High-frequency signal detection device

Abstract

The invention discloses a high-frequency signal detection device. The high-frequency signal detection device comprises a probe seat, a pair of grounding probes and at least one signal probe, wherein a pair of first mounting parts and at least one second mounting part are correspondingly arranged in the probe seat according to an element to be detected, the pair of first mounting parts are positioned on two outer sides of the second mounting part, and each grounding probe is mounted in each first mounting part and can capture at least one grounding signal after being in contact with the element to be detected. The signal probe is installed in the second installation part, and the signal probe has a design capable of reducing a dielectric constant, and can capture a high-frequency signal after being contacted with the element to be detected. Therefore, signal reflection loss caused by group reactance mismatching during application is reduced through the special design of the signal probe, so that the accuracy of bandwidth detection is improved.

Description

Technical Field

[0001] This invention relates to the field of electrical detection devices, and more particularly to a high-frequency signal detection device with an adjustable dielectric constant design to reduce signal reflection loss caused by impedance mismatch during application, thereby improving the accuracy of the detection bandwidth. Background Technology

[0002] With the advancement of integrated circuit technology, the size of semiconductor chips has also decreased. In addition to the smaller spacing of the corresponding probes, the measurement frequency must also be increased to meet the chip's requirements. This is especially true for high-speed networks, such as those requiring high-speed computation like the Internet of Things (IoT) or 5G mobile network signals. These require electrical testing equipment capable of detecting high-frequency signals. Traditionally, semiconductor chips are tested using an electrical connector with multiple electrical (signal) probes arranged at equal intervals inside. These probes contact the electrical pads of the semiconductor under test, and the correctness of the electrical signal is analyzed by the signal transmission after contact to obtain the test results. However, the electrical probes used in traditional electrical connectors are no longer sufficient. Currently, high-frequency probe cards are mostly used, which consist of a substrate and multiple probes. Their usage is the same as that of ordinary electrical probes; they test the signal transmitted from electrical testing equipment by generating uniform deformation and stress upon contact with the solder pads. For example, US patents US7,656,175 "Inspection Unit" and US4,724,180 "Electrically Shielded Connectors" are both high-frequency probe card structures with substrates. However, assembling these substrates presents alignment problems, which severely affect the detection of high-frequency signals and are quite difficult for assembly personnel. Furthermore, substrates using flexible circuit boards have a dissipation factor. The high signal factor (DF) of high-frequency probe cards is a significant drawback. Current designs primarily use a vertical transmission method to minimize signal loss during transmission, resulting in shorter transmission distances and greater attenuation of high-frequency signals. Furthermore, when used for high-bandwidth signal testing, the probe holder or connector must effectively shield against transmission noise. However, current probe holder and connector structures cannot achieve a good balance between insulation and impedance matching, thus compromising accuracy for high-bandwidth signal testing. In addition to these issues, interference during signal transmission and probe impedance matching during measurement also contribute to errors. Therefore, overcoming the challenges of transmitting high-frequency signals without increasing signal noise, avoiding external interference, and significantly reducing probe and pad damage remains a pressing problem.

[0003] For example, Taiwan Invention Patent No. I650561, "Probe Base," discloses an insulating component used in a probe base. The insulating component has a probe mounting hole and is a sheet-like structure with multiple through holes. The probe mounting hole is located at the center of the insulating component. The probe mounting hole and the through holes extend from a first surface to a second surface of the insulating component, respectively. The areas on the first and second surfaces without the probe mounting hole and through holes are coplanar. The probe base has a base body and at least one composite component. The base body has at least one detection area, and the composite component is disposed within the detection area and has at least one pinhole for mounting a probe. The insulating component is disposed within the pinhole to reduce signal reflection loss caused by impedance mismatch during application, thereby improving probe detection efficiency. For example, Taiwan Invention Patent Application No. 111132573, "Probe Device for High-Frequency Signal Testing," discloses a device including a signal shielding housing and at least two probes. The signal shielding housing contains at least two parallel cylindrical receiving spaces, which are interconnected and have at least a distance between them. Each cylindrical receiving space forms a through hole on each of its two opposing surfaces relative to the signal shielding housing, allowing a test end and a telescopic end at each end of the probe to pass through these through holes. A distance is provided between each probe and the inner wall of the cylindrical receiving space. Changing this distance and its dimensions allows adjustment of the required matching impedance. Accordingly, the test end and the telescopic end respectively contact a test object and an electrical connector to transmit high-frequency signals and shield against interference during transmission to reduce detection errors.

