Semiconductor device processing device with detection function

Abstract

The invention discloses a semiconductor device processing device with a detection function, which belongs to the technical field of semiconductor device processing and comprises a machine body and an ultrasonic cleaning tank arranged at the top in the machine body. Leaking holes are uniformly formed in the positions, corresponding to the lower portions of the wafers in the flower basket, of the bottom of the ultrasonic cleaning tank, all the wafers are independently separated in cooperation with the separating mechanism on the cover plate, and high-purity water precise flushing after ultrasonic cleaning is achieved in combination with the spraying mechanism; the sample extraction mechanism and the sample conveying mechanism can extract a cleaning liquid sample on line, detection of pollutants such as metal ions is directly completed through the inductively coupled plasma mass spectrometer, pollution detection can be completed without taking out a wafer, the necessary air drying step and the wafer transfer link in a traditional process are thoroughly omitted, and the detection efficiency is improved. The whole process period from cleaning to detection is greatly shortened, the risk of secondary pollution is eliminated from the source, and the accuracy and reliability of a detection result are ensured.

Description

TECHNICAL FIELD

[0001] The application relates to a processing device, in particular to a processing device with a detection function for semiconductor devices, and belongs to the technical field of semiconductor device processing. BACKGROUND

[0002] In the process of manufacturing semiconductor devices, the contaminants (such as particles, metal ions, organic matter, etc.) on the surface of a wafer will directly affect the yield and performance of the devices, so wafer cleaning is a crucial process step. Ultrasonic cleaning technology can strip the tiny contaminants on the surface of a wafer through liquid medium by virtue of its high-efficiency cavitation effect and vibration energy, and is widely used in the precision cleaning process of semiconductor wafers.

[0003] At present, in the actual production of ultrasonic cleaning devices, the wafer needs to be taken out from the flower basket after cleaning, dried by air, and then transferred to a detection device (such as TXRF, ICP-MS, etc.) for pollution ion detection. This process has obvious drawbacks: on the one hand, the air drying step will prolong the process cycle and reduce the production efficiency, and in the transfer process, secondary pollution may be introduced, resulting in distorted detection results; on the other hand, since the pollution ion concentration data in the cleaning process cannot be obtained in real time, it is difficult to dynamically adjust the cleaning parameters (such as ultrasonic power, cleaning time, cleaning agent concentration, etc.) according to the pollution residue, and only the preset process parameters can be relied on for cleaning, which may cause over-cleaning or insufficient cleaning problems, thereby affecting the yield and manufacturing cost of the wafer; in addition, in the process of cleaning, the flower basket is in direct contact with the surface of the wafer (such as clamping by a clamping groove, and adhesion by a support point), which will form a large area of shielding area on the surface of the wafer. These shielding areas not only hinder the effective transmission of ultrasonic energy, resulting in weakened cavitation effect, but also make it difficult to completely remove the contaminants, forming a "cleaning blind area" and affecting the cleaning rate.

[0004] Therefore, a processing device with a detection function for semiconductor devices is designed to optimize the above problems. SUMMARY

[0005] The main purpose of the present application is to provide a kind of processing device for semiconductor device with detection function, by corresponding wafer in basket bottom of ultrasonic cleaning tank evenly set leak hole in the lower position, cooperate with the separation mechanism on cover plate, each wafer is independently separated, then combined with spray mechanism realizes the high purity water precision flushing after ultrasonic cleaning, in this process, sample extraction mechanism and sample delivery mechanism can be extracted cleaning fluid sample on line, directly through inductively coupled plasma mass spectrometer to complete the detection of metal ions and other pollutants, this design can complete pollution detection without taking out wafer, completely eliminates the necessary drying step and wafer transfer link in traditional process, greatly shortens the overall process cycle from cleaning to detection, significantly improves production efficiency, while avoiding the contact of wafer and external environment, from the root, eliminates the risk of secondary pollution, ensures the accuracy and reliability of detection result, the sample delivery mechanism is composed of conveying motor, conveying screw, sliding block, peristaltic pump, sampling cannula, slide, guide block and corrugated chute, when conveying motor drives peristaltic pump to move horizontally, under the guidance of corrugated chute to guide block, sampling cannula can be automatically inserted into the cup when reaching the middle position of sampling cup, the structure realizes the automatic control of sample extraction, convenient and efficient operation, effectively improves the practicability and operating stability of the device, by setting groove in the end of basket, cooperate with rotating mechanism composed of rotating rod, guide roller, driven gear, rotating motor and driving gear, during cleaning process, guide roller supports wafer, and through motor drive realizes continuous rotation of wafer, constantly changes the contact position of wafer outside and guide roller, this design ensures that each area of wafer surface can uniformly receive high-frequency vibration energy transmitted by ultrasonic transducer, makes cavitation effect act on the whole surface of wafer, completely eliminates the cleaning blind area caused by traditional basket contact, and during high-purity water flushing process, rotating action can further improve flushing uniformity, significantly optimizes cleaning effect.

