Supporting disc inclination angle adjusting and determining method
By adjusting the tooling and calculating the included angles α and β, the problem of manually judging the perpendicularity of the machining spindle and the support plate was solved, thus improving the quality and efficiency of wafer processing.
Patent Information
- Application Number
- CN202511168984.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-20
- Publication Date
- 2025-10-31
AI Technical Summary
In existing technologies, it is difficult to accurately determine whether the machining spindle axis is perpendicular to the support surface of the support disk, which affects the quality and efficiency of wafer processing.
An adjustment fixture is used, including three adjustable adjustment platforms A, B, and C, which are arranged in an equilateral triangle with the center of the support plate as the center. By calculating the included angles α and β, the heights of adjustment platforms B and C are adjusted to make the axis of the support plate parallel to the axis of the machining spindle.
This achieves precise alignment between the support disk axis and the machining spindle axis, ensuring the uniformity and efficiency of wafer processing and avoiding the uncertainties caused by multiple adjustments.
Smart Images

Figure CN120862514A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor processing technology, and more specifically, to a method for adjusting and determining the tilt angle of a support disk. Background Technology
[0002] In wafer fabrication, the surface of the wafer needs to be thinned. This is typically done using a machining spindle and a grinding wheel placed on a support disk. During processing, the perpendicularity of the machining spindle axis to the support surface of the disk directly affects the wafer fabrication quality and efficiency. In related technologies, manual verification of the perpendicularity between the machining spindle axis and the support surface is performed before processing. However, wafer fabrication is a precision process, making it difficult for humans to determine the true perpendicularity. Even if the machining spindle axis is close to perpendicular, it can still negatively impact wafer fabrication quality and efficiency. Summary of the Invention
[0003] The purpose of this application is to provide a method for adjusting and determining the tilt angle of the support disk, which aims to solve the problem that in related technologies, before processing, it is necessary to manually determine whether the axis of the processing spindle is perpendicular to the support surface of the support disk. However, wafer processing is a precision process, and it is difficult for humans to determine whether the axis of the processing spindle is truly perpendicular to the support surface of the support disk. Even if the axis of the processing spindle is close to perpendicular to the support surface of the support disk, it will affect the processing quality and efficiency of the wafer.
[0004] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description or may be learned by practice of this application.
[0005] According to a first aspect of this application, a method for adjusting the tilt angle of a support plate is provided, which uses an adjustment fixture for adjustment. The support plate is located below the machining spindle. The adjustment fixture includes three adjustment platforms A, B, and C. The three adjustment platforms A, B, and C are vertically and vertically supported below the support plate and are arranged in an equilateral triangle with the center of the support plate as the center.
[0006] The method for adjusting the tilt angle of the support plate includes the following steps:
[0007] Obtain the angle α between the axis of the support disk and the first plane and the second plane in the spatial rectangular coordinate system. The third plane of the spatial rectangular coordinate system is parallel or coincident with the plane where the bottom surface of the support disk is located. The first plane, the second plane and the third plane are perpendicular to each other.
[0008] Calculate the adjustment height ΔX1 of adjustment platform B relative to adjustment platform A and the adjustment height ΔX2 of adjustment platform C relative to adjustment platform A based on the included angle α and the included angle β.
[0009] Adjust the heights of the adjustment table B and the adjustment table C according to the adjustment height ΔX1 and the adjustment height ΔX2, so that the axis of the support plate is parallel to the axis of the machining spindle.
[0010] In one exemplary embodiment of this application, the support point of the adjustment platform A is taken as the origin of the spatial rectangular coordinate system, and the adjustment height ΔX1 and the adjustment height ΔX2 are calculated as follows:
[0011]
[0012] Wherein, R is the radius of the circle formed by the support points of the three adjustment platforms A, B, and C.
[0013] In one exemplary embodiment of this application, the support points of the three adjustment platforms A, B, and C are arranged at the circumference of the support plate.
[0014] In one exemplary embodiment of this application, the three adjustment platforms A, B, and C are frustum structures with the same structure, and the support point is the center point of the top surface of the frustum structure.
[0015] According to a second aspect of this application, a method for determining the tilt angle of a support plate is provided, which uses an adjustment fixture for adjustment. The support plate is located below the machining spindle. The adjustment fixture includes three adjustment platforms A, B, and C. The three adjustment platforms A, B, and C are vertically and vertically supported below the support plate and are arranged in an equilateral triangle with the center of the support plate as the center.
