A combined electrode plasma process system and a method for performing plasma processes using combined electrodes.

Abstract

This invention discloses a combined electrode plasma process system and a method for performing plasma processes using combined electrodes. The combined electrode plasma process system includes a vacuum chamber, an upper electrode, a first electrode, a second electrode, and a double-sided adhesive component. The upper electrode is disposed within the vacuum chamber. The double-sided adhesive component is used to fix the substrate to be processed onto the second electrode. The second electrode can be selectively combined with the first electrode to form a lower electrode. A plasma process space is formed between the lower electrode and the upper electrode to perform plasma processing on the substrate. When the plasma process is stopped, the first electrode and the second electrode can be separated, and the substrate fixed to the second electrode can be removed together for transport. This invention offers the advantage of flexible process timing through the design of the second electrode.

Description

Technical Field

[0001] This invention relates to a plasma process system, and more particularly to a combined electrode plasma process system. Background Technology

[0002] In modern semiconductor applications, plasma processes are primarily used for cleaning, etching, and sputtering. During plasma processing, high temperatures are generated within the chamber, and the surface temperature of the substrate in contact with the plasma is also quite high. The substrate is prone to bending and deformation due to heat, especially substrates made of plastic or flexible materials. This bending and deformation results in an uneven surface, making it difficult for the plasma to process the substrate uniformly. Therefore, the substrate's quality can be unstable due to these factors, potentially affecting product yield. Summary of the Invention

[0003] The main objective of this invention is to solve the problem of warping of workpieces due to heat during plasma processing.

[0004] To achieve the above objectives, the present invention provides a combined electrode plasma processing system and a method for performing plasma processing using combined electrodes, for plasma processing of a substrate. The combined electrode plasma processing system includes a vacuum chamber, an upper electrode, a first electrode, a second electrode, and a double-sided adhesive. The upper electrode is disposed within the vacuum chamber, and the first electrode is disposed within the vacuum chamber and spaced apart from the upper electrode by a distance. The first electrode has a conductive assembly portion. The second electrode includes a bearing surface supporting the substrate and a contact assembly portion adjacent to the first electrode. The double-sided adhesive includes a first adhesive layer and a second adhesive layer. The first adhesive layer is attached to the substrate, and the second adhesive layer is attached to the bearing surface of the second electrode. When the conductive assembly portion and the contact assembly portion are in electrical contact, the first electrode and the second electrode form a lower electrode, and a plasma processing space is formed between the lower electrode and the upper electrode to perform plasma processing on the substrate. When the conductive assembly portion and the contact assembly portion are separated, the plasma processing of the substrate is stopped.

[0005] Furthermore, it also includes a frame-shaped cover plate, which is disposed on the side of the second electrode adjacent to the upper electrode. When the plasma process is performed in the vacuum chamber, the frame-shaped cover plate presses against an outer peripheral edge of the substrate.

[0006] Furthermore, the adhesive area of ​​the double-sided adhesive on the substrate occupies 70 to 99% of the area of ​​the substrate.

[0007] Furthermore, the double-sided adhesive has multiple vent holes that extend through the first adhesive layer and the second adhesive layer.

[0008] Furthermore, the diameter of these vent holes is between 0.5 mm and 1 mm.

[0009] Furthermore, the spacing between these vent holes is between 2mm and 5mm.

[0010] Furthermore, the vent holes are distributed at a density of 5 to 10 per square centimeter on the double-sided adhesive.

[0011] Furthermore, the material of the first adhesive layer is UV photolytic.

[0012] Furthermore, the material of the first adhesive layer is pyrolytic.

[0013] Furthermore, the material of the second adhesive layer is UV photolytic.

[0014] Furthermore, the material of the second adhesive layer is pyrolytic.

[0015] Furthermore, the double-sided adhesive has a thickness between 50 μm and 200 μm.

[0016] Furthermore, it also includes a lifting module connected to the side of the first electrode away from the second electrode to control the vertical height of the first electrode within the vacuum chamber.

