Production equipment and production process for precise miniature MBL bridge rectifier with double ends synchronously machined

Abstract

The invention relates to the related technical field of four-chip bridge rectifier processing, in particular to double-end synchronous processing precision miniature MBL bridge rectifier production equipment and a production process, and the equipment comprises a chip combining mechanism, and a material placing table, a solder paste printing mechanism and a die bonding mechanism which are symmetrically arranged along the chip combining mechanism and are sequentially arranged towards the direction of the chip combining mechanism; the die bonding mechanism comprises a support frame body; two symmetrical connecting parts are formed on the connecting arm and used for connecting the swing arm, and two die bonding suction nozzles are installed at the end, away from the connecting arm, of the swing arm; the buffering shaft is connected with the connecting arm, and a buffering piece which elastically buffers in the circumferential direction is arranged between the buffering shaft and the telescopic shaft connected with the driving source; the lifting driving unit is arranged on the supporting frame body and is used for driving the buffer shaft to move axially so as to drive the die bonding suction nozzle to move downwards and reset; the buffer shaft can effectively slow down the initial rotation speed under the action of the buffer piece, so that the problem that crystal grains on the die bonding suction nozzle deviate or fall off due to the dual action of inertia force and centrifugal force is solved.

Description

Technical Field

[0001] This invention relates to the technical field of four-chip bridge rectifier processing, specifically to precision micro MBL bridge rectifier production equipment and process for dual-end synchronous processing. Background Technology

[0002] In the field of power semiconductor device manufacturing, the four-chip bridge rectifier is a key rectifier device, and its manufacturing process directly affects the performance of equipment in power management, industrial control, and new energy fields. Traditional manufacturing processes employ a single-chip die-bonding model, assembling the half-bridge structure through chip-by-chip mounting, wire bonding, and other processes, followed by mold-fitting to complete device manufacturing. This process has significant technical limitations: firstly, the serial production method leads to low production efficiency; secondly, the accumulated accuracy errors from multiple positioning processes affect product consistency; and thirdly, the step-by-step mold-fitting process increases the difficulty of packaging alignment, restricting the improvement of product yield. Existing technology adopts a symmetrical frame mold-fitting scheme, integrating two chips on each of two independent frames to form a half-bridge structure, followed by planar mating packaging.

[0003] When processing a half-bridge structure, frame stamping, solder paste printing, and die bonding are required. Existing die bonding structures generally use a rotary die bonding mechanism. Traditional die bonding arms need to swing horizontally 180° and rise and fall. The swing angle is large, and the arm length increases with the wafer size, resulting in a significant increase in inertia. Furthermore, at the moment the die bonding arm rotates and stops, under the action of centrifugal force and inertial force, the nozzle's adsorption of the die is unstable, which can easily lead to die displacement or falling off. Summary of the Invention

[0004] The purpose of this invention is to provide precision micro MBL bridge rectifier manufacturing equipment and manufacturing process with simultaneous processing at both ends, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a precision micro MBL bridge rectifier production equipment with dual-end synchronous processing, comprising a lamination mechanism and a feeding table, a solder paste printing mechanism, and a die bonding mechanism arranged symmetrically along the lamination mechanism and sequentially facing the lamination mechanism; the die bonding mechanism comprises: a support frame; a connecting arm having two symmetrical connecting parts for connecting a swing arm, wherein two die bonding nozzles are installed at the end of the swing arm away from the connecting arm; a buffer shaft connecting the connecting arm, wherein a buffer element with circumferential elastic buffering is provided between the buffer shaft and the telescopic shaft connecting the drive source; and a lifting drive unit mounted on the support frame for driving the buffer shaft to move axially, thereby driving the die bonding nozzles to move downward and reset.

[0006] The precision micro MBL bridge rectifier production equipment with dual-end synchronous processing as described above: the telescopic shaft includes: a connecting sleeve, the drive shaft connected to the drive source is inserted into the connecting sleeve and can slide axially relative to the connecting sleeve.

