Automatic storage management and control method, system and device for intelligent wafer storage cabinet

Abstract

The invention discloses an automatic storage management and control method, system and device for an intelligent wafer storage cabinet, and belongs to the technical field of data processing, and the method comprises the following steps: S1, obtaining a designated storage position of a wafer box, and sending a storage instruction to a rotation supporting platform; s2, controlling a turntable storage mechanism to rotate to a specified angle, controlling a mechanical arm to store the wafer box to a specified storage position, acquiring a steady-state execution parameter of the turntable storage mechanism in real time, and analyzing to obtain an equipment adjustment instruction; s3, corresponding rotation angular velocity adjustment is carried out, and corresponding heat dissipation power adjustment is carried out; and S4, the speed of the conveying belt is increased and adjusted. Stable and efficient operation of the wafer storage process is achieved, and the problem that in the prior art, storage efficiency and equipment storage precision cannot be considered at the same time is solved.

Description

Technical Field

[0001] This invention relates to the field of data processing technology, and in particular to an automated storage management method, system and device for an intelligent wafer storage cabinet. Background Technology

[0002] Existing automated storage management systems for smart wafer storage cabinets primarily achieve this through path planning and task scheduling. First, they receive wafer access or transport requests. Then, based on the status information of the storage units and task priorities, they filter available storage locations or transport paths. Next, they calculate the metrics for each path and select the optimal path as the target path. Finally, they control the mechanical equipment to execute wafer access or transport tasks according to the scheduling order, achieving orderly storage and efficient flow of wafers.

[0003] For example, the path generation method, apparatus, computer equipment, and storage medium disclosed in Chinese invention patent CN114612049B include: receiving a transport request for a wafer to be transported; obtaining a list of routing nodes mapped by all storage locations; filtering transport routing nodes from the list of routing nodes that can temporarily store the wafer to be transported based on storage status information; determining multiple initial transport paths for the initial storage location and the destination storage location based on the transport routing nodes, wherein the initial transport paths carry the current waiting time and estimated current transfer time of each transport routing node; calculating the sum of metrics for different initial transport paths based on the current waiting time, estimated current transfer time, and weights; and selecting the initial transport path with the smallest sum of metrics as the target path.

[0004] For example, Chinese invention patent CN118313637B discloses a wafer cassette access method, apparatus, electronic device, and storage medium, which includes: determining the scheduling execution order of each wafer cassette retrieval task based on the current storage unit, output port, task priority, and cost of switching from the corresponding wafer cassette retrieval task to any other wafer cassette retrieval task; controlling a stacker crane to execute the corresponding wafer cassette retrieval task based on the scheduling execution order of each wafer cassette retrieval task; after any wafer cassette retrieval task is completed, determining the wafer cassette storage task corresponding to the next wafer cassette retrieval task based on the current storage unit of the next wafer cassette retrieval task and the destination storage unit of each wafer cassette storage task; then controlling the stacker crane to execute the wafer cassette storage task corresponding to the wafer cassette retrieval task, and then executing the next wafer cassette retrieval task of the wafer cassette retrieval task.

[0005] The above-mentioned technology has at least the following technical problems: Existing technologies achieve orderly storage and efficient transfer of wafers through path planning and task scheduling, but they do not pay enough attention to the safety and stability of the equipment during operation. For example, when mechanical equipment operates at high speed to improve access efficiency, existing systems often neglect real-time monitoring and adjustment of operating status or load changes, or they neglect access efficiency in order to ensure operational accuracy. Therefore, there is a technical problem that storage efficiency and equipment storage accuracy cannot be simultaneously achieved. Summary of the Invention

[0006] To address the technical problem of the inability to simultaneously achieve storage efficiency and device storage accuracy in existing technologies, embodiments of the present invention provide an automated storage management method, system, and device for intelligent wafer storage cabinets, the technical solution of which is as follows: On the one hand, an automated storage management method for an intelligent wafer storage cabinet is provided. This method includes: S1, when the intelligent wafer storage cabinet receives a wafer cassette transfer signal, the visual recognition unit of the robotic arm identifies the transferred wafer cassette, obtains the designated storage location of the wafer cassette, and issues a storage command to the rotary support platform. The robotic arm includes a first robotic arm and a second robotic arm; S2, after receiving the storage command, the rotary support platform controls the turntable storage mechanism to rotate to a designated angle and controls the robotic arm to store the wafer cassette in the designated storage location. The steady-state execution parameters of the turntable storage mechanism are acquired in real time, and equipment adjustment commands are obtained through analysis; S3, based on the equipment adjustment commands, the rotary support platform is adjusted to the corresponding rotational angular velocity, controlling the rotary support platform to rotate back to the initial storage position. The adjusted equipment operating temperature is obtained, and a heat dissipation power adjustment execution command is obtained, thereby performing corresponding heat dissipation power adjustments; S4, the real-time steady-state execution value after heat dissipation power adjustment is obtained, and the degree of secondary steady-state difference is analyzed, thereby adjusting the conveyor belt speed increase.

[0007] On the other hand, an automated storage management and control system for an intelligent wafer storage cabinet is provided. This system is applied to an automated storage management and control method for an intelligent wafer storage cabinet. The system includes: a storage location acquisition module, a steady-state analysis module, a heat dissipation power adjustment module, and a conveyor belt speed adjustment module. The storage location acquisition module is used to, when the intelligent wafer storage cabinet receives a signal from the conveyor belt to transport a wafer cassette, have the robotic arm's vision recognition unit identify the transported wafer cassette, obtain the designated storage location of the wafer cassette, and issue a storage command to the rotary support platform. The steady-state analysis module is used when the rotary support platform receives the storage command... The system then controls the turntable storage mechanism to rotate to a specified angle and controls the robotic arm to store the wafer cassette in a specified storage location. It acquires the steady-state execution parameters of the turntable storage mechanism in real time and analyzes them to obtain equipment adjustment commands. The heat dissipation power adjustment module adjusts the rotational angular velocity of the rotary support platform based on the equipment adjustment commands, acquires the adjusted equipment operating temperature, obtains the heat dissipation power adjustment execution command, and performs corresponding heat dissipation power adjustments. The conveyor belt speed adjustment module acquires the real-time steady-state execution value after heat dissipation power adjustment and analyzes the degree of difference in the secondary steady-state state, thereby adjusting the conveyor belt speed increase.

[0008] On the other hand, an automated storage and control device for an intelligent wafer storage cabinet is provided. This device applies an automated storage and control method for an intelligent wafer storage cabinet, including: a cabinet 1, a feeding line 2, an automated storage and retrieval module A3, a rotary storage mechanism 4, an automated storage and retrieval module B5, a discharging line 6, a central control unit 7, a fan processing unit 8, and a sensor control unit; the automated storage and retrieval modules A3 and B5 include a six-axis robotic arm 3-01, the end of which is equipped with a single chip. The six-axis robotic arm 3-01 is equipped with a vision recognition unit 3-04 at its end. The single-chip gripper 3-02 is used to grasp single wafers, and the wafer cassette gripper 3-03 is used to grasp wafer cassettes 2-02. The turntable storage mechanism 4 is a rotary structure, and its rotation is controlled by a rotary support platform 4-01. The rotary support platform 4-01 is equipped with multi-layer wafer cassettes 4-03 and multi-layer wafer cassette placement plates 4-02. The multi-layer wafer cassette placement plates 4-02 are connected by interlayer... The support column 4-04 is connected, and the turntable storage mechanism 4 is equipped with a sensor assembly 4-05 to identify the vibration amplitude; the feeding line 2 includes a belt conveyor 2-01, with identification units 2-03 at both ends of the belt conveyor 2-01 to identify wafer boxes or wafers; the central control unit 7 is used to send and receive commands and coordinate the operation of the intelligent wafer storage cabinet; the fan processing unit 8 is used to control the fan speed; the sensor control unit is used to monitor the temperature, humidity, and wind speed at various locations inside the cabinet and to maintain the purity of the inert gas; the feeding line 2 is fixedly connected to the feeding end of the cabinet 1; the automated storage and retrieval module A3 and the automated storage and retrieval module B5 communicate with the central control unit 7 via electrical connection and are mechanically connected to the turntable storage mechanism 4 and the discharge line 6; the discharge line 6 is connected to the output end of the turntable storage mechanism 4, and the output end is connected to the outside of the cabinet 1; the fan processing unit 8 is connected to the internal air channel of the cabinet 1 and communicates with the central control unit 7 via electrical connection; the sensor control unit is arranged in multiple locations inside the cabinet 1 and is signal-connected to the central control unit 7.

