Circuit board forming processing method, detection method and circuit board forming equipment

Abstract

The invention provides a circuit board forming processing method which comprises the following steps: detecting a first height of a circuit board at a forming position; the first depth of the forming position is obtained, and a blind groove is machined in the forming position based on the first depth; detecting a second height of the bottom of the blind groove; determining a second depth of the blind groove according to the first height and the second height; and according to a comparison result of the first depth and the second depth, controlling the molded circuit board. The invention further provides circuit board forming equipment. According to the circuit board forming processing method and the circuit board forming equipment, the forming processing precision and the detection efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of equipment or method for manufacturing printed circuit, more specifically, the present disclosure relates to a circuit board forming processing method, a detection method and a circuit board forming equipment. BACKGROUND

[0002] In the current PCB (Print Circuit Board) industry, in the circuit board forming process, the circuit board of a specific process needs to control the forming depth, and retain the inner groove or shape of a certain thickness, which is commonly known as controlled depth forming, also known as blind fishing. Blind fishing is generally made according to the specified depth requirement, and after the completion of blind fishing, manual depth measuring instruments are used to check whether the blind fishing depth meets the requirements. If it meets the requirements, continue to work, if it does not meet the requirements, the machine parameters need to be adjusted to re-produce. Manual measurement of blind fishing depth not only has low detection efficiency, but also affects the productivity of forming processing. How to efficiently detect the forming depth so as to improve the precision, efficiency and quality of the circuit board forming equipment is a technical problem to be solved by those skilled in the art.

[0003] DISCLOSURE

[0004] In order to solve the problems in the prior art, the present disclosure provides a circuit board forming processing method, a circuit board forming detection method and a circuit board forming equipment to solve the technical problems in the prior art.

[0005] According to a first aspect of the present disclosure, a circuit board forming processing method is provided, comprising: detecting a first height of a circuit board at a forming position; obtaining a first depth of the forming position, and processing a blind groove at the forming position based on the first depth; detecting a second height of a bottom of the blind groove; determining a second depth of the blind groove according to the first height and the second height; and controlling the forming processing of the circuit board according to a comparison result of the first depth and the second depth.

[0006] In some embodiments of the present disclosure, detecting the first height of the circuit board at the forming position comprises controlling a probe assembly or a secondary grating part on a main shaft assembly to detect the first height of the circuit board.

[0007] In some embodiments of the present disclosure, the probe assembly abuts against the surface of the circuit board at the forming position, and when the pressure reaches a preset value, the first height of the circuit board is obtained.

[0008] In some embodiments of the present disclosure, detecting the second height of the bottom of the blind groove comprises controlling a probe or a detection body to extend into the blind groove and abut against the bottom of the blind groove to detect the second height of the bottom of the blind groove.

[0009] In some embodiments of the present disclosure, the probe or the detection body abuts against the bottom of the blind groove and the pressure reaches a preset value, and the second height of the bottom of the blind groove is obtained.

[0010] In some embodiments of the present disclosure, determining the second depth of the blind slot according to the first height and the second height comprises, in the third direction, determining the second depth of the blind slot according to a difference between the first height and the second height.

[0011] In some embodiments of the present disclosure, controlling the forming processing of the circuit board according to the comparison result of the first depth and the second depth comprises, when the second depth is within a threshold range of the first depth, controlling the forming processing of the circuit board according to the first depth.

[0012] The second aspect of the present disclosure also provides a circuit board forming detection method, comprising: detecting a third height of a pad plate at a forming position; obtaining a first depth of the forming position, and processing a blind slot at the forming position of the circuit board based on the first depth; detecting a fourth height of a bottom of the blind slot; determining an actual residual thickness of the blind slot according to the third height and the fourth height; determining a theoretical residual thickness of the blind slot based on the first depth, and judging whether the depth of the blind slot is qualified according to a comparison result of the theoretical residual thickness and the actual residual thickness of the blind slot.

[0013] The third aspect of the present disclosure also provides a circuit board forming device, comprising: a workbench, the workbench moving along a first direction on a base, the workbench carrying a bakelite plate, a pad plate and a circuit board which are stacked in sequence; a main shaft assembly, the main shaft assembly slidingly connected to a cross beam and moving along a second direction, the main shaft being provided with a detection assembly; controlling the detection assembly to detect a first height of a forming position of the circuit board on the workbench; obtaining a first depth of the forming position, and processing a blind slot at the forming position based on the first depth; controlling the detection assembly to detect a second height of a bottom of the blind slot; determining a second depth of the blind slot according to the first height and the second height; controlling the forming processing of the circuit board along a third direction according to a comparison result of the first depth and the second depth; the first direction, the second direction and the third direction being perpendicular to each other.

[0014] The circuit board forming processing method, the detection method and the circuit board forming device of the present disclosure utilize the detection assembly provided on the main shaft assembly to detect the height values of the circuit board and the blind slot at the same position, utilize the height difference between the two to determine the actual depth value of the blind slot, compare the actual depth value with the theoretical depth value, and prompt, compensate and adjust the processing depth of the blind slot. Such a circuit board forming processing device can automatically detect the depth of each blind slot on the circuit board, prompt, compensate and adjust the depth value, improve the accuracy of the forming depth control, and improve the detection and processing efficiency.

[0015] Other features of the present disclosure and its advantages will become apparent from the following detailed description of exemplary and non-limiting embodiments thereof, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0016] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0017] Figure 1 A schematic diagram of a part of a circuit board forming apparatus according to an embodiment of the present disclosure is provided.

[0018] Figure 2 A schematic diagram of a part of a spindle assembly according to an embodiment of the present disclosure is provided.

[0019] Figure 3 A schematic diagram of a part of a spindle assembly according to an embodiment of the present disclosure is provided.

[0020] Figure 4 A schematic diagram of a part of a circuit board according to an embodiment of the present disclosure is provided.

[0021] Figure 5 A schematic diagram of a part of a circuit board on a worktable according to an embodiment of the present disclosure is provided.

[0022] Figure 6 A schematic diagram of a part of a circuit board on a worktable according to an embodiment of the present disclosure is provided.

[0023] Figure 7 A schematic diagram of a part of a cushion plate on a worktable according to an embodiment of the present disclosure is provided.

[0024] Figure 8 A schematic diagram of a part of a circuit board on a worktable according to an embodiment of the present disclosure is provided.

[0025] Figures 1 to 8 The one-to-one correspondence between the names of the components and the reference numerals in the drawings is as follows: 40, base; 30, crossbeam; 10, spindle assembly; 20, worktable; 11, spindle; 12, probe assembly; 121, probe; 122, pressure sensor; 13, secondary grating section; 131, grating ruler; 132, detection body; 21, bakelite plate; 22, cushion plate; 23, circuit board; 231, forming position; 24, blind slot; 241, bottom. DETAILED DESCRIPTION

[0026] Various exemplary disclosures of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement, numerical expressions, and numerical values of the components and steps set forth in these disclosures do not limit the scope of the present disclosure unless otherwise specifically stated.

[0027] The following detailed description of at least one exemplary disclosure does not actually limit the disclosure, its application or uses, and it should not be construed as any limiting. Techniques, methods, and devices known to those of ordinary skill in the relevant art can not be discussed in detail, but should be understood to be part of the specification, if appropriate. It should be noted that similar reference numerals and letters refer to similar items throughout the drawings, and therefore, once an item is defined in one drawing, it need not be discussed further in subsequent drawings.

