Adaptive calculation method and device for fluid-thermal coupling based on wall temperature correction of heat exchange coefficient

Abstract

The present application relates to the heat exchange coefficient based on wall temperature correction flow heat coupling adaptive calculation method and device, relates to flow heat coupling calculation technical field. Method includes: the wall surface heat exchange coefficient is modeled as wall temperature power function;In the initial coupling step, according to wall temperature power function, combined with solid domain transient heat conduction, first wall surface temperature is obtained by solving;With first wall surface temperature as new wall surface boundary condition, the flow field is recalculated, and first wall surface heat flow and first wall surface heat exchange coefficient are obtained;According to initial wall surface temperature, initial wall surface heat exchange coefficient, first wall surface temperature and first wall surface heat exchange coefficient, dynamic updated wall temperature power function is obtained by simultaneous solving;In the first coupling step, the wall surface heat flow is calculated in real time based on the dynamic updated wall temperature power function, and the second wall surface temperature and the second wall surface heat exchange coefficient are obtained;Repeat the steps until the preset final calculation time is reached. The present application can realize the dynamic correction of heat exchange coefficient.

Description

Technical Field

[0001] This invention relates to the field of fluid-heat coupling calculation technology, and in particular to an adaptive calculation method and apparatus for fluid-heat coupling based on wall temperature-corrected heat transfer coefficient. Background Technology

[0002] In aerodynamic heating, the macroscopic response of a structure to flow is mainly determined by thermal load, thus requiring the application of thermal boundary conditions as accurately as possible. However, the timescale of the flow process is usually much smaller than the timescale of heat transfer within the structure, resulting in extremely high computational costs for direct strong coupling. Therefore, loose coupling methods are commonly used in engineering.

[0003] Existing loosely coupled methods often employ a sequential staggered strategy: within each fixed coupling step, the heat flux from the flow field calculation is treated as constant and transferred to the solid domain for transient heat conduction solving. To further improve accuracy, some methods introduce heat flux interpolation update mechanisms based on second-order Taylor expansion. However, these methods require that the coupling steps be selected at equal intervals, and to ensure the accuracy of capturing heat flux changes, a relatively small time step is still needed, resulting in a large overall computational load and making it difficult to meet the needs of rapid engineering evaluation.

[0004] Furthermore, traditional methods typically treat the wall heat transfer coefficient as a constant, neglecting the significant changes in actual heat transfer capacity that occur as the wall temperature continues to rise during prolonged heating. Ignoring this effect necessitates further reducing the coupling time step to compensate for model mismatch, severely limiting computational efficiency. Summary of the Invention

[0005] Therefore, it is necessary to provide a flow-heat coupling adaptive calculation method and device based on wall temperature-corrected heat transfer coefficient that can achieve dynamic correction of heat transfer coefficient, addressing the aforementioned technical problems.

[0006] An adaptive calculation method for heat transfer coupling based on wall temperature-corrected heat transfer coefficient, the method comprising:

[0007] Step 1: Obtain the initial wall heat flux, initial wall heat transfer coefficient, and initial wall temperature; model the wall heat transfer coefficient as a power function of the wall temperature.

[0008] Step 2: In the initial coupling step, the correction exponent factor of the preset wall temperature power function is a known value. The initial wall temperature is used as the boundary condition, and the solution is obtained by combining the transient heat conduction in the solid domain.

[0009] Step 3: Recalculate the flow field using the first wall temperature as the new wall boundary condition to obtain the first wall heat flux and the first wall heat transfer coefficient.

[0010] Step 4: Based on the initial wall heat transfer coefficient, initial wall temperature, first wall heat transfer coefficient, and first wall temperature, solve the wall temperature power function simultaneously to obtain the dynamically updated wall temperature power function.

[0011] Step 5: In the first coupling step, the wall heat flux is calculated in real time based on the dynamically updated wall temperature power function, and the solution is obtained by combining the transient heat conduction in the solid domain.

[0012] Step 6: Repeat steps 3 to 5 until the preset final calculation time is reached.

[0013] On the other hand, a flow-thermal coupling adaptive computing device based on wall temperature-corrected heat transfer coefficient is also provided, comprising:

[0014] The initial module is used to obtain the initial wall heat flux, initial wall heat transfer coefficient, and initial wall temperature, and models the wall heat transfer coefficient as a power function of wall temperature.