[0004] In view of this, as the bandwidth required for high-frequency signal testing is increasing, the inventors have further designed the high-frequency signal detection device of the present invention based on the many shortcomings and imperfections of the above-mentioned conventional technologies. The signal probe and the housing are provided with an appropriate gap to adjust the dielectric constant design. After contacting the device under test, a high-frequency signal can be captured, reducing signal reflection loss caused by impedance mismatch during application, thereby improving the accuracy of the detection bandwidth. Summary of the Invention

[0005] The present invention aims to provide a high-frequency signal detection device, comprising a probe holder, a pair of ground probes, and at least one signal probe. The probe holder has independent mounting areas corresponding to the pair of ground probes and the signal probe, arranged according to the electrical configuration of a device under test (DUT). Upon contact with the DUT, it can capture at least one ground signal and one high-frequency signal. An appropriate gap is provided between the body of the signal probe and a housing to allow for adjustment of the dielectric constant during detection, thereby reducing signal reflection loss caused by impedance mismatch and improving the accuracy of the detection bandwidth.

[0006] To achieve the above objectives, the present invention provides a high-frequency signal detection device, comprising: a probe holder, wherein a pair of first mounting portions and at least one second mounting portion are disposed inside the probe holder according to a device under test, and two pairs of first through holes are formed on two symmetrical surfaces of the probe holder corresponding to the corresponding first mounting portions, and a pair of second through holes are formed on the two sides of the second mounting portions, wherein the pair of first mounting portions are located on the two outer sides of the second mounting portions; a pair of grounding probes are respectively installed in each of the first mounting portions, such that the two ends of the pair of grounding probes respectively protrude through the two pairs of first through holes, and can capture at least one grounding signal after contacting the device under test; and at least one signal probe is installed in the second mounting portion, such that the two ends of the signal probe respectively protrude through the pair of second through holes, and the signal probe has a design that can reduce the dielectric constant, and can capture a high-frequency signal after contacting the device under test, thereby reducing signal reflection loss caused by impedance mismatch during application.

[0007] In one embodiment, the probe holder of the present invention is a rectangular structure composed of a first housing and a second housing joined together, and the surfaces of the second through holes are both anodized, and the anodizing process is to form an insulating metal layer by anodizing an aluminum alloy. Furthermore, the grounding probe includes a first body, a first contact end, and a first probe end. The first body is a cylindrical structure corresponding to the diameter of the first mounting portion, and the first contact end and the first probe end are respectively located at the center of both ends of the first body. The first probe end is a four-claw shaped structure with a central concave shape and four pointed points formed at the quarter points. Furthermore, the signal probe of the present invention comprises two insulating rings, a housing, a second body, a second contact end, and a second probe end. The two insulating rings and the housing are combined to form an accommodating space for movably mounting the second body within the accommodating space. An adjustment ring is protruding from the middle of the second body, and the dielectric constant between them is changed by the distance between the adjustment ring and the housing. The second contact end and the second probe end are respectively located at the center of both ends of the second body. The second probe end has a centrally recessed four-claw structure with four sharp points at the quarter points. In addition, the surface area of ​​the adjustment ring is anodized to form a protective layer, which completely prevents surface wear of the adjustment ring when it moves between the two insulating rings, reduces signal loss, and reduces the occurrence of errors.

[0008] In another embodiment, depending on different detection configurations, the probe holder of the present invention also has the following two different configurations: First, the probe holder is provided with a pair of first mounting portions and a second mounting portion, such that the pair of first mounting portions are respectively spaced apart on both sides of the second mounting portion, forming a G(GROUND)-S(SIGNAL)-G(GROUND) detection configuration after installation. Alternatively, the probe holder of the present invention is provided with a pair of first mounting portions and two second mounting portions, such that the pair of first mounting portions are respectively spaced apart on both sides of the two second mounting portions, forming a G(GROUND)-S(SIGNAL)-S(SIGNAL)-G(GROUND) detection configuration after installation. Attached Figure Description

[0009] Figure 1 This is an exploded perspective view of a preferred embodiment of the present invention.

[0010] Figure 2 This is a cross-sectional view of the assembled components of a preferred embodiment of the present invention.

[0011] Figure 3 This is a cross-sectional view of another preferred embodiment of the present invention.

