Laminating process of cold plate and heating film

Abstract

The invention relates to a pressing process of a cold plate and a heating film. The pressing process comprises the following steps: mixing glue and a curing agent according to a mass ratio of (100: 1)-(110: 1); the cold plate is subjected to area covering in a closed environment, and then water-based glue is sprayed; baking the glued cold plate at 50-60 DEG C for 3-5 minutes to form a glue film; the heating film is attached to the adhesive film within 1-2 min, the adhesive film is placed in a profiling clamp to be rolled and exhausted, and appearance inspection and air tightness detection are conducted; staged hot pressing treatment is conducted, specifically, hot pressing is conducted for 4 min to 7 min at the temperature of 50 DEG C to 55 DEG C under the pressure of 2.3 MPa to 2.6 MPa, and then heat curing is conducted for 4 min to 7 min at the temperature of 100 DEG C to 110 DEG C under the pressure of 2.8 MPa to 3.2 MPa; and finally, standing at normal temperature to obtain a finished product. According to the process, a medium of an existing cold plate integrated heating film is replaced with the water-based glue, efficient integration of the cold plate and the heating film is achieved through the precisely-controlled pressing process, and the reliability and performance of a product are improved.

Description

Technical Field

[0001] This invention relates to the field of cold plate processing technology, and more specifically to a pressing process for cold plates and heating films. Background Technology

[0002] With the increasing demands on thermal management systems in industries such as automobiles and electronic devices, cold plate integrated heating film technology, as a highly efficient temperature control solution, is widely used in various application scenarios. The effective combination of cold plates and heating films enables precise temperature regulation, which is of great significance for improving equipment performance and extending its service life.

[0003] Currently, the bonding of cold plates and heating films is mainly achieved through adhesives. Waterborne polyurethane adhesives are widely used in the lamination process of cold plates and heating films due to their environmentally friendly and safe properties. CN105505279A discloses a waterborne adhesive comprising waterborne aliphatic polyurethane, deionized water, and a silane coupling agent, which can form a high-temperature resistant and corrosion-resistant adhesive layer. CN105670476A proposes a waterborne coating containing waterborne polyurethane resin and a waterborne isocyanate curing agent, which, after drying and curing, can form a coating with high hardness.

[0004] In the lamination process of cold-plate and heated film, the choice of adhesive and coating method have a decisive impact on the performance of the final product. CN107699152A discloses a coating process that improves the adhesion and aging resistance of the adhesive by using aliphatic waterborne polyurethane, and adds a blocked isocyanate curing agent to improve the adhesion, stability and water resistance of the coating. CN114736615B introduces a bonding process between substrates that utilizes the reaction between the functional groups contained in the main chain of thermoplastic polyurethane resin in the adhesive film and the coating on the substrate surface to enhance the bonding force between different materials.

[0005] Regarding adhesive coating film-forming processes, CN116651715A proposes a process that includes steps such as decontamination treatment, preparation of polyurethane adhesive, coating, ultraviolet irradiation treatment, preheating and molding, cooling and unloading. By combining high temperature and pressure, the polyurethane adhesive can form a film quickly in a short time, thereby improving the adhesive performance.

[0006] However, existing cold plate and heating film lamination processes still have some technical problems: First, small air bubbles are easily generated during the lamination process, affecting the appearance quality and performance of the product; second, existing adhesives generally have defects such as low thermal conductivity, short thermal cycle life, and insufficient toughness, making it difficult to meet the needs of high-performance applications; third, traditional single thermally conductive filler systems cannot simultaneously meet the requirements of high thermal conductivity and low interfacial thermal resistance, limiting the application areas of the product; finally, when using phase change materials, failure is easily caused by interfacial debonding, reducing the reliability and service life of the product.

[0007] Therefore, there is an urgent need to develop a cold plate and heating film pressing process that can solve the above problems, so as to improve the performance and reliability of the product and expand its application range. Summary of the Invention

[0008] To address the technical challenges of existing cold-plate integrated heating film solutions, such as air bubble problems during integration, limited application areas, inability to meet higher performance standards, low thermal conductivity of adhesives, short thermal cycle life, insufficient toughness, difficulty in balancing high thermal conductivity and low interfacial thermal resistance in traditional single thermally conductive filler systems, and the susceptibility of phase change materials to failure due to interfacial debonding, this invention provides a pressing process for cold-plate and heating film. This process aims to solve the air bubble and performance issues of integrated products, reduce costs and improve efficiency, enhance thermal conductivity, break through the thermal conductivity limits of traditional fillers, balance high shear strength and high toughness, improve interfacial bonding strength, and comply with environmental regulations.