[0015] The first wall temperature calculation module is used to calculate the first wall temperature by setting the correction exponent factor of the preset wall temperature power function to a known value in the initial coupling step, using the initial wall temperature as the boundary condition, and combining the transient heat conduction in the solid domain.

[0016] The first wall boundary condition calculation module is used to recalculate the flow field with the first wall temperature as the new wall boundary condition to obtain the first wall heat flux and the first wall heat transfer coefficient.

[0017] The wall temperature power function dynamic modeling module is used to solve the wall temperature power function simultaneously based on the initial wall heat transfer coefficient, the initial wall temperature, the first wall heat transfer coefficient, and the first wall temperature to obtain the dynamically updated wall temperature power function.

[0018] The second wall temperature calculation module is used to calculate the wall heat flow in real time based on the dynamically updated wall temperature power function in the first coupling step, and solve it by combining the transient heat conduction in the solid domain to obtain the second wall temperature.

[0019] The iterative calculation module is used to repeat the calculation process from the first wall boundary condition calculation module to the second wall temperature calculation module until the preset final calculation time is reached.

[0020] Compared with existing technologies, the adaptive calculation method and apparatus for heat transfer coupling based on wall temperature correction provided by this invention have the following advantages:

[0021] 1. By modeling the wall heat transfer coefficient as a power function of wall temperature, and solving the dynamic power function based on the wall heat flow and heat transfer coefficient data at the initial and first coupling moments, the influence of wall temperature rise on heat transfer capacity during long-term heating is truly reflected, thus improving the consistency between thermal boundary conditions and actual physical processes.

[0022] 2. The dynamically updated wall temperature power function can adapt to the heat flow calculation requirements under dynamic wall temperature changes, reduce the frequency of data interaction between the flow field and the solid domain, avoid redundant calculations caused by model mismatch, reduce the amount of calculation and improve the calculation efficiency, and meet the engineering needs for rapid evaluation of thermal protection analysis under long-term aerodynamic heating conditions.

[0023] 3. Using the initial wall temperature as the basic boundary condition, combined with the transient heat conduction solution in the solid domain, the flow field calculation is then adjusted with the updated wall temperature feedback, forming a closed-loop iteration of the flow field, solid domain, and thermal boundary. The dynamic power function ensures the real-time performance and accuracy of the wall heat flux calculation, provides accurate thermal load input for the solid domain thermal response solution, and improves the accuracy of the solid domain thermal response calculation.

[0024] 4. The entire method continuously adapts to scenarios where the wall temperature changes gradually over a long period of heating by iteratively updating the wall temperature, flow field parameters, and dynamic heat transfer coefficient model. It can stably advance the calculation without introducing an additional complex interpolation mechanism, taking into account both calculation stability and adaptability to operating conditions. It is suitable for efficient thermal analysis of thermal protection systems in a pneumatic heating environment. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of the present invention, and those skilled in the art can obtain other related drawings based on these drawings without creative effort.

[0026] Figure 1 This is a flowchart illustrating an adaptive calculation method for heat transfer coefficient based on wall temperature correction in one embodiment.

[0027] Figure 2 This is a structural block diagram of a heat-fluid coupling adaptive computing device based on wall temperature-corrected heat transfer coefficient in one embodiment.

[0028] Figure 3 This is an internal structural diagram of a computer device in one embodiment.

[0029] The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0031] It should be noted that in this invention, the use of terms such as "first," "second," etc., is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0032] It is understood that the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0033] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0034] Example 1

[0035] like Figure 1 As shown, this embodiment provides an adaptive calculation method for heat transfer coupling based on wall temperature-corrected heat transfer coefficient, including the following steps:

[0036] Step 1: Obtain the initial wall heat flux, initial wall heat transfer coefficient, and initial wall temperature, and model the wall heat transfer coefficient as a power function of the wall temperature.

[0037] Step 2: In the initial coupling step, the correction exponent factor of the preset wall temperature power function is a known value. The initial wall temperature is used as the boundary condition, and the solution is obtained by combining the transient heat conduction in the solid domain.

[0038] Step 3: Recalculate the flow field using the first wall temperature as the new wall boundary condition to obtain the first wall heat flux and the first wall heat transfer coefficient.

