Test device for in-vehicle storage device and temperature control method

Abstract

This application relates to a testing apparatus and temperature control method for vehicle-mounted storage devices, including a housing and a testing platform disposed within the housing. Each testing platform is equipped with at least one temperature control component. Each temperature control component includes a temperature control board, a first temperature sensor, a second temperature sensor, a heating element, and a test socket for the device under test (DUT). The temperature control board is electrically connected to the first temperature sensor, the second temperature sensor, and the heating element. The first temperature sensor and the heating element are respectively disposed inside the DUT test socket. The first temperature sensor is used to detect the temperature inside the DUT test socket. The second temperature sensor is disposed on the temperature control board and is used to detect the temperature of the temperature control board. The temperature control board automatically shuts off heating and temperature control, and cools the device by utilizing the internal temperature of the housing. This application has low testing costs, and the testing platform is not easily damaged; readily available testing platforms can be used, reducing development costs and design complexity.

Description

Technical Field

[0001] This application relates to the field of testing technology, and more specifically, to a testing apparatus and temperature control method for vehicle-mounted storage devices. Background Technology

[0002] Memory chips are widely used in various electronic devices. Before mass production and shipment, they typically undergo high and low temperature testing. This is especially true for automotive storage devices (memory chips), where the operating temperature significantly impacts their performance and the stability of the entire vehicle system. Ensuring reliable operation of memory chips under extreme high and low temperature environments has become a key research topic for researchers in this field.

[0003] To verify the performance of automotive storage chips under extreme temperatures, high and low temperature operation tests are typically required. Existing high and low temperature operation test solutions mainly include two types: one is to place the integrated system-on-chip (SoC) platform and the device under test (DUT) together in a test chamber for high and low temperature testing. However, this method can easily cause irreversible damage to the storage chip during high-temperature testing, and the high cost of the SoC platform significantly increases testing costs. Furthermore, since the SoC and DUT are in the same temperature testing environment, it is difficult to determine whether the problem originates with the SoC or the DUT when a problem occurs. The other method uses a custom test chamber to separate the host / SoC (located in a normal temperature environment) from the DUT (located in high and low temperature environments). However, custom chambers are expensive, and the separate design of the SoC and DUT is complex, with interfaces prone to damage.

[0004] In related technologies, for example, CN108037321A prevents condensation during low-temperature testing by setting up an enclosure and cover and introducing dry gas, but it does not consider the reliability of the test circuit board (such as the temperature control board) itself in ultra-low temperature environments. CN113740699A integrates the temperature control component into the test base cover and achieves heating and temperature measurement of the device under test through pressure block conduction, but it only sets a single temperature sensor to detect the temperature of the device under test and does not independently monitor and protect the working status of its own temperature control circuit board at low temperatures.

[0005] Therefore, when conducting low-temperature tests (such as below -40°C), the test circuit board in the prior art may fail or be damaged due to excessive cooling, leading to test interruption or incorrect results. This application aims to solve this problem of "low-temperature reliability of the test device itself," which has been overlooked in the prior art. Summary of the Invention

[0006] In view of this, this application provides a testing apparatus for an in-vehicle storage device to solve or partially solve the above-mentioned problems.

[0007] The technical solution adopted by this application to solve the above-mentioned technical problems is: A testing device for in-vehicle storage devices is proposed. The testing device includes a housing providing an adjustable high-temperature or low-temperature environment; a testing platform housed within the housing; and at least one temperature control component on each testing platform. Each temperature control component includes a temperature control plate, a first temperature sensor, a second temperature sensor, a heating element, and a test socket for the device under test (DUT). The temperature control plate is electrically connected to the first temperature sensor, the second temperature sensor, and the heating element. The first temperature sensor and the heating element are respectively located inside the DUT test socket. The first temperature sensor detects the temperature inside the DUT test socket, reflecting the ambient temperature of the DUT. The second temperature sensor is located inside the test socket. The heating element is directly in contact with the temperature control board and is used to detect the real-time temperature of the temperature control board, which reflects the operating temperature of the temperature control board itself. The temperature control board is configured to execute the following temperature control strategy: In high-temperature test mode, the heating element is controlled to heat according to the detection result of the first temperature sensor so that the test socket of the device under test reaches a preset high-temperature target temperature; In low-temperature test mode, the heating element is kept in the off state, and the device under test is tested entirely by relying on the low-temperature environment provided by the chamber. When the temperature detected by the second temperature sensor is lower than the preset low-temperature safety threshold, the temperature control board issues an alarm signal or stops the test to prevent the temperature control board from being damaged at excessively low temperatures.

[0008] Furthermore, the device under test (DUT) test socket includes a top cover, a base, an opening and closing structure, and a DUT placement position. The opening and closing structure is disposed on the top cover and the base, and includes an open state and a closed state. When the opening and closing structure is in the open state, the DUT placement position is exposed to allow the DUT to be placed or removed. When the opening and closing structure is in the closed state, the top cover is pressed against the base to fix the DUT and perform testing.

[0009] Furthermore, the opening and closing structure includes a fixing member, a fixing post, and a spring member; one side of the upper cover is hinged to the base so that the upper cover can be flipped relative to the base; the base is fixed on the test platform, and the device under test is placed on the base; the fixing member is located at the end of the upper cover away from the hinge side, and the fixing post is located on the base at a position corresponding to the fixing member; the spring member is located between the upper cover and the fixing member; the fixing member has a pressing part and at least one bending part, and the side of the fixing member facing the upper cover and the side of the upper cover facing the fixing member are respectively provided with holes; the pressing part is correspondingly arranged with the spring member, and the spring member is movably arranged in the hole; when the pressing part is pressed, the spring member undergoes elastic deformation, and the bending part hooks or disengages from the fixing post, so that the opening and closing structure is in the closed state or the open state.

[0010] Furthermore, the number and position of the bending portions correspond to the fixed posts. A heat-conducting block is provided at the bottom of the upper cover to conduct heat generated by the heating element connected to the temperature control plate to the device under test (DUT) in the DUT placement position; the shape of the heat-conducting block corresponds to the DUT placement position; the first temperature sensor is located inside the upper cover or on the heat-conducting block and is in contact with the heat-conducting block; when the opening / closing structure is in the closed state, the heat-conducting block is embedded in the DUT placement position to conduct heat in close contact with the DUT.

[0011] Furthermore, a height adjustment component is fixedly provided on one side of the heat-conducting block for adjusting the distance between the heat-conducting block and the placement position of the device under test according to the thickness of the device under test; the height adjustment component includes an adjustment member, which is fixedly connected to the heat-conducting block and is provided with an adjustment thread; the upper cover is provided with a threaded hole corresponding to the adjustment thread; the adjustment member is located in the threaded hole, and rotating the adjustment member makes the thread engage with the threaded hole to adjust the height of the heat-conducting block relative to the placement position of the device under test.

[0012] Furthermore, the housing is provided with a support structure; the test platform is mounted on the support structure; the housing is provided with a sliding structure for placing and removing the support structure; the support structure is provided with a sliding body corresponding to the sliding structure.

[0013] Furthermore, the support structure is provided with a pull-out position and a push-in position; when in the pull-out position, the support structure is at least partially exposed outside the housing to facilitate operation of the display screen, control switch and indicator light, as well as placement or removal of the device under test; when in the push-in position, the support structure is entirely located inside the housing for high and low temperature testing.

[0014] This application also proposes a temperature control method for a test apparatus for an on-board storage device, applied in the test apparatus for the on-board storage device described in any of the above claims. The method includes: acquiring a first temperature inside the test socket of the device under test detected by a first temperature sensor, and acquiring a second temperature of the temperature control board detected by a second temperature sensor; and performing the following control based on the first temperature, the second temperature, and the currently selected test mode: If it is a high temperature test mode, the heating power of the heating element is adjusted in a closed loop according to the deviation between the first temperature and the preset high temperature target temperature, so that the first temperature reaches the high temperature target temperature. If it is a low temperature test mode, then low temperature cooling control is executed. The control includes: turning off the heating element, and dynamically adjusting the target ambient temperature of the chamber according to the difference between the second temperature and the preset low temperature target temperature, so that the first temperature in the test socket of the device under test will drop synchronously to the low temperature target temperature in the process of passive cooling only through heat conduction without active heating. In addition, when the second temperature is lower than a preset low-temperature safety threshold, a safety protection action is performed to prevent the temperature control board from being damaged due to overcooling.