[0006] The object of the present application can be achieved by adopting the following technical solutions: A processing device for semiconductor device with detection function, comprising a machine body, an ultrasonic cleaning tank opened in the top of the machine body, a cover plate covering the top of the ultrasonic cleaning tank, a basket placed inside the ultrasonic cleaning tank for receiving wafers, and an ultrasonic transducer installed at the bottom of the ultrasonic cleaning tank. The cover plate is provided with a separation mechanism, which can extend into the ultrasonic cleaning tank and separate the wafers in the basket. One side of the machine body is provided with a flushing box connected with the cover plate through a spraying mechanism, and the output end of the spraying mechanism corresponds to the wafers on the basket. The bottom of the ultrasonic cleaning tank is provided with a leak hole corresponding to the lower position of the wafers on the basket, and the bottom of the machine body is provided with a mounting bin, and the inside of the mounting bin is provided with a recovery box. The outer side of the recovery box is uniformly provided with sampling cups at positions corresponding to the positions of the leakage holes, and the top of each sampling cup is provided with a sample extraction mechanism in communication with the waste discharge pipe and the inside of the flushing box; A discharge pipe is arranged between the bottom of each sampling cup and the recovery box, and a third electromagnetic valve is arranged on the discharge pipe. A sample delivery mechanism is arranged on the side of the recovery box, and the input end of the sample delivery mechanism corresponds to the sampling cup. A rotating mechanism is arranged in the flower basket to drive the wafer to rotate.

[0007] Preferably, the separation mechanism comprises a flat plate, a partition plate, a guide groove and a lifting assembly, the flat plate is horizontally arranged on the top of the cover plate, a plurality of partition plates are arranged at intervals on the bottom of the flat plate, the partition plates are vertically and slidably connected between the cover plate and the flat plate, guide grooves are vertically and uniformly arranged on the two sides of the flower basket and matched with the partition plates, and the top of the cover plate is provided with a lifting assembly for controlling the vertical movement of the flat plate.

[0008] Preferably, the lifting assembly comprises a bracket, a lifting motor and a lifting screw rod, the bracket is symmetrically fixed on the two sides of the top of the flower basket, the lifting motor is installed on the top end of the bracket, the output end of the lifting motor is vertically connected with the lifting screw rod, and the lifting screw rod is threadedly connected with the flat plate.

[0009] Preferably, the spraying mechanism comprises a first water pump, a conveying pipe, a spraying pipe and a second electromagnetic valve, the input end of the first water pump is in communication with the inside of the flushing box, the output end of the first water pump is connected with the conveying pipe, the conveying pipe extends into the inside of the cover plate, the conveying pipe is uniformly connected with the spraying pipes along the width direction of the cover plate, the spraying pipes correspond to the upper side of the wafer on the flower basket, the end of the spraying pipe is provided with the second electromagnetic valve, and the bottom of the spraying pipe is provided with a fan-shaped spray head.

[0010] Preferably, the sample extraction mechanism comprises a shunt pipe, a fourth electromagnetic valve, a second water pump, a backflushing pipe and a fifth electromagnetic valve, the top end of the shunt pipe is in communication with the waste discharge pipe, the bottom end of the shunt pipe extends into the inside of the sampling cup, the fourth electromagnetic valve is installed on the shunt pipe, the input end of the second water pump is in communication with the flushing box, the output end of the second water pump is provided with the backflushing pipe, and the bottom of the backflushing pipe is in communication with the shunt pipe through the fifth electromagnetic valve.

[0011] Preferably, the sample delivery mechanism comprises a conveying motor, a conveying screw rod, a sliding block, a peristaltic pump, a sampling cannula and an insertion assembly, the conveying motor is installed on the side of the recovery box, the output end of the conveying motor is connected with the conveying screw rod, the conveying screw rod is threadedly connected with the sliding block, the peristaltic pump is installed on the sliding block, the input end of the peristaltic pump is connected with the sampling cannula, the output end of the peristaltic pump is connected with the inductively coupled plasma mass spectrometer, and the sliding block is provided with an insertion assembly for controlling the vertical movement of the sampling cannula and the contact between the sampling cannula and the water sample in the sampling cup.

[0012] Preferably, the insertion assembly comprises a slide rod, a guide block and a corrugated slide groove; the slide rod is vertically and slidably arranged on the slide block; the outer side of the recovery box is provided with the corrugated slide groove along the length direction; the guide block is slidably arranged in the corrugated slide groove; the guide block is fixedly connected with the slide rod; the distance between adjacent wave crests of the corrugated slide groove is consistent with the distance between the sampling cups.

[0013] Preferably, the rotating mechanism comprises a groove, a rotating rod, a guide roller and a driving assembly; the groove is arranged at the end of the flower basket; the rotating rod is rotatably arranged on the two sides of the flower basket along the length direction; a plurality of guide rollers are arranged on the rotating rod at intervals; one end of the rotating rod extends into the groove; the bottom of the ultrasonic cleaning tank is provided with the driving assembly for controlling the rotation of the rotating rod.

[0014] Preferably, the driving assembly comprises a driven gear, a rotating motor and a driving gear; one end of the rotating rod located in the groove is provided with the driven gear; the bottom of the ultrasonic cleaning tank is provided with the rotating motor; the output end of the rotating motor is provided with the driving gear engaged with the driven gear; the bottom of the ultrasonic cleaning tank is provided with two positioning pins corresponding to the position of the groove; the bottom of the flower basket is provided with matching positioning holes.

