A thermal management system and method for on-orbit satellite COTS devices

Abstract

This application relates to the field of spacecraft simulation technology, and discloses a thermal management system and method for on-orbit satellite COTS devices. The system includes: a modeling unit configured to model the target commercial off-the-shelf device and its associated heat transfer link to obtain a target model; a thermal environment construction unit that, based on the target satellite's orbital parameters, calculates the external heat time-series data corresponding to the payload module's periodic entry and exit from the Earth's shadow region in orbit; a simulation unit that acquires the power consumption time-series data corresponding to the target commercial off-the-shelf device performing the target mission, determines the external heat time-series data as the boundary conditions of the target model, and performs thermal simulation on the target model based on the power consumption time-series data; and a management unit that adjusts the operating mode of the target commercial off-the-shelf device based on the simulation results. This system can achieve accurate thermal simulation and thermal management optimization of on-orbit satellite commercial off-the-shelf devices, improving device performance and extending service life.

Description

Technical Field

[0001] This application relates to the field of spacecraft simulation technology, specifically to a thermal management system and method for on-orbit satellite COTS devices. Background Technology

[0002] With the widespread use of Commercial Off-The-Shelf (COTS) devices in spacecraft, high-performance computing modules are extensively used in the payload bays of on-orbit satellites, making thermal management increasingly prominent. Since COTS devices are not specifically designed for aerospace engineering, their thermal characteristics differ significantly from traditional aerospace-grade devices, especially in extreme temperature fluctuations and vacuum environments, making them prone to overheating or performance degradation. Therefore, thermal simulation of COTS devices has become crucial for ensuring the reliable operation of on-orbit satellites. Current thermal simulation methods for COTS devices suffer from coarse simulation precision and low accuracy, resulting in significant deviations between simulation results and the actual thermal characteristics of the devices. This fails to guide effective thermal design, and the problems of overheating and performance degradation of onboard COTS devices remain unresolved. Summary of the Invention

[0003] The purpose of this application is to provide a thermal management system and method for on-orbit satellite COTS devices, enabling accurate thermal simulation and thermal management optimization of COTS devices.

[0004] To achieve the above objectives, the technical solution of this application is as follows: In a first aspect, embodiments of this application provide a thermal management system for on-orbit satellite COTS devices, the system comprising: The modeling unit is configured to model the target commercial off-the-shelf device and its associated heat transfer path to obtain a target model; the target commercial off-the-shelf device is deployed in the payload bay of the target satellite; The thermal environment construction unit is configured to calculate the external heat time series data corresponding to the periodic entry and exit of the payload cabin into and out of the Earth's shadow region in orbit, based on the orbital parameters of the target satellite; the external heat time series data affects the temperature of the target commercial off-the-shelf device through the heat transfer link; The simulation unit is configured to acquire power consumption timing data corresponding to the target commercial off-the-shelf device performing the target task; determine the external heat timing data as the boundary condition of the target model; perform thermal simulation on the target model based on the power consumption timing data; and obtain simulation results; the simulation results include: the real-time temperature of the target commercial off-the-shelf device as power consumption changes; The management unit is configured to adjust the operating mode of the target commercial off-the-shelf device based on the simulation results.

[0005] Optionally, the modeling unit includes a model building module configured to perform the following steps: Determine the heat transfer path of the target commercial off-the-shelf device; the heat transfer path is a closed path. Obtain modeling parameters for the target commercial off-the-shelf device and the structural components in the heat transfer link; the structural components include: load chamber shell, mounting plate, passive thermal control components, and support frame; the modeling parameters include: device model, size, material, and deployment location; Based on the modeling parameters of each structural component, the heat transfer capacity level of the structural component is determined; if the heat transfer capacity level of the structural component is first level, the modeling accuracy corresponding to the structural component is determined to be first accuracy; if the heat transfer capacity level of the structural component is second level, the modeling accuracy corresponding to the structural component is determined to be second accuracy; the first level is higher than the second level, and the first accuracy is higher than the second accuracy. Based on the modeling parameters of the target commercial off-the-shelf device, the target commercial off-the-shelf device is modeled in three dimensions using the first precision, and the target commercial off-the-shelf device is modeled as an equivalent thermal resistance model; and based on the modeling parameters of each structural component, each structural component is modeled in three dimensions using the modeling precision corresponding to each structural component. Based on the deployment locations of the target commercial off-the-shelf device and its various structural components, all generated 3D models are assembled to generate the initial target model.

[0006] Optionally, the modeling unit further includes a simplification module; the simplification module is configured to perform the following steps: Based on the modeling accuracy corresponding to the target commercial off-the-shelf device and each structural component, the initial target model is meshed using finite element analysis software to obtain a meshed target model. Based on the meshed target model, the following steps are performed to update the target model: Convert the rounded corner structures contained in the meshed target model into right-angle structures; For a structural component with a modeling accuracy of the second accuracy, the protruding structure contained in the structural component is transformed into a planar structure, and the hole structure contained in the structural component is filled.

[0007] Optionally, the modeling unit is configured to mesh the initial target model using finite element analysis software according to the modeling precision corresponding to the target commercial off-the-shelf device and each structural component, including: Using the finite element analysis software, a 3D tetrahedral mesh is used to mesh the structural components with a modeling accuracy of the first precision; the 3D tetrahedral mesh is a TET10 mesh or a TET4 mesh. The target commercial off-the-shelf device was meshed using the finite element analysis software with a TET10 mesh. Using the finite element analysis software, 2D shell element meshes are used to mesh the structural components with a modeling accuracy of second precision; the 2D shell element mesh is any of the following: TRI3 mesh, TRI6 mesh, or QUAD4 mesh.

[0008] Optionally, the thermal environment construction unit is configured to calculate, based on the orbital parameters of the target satellite, the time-series data of external heat corresponding to the periodic entry and exit of the payload module into and out of the Earth's shadow region in orbit, including: Obtain the orbital parameters of the target satellite, including: semi-major axis, inclination, eccentricity, right ascension of the ascending node, and argument of perigee; The orbital period of the target satellite is calculated based on the orbital parameters; Based on the orbital period, the first time period in which the payload cabin is in the Earth's sunlit zone and the second time period in the Earth's shadow zone are determined. During the first time period, the direct solar radiation and the Earth's albedo are calculated based on the orbital parameters and determined as the time-series data of the external heat of the payload cabin; During the second time period, the Earth's infrared radiation is calculated based on the orbital parameters and determined as the time-series data of the external heat of the payload cabin.

[0009] Optionally, the thermal environment construction unit is configured to determine, based on the orbital period, a first time period in which the payload module is in Earth's sunlit zone and a second time period in Earth's shadow zone, including: Based on the orbital period, the solar ephemeris is queried to obtain the direction vector of the sun in the geocentric inertial coordinate system at each moment of the orbital period; Based on the orbital parameters of the target satellite, determine the orbital plane normal vector of the target satellite's orbit; Calculate the angle between the direction vector of the sun in the terrain inertial coordinate system and the normal vector of the orbital plane at each moment of the orbital period; The absolute value of the included angle at each time point is compared with a first threshold. If the absolute value of the included angle is less than the first threshold, the payload compartment is determined to be in the Earth's shadow zone at the corresponding time. If the absolute value of the included angle is greater than or equal to the first threshold, the payload compartment is determined to be in the Earth's sun zone at the corresponding time.

[0010] Optionally, the simulation unit is configured to determine the external heat time-series data as the boundary condition of the target model, perform thermal simulation on the target model based on the power consumption time-series data, and obtain simulation results, including: Obtain the physical parameters of the target commercial off-the-shelf device, including: material density, specific heat capacity, thermal conductivity tensor, and volume; Based on the input power consumption and the volume of the target commercial off-the-shelf device, the heat generation rate per unit volume of the target commercial off-the-shelf device is calculated. Based on the physical parameters and the heat generation rate per unit volume, the instantaneous temperature field of the target commercial off-the-shelf device is calculated; Based on the thermal conductivity, contact thermal conductivity coefficient, ambient temperature, heat transfer area, volume of the target commercial off-the-shelf device, and boundary conditions of the target model of each structural component in the heat transfer link, the temperature fluctuation value of the target commercial off-the-shelf device affected by the external heat time series data is calculated. The real-time temperature of the target commercial off-the-shelf device is calculated based on the instantaneous temperature field and the temperature fluctuation value.