[0017] Furthermore, a plasma process is performed on a substrate, including the following steps: A substrate fixing step: A double-sided adhesive is formed between a substrate and a second electrode to fix the substrate to the second electrode; The electrode assembly steps are as follows: The second electrode, to which the substrate is fixed, is placed into a vacuum chamber and brought into contact with a first electrode located within the vacuum chamber to form a lower electrode. The vacuum chamber also contains an upper electrode, and a plasma processing space is formed between the lower electrode and the upper electrode to perform plasma processing on the substrate; and Substrate removal step: Release the combined contact state between the first electrode and the second electrode, and remove the second electrode together with the substrate fixed thereon from the vacuum chamber.

[0018] Furthermore, the substrate fixing step also includes the following steps: Adsorption step 1: First, the substrate is vacuum-adsorbed and fixed to an adsorption platform by adsorbing one side of the substrate. One bonding step: First, peel off the first release film of the double-sided adhesive, and then attach the double-sided adhesive to the side of the substrate away from the adsorption platform; and A fixing step: Remove the second release film of the double-sided adhesive, and attach the second electrode to the double-sided adhesive to make the second electrode adhere to the substrate.

[0019] Furthermore, prior to the substrate fixing step, a perforation step is performed: multiple vent holes are formed in the double-sided adhesive using a perforation method. These vent holes penetrate the double-sided adhesive, and gas is discharged through the channels of these vent holes.

[0020] Furthermore, after the substrate removal step, a substrate separation step is also included: using an adhesive removal tool to remove the adhesive of the double-sided adhesive to separate the substrate from the second electrode.

[0021] Furthermore, the lower electrode assembly step also includes the following steps: First, the second electrode is placed into the vacuum chamber, positioned above the first electrode, and a frame-shaped cover plate is placed between the upper electrode and the second electrode. One assembly step: A lifting module is connected to the side of the first electrode away from the second electrode to lift the first electrode, so that the first electrode and the second electrode make electrical contact to form the lower electrode; First pressing step: The lower electrode is lifted by the lifting module so that the lower electrode touches a frame-shaped cover plate, so that the substrate located on the second electrode is in a pressing state.

[0022] Furthermore, the substrate removal process also includes the following steps: Electrode separation step: After the plasma process is completed, a lifting module descends to separate the first electrode from the second electrode, and the substrate leaves the pressed state of a frame-shaped cover plate. Step 1: The second electrode, along with the substrate fixed thereto, is removed from the vacuum chamber using a transport device.

[0023] Therefore, the present invention utilizes the technical feature of combined electrodes that can combine and separate electrodes to optimize the processing sequence of plasma process, and uses adhesive to flatly attach the substrate to the electrode to improve the problem of uneven heating of the substrate, thereby improving the yield of plasma process. Attached Figure Description

[0024] A better understanding of the invention can be obtained from the following detailed description taken in conjunction with the accompanying drawings. It should be noted that, according to industry standard practice, the features are not drawn to scale. In fact, the dimensions of the features can be arbitrarily increased or decreased for clarity of discussion.

[0025] Figure 1 This is a three-dimensional structural diagram of a combined electrode plasma process system.

[0026] Figure 2 This is an exploded view of the combined electrode plasma process system.

[0027] Figure 3 This is a cross-sectional view of the double-sided adhesive component.

[0028] Figure 4 This is a schematic diagram of the lifting steps in a combined electrode plasma process system.

[0029] Figure 5 This is a schematic diagram illustrating the steps involved in lifting the first electrode and connecting it to the second electrode.

[0030] Figure 6 This is a schematic diagram illustrating the steps of lifting the lower electrode and attaching it to the frame-shaped cover plate.

[0031] Figure 7 This is a block diagram showing the steps involved in using a combined electrode plasma process system.

[0032] Figure 8 This is a block diagram showing another step in the use of a combined electrode plasma process system.

[0033] Figure 9 A block diagram showing the steps of fixing the substrate.