[0012] Figure 4 This is a schematic diagram of the state during operation of a preferred embodiment of the present invention.

[0013] Figures 5A to 5F This is a chart showing the changes in detection data after adjusting different spacings according to the present invention.

[0014] Explanation of reference numerals in the attached drawings: 1-High-frequency signal detection device; 11-Probe holder; 111-First mounting part; 1111-First through hole; 112-Second mounting part; 1121-Second through hole; 11211-Insulating metal layer; 113-First housing; 114-Second housing; 12-Grounding probe; 121-First body; 122-First contact end; 123-First probe end; 1231-Tip; 13-Signal probe; 131-Insulating ring; 132-Outer shell; 133-Second body; 1331-Adjusting ring; 134-Second contact end; 135-Second probe end; 1351-Tip; 136-Accommodation space; 2-Component under test. Detailed Implementation

[0015] To ensure a clear understanding of the contents of this invention, please refer to the following description and accompanying drawings.

[0016] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4The figure shows an exploded perspective view of a preferred embodiment of the present invention, a cross-sectional view of the assembled device, another embodiment of the preferred embodiment, and a schematic diagram of its operation. As shown in the figure, the high-frequency signal detection device 1 of the present invention includes a probe holder 11, a pair of ground probes 12, and at least one signal probe 13.

[0017] The probe holder 11 has a pair of first mounting portions 111 and at least one second mounting portion 112 corresponding to a test element 2. Two pairs of first through holes 1111 are formed on the two symmetrical surfaces of the probe holder 11, corresponding to the first mounting portions 111, and a pair of second through holes 1121 are formed on the two outer sides of the second mounting portions 112. It should be noted that the probe holder 11 of this invention is a rectangular structure made of metal, composed of a first housing 113 and a second housing 114 joined together. The surfaces of the pair of second through holes 1121 are anodized, forming an insulating metal layer 11211 by anodizing an aluminum alloy.

[0018] Each grounding probe 12 is installed in each of the first mounting portions 111, with each of the two ends of the grounding probe 12 passing through the two pairs of first through holes 1111 respectively. After contacting the device under test 2, it can capture at least one grounding signal. It should be noted that the grounding probe 12 of the present invention includes a first body 121, a first contact end 122 and a first probe end 123. The first body 121 is a cylindrical structure corresponding to the diameter of the first mounting portion 111. The first contact end 122 and the first probe end 123 are respectively located at the center of both ends of the first body 121. Furthermore, the first probe end 123 has a centrally recessed four-claw shape and four sharp points 1231 formed at the quarter points.

[0019] The signal probe 13 is installed in the second mounting portion 112, with its two ends protruding through the pair of second through holes 1121. The signal probe 13 is designed to reduce the dielectric constant, and upon contact with the device under test 2, it can capture a high-frequency signal to reduce signal reflection loss caused by impedance mismatch during application. It should be noted that the signal probe 13 includes two insulating rings 131, a housing 132, a second body 133, a second contact end 134, and a second probe end 135. The two insulating rings 131 and the housing 132 are combined to form an accommodating space 136, within which the second body 133 is movably installed. An adjustment ring 1331 protrudes from the middle of the second body 133, changing the dielectric constant between them by adjusting the distance between the adjustment ring 1331 and the housing 132. The second contact end 134 and the second probe end 135 are respectively located at the center of both ends of the second body 133. Furthermore, the second probe end 135 is a four-claw structure with a central concave shape, and four sharp points 1351 are formed at the quarter points. In addition, the surface area of ​​the adjustment ring 133 is anodized to form a protective layer, which completely prevents the surface wear of the adjustment ring 133 when it moves between the two insulating rings 131, reduces signal loss and reduces the occurrence of errors.

[0020] Please refer to the following as well. Figure 3 , Figure 4 These are two preferred embodiments of the present invention. Depending on the different detection configurations, the probe holder 11 also has the following two different configurations: First, the probe holder 11 has a pair of first mounting portions 111 and one second mounting portion 112, with the pair of first mounting portions 111 respectively spaced apart on both sides of the second mounting portion 112, forming a G(GROUND)-S(SIGNAL)-G(GROUND) detection configuration after installation. Second, the probe holder 11 has a pair of first mounting portions 111 and two second mounting portions 112, with the pair of first mounting portions 111 respectively spaced apart on both sides of the two second mounting portions 112, forming a G(GROUND)-S(SIGNAL)-S(SIGNAL)-G(GROUND) detection configuration after installation.