[0011] Optionally, the management unit is configured to adjust the operating mode of the target commercial off-the-shelf device based on the simulation results, including: The real-time temperature of the target commercial off-the-shelf device is compared with a first threshold; and the maximum temperature fluctuation value of the target commercial off-the-shelf device in the most recent first time period is compared with a second threshold. If the real-time temperature of the target commercial spot device is less than the first threshold, and the maximum temperature fluctuation value of the target commercial spot device in the most recent first time period is less than the second threshold, the operating mode of the target commercial spot device is adjusted to the first mode. If the real-time temperature of the target commercial spot device is greater than or equal to the first threshold, or if the maximum temperature fluctuation of the target commercial spot device in the most recent first time period is greater than or equal to the second threshold, the operating mode of the target commercial spot device is adjusted to the second mode; the operating frequency of the second mode is lower than the operating frequency of the first mode. The simulation unit is also configured to acquire power consumption timing data corresponding to the target task executed by the target commercial off-the-shelf device after adjusting its working mode, and to re-simulate the target model based on the power consumption timing data to obtain new simulation results.

[0012] Optionally, the simulation results include: real-time temperature variations in various regions of the target commercial off-the-shelf device as a function of power consumption; the management unit is further configured to perform the following steps: Based on the simulation results, heat dissipation optimization suggestions are generated for the target commercial off-the-shelf device, including at least one of the following: the heat dissipation material to be adjusted, the number and deployment location of heat dissipation devices, and the operating status of the heat dissipation devices to be adjusted.

[0013] Secondly, embodiments of this application provide a thermal management method for on-orbit satellite COTS devices, applied to the system provided in the first aspect of this application. The method includes: A target model is obtained by modeling the target commercial off-the-shelf device and its heat transfer link; the target commercial off-the-shelf device is deployed in the payload bay of the target satellite; Based on the orbital parameters of the target satellite, calculate the external heat time series data corresponding to the periodic entry and exit of the payload capsule into and out of the Earth's shadow region in orbit; the external heat time series data affects the temperature of the target commercial off-the-shelf device through the heat transfer link; Obtain the power consumption timing data corresponding to the target commercial off-the-shelf device performing the target task; The external heat time series data is used as the boundary condition of the target model. Thermal simulation is performed on the target model based on the power consumption time series data to obtain simulation results. The simulation results include the real-time temperature of the target commercial off-the-shelf device as power consumption changes. Based on the simulation results, the operating mode of the target commercial off-the-shelf device is adjusted.

[0014] The thermal management system for on-orbit satellite COTS devices provided in this application first models the COTS devices deployed in the on-orbit satellite payload bay and their associated heat transfer links using a modeling unit, obtaining a target model. Then, using a thermal environment construction unit, it accurately calculates the time-series data of external heat generated by dynamic thermal radiation experienced by the satellite as it periodically enters and exits the Earth's shadow region, based on the satellite's orbital parameters, obtaining precise time-series data of external heat in the payload bay. Furthermore, using the dynamic external heat time-series data of the payload bay as dynamic boundary values, and combining it with the dynamic external heat and the actual power consumption time-series data collected during the target COTS devices' execution of the target mission, the target model is simulated, yielding simulation results.

[0015] Compared to traditional simulation schemes that treat the satellite's external thermal radiation as a fixed value, this application accurately calculates the dynamic external radiation data experienced by the satellite during its periodic operation in orbit, based on the target satellite's orbital parameters, thus improving simulation accuracy. Furthermore, compared to traditional spacecraft simulation schemes that use static power consumption input, this application utilizes the actual dynamic power consumption timing data of the target COTS device during mission execution as simulation input, which can more accurately reflect the actual thermal behavior of the target COTS device, further improving simulation accuracy. Through a management unit, the operating mode of the target COTS device is adjusted based on the simulation results, enabling dynamic monitoring and performance maintenance of the target COTS device. This ensures that the COTS device operates within a safe temperature range, avoiding performance degradation or safety risks caused by overheating and extending the device's lifespan. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the thermal management system of an on-orbit satellite COTS device according to an embodiment of this application; Figure 2 This is a schematic diagram of the process of performing thermal simulation on the target model in one embodiment of this application; Figure 3 This is a flowchart of a thermal management method for an on-orbit satellite COTS device according to an embodiment of this application. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0019] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of this application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0020] In the various embodiments of this application, it should be understood that the sequence number of each process described below does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0021] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects as detailed in this application.

[0022] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0023] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0024] Figure 1 This is a schematic diagram of a thermal management system 100 for an on-orbit satellite COTS device according to an embodiment of this application. Figure 1 As shown, the system includes: Modeling unit 101 is configured to model the target commercial off-the-shelf device and its heat transfer link to obtain a target model; the target commercial off-the-shelf device is deployed in the payload bay of the target satellite; The thermal environment construction unit 102 is configured to calculate the external heat time series data corresponding to the periodic entry and exit of the payload cabin into and out of the Earth's shadow region in orbit based on the orbital parameters of the target satellite; the external heat time series data affects the temperature of the target commercial off-the-shelf device through the heat transfer link; Simulation unit 103 is configured to acquire power consumption timing data corresponding to the target commercial off-the-shelf device performing the target task; determine the external heat timing data as the boundary condition of the target model; perform thermal simulation on the target model based on the power consumption timing data; and obtain simulation results; the simulation results include: the real-time temperature of the target commercial off-the-shelf device as power consumption changes; Management unit 104 is configured to adjust the operating mode of the target commercial off-the-shelf device based on the simulation results.

[0025] In this embodiment, the system employs dynamic boundary conditions and input power consumption to simulate the thermal behavior of COTS devices (such as Raspberry Pi chips, Atlas chips, high-performance computing chips, etc.) in real-world usage scenarios, and then uses the simulation results to dynamically adjust the operating mode of the COTS devices. First, a modeling unit performs physical modeling of the target COTS device and the heat transfer link it resides in, based on the target COTS device to be thermally simulated. The target COTS device is deployed in the payload bay of the target satellite and periodically operates in orbit alongside the target satellite. During the execution of its mission, in addition to the heat generated by the target COTS device, the payload bay is also affected by thermal radiation from space. The payload bay's outer shell and the target COTS device inside the payload bay are connected by multiple structural components (such as mounting plates, brackets, etc.) to achieve heat transfer between the inside and outside of the payload bay, forming a closed heat transfer link.

[0026] In this embodiment, the modeling unit performs 3D modeling based on the target COTS device and its heat transfer link, according to the actual size, material, and deployment location of the COTS device and each structural component, to obtain the target model. The thermal environment construction unit calculates the time-series data of external heat generated by dynamic thermal radiation on the payload cabin shell during the periodic entry and exit of the satellite into and out of the Earth's shadow region as the satellite operates in orbit, based on the target satellite's orbital parameters.

[0027] COTS devices (such as Raspberry Pi and Atlas chips) exhibit significant nonlinear power fluctuation characteristics in actual operation, specifically as follows: (1) Dynamic load change: Due to the device's own thermal management strategy, the frequency reduction is triggered when the temperature reaches a certain level; (2) Intermittent high power consumption: The power consumption of the chip increases sharply when performing computing tasks, and decreases when idle, showing an irregular change; (3) Environmental coupling effect: The periodic entry and exit of the satellite in orbit into the Earth's shadow area causes the temperature and power of the COTS device to be coupled with each other, and the power of the payload COTS device changes.

[0028] These characteristics lead to a large deviation between the results obtained from traditional equivalent static power consumption simulation schemes and actual measured data (typical error >15%), making it difficult to meet the requirements of high-precision thermal management.

