Solder paste tube assembling device, printing machine comprising solder paste tube assembling device and solder paste tube assembling method

Abstract

The invention provides a solder paste tube assembling device, a printing machine comprising the solder paste tube assembling device and a solder paste tube assembling method. The solder paste tube assembling device is used for fixing and sealing a solder paste tube, a nozzle is arranged at the bottom of the solder paste tube, the solder paste tube provides solder paste through the nozzle, and the solder paste tube assembling device comprises a support, a top sealing device and a bottom supporting device. The top sealing device is arranged to controllably conduct lifting motion so as to be connected to the tops of the solder paste pipes of different heights in a sealed mode. According to the solder paste tube assembling device, through the top sealing device capable of automatically ascending and descending, the solder paste tubes can be automatically disassembled and replaced, and the solder paste tubes with different heights can be automatically replaced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of stencil printing system, and more particularly, to a solder paste tube assembling device, a printing machine comprising the same and a method for assembling a solder paste tube. BACKGROUND

[0002] In the process of manufacturing surface mount printed circuit boards, a printer can be used to extrude solder paste from a solder paste tube and then print the solder paste onto a circuit board so that electronic components can be subsequently deposited onto the circuit board. The circuit board, which has a conductive surface, is conveyed into the printer and is correctly aligned from below with apertures on a stencil in the printer by means of one or more small holes or marks (referred to as "fiducials") on the circuit board. After the circuit board has been aligned with the stencil in the printer, solder paste is extruded from the solder paste tube onto the stencil and a squeegee of the printer is moved along the upper surface of the stencil to force the solder paste through the apertures in the stencil onto the conductive surface of the circuit board.

[0003] Generally, a top of the solder paste tube is connected with a sealing device to seal the solder paste inside the solder paste tube. A bottom of the solder paste tube is provided with a nozzle for extruding the solder paste. When the solder paste in the solder paste tube is used up and needs to be replaced, the sealing device at the top of the solder paste tube often needs to be disassembled. After the replacement of the new solder paste tube is completed, the top of the solder paste tube is resealed. SUMMARY

[0004] The present application provides, in a first aspect, a solder paste tube assembling device for fixing and sealing a solder paste tube, wherein a bottom of the solder paste tube has a nozzle through which the solder paste tube provides solder paste, and the solder paste tube assembling device comprises a bracket, a top sealing device and a bottom supporting device. The top sealing device is assembled at a top of the bracket, and the top sealing device comprises a sealing assembly for sealingly connecting to a top of the solder paste tube. The bottom supporting device is assembled at a bottom of the bracket, and the bottom supporting device comprises a supporting seat for supporting the nozzle of the solder paste tube. The top sealing device is arranged to controllably move up and down for sealingly connecting to the top of the solder paste tube at different heights.

[0005] According to the above first aspect, the bottom supporting device is arranged to controllably move up and down to lower the height of the nozzle of the solder paste tube so that the top of the solder paste tube is away from the sealing assembly.

[0006] According to the above first aspect, the sealing assembly comprises an annular boss and a sealing ring, the sealing ring is sleeved outside the annular boss, and the annular boss is used to extend into the top of the solder paste tube to sealingly connect to the solder paste tube through the sealing ring.

[0007] According to the first aspect, the top sealing device comprises a cylinder slider and a guide rod, the guide rod extends in the height direction, the cylinder slider is arranged to move up and down along the extension direction of the guide rod, and the sealing assembly is connected to the cylinder slider.

[0008] According to the first aspect, the bottom support device comprises a cylinder and a push rod, the push rod extends in the height direction, the push rod is arranged to extend or retract in the height direction, and the support seat is connected to the push rod.

[0009] According to the first aspect, the solder paste tube assembly device further comprises a control device and a sensor group. The sensor group is connected to the bracket, and is arranged to detect the state of the solder paste tube and provide a corresponding signal to the control device. The control device is arranged to control at least one of the top sealing device and the bottom support device to move up and down based on the signal provided by the sensor group.

[0010] According to the first aspect, the solder paste tube comprises a pressing element. The sensor group comprises an empty tube position sensor arranged at a corresponding position where the pressing element is located at an empty tube position, and the empty tube position sensor is arranged to provide the empty tube signal to the control device when the pressing element reaches the empty tube position.

[0011] According to the first aspect, the sensor group further comprises a pre-warning position sensor arranged at a corresponding position where the pressing element is located at a pre-warning position, and the pre-warning position sensor is arranged to provide the pre-warning signal to the control device when the pressing element reaches the pre-warning position.

