Solder strip preparation method, solder strip and solder strip preparation device

Abstract

The present application relates to the field of photovoltaic technology, and particularly relates to a solder strip preparation method, a solder strip and a solder strip preparation device. The solder strip preparation method comprises: stage-wise calendering a base material to form a first segment and a second segment on the base material, the first segment and the second segment being different in shape; wrapping a protective tape on the first segment; plating a tin-resistant metal coating on the second segment; removing the protective tape from the first segment, and plating a solder coating on the first segment, the melting point of the tin-resistant metal coating being greater than the melting point of the solder coating. The solder strip prepared by the solder strip preparation method does not have the phenomenon of tin accumulation at the bending part, avoids the contact between the solder strip and the film strip, avoids the micro-short circuit phenomenon of the photovoltaic module, and prolongs the service life.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic technology, and in particular to a method for preparing solder ribbon, solder ribbon, and solder ribbon preparation apparatus. Background Technology

[0002] In the manufacturing process of photovoltaic modules, in order to improve the light absorption efficiency of photovoltaic modules, industry professionals set a film strip in the gap between the solar cells. One side of the film strip is an adhesive film, which is easy to bond with glass; the other side of the film strip is an aluminum layer, which is easy to reflect light and increase the light absorption efficiency of the solar cells.

[0003] like Figure 1 As shown, when the solder ribbon connects two solar cells 10', the solder ribbon at the gap on the back of the two solar cells 10' will form a "Z" shaped bend 30'. During the solder ribbon welding, the tin layer on the solder ribbon will melt. Under the action of gravity, the molten tin layer is prone to accumulate at the low point of the "Z" shaped bend 30', which will form tin nails 40', tin beads piercing or overlapping the aluminum layer of the film strip 20', causing micro short circuits in the photovoltaic module and shortening the service life of the photovoltaic module.

[0004] Therefore, there is an urgent need to design a method for preparing solder strips, as well as solder strips and solder strip preparation equipment, to solve the above technical problems. Summary of the Invention

[0005] The first objective of this invention is to provide a method for preparing solder ribbons that prevents solder buildup at bends, avoids contact between the solder ribbon and the film ribbon, prevents micro-short circuits in photovoltaic modules, and extends service life.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] This invention provides a method for preparing solder strips, comprising:

[0008] The substrate is subjected to staged calendering to form a first segment and a second segment that are adjacent to each other on the substrate, and the first segment and the second segment have different shapes.

[0009] Wrap the first segment with protective tape;

[0010] A non-tin-adhesive metal coating is plated onto the second segment.

[0011] Remove the protective tape from the first segment and plate a solder coating on the first segment; the melting point of the non-tinning metal coating is greater than the melting point of the solder coating.

[0012] As an optional technical solution for solder strip preparation, the step of performing staged rolling on the substrate to form adjacent first and second segments with different shapes further includes:

[0013] The calendered substrate is then annealed.

[0014] As an optional technical solution for solder strip preparation, the step of wrapping protective tape on the first segment includes:

[0015] The shapes of the first segment and the second segment are identified, and protective tape is wrapped around the first segment.

[0016] As an optional technical solution for the preparation of solder ribbon, the protective tape is a high-temperature aluminum foil wire harness tape.

[0017] The second objective of this invention is to provide a solder ribbon in which the non-tinned metal coating does not melt during the soldering process, thereby preventing tin buildup in the second segment at the bend and thus avoiding micro-short circuits in the photovoltaic module and extending its service life.

[0018] To achieve this objective, the present invention adopts the following technical solution:

[0019] This invention provides a welding strip, which is prepared by the welding strip preparation method described above. The welding strip includes a substrate, which includes a plurality of first segments and a plurality of second segments. The first segments and second segments are connected and alternately arranged, and the first segments and second segments have different shapes.

[0020] The first segment is coated with a solder coating, and the second segment is coated with a non-stick metal coating.

