≤0.3 mm). The gradient descent algorithm is used to train the model, and the error between the simulation deflection and the calculated deflection of the output parameters is ≤2% as the termination condition, and finally a mapping model that can be engineered is formed.

[0071] In some embodiments, the intelligent algorithm model incorporates the thermal expansion coefficient difference parameters of the frame material and the edge material of the photovoltaic module during the training process. By simulating the size change of the frame and the photovoltaic module under different environmental temperatures, the temperature adaptability of the slot structure depth, the fitting part inclination angle, and the hardness of the silicone strip are optimized. The bonding structure can still maintain stable elastic compression force and sealing performance in the temperature range of -40°C to 85°C, improving the long-term reliability of the module in complex environments.

[0072] This embodiment introduces temperature adaptability parameters in model training: considering the difference between frame material (such as aluminum alloy, thermal expansion coefficient 23x10 -6 / ℃) and photovoltaic module edge material (such as glass + EVA, thermal expansion coefficient 8x10 -6 / ℃), simulating the size change of both in the temperature range of -40°C~85°C, optimizing the slot depth, fitting angle, and silicone strip hardness to ensure stable elastic compression force and sealing performance at different temperatures.

[0073] Thermal expansion difference calculation is calculated by calculating the size change at extreme temperatures: ΔL = α x L x ΔT (α is the thermal expansion coefficient, L is the frame side length, ΔT = 125°C), for example, a 1m frame at 85°C, the aluminum alloy elongates 2.875mm, the glass assembly elongates 1mm, the difference is 1.875mm which needs to be compensated by the slot depth.

[0074] Temperature-deformation coupling simulation simulates the relative displacement of the slot and the fitting part at different temperatures by adding temperature load in the finite element model, adjusts the slot depth (such as increasing 0.5mm to compensate the gap), the fitting part inclination angle (increasing 2° to adapt to the thermal expansion direction), and optimizes the hardness of the silicone strip (the hardness is increased to 65 Shore A at low temperature to maintain the elastic force).

[0075] Multi-condition joint training expands the training sample set by taking temperature parameters (-40°C, 25°C, 85°C) as additional input dimensions, ensuring that the model output parameters meet the requirements of "elastic compression force ≥0.5MPa" and "sealing interface gap ≤0.1mm" in the full temperature range.

[0076] In some embodiments, the silicone strip is clamped between the card slot structure of the frame and the matching part of the photovoltaic module, the cross-sectional size and hardness parameter of the silicone strip are matched with the card slot structure and the gap parameter between the matching parts output by the intelligent algorithm model, including: the intelligent algorithm model calculates the three-dimensional gap volume between the card slot and the matching part according to the depth, width and matching part protrusion height of the card slot structure, combines the elastic recovery rate and anti-aging performance requirements of the silicone strip material, and outputs the cross-sectional size of the silicone strip that meets the sealing performance and long-term use reliability; at the same time, according to the constraint condition that the compression deformation amount of the silicone strip under high wind pressure load is not more than the preset safety threshold, the hardness parameter of the silicone strip is determined, so that the compression stress of the silicone strip under the rated load is matched with the structural strength of the frame and the edge of the photovoltaic module.

[0077] This embodiment clarifies the quantitative design logic of the silicone strip parameters: according to the three-dimensional gap volume (determined by the depth, width and protrusion height) of the card slot and the matching part, combining the elastic recovery rate (≥90%) and anti-aging requirements of the silicone strip, the cross-sectional size is calculated; at the same time, taking "compression amount under high wind pressure ≤ safety threshold" as the constraint, the hardness parameter is determined to ensure that the compression stress is matched with the frame / module strength (such as the allowable stress of aluminum alloy frame 80MPa).

[0078] Three-dimensional gap calculation: card slot depth H=12mm, matching part protrusion height h=8mm, vertical gap Δh=H-h=4mm; card slot opening width W=10mm, bottom width W2=12mm, trapezoidal cross-sectional gap volume V=(W+W2) / 2×Δh×L (L is the length of the frame). According to the sealing requirement (gap filling rate ≥95%), set the cross section of the silicone strip to be trapezoidal, the width is greater than the card slot opening 2mm (12mm), and the height is greater than the vertical gap 1mm (5mm), to ensure volume matching.

