Multi-faceted rinse sink structure for use in a potassium hydroxide etch cleaning stage

Abstract

The application discloses a multi-surface washing sink structure used in a potassium hydroxide etching cleaning stage, relates to the technical field of wafer etching and cleaning, and specifically comprises a cleaning box and a box door, wherein the cleaning box is provided with the box door on one side, rotating spray washing cavities and soaking cavities are arranged in the cleaning box, and a telescopic control assembly is arranged in the cleaning box; through the compact design of integrating the vertical soaking cavity and the horizontal rotating spray washing cavity, the automatic cooperation of the overturning placement mechanism and the telescopic control assembly, efficient posture switching of the wafer from vertical soaking to horizontal washing is realized, in the dynamic washing mechanism, the strip-shaped conveying assembly and the swing nozzle are linked and driven to rotate the wafer, and multi-angle spraying is cooperated to completely eliminate the cleaning blind area of surface residues.

Description

TECHNICAL FIELD

[0001] The application relates to a multi-surface flushing water tank structure used in a potassium hydroxide etching cleaning stage. BACKGROUND

[0002] In the field of semiconductor manufacturing and micro-electro-mechanical system processing, a potassium hydroxide wet etching process is widely used in the processing of silicon-based structures due to its anisotropic etching characteristics. However, the cleaning stage after etching faces problems such as low cleaning efficiency and incomplete removal of wafer surface residues, and traditional equipment has many shortcomings in structure design and process control.

[0003] For example, the invention patent with the publication number CN117080109A "slot cleaning and etching device" mentions that traditional slot cleaning equipment mostly adopts single-chamber design, and the flow direction of chemical solution is single, which leads to uneven flushing of etching residues on the wafer surface. The slot equipment is cleaned by the solution flowing upwards from the bottom of both sides.

[0004] However, uneven liquid flow distribution makes the cleaning rate of the wafer bottom area significantly higher than that of other areas, forming a fan-shaped etching feature. Related vertical rotation is used to improve the cleaning angle, but the processing efficiency is low. Therefore, a solution is proposed. SUMMARY

[0005] The purpose of the present application is to provide a unique flip placement mechanism and a telescopic control assembly that work together to switch the placement angle of the wafer between the soaking cavity and the rotary spray cavity, and to cooperate with the corresponding cleaning means in each cavity to solve the technical defects mentioned in the background art.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical solution: a multi-surface flushing water tank structure used in a potassium hydroxide etching cleaning stage, comprising a cleaning box and a box door, wherein the cleaning box is provided with a box door on one side, and the cleaning box is provided with a rotary spray cavity and a soaking cavity;

[0007] A telescopic control assembly is installed in the cleaning box, and the end of the electric push rod installed in the telescopic control assembly is provided with a flip placement mechanism. The flip placement mechanism comprises a sliding table and a placement plate, and the sliding table side wall is movably connected with a single-sided sleeve. The single-sided sleeve is fixedly connected with the placement plate.

[0008] The end of the electric push rod on the telescopic control assembly is fixed to the sliding table. A closing frame is installed in the rotary spray cavity. A strip-shaped conveying assembly is symmetrically and uniformly installed on the closing frame, and the strip-shaped conveying assembly is vertically distributed on the closing frame. A wafer feeding assembly is installed in the rotary spray cavity and located at the end of the strip-shaped conveying assembly. Flushing boxes are symmetrically installed on both sides of the strip-shaped conveying assembly in the rotary spray cavity. Swing nozzles are movably connected to the flushing boxes.

[0009] Further, the turnover placing mechanism further comprises a swing sleeve and a double-sided rotating sleeve, the swing sleeve is rotatably connected to the inner wall of the sliding table through a bearing, and the plate surface protrusion of the single-sided rotating sleeve abuts against the through groove on the swing sleeve, the double-sided rotating sleeve is movably connected to the sliding table, and one side protrusion of the double-sided rotating sleeve abuts against the through groove on the swing sleeve.

[0010] Further, a limiting plate is fixed to the side of the cleaning box through bolts, a limiting groove is formed in the limiting plate, and the side protrusion of the double-sided rotating sleeve abuts against the limiting groove.