[0007] The precision micro MBL bridge rectifier production equipment with dual-end synchronous processing as described above: the buffer component includes: an embedded post fixed on the buffer shaft and two extension plates formed on the embedded post, the embedded post being inserted into the connecting sleeve, and the extension plates penetrating the arc-shaped through groove formed on the connecting sleeve; it also includes two arc-shaped elastic members fixed on the outside of the connecting sleeve and arranged symmetrically, the movable end of the arc-shaped elastic members abutting against the extension plates.

[0008] The precision micro MBL bridge rectifier production equipment with dual-end synchronous processing as described above: the lifting drive unit includes: a receiving frame rotatably connected to the buffer shaft, the receiving frame sliding vertically on the support frame; a second motor installed on the support frame, the output shaft of the second motor being fixed with an eccentric rod, a connecting rod being rotatably installed at the eccentric position of the eccentric rod, and the end of the connecting rod away from the eccentric rod being rotatably connected to the receiving frame.

[0009] The precision micro MBL bridge rectifier production equipment with dual-end synchronous processing as described above also includes a correction unit, which is adapted to the buffer shaft and is used to automatically correct the buffer shaft when the die bonding nozzle moves down, so that the die bonding nozzle is facing the die bonding or die suction position.

[0010] The precision micro MBL bridge rectifier production equipment with dual-end synchronous processing as described above: The correction unit includes: symmetrically arranged arc-shaped cylinders, two of which are fixed to a support frame after being joined, and a cylindrical groove for accommodating the telescopic shaft and the buffer shaft is formed between the two arc-shaped cylinders; a correction guide groove is formed on the inner wall of the arc-shaped cylinder, and a sliding column fixed on the buffer shaft is placed in the correction guide groove to adaptively adjust the downward position of the buffer shaft when it moves downward; the correction guide groove includes: an arc-shaped horizontal groove formed on the inner wall of the arc-shaped cylinder, which forms an annular groove when the two arc-shaped cylinders are joined; and a vertical guide groove formed on the inner wall of the arc-shaped cylinder and located at the middle position of the arc-shaped horizontal groove, the connection between the vertical guide groove and the arc-shaped horizontal groove forming an arc-shaped guide part.

[0011] The precision micro MBL bridge rectifier production equipment with dual-end synchronous processing as described above includes the following: the solder paste printing mechanism comprises: a lifting plate, driven by a lifting drive mounted on a frame to move the lifting plate along the Y direction; a transverse mounting plate, connected to the movable end of an electric telescopic rod mounted on the lifting plate, the electric telescopic rod driving the transverse mounting plate to move along the Z direction, the transverse mounting plate being mounted with a printing plate; and a sliding mounting plate, slidably mounted on the transverse mounting plate and driven by a horizontal drive mounted on the transverse mounting plate to move along the X direction, the sliding mounting plate being mounted with a scraper unit that abuts against the printing plate.

[0012] The precision micro MBL bridge rectifier production equipment with dual-end synchronous processing as described above: the ink scraping unit includes: a receiving frame plate fixed on the sliding mounting plate, and an ink scraper and a return ink blade are provided on the side of the receiving frame plate facing the printing plate. The ink scraper and the return ink blade are respectively driven to rise and fall by a control cylinder mounted on the receiving frame plate.

[0013] The precision micro MBL bridge rectifier production equipment with dual-end synchronous processing as described above: the parts processed on the feeding table, solder paste printing mechanism, die bonding mechanism and wafer assembly mechanism are transferred by negative pressure grippers. The negative pressure grippers include: multiple negative pressure suction cups, which are driven by two-dimensional drive components.

[0014] The manufacturing process for precision miniature MBL bridge rectifiers with simultaneous machining at both ends, using the aforementioned precision miniature MBL bridge rectifier manufacturing equipment with simultaneous machining at both ends, includes the following steps: S1. A stamping mechanism is used to stamp out the frame structure, and the frame structures are stacked on the feeding platform in sequence. S2. The frame is transported to the solder paste printing mechanism by a negative pressure gripper for solder paste printing. Then, CCD image inspection is performed. The qualified frame is placed on the die bonding station for die bonding. Then, CCD image inspection is performed on the die bonding position. S3. Repeat steps S1 and S2 at another symmetrical station to complete the die bonding process of the second frame. S4. The two qualified frames are placed in the mold closing station for piece assembly and mold closing. S5. Subsequently, the chip positions after molding are sintered and encapsulated to form a four-chip bridge rectifier finished product.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: by setting a buffer shaft, the drive source drives the telescopic shaft to rotate. Due to the effect of inertia, the buffer shaft can effectively slow down the initial rotation speed under the action of the buffer component, thereby reducing the problem of grain displacement or falling off on the die bonding nozzle due to the combined action of inertial force and centrifugal force. At the same time, during the process of the telescopic shaft from the rotating state to the stop, the stopping speed of the buffer shaft can be effectively slowed down, further reducing the problem of grain displacement or falling off on the die bonding nozzle due to inertia.