[0012] According to the first aspect, the sensor group further comprises an additional sensor arranged to detect whether there is a solder paste tube in the solder paste tube assembly device.

[0013] The present application provides a printing machine in a second aspect, comprising the solder paste tube assembly device according to any one of the first aspect and a workbench. The solder paste tube assembly device is connected to the workbench and can move relative to the workbench in a first direction, a second direction or a third direction, wherein the third direction is the height direction.

[0014] The present application provides a solder paste tube assembly method in a third aspect, comprising the step of replacing a new solder paste tube. The step of replacing a new solder paste tube comprises: moving the top sealing device based on the height of the new solder paste tube, assembling the new solder paste tube, and raising the bottom support device so that the sealing assembly is sealed and connected to the top of the new solder paste tube.

[0015] According to the third aspect, the method further comprises detecting whether an old solder paste tube is present. If the old solder paste tube is present, the old solder paste tube is released and a new solder paste tube is replaced. If the old solder paste tube is not present, the new solder paste tube is replaced.

[0016] According to the third aspect, the step of releasing the old solder paste tube comprises lowering the bottom support means so that the sealing assembly is moved away from the top of the old solder paste tube; and removing the old solder paste tube.

[0017] Other features, objects, and advantages of the application can be derived from the specific embodiments, drawings, and claims, which follow. Moreover, it should be understood that the summary and the following detailed description are exemplary and intended to provide further explanation without limiting the scope of the application as claimed. The detailed description and specific examples are indicative, however, of only the preferred embodiments of the application. Various changes and modifications within the spirit and scope of the application will become apparent to those skilled in the art from this detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a perspective view of a printing machine according to an embodiment of the application;

[0019] Figure 2A is a perspective view of a print head in Figure 1 at one angle;

[0020] Figure 2B is a perspective view of a print head in Figure 2A at another angle;

[0021] Figure 2C is an exploded view of a print head in Figure 2A ;

[0022] Figure 2D is a sectional view of a print head in Figure 2A ;

[0023] Figure 3 shows a block diagram of a control device in Figure 1 ;

[0024] Figures 4A-1 - 4A-3 shows a process of releasing an old solder paste tube;

[0025] Figures 4B-1 - 4B-3 shows a process of replacing a new solder paste tube;

[0026] Figure 5 shows a flowchart of a method of assembling a solder paste tube;

[0027] Figure 6A showsFigure 5 a flow chart of releasing the old solder paste tube in the assembly method in

[0028] Figure 6B shows Figure 5 a flow chart of replacing the new solder paste tube in the assembly method in DETAILED DESCRIPTION

[0029] Various specific embodiments of the present application will be described herein with reference to the drawings, which are intended to demonstrate, but not limit, the application. It should be understood that the use of directional terms such as "front", "back", "up", "down", "left", "right", etc., are used for convenience only to describe the various example structures and elements of the present application as shown in the figures based on the example orientation shown in the figures. Since the embodiments disclosed herein can be positioned in different orientations, these directional terms are used only for illustrative purposes and should not be construed as limiting. Where possible, identical or similar reference numerals are used in the various figures to indicate the same or similar components.

[0030] Figure 1 The general structure of the printing machine 110 is shown. As shown in Figure 1 The printing machine 110 includes a printing head 100 and a worktable 115. The printing head 100 includes a solder paste tube 120 and a solder paste assembly device 118 for fixing and sealing the solder paste tube 120. The solder paste assembly device 118 is connected to the worktable 115 and moves on the worktable 115 to align the solder paste tube 120 on the solder paste assembly device 118 with the part to be printed on the stencil. Specifically, the worktable 115 includes an x-direction (i.e. first direction) moving mechanism 111, a y-direction (i.e. second direction) moving mechanism 112 and a z-direction (i.e. third direction) moving mechanism 113. The printing head 100 is connected to the z-direction (i.e. third direction or height direction) moving mechanism 113 so that the printing head 100 can move up and down along the z-direction relative to the worktable 115. And the printing head 100 is connected to the x-direction (i.e. first direction) moving mechanism 111 so that the printing head 100 can move left and right along the x-direction relative to the worktable 115. The x-direction moving mechanism 111 is connected to the y-direction (i.e. second direction) moving mechanism 112 so that the x-direction (i.e. first direction) moving mechanism 111 can move the printing head 100 together along the y-direction. It is understood by those skilled in the art that the structure of the worktable can be specifically set according to the type of the printing machine. It is noted that the first direction x, the second direction y and the third direction z are approximately perpendicular.