[0011] Further, a transmission box is fixedly connected to the top of the rotating spray washing cavity on the cleaning box, a cleaning liquid purification assembly is installed in the cleaning box, and a box is arranged in the cleaning liquid purification assembly and is connected in communication with the soaking cavity through a communication pipe.

[0012] Further, a U-shaped sliding bracket is slidably connected to the inner wall of the rotating spray washing cavity, and the U-shaped sliding bracket abuts against the end of the oscillating spray head on the two sides of the cleaning box.

[0013] Further, a motor is installed on the side of the rotating spray washing cavity on the cleaning box, a rotating disc is fixed to the output end of the motor, a driving arm is installed on the top of the cleaning box, one side of the driving arm is rotatably connected to the connecting rod arranged on the rotating disc, the other end of the driving arm penetrates through the cleaning box and extends into the rotating spray washing cavity, and one end of the driving arm in the rotating spray washing cavity is slidably connected to the U-shaped sliding bracket.

[0014] Further, a positioning rotating arm is rotatably connected to the cleaning box on the top of the rotating spray washing cavity, a stop block is slidably connected in the groove on the two sides of the positioning rotating arm, a rotating rod is installed on the cleaning box, one end of the rotating rod penetrates through the stop block and is movably connected to the side wall of the cleaning box, and the end of the positioning rotating arm is clamped to the arc groove on the driving arm.

[0015] The method for using the multi-surface flushing water tank structure used in the potassium hydroxide etching cleaning stage is as follows:

[0016] Pre-soaking cleaning: the telescopic control assembly drives the turnover placing mechanism to descend by two unit heights, so that the vertical placed wafer carrying the fixed wafer boat box is lowered to the soaking cavity on the surface of the placing plate, the wafer is completely immersed in the chemical liquid tank, and the reagent is put in advance to completely contact the wafer;

[0017] Deionized water flushing: the telescopic control assembly drives the turnover placing mechanism to rise by one unit height, so that the double-sided rotating sleeve contacts the limit groove bending part to rotate, drives the swing sleeve side single-sided rotating sleeve to rotate by 90 degrees, so that the vertically placed wafer is horizontally placed, and then the wafer feeding assembly is moved to move the top single wafer to the strip-shaped conveying assembly, and after the strip-shaped conveying assembly drives the top wafer to move by one body position on the closed frame, the adjacent bottom wafer is sent to the strip-shaped conveying assembly, and so on, the wafers are distributed and discharged layer by layer, and at the same time, the strip-shaped conveying assemblies on both sides rotate in the same direction to drive the wafers to rotate in place, and the swing nozzle on the flushing box sprays liquid, so that the wafers are flushed.

[0018] Compared with the prior art, the beneficial effects of the present application are:

[0019] In the present application, the turnover placing mechanism cooperates with the telescopic control assembly to realize automatic switching of the wafer between the soaking cavity and the rotary spray washing cavity, and the conversion of the wafer from the vertical soaking state to the horizontal flushing state is completed through the mechanical linkage of the double-sided rotating sleeve and the limit groove without manual intervention, which significantly improves the processing efficiency. At the same time, the strip-shaped conveying assembly in the rotary spray washing cavity is combined with the swing nozzle to drive the wafer to rotate and be sprayed from multiple angles, so that there is no cleaning blind area on the wafer surface, and it is especially suitable for removing stubborn pollutants such as residual polymers and metal ions after etching.

[0020] In the present application, the cleaning liquid purification assembly of the present application is connected with the soaking cavity through the communication pipe, can recycle and purify the impurities in the cleaning liquid in real time, realizes the recycling use of chemical reagents, and besides, the compact layout of the vertical soaking cavity and the horizontal rotary spray washing cavity is adopted in the equipment, compared with the traditional multi-cavity cleaning equipment, the occupied area is reduced by about 25%, especially suitable for the efficient use demand of space in the semiconductor manufacturing workshop, and at the same time, the design optimizes the coverage range of the swing nozzle by integrating the U-shaped slide and the adjustable driving arm, and further reduces the waste of cleaning liquid. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 A schematic view of a multi-face flushing water tank used in the potassium hydroxide etching cleaning stage of the present application is installed in a cleaning box.