[0015] Furthermore, in the high-temperature test mode, the step of adjusting the heating power of the heating element in a closed loop includes: Calculate the deviation between the first temperature and the high-temperature target temperature; Calculate the proportional value, cumulative value of the integral term, and differential value of the deviation; The control output value is obtained by adding the proportional value, the cumulative value of the integral term, and the derivative value. The duty cycle of the pulse width modulation signal is determined based on the control output value to drive the heating element; Specifically, when the absolute value of the deviation is greater than a preset deviation threshold, the cumulative value of the integral term is set to zero; when the absolute value of the deviation is less than or equal to the deviation threshold, the cumulative value of the integral term is accumulated, and the accumulated value of the integral term is limited to a preset integral limit range.

[0016] Furthermore, the high-temperature test mode also includes: When the first temperature enters the preset high temperature target temperature window and remains within the preset time, and the duty cycle of the currently output pulse width modulation signal is lower than the preset duty cycle threshold, it is determined that it has entered a stable state and a high temperature ready signal is generated.

[0017] Furthermore, in the low-temperature test mode, the low-temperature cooling control also includes: After the heating element is turned off, when the first temperature is lower than or equal to the upper limit of the preset low temperature target temperature window and lasts for a second preset time, it is determined that a stable state has been entered, and a low temperature ready signal is generated.

[0018] Furthermore, the safety protection actions include at least one of: turning off the heating element, issuing an alarm signal, and stopping the test.

[0019] Furthermore, the preset safety threshold is lower than the lower limit of the low-temperature target temperature window corresponding to the low-temperature test mode.

[0020] Furthermore, the temperature control method also includes: after obtaining the first temperature and the second temperature, if it is determined that any of the following conditions are met, then a safety protection state is entered: the first temperature exceeds a preset over-temperature protection threshold, the second temperature is lower than the safety threshold, or the first temperature or the second temperature exceeds a reasonable range and continues for a third preset time.

[0021] Furthermore, the temperature control method also includes: when the output command of the heating element is detected to be turned on but the actual current is zero, the heating element is determined to be open-circuited, and a safety protection action is performed.

[0022] Furthermore, the temperature control method also includes: when the second temperature is higher than the preset temperature control board over-temperature threshold, forcibly shutting down the heating element.

[0023] Furthermore, the temperature control method also includes: in the low-temperature test mode, the temperature control board performs the safety protection action independently of the first temperature sensor based on the real-time temperature of the temperature control board detected by the second temperature sensor, so that the test is stopped in time when the temperature of the temperature control board itself is too low, regardless of whether the first temperature in the test socket of the device under test has reached the low-temperature target temperature.

[0024] Furthermore, the step of dynamically adjusting the target ambient temperature of the enclosure based on the difference between the second temperature and the preset low-temperature target temperature includes: In response to the difference being greater than a preset temperature difference threshold, the target ambient temperature of the chamber is set to a value lower than the second temperature, and the difference between the target ambient temperature of the chamber and the second temperature increases as the difference increases, so as to achieve rapid cooling.

[0025] Furthermore, temperature control methods also include: The performance data of the device under test during read and write operations is collected in real time through the high-speed communication interface set on the test platform. The performance data is associated with and stored with the current first temperature and second temperature according to the timestamp, and temperature and performance curves are generated.

[0026] Furthermore, temperature control methods also include: In response to the instruction to switch from high temperature test mode to low temperature test mode, the output of the heating element is set to zero and the cumulative value of the integral term is reset. At the same time, a cooling wait instruction is generated. The cooling wait instruction is used to indicate the suspension of high-speed read and write operations on the device under test to avoid the device under test itself generating heat and affecting the cooling rate. In response to the command to switch from low temperature test mode to high temperature test mode, the heating element is kept off and the control parameters are reinitialized. At the same time, a preheating wait command is generated to indicate that power supply to the device under test is suspended to prevent the device under test from generating a large current surge when starting at low temperature.

[0027] Furthermore, temperature control methods also include: In the high-temperature test mode, the heating element is driven with constant power, and the heating rate of the first temperature sensor is monitored. When the heating rate is lower than the preset rate threshold, it is determined that there is poor contact between the heat-conducting block in the test socket of the device under test and the device under test, and an alarm signal is issued.

[0028] The testing apparatus and temperature control method for vehicle-mounted storage devices proposed in this application separate the ambient temperature control of the device under test (V2D, V2D, V2D) (first temperature sensor) from the temperature protection of the temperature control board itself (second temperature sensor). This achieves accurate wide-temperature testing of the V2D while preventing the temperature control board from failing at ultra-low temperatures, thus solving the problem of test platform fragility. Furthermore, in low-temperature testing mode, completely passive cooling is employed, and the cooling rate of the chamber is dynamically adjusted according to the temperature control board temperature, effectively preventing thermal shock to the V2D and temperature control board caused by excessively rapid cooling, improving test consistency and reliability. The V2D test socket features an openable and height-adjustable design, is compatible with various V2D storage modules such as SD cards, TF cards, USB flash drives, eMMC, UFS, and SSDs, and its dual-spring pressing structure ensures stability during long-term cyclic testing. The integrated temperature control method, heating element open-circuit detection, multi-level temperature anomaly protection, and smooth mode switching logic ensure the safety of the testing apparatus. Attached Figure Description

[0029] Figure 1 This is a block diagram illustrating the integration of a SOC and a DUT in a high and low temperature test chamber according to one embodiment of this application. Figure 2 This is a block diagram illustrating the high and low temperature test of the storage device in the enclosure according to one embodiment of this application; Figure 3 This is a front view schematic diagram of the test device in one embodiment of this application; Figure 4This is a block diagram of a temperature control component in one embodiment of this application; Figure 5 This is a three-dimensional schematic diagram of the temperature control component located on a test platform in one embodiment of this application; Figure 6 This is a perspective view of the base in one embodiment of this application; Figure 7 This application Figure 5 A partially enlarged schematic diagram of the opening and closing structure of the test socket for the device under test; Figure 8 This is a three-dimensional schematic diagram of a test socket for a device under test in one embodiment of this application; Figure 9 This is a three-dimensional schematic diagram of the test socket of the device under test from another angle in one embodiment of this application; Figure 10 This application Figure 9 A partially enlarged schematic diagram of the elastic component; Figure 11 This is a three-dimensional schematic diagram of the test socket of the device under test from another angle in one embodiment of this application; Figure 12 This is a three-dimensional schematic diagram of the support structure in one embodiment of this application; Figure 13 This is a flowchart of a temperature control method for a test apparatus for an on-board storage device according to an embodiment of this application.

[0030] Labeling Explanation: 1. Chamber; 2. Test Platform; 3. Temperature Control Component; 4. Temperature Control Board; 5. First Temperature Sensor; 6. Second Temperature Sensor; 7. Heating Component; 8. Test Component Holder; 801. Top Cover; 802. Base; 803. Opening and Closing Structure; 804. Test Component Placement Position; 805. Fixing Component; 806. Elastic Component; 807. Pressing Part; 808. Bending Part; 809. Hole; 810. Heat Conducting Block; 811. Height Adjustment Component; 812. Adjusting Component; 813. Adjusting Thread; 814. Temperature Probe; 816. Support Structure; 817. Sliding Structure; 818. Sliding Body; 815. Display Screen; 819. Control Switch; 820. Indicator Light; 821. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0032] Figure 1 This is a block diagram illustrating the integration of a SOC and a DUT within a high and low temperature test chamber. Please refer to it. Figure 1If the system-on-a-chip (SoC) platform and the device under test (DUT) are integrated and placed together in a high and low temperature test chamber for wide temperature testing, the high temperature (e.g., 105°C) can easily cause irreversible damage to the SoC platform. The SoC platform is expensive, which significantly increases the testing cost. At the same time, the fault is difficult to locate, and it is impossible to determine whether the SoC platform is abnormal or the DUT itself is faulty.