[0031] The printing machine 110 further comprises a control device 170, which is communicatively connected with the workbench 115 to control the specific position of the printing head 100 by controlling the movement action of each moving mechanism on the workbench 115, so as to align the solder paste tube 120 to the position on the stencil that needs to be printed. In the present application, the control device 170 is also communicatively connected with the printing head 100 to control the assembly action of the printing head 100, so as to control the controllable assembly of the solder paste tube 120 to the solder paste assembly device 118. The specific assembly action will be described in detail later.

[0032] Figures 2A - 2D The specific structure of the printing head is shown. Among them Figure 2A The perspective view of the printing head 100 is shown from the left to the right angle, Figure 2B The perspective view of the printing head 100 is shown from the right to the left angle, which is used to illustrate the general structure of the printing head 100. Figure 2C The exploded view of the printing head 100 is shown, which is used to illustrate the specific structure of the top sealing device 230 and the bottom supporting device 240. Figure 2D The sectional view of the printing head 100 is shown along the height direction at the solder paste tube 120, which is used to illustrate the specific structure of the solder paste tube 120.

[0033] As Figure 2A and Figure 2B shown, the solder paste tube 120 is a hollow tube, the top of the solder paste tube 120 is open, and the bottom of the solder paste tube 120 has a nozzle 221, the bottom of the nozzle 221 is open, so that the solder paste tube 120 can provide solder paste through the nozzle 221. The solder paste assembly device 118 further comprises a bracket 201, a top sealing device 230 and a bottom supporting device 240. The top sealing device 230 and the bottom supporting device 240 are arranged on the left side of the bracket 201, the z-direction moving mechanism 113 is arranged on the right side of the bracket 201, the solder paste tube 120 is arranged on the front side of the bracket 201, and matches the positions of the top sealing device 230 and the bottom supporting device 240. The z-direction moving mechanism 113 is tightly connected with the bracket 201, so that the z-direction moving mechanism 113 drives the printing head 100 to move up and down as a whole by driving the bracket 201 to move up and down along the z-direction.

[0034] The top sealing device 230 is assembled on the top of the bracket 201 and can be controlled by the control device 170 to perform lifting movement in the height direction. The top sealing device 230 comprises a sealing assembly 231 which can be sealingly connected to the top of the solder paste tube 120. With the lifting movement of the top sealing device 230, the sealing assembly 231 can press on the top of the solder paste tube 120 to seal the solder paste tube 120, or leave the top of the solder paste tube 120. And with the lifting movement of the top sealing device 230, the sealing assembly 231 can be sealingly connected to the top of the solder paste tube 120 at different heights.

[0035] The bottom support device 240 is assembled on the bottom of the bracket 201. The bottom support device 240 comprises a support seat 241 for supporting the nozzle 221 of the solder paste tube 120. In this embodiment, the bottom support device 240 can also be controlled by the control device 170 to perform lifting movement in the height direction. The support seat 241 keeps supporting the nozzle 221 of the solder paste tube 120, so that when the bottom support device 240 lifts, the solder paste tube 120 can also lift accordingly. When the top sealing device 230 keeps still, the lifting movement of the solder paste tube 120 can make the top of the solder paste tube 120 leave the sealing assembly 231 or resealingly connected to the sealing assembly 231.

[0036] Therefore, through the lifting movement of the top sealing device 230 and the bottom support device 240 cooperating with each other, the sealing assembly 231 can sealingly connect to the solder paste tube at different heights. In some embodiments, only the top sealing device 230 can perform lifting movement, while the bottom support device 240 keeps still, so that the top sealing device has more lifting positions accordingly.

[0037] As shown in Figure 2C The sealing assembly 231 comprises an annular boss 235 and a sealing ring 238, and the sealing ring 238 is sleeved on the outside of the annular boss 235. When the sealing assembly 231 is sealingly connected to the top of the solder paste tube 120, the annular boss 235 can extend into the top of the solder paste tube 120, and the sealing ring 238 can abut against the side wall of the solder paste tube 120, so that the sealing ring 238 is sealingly connected to the solder paste tube 120.