[0029] In this embodiment, the simulation unit uses dynamic external thermal time-series data as boundary conditions and on-orbit measured dynamic power consumption time-series data of the COTS device as simulation input during thermal simulation. This achieves accurate reproduction of the real operating environment of the target COTS device, improving simulation accuracy. By collecting dynamic power consumption time-series data to perform thermal simulation on the target model, the actual thermal behavior of the target COTS device during task execution can be accurately simulated, obtaining accurate real-time temperature changes with power. The management unit monitors the operating status of the target COTS device based on the dynamically output simulation results and adjusts the operating mode of the target COTS device based on the real-time simulation results to maintain the operating performance of the target COTS device, avoid performance degradation or safety risks caused by overheating, and extend the device's lifespan.

[0030] In one embodiment of this application, the modeling unit includes a model building module, configured to perform the following steps: Determine the heat transfer path of the target commercial off-the-shelf device; the heat transfer path is a closed path. Obtain modeling parameters for the target commercial off-the-shelf device and the structural components in the heat transfer link; the structural components include: load chamber shell, mounting plate, passive thermal control components, and support frame; the modeling parameters include: device model, size, material, and deployment location; Based on the modeling parameters of each structural component, the heat transfer capacity level of the structural component is determined; if the heat transfer capacity level of the structural component is first level, the modeling accuracy corresponding to the structural component is determined to be first accuracy; if the heat transfer capacity level of the structural component is second level, the modeling accuracy corresponding to the structural component is determined to be second accuracy; the first level is higher than the second level, and the first accuracy is higher than the second accuracy. Based on the modeling parameters of the target commercial off-the-shelf device, the target commercial off-the-shelf device is modeled in three dimensions using the first precision, and the target commercial off-the-shelf device is modeled as an equivalent thermal resistance model; and based on the modeling parameters of each structural component, each structural component is modeled in three dimensions using the modeling precision corresponding to each structural component. Based on the deployment locations of the target commercial off-the-shelf device and its various structural components, all generated 3D models are assembled to generate the initial target model.

[0031] Traditional spacecraft thermal simulation methods typically employ a single modeling scale. However, for tiny, precision devices like chips, using the same large modeling scale as large components (such as brackets and housings) fails to accurately capture local temperature gradients and hotspot distributions, leading to significant deviations in the thermal simulation results. Conversely, using a smaller modeling scale globally to ensure simulation accuracy for precision devices results in a sharp increase in computational resources and extremely low simulation efficiency. In this embodiment, to balance modeling accuracy and simulation efficiency, the model building module employs mixed-precision modeling for the target COTS device and other structural components in the heat transfer chain.

[0032] Specifically, the closed heat transfer link between the payload bay shell and the target COTS device is first determined. In this embodiment, a closed heat transfer link is constructed, combining the thermal radiation from the macroscopic orbital environment outside the satellite payload bay with the thermal conduction between the payload bay and the microscopic COTS chip components. All structural components in the heat transfer link are identified as the structural components to be modeled, including: macroscopic structural components such as the payload bay shell, mounting plate, passive thermal control components, support frame, etc., and microscopic internal structures of the COTS chip, thermal pads, etc. Modeling parameters for the target COTS device and each structural component are obtained, such as chip type, size, material, and deployment location in the payload bay. Based on these modeling parameters, the heat transfer capacity level of each structural component is determined.

[0033] In practical applications, structural components made of different materials exhibit varying thermal conductivity, resulting in different sensitivities to heat conduction and thus different heat transfer capabilities. For structural components with high heat conduction sensitivity (including COTS chips), their heat transfer capability level is designated as Level 1; conversely, for structural components with low heat conduction sensitivity, their heat transfer capability level is designated as Level 2. In this embodiment, a higher first-level precision is used to model structural components with a first-level heat transfer capability. A lower second-level precision is used to model structural components with a second-level heat transfer capability. Since the target COTS device is highly sensitive to heat conduction, temperature changes directly impact its performance. Therefore, the modeling precision for the target COTS device must be no less than the first-level precision to obtain accurate simulation results and achieve precise thermal control of the target COTS device.

[0034] It is worth noting that in practical applications, the target COTS device can be modeled with a modeling accuracy no lower than the first accuracy, based on the actual simulation efficiency and accuracy requirements, in order to meet the user's more accurate simulation needs for the target COTS device.

[0035] During 3D modeling, the target COTS device is modeled as an equivalent thermal resistance model based on its modeling parameters, facilitating subsequent simulation calculations. Simultaneously, based on the modeling parameters of other structural components in the heat transfer chain, 3D modeling is performed separately using corresponding modeling precision to obtain the corresponding models.

[0036] In practical applications, when the target COTS device is a high-power COTS chip (such as a Raspberry Pi 4B chip or an Atlas chip), its modeling parameters also include the packaging structure and internal material distribution. During modeling, detailed modeling of the internal structure and materials is necessary to ensure accurate simulation of the internal temperature gradient in subsequent thermal analysis. Commercial software such as SOLIDWORKS and UGNX can be used to perform detailed modeling of the target COTS device, heat sinks, and heat transfer components that are in direct contact with the COTS device, using high precision. This ensures that the model conforms to the real-world application scenario in terms of size and materials. Furthermore, for target COTS devices composed of multiple chips, detailed modeling of passive thermal control structures such as thermal pads and films between the individual COTS chips is also required, based on high precision, to ensure that the generated target model accurately reflects the actual operating environment of the target COTS device and improves the accuracy of thermal simulation.

[0037] For large, heat-insensitive objects such as the payload chamber shell and mounting plate, a simplified model with lower precision is used to improve computational efficiency while ensuring the integrity of the heat transfer path. After modeling, the target COTS device and the models of each structural component are assembled according to their respective deployment positions to obtain the initial target model. By simplifying the complex internal structure of the target COTS device into an equivalent thermal resistance network model and coupling it with macroscopic models such as the payload chamber, high-precision heat transfer analysis from the chip level to the chamber level is achieved.

[0038] In one embodiment of this application, the modeling unit further includes a simplification module; the simplification module is configured to perform the following steps: Based on the modeling accuracy corresponding to the target commercial off-the-shelf device and each structural component, the initial target model is meshed using finite element analysis software to obtain a meshed target model. Based on the meshed target model, the following steps are performed to update the target model: Convert the rounded corner structures contained in the meshed target model into right-angle structures; For a structural component with a modeling accuracy of the second accuracy, the protruding structure contained in the structural component is transformed into a planar structure, and the hole structure contained in the structural component is filled.

[0039] During simulation, the complex geometry of the target COTS device presents challenges due to excessive computational load, low efficiency, and even inability to perform calculations directly using the complete model. Therefore, to reduce computational complexity, this embodiment employs finite element analysis software (e.g., ANSYS, UGNX) to mesh the 3D model, automatically identifying the ensemble features of each part and generating a computational mesh. This results in a discretized model based on the target model. The discretized model determines the discretization accuracy of each region in subsequent simulation calculations and influences the stability and convergence of the final simulation results. In subsequent simulations, heat generation and transfer are calculated based on the mesh of this discretized model to ensure stable convergence.

[0040] In this embodiment, the simplification module uses finite element analysis software to mesh structural components and COTS chip models with different modeling accuracies, resulting in discrete meshed target models. The finite element analysis software automatically identifies complex structures and adaptively meshes them based on the geometric features of the model, such as size, shape, and boundary conditions, generating suitable finite element meshes. It also optimizes for different types of materials and geometric features to ensure the integrity of the heat transfer path and computational accuracy. During the model meshing process, a local mesh refinement strategy is adopted. High-density meshes are used for critical heat conduction areas with high heat transfer sensitivity, including the target COTS device and structural component areas in direct contact with the COTS device, to improve simulation accuracy. For non-critical areas with low heat transfer sensitivity, coarser and sparser meshes are used.

[0041] Then, based on the meshed target model, the rounded corner structures contained in the model are optimized and converted into right-angle structures to reduce computational load. For structural components with lower precision (i.e., modeling precision of second precision), such as load cells, supports, and mounting plates, the simplification module optimizes the protruding and perforated structures contained in these components. The nearest plane stretching algorithm is used to compress the protruding structures and fill the perforated structures, converting them into planar structures, thus reducing computational resource consumption while ensuring the integrity of the heat transfer link. Table 1 below shows the specific method of structural optimization of the target model in one embodiment of this application.

