Magnetic device, manufacturing method thereof and electronic equipment

Abstract

The invention provides a magnetic device, a manufacturing method thereof and electronic equipment. The magnetic device includes: a magnetic body; the patch electrodes are arranged on the bottom surface of the magnetic body and are electrically connected with a circuit board; the winding is arranged in the magnetic body, and two end parts of the winding extend out of the magnetic body through the bottom surface of the magnetic body and are electrically connected with the patch electrodes; and the plurality of first side surface electrodes are arranged on the corresponding side surfaces of the magnetic body, and the first side surface electrodes are formed by dipping conductive paste and are electrically connected with the corresponding patch electrodes. On the basis, the vertical AOI detection of the welding points of the magnetic device and the circuit board is facilitated, more and more flexible electrical connection points are provided, the welding reliability is higher, and the high-frequency electrical performance is better.

Description

Technical Field

[0001] This application relates to the field of magnetic devices, specifically to a magnetic device and its manufacturing method, and electronic equipment. Background Technology

[0002] With the rapid development of technology, especially the emergence of multifunctional devices, the demand for passive components is increasing, and magnetic components, as one type of passive element, are widely used. Magnetic components mainly consist of a magnetic body, windings, and surface mount electrodes (also known as "terminals" or "surface mount terminals"). Surface mount electrodes primarily serve two functions: first, to electrically connect with the windings; and second, to electrically connect with the circuit board (e.g., PCB, or Printed Circuit Board) using SMT (Surface Mount Technology) to mount the magnetic component onto the circuit board. High-quality solder joints obtained through SMT are a guarantee of electronic performance and reliability. Currently, the industry commonly uses vertical AOI (Automated Optical Inspection) technology to inspect solder joints for defects. The principle is to use optical technology to acquire and analyze images of the inspection location along a line of sight parallel to the side of the magnetic component.

[0003] However, since the surface-mount electrodes are located on the bottom surface of the magnetic body, the solder used in SMT (Surface Mount Technology) is typically located at the bottom of the magnetic component and is difficult to overflow, ultimately being blocked by the magnetic component. This makes it difficult to capture satisfactory SMT solder images using vertical AOI (Automated Optical Inspection) technology, hindering vertical AOI inspection and judgment. Furthermore, the gases generated during soldering are difficult to expel, easily creating numerous pores within the solder joint, affecting the mechanical strength and electrical reliability and stability of the connection between the magnetic component and the circuit board. Additionally, the solder joints, existing only on the bottom of the magnetic component, cannot provide more flexible electrical connection points, and the small solder joint area results in insufficient mechanical strength between the magnetic component and the circuit board, making it prone to cracking and failure under vibration or impact. While increasing the surface-mount electrodes to increase the soldering area can achieve sufficient soldering strength, this increases the parasitic capacitance between the surface-mount electrodes, adversely affecting high-frequency electrical performance. Summary of the Invention

[0004] In view of this, this application provides a magnetic device and its manufacturing method, as well as an electronic device, which can at least improve the problems of existing magnetic devices being unfavorable for vertical AOI inspection of solder joints, having insufficient and inflexible electrical connection points, insufficient welding reliability, and poor high-frequency electrical performance.

[0005] This application provides a magnetic device comprising: magnetic body; Multiple patch electrodes are disposed on the bottom surface of the magnetic body and are used for electrical connection with the circuit board; A winding is disposed within the magnetic body, with its two ends extending beyond the bottom surface of the magnetic body and electrically connected to the patch electrode. Multiple first side electrodes are disposed on the corresponding side of the magnetic body. The side is sandwiched between the bottom and top surfaces of the magnetic body and intersects the bottom and top surfaces perpendicularly. The first side electrodes are formed by dipping in conductive paste and are electrically connected to the corresponding patch electrodes.

[0006] Optionally, at least one of the plurality of first side electrodes is disposed on two corresponding intersecting sides of the magnetic body.

[0007] Optionally, at least one of the plurality of first side electrodes is disposed on a side corresponding to the magnetic body.

[0008] Optionally, the magnetic body includes an intermediate body, an upper cover plate, and a lower cover plate. The winding is disposed within the cavity of the intermediate body, and the upper cover plate and the lower cover plate respectively cover the top and bottom ends of the intermediate body. The magnetic device further includes at least one second side electrode. Each second side electrode includes a first extension, a main body, and a second extension connected in sequence. The main body is disposed on a side corresponding to the magnetic body. The first extension is disposed on the upper cover plate to be located on the top surface of the magnetic body, and the second extension is disposed on the lower cover plate to be located on the bottom surface of the magnetic body.

