114results about How to "Evenly bonded" patented technology

A compound punching film and preparation thereof, said punching film consisting of a layer of plastic film and one or two side compound non-woven fabrics. On plastic film is of evenly spread tiny mesh, density thereof is 170-500 mesh / C sqm ,perforating rate is 10-35%. Said whole compound film is perforated of evenly big mesh , aperture thereof greater than that of tiny mesh two times, the shape of big mesh is of funnel, thereof protruding to one side and on the surface of awl is of tiny mesh. Said invention combines PE film technique and punching one, making compound of a layer of non-woven fabric and cast film with the help of high melting temp. of cast film, also making use of mesh cage through vacuum suction nozzle punching tiny mesh, thereafter punching big mesh by pressure roller machine, thus to prepare new compound punching film with good permeability, softness and strong third dimension.

The process for producing a magnet according to the invention is characterized by comprising a first step in which a heavy rare earth compound containing Dy or Th as a heavy rare earth element is adhered onto a sintered compact of a rare earth magnet and a second step in which the heavy rare earth compound-adhered sintered compact is subjected to heat treatment, wherein the heavy rare earth compound is a Dy or Th iron compound.

A safety helmet structure and a processing method thereof. The safety helmet includes a first section, a second section and an extension section defined between the first and second sections. The first section is sprayed with a figure. A decorative section or a figure layers is adhered to the second section. After a periphery of the decorative section or figure layer partially passes over an edge of the second section, the periphery of the decorative section or figure layer enters the extension section. The first and second sections together form a helmet subassembly. The helmet subassembly is placed in a mold and integrally bonded with a buffer material or foam material filler to form a helmet assembly.

A polymer film including an adhesive layer, which can be peeled off with heat, is bonded to the upper surface of a semiconductor layer. Then, a KrF excimer laser light beam is applied to a surface of a substrate opposite to the semiconductor layer. This causes local heating at the laser spot, so that the bonding of atoms is cut off at the interface between the semiconductor layer and the substrate, thereby forming a thermal decomposition layer between the substrate and the semiconductor layer. Subsequently, the substrate is heated at a given temperature, so that the adhesive layer foams to lose its adhesive power. As a result, the polymer film is easily peeled off from the semiconductor layer.

A filter medium for an air filter, characterized in that it comprises a filter material having a glass fiber as its primary component and an alkyl ketene dimer adhered to the surface of the glass fiber; and a method for producing the filter medium which comprises a step of subjecting a dispersed slurry of a raw material fiber to a wet papermaking to form a wet paper, a step of immersing the wet paper in an aqueous dispersion or solution of the dimer or a liquid mixture of the dimer and a binder resin, or applying or spraying any of the above-mentioned liquids to the wet paper, to thereby allow the dimer to adhere onto the surface of the glass fiber, and a step of drying the resultant wet paper having the dimer adhered thereto. The filter medium exhibits a reduced amount of an out gas generated when it is used with ventilation and also exhibits high water-repellency and satisfactory strength in various applications such as air conditioning of a building and semiconductor manufacturing.

The invention belongs to the technical field of facing decoration materials and particularly relates to a seamless embroidery wall fabric which has a simple sticking method, strong artistry and low possibility of crinkling after being pasted with a wall surface. The seamless embroidery wall fabric comprises embroidery traycloth with embroidery patterns, wherein a wall paper base paper layer is bonded on the back side of the embroidery traycloth by an EVA (Ethylene Vinyl Acetate Copolymer) adhesive film layer. The invention also discloses a production method of the seamless embroidery wall fabric. According to the production method, the produced seamless embroidery wall fabric is full of exquisite embroidery patterns, width wall fabric products can be obtained and the defects that the wall fabric produced by a traditional method is not high in artistry, easy to crinkle and can be only produced into narrow products are overcome.

A wafer bonding process that compensates for curvatures in wafer surfaces, and a wafer stack produced by the bonding process. The process entails forming a groove in a surface of a first wafer, depositing a bonding stack on a surface of a second wafer, aligning and mating the first and second wafers so that the bonding stack on the second wafer contacts a bonding site on the first wafer, and then heating the first and second wafers to reflow the bonding stack. The groove either surrounds the bonding site or lies entirely within the bonding site, and the heating step forms a molten bonding material, causes at least a portion of the molten bonding material to flow into the groove, and forms a bonding structure that bonds the second wafer to the first wafer. Bonding stacks having different lateral surface areas can be deposited to form bonding structures of different heights to compensate for variations in the wafer gap.