[0016] The method for determining the tilt angle of the support plate includes the following steps:
[0017] Obtain the height value ΔX1 of adjustment platform B relative to adjustment platform A and the height value ΔX2 of adjustment platform C relative to adjustment platform A;
[0018] The angle α between the axis of the support disk and the first plane and the second plane in the spatial rectangular coordinate system are calculated based on the adjustment height ΔX1 and the adjustment height ΔX2. The third plane of the spatial rectangular coordinate system is parallel or coincident with the plane where the bottom surface of the support disk is located. The first plane, the second plane and the third plane are perpendicular to each other.
[0019] In one exemplary embodiment of this application, the support point of the adjustment platform A is taken as the origin of the spatial rectangular coordinate system, and the included angles α and β are calculated as follows:
[0020]
[0021] Where R is the radius of the circle formed by the support points of the three adjustment platforms.
[0022] In one exemplary embodiment of this application, the centers of the three adjustment platforms are arranged at the circumference of the support plate.
[0023] In one exemplary embodiment of this application, the three adjustment platforms A, B, and C are frustum structures with the same structure, and the support point is the center point of the top surface of the frustum structure.
[0024] The exemplary embodiments of this application may have some or all of the following beneficial effects:
[0025] The support plate tilt angle adjustment method provided in the example embodiment of this application uses an adjustment fixture for adjustment. The support plate is located below the machining spindle. The adjustment fixture includes three adjustment platforms A, B, and C, which are vertically and vertically supported below the support plate. The three adjustment platforms are arranged in an equilateral triangle with the center of the support plate as the center. The tilt angle of the support plate can be adjusted by adjusting the height of the adjustment platforms. The support plate tilt angle adjustment method includes the following steps: obtaining the angle α between the axis of the support plate and a first plane and a second plane in a spatial rectangular coordinate system, and the angle β between a third plane in the spatial rectangular coordinate system and the bottom surface of the support plate. The planes are parallel or coincident, and the first, second, and third planes are perpendicular to each other. The height ΔX is calculated based on the included angles α and β. The heights of the adjustment stages B and C are adjusted based on the adjustment heights ΔX1 and ΔX2 to make the axis of the support disk parallel to the axis of the machining spindle, that is, the axis of the machining spindle is perpendicular to the support surface of the support disk. This makes the pressure head mounted on the machining spindle parallel to the support disk. By adjusting the height of the adjustment stages, the angle of the support disk can be directly adjusted to the position corresponding to the machining spindle, ensuring uniform wafer thickness during the wafer thinning process, ensuring good wafer quality and processing efficiency.
[0026] Secondly, during the adjustment process, the included angles α and β of the support plate axis relative to two planes in the spatial rectangular coordinate system are obtained. The adjustment height ΔX1 of adjustment table B relative to adjustment table A and the adjustment height ΔX2 of adjustment table C relative to adjustment table A can be calculated. Based on the calculated values, the operator can directly adjust the heights of adjustment table B and adjustment table C accordingly, so that the support plate can be tilted to the target tilt angle, making the axis of the support plate parallel to the axis of the machining spindle. The adjustment process is quantitative, and the support plate can be quickly adjusted to a position where its axis is parallel to the machining spindle based on the calculated adjustment values, and the height of the adjustment table can be precisely adjusted without repeated adjustments.
[0027] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description
[0028] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.
[0029] Figure 1 A top view of the adjustment fixture in an embodiment of this application is shown;
[0030] Figure 2 A front view is shown in an embodiment of this application, showing that the axis of the machining spindle of the tooling is parallel to the axis of the support plate;
[0031] Figure 3 This is a front view showing the first tilt state between the axis of the machining spindle and the axis of the support plate in the adjustment fixture according to an embodiment of this application;
[0032] Figure 4 This application illustrates the adjustment fixture's support plate compared to... Figure 3 The adjusted main view;
[0033] Figure 5 This application shows a front view illustrating a second tilt state between the axis of the machining spindle and the axis of the support plate in an embodiment of the adjustment fixture.
[0034] Figure 6 This application illustrates the adjustment fixture's support plate compared to... Figure 5 The adjusted main view;
[0035] Figure 7 This illustration shows a first type of relationship between the axis of the machining spindle and the constructed rectangular coordinate system in an embodiment of this application;
[0036] Figure 8 This illustration shows a second relationship between the axis of the machining spindle in the tooling and the constructed rectangular coordinate system in an embodiment of this application.