[0028] The specific embodiments of the disclosure are described below with reference to the accompanying drawings. In this document, "upper", "lower", "front", "back", "left", "right", and the like are used only to indicate the relative positional relationship between the relevant parts, and do not limit the absolute position of the relevant parts. In this document, "first", "second", "third", "fourth", and the like are only used to distinguish from each other, and do not represent importance and order, and the premise of each other. In this document, "equal", "aligned", "aligned", "vertical", "horizontal", "above", "below", "consistent", "synchronous", "simultaneous", "in turn", "before and after" and the like are not strictly mathematical and / or geometric restrictions, but also include errors allowed by manufacturing or use that can be understood by those skilled in the art.

[0029] As shown in Figures 1 to 8 The circuit board forming device in the present disclosure includes a base 40, a crossbeam 30, a spindle assembly 10, a workbench 20, etc. The workbench 20 is arranged on the base 40 and moves along a first direction. The crossbeam 30 above the workbench 20 is slidably connected with a plurality of spindle assemblies 10 moving along a second direction. The spindle 11 of each spindle assembly 10 moves along a third direction to process the circuit board carried on the workbench 20. The first direction, the second direction and the third direction are perpendicular to each other. In the context of the present disclosure, the circuit board forming device can be implemented as a forming device, a machine device, etc., which is not limited herein. In the embodiments of the present disclosure, the number of spindle assemblies of the circuit board forming device can be one, two, three, four, five, six, eight, ten, twelve, etc., which is not limited herein.

[0030] In the process of the circuit board forming equipment, the depth of the forming needs to be controlled. For example, a blind slot is formed on a multilayer circuit board. The blind slot is a non-through slot, and the cross section can be circular, square, rhombic, trapezoidal, etc. Accurate control of the depth of the blind slot in the multilayer circuit board is a very key technical problem. The circuit board is affected by many factors such as thermal expansion and contraction, flatness, warping, assembly of the main shaft assembly, and machining precision, resulting in a deviation between the depth of the blind slot and the preset theoretical depth. This deviation may affect the processing quality and even cause the circuit board to be scrapped. In order to accurately control the depth of the blind slot, the depth of the blind slot needs to be sampled in the continuous processing process, so as to monitor the processing quality and processing precision of the circuit board forming equipment. In the process of manually sampling the depth of the blind slot, manual detection or stoppage detection will cause loss of production capacity and low efficiency.

[0031] In order to detect the depth of the blind slot and realize automatic compensation and adjustment, the present disclosure provides a circuit board forming equipment, comprising: a workbench, the workbench moves along a first direction on a base, and the workbench carries a bakelite plate, a cushion plate and a circuit board which are stacked in sequence; a main shaft assembly, the main shaft assembly is slidably connected to a cross beam and moves along a second direction, and a detection assembly is arranged on the main shaft; a first height of a forming position of the circuit board on the workbench is detected by the detection assembly; a first depth of the forming position is obtained, and a blind slot is processed at the forming position based on the first depth; a second height of the bottom of the blind slot is detected by the detection assembly; a second depth of the blind slot is determined according to the first height and the second height; the circuit board is controlled to be formed and processed along a third direction according to the comparison result of the first depth and the second depth; and the first direction, the second direction and the third direction are perpendicular to each other.

[0032] The circuit board forming equipment can detect the height values of the circuit board and the blind slot at the same forming position by using the detection assembly arranged on the main shaft assembly, determine the actual depth value of the blind slot by using the height difference between the two, compare the actual depth value with the theoretical depth value, and prompt, compensate and adjust the processing depth of the blind slot. The circuit board forming and processing equipment can automatically detect the depth of each blind slot on the circuit board, prompt, compensate and adjust the depth value, improve the accuracy of the depth control of the forming, and improve the detection and processing efficiency.

[0033] In some embodiments of the present disclosure, the main shaft assembly of the circuit board forming equipment includes a probe assembly as a detection assembly for detecting the height values of the circuit board, the backing plate and the blind slot. The probe assembly includes a probe, a pressure sensor and the like. In the third direction, the main shaft assembly drives the probe assembly to move towards the circuit board on the workbench until the tip of the probe contacts the upper surface of the circuit board. The main shaft assembly and the probe assembly continue to move in the third direction. The upper surface of the circuit board exerts a reverse pressure on the probe during the process of blocking the probe from falling. The pressure sensor receives the pressure value fed back by the probe. When the pressure accumulates to a preset value, the height of the tip of the probe is converted and recorded according to the reading of the primary grating ruler on the main shaft assembly. At this time, the tip of the probe and the surface of the circuit board are at the same height, and the height of the tip of the probe is also the first height of the upper surface of the circuit board. In this way, the first height of the upper surface of the circuit board relative to the reference position is detected by the probe assembly.

[0034] In some embodiments of the present disclosure, the main shaft assembly of the circuit board forming equipment includes a secondary grating assembly as a detection assembly for detecting the height values of the circuit board, the backing plate and the blind slot. The secondary grating assembly includes a grating ruler, a detection body and the like. In the third direction, the main shaft assembly drives the secondary grating assembly to move towards the circuit board on the workbench until the bottom end of the detection body contacts the upper surface of the circuit board. The main shaft assembly and the secondary grating assembly continue to move in the third direction. The upper surface of the circuit board blocks the movement of the detection body, and the reading on the grating ruler no longer changes and stabilizes around a fixed value. The control system receives the value fed back by the grating ruler and records it as the height of the bottom end of the detection body. At this time, the bottom end of the detection body and the upper surface of the circuit board are at the same height, and the height of the bottom end of the detection body is also the first height of the upper surface of the circuit board. In this way, the first height of the upper surface of the circuit board relative to the reference position is detected by the secondary grating assembly. In the above and below embodiments of the present disclosure, the detection body can be realized as a standard rod, a pin, a tool, a cylindrical metal piece and the like.

[0035] In some embodiments of the present disclosure, after the circuit board forming equipment processes the blind slot, since the blind slot on the multilayer circuit board is a non-through slot, the non-through slot has a bottom. The probe of the probe assembly is controlled to extend into the blind slot and abut against the bottom of the blind slot. Similarly to the detection of the first height, the second height of the bottom of the blind slot relative to the reference position can also be detected. In some other embodiments, the detection body of the secondary grating assembly is controlled to extend into the blind slot and abut against the bottom of the blind slot. Similarly to the detection of the first height, the second height of the bottom of the blind slot relative to the reference position can also be detected. In the above and below embodiments of the present disclosure, the methods and principles of the probe assembly for detecting the first height and the second height are similar, and the methods and principles of the secondary grating assembly for detecting the first height and the second height are similar, which will not be described herein.

[0036] In the circuit board forming equipment, a circuit board forming processing method is applied, which comprises: detecting a first height of a circuit board at a forming position; obtaining a first depth of the forming position, and processing a blind groove at the forming position on the circuit board based on the first depth; detecting a second height of a bottom of the blind groove; determining a second depth of the blind groove according to the first height and the second height; and controlling the forming processing of the circuit board according to a comparison result of the first depth and the second depth. In the circuit board forming equipment, the actual depth value of the blind groove is determined based on the detection of the height at the same position and the processing of the blind groove, and the actual processing depth of the blind groove is prompted, compensated and adjusted based on the comparison between the actual depth and the theoretical depth, so as to improve the accuracy of the depth control of the forming and provide the efficiency of the detection of the depth control.