[0016] The alignment unit ensures precise positioning of the die-bonding nozzle during its downward movement. By adapting to the buffer shaft, the alignment unit can fine-tune the buffer shaft as the die-bonding nozzle moves downward, ensuring that it always maintains the correct orientation. This guarantees that the die-bonding nozzle can accurately align with the die-bonding or pick-up position, which not only improves the accuracy of die bonding but also effectively avoids problems such as grain damage or poor die bonding caused by positional deviations, thereby further enhancing the stability and reliability of the entire die-bonding process. Attached Figure Description

[0017] Figure 1 Flowchart of the manufacturing process for a precision miniature MBL bridge rectifier with synchronous processing at both ends; Figure 2 A schematic diagram of the die bonding mechanism in a precision miniature MBL bridge rectifier production equipment for simultaneous processing at both ends; Figure 3 for Figure 2 Enlarged view of the structure at point A in the middle; Figure 4 Side view of a precision miniature MBL bridge rectifier manufacturing equipment that performs synchronous processing at both ends; Figure 5 A schematic diagram of the die bonding mechanism after removing the swing arm in a production equipment for precision micro MBL bridge rectifiers with dual-end synchronous processing. Figure 6 A schematic diagram of the state of the arc-shaped cylinder after separation in a precision micro MBL bridge rectifier production equipment for synchronous processing at both ends; Figure 7 A schematic diagram of the structure after the separation of the telescopic shaft and the buffer shaft in the production equipment for precision miniature MBL bridge rectifiers that are processed synchronously at both ends; Figure 8 A front view of the arc-shaped cylinder in a precision miniature MBL bridge rectifier production equipment for simultaneous processing at both ends; Figure 9 A schematic diagram of the negative pressure gripper in a precision miniature MBL bridge rectifier production equipment for simultaneous processing at both ends; Figure 10 A schematic diagram of the solder paste printing mechanism in a precision miniature MBL bridge rectifier production equipment for dual-end synchronous processing; Figure 11 This is a schematic diagram of the solder paste printing mechanism in a precision micro MBL bridge rectifier production equipment for simultaneous processing at both ends, taken from another angle.

[0018] In the diagram: 1-Mounting bracket, 2-First motor, 3-Second motor, 4-Upright plate, 5-Swing arm, 6-Die bonding nozzle, 7-Connecting arm, 8-Connecting bracket, 801-Through hole, 9-Guide post, 10-Fixing component, 11-Spring, 12-Arc-shaped cylinder, 1201-Correcting guide groove, 12011-Arc-shaped horizontal groove, 12012-Vertical guide groove, 12013-Arc-shaped guide part, 13-Eccentric rod, 14-Connecting rod, 15-Slide rail, 16-Slider, 17-Support bracket, 18-Drive shaft, 1801-Strip-shaped limit slider, 19-Connecting sleeve, 1901-Strip-shaped limit 1902-Arc-shaped through groove, 20-Buffer shaft, 2001-Embedded column, 2002-Extension plate, 2003-Sliding column, 21-Arc-shaped elastic element, 22-Horizontal movement driver, 23-Supporting plate, 24-Vertical lifting element, 25-Mounting plate, 26-Negative pressure suction cup, 27-Discharging platform, 28-Upright frame, 29-Lifting plate, 30-Lifting drive element, 31-Electric telescopic rod, 32-Horizontal movement mounting plate, 33-Sliding mounting plate, 34-Horizontal drive element, 35-Supporting frame plate, 36-Control cylinder, 37-Scraper blade, 38-Return ink blade, 39-Printing plate. Detailed Implementation

[0019] Various exemplary embodiments, features, and aspects of this application will now be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of the embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.

