Preparation method of multilayer circuit board and multilayer circuit board
By setting an etching layer in a multilayer circuit board to form an etching path, the problems of cumbersome process and tape residue in the circuit board windowing method are solved, achieving the effect of simplifying the process and improving yield.
CN122094037APending Publication Date: 2026-05-26QING DING PRECISION ELECTRONICS HUAIAN CO LTD +1
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- QING DING PRECISION ELECTRONICS HUAIAN CO LTD
- Filing Date
- 2024-11-15
- Publication Date
- 2026-05-26
AI Technical Summary
Technical Problem
Existing methods for opening windows on circuit boards are cumbersome, and suffer from problems such as tape residue and easy damage to the cover film.
Method used
By setting a first etching layer, a second etching layer, and a third etching layer in a multilayer circuit board to form an etching path, etching these layers can create windows in the multilayer circuit board, avoiding the cumbersome process of protective film in the pre-windowing process and the time-consuming and residual problems of tape in the post-windowing process.
Benefits of technology
It simplifies the circuit board manufacturing process, avoids problems such as tape residue and damage to the protective layer due to laser, and improves the manufacturing yield.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122094037A_ABST
Abstract
The invention provides a preparation method of a multilayer circuit board and the multilayer circuit board. According to the invention, the first etching layer, the second etching layer and the third etching layer are arranged in the area close to the first opening, and the windowing can be formed in the multilayer circuit board by etching the etching layers, so that the problem of tedious process due to pasting of a protective film in a previous windowing process is avoided; and the problems that time is consumed and the adhesive tape is easy to remain in the post-windowing process are solved, and the problem that the protective layer is damaged due to laser is also solved.
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