[0021] As an alternative technical solution for welding strips, the first segment is circular and the second segment is flat.

[0022] As an optional technology for welding strips, the length of the first segment is not less than the width of the battery cell.

[0023] As an optional technology for solder strips, the non-tin-adhesive metal coating is one of aluminum, zinc alloy or magnesium alloy.

[0024] As an optional solder strip technology, the solder coating is one of tin-lead coating, tin-lead-silver coating or tin-lead-bismuth coating.

[0025] As an optional technical solution for solder strips, the length of the first segment is set to 50mm-120mm, the length of the second segment is set to 3mm-12mm, the thickness of the second segment is set to 0.1mm-0.18mm, and the melting point of the non-stick metal coating is set to 400℃-700℃.

[0026] The third objective of this invention is to provide a solder ribbon preparation apparatus. This apparatus has a simple structure, can improve the yield of photovoltaic modules, thereby avoiding micro-short circuits in photovoltaic modules and extending their service life.

[0027] To achieve this objective, the present invention adopts the following technical solution:

[0028] This invention provides a solder strip preparation apparatus for preparing the solder strips described above. The solder strip preparation apparatus includes:

[0029] A calendering roll assembly for segmenting the substrate to form a first segment and a second segment;

[0030] An automatic protective tape wrapping assembly is located downstream of the calendering roll assembly and is used to wrap protective tape around the first segment.

[0031] A plating furnace is located downstream of the automatic protective tape wrapping assembly and is configured to plate a non-stick metal coating onto the second segment; a blade is provided at the outlet of the plating furnace and is configured to cut and remove the protective tape from the first segment.

[0032] A tin plating furnace, located downstream of the plating furnace, is configured to plate a solder coating onto the first section.

[0033] As an optional technical solution for a welding strip preparation device, the calendering roll assembly includes at least two eccentric wheels arranged opposite each other, a fixed shaft is provided on the eccentric wheels, the eccentric wheels are rotatable around the fixed shaft, and the eccentric wheels are configured to flatten the substrate in segments to form the first segment and the second segment.

[0034] As an optional technical solution for a solder strip preparation apparatus, the solder strip preparation apparatus further includes an annealing component disposed between the calendering roll assembly and the automatic wrapping protective tape assembly, and the annealing component is configured to anneal the substrate.

[0035] As an optional technical solution for a solder ribbon preparation device, the solder ribbon preparation device further includes a CCD shape recognition component, which is signal-connected to the automatic protective tape wrapping component, and the CCD shape recognition component is disposed between the annealing component and the automatic protective tape wrapping component;

[0036] The CCD shape recognition component is used to identify the shapes of the first segment and the second segment, and feeds back the shape signal to the automatic wrapping protective tape component, so that the automatic wrapping protective tape component wraps the protective tape around the first segment.

[0037] As an optional technical solution for a welding strip preparation device, the automatic protective tape wrapping assembly includes a tape roll, a stretching tape clamp, and a wrapping tape clamp. The tape roll is provided with protective tape, and the stretching tape clamp is located downstream of the wrapping tape clamp. The stretching tape clamp is used to stretch and flatten the protective tape, and the wrapping tape clamp is used to wrap the protective tape onto the first segment.

[0038] The beneficial effects of the present invention include at least the following:

[0039] This invention provides a method for preparing solder ribbon, which includes performing staged rolling on a substrate to form a first segment and a second segment that are adjacent to each other on the substrate, and the first segment and the second segment have different shapes; wrapping a protective tape on the first segment; depositing a non-stick metal coating on the second segment; removing the protective tape from the first segment and depositing a solder coating on the first segment, wherein the melting point of the non-stick metal coating is greater than the melting point of the solder coating.