[0020] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0021] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented even without certain specific details. In some instances, methods, means, and elements well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.

[0022] Please see Figures 2-11In this embodiment of the invention, the precision micro MBL bridge rectifier production equipment with dual-end synchronous processing includes a wafer assembly mechanism and a feeding platform 27, a solder paste printing mechanism, and a die bonding mechanism arranged symmetrically along the wafer assembly mechanism and sequentially facing the wafer assembly mechanism. This enables the integration of two chips on each of the two independent frames to form a half-bridge structure. Then, wafer assembly and packaging are performed on the wafer assembly mechanism to form a four-chip bridge stack, thereby improving processing efficiency.

[0023] In one embodiment, the die bonding mechanism includes: a support frame, the support frame including a horizontally placed mounting bracket 1 and a vertically placed upright plate 4 fixed on the mounting bracket 1; a connecting arm 7 having two symmetrical connecting parts for connecting a swing arm 5, the swing arm 5 having two die bonding nozzles 6 installed at the end away from the connecting arm 7, the two die bonding nozzles 6 being able to simultaneously grip and bond two dies to improve work efficiency; a buffer shaft 20 connecting the connecting arm 7, the buffer shaft 20 having a circumferentially elastic buffer between it and the telescopic shaft connecting the drive source (first motor 2); a lifting drive unit, installed on the support frame, for driving the buffer shaft 20 to move axially, thereby driving the die bonding nozzles 6 to move downward and reset; and a alignment unit, adapted to the buffer shaft 20, for automatically aligning the buffer shaft 20 when the die bonding nozzles 6 move downward, so that the die bonding nozzles 6 are aligned with the die bonding or pick-up position.

[0024] In the initial state, the two swing arms 5 face the die supply position and the die bonding position respectively. The lifting drive unit enables the two swing arms 5 to move down synchronously, thereby driving the die bonding nozzle 6 to perform die suction and die bonding operations. Subsequently, the lifting drive unit drives the two swing arms 5 to move in opposite directions, causing the die bonding nozzle 6 to disengage from the die suction position and the die bonding position. The drive source is activated to realize the swapping of the two swing arms 5. This alternating action can achieve synchronous die suction and die bonding, improving die bonding efficiency.

[0025] After the die-bonding nozzle 6 adsorbs the die and moves upward under the action of the lifting drive unit, the drive source drives the telescopic shaft to rotate. Due to the effect of inertia, the buffer shaft 20 can effectively slow down the initial rotation speed under the action of the buffer, thereby reducing the problem of die displacement or falling off the die on the die-bonding nozzle 6 due to the combined action of inertial force and centrifugal force. At the same time, during the process of the telescopic shaft from the rotating state to the stop, the stopping speed of the buffer shaft 20 can be effectively slowed down, further reducing the problem of die displacement or falling off the die on the die-bonding nozzle 6 due to inertia.

[0026] The alignment unit ensures the precise positioning of the die-bonding nozzle 6 during its downward movement. By adapting to the buffer shaft 20, the alignment unit can fine-tune the buffer shaft 20 as the die-bonding nozzle 6 moves downward, ensuring that it always maintains the correct orientation. This guarantees that the die-bonding nozzle 6 can accurately align with the die-bonding or pick-up position, which not only improves the accuracy of die bonding but also effectively avoids problems such as die damage or poor die bonding caused by positional deviations, thereby further enhancing the stability and reliability of the entire die-bonding process.

[0027] Please refer to [link / reference needed] for further information. Figure 2 and Figure 3 A connecting frame 8 is fixed to one end of the swing arm 5 facing the connecting arm 7. Multiple through holes 801 are formed on the connecting frame 8. Multiple guide posts 9 penetrating the through holes 801 are fixed to the connecting arm 7. At least one guide post 9 is equipped with a fixing member 10. A spring 11 is sleeved on the guide post 9 located between the fixing member 10 and the connecting frame 8. The two ends of the spring 11 abut against the fixing member 10 and the connecting frame 8, respectively. This allows the connecting frame 8 to elastically displace relative to the connecting arm 7 to a certain extent when the die-bonding nozzle 6 is performing die bonding or crystal suction. When the die-bonding nozzle 6 encounters external forces during die bonding or crystal suction operations, such as uneven forces during crystal adsorption or slight deviations in the die bonding position, the connecting frame 8 can absorb these external forces through the elastic deformation of the spring 11, thereby maintaining the stability of the die-bonding nozzle 6. This effectively enhances the adaptability of the die-bonding nozzle 6 during operation and also effectively reduces die bonding errors caused by external impacts, further improving the accuracy and reliability of the die bonding operation.