[0038] Those skilled in the art can understand that the top sealing device 230 and the bottom supporting device 240 can be any structure capable of controllable lifting movement. As an example, the top sealing device 230 and the bottom supporting device 240 include a commercially available cylinder structure. Specifically, the top sealing device 230 includes a cylinder slider 251 and a guide rod 252 extending in the height direction. The guide rod 252 is connected to the bracket 201 to be fixed, and the cylinder slider 251 is sleeved on the guide rod 252 and is arranged to slide along the extension direction of the guide rod 252 to perform lifting movement. The sealing assembly 231 is connected to the cylinder slider 251 so that the movement of the cylinder slider 251 can drive the movement of the sealing assembly 231. In the embodiment, the sealing assembly 231 is arranged at the front side of the cylinder slider 251 to match the position of the solder paste tube 120. The top sealing device 230 further includes a connecting block 253 connecting the cylinder slider 251 and the sealing assembly 231. Thus, the lifting movement of the cylinder slider 251 can drive the lifting movement of the sealing assembly 231, so that the sealing assembly 231 can seal the top of the solder paste tube 120 or leave the top of the solder paste tube 120.

[0039] The bottom supporting device 240 includes a cylinder 261 and a push rod 262 extending in the height direction. The cylinder 261 is connected to the bracket 201 to be fixed, and the push rod 262 can extend or retract in the height direction relative to the cylinder 261. The supporting seat 241 is connected to the push rod 262 so that the movement of the push rod 262 can drive the movement of the supporting seat 241. In the embodiment, the bottom supporting device 240 further includes a connecting block 263 connected at the bottom of the push rod 262, and the connecting block 263 connects the push rod 262 and the supporting seat 241. Thus, the extension or retraction of the push rod 262 can drive the lifting movement of the supporting seat 241, so that the solder paste tube 120 can perform lifting movement. In the embodiment, the supporting seat 241 further includes a fork 242 extending outward from the front side of the supporting seat 241 to match the position of the nozzle 221 of the solder paste tube 120, and the fork 242 can clamp the nozzle 221, so that the lifting movement of the supporting seat 241 can drive the movement of the solder paste tube 120.

[0040] In the present embodiment, the top sealing device 230 can further include a position limiting member 255 for limiting the position of the cylinder slide 251 on the guide rod 252. The position can be manually set according to the height of the solder paste tube 120 to be assembled, so that the sealing assembly 231 can match solder paste tubes 120 of various heights. As an example, the position limiting member 255 includes two position limiting members arranged at the top and bottom of the bracket 201, so that the solder paste assembly device 118 of the present embodiment can match two different heights of the solder paste tube 120. When the cylinder slide 251 abuts against the two position limiting members, the cylinder slide 251 cannot continue to rise or fall. In other embodiments, the position limiting member 255 can be arranged in other numbers or positions as needed. In the present embodiment, the push rod 262 of the bottom supporting device 240 has two positions of extension and retraction to drive the supporting seat 241 to move up and down between the corresponding first position and second position, the first position being lower in height and the second position being higher in height.

[0041] Further combined Figure 2D As shown, the hollow tubular solder paste tube 120 is used to store solder paste, which can be controllably discharged from the nozzle 221 at the bottom of the solder paste tube 120 when needed. In the present embodiment, the solder paste tube 120 is provided with a squeezing element 236. The solder paste is stored between the squeezing element 236 and the nozzle 221. By controlling the movement of the squeezing element 236 towards the nozzle 221, the control device 170 can control the discharge of the solder paste from the nozzle 221. When the squeezing element 236 is connected to the top of the solder paste tube 120, the solder paste tube 120 is in a full tube state, and the squeezing element 236 is in a full tube position. With the downward movement of the squeezing element 236, when the squeezing element 236 moves to the nozzle 221, the solder paste is almost completely discharged from the solder paste tube 120, and the solder paste tube 120 is in an empty tube state, and the squeezing element 236 is in an empty tube position. In the state as shown, the squeezing element 236 is in a warning position between the empty tube position and the full tube position. When the squeezing element 236 is in the warning position, the solder paste in the solder paste tube 120 is approximately in a half tube state. In some embodiments, the warning position of the squeezing element 236 can be set as needed, or no warning position is set. In the present embodiment, the middle part of the squeezing element 236 is recessed downward, so that when the squeezing element 236 is in the full tube position, the middle part of the squeezing element 236 can leave space for the annular boss 235 of the sealing assembly 231 to extend into the solder paste tube 120. And the bottom of the squeezing element 236 is arranged in a shape matching the bottom of the solder paste tube 120, so that when the squeezing element 236 moves to the empty tube position, the solder paste in the solder paste tube 120 can be almost completely discharged. Figure 2D

[0042] ​As an example, the sealing assembly 231 is further provided with an air conduit 233. The air conduit 233 penetrates the annular boss 235 to introduce air flow into the solder paste tube 120. In the present embodiment, the air flow is introduced above the extrusion element 236. The air flow introduced above the extrusion element 236 increases the pressure above the extrusion element 236, thereby forcing the extrusion element 236 to move downward. The control device 170 controls the direction of movement of the extrusion element 236 toward the nozzle 221 by controlling the air flow introduced into the solder paste tube 120 from the air conduit 233.