[0039] Step 4: Solve the wall temperature power function simultaneously based on the initial wall heat transfer coefficient, initial wall temperature, first wall heat transfer coefficient, and first wall temperature to obtain the dynamically updated wall temperature power function.

[0040] Step 5: In the first coupling step, the wall heat flux is calculated in real time based on the dynamically updated wall temperature power function, and the solution is obtained by combining the transient heat conduction in the solid domain.

[0041] Step 6: Repeat steps 3 to 5 until the preset final calculation time is reached.

[0042] In the specific implementation of step 1, the flow field and structural temperature field required for calculation are first initialized, and the initial time is determined. Initial flow parameters and initial temperature distribution of the structure are determined at the initial flow field. Subsequently, the flow field solver performs the first flow field calculation on the initialized flow field and structural temperature field, and the initial wall heat flux is obtained based on the calculation results. Combined with the initial wall heat flow Enthalpy of recovery at the station Enthalpy of the initial wall Correspondence: The initial wall heat transfer coefficient was derived. Simultaneously, the initial wall temperature set during the initialization of the structural temperature field is extracted. Finally, the initial wall heat flux was obtained. Initial wall heat transfer coefficient and initial wall temperature Core initial parameters, etc.

[0043] Due to the wall heat transfer coefficient It is not constant, but depends on the wall temperature. The Mach number, angle of attack, flight altitude, and other state parameters all have an impact. During long-term cruise, the external flow tends to stabilize, but the wall temperature... A sustained increase will significantly alter local heat transfer characteristics.

[0044] Based on this, this invention proposes a dynamic modeling of the heat transfer coefficient based on the Fay-Riddell stagnation heat flux formula. The Fay-Riddell formula is as follows:

[0045] ;

[0046] In the formula, Indicates heat flow over the wall; Indicates the wall fluid density; Indicates the viscosity of the fluid at the wall surface; Indicates the density of the stagnation fluid; Indicates the viscosity of the stagnation fluid; Indicates the velocity at the boundary layer; Represents the normal coordinates of the wall; Represents the Lewis number; Indicates dissociation enthalpy; Indicates the enthalpy of recovery at the station; Indicates wall enthalpy; This represents the Prandtl number.

[0047] Analysis shows that under steady-state cruise conditions, all parameters except those related to wall temperature can be considered constants. Therefore, the wall heat transfer coefficient can be modeled as a power function of wall temperature, and the expression for the power function of wall temperature is:

[0048] ;

[0049] In the formula, Indicates the wall heat transfer coefficient; Indicates wall temperature; Indicates the correction scaling factor; This indicates the correction index factor.

[0050] Among them, the correction scaling factor and modified index factor It is determined jointly by heat flow and wall temperature data at two adjacent coupling moments. Specifically, due to the wall heat flow... ,and yes The function (for an ideal gas, ,in, (This represents the specific heat capacity at constant pressure), therefore, heat flow through the known wall can be achieved. With wall temperature Back-calculation of wall heat transfer coefficient Then, fit the correction scaling factor. With the modified index factor .

[0051] This step uses a flow field solver to perform the initial calculations of the initialized flow field and structural temperature field, ensuring that the initial parameters are obtained based on a realistic flow field physical model. This provides accurate input for subsequent dynamic modeling of the heat transfer coefficient and solving for heat conduction in the solid domain, guaranteeing the accuracy of the initial conditions for the entire fluid-thermal coupling calculation. By constructing a wall temperature power function based on the Fay-Riddell stagnation point heat flux formula, the relationship between the wall heat transfer coefficient and wall temperature is established. This overcomes the limitation of traditional methods that treat the heat transfer coefficient as a constant, truly reflecting the impact of wall temperature rise on heat transfer capacity during long-term heating, and improving the consistency between thermal boundary conditions and actual physical processes.

[0052] In the specific implementation of step 2, the initial time interval corresponding to the initial coupling step is: Since there is only one set of initial data at the initial moment, it is impossible to solve for the parameters of the power function simultaneously. and Therefore, the correction index factor is preset to a known value as a physical prior; subsequently, the initial wall temperature is... As boundary conditions, substituting them into the transient heat conduction equation of the solid domain, and combining the wall temperature power function with a pre-defined correction exponential factor, the first-time value is obtained. The corresponding first wall temperature In this embodiment, due to the high wall temperature... , ,so Therefore, the correction index factor is taken. Further values ​​may be determined based on the actual situation.