[0028] Specifically, please refer to Figure 6 and Figure 7 The telescopic shaft includes a connecting sleeve 19. A drive shaft 18 connected to the drive source is inserted into the connecting sleeve 19 and can slide axially relative to the connecting sleeve 19. In one exemplary embodiment, at least one strip-shaped limiting slider 1801 is formed on the outer wall of the drive shaft 18, and a strip-shaped limiting groove 1901 is formed on the connecting sleeve 19 to slide with the strip-shaped limiting slider 1801, so that the connecting sleeve 19 can only move axially along the drive shaft 18.

[0029] Please see Figure 6 and Figure 7The buffer component includes an embedded post 2001 fixed on the buffer shaft 20 and two extension plates 2002 formed on the embedded post 2001. The embedded post 2001 is inserted into the connecting sleeve 19, and the extension plates 2002 penetrate the arc-shaped through groove 1902 formed on the connecting sleeve 19. It also includes two arc-shaped elastic members 21 fixed on the outside of the connecting sleeve 19 and arranged symmetrically. The movable end of the arc-shaped elastic member abuts against the extension plate 2002.

[0030] By setting the extension plate 2002 and the arc-shaped through groove 1902, the buffer shaft 20 can rotate at a certain angle relative to the connecting sleeve 19. At the same time, when the connecting sleeve 19 rotates, it can cooperate with the arc-shaped elastic element 21 to drive the buffer shaft 20 to rotate.

[0031] In this embodiment, when the buffer shaft 20 and the connecting sleeve 19 are not subjected to external force, the extension plate 2002 is located at the middle position of the arc-shaped through groove 1902, and the two sides of the extension plate 2002 are respectively in contact with the two ends of the two arc-shaped elastic elements 21. When the connecting sleeve 19 rotates instantaneously under the action of the drive shaft 18, the buffer shaft 20 and the whole installed on the buffer shaft 20 will squeeze the arc-shaped elastic elements 21 due to inertia, so that the buffer shaft 20 has a certain degree of hysteresis buffering effect, thereby reducing the instantaneous rotation acceleration of the buffer shaft 20, so as to reduce the problem of grain displacement or falling off on the die-bonding nozzle 6 due to the dual action of inertial force and centrifugal force.

[0032] The arc-shaped elastic element 21 also enables the buffer shaft 20 and the entire assembly mounted on the buffer shaft 20 to reset after rotation by the rebound force of the arc-shaped elastic element 21, thus ensuring the stability and accuracy of the die bonding nozzle 6.

[0033] Please see Figure 4 and Figure 5 The lifting drive unit includes a support frame 17 rotatably connected to the buffer shaft 20, the support frame 17 sliding vertically on the support frame; a second motor 3 mounted on the support frame, the output shaft of the second motor 3 being fixed with an eccentric rod 13, a connecting rod 14 rotatably mounted at the eccentric position of the eccentric rod 13, and the end of the connecting rod 14 away from the eccentric rod 13 being rotatably connected to the support frame 17.

[0034] The second motor 3 is fixed on the upright plate 4, and the receiving frame 17 is fixed with a slider 16. The upright plate 4 is equipped with a slide rail 15 that slides with the slider 16. When the second motor 3 works, it drives the eccentric rod 13 to rotate. When the eccentric rod 13 rotates, it drives the receiving frame 17 to move in the vertical direction through the action of the connecting rod 14, thereby realizing the displacement change of the die-bonding nozzle 6 in the vertical direction.