[0079] Hardness parameter derivation: based on the allowable compression amount Δh_max=0.3mm under the maximum wind pressure, using Hooke's law E=σ / ε=(F / A) / (Δh / hs), hs is the initial height of the silicone strip 5mm, the required elastic modulus E=(F / (12mm×L)) / (0.3 / 5) is calculated, and the hardness parameter (such as 65 Shore A corresponds to E≈3MPa) is deduced.

[0080] In some embodiments, the two sides of the silica gel strip are respectively in interference fit with the inner wall of the card slot structure and the outer surface of the matching part, including: the cross-sectional shape of the silica gel strip matches the cross-sectional shape of the card slot structure, and the width of the silica gel strip is greater than the width of the opening of the card slot structure, and the height of the silica gel strip is greater than the vertical gap between the card slot structure and the matching part; during assembly, the silica gel strip is pressed into the gap between the card slot structure and the matching part by external force, so that the two sides of the silica gel strip are respectively extruded with the inner wall of the card slot and the outer surface of the matching part to form an elastic connection interface with no gap, and the value of the extrusion stress is determined by an intelligent algorithm model to ensure the connection strength and sealing performance.

[0081] This embodiment specifies the implementation details of the interference fit: the cross-sectional shape of the silica gel strip matches the card slot (such as trapezoidal to trapezoidal), the width is greater than the opening of the card slot (interference amount 1-3mm), and the height is greater than the vertical gap (interference amount 1-2mm); during assembly, the silica gel strip is pressed into the gap between the card slot structure and the matching part by external force, so that the two sides of the silica gel strip are respectively extruded with the inner wall of the card slot and the outer surface of the matching part to form an elastic connection interface with no gap, and the value of the extrusion stress is determined by an intelligent algorithm model to ensure the connection strength and sealing performance.

[0082] Geometric matching design: the card slot is trapezoidal in cross-section (opening 10mm, bottom 12mm, depth 12mm), and the silica gel strip is designed to be the same trapezoidal cross-section (opening 12mm, bottom 14mm, height 5mm), the width interference amount is 2mm (1mm on one side), and the height interference amount is 1mm (compensating for the vertical gap of 4mm).

[0083] The assembly process is optimized using an automatic press-fitting machine to apply a constant pressure (such as 20N / mm) to press the silica gel strip along the inclination angle (15°) of the matching part, and the inclined surface is used as a guide (friction coefficient μ=0.6) to reduce the pressing force, while the extrusion stress (target value 1.0MPa±0.1) is monitored in real time by a pressure sensor to ensure uniform interference.

[0084] In some embodiments, the geometric parameters of the card slot structure and the matching part determined by the intelligent algorithm model include: the cross-sectional shape of the card slot structure is one of trapezoidal, dovetail-shaped or L-shaped, the depth value range is calculated by an intelligent algorithm model according to the target wind pressure resistance value of the assembly, and the depth direction is consistent with the thickness direction of the edge of the photovoltaic assembly; the protrusion height of the matching part is not less than 1 / 2 of the depth of the card slot structure, and the inclination angle is set to form a tapered guide structure between the outer surface of the matching part and the inner wall of the card slot structure to adapt to the deformation direction of the silica gel strip during pressing, and to reduce the assembly resistance.

[0085] The embodiment specifies the geometric parameters of the card slot and the matching part: the card slot cross section can be selected as trapezoidal, dovetail-shaped, L-shaped, the depth direction is consistent with the edge thickness of the assembly (such as 3.2mm glass+EVA+aluminum frame total thickness 20mm, card slot depth 12mm); the matching part protrusion height≥card slot depth 1 / 2 (such as≥6mm), the inclination angle forms a tapered guide structure (10°-20°), which adapts to the deformation direction of the silica gel strip and reduces the assembly resistance.