[0022] Figure 2 A schematic view of a rear view structure of the cleaning box of the present application is shown.

[0023] Figure 3 A schematic view of a frame removal glass structure in the cleaning box of the present application is shown.

[0024] Figure 4 A schematic view of a wafer placed in a wafer boat box on a placing plate in different height storage states of the present application is shown.

[0025] Figure 5It is the overall structure schematic view of the overturning and placing mechanism of the application;

[0026] Figure 6 It is the sliding and clamping schematic view of the driving arm and the U-shaped slide frame of the application;

[0027] Figure 7 It is the schematic view of driving the wafer movement by the reverse rotation of the conveyer belts on both sides of the strip transmission assembly on the closing frame of the application;

[0028] Figure 8 It is the schematic view of driving the wafer rotation by the same direction rotation of the conveyer belts on both sides of the strip transmission assembly on the closing frame of the application.

[0029] In the figure: 1, cleaning tank; 2, tank door; 3, rotary spray washing cavity; 4, soaking cavity; 5, telescopic control assembly; 6, overturning and placing mechanism; 601, sliding table; 602, placing plate; 603, single-sided rotating sleeve; 604, swing sleeve; 605, double-sided rotating sleeve; 7, limiting plate; 8, limiting groove; 9, rotating disc; 10, driving arm; 11, positioning rotating arm; 12, rotating rod; 13, stop block; 14, U-shaped slide frame; 15, flushing tank; 16, swing nozzle; 17, closing frame; 18, strip transmission assembly; 19, wafer feeding assembly; 20, transmission box; 21, cleaning liquid purification assembly. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the application.

[0031] Please refer to Figures 1-8 The application provides a technical solution:

[0032] Embodiment 1: For the cleaning of wafers after etching, removing impurities such as polymers, metal ions, photoresist fragments and oxide particles on the surface of the wafer, a plurality of cleaning cavities are usually arranged, combined with a step-by-step discharging mechanism, and the wafer is contacted with different cleaning liquids for soaking at the same time, and mechanical or ultrasonic auxiliary is used to enhance the particle separation effect. Due to the design of the multi-soaking cavity 4 chamber, the cleaning equipment occupies a larger area, and the moving and carrying cleaning efficiency is reduced.

[0033] As shown in Figure 1 and Figure 2 , the main body of the cleaning tank 1 includes the vertically placed soaking cavity 4 and the horizontally stored rotary spray washing cavity 3. The telescopic control assembly 5 arranged in the cleaning tank 1 drives multiple groups of wafers placed in the wafer boat box to switch back and forth in the two cavities, so as to realize the soaking and efficient flushing of the wafers after etching.

[0034] And according to the wafer etching after soaking and rinsing to adjust the angle of the wafer storage, about the wafer soaking, easy to clean liquid and wafer contact and easy to impurities off, usually vertical immersion water surface, and for wafer rinse, subsequent wafer unfolding, for this need to put the wafer horizontally, for wafer placement state switching, the end of the whole telescopic control assembly 5 is installed on the turnover mechanism 6;

[0035] As shown in Figure 3 And Figure 5 The telescopic control assembly 5 is installed in the cleaning tank 1. The sliding table 601 is initially placed at an angle as shown in Figure 4 The wafer in the wafer boat box is vertically placed, and the clamp installed on the placement plate 602 is used to fix the wafer boat box tightly. With the downward movement of the sliding table 601, the unilateral protrusion of the double-sided sleeve 605 at the end of the sliding table 601 abuts against the surface limiting groove 8 of the limiting plate 7 fixed on the inner wall of the cleaning tank 1, causing the double-sided sleeve 605 to automatically rotate when the sliding table 601 moves vertically downward, causing the other side to rotate synchronously. The swing sleeve 604 is also rotationally connected between the middle partition plate of the sliding table 601, and the other side of the double-sided sleeve 605 abuts against the through groove of the swing sleeve 604, thereby driving the swing sleeve 604 to rotate;

[0036] As shown in Figure 5 The single-sided sleeve 603 is movably connected to the outermost side of the sliding table 601. The single-sided sleeve 603 is also provided with a protrusion and abuts against the through groove between the swing sleeve 604, and the other end of the single-sided sleeve 603 is fixedly sleeved with the placement plate 602. The placement plate 602 is composed of two plate pieces and is provided with a water through groove. The placement plate 602 is additionally provided with a clamp;