[0037] In some embodiments of the present disclosure, detecting the first height of the circuit board at each forming position comprises controlling a probe assembly or a secondary grating part on the main shaft assembly to detect the first height of the circuit board. In the circuit board forming equipment, the bakelite plate, the cushion plate and the circuit board are stacked on the workbench in turn, and due to the influence of the physical structure of the circuit board, the circuit board may have flatness difference, warping, layer gap and the like, and these potential factors will affect the height of the circuit board. In the embodiments of the present disclosure, the height of the circuit board refers to the height value relative to the reference position in the third direction, and in some preferred embodiments, the upper surface of the workbench is selected as the reference position in the third direction.

[0038] The circuit board comprises a plurality of forming positions, and any one forming position is selected, at which the first height of the circuit board relative to the reference position is detected first. The detection method comprises controlling a probe assembly or a secondary grating part on the main shaft assembly to automatically detect the first height of the circuit board at the forming position relative to the reference position. Specifically, the main shaft assembly and the workbench are controlled to move relatively, and when the detection assembly moves above the forming position, there are two detection methods: the probe assembly is controlled to descend along the third direction until the probe tip abuts against the upper surface of the circuit board at the forming position, and based on the signal fed back by the pressure sensor, the control system records the first height H1 of the probe relative to the reference position, and the H1 value is the actual height value of the forming position of the circuit board relative to the reference position. Alternatively, the secondary grating part is controlled to descend along the third direction until the bottom end of the detection body abuts against the upper surface of the circuit board at the forming position, and when the reading of the grating ruler no longer changes, the control system obtains the reading of the grating ruler and converts it into the first height H1 of the bottom end of the detection body relative to the reference position, and the first height H1 value is the actual height of the forming position of the circuit board relative to the reference position.

[0039] In some embodiments of the present disclosure, the first height of the circuit board is obtained when the probe assembly abuts the surface of the circuit board at the molding position and the pressure reaches a preset value. The probe assembly includes a pressure sensor, one end of the probe abuts the circuit board, and the other end is connected with the pressure sensor. When the probe abuts the upper surface of the circuit board, the circuit board exerts a reverse pressure on the probe. Since the probe is made of rigid material, the pressure is transmitted to the pressure sensor by the probe. Since this pressure is variable, the optimal standard value is tested in advance. When the pressure reaches the preset optimal standard value, the first height value H1 of the probe tip is obtained by reading and converting the first grating scale on the spindle assembly. The probe tip is at the same height as the upper surface of the circuit board at the molding position. Therefore, the first height value H1 is the first height of the upper surface of the circuit board at the molding position relative to the reference position. By this method, the first height of each molding position can be tested. Compared with the average method, this method of detecting the first height of each molding position is more accurate, the depth of the blind slot is more accurate, and the processing accuracy and quality of the circuit board are improved.

[0040] In some embodiments of the present disclosure, detecting the second height of the bottom of the blind slot includes controlling the probe or the detection body to extend into the blind slot and abut the bottom of the blind slot to detect the second height of the bottom of the blind slot. Whether a probe or a detection body is used to detect the height of the bottom of the blind slot, both the probe and the detection body are generally cylindrical in structure and have a small diameter. That is, the cross-sectional diameter of the probe or the detection body is smaller than the cross-sectional diameter of the blind slot, so that the probe or the detection body can extend into the blind slot and abut the bottom of the blind slot, thereby providing a prerequisite for detecting the height of the bottom of the blind slot. During the detection of the second height, the probe or the detection body is controlled to extend into the blind slot, the spindle moves in the third direction, and the probe or the detection body abuts the bottom of the blind slot. Similar to the method and principle of detecting the first height, the height of the bottom of the blind slot relative to the reference position can be detected, and thus the second height H2 is detected by the probe or the detection body. It should be noted that the cross section of the blind slot is generally circular, and even if it is not circular, there is an inscribed circle. The cross section in the third direction is generally rectangular, and the bottom of the blind slot is generally planar. The height of the plane can be detected by the probe and the detection body.

[0041] In some embodiments of the present disclosure, the second height of the bottom of the blind hole is obtained when the probe assembly abuts against the bottom of the blind hole and the pressure reaches a preset value. The probe assembly includes a probe and a pressure sensor, one end of the probe abutting against the bottom of the blind hole and the other end connected to the pressure sensor. When the spindle assembly drives the probe assembly to move along the third direction towards the circuit board, the probe tip abuts against the bottom of the blind hole, the bottom of the blind hole exerts a reverse pressure on the probe, the spindle assembly continues to move, and the pressure continues to increase. When the pressure increases to a preset standard value, the second height value H2 of the probe tip is obtained according to the reading and conversion of the primary grating ruler on the spindle. The probe tip and the bottom of the blind hole are at the same height, so H2 is the second height of the bottom of the blind hole relative to the reference position. In the above and below embodiments of the present disclosure, since the spindle assembly processes the blind hole along the third direction towards the workbench, in the third direction, H1 is greater than H2.

[0042] In some embodiments of the present disclosure, determining the second depth of the blind hole according to the first height and the second height includes, in the third direction, determining the second depth of the blind hole according to the difference between the first height and the second height. On the workbench, there are sequentially stacked bakelite plate, cushion plate and circuit board, the spindle assembly moves along the third direction towards the workbench, and the first to be formed and processed is the circuit board layer. Therefore, reasonable control of the movement distance of the spindle assembly in the third direction can accurately control the depth of the processed blind hole. At the same forming position of the circuit board carried on the workbench, the first height H1 of the point relative to the reference position workbench is detected, and then the blind hole is processed at the point based on the theoretical depth D1 of the blind hole at the point. After the blind hole is completed, the second height H2 of the bottom of the blind hole relative to the reference position workbench is detected, and the difference between the first height H1 and the second height H2 is calculated to determine the actual depth D2 of the blind hole. That is, the difference between the top height and the bottom height of the blind hole at the same forming position determines the actual depth D2 of the blind hole. In the above and below embodiments of the present disclosure, the theoretical depth D1 and the actual depth D2 of the blind hole are both depth values along the third direction downward from the surface of the circuit board as the reference.

[0043] In some embodiments of the present disclosure, controlling the circuit board forming process according to the comparison result of the first depth and the second depth includes, when the second depth is within a threshold range of the first depth, controlling the circuit board to be formed according to the first depth; when the second depth exceeds the threshold range of the first depth and is greater than the first depth, the control system of the circuit board forming equipment sends a prompt message, and the technician can compensate the first depth in reverse according to the prompt message, and form the circuit board based on the compensated first depth; when the second depth exceeds the threshold range of the first depth and is less than the first depth, the control system of the circuit board forming equipment sends a prompt message, and the technician can control the spindle assembly to continue processing the blind slot in the third direction until the depth of the blind slot is within the threshold range of the first depth. The blind slot at any position on the circuit board has a different depth control depth. Selecting a certain forming position, obtaining the theoretical depth D1 of the blind slot, and comparing it with the actual depth D2 of the blind slot, based on the comparison result of the two, different control instructions are executed. Specifically, when the second depth D2 is within the threshold range of the first depth D1, it means that the second depth D2 meets the expectation and belongs to the normal blind slot depth, and the control is performed according to the first depth to process other circuit boards. When the second depth D2 exceeds the threshold range of the first depth and is greater than the threshold range of the first depth D1, the circuit board forming equipment sends an alarm, and the display screen outputs a prompt information box, prompting the technician to compensate the first depth D1 in reverse. Specifically, the technician sets a compensation value D3, when D2 is greater than D1, the blind slot depth exceeds the standard, and the difference (D1-D3) between D1 and D3 is used as the new theoretical depth of the blind slot, and the blind slot of other circuit boards is controlled according to (D1-D3) to form. When the second depth D2 exceeds the threshold range of the first depth and is less than the first depth D1, the circuit board forming equipment sends a prompt message, and the technician can control the spindle assembly to continue processing the blind slot in the third direction until the depth of the blind slot is within the threshold range of the first depth. When D2 is less than D1, the blind slot depth is insufficient, at this time, the blind slot is directly continued to be processed, and the difference between D1 and D2 is continuously eliminated until the actual depth of the blind slot is within the threshold range of the first depth D1. This prompt, detection, compensation and adjustment method can accurately control the depth of the blind slot, thereby correcting the deviation of each blind slot depth.