[0009] The beneficial effects of the technical solutions provided in the embodiments of the present invention include at least the following: 1. The automated storage control method for intelligent wafer storage cabinets provided by this invention obtains steady-state execution values ​​by analyzing the steady-state execution parameters of the turntable storage mechanism in real time and generates equipment adjustment instructions. This enables the equipment to be adjusted to increase or decrease efficiency based on the operating status of the turntable storage mechanism, effectively ensuring the stable and efficient operation of the wafer storage process, improving wafer storage efficiency, and avoiding wafer cell damage or storage deviation during high-speed operation. This effectively solves the problem of not being able to balance storage efficiency and equipment storage accuracy in the prior art.

[0010] 2. This invention improves the operating efficiency of the rotary support platform when the steady-state value is high by adjusting the rotational angular velocity based on the equipment adjustment command, or reduces the rotational angular velocity to ensure safety when the steady-state value is low. This enables adaptive adjustment of the platform's operating speed under different operating conditions, allowing the robotic arm to complete wafer cell storage at the optimal speed, improving storage efficiency and ensuring the stability and accuracy of equipment operation.

[0011] 3. By acquiring the temperature change of the equipment after the rotational angular velocity is adjusted, and combining it with the preset equipment operating temperature threshold and temperature change threshold in the database, the heat dissipation power adjustment command is judged, thereby increasing or decreasing the heat dissipation power. This enables real-time adjustment of the equipment temperature, allowing the turntable material storage mechanism to cool down quickly when the temperature is high or the temperature change is large, improving the steady-state execution value, reducing the risk of vibration or equipment instability caused by overheating, and ensuring the operational safety and stability of the wafer storage process.

[0012] 4. This invention achieves adaptive optimization of the conveyor belt speed by iteratively adjusting the conveyor belt speed in steps and generating first and second iteration stop commands by combining the vibration change ratio and steady-state execution value. At the same time, it detects the transmission waiting time of each wafer cell on the conveyor belt in real time and performs speed reduction processing, thereby achieving adaptive optimization of the conveyor belt speed, ensuring the balance of coordinated scheduling between the conveyor belt and the robotic arm, avoiding excessive speed operation that could cause product accumulation, excessive vibration or excessive temperature, and thus improving the overall operating efficiency and safety of the storage system. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 The execution flowchart of the automated storage management and control method for the intelligent wafer storage cabinet provided in the embodiments of this application is shown. Figure 2 A flowchart illustrating the steps of an automated storage management method for an intelligent wafer storage cabinet provided in this application embodiment; Figure 3 The execution flowchart and iterative adjustment flowchart of the automated storage management and control method for the intelligent wafer storage cabinet provided in the embodiments of this application; Figure 4 This is a schematic diagram of the structure of an automated storage control system for an intelligent wafer storage cabinet provided in an embodiment of this application; Figure 5 This is a structural block diagram of an automated storage control device for an intelligent wafer storage cabinet provided in an embodiment of this application; Figure 6 A structural block diagram of the automated storage control device for the intelligent wafer storage cabinet provided in this application embodiment; a schematic diagram of the conveyor belt structure. Figure 7 A schematic diagram of the automated access module A of the automated storage management and control device for the intelligent wafer storage cabinet provided in this application embodiment; Figure 8 A schematic diagram of the rotary storage mechanism of the automated storage control device for the intelligent wafer storage cabinet provided in this embodiment of the application; Figure 9 A schematic diagram of the change in the number of wafer boxes in the warehouse of the automated storage management and control system of the intelligent wafer storage cabinet provided in the embodiments of this application; Figure 10 A schematic diagram of the overall view of the intelligent wafer storage cabinet, which is part of the automated storage management and control system for the intelligent wafer storage cabinet provided in the embodiments of this application; Figure 11 A schematic diagram illustrating the storage details of the intelligent wafer storage cabinet in the automated storage management and control system provided in this application embodiment; Figure 12 This is a schematic diagram illustrating the storage details of the intelligent wafer storage cabinet in the automated storage management and control system provided in this embodiment of the application.

[0015] Reference numerals: 1. Cabinet, 2. Feeding line, 3. Automated storage and retrieval module A, 4. Turntable storage mechanism, 5. Automated storage and retrieval module B, 6. Discharge line, 7. Central control unit, 8. Fan processing unit, 3-01. Six-axis robotic arm, 3-02. Single-piece gripper, 3-03. Wafer box gripper, 3-04. Vision recognition unit, 4-01. Rotary support platform, 4-02. Multi-layer wafer box placement plate, 4-03. Multi-layer wafer box, 4-04. Interlayer support column, 4-05. Sensor assembly, 2-01. Belt conveyor, 2-02. Wafer box, 2-03. Recognition unit. Detailed Implementation

[0016] The technical solution of the present invention will now be described with reference to the accompanying drawings.

[0017] In embodiments of the present invention, words such as "exemplarily," "for example," etc., are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplary" in the present invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the word "exemplary" is intended to present the concept in a concrete manner. Furthermore, in embodiments of the present invention, the meaning expressed by "and / or" can be both, or either one.

[0018] In the embodiments of this invention, the terms "image" and "picture" may sometimes be used interchangeably. It should be noted that, without emphasizing the distinction between them, they convey the same meaning. Similarly, the terms "of," "corresponding (relevant)," and "corresponding" may sometimes be used interchangeably. It should be noted that, without emphasizing the distinction between them, they convey the same meaning.

[0019] In this embodiment of the invention, sometimes a subscript such as W1 may be written in a non-subscript form such as W1. When the difference is not emphasized, the meaning they express is the same.

[0020] To make the technical problems, technical solutions and advantages of the present invention clearer, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0021] like Figure 1 The diagram shows the execution flowchart of the automated storage management method for an intelligent wafer storage cabinet provided in this application embodiment. The method includes the following steps: S1. When the intelligent wafer storage cabinet receives a wafer cassette transfer signal, the visual recognition unit of the robotic arm identifies the transferred wafer cassette, obtains the designated storage location of the wafer cassette, and issues a storage command to the rotary support platform. The robotic arm includes a first robotic arm and a second robotic arm; S2. After receiving the storage command, the rotary support platform controls the turntable storage mechanism to rotate to a designated angle and controls the robotic arm to store the wafer cassette in the designated storage location. The steady-state execution parameters of the turntable storage mechanism are obtained in real time, and the equipment adjustment command is obtained through analysis; S3. Based on the equipment adjustment command, the rotary support platform is adjusted accordingly to rotate back to the initial storage position. The adjusted equipment operating temperature is obtained, and a heat dissipation power adjustment execution command is obtained, thereby performing the corresponding heat dissipation power adjustment; S4. The real-time steady-state execution value after the heat dissipation power adjustment is obtained, and the secondary steady-state difference value is analyzed, thereby adjusting the conveyor belt speed increase.

[0022] In this embodiment, it should be noted that performing a difference analysis specifically involves performing difference processing, for example, performing a difference analysis on numerical value A and numerical value B to obtain a difference value. In the formula, C represents the degree of difference. It should be noted that C can be either positive or negative. For example, to analyze the degree of difference between the final equipment temperature and the equipment operating temperature threshold, the degree of difference in equipment temperature is obtained. Specifically, the difference between the final equipment temperature and the equipment operating temperature threshold is processed to obtain the difference in the final equipment operating temperature. The degree of difference in the final equipment operating temperature is then divided by the equipment operating temperature threshold to obtain the degree of difference in equipment temperature.

[0023] It should be noted that during the process of adjusting the conveyor belt speed, the robotic arm makes adaptive adjustments by recognizing the speed of the goods being transported on the conveyor belt. That is, to a certain extent, the speed of the robotic arm changes synchronously with the increase / decrease of the conveyor belt speed. However, there is an upper limit to the speed adjustment of the robotic arm. When the upper limit of the robotic arm speed is reached, the speed of the robotic arm remains unchanged. Therefore, at this time, a state will occur where the conveyor belt speed is fast and the robotic arm speed is slow, which manifests as the goods (wafer boxes) on the conveyor belt being stuck.