The invention discloses a method for manufacturing an interior film-pasting woven bag, and relates to the technical field of woven bag manufacturing. The interior film-pasting woven bag comprises an outer plastic bag body formed by weaving polypropylene plastics. An ethylene-vinyl acetate film and a high-pressure low-density polyethylene film are sequentially arranged in the outer plastic bag body. The method includes the following operation steps: A, manufacturing plastic ribbon-like filaments; B, manufacturing the two films; C, manufacturing the outer plastic bag body with the double films; D, manufacturing an interior film-pasting woven bag reel by an interior film pasting combining machine through the outer plastic bag body, obtained in the step C, with the double films; and E, carrying out cutting and sewing on the interior film-pasting woven bag reel obtained in the step D, and completing manufacturing of the interior film-pasting woven bag. Compared with the prior art, the method can solve the problem that an inner bag body of an existing interior film-lining woven bag is prone to being damaged.

A laminating device 10 is provided with pressurization correcting mechanisms 32a to 32d which perform pressurization while adjusting working pressure so that the load distribution of a pressurizing plate 19 is equalized in accordance with load displacement by detecting the load displacement of the pressurizing plate 19 when both substrates W1, W2 are laminated.

A waterproof storage bag which comprises a bag body having an open end and a bag opening provided at the open end of the bag body to seal the bag body. The bag opening has inner surfaces which are smooth surfaces made of smooth and soft plastic material and the inner surfaces do not contain any self-adhesive material and are not disposed with any additional adhesive material thereon. A multi-porous resilient member is provided inside the bag body. It is an object of the present invention to provide a waterproof bag which could indicate to a user whether its waterproof function is still functioning properly. It has the advantages of simple structure, easy operation and low manufacturing costs.

Provided, among other things, is a slowly dissolvable film comprising: herbal bioactive agent(s); and polymer(s), dissolvable in the aggregate, wherein the film becomes adhesive as it is placed against a mucosal surface and begins to absorb moisture therefrom.

The invention discloses a preparation method of an activated carbon composite melt-blown fabric. A melt-blown melt is sprayed by using a fluidized state high-temperature high-pressure gas containing activated carbon particles as traction gas, in the process, a gas-liquid-solid three-phase mixed flow field is sprayed forwards, and finally, the melt is cooled and formed and cured in the form of a fiber mesh structure; meanwhile, activated carbon evenly adheres to and is constrained in the fiber mesh structure, and finally the stable activated carbon composite melt-blown fabric is formed. The activated carbon composite melt-blown fabric is soaked in a traditional Chinese medicine extract, so that the melt-blown fabric has the effects of sterilizing, disinfecting, respiratory tract resistanceimprovement, odor freshening and the like. The invention also discloses the activated carbon composite melt-blown fabric obtained through the preparation method and a mask using the activated carbon composite melt-blown fabric. The filtering, sterilizing and protecting effects are good.

A process for preparing diffusion-type alloy steel powder uses water-atomized pure iron powder and powdered alloy elements as raw materials, and includes mixing and diffusion steps. It can be used for high-density and high-strength powder metallurgy with the advantages of low cost and excellent performance.

A laminating apparatus and method of fabricating a display device are provided. According to an exemplary embodiment of the present disclosure, the laminating apparatus includes a first jig, which is configured to fix a window having curved surfaces, and a second jig, which includes a pressure pad facing the first jig. The pressure pad includes a top surface, which is convex toward the first jig, and depressed portions, which are inwardly depressed from side surfaces, respectively.

A high strength, lightweight building structure comprising a high-strength connection to a foundation, high-strength eaves, and high-strength structural panels. The fiber reinforced, high-strength structural panels form the walls, ceiling, roof, soffit, and eave of the structure. The panels comprise a rigid foam core having outer membrane layer, panel spacers, and sheeting. The high-strength foundation connection comprises a continuous seam plate with bonding agents, mechanical fasteners, and a metal bearing cap having continuously spaced, angle-shaped anchor studs welded to the metal bearing cap. The high-strength eave structure, comprise of a soffit panel connected to an inclined eave panel, a connection bracket and a rigid wedge continuously bonded between the ceiling panel and roof panel, thus forming a sealed, non-vented attic space.