[0040] The above describes a process where the substrate is segmented to form a first segment and a second segment with different shapes. Protective tape is then wrapped around the first segment to protect it during the subsequent plating of the non-stick metal coating onto the second segment, preventing the non-stick metal coating from adhering to it. After the non-stick metal coating is plated onto the second segment, the protective tape is removed from the first segment, facilitating the plating of the solder coating onto it. The first segment is used for welding to the front or back of the battery cell, while the second segment connects two adjacent battery cells and is located in the gap between them; that is, the second segment is situated at the "Z-shaped" bend. The method for preparing the solder ribbon is simple. By depositing a non-stick metal coating on the second section of the solder ribbon, and ensuring that the melting point of the non-stick metal coating is greater than that of the solder coating, the non-stick metal coating on the second section will not melt during soldering. This ensures that no coating will accumulate at the "Z-shaped" bend, thus preventing the solder pile-up phenomenon found in the prior art at the solder ribbon bend. This avoids the formation of solder studs or solder balls, and prevents contact between the solder ribbon and the film strip, thus avoiding micro-short circuits in the photovoltaic module and extending the service life of the photovoltaic module.

[0041] This invention provides a solder ribbon in which the non-tin-adhesive metal coating does not melt during the soldering process, thus preventing tin buildup at the second section of the bent section, thereby avoiding micro-short circuits in photovoltaic modules and extending their service life.

[0042] This invention provides a solder ribbon preparation device. The device has a simple structure and can improve the yield of photovoltaic modules, thereby avoiding micro-short circuits in photovoltaic modules and extending their service life. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0044] Figure 1 This is a schematic diagram of the contact between the solder strip and the film strip in the prior art, resulting in a micro-short circuit;

[0045] Figure 2 This is a schematic flowchart of the solder strip preparation method provided in the embodiments of the present invention;

[0046] Figure 3 This is a schematic diagram of the structure of the solder strip provided in an embodiment of the present invention;

[0047] Figure 4 This is a schematic diagram of the connection between the solder strip, the battery cell, and the film strip provided in an embodiment of the present invention;

[0048] Figure 5 This is a schematic diagram of the structure of the solder strip preparation apparatus provided in an embodiment of the present invention;

[0049] Figure 6 This is a schematic diagram of the structure of the automatic wrapping protective tape assembly provided in an embodiment of the present invention.

[0050] Figure Labels

[0051] 10. Solar cells; 20. Film strips;

[0052] 100. Welding strip; 110. First section; 120. Second section;

[0053] 200. Calendering roll assembly; 210. Eccentric wheel; 220. Fixed shaft;

[0054] 300 Annealing assembly; 400 CCD shape recognition assembly; 500 Automatic wrapping protective tape assembly; 510 Stretch tape clamp; 520 Wrapping tape clamp; 530 Protective tape; 540 Cutting knife; 600 Plating furnace; 610 Blade; 700 Tin plating furnace; 800 Unwinding assembly; 900 Rewinding assembly. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0056] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0057] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0058] In the description of this invention, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0059] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0060] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0061] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0062] This embodiment provides a method for preparing solder ribbon. The solder ribbon prepared by this method will not have solder buildup at the bending point, avoids contact between the solder ribbon and the film ribbon, avoids micro-short circuits in photovoltaic modules, and extends service life.

[0063] like Figures 2-6As shown, the method for preparing solder ribbon mainly includes performing staged rolling on the substrate to form a first segment 110 and a second segment 120 that are adjacent to each other on the substrate, and the first segment 110 and the second segment 120 have different shapes; wrapping a protective tape 530 on the first segment 110; depositing a non-stick metal coating on the second segment 120; removing the protective tape 530 from the first segment 110 and depositing a solder coating on the first segment 110, wherein the melting point of the non-stick metal coating is greater than the melting point of the solder coating.

[0064] Based on the above design, the substrate is segmented to form a first segment 110 and a second segment 120 with different shapes. Protective tape 530 is then wrapped around the first segment 110. This protects the first segment 110 during the subsequent plating of a non-stick metal coating onto the second segment 120, preventing the non-stick metal coating from adhering to it. After the non-stick metal coating is electroplated onto the second segment 120, the protective tape 530 is removed from the first segment 110, facilitating the plating of a solder coating onto the first segment 110. The first segment 110 is used for welding to the front or back of the battery cell 10, and the second segment 120 is used to connect two adjacent battery cells 10 and is located in the gap between the two battery cells 10; that is, the second segment 120 is located at the "Z-shaped" bend.