[0024] It should be noted that the secondary steady-state difference value is obtained as follows: the real-time steady-state execution value after the heat dissipation power adjustment is obtained and compared with the steady-state execution threshold. If the real-time steady-state execution value after the heat dissipation power adjustment is above the steady-state execution threshold, the secondary steady-state difference value is 0, and the conveyor belt speed increase adjustment is not performed. If the real-time steady-state execution value after the heat dissipation power adjustment is less than the steady-state execution threshold, the steady-state execution threshold is subtracted from the real-time steady-state execution value after the heat dissipation power adjustment to obtain the secondary steady-state difference value. The secondary steady-state difference value is obtained by dividing the secondary steady-state difference value by the steady-state execution threshold.

[0025] like Figure 2 As shown, Figure 2 The flowchart illustrates the steps of the automated storage management method for the intelligent wafer storage cabinet provided in this application embodiment. First, an adjustment command is received, and the rotational angular velocity of the rotary support platform is initially adjusted. Then, a heat dissipation power adjustment execution command is issued to complete the corresponding heat dissipation power adjustment operation, and the degree of difference in the second steady-state condition is calculated in real time to assess the deviation between the current system heat dissipation state and the target state. Based on this degree of difference, the conveyor belt speed is adjusted to achieve synergistic optimization of temperature control performance and conveying efficiency. Finally, the adjustment process is completed and the system enters the final state, ensuring that the equipment operates in a stable and efficient state.

[0026] Furthermore, the equipment adjustment instructions are obtained through the following methods: Real-time acquisition of the steady-state execution parameters of the rotary storage mechanism, including equipment operating temperature, rotational angular velocity, and load mass; acquisition of the preset steady-state execution reference set and vibration amplitude threshold from the database; acquisition of the vibration amplitude of the rotary storage mechanism and comparison with the vibration amplitude threshold; if the vibration amplitude is less than the vibration amplitude threshold, the vibration amplitude of the rotary storage mechanism is compared with the vibration amplitude threshold and inversely normalized to obtain the inverse vibration amplitude value; the steady-state execution parameters are compared with the steady-state execution reference set and vibration amplitude threshold and inversely normalized to obtain the inverse comparison value; and corresponding weighting factors are introduced based on the inverse vibration amplitude value and the inverse comparison value. The coupling process yields the steady-state execution value of the rotary storage mechanism. If the vibration amplitude exceeds the vibration amplitude threshold, the steady-state execution value of the rotary storage mechanism is defined as zero. The steady-state execution reference set includes the equipment operating temperature reference value, rotational angular velocity reference value, and load mass reference value. The steady-state execution value reflects the stability of the rotary storage mechanism during operation. The preset steady-state execution range in the database is obtained and compared with the steady-state execution value. If the steady-state execution value is within the steady-state execution range, the equipment adjustment instruction is to maintain the current state. If the steady-state execution value is greater than the maximum value of the steady-state execution range, the equipment adjustment instruction is to perform equipment efficiency enhancement processing. If the steady-state execution value is less than the minimum value of the steady-state execution range, the equipment adjustment instruction is to perform equipment efficiency reduction processing.

[0027] In this embodiment, the steady-state execution parameters, including vibration amplitude, equipment operating temperature (operating temperature of the smart wafer storage cabinet), rotational angular velocity, and load mass, can all be obtained through the background management system. The background management system is connected to various sensors (including temperature sensors, humidity sensors, speed sensors, and pressure sensors, etc.). Each sensor is distributed at different locations in the smart wafer storage cabinet and performs real-time status detection on the smart wafer storage cabinet, uploading the detected data to the background management system in real time.

[0028] The steady-state operating value of the rotary storage mechanism is obtained using the following method: ; In the formula, WT represents the steady-state execution value of the rotary storage mechanism, ZF represents the vibration amplitude, TF represents the vibration amplitude threshold, ZW represents the equipment operating temperature, TW represents the equipment operating temperature reference value, ZV represents the rotational angular velocity, TV represents the rotational angular velocity reference value, ZM represents the load mass, TM represents the load mass reference value, δ1 represents the vibration amplitude weighting factor, δ2 represents the equipment operating temperature weighting factor, δ3 represents the rotational angular velocity weighting factor, and δ4 represents the load mass weighting factor.

[0029] Vibration amplitude weighting factors, equipment operating temperature weighting factors, rotational angular velocity weighting factors, and load mass weighting factors can be obtained from a database. For example, the database stores historical vibration amplitudes, and these differences are processed to obtain historical vibration amplitude differences. A preset vibration amplitude difference threshold is retrieved from the database and compared with each historical vibration amplitude difference. Historical vibration amplitudes with differences less than the threshold are marked as historical reference vibration amplitudes. Historical weighting factors corresponding to each historical reference vibration amplitude are then obtained, resulting in historical vibration amplitude weighting factors. The mode of each historical vibration amplitude weighting factor is taken and used as the vibration amplitude weighting factor. If there are multiple modes, the mean is taken and used as the average of the resulting modes. Other weighting factors are obtained in a similar way to vibration amplitude weighting factors: their historical reference weighting factors are retrieved, and the mode of these historical reference factors is used as the weighting factor.

[0030] The analysis of steady-state operating parameters, including vibration amplitude, equipment operating temperature, rotational angular velocity, and load mass, takes into account the interrelationships between these parameters. For example, when the load mass increases, the turntable inertia increases, and the vibration amplitude and motor load increase accordingly, leading to an increase in equipment operating temperature. When the rotational speed is high and approaches the critical value, the vibration amplitude increases sharply and induces the risk of resonance, further accelerating the temperature rise and component wear. Excessive temperature will reduce lubrication performance and aggravate friction, forming a positive feedback effect of vibration amplification. If the speed is too high and the running time is too long, heat accumulation will actually increase the temperature.

[0031] Analyzing steady-state execution values ​​comprehensively reflects the stability of the rotary storage mechanism during operation. A higher steady-state execution value indicates smoother equipment operation, suggesting suitability for high-speed rotation and rapid warehousing, thus improving overall warehousing efficiency. Conversely, a low steady-state execution value indicates instability, potentially due to overheating, uneven load, or excessive vibration. Continuing high-speed operation in this state could lead to wafer cassette misalignment, scratching, or even damage during placement. By comparing the steady-state execution value with a preset steady-state execution range, corresponding equipment adjustment instructions are generated: when the steady-state execution value is higher than the maximum value of the range, efficiency enhancement is implemented to improve operating efficiency; when the steady-state execution value is lower than the minimum value of the range, efficiency reduction is implemented to decrease operating speed, reduce dynamic impact on the rotary table and robotic arm, and ensure wafer cassette safety. By generating equipment adjustment instructions based on the different relationships between the steady-state execution value and the steady-state execution range, a reasonable and coordinated control of equipment storage efficiency and storage safety is achieved.

[0032] Furthermore, the rotational angular velocity of the slewing support platform is adjusted accordingly based on the equipment adjustment command. The specific method is as follows: the steady-state execution value and steady-state execution range of the turntable material storage mechanism are analyzed to obtain the steady-state execution difference value; the steady-state execution difference value is matched with the database to obtain the steady-state execution adjustment coefficient; if the equipment adjustment command is to perform equipment efficiency enhancement processing, the rotational angular velocity of the slewing support platform is increased based on the steady-state execution adjustment coefficient; if the equipment adjustment command is to perform equipment efficiency reduction processing, the rotational angular velocity of the slewing support platform is decreased based on the steady-state execution adjustment coefficient; if the equipment adjustment command is to maintain the current state, the rotational angular velocity of the slewing support platform is maintained.

[0033] In this embodiment, the steady-state execution value and steady-state execution range of the rotary storage mechanism are analyzed to obtain the steady-state execution difference value. Specifically, if the steady-state execution value is greater than the maximum value of the steady-state execution range, the difference between the steady-state execution value and the maximum value of the steady-state execution range is analyzed to obtain the steady-state execution difference value. If the steady-state execution value is less than the minimum value of the steady-state execution range, the difference between the steady-state execution value and the minimum value of the steady-state execution range is analyzed to obtain the steady-state execution difference value.