[0053] This step uses a pre-set, reasonable correction exponent factor as a physical prior to avoid excessive deviation in the initial modeling. At the same time, it combines the solution of transient heat conduction in the solid domain to ensure the calculation accuracy of the first wall temperature, providing reliable boundary condition support for subsequent flow field updates.

[0054] In the specific implementation of step 3, the first wall temperature obtained in step 2 is used. Feedback is sent to the flow field solver to replace the initial wall temperature. As a new wall boundary condition, the flow field solver resolves the flow field based on this new boundary condition to obtain updated flow field parameters; and calculates the first wall heat flux at the fluid-solid interface based on the updated flow field parameters. Combined with the heat flow of the first wall Enthalpy of recovery at the station Enthalpy of the first wall Correspondence: The heat transfer coefficient of the first wall was derived. .

[0055] This step corrects the flow field calculation results based on the wall temperature after updating the thermal response of the solid domain, making the flow field parameters more consistent with the actual thermal response. This provides two independent sets of coupled time data for subsequent dynamic modeling of the heat transfer coefficient, ensuring the reliability of the dynamic modeling.

[0056] In the specific implementation of step 4, the initial time is utilized. Corresponding initial wall heat transfer coefficient Initial wall temperature The first moment Corresponding first wall heat transfer coefficient First wall surface temperature Solve simultaneously for the correction scaling factor in the power function of the heat transfer coefficient. and modified index factor .

[0057] Specifically, according to the description in step 2, the expression for wall heat flow is: Therefore, heat can be obtained through the known wall heat flow. With wall temperature Back-calculation of wall heat transfer coefficient Then, fit the correction scaling factor. With the modified index factor .

[0058] Based on this, the initial wall heat flow Initial wall temperature Initial wall heat transfer coefficient Heat flow at the first wall First wall surface temperature First wall heat transfer coefficient Substitute into the wall heat flow expression respectively Power function of wall temperature Then, by solving the simultaneous equations, the corrected scaling factor can be obtained. With the modified index factor Dynamic modeling of the wall temperature power function is completed, resulting in a dynamically updated wall temperature power function.

[0059] This step solves for the power function parameters simultaneously based on actual calculation data at two coupling moments, enabling the model to accurately reflect the impact of wall temperature rise on heat transfer capacity during long-term heating, improving the consistency between thermal boundary conditions and actual physical processes; avoiding model mismatch problems caused by traditional constant heat transfer coefficients, and providing accurate mathematical model support for subsequent real-time correction of wall heat flow.

[0060] In the specific implementation of step 5, within the first coupling step, the wall heat transfer coefficient at the continuous coupling moment, i.e., the initial wall heat transfer coefficient, is first determined. Heat transfer coefficient with the first wall Calculate the difference in change Based on the difference in change Adaptive adjustment of the time step of the first coupling step Then based on the time step The second moment after the end of the first coupling step is calculated as follows: Thus, the first time interval corresponding to the first coupling step is obtained as follows: It can be seen that in the first moment It is both the end time of the initial coupling step and the start time of the first coupling step.

[0061] Then, within the first time interval corresponding to the first coupling step, based on the dynamically updated wall temperature power function... Real-time calculation of wall heat flux By combining the transient heat conduction in the solid domain, the second time step is obtained. The corresponding second wall temperature .

[0062] In practical implementation, the difference in change Defined as the relative heat transfer coefficient field of the wall at adjacent coupling moments Norm deviation, its expression is:

[0063] ;

[0064] In the formula, Indicates the first The difference in heat transfer coefficient during the coupling process; Indicates the coupling moment The wall heat transfer coefficient; Indicates the coupling moment The wall heat transfer coefficient; This represents the fluid-solid interface.

[0065] Subsequently, based on the difference in change The time step size of the first coupling step is adaptively adjusted, and the adaptive adjustment formula is as follows:

[0066] ;

[0067] In the formula, Indicates the first Time step of the coupling step; Indicates the first Time step of the coupling step; Indicates the first The difference in heat transfer coefficient during the coupling process; Indicates the first The difference in heat transfer coefficient during the coupling process; , , Indicates the exponential coefficient; This indicates the preset tolerance for variation.