[0034] Figure 10 This is a block diagram showing the steps of the lower electrode assembly process.

[0035] Explanation of reference numerals in the attached figures 1:Substrate; 1a: Outer perimeter; 100: Combined electrode plasma process system; 10: Vacuum cavity; 20: Upper electrode; 30: First electrode; 31: Conductive assembly; 40: Second electrode; 41: Bearing surface; 42: Contact assembly section; 50: Double-sided adhesive parts; 51: First adhesive layer; 52: Second adhesive layer; 53: Exhaust port; 54: First release film; 55: Second release film; 56: Ontology; 60: Lower electrode; 70: Frame-shaped cover plate; 80: Lifting module; P: Plasma process space; S0: Puncture step; S1: Substrate fixing step; S1a: Adsorption step; S1b: Adhesive application steps; S1c: Fixed steps; S2: Lower electrode assembly step; S2a: Insertion step; S2b: Combination steps; S2c: Pressing step; S3: Substrate removal step; S3a: Electrode separation step; S3b: Removal steps; S4: Substrate separation step. Detailed Implementation

[0036] The spatial relationship between the two elements described in this invention applies not only to the orientation shown in the diagram, but also to orientations not shown in the diagram, such as inverted orientations.

[0037] Additionally, the terms "first," "second," etc., used in this article do not specifically refer to order or sequence, but are merely used to distinguish elements or operations described using the same technical terms.

[0038] Please see Figures 1 to 6 As shown, a combined electrode plasma processing system 100 of the present invention is disclosed, which is used to perform a plasma process on a substrate 1. The system includes a vacuum chamber 10, an upper electrode 20, a first electrode 30, a second electrode 40, and a double-sided adhesive 50. The upper electrode 20 is disposed in the vacuum chamber 10, and the first electrode 30 is disposed in the vacuum chamber 10 and spaced apart from the upper electrode 20 by a distance.

[0039] Please refer to the reference. Figure 2 , 4 As shown in Figure 6, in this embodiment, the first electrode 30 has a conductive assembly portion 31, which may be, for example, beryllium copper; the second electrode 40 includes a bearing surface 41 supporting the substrate 1 and a contact assembly portion 42 adjacent to the first electrode 30. When the conductive assembly portion 31 and the contact assembly portion 42 are in electrical contact, the first electrode 30 and the second electrode 40 form a lower electrode 60. An external power source can conduct electrical energy to the bearing surface 41 of the second electrode 40 through the electrical contact between the first electrode 30 and the second electrode 40. Thus, a plasma processing space P is formed between the lower electrode 60 and the upper electrode 20 for plasma processing of the substrate 1; when the conductive assembly portion 31 separates from the contact assembly portion 42, the plasma processing of the substrate 1 is stopped.

[0040] In one embodiment, the first electrode 30 or the second electrode 40 also has a cooling structure (not shown), which is disposed in the first electrode 30 or the second electrode 40 through a fluid conduit, and can quickly remove the heat energy received by the electrode.

[0041] In one embodiment, the double-sided adhesive component 50 includes a first adhesive layer 51 and a second adhesive layer 52. The first adhesive layer 51 is attached to the substrate 1, and the second adhesive layer 52 is attached to the bearing surface 41 of the second electrode 40. The double-sided adhesive component 50 is not limited to a laminated structure, as long as it can represent a structure with two opposing adhesive surfaces. Please refer to the following: Figure 3 As shown, in one embodiment, the double-sided adhesive 50 has a body 56, a first adhesive layer 51, a second adhesive layer 52, a first release film 54, and a second release film 55. Furthermore, the double-sided adhesive 50 has a thickness (e.g., the entire body 56, the first adhesive layer 51, and the second adhesive layer 52), which is between 50 μm and 200 μm. The thickness affects the distance between the substrate 1 and the bearing surface 41. If the thickness is too thin, the adhesion of the double-sided adhesive 50 may be insufficient, potentially causing the substrate 1 to warp. However, if the thickness is too thick, the substrate 1 will be too far from the bearing surface 41, making it difficult for the second electrode 40 to cool the substrate 1 through contact or conduction.