[0015] Preferably, the length of the sampling cannula is matched with the depth of the sampling cup; and the sampling cannula can be inserted into the interior of the sampling cup through the guidance of the corrugated slide groove.

[0016] The beneficial effects of the present application are: The processing device for semiconductor devices with detection function provided by the present application uniformly arranges the leakage holes at the bottom of the ultrasonic cleaning tank corresponding to the positions below the wafers in the flower basket, independently separates each wafer by the separation mechanism on the cover plate, and realizes the accurate flushing of high-purity water after ultrasonic cleaning in combination with the spraying mechanism. In this process, the sample extraction mechanism and the sample delivery mechanism can extract the cleaning liquid sample online, and directly complete the detection of metal ions and other pollutants by inductively coupled plasma mass spectrometer. This design can complete the pollution detection without taking out the wafer, completely eliminates the necessary air-drying step and wafer transfer link in the traditional process, greatly shortens the overall process cycle from cleaning to detection, significantly improves the production efficiency, avoids the contact of the wafer with the external environment, eliminates the risk of secondary pollution from the root, and ensures the accuracy and reliability of the detection results. The sample delivery mechanism composed of the delivery motor, the delivery screw rod, the slide block, the peristaltic pump, the sampling cannula, the slide rod, the guide block and the corrugated slide groove can make the sampling cannula automatically insert into the cup when reaching the middle position of the sampling cup by the guidance of the corrugated slide groove when the delivery motor drives the peristaltic pump to move horizontally. This structure realizes the automatic control of sample extraction, is convenient and efficient, and effectively improves the practicality and operation stability of the device. By setting a groove at the end of the flower basket, matching the rotating mechanism composed of rotating rod, guide roller, driven gear, rotating motor and driving gear, the wafer is supported by the guide roller during the cleaning process, and the wafer is continuously rotated by the motor drive, the contact position between the wafer outside and the guide roller is changed constantly, which ensures that the wafer surface can uniformly receive the high-frequency vibration energy transmitted by the ultrasonic transducer, so that the cavitation effect acts on the whole surface of the wafer, and the cleaning blind area caused by the traditional flower basket contact is completely eliminated, and in the high-purity water flushing process, the rotating action can further improve the flushing uniformity, and the cleaning effect is significantly optimized. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is an initial state sectional view of a preferred embodiment of the semiconductor device processing device with detection function; Figure 2 It is a cleaning state sectional view of a preferred embodiment of the semiconductor device processing device with detection function; Figure 3 It is an outer structure diagram of a recycling box in a preferred embodiment of the semiconductor device processing device with detection function; Figure 4 It is a sample conveying mechanism diagram in a preferred embodiment of the semiconductor device processing device with detection function; Figure 5 It is a sample extraction mechanism diagram in a preferred embodiment of the semiconductor device processing device with detection function; Figure 6 It is a machine body sectional view of a preferred embodiment of the semiconductor device processing device with detection function; Figure 7 It is a cover plate sectional view of a preferred embodiment of the semiconductor device processing device with detection function; Figure 8 It is a spraying mechanism diagram of a preferred embodiment of the semiconductor device processing device with detection function; Figure 9 It is a flower basket sectional view of a preferred embodiment of the semiconductor device processing device with detection function; Figure 10 It is a rotating mechanism diagram of a preferred embodiment of the semiconductor device processing device with detection function; Figure 11 It is a front view of a preferred embodiment of the semiconductor device processing device with detection function.

[0018] In the figure: 1, machine body; 101, ultrasonic cleaning tank; 102, cover plate; 103, flower basket; 104, ultrasonic transducer; 2. Inductively Coupled Plasma Mass Spectrometer; 3. Leak; 4. Mounting Chamber; 5. Recovery Box; 6. Waste Discharge Pipe; 7. First Solenoid Valve; 8. Separation mechanism; 801. Flat plate; 802. Partition plate; 803. Guide groove; 804. Bracket; 805. Lifting motor; 806. Lifting screw; 9. Rinse box; 10. Sprinkler mechanism; 1001. First water pump; 1002. Delivery pipe; 1003. Sprinkler pipe; 1004. Second solenoid valve; 11. Sampling cup; 1101. Discharge tube; 1102. Third solenoid valve; 12. Sample extraction mechanism; 1201. Diverter tube; 1202. Fourth solenoid valve; 1203. Second water pump; 1204. Backwash tube; 1205. Fifth solenoid valve; 13. Sample conveying mechanism; 1301. Conveying motor; 1302. Conveying screw; 1303. Slider; 1304. Peristaltic pump; 1305. Sampling tube; 1306. Sliding rod; 1307. Guide block; 1308. Corrugated chute; 14. Rotating mechanism; 1401. Groove; 1402. Rotating rod; 1403. Guide roller; 1404. Driven gear; 1405. Rotary motor; 1406. Driving gear. Detailed Implementation

[0019] To enable those skilled in the art to more clearly understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the embodiments and accompanying drawings, but the embodiments of the present invention are not limited thereto.