[0068] in, , , ; , , These are the proportional, integral, and derivative control gains, respectively.

[0069] This step addresses the problem of low computational efficiency caused by the fixed time step and constant heat transfer coefficient assumptions in traditional loosely coupled methods. It proposes an adaptive coupling step control strategy, which enables the time step to automatically adapt to the rate of change of thermal boundary conditions, reducing redundant calculations and maximizing computational efficiency while ensuring accuracy.

[0070] In the specific implementation of step 6, the second wall temperature obtained in step 5 is... The new wall boundary conditions are fed back to the flow field solver, and the flow field is recalculated to obtain the second time step. Corresponding second wall heat flow Heat transfer coefficient with the second wall Based on the heat flow of the first wall First wall heat transfer coefficient Heat flow at the second wall Heat transfer coefficient with the second wall Solve simultaneously for the correction scaling factor of the dynamically updated power function of wall temperature. and modified index factor Then, based on the heat transfer coefficient of the first wall surface... Heat transfer coefficient with the second wall Calculate the difference in change Based on the difference in change Adaptive adjustment of the time step of the second coupling step Then based on the time step The third moment after the end of the second coupling step is calculated as follows: Thus, the second time interval corresponding to the second coupling step is obtained. Within the time interval corresponding to the second coupling step, the wall heat flux is calculated in real time based on the dynamically updated wall temperature power function. Combined with the transient heat conduction in the solid domain, the third wall temperature is obtained. The process of steps 3 to 5 is repeated until the preset final calculation time is reached, at which point the iteration stops.

[0071] This step uses a closed-loop iterative mechanism to continuously adapt to the scenario of gradual wall temperature changes under long-term heating. Through the collaborative design of dynamically updating the wall heat transfer coefficient with a power function of wall temperature and adaptively adjusting the coupling time step, the calculation can be stably advanced without the need to introduce an additional complex interpolation mechanism. While ensuring the accuracy of the structural thermal response calculation, it significantly reduces the number of heat flow data interactions and greatly improves the computational efficiency of coupled simulation under long-term aerodynamic heating environment.

[0072] In one embodiment, starting from the first coupling step, during the solution of transient heat conduction in the solid domain corresponding to each coupling step, the current coupling step is divided into several sub-steps; in each sub-step, the wall heat flux is corrected in real time based on the dynamically updated wall temperature power function, and the corrected wall heat flux is used to perform the solution of transient heat conduction in the solid domain.

[0073] Among them, the wall heat flux is corrected in real time based on the dynamically updated wall temperature power function, and the calculation expression is as follows:

[0074] ;

[0075] In the formula, This represents the corrected wall heat flux during the solution of transient heat conduction in the solid domain; Indicates the correction scaling factor; Indicates the correction index factor; Indicates the current wall temperature; Indicates the enthalpy of recovery at the station; This represents the wall enthalpy.

[0076] The wall enthalpy is determined by the current wall temperature using the ideal gas law, which is expressed as:

[0077] ;

[0078] In the formula, This indicates the specific heat capacity at constant pressure.

[0079] In one embodiment, a loose coupling strategy is used for coupling during the fluid-thermal coupling process; the flow field calculation solves for the aerodynamic heat load in a steady-state manner, while the solid domain solves for the heat conduction process in a transient manner, with the flow field and solid domain connected through a fluid-solid interface. To conduct data interaction.

[0080] It should be understood that, although this embodiment Figure 1 The steps are shown sequentially as indicated by the arrows, but they are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order in which these steps are performed; they can be executed in other orders. Figure 1 At least some of the steps in the process may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least some of the sub-steps or stages of other steps.

[0081] Example 2

[0082] Based on the adaptive calculation method for heat transfer coefficient based on wall temperature correction in Example 1, this embodiment discloses an adaptive calculation device for heat transfer coefficient based on heat transfer coefficient based on wall temperature correction, such as... Figure 2 As shown, the heat transfer coefficient-based flow-heat coupling adaptive computing device includes: an initial module 401, a first wall temperature calculation module 402, a first wall boundary condition calculation module 403, a wall temperature power function dynamic modeling module 404, a second wall temperature calculation module 405, and an iterative calculation module 406, wherein:

[0083] The initial module 401 is used to obtain the initial wall heat flux, the initial wall heat transfer coefficient, and the initial wall temperature; the wall heat transfer coefficient is modeled as a power function of the wall temperature.