[0042] Table 1

[0043] As one embodiment of this application, the modeling unit is configured to mesh the initial target model using finite element analysis software according to the modeling precision corresponding to the target commercial off-the-shelf device and each structural component, including: Using the finite element analysis software, a 3D tetrahedral mesh is used to mesh the structural components with a modeling accuracy of the first precision; the 3D tetrahedral mesh is a TET10 mesh or a TET4 mesh. The target commercial off-the-shelf device was meshed using the finite element analysis software with a TET10 mesh. Using the finite element analysis software, 2D shell element meshes are used to mesh the structural components with a modeling accuracy of second precision; the 2D shell element mesh is any of the following: TRI3 mesh, TRI6 mesh, or QUAD4 mesh.

[0044] In the above embodiment, the simplification module performs mesh generation on the model using finite element analysis software, as follows: (1) A hybrid cell type meshing strategy is adopted. For the target COTS device, a 3D tetrahedral mesh is used for meshing. Given that the TET10 mesh can accurately fit the curved boundaries and small features inside the chip, the TET10 mesh is used to mesh the model of the target COTS device in this embodiment; (2) For structural components of the first precision, when using 3D tetrahedral mesh for meshing, either TET10 mesh or TET4 mesh can be selected. In one embodiment, TET4 mesh is used to mesh the structural component model of the first precision. Compared with TET10 mesh using second-order elements, TET4 mesh has higher computational efficiency and can further reduce the amount of computation in the subsequent simulation process; (2) For structural components with second precision, such as load chamber shells, PCB substrates and other large-area thin-walled structural components, simplified 2D shell unit meshes (such as triangular TRI3 meshes, six-node triangular TRI6 meshes or quadrilateral QUAD4 meshes) are used for meshing to significantly reduce the number of meshes and computational degrees of freedom while ensuring geometric topological integrity.

[0045] In this embodiment, a hybrid element type mesh is used to divide the component models and target COTS device models for different modeling accuracies, generating a meshed target model. This minimizes computational load and simplifies simulation complexity while ensuring simulation accuracy. Subsequent heat transfer simulation calculations are based on this meshed target model, saving computational resources and improving simulation efficiency.

[0046] As one embodiment of this application, the thermal environment construction unit is configured to calculate, based on the orbital parameters of the target satellite, the time-series data of external heat corresponding to the periodic entry and exit of the payload cabin into and out of the Earth's shadow region in orbit, including: Obtain the orbital parameters of the target satellite, including: semi-major axis, inclination, eccentricity, right ascension of the ascending node, and argument of perigee; The orbital period of the target satellite is calculated based on the orbital parameters; Based on the orbital period, the first time period in which the payload cabin is in the Earth's sunlit zone and the second time period in the Earth's shadow zone are determined. During the first time period, the direct solar radiation and the Earth's albedo are calculated based on the orbital parameters and determined as the time-series data of the external heat of the payload cabin; During the second time period, the Earth's infrared radiation is calculated based on the orbital parameters and determined as the time-series data of the external heat of the payload cabin.

[0047] In this embodiment, the external boundary conditions of the target model during simulation are predetermined. The target satellite is subjected to solar radiation during its periodic orbital operation, and the payload bay's external temperature fluctuates periodically due to thermal radiation. As the satellite moves in orbit, it periodically enters and exits the Earth's shadow region over time, experiencing significantly different levels of thermal radiation between the shadow and sunlit areas. Traditional spacecraft thermal simulation schemes typically treat the orbital thermal environment as a constant temperature environment, using a fixed solar radiation constant (e.g., 1367 W / m²) for simulation, neglecting the dynamic influence of orbital parameters on heat flow. This results in significant discrepancies between simulation results and actual conditions. This embodiment uses a thermal environment construction unit to accurately model the satellite's orbital environment, calculating the dynamic external heat time-series data of the payload bay as it changes over time, thus realistically reflecting the changes in external thermal load borne by the target COTS device during on-orbit operation. Furthermore, in subsequent simulations, this realistic dynamic heat time-series data is used as the boundary conditions of the target model, improving simulation accuracy.

[0048] In this embodiment, a dynamic thermal load calculation method based on orbital mechanics is employed. This method accurately models the three external heat sources—solar radiation, Earth's infrared radiation, and Earth's albedo—based on the satellite's actual orbital parameters, achieving thermal boundary condition settings that more closely resemble the real space environment. Specifically, the actual orbital parameters of the target satellite are first obtained, including: the semi-major axis of the orbit. Orbital inclination i, eccentricity e, right ascension of the ascending node Ω, and argument of perigee ω, etc. Based on the semi-major axis of the orbit. Calculate the orbital period T of the target satellite: ; Where μ is the Earth's gravitational constant (3.986 × 10¹). 4 m³ / s²); It is the semi-major axis of the track.

[0049] During its orbital operation, the satellite periodically enters and exits the Earth's shadow, causing significant dynamic changes in the external thermal load. Therefore, based on the target satellite's orbital period T, it is possible to determine the first time period when the payload module is in the Earth's sunlight zone and the second time period when it is in the Earth's shadow zone. During the time the payload module is in the Earth's sunlight zone, it is affected by both direct solar radiation and Earth's albedo radiation.

[0050] Specifically, during the first time period, the heat flux density of the thermal radiation received by the payload compartment includes the heat flux density of direct solar radiation. and the heat flux density of Earth's albedo : (1) Heat flux density of direct solar radiation Taking into account the seasonal variation in the Earth-Sun distance, the calculation method is as follows: ; in, It is the solar constant (1367 W / m²). The mean distance between the Earth and the Sun (1 AU). This represents the actual Earth-Sun distance.

[0051] (2) Earth albedo is the reflection of solar radiation on the Earth's surface, and the heat flux density of Earth albedo radiation. The calculation method is as follows: ; in, This is the Earth's average albedo (approximately 0.3). Earth-satellite angle coefficient; This represents the heat flux density of direct solar radiation.

[0052] During the second time period, the payload compartment is located in the Earth's shadow region and is mainly affected by the Earth's infrared radiation, resulting in a lower heat flux density. The calculation method is as follows: ; in The average emissivity of Earth (approximately 0.6 to 0.9). Stefan-Boltzmann constant ( W / m²·K 4 ); The Earth's average temperature (approximately 255 K); This is the Earth-satellite angle coefficient.

[0053] Based on the heat flux density of the thermal radiation received by the payload compartment in different time periods, the time series data of external heat of the payload compartment is calculated. The calculated time series data of external heat will be used as the boundary conditions of the target model for subsequent dynamic thermal simulation.

[0054] As one embodiment of this application, the thermal environment construction unit is configured to determine, based on the orbital period, a first time period in which the payload cabin is in the Earth's sunlit zone and a second time period in the Earth's shadow zone, including: Based on the orbital period, the solar ephemeris is queried to obtain the direction vector of the sun in the geocentric inertial coordinate system at each moment of the orbital period; Based on the orbital parameters of the target satellite, determine the orbital plane normal vector of the target satellite's orbit; Calculate the angle between the direction vector of the sun in the terrain inertial coordinate system and the normal vector of the orbital plane at each moment of the orbital period; The absolute value of the included angle at each time point is compared with a first threshold. If the absolute value of the included angle is less than the first threshold, the payload compartment is determined to be in the Earth's shadow zone at the corresponding time. If the absolute value of the included angle is greater than or equal to the first threshold, the payload compartment is determined to be in the Earth's sun zone at the corresponding time.

[0055] In one embodiment, the angle (Beta angle) between the orbital plane of the target satellite and the solar vector at each moment is calculated to determine whether the satellite is in the Earth's shadow at that moment, so as to determine the first time period in the satellite's orbital cycle when it is in the Earth's sunlight zone and the second time period when it is in the Earth's shadow zone.

[0056] First, based on the target satellite's orbital period, the solar ephemeris is consulted to obtain the direction vector of the Sun in the geocentric inertial coordinate system at each moment within the orbital period. According to the target satellite's orbital inclination *i* and right ascension of the ascending node *Ω*, the orbital plane normal vector of the satellite's orbit is determined. Based on the Sun's direction vector in the geocentric inertial coordinate system at each moment within the orbital period, and the orbital plane normal vector, the angle between the two at each moment within the orbital period is calculated; this is the Beta angle. The absolute value of this angle is compared with a first threshold. If the absolute value of the angle at a certain moment is less than the first threshold, the payload is determined to be in the Earth's shadow at that moment; if the absolute value of the angle at a certain moment is greater than or equal to the first threshold, the payload is determined to be in the Earth's sunlit area at that moment.