[0034] By analyzing steady-state execution values ​​and intervals, the degree of steady-state execution difference is obtained, and a steady-state execution adjustment coefficient is matched to achieve dynamic adjustment of the rotational angular velocity of the rotary support platform. Increasing the rotational angular velocity when the steady-state execution value is high and the equipment is operating smoothly shortens the time for turntable positioning and wafer cassette loading, improving overall loading efficiency. Conversely, decreasing the rotational angular velocity when the steady-state execution value is low or unstable factors such as overheating or increased vibration occur reduces the dynamic impact and residual vibration of the turntable, avoiding the risk of wafer cassette displacement, scratching, or damage during loading. Through angular velocity adjustment, the rotary support platform can fully utilize its performance while ensuring operational safety, achieving comprehensive optimization of operational efficiency and storage security.

[0035] The steady-state execution adjustment coefficient is obtained by matching the steady-state execution difference value with the database. The specific method is as follows: obtain each preset historical steady-state execution difference value in the database, compare it with the steady-state execution difference value, select the historical steady-state execution difference value that is closest to the steady-state execution difference value as the historical reference steady-state execution difference value, and use the historical steady-state execution adjustment coefficient corresponding to the historical reference steady-state execution difference value as the steady-state execution adjustment coefficient. If there are several historical reference steady-state execution difference values, obtain several historical reference steady-state execution adjustment coefficients corresponding to these several historical reference steady-state execution difference values, and average these several historical reference steady-state execution adjustment coefficients to obtain the average of the historical steady-state execution adjustment coefficients, which is used as the steady-state execution adjustment coefficient.

[0036] To increase the rotational angular velocity of the slewing support platform using a steady-state adjustment factor, the method is to add the product of the rotational angular velocity and the steady-state adjustment factor to the existing rotational angular velocity. Conversely, to decrease the rotational angular velocity of the slewing support platform using the same steady-state adjustment factor, the method is to subtract the product of the rotational angular velocity and the steady-state adjustment factor from the existing rotational angular velocity.

[0037] Furthermore, the heat dissipation power adjustment execution command is obtained. Specifically, the following method is used: The equipment operating temperatures at the first and last moments of a preset time period after the rotational angular velocity adjustment are obtained and marked as the first moment's equipment temperature and the last moment's equipment temperature, respectively, thus obtaining the first equipment temperature change. The preset equipment operating temperature threshold and temperature change threshold in the database are obtained and compared with the last moment's equipment temperature and the first equipment temperature change, respectively, to obtain the heat dissipation power adjustment execution command. If the last moment's equipment temperature is less than the equipment operating temperature threshold, and the first equipment temperature change is less than the temperature change threshold, then the heat dissipation power adjustment execution command is to reduce the heat dissipation power. If the last moment's equipment temperature is less than the equipment operating temperature threshold, and the first equipment temperature change is above the temperature change threshold, then the heat dissipation power adjustment execution command is to not adjust the heat dissipation power. If the last moment's equipment temperature is above the equipment operating temperature threshold, then the heat dissipation power adjustment execution command is to increase the heat dissipation power.

[0038] In this embodiment, as Figure 3 As shown, Figure 3 The execution flowchart of the automated storage management method for the intelligent wafer storage cabinet provided in this application embodiment is an iterative adjustment flowchart. First, it enters a multi-round execution speed iterative adjustment process, acquiring the vibration change ratio and steady-state execution change ratio after each round of adjustment, as well as the real-time steady-state execution value, and generating a first iteration stop command and a second iteration stop command. These two commands are input in parallel to the same judgment node to confirm whether there are conditions for stopping the speed iteration process. If the stopping conditions are met, the conveyor belt speed increase adjustment is completed ahead of schedule and the process ends; if the conditions are not met, the next round of iterative adjustment continues until the optimization target is achieved. This process emphasizes improving the accuracy of iterative stop judgment through parallel judgment, balancing equipment efficiency and operational accuracy.

[0039] It should be noted that the temperature change of the first device is the temperature of the last device minus the temperature of the first device. Therefore, the temperature can be positive or negative. Under normal circumstances, without additional cooling or changes in operating conditions, the device will accumulate heat as it continues to run. Therefore, the temperature change of the first device is usually positive.

[0040] By collecting data on the equipment's operating temperature at the beginning and end of each rotational angular velocity adjustment, and calculating the initial temperature change, a heat dissipation power adjustment command is generated based on preset operating temperature and temperature change thresholds. This allows for dynamic adjustment of the heat dissipation power. Increasing the heat dissipation power when the equipment temperature exceeds the threshold at the end of the adjustment accelerates cooling, bringing the operating temperature back to a reasonable range quickly. This reduces the risk of vibration and operational instability caused by overheating and improves steady-state performance. Conversely, reducing the heat dissipation power when the equipment temperature is below the threshold and the temperature change is small avoids excessive cooling, preventing energy waste and temperature fluctuations. This keeps the equipment in optimal thermal equilibrium, improving operational stability. Dynamically adjusting the heat dissipation power ensures the rotary support platform's operating temperature remains within the optimal range, thereby increasing the steady-state performance and guaranteeing the smoothness of the turntable's operation. This provides a reliable foundation for subsequent high-speed rotation and efficient warehousing.

[0041] Furthermore, corresponding heat dissipation power adjustments are made. Specifically, the following methods are employed: First, a temperature difference value is obtained by analyzing the difference between the final device temperature and the device operating temperature threshold, and this value is marked as the first temperature difference value. Second, a temperature change value is obtained by analyzing the difference between the first device temperature change and the temperature change threshold. Third, if the heat dissipation power adjustment execution command is a heat dissipation power reduction command, corresponding weighting factors are introduced based on the first temperature difference value and the first temperature change value for coupling processing to obtain a comprehensive temperature difference value. This comprehensive temperature difference value is then matched with a database to obtain a heat dissipation power adjustment ratio, and the heat dissipation power is reduced based on this ratio. Fourth, if the heat dissipation power adjustment execution command is a no-heat dissipation power adjustment command, then no heat dissipation power adjustment is performed. Fifth, if the heat dissipation power adjustment execution command is a heat dissipation power increase command, the first temperature difference value is matched with a database to obtain a heat dissipation power adjustment ratio, and the heat dissipation power is increased based on this ratio.

[0042] In this embodiment, the comprehensive value of temperature difference is obtained by the following method: ; In the formula, YL represents the comprehensive temperature difference value, TA represents the first temperature difference value, TB represents the first temperature change value, τ1 represents the weighting factor for the first temperature difference, and τ2 represents the weighting factor for the first temperature change.

[0043] The weighting factors for the first temperature difference degree and the first temperature change degree can be obtained from a database. For example, the historical first temperature difference degree values ​​stored in the database are retrieved, and the difference between these values ​​is calculated to obtain the historical first temperature difference degree difference values. A preset threshold for the first temperature difference degree difference in the database is retrieved and compared with each historical first temperature difference degree difference value. Historical first temperature difference degree values ​​whose differences are less than the threshold are marked as historical reference first temperature difference degree values. The historical weighting factors corresponding to each historical reference first temperature difference degree value are retrieved, resulting in weighting factors for each historical first temperature difference degree value. The mode of each historical first temperature difference degree value weighting factor is taken and used as the first temperature difference degree weighting factor. If there are multiple modes, the mean is taken and used as the first temperature difference degree weighting factor. The other first temperature change degree weighting factors are obtained in a similar way to the first temperature difference degree weighting factor, which involves retrieving their historical reference weighting factors and using the mode of the historical reference weighting factors as the weighting factors.

[0044] The method involves matching the comprehensive temperature difference value with a database to obtain the heat dissipation power adjustment ratio. Specifically, the method is as follows: obtain the preset comprehensive temperature difference values ​​in the database and compare them with the comprehensive temperature difference values. Select the comprehensive temperature difference value that is closest to the comprehensive temperature difference value as the historical reference comprehensive temperature difference value, and use the historical heat dissipation power adjustment ratio corresponding to the historical reference comprehensive temperature difference value as the heat dissipation power adjustment ratio. If there are several historical reference comprehensive temperature difference values, obtain several historical reference heat dissipation power adjustment ratios corresponding to these several historical reference comprehensive temperature difference values, and average these several historical reference heat dissipation power adjustment ratios to obtain the average historical heat dissipation power adjustment ratio, which is used as the heat dissipation power adjustment ratio.