[0020] Example 1:

[0021] like Figures 1-11 As shown, this embodiment provides a semiconductor device processing apparatus with detection function, including a body 1, an ultrasonic cleaning tank 101 opened in the top of the body 1, a cover plate 102 covering the top of the ultrasonic cleaning tank 101, a basket 103 placed inside the ultrasonic cleaning tank 101 for receiving wafers, and an ultrasonic transducer 104 installed at the bottom of the ultrasonic cleaning tank 101. The cover plate 102 is provided with a separating mechanism 8, which can extend into the ultrasonic cleaning tank 101 and separate the wafers in the basket 103 from each other. A rinsing box 9 is provided on one side of the machine body 1. The rinsing box 9 is connected to the cover plate 102 through the spray mechanism 10, and the output end of the spray mechanism 10 is set to correspond to the wafer on the flower basket 103. The bottom of the ultrasonic cleaning tank 101 is provided with a plurality of drain holes 3 corresponding to the positions below the wafers on the basket 103, the bottom of the machine body 1 is provided with a mounting bin 4, the inside of the mounting bin 4 is provided with a recovery tank 5, the bottom of each drain hole 3 is provided with a waste pipe 6, and the first electromagnetic valve 7 is installed on the waste pipe 6; The outside of the recovery tank 5 is uniformly provided with a sampling cup 11 corresponding to the position of the drain hole 3, and the top of the sampling cup 11 is provided with a sample extraction mechanism 12 in communication with the inside of the waste pipe 6 and the flushing tank 9; The bottom of the sampling cup 11 is provided with a discharge pipe 1101 between the sampling cup 11 and the recovery tank 5, and the third electromagnetic valve 1102 is installed on the discharge pipe 1101; The side of the recovery tank 5 is provided with a sample delivery mechanism 13, the input end of the sample delivery mechanism 13 corresponds to the sampling cup 11, and the output end of the sample delivery mechanism 13 is connected with the inductively coupled plasma mass spectrometer 2; The inside of the basket 103 is provided with a rotating mechanism 14 for driving the wafer to rotate.

[0022] The total working principle is that the wafers to be cleaned are placed in the basket 103, then the basket 103 is placed in the ultrasonic cleaning tank 101, the cover plate 102 is covered, the partition mechanism 8 is started, the partition plate 802 is inserted into the basket 103, the adjacent wafers are separated from each other to avoid contact pollution, the ultrasonic transducer 104 works, the cavitation effect is generated through high-frequency vibration, the wafer surface is cleaned, and the rotating mechanism 14 drives the wafer to continuously rotate, the contact position of the wafer and the guide roller 1403 is changed constantly, and it is ensured that the wafer can receive ultrasonic energy on the whole surface to eliminate the cleaning blind area; After cleaning, the spraying mechanism 10 is started: the first water pump 1001 extracts high-purity water from the flushing tank 9, the high-purity water is delivered to the spraying pipe 1003 through the delivery pipe 1002, the second electromagnetic valve 1004 is opened, and the high-purity water is accurately sprayed on the wafer surface from the spraying pipe 1003 to flush the residual pollutants; The waste liquid generated in the cleaning process and the waste water after flushing flows into the waste pipe 6 through the drain hole 3 at the bottom of the ultrasonic cleaning tank 101, at this time, the first electromagnetic valve 7 is opened, the liquid during ultrasonic cleaning completely enters the recovery tank 5, and during spraying cleaning, most of the liquid enters the recovery tank 5 through the waste pipe 6 for recovery, at the same time, the fourth electromagnetic valve 1202 of the sample extraction mechanism 12 is opened, part of the liquid flows into the corresponding sampling cup 11 through the shunt pipe 1201, and serves as a detection sample; The sample delivery mechanism 13 starts: the delivery motor 1301 drives the delivery screw 1302 to rotate, the sliding block 1303 moves along the delivery screw 1302, and the peristaltic pump 1304 and the sampling cannula 1305 move synchronously; during the movement, the guide block 1307 slides along the corrugated chute 1308, the sampling cannula 1305 is lowered vertically through the slide rod 1306, and is inserted into the sampling cup 11, the peristaltic pump 1304 works, and the sample in the sampling cup 11 is delivered to the inductively coupled plasma mass spectrometer 2 through the sampling cannula 1305, and the detection of metal ions and other pollutants is completed. After the detection is completed, the third electromagnetic valve 1102 is opened, the remaining liquid in the sampling cup 11 flows into the recovery tank 5 through the discharge pipe 1101, and is combined with the main waste liquid for treatment; if it is necessary to clean the shunt pipe 1201, the second water pump 1203 can be started to extract high-purity water from the flushing tank 9, the high-purity water enters the shunt pipe 1201 through the backflushing pipe 1204 and the fifth electromagnetic valve 1205, and the shunt pipe 1201 is backflushed to prevent blockage.

[0023] Example 2

[0024] The scheme in Example 1 will be further introduced in combination with a specific working mode, and details are described below: In this embodiment, the separation mechanism 8 includes a flat plate 801, a partition plate 802, a guide groove 803, and a lifting assembly, the flat plate 801 is horizontally arranged on the top of the cover plate 102, a plurality of partition plates 802 are arranged at the bottom of the flat plate 801 at intervals, the partition plates 802 are vertically and slidably connected between the cover plate 102, the guide grooves 803 matched with the partition plates 802 are vertically and uniformly arranged on the two sides of the flower basket 103, and the top of the cover plate 102 is provided with the lifting assembly for controlling the vertical movement of the flat plate 801.