[0057] In subsequent simulations, the corresponding dynamic external heat time series data are calculated based on the orbital parameters of the target satellite and used as the boundary conditions of the target model, thereby enabling the simulation results to accurately reproduce the real on-orbit environment of the target COTS device and improve the accuracy of thermal simulation.

[0058] In one embodiment of this application, the simulation unit is configured to determine the external heat time series data as the boundary condition of the target model, perform thermal simulation on the target model based on the power consumption time series data, and obtain simulation results, including: Obtain the physical parameters of the target commercial off-the-shelf device, including: material density, specific heat capacity, thermal conductivity tensor, and volume; Based on the input power consumption and the volume of the target commercial off-the-shelf device, the heat generation rate per unit volume of the target commercial off-the-shelf device is calculated. Based on the physical parameters and the heat generation rate per unit volume, the instantaneous temperature field of the target commercial off-the-shelf device is calculated; Based on the thermal conductivity, contact thermal conductivity coefficient, ambient temperature, heat transfer area, volume of the target commercial off-the-shelf device, and boundary conditions of the target model of each structural component in the heat transfer link, the temperature fluctuation value of the target commercial off-the-shelf device affected by the external heat time series data is calculated. The real-time temperature of the target commercial off-the-shelf device is calculated based on the instantaneous temperature field and the temperature fluctuation value.

[0059] In this embodiment, when simulating the target model, the simulation unit determines the true temperature of the target COTS device by calculating the temperature impact of the boundary conditions of the payload chamber on the target COTS device. A complete heat transfer loop is formed between the outer shell of the payload chamber and the internal target COTS device, and the temperature fluctuation of the payload chamber shell directly drives the temperature change of the chip as a boundary condition.

[0060] The real-time temperature of the target COTS device is affected by a combination of factors, including the heat generated by the target COTS device itself during operation, and the temperature fluctuation of the payload chamber shell on the target COTS device.

[0061] Specifically, the thermal impact of boundary conditions on the target COTS device is achieved through heat conduction, passing through various structural components in the heat transfer chain, and ultimately acting on the target COTS device. The simulation unit calculates the temperature fluctuation value of the target COTS device at the current moment based on the thermal conductivity, contact thermal conductivity coefficient, ambient temperature, heat transfer area of ​​each structural component in the heat transfer chain, the volume of the target COTS device, and the boundary conditions.

[0062] Specifically, the payload bay shell acts as a heat source, and its temperature changes are transferred to the PCB board and chip of the target COTS device through internal satellite components such as supports, mounting plates, and thermal pads. This process follows Fourier's law of conduction. Between the payload bay shell and the mounting brackets of the internal COTS device, and between the brackets and the COTS device, heat transfer efficiency is limited by contact thermal resistance. During simulation, appropriate orbital parameters are set to simulate the heat flow of the satellite outside its orbit. By rationally configuring the satellite's orbital data, the influence of boundary condition heat flow on the satellite is accurately simulated, thus completing the accurate thermal simulation and verification of the target COTS device in orbit. External heat transfer is calculated using the energy balance expression of the finite element method, solving for the current temperature T. The specific energy balance expression is as follows: ; in, For thermal conductivity tensor (supports anisotropic materials); S is the volume; S is the surface area of ​​the device; The contact thermal conductivity coefficient; For device temperature; Ambient temperature; This represents the area of ​​the device's contact heat transfer.

[0063] For the heat generated by the target COTS device itself, the simulation unit first initiates a finite element simulation to solve for the heat generation rate per unit volume of the device based on the input power consumption of the target COTS device. A transient thermal analysis method is used to accurately simulate the dynamic evolution of the chip temperature distribution by solving the partial differential equations of heat conduction. Based on the above energy balance expression, a transient thermal analysis method is used to solve the partial differential equation of heat conduction for the target COTS device, accurately simulating the dynamic evolution of the temperature distribution of the COTS chip, as follows: ; in, The local heat generation rate per unit volume is based on the input power consumption P and the volume of the target COTS device. V The solution was obtained. The density of the material; Specific heat capacity; For device temperature; For a moment, This is the thermal conductivity tensor (supporting anisotropic materials). This solution method approximates the temperature field through piecewise continuous approximation. The heat primarily originates from the power consumption of the target COTS device and is transferred via heat conduction through the mounting structure. External thermal loads (orbital solar radiation, Earth's albedo, etc.) are applied to the target COTS device through a boundary anchoring strategy. To ensure computational stability and convergence, this embodiment employs an implicit time discretization method, with the following temperature update equation: ; in, This is the mass matrix (characterizing the thermal inertia of the model). This is the stiffness matrix (describing thermal conductivity). This is the time integration coefficient (usually taken as 0.5 to ensure convergence). Heat flow; The time step (e.g., 10s); and These are the temperature vectors for the current time and the next time, respectively.

[0064] During the simulation, the simulation unit iteratively solves the above expression, outputs the real-time temperature of the target COTS device within the simulation time window, and generates the corresponding temperature time series data as the simulation result for subsequent thermal management strategy optimization.

[0065] Optionally, for simulations of high-power COTS chips, a finer time step can be used depending on the actual requirements (e.g., =1s) to improve the accuracy of transient thermal analysis.

[0066] Compared to traditional spacecraft thermal simulation methods that use equivalent average power or fixed operating condition assumptions as thermal load inputs, this embodiment uses the actual dynamic power consumption of the target COTS device (chip) as the simulation input, combined with dynamic boundary conditions calculated based on real orbital parameters, making the simulation process of the target model closer to the real application scenario and improving the accuracy of the simulation results.

[0067] As one embodiment of this application, the management unit is configured to adjust the operating mode of the target commercial off-the-shelf device based on the simulation results, including: The real-time temperature of the target commercial off-the-shelf device is compared with a first threshold; and the maximum temperature fluctuation value of the target commercial off-the-shelf device in the most recent first time period is compared with a second threshold. If the real-time temperature of the target commercial spot device is less than the first threshold, and the maximum temperature fluctuation value of the target commercial spot device in the most recent first time period is less than the second threshold, the operating mode of the target commercial spot device is adjusted to the first mode. If the real-time temperature of the target commercial spot device is greater than or equal to the first threshold, or if the maximum temperature fluctuation of the target commercial spot device in the most recent first time period is greater than or equal to the second threshold, the operating mode of the target commercial spot device is adjusted to the second mode; the operating frequency of the second mode is lower than the operating frequency of the first mode. The simulation unit is also configured to acquire power consumption timing data corresponding to the target task executed by the target commercial off-the-shelf device after adjusting its working mode, and to re-simulate the target model based on the power consumption timing data to obtain new simulation results.

[0068] In this embodiment, after obtaining the simulation results, the management unit adjusts the operating mode of the target COTS device based on the simulation result data to optimize the thermal management of the COTS device. In one embodiment, the real-time temperature of the target COTS device output by the simulation unit is compared with a preset first threshold to determine whether the instantaneous load of the current target COTS device is too high. Furthermore, the maximum temperature fluctuation value of the target COTS device in the most recent first time period (e.g., 10 minutes) is compared with a second threshold to determine whether the current task load fluctuation of the target COTS device is too large. If the real-time temperature of the target COTS device is less than the first threshold and the maximum temperature fluctuation value in the most recent first time period is less than the second threshold, it is determined that the current operating performance of the target COTS device is normal, and therefore the default first mode can continue to be used to execute the task. If the real-time temperature of the target COTS device is greater than or equal to the first threshold, it indicates that the instantaneous temperature of the target COTS device is too high; if the maximum temperature fluctuation value of the target COTS device in the most recent first time period is greater than or equal to the second threshold, it indicates that the current load fluctuation of the target COTS device executing the target task is too large. If the target COTS device experiences excessively high instantaneous temperature or excessive load fluctuations, it is necessary to adjust the operating mode of the target COTS device to a low-frequency, low-power second mode to avoid performance degradation or chip damage due to overheating, thereby ensuring smooth task execution and extending the device's lifespan.