[0086] Cross section shape selection: high wind pressure scenario preferentially selects dovetail-shaped cross section (deep bite, strong pullout resistance), and conventional scenario uses trapezoidal cross section (low processing cost); stress concentration coefficients of different shapes are calculated by algorithm model (dovetail shape≤1.1, trapezoidal≤1.3, L-shaped≤1.5), and selection is made as needed.

[0087] Guide structure design: the inclination angle θ of the outer surface of the matching part is 15°, which is consistent with the inclination angle of the inner wall of the card slot, forming a tapered channel (opening width>bottom width), so that the deformation direction of the silica gel strip is perpendicular to the inclined surface when it is pressed in, reducing the shear stress (traditional vertical surface pressure shear stress≥5MPa, the present scheme≤2MPa).

[0088] In some embodiments, the customized size and hardness of the silica gel strip realize the elastic compression connection and sealing of the frame and the edge of the photovoltaic module, including: the customized size of the silica gel strip meets the gap filling requirement between the card slot structure and the matching part, and the hardness parameter makes the elastic deformation amount of the silica gel strip in the normal working temperature range be in the recoverable deformation interval; when the photovoltaic module bears high wind pressure load, the silica gel strip absorbs the local stress of the module edge through elastic compression, and at the same time, the sealing interface formed by interference fit prevents external water vapor and dust from entering the inside of the module, and the elastic compression force and the sealing performance are optimized by intelligent algorithm model, to ensure the mechanical stability and environmental adaptability of the connection structure.

[0089] The embodiment specifies the coordination mechanism of elastic compression and sealing: the size of the silica gel strip meets the gap filling (filling rate≥95%), and the hardness ensures that the elastic deformation is recoverable within-40℃~85℃ (plastic strain≤5%); under high wind pressure, the edge stress is absorbed through elastic compression (absorption efficiency≥40%), and the sealing interface formed by interference fit (contact stress≥0.8MPa) blocks external pollutants, and the elastic compression force and the sealing performance are optimized by algorithm (such as, for every 0.1MPa increase in compression force, the sealing level is improved by 1 level).

[0090] Temperature-elasticity interval check: by testing the elastic modulus of the silica gel strip at different temperatures (such as E=5MPa at-40℃, E=3MPa at 25℃, E=2MPa at 85℃), it is ensured that the deformation amount is within the elastic limit (compression rate≤20%, corresponding to recoverable deformation) in the full temperature range.

[0091] Multi-performance collaborative optimization is to establish a multi-objective optimization function f = w1 × compression force + w2 × sealing level - w3 × deformation energy (weight coefficient w1 = 0.4, w2 = 0.3, w3 = 0.3), and to solve the Pareto optimal solution by algorithm, so that the compression force (0.8-1.2MPa) and the sealing level (IP68) can meet the standards at the same time.

[0092] In some embodiments, the frame and the photovoltaic module do not need to be coated with a structural adhesive, and the compression deformation amount of the silicone strip under high wind pressure load is limited within a preset safety threshold to reduce the risk of cell cracking, including: the preset safety threshold is determined according to the bending strength parameter of the photovoltaic module cell, and the intelligent algorithm model adjusts the depth of the clamping groove, the height of the matching part, and the hardness parameter of the silicone strip by simulating the compression deformation amount of the silicone strip under different wind pressure loads, so that the compression deformation amount of the silicone strip under the maximum design wind pressure of the module does not exceed the safety threshold; by canceling the structural adhesive and using the silicone strip clamping, the stress concentration effect of the glue curing shrinkage on the edge of the module in the traditional gluing process is avoided, and the risk of cell cracking is further reduced.

[0093] This embodiment clearly defines the core advantage of the glue-free design: the preset safety threshold is determined according to the bending strength of the cell (such as bending strength ≥ 20MPa, corresponding to maximum allowable deformation 0.3mm), and the depth of the clamping groove, the height of the matching part, and the hardness of the silicone strip are adjusted by algorithm, so that the compression amount under wind pressure ≤ safety threshold; cancel the structural adhesive, eliminate the glue curing shrinkage stress (traditional process shrinkage rate 10%-15%, leading to edge stress concentration 15MPa or more), and double reduce the risk of cracking.

