Chip calibration method and device, electronic equipment and storage medium

Abstract

Embodiments of the invention disclose a chip calibration method and apparatus, an electronic device and a storage medium. The method comprises the steps of obtaining a target process corner category of a target event camera chip; acquiring target working temperature information of the target event camera chip; a calibration data set is obtained, a target calibration scheme of the target event camera chip is selected from the calibration data set based on the target process corner category and the target working temperature information, and the calibration data set covers a data mapping relation among the process corner category, the working temperature information and the calibration scheme; and calibrating the target event camera chip based on the target calibration scheme. Therefore, the target calibration scheme is determined according to the process corner category of the event camera chip and the working temperature information of the event camera chip, the target calibration scheme is called, and the event camera chip is quickly and effectively calibrated, so that the performance of each event camera chip with different process corners in different temperature scenes meets application requirements, and the user experience is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, specifically to a chip calibration method, apparatus, electronic device, and storage medium. Background Technology

[0002] Currently, the performance of event camera chips exhibits temperature drift. For example, the performance of event camera chips deteriorates at low temperatures and improves at high temperatures. This means that the performance of event camera chips may not meet application requirements in different temperature scenarios, resulting in a poor user experience. Summary of the Invention

[0003] This application provides a chip calibration method, apparatus, electronic device, and storage medium. It can determine a target calibration scheme by the process corner category and operating temperature information of the event camera chip, call the target calibration scheme, and quickly and effectively calibrate the event camera chip. This enables the performance of event camera chips with different process corners to meet application requirements under different temperature scenarios, thereby improving the user experience.

[0004] In a first aspect, embodiments of this application provide a chip calibration method, including:

[0005] Obtain the target process corner category of the target event camera chip;

[0006] Obtain the target operating temperature information of the target event camera chip;

[0007] Obtain a calibration dataset, and select a target calibration scheme for the target event camera chip from the calibration dataset based on the target process corner category and the target operating temperature information. The calibration dataset covers the data mapping relationship between process corner category, operating temperature information and calibration scheme.

[0008] The target event camera chip is calibrated based on the target calibration scheme.

[0009] Secondly, embodiments of this application also provide a chip calibration apparatus, comprising:

[0010] The process corner category acquisition module is used to acquire the target process corner category of the target event camera chip;

[0011] The operating temperature information acquisition module is used to acquire the target operating temperature information of the target event camera chip;

[0012] The target calibration scheme determination module is used to acquire a calibration dataset and select a target calibration scheme for the target event camera chip from the calibration dataset based on the target process corner category and the target operating temperature information. The calibration dataset covers the data mapping relationship between process corner category, operating temperature information and calibration scheme.

[0013] The calibration module is used to calibrate the target event camera chip based on the target calibration scheme.

[0014] Thirdly, embodiments of this application also provide an electronic device, including a processor and a memory, wherein the memory stores a computer program, and when the computer program is executed by the processor, the electronic device performs the steps of any of the chip calibration methods provided in embodiments of this application.

[0015] Fourthly, embodiments of this application also provide a computer-readable storage medium storing a computer program thereon, which, when run on an electronic device, causes the electronic device to perform the steps of any of the chip calibration methods provided in embodiments of this application.

[0016] Fifthly, embodiments of this application also provide a computer program product, including a computer program stored in a computer-readable storage medium; when a processor of an electronic device reads the computer program from the computer-readable storage medium, the processor executes the computer program, causing the electronic device to perform the steps of any of the chip calibration methods provided in embodiments of this application.

[0017] The solution adopted in this application embodiment can obtain the target process corner category of the target event camera chip; obtain the target operating temperature information of the target event camera chip; obtain a calibration dataset; and select a target calibration scheme for the target event camera chip from the calibration dataset based on the target process corner category and target operating temperature information. The calibration dataset covers the data mapping relationship between process corner category, operating temperature information, and calibration schemes. Based on the target calibration scheme, the target event camera chip is calibrated. Thus, by determining the target calibration scheme through the process corner category and operating temperature information of the event camera chip, and calling the target calibration scheme, the event camera chip can be calibrated quickly and effectively. This ensures that the performance of each event camera chip with different process corners meets application requirements under different temperature scenarios, improving user experience. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of a system architecture for the chip calibration method provided in the embodiments of this application;

[0020] Figure 2 This is a schematic flowchart of one embodiment of the chip calibration method provided in this application.

[0021] Figure 3 This is a schematic flowchart of one embodiment of the chip calibration method provided in this application.

[0022] Figure 4 This is a schematic flowchart of one embodiment of the chip calibration method provided in this application.

[0023] Figure 5 This is a schematic flowchart of one embodiment of the chip calibration method provided in this application.

[0024] Figure 6 This is a schematic diagram of the chip calibration device provided in the embodiments of this application;

[0025] Figure 7 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] Furthermore, in the description of the embodiments of this application, the terms "first," "second," etc., are used only for distinguishing descriptions and should not be construed as indicating or implying relative importance. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0028] With the rise of event cameras, some manufacturers have already adopted mature Complementary Metal Oxide Semiconductor (CMOS) technology to mass-produce event camera chips. After studying multiple event camera chips mass-produced using a certain CMOS process, the inventors made the following discoveries:

[0029] (1) The performance of a single event camera chip exhibits temperature drift. That is, the performance of the event camera chip deteriorates in low-temperature scenarios (e.g., significantly increased static noise and decreased image contrast sensitivity), and the performance decline is more pronounced at lower temperatures. Conversely, the performance of the event camera chip improves in high-temperature scenarios (e.g., significantly reduced pixel bright spots and improved image contrast sensitivity), and the performance improvement is more pronounced at higher temperatures.

[0030] (2) Although the temperature drift trend of the performance of each event camera chip is generally consistent, as described in (1), due to the differences in manufacturing process conditions, the degree of temperature drift of the performance of multiple event camera chips belonging to different process angles in the same batch or different batches is different.

[0031] To address the issue that the performance of event camera chips may not meet application requirements in different temperature scenarios due to temperature drift, embodiments of this application provide a chip calibration method, apparatus, electronic device, and computer-readable storage medium.

[0032] The chip calibration method provided in this application embodiment can be applied to systems such as system architecture 100. Please refer to... Figure 1 ,like Figure 1 As shown, system architecture 100 may include terminal devices 101, 102, and 103, a network 104, and a server 105. Network 104 serves as the medium for providing communication links between terminal devices 101, 102, and 103 and server 105. Network 104 may include various connection types, such as wired or wireless communication links, or fiber optic cables, etc.

[0033] Users can use terminal devices 101, 102, and 103 to interact with server 105 via network 104 to receive or send messages, etc.

[0034] Terminal devices 101, 102, and 103 can be various electronic devices with displays and web browsing capabilities, including but not limited to smartphones, tablets, e-book readers, MP3 players (Moving Picture Eperts Group Audio Layer III), MP4 players (Moving Picture Eperts Group Audio Layer IV), laptops, and desktop computers. A terminal can be a device that includes both receiving and transmitting hardware, i.e., a device with receiving and transmitting hardware capable of performing bidirectional communication over a bidirectional communication link. The terminal and the server can communicate bidirectionally via a network.