[0065] The method for preparing the solder ribbon is simple. By depositing a non-stick metal coating on the second segment 120 of the solder ribbon 100, and ensuring that the melting point of the non-stick metal coating is greater than that of the solder coating, the non-stick metal coating on the second segment 120 will not melt during the soldering of the solder ribbon 100. This ensures that no coating will accumulate at the "Z-shaped" bend, i.e., no solder pile-up will occur at the bend of the solder ribbon 100 as in the prior art. This avoids the formation of solder studs or solder balls as in the prior art. There will be no contact between the solder ribbon 100 and the film strip 20, thus preventing micro-short circuits in the photovoltaic module and extending the service life of the photovoltaic module.

[0066] Optionally, the substrate in this embodiment is a round copper wire. The solder coating is selected from one of the conventional tin-lead coating, tin-lead-silver coating, or tin-lead-bismuth coating, which saves costs and improves flexibility and applicability.

[0067] like Figures 3-4 As shown, in this embodiment, the first segment 110 is a circular segment, and the second segment 120 is a flat segment. The first segment 110 is welded to the front or back of the battery cell 10, and the second segment 120 is located in the gap between the two battery cells 10.

[0068] The first segment 110 is designed as a circular segment, which ensures good contact with the solar cell 10 while maintaining a certain degree of flexibility and tension to accommodate minor deformations of the solar cell 10 during use. Furthermore, the surface design of the circular segment can reflect and refract incident light, improving the utilization rate of light on the solar cell 10 and thus increasing the power generation efficiency of the photovoltaic module.

[0069] The second segment 120 is set as a flat segment, which can greatly reduce the spacing between the solar cells 10, thereby improving the compactness and power density of the photovoltaic module.

[0070] Optionally, in this embodiment, the length of the first segment 110 is not less than the width of the battery cell 10, thereby improving the stability and reliability of the welding between the first segment 110 and the battery cell 10. Preferably, the length of the first segment 110 is equal to the width of the battery cell 10.

[0071] For example, the length of the first segment 110 is set to 50mm-120mm, and the operator can flexibly set the length of the first segment 110 according to the width of the battery cell 10 to be wired. The battery cell 10 can be set as half cell, three-quarter cell, four-quarter cell, etc. The length of the second segment 120 is set to 3mm-12mm, the thickness of the second segment 120 is set to 0.1mm-0.18mm, and the melting point of the non-stick metal coating is set to 400℃-700℃. This melting point is much higher than the melting point of the solder coating, thereby ensuring that the non-stick coating on the second segment 120 will not melt during the welding process between the first segment 110 and the battery cell 10.

[0072] like Figure 5 As shown, in this embodiment, after the step of performing staged rolling on the substrate to form adjacent first segments 110 and second segments 120 with different shapes, the substrate is further subjected to annealing. Annealing increases the flexibility of the substrate (copper wire), making it less prone to breakage during subsequent processing and use. By heating the copper wire at high temperature and then gradually cooling it, it can reach an ideal physical state, thereby better adapting to subsequent processing and use requirements. In addition, the annealing process can reduce the stress during welding of the solder strip 100, helping to reduce cracks and deformations that may occur during welding, and improving the welding quality of the solder strip 100.

[0073] like Figure 5 As shown, the step of wrapping the protective tape 530 on the first segment 110 includes recognizing the shapes of the first segment 110 and the second segment 120 so that the protective tape 530 can be accurately wrapped on the first segment 110, thereby improving the accuracy and efficiency of wrapping the first segment 110 with the protective tape 530 and increasing the degree of automation in the preparation of the solder ribbon 100.