The invention discloses a uniform-stirring adhesive stirring device. The uniform-stirring adhesive stirring device comprises a housing and a housing cover, wherein the bottom of the internal cavity of the housing is fixedly connected with the bottom of a motor box, a motor is fixedly mounted in the motor box, one end of an output shaft of the motor penetrates through a top plate of the motor box and is fixedly connected with the bottom end of a connecting rod, the top end of the connecting rod is fixedly connected with the bottom of a stirring barrel, and snapping blocks are fixedly mounted at the top of the housing. According to the uniform-stirring adhesive stirring device, through arranging the motor, the connecting rod and the stirring barrel which are matched with one another, materials for preparing an adhesive are mixed and stirred and are melted so as to form the adhesive; through arranging the snapping blocks and forming snapping grooves in the housing cover, the housing cover is in snap connection with the housing; through a fixing shaft, stirring shafts, stirring plates and stirring screens which are matched with one another, the area of contact of various kinds of liquid can be larger during the stirring of the stirring device, so that the adhesive is mixed more uniformly, and thus, a uniform stirring effect is achieved.

A wafer bonding process that compensates for curvatures in wafer surfaces, and a wafer stack produced by the bonding process. The process entails forming a groove in a surface of a first wafer, depositing a bonding stack on a surface of a second wafer, aligning and mating the first and second wafers so that the bonding stack on the second wafer contacts a bonding site on the first wafer, and then heating the first and second wafers to reflow the bonding stack. The groove either surrounds the bonding site or lies entirely within the bonding site, and the heating step forms a molten bonding material, causes at least a portion of the molten bonding material to flow into the groove, and forms a bonding structure that bonds the second wafer to the first wafer. Bonding stacks having different lateral surface areas can be deposited to form bonding structures of different heights to compensate for variations in the wafer gap.

A method of making a bread product comprising formulating and mixing a bread dough having flour as a major ingredient, and having the following additional ingredients, where percentages are based on the flour weight:Ingredients%Salt 1.8-2.3Yeast3.0; 2.5-4.5Sweetener 0.3-2.0Gluten 0.5-4.0L-Cysteine  10-100 PPMWater  50-65Oxidant 0.1-0.5Enzymes0.01-0.5Gum0.01-0.5pre-forming the dough into open molds shaped suitably for the bread product;pre-proofing the dough for less than 30 minutes in at least 70% relative humidity at a temperature in the range of 80° F. to 100° F.;freezing the pre-proofed dough to a temperature below 0° C.;partially defrosting the dough for a period of time of 60 minutes or less; andplacing the partially defrosted dough in a pre-heated oven at a temperature of about 170° C. to 180° C. to produce the bread product in less than 3 hours.

A conductive member for a non-contact type data carrier such as a wireless tag is simply and cheaply manufactured. A method for manufacturing a conductive member for a non-contact type data carrier comprises: a printing process during which, while a base material (4) is run, a bonding agent layer (5) is printed in a predetermined pattern on the surface thereof, and is dried; a bonding process during which a conductive layer (6) is laminated on the surface of the bonding agent layer (5) for heating and bonding; a punching process during which the conductive layer (6) is punched in the above-described pattern on the base material (4); and a separating process during which an unnecessary portion (6b) of the conductive layer (6) is separated from the base material (4). Accordingly, a conventional multilayered laminated sheet is not required to realize reduction in the material.

A spherical lens (K) for an optoelectronic module has a plane surface that is provided with a solderable metal coating (M). The spherical lens (K) is soldered by means of its plane, metallized surface (M) onto a solder pad (P) applied to the substrate (T).

The invention belongs to the field of crystal growth, and relates to a seed crystal bonding method for growing SiC crystals. The seed crystal bonding method for growing high-quality SiC crystal comprises the following steps of: (1) printing a silk screen; (2) bonding the seed crystals; and (3) curing an adhesive for bonding the seed crystals and a seed crystal support, wherein the thickness of the cured adhesive layer is 7-10 microns. The seed crystal bonding method for growing the high-quality SiC crystals provided by the invention can ensure uniform distribution of the thickness of the adhesive layer between the seed crystals and the seed crystal support and avoid cracking caused by non-uniform mechanical stress and heat stress; and meanwhile, the temperature gradient distribution of the seed crystals is uniform, thereby being beneficial to the uniform growth of the SiC crystals, and further improving the quality of the SiC crystals.

A water absorbing agent and a method for producing the water absorbing agent are disclosed. Water absorbent resin particles having an internal cross-linked structure obtained by polymerizing a water-soluble unsaturated monomer, organic acid, and water-soluble multivalent metal salt are mixed, so that it is possible to provide a water absorbing agent which suppresses permeation of metal components into the water absorbent resin particles and enables the metal components to evenly adhere to an entire surface of the water absorbent resin in a dot manner.