[0037] Explanation of reference numerals in the attached figures:
[0038] 1. Support plate; 2. Adjustment table; 3. Machining spindle. Detailed Implementation
[0039] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore their detailed descriptions will be omitted. Furthermore, the drawings are merely illustrative of this application and are not necessarily drawn to scale.
[0040] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another, these terms are used only for convenience, such as according to the orientation of the examples in the accompanying drawings. It is understood that if the device of the icon is flipped so that it is upside down, the component described as "upper" will become the component described as "lower." When a structure is "upper" of another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is "directly" mounted on the other structure, or that the structure is "indirectly" mounted on the other structure through another structure.
[0041] The terms “a,” “one,” “the,” and “at least one” are used to indicate the existence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first” and “second” are used only as markers and are not a limitation on the number of objects.
[0042] Example 1
[0043] This embodiment provides a specific implementation of a method for adjusting the tilt angle of the support plate. Adjustment is performed using an adjustment fixture, with the support plate 1 located below the machining spindle 3. Figure 1 and Figure 2 As shown, the adjustment fixture includes three adjustment platforms 2, which are vertically and vertically supported below the support plate 1. The three adjustment platforms 2 are arranged in an equilateral triangle with the center of the support plate 1 as the center. The tilt angle of the support plate 1 is adjusted by adjusting the lifting height of the adjustment platforms 2. The three adjustment platforms 2 are respectively denoted as adjustment platform A, adjustment platform B, and adjustment platform C. The method for adjusting the tilt angle of the support plate includes the following steps:
[0044] Obtain the angle α between the axis of the support disk 1 and the first plane and the second plane in the spatial rectangular coordinate system. The third plane in the spatial rectangular coordinate system is parallel to or coincides with the plane containing the bottom surface of the support disk 1. The third plane formed by the two coordinate axes in the spatial rectangular coordinate system is parallel to or coincides with the plane containing the support points of the three adjustment platforms supporting the support disk 1. Obtain the angle α between the axis of the support disk 1 and the first plane and the second plane in the spatial rectangular coordinate system. Calculate the adjustment height ΔX1 of adjustment platform B relative to adjustment platform A and the adjustment height ΔX2 of adjustment platform C relative to adjustment platform A based on the angles α and β. In this preferred embodiment, the height of adjustment platform A remains unchanged, while the adjustment heights ΔX1 of adjustment platform B and ΔX2 of adjustment platform C are adjusted respectively. Adjust the heights of adjustment platforms B and C according to the adjustment heights ΔX1 and ΔX2 to adjust the tilt angle of the support disk, so that the axis of the support disk is parallel to the axis of the machining spindle, that is, the axis of the machining spindle 3 is perpendicular to the support surface of the support disk 1. After calculating the adjustment height ΔX1 of adjustment stage B and the adjustment height ΔX2 of adjustment stage C, the operator can directly adjust the height of adjustment stage B and adjustment stage C according to the calculated values. This will allow the support plate 1 to tilt so that it is perpendicular to the axis of the processing spindle 3, and the axis of the support plate 1 is parallel to the axis of the processing spindle 3, thus ensuring the quality and efficiency of the wafer during the processing.
[0045] In some other embodiments, the height of adjustment platform A can also be adjusted, where adjustment height ΔX1 is the adjustment height of adjustment platform B relative to adjustment platform A, and adjustment height ΔX2 is the adjustment height of adjustment platform C relative to adjustment platform A. Furthermore, in some other embodiments, the heights of adjustment platform B or adjustment platform C can remain unchanged, while the heights of the other two can be adjusted; this is not limited.
[0046] Furthermore, adjustment platforms A, B, and C are all of the same frustum structure, and the support point of the support plate 1 for adjustment platform 2 is the center point of the top surface of the frustum structure.
[0047] In this embodiment, since the support plate 1 is to be used in conjunction with the machining spindle 3, taking the support plate 1 as being horizontal before adjustment and the machining spindle 3 being tilted relative to the horizontal plane as an example, to obtain the tilt angle of the machining spindle 3 relative to the horizontal plane, the support plate 1 needs to be adjusted so that its axis is parallel to the axis of the machining spindle 3, that is, the support plate 1 is adjusted to the same tilt angle as the machining spindle 3. The tilt angle of the machining spindle 3 relative to the horizontal plane is the target tilt angle of the support plate 1.
[0048] In this embodiment, after obtaining the target tilt angle that the machining spindle 3 needs to be adjusted, the value that the adjustment table 2 needs to be adjusted can be obtained quantitatively. That is, by simply adjusting according to this value, the desired target tilt angle can be obtained, thus avoiding the problem that the tilt angle needs to be adjusted repeatedly and the final result is not accurate enough.