[0045] The heat dissipation power adjustment ratio is obtained by matching the first temperature difference value with the database. Specifically, the method is as follows: Preset historical first temperature difference values ​​are obtained from the database and compared with the first temperature difference value. The historical first temperature difference value closest to the first temperature difference value is selected as the historical reference first temperature difference value. The historical heat dissipation power adjustment ratio corresponding to this historical reference first temperature difference value is used as the heat dissipation power adjustment ratio. If there are several historical reference first temperature difference values, the corresponding historical reference heat dissipation power adjustment ratios are obtained, and the average of these historical reference heat dissipation power adjustment ratios is calculated to obtain the average historical heat dissipation power adjustment ratio, which is then used as the heat dissipation power adjustment ratio. Increasing the heat dissipation power based on the heat dissipation power adjustment ratio involves adding the current heat dissipation power to the product of the current heat dissipation power and the heat dissipation power adjustment ratio. Decreasing the heat dissipation power based on the heat dissipation power adjustment ratio involves subtracting the product of the current heat dissipation power and the heat dissipation power adjustment ratio from the current heat dissipation power to obtain the heat dissipation power reduction.

[0046] By combining the differences between the final device temperature and the device operating temperature threshold, and the temperature change of the first device and the temperature change threshold, a comprehensive temperature difference value is obtained. Based on this comprehensive temperature difference value, the heat dissipation power is dynamically adjusted to achieve refined temperature control management. When both the temperature difference value and the temperature change value are small and below the threshold, the heat dissipation power is reduced to avoid excessive heat dissipation leading to excessively low temperatures and energy waste, maintaining the device in a suitable thermal equilibrium state and ensuring device stability. Increasing the heat dissipation power requires controlling the fan output power; higher fan output power may lead to more severe fan vibration, causing vibration and affecting the entire intelligent wafer storage cabinet. When the temperature is within a reasonable range but the rate of change is large, the heat dissipation power is not adjusted to prevent frequent adjustments that cause temperature fluctuations and vibration, ensuring the continuity and stability of device operation. When the final device temperature exceeds the threshold, the heat dissipation power is increased to accelerate the cooling rate, quickly returning the temperature to a safe range. This prevents damage caused by excessive temperature, increased vibration amplitude, and unstable turntable rotation, which could damage the wafer cassette during storage and retrieval.

[0047] Furthermore, the conveyor belt speed is adjusted. Specifically, the following method is used: The steady-state difference value is matched with the database to obtain the steady-state execution speed adjustment ratio. This ratio is then coupled with the current conveyor belt speed to obtain a reference value for speed adjustment. A preset speed adjustment step size is obtained from the database. Multiple rounds of iterative speed adjustment are performed based on this step size, gradually increasing the current conveyor belt speed. The steady-state execution value and equipment vibration value are acquired in real-time for each round, thus obtaining the vibration change ratio after each adjustment round (where the adjustment ratio for each round is obtained). The vibration change ratio after each round is calculated by subtracting the equipment vibration value from the previous round's value in each round, and then dividing the equipment vibration change value by the previous round's value to obtain the vibration change ratio after each round's adjustment. Based on the vibration change ratio and equipment vibration value analysis after each round's adjustment, a first iteration stop command is obtained, which includes stopping the speed iteration processing and continuing the speed iteration processing. Real-time steady-state execution values ​​during the multi-round iterative adjustment process are obtained and analyzed to obtain a second iteration stop command, which includes stopping the speed iteration processing and continuing the speed iteration processing. The system performs speed iteration processing. Based on the analysis of the first and second iteration stop instructions, if the first and / or second iteration stop instructions indicate a halt to speed iteration processing, the conveyor belt speed increase adjustment is completed in advance. If the first and / or second iteration stop instructions indicate a continuation of speed iteration processing, multiple rounds of conveyor belt speed iteration adjustment are performed until the conveyor belt speed reaches the reference value for adjustment. The first iteration stop instruction is obtained as follows: if the vibration change ratio in a certain round is greater than the preset vibration change ratio threshold in the database and the equipment vibration value is less than the preset equipment vibration threshold, the first iteration stop instruction is to stop speed iteration processing, and the system continues to operate at the current conveyor belt speed. It should be noted that if the vibration change ratio in a certain round is greater than the preset vibration change ratio threshold in the database but the equipment vibration value is above the preset equipment vibration threshold, no additional processing is performed (i.e., normal operation continues). If the equipment vibration value in a certain round is greater than the preset equipment vibration threshold in the database, the first iteration stop instruction is to continue speed iteration processing, and the conveyor belt is controlled to continue operating at the speed corresponding to the previous round.

[0048] In this embodiment, the steady-state execution speed adjustment ratio is obtained by matching the second-order steady-state difference value with the database. The specific method is as follows: obtain each preset historical second-order steady-state difference value in the database, compare it with the second-order steady-state difference value, select the historical second-order steady-state difference value that is closest to the second-order steady-state difference value as the historical reference second-order steady-state difference value, and use the historical steady-state execution speed adjustment ratio corresponding to the historical reference second-order steady-state difference value as the steady-state execution speed adjustment ratio. If there are several historical reference second-order steady-state difference values, obtain several historical reference steady-state execution speed adjustment ratios corresponding to these several historical reference second-order steady-state difference values, and average these several historical reference steady-state execution speed adjustment ratios to obtain the average historical steady-state execution speed adjustment ratio, which is used as the steady-state execution speed adjustment ratio.

[0049] The conveyor belt speed adjustment reference value is obtained by coupling the steady-state execution speed adjustment ratio with the current conveyor belt execution speed. Specifically, the current conveyor belt execution speed is multiplied by the steady-state execution speed adjustment ratio. It should be noted that the conveyor belt speed adjustment reference value refers to the specific speed adjustment amount of the conveyor belt execution speed.

[0050] It should be noted that because the speed adjustment process involves iterative adjustments to the conveyor belt speed, the conveyor belt speed gradually increases. This necessitates a gradual increase in the conveyor belt's operating power, consequently leading to a gradual increase in the vibration amplitude. However, gradually increasing the operating power during the adjustment process will result in a larger vibration amplitude. Furthermore, if the operating power is high, the vibration amplitude will not increase linearly; rather, the greater the operating power, the greater the proportional change in vibration.

[0051] By matching the secondary steady-state difference value with a database to obtain a reference value for conveyor belt speed adjustment, and combining this with a preset conveyor speed adjustment step size, multiple rounds of iterative adjustment are performed to gradually increase the conveyor belt execution speed. This avoids the operational shock and mechanical overload caused by a large adjustment at once, ensuring a smooth conveying process. In each iteration, steady-state execution values ​​and equipment vibration values ​​are collected in real time, and the vibration change ratio is analyzed. The iteration can be stopped early when the vibration change ratio is less than a threshold, preventing structural fatigue or damage caused by continued adjustment when the equipment is near its limits. When the vibration change ratio is small but the equipment vibration value has exceeded the threshold, the control rolls back to the previous safe execution speed, keeping the conveyor belt operation within a safe and stable range and avoiding damage to the wafer cassette caused by high vibration. By comprehensively analyzing the first and second iteration stop commands, speed adjustment can be completed before reaching the optimal conveyor belt speed, ensuring both improved conveyor belt operating efficiency and stable equipment operation, preventing wafer cassette damage.

[0052] Furthermore, the second iteration stop instruction is obtained as follows: The real-time steady-state execution value during multiple iterations is acquired and marked as the real-time steady-state execution value for iteration adjustment. If the real-time steady-state execution value is greater than the maximum value of the steady-state execution interval, the second iteration stop instruction is to continue speed iteration processing. If the real-time steady-state execution value is within the steady-state execution interval, the second iteration stop instruction is to stop speed iteration processing and continue running at the current conveyor belt execution speed. If the real-time steady-state execution value is less than the minimum value of the steady-state execution interval, the second iteration stop instruction is to stop speed iteration processing and control the conveyor belt to continue running at the speed corresponding to the previous round. If the second iteration stop instruction is to continue the speed iteration processing, then the difference between the real-time steady-state execution value of the iteration adjustment and the real-time steady-state execution value of the previous iteration adjustment is analyzed to obtain the steady-state difference ratio of the iteration adjustment. Based on the steady-state difference ratio of the iteration adjustment, it is determined whether to perform the corresponding transmission speed adjustment step size reduction processing. Specifically, the determination of whether to perform the corresponding transmission speed adjustment step size reduction processing is as follows: obtain the preset steady-state difference ratio threshold of the iteration adjustment in the database and compare it with the steady-state difference ratio of the iteration adjustment. If the steady-state difference ratio of the iteration adjustment is above the steady-state difference ratio threshold of the iteration adjustment, then the transmission speed adjustment step size reduction processing is performed; otherwise, the transmission speed adjustment step size reduction processing is not performed.