[0009] The objective of this invention is achieved through the following technical solution: a pressing process for a cold plate and a heating film, comprising the following steps: S1. Preparation of water-based adhesive: Weigh the adhesive and curing agent (water-based polyisocyanate), mix the adhesive and curing agent in a mass ratio of 100:1 to 110:1, stir until uniform, and obtain water-based adhesive for later use; the curing agent is preferably water-based polyisocyanate. S2. Applying adhesive: Place the cold plate to be pressed in a closed environment, cover the areas on the cold plate that do not need to be sprayed, and use a spray gun to evenly spray the water-based adhesive prepared in step S1 onto the areas on the cold plate to be sprayed. S3. Baking: Transfer the coated cold plate to the baking device and bake it until the water-based adhesive forms a film on the cold plate and has a certain fluidity. S4. Applying heating film: Apply the heating film to the adhesive film formed on the cold plate, then place the cold plate with the heating film on it in the conformal fixture, and use a roller press to squeeze out the air bubbles between the cold plate and the heating film. After completion, perform an appearance inspection and an airtightness test on the cold plate. S5. Staged hot pressing: Transfer the conforming fixture processed in step S4 to the hot press, heat it to 50-55℃ for hot pressing, and then heat it to 100-110℃ for heat curing. S6. Standing: Transfer the thermosetting product to a room temperature environment and let it stand for 65-75 hours to obtain the cold plate integrated heating film product.

[0010] This invention effectively solves the bubble problem in the process of integrating heating film into cold plates by precisely controlling the glue ratio, coating process, baking temperature, bonding timing, hot pressing parameters, and settling time, thereby improving the overall performance and reliability of the product. Compared with existing methods that use silicone fiberglass cloth or epoxy resin curing adhesive, the preparation process of this invention has lower cost, higher efficiency, stronger performance, and better thermal conductivity.

[0011] Preferably, after the water-based adhesive is prepared in step S1, it is filtered with a 190-210 μm filter to remove impurities.

[0012] Preferably, in step S2, the distance between the spray gun and the cold plate is 60mm-70mm (to ensure more uniform spraying); a spray gun with a nozzle diameter of 3mm is selected, and the water-based adhesive is sprayed at a speed of 1-3cm / s; the thickness of the water-based adhesive is 45-55um.

[0013] Preferably, the baking temperature in step S3 is 50-60℃ and the baking time is 3-5 minutes.

[0014] Preferably, the heating film should be bonded to the cold plate within 1-2 minutes after baking in step S3.

[0015] Preferably, when performing staged hot pressing in step S5, a layer of silicone rubber with a thickness of 2.8-3.2mm needs to be placed on the surface of the heating film to ensure that the pressing is free of air bubbles; the physical properties of the silicone rubber are: density of 1.1-1.3g / cm, hardness of 20-80 Shore A, resilience of 70%-90%, and heat resistance range of -50~200℃.

[0016] Preferably, the pressure during hot pressing in step S5 is 2.3-2.6 MPa, and the processing time is 4-7 min.

[0017] Preferably, the pressure during the thermosetting process in step S5 is 2.8-3.2 MPa, and the processing time is 4-7 min.

[0018] In this invention, during the staged hot pressing process, the water-based adhesive has not yet cured in the hot pressing stage. This stage is mainly to remove air bubbles. The heat curing stage is mainly to give full play to the performance of the adhesive and effectively avoid the occurrence of air bubbles.

[0019] Preferably, the heating film used in step S4 comprises an upper PI film, a heating core, and a lower PI film arranged from top to bottom.

[0020] Preferably, the contour jig used in step S4 has a hollowed-out flow channel that corresponds to the shape of the heating core; this can effectively protect the flow channel in the heating core from damage.