[0009] Optionally, the magnetic device includes two second side electrodes, which are disposed opposite to each other outside the magnetic body.

[0010] Optionally, the second side electrode is an integrally molded part and is disposed outside the magnetic body by adhesive bonding.

[0011] This application provides an electronic device including a first circuit board and a magnetic device as described in any of the preceding claims. A plurality of patch electrodes of the magnetic device are first soldered to pads corresponding to the first circuit board to achieve electrical connection. The solder of the first soldering overflows through the patch electrodes and out of the first side electrode.

[0012] Optionally, the magnetic device includes at least one second side electrode; the electronic device further includes at least one second circuit board, the second circuit board being disposed adjacent to the top surface of the magnetic device, a first extension of each second side electrode being secondly soldered to a pad of the second circuit board, and a second extension being thirdly soldered to a pad of the first circuit board to electrically connect the second circuit board to the first circuit board, the solder of the second soldering overflowing from the first extension to the body portion of the second side electrode, and the solder of the third soldering overflowing from the second extension to the body portion of the second side electrode.

[0013] This application provides a method for manufacturing a magnetic device, comprising: A semi-finished device is provided, the semi-finished device including a magnetic body, multiple surface-mount electrodes and a winding. The multiple surface-mount electrodes are disposed on the bottom surface of the magnetic body and are used for electrical connection with a circuit board. The winding is disposed in the magnetic body, and the two ends of the winding extend beyond the bottom surface of the magnetic body and are electrically connected to the surface-mount electrodes. The preset bottom corner of the semi-finished device is dipped in conductive paste to form a first side electrode located on the side corresponding to the magnetic body and electrically connected to the corresponding patch electrode. The side corresponding to the magnetic body is sandwiched between the bottom and top surfaces of the magnetic body and intersects the bottom and top surfaces perpendicularly.

[0014] Optionally, the magnetic body includes an intermediate body, an upper cover plate, and a lower cover plate. The winding is disposed within the cavity of the intermediate body, and the upper cover plate and the lower cover plate respectively cover the top and bottom ends of the intermediate body. The method further includes: bonding at least one second side electrode to the outside of the magnetic body. A single second side electrode includes a first extension, a main body, and a second extension connected in sequence. The main body is disposed on a side corresponding to the magnetic body. The first extension is disposed on the upper cover plate to be located on the top surface of the magnetic body, and the second extension is disposed on the lower cover plate to be located on the bottom surface of the magnetic body.

[0015] As described above, the magnetic device of this application is provided with a first side electrode located on the side of the magnetic body and electrically connected to the surface mount electrode. This is equivalent to extending the surface mount electrode to the side of the magnetic body, allowing the solder used in SMT to overflow to the side of the magnetic body. This facilitates the acquisition of SMT solder images that meet the requirements when using vertical AOI technology, which is beneficial for vertical AOI inspection and judgment. At the same time, the gas generated during surface mount electrode soldering can be discharged through the side, which is equivalent to providing a gas escape channel, helping to reduce the porosity generated inside the solder joint, and improving the reliability and stability of the mechanical strength connection and electrical connection between the magnetic device and the circuit board. In addition, the provision of the first side electrode is equivalent to increasing the area and placement of the surface mount electrode, allowing the solder joint to exist at the bottom and side of the magnetic device, resulting in more and more flexible electrical connection points. The larger soldering area also improves the mechanical strength connection between the magnetic device and the circuit board, making it less prone to cracking and failure under vibration or impact. In other words, under the premise of achieving the same or even higher soldering strength, this application can reduce the area of ​​the surface mount electrode located at the bottom, thereby increasing the distance between the surface mount electrodes to reduce parasitic capacitance, which is beneficial to improving high-frequency electrical performance.