[0094] The safety threshold is set by the cell bending test, and the critical cracking deformation amount is determined to be 0.3mm, which is used as the safety threshold of the compression amount of the silicone strip; a "clamping groove depth-compression amount" mapping relationship is established (such as depth increasing by 1mm, compression amount decreasing by 0.05mm), and the lower limit of the depth is deduced by algorithm (such as 12mm).

[0095] Cancel the gluing robot, glue curing line and other equipment, and use the automatic clamping machine of the silicone strip instead, and the single module assembly time is shortened from 30 minutes to 8 minutes, while avoiding the quality risk in the glue storage and mixing process (such as expired glue, wrong proportioning).

[0096] In some embodiments, the environmental humidity parameter (relative humidity 0-100%) is introduced by the intelligent algorithm model, combined with the moisture absorption and expansion characteristics of the silicone strip (water absorption rate 0.5%, volume expansion 1%) and the water vapor diffusion coefficient (D = 1 × 10 -12 m 2 / s), a "humidity-expansion amount-sealing gap" dynamic model is established. When the algorithm predicts a high humidity environment (such as RH≥90% for 48h), the card slot depth compensation value (+0.3mm) and the silica gel strip cross-sectional width (+1mm) are automatically adjusted to ensure that the sealing interface gap is still ≤0.05mm after absorbing moisture expansion, and at the same time, the sealing performance (leakage rate ≤5×10 -9 m 3 / s).

[0097] The humidity-sealing coupling modeling is based on Fick's law to simulate the diffusion process of water vapor in the silica gel strip, calculate the radial expansion amount of the silica gel strip under different humidity (Δw=0.01×RH%), and combine the moisture absorption oxide layer thickness of the frame aluminum alloy (0.1μm per day) to establish the interface gap change formula: Δd=Δw-Δox (Δox is the oxide layer thickness). A humidity-sensitive training data set is constructed: 1000 groups of data are collected under 85℃ / 85%RH (double 85 test) environment, the LSTM neural network model is trained, and the time series analysis of "humidity historical data→future 72h sealing gap prediction" is realized.

[0098] When continuous high humidity weather is predicted, the algorithm automatically triggers parameter correction: the card slot depth increases by 0.3mm (reserves expansion space), the silica gel strip width increases by 1mm (compensates for the oxide layer thickness), and the mold processing parameters (accuracy ±0.05mm) are updated synchronously through the MES system to ensure the sealing reliability of the components in high humidity environment.

[0099] In some embodiments, by embedding a digital twin in the intelligent algorithm model, real-time collection of pressure sensor data (pressure force 10-30N / mm) and visual inspection data (silica gel strip deformation uniformity ≥95%) on the assembly line is realized, and a "actual assembly parameter-design parameter deviation" feedback loop is constructed. When the pressure force fluctuation is detected to be more than ±15% (such as target 15N / mm, actual 18N / mm), the algorithm automatically back-projects the card slot inclination angle deviation (such as design 15°, actual 14°), and online corrects the mold processing parameters (accuracy ±0.1°) of subsequent batches, forming a "design-manufacturing-feedback" closed loop optimization.

[0100] The digital twin system is built by establishing a line-level digital twin model, integrating pressure assembly machine PLC data, machine vision images (20 frames per second), three-coordinate measuring instrument precision data (error ±0.02mm), and synchronizing to the algorithm platform in real time through OPC UA protocol. The parameter deviation tolerance is defined: pressure force deviation ≤±10%, silica gel strip cross-sectional deformation uniformity ≥95%, and when it exceeds the range, the algorithm self-correction is triggered.

[0101] Adaptive optimization process through when a batch of components press-in force abnormal rise (such as 18N / mm), algorithm through the inverse finite element analysis (inverse problem solving), determine is the fit part tilt angle small (14°) lead to friction resistance increase, automatically generate mold correction instruction (increase 1° tilt angle), and update design drawings at the same time, realize "abnormal discovery-reason positioning-parameter correction" in 30 minutes.