[0025] Partial working principle: the lifting assembly drives the flat plate 801 to move vertically, the partition plates 802 at the bottom of the flat plate 801 pass through the cover plate 102, and are inserted into the flower basket 103 along the guide grooves 803 on the two sides of the flower basket 103, so that the plurality of wafers in the flower basket 103 are isolated from each other, scratches or secondary pollution caused by the contact between the wafer surfaces during cleaning or rotation are avoided, and at the same time, enough space is ensured around each wafer to receive ultrasonic energy and flushing water.

[0026] In this embodiment, the lifting assembly includes a bracket 804, a lifting motor 805, and a lifting screw 806, the brackets 804 are symmetrically fixed on the two sides of the top of the flower basket 103, the lifting motors 805 are installed at the top ends of the brackets 804, the output ends of the lifting motors 805 are vertically connected with the lifting screws 806, and the lifting screws 806 are threadedly connected with the flat plate 801.

[0027] Local working principle: the bracket 804 is fixed on both sides of the top of the flower basket 103, providing support for the lifting motor 805, after the lifting motor 805 is started, the output end drives the lifting screw 806 to rotate, because the lifting screw 806 is screwed with the flat plate 801, the rotary motion is converted into the vertical motion of the flat plate 801, thereby controlling the lifting of the partition plate 802: when the lifting motor 805 rotates forward, the flat plate 801 descends, and the partition plate 802 is inserted into the flower basket 103; when it reverses, the flat plate 801 rises, and the partition plate 802 is separated from the flower basket 103.

[0028] In this embodiment, the spraying mechanism 10 comprises a first water pump 1001, a conveying pipe 1002, a spraying pipe 1003 and a second electromagnetic valve 1004, the input end of the first water pump 1001 is communicated with the inside of the flushing box 9, the output end of the first water pump 1001 is connected with the conveying pipe 1002, the conveying pipe 1002 extends to the inside of the cover plate 102, the conveying pipe 1002 is uniformly connected with the spraying pipe 1003 along the width direction of the cover plate 102, and the spraying pipe 1003 corresponds to the upper side of the wafer in the flower basket 103, the end of the spraying pipe 1003 is provided with the second electromagnetic valve 1004, and the bottom of the spraying pipe 1003 is provided with a fan-shaped nozzle with a hole diameter of 0.8 mm, the output water pressure of the first water pump 1001 is 0.3 MPa, and the flow of a single spraying pipe is 1-2 L / min, which ensures that the water flow covers the whole surface of the wafer.

[0029] Local working principle: the first water pump 1001 pumps out the high-purity water in the flushing box 9, and delivers it to the inside of the cover plate 102 through the conveying pipe 1002, the spraying pipe 1003 on the side of the conveying pipe 1002 is distributed along the width direction of the cover plate 102, and each spraying pipe 1003 corresponds to the upper side of a wafer in the flower basket 103, the second electromagnetic valve 1004 controls the on-off of the spraying pipe 1003, and can control the corresponding spraying pipe 1003 to work according to the number or position of the wafer, so as to realize accurate flushing and reduce water resource waste.

[0030] In this embodiment, the sample extraction mechanism 12 comprises a shunt pipe 1201, a fourth electromagnetic valve 1202, a second water pump 1203, a backwashing pipe 1204 and a fifth electromagnetic valve 1205, the top end of the shunt pipe 1201 is communicated with the waste pipe 6, the bottom end of the shunt pipe 1201 extends to the inside of the sampling cup 11, the fourth electromagnetic valve 1202 is installed on the shunt pipe 1201, the input end of the second water pump 1203 is communicated with the flushing box 9, the output end of the second water pump 1203 is provided with the backwashing pipe 1204, and the bottom of the backwashing pipe 1204 is communicated between the shunt pipe 1201 through the fifth electromagnetic valve 1205.

[0031] Local working principle: flushing stage, the fourth electromagnetic valve 1202 is opened, part of the liquid in the waste pipe 6 flows into the sampling cup 11 through the shunt pipe 1201, the pipe diameter of the shunt pipe 1201 is 1 / 5 of the waste pipe 6, when the fourth electromagnetic valve 1202 is opened, the shunt flow is 8%±2% of the total flow, the volume of the sampling cup 11 is 50ml, when the liquid level reaches 40ml, the fourth electromagnetic valve 1202 is automatically closed to ensure that the sample quantity meets the ICP-MS detection requirement, realizing real-time sampling collection, after each detection is completed, the third electromagnetic valve 1102 is opened for 10s to empty the sampling cup 11, the second water pump 1203 is started to extract high-purity water from the flushing tank 9, which is delivered to the fifth electromagnetic valve 1205 through the backflushing pipe 1204, after the fifth electromagnetic valve 1205 is opened, the high-purity water enters the shunt pipe 1201 to flush the shunt pipe 1201 and the inside of the sampling cup 11, ensuring no residue.

[0032] In the embodiment, the sample delivery mechanism 13 includes a delivery motor 1301, a delivery screw 1302, a sliding block 1303, a peristaltic pump 1304, a sampling cannula 1305 and an insertion assembly, the delivery motor 1301 is installed on the side of the recovery tank 5, the output end of the delivery motor 1301 is connected with the delivery screw 1302, the delivery screw 1302 is threadedly connected with the sliding block 1303, the sliding block 1303 is installed with the peristaltic pump 1304, the input end of the peristaltic pump 1304 is connected with the sampling cannula 1305, the output end of the peristaltic pump 1304 is connected with the inductively coupled plasma mass spectrometer 2, the sliding block 1303 is provided with the insertion assembly for controlling the vertical movement of the sampling cannula 1305 to contact with the water sample in the sampling cup 11.