[0021] The high-frequency signal detection device of the present invention, through the separation design of the probe holder 11, independently captures the ground signal and the high-frequency signal. Anodizing is applied to a portion of the high-frequency signal capture area (corresponding to the second contact end 134 and the second probe end 135) to produce an insulation effect, reducing signal reflection loss caused by impedance mismatch during application. Furthermore, an adjustment ring 1331 is provided on the second body 133 of the signal probe 13. By changing the thickness and diameter of the adjustment ring 1331 during manufacturing, the distance between it and the outer casing 132 is adjusted. Please refer to the accompanying documentation. Figures 5A to 5F The various charts illustrate the changes in detection data after adjusting different spacings, aiming to alter the dielectric constant during detection and improve the accuracy of the detection bandwidth. Here, IM stands for Impedance; IL for Insertion Loss; and RL for Return Loss. The vertical axis represents the specification range, and the horizontal axis represents the transmission speed. Therefore, from... Figures 5A to 5F As can be seen from the diagram, there is a significant linear difference between the change in spacing and the impedance when the signal is turned on. That is, the larger the spacing, the greater the impedance when the signal is turned on. Furthermore, the insertion loss and return loss decrease, especially in a certain range, as the transmission speed increases.

[0022] However, the above description is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. Therefore, any equivalent or easy changes made by those skilled in the art without departing from the spirit and scope of the present invention should be included within the scope of the present invention.

Claims

1. A high-frequency signal detection device, characterized in that, include: A probe holder has a pair of first mounting portions and at least one second mounting portion disposed inside for a device under test. Two pairs of first through holes are formed on two symmetrical surfaces of the probe holder corresponding to the first mounting portions, and a pair of second through holes are formed on the second mounting portions. The pair of first mounting portions are located on the two outer sides of the second mounting portions. A pair of grounding probes are respectively installed in each of the first mounting portions, with the two ends of the pair of grounding probes passing through the two pairs of first through holes, and after contacting the device under test, at least one grounding signal can be captured. and At least one signal probe is installed in the second mounting part, with the two ends of the signal probe passing through the pair of second through holes respectively. The signal probe has a design that can reduce the dielectric constant. After contacting the device under test, it can capture a high-frequency signal to reduce signal reflection loss caused by impedance mismatch during application.

2. The high-frequency signal detection device as described in claim 1, characterized in that, The probe holder is a rectangular structure composed of a first housing and a second housing joined together, and the surfaces of the pair of second perforations are anodized.

3. The high-frequency signal detection device as described in claim 2, characterized in that, The anodizing process involves anodizing an aluminum alloy to form an insulating metal layer.

4. The high-frequency signal detection device as described in claim 1, characterized in that, The grounding probe includes a first body, a first contact end, and a first probe end. The first body is a cylindrical structure corresponding to the diameter of the first mounting portion, and the first contact end and the first probe end are respectively located at the center of both ends of the first body.

5. The high-frequency signal detection device as described in claim 4, characterized in that, The first probe tip is a four-claw-shaped structure with a central concave shape, and four sharp points are formed at the quarter points.

6. The high-frequency signal detection device as described in claim 1, characterized in that, The signal probe includes two insulating rings, a housing, a second body, a second contact end, and a second probe end. The two insulating rings and the housing are combined to form an accommodating space, in which the second body is movably installed. An adjustment ring is protruding in the middle of the second body, and the dielectric constant between them is changed by the distance between the adjustment ring and the housing. The second contact end and the second probe end are respectively located at the center of both ends of the second body.

7. The high-frequency signal detection device as described in claim 6, characterized in that, The second probe end is a four-claw-shaped structure with a central concave shape, and four sharp points are formed at the quarter points.

8. The high-frequency signal detection device as described in claim 7, characterized in that, The surface area of ​​the adjustment ring is anodized to form a protective layer, which completely prevents surface wear when the adjustment ring moves between the two insulating rings, reduces signal loss and reduces the occurrence of errors.

9. The high-frequency signal detection device as described in claim 1, characterized in that, The probe holder has a pair of first mounting portions and a second mounting portion, such that the pair of first mounting portions are respectively spaced apart on both sides of the second mounting portion.

10. The high-frequency signal detection device as described in claim 1, characterized in that, The probe holder is provided with the pair of first mounting portions and two second mounting portions, such that the pair of first mounting portions are respectively spaced apart on both sides of the two second mounting portions.

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