[0084] The first wall temperature calculation module 402 is used to calculate the first wall temperature by setting the correction exponent factor of the preset wall temperature power function to a known value in the initial coupling step, using the initial wall temperature as the boundary condition, and combining it with the transient heat conduction in the solid domain.

[0085] The first wall boundary condition calculation module 403 is used to recalculate the flow field with the first wall temperature as the new wall boundary condition to obtain the first wall heat flux and the first wall heat transfer coefficient.

[0086] The wall temperature power function dynamic modeling module 404 is used to solve the wall temperature power function simultaneously based on the initial wall heat transfer coefficient, initial wall temperature, first wall heat transfer coefficient, and first wall temperature to obtain the dynamically updated wall temperature power function.

[0087] The second wall temperature calculation module 405 is used to calculate the wall heat flow in real time based on the dynamically updated wall temperature power function in the first coupling step, and solve it in combination with the transient heat conduction in the solid domain to obtain the second wall temperature.

[0088] The iterative calculation module 406 is used to repeat the calculation process from the first wall boundary condition calculation module to the second wall temperature calculation module until the preset final calculation time is reached.

[0089] In this embodiment, the specific working process and working principle of the initial module 401, the first wall temperature calculation module 402, the first wall boundary condition calculation module 403, the wall temperature power function dynamic modeling module 404, the second wall temperature calculation module 405, and the iterative calculation module 406 are the same as those in Embodiment 1, and therefore will not be described again in this embodiment. Each unit module can be implemented entirely or partially through software, hardware, or a combination thereof. Each unit module can be embedded in or independent of the processor in a computer device in hardware form, or it can be stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to the above unit modules.

[0090] Example 3

[0091] like Figure 3 The diagram illustrates a terminal device disclosed in this embodiment, comprising a transmitter, a receiver, a memory, and a processor. The transmitter transmits instructions and data, the receiver receives instructions and data, the memory stores computer-executed instructions, and the processor executes the computer-executed instructions stored in the memory to implement the method described in Embodiment 1 above.

[0092] It is important to note that the aforementioned memory can be either standalone or integrated with the processor. When the memory is set up independently, the terminal device also includes a bus for connecting the memory and the processor.

[0093] Example 4

[0094] This embodiment discloses a computer-readable storage medium storing computer-executable instructions. When a processor executes the computer-executable instructions, it implements the method in Embodiment 1 above.

[0095] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0096] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The embodiments described above are merely examples of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention.

Claims

1. A flow-heat coupling self-adaptive calculation method based on wall temperature correction heat transfer coefficient, characterized in that, The method comprises: Step 1, obtaining initial wall heat flux, initial wall heat transfer coefficient and initial wall temperature; modeling the wall heat transfer coefficient as a wall temperature power function; Step 2, in the initial coupling step, presetting a correction exponential factor of the wall temperature power function as a known value, taking the initial wall temperature as a boundary condition, combining the solid domain transient heat conduction to obtain a first wall temperature; Step 3, taking the first wall temperature as a new wall boundary condition to recalculate the flow field to obtain the first wall heat flux and the first wall heat transfer coefficient; Step 4, according to the initial wall heat transfer coefficient, the initial wall temperature, the first wall heat transfer coefficient and the first wall temperature, the wall temperature power function is solved to obtain a dynamically updated wall temperature power function; Step 5, in the first coupling step, the wall heat flux is calculated in real time based on the dynamically updated wall temperature power function, and the solid domain transient heat conduction is solved to obtain a second wall temperature; Step 6, repeating steps 3 to 5 until a preset final calculation time is reached; In step 2, the wall heat transfer coefficient is modeled as a wall temperature power function, and the wall temperature power function expression is: ； In the formula, represents a wall heat exchange coefficient; represents a wall temperature; represents a correction proportion factor; represents a correction exponential factor; Further comprising: from the first coupling step, in the solid domain transient heat conduction solving process corresponding to each coupling step, the current coupling step is divided into a plurality of sub-steps; In each sub-step, the wall heat flux is corrected in real time based on the dynamically updated wall temperature power function, and the solid domain transient heat conduction solving is performed using the corrected wall heat flux; In each sub-step, the wall heat flux is corrected in real time based on the dynamically updated wall temperature power function, and the calculation expression is: ； wherein, represents the corrected wall heat flux in the transient heat conduction solution process of the solid domain; represents the correction proportion factor; represents the correction exponential factor; represents the current wall temperature; represents the recovery enthalpy at the stagnation point; represents the wall enthalpy.