[0035] Please see Figures 4-8 The correction unit includes symmetrically arranged arc-shaped cylinders 12. The two arc-shaped cylinders 12 are connected and fixed to the support frame. A cylindrical groove for accommodating the telescopic shaft and the buffer shaft 20 is formed between the two arc-shaped cylinders 12. A correction guide groove 1201 is formed on the inner wall of the arc-shaped cylinder 12. A sliding column 2003 fixed on the buffer shaft 20 is placed in the correction guide groove 1201 to adaptively adjust the downward position of the buffer shaft 20 when it moves downward.

[0036] For example, in one embodiment, the corrective guide groove 1201 includes an arc-shaped horizontal groove 12011 formed on the inner wall of the arc-shaped cylinder 12. When the two arc-shaped cylinders 12 are joined together, the arc-shaped horizontal grooves 12011 on the two arc-shaped cylinders 12 form an annular groove. A vertical guide groove 12012 is formed on the inner wall of the arc-shaped cylinder 12 and is located at the middle position of the arc-shaped horizontal groove 12011. The connection between the vertical guide groove 12012 and the arc-shaped horizontal groove 12011 forms an arc-shaped guide portion 12013.

[0037] It should be noted that the vertical guide grooves 12012 on the two arc-shaped cylinders 12 are respectively oriented towards the crystal suction position and the crystal bonding position. That is to say, when the crystal bonding nozzle 6 is located above the crystal suction position and the crystal bonding position, the sliding column 2003 is located in the middle position of the arc-shaped horizontal groove 12011 (the sliding column 2003 is located directly above the vertical guide groove 12012).

[0038] During the rotation of the buffer shaft 20, due to the restriction of the receiving frame 17, the buffer shaft 20 will not change its position along its axial direction. Therefore, the sliding column 2003 can only rotate in the same plane. That is to say, the sliding column 2003 can only rotate in the annular groove. When the die bonding nozzle 6 is located above the die bonding position, the sliding column 2003 is located directly above the vertical guide groove 12012. At this time, the lifting drive drives the receiving frame 17 to move down, thereby driving the buffer shaft 20 to move down. The die bonding nozzle 6 moves down synchronously. Due to the directional sliding cooperation between the sliding column 2003 and the vertical guide groove 12012, the die bonding nozzle 6 will not deviate when moving down, ensuring the accuracy of the die bonding position.

[0039] Meanwhile, the arc-shaped guide part 12013 allows the sliding column 2003 to smoothly transition from the arc-shaped horizontal groove 12011 into the vertical guide groove 12012, avoiding the sliding column 2003 from being unable to move into the vertical guide groove 12012 due to the elastic force of the arc-shaped elastic element 21.

[0040] Please see Figures 10-11The solder paste printing mechanism includes a lifting plate 29, driven by a lifting drive 30 mounted on a stand 28, to move the lifting plate 29 along the Y direction; a transverse mounting plate 32, connected to the movable end of an electric telescopic rod 31 mounted on the lifting plate 29, the electric telescopic rod 31 being used to drive the transverse mounting plate 32 to move along the Z direction, the printing plate 39 being mounted on the transverse mounting plate 32; and a sliding mounting plate 33, slidably mounted on the transverse mounting plate 32, and driven by a horizontal drive 34 mounted on the transverse mounting plate 32 to move along the X direction, the sliding mounting plate 33 being mounted with a scraper unit, the scraper unit abutting against the printing plate 39.

[0041] In one exemplary embodiment, the ink-scraping unit includes: a receiving frame plate 35 fixed on the sliding mounting plate 33, wherein the receiving frame plate 35 is provided with an ink scraper 37 and an ink return blade 38 on the side facing the printing plate 39, and the ink scraper 37 and the ink return blade 38 are respectively driven to rise and fall by a control cylinder 36 mounted on the receiving frame plate 35.

[0042] In this embodiment, the lifting drive 30 (servo motor-screw or cylinder) drives the lifting plate 29 and the entire assembly mounted on the lifting plate 29 to adjust their position in the Y direction, so that the printing plate 39 (with printing holes corresponding to the printing positions of the frame) fits against the frame or is lifted off the frame. When the printing plate 39 fits against the frame, the control cylinder 36 drives the ink return blade 38 to lift, and the ink scraper 37 remains in contact with the printing plate 39. Then, the horizontal drive 34 drives the ink scraper 37 and the ink return blade 38 to move synchronously to achieve printing. Subsequently, the ink return blade 38 is lowered to fit against the printing plate 39, the ink scraper 37 is raised, and the horizontal drive 34 drives the ink scraper 37 and the ink return blade 38 to move in the opposite direction to achieve ink return processing, thereby completing one solder paste printing.