[0049] Furthermore, in the process of constructing the spatial rectangular coordinate system, it is preferable to take the support point A of the adjustment platform A as the origin of the spatial rectangular coordinate system, such as... Figure 7 and Figure 8 As shown, draw AD perpendicular to line BC, intersecting BC at point D. Draw DE perpendicular to both AD and BC. Plane ADE is formed by points A, D, and E, and plane BCE is formed by points B, C, and E. Figure 8 As shown, line DE is perpendicular to plane ABC. Angle α is the angle between the projection of the axis of machining spindle 3 onto plane BCE and line BC, and angle β is the angle between the projection of the axis of machining spindle 3 onto plane ADE and line AD. These angles can be obtained by taking pictures with a vision camera.
[0050] Furthermore, in calculating the heights ΔX1 and ΔX2, the connecting line AD is considered the X-axis, the ray drawn from point A parallel to the connecting line BC is considered the Y-axis, and the ray drawn from point A parallel to the connecting line DE is considered the Z-axis. At this point, the plane formed by surface ABC and the X-axis and Y-axis coincides. The axis of machining spindle 3 is represented by the vector (X, Y, Z). After machining spindle 3 rotates around the connecting line BC by an angle α, the vector (X, Y, Z) changes to the vector (X1, Y1, Z1).
[0051]
[0052] Subsequently, after the machining spindle 3 (X1, Y1, Z1) is rotated by an angle β around the connecting line AD, the machining spindle 3 (X1, Y1, Z1) changes into a vector (X2, Y2, Z2).
[0053]
[0054] Based on the above relationships, the adjustment height ΔX1 of adjustment platform B and the adjustment height ΔX2 of adjustment platform C are calculated according to the following formulas:
[0055]
[0056] The adjustment heights ΔX1 and ΔX2 of adjustment table B and adjustment table C are calculated. Then, the heights of adjustment table B and adjustment table C are adjusted so that the tilt angle of support plate 1 is perpendicular to the axis of machining spindle 3. Given the tilt angle of support plate 1 relative to machining spindle 3, the adjustment heights ΔX1 and ΔX2 of adjustment table B and adjustment table C are obtained according to the required adjustment angle value. Then, support plate 1 can be tilted to the target tilt angle directly.
[0057] Furthermore, in some other embodiments, when constructing the spatial rectangular coordinate system, it can also be constructed at point B or point C, and the heights of the other two adjustment platforms can be adjusted accordingly. This embodiment does not limit this, as long as one of the points is used as the origin to construct the spatial rectangular coordinate system, the heights of the other two adjustment platforms can be adjusted.
[0058] In this embodiment, the tilt angle of the support plate 1 relative to the machining spindle 3 can be obtained through calculation, external equipment assistance, or other methods. The spatial rectangular coordinate system can also be established with the assistance of external equipment such as a central control computer.
[0059] In this embodiment, the support points of the three adjustment platforms 2 are preferably evenly distributed along the circumference of the support plate 1. This makes the change in the tilt angle of the support plate 1 smoother when adjusting the height of the adjustment platforms 2. If it is necessary to adjust the support plate 1 to a certain tilt angle, the closer to the outer edge, the higher the lifting height of the adjustment platform 2, making it easier to control and allowing for precise adjustment. In other embodiments, the three adjustment platforms 2 only need to be arranged in a circle around the center of the support plate 1, forming an equilateral triangle. The position of the adjustment platforms 2 can be adjusted radially below the support plate 1, preferably with the center of the adjustment platform 2 located at the circumferential axis of the support plate 1.
[0060] like Figure 2 As shown, this is the state when the axis of the machining spindle 3 is aligned with the axis of the support plate 1, and as shown in the figure. Figure 3 and Figure 5 As shown, the axis of the machining spindle 3 is tilted at a certain angle relative to the axis of the support plate 1. Based on the tilt angle of the machining spindle 3, the adjustment height ΔX1 of the adjustment table B and the adjustment height ΔX2 of the adjustment table C can be adjusted, as follows: Figure 4 and Figure 6 As shown, the tilt angle of the support disk 1 is adjusted so that the support disk 1 tilts to the target tilt angle, so that the processing spindle 3 can drive the grinding disk and other components to grind the wafer on the support disk 1.
[0061] In this embodiment, the adjustment platform is operated by a high-precision actuator, such as a piezoelectric ceramic driver, servo motor, or ball screw drive. In addition, each adjustment platform can also integrate a grating ruler or an electrical sensor to provide real-time height feedback and correct errors.
