Superconducting coil assembly and actuator system

Abstract

A lithographic apparatus includes: a patterning device; a first positioner for positioning the patterning device support member; a substrate support; the second positioner is used for positioning the substrate supporting piece; and a projection system configured to project a radiation beam from the patterning device onto the substrate wherein the patterning device support, the first locator, the substrate support and / or the second locator have, during use, a plurality of superconducting coils configured to generate a magnetic field, the plurality of superconducting coils are grouped into a plurality of separable and discrete modules, and the plurality of modules form an assembly when assembled; each module includes a subset of one or more coils of the plurality of coils and includes an electrical interface for providing power to the subset of one or more coils and a cooling interface for providing cooling for the superconductivity of the subset of one or more coils.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to European Application 23189382.7, filed on 3 August 2023, and European Application 23204881.9, filed on 20 October 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This specification relates to a superconducting coil system for use in, for example, magnetic positioners in photolithography equipment. Background Technology

[0004] A lithography apparatus is a machine configured to apply a desired pattern onto a substrate. Lithography apparatus can be used, for example, in the manufacture of integrated circuits (ICs). A lithography apparatus can project a pattern (often referred to as a “design layout” or “design”) from a patterning apparatus (e.g., a mask) onto a layer of radiation-sensitive material (resist) disposed on a substrate (e.g., a wafer).

[0005] As semiconductor manufacturing processes continue to advance, the size of circuit elements has shrunk steadily over the past few decades, while the number of functional elements, such as transistors, per device has steadily increased, following a trend commonly known as "Moore's Law." To keep pace with Moore's Law, the semiconductor industry is pursuing technologies that enable the creation of increasingly smaller features. To pattern a substrate, photolithography equipment can use electromagnetic radiation. The wavelength of this radiation determines the minimum size of the feature to be patterned on the substrate. Typical wavelengths currently used are 365 nm (i-line), 248 nm, 193 nm, and 13.5 nm. Compared to photolithography equipment using radiation with a wavelength, for example, 193 nm, photolithography equipment using extreme ultraviolet (EUV) radiation with wavelengths in the range of 4 nm to 20 nm (e.g., 6.7 nm or 13.5 nm) can be used to form smaller features on a substrate.

[0006] A photolithography apparatus may include: an irradiation system configured to provide a projection beam of radiation; and a support structure configured to support a patterning apparatus. The patterning apparatus may be used to impart a pattern to the projection beam in its cross-section. The apparatus may also include a projection system configured to project the patterned beam onto a target portion of a substrate. Thus, in a photolithography apparatus that uses radiation to generate a pattern, the patterning apparatus is irradiated by a radiation beam. As the patterning apparatus passes through the radiation beam, a pattern is imparted to it. Subsequently, the radiation beam with the imparted pattern passes through the projection system, which projects the imparted pattern onto the substrate. Summary of the Invention

[0007] To provide a desired pattern to a substrate, both the patterning apparatus and the substrate move relative to the projection system and relative to each other. For this purpose, linear and / or planar actuator systems are typically used based on one or more current-conducting coils and one or more magnets at room temperature or higher temperatures due to heat generated by the one or more coils. Linear and planar actuator systems typically have a stator portion and a mover portion, the mover portion being able to move in a controlled manner relative to the stator portion by manipulating current through one or more current-conducting coils. One or more magnets (which may be, for example, one or more permanent magnets and / or one or more electromagnets) may be arranged in the stator portion and one or more current-conducting coils in the mover portion, or conversely, one or more magnets may be arranged in the mover portion and one or more current-conducting coils in the stator portion. For example, in some arrangements, the surface of the positioner is equipped with strong permanent magnets in a checkerboard pattern (e.g., a Halbach array) on the stator. The mover portion includes one or more electromagnets (e.g., in a Lorentz actuator) and is suspended above the stator.

[0008] The magnetic field density of one or more coils in a linear or planar actuator system can be increased by, for example, three to five times, by using one or more superconducting electromagnets at a temperature of 4K. In practice, superconductors that are superconducting at higher cryogenic temperatures in the range of 70K to 150K can be obtained. Not only can one or more magnets be one or more superconducting magnets with one or more superconducting coils, but additionally or alternatively, one or more current-conducting coils can also be one or more superconducting coils.

[0009] Therefore, replacing permanent magnets, such as those on a stator, with superconducting electromagnets can increase the magnetic field density and thus provide a significant improvement in production yield. However, achieving high field density superconducting coils involves cryogenic cooling. Therefore, to put superconducting electromagnets into practice, thermal insulation ranging from cryogenic temperatures to room temperature is desirablely suited to small stack heights. Otherwise, the distance between one or more coils of the mover and one or more superconducting magnets would increase due to insulation to the extent that the increase in magnetic field density in one or more coils would be lost. Therefore, a thermal insulation layer with a small height is desirable.

[0010] In one embodiment, a superconducting assembly for an actuator is provided, the assembly including a plurality of superconducting coils configured to generate a magnetic field during use, wherein the plurality of superconducting coils are divided into a plurality of separable and discrete modules, the plurality of modules forming the assembly when assembled, each module including a subset of one or more of the plurality of coils and including an electrical interface for providing power to the subset of one or more coils.

[0011] In one embodiment, a magnet body for a planar motor is provided, the magnet body including, during use, a plurality of superconducting coils configured to generate a two-dimensional (2D) alternating magnetic field, wherein the plurality of superconducting coils are grouped into a set of separable and discrete modules, the set of modules forming the magnet body when assembled, each module including a subset of the plurality of coils.

[0012] In one embodiment, a module for a superconducting assembly of an actuator is provided, the module including one or more superconducting coils of the assembly, the module having external or multi-surface non-planar walls.

[0013] In one embodiment, a lithography apparatus assembly is provided, comprising: a patterning apparatus support configured to support a patterning apparatus; a first positioner configured to position the patterning apparatus support; a substrate support configured to hold a substrate; a second positioner configured to position the substrate support; and a projection system configured to project a radiation beam from the patterning apparatus onto the substrate, wherein one or more selected from the patterning apparatus support, the first positioner, the substrate support, and / or the second positioner include, during use, a plurality of superconducting coils configured to generate a magnetic field, wherein the plurality of superconducting coils are divided into separable and discrete plurality of modules, the plurality of modules forming the assembly when assembled, each module including a subset of one or more of the plurality of coils and including an electrical interface for providing power to the subset of one or more coils.

[0014] In one embodiment, a superconducting assembly for an actuator is provided, the superconducting assembly including an array of superconducting coils configured to cooperate with a mover of the actuator and one or more superconducting coils configured to cooperate with an object separated from the mover, the array of superconducting coils and the one or more superconducting coils having a common cooling arrangement for providing cooling for superconductivity.

[0015] In one embodiment, a lithography apparatus assembly is provided, comprising: a patterning apparatus support configured to support a patterning apparatus; a first positioner configured to position the patterning apparatus support; a substrate support configured to hold a substrate; a second positioner configured to position the substrate support; and a projection system configured to project a radiation beam from the patterning apparatus onto the substrate, wherein one or more selected from the patterning apparatus support, the first positioner, the substrate support, and / or the second positioner include an array of superconducting coils configured to cooperate with a mover and one or more superconducting coils configured to cooperate with an object separated from the mover, the array of superconducting coils and the one or more superconducting coils having a common cooling arrangement for providing cooling for superconductivity. Attached Figure Description

[0016] Embodiments of the invention will now be described with reference only to the accompanying schematic drawings, in which corresponding reference numerals indicate corresponding parts, and in the drawings:

[0017] Figure 1 A schematic diagram of a photolithography apparatus;

[0018] Figure 2 schematic depiction Figure 1 A view of a portion of a lithography device;

[0019] Figure 3 A schematic depiction of the position control system;

[0020] Figure 4 A cross-section of the actuator system according to an embodiment is schematically depicted;

[0021] Figure 5 The actuator system is schematically depicted in a top view;

[0022] Figure 6 An embodiment of the insulating covering of components of an actuator system is schematically depicted;

[0023] Figure 7 An embodiment of the insulating covering of components of an actuator system is schematically depicted;

[0024] Figure 8 A schematic depiction of the details of the insulating covering of the components of the actuator system;

[0025] Figure 9 A cross-section of the actuator system according to an embodiment is schematically depicted;

[0026] Figure 10A heat-regulating plate according to an embodiment is schematically depicted;

[0027] Figure 11 A cross-section of a flexible catheter according to an embodiment is schematically depicted;

[0028] Figure 12A and Figure 12B The arrangement of the internal pathway network according to an embodiment is schematically depicted;

[0029] Figure 13a A cross-section of the actuator system according to an embodiment is schematically depicted;

[0030] Figure 13b A power supply that can be applied in an actuator system according to an embodiment is schematically depicted;

[0031] Figure 13c and Figure 13d A cross-section of the actuator system according to an embodiment is schematically depicted;

[0032] Figure 14 A perspective view schematically depicting the arrangement of modules for holding the coils of the actuator system according to an embodiment;

[0033] Figure 15A , Figure 15B and Figure 15C A schematic depiction of a cross-section (when viewed from the bottom or top) of a portion of the module used to hold the coils of the actuator system according to an embodiment; and

[0034] Figure 16 A cross-section of the actuator system according to an embodiment is schematically depicted.

[0035] The features shown in the accompanying drawings are not necessarily drawn to scale, and the dimensions and / or arrangements depicted are not limiting. It should be understood that the drawings include optional features that may not be essential to the invention. Furthermore, not all features of the device are depicted in each of the drawings, and the drawings may show only some of the parts associated with describing a particular feature. Detailed Implementation

[0036] In this document, the terms “radiation” and “beam” are used to encompass all types of electromagnetic radiation or charged particles, including ultraviolet radiation (e.g., wavelengths of 365 nm, 248 nm, 193 nm, 157 nm, or 126 nm), EUV radiation (extreme ultraviolet radiation, e.g., wavelengths in the range of about 5 nm to 100 nm, such as 13.5 nm), or charged particles (e.g., electron beams, ion beams, etc.).

[0037] As used herein, the terms "mask," "mask," or "patterning apparatus" can be broadly interpreted to refer to a general patterning apparatus that can be used to impart a patterned cross-section to a radiation beam, the patterned cross-section corresponding to a pattern to be generated in a target portion of a substrate. In such contexts, the term "optical valve" may also be used. Examples of these patterning apparatuses, in addition to classic masks (transmissive or reflective, binary, phase-shifting, hybrid, etc.), include programmable mirror arrays and programmable LCD arrays.

[0038] Figure 1 A lithography apparatus LA is schematically depicted. The lithography apparatus LA includes: an irradiation system (also called an irradiator) IL configured to modulate a radiation beam B (e.g., UV radiation, DUV radiation, or EUV radiation); a patterning apparatus support (e.g., a mask stage) MT configured to support a patterning apparatus (e.g., a mask) MA and connected to a first positioner PM configured to accurately position the patterning apparatus MA according to predetermined parameters; a substrate support (e.g., a substrate stage or substrate holder) WT configured to hold a substrate (e.g., a wafer coated with resist) W and connected to a second positioner PW configured to accurately position the substrate support according to predetermined parameters; and a projection system (e.g., a refractive and / or reflective projection lens system) PS configured to project a pattern imparted to the radiation beam B by the patterning apparatus MA onto a target portion C (e.g., comprising one or more dies) of the substrate W.

[0039] The components according to embodiments of the invention, which will be further described below, can be used in the first positioner PM and / or support MT. Alternatively, the components according to embodiments of the invention, which will be further described below, can be used in the second positioner PW and / or support WT.

[0040] In operation, the irradiation system IL receives a radiation beam from the radiation source SO, for example, via a beam delivery system BD. The irradiation system IL may include various types of optical components for guiding, shaping, and / or controlling the radiation, such as refractive, reflective, magnetic, electromagnetic, electrostatic, and / or other types of optical components, or any combination thereof. The irradiator IL can be used to adjust the radiation beam B so that the radiation beam has a desired spatial and / or angular intensity distribution in its cross-section at the plane of the pattern forming apparatus MA.

[0041] The term “projection system” PS as used herein should be broadly interpreted to encompass various types of projection systems suitable for the exposure radiation used and / or for other factors such as immersion in liquids or vacuum, including refractive, reflective, reflective-refractive, distorting, magnetic, electromagnetic, and / or electrostatic optical systems or any combination thereof. Any use of the term “projection lens” herein may be considered synonymous with the more general term “projection system” PS.

[0042] Photolithography equipment (LA) can fall into a category where at least a portion of the substrate can be covered by a liquid with a relatively high refractive index, such as water, to fill the space between the projection system (PS) and the substrate (W)—this is also known as immersion lithography. Further information on immersion techniques is given in U.S. Patent No. US6,952,253, which is incorporated herein by reference in its entirety.

[0043] In addition to the substrate support WT, the lithography apparatus LA may also include a common support disposed at the same level as the substrate support WT. In embodiments, the common support is arranged to hold sensors and / or cleaning devices. In embodiments, the common support is not configured to support the substrate W, i.e., it cannot hold the substrate W for exposure. Sensors may be arranged to measure the properties of the projection system PS or the properties of the radiation beam B. The common support may hold multiple sensors. Cleaning devices may be arranged to clean portions of the lithography apparatus, such as portions of the projection system PS or portions of the system providing immersion liquid. The common support may be movable below the projection system PS as the substrate support WT moves away from the projection system PS.

[0044] Therefore, a lithography apparatus LA can belong to the type having two or more substrate supports WT and having one or more substrate supports WT and one or more common supports. In such a "multi-platform" machine, supports can be used in parallel, and / or subsequent exposure preparation steps of the substrate can be performed on the substrate W located on one substrate support WT or using the common support, while the substrate W on the substrate support WT is being used to expose patterns on the substrate W.

[0045] Furthermore, in the case of two or more supports (e.g., two or more substrate supports or one or more substrate supports and one or more common supports), the components according to embodiments of the invention, which will be further described below, can be used in the second positioner PW and / or in one or more of the associated supports (e.g., support WT and / or common supports) at the second positioner PW.

[0046] In operation, a radiation beam B is incident on a pattern forming apparatus MA, such as a mask, held on a support MT, and patterned by a pattern (design layout) present on the pattern forming apparatus MA. Having traversed the pattern forming apparatus MA, the radiation beam B passes through a projection system PS, which focuses the beam onto a target portion C of the substrate W. With the aid of a second positioner PW and a position measurement system PMS, the substrate support WT can be accurately moved, for example, to position different target portions C in a focused and aligned position within the path of the radiation beam B. Similarly, a first positioner PM and possibly another position sensor (which is not in...) Figure 1 The pattern forming apparatus MA (as clearly depicted) can be used to accurately position itself relative to the path of the radiation beam B. The pattern forming apparatus alignment marks M1, M2 and substrate alignment marks P1, P2 can be used to align the pattern forming apparatus MA and the substrate W. Although the illustrated substrate alignment marks P1, P2 occupy dedicated target portions, they can be located in the space between the target portions. When the substrate alignment marks P1, P2 are located between the target portions C, these substrate alignment marks are referred to as scribing alignment marks.

[0047] To illustrate embodiments of the invention, a Cartesian coordinate system is used. A Cartesian coordinate system has three axes: the x-axis, the y-axis, and the z-axis. Each of the three axes is orthogonal to the other two. Rotation about the x-axis is called Rx rotation. Rotation about the y-axis is called Ry rotation. Rotation about the z-axis is called Rz rotation. The x-axis and y-axis define a horizontal plane, while the z-axis is in the vertical direction. The Cartesian coordinate system is not limiting of the invention and is only used for illustration. Alternatively, another coordinate system, such as a cylindrical coordinate system, can be used to illustrate embodiments of the invention. The orientation of the Cartesian coordinate system can be different, for example, such that the z-axis has a component along the horizontal plane.

[0048] Figure 2 Show Figure 1 A more detailed view of a portion of a lithography apparatus LA. The lithography apparatus LA may be provided with a base frame BF, a counterweight BM, a measurement frame MF, and a vibration isolation system IS. The measurement frame MF supports a projection system PS. Additionally, the measurement frame MF may support a portion of a position measurement system PMS. The measurement frame MF is supported by the base frame BF via the vibration isolation system IS. The vibration isolation system IS is arranged to prevent or reduce vibrations propagating from the base frame BF to the measurement frame MF. An embodiment of the counterweight BM will be located... Figure 1 The second locator PW shown is located between the base and the base.

[0049] At least a portion of the second positioner PW (e.g., if the second positioner PW has only one actuator, then this portion is the sole actuator of the second positioner PW; or if the second positioner PW has multiple actuators, then this portion is a specific actuator among the multiple actuators) is arranged to accelerate the substrate support WT by providing a driving force between the substrate support WT and the counterweight BM. The driving force accelerates the substrate support WT in a desired direction. Due to the conservation of momentum, the driving force is also applied to the counterweight BM of equal magnitude, but in the opposite direction to the desired direction. Typically, the mass of the counterweight BM is significantly greater than the mass of the moving portion of at least a portion of the second positioner PW and the substrate support WT. In an embodiment, the counterweight BM is movable (e.g., supported by bearings on the base frame BF or by one or more flexures on the base frame BF). In an embodiment, one or more drift motors may be present, which are configured to assist in the movement of the counterweight, for example, to help place the counterweight in the appropriate position.

[0050] In embodiments, at least a portion of the second positioner PW is supported by a balancing mass block BM. For example, in one embodiment, the balancing mass block BM supports the stator portion of an electric actuator, while the substrate support WT has the mover portion of the electric actuator. For example, a portion of the planar actuator system of the second positioner PW is used to suspend or accelerate the substrate support WT above and / or relative to the balancing mass block BM. In one embodiment, the second positioner PW is supported by a base frame BF, for example, wherein the second positioner PW includes the stator of the actuator and includes a bearing, such as a gas bearing, for suspending the substrate support WT above the base frame BF. According to an example, the second positioner PW may include a linear actuator system.