[0035] Server 105 can be a server providing various services, such as a backend server supporting the pages displayed on terminal devices 101, 102, and 103. This server can be a standalone server, or a server network or cluster, including but not limited to computers, network hosts, single network servers, multiple network server sets, or cloud servers composed of multiple servers. Cloud servers consist of a large number of computers or network servers based on cloud computing.

[0036] It should be noted that the chip calibration method provided in this application embodiment can be executed by a server, with the server performing calibration calculations, and correspondingly, the chip calibration device is located in the server; the chip calibration method provided in this application embodiment can also be executed by a terminal device, with the terminal device performing calibration calculations, and correspondingly, the chip calibration device is located in the terminal device.

[0037] It should be understood that Figure 1 The number of terminal devices, networks, and servers shown is merely illustrative. Depending on implementation needs, any number of terminal devices, networks, and servers can be included. The terminal devices 101, 102, and 103 in this embodiment can specifically correspond to application systems in actual production.

[0038] The following detailed description, in conjunction with the accompanying drawings, illustrates that the executing entity in this embodiment is an electronic device capable of acquiring the target video. It should be noted that the order of description in the following embodiments is not intended to limit the preferred order of the embodiments. Although a logical order is shown in the flowcharts, in some cases, the steps shown or described may be performed in a different order than that shown in the accompanying drawings.

[0039] Please refer to Figure 2 The specific process of this chip calibration method can be summarized in steps 201 to 204, where:

[0040] Step 201: Obtain the target process corner category of the target event camera chip.

[0041] Among them, the target event camera chip refers to the event camera chip that needs to be calibrated.

[0042] The type of event camera chip can be adjusted according to actual needs, and this application embodiment does not impose any limitations. For example, the event camera chip can be a pure event camera chip with only event mode. Alternatively, the event camera chip can be a fusion camera chip that integrates event mode and traditional image frame mode. When the event camera chip is a fusion camera chip, its performance refers to the event perception performance of the event camera chip in event mode or hybrid mode.

[0043] By calibrating the target event camera chip, the performance of the calibrated event camera chip under different temperature scenarios can meet the application requirements.

[0044] Among them, the target process corner category refers to the process corner category to which the target event camera chip belongs among multiple process corner categories.

[0045] It should be noted that process corners refer to a series of extreme values ​​that the electrical characteristics of a transistor can reach under a specific manufacturing process. These extreme values ​​typically include the fastest, slowest, and typical device performance. Process corners include TT (Typical NMOS / Typical PMOS), FF (Fast NMOS / Fast PMOS), SS (Slow NMOS / Slow PMOS), FS (Fast NMOS / Slow PMOS), and SF (Slow NMOS / Fast PMOS). Among them, the TT process corner refers to the typical conditions of N-type metal-oxide-semiconductor (NMOS) and positive-channel metal-oxide-semiconductor (PMOS) transistors with n-type substrates, p-channels, and current carried by hole flow. The FF process angle refers to the NMOS and PMOS being at their fastest speeds, the SS process angle refers to the NMOS and PMOS being at their slowest speeds, the FS process angle refers to the NMOS being at its fastest speed and the PMOS being at its slowest speed, and the SF process angle refers to the NMOS being at its slowest speed and the PMOS being at its fastest speed.

[0046] Process corner category refers to the classification of process corners. There are various criteria for classifying process corners, which can be adjusted according to actual circumstances; this application does not impose any limitations. For example, process corners can be classified into five types: TT process corner, FF process corner, SS process corner, FS process corner, and SF process corner, resulting in five process corner categories. Alternatively, process corners can be classified into at least two categories based on the performance parameters of the event camera chip (such as static noise, image contrast sensitivity, pixel brightness parameters, etc.).

[0047] For example, such as Figure 4 As shown, the process corner categories include Class A and Class B. Class A includes TT, FS, and FF process corners, while Class B includes SS and SF process corners. Based on the performance parameters of the event camera chip, the process corner of the event camera chip is classified into either Class A or Class B.

[0048] It should be noted that, statistical analysis revealed that, in one optional embodiment, under specific process conditions, while the performance indicators such as static noise, image contrast sensitivity, and pixel brightness parameters for event camera chips corresponding to the five process corners (TT, FS, FF, SS, and SF) showed a consistent trend with temperature variation—becoming better at high temperatures and worse at low temperatures—the static noise of event camera chips corresponding to the SS and SF process corners was generally higher at room temperature and above. Therefore, process corner screening can be performed at the wafer testing end using static noise at room temperature to classify multiple event camera chips by process corner. Using the static noise of the TT process corner event camera chip at room temperature as a benchmark, process corners are classified into two categories: Category A and Category B. Event camera chips with static noise no higher than that of the TT process corner are classified into Category A, while those with static noise higher than that of the TT process corner are classified into Category B.

[0049] Step 202: Obtain the target operating temperature information of the target event camera chip.

[0050] The target operating temperature information refers to the temperature value or temperature range of the target event camera chip during operation. For example, the target operating temperature information refers to a specific temperature value (such as an operating temperature of 25°C). Another example is that the target operating temperature information refers to a temperature range (such as an operating temperature below 25°C).

[0051] There are various ways to obtain target operating temperature information, which can be adjusted according to actual conditions, and this application embodiment does not impose any limitations. For example, the operating temperature of the target event camera chip can be directly obtained through the temperature sensor inside the target event camera chip. Another example is that temperature information collected by external sensors of the target event camera chip can be obtained through software communication.

[0052] It should be noted that there are various standards for classifying working temperature information, which can be adjusted according to actual conditions. This application does not impose any restrictions on these standards.

[0053] In some optional embodiments, since the performance of event camera chips at different process stages deteriorates in low-temperature scenarios and improves in high-temperature scenarios, the operating temperature of event camera chips is classified based on room temperature. This can be divided into two temperature ranges: low temperature and room temperature and above. Specifically, the applicable operating temperature range for event camera chips is -40℃ to 80℃, and room temperature can be defined as 25℃. Therefore, the low temperature range is -40℃ to 25℃, and the room temperature and above range is 25℃ to 80℃.

[0054] In some optional embodiments, since the performance parameters of event camera chips with different process angles vary more complexly with temperature, such as no longer uniformly showing a trend of improvement at high temperatures and deterioration at low temperatures, the operating temperature information can be divided into more temperature ranges for subsequent refined calibration. For example, the operating temperature range applicable to event camera chips can be divided into three, four, or five segments, or even more. The specific division can be adjusted according to the actual situation, and the embodiments of this application do not impose any limitations.

[0055] Step 203: Obtain the calibration dataset and select the target calibration scheme for the target event camera chip from the calibration dataset based on the target process corner category and target operating temperature information. The calibration dataset covers the data mapping relationship between process corner category, operating temperature information and calibration scheme.