[0044] In some embodiments of the present disclosure, compensating the first depth includes compensating a value less than a difference between the first depth and the second depth. For the blind slot, when the second depth D2 exceeds a threshold range of the first depth D1 and is greater than the first depth D1, a technician is prompted to set a compensation value D3 for compensating the first depth D1. In theory, the difference between D1 and D2 should be compensated, but D1 has a threshold range, which is qualified within the threshold range, and D1 is compared with the threshold range of D2. Therefore, setting the compensation value D3 less than the absolute value of the difference between the first depth D1 and the second depth D2 can quickly and accurately adjust the actual depth of the blind slot to the threshold range of the preset theoretical depth.

[0045] In the circuit board forming device, a circuit board forming detection method is also provided, including: detecting a third height of the cushion plate at the forming position; obtaining a first depth of the blind slot at the forming position based on the first depth; detecting a fourth height of the bottom of the blind slot; determining an actual residual thickness of the blind slot according to the third height and the fourth height; determining a theoretical residual thickness of the blind slot based on the first depth; and judging whether the depth of the blind slot is qualified according to a comparison result of the theoretical residual thickness and the actual residual thickness.

[0046] On the workbench of the circuit board forming device, the bakelite plate, the cushion plate and the circuit board are sequentially stacked in the third direction, and the three can be fixed on the workbench by means of pins and the like, and the gap between the adjacent layers is almost zero. In order to detect the actual depth of the blind slot, in addition to the method of detecting the difference between the top and the bottom of the blind slot, the residual value method can also be used, that is, the residual thickness of the blind slot is first detected, and then whether the depth of the blind slot is qualified is judged according to the comparison result of the theoretical residual thickness and the actual residual thickness of the blind slot. In the embodiments of the present disclosure, the residual thickness refers to the thickness of the functional layer of the circuit board remaining between the bottom of the blind slot and the lower surface of the circuit board; the blind slot is a non-through slot, and after a hole of a certain depth is processed, the thickness of the non-through part at the bottom of the blind slot is called the residual thickness of the circuit board, that is, the sum of the depth of the blind slot and the residual thickness is equal to the thickness between the upper surface and the lower surface of the circuit board, that is, the actual thickness of the circuit board at the forming position.

[0047] Based on the method of detecting the residual thickness, the third height of the cushion plate is first detected, which refers to the height of the upper surface of the cushion plate relative to the upper surface of the workbench at the reference position. Since the circuit board is fixed on the workbench by the pressure plate assembly, the circuit board and the cushion plate are tightly attached, that is, the upper surface of the cushion plate and the lower surface of the circuit board are at the same level, and both have the same third height relative to the workbench. When the height of the upper surface of the cushion plate is detected, the height of the lower surface of the circuit board is also detected.

[0048] In the same selected forming position, after detecting the height of the lower surface of the circuit board, the blind hole is first machined to a first depth based on the acquired theoretical depth of the blind hole. The fourth height of the bottom of the blind hole is then detected. Based on the fourth height of the bottom of the blind hole and the third height of the lower surface of the circuit board, the spacing between the bottom of the blind hole and the lower surface of the circuit board in the same forming position is calculated and determined, which is also the residual thickness of the blind hole. After determining the actual residual thickness of the blind hole, the acquired theoretical residual thickness of the blind hole is compared with the actual residual thickness to determine whether the blind hole is qualified. Specifically, when the actual residual thickness of the blind hole is within a preset threshold range of the theoretical residual thickness, it is determined that the actual residual thickness of the blind hole is qualified, and the machined depth of the blind hole meets the process requirements; if the actual residual thickness of the blind hole exceeds the threshold range of the theoretical residual thickness, it is determined that the residual thickness of the blind hole is unqualified, and the depth of the blind hole does not meet the predetermined requirements. This method of detecting the residual thickness indirectly determines whether the depth of the blind hole meets the process requirements, provides another method of detecting the depth of the blind hole, and also improves the accuracy of the depth control of the forming and provides the efficiency of detecting the depth control.

[0049] In the process of detecting the residual thickness, the third height H3 of the pad plate and the fourth height H4 of the bottom of the blind hole can also be detected based on the probe assembly. Alternatively, the third height H3 of the pad plate and the fourth height H4 of the blind hole are detected using the secondary grating part. The detection method and principle are similar to the first height H1 and the second height H2, which will not be described here.

[0050] In the embodiments of the present disclosure, the specific position of the forming position is expressed using the center position coordinates. During the relative movement of the spindle assembly and the workbench, the position of the spindle assembly in the two-dimensional coordinate system of the workbench has a specific two-dimensional coordinate in the two-dimensional coordinate system of the workbench. That is, the plurality of forming positions on the circuit board essentially have a clear two-dimensional coordinate position. Therefore, for each forming position, there is a clear two-dimensional coordinate position, and controlling the relative movement of the spindle assembly and the workbench to this position is essentially a theoretical coordinate position. Under the premise that the center position of the spindle assembly and the perpendicularity are qualified, in the same forming position, the third height H3 of the pad plate is first detected, then the blind hole is machined based on the preset first depth D1 of the theoretical depth of the blind hole, and the fourth height H4 of the bottom of the blind hole is detected. In the above detection, machining and detection process, it is aimed at the same forming position, and the circuit board includes a plurality of forming positions, and the above forming machining method is performed for each forming position, which is beneficial to provide the machining accuracy and machining efficiency of the circuit board forming equipment.

[0051] Application scenario one

[0052] In this embodiment, the circuit board forming equipment has six spindle assemblies, and the detection method uses a probe assembly. The specific application scenario and implementation process of the circuit board forming machining method and the circuit board forming equipment will be described in detail below with reference to the accompanying drawings.