[0069] Optionally, after the adjustment is completed, the simulation unit also performs optimization result verification, including: checking whether the steady-state temperature of the COTS device remains within a safe range, evaluating whether the impact of the task load on the temperature conforms to the simulation prediction, and ensuring that the power consumption of the thermal management strategy is within a reasonable range.

[0070] For example, in the Raspberry Pi 4B COTS device, when the SoC temperature is greater than or equal to 85°C, the operating frequencies of the ARM and GPU cores are limited, thus requiring mandatory thermal control strategies. In addition, the Raspberry Pi 4B implements dynamic voltage and frequency scaling. Various clocks within the SoC (System on Chip) (such as ARM, Core, V3D, ISP, H264, HEVC, etc.) are monitored by firmware. When they are not running at full speed, the voltage supplied to the clock-driven parts is reduced. By dynamically adjusting the chip's voltage and frequency, the SoC's power consumption can be significantly reduced, thereby reducing the total heat generated.

[0071] In addition, in practical applications, the management unit can also adjust the task queue that has not yet been assigned to the target COTS device based on the simulation results of the target COTS device, so as to avoid assigning high-load tasks to the target COTS device.

[0072] After the management unit adjusts the operating mode of the target COTS device, the simulation unit re-collects real-time power consumption data of the target COTS device to obtain new power consumption timing data. Based on the new power consumption timing data, the target model is re-simulated to achieve dynamic monitoring and dynamic thermal management of the target COTS device. This system supports a closed-loop iterative optimization mechanism. During the actual on-orbit operation of the satellite, temperature and power consumption data during the target COTS period are continuously collected and fed back to the system for iterative adjustment and optimization of parameters. The optimization process can use machine learning regression algorithms to analyze temperature change trends and automatically adjust the thermal management strategy through the simulation unit to improve the thermal stability of the COTS device.

[0073] Figure 2 This is a schematic diagram illustrating the process of performing thermal simulation on a target model in one embodiment of this application. For example... Figure 2 As shown, in one embodiment, before performing thermal simulation, the simulation environment is first initialized, including setting boundary conditions (external heat time-series data), thermal load input (power consumption time-series data), and solution parameters (real-time temperature). To accurately simulate the thermal load of the target COTS device in its on-orbit operation environment, this embodiment defines the power consumption input method and operating mode of the COTS device in the initial stage of simulation. Compared to traditional simulation schemes that use fixed power consumption as the simulation input, this embodiment obtains real-time power consumption data of the COTS device under different target mission loads in the default first operating mode through a satellite telemetry system, and stores it as power consumption time-series data (i.e., a dynamic thermal power consumption curve based on a time series), using this power consumption time-series data as the simulation input. Furthermore, key thermophysical parameters are precisely set for heat conduction inside the payload bay, including: the convective heat transfer coefficient characterizing the intensity of convective heat transfer, the surface emissivity determining the radiative heat dissipation capacity, and the contact thermal resistance describing the thermal conductivity of the interface between the device and the heat sink, to ensure accurate measurement of the impact of external boundary conditions on the temperature of the COTS device.

[0074] Based on the initialized simulation environment, simulation operations are executed, and simulation results are continuously generated. Actual simulation result data includes: instantaneous power of the target COTS device, real-time temperature (measured by temperature sensors), and ambient temperature of the payload chamber. The simulation results are output in CSV format for compatibility with various thermal simulation tools.

[0075] After completing the thermal simulation calculations, the simulation results need to be verified to ensure the accuracy of the calculations. Verification methods include: (1) Compare the simulated temperature distribution with the actual temperature data of the target COTS device to check whether the simulated temperature distribution is consistent with the actual operating environment; (2) Error analysis: Calculate the error range between the simulation data and the measured data to ensure that the error between the two is less than 5%; (3) Conduct sensitivity analysis to evaluate the impact of different materials, thermal resistance and boundary conditions on the simulation results, and adjust key parameters to improve simulation accuracy.

[0076] Based on the simulation results, the management unit optimizes the thermal management of the target COTS device, adjusts its operating mode, generates corresponding optimized configurations, and distributes them to the on-orbit target COTS device for application. After implementing the optimized configurations, the simulation unit obtains new power consumption timing data and related parameters from the on-orbit target COTS device, and further adjusts the current simulation environment based on the new data, thereby achieving iterative simulation and thermal management optimization of the target COTS device.

[0077] As one embodiment of this application, the simulation results include: real-time temperature of various regions of the target commercial off-the-shelf device as a function of power consumption; the management unit is further configured to perform the following steps: Based on the simulation results, heat dissipation optimization suggestions are generated for the target commercial off-the-shelf device, including at least one of the following: the heat dissipation material to be adjusted, the number and deployment location of heat dissipation devices, and the operating status of the heat dissipation devices to be adjusted.

[0078] In one embodiment, the simulation unit calculates the real-time temperature of different regions on the target COTS device as input power consumption changes based on the internal structure and physical parameters of the target COTS device, obtaining the thermal simulation results for each region of the target COTS device. The management unit optimizes the heat transfer path of the target COTS device based on the thermal simulation results for each region. Specifically, the management unit can adjust the deployment scheme of the heat-conducting materials in the target COTS device, adjust the number of heat dissipation devices, or adjust the deployment position of the heat dissipation devices based on the thermal simulation results for each region of the target COTS device.

[0079] Specifically, based on simulation results, the management unit analyzes and determines information such as the quantity of heat dissipation materials (e.g., high thermal conductivity silicone grease), heat dissipation devices (e.g., heat sinks), the operating status of heat dissipation devices, and the deployment location of heat dissipation devices that need adjustment. It then generates heat dissipation optimization suggestions to optimize the heat transfer path, improve thermal management efficiency, and reduce the risk of excessively high local temperatures in COTS devices. For example, based on simulation results, the management unit generates optimization suggestions for controlling the operating status of the active cooling system (e.g., fans or liquid cooling modules) to enhance the heat dissipation effect of the target COTS device under high load operation.

[0080] Optionally, after completing the thermal simulation, the management unit generates a thermal management optimization report for the target COTS device based on the optimized thermal management scheme and heat dissipation optimization suggestions based on the simulation results. The report includes temperature distribution data, heat dissipation performance evaluation, comparative analysis before and after optimization, optimization suggestions, etc., to guide the thermal management decisions for subsequent tasks.

[0081] Based on the same inventive concept, one embodiment of this application provides a thermal management method for COTS devices in an on-orbit satellite. Figure 3 This is a flowchart of a thermal management method for an on-orbit satellite COTS device according to an embodiment of this application. Figure 3 As shown, the method includes: S1: Model the target commercial off-the-shelf device and its heat transfer link to obtain the target model; the target commercial off-the-shelf device is deployed in the payload bay of the target satellite; S2: Based on the orbital parameters of the target satellite, calculate the external heat time series data corresponding to the periodic entry and exit of the payload capsule into and out of the Earth's shadow region in orbit; the external heat time series data affects the temperature of the target commercial off-the-shelf device through the heat transfer link; S3: Obtain the power consumption timing data corresponding to the target commercial off-the-shelf device performing the target task; S4: The external heat time series data is determined as the boundary condition of the target model, and thermal simulation is performed on the target model based on the power consumption time series data to obtain simulation results; the simulation results include: the real-time temperature of the target commercial off-the-shelf device as power consumption changes; S5: Based on the simulation results, adjust the operating mode of the target commercial off-the-shelf device.