[0062] Working principle:
[0063] After obtaining the target tilt angle of the machining spindle 3, the adjustment height ΔX1 of the adjustment table B and the adjustment height ΔX2 of the adjustment table C are calculated based on the target tilt angle. Then, the heights of the adjustment table B and the adjustment table C are adjusted according to the calculated values so that the tilt angle of the support plate 1 can be directly adjusted to the preset tilt angle, making the axis of the support plate 1 parallel to the axis of the machining spindle 3. The adjustment process is simple and convenient, and can form a quantitative adjustment with high precision.
[0064] Example 2
[0065] This embodiment provides a specific implementation of a method for determining the tilt angle of a support plate. Adjustment is performed using an adjustment fixture. The support plate 1 is located below the machining spindle 3. The adjustment fixture includes three adjustment platforms 2, which are vertically and vertically supported below the support plate 1. The three adjustment platforms are arranged in an equilateral triangle with the center of the support plate 1 as the center. By adjusting the height of the adjustment platforms 2, the tilt angle of the support plate 1 relative to the machining spindle 3 is adjusted. The three adjustment platforms 2 are respectively denoted as adjustment platform A, adjustment platform B, and adjustment platform C. The method for adjusting the tilt angle of the support plate 1 includes the following steps:
[0066] Obtain the adjustment height ΔX1 of adjustment platform B relative to adjustment platform A and the adjustment height ΔX2 of adjustment platform C relative to adjustment platform A;
[0067] The angle α between the axis of the support disk and the first plane and the second plane in the spatial rectangular coordinate system are calculated based on the adjustment height ΔX1 and the adjustment height ΔX2. The third plane of the spatial rectangular coordinate system is parallel or coincident with the plane where the bottom surface of the support disk 1 is located. The first plane, the second plane and the third plane are perpendicular to each other.
[0068] Furthermore, the third plane formed by the two coordinate axes in the spatial rectangular coordinate system is parallel to or coincides with the plane on which the bottom surface of the support plate 1 is located, which is supported by the three adjustment platforms 2.
[0069] In this embodiment, in the steps of obtaining the adjustment height ΔX1 of adjustment platform B relative to adjustment platform A and the adjustment height ΔX2 of adjustment platform C relative to adjustment platform A, the tilt angle of the axis of support plate 1 relative to the axis of machining spindle 3 is calculated based on the adjustment height ΔX1 and adjustment height ΔX2. The tilt angle of support plate 1 relative to machining spindle 3 is obtained by adjusting the adjustment value of adjustment platform 2, so that the adjustment value of adjustment platform 2 and the tilt angle of support plate 1 form a quantitative correspondence. The effect value obtained by adjustment can be clearly understood during the adjustment process, making the adjustment result more intuitive.
[0070] Furthermore, in the steps of obtaining the adjustment height ΔX1 of adjustment platform B relative to adjustment platform A and the adjustment height ΔX2 of adjustment platform C relative to adjustment platform A, the height can be obtained by laser ranging. For example, three reflection points are arranged on the support plate 1, and the height difference is monitored in real time by a laser rangefinder to ensure the accuracy of the obtained adjustment platform height.
[0071] In this embodiment, the height values of adjustment platforms A, B, and C are obtained, and the height of adjustment platform A remains unchanged. Only the adjustment heights ΔX1 and ΔX2 of adjustment platforms B and C relative to adjustment platform A are needed. Based on the adjustment heights ΔX1 and ΔX2, the tilt angle of the support plate 1 relative to the machining spindle 3 can be calculated, so that the adjustment heights ΔX1 and ΔX2 form a quantitative relationship with the tilt angle of the support plate 1 relative to the machining spindle 3. The tilt angle value of the support plate 1 relative to the machining spindle 3 can be determined by adjusting heights ΔX1 and ΔX2.
[0072] In this embodiment, the centers of the three adjustment platforms 2 are evenly distributed along the circumference of the support plate 1.
[0073] Furthermore, in the process of constructing the spatial rectangular coordinate system, it is preferable to use the support point of the adjustment platform A as the origin of the spatial rectangular coordinate system, such as... Figure 7 and Figure 8 As shown, the support point of the adjustment platform A is point A. Draw AD perpendicular to line BC, intersecting BC at point D. Draw line DE perpendicular to both lines AD and BC. Surface ADE is formed by points A, D, and E, and surface BCE is formed by points B, C, and E. Figure 8 As shown, line DE is perpendicular to plane ABC. Angle α is the angle between the projection of the axis of machining spindle 3 onto plane BCE and line BC, and angle β is the angle between the projection of the axis of machining spindle 3 onto plane ADE and line AD. These angles can be obtained by taking pictures with a vision camera.