[0016] This application relates to a structural design for a magnetic body comprising an intermediate body, an upper cover plate, and a lower cover plate. The magnetic device may also be provided with at least one second side electrode. The second side electrode comprises a first extension, a main body, and a second extension connected in sequence. The main body is disposed on a side corresponding to the magnetic body. The first extension is disposed on the upper cover plate of the magnetic device, located on the top surface of the magnetic body. The second extension is disposed on the lower cover plate of the magnetic device, located on the bottom surface of the magnetic body. In this way, the second side electrode can apply a force toward the intermediate body to the upper cover plate and the lower cover plate respectively, thereby improving the structural stability of the magnetic body. At the same time, other circuit boards (i.e., the second circuit board) can be electrically connected to the first circuit board at the bottom through the second side electrode, further making the solder joints of the magnetic device more numerous and flexible. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the magnetic device according to the first embodiment of this application; Figure 2 yes Figure 1 The diagram shows the structure of the magnetic device. Figure 3 yes Figure 1 The bottom view of the magnetic device shown; Figure 4 yes Figure 1 The shown is a side view of the magnetic device and the first circuit board in a soldered state. Figure 5 This is a schematic diagram of the structure of the magnetic device according to the second embodiment of this application; Figure 6 yes Figure 5 The bottom view of the magnetic device shown; Figure 7 yes Figure 5 The shown magnetic device is a side view of the structure of the first and second circuit boards in the soldered state.

[0018] First direction x, second direction y, third direction Z; magnetic device 100, magnetic body 1, winding 2, patch electrode 3, first side electrode 4, first side 11, second side 12, third side 13, fourth side 14, top surface 15, bottom surface 16, first part 41, second part 42, first circuit board 5, solder 50, solder joint 51, intermediate body 101, upper cover plate 102, lower cover plate 103, second side electrode 6, main body 60, first extension 61, second extension 62, second circuit board 7. Detailed Implementation

[0019] To address the aforementioned problems in the prior art, this application provides a magnetic device, a method for manufacturing the same, and an electronic device. These protected subjects are based on the same concept, and the principles for solving the problems are essentially the same or similar. The implementation methods of each protected subject can be referred to mutually, and repeated details will not be elaborated upon.

[0020] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly described below in conjunction with specific embodiments and corresponding drawings. Obviously, the embodiments described below are only a part of the embodiments of this application, and not all of them. Unless otherwise specified, the following embodiments and their technical features can be combined with each other, and also belong to the technical solutions of this application.

[0021] In the description of the embodiments of this application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the technical solutions of the corresponding embodiments, and are not intended to indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limitations on this application.

[0022] Please combine them together Figures 1 to 4 As shown in the figure, a magnetic device 100 provided in this application embodiment includes a magnetic body 1, a winding 2, a plurality of patch electrodes 3, and a plurality of first side electrodes 4. The number, position, etc. of the patch electrodes 3 and the first side electrodes 4 can be adapted according to actual needs. The four patch electrodes 3 and four first side electrodes 4 shown in the figure are only illustrative examples.

[0023] The magnetic body 1 can be formed from magnetic powder using a predetermined process. The specific composition of the magnetic powder can be a soft magnetic material of existing technology, and the predetermined process can be a hot pressing process. The magnetic body 1 can be a cuboid or a tetragonal-like shape. A tetragonal-like shape can be understood as the magnetic body 1 having a rectangular overall shape, but with rounded corners having a predetermined radius of curvature, and the lines forming a single corner are not the two traditional sharp corners. The rectangular magnetic body 1 can include six faces, namely a first side face 11, a second side face 12, a third side face 13, a fourth side face 14, a top face 15, and a bottom face 16. The third side face 13, the fourth side face 14, and the bottom face 16 are constrained by... Figure 1 The placement orientation shown is not displayed, but... Figure 3 and Figure 4 As shown in the diagram, the first side 11, the second side 12, the third side 13, and the fourth side 14 are connected sequentially and are all perpendicularly connected to the bottom surface 16 and the top surface 15. That is to say, in... Figures 1 to 3 In the orientation shown, the first side surface 11 and the third side surface 13 are positioned opposite each other along the third direction z, the second side surface 12 and the fourth side surface 14 are positioned opposite each other along the first direction x, and the bottom surface 16 and the top surface 15 are positioned opposite each other along the second direction y. The surface of the magnetic body 1 may or may not be covered with an insulating layer. The magnetic body 1 illustrated in this application is merely an example and may also be of other shapes.