[0021] Preferably, the adhesive comprises the following raw materials in parts by weight: The composition includes: 55-65 parts of waterborne polyurethane prepolymer, 4-8 parts of hydroxyl-terminated hyperbranched polyester, 3-7 parts of waterborne polyurethane dispersion, 1.5-2.5 parts of graphene nanosheets, 0.3-0.8 parts of carbon nanotubes, 4-8 parts of micron-sized aluminum nitride, 10-20 parts of nano-alumina, 8-12 parts of paraffin microcapsules, 1.0-1.5 parts of silane coupling agent, 0.8-1.2 parts of polyethyleneimine, 1-3 parts of polyethylene glycol, and 40-60 parts of deionized water.

[0022] Furthermore, the adhesive is prepared by the following method: A1. Place graphene nanosheets and carbon nanotubes in a Tris-HCl buffer solution at pH 8.5, add 0.5 mg / mL dopamine hydrochloride, and stir at 25-35℃ for 10-14 h to obtain polydopamine-coated functionalized carbon nanotubes for later use. A2. According to the weight parts, mix micron-sized aluminum nitride and nano-sized aluminum oxide, add ethanol-water solution of silane coupling agent (v / v=9:1), heat to 75-85℃ and reflux for 1-3 hours, dry to obtain modified thermally conductive filler for later use. A3. Disperse the paraffin microcapsules in an aqueous solution of polyethyleneimine and deionized water according to the weight parts, ultrasonically disperse for 20-40 min, centrifuge and wash, heat to 50-55℃ and vacuum dry to obtain the pretreated paraffin microcapsules for later use. A4. According to the weight parts, add the waterborne polyurethane prepolymer, hydroxyl-terminated hyperbranched polyester, waterborne polyurethane dispersion, and polyethylene glycol into a mixer, heat to 20-25℃ and stir at a rate of 2000-2300 rpm for 20-40 min to obtain predispersion A, for later use. A5. Add the functionalized nano-carbon obtained in step A1 and the modified thermally conductive filler obtained in step A1 to pre-dispersion A, heat to 20-25℃ and shear disperse at a rate of 2800-3200 rpm for 40-45 min, then add the pretreated paraffin microcapsules and stir at a rate of 1500 rpm for 8-12 min to obtain pre-dispersion B. Then place pre-dispersion B under a vacuum of -0.09 MPa for 10-20 min to degas and obtain the adhesive.

[0023] The adhesive in this invention is prepared using the above-mentioned raw materials and preparation method. The adhesive prepared using the above-mentioned raw materials has a thermal conductivity ≥2.5 W / m·K, a thermal cycle life ≥1000 cycles, a shear strength ≥5 MPa, and an elongation at break ≥400%, and can be mass-produced. Specifically, a primary cross-linked network is formed by reacting waterborne polyurethane prepolymer with hydroxyl-terminated hyperbranched polyester via a -NCO / -OH reaction. Soft segments in the waterborne polyurethane dispersion provide toughness, while polyethylene glycol, as a hydrophilic long chain, reduces interfacial tension. Graphene nanosheets / carbon nanotubes form continuous conductive and thermally conductive channels through π-π stacking. Carbon nanotubes and micron-sized aluminum nitride can synergistically fill the gaps, forming a highly efficient "bridge-gap" thermally conductive path. Paraffin microcapsules absorb / release heat around 48°C, reducing interfacial thermal stress. Silane coupling agent KH-560 and polyethyleneimine synergistically enhance the microcapsule-matrix interface bonding, suppressing phase change leakage. Through the above design, the resulting adhesive can effectively integrate the cold plate and heating film through a pressing process, ensuring the overall performance of the final cold plate integrated heating film product.