[0051] The position measurement system (PMS) can include any type of sensor adapted to determine the position of the substrate support WT. The PMS can also include any type of sensor adapted to determine the position of the support MT. The sensor can be an optical sensor, such as an interferometer or encoder. The PMS can include a combined system of interferometers and encoders. The sensor can be another type of sensor, such as a magnetic sensor, a capacitive sensor, or an inductive sensor. The PMS can determine the position relative to a reference (e.g., a measurement frame MF or a projection system PS). The PMS can determine the position of the support WT and / or the support MT by measuring the position or by measuring the time derivative of the position (such as velocity or acceleration).

[0052] A position measurement system (PMS) may include an encoder system. An encoder system is known, for example, from U.S. Patent Application No. US2007 / 0058173, which is incorporated herein by reference in its entirety. The encoder system includes an encoder head, a grating, and a sensor. The encoder system can receive a primary radiation beam and a secondary radiation beam. Both the primary and secondary radiation beams originate from the same radiation beam, i.e., the original radiation beam. The primary and / or secondary radiation beams are generated by diffracting the original radiation beam using a grating. If both the primary and secondary radiation beams are generated by diffracting the original radiation beam using a grating, the primary radiation beam needs to have a different diffraction order compared to the secondary radiation beam. Different diffraction orders are, for example, +1, -1, +2, and -2. The encoder system optically combines the primary and secondary radiation beams into a combined radiation beam. A sensor in the encoder head determines the phase or phase difference of the combined radiation beam. The sensor generates a signal based on the phase or phase difference. The signal indicates the position of the encoder head relative to the grating. One of the encoder head and the grating may be arranged on the substrate structure WT. The other of the encoder head and the grating may be arranged on the measurement frame MF or the base frame BF. For example, in one embodiment, multiple encoder heads are arranged on the measurement frame MF, while one or more gratings are arranged on the top surface of the substrate support WT. In another example, one or more gratings are arranged on the bottom surface of the substrate support WT, and the encoder head is arranged below the substrate support WT.

[0053] A position measurement system (PMS) may include an interferometer system. An interferometer system is known from, for example, U.S. Patent 6,020,964, which is incorporated herein by reference in its entirety. An interferometer system may include a beam splitter, a mirror, a reference mirror, and a sensor. A radiation beam is split into a reference beam and a measurement beam by the beam splitter. The measurement beam propagates to the mirror and is reflected back to the beam splitter. The reference beam propagates to the reference mirror and is reflected back to the beam splitter. At the beam splitter, the measurement beam and the reference beam are combined into a combined radiation beam. The combined radiation beam is incident on the sensor. The sensor determines the phase or frequency of the combined radiation beam. The sensor generates a signal based on the phase or the frequency. This signal represents the displacement of the mirror. In one embodiment, the mirror is connected to a substrate support WT. The reference mirror may be connected to a measurement frame MF. In another embodiment, the measurement beam and the reference beam are combined into a combined radiation beam using additional optical components instead of a beam splitter.

[0054] The first positioner PM may include a long-stroke module and a short-stroke module. The short-stroke module is arranged to move the pattern forming apparatus support MT relative to the long-stroke module with high accuracy over a small range of motion. The long-stroke module is arranged to move the short-stroke module relative to the projection system PS with relatively low accuracy over a large range of motion. Through the combination of the long-stroke module and the short-stroke module, the first positioner PM can move the pattern forming apparatus support MT relative to the projection system PS with high accuracy over a large range of motion. For example, the long-stroke module may move the support MT with µm accuracy, while the short-stroke module may move the support MT with nm accuracy.

[0055] Similarly, the second positioner PW may include a long-stroke module and a short-stroke module. The short-stroke module is arranged to move the substrate support WT with high accuracy relative to the long-stroke module over a small range of motion. The long-stroke module is arranged to move the short-stroke module with relatively low accuracy relative to the projection system PS over a large range of motion. Through the combination of the long-stroke and short-stroke modules, the second positioner PW is able to move the substrate support WT with high accuracy relative to the projection system PS over a large range of motion. For example, the long-stroke module may move the support WT with µm accuracy, while the short-stroke module may move the support WT with nm accuracy. In an embodiment, the long-stroke module of the second positioner PW interacts with the balancing mass block BM.

[0056] The first positioner PM and the second positioner PW are each provided with actuators for moving the pattern forming apparatus support MT and the substrate support WT, respectively. The actuators of the first positioner and / or the second positioner can be linear actuators for providing driving force along a single axis (e.g., the y-axis). Multiple linear actuators can be applied to provide driving force along multiple axes. The actuator can be a planar actuator for providing driving force along multiple axes. For example, a planar actuator can be arranged to move the support in 6 degrees of freedom. The actuator can be an electromagnetic actuator comprising at least one coil and at least one magnet. In an embodiment, the actuator is arranged to provide relative movement between at least one coil and at least one magnet by applying current to at least one coil. The actuator can be a moving magnet type actuator having at least one magnet coupled to the support (e.g., support WT or support MT). The actuator can be a moving coil type actuator having at least one coil coupled to the support (e.g., support WT or support MT). The actuator can be a voice coil actuator, a magnetoresistive actuator, a Lorentz actuator, a piezoelectric actuator, or any other suitable actuator.

[0057] It can provide such as Figure 3A position control system (PCS) is schematically depicted. In an embodiment, a lithography apparatus includes a position control system (PCS). In an embodiment, the position control system (PCS) includes a setpoint generator (SP), a feedforward controller (FF), and a feedback controller (FB). The position control system (PCS) provides a drive signal to an actuator (ACT). The actuator (ACT) may be an actuator of a first positioner (PM) or a second positioner (PW). The actuator (ACT) drives a device (P), which may include a substrate support (WT) or a patterning apparatus support (MT). The output of the device (P) is a position quantity, such as position, velocity, or acceleration. The position quantity is measured by a position measurement system (PMS). The position measurement system (PMS) generates a signal representing the position quantity of the device (P). The setpoint generator (SP) generates a signal representing a reference signal representing the desired position quantity of the device (P). For example, the reference signal represents the desired trajectory of the substrate support (WT). The difference between the reference signal and the position signal forms the input of the feedback controller (FB). Based on the input, the feedback controller (FB) provides at least a portion of the drive signal to the actuator (ACT). The reference signal may form the input of the feedforward controller (FF). Based on the input, the feedforward controller FF provides at least a portion of the drive signal to the actuator ACT. The feedforward FF may utilize information about one or more dynamic characteristics of the device P, such as mass, stiffness, resonant modes, and / or natural frequencies.

[0058] Figure 4 A side cross-section of an actuator system 1 according to an embodiment is schematically shown. The actuator system has a coil layer 3 with one or more coils 2 to form one or more electromagnets, and is arranged in a configuration of 6, 7, 8, and 9. Due to the flatness of the coil layer 3, this actuator system 1 is either a linear actuator system or a planar actuator system. The coil layer 3 is flat because one or more coils 2 are arranged in a plane. Figure 4 In the example shown, it is a planar actuator system. In the illustrated example, this planar actuator system 1 is used, for example, in a wafer platform of a photolithography apparatus. For this purpose, it is used with… Figures 1 to 3 The same reference numerals used in the figures are used to indicate the substrate W, the substrate support WT, and the second positioner PW. Alternatively, the positioning system 1 can be used as a planar or linear actuator system in the mask platform of the lithography apparatus, in which case the substrate W can be replaced by a patterning apparatus MA (e.g., a mask), the substrate support WT can be replaced by a patterning apparatus support MT, and the second positioner PW can be replaced by a first positioner PM.

[0059] Figure 5 Show Figure 4 Details, in Figure 4 According to the middle Figure 5 The detail is shown in the cross-section of arrow IV as indicated in the figure.

[0060] exist Figure 4 and Figure 5 In this embodiment, arrangements 6, 7, 8, and 9 are disposed in the stator portion of the planar actuator system 1. The mover portion of this planar actuator system (in this example, indicated as WT) has a layer (in this embodiment, a flat layer) of conductive coils 21 and 22 disposed on its underside, and the current in the layer can be manipulated by a controller to control the position of the mover portion WT relative to the stator portions PW, 8, 3, and 9.

[0061] Arrangements 6, 7, 8, and 9 are configured to cryogenically cool one or more of the superconducting coils 2 in coil layer 3 at or below 30 K, as in Figure 4 As indicated in the document. In the embodiment, arrangements 6, 7, 8, and 9 have features similar to a cryostat. Considering the availability of materials that are superconducting in the range of 70K to 150K, this temperature can also be higher than 30K.

[0062] exist Figure 4 and Figure 5 In one embodiment, coil layer 3 is a layer of one or more superconducting coils 2. In another embodiment, the coil layer is flat and has opposite layers 4 and 5. Figure 4 In the middle, layer 4 is the lower surface of coil layer 3, and layer 5 is the upper surface of coil layer 3.

[0063] The arrangement includes a cryogenic cooler system 6, a vacuum system 7, and two insulating covers 8 and 9. The coil layer 3 and the two insulating covers 8 and 9 are arranged in a sandwich manner, wherein the coil layer 3 is arranged between the two insulating covers 8 and 9, such that each of the two opposite layers 4 and 5 is covered by one of the insulating covers 8 and 9.

[0064] One or both of the insulating covers 8 and 9 may include an inner plate 10 and an outer plate 11 generally parallel to the inner plate 10. The inner plate 10 is closest to the coil layer 3 and is disposed between the outer plate 11 and the coil layer 3. One or both of the insulating covers 8 and 9 may also include an insulating system 12 disposed between the inner plate 10 and the outer plate 11.

[0065] The vacuum system is configured to provide low pressure / vacuum (layer) 13 in the insulation system.

[0066] The cryogenic cooler system is configured to cryogenically cool the inner side plate 10 and is connected to the inner side plate 10 of the insulating cover 9 at point 14 for this purpose. Since the inner side plate 10 of the insulating cover 8 is thermally connected to the inner side plate 10 of the insulating cover 9, the inner side plate 10 of the insulating cover will also be cryogenically cooled. This thermal connection can be provided, for example, via a magnet 2 or via a thermal bridge (not shown).

[0067] According to an embodiment, the insulation system 12 of one or both of the insulating covers 8 and 9 includes one or more layers of solids 101 in a low-pressure / vacuum (layer) 13, each solid defining, for example, a profile 102 (e.g., which is at least partially circular) and extending through a central portion of each solid 101 and perpendicular to the central axis of the profile 102. The central axis of the solid 101 of each layer extends parallel to the inner side plate 10 and the outer side plate 11.

[0068] exist Figure 4 In the embodiments described, entity 101 is a sphere, in this case a sphere, but these entities 101 can be hemispherical, elliptical, or cylindrical entities, such as fully cylindrical entities, elliptical entities, or semi-cylindrical entities. The term "fully" specifically refers to the outer contour of the entity, not the inner contour of the entity. To reduce weight and / or lower the thermal conductivity of the entity, the interior of a fully circular entity can be, for example, hollow, or a fully circular entity can have through holes.

[0069] In embodiments, insulating covers 8, 9 are configured to provide at least one layer 104, 105 with point contacts 106 between two layers of the body 101 or between one layer of the body 101 and the inner side plate 10 and / or the outer side plate 11. This configuration ensures that every possible thermal path between the inner side plate 10 and the outer side plate 11 must pass through at least one point contact 106 at some location. This allows the insulating covers to have minimal or low thermal conductivity, at one hand due to the layers of point contacts, and high load-bearing capacity, at the other hand due to the body. Figure 4 In the example, there are two layers 104 and 105 with point contact 106. One layer 105 is on the outer side plate 11 side, and one layer 104 is on the inner side plate 10 side.

[0070] exist Figure 4In one embodiment, entity 101 may be a zirconium (full) sphere with a diameter of 7 mm. These spheres are positioned between the inner plate 10 and the outer plate 11. In the linear actuator, the vertical distance D between the layer 3 of the electromagnet 2 and the conductive coils 21, 22 is limited. This means that the vertical thickness of the insulating cover 8 (in the direction of the double arrow D) will remain relatively low. Using an aluminum inner plate 10 and an aluminum outer plate 11 with thicknesses of 0.75 mm and spheres with a diameter of 7 mm, the total thickness of the insulating cover is approximately 9 mm. This thickness can be reduced by using thinner inner plates 10 and thinner outer plates 11 and / or by using entity 101 with a smaller cross-sectional width. In this regard, it will be noted that zirconium spheres with a diameter of 0.2 mm are available.

[0071] Furthermore, the insulating cover 9 can be designed to be very thin. However, considering that it is on the side of layer 3 of one or more superconducting coils 2, the real issue is usually not space, and the solid 101 in the insulating cover 9 can be larger than the solid 101 in the insulating cover 8. The solid in the insulating cover 9 can be, for example, in the range of 15 mm to 20 mm.

[0072] To help prevent movement of these entities, a spacer 107 can be provided. The spacer 107 may have a perforated pattern, each perforation having a cross-sectional width ranging from 70% to 100% of the cross-sectional width of the entity. By using a spacer with a coefficient of thermal expansion greater than that of the entity, a sealed shrinkage connection can be achieved between the entity 101 and the spacer 107 when the inner sideplate is cryogenically cooled. Furthermore, in this example, the spacer 107 can be held at a temperature of approximately 80 K by a cryogenic cooler. For this purpose, the cryogenic cooler 6 is connected at 108 to the spacer 107 of the insulating cover 9 (and / or 8, not shown). The spacer 107 also serves as a shield to improve the insulation capability of the insulating covers 8, 9. To cool the two spacers 107, the spacers 107 are thermally connected by a thermal connector 109.

[0073] like Figure 4 As shown by reference to the indicated temperatures, the substrate support WT can be at room temperature (295 K), the coils 21 and 22 can have temperatures above room temperature (>295 K) due to heat generation in the coils 21 and 22, and the frame 15 for supporting the actuator system 1 can also be at room temperature. Furthermore, a cryogenic cooler cryogenically cools the two inner plates 10 at a cryogenic temperature, which, according to this example, will be below 30 K. To improve insulation, the spacer plate 107 is cooled by the cryogenic cooler to have a temperature between the temperature of the inner plates (<30 K in this example) and the temperature of the outer plates (295 K in this example). The temperature of the spacer plate can be, for example, 80 K.

[0074] exist Figure 4 and Figure 5 In the example, the planar actuator system has: a stator portion having a layer of one or more superconducting coils 2; and a mover portion having a layer of normally conducting coils 21, 22 (which are typically at or above room temperature and generate heat during use), see [reference]. Figure 4 and Figure 5 It should be noted that, alternatively or in addition, according to the embodiments, the layers of coils 21 and / or 22 may be layers of one or more superconducting coils, having insulating coverings 8, 9 on both sides or one side of the layer, and having a solid in a low-voltage / vacuum layer. In such a case, coil layer 3 may be a coil layer of one or more permanent magnets, one or more normal electromagnets, or one or more superconducting electromagnets.

[0075] As in Figure 6 and Figure 7 As shown in the very schematic cross-section, the insulating cover 8 and / or insulating cover 9 may also comprise multiple layers of solid separated by an intermediate plate.

[0076] Figure 6 Two layers 200 and 210 are shown for entities 201 and 211, respectively. Entity 201 in layer 200 can be held in place by spacer 207, and entity 211 in layer 210 can be held in place by spacer 217. The two layers 200 and 210 for entities 201 and 211 can be separated by an intermediate layer 240. This configuration provides a total of four layers 204, 205, 214, and 215 for point contacts 206 and 216. By using entities with a smaller cross-sectional width (e.g., diameter), Figure 6 The thickness of the insulation covering can still be maintained at or below 9 mm, as relative to Figure 4 As mentioned.

[0077] Figure 7The four layers 300, 310, 320, and 330 of entities 301, 311, 321, and 331 are shown respectively. Entity 301 in layer 300 can be held in place by spacer 307, entity 311 in layer 310 can be held in place by spacer 317, entity 321 in layer 320 can be held in place by spacer 327, and entity 331 in layer 330 can be held in place by spacer 337. The two layers 300 and 310 of entities 301 and 311 can be separated by intermediate layer 340, the two layers 310 and 320 of entities 311 and 321 can be separated by intermediate layer 350, and the two layers 320 and 330 of entities 321 and 331 can be separated by intermediate layer 360. This configuration provides a total of eight layers of 304, 305, 314, 315, 324, 325, 334, and 335 with point contacts of 206, 216, 226, and 236. This is achieved by using spheres with a smaller cross-sectional width (e.g., diameter). Figure 7 The thickness of the insulation covering can still be maintained at or below 9 mm, as relative to Figure 4 As mentioned.

[0078] As in Figure 8 As shown in the very schematic perspective view, an insulation system 400 providing at least one point contact layer can also be obtained through intersecting layers of straight (e.g., cylindrical) entities 401, 411 (like lines with corresponding circular outer contours 402, 412). At the intersection of entities 401 and 411, point contacts 406 will be present, as shown in the diagram. Figure 8 As schematically indicated at the four intersections. Figure 8 In the construction, the solids 401, 402 of each layer are straight, and the cross-over stacking of the layers helps to ensure that every possible heat conduction path between the inner and outer side plates must pass through at least one point contact at some point.

[0079] Therefore, in this embodiment, a cryogenic environment is provided for a coil layer comprising two insulating covers. The coil layer and the two insulating covers are arranged in a sandwich manner, wherein the coil layer is arranged between the two insulating covers and each of two opposite layers of the coil layer covered by one of the insulating covers, so as to enable the coil layer to be maintained at the low temperature required for the superconductivity of one or more coils.

[0080] In an embodiment, each insulating cover includes: an inner side plate and an outer side plate parallel to the inner side plate, the inner side plate being disposed between the outer side plate and the coil layer; and an insulation system disposed between the inner side plate and the outer side plate. The inner side plate and / or the outer side plate may be made of a stainless steel alloy.