[0053] As Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figure 6 shown in the present embodiment, the circuit board forming equipment includes: base 40, crossbeam 30, main shaft assembly 10, workbench 20, etc. The workbench 20 moves along the first direction on the base 40, and the workbench 20 carries the circuit board to be processed; the main shaft assembly 10 is slidingly connected to the crossbeam 30, and the crossbeam 30 is arranged above the workbench 20, and the main shaft assembly 10 moves along the second direction on the crossbeam 30. The main shaft of each main shaft assembly 10 moves along the third direction to process the circuit board carried on the workbench 20. The first direction, the second direction and the third direction are perpendicular to each other. Specifically, the workbench 20 carries the bakelite board 21, the cushion plate 22 and the circuit board 23 which are stacked in sequence; the main shaft 11 and the probe assembly 12 are arranged on the main shaft assembly 10. A forming processing method is applied in this circuit board forming equipment, which includes: detecting the first height H1 of the circuit board at the forming position; obtaining the first depth D1 of the forming position, and processing the blind groove at the forming position on the circuit board based on the first depth D1; detecting the second height H2 of the bottom of the blind groove; determining the second depth D2 of the blind groove according to the first height H1 and the second height H2; and controlling the forming processing circuit board according to the comparison result of the first depth D1 and the second depth D2. This circuit board forming processing equipment and forming processing method, based on detecting the height at the same position, processing the blind groove, determining the actual depth value of the blind groove, and based on the comparison between the actual depth and the theoretical depth, prompting, compensating and adjusting the actual processing depth of the blind groove, thereby improving the accuracy of the forming depth control depth and providing the efficiency of detecting the depth control depth.

[0054] In the present embodiment, as Figure 2 shown, the main shaft assembly 10 is provided with a primary grating ruler, which can obtain the position of the main shaft in the third direction in real time. A side of the main shaft 11 is fixedly provided with a side shaft, and the side shaft is provided with a probe assembly 12. The probe assembly 12 includes a probe 121 and a pressure sensor 122. Along the third direction, the tip of the probe 121 faces the circuit board 23 on the workbench 20, and the other end of the probe 121 is connected to the pressure sensor 122. The probe 121 abuts against the circuit board or the bottom of the blind groove, and conducts the reverse pressure to the pressure sensor 122. The pressure sensor 122 obtains the pressure and outputs the pressure data information to the control system. The control system obtains the height position information of the probe 121 in the third direction based on the reading of the primary grating ruler according to the obtained pressure data information.

[0055] In the present embodiment, as Figure 5 , Figure 6 shown, the workbench 20 is stacked with the bakelite board 21, the cushion plate 22 and the circuit board 23, and the three are fixed on the workbench 20 by the pressing plate assembly. As Figure 4As shown, the circuit board 23 includes multiple forming positions 231, and a blind groove 24 is processed at each forming position 231. The blind groove 24 is a square non-through groove and has a bottom 241.

[0056] A forming process method is applied in circuit board forming equipment, which specifically includes the following steps:

[0057] S10: Detect the first height of the circuit board at the forming position.

[0058] In this embodiment, the probe assembly 12 on the spindle assembly 10 detects the first height of the circuit board. For example... Figure 4 As shown, on the circuit board 23, a point P is randomly selected from multiple forming positions 231. Based on this determined position P, the spindle assembly 10 and the worktable 20 are controlled to move relative to each other until the probe 121 on the spindle assembly 10 moves to point P. The spindle assembly 10 is controlled to move in a third direction, and the probe 121 moves toward the circuit board 23 along with the spindle assembly 10 until the tip of the probe 121 abuts against the upper surface of the circuit board 23. The distance data fed back by the first-level grating ruler on the spindle assembly 10 is linked with the pressure data of the pressure sensor 122. The control system captures the reading of the first-level grating ruler when the pressure value reaches G1, and converts it as the first height of the tip of the probe 121. Since the tip of the probe 121 and the upper surface of the circuit board 23 are at the same horizontal level, the first height of the tip of the probe 121 is also the first height H1 of point P on the upper surface of the circuit board. Figure 5 As shown. This method, which uses the probe assembly 12 to abut against the surface of the circuit board and the pressure of the pressure sensor to reach a preset value G1 to obtain the first height, can simply and efficiently detect the first height H1 of any molding position P point relative to the reference position stage 20.

[0059] S20: Obtain the first depth of the forming position, and process a blind groove on the circuit board based on the first depth of the forming position.

[0060] After detecting the first height H1, a blind groove needs to be machined. The spindle assembly 10 and the worktable 20 are moved relative to each other until the tool held by the spindle assembly 10 moves above point P. The spindle assembly 10 is then moved along a third direction towards the circuit board 23, and the tool machines the blind groove 24. The shape of the blind groove is related to the structure of the tool; a tool with a suitable shape and diameter is selected to machine a blind groove of a predetermined shape. The depth of the blind groove is related to the distance the tool moves along a third direction. The blind groove has a predetermined theoretical depth, i.e., a first depth D1. The spindle assembly 10 moves a predetermined distance along a third direction, and based on the preset first depth D1, the blind groove 24 is machined at point P on the circuit board 23.

[0061] S30: Detect the second height of the bottom of the blind slot.

[0062] likeFigure 6 As shown, after the blind slot 24 is formed, the second height of the bottom of the blind slot 24 is detected. The spindle assembly 10 and the worktable 20 are controlled to move relative to each other until the probe 121 on the spindle assembly 10 moves to the P point. The spindle assembly 10 is controlled to move in the third direction, and the probe 121 moves with the spindle assembly 10 towards the circuit board 23 until the tip of the probe 121 abuts against the bottom 241 of the blind slot 24. The distance data fed back by the primary grating ruler on the spindle assembly 10 is linked with the pressure data of the pressure sensor 122, and the control system captures the reading of the primary grating ruler when the pressure value reaches G2, which is converted to the second height of the tip of the probe 121. Since the tip of the probe 121 and the bottom 241 of the blind slot have the same height, the height of the tip of the probe 121 is used to feed back the second height H2 of the bottom 241 of the blind slot. This method of using the probe assembly 12 to abut against the bottom of the blind slot and using the pressure of the pressure sensor to reach the preset value G2 to obtain the second height detects the second height H2 of the bottom 241 of the blind slot.

[0063] S40: According to the first height and the second height, the second depth of the blind slot is determined.

[0064] In the third direction, after the first height H1 and the second height H2 are detected, the second depth D2 of the blind slot is determined according to the difference between the first height H1 and the second height H2. Generally, the first height H1 is the height of the top of the blind slot, and the second height H2 is the height of the bottom of the blind slot. Relative to the worktable 20, the first height H1 is greater than the second height H2. According to the difference between the first height H1 and the second height H2, the actual second depth D2 of the blind slot 24 is determined.

[0065] S50: According to the comparison result of the first depth and the second depth, the circuit board is controlled to be formed.

[0066] In the embodiment, when the second depth D2 is within the threshold range of the first depth D1, the circuit board forming equipment is controlled to form and process the circuit board according to the first depth D1 ; when the second depth D2 exceeds the threshold range of the first depth D1 and is greater than the first depth D1, the control system of the circuit board forming equipment sends a prompt information, and the technician can reverse compensate the first depth D1 according to the prompt information and form and process the circuit board based on the compensated first depth; when the second depth D2 exceeds the threshold range of the first depth D1 and is less than the first depth D1, the control system of the circuit board forming equipment sends a prompt information, and the technician can control the spindle assembly to continue processing the blind slot in the third direction until the depth of the blind slot is within the threshold range of the first depth D1. Specifically, when the second depth D2 is within the threshold range of the first depth D1, it indicates that the second depth D2 meets the expectation and belongs to the normal blind slot depth, and the circuit board forming equipment is controlled to form and process other circuit boards according to the first depth D1. When the second depth D2 exceeds the threshold range of the first depth D1 and is greater than the first depth D1, the circuit board forming equipment sends an alarm, and the display screen outputs a prompt information box to prompt the technician to reverse compensate the first depth D1. Specifically, the technician sets a compensation value D3, when D2 is greater than D1, the depth of the blind slot exceeds the standard, and the difference between D1 -D3 is taken as a new theoretical depth (D1 -D3) of the blind slot, and the blind slot of other circuit boards is formed and processed according to (D1 -D3). When the second depth D2 exceeds the threshold range of the first depth D1 and is less than the first depth D1, the depth of the blind slot is insufficient, the circuit board forming equipment sends an alarm, and the display screen outputs a prompt information box to prompt the technician to control the spindle assembly to continue processing the blind slot in the third direction until the depth of the blind slot is within the threshold range of the first depth D1. In the embodiment, the compensation value D3 is less than the absolute value of the difference between the first depth D1 and the second depth D2.