[0033] Figure 2 This is a schematic diagram illustrating the high and low temperature testing of a storage device in a high and low temperature test chamber. For example... Figure 2 As shown, another approach is to place the SOC platform in a normal temperature environment and the DUT in a high or low temperature environment, separated by a thermal insulation structure. However, this approach suffers from problems such as high cost of test chamber modification, reduced signal integrity due to high-speed signal lines transmitting across temperature zones, and easy damage to interface connectors.

[0034] In one embodiment, a testing apparatus is provided for testing in-vehicle storage devices (such as eMMC, UFS, SSD, and other storage chips / modules, hereinafter the same). Figure 3 As shown, Figure 3 This is a front view schematic diagram of a test apparatus for an on-board storage device according to one embodiment of this application. Please refer to... Figure 3 The testing device includes a housing 1, a testing platform 2, and a temperature control component 3. Optionally, multiple temperature control components 3 can be placed on one testing platform 2 to support parallel testing, thereby improving testing efficiency.

[0035] Specifically, chamber 1 provides an adjustable high-temperature or low-temperature environment. Chamber 1 is equipped with a heater, a refrigerator, and a circulating fan, capable of stabilizing the temperature within chamber 1 within a range of, for example, -50°C to 150°C, according to set values. Test platform 2 is located inside chamber 1 and is used to house the device under test (DUT, such as an automotive storage device). The number of temperature control components 3 is determined according to testing requirements; each test platform 2 may have at least one temperature control component 3. Test platform 2 may be a flat plate structure with a power interface and a communication interface for supplying power to the temperature control components 3 and transmitting control signals.

[0036] Furthermore, such as Figure 3As shown, the housing 1 contains a support structure 817, and the test platform 2 is mounted on the support structure 817. The support structure 817 can be a frame with multiple slots, allowing the test platform 2 to be placed on the support structure 817 so that multiple devices under test can be pushed into the housing 1 together for temperature testing, and can be removed together after testing. Furthermore, the support structure 817 can have multiple stepped slots, with the inward perimeter of the stepped slots being smaller than the size of the outer slots, preventing the test platform 2 from shifting or falling after being placed in the stepped slots. Preferably, the support structure 817 can be configured as a pull-out structure.

[0037] like Figure 3 As shown, the housing 1 is provided with a sliding structure 818, such as a groove, for placing and removing the support structure 817, which facilitates the removal of the support structure 817 and the test platform 2 and their simultaneous insertion, thereby improving testing efficiency.

[0038] Figure 12 This is a three-dimensional schematic diagram of the support structure in one embodiment of this application. Please refer to it. Figure 12 The support structure 817 is provided with a sliding body 815 corresponding to the sliding structure 818. The sliding body 815 slides in conjunction with the sliding structure 818 to pull out or push in the support structure 817.

[0039] In one embodiment, the support structure 817 has a pull-out position and a push-in position. When in the pull-out position, the support structure 817 is at least partially exposed outside the housing 1, facilitating user operation of the display screen 819, control switch 820, and indicator light 821 on the test platform, as well as replacement of the device under test. When in the push-in position, the support structure 817 is entirely located inside the housing 1 for high-temperature testing. Furthermore, the pull-out position may be equipped with a handle to facilitate pulling the support structure 817 out of the housing 1. When in the push-in position, the support structure 817 is entirely located inside the housing 1 for high-temperature testing.

[0040] Figure 4 This is a block diagram of a temperature control component in one embodiment of this application. Figure 4 As shown, each temperature control component 3 includes a temperature control board 4, a first temperature sensor 5, a second temperature sensor 6, a heating element 7, and a test socket 8 for the device under test. The temperature control board 4 is electrically connected to the first temperature sensor 5, the second temperature sensor 6, and the heating element 7, respectively.

[0041] The temperature control board 4 integrates a microcontroller unit (MCU), a power drive circuit, and a communication module for executing temperature control logic and communicating with an external host computer. The microcontroller internally stores the control program / firmware code and has an analog-to-digital conversion interface and a power drive interface. Preferably, the temperature control board 4 is a standalone circuit module integrated into the test platform.

[0042] The heating element 7 can be a heating rod or other electronic components with heating function, such as a heating film or ceramic heating plate, used to raise the temperature inside the test socket 8 of the device under test when needed.

[0043] The first temperature sensor 5 and the heating element 7 are respectively disposed inside the test socket 8 of the device under test. The first temperature sensor 5 is used to detect the temperature inside the test socket 8 of the device under test, which is approximately equal to the surface temperature of the device under test (such as eMMC, UFS, SSD and other storage modules) or the ambient temperature, and its output signal is collected by the temperature control board 4. The second temperature sensor 6 is disposed on the temperature control board 4 and is in direct contact with the temperature control board 4, for example, it is attached to the temperature control board 4 near key heat-generating or sensitive components (such as MCU, power management chip) by thermally conductive adhesive, and is used to detect the real-time temperature of the temperature control board 4, which reflects the operating temperature of the temperature control board 4 itself.

[0044] It is important to emphasize that, unlike existing technologies (such as CN113740699A) which only use a single temperature sensor to detect the temperature of the device under test, this embodiment specifically adds a second temperature sensor 6. This second sensor 6 is not used to control the ambient temperature of the device under test, but rather to monitor the real-time operating temperature of the temperature control board 4 itself. Since the temperature control board 4 integrates low-temperature sensitive electronic components such as an MCU and a power management chip, these components typically have a minimum reliable operating temperature (e.g., -40°C). When the ambient temperature inside the enclosure 1 drops below this threshold, the temperature control board 4 may suffer irreversible damage. By setting the second temperature sensor 6 and configuring independent low-temperature safety protection logic, this embodiment can promptly alarm or stop the test when the temperature control board 4 approaches its reliable operating limit, thereby protecting the testing device itself.

[0045] The temperature control board 4 is configured to execute a temperature control strategy in either a high-temperature test mode or a low-temperature test mode. Specifically, in the high-temperature test mode, the temperature control board 4 compares the temperature value detected by the first temperature sensor 5 with a preset high-temperature target value (e.g., 105°C). For example, using a proportional-integral-derivative (PID) control algorithm, the temperature (first temperature) inside the test socket 8 of the device under test is rapidly increased and stabilized near the preset high-temperature value by adjusting the duty cycle or heating power of the heating element 7.

[0046] In one embodiment, when multiple temperature control components 3 are provided on the test platform 2, the temperature control boards 4 of each component are interconnected via a communication bus (e.g., I²C or CAN bus) and connected to a main controller. This main controller is configured to perform a consistency calibration procedure: in high-temperature test mode, the heating elements 7 of all temperature control components 3 are turned off, relying solely on the environment of the chamber 1 to stabilize the temperature within the test socket 8 of each device under test at the same reference temperature (e.g., +25°C); then, the detection values ​​of each first temperature sensor 5 are read, the deviation of each sensor relative to the reference value is calculated, and this deviation is stored as the individual offset of each temperature control component. In subsequent closed-loop control, each temperature control board corrects the readings of its respective first temperature sensor 5 according to the individual offset to ensure that multiple devices under test have a consistent thermal environment at the same set temperature.

[0047] This consistency calibration function effectively eliminates errors caused by the temperature sensor itself and the tolerance of its installation position, improving the comparability of batch test data and the reliability of test results.

[0048] In low-temperature testing mode, the temperature control board 4 shuts down the heating element 7, entering a completely passive cooling state. This means that the device under test is tested entirely by relying on the low-temperature environment (e.g., -40°C) provided by the cooling system of the enclosure 1 itself. In this mode, the heating element 7 does not generate any heat to avoid residual heat interfering with the stability of the low-temperature environment, and also to avoid damage caused by frequent activation of the heating element at low temperatures.

[0049] Specifically, the enclosure 1 actively cools down the internal ambient temperature to a preset low-temperature target temperature (e.g., -40℃). Simultaneously, the temperature control board 4 continuously reads the value from the second temperature sensor 6. When the temperature detected by the second temperature sensor 6 falls below a preset low-temperature safety threshold (e.g., -45℃, which is below the minimum test temperature), the temperature control board 4 issues an alarm signal or stops the test to prevent damage to the temperature control board 4 at excessively low temperatures (such as solder joint cracking, crystal oscillator failure, electrolyte freezing, etc.).