[0081] In one embodiment, the insulation system is configured to have a vacuum layer. The vacuum layer in the insulation system reduces the thermal conductivity between the inner and outer side plates. This vacuum can be 10... -3 A vacuum of Pa or lower. If the insulation covering is in a normal atmospheric pressure environment, this means that the insulation covering must be able to withstand a pressure difference of approximately 100 kPa.

[0082] In one embodiment, the inner side plate is configured to be cooled at a low temperature to keep the coil layer at a low temperature and maintain the coil layer at a low temperature.

[0083] In the embodiments, the insulation system of one or both of the insulating covers:

[0084] - The vacuum layer comprises one or more solid layers, each solid defining a contour and extending through a central portion of the contour and perpendicular to the central axis of the contour, the central axis of the solid in each circular solid layer extending parallel to the inner and outer side plates, and

[0085] - At least one layer is configured to provide point contact between two layers of a solid or between one layer of a solid and an inner and / or outer plate, such that every possible heat conduction path between the inner and outer plates must pass through at least one point contact at some location.

[0086] In an embodiment, layers of the solid are arranged between the inner and outer side plates, supporting the inner side plate on the outer side plate when the inner side plate is above the outer side plate, or supporting the outer side plate on the inner side plate when the outer side plate is above the inner side plate. On the one hand, the solid can have high load-bearing capacity, and on the other hand, it provides point contacts. Because point contacts have very small contact surfaces, the thermal conductivity through them is very low. With one or more layers of the solid having their central axes parallel to the inner and outer side plates and at least one layer configured to provide point contacts, it helps ensure that every possible heat conduction path between the inner and outer side plates must pass through at least one point contact at some point. On the one hand, this enables the insulating covering to have minimal thermal conductivity, and on the other hand, high load-bearing capacity.

[0087] In embodiments, the entity may be fully circular or partially circular, having a partially circular profile extending at an angle of 180° or less (e.g., 60° to 120°). The entity may be a spherical entity, such as a sphere and / or a hemisphere, and / or a straight cylindrical entity, such as a cylinder and / or a semi-cylinder. For example, in the case of a hemisphere or semi-cylinder, the hemisphere or semi-cylinder may be glued to the inner side panel facing the outer side panel and / or glued to the outer side panel facing the inner side panel, and overlap each other, creating layers with point contacts between hemispheres, between semi-cylinders, or between hemispheres and semi-cylinders.

[0088] The diameter of the solid is defined as twice the radius of the circular profile from its center. According to embodiments, the diameter of the solid can be less than 7 mm, such as less than 5 mm. The diameter can range from 0.1 mm to 5 mm, such as from 0.5 mm to 4 mm. A solid with this diameter makes it possible to have an insulating cover with a thickness of less than 10 mm (perpendicular to the inner and outer plates). It is even possible to achieve multiple layers with much lower thickness and / or smaller diameter point contacts, while still keeping the total thickness of the insulating cover below 10 mm. For example, this thickness can be at most 7 mm to 8 mm.

[0089] According to an embodiment, point contacts in a layer of point contacts may be arranged with a pitch of 5 mm to 20 mm, such as a pitch of 10 mm to 15 mm.

[0090] According to embodiments, the entity can be made of materials selected from: zirconium oxide, Kevlar, Kevlar composites, Kevlar fiber composites, glass, glass composites, glass fiber composites, or titanium alloys. These materials are commercially available in the form of wires and spheres, and have high strength and low thermal conductivity.

[0091] According to an embodiment, the entity may be made of a material whose Young's modulus is at least 1 N / Wm, such as at least 1.5 N / Wm, as the integral of its thermal conductivity over a temperature range of 4K to 80K.

[0092] According to an embodiment, at least one of the layers of the entity may include a spacer plate patterned with perforations for receiving the entity, each perforation having a cross-sectional width configured to contact the entity such that the spacer plate is supported by the entity, wherein the spacer plate is arranged parallel to the inner and outer side plates. Viewed perpendicularly to the spacer plate, the spacer plate is arranged at a distance from each of the opposite ends of the entity. The spacer plate prevents the entity from moving by holding the entity at the location defined by the perforations. In this embodiment, the spacer plate may be configured to be cooled at a temperature between the temperature of the inner side plate and the temperature of the outer side plate, such as by cryogenic cooling. The spacer plate then further serves as an insulating shield to increase thermal insulation. The width of the perforations may be, for example, in the range of 70% to 100% of the width (e.g., diameter) of the entity, such as in the range of 90% to 100% of the width (e.g., diameter) of the entity. In an embodiment, the coefficient of thermal expansion of the spacer plate may be greater than that of the entity, such that a contractile connection between the spacer plate and the entity is obtained in the perforations when the spacer plate and the entity are cooled. This shrink-fit connection provides a seal relative to a solid closed perforation, which improves the insulation capability of the insulation system. For this purpose, the spacer can be made of aluminum or an aluminum alloy.

[0093] According to an embodiment, the component may include multiple solid layers, wherein partitions are arranged between adjacent layers in the solid layers, providing an additional point contact layer between the partitions and the solids on each side. In this embodiment, the partitions may be arranged to be cooled at a temperature between the temperature of the inner plate and the temperature of the outer plate, such as cryogenic cooling.

[0094] According to an embodiment, one or more solid layers may include at least one set of two solid (e.g., cylindrical and / or semi-cylindrical) layers; wherein the solids of a first layer of the two layers are configured to be parallel to each other with a gap between adjacent solids, and the solids of a second layer of the two layers are configured to be parallel to each other with a gap between adjacent solids; and wherein the first and second layers directly overlap each other, wherein the solids of the first layer intersect with respect to the solids of the second layer to provide a point contact layer between the solids of the first layer and the solids of the second layer. In this embodiment, the solids may be lines. The intersection may be at an angle of 90° or any other angle, such as an angle in the range of 30° to 90°, for example, an angle of about 60°.

[0095] According to an embodiment, a cryogenic cooler system configured to provide cryogenic cooling for, for example, an inner side panel can be provided.

[0096] According to embodiments, a system configured to provide 10 Pa or less, 1 Pa or less, or 10 Pa can be provided. -2 Pa or lower or 10 -3 Low-pressure / vacuum systems with pressures of Pa or lower.

[0097] According to one aspect, a photolithography apparatus including the components described herein is provided. Such a photolithography apparatus may include: a patterning apparatus support configured to support a patterning apparatus; a first positioner configured to position the patterning apparatus support relative to the first positioner; a substrate support configured to hold a substrate; a second positioner configured to position the substrate support relative to the second positioner; and a projection system configured to project a radiation beam from the patterning apparatus onto the substrate, wherein one or more selected from the patterning apparatus support, the first positioner, the substrate support, and / or the second positioner are provided with the components described herein.

[0098] According to one aspect, an assembly for a photolithography apparatus is provided, the assembly comprising: a thermal regulating plate including an internal network of pathways for allowing a coolant to flow therein; and a plurality of superconducting coils for magnetically suspending and linearly displacing a platform thereon, wherein the plurality of superconducting coils are in thermal contact with an outer surface of the thermal regulating plate.

[0099] U.S. Patent Application Publication No. 2021 / 0223706, incorporated herein by reference in its entirety, discloses a cryogenic cooling arrangement with one or more superconducting coils suitable for, for example, photolithography. For example, it describes a cryogenic cooler directly attached to a first platform of a spacer at, for example, 80 K, and a cryogenic cooler attached to a second platform of an inner plate at, for example, < 30 K, on ​​which one or more superconducting coils are mounted. In such a design, the cryogenic cooler acts as a heat sink for the component at both temperature levels. The cold end of the cryogenic cooler has a point connection to the cold surfaces, i.e., the spacer and the inner plate.

[0100] In such an arrangement, the cooling capacity of the cryocooler may be limited by the number of point connections generated on the cold surface and the thermal conductivity between these connections and the heat generated / absorbed. Due to the heat generated near one or more superconducting coils on the top of the inner plate, and considering that the average size of the inner plate may be greater than one meter, the temperature distribution of one or more superconducting coils may still vary significantly even if the cryocooler is centrally positioned. If the temperature variation is large enough, it may impair the positioner's performance. In particular, variations in space temperature may cause unwanted changes in the electromagnetic properties of one or more superconducting coils.

[0101] To compensate for temperature variations, a more powerful cryogenic cooler could be used to keep the warmest coil at the target temperature, but this could lead to a significant increase in the required cooling power. Alternatively, the number of connections between the cryogenic cooler and the cold surface could be increased, for example, by providing multiple cryogenic coolers. However, increasing the number of connections can lead to mechanical obstacles because the positioner may experience sharp accelerations during operation, and one or more cryogenic cooler components move with the positioner. For example, the accelerating force could be detrimental to the mechanical connection between a long and slender cryogenic cooler and a relatively rigid positioner. Another potential obstacle associated with an increased number of connections is insufficient space.

[0102] Figure 9An actuator system 1 according to an embodiment is depicted. The actuator system 1 includes a thermal adjustment plate 25 and one or more superconducting coils 2 (e.g., preferably multiple superconducting coils). One or more superconducting coils 2 are used to magnetically levitate and linearly displace a platform 29 thereon. The actuator system 1 and platform 29 can be any positioner and support, such as within a lithography apparatus. For example, platform 29 can be a patterning apparatus support MT for a patterning apparatus MA, and actuator system 1 can be part of a first positioner PM. Alternatively or additionally, platform 29 can be a substrate support WT, and actuator system 1 can be a second positioner PW. Platform 29 may include a long-stroke component that supports the short-stroke actuator described herein. Platform 29 has one or more coils or one or more magnets that interact with one or more superconducting coils 2 when appropriate.

[0103] like Figure 10 As shown, the heat regulation plate 25 may include an internal passage network 26 for allowing refrigerant to flow therethrough. Therefore, the heat regulation plate 25 can be thermally regulated, for example, cooled, by the refrigerant flowing within the internal passage network 26. As shown, one or more superconducting coils 2 are in thermal contact with the outer surface 27 of the heat regulation plate 25. More specifically, one or more superconducting coils 2 may be disposed on the outer surface 27 of the heat regulation plate 25. One or more superconducting coils 2 may be disposed directly on the outer surface 27. One or more superconducting coils 2 may be in thermal contact with the outer surface 27 of the heat regulation plate 25 without direct contact with the refrigerant (e.g., not immersed in the refrigerant). Alternatively, one or more superconducting coils 2 may be embedded in the heat regulation plate 25 and may be in direct contact with the refrigerant (e.g., immersed in the refrigerant).

[0104] In addition, such as Figure 10 As shown, the internal pathway network 26 may extend substantially together with one or more superconducting coils 2. That is, the internal pathway network 26 may have a lateral extent similar to or substantially the same as that of one or more superconducting coils 2. This can help improve the uniformity of thermal regulation (e.g., providing cooling to one or more superconducting coils 2).

[0105] Because the refrigerant flows within the internal network of channels 26 of the thermal conditioning plate 25, one or more superconducting coils 2 can be thermally regulated, for example, cooled more uniformly than cooling is provided at a limited number of connection points in a cryogenic cooler. In other words, the temperature distribution of one or more superconducting coils 2 can become more uniform. This, in turn, can lead to more uniform performance of one or more superconducting coils 2.

[0106] Furthermore, since cooling is provided via an internal network of channels 26 rather than multiple connection points of multiple cryogenic coolers, the actuator system 1 can be more compact, which is desirable because the space around the actuator system 1 may be limited. Specifically, the total mass of the moving parts of the actuator system 1 can be reduced. This can reduce the amount of vibration generated during operation.

[0107] Furthermore, since the refrigerant flows within the thermal regulating plate 25, the refrigerant within the thermal regulating plate 25 at a given time can provide a buffer against quench events. A quench event refers to the change of an electromagnet from a superconducting to a non-superconducting state, resulting in an increase in resistance. The increase in resistance may initially be small, as the electromagnet may only be slightly non-superconducting. However, the increase in resistance can then generate a certain amount of heat (through Joule heating) as electricity continues to flow through one or more coils. In the absence of sufficient heat sinks or heat transfer paths, this leads to a further increase in temperature in one or more electromagnet coils, and a corresponding increase in resistance in a self-reinforcing, runaway manner. In particular, quenching can typically be initiated at a localized point in a previously superconducting electromagnet and can propagate as a heat wave to adjacent parts of the electromagnet, thereby rendering other parts of the electromagnet non-superconducting. Therefore, a chain reaction may then occur, potentially causing a complete loss of superconductivity in the entire electromagnet. For example, all superconducting coils may be connected in series, and therefore, in the event of a quench, all superconducting coils may cease to function. The quenching event is therefore undesirable and may cause irreversible weakening of the material of the heat regulation plate 25.

[0108] The likelihood of a quench event can be reduced by adding a heat sink. For example, passive cooling can be provided. For example, passive cooling can be provided by bringing one or more superconducting coils 2 into thermal contact with a thermal mass block (such as a thermally conductive plate, e.g., copper or aluminum). For example, the material of the thermal regulating plate 25 can provide some passive cooling capacity.

[0109] However, active heat absorption capability is desirable. As mentioned above, the refrigerant within the thermal regulating plate 25 at a given time can provide additional heat absorption capability. Specifically, since the material of the thermal regulating plate 25 can have a reduced heat capacity at low temperatures, the presence of refrigerant within the thermal regulating plate 25 can provide additional heat absorption capability for the thermal regulating plate 25, for example, in the event of an unplanned shutdown. More specifically, the refrigerant can be capable of maintaining the thermal regulating plate 25 at a low temperature while absorbing a large amount of heat, particularly latent heat of fusion and / or latent heat of vaporization, from one or more superconducting coils 2. Other active techniques such as dump resistors and quench-back heaters can also be employed.

[0110] The advantage associated with the flow of refrigerant within the internal circulation network 26 is that it reduces sloshing. That is, if in Figure 10 The internal passage network 26 shown is replaced by a single plenum containing refrigerant. During operation of the lithography apparatus, the refrigerant could slosh around within the plenum, potentially causing significant mechanical vibrations. More specifically, when a closed volume containing fluid (e.g., a single plenum) undergoes acceleration, the fluid itself also accelerates. This non-flow-induced acceleration (i.e., sloshing) acts as an acoustic disturbance and generates pressure waves within the closed volume. These pressure waves can then travel (at the speed of sound) through the fluid lines and may introduce dynamic pressures that lead to dynamic deformation (i.e., vibration). In contrast, by employing the internal passage network 26, any movement of the refrigerant is confined within the passages of the internal passage network 26, which in turn limits mechanical vibrations.

[0111] The heat regulating plate 25 can be constructed in different ways. For example, the heat regulating plate 25 may include a thermally conductive material. Examples of thermally conductive materials include aluminum, copper, aluminum alloys, and / or copper alloys. The heat regulating plate 25 may include a high-rigidity material, such as stainless steel. High rigidity is desirable because it allows the heat regulating plate 25 to withstand sharp acceleration forces during operation. High rigidity can be achieved by selecting materials and / or designing the construction. Depending on the manufacturing method, the heat regulating plate 25 may be constructed from a single material or from several materials. In particular, the heat regulating plate 25 may be constructed from several materials with different thermal conductivity.

[0112] For example, the heat regulating plate 25 can be formed by casting, in which case the internal passage network 26 can be formed directly during the casting process. Alternatively, the heat regulating plate 25 can initially be manufactured as two plates, wherein open channels are machined into one or both plates, and then the plates can be joined together using, for example, vacuum brazing or other suitable methods to close the channels forming the internal passage network 26. Alternatively, the heat regulating plate 25 can be formed by fitting forged pipes of the desired shape into corresponding machined channels on the surface of the heat regulating plate 25. The forged pipes can be tightly fitted into the heat regulating plate 25, allowing for good thermal contact between the forged pipes and the material of the heat regulating plate 25. As another alternative, the heat regulating plate 25 can be formed by drilling parallel holes through a solid plate and sealing the surface holes with plugs. As yet another alternative, the heat regulating plate 25 can be formed by forging pipes into the desired shape of the internal passage network 26 and casting the heat regulating plate 25 around the forged pipes. Specifically, in this manufacturing method, the pipe can be made of stainless steel, or it can be cast from aluminum (or an aluminum alloy) with a low melting point to form the heat regulating plate 25. It should be understood that these manufacturing methods are merely non-limiting examples; other suitable manufacturing methods can be used to form the heat regulating plate 25.

[0113] The internal pathway network 26 can have different geometries or morphologies. Typically, the internal pathway network 26 may include one or more elongated pathways covering a range within the heat-regulating plate 25. Figure 12A and Figure 12B Two non-limiting examples of the internal pathway network 26 are shown. For example... Figure 12A As shown, the internal pathway network 26 can have a serpentine shape. In one example, the internal pathway network 26 can be a single continuous pathway without branches. Alternatively, the internal pathway network 26 can have branches. For example, Figure 12B An internal channel network 26 comprising a series of parallel-connected channels is shown. In such an arrangement, a flow limiter 223 can be positioned at or near the inlet of each individual parallel channel, allowing the internal channel network 26 to be calibrated to provide a uniform refrigerant flow through the parallel channels. Furthermore, in Figure 12B In this arrangement, the refrigerant supply line 61 and the refrigerant return line 62 can be located at opposite ends of the series of parallel passages, which can help balance the flow in the parallel passages.

[0114] The internal pathway network 26 can be formed into any other suitable geometry. For example, the internal pathway network 26 can have a maze-like geometry. The elongated shape of the internal pathway network 26 can help reduce swaying. Furthermore, the presence of bends in the internal pathway network 26 can also help reduce swaying. Specifically, swaying can be reduced by decreasing the number and / or length of straight pathways.

[0115] It should be understood that Figure 12A snake shape and Figure 12B The parallel pathway arrangements can be combined within a single internal pathway network 26. It should also be understood that the internal pathway network 26 may include a number of sub-segments, each of which may have the same or different geometries, and the sub-segments may be interconnected or isolated from each other. Furthermore, different sub-segments may be arranged laterally within the heat-regulating plate 25, and / or may overlap in the thickness direction of the heat-regulating plate 25.