[0024] For ease of description and understanding, combined with Figures 1 to 4 The orientations shown are illustrated using the magnetic body 1, which is generally rectangular, as an example. Here, the width direction of the magnetic device 100 is referred to as the first direction x, the height direction as the second direction y, and the thickness direction as the third direction z. The first direction x, the second direction y, and the third direction z are all perpendicular to each other and can be considered as the three coordinate axes of a three-dimensional Cartesian coordinate system. It should be understood that the term "perpendicular" throughout this application does not require the angle between the two directions to be 90°, but allows for deviations such as ±10°. That is, "perpendicular" can be understood as the angle between any two directions being 80° to 100°. Similarly, the term "parallel" throughout this application does not require the angle between the two directions to be 0° or 180°, but allows for deviations such as ±10°. That is, "parallel" can be understood as the angle between any two directions being 0° to 10° or 170° to 190°.

[0025] The winding 2 is disposed within the magnetic body 1 and is a wound structure; here, the winding 2 can also be referred to as coil 2. Its shape and the specific number of turns can be determined according to the adaptability of the actual scenario. Figure 2As shown, the winding 2 of this application can be formed by winding enameled wire or by winding a long strip (or a long strip-shaped sheet) of flat wire. The flat wire has a lower DC resistance (DCR), resulting in a lower impedance for the winding 2. The winding 2 has multiple ends, which can extend beyond the bottom surface 16 of the magnetic body 1, thereby correspondingly welding to each of the patch electrodes 3 on the bottom surface 16 of the magnetic body 1 to achieve electrical connection. Figure 3 In one example, the structure and shape of each patch electrode 3 can be completely identical, and they are respectively disposed in the four apex regions of the bottom surface 16 of the magnetic body 1. Then, each end of the winding 2 also extends to the four apex regions of the bottom surface 16. In another example, each patch electrode 3 can be formed by extrusion deformation of each end of the winding 2, that is, each patch electrode 3 can be regarded as part of the end of the winding 2.

[0026] Multiple first side electrodes 4 are disposed on the corresponding side of the magnetic body 1, for example, combined with Figure 3 As shown, the first side 11, second side 12, third side 13, and fourth side 14 of the magnetic body 1 are each provided with a first side electrode 4. The structures of the multiple first side electrodes 4 can be the same or different; here, some parts of this document are described using a single first side electrode 4 as an example. The first side electrode 4 is formed by dipping it in a conductive paste (e.g., silver) and is electrically connected to the corresponding patch electrode 3. Because the conductive paste is a fluid or semi-fluid, the degree of dipping varies on each side, resulting in different shapes for the final first side electrodes 4, unlike the examples shown. Figure 1 The edges and corners shown are not regular, but may be at least one of concave arc, convex arc or crescent shape.

[0027] In one example, at least one of the plurality of first side electrodes 4 is disposed on two corresponding intersecting side surfaces of the magnetic body 1. For example, in Figure 1 The area selected by the dashed line in the figure includes the first side electrode 4, which is marked as the first part 41 and the second part 42. The first part 41 is disposed on the first side 11 of the magnetic body 1 and extends to the bottom surface 16 to connect with the patch electrode 3. The second part 42 is disposed on the second side 12 of the magnetic body 1 and extends to the bottom surface 16 to connect with the patch electrode 3. The first side 11 and the second side 12 intersect perpendicularly.

[0028] In another example, at least one of the plurality of first side electrodes 4 is disposed on a side corresponding to the magnetic body 1. That is, a certain first side electrode 4 may only have one of the aforementioned first portion 41 and second portion 42, without the other.

[0029] Based on the above, by setting the first side electrode 4, it is equivalent to extending the patch electrode 3 of the magnetic device 100 to the side of the magnetic body 1, combined with Figure 4 As shown, when the magnetic device 100 and the pads of the first circuit board 5 are subjected to SMT (Surface Mount Technology), the solder 50 used in the soldering process can overflow to the side of the magnetic body 1. This facilitates the acquisition of SMT solder images that meet the requirements when using vertical AOI (Automated Optical Inspection) technology, which is beneficial for vertical AOI detection and judgment. Simultaneously, the gas generated when the surface mount electrode 3 is soldered to the pads of the first circuit board 5 can be discharged through the side, effectively providing a gas escape channel. This helps reduce porosity inside the solder joint 51, improving the reliability and stability of the mechanical and electrical connections between the magnetic device 100 and the first circuit board 5. Furthermore, the... The arrangement of the first side electrode 4 is equivalent to increasing the area and position of the patch electrode 3, so that the solder joint 51 can exist on the bottom and side of the magnetic device 100. The magnetic device 100 has more and more flexible electrical connection points, and the larger solder area can also improve the mechanical strength connection between the magnetic device 100 and the first circuit board 5, making it less prone to cracking and failure when subjected to vibration or impact. In other words, under the premise of achieving the same or even higher solder strength, this application can reduce the area of ​​the patch electrode 3 located on the bottom surface 16, thereby increasing the distance between the patch electrodes 3 to reduce parasitic capacitance, which is beneficial to improving high-frequency electrical performance.