[0043] As Figures 2A - 2DAs shown, the solder paste fitting device 118 further comprises a sensor group 280 connected to the bracket 201 and in communication with the control device 170. The sensor group 280 is configured to detect the state of the solder paste tube 120 and provide corresponding signals to the control device 170. The control device 170 controls the actions of various devices based on the signals provided by the sensor group 280, such as the lifting motion of the top sealing device 230 and / or the lifting motion of the bottom supporting device 240. Specifically, the sensor group 280 comprises an empty tube position sensor 281, a pre-warning position sensor 282, and an additional position sensor 283. The empty tube position sensor 281 and the pre-warning position sensor 282 are arranged on the right side of the solder paste tube 120 and configured to detect the position of the extrusion element 236 inside the solder paste tube 120. In the present embodiment, the pre-warning position sensor 282 is arranged above the empty tube position sensor 281. Specifically, the empty tube position sensor 281 is arranged at a position corresponding to the empty tube position of the extrusion element 236, so as to provide an empty tube signal to the control device 170 when the extrusion element 236 is detected to reach the empty tube position. The pre-warning position sensor 282 is arranged at a position corresponding to the pre-warning position of the extrusion element 236, so as to provide a pre-warning signal to the control device 170 when the extrusion element 236 is detected to reach the pre-warning position. The additional position sensor 283 is arranged on the back side of the solder paste tube 120 and configured to detect whether the solder paste tube 120 is present in the solder paste fitting device 118. It is understood by those skilled in the art that the solder paste usually needs to be refrigerated for storage, but needs to be used at room temperature. Therefore, the solder paste tube needs to be taken out of the refrigeration device in advance when it is replaced, and can be used after being placed at room temperature for a period of time. The pre-warning position sensor 282 is configured to prompt the control device 170 that the new solder paste tube to be replaced can be taken out in advance, so as to speed up the efficiency of replacing the solder paste tube 120. In some embodiments, the sensor group 280 can also not comprise the pre-warning position sensor 282. In some embodiments, the sensor group 280 can further comprise a two-dimensional code recognition device, and the solder paste tube 120 is provided with a corresponding two-dimensional code. The two-dimensional code recognition device is configured to recognize the two-dimensional code on the solder paste tube 120 to receive the height, capacity, and other parameter information of the solder paste tube 120. The control device 170 controls various devices based on these parameter information. The control flow of the control device 170 based on the signals detected by the sensor group 280 will be described in detail later.

[0044] Figure 3 A structural block diagram of the control device 170 is shown. As shown, the control device 170 comprises a central processing unit (CPU) 171, a read-only memory (ROM) 172, a random access memory (RAM) 173, a storage device 174, an input device 175, and an output device 176. The CPU 171, the ROM 172, the RAM 173, the storage device 174, the input device 175, and the output device 176 are connected to each other through a bus. Figure 3As shown, the control device 170 includes a bus 371, a processor 372, an input interface 373, an output interface 374, and a memory 375 containing a control program 376. The various components of the control device 170, including the processor 372, input interface 373, output interface 374, and memory 375, are communicatively connected to the bus 371, enabling the processor 372 to control the operation of the input interface 373, output interface 374, and memory 375. Specifically, the memory 375 stores programs, instructions, and data, while the processor 372 reads programs, instructions, and data from the memory 375 and can write data to the memory 375. By executing the programs and instructions read from the memory 375, the processor 372 controls the operation of the input interface 373 and output interface 374.

[0045] like Figure 3 As shown, the input interface 373 is communicatively connected to the sensor group 280 and external devices via connection 377 to receive various signals and information provided by the sensor group 280 or various input commands provided by external devices, and stores these signals, information, or commands in the memory 375. The output interface 374 is communicatively connected to the top sealing device 230 and the bottom support device 240 via connection 378. In some embodiments, the output interface 374 is also communicatively connected to the x-direction (i.e., first direction) moving mechanism 111, the y-direction (i.e., second direction) moving mechanism 112, and the z-direction (i.e., third direction) moving mechanism 113 on the worktable 115 via connection 378. By executing the program 376 in the memory 375, the control device 170 controls the lifting and lowering movement of the cylinder slider 251 of the top sealing device 230 and the cylinder 261 of the bottom support device 240, and controls the moving position of the printing head 100 relative to the worktable 115. In addition, the control device 170 is also communicatively connected to the air supply device (not shown) to control the amount of solder paste extruded from the solder paste tube 120.