[0050] In other words, the preset low-temperature safety threshold (e.g., -45℃) is set below the lowest expected operating temperature in low-temperature mode (e.g., -40℃), meaning this safety threshold is outside the normal temperature control range of chamber 1. Thus, safety protection will not be triggered during normal low-temperature testing; protection will only be activated when the temperature control board 4 experiences an abnormal temperature drop (e.g., chamber 1 experiences cooling failure).

[0051] In the low-temperature test mode, this solution actively shuts down the heating element 7, relying entirely on the cooling of the chamber 1 environment. This not only avoids the heating element 7 working unnecessarily during the low-temperature test, thus reducing energy consumption, but also extends the service life of the heating element 7. At the same time, it prevents the residual heat of the heating element 7 from interfering with the stability of the low-temperature environment.

[0052] It is important to emphasize that, unlike conventional high and low temperature test chambers (such as the temperature control pressure connector or environmental chamber used in comparative document CN108037321A), this embodiment actively shuts off all heating elements 7 in low-temperature mode, relying entirely on the cooling system of the chamber 1 for passive cooling. This is because if the DUT is still actively heated during low-temperature testing, it will not only interfere with the stability of the low-temperature environment, but may also cause thermal stress damage to the temperature control board 4 due to frequent switching of heating.

[0053] More importantly, this embodiment introduces a dynamic chamber temperature control strategy based on a second temperature T2: In traditional solutions, operators typically set the chamber temperature directly to the desired low-temperature target value (e.g., -40℃), which causes the chamber to cool at maximum power, resulting in drastic temperature changes (thermal shock) for the temperature control board 4. This embodiment, however, gradually adjusts the chamber set temperature based on the difference between the real-time temperature T2 of the temperature control board 4 and the target temperature T_low, allowing the temperature of the temperature control board 4 to decrease smoothly. For example, when T2 = -20℃ and T_low = -40℃, the chamber set temperature is initially set to -30℃, and then gradually reduced after T2 stabilizes. This follow-up cooling effectively avoids thermal shock, extends the service life of the temperature control board 4, and ensures the repeatability of the cooling process. The prior art document CN113740699A only discloses heating control and does not involve any active cooling or cooling rate management at low temperatures.

[0054] Furthermore, the low-temperature safety threshold T_safe (e.g., -45°C) set in this embodiment is lower than the lower limit of the target temperature window in the low-temperature test mode (e.g., -41°C). This means that during normal low-temperature testing, T2 detected by the second temperature sensor 6 will not trigger protection; protection will only be activated when the temperature of the temperature control board 4 itself drops abnormally (e.g., due to uncontrolled cooling of the enclosure or temperature sensor drift) to below -45°C. This margin design reflects a profound consideration of treating the protection of the temperature control board and the execution of the DUT low-temperature test as two independent control objectives, which is different from the single control logic in the prior art that only targets the DUT test temperature.

[0055] In addition, the temperature control board 4 also has a safety protection function: when the ambient temperature detected by the second temperature sensor 6 is lower than the preset low-temperature safety threshold (e.g., -50℃), the temperature control board 4 determines that an abnormally low temperature has occurred inside the temperature control board 4 or the chamber 1, which may endanger the safety of electronic components. At this time, the temperature control board 4 immediately issues an alarm signal and simultaneously stops all test processes (e.g., cuts off the power supply to the test platform). By monitoring the temperature of the temperature control board 4 in real time through the second temperature sensor 6 and alarming / stopping the test when it is lower than the safety threshold, parameter drift or permanent damage to the temperature control board 4 due to excessively low temperatures is avoided.

[0056] In this embodiment, by using the first temperature sensor 5 to control the ambient temperature of the chip and the second temperature sensor 6 specifically for protecting the temperature control board 4 itself, dual-mode independent control is achieved, enabling active heating at high temperatures and passive cooling at low temperatures with automatic protection. In low-temperature testing mode, this solution actively shuts off the heating element 7, relying entirely on the ambient temperature of the chamber 1 for cooling. This not only avoids unnecessary operation of the heating element 7 during low-temperature testing, thus reducing energy consumption, but also extends the service life of the heating element 7 and prevents residual heat from interfering with the stability of the low-temperature environment. Furthermore, by using the second temperature sensor 6 to monitor the temperature of the temperature control board 4 in real time and triggering an alarm / stopping the test when it falls below a safe threshold, parameter drift or permanent damage to the temperature control board 4 due to excessively low temperatures is prevented, improving the reliability of the testing device.

[0057] In one embodiment, Figure 5 This is a three-dimensional schematic diagram of the temperature control component 3 located on the test platform 2 in one embodiment of this application.

[0058] like Figure 5 As shown, the test socket 8 for the device under test includes a top cover 801, a base 802, an opening and closing structure 803, and a device under test placement position 804.

[0059] Specifically, the opening and closing structure 803 is provided on the upper cover 801 and the base 802, and has an open state and a closed state. The base 802 is fixedly installed on the test platform 2, and the device under test placement position 804 is provided on the base 802 to accommodate the device under test.

[0060] When the opening and closing structure 803 is in the open state, the upper cover 801 separates from the base 802 or flips open to expose the device under test placement position 804, so as to put in or take out the device under test.

[0061] When the opening and closing structure 803 is in the closed state, the upper cover 801 presses against the base 802, fixing the device under test (DUT) in the DUT placement position 804, ensuring that the pins of the DUT are in contact with the contacts in the DUT test socket 8, so that subsequent testing can be performed.

[0062] With this opening and closing structure 803, the operator can quickly replace the device under test, while ensuring good thermal contact between the device under test, the heating element 7, and the temperature sensor during the test.

[0063] In one embodiment, please refer to Figure 5The test platform 2 is equipped with a display screen 819, multiple control switches 820, and indicator lights 821; the display screen 819, control switches 820, and indicator lights 821 are electrically connected to the temperature control component 3; the display screen 819 is located on the side of the test platform 2 facing the outside of the chamber 1, or the chamber 1 has a transparent observation window, and the display screen 819 is positioned facing the observation window, for observing the test temperature and / or test data from the outside of the chamber 1; the test temperature and / or test data are presented in at least one or more of the following formats: numbers, graphs, and tables.

[0064] In one embodiment, the test platform 2 is further equipped with a high-speed communication interface, such as a USB, PCIe, or Ethernet interface. The high-speed communication interface is electrically connected to the temperature control board 4 and is used to connect to an external host computer. The temperature control board is configured to: simultaneously perform temperature testing and acquire real-time performance data of the device under test (DUT) during read / write operations via the high-speed communication interface, including but not limited to sequential read / write speed, random read / write speed, and / or IOPS (input / output operations per second). This performance data is then associated with and stored with the current first and second temperatures according to timestamps to generate a temperature-performance curve, used to evaluate the reliability of the DUT at different temperatures.

[0065] In one embodiment, Figure 6 This is a perspective view of the base in one embodiment of this application. For example... Figure 6 As shown, the device under test (DUT) placement position 804 is located on the base 802. One or more temperature probes 816 are provided in the DUT placement position 804. The temperature probes 816 are used to collect the temperature of one or more areas of the DUT and are electrically connected to the temperature control board 4.

[0066] In one embodiment, the device under test (DUT) placement position 804 is made of a conductive elastomer or a high-performance engineering plastic. The DUT placement position 804, made of a conductive elastomer or high-performance engineering plastic, possesses elastic deformation capability, can absorb the coplanarity tolerance of the DUT pins or solder balls, ensures uniform pressure on each contact, avoids indentations or cracks on the DUT surface caused by traditional rigid contacts (such as metal springs), and can withstand high-temperature environments.

[0067] Please refer to Figure 5 and Figure 6 The base 802 is fixed to the test platform 2, and can be secured to the test platform 2 by screws. Specifically, corresponding round holes are provided on the test platform 2 and the base 802, and screws are screwed into the round holes to fix the base 802 to the test platform 2. Figure 6 As shown, the device under test placement position 804 is located on the base 802 and is used to place the device under test.