[0033] Local working principle: the delivery motor 1301 drives the delivery screw 1302 to rotate, the sliding block 1303 threadedly connected with the delivery screw 1302 moves along the screw shaft, driving the peristaltic pump 1304 and the sampling cannula 1305 on the sliding block 1303 to move synchronously, realizing the switching of the sampling position, during the movement process, the guide block 1307 of the insertion assembly slides in the corrugated slide groove 1308, the undulating structure of the corrugated slide groove 1308 drives the sliding rod 1306 to vertically slide on the sliding block 1303 through the guide block 1307, so that the sampling cannula 1305 automatically descends and inserts into the cup when reaching the sampling cup 11, and automatically rises and separates when moving with the sliding block 1303 after extracting the sample, realizing the automation of sampling.

[0034] In the embodiment, the insertion assembly includes a sliding rod 1306, a guide block 1307 and a corrugated slide groove 1308, the sliding rod 1306 is vertically slidably arranged on the sliding block 1303, the outside of the recovery tank 5 is provided with the corrugated slide groove 1308 along the length direction, the guide block 1307 is slidably arranged in the corrugated slide groove 1308, the guide block 1307 is fixedly connected with the sliding rod 1306, and the interval between adjacent wave crests of the corrugated slide groove 1308 is consistent with the interval of the sampling cup 11.

[0035] Local working principle: the slide rod 1306 is in sliding connection with the sliding block 1303 and can move vertically along the sliding block 1303; the guide block 1307 is fixed at the bottom of the slide rod 1306 and is embedded in the corrugated chute 1308 outside the recycling box 5; when the sliding block 1303 moves with the conveying screw rod 1302, the guide block 1307 slides along the corrugated chute 1308; the ups and downs of the corrugated chute 1308 force the guide block 1307 to move the slide rod 1306 up and down, thereby controlling the lifting of the sampling cannula 1305, and ensuring that the sampling cannula 1305 is accurately inserted into or separated from the sampling cup 11.

[0036] In the embodiment, the rotating mechanism 14 comprises a groove 1401, a rotating rod 1402, a guide roller 1403 and a driving assembly; the groove 1401 is arranged at the end of the flower basket 103; the rotating rod 1402 is rotatably arranged at the length direction of both sides of the flower basket 103; a plurality of guide rollers 1403 are arranged on the rotating rod 1402 at intervals; one end of the rotating rod 1402 extends into the interior of the groove 1401; and the bottom of the ultrasonic cleaning tank 101 is provided with the driving assembly for controlling the rotation of the rotating rod 1402.

[0037] Local working principle: the groove 1401 at the end of the flower basket 103 provides a mounting space for the driving assembly; the guide rollers 1403 are arranged on the rotating rod 1402 at the length direction of both sides of the flower basket 103 at intervals; the guide rollers 1403 are in contact with the edges of the wafer and support the wafer; the driving assembly drives the rotating rod 1402 to rotate, and the rotating rod 1402 drives the guide rollers 1403 to rotate, thereby driving the wafer to rotate around its axis, so that each region of the wafer surface is in contact with the guide rollers 1403 in turn, avoiding that a single position is blocked for a long time, and ensuring that the ultrasonic energy and the flushing water uniformly act on the whole surface of the wafer.

[0038] In the embodiment, the driving assembly comprises a driven gear 1404, a rotating motor 1405 and a driving gear 1406; one end of the rotating rod 1402 located in the interior of the groove 1401 is provided with the driven gear 1404; the bottom of the ultrasonic cleaning tank 101 is provided with the rotating motor 1405; the output end of the rotating motor 1405 is provided with the driving gear 1406 engaged with the driven gear 1404; the bottom of the ultrasonic cleaning tank 101 is provided with two positioning pins corresponding to the position of the groove 1401; and the bottom of the flower basket 103 is provided with matching positioning holes; when the flower basket is placed in the cleaning tank, the positioning pins are inserted into the positioning holes, so that the engagement gap between the driving gear 1406 and the driven gear 1404 is controlled within the range of 0.1-0.2 mm.

[0039] Local working principle: the rotating speed of the rotating motor 1405 can be adjusted by PLC, the range is 5-30 rpm: for the wafer with diameter ≤6 inches, the rotating speed is set to 20 rpm, for the wafer with diameter 8-12 inches, the rotating speed is set to 10 rpm, to prevent the wafer from deviating due to excessive centrifugal force, the rotating motor 1405 is fixed at the bottom of the ultrasonic cleaning tank 101, the output end drives the driving gear 1406 to rotate, the driving gear 1406 is engaged with the driven gear 1404 at the end of the rotating rod 1402, the rotating power is transmitted to the rotating rod 1402, the rotating rod 1402 rotates synchronously with the rotating motor 1405, and then the guide roller 1403 drives the wafer to rotate.

[0040] In the embodiment, the length of the sampling tube 1305 is matched with the depth of the sampling cup 11, and the sampling tube 1305 can extend into the inside of the sampling cup 11 under the guidance of the corrugated sliding groove 1308.