[0082] As one embodiment of this application, a target commercial off-the-shelf device and its associated heat transfer path are modeled to obtain a target model, including: Determine the heat transfer path of the target commercial off-the-shelf device; the heat transfer path is a closed path. Obtain modeling parameters for the target commercial off-the-shelf device and the structural components in the heat transfer link; the structural components include: load chamber shell, mounting plate, passive thermal control components, and support frame; the modeling parameters include: device model, size, material, and deployment location; Based on the modeling parameters of each structural component, the heat transfer capacity level of the structural component is determined; if the heat transfer capacity level of the structural component is first level, the modeling accuracy corresponding to the structural component is determined to be first accuracy; if the heat transfer capacity level of the structural component is second level, the modeling accuracy corresponding to the structural component is determined to be second accuracy; the first level is higher than the second level, and the first accuracy is higher than the second accuracy. Based on the modeling parameters of the target commercial off-the-shelf device, the target commercial off-the-shelf device is modeled in three dimensions using the first precision, and the target commercial off-the-shelf device is modeled as an equivalent thermal resistance model; and based on the modeling parameters of each structural component, each structural component is modeled in three dimensions using the modeling precision corresponding to each structural component. Based on the deployment locations of the target commercial off-the-shelf device and its various structural components, all generated 3D models are assembled to generate the initial target model.

[0083] As one embodiment of this application, after generating the initial target model, the method further includes: Based on the modeling accuracy corresponding to the target commercial off-the-shelf device and each structural component, the initial target model is meshed using finite element analysis software to obtain a meshed target model. Based on the meshed target model, the following steps are performed to update the target model: Convert the rounded corner structures contained in the meshed target model into right-angle structures; For a structural component with a modeling accuracy of the second accuracy, the protruding structure contained in the structural component is transformed into a planar structure, and the hole structure contained in the structural component is filled.

[0084] As one embodiment of this application, according to the modeling accuracy corresponding to the target commercial off-the-shelf device and each structural component, the initial target model is meshed using finite element analysis software, including: Using the finite element analysis software, a 3D tetrahedral mesh is used to mesh the structural components with a modeling accuracy of the first precision; the 3D tetrahedral mesh is a TET10 mesh or a TET4 mesh. The target commercial off-the-shelf device was meshed using the finite element analysis software with a TET10 mesh. Using the finite element analysis software, 2D shell element meshes are used to mesh the structural components with a modeling accuracy of second precision; the 2D shell element mesh is any of the following: TRI3 mesh, TRI6 mesh, or QUAD4 mesh.

[0085] As one embodiment of this application, based on the orbital parameters of the target satellite, the time-series data of external heat corresponding to the periodic entry and exit of the payload module into and out of the Earth's shadow region in orbit are calculated, including: Obtain the orbital parameters of the target satellite, including: semi-major axis, inclination, eccentricity, right ascension of the ascending node, and argument of perigee; The orbital period of the target satellite is calculated based on the orbital parameters; Based on the orbital period, the first time period in which the payload cabin is in the Earth's sunlit zone and the second time period in the Earth's shadow zone are determined. During the first time period, the direct solar radiation and the Earth's albedo are calculated based on the orbital parameters and determined as the time-series data of the external heat of the payload cabin; During the second time period, the Earth's infrared radiation is calculated based on the orbital parameters and determined as the time-series data of the external heat of the payload cabin.

[0086] As one embodiment of this application, determining the first time period during which the payload module is in the Earth's sunlit zone and the second time period during which it is in the Earth's shadow zone based on the orbital period includes: Based on the orbital period, the solar ephemeris is queried to obtain the direction vector of the sun in the geocentric inertial coordinate system at each moment of the orbital period; Based on the orbital parameters of the target satellite, determine the orbital plane normal vector of the target satellite's orbit; Calculate the angle between the direction vector of the sun in the terrain inertial coordinate system and the normal vector of the orbital plane at each moment of the orbital period; The absolute value of the included angle at each time point is compared with a first threshold. If the absolute value of the included angle is less than the first threshold, the payload compartment is determined to be in the Earth's shadow zone at the corresponding time. If the absolute value of the included angle is greater than or equal to the first threshold, the payload compartment is determined to be in the Earth's sun zone at the corresponding time.

[0087] As one embodiment of this application, the external heat time series data is determined as the boundary condition of the target model, and thermal simulation is performed on the target model based on the power consumption time series data to obtain simulation results, including: Obtain the physical parameters of the target commercial off-the-shelf device, including: material density, specific heat capacity, thermal conductivity tensor, and volume; Based on the input power consumption and the volume of the target commercial off-the-shelf device, the heat generation rate per unit volume of the target commercial off-the-shelf device is calculated. Based on the physical parameters and the heat generation rate per unit volume, the instantaneous temperature field of the target commercial off-the-shelf device is calculated; Based on the thermal conductivity, contact thermal conductivity coefficient, ambient temperature, heat transfer area, volume of the target commercial off-the-shelf device, and boundary conditions of the target model of each structural component in the heat transfer link, the temperature fluctuation value of the target commercial off-the-shelf device affected by the external heat time series data is calculated. The real-time temperature of the target commercial off-the-shelf device is calculated based on the instantaneous temperature field and the temperature fluctuation value.

[0088] As one embodiment of this application, adjusting the operating mode of the target commercial off-the-shelf device based on the simulation results includes: The real-time temperature of the target commercial off-the-shelf device is compared with a first threshold; and the maximum temperature fluctuation value of the target commercial off-the-shelf device in the most recent first time period is compared with a second threshold. If the real-time temperature of the target commercial spot device is less than the first threshold, and the maximum temperature fluctuation value of the target commercial spot device in the most recent first time period is less than the second threshold, the operating mode of the target commercial spot device is adjusted to the first mode. If the real-time temperature of the target commercial spot device is greater than or equal to the first threshold, or if the maximum temperature fluctuation of the target commercial spot device in the most recent first time period is greater than or equal to the second threshold, the operating mode of the target commercial spot device is adjusted to the second mode; the operating frequency of the second mode is lower than the operating frequency of the first mode. The simulation unit is also configured to acquire power consumption timing data corresponding to the target task executed by the target commercial off-the-shelf device after adjusting its working mode, and to re-simulate the target model based on the power consumption timing data to obtain new simulation results.

[0089] As one embodiment of this application, the simulation results include: real-time temperature variations of various regions of the target commercial off-the-shelf device as a function of power consumption; the method further includes: Based on the simulation results, heat dissipation optimization suggestions are generated for the target commercial off-the-shelf device, including at least one of the following: the heat dissipation material to be adjusted, the number and deployment location of heat dissipation devices, and the operating status of the heat dissipation devices to be adjusted.

[0090] Regarding the methods in the above embodiments, the specific manner in which each operation is performed has been described in detail in the embodiments related to the system, and will not be elaborated upon here. The above descriptions are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0091] For the sake of simplicity, the method embodiments are described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to this application. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and components involved are not necessarily essential to this application.

[0092] Those skilled in the art will understand that embodiments of this application can be provided as methods, apparatus, or computer program products. Therefore, embodiments of this application can take the form of entirely hardware embodiments, entirely software embodiments, or embodiments combining software and hardware aspects. Furthermore, embodiments of this application can take the form of computer program products implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0093] This application describes embodiments with reference to flowchart illustrations and / or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of this application. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing terminal device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal device, generate instructions for implementing the flowchart illustrations. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0094] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing terminal device to operate in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0095] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal equipment, causing a series of operational steps to be performed on the computer or other programmable terminal equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable terminal equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0096] Although preferred embodiments of the embodiments of this application have been described, those skilled in the art, once they understand the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, this application is to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of this application.

[0097] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0098] The thermal management system and method for on-orbit satellite COTS devices provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A thermal management system for on-orbit satellite COTS devices, characterized in that, include: The modeling unit is configured to model the target commercial off-the-shelf device and its heat transfer path to obtain the target model; The target commercial off-the-shelf device is deployed in the payload bay of the target satellite; The thermal environment construction unit is configured to calculate the time series data of external heat corresponding to the periodic entry and exit of the payload cabin into and out of the Earth's shadow zone in orbit, based on the orbital parameters of the target satellite. The external heat time series data affects the temperature of the target commercial off-the-shelf device through the heat transfer link; The simulation unit is configured to acquire power consumption timing data corresponding to the target commercial off-the-shelf device performing the target task; The external heat time series data is used as the boundary condition of the target model. Thermal simulation is performed on the target model based on the power consumption time series data to obtain simulation results. The simulation results include the real-time temperature of the target commercial off-the-shelf device as power consumption changes. The management unit is configured to adjust the operating mode of the target commercial off-the-shelf device based on the simulation results.

