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Placode binder and binding method

A technology for bonding devices and substrates, used in optics, instruments, electrical components, etc., can solve the problems of uneven substrate spacing, difficulty in making stable products, and increased device weight, preventing uneven substrate spacing and reducing display. Poor phenomenon, the effect of keeping the parallelism uniform

Inactive Publication Date: 2004-09-22
FUJITSU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, there is a problem in the above-mentioned conventional bonding apparatus in that in order to reduce the deformation of the holding plate due to the pressure difference from the outside (atmospheric pressure) when the processing chamber is evacuated, the portion affected by the pressure difference High rigidity is required, therefore, the weight of the device increases, or the volume of the device increases, etc.
[0009] In recent years, with the increase in the size and thickness of the substrate, it is difficult to ensure a certain degree of flatness of the holding plate in the processing stage, and it is difficult to maintain the parallelism of the two substrates with high precision.
Therefore, when bonding large and thin substrates, it is particularly easy to cause dislocation and uneven substrate spacing during bonding
[0010] Such substrate misalignment and uneven spacing between substrates are the cause of display defects such as light leakage from the light-shielding portion and display unevenness, making it difficult to manufacture stable products and causing a decrease in yield.

Method used

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Examples

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no. 1 example

[0028] Below, according to Figure 1 to Figure 5 The first embodiment embodying the present invention will be described.

[0029] figure 1 It is a front view showing a schematic structure of a substrate bonding apparatus (hereinafter referred to as bonding apparatus) 10 of the first embodiment, figure 2 is a top view of the bonding device 10, image 3 It is a partially enlarged view of the bonding device 10 . This bonding apparatus 10 bonds two kinds of first and second substrates W1 and W2 supplied with liquid crystal dropwise in advance to one of them to form a liquid crystal display panel.

[0030] Moreover, the liquid crystal display panel produced by this embodiment is an active matrix type liquid crystal display panel, the first substrate W1 is a color filter substrate (CF substrate) on which a color filter or a light-shielding film is formed, and the second substrate W1 is a color filter substrate (CF substrate). W2 is an array substrate (TFT substrate) on which TF...

no. 2 example

[0077] Below, according to Image 6 and Figure 7 A second embodiment embodying the present invention will be described.

[0078] In addition, in the present embodiment, the same reference numerals are assigned to the parts having the same configuration as those in the above-mentioned first embodiment, and description thereof will be omitted.

[0079] Image 6 It is a side view showing a schematic structure of a substrate bonding device (hereinafter referred to as bonding device) 50 of the second embodiment, Figure 7 is along Image 6 A cross-sectional view of bonding apparatus 50 taken along line A-A is shown. Similar to the first embodiment, the bonding device 50 bonds the first and second substrates W1, W2 to form a liquid crystal display panel.

[0080] like Image 6 As shown, the bonding apparatus 50 includes an inner cavity 51, and a pressure plate 52 for absorbing and holding the first substrate W1 is provided in an upper container 51a of the inner cavity 51. Mo...

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Abstract

A laminating device 10 is provided with pressurization correcting mechanisms 32a to 32d which perform pressurization while adjusting working pressure so that the load distribution of a pressurizing plate 19 is equalized in accordance with load displacement by detecting the load displacement of the pressurizing plate 19 when both substrates W1, W2 are laminated.

Description

technical field [0001] The present invention relates to a substrate bonding device and a substrate bonding method. Specifically, it is suitable for making a bonded substrate (board / panel) from two substrates such as a liquid crystal display device (Liquid Crystal Display: LCD). ) substrate bonding device and substrate bonding method used. [0002] In recent years, flat display panels such as LCDs have been required to be further reduced in cost due to progress in size and weight reduction (thinning). Therefore, there is a demand for an apparatus for bonding two substrates to manufacture a display panel that can improve yield and productivity. Background technique [0003] Liquid crystal display panels are arranged at extremely narrow intervals (about a few μm) on an array substrate in which a plurality of TFTs (thin film transistors) are made into a matrix (matrix), and color filters (red, green, blue) and light-shielding filters are formed. A color filter (CF) substrate s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13B30B1/18B30B15/00B30B15/14B30B15/24G02F1/1339H01L21/02
CPCG02F1/1303G02F1/1339
Inventor 远藤茂伊藤彰悦门脇徹二宫岛良政
Owner FUJITSU LTD
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