[0041] Local working principle: the length of the sampling tube 1305 is matched with the depth of the sampling cup 11, to ensure that the sampling tube 1305 can contact the liquid in the cup when being inserted, under the driving of the sample conveying mechanism 13, the sampling tube 1305 moves horizontally with the sliding block 1303, and simultaneously, under the action of the corrugated sliding groove 1308 and the insertion assembly, the sampling tube 1305 vertically ascends and descends, to realize the sequential sampling of different sampling cups 11, and after the sampling is completed, the sampling tube 1305 can completely separate from the sampling cup 11, to avoid the pollution of other samples by carrying residual liquid.

[0042] Embodiment 3:

[0043] The schemes in the embodiments 1 and 2 are further introduced in combination with specific working modes, which are described in detail as follows: When the device works, first, the wafer is placed into the flower basket 103, and is placed in the ultrasonic cleaning tank 101, the cover plate 102 is covered, the lifting motor 805 is started, the flat plate 801 is lowered through the lifting screw rod 806, the partition plate 802 is inserted into the flower basket 103 along the guide groove 803, and the wafer is separated.

[0044] The ultrasonic transducer 104 is started, high-frequency vibration is generated to clean the wafer, the rotating motor 1405 drives the rotating rod 1402 to rotate through the driving gear 1406 and the driven gear 1404, and the guide roller 1403 drives the wafer to rotate, to eliminate the cleaning blind area.

[0045] After the cleaning is completed, the waste liquid after the ultrasonic cleaning is completely discharged into the recovery tank 5, then the first water pump 1001 pumps water from the flushing tank 9, the water is conveyed through the conveying pipe 1002 and the spraying pipe 1003, the second electromagnetic valve 1004 is opened, the wafer is sprayed and flushed, the flushing waste water flows into the waste discharge pipe 6 through the leakage hole 3, the first electromagnetic valve 7 is opened, most of the liquid enters the recovery tank 5, the fourth electromagnetic valve 1202 is opened, and part of the liquid enters the sampling cup 11 through the shunt pipe 1201.

[0046] During the sample transport stage, the transport motor 1301 drives the transport screw 1302, the slider 1303 drives the peristaltic pump 1304 to move, the guide block 1307 slides along the corrugated groove 1308, so that the sampling tube 1305 is inserted into the sampling cup 11, and the peristaltic pump 1304 transports the sample to the inductively coupled plasma mass spectrometer 2 for detection.

[0047] After the test is completed, the third solenoid valve 1102 is opened, and the liquid in the sampling cup 11 flows back to the recovery box 5 through the discharge pipe 1101. Then the diversion pipe 1201 is cleaned, and the second water pump 1203 rinses it through the backwash pipe 1204 and the fifth solenoid valve 1205. The whole process does not require removing the wafer, realizing the integration of cleaning and testing, avoiding secondary pollution and improving efficiency.

[0048] The above description is merely a further embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope disclosed in the present invention, based on the technical solution and concept of the present invention, shall fall within the scope of protection of the present invention.

Claims

1. A semiconductor device processing apparatus with detection function, comprising a body (1), an ultrasonic cleaning tank (101) opened in the top of the body (1), a cover plate (102) covering the top of the ultrasonic cleaning tank (101), a basket (103) placed inside the ultrasonic cleaning tank (101) for receiving wafers, and an ultrasonic transducer (104) installed at the bottom of the ultrasonic cleaning tank (101). Its features are: The cover plate (102) is provided with a separating mechanism (8), which can extend into the ultrasonic cleaning tank (101) and separate the wafers in the basket (103); A rinsing box (9) is provided on one side of the machine body (1). The rinsing box (9) is connected to the cover plate (102) through a spray mechanism (10), and the output end of the spray mechanism (10) is set to correspond to the wafer on the flower basket (103). The bottom of the ultrasonic cleaning tank (101) is provided with a drain hole (3) at the position below the wafer on the flower basket (103). The bottom of the machine body (1) is provided with an installation chamber (4). The inside of the installation chamber (4) is provided with a recycling box (5). The bottom of the drain hole (3) and the recycling box (5) are provided with a waste discharge pipe (6). The waste discharge pipe (6) is provided with a first solenoid valve (7). Sampling cups (11) are evenly arranged on the outside of the recycling box (5) at the position corresponding to the leak hole (3). The top of the sampling cup (11) is provided with a sample extraction mechanism (12) that is connected to the waste discharge pipe (6) and the inside of the rinsing box (9). A discharge pipe (1101) is provided between the bottom of the sampling cup (11) and the recycling box (5), and a third solenoid valve (1102) is provided on the discharge pipe (1101). The side of the recycling bin (5) is provided with a sample conveying mechanism (13). The input end of the sample conveying mechanism (13) is set to the sampling cup (11), and the output end of the sample conveying mechanism (13) is connected to an inductively coupled plasma mass spectrometer (2). The flower basket (103) has a rotating mechanism (14) inside, which is used to drive the wafer to rotate.