[0056] The calibration dataset refers to a collection of data consisting of multiple calibration schemes. A calibration scheme is a calibration method designed to improve the performance of an event camera chip.

[0057] The calibration scheme can be a pre-configured scheme for direct use by the subsequent event camera chip. The calibration scheme can also be a real-time updated scheme, and its specific implementation can be adjusted according to actual conditions; this application does not impose any limitations on this.

[0058] It should be noted that the calibration scheme is universal, meaning that when the operating temperature information and process angle category of the event camera chip correspond to the calibration scheme, the calibration scheme can be used to calibrate the event camera chip to improve its performance.

[0059] The data mapping relationship between process corner categories, operating temperature information, and calibration schemes can be one-to-one, meaning one process corner category and one operating temperature information correspond to one calibration scheme. Alternatively, the data mapping relationship can be many-to-one, meaning multiple combinations of process corner categories and operating temperature information correspond to one calibration scheme.

[0060] For example, please refer to Figure 4 , Figure 4 The illustrated embodiment has four calibration schemes: default configuration 0, calibration configuration 1, calibration configuration 2, and calibration configuration 3. Operating temperature information includes low temperature, room temperature, and above. Process corner categories include Class A and Class B process corner categories. For example... Figure 4 As shown, the Class A process corner category (process corner category) and ambient temperature and above (operating temperature information) correspond to the default configuration 0 (calibration scheme). The Class A process corner category (process corner category) and low temperature (operating temperature information) correspond to calibration configuration 1 (calibration scheme). The Class B process corner category (process corner category) and low temperature (operating temperature information) correspond to calibration configuration 2 (calibration scheme). The Class B process corner category (process corner category) and ambient temperature and above (operating temperature information) correspond to calibration configuration 3 (calibration scheme).

[0061] Among them, the target calibration scheme refers to the calibration scheme that can calibrate the target event camera chip so that the performance of the target event camera chip meets the standard under the corresponding target operating temperature information and target process angle category.

[0062] Specifically, based on the data mapping relationship between the process corner category, operating temperature information and calibration scheme covered by the calibration dataset, the calibration scheme corresponding to the target process corner category and target operating temperature is taken as the target calibration scheme.

[0063] Step 204: Based on the target calibration scheme, calibrate the target event camera chip.

[0064] Specifically, the target event camera chip is calibrated according to the specific content of the target calibration scheme so that the performance of the calibrated target event camera chip is improved.

[0065] The solution adopted in this application embodiment can be achieved by obtaining the target process corner category of the target event camera chip; obtaining the target operating temperature information of the target event camera chip; obtaining a calibration dataset; and selecting a target calibration scheme for the target event camera chip from the calibration dataset based on the target process corner category and target operating temperature information. The calibration dataset encompasses the data mapping relationship between process corner category, operating temperature information, and calibration schemes. Based on the target calibration scheme, the target event camera chip is calibrated. Thus, a target calibration scheme is determined by the process corner category and operating temperature information of the event camera chip. By calling this target calibration scheme, the event camera chip can be calibrated quickly and effectively, thereby ensuring that the performance of various event camera chips belonging to different process corners meets application requirements under different temperature scenarios, improving user experience.

[0066] There are multiple ways to obtain the target process corner category of the target event camera chip, and the specific method can be adjusted according to the actual situation. This application embodiment does not impose any restrictions.

[0067] In some optional embodiments, the process of obtaining the target process corner category of the target event camera chip may include: real-time detection of the performance index parameters of the target event camera chip to obtain the corresponding parameter values; obtaining the process corner determination rules of the performance index parameters, and determining the target process corner category of the target event camera chip based on the parameter values ​​and the process corner determination rules, wherein the process corner determination rules cover the data mapping relationship between parameter values ​​and process corner categories.

[0068] Among them, performance index parameters are used to indicate and measure the performance of the event camera chip (such as event perception performance). That is, its subjective and objective performance as an event camera. The specific content of the performance index parameters can be adjusted according to actual conditions, and this application embodiment does not impose limitations. For example, the performance index parameter is static noise. Another example is that the performance index parameters include static noise, image contrast sensitivity, and pixel brightness parameters.

[0069] Among them, the process corner determination rule refers to the rule used to determine the process corner category to which the event camera chip belongs. Specifically, the process corner determination rule covers the data mapping relationship between parameter values ​​and process corner categories. By determining the specific parameter values ​​of the event camera chip's performance indicators and the data mapping relationship between these specific parameter values ​​and the process corner category, the process corner category to which the event camera chip belongs is determined.

[0070] The data mapping relationship between parameter values ​​and process corner categories can also indicate the range of parameter values ​​or parameter thresholds corresponding to different process corner categories.

[0071] For example, please refer to Figure 4The performance parameter is static noise, and the threshold value is the static noise of the event camera chip at room temperature using a TT process corner. Static noise is detected on the target event camera chip to obtain its static noise level. If the static noise of the target event camera chip is not higher than the threshold value, the target process corner category is determined to be Class A. If the static noise of the target event camera chip is higher than the threshold value, the target process corner category is determined to be Class B.

[0072] Specifically, the performance parameters of the target event camera chip are detected to obtain the parameter values ​​of the target event camera chip under the specified performance parameters. By comparing these parameter values ​​with the parameter thresholds of the process corner determination rules, the target process corner category of the target event camera chip corresponding to these parameter values ​​is determined.

[0073] It should be noted that this embodiment is applicable to temporarily determining the target process corner category of the target event camera chip during packaging, or determining the target process corner category of the target event camera chip in real time, or determining the target process corner category of the target event camera chip in advance during wafer testing. The specific method can be adjusted according to the actual situation.

[0074] In some optional embodiments, if the target process corner category of the target event camera chip is determined in advance during wafer testing, the process of obtaining the target process corner category of the target event camera chip may further include: pre-detecting the target event camera chip to determine the target process corner category of the target event camera chip, and storing the target process corner category of the target event camera chip in a flag bit; when the user uses it, the flag bit is obtained in real time, and the target process corner category of the target event camera chip is determined based on the stored information in the flag bit.

[0075] The stored information of the identifier bit refers to the process corner category of the camera chip used to identify the event.

[0076] There are multiple ways to represent the information stored in the identifier bits, and the specific representation can be adjusted according to the actual situation. This application does not impose any limitations on this method. For example, process corner categories include Class A and Class B process corner categories, and the stored information in the identifier bits can be represented by A and B. Specifically, storing the identifier bit as A indicates that the corresponding process corner category is Class A, and storing the identifier bit as B indicates that the corresponding process corner category is Class B. As another example, process corner categories include TT, FF, SS, FS, and SF process corner categories, and the stored information in the identifier bits can be represented by TT, FF, SS, FS, and SF. Specifically, storing the identifier bit as TT indicates that the corresponding process corner category is TT, and other identifiers are determined according to this rule. For example, the process corner categories include TT process corner category, FF process corner category, SS process corner category, FS process corner category and SF process corner category. The storage information of the identifier bit can also be represented by 1-5. Among them, the storage information of the identifier bit is 1, which means that the corresponding process corner category is TT process corner category. The storage information of other identifier bits is determined according to this rule.