[0030] Example 2 Figures 5 to 7 A magnetic device 100 according to another embodiment of this application is also shown. For ease of description and understanding, structural elements with the same name are identified by the same reference numerals in this application. Please refer to the accompanying documentation. Figures 5 to 7 As shown, based on the structural design and beneficial effects of the aforementioned embodiment 1, the difference lies in that the magnetic body 1 of this embodiment 2 includes an intermediate body 101, an upper cover plate 102, and a lower cover plate 103. The intermediate body 101 is a cavity structure with a hollow interior and openings at the top and bottom. The winding 2 is disposed in the cavity of the intermediate body 101. The upper cover plate 102 and the lower cover plate 103 respectively cover the openings at the top and bottom of the intermediate body 101, thereby forming a rectangular and sealed magnetic body 1.

[0031] Correspondingly, the magnetic device 100 of this embodiment 2 also includes at least one second side electrode 6, for example Figure 5 and Figure 6Two second side electrodes 6 are shown, which are arranged opposite each other along a first direction x. Each second side electrode 6 includes a first extension 61, a main body 60, and a second extension 62 connected in sequence. The main body 60 is disposed on a corresponding side of the magnetic body 1; for example, the main body 60 of one second side electrode 6 is disposed on the second side 12 of the magnetic body 1, and the main body 60 of the other second side electrode 6 is disposed on the fourth side 14 of the magnetic body 1. The first extension 61 of any second side electrode 6 is disposed on the upper cover plate 102 of the magnetic body 1, thus located on the top surface 15 of the magnetic body 1, and the second extension 62 of any second side electrode 6 is disposed on the lower cover plate 103 of the magnetic body 1, thus located on the bottom surface 16 of the magnetic body 1. Figure 5 and Figure 6 In the example, the first extensions 61 of the two second side electrodes 6 are both disposed on the upper cover plate 102 of the magnetic body 1 and are disposed opposite to each other on the top surface 15 along the first direction x. The second extensions 62 of the two second side electrodes 6 are both disposed on the lower cover plate 103 of the magnetic body 1 and are disposed opposite to each other on the bottom surface 16 along the first direction x.

[0032] Therefore, each second side electrode 6 can apply a force toward the intermediate body 101 to the upper cover plate 102 and the lower cover plate 103 respectively, thereby ensuring a stable fit between the upper cover plate 102 and the lower cover plate 103 and the intermediate body 101, so that the magnetic body 1 has good structural stability. At the same time, combined with Figure 7 As shown, other circuit boards (i.e., the second circuit board 7) can be electrically connected to the first circuit board 5 at the bottom through the second side electrode 6, which further makes the solder joints 51 of the magnetic device 100 more numerous and flexible.

[0033] Further integration Figure 7 As shown, when soldering the second side electrode 6 to the pads of the second circuit board 7, the first extension 61 of the second side electrode 6 can be soldered to the second circuit board 7. The solder 50 used in the soldering can overflow to the side of the magnetic body 1 and / or the side of the main body 60 of the second side electrode 6. This facilitates the acquisition of SMT solder images that meet the requirements when using vertical AOI technology, which is beneficial for vertical AOI inspection and judgment. Similarly, the gas generated when the first extension 61 is soldered to the pads of the second circuit board 7 can be discharged through the side, which is equivalent to providing a gas escape channel. This helps to reduce the porosity generated inside the solder joint 51 and can improve the reliability and stability of the mechanical strength connection and electrical connection between the magnetic device 100 and the second circuit board 7.