[0043] The electric telescopic rod 31 can realize the overall position change on the horizontal moving mounting plate 32 to meet the needs of multi-station solder paste printing or to realize the position fine adjustment of the printing board 39. The specific position can be determined according to the actual needs, and this embodiment does not make specific limitations.

[0044] The aforementioned horizontal drive component 34 can be a servo motor combined with a lead screw, or it can be a belt-type horizontal conveyor, etc. The specific choice can be made according to actual needs, and this embodiment does not impose any specific limitations.

[0045] Further, please refer to Figure 9The workpieces processed on the feeding platform 27, solder paste printing mechanism, die bonding mechanism and wafer assembly mechanism are transferred by a negative pressure gripper. The negative pressure gripper includes a plurality of negative pressure suction cups 26. The negative pressure suction cups 26 are driven by a two-dimensional drive. For example, in one embodiment, the two-dimensional drive includes a receiving plate 23 and a horizontal movement driver 22 (including but not limited to a servo motor-lead screw or cylinder) that drives the receiving plate 23 to move horizontally. It also includes a mounting plate 25. The mounting plate 25 is connected to the receiving plate 23 through a vertical lifting component 24 (including but not limited to a cylinder). At least one set of negative pressure suction cups 26 is mounted on the mounting plate 25.

[0046] As another embodiment of the present invention, please refer to Figure 1 Furthermore, a precision miniature MBL bridge rectifier manufacturing process with simultaneous processing at both ends is proposed. This process utilizes the aforementioned precision miniature MBL bridge rectifier manufacturing equipment with simultaneous processing at both ends, and includes the following steps: S1. A stamping mechanism is used to stamp out the frame structure, and the frame structures are stacked on the feeding table 27 in sequence. S2. The frame is transported to the solder paste printing mechanism by a negative pressure gripper for solder paste printing. Then, CCD image inspection is performed. The qualified frame is placed on the die bonding station for die bonding. Then, CCD image inspection is performed on the die bonding position. S3. Repeat steps S1 and S2 at another symmetrical station to complete the die bonding process of the second frame. S4. The two qualified frames are placed in the mold closing station for piece assembly and mold closing. S5. Subsequently, the chip positions after molding are sintered and encapsulated to form a four-chip bridge rectifier finished product.

[0047] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0048] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A precision miniature MBL bridge rectifier production equipment with dual-end synchronous processing, comprising a lamination mechanism and a feeding table, a solder paste printing mechanism, and a die bonding mechanism symmetrically arranged along the lamination mechanism and sequentially arranged towards the lamination mechanism; characterized in that, The die bonding mechanism includes: a support frame; a connecting arm with two symmetrical connecting parts for connecting a swing arm, wherein two die bonding nozzles are installed at the end of the swing arm away from the connecting arm; a buffer shaft connecting the connecting arm, wherein a buffer element with circumferential elastic buffering is provided between the buffer shaft and the telescopic shaft connecting the drive source; and a lifting drive unit installed on the support frame for driving the buffer shaft to move axially, thereby driving the die bonding nozzles to move downward and reset.

2. The precision miniature MBL bridge rectifier production equipment with dual-end synchronous processing according to claim 1, characterized in that, The telescopic shaft includes a connecting sleeve, wherein a drive shaft connected to the drive source is inserted into the connecting sleeve and is axially slidable relative to the connecting sleeve.

3. The precision miniature MBL bridge rectifier production equipment with dual-end synchronous processing according to claim 2, characterized in that, The buffer component includes: an embedded post fixed on the buffer shaft and two extension plates formed on the embedded post, the embedded post being inserted into the connecting sleeve and the extension plates passing through the arc-shaped through groove formed on the connecting sleeve; it also includes two arc-shaped elastic members fixed on the outside of the connecting sleeve and arranged symmetrically, the movable ends of the arc-shaped elastic members abutting against the extension plates.