[0116] Different refrigerants can be used for thermal conditioning, such as cooling thermal conditioning plates 25. Table 1 below lists examples of suitable refrigerants and some of their related thermodynamic properties. The range between their triple point and critical point identifies their potential use in flow boiling applications. "Flow boiling" refers to evaporative cooling, where a continuous flow of coolant evaporates as it flows over / passes a heat source. In contrast, "pool boiling" refers to evaporative cooling, where a non-flowing pool of coolant evaporates as it absorbs heat. Generally, flow boiling is a more efficient cooling mechanism (in terms of watts per unit volume of coolant). In particular, helium is suitable for multiphase flow heat transfer applications down to 1.9 K (although below the λ point in the case of superfluids). Alternatively, secondary hydrogen can be used for multiphase flow cooling applications with a target temperature of 20 K. For another example, liquid neon or hydrogen can be used for an operating temperature of 25 K. For 60 K, coolants such as fluorine or oxygen can be used. Typically, a coolant can be selected that lowers the operating temperature to above the coolant's triple point (so that the coolant does not solidify) and below the coolant's critical temperature (so that the coolant does not evaporate).

[0117]

[0118] Table 1

[0119] By way of a non-limiting example, in a heat-regulating plate 25 constructed of aluminum, 1.2 m to 2.4 m wide and 40 mm thick, with an internal circulation network 26 having passages of 20 mm diameter, a moderate heat transfer coefficient (e.g., 20 W / m² at 20 K) is assumed. -2 K -1According to the embodiments described herein, the temperature change on the outer surface 21 can be less than 0.02 K. At 20 K, liquid hydrogen is at its boiling point at 0.934 bar. At such pressure and temperature, liquid hydrogen has a latent heat of 445 kJ / kg and approximately 71.1 kg / m³. 3 The density is given. Assuming a flow velocity of 0.1 m / s and a pipe diameter of 20 mm, the mass flow rate can be calculated as 2.2 g / s. Assuming complete evaporation of the liquid refrigerant, the cooling capacity due to the phase change at 20 K is estimated to be 1 kW, which is significantly greater than the cooling capacity achievable by a known arrangement of a cryogenic cooler in thermal contact with a heat-regulating plate at a point connection. Furthermore, in this example, the refrigerant can provide excess cooling capacity, which can be used as a margin against quench events or power interruptions. For example, assuming a normal heat load of 100 W at 20 K, only about 10% of the cryogenic fluid will evaporate during normal operation, and the remaining 900 W can be used as a safety margin for potential quench events. It should be understood that different dimensions, refrigerant selections, operating temperatures, flow rates, and / or flow velocities may be used depending on the specific implementation.

[0120] As mentioned above, the internal pathway network 26 may include multiple segments. For example, as Figure 10 As shown, the internal pathway network 26 may include a first pathway segment 221 and a second pathway segment 222. As illustrated, the first pathway segment 221 may be located relatively close to one or more superconducting coils 2, and the second pathway 222 may be located relatively far from one or more superconducting coils 2. Furthermore, the second pathway segment 222 may be downstream of the first pathway segment 221. That is, the refrigerant may first flow through the first pathway segment 221 and then through the second pathway segment 222. The refrigerant at the specified temperature may absorb heat from the superconducting coils 2 as it flows through the first pathway segment 221 and then through the second pathway segment 222. Because the first pathway segment 221 may be located closer to the multiple superconducting coils 2, heat from the superconducting coils 2 can be effectively transferred to the refrigerant in the first pathway segment 221, which may be at a lower temperature than the refrigerant in the second pathway 222.

[0121] To achieve and maintain a low temperature for the thermal conditioning plate 25 without using excessive cooling power, it may be advantageous to thermally insulate the thermal conditioning plate 25 and one or more superconducting coils 2 from the external environment. For example, as Figure 9 As shown, the actuator system 1 may further include a vacuum / low-pressure container 28. The container 28 may define a chamber 41 in which a thermal regulating plate 25 and one or more superconducting coils 2 are positioned, and the container 28 may enclose the thermal regulating plate 25 and one or more superconducting coils 2.

[0122] Low pressures (e.g., pressures at or below 20 Pa, 10 Pa, 5 Pa, 1 Pa, 0.1 Pa, 0.01 Pa, 0.001 Pa, or 0.0001 Pa) can be applied to the space within container 28. For this purpose, a pump (not shown) can be connected to the volume of space within container 28. The pump can also help prevent solids from accumulating on cold surfaces. Specifically, when the surface reaches a low temperature (e.g., less than 44 K), any molecules in contact with the cold surface (other than, for example, helium, neon, or hydrogen) will solidify and will no longer exist as free gases. This, in turn, can reduce the pressure within container 28 even without the aid of a pump. However, allowing solidified condensate to accumulate may not be desirable, as this could reduce thermal performance and / or (e.g., create electrical short circuits between the heat exchanger 25 and container 28). To avoid solid accumulation, a pump can be used to evacuate molecules from container 28 before cooling.

[0123] Furthermore, since the molecules present in container 28 will promote convective heat transfer, their presence may prolong the time required to cool the heat regulating plate 25 to the target temperature. Therefore, by evacuating container 28 before cooling, the time and energy required to cool the heat regulating plate 25 can be reduced.

[0124] Although vacuum is an effective form of thermal insulation, other methods of thermal ventilation can be used as alternatives.

[0125] Actuator system 1 may alternatively or additionally include a heat shield 30 for improving thermal insulation. For example... Figure 9 As shown, the heat shield 30 can form a chamber 31 in which a heat regulating plate 25 and one or more superconducting coils 2 are positioned, and the heat shield 30 can enclose the heat regulating plate 25 and one or more superconducting coils 2. In the presence of a container 28, the heat shield 30 can also be enclosed within the container 28.

[0126] With this arrangement, by means of a non-limiting example, the thermal regulating plate 25 and one or more superconducting coils 2 can be maintained at approximately 44 K or less, preferably 10 K to 35 K, preferably 20 K or less. The thermal shield 30 can be maintained at approximately 50 K to 90 K. The container 28 can be maintained at room temperature, i.e., approximately 295 K. It should be understood that the low pressure applied within the container 28 does not need to be a complete vacuum. For example, the pressure within the container 28 can be maintained at approximately 10 Pa or less.

[0127] To further improve the thermal insulation of the thermal regulating plate 25, the thermal shield 30 may also include an internal network of channels 32 for the flow of refrigerant therein. This can further reduce the temperature within the thermal shield 30, which can help ensure that the thermal regulating plate 25 and one or more superconducting coils 2 can be maintained at the desired low temperature. To further improve thermal insulation, additional thermal shields similar to the thermal shield 30 may be provided depending on space availability.

[0128] like Figure 9 As shown, container 28 may include a penetration 43 through which refrigerant is supplied to the internal passage network 26 of the heat regulating plate 25. For example, as Figure 9 As shown, the refrigerant supply line 61 can be configured to pass through the penetration 43 and connect to the internal passage network 26 of the heat shield 25. In the presence of the heat shield 30, the heat shield can be provided with the penetration 33 to allow the refrigerant supply line 61 to pass through it to reach the heat shield 25. Similarly, refrigerant for the internal passage network 32 of the heat shield 30 can be supplied through the penetration 43 of the container 28. More generally, any desired number of refrigerant supplies can be provided through the penetration 43 of the container 28 (and optionally, the penetration 33 of the heat shield 30). This arrangement reduces the required number of penetrations compared to having multiple cryogenic coolers in contact with the heat shield at multiple point connections (which requires a corresponding number of penetrations).

[0129] In addition, such as Figure 9As shown, actuator system 1 may include a flexible conduit 66 configured to pass through a penetration 43 of vacuum container 28. Refrigerant can be supplied through this flexible conduit 66 to the internal pathway network 26 of thermal regulating plate 25 and / or the internal pathway network 32 of thermal mask 30. The flexibility of the flexible conduit 66 can facilitate the movement of thermal regulating plate 25, thermal mask 30, and / or container 28 during operation. Thermal regulating plate 25 may move up to 10 mm to 100 mm, for example, 50 mm. This movement may be caused by the movement of container 28 during the movement operation of actuator system 1, such as during scanning operation of a lithography apparatus. Alternatively or additionally, the movement of thermal regulating plate 25 may be attributed to thermal shrinkage. Furthermore, to accommodate these movements, one or more of the thermal regulating plate 25, thermal mask 30, and / or container 28 may be mechanically suspended rather than rigidly fixed. For example, one or more flexible mechanical supports (not shown) may mechanically connect thermal regulating plate 25 and container 28. These one or more mechanical supports can be provided through through-holes in the thermal mask 30. Similarly, the container 28 can also be attached to a device (e.g., a lithography device) using one or more flexible mechanical supports. Typically, it may be desirable for these one or more mechanical supports to have low thermal conductivity in order to reduce the amount of heat reaching the thermal conditioning plate 25 from the external environment. For example, one or more mechanical supports may comprise a material with low thermal conductivity. One or more mechanical supports may have a small cross-sectional area.

[0130] In its simplest case, the refrigerant supplied to the internal passage network 26 could be discharged into the environment after it has passed through the internal passage network 26. However, since this could be wasteful, the refrigerant supplied to the internal passage network 26 could be recycled. For example, as... Figure 9 As shown, in addition to the refrigerant supply line 61 through which the refrigerant flows toward the internal passage network 26, the actuator system 1 may also include a refrigerant return line 62 through which the refrigerant flows away from the internal passage network 26. Figure 9 As shown, both the refrigerant supply line 61 and the refrigerant return line 62 can be housed within the flexible conduit 66. That is, both the refrigerant supply line 61 and the refrigerant return line 62 can be configured to pass through the same penetration 43 of the container 28. Compared to configuring the refrigerant supply line 61 and the refrigerant return line 62 through separate flexible conduits and separate penetrations, configuring the refrigerant supply line 61 and the refrigerant return line 62 through the same flexible conduit 66 or the same penetration 43 reduces the number of flexible conduits and penetrations required. This, in turn, reduces the amount of heat reaching the thermal regulating plate 25 from the external environment.

[0131] To supply power to one or more superconducting coils 2, one or more power supplies can be used to power leads 63. For example... Figure 9 As shown, one or more power supply leads 63 may be disposed within a flexible conduit 66. Specifically, one or more power supply leads 63 may be disposed within the same flexible conduit 66 as the refrigerant supply line 61. Typically, one or more power supply leads 63 may be required to carry a large current, for example, 1 kA to 5 kA, or at least 2 kA. Given the large current carried by one or more power supply leads 63, cooling one or more power supply leads can be beneficial in order to reduce resistive losses. For this purpose, one or more power supply leads 63 may be surrounded by a refrigerant. In particular, one or more power supply leads 63 may be surrounded by the same refrigerant as the refrigerant supplied to the internal passage network 26 of the thermal regulating plate 25. One or more power supply leads 63 may be superconducting. Another advantage of using one or more superconducting power supply leads 63 is that the cross-sectional width (e.g., diameter) of one or more power supply leads 63 can be reduced without increasing resistive losses.

[0132] More specifically, such as Figure 9 As shown, one or more power supply leads 63 may be provided within the refrigerant supply line 61 and / or the refrigerant return line 62. Advantageously, as Figure 11 As shown, each of the refrigerant supply line 61 and the refrigerant return line 62 may have one of the power supply leads 63 disposed therein. More specifically, as Figure 11 As shown, one power lead 63 may be surrounded by refrigerant 610 in the refrigerant supply line 61, and another power lead 63 may be surrounded by refrigerant 620 in the refrigerant return line 62. By providing one power supply lead 63 in each of the refrigerant supply line 61 and the refrigerant return line 62, instead of providing two (or more) power supply leads 63 in a single refrigerant supply line 61 or refrigerant return line 62, the refrigerant supply line 61 and / or the refrigerant return line 62 can have a relatively small cross-sectional width (e.g., diameter), which can result in greater flexibility in the refrigerant supply line 61 and / or the refrigerant return line 62. Greater flexibility allows the refrigerant supply line 61 and the refrigerant return line 62 to more preferably accommodate the movement of the thermal adjustment plate 25 and / or the thermal shield 30 and / or the container 28. Furthermore, by combining the power supply, refrigerant supply, and low-pressure / vacuum supply in the same flexible conduit 6, tightness can be improved.

[0133] Because the flexible conduit 66 can have a predetermined length necessary to accommodate the movement of the heat regulation plate 25, the heat shield 30, and / or the container 28, the refrigerant can absorb heat from the external environment as it flows within the flexible conduit 66. To reduce the amount of heat reaching the refrigerant from the external environment into the flexible conduit 66, a low pressure / vacuum can be applied to the space 60 between the refrigerant supply line 61 and the refrigerant return line 62 and the flexible conduit 66. In one arrangement, such as Figure 9 As shown, this gap space 60 (i.e., the space between the refrigerant supply line 61 and the refrigerant return line 62 and the flexible conduit 66) can be fluidly connected to the internal volume of the container 28. With this arrangement, a common low-pressure / vacuum source (such as a pump) can be used to apply low pressure / vacuum to the internal volume of the container 28 and the gap space 60 of the flexible conduit 66. Alternatively, the gap space 60 of the flexible conduit 66 and the internal volume of the container 28 can be non-fluidly connected and can be subjected to low pressure / vacuum separately.

[0134] To reuse the refrigerant, the actuator system 1 may include a refrigerant recirculation unit 70, such as Figure 9 As shown in the diagram, the refrigerant recirculation unit 70 can be configured to receive refrigerant from the internal access network 26, cool the received refrigerant, and supply the cooled refrigerant back to the internal access network 26. For example, the refrigerant received from the internal access network 26 can be cooled by the cryogenic cooler 73 before returning to the internal access network 26.

[0135] Additionally, the refrigerant recirculation unit 70 may include a control system (not shown) for controlling the flow rate, pressure, and / or temperature of the refrigerant supplied to the internal passage network 26. For example, it may be desirable to keep the refrigerant in the internal passage network 26 throughout the thermal regulating plate 25 in a liquid state. Therefore, the control system may be configured to control the flow rate, pressure, and / or temperature of the refrigerant supplied to the internal passage network 26 such that the temperature of the refrigerant received from the internal passage network 26 is at or below the boiling point of the refrigerant. This may be desirable because refrigerant in a liquid state can have a larger volumetric heat capacity than refrigerant in a gaseous state. Furthermore, by helping to ensure that the entire internal passage network 26 is filled with liquid refrigerant, the refrigerant within the internal passage network 26 can have a greater heat absorption capacity, making the thermal regulating plate 25 more capable of responding to unplanned malfunction events.

[0136] More typically, the control system can be configured to control the flow rate, pressure, and / or temperature of the refrigerant supplied to the internal circulation network 26, such that the refrigerant remains in a single phase throughout the internal circulation network 26. The single phase can be gas, liquid, or supercritical.

[0137] In an embodiment, the control system can be configured to control the flow rate, pressure, and / or temperature of the refrigerant supplied to the internal passage network 26, such that a portion of the refrigerant changes from a liquid to a gaseous state as it flows through the internal passage network 26. In other words, the refrigerant can gradually boil because it absorbs latent heat of vaporization as it flows through the internal passage network 26 of the heat regulating plate 25. This arrangement can be advantageous because boiling occurs at a substantially constant temperature, which in turn can help reduce temperature variations on the heat regulating plate 25. Furthermore, the control system can be configured to control the flow rate, pressure, and / or temperature of the refrigerant supplied to the internal passage network 26, such that sufficient liquid refrigerant reserves are maintained at the outlet of the internal passage network 26. In the event of an unplanned quench event, this reserve of liquid refrigerant can provide additional heat absorption capacity.

[0138] The advantage of allowing a portion of the refrigerant to boil as it flows through the internal circulation network 26 is that two-phase flow can possess excellent vibration damping properties. For example, two-phase flow can help reduce sloshing. In short, the interface waves between the two phases can serve as an energy dissipation mechanism, thus providing additional acoustic and mechanical damping. A damping ratio of approximately 2% to 3% can be achieved using two-phase flow, while the actual structural damping in most single-phase systems is far less than 1%. Compared to single-phase flow, a smaller amount of two-phase fluid can be used while maintaining approximately the same damping performance.

[0139] In an embodiment, the control system can be configured to control the flow rate, temperature, and / or pressure of the refrigerant supplied to the internal channel network 26, such that the refrigerant is in slush form. In other words, the refrigerant supplied to the internal channel network 26 may include solid particles of refrigerant suspended in liquid form within the refrigerant. The presence of solid refrigerant can cool one or more superconducting coils 2 to temperatures below those achievable with the same refrigerant in liquid or gaseous form, and can provide a greater reserve of heat absorption capacity for unplanned quench events. Furthermore, using a slush-like refrigerant allows the refrigerant to be transported like a liquid compared to a purely solid form.

[0140] The temperature of the refrigerant supplied to the internal circulation network 26 can be controlled in various ways. For example, its temperature can be controlled by changing the refrigerant pressure. More specifically, depressurization can cause a decrease in the refrigerant's saturation temperature. Figure 9As shown, refrigerant can be supplied from the refrigerant recirculation unit 70 to the internal passage network 26 of the thermal control plate 25 via the refrigerant supply line 61. To control the temperature of the refrigerant supplied to the internal passage network 26, the control system may include a refrigerant pressure controller 71 mounted on the supply line 61. The refrigerant pressure controller 71 can cause a pressure drop in the refrigerant as it flows from the upstream section 611 to the downstream section 612 of the refrigerant supply line 61. The refrigerant pressure controller 71 can control the amount of the pressure drop. By controlling the amount of the pressure drop, the temperature of the refrigerant in the downstream section 612 of the supply line 61 can be controlled.

[0141] Furthermore, the refrigerant pressure controller 71 can be positioned relatively close to the heat regulation plate 25. That is, the downstream section 612 of the refrigerant supply line 61 can be shorter than the upstream section 611 of the supply line 61. This can be advantageous because the amount of heat absorbed by the refrigerant while in the refrigerant supply line 61 can be difficult to predict. By placing the refrigerant pressure controller 71 relatively close to the point of use (i.e., close to the heat regulation plate 25), the regulation of the refrigerant actually supplied to the internal circulation network 26 can be controlled with greater accuracy.