[0042] In practice, it is difficult to find a large-area double-sided adhesive component 50. Therefore, in one embodiment, there are multiple double-sided adhesive components 50. These double-sided adhesive components 50 are closely spliced ​​together to form a large double-sided adhesive component 50 relative to the area of ​​the substrate 1. The spliced ​​area can occupy 70% to 99% of the area of ​​the substrate 1. If the spliced ​​area of ​​the double-sided adhesive component 50 is less than 70%, it is impossible to avoid the problem that the area of ​​the substrate 1 not adhered to by the double-sided adhesive component 50 will warp when heated.

[0043] In some embodiments, since the second electrode 40 is metallic and has better thermal conductivity, the second adhesive layer 52 can be made pyrolytic. Heating the second adhesive layer 52 with a heating tool (e.g., a hot air gun) causes it to lose its adhesiveness, thus separating the second electrode 40 from the second adhesive layer 52. The first adhesive layer 51 is UV photolytic. Since the second electrode 40 has detached and the second adhesive layer 52 is translucent, irradiating the double-sided adhesive 50 with UV light can cause the first adhesive layer 51 to lose its adhesiveness and detach from the substrate 1. Alternatively, if the substrate 1 is translucent, after the plasma process is completed, irradiating the first adhesive layer 51 with UV light can cause it to lose its adhesiveness, separating the substrate 1 from the first adhesive layer 51; then heating the second adhesive layer 52 with a heating tool (e.g., a hot air gun) can cause it to lose its adhesiveness and detach from the second electrode 40.

[0044] In some embodiments, the materials of the first adhesive layer 51 and the second adhesive layer 52 are both pyrolytic. The double-sided adhesive 50 is heated using a heating tool (such as a heat gun) to make it lose its stickiness.

[0045] In some embodiments, the materials of the first adhesive layer 51 and the second adhesive layer 52 are both UV photolytic. When the substrate 1 is light-transmitting, the double-sided adhesive 50 is irradiated with UV light to make it lose its adhesiveness.

[0046] In some embodiments, the first adhesive layer 51 is pyrolytic. The first adhesive layer 51 is heated using a heating tool (e.g., a hot air gun) to make it lose its adhesiveness, thereby separating the substrate 1 from the first adhesive layer 51. The second adhesive layer 52 is UV photolytic. Since the substrate 1 has been detached and the first adhesive layer 51 is transparent, the second adhesive layer 52 can lose its adhesiveness and detach from the second electrode 40 by irradiating the double-sided adhesive 50 with UV light.

[0047] Additionally, please refer to the following: Figure 2 As shown, in one embodiment, the double-sided adhesive 50 has a plurality of vent holes 53, which penetrate the first adhesive layer 51 and the second adhesive layer 52. In actual operation, small air bubbles are easily generated during the process of attaching the double-sided adhesive 50 to the substrate 1. Therefore, the gas can be discharged through the channels of the vent holes 53 to avoid gaps between the double-sided adhesive 50 and the substrate 1. In addition to affecting the uniformity of heating of the substrate 1, gaps will also affect the cooling structure (not shown) in cooling the substrate 1, thereby affecting the process yield. Furthermore, the diameter of the vent holes 53 is between 0.5 mm and 1 mm, the spacing between the plurality of vent holes 53 is between 2 mm and 5 mm, and the density of the vent holes 53 distributed in the double-sided adhesive 50 is 5 to 10 per square centimeter.