2. The adaptive calculation method of flow-thermal coupling based on wall temperature corrected heat transfer coefficient according to claim 1, characterized in that, In step 5, further comprising: According to the initial wall heat transfer coefficient and the first wall heat transfer coefficient, a change difference value is calculated; and the time step of the first coupling step is adaptively adjusted according to the change difference value.

3. The adaptive calculation method of heat transfer coefficient based on wall temperature correction according to claim 2, characterized in that, The change difference value is calculated based on the wall heat transfer coefficient at the continuous coupling time, and the expression is: ； In the formula, indicates the wall surface heat transfer coefficient at the coupling time indicates the wall surface heat transfer coefficient at the coupling time indicates the difference of heat transfer coefficient change in the coupling step; indicates the wall surface heat transfer coefficient at the coupling time indicates the wall surface heat transfer coefficient at the coupling time indicates the wall surface heat transfer coefficient at the coupling time indicates the fluid-solid interface.

4. The adaptive calculation method of heat transfer coefficient based on wall temperature correction according to claim 3, characterized in that, The time step of the first coupling step is adaptively adjusted according to the change difference value, and the adaptive adjustment formula is: ； In the formula, represents the first time step of the coupling step; represents the first time step of the coupling step; represents the first difference value of the heat exchange coefficient during the coupling step; represents the first difference value of the heat exchange coefficient during the coupling step; , , represents an exponential coefficient; represents a preset change difference tolerance.

5. The adaptive calculation method of heat transfer coefficient based on wall temperature correction according to any one of claims 1 to 4, characterized in that, The wall enthalpy is determined by the current wall temperature through an ideal gas relationship, and the ideal gas relationship expression is: ； In the formulae, denotes the specific heat capacity at constant pressure.

6. The adaptive calculation method of heat transfer coefficient based on wall temperature correction according to any one of claims 1 to 4, characterized in that, In the process of heat convection, the loose coupling strategy is adopted for coupling; the flow field calculation is solved in a steady-state manner to obtain aerodynamic thermal load, and the solid domain is solved in a transient manner to obtain heat conduction process, and the flow field and the solid domain are coupled through the fluid-solid interface data interaction.

7. A heat flow coupling self-adaptive calculation device based on wall temperature correction of heat exchange coefficient, characterized in that, The device comprises: An initial module for obtaining initial wall heat flux, initial wall heat transfer coefficient and initial wall temperature; modeling the wall heat transfer coefficient as a wall temperature power function; A first wall temperature calculation module for, in the initial coupling step, presetting a correction exponential factor of the wall temperature power function as a known value, taking the initial wall temperature as a boundary condition, combining the solid domain transient heat conduction to obtain a first wall temperature; A first wall boundary condition calculation module for taking the first wall temperature as a new wall boundary condition to recalculate the flow field to obtain the first wall heat flux and the first wall heat transfer coefficient; A wall temperature power function dynamic modeling module for, according to the initial wall heat transfer coefficient, the initial wall temperature, the first wall heat transfer coefficient and the first wall temperature, solving the wall temperature power function to obtain a dynamically updated wall temperature power function; A wall temperature power function dynamic modeling module for, according to the initial wall heat transfer coefficient, the initial wall temperature, the first wall heat transfer coefficient and the first wall temperature, solving the wall temperature power function to obtain a dynamically updated wall temperature power function; a second wall surface temperature calculation module, configured to calculate a wall surface heat flow in real time based on the dynamically updated wall temperature power function in the first coupling step, and solve the wall surface heat flow in combination with solid domain transient heat conduction to obtain a second wall surface temperature; an iterative calculation module, configured to repeat the calculation process of the first wall surface boundary condition calculation module to the second wall surface temperature calculation module until a preset final calculation time is reached.

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