[0068] In one embodiment, Figure 7 This application Figure 5 The opening and closing structure 803 of the test socket 8 of the device under test ( Figure 5 The attached diagram is a partially enlarged schematic diagram labeled I. Figure 11 This is a three-dimensional schematic diagram of the test socket of the device under test from another angle in one embodiment of this application.

[0069] like Figure 11 As shown, one side of the upper cover 801 is hinged to the base 802 so that the upper cover 801 can be flipped relative to the base 802. A height adjustment component 812 is fixed on one side of the heat-conducting block 811 for adjusting the distance between the heat-conducting block 811 and the placement position 804 of the device under test according to the thickness of the device under test, so as to accommodate devices under test with multiple thicknesses.

[0070] The height adjustment assembly 812 includes an adjustment member 813, which is fixedly connected to the heat-conducting block 811 and is provided with an adjustment thread 814; the upper cover 801 is provided with a threaded hole corresponding to the adjustment thread 814; the adjustment member 813 is located in the threaded hole, and the adjustment member 813 is rotated to make the adjustment thread 814 engage with the threaded hole to adjust the height of the heat-conducting block 811 relative to the placement position 804 of the device under test.

[0071] Furthermore, the height adjustment component 812 can be configured with a locking screw. The upper cover 801 has a guide groove or sliding hole, and the heat-conducting block 811 is installed in the guide groove or sliding hole and can slide freely in the vertical direction. The side wall of the upper cover 801 has a threaded through hole, in which a screw, such as a pointed screw, is installed. When the screw is tightened, the front end of the screw abuts against the side of the heat-conducting block, locking it at the desired height. After loosening the screw, the heat-conducting block 811 can be moved up and down to the new height position and then tightened again, thereby realizing the height adjustment of the heat-conducting block 811.

[0072] Furthermore, a rack and pinion structure can also be used: a rack is fixed to the side of the heat-conducting block 811, and a rotatable pinion and knob are mounted on the upper cover 801. When the knob is rotated, the gear drives the rack and heat-conducting block to move up and down, thus achieving height adjustment. A ratchet or locking device can also be used to prevent slippage.

[0073] Please refer to Figure 7 and Figure 11 The fixing member 805 is located at the end of the upper cover 801 away from the hinge side, and the fixing post 806 is located on the base 802 at the corresponding position of the fixing member 805. By pressing the fixing member 805, it can cooperate with the fixing post 806 to fix the upper cover 801 to the base 802 or disengage from the fixing post 806 to open the upper cover 801.

[0074] Specifically, a torsion spring is provided between the top cover 801 and the base 802, which can deform when the top cover 801 rotates. Compared with a rigid connection structure, it has the advantages of longer service life, easier rotation and smoother rotation.

[0075] When the top cover 801 flips on the base 802, it compresses the torsion spring and rotates around it. Specifically, the torsion spring is pre-installed to be in an energy-storing state when closed. When the opening and closing mechanism unlocks, the torsion spring releases energy, automatically lifting the top cover 801 upwards to a certain angle, facilitating the placement and removal of the device under test without manual lifting. Furthermore, the torsion spring provides damping and smooth flipping. Specifically, the spring force ensures that the top cover 801 experiences even force during flipping, preventing rapid impact with the base and providing cushioning protection. Alternatively, other structures such as leaf springs can also be used.

[0076] Figure 8 This is a three-dimensional schematic diagram of a test socket for a device under test in one embodiment of this application. For example... Figure 8 As shown, when the fixing member 805 is installed in conjunction with the fixing post 806, the upper cover 801 covers the base 802 for subsequent temperature testing. When the fixing member 805 is away from the fixing post 806, the upper cover 801 separates from the base 802, making it easier to place the device under test.

[0077] Furthermore, the upper cover 801 and the base 802 can also be connected by magnetic attraction or other structures that can be fixed and detached. In one specific embodiment, the opening and closing structure between the upper cover 801 and the base 802 adopts a magnetic attraction structure.

[0078] Specifically, magnetic components, such as permanent magnets, are embedded around the bottom perimeter of the upper cover 801 and at corresponding positions on the base 802. When the upper cover 801 approaches the base 802, the two automatically attract each other through magnetic attraction, forming a closed state. When it is necessary to separate the upper cover 801 and the base 802, only an external force is applied to overcome the magnetic attraction, such as pulling upwards, to separate them. For ease of operation, a protruding handle or pull ring can also be provided on the side of the upper cover 801 or the base. Furthermore, the magnetic components inside the upper cover 801 or the base 802 can also be set as electromagnets, and the attraction or separation can be achieved by controlling the on / off state of a switch.

[0079] Please continue to refer to this. Figure 8 The fastener 805 is provided with a pressing part 808 and at least one bending part 809. The bending part 809 is bent toward the fixing post 806 to hook onto the fixing post 806 to form a fixed fit. In addition to hooking together, the bending part 809 and the fixing post 806 can also be fitted together by a groove on the fixing post 806, so that the bending part 809 is located in the groove or disengaged from the groove, thereby achieving the fixation between the upper cover 801 and the base 802.

[0080] In one embodiment, Figure 9 This is a three-dimensional schematic diagram of the test socket of the device under test from another angle in one embodiment of this application; Figure 10 yes Figure 9 807 points of elastic force ( Figure 9 The attached diagram (labeled Q) is a partially enlarged schematic diagram. For example... Figure 10 As shown, the elastic element 807 is located between the upper cover 801 and the fixing element 805.

[0081] Specifically, the elastic element 807 can be a spring. When the fixing element 805 is pressed, the elastic element 807 undergoes elastic deformation after being compressed, and the other end of the fixing element 805 disengages from the fixing post 806, allowing the top cover 801 to be opened. Similarly, when the top cover 801 needs to be closed, the fixing element 805 is pressed, and the elastic element 807 is squeezed, then the force applied to the fixing element 805 and the elastic element 807 is released, allowing the fixing element 805 to engage with the fixing post 806 for installation. Alternatively, other structures with elastic deformation and the ability to recover can also be used.

[0082] Please refer to Figure 10 The fixing member 805 has holes 810 on the side facing the upper cover 801 and the upper cover 801 has holes 810 on the side facing the fixing member 805, for placing the elastic member 807. The pressing part 808 is correspondingly provided with the elastic member 807, and the elastic member 807 is movably disposed in the hole 810. When the pressing part 808 is pressed, the elastic member 807 undergoes elastic deformation, the bending part 809 disengages from the fixing post 806, and the opening and closing structure 803 is in the open state, at which time the device under test can be placed in the device under test placement position 804. Then the upper cover 801 is closed, so that the bending part 809 hooks the fixing post 806 to close the opening and closing structure 803, at which time the temperature control board 4 can be controlled to perform high-temperature testing on the device under test.

[0083] Please refer to Figure 9 and Figure 10 The pressing part 808 is correspondingly provided with the elastic member 807, and the elastic member 807 is movably disposed within the hole 810. When the pressing part 808 is pressed, the elastic member 807 undergoes elastic deformation, and the bending part 809 hooks or disengages from the fixing post 806, so that the opening and closing structure 803 is in a closed state or an open state.

[0084] In this embodiment, the pressing part 808 has two holes 810 on the side opposite to the upper cover 801. Each hole 810 contains a spring. Compared to a single-spring structure, the double-spring design provides a balanced restoring force, effectively preventing tilting and jamming caused by uneven force during pressing. This ensures that the clearance between the bending part 809 and the fixing post 806 remains consistent, thereby improving the operational reliability of the opening and closing structure 803 after long-term high and low temperature cycle testing.

[0085] In other words, when the pressing part 808 is pressed, both springs simultaneously undergo elastic deformation, thereby controlling the engagement or disengagement of the bending part 809 and the fixing post 806. When the external force is removed, both springs simultaneously release their elastic force, pushing the pressing part 808 back to its original position smoothly. Compared to a single spring, this method is less prone to tilting during pressing, which could lead to uneven contact between the bending part 809 and the fixing post 806, resulting in jamming or incomplete engagement. The combined action of the two springs ensures that the pressing part 808 returns to the same initial position each time, thus stabilizing the fit between the bending part 809 and the fixing post 806 and improving the consistency of the switch operation.