[0048] Please refer to the reference. Figure 4 As shown, in one embodiment, the present invention further includes a frame-shaped cover plate 70, which is fixed to one side of the second electrode 40 adjacent to the upper electrode 20. When the plasma process begins in the vacuum chamber 10, the frame-shaped cover plate 70 presses against the outer peripheral edge 1a of the substrate 1. This pressing action of the frame-shaped cover plate 70 further ensures that the substrate 1 is flatly and evenly attached to the second electrode 40. It should also be noted that during the plasma process, in some embodiments, cooling gas is introduced into the electrode to prevent damage to the substrate 1 due to high temperatures. Therefore, the pressing action of the frame-shaped cover plate 70 also ensures that the substrate 1 is flatly attached to the second electrode 40, effectively achieving cooling.

[0049] In other words, such as Figure 1As shown, the separability of the lower electrode 60, composed of the first electrode 30 and the second electrode 40, allows for a more flexible timing arrangement of the plasma process. After the plasma process is completed, the substrate 1 can be removed from the opening of the vacuum chamber 10 using a transport device (such as a robotic arm or transmission mechanism). The next second electrode 40 carrying the new substrate 1 can be smoothly introduced into the vacuum chamber 10 without waiting for the substrate 1 to undergo a descaling process, so that the plasma process can continue. In one embodiment, the vacuum chamber 10 is part of an inline machine, meaning it has an inlet and an outlet and can be connected in series with other chambers. This allows multiple substrates 1 to be processed to sequentially enter the vacuum chamber 10 for plasma processing. After processing, the processed substrate 1 is removed from the vacuum chamber 10 through one of the openings using a transmission mechanism (not shown). Simultaneously, the transmission mechanism transports the substrate 1 to be processed into the vacuum chamber 10 for further processing.

[0050] In another embodiment, please refer to the following reference: Figures 4 to 6 The present invention includes a lifting module 80, which is connected to the side of the first electrode 30 away from the second electrode 40 to control the vertical height of the first electrode 30 within the vacuum chamber 10. Figure 4 As shown, the second electrode 40, to which the substrate 1 has already been attached, is placed into the vacuum chamber 10 by manual operation, a robotic arm, or a transfer mechanism. At this point, the second electrode 40 has not yet come into contact with the first electrode 30. Figure 4 The diagram only shows the relative positions of the second electrode 40 and the first electrode 30, without illustrating the positioning method of the second electrode 40. In reality, the second electrode 40 can be positioned using a support or track installed inside the vacuum chamber 10. Next... Figure 5 As shown, the lifting module 80 raises the first electrode 30, causing the first electrode 30 to contact the second electrode 40 to form the lower electrode 60. Then, as... Figure 6 As shown, the lifting module 80 continuously raises the lower electrode 60 to the position of the frame-shaped cover plate 70, using the frame-shaped cover plate 70 to press the substrate 1 against the lower electrode 60 for plasma processing. After the plasma process is completed, the lifting module 80 can descend to remove the substrate 1 from the pressed state of the frame-shaped cover plate 70, and then continue to descend to return the second electrode 40 to its original position. Figure 4 The state of separation of the first electrode 30 and the second electrode 40 can then be removed from the vacuum chamber 10 by manual operation, a robotic arm or a transport device.

[0051] In addition, this invention also provides a method for plasma processing using combined electrodes; please refer to the accompanying documentation. Figures 7 to 10 As shown, it is used to perform a plasma process on substrate 1, and includes the following steps: Substrate fixing step S1: A double-sided adhesive 50 is formed between the substrate 1 and the second electrode 40 to fix the substrate 1 onto the second electrode 40.

[0052] like Figure 8 As shown, in some embodiments, the substrate fixing step S1 may further include the following steps: Adsorption step S1a: First, the substrate 1 is vacuum-adsorbed and fixed to one side of the adsorption platform (not shown). Since the substrate 1 itself may be made of a flexible material and it is not easy to attach the double-sided adhesive 50, the adsorption platform can be used to fix the substrate 1 to facilitate the subsequent attachment of the double-sided adhesive 50.

[0053] Adhesion step S1b: First, remove the first release film 54 of the double-sided adhesive 50 and attach the double-sided adhesive 50 to the side of the substrate 1 away from the adsorption platform.