[0077] Please see Figure 2 ,like Figure 2 At the wafer testing end, the process corner category of each event camera chip is pre-tested and determined, and the corresponding flag bits are stored in the chip's OTP (One-Time Programmable) memory. At the application end, the initial parameter configuration for each event camera chip is the default configuration 0, with no initial calibration. During calibration, the process corner category and chip operating temperature of each event camera chip are directly obtained. The calibration partition to which each event camera chip belongs is determined based on the process corner category and chip operating temperature. After determining the calibration partition, the corresponding calibration scheme is called to calibrate the event camera chip. The event camera chips in the first calibration partition are calibrated using calibration configuration 1; the event camera chips in the second calibration partition still use the default configuration 0 without calibration update; the event camera chips in the third calibration partition are calibrated using calibration configuration 2; and the event camera chips in the fourth calibration partition are calibrated using calibration configuration 3. Calibration is performed directly at the wafer testing end and stored in the OTP.

[0078] In some optional embodiments, the calibration dataset described above encompasses data mapping relationships between multiple calibration partitions and multiple calibration schemes, with the calibration partitions determined jointly by process corner categories and operating temperature information.

[0079] Based on this, the process of selecting the target calibration scheme for the target event camera chip from the calibration dataset based on the target process corner category and target operating temperature information may also include: determining the target calibration partition of the target event camera chip according to the calibration dataset and based on the target process corner category and target operating temperature information; and selecting the target calibration scheme for the target event camera chip from multiple calibration schemes based on the target calibration partition and the calibration dataset.

[0080] Specifically, based on the operating temperature information and process angle category, multiple calibration zones are determined, where each calibration zone corresponds to a calibration scheme; from the multiple calibration zones, a target calibration zone corresponding to the target process angle category and target operating temperature information is determined; and the calibration scheme corresponding to the target calibration zone is taken as the target calibration scheme.

[0081] It should be noted that, as Figure 3 As shown, during the study of multiple event camera chips mass-produced using a certain CMOS process, it was found that:

[0082] 1) Following verification sequence 1, the EVS performance of the event camera chip with the default configuration 0 (no parameter calibration) of the TT process corner was verified and tested. The performance of the event camera with the TT process corner deteriorated at low temperatures, such as a significant increase in static noise and a decrease in image contrast sensitivity. The performance degradation was more pronounced at lower temperatures, with the corresponding performance being -20℃ < -10℃ < 0℃. On the other hand, the performance of the event camera with the TT process corner improved at high temperatures, such as a significant reduction in pixel bright spots and an improvement in image contrast sensitivity. The performance improvement was more pronounced at higher temperatures.

[0083] 2) Following verification sequence 2, the EVS performance of the event camera chips with the default configuration 0 (no parameter calibration) of FF and FS process corners was verified and tested. The performance change trend with temperature is consistent with the performance change trend of the event camera with the TT process corner. The performance deteriorates at low temperature and the performance deteriorates more significantly at lower temperatures, while the performance improves at high temperatures and the performance improvement is more significant at higher temperatures.

[0084] 3) Following verification sequence 3, the EVS performance of the event camera chips with the default configuration of 0 (no parameter calibration) in the SS and SF process corners was verified and tested. The performance change trend with temperature is different from that of the event camera with the TT process corner. The performance deteriorates at low temperatures and the performance decline is more obvious at lower temperatures. Some performances improve at high temperatures, but the static noise is generally larger in the room temperature and above temperature range.

[0085] 4) As can be seen from 2) and 3), the test was further extended to event camera chips of other process corners. After verifying their subjective and objective performance at high and low temperatures, the verification results showed that the performance of event camera chips of other process corners was the same as that of event camera chips of TT process corner. However, at the same temperature, event camera chips of different process corners had different EVS performance, SS < SF < TT < FS < FF. That is to say, due to the difference in process conditions, the degree of temperature drift of EVS performance of multiple event camera chips of the same batch or different batches belonging to different process corners is different.

[0086] Therefore, in some embodiments, obtaining the calibration dataset includes: preparing multiple sample event camera chips belonging to different process corner categories, and obtaining the performance index parameters of each sample event camera chip under multiple different operating temperature information; based on the performance index parameters, and combining the two dimensions of process corner category and operating temperature information, statistically classifying the multiple sample event camera chips to obtain multiple calibration partitions; based on the feedback of the performance index parameters, pre-calibrating the sample event camera chips under each calibration partition to obtain a corresponding calibration scheme, so that the performance index parameters of the pre-calibrated sample event camera chips meet preset conditions; and establishing a mapping relationship based on each calibration scheme and the process corner category and operating temperature information corresponding to each calibration partition to obtain the calibration dataset.

[0087] Here, the sample event camera chip refers to the sample chip used to determine the calibration dataset. Performance metrics are used to indicate and measure the performance of the event camera chip (such as event perception performance), including both subjective and objective performance. The specific content of the performance metrics can be adjusted according to actual conditions, and this application embodiment does not impose limitations. For example, the performance metric is static noise. Another example is that the performance metric includes parameters such as static noise, image contrast sensitivity, and pixel brightness.

[0088] Each calibration partition is determined by both the process corner category and operating temperature information. It should be noted that when statistically distinguishing multiple event camera chips belonging to different process corners produced in batches using a certain CMOS process according to their performance indicators, the corresponding statistical sample can be multiple event camera chips obtained through tape-out or small-batch trial production using that CMOS process. Using chips obtained through tape-out or small-batch trial production to represent multiple event camera chips produced in subsequent large-batch production reduces the statistical volume and improves statistical efficiency. However, the number of corresponding event camera chips is small, which may introduce some errors. Therefore, the corresponding statistical sample can also be multiple event camera chips produced in large-batch production using that CMOS process within a previous period. The statistical sample covers multiple event camera chips from multiple batches; the more event camera chips, the better, and the more accurate the corresponding statistical results. However, the corresponding statistical volume is large and the statistical efficiency is low.

[0089] In actual statistical analysis, the selection can be flexibly chosen after comprehensive consideration, and no restrictions are imposed here. However, regardless of the size of the statistical sample, the statistical sample must at least include event camera chips from various process corners, and the number of event camera chips for each process corner must not be less than the statistical threshold to meet the basic requirements of statistics.

[0090] It should be noted that due to differences in CMOS process steps and parameters, the performance deviations of multiple event camera chips produced in batches using the same process are not necessarily "deteriorating at low temperatures and improving at high temperatures" as described in the above embodiments. Furthermore, the performance deviations at the corresponding process angles at the same temperature are not necessarily "SS < SF < TT < FS < FF". Therefore, when statistically distinguishing the performance of multiple event camera chips produced in batches, the statistical trends of their changes with temperature and process angles may be more complex, resulting in a larger number of calibration partitions. Each calibration partition may have more complex calibrations and higher calibration accuracy, leading to a larger number of corresponding calibration schemes. However, the subsequent confirmation and calibration call process is the same as in the above embodiments and will not be repeated here.