[0046] Figures 4A and 4B illustrate the process of replacing the solder paste tube 120 using the solder paste tube assembly device 118, explaining the coordinated lifting and lowering process of the top sealing device 230 and the bottom support device 240. Figure 4A shows the process of releasing the old solder paste tube, and Figure 4B shows the process of replacing the old solder paste tube.

[0047] like Figure 4A-1As shown, the top of the solder paste tube 120 is pressed and sealed by the sealing component 231 of the top sealing device 230, and the nozzle 221 of the solder paste tube 120 is supported on the support base 241 of the bottom support device 240, so that the solder paste tube assembly device 118 assembles the solder paste tube 120 in place. At this time, the distance between the top sealing device 230 and the bottom support device 240 is approximately equal to the height of the solder paste tube 120. The control device 170 can extrude solder paste from the solder paste tube 120 until the empty tube position sensor 281 detects that the solder paste tube 120 is empty. When the control device 170 detects that the old solder paste tube is empty and a new solder paste tube needs to be replaced, the top sealing device 230 remains stationary, and the bottom support device 240 moves downward, so that the support base 241 and the nozzle 221 of the old solder paste tube descend with the bottom support device 240, and the sealing component 231 leaves the top of the old solder paste tube, until the solder paste tube assembly device 118 reaches the position of the old solder paste tube. Figure 4A-2 The location shown.

[0048] like Figure 4A-2 As shown, the distance between the top sealing device 230 and the bottom support device 240 is greater than the height of the old solder paste tube. Although the top sealing device 230 remains stationary, the descending movement of the bottom support device 240 causes the sealing assembly 231 to no longer seal the old solder paste tube. However, the support base 241 of the bottom support device 240 still supports the nozzle 221 of the old solder paste tube, so that the old solder paste tube remains connected in the solder paste tube assembly device 118. At this time, the operator can manually remove the old solder paste tube, or push the old solder paste tube according to the specific settings of the printing press, so that the old solder paste tube is detached from the support base 241. The solder paste tube assembly device 118 reaches the height of the old solder paste tube. Figure 4A-3 The location shown.

[0049] like Figure 4A-3 As shown, both the top sealing device 230 and the bottom support device 240 remain stationary, and their distance is still greater than the height of the old solder paste tube. After the old solder paste tube detaches, the additional position sensor 283 detects and confirms that there is no solder paste tube on the solder paste tube assembly device 118, and the replacement of the new solder paste tube can begin according to the process in Figure 4B. The control device 170 obtains the height data of the new solder paste tube by recognizing the QR code on the new solder paste tube through the QR code recognition device, or the control device 170 receives the height data of the new solder paste tube input by the operator. When the height data of the new solder paste tube is lower than the height data of the old solder paste tube, the bottom support device 240 remains stationary, and the top sealing device 230 descends to the position shown in Figure 4B. Figure 4B-1 The location shown.

[0050] like Figure 4B-1As shown, the top sealing device 230 descends to a height matching the new solder paste tube. This matching height means that the descended position of the top sealing device 230 allows the sealing component 231 of the top sealing device 230 to seal against the top of the new solder paste tube when the bottom support device 240 is raised to its highest position. At this time, the bottom support device 240 remains in a descended state, therefore the distance between the bottom support device 240 and the top sealing device 230 is greater than the height of the new solder paste tube. At this point, the operator can manually assemble the new solder paste tube, or push the new solder paste tube onto the support base 241 according to the specific settings of the printing press, so that the nozzle 221 of the new solder paste tube is supported by the support base 241. The solder paste tube assembly device 118 reaches the position shown in the image. Figure 4B-2 The location shown.

[0051] like Figure 4B-2 As shown, the distance between the bottom support device 240 and the top sealing device 230 is still greater than the height of the new solder paste tube. The nozzle 221 of the new solder paste tube is supported on the support base 241, but the sealing component 231 of the top sealing device 230 is spaced a certain distance from the top of the new solder paste tube, so that the sealing component 231 has not yet sealed the top of the new solder paste tube. After the new solder paste tube is assembled in place, the top sealing device 230 remains stationary, while the bottom support device 240 drives the new solder paste tube to move upward together, so that the solder paste tube assembly device 118 reaches the height of the new solder paste tube. Figure 4B-3 The location shown.