[0037] After the wafer boat box is placed into the cleaning tank 1 through the tank door 2, the two sides of the wafer boat box are vertically clamped with the placement plate 602, and the clamp is used to limit and clamp the upper and lower sides of the wafer boat box to prevent the wafer boat box from falling during the turnover process. When the whole sliding table 601 moves downward, the double-sided sleeve 605 rotates downward, driving the whole swing sleeve 604 to rotate to the right side;

[0038] As shown in Figure 5 The right rotation of the swing sleeve 604 also causes the single-sided sleeve 603 at the top to rotate. Through the slope control of the limiting groove 8, the single-sided sleeve 603 can be rotated at a fixed angle with the placement plate 602, and finally the angle of the wafer on the placement plate 602 can be adjusted;

[0039] As shown in Figure 4 In the soaking cavity 4, the wafer boat box on the placement plate 602 is lowered by one unit height. The unit height is freely controlled according to the deflection angle. When the placement plate 602 is lowered by another unit height, the whole placement plate 602 starts to reset the angle under the constraint of the limiting groove 8, so that the wafer is vertically placed when it contacts the bottom of the soaking cavity 4.

[0040] At this time as Figure 3 shown, the cleaning liquid pumped into the soaking cavity 4 in advance contacts the wafer, and the overall cleaning effect is improved with the aid of ultrasonic vibration. After single soaking cleaning, the residual cleaning liquid on the wafer surface needs to be treated in time. Therefore, the wafer needs to be rinsed with UPW after contact soaking. To improve the overall rinsing effect;

[0041] As shown in Figure 4 , multiple wafers are arranged in a stepped manner in the rotary spray washing cavity 3, so that the two sides of the unfolded wafer can fully contact the swing nozzles 16 installed on the rinse tank 15. At the same time, the cleaning liquid in the soaking cavity 4 is automatically recycled, and the swing nozzles 16 in the rotary spray washing cavity 3 work, and the generated cleaning sewage automatically flows into the soaking cavity 4, and then the pumped cleaning liquid is purified in the cleaning liquid purification assembly 21 and recycled after filtration and purification treatment.

[0042] Example 2: Since the wafers in the wafer boat box need to be placed horizontally, the placement plate 602 after soaking cleaning moves up by one unit height with the extension control assembly 5. At this time, the 90° rotation of the placement plate 602 causes the wafer to face the entire rotary spray washing cavity 3.

[0043] As for the wafers placed on the multi-layer strip-shaped conveying assembly 18 in the rotary spray washing cavity 3, as shown in Figure 4 and Figure 7 , the strip-shaped conveying assembly 18 is arranged on the closed frame 17 after spacing adjustment. The spacing between the two closed frames 17 is adjusted according to the diameter of the wafer. The strip-shaped conveying assembly 18 on both sides of the closed frame 17 can complete the clamping and conveying of the wafer. At the same time, the spacing between each group of conveying belts on the strip-shaped conveying assembly 18 needs to be adapted to the spacing of the wafers placed in the wafer boat box, so that the corresponding wafers in the wafer boat box can be accurately moved to each layer of conveying belt.

[0044] A wafer feeding mechanism is arranged at the end of the rotary spray washing cavity 3. The movable claw arm sends the wafers into the transmission belt one by one. First, a single wafer is moved to the topmost transmission belt. As shown in Figure 7 , the wafer starts to move to the right in the conveying belt, and the moving distance is one body position of the wafer itself. Then the second layer of wafers is moved to the corresponding height of the conveying belt. With the rotation of the conveying belt, the wafer in front of the conveying belt is kept one body position away from the wafer behind, and is located at different heights. In this way, all the wafers are fed on the surface of the conveying belt. At this time, the spraying and rinsing work can be carried out.

[0045] A rinsing box 15 is symmetrically installed inside the rotary spray chamber 3, and a swing nozzle 16 is evenly connected to the rinsing box 15. In order to improve the overall rinsing effect of the swing nozzle, a U-shaped slide 14 is provided on both sides. The U-shaped slide 14 swings and contacts the swing nozzle 16 to realize the swing nozzle 16 to rinse and improve the overall rinsing effect.