[0074] Optionally, the protective tape 530 in this embodiment is a high-temperature aluminum foil wire harness tape.

[0075] Optionally, the non-tin-adhesive metal coating in this embodiment is one of aluminum, zinc alloy or magnesium alloy, and all three non-tin-adhesive metal coatings are silver-white. Not only is the melting point much greater than that of the solder coating, but it can also enhance the reflection and refraction of light, improve the utilization rate of light on the solar cell 10, and thus increase the power generation efficiency of the photovoltaic module.

[0076] like Figure 5 As shown, in this embodiment, the steps of removing the protective tape 530 from the first segment 110 and applying a solder coating to the first segment 110 include using a blade 610 to cut and remove the protective tape 530 from the first segment 110 and then applying a solder coating to the first segment 110. The blade 610 reduces the need for manual removal of the protective tape 530, thus improving work efficiency.

[0077] like Figure 3 and Figure 4 As shown, this embodiment also provides a solder ribbon 100, which is prepared by the solder ribbon preparation method described above. The solder ribbon 100 includes a substrate, which is composed of a plurality of first segments 110 and a plurality of second segments 120. The first segments 110 and the second segments 120 are connected and alternately arranged. The first segments 110 and the second segments 120 have different shapes. The first segments 110 are coated with a solder coating, and the second segments 120 are coated with a non-stick metal coating.

[0078] The substrate is copper wire, and the solder coating is one of the conventional tin-lead coating, tin-lead-silver coating or tin-lead-bismuth coating. The non-tin-adhesive metal coating is one of aluminum, zinc alloy or magnesium alloy. The melting point of the non-tin-adhesive metal coating is greater than that of the solder coating.

[0079] During the welding process, the non-tin-adhesive metal coating of the solder ribbon 100 will not melt, thus preventing tin buildup at the second section 120 at the bend. This avoids contact between the solder ribbon 100 and the film strip 20, thereby preventing micro-short circuits in the photovoltaic module and extending its service life.

[0080] like Figures 5-6As shown, this embodiment also provides a solder strip preparation apparatus for preparing the aforementioned solder strip 100. The solder strip preparation apparatus includes a calendering roller assembly 200, an automatic wrapping protective tape assembly 500, a plating furnace 600, a blade 610, and a tin plating furnace 700. The calendering roll assembly 200 is used to flatten the substrate in segments to form a first segment 110 and a second segment 120. The automatic protective tape wrapping assembly 500 is located downstream of the calendering roll assembly 200 and is used to wrap the protective tape 530 onto the first segment 110. The plating furnace 600 is located downstream of the automatic protective tape wrapping assembly 500 and is configured to plate a non-stick metal coating onto the second segment 120. A blade 610 is provided at the outlet of the plating furnace 600 and is configured to cut and remove the protective tape 530 from the first segment 110. The tin plating furnace 700 is located downstream of the plating furnace 600 and is configured to plate a solder coating onto the first segment 110.

[0081] The solder ribbon preparation device has a simple structure. During the soldering process, the non-tin-adhesive metal coating of the prepared solder ribbon 100 will not melt, and thus no tin buildup will occur in the second section 120 at the bend. This avoids contact between the solder ribbon 100 and the film strip 20, thereby preventing micro-short circuits in the photovoltaic module, improving the yield of the photovoltaic module, and extending the service life of the photovoltaic module.

[0082] Optionally, the plating furnace 600, blade 610 and tin plating furnace 700 in this embodiment are all conventional components, and their specific structures will not be described in detail here.