2. The semiconductor device processing apparatus with detection function according to claim 1, characterized in that: The partition mechanism (8) includes a flat plate (801), partitions (802), guide grooves (803) and a lifting assembly. The flat plate (801) is horizontally set on the top of the cover plate (102). Multiple partitions (802) are spaced apart on the bottom of the flat plate (801). The partitions (802) are vertically slidably connected to the cover plate (102). Guide grooves (803) that cooperate with the partitions (802) are evenly and vertically opened on both sides of the flower basket (103). The top of the cover plate (102) is provided with a lifting assembly that controls the vertical movement of the flat plate (801).

3. The semiconductor device processing apparatus with detection function according to claim 2, characterized in that: The lifting assembly includes a bracket (804), a lifting motor (805), and a lifting screw (806). The bracket (804) is symmetrically fixed on both sides of the top of the flower basket (103). The top of the bracket (804) is equipped with a lifting motor (805). The output end of the lifting motor (805) is vertically connected to the lifting screw (806). The lifting screw (806) is threadedly connected to the plate (801).

4. The semiconductor device processing apparatus with detection function according to claim 1, characterized in that: The spraying mechanism (10) includes a first water pump (1001), a delivery pipe (1002), a spray pipe (1003), and a second solenoid valve (1004). The input end of the first water pump (1001) is connected to the inside of the rinsing tank (9). The output end of the first water pump (1001) is connected to the delivery pipe (1002). The delivery pipe (1002) extends to the inside of the cover plate (102). The side of the delivery pipe (1002) is evenly connected with the spray pipe (1003) along the width direction of the cover plate (102). The spray pipe (1003) corresponds to the top of the wafer on the flower basket (103). The end of the spray pipe (1003) is provided with a second solenoid valve (1004). The bottom of the spray pipe (1003) is provided with a fan-shaped nozzle.

5. The semiconductor device processing apparatus with detection function according to claim 1, characterized in that: The sample extraction mechanism (12) includes a diversion tube (1201), a fourth solenoid valve (1202), a second water pump (1203), a backwash tube (1204), and a fifth solenoid valve (1205). The top end of the diversion tube (1201) is connected to the waste discharge tube (6), and the bottom end of the diversion tube (1201) extends into the sample cup (11). The fourth solenoid valve (1202) is installed on the diversion tube (1201). The input end of the second water pump (1203) is connected to the rinsing tank (9), and the output end of the second water pump (1203) is equipped with a backwash tube (1204). The bottom of the backwash tube (1204) is connected to the diversion tube (1201) through the fifth solenoid valve (1205).

6. The semiconductor device processing apparatus with detection function according to claim 1, characterized in that: The sample delivery mechanism (13) includes a delivery motor (1301), a delivery screw (1302), a slider (1303), a peristaltic pump (1304), a sampling tube (1305), and an insertion assembly. The delivery motor (1301) is installed on the side of the recovery box (5). The output end of the delivery motor (1301) is connected to the delivery screw (1302). The slider (1303) is threaded onto the delivery screw (1302). The peristaltic pump (1304) is installed on the slider (1303). The input end of the peristaltic pump (1304) is connected to the sampling tube (1305). The output end of the peristaltic pump (1304) is connected to the inductively coupled plasma mass spectrometer (2). The slider (1303) is provided with an insertion assembly that controls the vertical movement of the sampling tube (1305) to contact the water sample inside the sampling cup (11).

7. The semiconductor device processing apparatus with detection function according to claim 6, characterized in that: The insertion assembly includes a slide rod (1306), a guide block (1307), and a corrugated groove (1308). The slide rod (1306) is vertically slidably mounted on the slider (1303). A corrugated groove (1308) is provided on the outer side of the recycling box (5) along the length direction. A guide block (1307) is slidably mounted inside the corrugated groove (1308). The guide block (1307) is fixedly connected to the slide rod (1306). The spacing between adjacent peaks on the corrugated groove (1308) is consistent with the spacing of the sampling cup (11).

8. The semiconductor device processing apparatus with detection function according to claim 1, characterized in that: The rotating mechanism (14) includes a groove (1401), a rotating rod (1402), a guide roller (1403), and a drive assembly. The groove (1401) is located at the end of the basket (103). The rotating rod (1402) is rotatably mounted on both sides of the basket (103) along the length direction. Multiple guide rollers (1403) are spaced apart on the rotating rod (1402). One end of the rotating rod (1402) extends into the interior of the groove (1401). The bottom of the ultrasonic cleaning tank (101) is provided with a drive assembly to control the rotation of the rotating rod (1402).

9. A semiconductor device processing apparatus with detection function according to claim 8, characterized in that: The drive assembly includes a driven gear (1404), a rotary motor (1405), and a driving gear (1406). The driven gear (1404) is installed at one end of the rotating rod (1402) inside the groove (1401). The rotary motor (1405) is installed at the bottom of the ultrasonic cleaning tank (101). The output end of the rotary motor (1405) is equipped with a driving gear (1406) that meshes with the driven gear (1404). Two positioning pins are provided at the bottom of the ultrasonic cleaning tank (101) corresponding to the position of the groove (1401). The bottom of the basket (103) is provided with matching positioning holes.

10. A semiconductor device processing apparatus with detection function according to claim 7, characterized in that: The length of the sampling cannula (1305) is adapted to the depth of the sampling cup (11), and the sampling cannula (1305) can be extended into the interior of the sampling cup (11) by means of the corrugated groove (1308).

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