Placode binder and binding method

A technology for bonding devices and substrates, used in optics, instruments, electrical components, etc., can solve the problems of uneven substrate spacing, difficulty in making stable products, and increased device weight, preventing uneven substrate spacing and reducing display. Poor phenomenon, the effect of keeping the parallelism uniform
CN1530714AInactive Publication Date: 2004-09-22FUJITSU LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
FUJITSU LTD
Publication Date
2004-09-22
Estimated Expiration
Not applicable · inactive patent

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Abstract

A laminating device 10 is provided with pressurization correcting mechanisms 32a to 32d which perform pressurization while adjusting working pressure so that the load distribution of a pressurizing plate 19 is equalized in accordance with load displacement by detecting the load displacement of the pressurizing plate 19 when both substrates W1, W2 are laminated.
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Description

technical field

[0001] The present invention relates to a substrate bonding device and a substrate bonding method. Specifically, it is suitable for making a bonded substrate (board / panel) from two substrates such as a liquid crystal display device (Liquid Crystal Display: LCD). ) substrate bonding device and substrate bonding method used.

[0002] In recent years, flat display panels such as LCDs have been required to be further reduced in cost due to progress in size and weight reduction (thinning). Therefore, there is a demand for an apparatus for bonding two substrates to manufacture a display panel that can improve yield and productivity. Background technique

[0003] Liquid crystal display panels are arranged at extremely narrow intervals (about a few μm) on an array substrate in which a plurality of TFTs (thin film transistors) are made into a matrix (matrix), and color filters (red, green, blue) and light-shielding filters are formed. A color filter (CF) substrate s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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