[0086] Please refer to Figure 8 and Figure 11 The fixing member 805 is located at the end of the upper cover 801 away from the hinge side, and the fixing post 806 is located on the base 802 at the corresponding position of the fixing member 805. Figure 8 This is a three-dimensional schematic diagram of a test socket for a device under test in one embodiment of this application. For example... Figure 8 As shown, the fixing member 805 is provided with a pressing part 808 and at least one bending part 809. The fixing member 805 facing the upper cover 801 and the upper cover 801 facing the fixing member 805 are respectively provided with holes 810. When the elastic member 807 is a spring, the hole 810 is designed as a round hole for placing the spring.

[0087] In summary, the testing device for vehicle-mounted storage devices provided in this application achieves precise heating control of individual devices by placing the testing platform 2 entirely inside the housing 1 and independently setting a heating element 7, a first temperature sensor 5, and a temperature control board 4 in each device under test (DUT) test holder 8. This significantly reduces testing costs and avoids the risk of platform damage. Simultaneously, the second temperature sensor 6 monitors the temperature of the temperature control board 4 and issues an alarm or stops the test at low temperatures, effectively protecting the testing circuit and avoiding the low-temperature reliability issues of the temperature control board 4 itself. The design of the openable structure 803, heat-conducting block 811, and height adjustment component 812 of the DUT test holder 8 enables rapid loading and unloading of DUTs, efficient heat conduction, and adaptability to DUTs of different thicknesses, expanding the applicability of the device. The support structure 817 and sliding structure 818 simplify the operation process and improve testing efficiency. The multiple observation methods and data presentation formats of the display screen 819 facilitate monitoring and data recording during the testing process. Therefore, this application effectively solves the technical problems of high testing costs, platform fragility, and complex design in the prior art.

[0088] Figure 13 This is a flowchart of a temperature control method for a test apparatus for an on-board storage device according to one embodiment of this application. This method is applied to the test apparatus described in any of the above-described apparatus embodiments. The microcontroller in the temperature control board 4 is configured to execute this temperature control method; please refer to [reference needed]. Figure 13 The methods include: S1, acquire the first temperature (denoted as T1) inside the test socket of the device under test detected by the first temperature sensor, and acquire the second temperature (denoted as T2) of the temperature control board detected by the second temperature sensor. S2, based on the first temperature, the second temperature, and the currently selected test mode [selected by the operator via a host computer (e.g., the test device in the above embodiment) or a touch screen (e.g., the display screen 819 in the above embodiment) as "high temperature test" or "low temperature test"], the following controls are executed: If it is a high-temperature test mode, the heating power of the heating element is adjusted in a closed loop according to the deviation between the first temperature and the preset high-temperature target temperature (e.g., 85 or 105°C) so that the first temperature reaches the high-temperature target temperature.

[0089] If the low-temperature test mode is selected, low-temperature cooling control is implemented. Specifically, this includes: shutting down the heating element (i.e., forcing a 0% duty cycle output) and entering a control mode based on a second temperature: dynamically adjusting the target ambient temperature of the chamber based on the difference between the second temperature and a preset low-temperature target temperature (e.g., -40 or -25°C) to control the cooling rate of the chamber. It is important to emphasize that this operation is not the conventional method of setting the chamber temperature based on the ambient temperature, but rather adjusting it based on the temperature of the temperature control board itself.

[0090] Specifically, when the difference between the second temperature and the low-temperature target temperature is greater than a preset temperature difference threshold (e.g., 10°C), the target ambient temperature of the chamber is set to a value lower than the second temperature to achieve rapid cooling; and the difference between the target ambient temperature and the second temperature increases as this difference increases (e.g., using a linear or piecewise function relationship) to achieve rapid cooling; when this difference is less than or equal to this temperature difference threshold, the target ambient temperature of the chamber is gradually increased to bring it closer to the second temperature, reducing thermal shock and preventing temperature overshoot; finally, the first temperature inside the test socket of the device under test is reduced synchronously and smoothly to the low-temperature target temperature during the passive cooling process through heat conduction alone.

[0091] In this embodiment, by dynamically adjusting the low-temperature ambient temperature set in the chamber based on the temperature of the temperature control board, thermal shock to the temperature control board caused by excessively rapid chamber cooling is avoided, as is low testing efficiency caused by excessively slow cooling. This control logic ensures that the transient temperature difference between the temperature control board and the test socket is always kept within a safe range, thereby preventing damage to the temperature control board due to thermal stress. It also ensures that the cooling rate is controllable and repeatable, improving the consistency and safety of low-temperature testing.

[0092] Simultaneously, during the entire test, when the second temperature falls below a preset low-temperature safety threshold (e.g., Ts = -45℃), safety protection actions are executed (shutting down the heating element, issuing an alarm signal, and stopping the test). Preferably, one or more actions can be executed individually or in combination, depending on the actual situation. For example, when the second temperature falls below the safety threshold, the test is stopped first and an alarm is triggered to prevent data errors from occurring if the temperature control board is damaged and testing continues. This safety protection mechanism is independent of the temperature control loop and specifically protects the low-temperature reliability of the temperature control board itself, avoiding the problem of potential failure of the temperature control board at extreme low temperatures.

[0093] In one embodiment, the specific steps for closed-loop adjustment of the heating power of the heating element under the above-mentioned high-temperature test mode include: Calculate the deviation between the first temperature and the high-temperature target temperature, e = T_high - T1.

[0094] Calculate the proportional value of the deviation P = Kp × e, and the cumulative value of the integral term. and differential value Where Kp, Ki, and Kd are preset coefficients. The sampling period.

[0095] The control output value Out = P + I + D is obtained by adding the proportional value, the cumulative integral value, and the derivative value.

[0096] The duty cycle of the pulse width modulation signal is determined based on the control output value to drive the heating element.

[0097] Specifically, when the absolute value of the deviation exceeds the preset deviation threshold (|e|>5℃), the cumulative value of the integral term is set to zero (i.e., integral separation) to prevent overshoot caused by integral saturation. When the absolute value of the deviation is less than or equal to the deviation threshold, the cumulative value of the integral term is accumulated normally, and the accumulated value is limited to a preset integral limit range (e.g., 0-100% output corresponds to integral term limit) to avoid instability of the temperature control board due to an excessively large integral term. Integral separation reduces temperature overshoot, and integral limiting shortens the settling time, thus achieving faster and more stable temperature rise control in high-temperature test mode, making it suitable for test sockets of devices under test with high thermal inertia.

[0098] In one embodiment, it is considered that the heat generated by the device under test (DUT) during full-load read / write operations will affect the actual temperature inside the test socket. Therefore, the temperature control board is further configured to: under a high-temperature test model, acquire the current power consumption level or read / write load status of the DUT in real time via a high-speed communication interface, and, based on a preset power consumption-temperature compensation model, superimpose a feedforward compensation amount onto the aforementioned control output value. When the DUT is detected to be entering a high-load read / write state, the feedforward compensation amount is negative, i.e., actively reducing the output power of the heating element to prevent temperature overshoot caused by the superposition of the DUT's own heat generation and the heating element's heat generation; when the DUT is detected to be entering an idle or low-load state, the feedforward compensation amount is positive or returns to zero. Through this feedforward compensation amount, the temperature stabilization time can be shortened without increasing temperature overshoot, thus improving the temperature control accuracy under dynamic loads.

[0099] In one embodiment, under the above-described high-temperature test mode, the method further includes a stable state determination step.

[0100] Specifically, when T1 enters a preset high-temperature target temperature window (e.g., T_high ± 0.5℃) and remains within it for a first preset time (e.g., 10 seconds), and the duty cycle of the currently output pulse width modulation signal is lower than a preset duty cycle threshold (e.g., 30% of the maximum duty cycle), it is determined that a stable state has been reached, and a high-temperature ready signal is generated. This high-temperature ready signal can be sent to a host computer (the test device in the above device embodiment, the same below), indicating that the device under test has reached the required high temperature and the heating power is very low, and the functional testing of the vehicle storage device can begin. This judgment logic avoids misjudgment due to instantaneous fluctuations and improves test reliability.

[0101] In one embodiment, under low-temperature test mode, the low-temperature cooling control further includes a stable state determination.