[0091] The process of determining multiple calibration partitions based on operating temperature information and process corner category may include: acquiring multiple sample event camera chips; determining the process corner category to which the process corner of each sample event camera chip belongs; determining the performance index information of each sample event camera chip under multiple operating temperature information; dividing event camera chips of the same process corner category and with the same performance index information into the same calibration partition to obtain multiple calibration partitions, wherein each calibration partition corresponds to a process corner category and an operating temperature information.

[0092] Specifically, during tape-out or small-batch trial production, for multiple event camera chips covering different process angles, the performance of these event camera chips at different temperatures can be collected from two dimensions: process angle and operating temperature. The performance indicators can be classified and statistically analyzed according to their quality. The process angle and operating temperature can be classified separately to obtain multiple process angle categories and operating temperature information. At the same time, the process angle categories and operating temperature information can be combined and matched to obtain multiple calibration partitions, and a corresponding calibration scheme can be configured for each calibration partition.

[0093] The process of configuring a corresponding calibration scheme for a calibration partition may include: acquiring multiple calibration conditions; selecting a target calibration condition from the multiple calibration conditions; and determining a calibration scheme for each calibration partition based on the target calibration condition, so that after calibrating the event camera chip belonging to the calibration partition based on the calibration scheme, the performance index information of the event camera chip under the preset operating temperature information corresponding to the calibration partition meets the preset conditions.

[0094] Specifically, a specific embodiment will be used for explanation below.

[0095] Assume multiple calibration conditions are designed, including: 1. Adjusting bias voltage bias1; 2. Adjusting bias voltage bias2; 3. Modifying bias voltage bias3; 4. Modifying the remaining bias voltages; 5. Modifying the pixel-end power supply voltage; 6. Adjusting the offset of threshold voltages vrefp0 and vrefn0.

[0096] After adjustments based on the above calibration conditions, the performance effect is as follows:

[0097] 1. Trying to adjust bias1 did not significantly improve performance, and the on event response was abnormal;

[0098] 2. Trying to adjust bias2 did not improve performance; in fact, the noise increased.

[0099] 3. Attempting to modify bias3 did not significantly improve performance and also introduced additional peak issues.

[0100] 4. Attempts to modify other bias voltages yielded no improvement in performance;

[0101] 5. Trying to modify the power supply voltage at the pixel end resulted in a significant performance improvement;

[0102] 6. Adjusting the offset of threshold voltages vrefp0 and vrefn0 significantly improves performance.

[0103] Based on the above performance results, the target calibration conditions can be determined as follows: modify the pixel-end power supply voltage and adjust the offset of the threshold voltages vrefp0 and vrefn0.

[0104] For each calibration zone, parameters are adjusted based on the above target calibration conditions to determine the specific calibration scheme for each calibration zone.

[0105] Through the above steps, all calibration partitions can share a single set of calibration conditions. By adjusting the parameters of these conditions, the calibration scheme for each calibration partition can be determined. This allows for the rapid determination of calibration schemes for each event camera chip at different process angles under various temperature scenarios, ensuring that the performance of the event camera chip meets application requirements and improving user experience. Furthermore, after calibrating the event camera chip to its optimal performance at low temperatures, the above steps demonstrate a trend of improved performance as the temperature increases. The corresponding calibration configuration also exhibits better performance at higher temperatures, eliminating the need for separate calibration at those higher temperatures.

[0106] For details, please refer to Figure 4For event camera chips of process corner categories A and B, four calibration schemes were determined. Default configuration 0: No calibration required. Calibration configuration 1: Requires adjustment of the pixel-end power supply voltage trim code from 0x04 to 0x0A, and adjustment of vrefp0 from 0x19 to 0x20. Calibration configuration 2: Requires adjustment of the pixel-end power supply voltage trim code from 0x04 to 0x0c, and adjustment of vrefp0 from 0x19 to 0x20. Calibration configuration 3: Requires adjustment of the pixel-end power supply voltage trim code from 0x04 to 0x0c.

[0107] Specifically, for event camera chips of type A process corner, based on the adjustment of configurations 5 and 6, their performance at extreme low temperatures (such as -40℃) is adjusted to the optimal state. The corresponding calibration configuration is defined as calibration configuration 1, which is the first calibration partition calibration scheme.

[0108] For event camera chips of type A process corner, since the performance at room temperature has already met the standard and the higher the temperature, the better the performance, no calibration is required in the temperature range of room temperature and above. The corresponding configuration is defined as default configuration 0. Default configuration 0 is the configuration scheme of the second calibration partition, which means no calibration is required.

[0109] For event camera chips of type B process corner, based on the adjustment of configurations 5 and 6, their performance at extreme low temperatures (such as -40℃) is adjusted to the best state. The corresponding calibration configuration is defined as calibration configuration 2, which is the third calibration partition calibration scheme.

[0110] For event camera chips of type B process corner, the performance parameters deteriorate at room temperature and above (e.g., 35℃). Based on the adjustment of configurations 5 and 6, the performance at room temperature and above is adjusted to the optimal state. The corresponding calibration configuration is defined as calibration configuration 3, which is the fourth calibration partition calibration scheme.

[0111] In some embodiments, the operating temperature information includes normal operating temperature information and abnormal operating temperature information.

[0112] In this embodiment, the process of selecting a target calibration scheme for a target event camera chip from a calibration dataset based on the target process corner category and target operating temperature information may include: selecting a corresponding calibration scheme from the calibration dataset as the target calibration scheme based on the target process corner category and normal operating temperature information; determining whether the target operating temperature information is normal operating temperature information, and updating the target calibration scheme according to the determination result; wherein, if the target operating temperature information is normal operating temperature information, the target calibration scheme remains unchanged; if the target operating temperature information is abnormal operating temperature information, the target calibration scheme is updated by selecting a corresponding calibration scheme from the calibration dataset based on the target process corner category and abnormal operating temperature information.

[0113] The normal operating temperature information is used to indicate the operating temperature range in which the performance of the event camera chip improves as it operates with this operating temperature information.

[0114] Among them, the abnormal operating temperature information is used to indicate the operating temperature range in which the performance of the event camera chip deteriorates when it operates according to the operating temperature information.

[0115] Specifically, in combination Figure 5 To explain further: If the event camera chip's process corner belongs to category A, its initial parameter configuration is the default configuration 0. That is, if the event camera's operating temperature information is within the normal operating temperature range when the event camera's process corner belongs to category A, the default calibration scheme (i.e., default configuration 0) will be used as the target calibration scheme. If the event camera chip's process corner belongs to category B, its initial parameter configuration will be automatically loaded and updated to calibration configuration 3. That is, if the event camera chip's process corner belongs to category B, and the event camera's operating temperature information is within the normal operating temperature range, the default calibration scheme (i.e., default configuration 3) will be used as the target calibration scheme. After configuring the event camera chip, the image output process begins.