[0034] In one example, either of the second side electrodes 6 can be a single-piece molded part, and the sheet-like second side electrode 6 is attached to the outside of the magnetic body 1 by adhesive bonding. This results in higher structural strength for the second side electrode 6, which is more conducive to improving the structural stability of the magnetic body 1.

[0035] exist Figure 5 and Figure 6 In the example, the magnetic device 100 includes two second side electrodes 6, which are disposed opposite to each other outside the magnetic body 1, thereby applying forces to the upper cover plate 102 and the lower cover plate 103 in their respective relative directions, which can better improve the structural stability of the magnetic body 1.

[0036] Example 3 This application also provides an electronic device, including, as in the following embodiments: Figure 4 The structural components shown may also include, for example: Figure 7 The structure shown is as follows. That is, the electronic device includes a first circuit board 5 and a magnetic device 100 as in any of the examples above. A plurality of surface-mount electrodes 3 of the magnetic device 100 are first soldered to the corresponding pads of the first circuit board 5 to achieve electrical connection. The solder 50 of the first soldering overflows through the surface-mount electrodes 3 and overflows beyond the first side electrode 4.

[0037] Furthermore, in combination Figure 7 As shown, in an example where the magnetic device 100 includes at least one second side electrode 6, the electronic device may further include at least one second circuit board 7 disposed adjacent to the top surface 15 of the magnetic device 100. The first extension 61 of each second side electrode 6 is secondly soldered to the pad of the second circuit board 7, and the second extension 62 is thirdly soldered to the pad of the first circuit board 7 to electrically connect the second circuit board 7 to the first circuit board 5. The solder 50 of the second soldering overflows to the outside of the main body 60 of the second side electrode 6 via the corresponding first extension 61, and the solder 50 of the third soldering overflows to the outside of the main body 60 of the second side electrode 6 via the corresponding second extension 62.

[0038] Since the electronic device includes the magnetic device 100 of the aforementioned corresponding example, the beneficial effects that the magnetic device 100 of the corresponding example can produce can be generated, which will not be repeated here.

[0039] Example 4 This application also provides a method for manufacturing a magnetic device, comprising: S1. Provide a semi-finished device, the semi-finished device including a magnetic body, multiple surface-mount electrodes and a winding, the multiple surface-mount electrodes being disposed on the bottom surface of the magnetic body and used for electrical connection with a circuit board; the winding being disposed within the magnetic body, the two ends of the winding extending beyond the bottom surface of the magnetic body and being electrically connected to the surface-mount electrodes. S2. Dip the preset bottom corner of the semi-finished device into conductive paste to form a first side electrode located on the side corresponding to the magnetic body and electrically connected to the corresponding patch electrode. The side corresponding to the magnetic body is sandwiched between the bottom and top surfaces of the magnetic body and intersects the bottom and top surfaces perpendicularly.

[0040] The preset bottom angle can be as described above. Figure 1 and Figure 3 The four base corners are shown.

[0041] The method described above can be used to produce at least the magnetic device 100 described in Example 1 above, and thus can produce the beneficial effects that the magnetic device 100 of Example 1 can produce, which will not be repeated here.

[0042] like Figures 5 to 7 As shown, in a scenario where the magnetic body 1 includes an intermediate body 101, an upper cover plate 102, and a lower cover plate 103, the method may further include step S3.

[0043] S3. At least one second side electrode is bonded to the outside of the magnetic body. The single second side electrode includes a first extension, a main body, and a second extension connected in sequence. The main body is disposed on a side corresponding to the magnetic body. The first extension is disposed on the upper cover plate to be located on the top surface of the magnetic body. The second extension is disposed on the lower cover plate to be located on the bottom surface of the magnetic body.

[0044] Therefore, the method described above can at least be used to produce the magnetic device 100 described in the aforementioned Example 2, and thus can produce the beneficial effects that the magnetic device 100 of Example 2 can produce, which will not be repeated here.

[0045] The above description is only a part of the embodiments of this application and does not limit the patent scope of this application. For those skilled in the art, any equivalent structural transformations made using the content of this specification and drawings are similarly included within the patent protection scope of this application.

[0046] Although this document uses terms such as "first," "second," etc., to describe various types of information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. Furthermore, the singular forms "a," "an," and "the" are intended to also include the plural forms. The terms "or" and "and / or" are interpreted as inclusive, or meaning either one or any combination thereof. Exceptions to this definition only arise when combinations of elements, functions, steps, or operations are inherently mutually exclusive in some way.