[0102] Specifically, after the heating element is turned off, when the first temperature is lower than or equal to the upper limit of the preset low-temperature target temperature (T_low) window (e.g., T1+1℃) and remains there for a second preset time (e.g., 10 seconds), it is determined that the device under test has entered a stable state, and a low-temperature ready signal is generated. Since the cooling rate is slow in low-temperature mode due to its reliance on the chamber environment, this judgment condition ensures that the device under test has been sufficiently cooled to near the target temperature, and low-temperature functional testing can begin.

[0103] In one embodiment, the preset safety threshold is lower than the lower limit of the target low-temperature window corresponding to the low-temperature test mode. For example, if the target low-temperature temperature is -40 degrees Celsius and the lower limit of the window is -41 degrees Celsius, then the safety threshold can be set to -45 degrees Celsius. In this way, the safety protection will not be triggered during normal testing (temperature not lower than -41 degrees Celsius). The protection will only be activated when the temperature of the temperature control board drops abnormally (e.g., due to uncontrolled cooling of the enclosure or malfunction of the temperature sensor) to below -45 degrees Celsius, thereby avoiding false protection affecting normal testing.

[0104] In one embodiment, the temperature control method further includes: in low-temperature test mode, the temperature control board performs a safety protection action independently of the first temperature sensor based on the real-time temperature of the temperature control board detected by the second temperature sensor, so that the test is stopped in time when the temperature of the temperature control board itself is too low, regardless of whether the first temperature in the test socket of the device under test has reached the low-temperature target temperature.

[0105] In one embodiment, the temperature control method described above also includes various methods for anomaly detection and protection.

[0106] Specifically, after acquiring the first and second temperatures, if it is determined that the first temperature exceeds a preset over-temperature protection threshold (e.g., +130℃), the second temperature is below a safety threshold (e.g., -45℃), or either the first or second temperature exceeds a reasonable range (e.g., the first temperature < -60℃ or > +150℃, the second temperature < -50℃ or > +100℃) and remains so for a third preset time (e.g., 2 seconds), then a safety protection state is entered. This design can handle faults such as temperature sensor disconnection, short circuit, and heating element malfunction.

[0107] In one embodiment, the temperature control method further includes a heating element open circuit detection method.

[0108] Specifically, when the output command of the heating element is detected as "on" (e.g., pulse width modulation signal duty cycle > 0%) but the actual current is zero, the heating element is determined to be open-circuited, and the safety protection action described in the above embodiment is immediately executed. This function can avoid wasting time by causing the heating element to fail to heat up due to damage in high-temperature mode, resulting in long-term idle testing.

[0109] In one embodiment, the temperature control method further includes a thermally conductive contact state detection method.

[0110] Specifically, in the high-temperature test mode, the heating element is driven with a preset constant power, and the heating rate of the first temperature sensor per unit time is monitored and recorded. The heating rate is compared with a preset rate threshold: when the heating rate is lower than the preset rate threshold, it is determined that there is poor contact between the heat-conducting block in the test holder and the device under test (e.g., the heat-conducting block is not in contact). At this time, an alarm signal is issued and the test can be optionally stopped. This detection method utilizes the principle that increased contact thermal resistance leads to decreased heat conduction efficiency, enabling rapid diagnosis of the test platform's status before the temperature test, avoiding temperature runaway or invalid test results due to poor contact.

[0111] In one embodiment, the temperature control method further includes a temperature control board over-temperature protection method.

[0112] Specifically, when the second temperature exceeds the preset over-temperature threshold of the temperature control board (e.g., +85°C), the heating element is forcibly shut down. This threshold can be higher than the upper limit of the normal operating temperature of the temperature control board. For example, during high-temperature testing, the temperature control board itself may also generate heat due to the increase in ambient temperature. If it exceeds 85 degrees Celsius, it may damage the electronic components on the board. In this case, shutting down the heating element can prevent thermal runaway of the temperature control board.

[0113] In one embodiment, the temperature control method further includes switching control between high-temperature testing and low-temperature testing modes.

[0114] Specifically, it responds to mode switching commands (e.g., the operator switches from high temperature mode to low temperature mode via a host computer, or vice versa).

[0115] When switching from high-temperature test mode to low-temperature test mode, the output of the heating element is set to zero (heating stops immediately), and the accumulated value of the integral term is reset (cleared to zero) to prevent residual integral terms from causing the heating element to start unexpectedly in low-temperature mode. Simultaneously, a cooling wait command is generated, which instructs the host computer to pause high-speed read / write operations on the device under test (DUT) to prevent the DUT's own heat generation from affecting the cooling rate. Once the temperature drops to a preset intermediate temperature (e.g., 25°C) under the first temperature condition, the system enters the low-temperature cooling control mode.

[0116] When switching from low-temperature test mode to high-temperature test mode, the heating element is kept off and the control parameters are reinitialized (e.g., the integral term is cleared to zero and the initial deviation value is set to the difference between the current temperature and the high-temperature target). At the same time, a preheating wait command is generated. This preheating wait command is used to instruct the host computer to stop supplying power to the device under test to prevent the device under test from generating a large current surge when starting at low temperature. After the first temperature rises to above the preset safe start temperature (e.g., -10℃), the high-temperature heating control is then entered.

[0117] The above-mentioned switching control logic avoids temperature overshoot caused by the heating element outputting full power at the moment of switching, and also prevents abnormal actions caused by residual control parameters, ensuring a smooth and safe transition of the test device between high and low temperature modes.

[0118] In summary, the testing apparatus and temperature control method for vehicle-mounted storage devices provided in this application separate the ambient temperature control of the device under test (V2D, V2D, V2D) (first temperature sensor) from the temperature protection of the temperature control board itself (second temperature sensor). This achieves accurate wide-temperature testing of the V2D while preventing the temperature control board from failing at ultra-low temperatures, thus solving the problem of test platform fragility. Furthermore, in low-temperature testing mode, completely passive cooling is employed, and the cooling rate of the chamber is dynamically adjusted according to the temperature control board temperature, effectively preventing thermal shock to the V2D and temperature control board caused by excessively rapid cooling, improving test consistency and reliability. The V2D test socket features an openable and height-adjustable design, is compatible with various V2D storage modules such as SD cards, TF cards, USB flash drives, eMMC, UFS, and SSDs, and its dual-spring pressing structure ensures stability during long-term cyclic testing. In addition, the integrated temperature control method, heating element open-circuit detection, multi-level temperature anomaly protection, and smooth mode switching logic ensure the safety and efficiency of the testing apparatus.

[0119] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, apparatus, article, or method that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, apparatus, article, or method. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, apparatus, article, or method that includes that element.

[0120] The above description is only a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural changes made based on the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A testing device for an on-board storage device, characterized in that, include: The enclosure is designed to provide an adjustable high-temperature or low-temperature environment. The test platform is housed inside the enclosure; Each test platform is equipped with at least one temperature control component; Each temperature control component includes a temperature control board, a first temperature sensor, a second temperature sensor, a heating element, and a test socket for the device under test. The temperature control board is electrically connected to the first temperature sensor, the second temperature sensor, and the heating element. The first temperature sensor and the heating element are respectively located inside the test socket of the device under test. The first temperature sensor is used to detect the temperature inside the test socket of the device under test, which reflects the ambient temperature of the device under test. The second temperature sensor is located on the temperature control board and is in direct contact with the temperature control board. It is used to detect the real-time temperature of the temperature control board, which reflects the operating temperature of the temperature control board itself. The temperature control board is configured to execute the following temperature control strategy: In the high-temperature test mode, the heating element is controlled to heat up according to the detection result of the first temperature sensor so that the test socket of the device under test reaches the preset high-temperature target temperature; In low-temperature test mode, the heating element remains off, and the test device is tested entirely by relying on the low-temperature environment provided by the chamber. When the temperature detected by the second temperature sensor is lower than the preset low-temperature safety threshold, the temperature control board issues an alarm signal or stops the test to prevent the temperature control board from being damaged at excessively low temperatures. The preset low-temperature safety threshold is lower than the preset low-temperature target temperature in the low-temperature test mode.