[0142] The actuator system 1 may also include a buffer tank 72 configured to hold a volume of refrigerant. The cryogenic cooler 73 may use a cooling circuit 731 to cool the refrigerant. Figure 9 As shown, the cooling circuit 731 may include a heat exchanger 721 configured to cool the refrigerant in the buffer tank 72. In an embodiment, the working fluid within the cooling circuit 731 may be helium. The buffer tank 72 provides thermal buffering because a relatively large amount of refrigerant can be maintained at the desired temperature during planned or unplanned shutdowns (e.g., during maintenance or short power interruptions). At the end of the shutdown, the cooling process of the system can be shortened compared to an arrangement without the buffer tank 72.

[0143] Although buffer tank 72 and cryogenic cooler 73 are in Figure 9 While shown as separate components, it should be understood that these components can be housed within a single unit. It should also be understood that any cryogenic cooler, including off-the-shelf equipment, suitable for supplying refrigerant to the thermal regulating plate 25 can be used.

[0144] While a single refrigerant can be used to implement the embodiments, several refrigerants can be used. For example, actuator system 1 may include a source of a first refrigerant and a source of a second refrigerant (not shown). The first and second refrigerants may be different. In particular, the second refrigerant may have a lower boiling point than the first refrigerant. The boiling points of the first and second refrigerants can be compared at 1 atm. Positioner assembly 1 may switch between the first and second refrigerants based on the temperature of thermal regulating plate 25 at a given time.

[0145] Specifically, as the temperature of the heat exchanger 25 decreases from a higher temperature to a target temperature, the actuator system 1 can initially supply a first refrigerant (higher boiling point) to the internal passage network 26, and then switch to a second refrigerant (lower boiling point). Specifically, the actuator system 1 can be configured to supply the first refrigerant to the internal passage network 26 while the heat exchanger 25 is cooling, and can switch to the second refrigerant once the temperature of the heat exchanger 25 has decreased to or below the boiling point of the second refrigerant. This helps ensure that the refrigerant supplied to the internal passage network 26 remains in liquid form for a larger portion of the cooling process. This is advantageous because a liquid refrigerant can have a larger heat capacity than the same refrigerant in gaseous form. More specifically, the second refrigerant can be selected to have a larger specific heat capacity than the first refrigerant, such that the refrigerant flow rate can be reduced after switching to the second refrigerant.

[0146] The first and second refrigerants can be any two refrigerants, such as those selected from Table 1 above (Table 1 lists refrigerants in ascending order of boiling point from left to right). For example, the first refrigerant can be liquid nitrogen, and the second refrigerant can be secondary hydrogen. As can be seen in Table 1, switching to secondary hydrogen as the second refrigerant can be advantageous due to its relatively large heat of vaporization. In another example, the first refrigerant can be liquid nitrogen, and the second refrigerant can be liquid neon or liquid helium. In one example, the first refrigerant can be used to cool the heat regulating plate 25 to approximately 77 K (e.g., from room temperature) before switching to the second refrigerant. The second refrigerant can be used to further cool the heat regulating plate 25 to the operating temperature, such as to approximately 20 K. The second refrigerant can then maintain the temperature of the heat regulating plate 25.

[0147] When using two refrigerants, the internal passage network 26 of the thermal regulating plate 25 may include a first subnet and a second subnet (not shown) that are fluidly isolated from each other. The actuator system 1 may be configured to supply the first refrigerant to the first subnet and the second refrigerant to the second subnet. The actuator system 1 may be configured to supply one of the first and second refrigerants, but not both, to its corresponding subnet at any given time. As described above, the switching between the first and second refrigerants may depend on the temperature of the thermal regulating plate 25. By fluidly isolating the first and second subnets, mixing of the first and second refrigerants can be prevented. Furthermore, the actuator system 1 can switch between the first and second refrigerants without first emptying the refrigerant supply line 61 and / or the refrigerant return line 62. It should be noted that when using more than one refrigerant, separate sets of refrigerant supply lines 61 and refrigerant return lines 62 and / or buffer tanks 72 and / or cryogenic coolers 73 may be provided for each refrigerant.

[0148] Figure 13a An actuator system 1 according to an embodiment is depicted. The actuator system 1 includes a thermal adjustment plate 25 and one or more superconducting coils 2 (e.g., preferably multiple superconducting coils). One or more superconducting coils 2 are used to magnetically levitate and linearly displace a platform 29 thereon. The actuator system 1 and platform 29 can be any positioner and support, such as within a lithography apparatus. For example, platform 29 can be a patterning apparatus support MT for a patterning apparatus MA, and actuator system 1 can be part of a first positioner PM. Alternatively or additionally, platform 29 can be a substrate support WT, and actuator system 1 can be a second positioner PW. Platform 29 may include long-stroke components that support the short-stroke actuators described herein. Platform 29 has one or more coils or one or more magnets that interact with one or more superconducting coils 2 when appropriate.

[0149] In an embodiment, the thermal regulating plate 25 may include internal pathways (same as or similar to the internal pathway network 26 described herein) for allowing refrigerant to flow therein. Thus, the thermal regulating plate 25 can be thermally regulated, e.g., cooled, by the refrigerant flowing therein. As shown, one or more superconducting coils 2 are in thermal contact with the outer surface of the thermal regulating plate 25. More specifically, one or more superconducting coils 2 may be disposed on the outer surface of the thermal regulating plate 25. One or more superconducting coils 2 may be disposed directly on said outer surface. One or more superconducting coils 2 may be in thermal contact with the outer surface of the thermal regulating plate 25 without direct contact with the refrigerant (e.g., not immersed in the refrigerant). Alternatively, one or more superconducting coils 2 may be embedded in the thermal regulating plate 25 and may be in direct contact with the refrigerant (e.g., immersed in the refrigerant).

[0150] To achieve and maintain a low temperature for the thermal conditioning plate 25 without using excessive cooling power, it may be advantageous to thermally insulate the thermal conditioning plate 25 and one or more superconducting coils 2 from the external environment. For example, as Figure 13a As shown, the actuator system 1 may also include a vacuum / low-pressure container 28. The container 28 may enclose a thermal regulating plate 25 and one or more superconducting coils 2.

[0151] Low pressure (e.g., pressure at or below 20 Pa, pressure at or below 10 Pa, pressure at or below 5 Pa, pressure at or below 1 Pa, pressure at or below 0.1 Pa, pressure at or below 0.01 Pa, pressure at or below 0.001 Pa, or pressure at or below 0.0001 Pa) can be applied to the space within container 28. For this purpose, a vacuum / low pressure source (e.g., a pump) 69 can be connected to the volume of space within container 28 via conduit 68. While vacuum is an effective means of thermal insulation, other methods of thermal ventilation are alternatively used.

[0152] Actuator system 1 may alternatively or additionally include a heat shield 30 for improving thermal insulation. For example... Figure 13a As shown, the thermal mask 30 can enclose the thermal regulating plate 25 and one or more superconducting coils 2. In the presence of the container 28, the thermal mask 30 can also be enclosed within the container 28.

[0153] With this arrangement, by means of a non-limiting example, the thermal regulating plate 25 and one or more superconducting coils 2 can be maintained at approximately 44 K or less, preferably 10 K to 35 K, preferably 20 K or less. The thermal shield 30 can be maintained at approximately 50 K to 90 K. The container 28 can be maintained at room temperature, i.e., approximately 295 K. It should be understood that the low pressure applied within the container 28 does not need to be a complete vacuum. For example, the pressure within the container 28 can be maintained at approximately 10 Pa or less.

[0154] To further improve the thermal insulation of the heat treatment plate 25, the heat shield 30 may also include internal pathways (e.g., the same as or similar to the internal pathway network 32) for the flow of refrigerant therein. This can further reduce the temperature within the heat shield 30, which can help ensure that the heat treatment plate 25 and one or more superconducting coils 2 can be maintained at the desired low temperature. To further improve thermal insulation, additional heat shields similar to the heat shield 30 may be provided depending on space availability.

[0155] like Figure 13aAs shown, container 28 may include a penetration 43 through which refrigerant is supplied to heat regulating plate 25. For example, as Figure 13a As shown, the refrigerant supply line 61, configured to supply refrigerant to the heat regulating plate 25, can be arranged from the refrigerant unit 81 through the penetration 43 and can be connected to the internal passage of the heat regulating plate 25. In the presence of a heat shield 30, the heat shield can be provided with the penetration 33 to allow the refrigerant supply line 61 to pass through it to the heat regulating plate 25. Similarly, refrigerant for the internal passage of the heat shield 30 can be supplied through the penetration 43 of the container 28. More generally, any desired amount of refrigerant can be supplied through the penetration 43 of the container 28 (and optionally, the penetration 33 of the heat shield 30).

[0156] The thermal adjustment plate 25 can move up to 10 mm to 100 mm, for example, 50 mm. This movement may be caused by movement during the movement operation of the actuator system 1, such as by movement during the scanning operation of the lithography apparatus. Alternatively or additionally, the movement of the thermal adjustment plate 25 may be attributed to thermal shrinkage. To accommodate these movements, one or more of the thermal adjustment plate 25, the thermal mask 30, and / or the container 28 may be mechanically suspended rather than rigidly fixed. For example, one or more flexible mechanical supports 80 may mechanically connect the thermal adjustment plate 25 to the frame 15. These one or more mechanical supports may be provided through through-holes in the container 28 and / or the thermal mask 30. In embodiments, the thermal adjustment plate 25 may be attached to the container 28 and / or the thermal mask 30, and similarly, one or more flexible mechanical supports 80 may be attached to the frame 15. Typically, it may be desirable for these one or more mechanical supports to have low thermal conductivity in order to reduce the amount of heat reaching the thermally adjustable plate 25 from the external environment. For example, one or more mechanical supports may comprise a material with low thermal conductivity. One or more mechanical supports may have a small cross-sectional area. In embodiments, one or more mechanical supports enable the thermally adjustable plate 25, alone or in combination with the container 28 and / or the thermal shield 30, to function as a balancing mass block, i.e., to absorb reaction forces and move in response to them (in embodiments, due to the mass difference between the platform 29 and the thermally adjustable plate 25 (or in combination with the container 28 and / or the thermal shield 30), resulting in a relatively smaller distance movement compared to the platform 29).

[0157] In its simplest case, the refrigerant supplied to at least the heat regulating plate 25 for cooling can be discharged after it has passed through the internal passages. However, since this could be wasteful, the supplied refrigerant can be recycled. For example, as... Figure 13aAs shown, a refrigerant return line 62 can be provided, through which the refrigerant flows away from the heat regulating plate 25 and reaches the refrigerant unit 71 (which may have a recirculation function, for example, as described above relative to...). Figure 9 As discussed above). Figure 13a As shown, the refrigerant supply line 61 and the refrigerant return line 62 can both be configured to pass through the same penetration 43; however, they need not be.

[0158] To supply power to one or more superconducting coils 2, one or more power supply leads 63 can be used to supply current from power source 82. For example... Figure 13a As shown, one or more power supply leads 63 may be configured to be separate from the refrigerant supply line 61 and the refrigerant return line 62; however, they need not be so and can be combined in a common conduit, for example... Figure 9 As shown in the diagram. Typically, one or more power supply leads 63 may be required to carry a large current, for example, 1 kA to 5 kA, or at least 2 kA. Given the large current carried by one or more power supply leads 63, cooling one or more power supply leads can be beneficial in order to reduce resistive losses. For this purpose, one or more power supply leads 63 may be surrounded by a refrigerant. In particular, one or more power supply leads 63 may be surrounded by the same refrigerant supplied to the thermal regulating plate 25. One or more power supply leads 63 may be superconducting.

[0159] In this embodiment, one or more power supply leads 63, refrigerant supply lines 61, refrigerant return lines 62 and / or lines 68 are flexible. This flexibility allows for movement of the thermal control plate 25, container 28 and / or heat shield 30 without causing the corresponding one or more power supply leads 63, refrigerant supply lines 61, refrigerant return lines 62 and / or lines 68 to malfunction, become disconnected, etc.

[0160] In an embodiment, such as Figure 13a As shown, the refrigerant unit 81, power supply 82 and / or vacuum / low-pressure source (e.g., pump) 69 are located on the ground 83 of the manufacturing plant (fab) (e.g., a sub-plant) and are connected to the heat treatment plate 25, container 28 and / or heat shield 30 by means of a flexure 80 (typically a mechanical support).

[0161] When the thermal regulating plate 25 is used alone or in combination with the container 28 and / or the thermal shield 30 as a balancing mass, the power lead 63, which carries a relatively large current to power the superconducting coil 2, needs to have some flexibility. To reduce resistive losses in the power lead 63, it can be cryogenically cooled. Due to the relatively thick conductor used for the power lead 63 and the cryogenic cooling of the lead, it may be difficult to achieve low flexibility for the power lead connection between the power source 82 and the superconducting coil 2.

[0162] In this embodiment, it is therefore proposed that when the container is used as a balancing mass block, the power supply 82 be installed to the container 28. This achieves the desired flexibility in the power lead connection between the stationary world (e.g., ground 83) and the superconducting coil 2.

[0163] Figure 13b A power supply 82 that can be applied in embodiments of the invention is schematically shown. The schematically shown power supply 82 includes an input terminal 82.1 configured to connect to a main power supply 800, such as a three-phase AC power supply. A power supply 82 suitable for powering one or more coils, such as superconducting coil 2, would typically include a power converter 82.3 that converts the AC input power received from the input terminal into a suitable output power for powering one or more coils. To power one or more superconducting coils, a low-voltage / high-current DC output power is typically required. As mentioned above, powering the coils may require a current of 1 kA to 5 kA. Therefore, the power lead 86 exiting the output terminal 82.2 will typically have a relatively large cross-section and will therefore be considerably more rigid compared to the power lead 88 that connects the main power supply 800 to the input terminal 82.1 of the power supply 82.

[0164] Figure 13c An embodiment of actuator system 1 is schematically shown, wherein a power supply 82 for powering the superconducting coil 2 is mounted to a container 28. Figure 13aCompared to the previous embodiment, container 28 is mounted on mechanical support 80 in a displaceable manner, thus allowing the container and its components to serve as a balancing mass block for platform 29. By mounting power supply 82 to container 28, the power lead connection 88 connecting power supply 82 to the main supply 800 may include relatively thin electrical connectors or wires, resulting in relatively low stiffness in the dynamic connection between actuator assembly 1 and frame 15. In the illustrated embodiment, power supply 82 is mounted adjacent to penetration 44 to allow for the transfer of power leads toward superconducting coil 2. In the illustrated embodiment, power converter 82 is mounted to the outer surface of container 28. It can be noted that alternative arrangements are also contemplated. In particular, power supply 82 may be mounted, for example, to the inner surface of container 28. In the embodiment, power supply 82 may be integrated, for example, into the available space between container 28 and thermal shield 30.

[0165] Figure 13d An embodiment of an actuator assembly including a power supply 82 for powering the superconducting coil array 2 is schematically shown. For clarity, it has been... Figure 13d For example, in the middle, omissions are made. Figure 13c The actuator assembly shown comprises multiple components. In the illustrated embodiment, frame 16 is mounted to the bottom surface of container 28, and power supply 82 is disposed within a cavity of frame 16. Figure 13d Further illustrated is a power supply lead 88 connecting the power source 82 (particularly the first terminal 82.1 of the power source 82) to the main power supply 800 (e.g., a three-phase AC power supply). In the illustrated embodiment, the power output terminal 82.2 is disposed in a penetration of the container 28, and the power lead 86 is configured to reach the array of superconducting coils 2 via a penetration of the thermal shield 30, the superconducting coils 2 being mounted to the thermal adjustment plate 25. In the illustrated embodiment, the container 28 is supported on a frame 15 via a frame 16 and a mechanical support member 80, the frame 15 being either a vibration-isolated frame or a ground member. It should be noted that in this embodiment, the container 28 may be directly supported on the frame 15 by means of the mechanical support member 80. In this embodiment, the mechanical support member 80 will be directly connected to the bottom surface of the container 28.

[0166] In one embodiment, a shuttle 84 is provided that effectively follows the platform 29 in at least one direction. For example, in Figure 13cIn the embodiments depicted, shuttle 84 follows platform 29 in the Y direction, while platform 29 can move in at least the XY plane. Of course, shuttle 84 can move in different directions and can move in more than one direction. In an embodiment, shuttle 84 may have an arm 85, and platform 29 can move relative to said arm 85; for example, platform 29 can move primarily in the X direction relative to arm 85. Desiredly, platform 29 is in a primarily non-contact arrangement relative to arm 85. In an embodiment, shuttle 84 is displaced by an actuator at least a portion on actuator structure 86. For example, the actuator may include a linear motor (e.g., a coil and magnet linear motor) configured to actively pause and displace shuttle 84, wherein, for example, a coil or magnet is located in or on actuator structure 86 and another of the magnet or coil is located in or on shuttle 84 (e.g., the bottom portion of shuttle 84 extends across actuator structure 86). In an embodiment, the actuator structure 86 may include a guide member for guiding the movement of the shuttle 84 and limiting uncontrolled movement of the shuttle 84.