Claims

1. A magnetic device, characterized by, The magnetic device comprises: a magnetic body; a plurality of patch electrodes arranged on the bottom surface of the magnetic body and used for electrically connecting with a circuit board; a winding arranged in the magnetic body, two ends of the winding extending out of the magnetic body through the bottom surface of the magnetic body and electrically connecting with the patch electrodes; a plurality of first side electrodes arranged on the corresponding side surface of the magnetic body, the side surface being arranged between the top surface and the bottom surface of the magnetic body and perpendicularly intersecting with the top surface and the bottom surface, the first side electrodes being formed by dipping conductive paste and electrically connecting with the corresponding patch electrodes.

2. The magnetic device of claim 1, wherein, At least one of the plurality of first side electrodes is arranged on the corresponding two intersecting side surfaces of the magnetic body.

3. The magnetic device of claim 1, wherein, At least one of the plurality of first side electrodes is arranged on the corresponding one side surface of the magnetic body.

4. The magnetic device according to any one of claims 1 to 3, characterized in that, The magnetic body comprises an intermediate body, an upper cover plate and a lower cover plate, the winding is arranged in the cavity of the intermediate body, and the upper cover plate and the lower cover plate cover the top end and the bottom end of the intermediate body, respectively. The magnetic device further comprises at least one second side electrode, each of the second side electrodes comprises a first extension part, a main body part and a second extension part connected in sequence, the main body part is arranged on the corresponding one side surface of the magnetic body, the first extension part is arranged on the upper cover plate to be located on the top surface of the magnetic body, and the second extension part is arranged on the lower cover plate to be located on the bottom surface of the magnetic body.

5. The magnetic device of claim 4, wherein, The magnetic device comprises two second side electrodes, and the two second side electrodes are oppositely arranged outside the magnetic body.

6. The magnetic device of claim 4, wherein, The second side electrode is an integrally formed part and is arranged outside the magnetic body by means of adhesion.

7. An electronic device, comprising: The electronic device comprises a first circuit board and the magnetic device according to any one of claims 1 to 6, the plurality of patch electrodes of the magnetic device are first soldered with the corresponding pads of the first circuit board to realize electrical connection, and the solder of the first soldering overflows through the patch electrodes and to the outside of the first side electrodes.

8. The electronic device of claim 7, wherein, The magnetic device comprises at least one second side electrode, and the electronic device further comprises at least one second circuit board, the second circuit board is arranged adjacent to the top surface of the magnetic device, the first extension part of each second side electrode is second soldered with the pads of the second circuit board, and the second extension part is third soldered with the pads of the first circuit board, so as to electrically connect the second circuit board with the first circuit board, the solder of the second soldering overflows to the outside of the main body part of the second side electrode through the first extension part, and the solder of the third soldering overflows to the outside of the main body part of the second side electrode through the second extension part.

9. A method of manufacturing a magnetic device, characterized by, The method comprises: providing a semi-finished device, the semi-finished device comprising a magnetic body, a plurality of patch electrodes and a winding, the plurality of patch electrodes being arranged on the bottom surface of the magnetic body and used for electrically connecting with a circuit board, and the winding being arranged in the magnetic body, two ends of the winding extending out of the magnetic body through the bottom surface of the magnetic body and electrically connecting with the patch electrodes; The preset bottom corner of the semi-finished device is dipped into conductive paste to form a first side electrode located on a corresponding side of the magnetic body and electrically connected with a corresponding patch electrode, the corresponding side of the magnetic body being clamped between the bottom surface and the top surface of the magnetic body and perpendicularly intersecting the bottom surface and the top surface.

10. The method of claim 9, wherein, The magnetic body comprises an intermediate body, an upper cover plate and a lower cover plate, the winding being arranged in a cavity of the intermediate body, the upper cover plate and the lower cover plate covering the top end and the bottom end of the intermediate body respectively; The method further comprises: At least one second side electrode is bonded outside the magnetic body, each of the second side electrodes comprising a first extension part, a main body part and a second extension part connected in sequence, the main body part being arranged on a corresponding side of the magnetic body, the first extension part being arranged on the upper cover plate to be located on the top surface of the magnetic body, and the second extension part being arranged on the lower cover plate to be located on the bottom surface of the magnetic body.

Images