[0102] In some embodiments, by introducing the full life cycle cost parameters (material cost, processing cost, operation and maintenance cost, failure replacement cost) through the intelligent algorithm model, taking "25-year LCC (life cycle cost) minimum" as the objective function, combining reliability index (failure rate ≤0.5% / year) and performance index (wind pressure resistance ≥2.5kPa), a multi-objective optimization model is constructed. The algorithm automatically balances the material thickness of the clamping groove (such as aluminum alloy from 2mm to 1.8mm, cost reduction of 10%) and the replacement period of silica gel strip (from 15 years to 20 years, operation and maintenance cost reduction of 20%), and outputs the optimal combination of geometric parameters.

[0103] Cost model construction: define cost function: LCC = C_material + C_manufacture + C_maintenance + C_failure, where material cost is positively correlated with clamping groove depth and width (depth increases by 1mm, cost increases by 5 yuan), and operation and maintenance cost is negatively correlated with silica gel strip life (life increases by 5 years, cost decreases by 8 yuan / year). Particle swarm optimization algorithm (PSO) is used to search for the parameter combination corresponding to the minimum 25-year LCC under the constraints of wind pressure resistance ≥2.5kPa and sealing level IP68 (such as depth 12mm→11mm, width 10mm→9.5mm, hardness 65 Shore A→60 Shore A).

[0104] Sensitivity analysis and decision making: the algorithm outputs the Pareto frontier of different parameter schemes for designers to choose: such as "low-cost scheme" (LCC reduction of 15%, reliability reduction of 5%) or "high-reliability scheme" (LCC increase of 8%, failure rate reduction of 60%), supporting customized decision making.

[0105] In some embodiments, by integrating an AI vision evaluation module in the intelligent algorithm model, a high-resolution camera (accuracy ±0.1mm) is carried by a drone to regularly scan the frame deformation of the running components (such as clamping groove opening expansion ≥0.5mm warning), combined with historical meteorological data (wind speed, temperature cycle times), the aging degree of silica gel strip is inversely calculated (hardness decay rate ≥15% triggers pre-adjustment). The algorithm automatically generates pre-adjustment parameters (such as increasing clamping groove depth by 0.5mm to compensate for aging deformation), and realizes parameter pre-configuration of spare parts through remote control, ensuring the structural matching of operation and replacement.

[0106] The service state monitoring system deploys edge computing nodes to process visual images in real time: identify the edge cracks of the card slot (resolution ≥ 0.2 mm), the surface cracks of the silica gel strip (length ≥ 2 mm), and combine with the acceleration sensor data (vibration amplitude ≥ 0.3g continuous recording) to build a "damage-load-aging" correlation model. Define the aging threshold: when the hardness of the silica gel strip decays to 85% of the design value (such as from 65 Shore A to 55 Shore A), or the plastic deformation of the card slot ≥ 0.3mm, trigger the algorithm pre-adjustment process.

[0107] Pre-adjustment parameter generation mechanism: based on the aging degree, the algorithm calculates the compensation parameters: if the hardness of the silica gel strip decays by 10%, the depth of the card slot increases by 0.3mm (maintaining the designed compression amount), the inclination angle of the matching part decreases by 2° (reducing the resistance to penetration after aging), and the parameters are synchronized to the spare parts manufacturer (error ± 0.05mm), realizing the digitalization of the whole process of "monitoring-evaluation-pre-adjustment".

[0108] In some embodiments, for the problem of extreme temperature gradient in high altitude areas (such as the Qinghai-Tibet Plateau, the diurnal temperature difference ≥ 40℃), the intelligent algorithm model adds a temperature gradient parameter (ΔT / h ≥ 10℃ / min), simulates the thermal stress distribution of the frame and the edge of the component under rapid temperature change (aluminum alloy thermal stress ≤ 120MPa, glass edge stress ≤ 40MPa). By optimizing the heat conduction path of the card slot structure (such as adding heat insulation grooves, heat resistance increased by 50%) and the temperature sensitivity parameters of the silica gel strip (hardness gradient changes in low temperature section, hardness 70 Shore A at -40℃, 60 Shore A at 25℃), the thermal stress concentration of the connection structure is reduced by 40% under the temperature change rate of 10℃ / min.