[0167] The shuttle 84 may have one or more functions. For example, the shuttle 84 may carry one or more conduits / cables 87 for the platform 29 (e.g., one or more power lines, fluid supply components for, for example, cooling, etc.). This can help reduce the forces acting on the platform 29 due to such one or more conduits / cables. In embodiments, the conduits / cables 87 are flexible or displaceable so as to be able to move with the platform 29. Thus, while the shuttle 84 supports the conduits / cables 87, the conduits / cables 87 can move at least partially relative to the shuttle 84 to follow the platform 29. In embodiments, the shuttle 84 may include one or more sensors for enabling a position measurement system for the platform 29 (and optionally the shuttle 84 itself). In embodiments, the shuttle 84 may provide a collision interface for the platform 29. For example, if the positioning of the platform 29 becomes uncontrollable, the shuttle 84 may be used to limit at least some further movement of the platform 29. As an example, shuttle 84 can restrict movement in one or more of the X, Y, Z, Rx, Ry, and / or Rz directions. This restriction can occur through physical contact between a portion of platform 29 and arm 85 of shuttle 84. That is, for example, in a collision scenario, a portion of platform 29 can be configured to interact with the track of arm 85. When platform 29 is controlled, there is no contact between the portion of platform 29 and the track of arm, but when the movement of platform 29 becomes uncontrolled, the portion of platform 29 contacts the track in a manner that restricts undesired uncontrolled movement. Preventing or restricting such uncontrolled movement can, for example, help prevent damage to one or more pipes / cables. Preventing or restricting such uncontrolled movement can, for example, help limit forces, such as forces applied to one or more pipes / cables. Preventing or restricting such uncontrolled movement can, for example, help prevent or reduce damage. Figure 13c In this embodiment, arm 85 is depicted as relatively short merely for convenience and to allow for a more preferred depiction of all components; in another embodiment, arm 85 may be long enough to allow platform 29 to traverse coil layer 2 to reach distant locations (e.g., to or near one or more edges of the coil layer) as needed. In another embodiment, shuttle 84 may dampen the motion and / or vibration of the balancing mass block. For example, the mass of the actively levitated shuttle 84 may serve as an adjusted mass damper for one or more modes (e.g., Ry modes) of the balancing mass block.

[0168] In an embodiment, one or more other platforms besides platform 29 may be configured to interact with coil layer 2. In an embodiment, the other platforms may be effective repeats of platform 29. In an embodiment, the other platforms may include the common support described above, which is arranged, for example, to hold sensors and / or cleaning devices, but not configured to hold the substrate. The other platforms may move primarily on the right side of coil layer 2 as shown in FIG. 13. The other platforms may have their own shuttles, such as shuttle 84. These may be located, for example, on the right side of coil layer 2 as shown in FIG. 13. Of course, the other shuttles may have actuators having similar actuator structures 86.

[0169] As mentioned above Figure 13a As schematically illustrated, coil layer 2 can be an integrated structure. That is, while the individual coils of coil layer 2 can be manufactured separately, the coils are schematically depicted as assembled into a single, fairly rigid structure, wherein the coils of coil layer 2 are connected to each other. However, this design may have one or more disadvantages. For example, in the embodiment, the coils of coil layer 2 are mounted in series, and therefore a possible failure could damage all the coils, and / or a failure of one coil might require replacing the entire coil layer 2 or a complex, costly, and time-consuming removal or repair of the faulty coil. As another example, if a quench occurs, all the coils and surrounding materials may be damaged. As discussed herein, a quench in a superconductor is a sudden, unexpected, and irreversible transition to the superconductor's normal (non-energized) state, which causes the stored energy to be converted primarily into heat, which could lead to the superconductor's destruction if not properly controlled. Therefore, replacing or repairing all or part of coil layer 2 after an uncontrolled quench event can be complex, costly, and time-consuming. As another example, the integrated coil layer 2 can bend or warp if it is not properly supported. Therefore, repairing such bending or warping can be complex, costly, and time-consuming. As another example, uncontrolled movement and / or stopping of platform 29 could cause collisions on coil layer 2, potentially damaging coil layer 2 and / or its adjacent structures. Repairing such damage can be complex, costly, and time-consuming.

[0170] Therefore, in this embodiment, coil layer 2 is further divided into multiple separable and discrete modules, each module having one or more coils of coil layer 2 (desirably, multiple coils connected in series). In this embodiment, each module has an interface for allowing power to be supplied to at least the module. Therefore, with coil layer 2 being divided into modules, repair and / or replacement can be, for example, easier, less time-consuming, and less costly. For example, if an unplanned quench event occurs, it is easy to remove only one or more modules affected by the quench, while leaving unaffected modules in place. The removed one or more modules can then be repaired or simply replaced.

[0171] refer to Figure 14 This depicts a highly schematic embodiment of a modular implementation of the coil layer. Figure 14 In the figure, a bottom view of the modular implementation of coil layer 2 is depicted to show an embodiment that allows power to be supplied to the interfaces in the module. Therefore, for example, the modular implementation of coil layer 2 will be rotated 180 degrees for addition to the embodiment in Figure 13.

[0172] exist Figure 14 The diagram shows six modules 88 assembled together to form coil layer 2. Of course, fewer or more modules may be present. In embodiments, there are four or more modules, six or more modules, ten or more modules, twenty or more modules, fifty or more modules, one hundred or more modules, or five hundred or more modules. The assembled module 88 can be considered similar to at least coil layer 2 of thermal regulating plate 25. If cooling is supplied to the module as discussed below to provide superconductivity within the module, the assembled module 88 can be considered similar to the combination of coil layer 2 and thermal regulating plate 25.

[0173] In embodiments, each module 88 includes an external structure 89, which, for convenience only, is referred to herein as a superconducting coil block. Effectively, the superconducting coil block 89 is a box-like structure to house one or more coils of the coil layer 2, preferably multiple coils. For example, 10 or more coils, 20 or more coils, 40 or more coils, or 100 or more coils can be encapsulated in the superconducting coil block. The superconducting coil block introduces modularity, which helps increase the serviceability, manufacturability, and ease of assembly of the coil layer 2. In the event of a failure inside the superconducting coil block, the superconducting coil block can be directly replaced by a new superconducting coil block, rather than replacing the entire coil layer 2. Therefore, service and maintenance costs and time can be reduced, and hopefully, reliability and testability can be improved by discretizing the coil arrangement within the coil layer 2. In embodiments, the superconducting coil block can enclose one or more coils; that is, the superconducting coil block can have one or more walls to cover the top, bottom, and one or more sides of one or more coils of the associated module. In one embodiment, the superconducting coil block may have one or more walls covering the bottom and one or more sides of one or more coils, and is therefore open at the top. In another embodiment, the superconducting coil block may have walls covering only the bottom of one or more coils, desirably extending beyond one or more sides of the coils to provide a surface for mating with the surface of a wall of an adjacent module. In yet another embodiment, the superconducting coil block is made of a non-conductive material.

[0174] In an embodiment, each module 88 includes one or more interfaces 92 for allowing services to access one or more of the module, wherein the services include a power supply for coils within the module. In an embodiment, the service may have multiple components. For example, one component of the service may be cooling for providing superconductivity to the coils within the module. In an embodiment, one component of the service may be unidirectional or bidirectional transmission of electrical signals from one or more sensors within the module. Thus, for example, in an embodiment, one or more interfaces 92 allow cooling to be supplied within the module to provide superconductivity to the coils within the module, and / or one or more interfaces 92 allow unidirectional or bidirectional transmission of electrical signals from one or more sensors within the module. In an embodiment, separate interfaces may exist for components of the service, or a single interface may exist for all components of the service.

[0175] In an embodiment, one or more interfaces 92 may include one or more connectors to allow for relatively easy connection and disconnection of services. In an embodiment, such as... Figure 14As shown, one or more interfaces 92 are located on a surface opposite to the surface across which the platform 29 moves (e.g., the bottom surface). Accordingly, a connection structure (not shown) can be provided that provides one or more mating connectors for one or more connectors of one or more interfaces 92 of the module, such that the connection structure provides services to the module, and in embodiments, this structure can be integrated to provide all or most of the connectors in module 88. The connection structure can be, for example, the wall and / or heat shield 30 and / or frame 15 of container 28. Desiredly, all or most of the one or more service connections in module 88 are similar, thus bringing commonality and simplicity to the design.

[0176] In embodiments, additionally or alternatively, one or more modules 88 may have one or more interfaces 92 on one or more different surfaces, for example, on one or more side surfaces. In that case, one or more modules 88 may be connected to one or more other modules 88. Thus, in embodiments, one or more modules 88 may be connected to one or more other modules 88 in series. For example, an electrical connection may be located inside two adjacent superconducting coil blocks 89, such that a coil in one module 88 is connected in series with a coil in another module 88.

[0177] In this embodiment, the service for each module 88 is controlled and optionally monitored so that the service for each module 88 can be controlled separately and individually. Thus, for example, different power supplies can be provided to different modules 88, and different cooling supplies can be provided to different modules 88 if cooling for the modules 88 is available. This can help prevent or respond to faults such as overruns, coil failures, etc.

[0178] In embodiments, a control system of electronic hardware and / or software may be provided to provide multiple service levels and may monitor significant power and / or thermal changes as needed (e.g., using signals from sensors in module 88) to provide appropriate control signals to cut off service to module 88, change the amount of service to module 88, etc. In embodiments, where modules 88 are assembled to form, for example, a magnet array, the control system may provide regulation or calibration routines to regulate and / or take into account, for example, a magnetic field, when modules 88 are assembled. Regulation may include, for example, adjusting one or more currents in modules 88 to adjust the overall magnetic field of module 88. Calibration may include, for example, adjusting the power supply to platform 29 based on the determined magnetic field of the assembled module 88. Such regulation and / or calibration may be performed using measurements generated by one or more sensors, such as one or more sensors in or attached to module 88 and / or one or more external sensors (e.g., sensors temporarily used to measure the magnetic field of the assembled module 88).

[0179] In one embodiment, each superconducting coil block has a substantially identical configuration and construction to enable mass production and relatively easy replacement. In another embodiment, one or more superconducting coil blocks may have a different configuration and construction than most superconducting coil blocks.

[0180] In an embodiment, one or more mechanical connectors 93 are provided to connect the module to adjacent modules when the modules 88 are assembled together to form coil layer 2. In an embodiment, one or more mechanical connectors 93 may be separate from the superconducting coil block of module 88, for example, they may be any type of fastener. In an embodiment, one or more mechanical connectors 93 may be part of or integrated with the superconducting coil block of the module, for example, they may be protruding elements for engaging into and desirably locking with an opening in an adjacent module. In an embodiment, the mechanical connectors 93 are positioned inside the module between two adjacent superconducting coil blocks to fabricate the assembled superconducting coil blocks relatively, at least in the X and Y directions, thus improving, for example, the torsion or bending patterns of the assembled module, and therefore improving the assembled layer 2. In an embodiment, one or more mechanical connectors 93 have the same or similar design to bring commonality and simplicity to the design.

[0181] In an embodiment, when modules 88 are assembled together to form coil layer 2, one or more pillars 94 are disposed around the periphery of the assembled module to provide stiffness, for example, in the Z direction, and / or to provide impact protection. In an embodiment, one or more pillars 94 are located at the junction between adjacent superconducting coil blocks. In an embodiment, one or more pillars 93 may be separate from the superconducting coil blocks of module 88, for example, and are any type of solid or fastener. In an embodiment, one or more pillars 93 may be part of or integrated with the superconducting coil blocks of the module, for example, a solid element for engagement with and desired to lock into a solid element of an adjacent module. In an embodiment, one or more pillars 93 have the same or similar design to bring commonality and simplicity to the design.

[0182] In an embodiment, one or more external connectors 95 are disposed around the periphery of the assembled module 88 to secure the assembled module to another object, such as the heat-regulating plate 25 and / or container 28 and / or heat shield 30 and / or frame 15. In an embodiment, a structure 95 may be provided, through which the assembled module 88 is connected via one or more external connectors 95. This structure 95 can then be secured to the heat-regulating plate 25 and / or container 28 and / or heat shield 30 and / or frame 15. In an embodiment, one or more external connectors 95 may be, in addition to... Figure 14 Any other part other than those shown.

[0183] In one embodiment, the superconducting coil block 89 of module 88 has an outer wall that is non-planar or comprises multiple surfaces (multi-surface) to mate with the outer wall of another module 88. In another embodiment, the mate includes a mating such that one surface of the outer wall of the superconducting coil block 89 of one module contacts a surface of the other module. In another embodiment, the mate includes an interlock, wherein the outer wall of the superconducting coil block 89 of one module overlaps at least a portion of the wall of another module, wherein the interlock does not require contact between the modules but may include contact. As will be appreciated, various types of configurations of non-planar or multi-surface outer walls can be provided. Several non-limiting examples of these configurations are described below.

[0184] refer to Figure 15A This illustrates an example configuration of a multi-surface outer wall 97 of a superconducting coil block 89. In such a configuration, the multi-surface wall 97 comprises at least two surfaces, at least one of which mates with a surface of the outer wall of another module 88 (e.g., mating, interlocking, etc.). In an embodiment, two or more surfaces of the multi-surface wall 97 mate with one or more surfaces of the outer wall of another module 88. Figure 15AIn the example, wall 97 of one module overlaps at least a portion of the wall of an adjacent module in the X direction.

[0185] Figure 15B Another example configuration of the multi-surface outer wall 97 of the superconducting coil block 89 is shown. This wall 97 has a serrated structure, which, in this embodiment, interlocks with a wall of another module, which also has a multi-surface wall with a serrated structure. Figure 15B In the example, a wall 97 of a module overlaps with at least a portion of the wall of an adjacent module in the X direction at at least two occasions or conditions.

[0186] Figure 15C An example configuration of the non-planar outer wall 98 of a superconducting coil block 89 is shown. This wall 98 has a corrugated configuration, which, in this embodiment, interlocks with the wall of another module, which also has a non-planar wall with a corrugated configuration. Figure 15C In the example, wall 98 of one module overlaps at least a portion of the wall of an adjacent module in the X direction.

[0187] In one embodiment, the cross-section of the superconducting coil block 89 in a plane parallel to the layout of the plurality of superconducting coils (e.g., coil layer 2) is non-rectangular. For example, as... Figure 15A , Figure 15B and Figure 15C As seen in each of the diagrams, a non-rectangular cross-section of the superconducting coil block 89 is shown (which, in contrast to...). Figure 14 Each module 88 shown has a different rectangular cross-section. As will be understood, the cross-section may have a different shape than the depicted cross-section.

[0188] In one embodiment, the non-planar or multi-surface outer wall 97 has a portion protruding from the outside of the module, and at least one coil 99 is arranged to extend at least partially inside said portion. Figure 15A , Figure 15B and Figure 15C As seen in each of these examples, examples of coils 99 are identified that extend at least partially into the protrusion formed by the non-planar or multi-surface outer wall 97. For example, this configuration allows for a hexagonal array or grid arrangement of coils across the module. Of course, this configuration can also allow for each type of array or grid arrangement, with coils aligned in an array or grid other than a square array or grid. In embodiments, the array or grid has approximately equal periods in the X and Y directions.

[0189] Therefore, in an embodiment, a superconducting assembly for an actuator is provided, the superconducting assembly including a plurality of superconducting coils configured to generate a magnetic field during use, wherein the plurality of superconducting coils are divided into a plurality of separable and discrete modules 88, the plurality of modules forming the superconducting assembly when assembled, each module including a subset of one or more coils 2 of the plurality of coils and including an electrical interface 92 for providing power to the subset of one or more coils. In an embodiment, each module includes a cooling interface for providing cooling for the superconductivity of the subset of one or more coils. In an embodiment, at least one module has a nonplanar or multi-surface outer wall, such as walls 97, 98. In an embodiment, each of adjacent modules in the module has a nonplanar or multi-surface outer wall, and the nonplanar or multi-surface outer walls are designed to interlock with each other. In an embodiment, the nonplanar or multi-surface outer wall has a portion protruding from the outside of the module, and at least one coil is arranged to extend at least partially inside said portion. In an embodiment, the non-planar or multi-surface outer wall is a multi-surface outer wall comprising two generally planar sub-walls that are joined to form a line (e.g., a straight line, a curve, a Z-shaped line, etc.). In an embodiment, the superconducting coil is configured to generate a two-dimensional (2D) alternating magnetic field during use. In an embodiment, the electrical interface is located on a wall other than one or more walls arranged to interface with one or more adjacent modules. In an embodiment, the plurality of superconducting coils are configured to cooperate with the mover of an actuator, and the assembly further includes one or more additional superconducting coils configured to cooperate with an object separated from the follower, the plurality of superconducting coils and the one or more additional superconducting coils having a common cooling arrangement for providing cooling for superconductivity.

[0190] In one embodiment, a magnet body for a planar motor is provided, the magnet body including a plurality of superconducting coils configured to generate a 2D spatially alternating magnetic field during use, wherein the plurality of superconducting coils are grouped into a set of separable and discrete modules 88, the modules forming the magnet body when assembled, each module including a subset of the plurality of coils. In one embodiment, at least one module has a nonplanar or multi-surface outer wall. In one embodiment, each of adjacent modules in the module has a nonplanar or multi-surface outer wall, and the nonplanar or multi-surface outer walls are designed to interlock with each other. In one embodiment, the nonplanar or multi-surface outer wall has a portion protruding from the outside of the module, and at least one coil is arranged to extend at least partially inside said portion. In one embodiment, the nonplanar or multi-surface outer wall is a multi-surface outer wall comprising two generally planar sub-walls that are joined to form a line. In one embodiment, the superconducting coils are configured to generate a 2D spatially alternating magnetic field during use. In an embodiment, at least one module has an electrical interface for providing power to a subset of one or more coils and / or a cooling interface for providing cooling for the superconductivity of the subset of one or more coils, the electrical and / or cooling interfaces being located on a wall other than one or more walls arranged to dock with adjacent one or more modules.

[0191] In one embodiment, a module 88 for a superconducting assembly of an actuator is provided. The module includes one or more superconducting coils of the assembly. The module has one or more multi-surface non-planar outer walls, such as walls 97, 98. In one embodiment, the non-planar or multi-surface outer wall has a portion projecting from the outside of the module, and at least one coil is configured to extend at least partially inside said portion. In one embodiment, the non-planar or multi-surface outer wall is a multi-surface outer wall comprising two generally planar sub-walls that abut to form a line. In one embodiment, the non-planar or multi-surface outer wall is a multi-surface outer wall comprising a serrated configuration. In one embodiment, the module has a non-rectangular cross-section in a plane parallel to the arrangement of the multiple superconducting coils.