[0052] like Figure 4B-3 As shown, the distance between the bottom support device 240 and the top sealing device 230 is approximately equal to the height of the new solder paste tube. The sealing component 231 of the top sealing device 230 is resealed to the top of the new solder paste tube, and the bottom support device 240 supports the nozzle 221 of the new solder paste tube, so that the new solder paste tube is assembled in place on the solder paste tube assembly device 118.

[0053] Those skilled in the art will understand that if the height of the new solder paste tube is the same as the height of the old solder paste tube, the top sealing device 230 can be directly installed with the new solder paste tube without needing to move up or down after removing the old solder paste tube. Similarly, if the height of the new solder paste tube is greater than the height of the old solder paste tube, the top sealing device 230 can move upwards after removing the old solder paste tube, and then... Figure 4B-2 and Figure 4B-3 The process of assembling new solder paste tubes.

[0054] Figure 5 A partial flowchart of the assembly method for the solder paste tube assembly device 118 is shown. Figure 5 As shown, at step 591, the control device 170 first identifies whether there is an old solder paste tube on the solder paste tube assembly device 118.

[0055] If an old solder paste tube exists, proceed to step 592, in which the old solder paste tube is released. Then proceed to step 593, in which a new solder paste tube is replaced.

[0056] If the old solder paste tube is not available, proceed directly to step 593.

[0057] Figure 6A A more detailed flowchart of step 592 is shown below. Figure 6B A more detailed flowchart of step 593 is shown.

[0058] like Figure 6A As shown, in step 592, control device 170 first executes step 594. In step 594, control device 170 lowers the bottom support device 240 so that the old solder paste tube is removed from the sealing assembly 231. Then step 595 is executed.

[0059] In step 595, the old solder paste tube is removed, for example by manual removal or by automatic removal by control device 170.

[0060] like Figure 6B As shown, in step 593, the control device 170 first executes step 596. In step 596, the control device 170 automatically identifies the information of the new solder paste tube, or identifies the information of the new solder paste tube entered manually. Then, it executes step 597.

[0061] In step 597, the control device 170 moves the top sealing device 230 based on the information of the new solder paste tube, so that the position of the top sealing device 230 matches the height of the new solder paste tube. Then step 598 is executed.

[0062] In step 598, a new solder paste tube is assembled, for example, by manual assembly or by automatic assembly by control device 170. Then step 599 is performed.

[0063] In step 599, the control device raises the bottom support device 240 so that the sealing assembly 231 of the top sealing device 230 can reseal the connection to the top of the new solder paste tube.

[0064] Therefore, the solder paste tube assembly device 118 of this application can automatically complete the disassembly and replacement of solder paste tubes of various heights.

[0065] In some printing presses, it may be necessary to replace solder paste tubes depending on the specific operating conditions of the press. The solder paste tube assembly device of this application, through a top sealing device capable of automatic upward and downward movement, can automatically complete the disassembly and replacement of solder paste tubes, and can automatically replace solder paste tubes of different heights.

[0066] And the tin paste tube assembly device of the present application reduces the lifting position required to be set for the top sealing device and the bottom supporting device through the mutual cooperation of the top sealing device and the bottom supporting device, and simplifies the lifting structure of the top sealing device and the bottom supporting device.

[0067] In addition, the tin paste tube assembly device of the present application further improves the automation degree of the printing machine by setting the sensor group, and can better understand the working condition of the printing head and the tin paste tube when the printing machine is in a closed working state.

[0068] Although the present disclosure has been described in connection with the examples of the embodiments outlined above, various alternatives, modifications, variations, improvements, and / or substantial equivalents, whether known or not, can become apparent to those of ordinary skill in the art. Additionally, the technical effects and / or technical problems described in this specification are exemplary and not limiting. Therefore, the disclosure in this specification can be used to solve other technical problems and have other technical effects. Accordingly, the examples of the embodiments of the present disclosure as stated above are intended to be illustrative, not limiting. Various changes can be made without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure is intended to include all known or earlier developed alternatives, modifications, variations, improvements, and / or substantial equivalents.