[0054] Fixing step S1c: Remove the second release film 55 of the double-sided adhesive 50 so that the substrate 1 can be attached to the second electrode 40.

[0055] In one embodiment, during the bonding step S1b, the second release film 55 can be removed first, and the double-sided adhesive 50 can be attached to the side of the substrate 1 away from the adsorption platform. Then, during the fixing step S1c, the first release film 54 can be removed, so that the substrate 1 can be attached to the second electrode 40.

[0056] After completing the substrate fixing step S1, the lower electrode assembly step S2 is performed: the second electrode 40, on which the substrate 1 is fixed, is placed into the vacuum chamber 10 and comes into contact with the first electrode 30 located in the vacuum chamber 10 to form the lower electrode 60. The vacuum chamber 10 also has an upper electrode 20. A plasma process space P is formed between the lower electrode 60 and the upper electrode 20 to perform plasma process processing on the substrate 1.

[0057] like Figure 9 As shown, in one embodiment, the lower electrode assembly step S2 further includes the following steps: Insertion step S2a: First, place the second electrode 40 into the vacuum chamber 10 and position the second electrode 40 above the first electrode 30. The frame-shaped cover plate 70 is already positioned in the vacuum chamber 10 and is located between the upper electrode 20 and the second electrode 40.

[0058] Assembly step S2b: Using the lifting module 80 connected to the side of the first electrode 30 away from the second electrode 40, the first electrode 30 is lifted, so that the first electrode 30 and the second electrode 40 make electrical contact to form the lower electrode 60.

[0059] Pressing step S2c: The lower electrode 60 is lifted by the lifting module 80, so that the lower electrode 60 contacts the frame cover plate 70, thereby pressing the substrate 1 on the second electrode 40 into a pressed state by the frame cover plate 70. Then, the substrate 1 can be subjected to plasma processing.

[0060] Next, after the lower electrode assembly step S2 and the completion of the plasma process, the substrate removal step S3 is performed: the combined contact state of the first electrode 30 and the second electrode 40 is released, and the second electrode 40, along with the substrate 1 fixed thereon, is removed from the vacuum chamber 10. Please refer to the reference. Figure 10 In some embodiments, the substrate removal step S3 may further include the following steps: Electrode separation step S3a: After the plasma process is completed, the lifting module 80 descends to separate the first electrode 30 from the second electrode 40, and the substrate 1 leaves the pressed state of the frame cover plate 70.

[0061] Step S3b: The second electrode 40, together with the substrate 1 fixed thereon, is removed from the vacuum chamber 10 by manual labor, a robotic arm or a transport device.

[0062] like Figure 7 As shown, in one embodiment, after the substrate removal step S3, there is also a substrate separation step S4: using an adhesive release tool to remove the adhesive of the double-sided adhesive 50, so as to separate the substrate 1 from the second electrode 40.

[0063] In one embodiment, the adhesive release tool may be a heating tool (e.g., a heat gun) or an irradiation device that emits UV light, and the material of the double-sided adhesive 50 may be thermally degradable or UV photodegradable accordingly.

[0064] The substrate separation step S4 may have several variations depending on the material of the double-sided adhesive 50, as illustrated below: First, the first adhesive layer 51 is de-adhesive by irradiating it with UV light, so that the substrate 1 is separated from the first adhesive layer 51. Then, the second adhesive layer 52 is heated by a heating tool (such as a hot air gun) to de-adhere it and detach it from the second electrode 40.

[0065] Second, unlike the above, both the first adhesive layer 51 and the second adhesive layer 52 are pyrolytic. Therefore, in the second case, a heating tool is used to separate the double-sided adhesive 50 from the substrate 1 and the second electrode 40.

[0066] Third, since both the first adhesive layer 51 and the second adhesive layer 52 are UV photolytic, in the third case, UV light is emitted onto the double-sided adhesive 50 using a UV light irradiation device, causing the double-sided adhesive 50 to separate from the substrate 1 and the second electrode 40.