[0192] In the embodiments, since the shuttle 84 follows the movement of the platform 29 in at least one direction, the acceleration and velocity of the shuttle 84 should be the same as, or very close to, the same as, the acceleration and velocity of the platform 29 in at least one direction. Therefore, it is desirable to have an actuator for the shuttle 29 that provides increased acceleration and / or velocity compared to a conventional linear motor, but can be adapted within the tight volume and physical constraints of the actuator system 1 described herein. For example, a significant increase in the size of the actuator structure 86 of the shuttle 84 supporting the increased acceleration and / or velocity of the platform 29 would mean an undesirable increase in, for example, the volume requirement of the thermal adjustment plate 25. Therefore, in the embodiments, an ultra-driven actuator for the shuttle 84 is provided, which can be adapted within the tight volume and physical constraints of the actuator system 1.

[0193] refer to Figure 16 Showing about Figure 13a The actuator system described is similar to actuator system 1. For the sake of brevity only, the description is similar to... Figure 13a The differences in the embodiments. In particular, in Figure 16 In this context, a super actuator is provided to enable movement of objects other than platform 29. Figure 16 In one embodiment, the object other than platform 29 is shuttle 84. In another embodiment, the object other than platform 29 may be a thermal regulating plate 25 (and optionally a container 28 and / or a thermal shield 30). In that case, movement may involve “recentering” the thermal regulating plate 25 (and optionally the container 28 and / or the thermal shield 30) in a scenario where it functions as a balancing mass. For example, the balancing mass may not return to its original position and / or orientation after absorbing the various reaction forces that occur during the movement of platform 29. That is, the balancing mass may become displaced in the X, Y, or Z directions other than the position expected due to reaction forces, or it may become oriented (rotated) about the X, Y, or Z directions (e.g., drifting from the expected position). Therefore, it may be necessary to move the balancing mass back to or near its center or original position and / or orientation (e.g., correcting the drift). A superconducting actuator may be used to perform this operation. In an embodiment, the object other than platform 29 may be an object used to counteract the torque generated by the movement of platform 29 and applied to the heat regulating plate 25 (and optionally container 28 and / or heat shield 30). That is, the object generates torque in a manner opposite to, and preferably the same as, the torque applied to the heat regulating plate 25, which can be dynamically applied when different torques are applied to the heat regulating plate 25.

[0194] In one embodiment, components for the super-actuated actuators for objects other than platform 29 can be arranged in the same cryostat arrangement, wherein the coil array 2 for platform 29 is located in the cryostat arrangement. Reference Figure 16 The system provides one or more superconducting coils 90 (desirably, multiple superconducting coils 90 arranged, for example, in an array) configured to cooperate with an object detached from platform 29. Furthermore, the coil layer 2 and the one or more superconducting coils 90 have a common cooling arrangement for providing cooling for superconductivity, i.e., at least a thermal conditioning plate 25. In an embodiment, one or more superconducting coils form a superconducting magnet assembly. Therefore, in an embodiment, one or more superconducting coils 90 are arranged in the same cryogenic thermostat arrangement as the coil array 2 used to house platform 29. Thus, the existing superconducting magnets for platform 29 are used for superconductivity. Figure 13a For example, cryogenic cooling up to 20K. Therefore, no additional volume is needed for cryogenic cooling of actuators for objects other than platform 29.

[0195] In one embodiment, one or more superconducting coils 90 are used in conjunction with shuttle 84 (the second mover, wherein platform 29 is the first mover). Accordingly, in another embodiment, shuttle 84 has actuator components for cooperating with one or more superconducting coils 90 to achieve displacement of shuttle 84. For example, in the case where one or more superconducting coils 90 form a magnet assembly, shuttle 84 may include one or more coils that provide current to achieve displacement of shuttle 84 when one or more coils interact with the magnetic field of one or more superconducting coils 90 in the form of a magnet assembly. Of course, this arrangement can be reversed with the magnet assembly on shuttle 84.

[0196] In one embodiment, one or more superconducting coils 90 are located on the thermal adjustment plate 25 at positions opposite to the coil array 2, such as... Figure 16 As shown in the diagram. However, one or more superconducting coils 90 need not be located there. One or more superconducting coils 90 may be located, for example, on one side of the thermal conditioning plate 25. Or, for example, one or more superconducting coils 90 may be located at the center of the thermal conditioning plate 2, depending on the application of the one or more superconducting coils 90 (e.g., for recentering the balancing mass block as described above).

[0197] In an embodiment, one or more superconducting coils 90 may be configured in the structural arrangement, such as... Figure 14As shown in Figure 15. For example, one or more superconducting coils 90 can be divided into modules similar to those for coil 2. In an embodiment, modules for one or more superconducting coils 90 can be combined with modules for coil 2. In an embodiment, modules for one or more superconducting coils 90 can be integrated into one (or more) modules for coil 2. Of course, if one or more superconducting coils 90 are not segmented into modules, these one or more superconducting coils 90 can be located in one or more structures of the module for coil 2.

[0198] also, Figure 16 One or more superconducting coils 90 are shown on the left and one or more superconducting coils 90 are shown on the right. Figure 16 In one embodiment, one or more superconducting coils 90 located on the left side are configured to move shuttle 84. In another embodiment, one or more superconducting coils 90 located on the right side may be used with another shuttle (not shown) having the same or similar construction as shuttle 84. The other shuttle (not shown) may be used with another platform (not shown) having the same or similar construction as platform 29 (or a platform with a common support, as described herein) and thus have a dual-platform configuration. In another embodiment, one or more superconducting coils 90 located on the right side may be used to recenter the balancing mass as described above (e.g., by having cooperating coils in an object in which the balancing mass can move relative to it, such as in frame 15, in container 28 where the thermal adjustment plate 25 can move relative to container 28, or in thermal shield 30 where the thermal adjustment plate 25 can move relative to container 28).

[0199] In one embodiment, one or more superconducting coils 90 are powered by a large current, such as 1 kA to 5 kA, or at least 2 kA. Accordingly, one or more current leads, shown by supply line 63, are provided to supply current to one or more superconducting coils 90.

[0200] In an embodiment, the guide beam structure can be configured similarly to the guide beam structure of actuator structure 86. For example, the guide beam structure can be located between one or more superconducting coils 90 and shuttle 84. Like the guide beam for actuator structure 86, the guide beam structure, in conjunction with one or more superconducting coils 90, provides, for example, a collision interface in the event that shuttle 84 becomes uncontrolled. For example, during relative movement between shuttle 84 and the guide beam structure, the guide beam structure does not make physical contact with shuttle 84, but instantiates contact with shuttle 84 to limit the range of movement of shuttle 84 when shuttle movement becomes uncontrolled or otherwise exceeds specifications. In an embodiment, due to the use of one or more superconducting coils 90, a guide beam for actuator structure 86 may not be required. Therefore, the volume required for winding one or more superconducting coils 90 in the Z direction may not require additional volume in the Z direction, as the occupied guide beam volume can be used.

[0201] Therefore, by introducing one or more superconducting coils 90, benefits such as minimal heat dissipation can be achieved to enable the movement of objects other than platform 29, compared to conventional solutions, since the acceleration of other objects can be achieved, for example, by increasing the magnetic field density, compared to increasing the current in conventional solutions.

[0202] According to embodiments, "cryogenic cooling" or "cooling the coil layer to a cryogenic temperature" refers to the process of cooling the coil layer to a temperature at which the coil exhibits superconducting behavior and maintaining the coil at such a temperature. Therefore, when cooled to such a temperature, the coil can be supplied with current with virtually no ohmic losses. It will be understood by those skilled in the art that the required temperature or cooling can depend on the material or composition of the coil coating and / or the prevailing pressure conditions. Accordingly, "cryotherm" or "cryotherm environment" refers to a device used to maintain a lower cryogenic temperature for one or more components (e.g., one or more coils) within a cryotherm. Thus, for example, a "cryotherm" or "cryotherm environment" can be an insulating environment cooled by cryogenic cooling, such as a vacuum-insulated environment.

[0203] According to embodiments, a positioner or actuator refers to a device that moves and / or suspends an object. A positioner or actuator may be a linear positioner or actuator that moves an object primarily in one particular direction. A positioner or actuator may be a planar positioner or actuator that moves an object primarily in two or more directions (e.g., in a plane defined by two or more directions). In embodiments, a positioner or actuator includes a combination of two or more linear actuators or positioners (e.g., a short-stroke arrangement and a long-stroke arrangement). In embodiments, a positioner or actuator includes a combination of one or more planar motors and one or more linear actuators or positioners (e.g., a short-stroke arrangement and a long-stroke arrangement). In embodiments, a positioner or actuator includes a combination of two or more planar actuators or positioners (e.g., a short-stroke arrangement and a long-stroke arrangement).

[0204] In the embodiments, the positioner or actuator system is provided with the modules, components, magnet body, etc., described herein. Therefore, the positioner or actuator system may be a cryogenic positioner or actuator.

[0205] In one embodiment, the coil layer may be wired and energized for alternating current operation. In another embodiment, the coil layer may be wired and energized for direct current operation (e.g., as an electromagnet array).

[0206] In one embodiment, a material handling or measurement apparatus is provided, comprising the modules, components, magnet body, positioner, or actuator described herein. The material handling apparatus may be, for example, a photolithography apparatus, etching tool, resist coating tool, polishing apparatus, etc. The measurement apparatus may be, for example, an electron beam-based measurement tool (such as a scanning electron microscope), an electromagnetic radiation-based optical or scattering measurement tool, an alignment measurement tool, an overlay measurement tool, etc.

[0207] In one embodiment, a photolithography apparatus is provided, comprising: a pattern forming apparatus support configured to support a pattern forming apparatus; a first positioner configured to position the pattern forming apparatus support; a substrate support configured to hold a substrate; a second positioner configured to position the substrate support; and a projection system configured to project a radiation beam from the pattern forming apparatus onto the substrate, wherein one or more selected from the pattern forming apparatus support, the first positioner, the substrate support, and / or the second positioner include modules, components, magnet bodies, positioners, or actuators as described herein.

[0208] The embodiments described herein have focused on positioners (PW). However, all the ideas described herein can be applied to other supports and positioners. For example, all the ideas described herein can be applied to positioners (PM), which may have their own balancing mass, their own position measurement system (e.g., similar to a measurement system (PMS)), etc.

[0209] Each embodiment can be combined with one or more of the other embodiments as needed. Furthermore, one or more aspects of one embodiment can be combined with one or more aspects of another embodiment.

[0210] While specific references may be made herein to the use of lithography equipment in IC manufacturing, it should be understood that the lithography equipment described herein may have other applications. Possible other applications include fabricating integrated optical systems, guiding and detecting patterns for magnetic domain memories, flat panel displays, liquid crystal displays (LCDs), thin-film magnetic heads, etc. Those skilled in the art will understand that in the context of these alternative applications, any use of the terms “wafer” or “die” herein may be considered synonymous with the more general terms “substrate” or “target portion,” respectively. The substrates mentioned herein may be processed before or after exposure in, for example, in coating and developing systems (typically tools that apply a resist layer to the substrate and develop the exposed resist), metrology tools, and / or inspection tools. Where applicable, the disclosure herein may be applied to these and other substrate processing tools. Furthermore, the substrate may be processed more than once, for example, to produce multilayer ICs, such that the term “substrate” as used herein may also refer to a substrate that already includes one or more processed layers.

[0211] While specific reference is made herein to embodiments of the invention within the context of a photolithography apparatus, embodiments of the invention can be used in other apparatus or different applications. Embodiments may be part of a mask inspection apparatus, a metrology apparatus, or any apparatus that measures or inspects an object (such as a wafer (or other substrate)) or a mask (or other patterning)). Embodiments may be part of an etching apparatus, a resist-coating apparatus, a resist developing apparatus, a substrate polishing apparatus (e.g., a CMP apparatus), or other apparatus that performs material handling on the object. More generally, embodiments may be part of an apparatus for moving the object. These various apparatuses may generally be referred to as object handling tools. Such object handling tools may be used in vacuum conditions or ambient (non-vacuum) conditions.

[0212] While the foregoing can be specifically used in the context of optical lithography with reference to embodiments of the invention, it should be understood that embodiments of the invention are not limited to optical lithography and can be used in other applications, such as imprint lithography (and therefore in imprinting equipment), where circumstances permit.

[0213] Where circumstances permit, embodiments of the invention may be implemented in hardware, firmware, software, or any combination thereof. Embodiments of the invention may also be implemented as instructions stored on a machine-readable medium that can be read and executed by one or more processors. A machine-readable medium may include any mechanism for storing or transmitting information in a form that can be read by a machine (e.g., a computing device). For example, a machine-readable medium may include: read-only memory (ROM); random access memory (RAM); magnetic storage media; optical storage media; flash memory devices; electrical, optical, acoustic, or other forms of propagation signals (e.g., carrier waves, infrared signals, digital signals, etc.) and others. Additionally, firmware, software, routines, and instructions may be described herein as performing certain actions.

[0214] However, it should be understood that these descriptions are merely for convenience, and these actions are actually caused by computing devices, processors, controllers, or other devices that execute firmware, software, routines, instructions, etc., and such actions may cause actuators or other devices to interact with the physical world.

[0215] While specific embodiments of the invention have been described above, it should be understood that the invention can be practiced in other ways than those described. The above description is intended to be illustrative and not restrictive. Therefore, those skilled in the art will understand that modifications can be made to the described invention without departing from the scope of the claims set forth below. Other aspects of the invention are set forth in the following numbered clauses.

[0216] 1. A photolithography equipment component, comprising:

[0217] A pattern forming apparatus support, the pattern forming apparatus support being configured to support a pattern forming apparatus;

[0218] A first locator, configured to position the pattern forming apparatus support;

[0219] A substrate support configured to hold a substrate;

[0220] A second positioner, configured to position the substrate support; and

[0221] A projection system configured to project a radiation beam from the patterning apparatus onto the substrate.

[0222] The plurality of superconducting coils selected from one or more of the pattern forming apparatus support, the first positioner, the substrate support and / or the second positioner include, during use, a plurality of superconducting coils configured to generate a magnetic field, wherein the plurality of superconducting coils are divided into a plurality of separable and discrete modules, the plurality of modules forming the assembly when assembled, each module including a subset of one or more of the plurality of coils and including an electrical interface for providing power to the subset of one or more coils.

[0223] 2. A superconducting assembly for an actuator, the superconducting assembly including, during use, a plurality of superconducting coils configured to generate a magnetic field, wherein the plurality of superconducting coils are divided into a plurality of separable and discrete modules, the plurality of modules forming the superconducting assembly when assembled, each module including a subset of one or more of the plurality of coils and including an electrical interface for supplying power to the subset of one or more coils.

[0224] 3. The component according to clause 1 or clause 2, wherein each module includes a cooling interface for providing cooling for the superconductivity of the subset of one or more coils.

[0225] 4. The component according to any one of clauses 1 to 3, wherein at least one module has a non-planar or multi-surface outer wall.

[0226] 5. The component according to clause 4, wherein each of the adjacent modules in the module has a non-planar or multi-surface external wall, and the non-planar or multi-surface external walls are designed to interlock with each other.

[0227] 6. The component according to clause 4 or clause 5, wherein the non-planar or multi-surface outer wall has a portion protruding from the outside of the module, and at least one coil is arranged to extend at least partially inside the portion.

[0228] 7. The component according to any one of clauses 4 to 6, wherein the non-planar or multi-surface outer wall is a multi-surface outer wall comprising two generally planar sub-walls that are joined to form a line.

[0229] 8. The component according to any one of clauses 1 to 7, wherein the superconducting coil is configured to generate a two-dimensional (2D) spatial alternating magnetic field during use.

[0230] 9. The component according to any one of clauses 1 to 8, wherein the electrical interface is located on a wall other than one or more walls arranged to mate with one or more adjacent modules.

[0231] 10. The assembly according to any one of claims 1 to 9, wherein the plurality of superconducting coils are configured to cooperate with a mover of the actuator, and the assembly further includes one or more additional superconducting coils configured to cooperate with an object separated from the mover, the plurality of superconducting coils and the one or more additional superconducting coils having a common cooling arrangement for providing cooling for superconductivity.

[0232] 11. A material handling or measuring apparatus comprising the components according to any one of claims 2 to 10.

[0233] 12. A photolithography apparatus, comprising:

[0234] A pattern forming apparatus support, the pattern forming apparatus support being configured to support a pattern forming apparatus;

[0235] A first locator, configured to position the pattern forming apparatus support;

[0236] A substrate support configured to hold a substrate;

[0237] A second positioner, configured to position the substrate support; and

[0238] A projection system configured to project a radiation beam from the patterning apparatus onto the substrate.

[0239] Wherein, one or more selected from the pattern forming apparatus support, the first positioner, the substrate support and / or the second positioner include the components according to any one of clauses 2 to 10.

[0240] 13. A magnet body for a planar motor, the magnet body comprising, during use, a plurality of superconducting coils configured to generate a two-dimensional (2D) alternating magnetic field, wherein the plurality of superconducting coils are divided into a set of separable and discrete modules, the modules forming the magnet body when assembled, each module comprising a subset of the plurality of coils.

[0241] 14. The magnet body according to clause 13, wherein at least one module has a non-planar or multi-surface outer wall.

[0242] 15. The magnet body according to clause 14, wherein each of the adjacent modules in the module has a non-planar or multi-surface outer wall, and the non-planar or multi-surface outer walls are designed to interlock with each other.

[0243] 16. The magnet body according to clause 14 or clause 15, wherein the non-planar or multi-surface outer wall has a portion protruding from the outside of the module, and at least one coil is arranged to extend at least partially inside the portion.

[0244] 17. The magnet body according to any one of clauses 14 to 16, wherein the non-planar or multi-surface outer wall is a multi-surface outer wall comprising two generally planar sub-walls that are joined to form a line.