[0109] Temperature gradient field modeling uses transient thermal analysis module to simulate the rapid heating process of the component from -40℃ to 85℃ (within 30 minutes), calculates the interfacial heat flux of the frame and glass (q=500W / m²), combines with the thermal conductivity of the silica gel strip (0.2W / m*K), designs the heat insulation groove structure (depth 2mm, width 3mm, spacing 10mm) to block the heat flow path. Develop a variable hardness silica gel strip formula (add temperature sensitive fillers), determine the hardness target value at different temperature sections through algorithm, ensure that the elastic modulus change rate ≤ 15% / 10℃ during temperature change, maintain stable compression force (fluctuation ≤ 10%).

[0110] Multi-objective optimization strategy: taking "thermal stress ≤ material allowable stress" and "stable compression force during temperature change" as the target, input the temperature gradient parameter, output the geometric parameters of the heat insulation groove (recommended depth 2-3mm, spacing 8-12mm) and the hardness-temperature curve of the silica gel strip, realize the rapid iteration of the structure through 3D printing mold (sample making period is shortened from 7 days to 2 days).

[0111] The application inputs parameters such as the target wind pressure resistance value, deformation resistance, and elastic modulus of the silica gel strip material of the assembly, and outputs the optimized geometric parameters of the clamping groove structure and the matching part, thereby solving the problem of insufficient matching precision of structural parameters and mechanical properties in traditional empirical design, and realizing quantitative control of the deflection deformation of the assembly under high wind pressure conditions. The silica gel strip clamping structure replaces the structural adhesive bonding structure, eliminating the need for gluing and curing processes and eliminating the risk of glue overflow pollution, thereby significantly improving the assembly efficiency of the assembly. At the same time, the edge stress concentration caused by the curing shrinkage of the structural adhesive is avoided, and the risk of hidden cracks of the battery piece is reduced. Through the collaborative optimization of the algorithm model for the clamping groove cross-sectional shape and the hardness of the silica gel strip, the compression deformation of the connecting structure under high wind pressure is limited within the safety threshold of the battery piece, and a reliable sealing interface is formed through the interference fit, thereby balancing the mechanical stability, sealing performance, and environmental adaptability, and prolonging the service life of the assembly. The traditional overflow glue groove structure design is reduced, the frame processing technology is simplified, and the material and manufacturing costs are reduced. The combination of the stainless steel frame and the algorithm-optimized elastic connecting structure improves the weather resistance of the assembly in high-corrosion coastal environments and broadens the application scenarios.

[0112] The above merely describes specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements shall be encompassed within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A frame bonding structure of a photovoltaic module, comprising a photovoltaic module and a frame, the frame being provided at an edge of the photovoltaic module, characterized in that, The frame is provided with a clamping groove structure for installation, and the edge of the photovoltaic module is provided with a matching part corresponding to the position of the clamping groove structure; The cross-sectional shape, depth and width of the clamping groove structure and the protrusion height and inclination angle of the matching part are determined by a preset intelligent algorithm model, the intelligent algorithm model takes the target wind pressure resistance value, deformation resistance and elastic modulus of the silicon rubber strip material of the module as input parameters, is trained based on finite element simulation data, and is used to output structural parameters meeting the deflection deformation control requirements under high wind pressure conditions; A silicon rubber strip is clamped between the clamping groove structure of the frame and the matching part of the photovoltaic module, the cross-sectional size and hardness parameters of the silicon rubber strip are adapted to the gap parameters of the clamping groove structure and the matching part output by the intelligent algorithm model, and the two side surfaces of the silicon rubber strip are in interference fit with the inner wall of the clamping groove structure and the outer surface of the matching part, respectively. The geometric parameters of the clamping groove structure and the matching part determined by the intelligent algorithm model, in combination with the customized size and hardness of the silicon rubber strip, realize elastic compression connection and sealing of the frame and the edge of the photovoltaic module, no structural glue is needed between the frame and the photovoltaic module, and the compression deformation amount of the silicon rubber strip under high wind pressure load is limited within a preset safety threshold to reduce the risk of cell cracking.