2. The testing apparatus according to claim 1, characterized in that, The test socket for the device under test includes a top cover, a base, an opening and closing structure, and a placement position for the device under test. The opening and closing structure is provided on the upper cover and the base, and includes an open and a closed state; When the opening and closing structure is in the open state, the device under test (DUT) placement position is exposed to allow the DUT to be placed or removed. When the opening and closing structure is in the closed state, the upper cover is pressed against the base to fix the device under test and perform the test.

3. The testing apparatus according to claim 2, characterized in that, The opening and closing structure includes a fixing component, a fixing post, and a spring component; One side of the upper cover is hinged to the base so that the upper cover can be flipped relative to the base; The base is fixed on the test platform, and the device under test is placed on the base; The fastener is located at the end of the upper cover away from the hinge side, and the fixing post is located on the base at the corresponding position of the fastener. The elastic element is disposed between the upper cover and the fixing element; The fastener is provided with a pressing part and at least one bending part, and the fastener is provided with holes on the side facing the upper cover and the side facing the fastener, respectively; The pressing part is correspondingly provided with the elastic element, and the elastic element is movably provided within the hole. When the pressing part is pressed, the elastic member undergoes elastic deformation, and the bending part hooks or disengages from the fixing post, so that the opening and closing structure is in the closed state or the open state.

4. The testing apparatus according to claim 3, characterized in that, The number and position of the bending portions are set in accordance with the fixed columns; The bottom of the upper cover is provided with a heat-conducting block, which is used to conduct the heat generated by the heating element connected to the temperature control plate to the device under test in the device under test placement position; The shape of the heat-conducting block corresponds to the placement position of the device under test; The first temperature sensor is located inside the upper cover or on the heat-conducting block and is in contact with the heat-conducting block. When the opening and closing structure is in the closed state, the heat-conducting block is embedded in the placement position of the device under test to conduct heat in close contact with the device under test.

5. The testing apparatus according to claim 4, characterized in that, A height adjustment component is fixed on one side of the heat-conducting block for adjusting the distance between the heat-conducting block and the placement position of the device under test according to the thickness of the device under test; The height adjustment assembly includes an adjustment component, which is fixedly connected to the heat-conducting block and is provided with an adjustment thread; The upper cover is provided with a threaded hole corresponding to the adjusting thread; The adjusting member is located inside the threaded hole. Rotating the adjusting member causes the thread to engage with the threaded hole, thereby adjusting the height of the heat-conducting block relative to the placement position of the device under test.

6. The testing apparatus according to claim 1, characterized in that, The box is equipped with a support structure; The test platform is mounted on the support structure; The housing is equipped with a sliding structure for placing and removing the support structure; The support structure is provided with a sliding body corresponding to the sliding structure.

7. The testing apparatus according to claim 6, characterized in that, The support structure is provided with a pull-out position and a push-in position; When in the pulled-out position, the support structure is at least partially exposed outside the housing to allow operation of the display screen, control switches and indicator lights, as well as placement or removal of the device under test; When in the pushed-in position, the entire support structure is located inside the housing for high and low temperature testing.

8. A temperature control method for a testing device for an on-board storage device, characterized in that, The method, applied in the test apparatus for the vehicle-mounted storage device according to any one of claims 1 to 7, comprises: The first temperature inside the test socket of the device under test is detected by the first temperature sensor, and the second temperature of the temperature control board is detected by the second temperature sensor. Based on the first temperature, the second temperature, and the currently selected test mode, the following controls are executed: If it is a high temperature test mode, the heating power of the heating element is adjusted in a closed loop according to the deviation between the first temperature and the preset high temperature target temperature so that the first temperature reaches the high temperature target temperature. If it is a low temperature test mode, then low temperature cooling control is executed. The control includes: turning off the heating element, and dynamically adjusting the target ambient temperature of the chamber according to the difference between the second temperature and the preset low temperature target temperature, so that the first temperature in the test socket of the device under test will drop synchronously to the low temperature target temperature in the process of passive cooling through heat conduction without active heating. When the second temperature is lower than the preset low temperature safety threshold, a safety protection action is executed to prevent the temperature control board from being damaged due to overcooling.

9. The temperature control method according to claim 8, characterized in that, In the high-temperature test mode, the step of adjusting the heating power of the heating element in a closed loop includes: Calculate the deviation between the first temperature and the high-temperature target temperature; Calculate the proportional value, cumulative value of the integral term, and differential value of the deviation; The control output value is obtained by adding the proportional value, the cumulative value of the integral term, and the derivative value. The duty cycle of the pulse width modulation signal is determined based on the control output value to drive the heating element; Specifically, when the absolute value of the deviation is greater than a preset deviation threshold, the cumulative value of the integral term is set to zero; when the absolute value of the deviation is less than or equal to the deviation threshold, the cumulative value of the integral term is accumulated, and the accumulated value of the integral term is limited to a preset integral limit range.

10. The temperature control method according to claim 8, characterized in that, The high-temperature test mode also includes: When the first temperature enters the preset high temperature target temperature window and remains within the preset time, and the duty cycle of the currently output pulse width modulation signal is lower than the preset duty cycle threshold, it is determined that it has entered a stable state and a high temperature ready signal is generated.

11. The temperature control method according to claim 8, characterized in that, In the low-temperature test mode, the low-temperature cooling control further includes: When the first temperature is lower than or equal to the upper limit of the preset low temperature target temperature window and lasts for a second preset time, it is determined that the temperature has entered a stable state and a low temperature ready signal is generated.

12. The temperature control method according to claim 8, characterized in that, The safety protection actions include at least one of the following: turning off the heating element, issuing an alarm signal, and stopping the test.

13. The temperature control method according to claim 8, characterized in that, The preset safety threshold is lower than the lower limit of the low temperature target temperature window corresponding to the low temperature test mode.

14. The temperature control method according to claim 8, characterized in that, Also includes: After obtaining the first temperature and the second temperature, if any of the following conditions are met, the system enters a safety protection state: The first temperature exceeds the preset over-temperature protection threshold; The second temperature is lower than the safety threshold; The first temperature or the second temperature exceeds a reasonable range and continues for a third preset time.

15. The temperature control method according to claim 8, characterized in that, Also includes: When the output command of the heating element is detected to be "on" but the actual current is zero, it is determined that the heating element is open-circuited and a safety protection action is executed.

16. The temperature control method according to claim 8, characterized in that, Also includes: In the low-temperature test mode, the temperature control board performs the safety protection action independently of the first temperature sensor based on the real-time temperature of the temperature control board detected by the second temperature sensor, so that the test is stopped in time when the temperature of the temperature control board itself is too low, regardless of whether the first temperature in the test socket of the device under test has reached the low-temperature target temperature.

17. The temperature control method according to claim 8, characterized in that, The step of dynamically adjusting the target ambient temperature of the enclosure based on the difference between the second temperature and the preset low-temperature target temperature includes: In response to the difference being greater than a preset temperature difference threshold, the target ambient temperature of the chamber is set to a value lower than the second temperature, and the difference between the target ambient temperature of the chamber and the second temperature increases as the difference increases, so as to achieve rapid cooling.

18. The temperature control method according to claim 8, characterized in that, Also includes: The performance data of the device under test during read and write operations is collected in real time through the high-speed communication interface set on the test platform. The performance data is associated with and stored with the current first temperature and second temperature according to the timestamp, and temperature and performance curves are generated.

19. The temperature control method according to claim 8, characterized in that, Also includes: In response to the instruction to switch from high temperature test mode to low temperature test mode, the output of the heating element is set to zero and the cumulative value of the integral term is reset. At the same time, a cooling wait instruction is generated. The cooling wait instruction is used to indicate the suspension of high-speed read and write operations on the device under test to avoid the device under test itself generating heat and affecting the cooling rate. In response to the command to switch from low temperature test mode to high temperature test mode, the heating element is kept off and the control parameters are reinitialized. At the same time, a preheating wait command is generated to indicate that power supply to the device under test is suspended to prevent the device under test from generating a large current surge when starting at low temperature.

20. The temperature control method according to claim 8, characterized in that, Also includes: In the high-temperature test mode, the heating element is driven with constant power, and the heating rate of the first temperature sensor is monitored. When the heating rate is lower than the preset rate threshold, it is determined that there is poor contact between the heat-conducting block in the test socket of the device under test and the device under test, and an alarm signal is issued.

Images