[0024] The beneficial effects of this invention are as follows: 1) This invention effectively solves the bubble problem in the process of integrating heating film into cold plate by precisely controlling the glue ratio, glue application process, baking temperature, bonding timing, hot pressing parameters and settling time, thereby improving the overall performance and reliability of the product; 2) Compared with traditional silicone fiberglass cloth or epoxy resin curing adhesive, the pressing process of the present invention has lower cost, higher production efficiency, stronger product performance, and better thermal conductivity. 3) The adhesive formulation used in this invention achieves excellent performance indicators such as thermal conductivity ≥2.5 W / m·K, thermal cycle life ≥1000 cycles, shear strength ≥5 MPa, and elongation at break ≥400% through the synergistic effect of gradient crosslinked waterborne polyurethane matrix, multi-level thermally conductive filler system, thermal management phase change system, and interface and curing system. 4) This invention breaks through the thermal conductivity limit of traditional single-scale fillers by using multi-level filler synergy (graphene nanosheets, carbon nanotubes, micron-sized aluminum nitride and nano-alumina) to form a highly efficient thermally conductive network. 5) The gradient crosslinking network (waterborne polyurethane prepolymer and hydroxyl-terminated hyperbranched polyester) introduced in this invention enables the adhesive to have both high shear strength and high toughness, significantly improving the mechanical properties and durability of the product. 6) The paraffin microcapsules in this invention are treated with polyethyleneimine for a second time, which increases the interfacial bonding strength by 40%, effectively solving the problem that phase change materials are prone to failure due to interfacial debonding. 7) This invention uses a fully water-based system with VOC < 50 g / L, which meets environmental protection regulations and is more environmentally friendly and safe. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of the roller press of the present invention; Figure 2 This is an exploded schematic diagram of the heating film of the present invention.

[0026] The attached diagram is labeled as follows: 1-heating film, 11-upper PI film, 12-heating core, 13-lower PI film, 2-cold plate, 3-contouring fixture, 31-hollowed-out flow channel, and 4-roller press. Detailed Implementation

[0027] To facilitate understanding by those skilled in the art, the following description is provided in conjunction with embodiments and appendices. Figure 1-2 The present invention will be further described below, and the content mentioned in the embodiments is not intended to limit the present invention. Example 1

[0028] See Figure 1-2 A pressing process for a cold plate and a heating film includes the following steps: S1. Preparation of water-based adhesive: Weigh the adhesive and curing agent, mix them in a mass ratio of 100:1 to 110:1, and stir until homogeneous to obtain the water-based adhesive for later use. The mass ratio of adhesive to curing agent can be 100:1, 105:1, or 110:1, and the curing agent is water-based polyisocyanate. In a preferred embodiment, the mass ratio of adhesive to curing agent is 105:1. After preparation, filter the water-based adhesive using a 200µm filter to remove impurities, ensuring that there are no impurity particles in the water-based adhesive.

[0029] The adhesive comprises the following raw materials in parts by weight: 60 parts of waterborne polyurethane prepolymer, 6 parts of hydroxyl-terminated hyperbranched polyester, 5 parts of waterborne polyurethane dispersion, 2 parts of graphene nanosheets, 0.5 parts of carbon nanotubes, 6 parts of micron-sized aluminum nitride, 15 parts of nano-alumina, 10 parts of paraffin microcapsules, 1.2 parts of silane coupling agent, 1 part of polyethyleneimine, 2 parts of polyethylene glycol, and 50 parts of deionized water; wherein, the waterborne polyurethane prepolymer is preferably a low-free MDI waterborne prepolymer (Lanxess W5610 series), the silane coupling agent is silane coupling agent KH-560, the hydroxyl-terminated hyperbranched polyester is HyPer H10 provided by Wuhan Hyperbranched Resin Technology, the waterborne polyurethane dispersion is PU-601 provided by PU-601, and the paraffin microcapsules are Micronal® DS 5008 X provided by BASF Germany.

[0030] The glue is prepared by the following method: A1. Place graphene nanosheets and carbon nanotubes in Tris-HCl buffer solution at pH 8.5, add 0.5 mg / mL dopamine hydrochloride, stir at 30°C for 12 h to obtain polydopamine-coated functionalized carbon nanotubes for later use. A2. According to the weight parts, micron-sized aluminum nitride and nano-sized aluminum oxide are mixed, and an ethanol-water solution of silane coupling agent (v / v=9:1) is added. The mixture is heated to 80°C and refluxed for 2 hours, then dried to obtain the modified thermally conductive filler for later use. A3. According to the weight parts, disperse the paraffin microcapsules in an aqueous solution of polyethyleneimine and deionized water, sonicate for 30 min, centrifuge and wash, heat to 52℃ and vacuum dry to obtain the pretreated paraffin microcapsules for later use. A4. According to the weight parts, add the waterborne polyurethane prepolymer, hydroxyl-terminated hyperbranched polyester, waterborne polyurethane dispersion, and polyethylene glycol into a mixer, heat to 22°C and stir at a rate of 2200 rpm for 30 minutes to obtain predispersion A, for later use. A5. Add the functionalized nano-carbon obtained in step A1 and the modified thermally conductive filler obtained in step A2 to pre-dispersion A, heat to 22℃ and shear disperse at 3000rpm for 42min, then add the pretreated paraffin microcapsules and stir at 1500rpm for 10min to obtain pre-dispersion B. Then place pre-dispersion B under -0.09MPa vacuum for 15min to degas and obtain adhesive.