[0245] 18. The magnet body according to any one of clauses 13 to 17, wherein the superconducting coil is configured to generate a two-dimensional (2D) spatial alternating magnetic field during use.

[0246] 19. A magnet body according to any one of clauses 13 to 18, wherein at least one module has an electrical interface for supplying power to a subset of one or more coils and / or a cooling interface for providing cooling for the superconductivity of said subset of one or more coils, said electrical interface and / or cooling interface being located on a wall other than one or more walls arranged to abut against an adjacent one or more modules.

[0247] 20. A material handling or measuring apparatus comprising a magnet body according to any one of claims 13 to 19.

[0248] 21. A photolithography apparatus, comprising:

[0249] A pattern forming apparatus support, the pattern forming apparatus support being configured to support a pattern forming apparatus;

[0250] A first locator, configured to position the pattern forming apparatus support;

[0251] A substrate support configured to hold a substrate;

[0252] A second positioner, configured to position the substrate support; and

[0253] A projection system configured to project a radiation beam from the patterning apparatus onto the substrate.

[0254] The pattern forming apparatus support, the first positioner, the substrate support and / or the second positioner, or one or more of them, include a magnet body according to any one of clauses 13 to 19.

[0255] 22. A module for a superconducting assembly of an actuator, the module comprising one or more superconducting coils of a plurality of superconducting coils of the superconducting assembly, the module having a multi-surfaced or non-planar outer wall.

[0256] 23. The module according to clause 22, wherein the non-planar or multi-surface outer wall has a portion protruding from the outside of the module, and at least one coil is arranged to extend at least partially inside the portion.

[0257] 24. The module according to clause 22 or clause 23, wherein the non-planar or multi-surface outer wall is a multi-surface outer wall comprising two generally planar sub-walls that are joined to form a line.

[0258] 25. The module according to any one of clauses 22 to 24, wherein the non-planar or multi-surface outer wall is a multi-surface outer wall including a sawtooth structure.

[0259] 26. The module according to any one of clauses 22 to 25, wherein the module has a non-rectangular cross-section in a plane parallel to the arrangement of the plurality of superconducting coils.

[0260] 27. A material handling or measuring apparatus comprising a module according to any one of clauses 22 to 26.

[0261] 28. A photolithography apparatus, comprising:

[0262] A pattern forming apparatus support, the pattern forming apparatus support being configured to support a pattern forming apparatus;

[0263] A first locator, configured to position the pattern forming apparatus support;

[0264] A substrate support configured to hold a substrate;

[0265] A second positioner, configured to position the substrate support; and

[0266] A projection system configured to project a radiation beam from the patterning apparatus onto the substrate.

[0267] The pattern forming apparatus support, the first positioner, the substrate support and / or the second positioner, selected from one or more of them, include the module according to any one of clauses 22 to 26.

[0268] 29. A photolithography equipment component, comprising:

[0269] A pattern forming apparatus support, the pattern forming apparatus support being configured to support a pattern forming apparatus;

[0270] A first locator, configured to position the pattern forming apparatus support;

[0271] A substrate support configured to hold a substrate;

[0272] A second positioner, configured to position the substrate support; and

[0273] A projection system configured to project a radiation beam from the patterning apparatus onto the substrate.

[0274] The pattern forming apparatus support, the first positioner, the substrate support, and / or the second positioner, or one or more of them, include an array of superconducting coils configured to cooperate with a mover and one or more superconducting coils configured to cooperate with an object separated from the mover, the array of superconducting coils and the one or more superconducting coils having a common cooling arrangement for providing cooling for superconductivity.

[0275] 30. A superconducting assembly for an actuator, the superconducting assembly comprising an array of superconducting coils configured to cooperate with a mover of the actuator and one or more superconducting coils configured to cooperate with an object separated from the mover, the array of superconducting coils and the one or more superconducting coils having a common cooling arrangement for providing cooling for superconductivity.

[0276] 31. The superconducting assembly according to clause 29 or clause 30, wherein the common cooling arrangement is arranged to provide a common cryogenic environment for the superconducting coil array and the one or more superconducting coils.

[0277] 32. The superconducting assembly according to any one of clauses 29 to 31, wherein the separated object includes a second mover, and the one or more superconducting coils form a superconducting magnet array configured to cooperate with the second mover.

[0278] 33. The superconducting assembly according to clause 32, wherein the second mover forms part of a drive system configured to displace one or more current-carrying cables of the first mover.

[0279] 34. A superconducting assembly according to clause 30 or clause 31, wherein the separated object cooperates with the one or more superconducting coils to apply force and / or torque to the assembly.

[0280] 35. The superconducting assembly according to any one of clauses 30 to 34, wherein the actuator is a planar actuator for moving coils, and the superconducting coil array is configured to generate a two-dimensional (2D) spatial alternating magnetic field.

[0281] 36. A superconducting assembly according to any one of claims 30 to 35, wherein the superconducting coil array includes a plurality of superconducting coils configured to generate a magnetic field during use, wherein the plurality of superconducting coils of the superconducting coil array are divided into a plurality of separable and discrete modules, the plurality of modules forming the superconducting coil array when assembled, each module including a subset of one or more of the plurality of coils of the superconducting coil array.

[0282] 37. The superconducting assembly according to any one of clauses 30 to 36, wherein at least one module has a non-planar or multi-surface outer wall.

[0283] 38. A material handling or measuring apparatus comprising any one of claims 30 to 37.

[0284] 39. A photolithography apparatus, comprising:

[0285] A pattern forming apparatus support, the pattern forming apparatus support being configured to support a pattern forming apparatus;

[0286] A first locator, configured to position the pattern forming apparatus support;

[0287] A substrate support configured to hold a substrate;

[0288] A second positioner, configured to position the substrate support; and

[0289] A projection system configured to project a radiation beam from the patterning apparatus onto the substrate.

[0290] The portion selected from one or more of the pattern forming apparatus support, the first positioner, the substrate support, and / or the second positioner includes the component according to any one of clauses 30 to 37.

[0291] 40. A superconducting assembly for an actuator, the superconducting assembly comprising:

[0292] Containers, and

[0293] A superconducting coil array configured to cooperate with the mover of the actuator, the superconducting coil array being arranged inside the container;

[0294] A power source for supplying power to one or more coils of the superconducting coil array;

[0295] The superconducting component is configured to function as a balancing mass block during use, and

[0296] The power source is connected to the container of the superconducting component.

[0297] 41. The superconducting assembly according to clause 40, wherein the superconducting coil is configured to generate a two-dimensional (2D) spatial alternating magnetic field during use.

[0298] 42. The superconducting assembly according to clause 40 or 41, wherein the superconducting coil array is mounted to a heat-conducting plate of the superconducting assembly.

[0299] 43. The superconducting assembly according to any one of clauses 40 to 42, wherein the container includes a thermal shield.

[0300] 44. The superconducting assembly according to any one of clauses 40 to 43, wherein the power source includes an input terminal configured to receive power leads from a main power source.

[0301] 45. The superconducting assembly according to any one of clauses 40 to 44, wherein the power source includes an output terminal configured to receive power leads for supplying power to the one or more coils of the superconducting coil array.

[0302] 46. ​​A photolithography apparatus, comprising:

[0303] A pattern forming apparatus support, the pattern forming apparatus support being configured to support a pattern forming apparatus;

[0304] A first locator, configured to position the pattern forming apparatus support;

[0305] A substrate support configured to hold a substrate;

[0306] A second positioner, configured to position the substrate support; and

[0307] A projection system configured to project a radiation beam from the patterning apparatus onto the substrate.

[0308] The superconducting component selected from one or more of the pattern forming apparatus support, the first positioner, the substrate support and / or the second positioner includes any one of clauses 40 to 45.

[0309] 47. A material handling or measuring apparatus comprising a superconducting component according to any one of claims 40 to 45.

Claims

1. A lithographic apparatus assembly, comprising: a patterning device support configured to support a patterning device; a first positioner configured to position the patterning device support; a substrate support configured to hold a substrate; a second positioner configured to position the substrate support; and a projection system configured to project a beam of radiation from the patterning device onto the substrate, wherein one or more of the patterning device support, the first positioner, the substrate support and / or the second positioner comprises, during use, a plurality of superconducting coils configured to generate a magnetic field, wherein the plurality of superconducting coils are grouped into a plurality of modules that are separable and discrete, the plurality of modules forming the assembly when assembled, each module comprising a subset of one or more coils of the plurality of coils and comprising an electrical interface for providing power to the subset of one or more coils.

2. A superconducting assembly for an actuator, the assembly comprising, during use, a plurality of superconducting coils configured to generate a magnetic field, wherein, the plurality of superconducting coils are grouped into a plurality of modules that are separable and discrete, the plurality of modules forming the assembly when assembled, each module comprising a subset of one or more coils of the plurality of coils and comprising an electrical interface for providing power to the subset of one or more coils.

3. The assembly of claim 1 or claim 2, wherein, each module comprises a cooling interface for providing cooling for the superconductivity of the subset of one or more coils.

4. The assembly of any one of claims 1-3, wherein, at least one module has a non-planar or multi-faceted exterior wall.

5. The assembly of claim 4, wherein, each of adjacent modules of the plurality of modules has a non-planar or multi-faceted exterior wall, and the non-planar or multi-faceted exterior walls are designed to interlock with each other.

6. The assembly of claim 4 or claim 5, wherein, the non-planar or multi-faceted exterior wall has a portion that protrudes from the exterior of the module, and at least one coil is arranged to extend at least partially inside the portion.

7. The assembly of any one of claims 4-6, wherein, the non-planar or multi-faceted exterior wall is a multi-faceted exterior wall comprising two generally planar sub-walls that meet to form a line.

8. The assembly of any one of claims 1-7, wherein, the superconducting coils are configured to generate a 2D spatially alternating magnetic field during use.

9. The assembly of any one of claims 1-8, wherein, the electrical interface is located at a wall other than one or more walls arranged to interface with an adjacent module or modules.

10. The assembly of any one of claims 1 to 9, wherein, the plurality of superconducting coils are configured to cooperate with a mover of the actuator, and the assembly further comprises one or more further superconducting coils configured to cooperate with an object separate from the mover, the plurality of superconducting coils and the one or more further superconducting coils having a common cooling arrangement for providing cooling for the superconductivity.

11. A material processing or metrology apparatus comprising the assembly of any of claims 2 to 10.

12. A lithographic apparatus, comprising: a patterning device support configured to support a patterning device; a first positioner configured to position the patterning device support; a substrate support configured to hold a substrate; a second positioner configured to position the substrate support; and a projection system configured to project a beam of radiation from the patterning device onto a substrate, wherein one or more selected from the group consisting of the patterning device support, the first positioner, the substrate support and / or the second positioner comprises an assembly according to any one of claims 2 to 10.

13. A magnet body for a planar motor, the magnet body comprising, during use, a plurality of superconducting coils configured to generate a 2D spatial alternating magnetic field during use, wherein, The plurality of superconducting coils are grouped into a set of separable and discrete modules that, when assembled, form the magnet body, each module comprising a subset of the plurality of coils.

14. The magnet body of claim 13, wherein, At least one module has a non-planar or multi-faceted external wall.

15. The magnet body of claim 14, wherein, Each of adjacent ones of the modules has a non-planar or multi-faceted external wall, and the non-planar or multi-faceted external walls are designed to interlock with one another.

16. The magnet body of claim 14 or claim 15, wherein, The non-planar or multi-faceted external wall has a portion that protrudes from an exterior of the module, and at least one coil is arranged to extend at least partially inside the portion.

17. The magnet body of any one of claims 14-16, wherein, The non-planar or multi-faceted external wall is a multi-faceted external wall comprising two generally planar sub-walls that meet to form a line.

18. The magnet body of any one of claims 13-17, wherein, The superconducting coils are configured to generate a 2D spatially alternating magnetic field during use.

19. The magnet body of any one of claims 13 to 18, wherein, At least one module has an electrical interface for providing electrical power to a subset of one or more coils and / or a cooling interface for providing cooling for superconductivity of the subset of one or more coils, the electrical interface and / or cooling interface being at a wall other than one or more walls arranged to interface with an adjacent one or more modules.

20. A material processing or metrology apparatus comprising a magnet body according to any one of claims 13 to 19.

21. A lithographic apparatus comprising: a patterning device support configured to support a patterning device; a first positioner configured to position the patterning device support; a substrate support configured to hold a substrate; a second positioner configured to position the substrate support; and a projection system configured to project a beam of radiation from the patterning device onto a substrate, wherein one or more selected from the group consisting of the patterning device support, the first positioner, the substrate support and / or the second positioner comprises a magnet body according to any one of claims 13 to 19.

22. A module for a superconducting assembly of an actuator, the module comprising one or more superconducting coils of a plurality of superconducting coils of the assembly, the module having a multi-faceted or non-planar external wall.

23. The module of claim 22, wherein, The non-planar or multi-faceted external wall has a portion that protrudes from an exterior of the module, and at least one coil is arranged to extend at least partially inside the portion.

24. The module of claim 22 or claim 23, wherein, The non-planar or multi-faceted external wall is a multi-faceted external wall comprising two generally planar sub-walls that meet to form a line.

25. The module of any of claims 22 to 24, wherein, The non-planar or multi-faceted external wall is a multi-faceted external wall comprising a sawtooth configuration.

26. The module of any of claims 22 to 25, wherein, The module has a cross-section in a plane parallel to the layout of the plurality of superconducting coils that is non-rectangular.

27. A material processing or metrology apparatus comprising the module of any of claims 22-26.

28. A lithographic apparatus comprising: a patterning device support configured to support a patterning device; a first positioner configured to position the patterning device support; a substrate support configured to hold a substrate; a second positioner configured to position the substrate support; and a projection system configured to project a beam of radiation from the patterning device onto the substrate, wherein one or more selected from the group consisting of the patterning device support, the first positioner, the substrate support and / or the second positioner comprises the module of any of claims 22-26.

29. A lithographic apparatus assembly comprising: a patterning device support configured to support a patterning device; a first positioner configured to position the patterning device support; a substrate support configured to hold a substrate; a second positioner configured to position the substrate support; and a projection system configured to project a beam of radiation from the patterning device onto the substrate, wherein one or more selected from the group consisting of the patterning device support, the first positioner, the substrate support and / or the second positioner comprises an array of superconducting coils configured to cooperate with a mover and one or more superconducting coils configured to cooperate with an object separate from the mover, the array of superconducting coils and the one or more superconducting coils having a common cooling arrangement for providing cooling for superconductivity.

30. A superconducting assembly for an actuator, the assembly comprising an array of superconducting coils configured to cooperate with a mover of the actuator and one or more superconducting coils configured to cooperate with an object separate from the mover, the array of superconducting coils and the one or more superconducting coils having a common cooling arrangement for providing cooling for superconductivity.

31. The assembly of claim 29 or claim 30, wherein, The common cooling arrangement is arranged to provide a common cryostat environment for the array of superconducting coils and the one or more superconducting coils.

32. The assembly of any one of claims 29-31, wherein, The separate object comprises a second mover and the one or more superconducting coils form an array of superconducting magnets configured to cooperate with the second mover.

33. The assembly of claim 32, wherein, The second mover forms part of a drive system configured to displace one or more current carrying cables of the first mover.

34. The assembly of claim 30 or claim 31, wherein, The separate object cooperates with the one or more superconducting coils to apply a force and / or a torque to the assembly.

35. The assembly of any one of claims 30-34, wherein, The actuator is a moving coil planar actuator and the array of superconducting coils is configured to generate a 2D spatially alternating magnetic field.

36. The assembly of any one of claims 30-35, wherein, The superconducting coil array comprises, during use, a plurality of superconducting coils configured to generate a magnetic field, wherein the plurality of superconducting coils of the superconducting coil array are grouped into a plurality of modules that are separable and discrete, the plurality of modules forming the superconducting coil array when assembled, each module comprising a subset of one or more coils of the plurality of coils of the superconducting coil array.

37. The assembly of any one of claims 30-36, wherein, At least one module has a non-planar or multi-faceted exterior wall.

38. A material processing or metrology apparatus comprising the assembly of any of claims 30 to 37.

39. A lithographic apparatus comprising: a patterning device support configured to support a patterning device; a first positioner configured to position the patterning device support; a substrate support configured to hold a substrate; a second positioner configured to position the substrate support; and a projection system configured to project a beam of radiation from the patterning device onto the substrate, wherein one or more selected from the group consisting of the patterning device support, the first positioner, the substrate support and / or the second positioner comprises the assembly of any of claims 30 to 37.

40. A superconducting assembly for an actuator, the assembly comprising: a container, and a superconducting coil array configured to cooperate with a mover of the actuator, the superconducting coil array being arranged inside the container; a power supply for powering one or more coils of the superconducting coil array; wherein the superconducting assembly is configured to function as a balance mass during use, and wherein the power supply is mounted to the container of the superconducting assembly. The superconducting coil is configured to generate a 2D spatially alternating magnetic field during use.

41. The superconducting assembly of claim 40, wherein, The superconducting coil array is mounted to a thermally conductive plate of the assembly.

42. The superconducting assembly of claim 40 or 41, wherein, The container comprises a thermal shield.

43. The superconducting assembly of any of claims 40-42, wherein, The power supply comprises an input terminal configured to receive a power supply lead from a main power supply.

44. The superconducting assembly of any of claims 40-43, wherein, The power supply comprises an output terminal configured to receive a power supply lead for powering the one or more coils of the superconducting coil array.

45. The superconducting assembly of any of claims 40-44, wherein, 46. A lithographic apparatus comprising: a patterning device support configured to support a patterning device; a first positioner configured to position the patterning device support; a substrate support configured to hold a substrate; a second positioner configured to position the substrate support; and a projection system configured to project a beam of radiation from the patterning device onto the substrate, wherein one or more selected from the group consisting of the patterning device support, the first positioner, the substrate support and / or the second positioner comprises the assembly of any of claims 40 to 45.

47. A material processing or metrology apparatus comprising the superconducting assembly of any of claims 40 to 45. ​ ​

Images