[0067] The circuit board forming equipment and the forming and processing method can detect the height values of the circuit board and the blind slot at the same position by using the probe assembly arranged on the spindle assembly, determine the actual depth value of the blind slot by using the height difference between the two, compare the actual depth value with the theoretical depth value, and prompt, compensate and adjust the processing depth of the blind slot. The circuit board forming and processing equipment can automatically detect the depth of each blind slot on the circuit board, prompt, compensate and adjust the depth value, improve the accuracy of the forming and depth control, and improve the detection and processing efficiency.

[0068] Application scenario two

[0069] In the embodiment, the circuit board forming equipment has six spindle assemblies, and the detection method uses a two-stage grating part. The specific application scenarios and implementation processes of the circuit board forming and processing method and the circuit board forming equipment are described in detail below in combination with the drawings.

[0070] As Figure 1 , Figure 3 , Figure 4、 Figure 5 、 Figure 6 As shown in the figure, in the embodiment, the circuit board forming device comprises a base 40, a crossbeam 30, a spindle assembly 10, a workbench 20, etc. The workbench 20 moves along a first direction on the base 40, and the workbench 20 carries the circuit board to be processed. The spindle assembly 10 is slidably connected to the crossbeam 30, and the crossbeam 30 is arranged above the workbench 20. The spindle assembly 10 moves along a second direction on the crossbeam 30. The spindle of each spindle assembly 10 moves along a third direction to process the circuit board carried on the workbench 20. The first direction, the second direction and the third direction are perpendicular to each other. Specifically, the workbench 20 carries the bakelite board 21, the cushion plate 22 and the circuit board 23 which are stacked in sequence. The spindle 11 and the secondary grating part 13 are arranged on the spindle assembly 10. A forming processing method is applied in the circuit board forming device, which comprises the following steps: detecting a first height H1 of the circuit board at the forming position; obtaining a first depth D1 of the forming position, and processing a blind groove on the circuit board based on the first depth D1; detecting a second height H2 of the bottom of the blind groove; determining a second depth D2 of the blind groove according to the first height H1 and the second height H2; and controlling the forming processing circuit board according to the comparison result of the first depth D1 and the second depth D2. The circuit board forming processing device and the forming processing method can detect the height at the same position, process the blind groove, determine the actual depth value of the blind groove, compare the actual depth value with the theoretical depth value, and prompt, compensate and adjust the actual processing depth of the blind groove, thereby improving the accuracy of the forming depth control and providing the detection efficiency of the depth control.

[0071] In the embodiment, as shown in the figure, Figure 3 The spindle assembly 10 is provided with a primary grating ruler, which can obtain the position of the spindle in the third direction in real time. A side of the spindle 11 is fixedly provided with a side shaft, and the side shaft is provided with a secondary grating part 13. The secondary grating part 13 comprises a grating ruler 131 and a detection body 132. In the third direction, the bottom end of the detection body 132 faces the circuit board 23 on the workbench 20, and the other end of the detection body 132 is slidably connected to the grating ruler. The detection body 132 abuts against the circuit board or the bottom of the blind groove. The circuit board 23 blocks the movement of the detection body 132, and the reading on the grating ruler 131 no longer changes and stabilizes around a fixed value. The control system receives the value fed back by the grating ruler 131 and records it as the height of the bottom end of the detection body 132. At this time, the bottom end of the detection body 132 and the upper surface of the circuit board 23 are at the same height, and the height of the bottom end of the detection body 132 is also the first height of the upper surface of the circuit board 23. In the embodiment, the detection body 132 can be realized as a pin.

[0072] In the embodiment, as shown in the figure, Figure 5 The workbench 20 is stacked with the bakelite board 21, the cushion plate 22 and the circuit board 23, and the three are fixed on the workbench 20 by the pressing plate assembly. As shown in the figure, Figure 4As shown, the circuit board 23 includes multiple forming positions 231, and a blind groove 24 is processed at each forming position 231. The blind groove 24 is a circular non-through groove and has a bottom 241.

[0073] A forming process method is applied in circuit board forming equipment, which specifically includes the following steps:

[0074] S110: Detects the first height of the circuit board at the forming position.

[0075] In this embodiment, the secondary grating section 13 on the control spindle assembly 10 detects the first height of the circuit board. On the circuit board 23, as... Figure 4 As shown, a point Q is selected from multiple forming positions 231. Based on this determined position Q, the spindle assembly 10 and the worktable 20 are controlled to move relative to each other until the detection body 132 on the spindle assembly 10 moves above point Q. The spindle assembly 10 is controlled to move along a third direction, and the detection body 132 moves toward the circuit board 23 along with the spindle assembly 10 until the bottom end of the detection body 132 abuts against the upper surface of the circuit board 23. The reading of the grating ruler 131 is linked to the movement distance of the detection body. The circuit board 23 blocks the movement of the detection body 132, and the reading on the grating ruler 131 no longer changes and stabilizes near a fixed value. The control system receives the value fed back by the grating ruler 131 and records it as the height of the bottom end of the detection body 132. At this time, the bottom end of the detection body 132 and the upper surface of the circuit board 23 are at the same horizontal height, and the height of the bottom end of the detection body 132 is also the first height H1 of point Q on the upper surface of the circuit board 23. This method, which uses the detector 132 to abut against the surface of the circuit board and the grating ruler reading no longer changes to obtain the first height, can simply and efficiently detect the first height H1 of any forming position Q point relative to the reference position worktable 20.

[0076] S120: Obtain the first depth of the forming position, and process a blind groove on the circuit board based on the first depth of the forming position.

[0077] After detecting the first height H1, a blind groove needs to be machined. Control the relative movement of the spindle assembly 10 and the worktable 20 until the tool held by the spindle assembly 10 moves above point Q. For example... Figure 6 As shown, the spindle assembly 10 moves along a third direction toward the circuit board 23, and the tool processes a blind groove 24. The diameter of the blind groove is related to the diameter of the tool; a tool of a suitable diameter is selected to process a blind groove of a predetermined diameter. The depth of the blind groove is related to the distance the tool moves along the third direction. The blind groove has a predetermined theoretical depth, a first depth D1. The spindle assembly 10 moves a predetermined distance along the third direction, and based on the preset first depth D1, the blind groove 24 is processed at point Q on the circuit board 23.

[0078] S130: Detect the second height of the bottom of the blind slot.