[0046] like Figure 6 As shown, the range of motion of the swing nozzle 16 can also be manually adjusted. A turntable 9 is fixed on the motor output end of the outer wall of the cleaning tank 1. At the same time, a drive arm 10 is installed on the cleaning line, and its end abuts against the U-shaped carriage 14. The movable connecting rod on the turntable 9 is movably connected to the drive arm 10. As the turntable 9 rotates, the positioning arm 11 abuts against the arc groove on the drive arm 10, causing the entire U-shaped carriage 14 to slide in the rotating spray chamber 3. The position of the positioning arm 11 abutting against the arc groove in the drive arm 10 controls the swing amplitude of the drive arm 10. When the positioning arm 11 is closer to the turntable 9, the swing amplitude of the drive arm 10 is larger, and vice versa.

[0047] As for the adjustment of the rotation angle of the entire positioning arm 11, a stop 13 is installed in its own channel, and a rotating rod 12 passes through the stop 13 and is threadedly connected to the stop 13. By rotating the rotating rod 12, the stop 13 is moved, which pushes the entire positioning arm 11 to rotate, thereby realizing the adjustment of the center position of the drive arm 10.

[0048] After being rinsed by the adjustable oscillating nozzle 16, its contact surface with the wafer is relatively fixed, making it difficult to effectively clean the wafer sides that are biased towards the sides of the conveyor belt. Therefore, as Figure 8 As shown, the transmission box 20 controls the two strip conveyor components 18 on the closed frame 17 to rotate in the same direction, causing the wafer to rotate between the clamped conveyor belts. Combined with the oscillating nozzles for rinsing, the wafer surface is cleaned efficiently. Then, the wafer feeding component 19 sends the rinsed wafer back to the wafer boat box on the placement plate 602 for tumbling and soaking. The efficient soaking and cleaning after angle adjustment, combined with the unfolding rotary spray washing, improves the efficiency and effect of wafer rinsing at each stage.

[0049] The above description is merely an example and illustration of the structure of the present invention. Those skilled in the art can make various modifications or additions to the specific embodiments described, or use similar methods to replace them, as long as they do not deviate from the structure of the invention or exceed the scope defined in the claims, all of which should fall within the protection scope of the present invention.

[0050] In the description of the specification, reference to "one embodiment", "an example", "a specific example" or the like means that a particular feature, structure, material or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. The appearances of the phrases "in one embodiment", "an example", "a specific example" or the like in various places in the specification are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0051] The preferred embodiments of the application disclosed above are only to help explain the application. The preferred embodiments do not describe all the details of the application and limit the application to the specific embodiments. Obviously, many modifications and variations can be made in light of the contents of the specification. The specification selects and specifically describes these embodiments in order to better explain the principles and practical application of the application, so that those skilled in the art can well understand and utilize the application. The application is limited only by the claims and their full scope and equivalents.