[0053] In this embodiment, by acquiring the steady-state execution value during multiple rounds of iterative adjustment in real time and comparing it with the steady-state execution range, precise control of the conveyor belt speed adjustment process is achieved: when the real-time steady-state execution value of the iterative adjustment is within the steady-state execution range, the speed iteration process is stopped in time to ensure stable operation of the conveyor belt at the current speed, avoiding unnecessary speed fluctuations caused by over-adjustment; when the real-time steady-state execution value of the iterative adjustment is less than the minimum value of the steady-state execution range, the speed automatically reverts to the safe speed of the previous round to ensure that the equipment does not enter the low steady-state abnormal zone, preventing excessively low operating efficiency or mechanical instability; when the real-time steady-state execution value of the iterative adjustment is greater than the maximum value of the steady-state execution range, the speed iteration process continues, and a judgment is made based on the steady-state difference ratio of the iterative adjustment. If the difference ratio is large, the speed adjustment step size is automatically reduced, making subsequent adjustments smoother and more gradual, reducing vibration and mechanical shock caused by excessively rapid speed changes. Through the dynamic judgment of the difference ratio threshold and the step size reduction processing described above, adaptive optimization of the speed adjustment process is achieved, balancing efficiency improvement and equipment operating stability, and reducing potential damage risks.

[0054] The transmission speed adjustment step size reduction process is performed. Specifically, the historical transmission speed adjustment step size stored in the database is obtained and analyzed in conjunction with the current transmission speed adjustment step size. The historical transmission speed adjustment step size that is smaller than and closest to the current transmission speed adjustment step size is selected as the reduced transmission speed adjustment step size. It should be noted that the adjustment step size in the past was a fixed value preset in the database, such as 0.03 m / s, 0.04 m / s, and 0.05 m / s.

[0055] Furthermore, it also includes real-time detection of the goods transportation status of the conveyor belt and determination of whether to adjust the conveyor belt speed. The specific method is as follows: the goods transportation status during the operation of the conveyor belt is obtained, and the transmission waiting time of each wafer cell on the conveyor belt is obtained. The transmission waiting time can be detected by the monitoring unit in the intelligent wafer storage cabinet. Based on the analysis of the transmission waiting time of each wafer cell, a conveyor belt deceleration judgment instruction is obtained. If the transmission waiting time of a certain item is greater than the preset transmission waiting time in the database, the conveyor belt deceleration judgment instruction is to execute the conveyor belt speed reduction process; otherwise, the conveyor belt speed reduction judgment instruction is not to execute the conveyor belt speed reduction process.

[0056] In this embodiment, it should be noted that the specific method for performing conveyor belt speed reduction is as follows: obtain the preset speed reduction execution step size of the conveyor belt in the database, and gradually reduce the running speed of the conveyor belt based on the speed reduction execution step size until the waiting time of any wafer cell is no longer greater than the preset transmission waiting time in the database.

[0057] By monitoring the transport status of each wafer cassette on the conveyor belt in real time and analyzing the transmission waiting time, the system determines whether to implement conveyor belt speed reduction. When the transmission waiting time of a particular wafer cassette exceeds a preset threshold in the database, it indicates that the operating speed of the robotic arm inside the intelligent wafer storage cabinet is approaching its safe limit, while the conveyor belt speed is relatively too high. This causes the goods to accumulate and wait during transport, potentially leading to transport shocks or excessive wafer cassette stacking. By controlling the conveyor belt speed, not only can the problems of goods accumulation and long waiting times be alleviated, but equipment vibration and additional heat generated by high-speed operation can also be reduced. This improves the overall operational stability of the equipment, ensures the safe coordinated scheduling of the robotic arm and conveyor belt, and maintains the integrity of the wafer cassettes during the storage process.

[0058] like Figure 4The diagram shown is a structural schematic of an automated storage management system for an intelligent wafer storage cabinet provided in this application embodiment. The automated storage management system for an intelligent wafer storage cabinet provided in this application embodiment includes: a storage location acquisition module, a steady-state analysis module, a heat dissipation power adjustment module, and a conveyor belt speed adjustment module. The storage location acquisition module is used to, when the intelligent wafer storage cabinet receives a signal from the conveyor belt to transport a wafer cassette, have the robotic arm's vision recognition unit identify the transported wafer cassette, obtain the designated storage location of the wafer cassette, and issue a storage command to the rotary support platform. The steady-state analysis module is used to, upon receiving a signal from the rotary support platform... After receiving the storage command, the system controls the turntable material storage mechanism to rotate to a specified angle and controls the robotic arm to store the wafer cassette in the specified storage location. It acquires the steady-state execution parameters of the turntable material storage mechanism in real time and analyzes them to obtain equipment adjustment commands. The heat dissipation power adjustment module adjusts the rotational angular velocity of the rotary support platform based on the equipment adjustment commands, acquires the adjusted equipment operating temperature, obtains the heat dissipation power adjustment execution command, and performs corresponding heat dissipation power adjustments. The conveyor belt speed adjustment module acquires the real-time steady-state execution value after heat dissipation power adjustment and analyzes the degree of difference in the secondary steady-state state, thereby adjusting the conveyor belt speed increase.

[0059] like Figure 5 As shown, Figure 5This is a structural block diagram of an automated storage control device for an intelligent wafer storage cabinet provided in an embodiment of this application. The device is used in an automated storage control method for an intelligent wafer storage cabinet. It includes a cabinet body 1, a feeding line 2, an automated storage and retrieval module A3, a rotary storage mechanism 4, an automated storage and retrieval module B5, a discharge line 6, a central control unit 7, a fan processing unit 8, and a sensor control unit. The sensor control unit is installed on the side wall of the fan processing unit to detect wind speed and is also installed inside the rotary storage mechanism to detect the environment within the rotary storage mechanism, including temperature and humidity. Automated storage and retrieval modules A3 and B5 include a six-axis robotic arm 3-01. The end of the six-axis robotic arm 3-01 is equipped with a single-chip gripper 3-02 and a wafer cassette gripper 3-03. The end of the six-axis robotic arm 3-01 is equipped with a vision recognition unit 3-04. The single-chip gripper 3-02 is used to grasp single wafers, and the wafer cassette gripper 3-03 is used to grasp wafer cassettes 2-02. The turntable storage mechanism 4 is a rotary structure. The rotation of the turntable storage mechanism 4 is controlled by a rotary support platform 4-01. The rotary support platform 4-01 is equipped with multi-layer wafer cassettes 4-03 and multi-layer wafer cassette placement plates 4-02. 02 is connected by interlayer support columns 4-04. The turntable storage mechanism 4 is equipped with sensor components 4-05 to identify vibration amplitude. The feeding line 2 includes a belt conveyor 2-01, with identification units 2-03 at both ends to identify wafer boxes or wafers. The central control unit 7 is used to send and receive commands and coordinate the operation of the intelligent wafer storage cabinet. The fan processing unit 8 is used to control the fan speed. The sensor control unit is used to monitor the temperature, humidity, and wind speed at various locations inside the cabinet and to maintain the purity of the inert gas. Feed line 2 is fixedly connected to the feed end of cabinet 1; automated storage and retrieval module A3 and automated storage and retrieval module B5 communicate with central control unit 7 via electrical connection and are mechanically connected to turntable storage mechanism 4 and discharge line 6; discharge line 6 is connected to the output end of turntable storage mechanism 4, and the output end is connected to the outside of cabinet 1; fan processing unit 8 is connected to the air channel inside cabinet 1 and communicates with central control unit 7 via electrical connection; sensor control units are arranged in multiple positions inside cabinet 1 and are signal connected to central control unit 7.