[0067] Fourth, the first adhesive layer 51 is pyrolytic, and a heating tool is used to make the first adhesive layer 51 lose its adhesiveness, so that the substrate 1 is separated from the first adhesive layer 51; the second adhesive layer 52 is UV photolytic, and a UV light irradiation device is used to make the second adhesive layer 52 lose its adhesiveness and detach from the second electrode 40.

[0068] Additionally, in one embodiment, please refer to the reference. Figure 7 Before the substrate fixing step S1, a piercing step S0 may be included. Multiple venting holes 53 are formed in the double-sided adhesive 50 using a piercing method. These venting holes 53 penetrate the double-sided adhesive 50, allowing gas generated during the bonding process to be smoothly discharged through the pierced channels. Further explanation: the piercing method can be a kenzan-style bubble-punching method, laser drilling method, or hot needle piercing method, as long as both sides of the double-sided adhesive 50 have through holes sufficient to allow gas to escape. However, the piercing step S0 is only one embodiment and is not a limitation on all embodiments of this invention requiring the piercing step S0.

[0069] Therefore, the present invention has the following advantages: 1. The present invention forms a plurality of vent holes 53 on the double-sided adhesive 50, so that air bubbles generated during the adhesive process can be discharged through the channels of the vent holes 53, thereby avoiding gaps between the double-sided adhesive 50 and the substrate 1 and affecting the process yield.

[0070] 2. The present invention uses a frame-shaped cover plate 70 to press the outer peripheral edge 1a of the substrate 1 to prevent the substrate 1 from curling and deforming due to temperature rise in the vacuum cavity 10, and to enable the substrate 1 to be heated and cooled evenly, thereby achieving the effect of stabilizing the process yield.

[0071] 3. The lower electrode 60 composed of the first electrode 30 and the second electrode 40 of the present invention has separability, which makes the timing arrangement of the plasma process more flexible. After the plasma process is completed, the substrate 1 can be removed by the transport device without waiting for the substrate 1 to undergo the desmearing process, and the next process can be carried out smoothly, thereby optimizing the timing arrangement of the process.

[0072] 4. The double-sided adhesive material of the double-sided adhesive component 50 can have different release properties, and can be used together to perform the separation operation of the substrate 1 and the second electrode 40.

[0073] Although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the invention patent.

Claims

1. A combined electrode plasma process system, characterized by, A combined electrode plasma processing system for performing plasma processing on a substrate includes: a vacuum chamber; an upper electrode disposed in the vacuum chamber; a first electrode disposed in the vacuum chamber and spaced apart from the upper electrode, the first electrode having a conductive assembly portion; a second electrode including a bearing surface for bearing the substrate and a contact assembly portion adjacent to the first electrode; and a double-sided adhesive member including a first adhesive layer and a second adhesive layer, the first adhesive layer attached to the substrate and the second adhesive layer attached to the bearing surface of the second electrode; wherein when the conductive assembly portion and the contact assembly portion are in electrical contact, the first electrode and the second electrode are combined into a lower electrode, and a plasma processing space is formed between the lower electrode and the upper electrode for performing plasma processing on the substrate; and when the conductive assembly portion and the contact assembly portion are separated, the plasma processing on the substrate is stopped.

2. The combined electrode plasma processing system of claim 1, wherein, Further including a frame-shaped cover plate disposed on a side of the second electrode adjacent to the upper electrode, the frame-shaped cover plate presses a peripheral edge of the substrate when the plasma processing is performed in the vacuum chamber.

3. The combined electrode plasma processing system of claim 1, wherein, The adhesive area of the double-sided adhesive member on the substrate occupies 70 to 99% of the area of the substrate.

4. The combined electrode plasma processing system of claim 1, wherein, The double-sided adhesive member has a plurality of exhaust holes penetrating through the first adhesive layer and the second adhesive layer.

5. The combined electrode plasma processing system of claim 4, wherein, The diameter of the exhaust holes is between 0.5 mm and 1 mm.