2. A method for preventing overflow of adhesive in a frame bonding structure of a photovoltaic module, characterized by, The application is applied to the photovoltaic module frame bonding structure in claim 1, the frame is provided with a clamping groove structure for installation, and the edge of the photovoltaic module is provided with a matching part corresponding to the position of the clamping groove structure; the method comprises: The cross-sectional shape, depth and width of the clamping groove structure and the protrusion height and inclination angle of the matching part are determined by a preset intelligent algorithm model, the intelligent algorithm model takes the target wind pressure resistance value, deformation resistance and elastic modulus of the silicon rubber strip material of the module as input parameters, is trained based on finite element simulation data, and is used to output structural parameters meeting the deflection deformation control requirements under high wind pressure conditions; A silicon rubber strip is clamped between the clamping groove structure of the frame and the matching part of the photovoltaic module, the cross-sectional size and hardness parameters of the silicon rubber strip are adapted to the gap parameters of the clamping groove structure and the matching part output by the intelligent algorithm model, and the two side surfaces of the silicon rubber strip are in interference fit with the inner wall of the clamping groove structure and the outer surface of the matching part, respectively. The geometric parameters of the clamping groove structure and the matching part determined by the intelligent algorithm model, in combination with the customized size and hardness of the silicon rubber strip, realize elastic compression connection and sealing of the frame and the edge of the photovoltaic module, no structural glue is needed between the frame and the photovoltaic module, and the compression deformation amount of the silicon rubber strip under high wind pressure load is limited within a preset safety threshold to reduce the risk of cell cracking.

3. The method of claim 2, wherein, The cross-sectional shape, depth and width of the clamping groove structure and the protrusion height and inclination angle of the matching part are determined by a preset intelligent algorithm model, the intelligent algorithm model takes the target wind pressure resistance value, deformation resistance and elastic modulus of the silicon rubber strip material of the module as input parameters, is trained based on finite element simulation data, and is used to output structural parameters meeting the deflection deformation control requirements under high wind pressure conditions; The intelligent algorithm model determines the minimum support strength required for the connection of the frame and the edge of the photovoltaic module based on the component target wind pressure resistance value, calculates the contact stress distribution of the clamping groove structure and the matching part in combination with the deformation resistance requirement, simulates the compression deformation state under different geometric parameters according to the elastic modulus of the silicone strip material, and outputs the cross-sectional shape, depth, width, protrusion height and inclination angle parameters of the frame and the photovoltaic module connection interface that meet the uniformity requirement of the interface stress under high wind pressure conditions.

4. The method of claim 2, wherein, The intelligent algorithm model takes the component target wind pressure resistance value, deformation resistance, and silicone strip material elastic modulus as input parameters, is trained based on finite element simulation data, and includes: The finite element model of different clamping groove cross-sectional shapes, depths, widths, and matching part protrusion heights and inclination angles is established in advance, different wind pressure loads and silicone strip elastic modulus parameters are input for simulation, the stress distribution of the frame and the photovoltaic module connection interface, the silicone strip compression deformation amount, and the overall deflection deformation data of the module are obtained, the above data is taken as a training sample, a mapping relationship model with structure parameters as output and target wind pressure value, deformation resistance, and silicone strip elastic modulus as input is constructed, and the model parameters are optimized through a machine learning algorithm until the output structure parameters meet the preset deflection deformation control accuracy requirement.

5. The method of claim 4, wherein, The intelligent algorithm model incorporates the thermal expansion coefficient difference parameters of the frame material and the edge material of the photovoltaic module in the training process, simulates the size change amount of the frame and the photovoltaic module under different environmental temperatures, and optimizes the temperature adaptability of the clamping groove structure depth, the matching part inclination angle, and the silicone strip hardness parameter, so that the adhesive structure can still maintain stable elastic compression force and sealing performance in the temperature range of -40℃ to 85℃, and the long-term reliability of the module in complex environments is improved.