2. The thermal management system for on-orbit satellite COTS devices according to claim 1, characterized in that, The modeling unit includes a model building module, configured to perform the following steps: Determine the heat transfer path of the target commercial off-the-shelf device; the heat transfer path is a closed path. Obtain the modeling parameters of the target commercial off-the-shelf device and the structural components in the heat transfer link; The structural components include: a payload compartment shell, a mounting plate, passive thermal control components, and a support frame; the modeling parameters include: device model, size, material, and deployment location; Based on the modeling parameters of each structural component, the heat transfer capacity level of the structural component is determined; if the heat transfer capacity level of the structural component is first level, the modeling accuracy corresponding to the structural component is determined to be first accuracy; if the heat transfer capacity level of the structural component is second level, the modeling accuracy corresponding to the structural component is determined to be second accuracy; the first level is higher than the second level, and the first accuracy is higher than the second accuracy. Based on the modeling parameters of the target commercial off-the-shelf device, the target commercial off-the-shelf device is modeled in three dimensions using the first precision, and the target commercial off-the-shelf device is modeled as an equivalent thermal resistance model; and based on the modeling parameters of each structural component, each structural component is modeled in three dimensions using the modeling precision corresponding to each structural component. Based on the deployment locations of the target commercial off-the-shelf device and its various structural components, all generated 3D models are assembled to generate the initial target model.

3. The thermal management system for on-orbit satellite COTS devices according to claim 2, characterized in that, The modeling unit further includes a simplification module; the simplification module is configured to perform the following steps: Based on the modeling accuracy corresponding to the target commercial off-the-shelf device and each structural component, the initial target model is meshed using finite element analysis software to obtain a meshed target model. Based on the meshed target model, the following steps are performed to update the target model: Convert the rounded corner structures contained in the meshed target model into right-angle structures; For a structural component with a modeling accuracy of the second accuracy, the protruding structure contained in the structural component is transformed into a planar structure, and the hole structure contained in the structural component is filled.

4. The thermal management system for on-orbit satellite COTS devices according to claim 3, characterized in that, The modeling unit is configured to mesh the initial target model using finite element analysis software according to the modeling precision corresponding to the target commercial off-the-shelf device and each structural component, including: Using the finite element analysis software, a 3D tetrahedral mesh is used to mesh the structural components with a modeling accuracy of the first precision; the 3D tetrahedral mesh is a TET10 mesh or a TET4 mesh. The target commercial off-the-shelf device was meshed using the finite element analysis software with a TET10 mesh. Using the finite element analysis software, 2D shell element meshes are used to mesh the structural components with a modeling accuracy of second precision; the 2D shell element mesh is any of the following: TRI3 mesh, TRI6 mesh, or QUAD4 mesh.

5. The thermal management system for on-orbit satellite COTS devices according to claim 1, characterized in that, The thermal environment construction unit is configured to calculate, based on the orbital parameters of the target satellite, the time-series data of external heat corresponding to the periodic entry and exit of the payload module into and out of the Earth's shadow region in orbit, including: Obtain the orbital parameters of the target satellite, including: semi-major axis, inclination, eccentricity, right ascension of the ascending node, and argument of perigee; The orbital period of the target satellite is calculated based on the orbital parameters; Based on the orbital period, the first time period in which the payload cabin is in the Earth's sunlit zone and the second time period in the Earth's shadow zone are determined. During the first time period, the direct solar radiation and the Earth's albedo are calculated based on the orbital parameters and determined as the time-series data of the external heat of the payload cabin; During the second time period, the Earth's infrared radiation is calculated based on the orbital parameters and determined as the time-series data of the external heat of the payload cabin.

6. The thermal management system for on-orbit satellite COTS devices according to claim 5, characterized in that, The thermal environment construction unit is configured to determine, based on the orbital period, a first time period in which the payload cabin is in Earth's sunlit zone and a second time period in Earth's shadow zone, including: Based on the orbital period, the solar ephemeris is queried to obtain the direction vector of the sun in the geocentric inertial coordinate system at each moment of the orbital period; Based on the orbital parameters of the target satellite, determine the orbital plane normal vector of the target satellite's orbit; Calculate the angle between the direction vector of the sun in the terrain inertial coordinate system and the normal vector of the orbital plane at each moment of the orbital period; The absolute value of the included angle at each time point is compared with a first threshold. If the absolute value of the included angle is less than the first threshold, the payload compartment is determined to be in the Earth's shadow zone at the corresponding time. If the absolute value of the included angle is greater than or equal to the first threshold, the payload compartment is determined to be in the Earth's sun zone at the corresponding time.

7. The thermal management system for on-orbit satellite COTS devices according to claim 1, characterized in that, The simulation unit is configured to determine the external heat time-series data as the boundary conditions of the target model, perform thermal simulation on the target model based on the power consumption time-series data, and obtain simulation results, including: Obtain the physical parameters of the target commercial off-the-shelf device, including: material density, specific heat capacity, thermal conductivity tensor, and volume; Based on the input power consumption and the volume of the target commercial off-the-shelf device, the heat generation rate per unit volume of the target commercial off-the-shelf device is calculated. Based on the physical parameters and the heat generation rate per unit volume, the instantaneous temperature field of the target commercial off-the-shelf device is calculated; Based on the thermal conductivity, contact thermal conductivity coefficient, ambient temperature, heat transfer area, volume of the target commercial off-the-shelf device, and boundary conditions of the target model of each structural component in the heat transfer link, the temperature fluctuation value of the target commercial off-the-shelf device affected by the external heat time series data is calculated. The real-time temperature of the target commercial off-the-shelf device is calculated based on the instantaneous temperature field and the temperature fluctuation value.

8. The thermal management system for on-orbit satellite COTS devices according to claim 1, characterized in that, The management unit is configured to adjust the operating mode of the target commercial off-the-shelf device based on the simulation results, including: The real-time temperature of the target commercial off-the-shelf device is compared with a first threshold; and the maximum temperature fluctuation value of the target commercial off-the-shelf device in the most recent first time period is compared with a second threshold. If the real-time temperature of the target commercial spot device is less than the first threshold, and the maximum temperature fluctuation value of the target commercial spot device in the most recent first time period is less than the second threshold, the operating mode of the target commercial spot device is adjusted to the first mode. If the real-time temperature of the target commercial spot device is greater than or equal to the first threshold, or if the maximum temperature fluctuation of the target commercial spot device in the most recent first time period is greater than or equal to the second threshold, the operating mode of the target commercial spot device is adjusted to the second mode; the operating frequency of the second mode is lower than the operating frequency of the first mode. The simulation unit is also configured to acquire power consumption timing data corresponding to the target task executed by the target commercial off-the-shelf device after adjusting its working mode, and to re-simulate the target model based on the power consumption timing data to obtain new simulation results.

9. The thermal management system for on-orbit satellite COTS devices according to claim 1, characterized in that, The simulation results include: real-time temperature variations in various regions of the target commercial off-the-shelf device as power consumption changes; the management unit is also configured to perform the following steps: Based on the simulation results, heat dissipation optimization suggestions are generated for the target commercial off-the-shelf device, including at least one of the following: the heat dissipation material to be adjusted, the number and deployment location of heat dissipation devices, and the operating status of the heat dissipation devices to be adjusted.

10. A thermal management method for COTS devices in an on-orbit satellite, characterized in that, Applied to the system as described in any one of claims 1-9, comprising: A target model is obtained by modeling the target commercial off-the-shelf device and its heat transfer link; the target commercial off-the-shelf device is deployed in the payload bay of the target satellite; Based on the orbital parameters of the target satellite, calculate the external heat time series data corresponding to the periodic entry and exit of the payload capsule into and out of the Earth's shadow region in orbit; the external heat time series data affects the temperature of the target commercial off-the-shelf device through the heat transfer link; Obtain the power consumption timing data corresponding to the target commercial off-the-shelf device performing the target task; The external heat time series data is used as the boundary condition of the target model. Thermal simulation is performed on the target model based on the power consumption time series data to obtain simulation results. The simulation results include the real-time temperature of the target commercial off-the-shelf device as power consumption changes. Based on the simulation results, the operating mode of the target commercial off-the-shelf device is adjusted.

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