[0079] like Figure 6 As shown, after forming the blind groove 24, the second height of the bottom of the blind groove 24 is detected. The spindle assembly 10 and the worktable 20 are controlled to move relative to each other until the probe 121 on the spindle assembly 10 moves to point Q. The spindle assembly 10 is controlled to move in a third direction, and the detection body 132 moves toward the circuit board 23 along with the spindle assembly 10 until the bottom end of the detection body 132 abuts against the bottom 241 of the blind groove 24. The reading of the grating ruler 131 is linked to the moving distance of the detection body. The circuit board 23 blocks the movement of the detection body 132, and the reading on the grating ruler 131 no longer changes and stabilizes near a fixed value. The control system receives the value fed back by the grating ruler 131 and records it as the height of the bottom end of the detection body 132. At this time, the bottom end of the detection body 132 and the bottom 241 of the hole are at the same horizontal height, and the height of the bottom end of the detection body 132 is also the second height H2 of the bottom 241 of the blind groove. This method, which uses the detector 132 to contact the bottom of the blind groove and the grating ruler reading no longer changes to obtain the second height, detected the second height H2 of the bottom 241 of the blind groove.

[0080] S140: Determine the second depth of the blind slot based on the first height and the second height.

[0081] In the third direction, after detecting the first height H1 and the second height H2, the second depth D2 of the blind slot is determined based on the difference between the first height H1 and the second height H2. Typically, the first height H1 is the height of the top of the blind slot, and the second height H2 is the height of the bottom of the blind slot. Relative to the worktable 20, the first height H1 is greater than the second height H2. The actual second depth D2 of the blind slot 24 is determined based on the difference between the first height H1 and the second height H2.

[0082] S150: Based on the comparison results of the first depth and the second depth, control the forming and processing of the circuit board.

[0083] In the embodiment, when the second depth D2 is within the threshold range of the first depth D1, the circuit board forming equipment is controlled to form and process the circuit board according to the first depth D1 ; when the second depth D2 exceeds the threshold range of the first depth D1 and is greater than the first depth D1, the control system of the circuit board forming equipment sends a prompt information, and the technician can reverse compensate the first depth D1 according to the prompt information and form and process the circuit board based on the compensated first depth; when the second depth D2 exceeds the threshold range of the first depth D1 and is less than the first depth D1, the control system of the circuit board forming equipment sends a prompt information, and the technician can control the spindle assembly to continue processing the blind slot in the third direction until the depth of the blind slot is within the threshold range of the first depth D1. Specifically, when the second depth D2 is within the threshold range of the first depth D1, it indicates that the second depth D2 meets the expectation and belongs to the normal blind slot depth, and the circuit board forming equipment is controlled to form and process other circuit boards according to the first depth D1. When the second depth D2 exceeds the threshold range of the first depth D1 and is greater than the first depth D1, the circuit board forming equipment sends an alarm, and the display screen outputs a prompt information box to prompt the technician to reverse compensate the first depth D1. Specifically, a compensation value D4 is set, when D2 is greater than D1, the depth of the blind slot exceeds the standard, and the difference between D1 -D4 is taken as a new theoretical depth (D1 -D4) of the blind slot, and the blind slot of other circuit boards is formed and processed according to (D1 -D4). When the second depth D2 exceeds the threshold range of the first depth D1 and is less than the first depth D1, the depth of the blind slot is insufficient, the circuit board forming equipment sends an alarm, and the display screen outputs a prompt information box to prompt the technician to control the spindle assembly to continue processing the blind slot in the third direction until the depth of the blind slot is within the threshold range of the first depth D1. In the embodiment, the compensation value D4 is less than the absolute value of the difference between the first depth D1 and the second depth D2.

[0084] The circuit board forming equipment and the forming and processing method can detect the height values of the circuit board and the blind slot at the same position by using the probe assembly arranged on the spindle assembly, determine the actual depth value of the blind slot by using the height difference between the two, compare the actual depth value with the theoretical depth value, and prompt, compensate and adjust the processing depth of the blind slot. The circuit board forming and processing equipment can automatically detect the depth of each blind slot on the circuit board, prompt, compensate and adjust the depth value, improve the accuracy of the forming and depth control, and improve the detection and processing efficiency.

[0085] Application scenario three

[0086] In the embodiment, the circuit board forming equipment has six spindle assemblies, and the detection method uses the probe assembly and the residual thickness method. The specific application scenarios and implementation processes of the circuit board forming and processing method and the circuit board forming equipment will be described in detail below with reference to the drawings.

[0087] In the embodiment, the structure of the circuit board forming equipment is the same as that of the first embodiment, as shown in Figure 1 ,Figure 2 , Figure 4 As shown, details will not be repeated here. The difference lies in the circuit board forming process; in this embodiment, a probe assembly and a residual thickness method are used to detect the depth. A forming inspection method is applied in the circuit board forming equipment, specifically including the following steps:

[0088] S210: Detect the third height of the pad at the forming position;

[0089] In this embodiment, the probe assembly 12 on the spindle assembly 10 is controlled to detect the third height of the pad 22. For example... Figure 4 , 7 As shown, on the pad 22 without the superimposed circuit board, a point M is selected from multiple forming positions 231. Based on this determined position M, the spindle assembly 10 and the worktable 20 are controlled to move relative to each other until the probe 121 on the spindle assembly 10 moves above point M. The spindle assembly 10 is controlled to move in a third direction, and the probe 121 moves toward the pad 22 along with the spindle assembly 10 until the tip of the probe 121 abuts the upper surface of the pad 22. The distance data fed back by the first-level grating ruler on the spindle assembly 10 is linked with the pressure data of the pressure sensor 122. The control system captures the reading of the first-level grating ruler when the gripping pressure value reaches G3, and converts it as the third height of the tip of the probe 121. Since the tip of the probe 121 and the upper surface of the pad 22 are at the same horizontal height, the third height of the tip of the probe 121 is also the third height H3 of the upper surface of the pad 22. This method, which uses the probe assembly 12 to abut against the surface of the pad 22 and the pressure of the pressure sensor to reach the preset value G3 to obtain the third height, can simply and efficiently detect the third height H3 of any forming position M relative to the reference position stage 20.

[0090] S220: Obtain the first depth of the forming position, and process a blind groove on the circuit board based on the first depth of the forming position.

[0091] Similar to step S20, after detecting the third height H3, a blind slot needs to be machined. For example... Figure 8 As shown, circuit board 23 is placed on pad 22. The spindle assembly 10 and worktable 20 are moved relative to each other until the tool held by the spindle assembly 10 moves above point M. The spindle assembly 10 is then moved along a third direction towards circuit board 23, and the tool machined a blind groove 24. The shape of the blind groove is related to the shape and diameter of the tool; a suitable type of tool is selected to machine a blind groove of a predetermined shape. The depth of the blind groove is related to the distance the tool moves along a third direction. The blind groove has a predetermined theoretical depth, a first depth D1. The spindle assembly 10 moves a predetermined distance along the third direction, and based on the preset first depth D1, the blind groove 24 is machined at point M on circuit board 23.