[0083] like Figure 5 As shown, the calendering roll assembly 200 includes at least two opposing eccentric wheels 210. A fixed shaft 220 is disposed on each eccentric wheel 210. The eccentric wheels 210 are rotatable around the fixed shaft 220. The eccentric wheels 210 are configured to flatten the substrate in segments to form a first segment 110 and a second segment 120. In other words, the position of the fixed shaft 220 is offset from the circle of the eccentric wheels 210. The two eccentric wheels 210 are mirror images of each other. When the eccentric wheels 210 rotate around the fixed shaft 220, the distance between the two eccentric wheels 210 is not constant. When the edge of the eccentric wheel 210 furthest from the fixed shaft 220 contacts the substrate, the distance between the two eccentric wheels 210 is closest, thereby flattening the substrate to form the second segment 120. As the two eccentric wheels 210 continue to rotate, the gap between the two eccentric wheels 210 increases to ensure that the substrate is not squeezed, thus forming the first segment 110. Optionally, in this embodiment, the minimum gap between the two eccentric wheels 210 is set to be between 0.1mm and 0.18mm.

[0084] Preferably, in this embodiment, the eccentric wheel 210 is circular, and the fixed shaft 220 is offset from the center of the eccentric wheel 210. The operator can set the circumference of the eccentric wheel 210 according to the length of the second segment 120 to be processed.

[0085] In some embodiments, the two eccentric wheels 210 can also be placed asymmetrically.

[0086] like Figure 5 As shown, in this embodiment, the ribbon preparation apparatus further includes an annealing assembly 300, which is disposed between the calendering roll assembly 200 and the automatic wrapping protective tape assembly 500. The annealing assembly 300 is configured to anneal the substrate. Optionally, the annealing assembly 300 can be a conventional annealing furnace.

[0087] Furthermore, the solder ribbon preparation apparatus in this embodiment also includes a CCD (Charge-Coupled Device) shape recognition component 400. The CCD shape recognition component 400 is signal-connected to the automatic protective tape wrapping component 500, and is disposed between the annealing component 300 and the automatic protective tape wrapping component 500. The CCD shape recognition component 400 is used to recognize the shapes of the first segment 110 and the second segment 120, and feeds back the shape signals to the automatic protective tape wrapping component 500, so that the automatic protective tape wrapping component 500 wraps the protective tape 530 around the first segment 110.

[0088] Optionally, the CCD shape recognition component 400 can be set to a commercially available CCD camera, such as a three-line sensor CCD industrial camera commonly used in manufacturing, a high-speed industrial camera (e.g., a high-speed color CCD industrial camera CV-GF130-60GC), etc. The CCD camera can capture images of the receding first segment 110 and second segment 120, and feed the captured signal back to the automatic protective tape wrapping component 500, so that the automatic protective tape wrapping component 500 wraps the protective tape 530 around the first segment 110, while the second segment 120 does not need to be wrapped with protective tape 530.

[0089] like Figures 5-6As shown, in this embodiment, the automatic protective tape wrapping assembly 500 includes a tape roll, a stretching tape clamp 510, and a wrapping tape clamp 520. Protective tape 530 is disposed on the tape roll. The stretching tape clamp 510 is located downstream of the wrapping tape clamp 520. The stretching tape clamp 510 is used to stretch and flatten the protective tape 530, and the wrapping tape clamp 520 is used to wrap the protective tape 530 onto the first segment 110. A cutting blade 540 is provided at the entrance of the automatic protective tape wrapping assembly 500 to cut the protective tape 530, ensuring that the protective tape 530 is wrapped only on the first segment 110.

[0090] Before the stretching tape clamp 510 is in place, the wrapping tape clamp 520 starts to operate. After the stretching tape clamp 510 is in place, the cutting blade 540 cuts the high-temperature aluminum foil wire harness tape. This process is repeated so that all the first segments 110 on the welding strip 100 are wrapped with protective tape 530.

[0091] It should be noted that the remaining structures of the automatic protective tape wrapping assembly 500 in this embodiment are all conventional components, and the working principle of the automatic protective tape wrapping assembly 500 is the same as that of the existing film application device, so it will not be described again here.

[0092] like Figure 5 As shown, in this embodiment, the solder strip preparation apparatus further includes a winding assembly 900 and an unwinding assembly 800. The unwinding assembly 800 is located upstream of the calendering roll assembly 200 and is used to unwind the substrate. The winding assembly 900 is located downstream of the tin plating furnace 700 and is used to wind up the prepared solder strip 100.