Claims

1. A tin-paste tube assembly device for fixing and sealing a tin-paste tube (120) having a nozzle (221) at a bottom of the tin-paste tube (120) through which the tin-paste tube (120) provides tin paste, characterized in that The tin paste tube assembly device (118) comprises: a bracket (201); a top sealing device (230) assembled at the top of the bracket (201), the top sealing device (230) comprising a sealing assembly (231) for sealingly connecting to the top of the tin paste tube (120); and a bottom supporting device (240) assembled at the bottom of the bracket (201), the bottom supporting device (240) comprising a supporting seat (241) for supporting the nozzle (221) of the tin paste tube (120); wherein the top sealing device (230) is arranged to be controllably lifted and lowered for sealingly connecting to the top of the tin paste tube (120) at different heights.

2. The tin paste tube assembly device according to claim 1, wherein: the bottom supporting device (240) is arranged to be controllably lifted and lowered to lower the height of the nozzle (221) of the tin paste tube (120) so that the top of the tin paste tube (120) is away from the sealing assembly (231).

3. The tin paste tube assembly device according to claim 1, wherein: the sealing assembly (231) comprises an annular boss (235) and a sealing ring (238), the sealing ring (238) being sleeved outside the annular boss (235), wherein the annular boss (235) is used to extend into the top of the tin paste tube (120) to sealingly connect to the tin paste tube (120) through the sealing ring (238).

4. The tin paste tube assembly device according to claim 1, wherein: the top sealing device (230) comprises a cylinder slider (251) and a guide rod (252), the guide rod (252) extending in the height direction, the cylinder slider (251) being arranged to be lifted and lowered along the extension direction of the guide rod (252), wherein the sealing assembly (231) is connected to the cylinder slider (251).

5. The tin paste tube assembly device according to claim 2, wherein: the bottom supporting device (240) comprises a cylinder (261) and a push rod (262), the push rod (262) extending in the height direction, the push rod (262) being arranged to extend or retract in the height direction, wherein the supporting seat (241) is connected to the push rod (262).

6. The tin paste tube assembly device according to claim 2, wherein Further comprising: a control device (170); and a sensor group (280) connected to the bracket (201), the sensor group (280) being arranged to detect the state of the tin paste tube (120) and provide corresponding signals to the control device; wherein the control device (170) is arranged to control at least one of the top sealing device (230) and the bottom supporting device (240) to lift and lower based on the signals provided by the sensor group (280).

7. The tin paste tube assembly device according to claim 6, characterized in that: the tin paste tube (120) comprises a pressing element (236); the sensor group (280) comprises an empty tube position sensor (281) arranged at a corresponding position where the pressing element (236) is located at an empty tube position, the empty tube position sensor (281) being arranged to provide the empty tube signal to the control device (170) when the pressing element (236) reaches the empty tube position.

8. The tin paste tube assembly device according to claim 7, characterized in that: the sensor group (280) further comprises a pre-warning position sensor (282) arranged at a corresponding position where the pressing element (236) is located at a pre-warning position, the pre-warning position sensor (282) being arranged to provide the pre-warning signal to the control device (170) when the pressing element (236) reaches the pre-warning position.

9. The tin paste tube assembly device according to claim 7, characterized in that: the sensor group (280) further comprises an additional sensor (283) arranged to detect whether a tin paste tube (120) is present in the tin paste tube assembly device (118).

10. A printing press characterized in that comprising: the tin paste tube assembly device (118) according to any one of claims 1-9; and a worktable (115); wherein the tin paste tube assembly device (118) is connected to the worktable (115) and is movable relative to the worktable (115) in a first direction (x), a second direction (y) or a third direction (z), wherein the third direction (z) is a height direction.

11. A method of assembling a tin paste tube, characterized by comprising the steps of: replacing a new tin paste tube, the step of replacing a new tin paste tube comprising: moving a top sealing device (230) based on a height of the new tin paste tube; assembling the new tin paste tube; and lifting a bottom support device (240) such that a sealing assembly (231) is sealingly connected to a top of the new tin paste tube.

12. The method of assembling a tin paste tube according to claim 11, wherein further comprising: detecting whether an old tin paste tube is present; if the old tin paste tube is present, first releasing the old tin paste tube and then replacing the new tin paste tube; if the old tin paste tube is not present, replacing the new tin paste tube.

13. The method of assembling a tin paste tube according to claim 12, characterized in that: the step of releasing the old tin paste tube comprises: lowering the bottom support device (240) such that the sealing assembly (231) is removed from a top of the old tin paste tube; and removing the old tin paste tube.

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