6. The method of claim 2, wherein, The silicone strip is clamped between the clamping groove structure of the frame and the matching part of the photovoltaic module, the cross-sectional size and hardness parameter of the silicone strip are adapted to the gap parameter between the clamping groove structure and the matching part output by the intelligent algorithm model, and include: The intelligent algorithm model calculates the three-dimensional gap volume between the clamping groove and the matching part according to the depth, width of the clamping groove structure and the protrusion height of the matching part, outputs the cross-sectional size of the silicone strip that meets the sealing performance and long-term use reliability in combination with the elastic recovery rate and anti-aging performance requirements of the silicone strip material, and determines the hardness parameter of the silicone strip according to the constraint condition that the compression deformation amount of the silicone strip under high wind pressure load does not exceed the preset safety threshold, so that the compression stress of the silicone strip under the rated load matches the structural strength of the frame and the edge of the photovoltaic module.

7. The method of claim 6, wherein, The two side surfaces of the silicone strip are in interference fit with the inner wall of the clamping groove structure and the outer surface of the matching part, respectively, and include: The cross-sectional shape of the silicone strip matches the cross-sectional shape of the clamping groove structure, and the width of the silicone strip is greater than the width of the opening of the clamping groove structure, and the height of the silicone strip is greater than the vertical gap between the clamping groove structure and the matching part. In the assembly process, the silica gel strip is pressed into the gap between the card slot structure and the matching part by external force, so that the two side surfaces of the silica gel strip are respectively extruded with the inner wall of the card slot and the outer surface of the matching part, forming an elastic connection interface with no gap, and the value of the extrusion stress is determined by an intelligent algorithm model to ensure the connection strength and sealing performance.

8. The method of claim 2, wherein, The geometric parameters of the card slot structure and the matching part determined by the intelligent algorithm model include: The cross-sectional shape of the card slot structure is one of trapezoidal, dovetail or L-shaped, and the depth value range is calculated by an intelligent algorithm model according to the target wind pressure resistance value of the assembly, and the depth direction is consistent with the thickness direction of the edge of the photovoltaic assembly; the protrusion height of the matching part is not less than 1 / 2 of the depth of the card slot structure, and the inclination angle is set to form a tapered guide structure between the outer surface of the matching part and the inner wall of the card slot structure to adapt to the deformation direction when the silica gel strip is pressed in, and to reduce the assembly resistance.

9. The method of claim 2, wherein, The combination of the customized size and hardness of the silica gel strip realizes the elastic compression connection and sealing of the frame and the edge of the photovoltaic assembly, including: The customized size of the silica gel strip meets the gap filling requirement between the card slot structure and the matching part, and the hardness parameter makes the elastic deformation amount of the silica gel strip within the normal working temperature range in the recoverable deformation interval; When the photovoltaic assembly bears high wind pressure load, the silica gel strip absorbs the local stress of the assembly edge through elastic compression, and the sealing interface formed by interference prevents external water vapor and dust from entering the inside of the assembly, and the elastic compression force and sealing performance are optimized by an intelligent algorithm model to ensure the mechanical stability and environmental adaptability of the connection structure.

10. The method of claim 2, wherein, The frame and the photovoltaic assembly do not need to be coated with structural glue, and the compression deformation amount of the silica gel strip under high wind pressure load is limited within a preset safety threshold to reduce the risk of cell cracking, including: The preset safety threshold is determined according to the bending strength parameter of the photovoltaic assembly cell, and the intelligent algorithm model adjusts the depth of the card slot structure, the protrusion height of the matching part and the hardness parameter of the silica gel strip by simulating the compression deformation amount of the silica gel strip under different wind pressure loads, so that the compression deformation amount of the silica gel strip when the assembly bears the maximum design wind pressure does not exceed the safety threshold; By canceling the structural glue and using the silica gel strip clamping, the stress concentration effect of glue curing shrinkage on the assembly edge in the traditional gluing process is avoided, and the risk of cell cracking is further reduced.

Citation Information

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