4. The precision miniature MBL bridge rectifier production equipment with dual-end synchronous processing according to claim 1, characterized in that, The lifting drive unit includes: a support frame rotatably connected to the buffer shaft, the support frame sliding vertically on the support frame; a second motor mounted on the support frame, the output shaft of the second motor having an eccentric rod fixed thereon, a connecting rod rotatably mounted at the eccentric position of the eccentric rod, and the end of the connecting rod away from the eccentric rod being rotatably connected to the support frame.

5. The precision miniature MBL bridge rectifier production equipment with dual-end synchronous processing according to claim 1, characterized in that, It also includes a correction unit, which is adapted to the buffer shaft and is used to automatically correct the buffer shaft when the die bonding nozzle moves down, so that the die bonding nozzle is facing the die bonding or pick-up position.

6. The precision miniature MBL bridge rectifier production equipment with dual-end synchronous processing according to claim 5, characterized in that, The correction unit includes: symmetrically arranged arc-shaped cylinders, two of which are fixed to the support frame after being joined together, and a cylindrical groove for accommodating the telescopic shaft and the buffer shaft is formed between the two arc-shaped cylinders; a correction guide groove is formed on the inner wall of the arc-shaped cylinder, and a sliding column fixed on the buffer shaft is placed in the correction guide groove to adaptively adjust the downward position of the buffer shaft when it moves downward; the correction guide groove includes: an arc-shaped horizontal groove formed on the inner wall of the arc-shaped cylinder, which forms an annular groove when the two arc-shaped cylinders are joined together; and a vertical guide groove formed on the inner wall of the arc-shaped cylinder and located at the middle position of the arc-shaped horizontal groove, the connection between the vertical guide groove and the arc-shaped horizontal groove forming an arc-shaped guide part.

7. The precision miniature MBL bridge rectifier production equipment with dual-end synchronous processing according to claim 1, characterized in that, The solder paste printing mechanism includes: a lifting plate, driven by a lifting drive mounted on a stand to move the lifting plate along the Y direction; a transverse mounting plate, connected to the movable end of an electric telescopic rod mounted on the lifting plate, the electric telescopic rod driving the transverse mounting plate to move along the Z direction, the transverse mounting plate having a printing plate mounted thereon; and a sliding mounting plate, slidably mounted on the transverse mounting plate and driven by a horizontal drive mounted on the transverse mounting plate to move along the X direction, the sliding mounting plate having a scraper unit that abuts against the printing plate.

8. The precision miniature MBL bridge rectifier production equipment with dual-end synchronous processing according to claim 7, characterized in that, The ink scraping unit includes: a receiving frame plate fixed on the sliding mounting plate, and an ink scraper and an ink return blade are provided on the side of the receiving frame plate facing the printing plate. The ink scraper and the ink return blade are respectively driven to rise and fall by a control cylinder mounted on the receiving frame plate.

9. The precision miniature MBL bridge rectifier production equipment with dual-end synchronous processing according to claim 1, characterized in that, The workpieces processed on the feeding platform, solder paste printing mechanism, die bonding mechanism and wafer assembly mechanism are transferred using negative pressure grippers. The negative pressure grippers include multiple negative pressure suction cups, which are driven by a two-dimensional drive component.

10. A precision miniature MBL bridge rectifier manufacturing process with simultaneous machining at both ends, characterized in that, The precision miniature MBL bridge rectifier production equipment with dual-end synchronous processing as described in any one of claims 1-9 includes the following steps: S1. A stamping mechanism is used to stamp out the frame structure, and the frame structures are stacked on the feeding platform in sequence. S2. The frame is transported to the solder paste printing mechanism by a negative pressure gripper for solder paste printing. Then, CCD image inspection is performed. The qualified frame is placed on the die bonding station for die bonding. Then, CCD image inspection is performed on the die bonding position. S3. Repeat steps S1 and S2 at another symmetrical station to complete the die bonding process of the second frame. S4. The two qualified frames are placed in the mold closing station for piece assembly and mold closing. S5. Subsequently, the chip positions after molding are sintered and encapsulated to form a four-chip bridge rectifier finished product.

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