[0092] S230: Detect the fourth height of the bottom of the blind slot;

[0093] After the blind slot 24 is formed, the fourth height of the bottom of the blind slot 24 is detected. The spindle assembly 10 and the worktable 20 are controlled to move relative to each other until the probe 121 on the spindle assembly 10 moves to the M point. The spindle assembly 10 is controlled to move in the third direction, and the probe 121 moves toward the circuit board 23 along with the spindle assembly 10 until the tip of the probe 121 abuts against the bottom 241 of the blind slot 24. The distance data fed back by the primary grating ruler on the spindle assembly 10 is linked with the pressure data of the pressure sensor 122, and the control system captures the reading of the primary grating ruler when the pressure value reaches G4, which is converted to the fourth height of the tip of the probe 121. Since the tip of the probe 121 and the bottom 241 of the blind slot have the same height, the fourth height H4 of the bottom 241 of the blind slot is fed back using the height of the tip of the probe 121, as shown in FIG. 4. This method of using the probe assembly 12 to abut against the bottom of the blind slot and using the pressure sensor to reach a preset pressure value G4 to obtain the fourth height detects the fourth height H4 of the bottom 241 of the blind slot. Figure 8

[0094] S240: According to the third height and the fourth height, the actual residual thickness of the blind slot is determined.

[0095] In the third direction, after the third height H3 and the fourth height H4 are detected, the actual residual thickness D3 of the blind slot is determined according to the difference between the third height H3 and the fourth height H4. Generally, as shown in FIG. 3, the third height H3 is the height of the bottom of the residual thickness, and as shown in FIG. 4, the fourth height H4 is the height of the top of the residual thickness of the blind slot. The third height H3 is smaller than the fourth height H4 with respect to the worktable 20. According to the difference between the fourth height H4 and the third height H3, the actual residual thickness D3 of the residual thickness of the blind slot is determined. Figure 7 Figure 8

[0096] S250: Based on the first depth, the theoretical residual thickness of the blind slot is determined, and according to the comparison result of the theoretical residual thickness and the actual residual thickness, it is judged whether the depth of the blind slot is qualified.

[0097] ​​​In the embodiment, based on the first depth D1 of the blind slot, the theoretical thickness of the circuit board can be combined to calculate the theoretical residual thickness of the blind slot. After determining the actual residual thickness D3 of the blind slot in S240, the actual residual thickness D3 of the blind slot is compared with the theoretical residual thickness of the blind slot. When the actual residual thickness D3 is within the threshold range of the theoretical residual thickness, it is judged that the actual residual thickness D3 is qualified, and it also indicates that the actual depth of the blind slot is qualified. When the actual residual thickness D3 exceeds the threshold range of the theoretical residual thickness, it is judged that the actual residual thickness D3 is unqualified, and it also indicates that the actual depth of the blind slot is unqualified, and the control system of the circuit board forming equipment sends a prompt information. In the case that the actual residual thickness D3 is unqualified and less than the theoretical residual thickness, an alarm and a prompt box are output, prompting the technician to compensate and adjust the residual thickness. A compensation value can usually be set, and the compensation value is compensated into the movement distance of the main shaft assembly 10 along the third direction for machining the blind slot, so as to reduce the movement distance, thereby increasing the actual residual thickness of the blind slot, and achieving the purpose of compensating and adjusting the depth of the blind slot. In the case that the actual residual thickness D3 is unqualified and greater than the theoretical residual thickness, it indicates that the residual thickness is out of tolerance, and the circuit board forming equipment outputs an alarm and a prompt box, prompting the technician to control the main shaft assembly to clamp the tool to continue machining to reduce the residual thickness until the residual thickness is within the threshold range of the actual residual thickness.

[0098] This method of detecting the depth of the blind slot and judging the depth of the blind slot by using the residual thickness method and the probe assembly can also automatically detect the depth of each blind slot on the circuit board, compensate and adjust the depth value, improve the accuracy of the depth control during forming, and improve the detection and machining efficiency.

[0099] In the embodiments of the present disclosure, the depth of the blind slot is compensated or adjusted. Here, the compensation, adjustment or fine adjustment refers to fine adjustment according to the deviation between the actual value and the theoretical value. The adjustment range is usually microns. Since the assembly and machining precision of the circuit board forming equipment is high, the actual deviation that needs to be adjusted may be 20 microns, 10 microns or even a few microns. Precise detection, compensation and adjustment of the depth of each blind slot can effectively improve the machining precision.

[0100] The above has described the various disclosures of the present disclosure. The above description is exemplary and is not exhaustive, and is not limited to the disclosed disclosures. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described disclosures. The selection of terms used herein is intended to best explain the principles, practical applications or improvements in the art of the technology, or to enable other ordinary skilled persons in the art to understand the disclosures disclosed herein. The scope of the present disclosure is defined by the appended claims.

Claims

1. A method of forming a circuit board, comprising: The method comprises the following steps: detecting a first height of a circuit board at a molding position; obtaining a first depth of the molding position, and processing a blind slot at the molding position based on the first depth; detecting a second height of a bottom of the blind slot; and determining a second depth of the blind slot according to the first height and the second height; controlling the molding processing of the circuit board according to a comparison result of the first depth and the second depth.

2. The method according to claim 1, wherein The detecting of the first height of the circuit board at the molding position comprises the following steps:

3. The method according to claim 2, wherein controlling a probe assembly or a secondary grating part on a spindle assembly to detect the first height of the circuit board at the molding position.

4. The method according to claim 1, wherein The probe assembly abuts against a surface of the circuit board at the molding position, and the first height of the circuit board is obtained when a pressure reaches a preset value.

5. The method according to claim 4, wherein The detecting of the second height of the bottom of the blind slot comprises the following steps:

6. The method according to claim 1, wherein controlling a probe or a detection body to extend into the blind slot and abut against the bottom of the blind slot to detect the second height of the bottom of the blind slot.

7. The method according to claim 1, wherein The probe or the detection body abuts against the bottom of the blind slot, and the second height of the bottom of the blind slot is obtained when a pressure reaches a preset value.

8. A method of inspecting a circuit board shape, characterized by, The determining of the second depth of the blind slot according to the first height and the second height comprises the following steps: determining the second depth of the blind slot according to a difference between the first height and the second height in a third direction. The controlling of the molding processing of the circuit board according to the comparison result of the first depth and the second depth comprises the following steps: controlling the molding processing of the circuit board according to the first depth when the second depth is within a threshold range of the first depth. The method comprises the following steps:

9. A circuit board forming apparatus characterized by comprising: detecting a third height of a backing plate at a molding position; obtaining a first depth of the molding position, and processing a blind slot at the molding position of a circuit board based on the first depth; detecting a fourth height of a bottom of the blind slot; and determining an actual residual thickness of the blind slot according to the third height and the fourth height; determining a theoretical residual thickness of the blind slot based on the first depth, and judging whether the depth of the blind slot is qualified according to a comparison result of the theoretical residual thickness and the actual residual thickness. The method comprises the following steps: a workbench moves along a first direction on a base, and the workbench carries a bakelite plate, a backing plate and a circuit board which are stacked in sequence; a spindle assembly slides on a cross beam and moves along a second direction, and a detection assembly is arranged on the spindle; 10. The circuit board forming apparatus according to claim 9, wherein controlling the detection assembly to detect a first height of a molding position of the circuit board on the workbench; obtaining a first depth of the molding position, and processing a blind slot at the molding position based on the first depth; controlling the detection assembly to detect a second height of a bottom of the blind slot; determining a second depth of the blind slot according to the first height and the second height, and controlling the molding processing of the circuit board along a third direction according to a comparison result of the first depth and the second depth; the first direction, the second direction and the third direction are perpendicular to each other. The detection assembly comprises a probe assembly or a secondary grating part, and the detection assembly abuts against a surface of the circuit board and obtains the first height of the circuit board when a pressure reaches a preset value in the third direction.

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