[0116] Further, the operating temperature information of the event camera chip is obtained, and it is determined which temperature range the chip's operating temperature falls into. If the operating temperature remains within the normal operating range, the initial parameter configuration (i.e., the default calibration scheme) remains unchanged. If the operating temperature changes to an abnormal operating temperature, the calibration scheme needs to be switched to the corresponding calibration scheme based on the process corner category. For example, the calibration scheme for process corner category A is switched from the default configuration 0 to calibration configuration 1, and the calibration scheme for process corner category B is switched from calibration configuration 3 to calibration configuration 2.

[0117] In some embodiments, the above-described event camera chip calibration method further includes: acquiring real-time operating temperature information of the target event camera chip at preset time intervals; determining a real-time calibration scheme for the target event camera chip based on the target process corner category and the real-time operating temperature information, and updating the target calibration scheme based on the real-time calibration scheme, wherein if the real-time calibration scheme is different from the target calibration scheme, the target calibration scheme is updated to the real-time calibration scheme, otherwise the target calibration scheme remains unchanged; and calibrating the target event camera chip based on the updated target calibration scheme.

[0118] The preset time interval can be set manually or based on empirical values, and the specific implementation of this application does not limit it.

[0119] This embodiment also provides a chip calibration device, which can be integrated into an electronic device, such as a computer device. The computer device can be a terminal, server, or other device. This embodiment does not limit this.

[0120] For example, such as Figure 6 As shown, the chip calibration device may include:

[0121] The process corner category acquisition module 301 is used to acquire the target process corner category of the target event camera chip.

[0122] The operating temperature information acquisition module 302 is used to acquire the target operating temperature information of the target event camera chip.

[0123] The target calibration scheme determination module 303 is used to acquire a calibration dataset and select a target calibration scheme for the target event camera chip from the calibration dataset based on the target process corner category and target operating temperature information. The calibration dataset covers the data mapping relationship between process corner category, operating temperature information and calibration scheme.

[0124] The calibration module 304 is used to calibrate the target event camera chip based on the target calibration scheme.

[0125] Optionally, in the apparatus of this application embodiment, the above-mentioned process corner category acquisition module 301 is specifically used for:

[0126] The performance parameters of the target event camera chip are detected in real time to obtain the corresponding parameter values;

[0127] The process angle determination rules for performance index parameters are obtained, and the target process angle category of the target event camera chip is determined based on the parameter values ​​and process angle determination rules. The process angle determination rules cover the data mapping relationship between parameter thresholds and process angle categories.

[0128] Optionally, in the apparatus of this application embodiment, the above-mentioned process corner category acquisition module 301 is specifically used for:

[0129] The target event camera chip is pre-detected to determine the target process corner category of the target event camera chip, and the target process corner category of the target event camera chip is stored in the flag bit.

[0130] The flag bits are acquired in real time, and the target process angle category of the target event camera chip is determined based on the stored information in the flag bits.

[0131] Optionally, in the apparatus of this application embodiment, the above-mentioned calibration dataset covers the data mapping relationship between multiple calibration partitions and multiple calibration schemes, and the above-mentioned calibration partitions are jointly determined by process corner category and operating temperature information.

[0132] Based on this, the target calibration scheme determination module 303 described above is specifically used for:

[0133] Based on the calibration dataset, the target calibration partition of the target event camera chip is determined according to the target process angle category and target operating temperature information;

[0134] Based on the target calibration partition and calibration dataset, the target calibration scheme for the target event camera chip is selected from multiple calibration schemes.

[0135] Optionally, in the apparatus of this application embodiment, the target calibration scheme determination module 303 is specifically used for:

[0136] Prepare multiple sample event camera chips belonging to different process corner categories, and obtain the performance index parameters of each sample event camera chip under multiple different operating temperature information.

[0137] Based on performance parameters, and combined with process corner category and operating temperature information, multiple sample events of camera chips are statistically classified to obtain multiple calibration partitions.

[0138] Based on the feedback of performance index parameters, the sample event camera chip under each calibration partition is pre-calibrated to obtain a corresponding calibration scheme so that the performance index parameters of the pre-calibrated sample event camera chip meet the preset conditions.

[0139] A mapping relationship is established based on each calibration scheme and the process corner category and operating temperature information corresponding to each calibration partition to obtain the calibration dataset.

[0140] Optionally, in the apparatus of this application embodiment, the above-mentioned operating temperature information includes normal operating temperature information and abnormal operating temperature information.

[0141] Based on this, the target calibration scheme determination module 303 described above is specifically used for:

[0142] Based on the target process angle category and normal operating temperature information, the corresponding calibration scheme is selected from the calibration dataset as the target calibration scheme;

[0143] Determine whether the target operating temperature information is the normal operating temperature information, and update the target calibration scheme based on the determination result;

[0144] If the target operating temperature information is the normal operating temperature information, then the target calibration scheme remains unchanged;

[0145] If the target operating temperature information is abnormal operating temperature information, then based on the target process corner category and the abnormal operating temperature information, the corresponding calibration scheme is selected from the calibration dataset to update the target calibration scheme.

[0146] Optionally, in the apparatus of this application embodiment, the chip calibration apparatus can also be used for:

[0147] According to the preset time interval, the real-time operating temperature information of the target event camera chip is obtained;

[0148] Based on the target process corner category and real-time operating temperature information, the real-time calibration scheme of the target event camera chip is determined, and the target calibration scheme is updated based on the real-time calibration scheme. If the real-time calibration scheme is different from the target calibration scheme, the target calibration scheme is updated to the real-time calibration scheme; otherwise, the target calibration scheme remains unchanged.

[0149] The target event camera chip is calibrated based on the updated target calibration scheme.

[0150] The chip calibration apparatus provided in this application embodiment can obtain the target process corner category of the target event camera chip; obtain the target operating temperature information of the target event camera chip; obtain a calibration dataset; and select a target calibration scheme for the target event camera chip from the calibration dataset based on the target process corner category and target operating temperature information. The calibration dataset covers the data mapping relationship between process corner category, operating temperature information, and calibration schemes. Based on the target calibration scheme, the target event camera chip is calibrated. Thus, a target calibration scheme is determined by the process corner category and operating temperature information of the event camera chip. By calling this target calibration scheme, the event camera chip can be calibrated quickly and effectively, thereby ensuring that the performance of each event camera chip with different process corners meets application requirements under different temperature scenarios, improving user experience.

[0151] Accordingly, this application also provides an electronic device, which can be a terminal, such as a smartphone, tablet computer, laptop computer, touch screen, game console, personal computer (PC), personal digital assistant (PDA), or other terminal device. Alternatively, the electronic device can be a server.