A method for bonding glass components using an encapsulated photo-initiated optical adhesive, and the resulting glass assemblies produced by the same. A mixture containing a catalyst and a resin is provided where at least one of either the catalyst or the resin is encapsulated. The mixture is applied to a glass component. The encapsulated catalyst may then be exposed to ultraviolet light causing the capsules to release the portions contained therein and combine to form an adhesive. A second glass component is then placed on the adhesive so that the adhesive is interposed between the glass components and the adhesive is permitted to cure. Alternatively, the mixture may be exposed to UV light after the second glass component is placed. An exemplary method uses a frame with the first glass component to create a uniform thickness of adhesive and provide a low level of optical defects. Barrier coats and skirting tape may also be used.

An adhesive wound patch is provided. The adhesive wound patch includes a covering layer, a dressing layer, a releasing paper and a supporting layer. A pressure sensitive adhesive is coated on an inner surface of the covering layer, and the pressure sensitive adhesive with stickiness may adhere to the surrounding skin tightly. The dressing layer covers the pressure sensitive adhesive, the covering layer includes waterproof-breathable material, and the dressing layer includes hydro-absorbent material. The releasing paper includes separated first and second portions, and covers the entire covering layer. The supporting layer sticks to the covering layer, and has an ear portion, which is in the middle part of one side of the supporting layer and protrudes beyond the edge of the covering layer. After the dressing layer is adhered to the wound, the supporting layer is separated from the covering layer by tearing off the ear portion.

The ultrasonic mounting method is capable of uniformly bonding bumps of an electronic component to a circuit board and improving reliability of ultrasonic-mounting the electronic component. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. The ultrasonic vibrations are applied in a direction parallel to a surface of the electronic component, and loads are vertically applied to the surface of the electronic component in conjunction with vibration cycles of the ultrasonic vibrations.

Ambulatory monitors and related methods employ an adhesive layer with conductive and non-conductive regions to improve electrical isolation of electrodes. An ambulatory monitor includes a biocompatible layer, first and second electrodes, an adhesive layer, and a physiological data recording module. The adhesive layer is interfaced with the biocompatible layer and configured to adhere the biocompatible layer to the user's skin. The adhesive layer has a first conductive adhesive region comprising a conductive adhesive electrically coupled with the first electrode, a second conductive adhesive region comprising a conductive adhesive electrically coupled with the second electrode, and a non-conductive adhesive region comprising a non-conductive adhesive. The non-conductive adhesive region serves as an electrical insulator between the first conductive adhesive region and the second conductive adhesive region. The physiological data recording module is configured to store physiological data of the user generated from an electrical signal from the first and second electrodes.

The invention provides a tipipenem pectin granule and a preparation method thereof, and relates to the technical field of medicine and its preparation. A tipipenem granule, comprising the following raw materials in parts by weight: 600 to 700 parts of tipipenem, 3500 to 4500 parts of diluent, 40 to 50 parts of hydroxypropyl cellulose, and 455 to 470 parts of coating agent I 380-400 parts of coating agent II, the coating agent I is composed of ethyl cellulose suspension and talcum powder at a weight ratio of 10-20:1, the coating agent II is composed of gastric-soluble acrylic resin, Talc powder, hydroxypropyl methylcellulose and aspartame are composed in a weight ratio of 25-40:1-3:1:1.5-2.5. The tipipenem ester granule of the present invention uses tipipenem ester as the main drug, strictly screens and controls the ingredients of the excipients, optimizes the proportion, has stable drug efficacy under high temperature and high humidity environment, safe quality, high dissolution rate and excellent process. Easy to control and suitable for industrial production.

A high strength, lightweight building structure comprising a high-strength connection to a foundation, high-strength eaves, and high-strength structural panels. The fiber reinforced, high-strength structural panels form the walls, ceiling, roof, soffit, and eave of the structure. The panels comprise a rigid foam core having outer membrane layer, panel spacers, and sheeting. The high-strength foundation connection comprises a continuous seam plate with bonding agents, mechanical fasteners, and a metal bearing cap having continuously spaced, angle-shaped anchor studs welded to the metal bearing cap. The high-strength eave structure, comprise of a soffit panel connected to an inclined eave panel, a connection bracket and a rigid wedge continuously bonded between the ceiling panel and roof panel, thus forming a sealed, non-vented attic space.

A vehicle body structure includes a reinforcing member formed of a fiber reinforced resin and having a plate shape or a sheet shape and a metallic vehicle framework member. The vehicle framework member includes a rear wall portion and a reinforcing portion, one end face of the reinforcing member in a thickness direction of the reinforcing member being bonded to the rear wall portion and the reinforcing portion being disposed on the rear wall portion and protruding along a vertical direction from the rear wall portion.