Claims

1. A multi-faceted rinsing tank structure used in the potassium hydroxide etching and cleaning stage, comprising a cleaning tank (1) and a door (2), wherein the door (2) is installed on one side of the cleaning tank (1), and the cleaning tank (1) is provided with a rotating spray chamber (3) and an immersion chamber (4), characterized in that: The cleaning tank (1) is equipped with a telescopic control assembly (5). The end of the electric push rod installed in the telescopic control assembly (5) is provided with a flipping placement mechanism (6). The flipping placement mechanism (6) includes a slide (601) and a placement plate (602). A single-sided rotating sleeve (603) is movably connected to the side wall of the slide (601). The placement plate (602) is fixedly connected inside the single-sided rotating sleeve (603). The end of the electric push rod on the telescopic control component (5) is fixed to the slide table (601). A closing frame (17) is installed in the rotary spray washing chamber (3). A strip conveying component (18) is symmetrically and evenly installed on the closing frame (17), and the strip conveying component (18) is vertically distributed on the closing frame (17). A wafer feeding component (19) is installed in the rotary spray washing chamber (3) and at the end of the strip conveying component (18). A rinsing box (15) is symmetrically installed in the rotary spray washing chamber (3) and on both sides of the strip conveying component (18). A swing nozzle (16) is evenly and movably connected to the rinsing box (15). The flipping and placing mechanism (6) also includes a swing sleeve (604) and a double-sided rotating sleeve (605). The inner wall of the slide (601) is rotatably connected to the swing sleeve (604) through a bearing. The protrusion on the plate surface of the single-sided rotating sleeve (603) abuts against the through groove on the swing sleeve (604). The slide (601) is also movably connected to the double-sided rotating sleeve (605), and one side protrusion of the double-sided rotating sleeve (605) abuts against the through groove on the swing sleeve (604). The cleaning tank (1) is located on the side of the telescopic control component (5) and a limiting plate (7) is fixed by bolts. A limiting groove (8) is opened on the limiting plate (7). The protrusion on the side of the double-sided rotating sleeve (605) abuts against the limiting groove (8). A transmission box (20) is fixedly connected to the cleaning box (1) and located at the top of the rotating spray chamber (3). A cleaning liquid purification component (21) is installed inside the cleaning box (1), and the box body inside the cleaning liquid purification component (21) is connected to the soaking chamber (4) through a connecting pipe.

2. The multi-faceted rinsing water tank structure used in the potassium hydroxide etching and cleaning stage according to claim 1, characterized in that, The inner wall of the rotating spray chamber (3) is slidably connected to a U-shaped carriage (14), which abuts against the ends of the swing nozzles (16) on the two side flushing boxes (15).

3. The multi-faceted rinsing water tank structure used in the potassium hydroxide etching and cleaning stage according to claim 2, characterized in that, A motor is installed on the cleaning tank (1) and on the side of the rotating spray chamber (3), and a turntable (9) is fixed on the output end of the motor. A drive arm (10) is installed on the top of the cleaning tank (1). One side of the drive arm (10) is rotatably connected to the turntable (9) with a connecting rod. The other end of the drive arm (10) passes through the cleaning tank (1) and extends into the rotating spray chamber (3). One end of the drive arm (10) located in the rotating spray chamber (3) is slidably engaged with the U-shaped slide (14).

4. The multi-faceted rinsing water tank structure used in the potassium hydroxide etching and cleaning stage according to claim 3, characterized in that, A positioning arm (11) is rotatably connected to the cleaning box (1) at the top of the rotating spray chamber (3). A stop block (13) is slidably connected in the grooves on both sides of the positioning arm (11). A rotating rod (12) is installed on the cleaning box (1), and one end of the rotating rod (12) passes through the stop block (13) and is movably connected to the side wall of the cleaning box (1). The end of the positioning arm (11) is engaged with the arc groove on the drive arm (10).

5. The multi-faceted rinsing water tank structure used in the potassium hydroxide etching and cleaning stage according to claim 4, characterized in that, The method of using the multi-faceted rinsing tank structure in the potassium hydroxide etching and cleaning stage is as follows: Pre-soaking cleaning: The telescopic control component (5) drives the flipping placement mechanism (6) to descend by two unit heights, so that the vertically placed wafers carrying the fixed crystal boat box descend from the surface of the placement plate (602) into the soaking chamber (4), and the wafers are completely immersed in the chemical liquid tank. The reagents are placed in advance to fully contact the wafers. Deionized water rinsing: The telescopic control component (5) drives the flipping placement mechanism (6) to rise one unit height, so that the double-sided rotating sleeve (605) contacts the bending part of the limiting groove (8) and rotates, driving the single-sided rotating sleeve (603) on the side of the swing sleeve (604) to rotate 90°, so that the vertically placed wafer is placed horizontally, and then transported by the wafer feeding component (19). First, the top single wafer is moved to the strip conveyor component (18), and on the closed frame (17), the strip conveyor component (18) drives the top wafer to move one body position, and then the adjacent bottom wafer is sent to the strip conveyor component (18). In this way, the wafers are distributed and arranged layer by layer. At the same time, the conveyor belts on both sides of the strip conveyor component (18) rotate in the same direction, driving the wafer to rotate in place. Accompanied by the swing nozzle (16) on the rinsing box (15) spraying liquid, the wafer is rinsed.

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