[0152] like Figure 7 As shown, Figure 7 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device 400 includes a processor 401 with one or more processing cores, a memory 402 with one or more computer-readable storage media, and a computer program stored in the memory 402 and executable on the processor. The processor 401 and the memory 402 are electrically connected. Those skilled in the art will understand that the electronic device structure shown in the figure does not constitute a limitation on the electronic device, and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0153] The processor 401 is the control center of the electronic device 400. It connects various parts of the electronic device 400 through various interfaces and lines. By running or loading software programs and / or units stored in the memory 402, and calling data stored in the memory 402, it executes various functions of the electronic device 400 and processes data. The processor 401 may be a CPU, GPU, network processor (NP), etc., and can implement or execute the methods, steps, and logic block diagrams disclosed in the embodiments of this application.

[0154] In this embodiment, the processor 401 in the electronic device 400 loads the instructions corresponding to the processes of one or more applications into the memory 402 according to the following steps, and the processor 401 runs the applications stored in the memory 402 to realize various functions, such as:

[0155] Obtain the target process corner category of the target event camera chip;

[0156] Obtain the target operating temperature information of the target event camera chip;

[0157] Obtain the calibration dataset, and select the target calibration scheme for the target event camera chip from the calibration dataset based on the target process corner category and target operating temperature information. The calibration dataset covers the data mapping relationship between process corner category, operating temperature information and calibration scheme.

[0158] The target event camera chip is calibrated based on the target calibration scheme.

[0159] Therefore, the electronic device provided in this application embodiment can obtain the target process corner category of the target event camera chip; obtain the target operating temperature information of the target event camera chip; obtain a calibration dataset; and select a target calibration scheme for the target event camera chip from the calibration dataset based on the target process corner category and target operating temperature information. The calibration dataset covers the data mapping relationship between process corner category, operating temperature information, and calibration schemes. Based on the target calibration scheme, the target event camera chip is calibrated. Thus, a target calibration scheme is determined through the process corner category and operating temperature information of the event camera chip. By calling this target calibration scheme, the event camera chip can be calibrated quickly and effectively, thereby ensuring that the performance of each event camera chip with different process corners meets application requirements under different temperature scenarios, improving the user experience.

[0160] Furthermore, the various functions implemented by running the application stored in memory 402 can also be found in the description of the foregoing embodiments, and will not be repeated here.

[0161] For details on the implementation of each of the above operations, please refer to the previous examples, which will not be repeated here.

[0162] Optional, such as Figure 7 As shown, the electronic device 400 also includes: a touch display screen 403, a radio frequency circuit 404, an audio circuit 405, an input unit 406, and a power supply 407. The processor 401 is electrically connected to the touch display screen 403, the radio frequency circuit 404, the audio circuit 405, the input unit 406, and the power supply 407. Those skilled in the art will understand that... Figure 7 The electronic device structure shown does not constitute a limitation on the electronic device and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0163] The touch display screen 403 can be used to display a graphical user interface (GUI) and receive operation commands generated by the user interacting with the GUI. The touch display screen 403 may include a display panel and a touch panel. The display panel can be used to display information input by the user or information provided to the user, as well as various graphical user interfaces of the electronic device. These graphical user interfaces can be composed of graphics, text, icons, video, and any combination thereof. Optionally, the display panel can be configured using a liquid crystal display (LCD), organic light-emitting diode (OLED), or other similar technologies. The touch panel can be used to collect touch operations performed by the user on or near it (such as operations performed by the user using a finger, stylus, or any suitable object or accessory on or near the touch panel), generate corresponding operation commands, and execute the corresponding program according to the operation commands. Optionally, the touch panel may include two parts: a touch detection device and a touch controller. The touch detection device detects the user's touch location and the signal generated by the touch operation, transmitting the signal to the touch controller. The touch controller receives touch information from the touch detection device, converts it into touch point coordinates, and sends it to the processor 401. It can also receive and execute commands from the processor 401. The touch panel can cover the display panel. When the touch panel detects a touch operation on or near it, it transmits the information to the processor 401 to determine the type of touch event. Subsequently, the processor 401 provides corresponding visual output on the display panel based on the type of touch event. In this embodiment, the touch panel and the display panel can be integrated into the touch display screen 403 to achieve input and output functions. However, in some embodiments, the touch panel and the touch display screen 403 can be implemented as two independent components to achieve input and output functions. That is, the touch display screen 403 can also be used as part of the input unit 406 to achieve input functions.

[0164] The radio frequency circuit 404 can be used to transmit and receive radio frequency signals to establish wireless communication with network devices or other electronic devices, and to transmit and receive signals with network devices or other electronic devices.

[0165] Audio circuit 405 can be used to provide an audio interface between a user and an electronic device via a speaker and a microphone. Audio circuit 405 can convert received audio data into electrical signals and transmit them to the speaker, where the speaker converts them into sound signals for output. Conversely, the microphone converts collected sound signals into electrical signals, which are then received by audio circuit 405, converted back into audio data, and then processed by processor 401 before being transmitted via radio frequency circuit 404 to, for example, another electronic device, or output to memory 402 for further processing. Audio circuit 405 may also include an earphone jack to provide communication between peripheral headphones and electronic devices.

[0166] The input unit 406 can be used to receive input event signal sequences and generate keyboard, mouse, joystick, optical, or trackball signal inputs related to user settings and function control.

[0167] Power supply 407 is used to supply power to various components of electronic device 400. Optionally, power supply 407 can be logically connected to processor 401 through a power management system, thereby enabling functions such as charging, discharging, and power consumption management through the power management system. Power supply 407 may also include one or more DC or AC power supplies, recharging systems, power fault detection circuits, power converters or inverters, power status indicators, and other arbitrary components.

[0168] although Figure 7 As not shown in the diagram, the electronic device 400 may also include a camera, sensor, wireless fidelity module, Bluetooth module, etc., which will not be described in detail here.

[0169] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0170] Those skilled in the art will understand that all or part of the steps in the various methods of the above embodiments can be performed by instructions, or by instructions controlling related hardware. These instructions can be stored in a computer-readable storage medium and loaded and executed by a processor.

[0171] Therefore, embodiments of this application provide a computer-readable storage medium storing a computer program thereon. When the computer program is run on an electronic device, it causes the electronic device to perform any of the chip calibration methods provided in the embodiments of this application. For example, the computer program can perform the steps of the following chip calibration method:

[0172] Obtain the target process corner category of the target event camera chip;

[0173] Obtain the target operating temperature information of the target event camera chip;

[0174] Obtain the calibration dataset, and select the target calibration scheme for the target event camera chip from the calibration dataset based on the target process corner category and target operating temperature information. The calibration dataset covers the data mapping relationship between process corner category, operating temperature information and calibration scheme.

[0175] The target event camera chip is calibrated based on the target calibration scheme.