[0093] Obviously, the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

[0094] Note that in the description of this specification, the references to terms such as "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

Claims

1. A method for preparing solder strips, characterized in that, include: The substrate is subjected to staged calendering to form a first segment and a second segment that are adjacent to each other on the substrate, and the first segment and the second segment have different shapes. Wrap the first segment with protective tape; A non-tin-adhesive metal coating is plated onto the second segment. Remove the protective tape from the first segment and plate a solder coating on the first segment; the melting point of the non-tinning metal coating is greater than the melting point of the solder coating.

2. The method for preparing solder strips according to claim 1, characterized in that, The step of wrapping protective tape around the first segment includes: The shapes of the first segment and the second segment are identified, and protective tape is wrapped around the first segment; the protective tape is high-temperature aluminum foil wire harness tape.

3. A welding strip, characterized in that, The welding strip is prepared by the welding strip preparation method according to any one of claims 1-2. The welding strip includes a substrate, the substrate includes a plurality of first segments and a plurality of second segments, and the first segments and the second segments are connected and alternately arranged, and the first segments and the second segments have different shapes. The first segment is coated with a solder coating, and the second segment is coated with a non-stick metal coating.

4. The welding strip according to claim 3, characterized in that, The first segment is circular, and the second segment is flat; the length of the first segment is not less than the width of the battery cell.

5. The welding strip according to claim 3, characterized in that, The non-tin-adhesive metal coating is one of aluminum, zinc alloy, or magnesium alloy; the solder coating is one of tin-lead coating, tin-lead-silver coating, or tin-lead-bismuth coating.

6. The welding strip according to claim 3, characterized in that, The length of the first segment is set to 50mm-120mm, the length of the second segment is set to 3mm-12mm, the thickness of the second segment is set to 0.1mm-0.18mm, and the melting point of the non-tin-adhesive metal coating is set to 400℃-700℃.

7. A welding strip preparation apparatus, characterized in that, The welding strip preparation apparatus is used to prepare the welding strip according to any one of claims 3-6, and the welding strip preparation apparatus comprises: A calendering roll assembly for segmenting the substrate to form a first segment and a second segment; An automatic protective tape wrapping assembly is located downstream of the calendering roll assembly and is used to wrap protective tape around the first segment. A plating furnace is located downstream of the automatic protective tape wrapping assembly and is configured to plate a non-stick metal coating onto the second segment; a blade is provided at the outlet of the plating furnace and is configured to cut and remove the protective tape from the first segment. A tin plating furnace, located downstream of the plating furnace, is configured to plate a solder coating onto the first section.

8. The welding strip preparation apparatus according to claim 7, characterized in that, The calendering roll assembly includes at least two opposing eccentric wheels, each with a fixed shaft. The eccentric wheels are rotatable around the fixed shaft and are configured to flatten the substrate in segments to form a first segment and a second segment.

9. The welding strip preparation apparatus according to claim 7, characterized in that, The solder ribbon preparation device further includes a CCD shape recognition component, which is signal-connected to the automatic wrapping protective tape component, and the CCD shape recognition component is located upstream of the automatic wrapping protective tape component; The CCD shape recognition component is used to identify the shapes of the first segment and the second segment, and feeds back the shape signal to the automatic wrapping protective tape component, so that the automatic wrapping protective tape component wraps the protective tape around the first segment.

10. The welding strip preparation apparatus according to claim 7, characterized in that, The automatic protective tape wrapping assembly includes a tape roll, a stretching tape clamp, and a wrapping tape clamp. The tape roll is provided with protective tape, and the stretching tape clamp is located downstream of the wrapping tape clamp. The stretching tape clamp is used to stretch the protective tape flat, and the wrapping tape clamp is used to wrap the protective tape onto the first segment.

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