[0074] Furthermore, the three adjustment platforms 2 are identical frustum structures, and the support point of the support plate 1 for the adjustment platform 2 is the center point of the top surface of the frustum structure.
[0075] Based on the above positional relationships, the included angles α and β are calculated using the following formulas:
[0076]
[0077] Where R is the radius of the circle formed by points A, B, and C. By calculating the values of the included angles α and β, the tilt angle of the support plate 1 relative to the machining spindle 3 can be determined, so as to determine whether the support surface of the machining spindle 3 and the support plate 1 are perpendicular.
[0078] Other embodiments of this application will readily conceive of by those skilled in the art upon consideration of the specification and practice of the embodiments thereof. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not claimed in this application. The specification and embodiments are to be considered exemplary only, and the true scope and spirit of this application are indicated by the appended claims.
Claims
1. A method for adjusting the tilt angle of a support plate, characterized in that, Adjustment is performed using an adjustment fixture. The support plate is located below the machining spindle. The adjustment fixture includes three adjustment platforms A, B, and C. The three adjustment platforms A, B, and C are vertically and vertically supported below the support plate and are arranged in an equilateral triangle with the center of the support plate as the center. The method for adjusting the tilt angle of the support plate includes the following steps: Obtain the angle α between the axis of the support disk and the first plane and the second plane in the spatial rectangular coordinate system. The third plane of the spatial rectangular coordinate system is parallel or coincident with the plane where the bottom surface of the support disk is located. The first plane, the second plane and the third plane are perpendicular to each other. Calculate the adjustment height ΔX1 of adjustment platform B relative to adjustment platform A and the adjustment height ΔX2 of adjustment platform C relative to adjustment platform A based on the included angle α and the included angle β. Adjust the heights of the adjustment table B and the adjustment table C according to the adjustment height ΔX1 and the adjustment height ΔX2, so that the axis of the support plate is parallel to the axis of the machining spindle.
2. The method for adjusting the tilt angle of the support plate according to claim 1, characterized in that, Using the support point of the adjustment platform A as the origin of the spatial rectangular coordinate system, the adjustment height ΔX1 and the adjustment height ΔX2 are calculated as follows: Wherein, R is the radius of the circle formed by the support points of the three adjustment platforms A, B, and C.
3. The method for adjusting the tilt angle of the support plate according to claim 1 or 2, characterized in that, The support points of the three adjustment platforms A, B, and C are arranged at the circumference of the support plate.
4. The method for adjusting the tilt angle of the support plate according to claim 3, characterized in that, The three adjustment platforms A, B, and C are identical frustum structures, and the support point is the center point of the top surface of the frustum structure.
5. A method for determining the tilt angle of a support plate, characterized in that, Adjustment is performed using an adjustment fixture. The support plate is located below the machining spindle. The adjustment fixture includes three adjustment platforms A, B, and C. The three adjustment platforms A, B, and C are vertically and vertically supported below the support plate and are arranged in an equilateral triangle with the center of the support plate as the center. The method for determining the tilt angle of the support plate includes the following steps: Obtain the height value ΔX1 of adjustment platform B relative to adjustment platform A and the height value ΔX2 of adjustment platform C relative to adjustment platform A; The angle α between the axis of the support disk and the first plane and the second plane in the spatial rectangular coordinate system are calculated based on the adjustment height ΔX1 and the adjustment height ΔX2. The third plane of the spatial rectangular coordinate system is parallel or coincident with the plane where the bottom surface of the support disk is located. The first plane, the second plane and the third plane are perpendicular to each other.
6. The method for determining the tilt angle of the support disk according to claim 5, characterized in that, Using the support point of the adjustment platform A as the origin of the spatial rectangular coordinate system, the included angles α and β are calculated as follows: Where R is the radius of the circle formed by the support points of the three adjustment platforms.
7. The method for determining the tilt angle of the support plate according to claim 5 or 6, characterized in that, The centers of the three adjustment platforms are located at the circumference of the support plate.
8. The method for adjusting the tilt angle of the support plate according to claim 7, characterized in that, The three adjustment platforms A, B, and C are identical frustum structures, and the support point is the center point of the top surface of the frustum structure.