[0060] like Figure 6 , Figure 7 and Figure 8 As shown, Figure 6 This is a structural block diagram of the automated storage control device for the intelligent wafer storage cabinet provided in an embodiment of this application, and a schematic diagram of the conveyor belt structure. Figure 7 This is a schematic diagram of the automated access module A of the automated storage management device for the intelligent wafer storage cabinet provided in this application embodiment. The automated access module A has the same structure as the automated access module B. Figure 8This is a schematic diagram of the rotary storage mechanism of the automated storage and control device for the intelligent wafer storage cabinet provided in this application embodiment. The diagram shows the specific composition of the conveyor belt, automated storage and retrieval module, and rotary storage mechanism inside the intelligent wafer storage cabinet.

[0061] like Figure 9 and Figure 10 As shown, Figure 9 This is a schematic diagram illustrating the change in the number of wafer cells in the warehouse of the automated storage management system for the intelligent wafer storage cabinet provided in this application embodiment. Figure 10 This is a schematic diagram of the overall view of the intelligent wafer storage cabinet of the automated storage management and control system provided in the embodiments of this application. The diagram shows the changes in the number of wafer boxes in the warehouse at various points in time, the overall trend of changes within a day, and whether the intelligent wafer storage cabinet is operating normally.

[0062] like Figure 11 and Figure 12 As shown, Figure 11 A schematic diagram illustrating the storage details of the intelligent wafer storage cabinet in the automated storage management and control system provided in this application embodiment. Figure 12 This is a schematic diagram showing the storage details of the intelligent wafer storage cabinet in the automated storage management and control system provided in this application embodiment. The diagram shows the current warning information of the device, as well as the device's operating status and operating environment, and it can be remotely controlled.

[0063] In summary, this embodiment obtains steady-state execution values ​​by analyzing the steady-state execution parameters of the turntable material storage mechanism in real time and generates equipment adjustment instructions. This enables the equipment to be adjusted to increase or decrease efficiency based on the operating status of the turntable material storage mechanism, effectively ensuring the stable and efficient operation of the wafer storage process, improving wafer storage efficiency, and avoiding wafer cell damage or storage deviation during high-speed operation. This effectively solves the problem of not being able to balance storage efficiency and equipment storage accuracy in the prior art.

[0064] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, systems, or computer program products. Therefore, the present invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0065] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0066] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0067] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. An automated storage control method for an intelligent wafer storage cabinet, characterized in that, Includes the following steps: S1. When the intelligent wafer storage cabinet receives the wafer box transmission signal, the vision recognition unit of the robotic arm identifies the transmitted wafer box, obtains the designated storage location of the wafer box, and sends a storage command to the rotary support platform. The robotic arm includes a first robotic arm and a second robotic arm. S2. After receiving the storage command, the rotary support platform controls the turntable storage mechanism to rotate to the specified angle and controls the robotic arm to store the wafer cassette in the specified storage position. It obtains the steady-state execution parameters of the turntable storage mechanism in real time and analyzes them to obtain the equipment adjustment command. S3. Based on the equipment adjustment command, adjust the rotational angular velocity of the slewing support platform accordingly, control the slewing support platform to rotate back to the initial storage position, obtain the adjusted equipment operating temperature, obtain the heat dissipation power adjustment execution command, and thus perform the corresponding heat dissipation power adjustment. S4. Obtain the real-time steady-state execution value after the heat dissipation power is adjusted, and analyze the degree of difference in the second steady state to adjust the speed increase of the conveyor belt.

2. The automated storage control method for the intelligent wafer storage cabinet as described in claim 1, characterized in that: The specific method for obtaining the device adjustment command is as follows: The steady-state execution parameters of the rotary storage mechanism are acquired in real time, including the equipment operating temperature, rotational angular velocity, and load mass. Obtain the preset steady-state execution reference set and vibration amplitude threshold from the database; The vibration amplitude of the rotary storage mechanism is obtained and compared with the vibration amplitude threshold. If the vibration amplitude is less than the vibration amplitude threshold, the vibration amplitude of the rotary storage mechanism is compared with the vibration amplitude threshold and normalized inversely to obtain the vibration amplitude inverse processing value. The steady-state execution parameter is compared with the steady-state execution reference set and the vibration amplitude threshold and normalized inversely to obtain the comparison normalized inverse processing value. Based on the vibration amplitude inverse processing value and the comparison normalized inverse processing value, the corresponding weighting factor is introduced for coupling processing to obtain the steady-state execution value of the rotary storage mechanism. If the vibration amplitude is above the vibration amplitude threshold, the steady-state execution value of the rotary storage mechanism is defined as zero. The steady-state execution reference set includes equipment operating temperature reference value, rotational angular velocity reference value, and cargo mass reference value; The steady-state execution value is used to reflect the stability of the rotary storage mechanism during operation; The system retrieves the preset steady-state execution range from the database and compares it with the steady-state execution value. If the steady-state execution value is within the steady-state execution range, the device adjustment instruction is to maintain the current state. If the steady-state execution value is greater than the maximum value of the steady-state execution range, the device adjustment instruction is to perform device efficiency enhancement processing. If the steady-state execution value is less than the minimum value of the steady-state execution range, the device adjustment instruction is to perform device efficiency degradation processing.

3. The automated storage control method for the intelligent wafer storage cabinet as described in claim 1, characterized in that: The method for adjusting the rotational angular velocity of the slewing support platform based on equipment adjustment commands is as follows: Based on the analysis of the steady-state execution value and steady-state execution range of the rotary storage mechanism, the degree of steady-state execution difference is obtained; The steady-state execution adjustment coefficient is obtained by matching the steady-state execution difference value with the database. If the equipment adjustment command is to perform equipment efficiency enhancement processing, the rotational angular velocity of the slewing support platform is increased based on the steady-state adjustment coefficient. If the equipment adjustment command is to perform equipment efficiency reduction processing, the rotational angular velocity of the slewing support platform is decreased based on the steady-state adjustment coefficient. If the equipment adjustment command is to maintain the current state, the rotational angular velocity of the slewing support platform is maintained.

4. The automated storage control method for the intelligent wafer storage cabinet as described in claim 1, characterized in that: The specific method for obtaining the heat dissipation power adjustment execution command is as follows: The equipment operating temperature at the first and last moments within a preset time period after the rotational angular velocity adjustment is obtained, and these temperatures are marked as the first moment equipment temperature and the last moment equipment temperature, respectively, thereby obtaining the first equipment temperature change. Obtain the preset device operating temperature threshold and temperature change threshold from the database, and compare them with the device temperature at the last moment and the temperature change of the first device, respectively, to obtain the heat dissipation power adjustment execution instruction. If the device temperature at the last moment is less than the device operating temperature threshold and the temperature change of the first device is less than the temperature change threshold, then the heat dissipation power adjustment execution instruction is to reduce the heat dissipation power. If the temperature of the last device is lower than the operating temperature threshold and the temperature change of the first device is above the temperature change threshold, then the heat dissipation power adjustment execution command is to not perform heat dissipation power adjustment. If the device temperature at the last moment is above the device operating temperature threshold, the heat dissipation power adjustment command will be to increase the heat dissipation power.

5. The automated storage control method for the intelligent wafer storage cabinet as described in claim 4, characterized in that: The method for adjusting the heat dissipation power accordingly is as follows: Based on the difference between the final equipment temperature and the equipment operating temperature threshold, the equipment temperature difference value is obtained and marked as the first temperature difference value. Based on the difference between the temperature change of the first device and the temperature change threshold, the first temperature change degree value is obtained; If the heat dissipation power adjustment execution instruction is a heat dissipation power reduction instruction, then based on the first temperature difference degree value and the first temperature change degree value, the corresponding weighting factors are introduced for coupling processing to obtain the comprehensive temperature difference degree value. Based on the comprehensive temperature difference degree value, the heat dissipation power adjustment ratio is obtained by matching with the database. Based on the heat dissipation power adjustment ratio, the heat dissipation power is reduced. If the instruction to adjust the heat dissipation power is "Do not adjust heat dissipation power", then no heat dissipation power adjustment will be performed. If the instruction to adjust the heat dissipation power is to increase the heat dissipation power, then the heat dissipation power adjustment ratio is obtained by matching the first temperature difference value with the database, and the heat dissipation power is increased based on the heat dissipation power adjustment ratio.