[0176] Therefore, using the computer-readable storage medium provided in this application embodiment, the target event camera chip's target process corner category can be obtained; the target operating temperature information of the target event camera chip can be obtained; a calibration dataset can be obtained, and based on the target process corner category and target operating temperature information, a target calibration scheme for the target event camera chip can be selected from the calibration dataset. The calibration dataset covers the data mapping relationship between process corner category, operating temperature information, and calibration schemes. Based on the target calibration scheme, the target event camera chip can be calibrated. Thus, a target calibration scheme is determined through the event camera chip's process corner category and its operating temperature information. By calling this target calibration scheme, the event camera chip can be calibrated quickly and effectively, thereby ensuring that the performance of each event camera chip with different process corners meets application requirements under different temperature scenarios, improving user experience.

[0177] Furthermore, the detailed steps of the above method can be found in the description of the foregoing embodiments, and will not be repeated here.

[0178] For details on the implementation of each of the above operations, please refer to the previous examples, which will not be repeated here.

[0179] The computer-readable storage medium may include: read-only memory (ROM), random access memory (RAM), disk or optical disk, etc.

[0180] Since the computer program stored in the computer-readable storage medium can execute any of the chip calibration methods provided in the embodiments of this application, it can achieve the beneficial effects that any of the chip calibration methods provided in the embodiments of this application can achieve, as detailed in the preceding embodiments, and will not be repeated here.

[0181] According to one aspect of this application, a computer program product is also provided, comprising a computer program stored in a computer-readable storage medium; when a processor of an electronic device reads the computer program from the computer-readable storage medium, the processor executes the computer program, causing the electronic device to perform the methods provided in various optional implementations of the above embodiments.

[0182] In the above embodiments of the chip calibration device, computer-readable storage medium, electronic device, and computer program product, the descriptions of each embodiment have different focuses. Parts not described in detail in a particular embodiment can be referred to in the relevant descriptions of other embodiments. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes and beneficial effects of the chip calibration device, computer-readable storage medium, computer program product, electronic device, and their corresponding units described above can be referred to the description of the chip calibration method in the above embodiments, and will not be repeated here.

[0183] The foregoing has provided a detailed description of a chip calibration method, apparatus, electronic device, computer-readable storage medium, and computer program product provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A chip calibration method, characterized in that, include: Obtain the target process corner category of the target event camera chip; Obtain the target operating temperature information of the target event camera chip; Obtain a calibration dataset, and select a target calibration scheme for the target event camera chip from the calibration dataset based on the target process corner category and the target operating temperature information. The calibration dataset covers the data mapping relationship between process corner category, operating temperature information and calibration scheme. The target event camera chip is calibrated based on the target calibration scheme.

2. The chip calibration method according to claim 1, characterized in that, The target process angle category for acquiring the target event camera chip includes: The performance parameters of the target event camera chip are detected in real time to obtain the corresponding parameter values; The process corner determination rule for the performance index parameter is obtained, and the target process corner category of the target event camera chip is determined according to the parameter value and the process corner determination rule, wherein the process corner determination rule covers the data mapping relationship between the parameter value and the process corner category.

3. The chip calibration method according to claim 1, characterized in that, The target process angle category for acquiring the target event camera chip includes: The target event camera chip is pre-detected to determine the target process corner category of the target event camera chip, and the target process corner category of the target event camera chip is stored in a flag bit. The flag bit is acquired in real time, and the target process angle category of the target event camera chip is determined based on the stored information in the flag bit.

4. The chip calibration method according to claim 1, characterized in that, The calibration dataset encompasses data mapping relationships between multiple calibration partitions and multiple calibration schemes, wherein the calibration partitions are jointly determined by the process corner category and the operating temperature information; the step of selecting the target calibration scheme for the target event camera chip from the calibration dataset based on the target process corner category and the target operating temperature information includes: Based on the calibration dataset, the target calibration partition of the target event camera chip is determined according to the target process angle category and the target operating temperature information; Based on the target calibration partition and the calibration dataset, the target calibration scheme for the target event camera chip is selected from multiple calibration schemes.

5. The chip calibration method according to claim 4, characterized in that, The acquisition of the calibration dataset includes: Prepare multiple sample event camera chips belonging to different process angle categories, and obtain the performance index parameters of each sample event camera chip under multiple different operating temperature information. Based on the performance index parameters, and combined with the process corner category and the operating temperature information, the multiple sample event camera chips are statistically classified to obtain multiple calibration partitions. Based on the feedback of the performance index parameters, the sample event camera chip under each calibration partition is pre-calibrated to obtain a corresponding calibration scheme so that the performance index parameters of the pre-calibrated sample event camera chip meet the preset conditions. Based on each of the calibration schemes, and the process corner category and operating temperature information corresponding to each of the calibration partitions, a mapping relationship is established to obtain the calibration dataset.

6. The chip calibration method according to claim 1, characterized in that, The operating temperature information includes normal operating temperature information and abnormal operating temperature information; The step of selecting a target calibration scheme for the target event camera chip from the calibration dataset based on the target process angle category and the target operating temperature information includes: Based on the target process angle category and the normal operating temperature information, the corresponding calibration scheme is selected from the calibration dataset as the target calibration scheme; Determine whether the target operating temperature information is the normal operating temperature information, and update the target calibration scheme according to the determination result; Wherein, if the target operating temperature information is the normal operating temperature information, the target calibration scheme remains unchanged; If the target operating temperature information is the abnormal operating temperature information, then based on the target process corner category and the abnormal operating temperature information, the corresponding calibration scheme is selected from the calibration dataset to update the target calibration scheme.

7. The chip calibration method according to any one of claims 1 to 6, characterized in that, The method further includes: The real-time operating temperature information of the target event camera chip is acquired at preset time intervals. Based on the target process corner category and the real-time operating temperature information, a real-time calibration scheme for the target event camera chip is determined, and the target calibration scheme is updated based on the real-time calibration scheme. If the real-time calibration scheme is different from the target calibration scheme, the target calibration scheme is updated to the real-time calibration scheme; otherwise, the target calibration scheme remains unchanged. The target event camera chip is calibrated based on the updated target calibration scheme.

8. A chip calibration device, characterized in that, include: The process corner category acquisition module is used to acquire the target process corner category of the target event camera chip; The operating temperature information acquisition module is used to acquire the target operating temperature information of the target event camera chip; The target calibration scheme determination module is used to acquire a calibration dataset and select a target calibration scheme for the target event camera chip from the calibration dataset based on the target process corner category and the target operating temperature information. The calibration dataset covers the data mapping relationship between process corner category, operating temperature information and calibration scheme. The calibration module is used to calibrate the target event camera chip based on the target calibration scheme.

9. An electronic device, characterized in that, The device includes a processor and a memory, wherein the memory stores a computer program that, when executed by the processor, causes the electronic device to perform the steps of the chip calibration method according to any one of claims 1 to 7.

10. A storage medium, characterized in that, It stores a computer program that, when run on the electronic device, causes the electronic device to perform the steps of the chip calibration method according to any one of claims 1 to 7.

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