[0031] S2. Applying Adhesive: Place the cold plate 2 to be pressed in a sealed environment. Cover the areas on the cold plate 2 that do not need to be sprayed. Use a spray gun to evenly spray the water-based adhesive prepared in step S1 onto the areas on the cold plate 2 to be sprayed. During spraying, the height of the spray gun from the cold plate 2 is 65mm; the water-based adhesive is sprayed at a speed of 2cm / s; the thickness of the water-based adhesive is controlled at 50um.

[0032] S3. Baking: Transfer the coated cold plate 2 to the baking device and bake until the water-based adhesive forms a film on the cold plate 2. The baking temperature is 55℃ and the baking time is 4 minutes to ensure that the water-based adhesive is fully dried and forms a uniform film layer.

[0033] S4. Applying Heating Film 1: Within 1.5 minutes after baking, apply heating film 1 onto the adhesive film formed on cold plate 2. Then, place the cold plate 2 with heating film 1 applied onto it into the conformal fixture 3. Use a roller press 4 to squeeze out any air bubbles between the cold plate 2 and heating film 1. After completion, perform a visual inspection and an airtightness test on the cold plate 2. Heating film 1 consists of an upper PI film 11, a heating core 12, and a lower PI film 13 arranged from top to bottom. The conformal fixture 3 has a perforated flow channel 31 corresponding to the shape of the heating core 12. This design ensures that heating film 1 can be completely adhered to cold plate 2 during the pressing process, avoiding air bubbles or wrinkles.

[0034] S5. Staged Hot Pressing: Transfer the conforming fixture 3 processed in step S4 to a hot press. First, heat it to 52℃ for hot pressing at a pressure of 2.5MPa for 5 minutes. Then, heat it to 105℃ for thermosetting at a pressure of 3.0MPa for 6 minutes. During staged hot pressing, a 3.0mm layer of silicone rubber should be placed on the surface of the heating film 1. The silicone rubber ensures uniform pressure distribution and prevents damage to the heating film 1 during the hot pressing process.

[0035] S6. Settling: Transfer the heat-cured product to a room temperature environment and let it stand for 70 hours to obtain the product of cold plate 2 integrated with heating film 1. The settling process allows the adhesive to fully cure, improving the bonding strength between cold plate 2 and heating film 1.

[0036] The cold plate 2 and heating film 1 pressed together by the above process have the following advantages: (1) Water-based adhesive is used, which is environmentally friendly and non-toxic; (2) The generation of bubbles and wrinkles is effectively avoided by the staged hot pressing process; (3) The addition of thermally conductive fillers such as graphene nanosheets and carbon nanotubes improves the thermal conductivity of the product; (4) The addition of paraffin microcapsules can improve the flexibility of the adhesive and reduce the impact of thermal stress on the product; (5) The product has good airtightness and durability.

[0037] The difference between Examples 2-3 and Example 1 is as follows: As shown in Table 1, the rest of the contents of Examples 2-3 are the same as those of Example 1, and will not be repeated here.

[0038] Table 1

[0039] The performance of the water-based adhesive prepared in Example 1 was tested, and the test results are as follows.

[0040] 1. 180° peel strength: At 23℃, peel strength ≥4N / cm; at 65℃, peel strength ≥4N / cm; at -40℃ (-50℃), peel strength ≥5N / cm; 2. Dynamic shear strength: At 23℃, dynamic shear strength ≥ 5 MPa; at 85℃, dynamic shear strength ≥ 1 MPa; at 65℃, dynamic shear strength ≥ 2 MPa; at -40℃ (-50℃), dynamic shear strength ≥ 2 MPa. 3. Pull-out strength: At 23℃, the pull-out strength is ≥5MPa; at 85℃, the pull-out strength is ≥1MPa; at 65℃, the pull-out strength is ≥2MPa; at -40℃ (-50℃), the dynamic shear strength is ≥2MPa.