6. The automated storage control method for the intelligent wafer storage cabinet as described in claim 1, characterized in that: The specific method for adjusting the conveyor belt speed is as follows: The steady-state difference value is matched with the database to obtain the steady-state execution speed adjustment ratio. The steady-state execution speed adjustment ratio is coupled with the current conveyor belt execution speed to obtain the conveyor belt speed adjustment reference value. The system obtains the preset conveyor speed adjustment step size from the database, performs multiple rounds of iterative adjustment of the conveyor belt execution speed based on the conveyor speed adjustment step size, gradually increases the current execution speed of the conveyor belt, and obtains the steady-state execution value and equipment vibration value of each round in real time, thereby obtaining the vibration change ratio after each round of adjustment; Based on the analysis of the vibration change ratio and equipment vibration value after each round of adjustment, the first iteration stop command is obtained. The first iteration stop command includes stopping the speed iteration process and continuing to execute the speed iteration process. The real-time steady-state execution value during the multi-round iterative adjustment process is obtained, and the second iteration stop instruction is obtained by analysis. The second iteration stop instruction includes stopping the speed iteration process and continuing to execute the speed iteration process. Based on the analysis of the first and second iteration stop instructions, if the first and / or second iteration stop instructions are to stop the speed iteration process, the conveyor belt speed increase adjustment is completed in advance; if the first and / or second iteration stop instructions are to continue the speed iteration process, multiple rounds of conveyor belt execution speed iteration adjustment are continued until the conveyor belt execution speed reaches the conveyor belt speed adjustment reference value and the adjustment ends. The specific method for obtaining the first iteration stop instruction is as follows: If the vibration change ratio of a certain cycle is greater than the preset vibration change ratio threshold in the database and the equipment vibration value is less than the preset equipment vibration threshold, then the first iteration stop instruction is to stop the speed iteration processing and continue running at the current conveyor belt execution speed. If the equipment vibration value in a certain round exceeds the preset equipment vibration threshold in the database, the first iteration stop instruction is to continue the speed iteration processing and control the conveyor belt to continue running according to the conveyor belt execution speed corresponding to the previous round.

7. The automated storage control method for the intelligent wafer storage cabinet as described in claim 6, characterized in that: The specific method for obtaining the second iteration stop instruction is as follows: Obtain the real-time steady-state execution value during multiple rounds of iterative adjustment and mark it as the real-time steady-state execution value of iterative adjustment; If the real-time steady-state execution value of the iterative adjustment is greater than the maximum value of the steady-state execution range, the second iteration stop instruction is to continue the speed iteration processing. If the real-time steady-state execution value of the iterative adjustment is within the steady-state execution range, the second iteration stop instruction is to stop the speed iteration processing and continue running at the current conveyor belt execution speed. If the real-time steady-state execution value of the iterative adjustment is less than the minimum value of the steady-state execution range, the second iteration stop instruction is to stop the speed iteration processing and control the conveyor belt to continue running according to the conveyor belt execution speed corresponding to the previous round. If the second iteration stop instruction is to continue the speed iteration processing, then the difference between the real-time steady-state execution value of the iteration adjustment and the real-time steady-state execution value of the previous iteration adjustment is analyzed to obtain the steady-state difference ratio of the iteration adjustment. Based on the steady-state difference ratio of the iteration adjustment, it is determined whether to perform the corresponding transmission speed adjustment step size reduction processing. The determination of whether to perform the corresponding transmission speed adjustment step size reduction process is as follows: obtain the preset iterative adjustment steady-state difference ratio threshold in the database and compare it with the iterative adjustment steady-state difference ratio. If the iterative adjustment steady-state difference ratio is above the iterative adjustment steady-state difference ratio threshold, then the transmission speed adjustment step size reduction process is performed; otherwise, the transmission speed adjustment step size reduction process is not performed.

8. The automated storage control method for the intelligent wafer storage cabinet as described in claim 1, characterized in that: It also includes real-time monitoring of the goods transport status on the conveyor belt and determining whether to adjust the conveyor belt speed. The specific method is as follows: The transport status of goods during the operation of the conveyor belt is obtained, and the transmission waiting time of each wafer cell on the conveyor belt is obtained. Based on the analysis of the transmission waiting time of each wafer cell, a conveyor belt deceleration determination instruction is obtained. If the transmission waiting time of a certain wafer cell is greater than the preset transmission waiting time in the database, the conveyor belt deceleration determination instruction is to execute the conveyor belt deceleration process; otherwise, the conveyor belt deceleration determination instruction is not to execute the conveyor belt deceleration process.

9. A system applying the automated storage control method for an intelligent wafer storage cabinet as described in any one of claims 1-8, characterized in that, include: Storage location acquisition module, steady-state analysis module, heat dissipation power adjustment module, and conveyor belt speed adjustment module; The storage location acquisition module is used so that when the smart wafer storage cabinet receives the signal of the conveyor belt conveying the wafer box, the vision recognition unit of the robotic arm identifies the conveyed wafer box, obtains the designated storage location of the wafer box, and sends a storage command to the rotary support platform. The steady-state analysis module is used to control the rotary support platform to rotate the turntable storage mechanism to a specified angle after receiving the storage instruction, and to control the robotic arm to store the wafer cassette in a specified storage position. It also acquires the steady-state execution parameters of the turntable storage mechanism in real time and analyzes them to obtain the equipment adjustment instructions. The heat dissipation power adjustment module is used to adjust the rotational angular velocity of the slewing support platform according to the equipment adjustment command, obtain the adjusted equipment operating temperature, obtain the heat dissipation power adjustment execution command, and thereby perform the corresponding heat dissipation power adjustment. The conveyor belt speed adjustment module is used to obtain the real-time steady-state execution value after the heat dissipation power is adjusted, and to analyze the degree of difference in the second steady state, thereby adjusting the speed increase of the conveyor belt.

10. An apparatus for applying the automated storage control method of an intelligent wafer storage cabinet as described in any one of claims 1-8, comprising a cabinet (1), a feeding line (2), an automated storage and retrieval module A (3), a rotary storage mechanism (4), an automated storage and retrieval module B (5), a discharging line (6), a central control unit (7), a fan processing unit (8), and a sensor control unit; The automated access module A (3) and automated access module B (5) include a six-axis robotic arm (3-01), the end of which is equipped with a single-piece gripper (3-02) and a wafer cassette gripper (3-03), and the end of which is equipped with a vision recognition unit (3-04). The single-piece gripper (3-02) is used to grasp a single piece, and the wafer cassette gripper (3-03) is used to grasp a wafer cassette (2-02). The turntable storage mechanism (4) is a rotary structure. The rotation of the turntable storage mechanism (4) is controlled by the rotary support platform (4-01). The rotary support platform (4-01) is equipped with a multi-layer wafer box (4-03) and a multi-layer wafer box placement plate (4-02). The multi-layer wafer box placement plate (4-02) is connected by interlayer support columns (4-04). The turntable storage mechanism (4) is equipped with a sensor assembly (4-05) for identifying vibration amplitude. The feeding line (2) includes a belt conveyor (2-01), and the belt conveyor (2-01) has identification units (2-03) at both ends to identify wafer boxes or wafers; The central control unit (7) is used to send and receive commands and coordinate the operation of the smart wafer storage cabinet; The fan processing unit (8) is used to control the fan speed; The sensing and control unit is used to monitor the temperature, humidity, wind speed, and maintain the purity of the inert gas at various locations inside the cabinet. The feeding line (2) is fixedly connected to the feeding end of the cabinet (1); The automated storage and retrieval module A (3) and automated storage and retrieval module B (5) communicate with the central control unit (7) via electrical connection and are mechanically connected to the turntable storage mechanism (4) and the discharge line (6). The discharge line (6) is connected to the output end of the turntable storage mechanism (4), and the output end is connected to the outside of the cabinet (1); The fan processing unit (8) is connected to the internal air passage of the cabinet (1) and communicates with the central control unit (7) via electrical connection; The sensing and control unit is arranged in multiple positions inside the cabinet (1) and is connected to the central control unit (7) via signal.

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