6. The combined electrode plasma processing system of claim 4, wherein, The spacing distance between the exhaust holes is between 2 mm and 5 mm.

7. The combined electrode plasma processing system of claim 4, wherein the plasma processing chamber is a capacitively coupled plasma processing chamber. The density of the exhaust holes distributed on the double-sided adhesive member is 5 to 10 per square centimeter.

8. The combined electrode plasma processing system of claim 1, wherein, The material of the first adhesive layer has UV photolysis.

9. The combined electrode plasma processing system of claim 1, wherein, The material of the first adhesive layer has pyrolysis.

10. The combined electrode plasma processing system of claim 1, wherein, The material of the second adhesive layer has UV photolysis.

11. The combined electrode plasma processing system of claim 1, wherein, The material of the second adhesive layer has pyrolysis.

12. The combined electrode plasma processing system of claim 1, wherein, The double-sided adhesive member has a thickness between 50 μm and 200 μm.

13. The combined electrode plasma processing system of claim 1, wherein, Further including a lifting module connected to a side of the first electrode away from the second electrode to control the vertical height of the first electrode in the vacuum chamber.

14. A method for plasma processing using combined electrodes, characterized in that, A method for performing plasma processing on a substrate includes the following steps: a substrate fixing step of forming a double-sided adhesive member between a substrate and a second electrode to fix the substrate on the second electrode; a lower electrode combining step of placing the second electrode with the substrate fixed thereon into a vacuum chamber and contacting a first electrode in the vacuum chamber to combine into a lower electrode, the vacuum chamber also having an upper electrode, a plasma processing space being formed between the lower electrode and the upper electrode for performing plasma processing on the substrate; and a substrate taking-out step of removing the combined contact state of the first electrode and the second electrode and taking out the second electrode together with the substrate fixed thereon from the vacuum chamber.

15. The method for plasma processing using a combined electrode as described in claim 14, characterized in that, In the substrate fixing step, further including the following steps: an adsorbing step of first fixing one side of the substrate to an adsorption platform by vacuum adsorption; an adhering step of first removing a first release film of the double-sided adhesive member and adhering the double-sided adhesive member to a side of the substrate away from the adsorption platform; and A fixing step: tearing off a second release film of the double-sided adhesive member, and adhering the second electrode to the double-sided adhesive member so that the second electrode is attached to the substrate.

16. The method of claim 14, wherein the method further comprises: applying a voltage to the electrode to generate a plasma in the chamber. 15 Before the substrate fixing step, a piercing step is further included: forming a plurality of exhaust holes in the double-sided adhesive member by using a piercing method, the exhaust holes penetrating through the double-sided adhesive member, and gas being exhausted through the exhaust holes.

17. The method for plasma processing using a combined electrode as described in claim 14, characterized in that, After the substrate taking-out step, a substrate separating step is further included: removing the adhesion of the double-sided adhesive member by using an adhesion removing tool so that the substrate is separated from the second electrode.

18. The method for plasma processing using a combined electrode as described in claim 14, characterized in that, The lower electrode assembling step further includes the following steps: A placing step: placing the second electrode into the vacuum chamber, positioning the second electrode above the first electrode, and placing a frame-shaped cover plate between the upper electrode and the second electrode; An assembling step: connecting a lifting module to a side of the first electrode away from the second electrode, lifting the first electrode so that the first electrode and the second electrode are electrically connected to form the lower electrode; A pressing step: lifting the lower electrode by using the lifting module so that the lower electrode contacts the frame-shaped cover plate, and the substrate on the second electrode is in a pressed state.

19. The method of claim 14, wherein the method further comprises: The substrate taking-out step further includes the following steps: An electrode separating step: after the plasma process is completed, a lifting module is lowered so that the first electrode and the second electrode are separated, and the substrate is separated from the pressed state of the frame-shaped cover plate; A taking-out step: using a conveying device to take out the second electrode together with the substrate fixed thereon from the vacuum chamber.

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