[0041] 4. High temperature and high humidity aging: Place the samples in an ambient temperature chamber at (85±2)℃ and humidity at 85%±5% RH, avoiding contact with the chamber walls. Take out 5 samples every 400 hours, measure and record the bonding strength at room temperature. Stop the test when the cumulative test time reaches 1600 hours. After completing 1600 hours of high temperature aging, the bonding strength of the water-based adhesive between the heating film 1 and the cold plate 2 should decrease by ≤20% (peeling, shearing, pull-out).

[0042] 5. Temperature shock: Place the sample in a constant temperature and humidity test chamber, set the temperature to -40℃ and let it stand for 15 minutes. Then, raise the temperature from -40℃ to 85℃ in 5 minutes, maintain the temperature at 85℃ for 15 minutes, and then lower the temperature from 85℃ to -40℃ within 5 minutes. This is one cycle (approximately 40 minutes). A total of 1600 cycles are tested, with measurements taken every 400 cycles until all cycles are completed. After 1600 temperature shocks, the adhesion strength of the water-based adhesive between the heating film 1 and the cold plate 2 is measured to be ≤20% (peeling, shearing, and pulling).

[0043] As can be seen from the above, the water-based adhesive made using the raw materials of this invention has excellent thermal conductivity, mechanical properties, etc., and has broad market prospects and application value.

[0044] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A cold plate and heating film lamination process, characterized by: Comprising the following steps: S1, preparing water-based glue: weigh glue and curing agent, mix glue and curing agent according to the mass ratio of 100:1~110:1, stir until uniform, get water-based glue, standby; S2, gluing: place the cold plate to be pressed in a closed environment, cover the area of the cold plate that does not need to be sprayed, use a spray gun to uniformly spray the water-based glue prepared in step S1 on the cold plate; S3, baking: transfer the cold plate with glue to the baking device, bake until the water-based glue forms a glue film on the cold plate; S4, laminating heating film: laminating the heating film on the glue film formed on the cold plate, then placing the cold plate with heating film in the profiling fixture, using a roller press to extrude and remove the air bubbles between the cold plate and the heating film, then performing appearance inspection and air tightness test on the cold plate; S5, hot pressing in stages: transfer the profiling fixture treated in step S4 to the hot press, heat to 50-55℃ for hot pressing, then heat to 100-110℃ for heat curing; S6, standing: transfer the heat-cured product to a normal temperature environment and stand for 65-75h to obtain the product of cold plate integrated with heating film.

2. The cold plate and heating film compression process of claim 1, wherein: After the preparation of water-based glue in step S1, filter the impurities with a 190-210um filter screen.

3. The cold plate and heating film compression process of claim 1, wherein: In step S2, the height of the spray gun from the cold plate during gluing is 60-70mm; the spray gun sprays water-based glue at a speed of 1-3cm / s; the thickness of the sprayed water-based glue is 45-55um.

4. The cold plate and heating film compression process of claim 1, wherein: The temperature of the baking process in step S3 is 50-60℃, and the baking time is 3-5min.

5. The cold plate and heating film compression process of claim 1, wherein: The heating film needs to be laminated with the cold plate within 1-2min after baking in step S3.

6. The cold plate and heating film compression process of claim 1, wherein: In step S5, a layer of silicone skin material with a thickness of 2.8-3.2mm needs to be placed on the surface of the heating film during hot pressing in stages.

7. The cold plate and heating film compression process of claim 1, wherein: The pressure during hot pressing in step S5 is 2.3-2.6MPa, and the processing time is 4-7min.

8. The cold plate and heating film compression process of claim 1, wherein: The pressure during heat curing in step S5 is 2.8-3.2MPa, and the processing time is 4-7min.

9. The cold plate and heating film compression process of claim 1, wherein: The heating film used in step S4 includes an upper PI film, a heating core, and a lower PI film arranged from top to bottom.

10. The cold plate and heating film compression process of claim 1, wherein: The profiling fixture used in step S4 is provided with a hollow channel corresponding to the shape of the heating core.

Images